Sie sind auf Seite 1von 30

Internal Use Only

North/Latin America http://aic.lgservice.com


Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

LCD TV
SERVICE MANUAL
CHASSIS : LP91A

MODEL : 32LH30FR 32LH30FR-MA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION................................................................11

TROUBLE SHOOTING ............................................................................16

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 20

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE


Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed


metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
such as WATER PIPE,
shock. CONDUIT etc.
To Instruments
0.15uF
exposed
Leakage Current Cold Check(Antenna Cold Check) METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1
measured resistance should be between 1M and 5.2M. *Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500F to 600F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500F to 600F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500F to 600F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method


This spec sheet is applied to LCD TV used LP91A chassis. 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
2. Specification - EMC : CE, IEC
Each part is tested as below without special appointment.

1) Temperature : 255C (779F), CST : 405C


2) Relative Humidity : 6510%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Electrical specification
4.1 General Specification
No Item Specification Measurement Remark
1 Screen Size 32 wide Color Display Module Resolution: 1366*768 / 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32 TFT WUXGA LCD FHD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
170 W 32 FHD
7 LDC Module FHD 760 x 450 x 48 with inverter
(Maker : LGD) 0.36375 x 0.36375

Coating 3H

Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 32(FHD)
Wy -0.03 0.292 +0.03 LC320WUN-SAB1
RED Xr 0.638
Yr 0.334
Green Xg 0.291
Yg 0.607
Blue Xb 0.145
Yb 0.062
4. Contrast ratio 900:1 1300:1 LGD 32(FHD)
5. Luminance Variation 1.3

8. Component Video Input (Y, PB, PR)


Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
9. RGB
9.1 Analog PC, RGB- DTV NOT SUPPORT

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

10. HDMI Input


10.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA

10.2 DTV Mode


Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
11. Mechical spec.
No Item Min Typ Max Unit
1. C/ A + B/ C top gap 0.5 1 1.5 mm
2. C/ A + B/ C side gap 0.5 1 1.5 mm
3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
1) Gap between Front Frame /Back cover and Middle Cabinet
2) Gap between Front Frame /Middle Cabinet
Top View

Back Cover

"b
Middle Cabinet
"b

Front Frame

Gap b between Front Frame (Back cover) and Middle Cabinet


-> 0 b B (Side gap)

"b

Gap a between Front Frame and Middle Cabine


-> 0 a A (Side gap)

"a

Gap a between Front Frame and Middle Cabine


-> 0 a A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Side View
Back View

Side AV

Back Cover

Gap f between Back Cover and Side AV


-> 0 f 1.0
Gap g between Back Cover and Side AV
-> 0 g 1.0

Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
4)Gap between Back Cover and Side AV

"h"
Side View

Control Braket

Back Cover

Gap h between Back Cover and Control Bracket


-> 0 h 0.8
*Active area
1. Active area of LCD PANEL is in bezel of cabinet
2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and beze

Active Area
A B

D Bezel

Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ISP Tool program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, utility Vx.x.x) will be opened
LP91A/B/C/D chassis. 2) Click the Connect button and confirm Dialog Box

2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option
(3) Fownload the EDID
=> EDID datas are automatically downloaded when
adjusting the Tool Option2.
(4) ADC Calibration RGB / Component
(5) Check SW Version. 3) Click the Config. button and Change speed I2C Speed
setting : 350Khz~400Khz
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Toop-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input

4. PCB assembly adjustment method


4.1. Mstar Main S/W program download
- LH20/ LH30
4) Read and write bin file.
Click (1)Read tab, and then load download
file(XXXX.bin) by clicking Read.

Filexxx.bin
1

Filexxx.

4.1.1. Using D/L Jig


(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack

Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
5) Click (2)Auto tab and set as below 4.2. Input tool option
6) Click (3)Run. Adjust tool/area option refer to the BOM.
7) After downloading, you can see the (4)Pass message. - Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process

After Input Tool Option and AC off


Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

4.2.1. Profile : Must be changed the option value because being


different with some setting value depend on
module maker, inch and market

4.2.2. Equipment : Adjustment remote control.


4.2.3. Adjustment method
4.1.2. Using the Memory Stick - The input methods are same as other chassis(Use IN-
* USB download : Service Mode START Key on the Adjust Remocon)
1) Insert the USB memory stick to the ISB port. (If not changed the option, the input menu can differ the
2) Automatically detect the SW Version. model spec.)
-> S/W download process is executed automatically. Refer to Job Expression of each main chassis assy for
3) Show the message Copy the file from the Memory Option value
Caution : Dont Press IN-STOP key after completing the
function inspection.

4.3. EDID D/L method


Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data

4.3.1. 1st Method


EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
4.3.2. 2nd Method <HDMI 2 : 256Bytes>
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then compele.

<HDMI 3 : 256Bytes>

4.3.3. RS-232C command Method


(1) Command : AE 00 10

* Caution
Dont connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.

4.3.4. EDID data


(1) HD MODEL
<Analog(RGB): 128bytes>

<HDMI 1 : 256Bytes>

Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
4.4. ADC Calibration 4.5. Check SW Version
4.4.1. ADC Calibration - Component (Using External pattern) (1) Method
(1) Required Equipments 1) Push In-star key on Adjust remote-controller.
- Remote controller for adjustment 2) SW Version check
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator Check SW VER : V3.xx LH20

(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.


4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A). 5. PCB Assembly adjustment method
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear 5.1. Input Area-Option
5.1.1. Profile : Must be changed the Area option value
OK because being different of each Countrys
Language and signal Condition.
4.4.2. ADC Calibration - RGB (Using External pattern) 5.1.2. Equipment : Adjustment remote control.
(1) Required Equipments 5.1.3. Adjustment method
- Remote controller for adjustment - The input methods are same as other chassis(Use IN-
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator START Key on the Adjust Remocon)
Refer to job Expression of each main chassis assy for Option
(2) Process value.
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar White Balance Adjustment
signal into RGB. - Purpose : Adjust the color temperature to reduce the
(MSPG-925F Model: 60 / Pattern: 65 ) deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192(default data) and
decrease the others.
- Adjustment mode : Three modes - Cool/Medium/Warm

*Required Equipment
- Remote controller for adjustment
- Color Analyzer : CA100+ or CA-210 or same product - LCD
TV(ch:9)
(should be used in the calibrated ch by CS-1000)
3) Press ADJ key on R/C for adjustment. - Auto W/B adjustment instrument(only for Auto adjustment)
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear

OK

Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
5.2. Adjustment of White Balance : 5.3. Adjustment of White Balance (for Manual
(For Automatic Adjustment) adjustment)
Connection diagram of equipment for measuring (1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
* LP91A~D Support RS-232C & I2C DDC Interface for ADC/DDC 3) Change to the AV mode by remote control.
Adjustment 4) Input external pattern (85% white pattern)
- LH60/LH80/LH90 Chassis Support Only I2C interface 5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
(1) Enter the adjustment mode of DDC 7) Enter the W/B ADJUST Mode
- Set command delay time : 50ms 8) Stick the sensor to the center of the screen and select
- Enter the DDC adjustment mode at the same time heat- each items (Red/Green/Blue Gain and Offset) using
run mode when pushing the power on by power only key D/E(CH +/-) key on R/C..
- Maintain the DDC adjustment mode with same condition 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
of Heat-run => Maintain after AC off/on in status of Heat- 10) Adjust three modes all (Cool / Medium / Warm) : Fix
run pattern display) the one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
(2) Release the DDC adjustment mode 12) Exit adjustment mode using EXIT key on R/C.
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off * CASE
command(F3 00 00) from adjustment equipment. First adjust the coordinate far away from the target value(x, y).
- Need to transmit the aging off command to TV set after 1. x, y > target
finishing the adjustment. i) Decrease the R, G.
- Check DDC adjust mode release by exit key and release 2. x, y < target
DDC adjust mode) i) First decrease the B gain,
ii) Decrease the one of the others.
(3) Enter the adjust mode of white balance) 3. x > target, y < target
- Enter the white balance adjustment mode with aging i) First decrease B, so make y a little more than the target.
command (F3, 00, FF)
ii) Adjust x value by decreasing the R
* Luminance min value is 150cd in the Cool/Medium/Warm
4. x < target, y > target
mode(For LCD)
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the


CA100+ or CA210 equipment

Coordinate
Mode Temp uv
x y
Cool 0.2760.002 0.2830.002 11000K 0.000
Medium 0.2850.002 0.2930.002 9300K 0.000
Warm 0.3130.002 0.3290.002 6500K 0.003

To check the Coordinates of White Balance, you have to


measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec

Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
TROUBLESHOOTING

No power : [A] PROCESS


(LED indicator off)

Fail
Check 24V, 12V, 5,2V Check short of Main B/D
of Power B/D or Change Power B/D

Pass

Fail Fail
Check Output of Check short of IC1001, Re-soldering or Change defect
IC1001, IC1003, IC1007 IC1003, IC1007 part of IC1001, IC1003, IC1007

Pass
Pass
Change IC1002,, Q1003

Fail
Check LEDAssy Change LEDAssy

Pass

Check P307 Connector

No Raster [B]: Process

Pass

Check LED status


Repeat A PROCESS
On Display Unit Fail

Pass

Check Panel Link Cable Change Panel Link Cable


Or Module Fail Or Module

Pass

Check Inverter Connector Change Inverter Connector


Or Inverter Fail Or Inverter

Pass

Check Output of IC802 Change IC802


Fail

Pass

Check LVDS Cable Change Module


Fail

Copyright LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
No Raster on PC Signal

Pass

Check Input source Cable


and Jack

Pass

Check the Input/Output Re-soldering or


Of J104 Fail Change the defect part

Pass

Re-soldering or
Check the Input/Output
Of IC100 Fail Change the defect part,
Check RGB EDID Data

Pass

Check the Input/Output Re-soldering or


Of IC800 Fail Change the defect part

Pass

Repeat [A], & [B] Process

No Raster on HDMI Signal


No Raster on COMMPONENT Signal

Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass

Pass Check the Input/Output Re-soldering or


Of JK301, JK302, JK303 Fail Change the defect part
Check The Input/Output Re-soldering or
Of JK101 Fail Change the defect part
Pass
Re-soldering or
Check the Input/Output Change the defect part
Pass Of IC300, IC301, JK302 Check HDMI EDID Data
Fail
Re-download HDCP
Check the Input/Output Re-soldering or Pass
Of IC800 Fail Change the defect part
Check the Input/Output Re-soldering or
Of IC800 Fail Change the defect part

Pass
Repeat [A], & [B] Process

Repeat [A], & [B] Process

Copyright LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal

Pass Pass

Check Input source


Cable And Jack Check Input source
Cable And Jack

Pass
Pass

Check The Input/Output Re-soldering or


Of JK101, JK201 Change the defect part Check The Input/Output Re-soldering or
Fail
Of TU500 Fail Change the defect part

Pass
Pass

Check the Input/Output Re-soldering or


Check the Input/Output Re-soldering or
Of IC800 Fail Change the defect part
Of IC800 Fail Change the defect part

Pass
Pass

Repeat [A], & [B] Process Repeat [A], & [B] Process

No Sound

Check The Input Sourse. Change The Source Input.


Fail

Pass

Check The Input/Output Re-soldering or


Of IC600. Fail Change the defect part.

Pass

Check The Speaker. Change Speaker.


Fail

Pass

Check The Speaker Wire.

Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
Copyright
EEPROM HDM 2_SCL/ SDA
TMDS 24C02 IR
HDMI1 HDMI_DATA_1
HDMI2 TMDS TX
HDMI_DATA_2
EEPROM
HDMI1_SCL/
_ SDA
24C02
PC_Aud io _L/ R :7 00m Vrms
PC_Aud io PC_Aud io _L/ R Serial Flas h
EEPROM ( 8MByt e)
RGB_PC 24C02 PC_SCL/ SDA

Only for training and service purposes


PC_R/ G/ B/ HS/ VS
PC_R/ G/ B/ HS/ VS

COMP1_Y/ Pb / P
Pr : 1/ 0. 7Vp p EEPROM( 256K)
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p
COMP1 COMP2_Y/ Pb /Pr/ : 1/ 0. 7Vp p
COMP2_Y/ Pb / Pr: 1/0. 7Vp p
COMP2 Co mp 1_L/ R :5 00mVrms
COMP1_LIN/
MNT_OUT RIN
Co mp 2_L/ R :5 00mVrms
COMP2_LIN/ RIN

LG Electronics. Inc. All right reserved.


DDR2( 512MB)

AV1_VIN: 1Vp p
AV1_VIN
MNT_OUT MNT_OUT: 1Vp p
MNT_VOUT
AV1 AV11_LIN/ RIN :5 00m Vrms
AV1_LIN/ RIN

MNT_LOUT/ ROUT: 500m Vrm s AUDIO


MAIN SCALER

- 19 -
MNT_L/ R OUT
AMP OUT_E_TX_A
OUT_E_TX_A
OUT_E_TX_B
OUT_E_TX_B
TV TU_MAIN TU_MAIN OUT_E_TX_C
OUT_E_TX_C
TUNER SUB_SCL / SDA OUT_E_TX_CLK
OUT_E_TX_CLK
( RF)
SIF SIF OUT_E_TX_
OUT_E_TX_D
OUT_E_TX_
OUT_E_TX_E
Tx/ Rx : 15Vp p 232C Driver
TXD / RXD :5V Dig it al OUT_O_TX_A
OUT_O_TX_A
ST3232C OUT_O_TX_B
OUT_O_TX_B
RS232
BLOCK DIAGRAM

OUT_O_TX_C
OUT_O_TX_C
OUT_O_TX_CLK
OUT_O_TX_C
L VDS c onnec tor

USB OUT_O_TX_D
OUT_O_TX_D
Fo r D/ L OUT_O_TX_E
OUT_O_TX_E

USB USB_DN/ PN
EEPROM HDMI3_SCL/ SDA
TMDS 24C02
HDMI3 HDMI_DATA_3 PWM
NTP3100L
IIS_OUT R_CH R_SPK_OUT
L_CH L_SPK_OUT
SIDE_L/ SIDE_R :5 00mVrms
AV2 AV2_LIN/ RIN
( Sid e AV) SIDE_V : 1Vp p
AV2_VIN

LGE Internal Use Only


EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

A10
400

LV1
805

521

540
530

806

A2
801

803
804

550
802
200

900
200T

120
300

200N

510

310
500

Copyright LG Electronics. Inc. All right reserved. - 20 - LGE Internal Use Only
Only for training and service purposes
Copyright
4.7K R8010 4.7K R8011 +3.3V_MULTI_MST
R896 4.7K R898 4.7K
*H/W OPTION Small_HD Small_HD Non_Small_FHD
+3.3V_MULTI_MST
Small_FHD
R896 R898 R8010 R8011 R8010-*3 R8011-*3 R896-*2 R898-*2
4.7K 4.7K 4.7K 4.7K
Small HD 4.7K X 4.7K X Apollo 100Hz Non_Small_HD 100Hz DDR2_A[0-12]
Small FHD (27) 4.7K X 4.7K R8010-*2 R8011-*2 R896-*1 R898-*1
4.7K 4.7K 4.7K 4.7K 4.7K
Non Small HD 4.7K X X 4.7K Non_Small_FHDApollo Small_FHD Apollo

DDR2_A[3]
DDR2_A[7]
DDR2_A[9]
DDR2_A[5]
DDR2_A[1]
DDR2_A[8]
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
R8010-*1 Close to IC as close as possible

DDR2_A[12]
DDR2_A[10]
DDR2_A[11]
R8011-*1

POWER_SW
Non Small FHD X 4.7K 4.7K X 4.7K 4.7K +1.2V_VDDC_MST
Apollo X 4.7K 4.7K 4.7K Small_FHD Non_Small_HD +5VST_MST +1.8V_DDR
R8020
100HZ X 4.7K X 4.7K +3.3V_MST 10K +3.3V_MST
IC802
** Small HD : 19/22/26 Inch R8003

DDR2_CKE
DDR2_BA0
DDR2_BA1
DDR2_WEZ
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
SERIAL FLASH 64M MX25L6405DMI-12G
** Non Small FHD : Normal(non 100Hz) FHD Model
C811
10K C857 C859 C877 C878 C879
+3.3V_MULTI_MST 0.1uF 0.01uF 0.01uF 0.01uF

R867 1K
0.01uF 0.01uF
1 HOLD SCLK 16 I2S_OUT +3.3V_MULTI_MST
SPI_CLK +1.8V_DDR
C807

56
0.1uF
0.1uF
1K
0.01uF 2 VCC SI.SIO015

LED_R
TXD
RXD

KEY2
KEY1
SPI_DI

EEP_SCL
EEP_SDA

IR
RXD
TXD
I2S_SDO
I2S_SCK
I2S_WS
I2S_MCLK
PANEL_STATUS
AR812
56
AR813
56
AR814
56
AR815
56
AR800
56

RL_ON

PC_VS
PC_HS

CEC_C
SYS_RESET
L802

DSUB_SDA
120-ohm C864 C858 C860 C862 C865

R852
C844
C863
R868
3 NC_1 NC_8 14 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF

C817 20pF
C816 20pF
+1.8V_DDR
4 NC_2 NC_7 13
+3.3V_MULTI_MST +1.2V_VDDC_MST

X801
12MHz
READY
READY
+3.3V_MULTI_MST

0
0
100
100
100
100
100
100
0
0
0.1uF
100
+3.3V_MULTI_MST 5 NC_3 NC_6 12

100 R8022
100 R8021
R878 C867

R839
1M
C866

R8035
R8034
R895
R849
R850
R8012
R824
R825
R8016
R8017
C883
R829
6 NC_4 NC_5 11 4.7K 0.1uF 10uF
R877

Only for training and service purposes


4.7K
7 CS GND 10 C R828
SPI_CZ B DDC_WP
E 10K

194
L800
Q805 READY 120-ohm
8 SO/SIO1 WP/ACC 9

XIN 244

CEC 255
RT1C3904-T112

IRIN 250
SAR3 241
SAR2 240
SAR1 239
SAR0 238
SPI_DO

XOUT 243
READY R851 10 1 RXBCKN B_MCLKZ 192 R843 33

A_ODT 196

A_WEZ 206

SPDIFO 229
MVREF 195
TMDS2_RXC- DDR2_MCLKZ

GND_18 235
GND_17 234
GND_16 225
GND_15 202
GND_14 193
DDR2_D[0-15]

VDDP_5 224
A_CASZ 198
A_RASZ 197

GPIO140 249
GPIO139 248
GPIO138 247
GPIO135 246
GPIO134 245
VDDC_7 226
VDDC_6 218

VSYNC1 254
HSYNC1 253
VSYNC0 252
HSYNC0 251
USB0_DP 237
USB0_DM 236

HWRESET 256
I2S_IN_SD 221
A_MCLKE 217
R854 10 2 RXBCKP B_MCLK 191 R844 33

A_BADR[0] 208
A_BADR[1] 207
TMDS2_RXC+ DDR2_MCLK

A_MADR[3] 216
A_MADR[7] 215
A_MADR[9] 213
A_MADR[5] 212
A_MADR[1] 209
A_MADR[8] 204
A_MADR[6] 203
A_MADR[4] 201
A_MADR[2] 200
A_MADR[0] 199

I2S_OUT_SD 228
A_MADR[12] 214
A_MADR[10] 210
A_MADR[11] 205

I2S_OUT_WS 223

AVDD_MPLL 242
I2S_OUT_BCK 227
AVDD_DDR_6 211
R856 10 3 RXB0N B_MDATA[5] 190 DDR2_D[5]

I2S_OUT_MCK 222
TMDS2_RX0-

AVDD_MEMPLL
R858 10 4 RXB0P B_MDATA[2] 189 AR805 DDR2_D[2]

I2S_IN_WS/GPIO67219
TMDS2_RX0+

UART1_TX/GPIO87 233
UART1_RX/GPIO86 232
I2S_IN_BCK/GPIO68220
5 HOTPLUGB B_MDATA[0] 188 56 DDR2_D[0]

UART2_TX/I2CM_SCK 231
HPD_MST_2

UART2_RX/I2CM_SDA 230
TMDS2_RX1- R859 10 6 RXB1N B_MDATA[7] 187 DDR2_D[7]
R862 10 7 RXB1P AVDD_DDR_5 186 C853 0.1uF

HDMI_2
EEPROM TMDS2_RX1+
8 AVDD_33_1 B_MDATA[13] 185 DDR2_D[13]
IC801 C833 0.1uF R869 10 9 RXB2N B_MDATA[10] 184 AR806 DDR2_D[10]
TMDS2_RX2-
24LC256-I/SM R871 10 10 RXB2P GND_13 183 56 DDR2_D[8]
+3.3V_MULTI_MST TMDS2_RX2+
TMDS1_RXC- R872 10 11 RXACKN B_MDATA[8] 182 DDR2_D[15]
A0 VCC TMDS1_RXC+ R873 10 12 RXACKP B_MDATA[15] 181
1 8
TMDS1_RX0- R874 10 13 RXA0N AVDD_DDR_4 180
C803 TMDS1_RX0+ R879 10 14 RXA0P B_DDR2_DQSB[1] 179 DDR2_DQS1M
A1 WP 0.01uF
2 7 R8027 R8028 15 AVDD_33_2 B_DDR2_DQS[1] 178 DDR2_DQS1P
4.7K 4.7K C815 0.1uF TMDS1_RX1- R880 10 16 RXA1N GND_12 177

HDMI_1
A2 SCL TMDS1_RX1+ R890 10 17 RXA1P VDDP_4 176 C849 0.1uF
3 6 R812 22
EEP_SCL 18 GND_1 AVDD_DDR_3 175
R891 10 19 RXA2N B_DDR2_DQSB[0] 174

LG Electronics. Inc. All right reserved.


VSS SDA TMDS1_RX2- DDR2_DQS0M
4 5 R813 22 TMDS1_RX2+ R892 10 20 RXA2P B_DDR2_DQS[0] 173 DDR2_DQS0P
EEP_SDA HPD_MST_1 21 HOTPLUGA GND_11 172
IC800
R840 390 22 REXT B_DDR2_DQM[0] 171 DDR2_DQM0
C819 0.1uF C804 0.1uF 23 VCLAMP B_DDR2_DQM[1] 170 DDR2_DQM1
C804/C805/C806:Close to IC C805 0.1uF 24 REFP AVDD_DDR_2 169
as close as possible C806 0.1uF 25 REFM MST99A88ML(MATRIX BASIC) B_MDATA[14] 168 DDR2_D[14]
R814 47 C843 0.047uF 26 BIN1P B_MDATA[9] 167 AR809 DDR2_D[9]
PC_B
R803 470 C846 1000pF 27 SOGIN1 GND_10 166 56 DDR2_D[12]
HDCP EEPROM PC_G
+3.3V_MULTI_MST R816 47 C845 0.047uF 28 GIN1P B_MDATA[12] 165 DDR2_D[11]
PC_R R818 47 C847 0.047uF 29 RIN1P B_MDATA[11] 164
R838 47 C825 0.047uF 30 BINM AVDD_DDR_1 163
IC803 31 BIN0P B_MDATA[6] 162 DDR2_D[6]
R833 47 C827 0.047uF 32 GINM B_MDATA[1] 161 AR810 DDR2_D[1]
R8004 CAT24WC08W-T R817 33 GIN0P GND_9 160 56 DDR2_D[3]
4.7K 4.7K 34 SOGIN0 B_MDATA[3] 159 DDR2_D[4]
A0 VCC
1 8 R836 47 C829 0.047uF 35 RINM B_MDATA[4] 158
36 RIN0P VDDC_5 157
A1 WP 37 AVDD_33_3 VDDP_3 156 C848 0.1uF R8018
2 7 1K
C838 0.1uF 38 GND_2 GPIO58 155 MUTE_LINE R865 4.7K
R832 47 C826 0.047uF 39 BIN2P GPIO57 154 R8038 1K
A2 SCL COMP2_PB SUB_SCL R866 4.7K +3.3V_MULTI_MST
3 6 R8005 22 COMP2_Y R834 47 C828 0.047uF 40 GIN2P GPIO56 153 SUB_SDA
EEP_SCL R8042 100
R835 470 C835 1000pF 41 SOGIN2 GPIO55 152 S_VIDEO_DET
VSS SDA COMP2_PR R837 47 C830 0.047uF 42 RIN2P GPIO54 151 PANEL_ON R819 3.3K
4 5 R8006 22
EEP_SDA SIDE_C R804 47 C800 0.047uF 43 CVBS6 GPIO53 150 DISP_EN/VAVS_ON
S-VIDEO
SIDE_Y R815 47 C801 0.047uF 44 CVBS5 GPIO52 149 SW_RESET
CVBS_VIN R897 47 C831 0.047uF 45 CVBS4 GPIO51 148 DDC_WP
MSTAR

SIDE_V R802 47 C832 0.047uF 46 CVBS3 GND_8 147


47 CVBS2 GPIO152/I2C_OUT_SD3 146 R893 4.7K
48 CVBS1 GPIO151/I2C_OUT_SD2 145
R831 47 C834 0.047uF 49 VCOM1 GPIO150/I2C_OUT_MUTE 144 OPC_EN
TV_MAIN R857 47 C836 0.047uF 50 CVBS0 VDDC_4 143
+12V_AUDIO
GAIN X 4 C810 0.01uF R830 47 C837 0.047uF 51 VCOM0 GND_7 142
52 AVDD_33_4 AVDD_LPLL 141 C850 0.01uF
TXCO4-
MNT_VOUT_T 53 CVBSOUT LVB0M 140
R809 TXCO4+
54 GND_3 LVB0P 139
470 TXCO3-
E MAIN_SIF R875 47 C868 0.1uF 55 SIF0P LVB1M 138
C B TXCO3+
R876 47 C869 0.1uF 56 SIF0M LVB1P 137
TXCLKO-
Q801 C R8041 57 VDDC_1 LVB2M 136
ISA1530AC1 B TXCLKO+
SIDE_LIN C856 2.2uF 58 AUL5 LVB2P 135
E 47 TXCO2-
SIDE_RIN C861 2.2uF 59 AUR5 LVBCKM 134
Q802 MNT_VOUT_T TXCO2+
R808 220 RT1C3904-T112 60 AUVRM LVBCKP 133
MNT_VOUT TXCO1-
MNT_L_AMP R882 100 61 AUOUTL2 LVB3M 132
TXCO1+
MNT_R_AMP R881 100 62 AUOUTR2 LVB3P 131
R807 402 R810 TXCO0-
68 R846 100 63 AUOUTL1 LVB4M 130
READY R842 22K TXCO0+
SCHEMATIC DIAGRAM

R847 100 64 AUOUTR1 LVB4P 129


C839 0.01uF

AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2

R845 22K
C841 0.01uF

65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
96
99
102
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128

P_24V_SMALL_15V
P_12V_SMALL_15V NON 19_22"
Q804 C842 0.1uF
R800 RT1C3904-T112 NON 19_22"
R8001
AR818
33

R8037

0
0
0
0

0 READY
0.1uF

READY
100
100
100
100
10 HDMI3_SIDE 94
10 HDMI3_SIDE 95
10 HDMI3_SIDE 97
10 HDMI3_SIDE 98
10 HDMI3_SIDE 100
10 HDMI3_SIDE 101
10 HDMI3_SIDE 103
10 HDMI3_SIDE 104
0
0

2.2uF
C B R8007 33K RL_ON TXCE4-
0 E NON 19_22" 0
0 C871 TXCE4+
4.7uF TXCE3-

GND
R894
R899
C876 0.01uF

10V TXCE3+

C823 2.2uF
C824 2.2uF
C802 2.2uF
C873 2.2uF
C874 2.2uF
C875 2.2uF
C808 0.1uF
C821
C822 2.2uF
C840 0.01uF
R806
R870

R8033

R8023
R8024
R8025
R8026
C882
R8039 100 HDMI3_SIDE
R801
R805
R8040 100HDMI3_SIDE
R820
R821
R822
R823
R841
R848
R826
R827

READY TXCLKE-
TXCLKE+
D801 POWER_DET TXCE2-
KDS181 TXCE2+
L801
R885 150 +5VST_MST TXCE1-
120-ohm

D802
TXCE1+
I-DIM

R860 1K KDS181
E-DIM

SPI_DI
SPI_CZ

USB_DN
SPI_DO

TXCE0-
SPI_CLK

R855

COMP2_L
COMP2_R

CVBS_LIN
CVBS_RIN
TXCE0+
DDC_SCL1
DDC_SCL2
DDC_SCL3

PC_AUD_L
DSUB_SCL

PC_AUD_R
DDC_SDA1
DDC_SDA2
DDC_SDA3

DSUB_SDA
POWER_DET

R8036 10K
HPD_MST_3

TMDS3_RX0-
TMDS3_RX1-
TMDS3_RX2-

TMDS3_RXC-
TMDS3_RX0+
TMDS3_RX1+
TMDS3_RX2+

TMDS3_RXC+

20K C870 +1.2V_VDDC_MST HDMI_3


19_22_26" 47uF25V +5VST_MST C MULTI_PW_SW
R853 B Q803 +3.3V_MULTI_MST
USB PART USB_DP

RT1C3904-T112
Q800 SW800 1K 4.7K R863
ISA1530AC1 C8000 2.2uF E +3.3V_MULTI_MST +3.3V_MULTI_MST
JTP-1127WEM 16V 4.7K R864

2
READY
R861 1K B E
C SYS_RESET

3 1
4
R886 +5VST_MST
R811 R883
2K 1K 1K
C809 10uF 16V
C813 0.1uF
C818 1000pF
C820 4.7uF

C812 READY
M_SCL

R8000
M_SDA

Close to IC
with width trace

10K R888 100 4.7uF


C814 R887
0.1uF 33K D803
HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140
GPIO139
GPIO138
GPIO135
GPIO134
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14

256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193

RXBCKN 1 192 B_MCLKZ


RXBCKP 2 191 B_MCLK
RXB0N 3 190 B_MDATA[5]
RXB0P 4 189 B_MDATA[2]
HOTPLUGB 5 188 B_MDATA[0]
KDS181 R889 R884 RXB1N
RXB1P
AVDD_33_1
6
7
8
187
186
185
B_MDATA[7]
AVDD_DDR_5
B_MDATA[13]
RXB2N 9 184 B_MDATA[10]
RXB2P 10 183 GND_13
RXACKN 11 182 B_MDATA[8]
1K 1K RXACKP
RXA0N
12
13
181
180
B_MDATA[15]
AVDD_DDR_4
RXA0P 14 179 B_DDR2_DQSB[1]
AVDD_33_2 15 178 B_DDR2_DQS[1]
RXA1N 16 177 GND_12
READY RXA1P
GND_1
17
18
176
175
VDDP_4
AVDD_DDR_3
RXA2N 19 174 B_DDR2_DQSB[0]
RXA2P 20 173 B_DDR2_DQS[0]
HOTPLUGA 21 172 GND_11
REXT IC800-*1
22 171 B_DDR2_DQM[0]
VCLAMP 23 170 B_DDR2_DQM[1]
REFP 24 169 AVDD_DDR_2
REFM 25
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ] 168 B_MDATA[14]
BIN1P 26 167 B_MDATA[9]
SOGIN1 27 166 GND_10
GIN1P 28 165 B_MDATA[12]
RIN1P 29 164 B_MDATA[11]
RESET BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
30
31
32
33
34
163
162
161
160
159
AVDD_DDR_1
B_MDATA[6]
B_MDATA[1]
GND_9
B_MDATA[3]
35 158 B_MDATA[4]
RIN0P 36 157 VDDC_5
AVDD_33_3 37 156 VDDP_3
GND_2 38 155 GPIO58
BIN2P 39 154 GPIO57
GIN2P 40 153 GPIO56
SOGIN2 41 152 GPIO55
RIN2P 42 151 GPIO54
CVBS6 43 150 GPIO53
CVBS5 44 149 GPIO52
CVBS4 45 148 GPIO51
CVBS3 46 147 GND_8
CVBS2 47 146 GPIO152/I2C_OUT_SD3
CVBS1 48 145 GPIO151/I2C_OUT_SD2
VCOM1 49 144 GPIO150/I2C_OUT_MUTE
CVBS0 50 143 VDDC_4
VCOM0 51 142 GND_7
AVDD_33_4 52 141 AVDD_LPLL
CVBSOUT 53 140 LVB0M
GND_3 54 139 LVB0P
SIF0P 55 138 LVB1M
SIF0M 56 137 LVB1P
VDDC_1 57 136 LVB2M
AUL5 58 135 LVB2P
AUR5 59 134 LVBCKM
AUVRM 60 133 LVBCKP
AUOUTL2 61 132 LVB3M
AUOUTR2 62 131 LVB3P
[MODE SELECTION] AUOUTL1
AUOUTR1
63
64
130
129
LVB4M
LVB4P
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128

SDI
SCZ

SCK
SDO

AUL0
AUL1
AUL2
AUL3
AUL4

AUR0
AUR1
AUR2
AUR3
AUR4
PWM0
PWM1
PWM2
PWM3

RXC0P
RXC1P
RXC2P
LVA4P
LVA3P
LVA2P
LVA1P
LVA0P

GND_4
GND_5
GND_6

RXC0N
RXC1N
RXC2N

GPIO20

AUVRP
LVA4M
LVA3M
LVA2M
LVA1M
LVA0M

AUVAG

AUCOM
VDDP_1
VDDP_2

VDDC_2
VDDC_3
RXCCKP
LVACKP

RXCCKN
USB1_DP
LVACKM

USB1_DM

DDCA_CK
DDCA_DA

AVDD_AU
AVDD_DM

UART2_TX
UART2_RX
HOTPLUGC

DDCDB_CK
DDCDC_CK

DDCDA_CK
DDCDB_DA
DDCDC_DA

DDCDA_DA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LGE Internal Use Only


Copyright
DDR2_D[0-15]
DDR2_D[0-15]

+1.8V_DDR V_REF

1K
R907
C904 C905 C918

1K
0 . 0 1 u F 1000pF 0.1uF
50V

R908
V_REF
IC900
Close to DDR2 IC HYB18TC512160B2F-2.5
DDR2_A[0-12]
VREF DQ0 DDR2_D[0]
J2 G8
DQ1 DDR2_D[1]
G2
DQ2 DDR2_D[2]
DDR2_A[0] H7

Only for training and service purposes


A0 M8 DDR2_D[3]
DDR2_A[1] H3 DQ3
A1 M3 DDR2_D[4]
DDR2_A[2] H1 DQ4
A2 M7 DDR2_D[5]
DDR2_A[3] H9 DQ5
A3 N2 DDR2_D[6]
DDR2_A[4] F1 DQ6
A4 N8 DDR2_D[7]
DDR2_A[5] F9 DQ7
A5 N3 DDR2_D[8]
DDR2_A[6] C8 DQ8
A6 N7 DDR2_D[9]
DDR2_A[7] C2 DQ9
A7 P2 DDR2_D[10]
DDR2_A[8] D7 DQ10
A8 P8 DDR2_D[11]
DDR2_A[9] D3 DQ11
A9 P3 DDR2_D[12]
DDR2_A[10] D1 DQ12
A10/AP M2 DDR2_D[13]
DDR2_A[11] D9 DQ13
A11 P7 DDR2_D[14]
DDR2_A[12] B1 DQ14 Close to DDR2 IC
A12 R2 DDR2_D[15]
B9 DQ15
+1.8V_DDR
DDR2_BA0 BA0 L2
+1.8V_DDR
BA1 L3 VDD5

LG Electronics. Inc. All right reserved.


DDR2_BA1 A1
R906 E1 VDD4
150 C901 C902 C903 C906 C907 C908 C909 C910 C911 C912 C913 C914 C915 C916 C917
CK J8 J9 VDD3 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF
DDR2_MCLK CK VDD2
K8 M9
DDR2_MCLKZ READY CKE VDD1
K2 R1
DDR2_CKE
ODT K9
DDR2_ODT CS VDDQ10
L8 A9
RAS K7 C1 VDDQ9
DDR2_RASZ CAS VDDQ8
L7 C3
DDR2_CASZ WE VDDQ7
K3 C7
DDR2_WEZ VDDQ6
C9
R900 E9 VDDQ5
LDQS F7
DDR2_DQS0P 56 G1 VDDQ4
R901 UDQS B7
DDR2_DQS1P 56 G3 VDDQ3
G7 VDDQ2
R902 LDM VDDQ1
F3 G9
DDR2_DQM0 56 UDM
R903 B3
DDR2

DDR2_DQM1 56

R904 LDQS VSS5


E8 A3
DDR2_DQS0M 56 UDQS VSS4
R905 A8 E3
DDR2_DQS1M 56 VSS3
J3
N1 VSS2
NC4 L1
P9 VSS1
NC5 R3
NC6 R7

B2 VSSQ10
NC1 A2
B8 VSSQ9
NC2 E2
A7 VSSQ8
NC3 R8
D2 VSSQ7
D8 VSSQ6
+1.8V_DDR VSSDL E7 VSSQ5
J7
F2 VSSQ4
F8 VSSQ3
H2 VSSQ2
VDDL J1 H8 VSSQ1
C900 C919
0.01uF 10uF
50V 10V

DDR2 MEMORY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LGE Internal Use Only


Copyright
L1000
CIC21J501NE
P_24V_SMALL_15V +16V_NTP
EAM58113401 C1001
C1006 C1046 0.1uF
68uF 0.01uF 50V

L1012
35V
MLB-201209-0120P-N2
P_12V_SMALL_15V +12V_AUDIO **5V_MULTI->3.3V->1.2V
120-ohm C1002 C1007
P1001 47uF 25V 0.01uF
FM20020-24
L1001
P_5V +5VST_MST
NC 1 2 Power ON 120-ohm C1003 C1008 C1011
GND 3 4 GND 10uF 0.01uF 0.01uF
GND GND
IC1001
5 6 16V
5.2V 5.2V
BD9130EFJ-E2
7 8
5.2V 9 10 5.2V
GND 11 12 GND ADJ EN
1 8
12V 13 14 12V
GND GND
*ST 5V->3.3V 10K
15 16 R1006
VCC PVCC
24V 17 18 24V 2 7
+5V_MULTI
NC 19 20 Inverter ON L1002
A.Dim Error Out 2.2uH OUT:1.27V
21 22 ITH SW
IC1007 3 6 +1.2V_VDDC_MST
NC 23 24 PWM Dim
AP2121N-3.3TRE1 C1004 C1017 R2 C1036
10uF R1008 R1078
10uF

R1009
2K
1%
12K GND PGND C1014 1uF 25V
16V 4 5 3.3
25 16V 0 . 1 u FC1013 C1018 READY
VIN 3 2 VOUT READY 10uF
+5VST_MST +3.3V_MST C1055 16V 10uF

.
MAX 300mA C1012 16V 16VR1010
26" 1 C1053 C1034 2200pF 3.3K R1
C1052 560pF MAX 2A

1/10W 1/10W
0.01uF 1uF 25V 50V 1%
GND 10uF16V 50V
READY READY

Only for training and service purposes


P1000 V0 = 0.8*(1+(R2/R1))
FW20020-24S IC1003
AZ1085S-3.3TR/E1
P_5V R1013
0
NON 19_22" R1073 0 INPUT 3
MAX 3A
2 OUTPUT OUT:3.3V +3.3V_MULTI_MST
R1000 19_22" IC1002
C1054 1 C1028
R1077 0 NC Power ON 2.2K P1002 0.1uF ADJ/GND 100uF16V AP1117EG-13
1 2 L1013
SMAW200-11 MLB-201209-0120P-N2
READY GND GND 3 IN OUT OUT:1.85V
3 4 R1003 10K 3 MAX 1A 2 +1.8V_DDR
12 RL_ON 1 120-ohm DDR2, Vref
NON 19_22" R1 R1004
GND GND C1016 C1015
5 6 ADJ/GND 120 C1022 C1023 C1037
Q1000 10uF 0.1uF 10uF 0.1uF
5.2V 2SC3875S 15V 10V 50V
5% 6.3V 50V 1uF 25V +1.8V
7 8 5.2V NON 19_22" 1 READY NTP,AUDIO DSP
P_5V P_5V R1007
R2
5.2V 5.2V 56
9 10 1%
15V
GND 11 12 GND 2
12V 13 14 12V V0 = 1.25*(1+(R2/R1))
P_12V_SMALL_15V P_12V_SMALL_15V

R1074
0
1/4W
5%
GND

19_22"
GND GND 3
15 16
24V 24V

LG Electronics. Inc. All right reserved.


P_24V_SMALL_15V 17 18 P_24V_SMALL_15V GND
NC Inverter ON 4
19 20
A.Dim 21 22 Error Out 5V
5
NC 23 24 PWM Dim **Switch 12V:P12V
5V
6
**Switch 5V:5V_MULTI -> 1.8V
NC P_5V P_12V_SMALL_15V
NON_19_22_26" 7
L1005 L1006
120-ohm 120-ohm
NC
8 19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"
Q1003
C1027 R1049 C1056 SI4925BDY
68uF 33K 1uF25V
Inverter_ON 35V EBK32753101
9 READY
Close to Q1003 R1065 L1007
33K NON 19_22" S1 D1_2 MLB-201209-0120P-N2
R1065-*1 1 8 +5V_+12V_LCD
PWM_Dim 19_22" 10K C C1005 0LCML00003B R1050 R1051 R1052 C1009 C1010
10 R1048 10K B Q1001 G1 2 0.1uF 2.2K 2.2K 2.2K 100uF16V 0.01uF
7 D1_1
PANEL_ON RT1C3904-T112
R1020 E
A.Dim 10K S2 3 6 D2_2
POWER

11
P_5V G2 D2_1
4 5 +5V_MULTI
C1019 C1021
10uF 16V 0.01uF
C1048
R1070 1uF
22K

R1069
1.6K
R1054 4.7K R1001 0
PANEL_STATUS C
NON SHARP 32&52",AUO NON CMO 57" R1068
25V 10K B Q1004
R1053 C1043
0 0.47uF POWER_SW RT1C3904-T112
SHARP 52",AUO NON SHARP 52",AUO E
R1014
0
CMO 32,42,47,57

+5V_MULTI
R1064 0
R1046
3K
R1040 0 V0 = 0.8*(1+(R1/R2)) OUT:5V L1010
**DC-DC CONVERTER MLB-201209-0120P-N2
CMO 57" +5V_TUNER
R1041 3 +5V_MULTI C1000 C1020 C1025
0 R1047 10K 10uF 10uF 0.1uF C1038
DISP_EN/VAVS_ON C1026
CMO 57" 1 2 Q1002 100uF 16V 16V 16V 1uF 25V
R1039 2SC3875S 12V->5V_TUNER/USB 16V READY
0 R1059 READY R1056
CMO 32,42,47 R1023 10 +5V_USB
R1042 0 10K
0 NON (CMO 32,42,47,57, SHARP 32") NON 19_22"
OPC_DISABLE
R1076 C1024
1K 0.1uF
R1043 0 R1044 1K 50V
NON CMO 32,42,47,57 DC_DIM E-DIM R1057 IC1006 READY
R1075 R1 MP2212DN
1K 30K
LED Block C1045 OPC_OUT R1018
2.2uF 16V R1044-*1
100 OPC_ENABLE 2K
R1022
DC_DIM PWM_DIM R1021 1K FB 1 8 EN/SYNC NON 19_22"
1K R1058 C1032 MAX 3A +5V_MULTI
*SHARP32":DC DIMMING OPC_DISABLE OPC_ENABLE 560pF
19_22" R2 5.6K L1009 3.6uH 19_22"
Small(19_22")
+5VST_MST +5V_MULTI 50V
R1079 D1001 R1016
R10450 10K GND2 7 SW_2
R1015 10 4.7K
R1002 R1005 CMO 32,42,47,57 C1044
I-DIM L1008 S2A 50V +5V_MULTI
CIC21J501NE R1012 19_22"
10K 1.2K 2.2uF 16V IN 3 6 SW_1
0 R1024 3 R1017 10K
**OPC_ENABLE : USE LGD Module P_12V_SMALL_15V NON 19_22" C1030 C1031 RL_ON
10uF 10uF 10 12 19_22"
25V 25V BS 4 5 VCC
Q1005
D1002 C1035 C1029 C1033 2SC3875S
0.1uF
1uF 25V 50V 0.1uF 19_22"
SAM2333 50V
R1011

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LGE Internal Use Only


Copyright
AMP :GAIN X 4
+12V_AUDIO
IC601
+1.8V
HOTEL_OPT
L606 C
120-ohm +16V_NTP C620 R613-*12K
0.1uF Q600 B
MLB-201209-0120P-N2 RT1C3904-T112
1 OUT1 LM324DOUT4 14
+1.8V_AVDD R607 NON_HOTEL_OPT
1K
0LCML00003B E R613 10K
C642 C615 C617 R604 C612
READY 3.3 330uF35V C627
L605 10uF 0.1uF 0.1uF 6800pF
120-ohm 35V
R605 C631 33pF
+1.8V_DVDD C613 MNT_LOUT 4.7K 2 INPUT1- INPUT4- 13
MLB-201209-0120P-N2 0.01uF
R618
0LCML00003B 6.8K

Only for training and service purposes


C672 SPK_L+
R608 R611 0.01uF
12 12 C637 R663 R614 5.6K 3 INPUT1+ INPUT4+ 12
L603 0.1uF 4.7K MNT_L_AMP
C619 2S DA-8580 2F R626
390pF 3.3
C632
C621 1S 1F 0.47uF R625 +12V_AUDIO
390pF C669 3.3
R610 R638
EAP38319001 0.1uF R623
4.7K
4 VCC GND 11
C671 SPK_L-
C635
12 12 0.01uF 0.01uF
+3.3V_MST
SPK_L-
C616
C611 22000pF 22000pF C618 R615 5.6K 5 INPUT2+ INPUT3+ 10
R630 1uF MNT_R_AMP
10K
C633 33pF
+12V_AUDIO NON_HOTEL_OPT
C
R629 10KB R616 10K 6 INPUT2- INPUT3- 9

PGND1A_2
PGND1A_1
OUT1A_2
OUT1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
OUT1B_2
OUT1B_1
PGND1B_2
PGND1B_1
BST1B
VDR1B
Q603
RT1C3904-T112 R622
E HOTEL_OPT 6.8K
C622 C

56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF R616-*12K
READY Q601 B
RT1C3904-T112 7 OUT2 OUT3 8
R624

LG Electronics. Inc. All right reserved.


NC R609
SW_RESET BST1A 1 42 1K
E
0 MNT_ROUT
READY
R631 VDR1A 2 41 VDR2A
C628
22KREADY R606
C608 C624 4.7K 6800pF
R627 R601 100 1uF RESET 3 40 BST2A 1uF
MULTI_PW_SW 0 C606
1000pF AD 4 39 PGND2A_2