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Hermeticity testing of mems and microelectronic Packages

Book September 2013

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M.P.Y. Desmulliez
Heriot-Watt University
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 Costello Desmulliez
Packaging of microelectronics has been developing since the invention
of the transistor in 1947. With the increasing complexity and decreasing
size of the die, packaging requirements have continued to evolve. A step
change in package requirements came with the introduction of the micro-
electromechanical system (MEMS), whereby interactions with the external
environment are, in some cases, required.

This resource is a rapid, definitive reference on test methods for hermetic

packaging for the MEMS and microelectronics industries, giving practi-

Hermeticity Testing of MEMS and Microelectronic Packages

cal guidance on traditional and newly developed test methods. This book
includes up-to-date and applicable test methods for todays package types.
The authors cover the history and development of packaging, with a view
to understanding hermeticity testing requirements and the subsequent
limitations of these methods when applied to new package types.

Contents Overview:
Introduction to hermetic packages and leak types; Traditional hermetic-
ity test techniques and standards; Limitations of existing hermeticity
test methods in low volume packages; Novel methods of leak detection;
Conclusions and vision for the future

Suzanne Costello is a development scientist at MCS Ltd, Roslin, Scotland.

Hermeticity
She earned her Ph.D. in electrical engineering from Heriot-Watt University.

Marc P. Y. Desmulliez is the head of the Research Institute in Sensors,

Testing of
Signals and Systems (ISSS) at Heriot-Watt University, Scotland. He earned
his Ph.D. in optoelectronics from Heriot-Watt University.

MEMS and
Microelectronic
Include bar code

ISBN 13: 978-1-60807-527-0

ISBN 10: 1-60807-527-3
Packages
Suzanne Costello Marc P. Y. Desmulliez
BOSTON LONDON

www.artechhouse.com

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