Solutions for Fundamentals of Modern Manufacturing, 5e (published by Wiley) MPGroover 2012

34 ELECTRONICS ASSEMBLY AND PACKAGING

Review Questions
34.1 What are the functions of a well-designed electronics package?
Answer. The principal functions are (1) power distribution and signal interconnection, (2) structural
support, (3) environmental protection, (4) heat dissipation, (5) minimum delays in signal
transmission.
34.2 Identify the levels of packaging hierarchy in electronics.
Answer. The levels are (0) chip intraconnections, (1) IC chip to IC package, (2) IC component to
PCB, (3) PCB to rack or chassis, and (4) wiring and cabling inside a cabinet.
34.3 What is the difference between a track and a land on a printed circuit board?
Answer. A track is a copper-conducting path on a PCB, while a land is a small copper area for
electrically attaching components.
34.4 Define printed circuit board (PCB).
Answer. A PCB is a laminated flat panel of insulating material to which electronic components are
attached and electrically interconnected.
34.5 Name the three principal types of printed circuit board.
Answer. The three types are (1) single-sided board, (2) double-sided board, and (3) multilayer
board.
34.6 What is a via hole in a printed circuit board?
Answer. A via hole is a hole in the printed circuit board whose sides are plated with copper to serve
as a conducting path from one side of a PCB to the other or between intermediate layers in a
multilayer board.
34.7 What are the two basic methods by which the circuit pattern is transferred to the copper surface of
the boards?
Answer. The two methods are (1) screening, such as silk screening, and (2) photolithography.
34.8 What is etching used for in PCB fabrication?
Answer. Etching is used to remove copper cladding on the PCB surface to define the tracks and
lands of the circuit.
34.9 What is continuity testing, and when is it performed in the PCB fabrication sequence?
Answer. Continuity testing is an electrical test in which contact probes are brought into contact
with track and land areas to insure the existence of electrical conduction paths. Continuity tests are
generally used (1) after the bare board has been fabricated and (2) again after the board has been
populated with components.
34.10 What are the two main categories of printed circuit board assemblies, as distinguished by the
method of attaching components to the board?
Answer. The two categories are (1) pin-in-hole technology, also known as through-hole technology,
and (2) surface mount technology.

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Solutions for Fundamentals of Modern Manufacturing, 5e (published by Wiley) MPGroover 2012

34.11 What are some of the reasons and defects that make rework an integral step in the PCB fabrication
sequence?
Answer. Rework is required to correct the following types of defects: (1) replace defective
components, (2) insert missing components, (3) repair faulty solder joints, and (4) repair of copper
film that has lifted from the substrate surface.
34.12 Identify some advantages of surface-mount technology over conventional through-hole technology.
Answer. Advantages of SMT include (1) smaller components, (2) higher packing densities, (3)
components can be mounted on both sides of the board, (4) smaller PCBs are possible for the same
function, (5) reduced number of holes drilled in the board, and (6) certain undesirable electrical
effects are reduced, such as spurious surface capacitances and inductances.
34.13 Identify some limitations and disadvantages of surface-mount technology.
Answer. Limitations and disadvantages of SMT include (1) components are more difficult for
humans to handle, (2) SMT components are generally more expensive than THT components, (3)
inspection, testing, and rework are more difficult, and (4) certain types of components are not
available in SMT.
34.14 What are the two methods of component placement and soldering in surface-mount technology?
Answer. The two methods are (1) adhesive bonding and wave soldering and (2) solder paste and
reflow soldering.
34.15 What is a solder paste?
Answer. A solder paste is a suspension of solder powders in a flux binder. The flux binder includes
an adhesive that attaches the SMT components to the board surface. The solder constitutes about
85% of the total volume of the paste.
34.16 Identify the two basic methods of making electrical connections.
Answer. The two methods are (1) soldering, and (2) pressure connections.
34.17 Define crimping in the context of electrical connections.
Answer. Crimping involves the mechanical forming of a terminal barrel to create a permanent
connection with the stripped end of a conductor wire.
34.18 What is press fit technology in electrical connections?
Answer. A press fit technology in the context of electrical connections is an interference fit between
a terminal pin and the plated hole into which it is inserted.
34.19 What is a terminal block?
Answer. A terminal block consists of a series of evenly spaced receptacles that allow connection of
individual wires or terminals.
34.20 What is a pin connector?
Answer. A pin connector is a connector with multiple pins or blades that are inserted into the holes
of a mating receptacle to establish electrical contact.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to
students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
by Sections 107 or 108 of the 1976 United States Copyright Act without the permission of the copyright owner is unlawful.
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