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PACKAGE OUTLINE DIMENSIONS(AP02002)

SUGGESTED PAD LAYOUT(AP02001)


(Based on IPC-7351A)
Table of Contents
X4-DFN0402-2/SWP ................................................................................................................................................................ 11
X2-DFN0603-2 ......................................................................................................................................................................... 12
X3-DFN0603-2 ......................................................................................................................................................................... 13
X2-DFN0606-3 ......................................................................................................................................................................... 14
X2-DFN0806-3 ......................................................................................................................................................................... 15
X2-DFN0808-4 ......................................................................................................................................................................... 16
X2-DFN0910-6 ......................................................................................................................................................................... 17
U-DFN1006-2/SWP ................................................................................................................................................................. 18
X1-DFN1006-2 ......................................................................................................................................................................... 19
X2-DFN1006-2 ......................................................................................................................................................................... 20
X1-DFN1006-3 ......................................................................................................................................................................... 21
X2-DFN1006-3 ......................................................................................................................................................................... 22
X2-DFN1010-3 ......................................................................................................................................................................... 23
X2-DFN1010-4 ......................................................................................................................................................................... 24
X1-DFN1010-6 (TYPE B) ........................................................................................................................................................... 25
X2-DFN1010-6 ......................................................................................................................................................................... 26
X2-DFN1010-6 (TYPE C) ........................................................................................................................................................... 27
W-DFN1114-3 ......................................................................................................................................................................... 28
X2-DFN1210-6 ......................................................................................................................................................................... 29
X2-DFN1210-8 ......................................................................................................................................................................... 30
X1-DFN1212-3 ......................................................................................................................................................................... 31
X1-DFN1212-3(TYPE B) ............................................................................................................................................................ 32
X2-DFN1212-6 ......................................................................................................................................................................... 33
U-DFN1212-3 (TYPE C)............................................................................................................................................................ 34
X1-DFN1216-4 ......................................................................................................................................................................... 35
X2-DFN1310-6 ......................................................................................................................................................................... 36
X2-DFN1409-6 ......................................................................................................................................................................... 37
X2-DFN1410-6 ......................................................................................................................................................................... 38
X1-DFN1411-3 ......................................................................................................................................................................... 39
U-DFN1510-6 .......................................................................................................................................................................... 40
U-DFN1608-2 .......................................................................................................................................................................... 41

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may
be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to
the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid
details, please see document IEC, Publication 97.
Rev. 90 1 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
U-DFN1610-6 .......................................................................................................................................................................... 42
X1-DFN1612-6 ......................................................................................................................................................................... 43
X2-DFN1612-8 ......................................................................................................................................................................... 44
U-DFN1616-6 .......................................................................................................................................................................... 45
U-DFN1616-6 (TYPE E) ............................................................................................................................................................. 46
X1-DFN1616-6 (TYPE E) ........................................................................................................................................................... 47
U-DFN1616-6 (TYPE F) ............................................................................................................................................................. 48
U-DFN1616-6 (TYPE G) ............................................................................................................................................................ 49
U-DFN1616-8 .......................................................................................................................................................................... 50
X2-DFN2015-3 ......................................................................................................................................................................... 51
X2-DFN2015-6 ......................................................................................................................................................................... 52
X2-DFN2015-8 ......................................................................................................................................................................... 53
U-DFN2018-6 .......................................................................................................................................................................... 54
X2-DFN2018-8 ......................................................................................................................................................................... 55
U-DFN2020-3 .......................................................................................................................................................................... 57
U-DFN2020-3 (TYPE B) ............................................................................................................................................................ 58
V-DFN2020-3 .......................................................................................................................................................................... 59
U-DFN2020-6 .......................................................................................................................................................................... 60
U-DFN2020-6/SWP ................................................................................................................................................................. 61
U-DFN2020-6 (TYPE B) ............................................................................................................................................................ 62
U-DFN2020-6 (TYPE C) ............................................................................................................................................................ 63
U-DFN2020-6 (TYPE E) ............................................................................................................................................................. 64
U-DFN2020-6 (TYPE F) ............................................................................................................................................................. 65
X2-DFN2020-6 ......................................................................................................................................................................... 67
U-DFN2020-8 .......................................................................................................................................................................... 68
W-DFN2020-6 (TYPE US) ......................................................................................................................................................... 70
W-DFN2020-8 (TYPE C) ........................................................................................................................................................... 71
U-DFN2030-6 (TYPE B) ............................................................................................................................................................ 72
U-DFN2030-6 (TYPE C) ............................................................................................................................................................ 73
U-DFN2030-8 .......................................................................................................................................................................... 74
X1-DFN2030-8 ......................................................................................................................................................................... 75
U-DFN2510-10 ........................................................................................................................................................................ 76
U-DFN2535-6 .......................................................................................................................................................................... 77
U-DFN2535-6(TYPE B) ............................................................................................................................................................. 78

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 2 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
V-DFN2050-4 .......................................................................................................................................................................... 79
U-DFN2116-8 .......................................................................................................................................................................... 80
U-DFN2523-6 .......................................................................................................................................................................... 81
U-DFN2626-10 ........................................................................................................................................................................ 82
U-DFN3016-12 ........................................................................................................................................................................ 83
X2-DFN3020-6 ......................................................................................................................................................................... 84
V-DFN3020-8 .......................................................................................................................................................................... 85
W-DFN3020-8 (TYPE B) ........................................................................................................................................................... 86
W-DFN3020-8 (TYPE K) ........................................................................................................................................................... 87
V-DFN3020-8 (TYPE N) ........................................................................................................................................................... 88
V-DFN3020-8 (TYPE P) ............................................................................................................................................................. 89
U-DFN3020-10 ........................................................................................................................................................................ 90
V-DFN3020-10......................................................................................................................................................................... 91
V-DFN3020-14......................................................................................................................................................................... 92
U-DFN3030-4 .......................................................................................................................................................................... 93
U-DFN3030-6 .......................................................................................................................................................................... 94
U-DFN3030-6 (TYPE B) ............................................................................................................................................................ 95
V-DFN3030-6 .......................................................................................................................................................................... 96
U-DFN3030-8 .......................................................................................................................................................................... 97
U-DFN3030-8 (TYPE D) ............................................................................................................................................................ 98
U-DFN3030-8 (TYPE E) ............................................................................................................................................................. 99
V-DFN3030-8 ........................................................................................................................................................................ 100
V-DFN3030-8 TYPE H ............................................................................................................................................................. 101
V-DFN3030-8 TYPE J .............................................................................................................................................................. 102
V-DFN3030-8 TYPE K ............................................................................................................................................................. 103
V-DFN3030-8 TYPE M ............................................................................................................................................................ 104
U-DFN3030-10 ...................................................................................................................................................................... 105
U-DFN3030-12 ...................................................................................................................................................................... 106
W-DFN3030-12 ..................................................................................................................................................................... 107
U-DFN3030-14 ...................................................................................................................................................................... 108
W-DFN3030-16 (TYPE US) ..................................................................................................................................................... 109
U-QFN3030-16 (TYPE B) ........................................................................................................................................................ 110
U-QFN3030-20 ...................................................................................................................................................................... 111
U-DFN3216-14 ...................................................................................................................................................................... 112

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 3 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
DFN322 ................................................................................................................................................................................. 113
X1-DFN3313-8 ....................................................................................................................................................................... 114
V-DFN3535-14....................................................................................................................................................................... 115
U-DFN4030-12 ...................................................................................................................................................................... 116
U-DFN4030-12 (TYPE B) ........................................................................................................................................................ 117
U-DFN4030-12 (TYPE C)......................................................................................................................................................... 118
U-DFN4030-12 (TYPE D) ........................................................................................................................................................ 119
V-DFN4030-14....................................................................................................................................................................... 120
W-DFN4030-14 ..................................................................................................................................................................... 121
U-DFN4040-8 ........................................................................................................................................................................ 122
W-DFN5020-6 ....................................................................................................................................................................... 123
V-DFN5045-12....................................................................................................................................................................... 124
V-DFN5045-12 (TYPE B) ......................................................................................................................................................... 125
V-DFN5060-4 ........................................................................................................................................................................ 126
U-DFN6040-12 ...................................................................................................................................................................... 127
V-DFN6040-22....................................................................................................................................................................... 128
D-FLAT .................................................................................................................................................................................. 129
DF-S ...................................................................................................................................................................................... 130
U-FLGA1515-9 ....................................................................................................................................................................... 131
W-FLGA2520-17 .................................................................................................................................................................... 132
MINIDIP ................................................................................................................................................................................ 133
MINIMELF ............................................................................................................................................................................. 134
MELF ..................................................................................................................................................................................... 135
MSB ...................................................................................................................................................................................... 136
MSOP-8 ................................................................................................................................................................................ 137
MSOP-8EP ............................................................................................................................................................................. 138
MSOP-10............................................................................................................................................................................... 139

POWERDI 5 ........................................................................................................................................................................... 140

POWERDI 123 ....................................................................................................................................................................... 141

POWERDI 123(TYPE B) .......................................................................................................................................................... 142

POWERDI 323 ....................................................................................................................................................................... 143

POWERDI 3333-8 .................................................................................................................................................................. 144

POWERDI 3333-8(TYPE B) ..................................................................................................................................................... 145
POWERDI3333-8 (TYPE UX) ................................................................................................................................................... 146

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 4 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated

POWERDI 5060-8 .................................................................................................................................................................. 147
POWERDI5060-8 (TYPE B) ................................................................................................................................................... 148
POWERDI5060-8 (TYPE C) ..................................................................................................................................................... 149
POWERDI5060-8 (TYPE D) ..................................................................................................................................................... 150

POWERDI 5SP ....................................................................................................................................................................... 151

POWERDI 5SP (TYPE B) ......................................................................................................................................................... 152
W-QFN3020-12 ..................................................................................................................................................................... 153
U-QFN4040-16 (TYPE C) ........................................................................................................................................................ 154
U-QFN4040-20 ...................................................................................................................................................................... 155
V-QFN4525-20 ...................................................................................................................................................................... 156
QSOP-16 ............................................................................................................................................................................... 157
QSOP-20 ............................................................................................................................................................................... 158
SM-8 ..................................................................................................................................................................................... 159
SMA ...................................................................................................................................................................................... 160
SMAF .................................................................................................................................................................................... 161
SMB ...................................................................................................................................................................................... 162
SMC ...................................................................................................................................................................................... 163
SO-8 ...................................................................................................................................................................................... 164
SO-8EP .................................................................................................................................................................................. 165
SO-8EP .................................................................................................................................................................................. 166
SO-14 .................................................................................................................................................................................... 167
SO-16 .................................................................................................................................................................................... 168
SO-20 .................................................................................................................................................................................... 169
SO-24 (TYPE TH) .................................................................................................................................................................... 170
SOD123 ................................................................................................................................................................................. 171
SOD123F ............................................................................................................................................................................... 172
SOD323 ................................................................................................................................................................................. 173
SOD323F ............................................................................................................................................................................... 174
SOD523 ................................................................................................................................................................................. 175
SOD923 (0.2MM LEAD WIDTH) ............................................................................................................................................. 176
SOD923 (0.3MM LEAD WIDTH) ............................................................................................................................................. 177
SOT143 ................................................................................................................................................................................. 178
SOT223 ................................................................................................................................................................................. 179
SOT25 ................................................................................................................................................................................... 180

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 5 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
SOT26 / SC74R ...................................................................................................................................................................... 181
SOT353 ................................................................................................................................................................................. 182
SOT363 ................................................................................................................................................................................. 183
SC59 ...................................................................................................................................................................................... 184
SOT523 ................................................................................................................................................................................. 185
SOT323 ................................................................................................................................................................................. 186
SOT23 ................................................................................................................................................................................... 187
SOT23F ................................................................................................................................................................................. 188
SOT543 ................................................................................................................................................................................. 189
SOT553 ................................................................................................................................................................................. 190
SOT563 ................................................................................................................................................................................. 191
SOT666 ................................................................................................................................................................................. 192
SOT953 ................................................................................................................................................................................. 193
SOT963 ................................................................................................................................................................................. 194
SOT89 ................................................................................................................................................................................... 195
SOT89-5 ................................................................................................................................................................................ 196
TO252 (DPAK) ....................................................................................................................................................................... 197
TO252 TYPE B (DPAK)............................................................................................................................................................ 198
TO252 (DPAK) (TYPE BR) ....................................................................................................................................................... 199
TO252 TYPE C (DPAK) ............................................................................................................................................................ 200
TO252 (DPAK) (TYPE TH) ....................................................................................................................................................... 201
TO252-4 ................................................................................................................................................................................ 202
TO252-5 ................................................................................................................................................................................ 203
TO263AB (D2PAK) ................................................................................................................................................................. 204
2
TO263AB TYPE B (D PAK) ...................................................................................................................................................... 205
TO263AB (D2PAK)(TYPE BR).................................................................................................................................................. 206
2
TO263AB TYPE C (D PAK) ...................................................................................................................................................... 207
TO263AB (D2PAK) (TYPE TH) ................................................................................................................................................. 208
TO263-5 ................................................................................................................................................................................ 209
T-MINIDIP ............................................................................................................................................................................. 210
TSSOP-8 ................................................................................................................................................................................ 211
TSSOP-14 .............................................................................................................................................................................. 212
TSSOP-16 .............................................................................................................................................................................. 213
TSSOP-16EP .......................................................................................................................................................................... 214

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 6 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
TSSOP-20 .............................................................................................................................................................................. 215
TSSOP-20EP .......................................................................................................................................................................... 216
TSOT25 ................................................................................................................................................................................. 217
TSOT25F................................................................................................................................................................................ 218
TSOT26 ................................................................................................................................................................................. 219
TSOT26F................................................................................................................................................................................ 220
X4-WLB0402-2/SWP ............................................................................................................................................................. 221
X2-WLB0505-3 ...................................................................................................................................................................... 222
X2-WLB0603-2 ...................................................................................................................................................................... 223
X3-WLB0603-2 ...................................................................................................................................................................... 224
X4-WLB0603-2 ...................................................................................................................................................................... 225
X3-WLB0603-3 ...................................................................................................................................................................... 226
X3-WLB0606-3 ...................................................................................................................................................................... 227
U-WLB0808-4 ........................................................................................................................................................................ 228
W-WLB0808-4 ....................................................................................................................................................................... 229
X1-WLB0808-4 ...................................................................................................................................................................... 230
X3-WLB0808-4 ...................................................................................................................................................................... 231
X2-WLB1006-2 ...................................................................................................................................................................... 232
X3-WLB1006-2 ...................................................................................................................................................................... 233
X3-WLB1006-2(TYPE B) ......................................................................................................................................................... 234
U-WLB1010-4 ........................................................................................................................................................................ 235
U-WLB1010-4 (TYPE B) .......................................................................................................................................................... 236
U-WLB1313-9 ........................................................................................................................................................................ 237
X2-WLB1406-2 ...................................................................................................................................................................... 238
X3-WLB1406-2 ...................................................................................................................................................................... 239
X3-WLB1408-2 ...................................................................................................................................................................... 240
U-WLB1510-6 ........................................................................................................................................................................ 241
U-WLB1515-9 ........................................................................................................................................................................ 242
U-WLB1520-12 ...................................................................................................................................................................... 243
X3-WLB1608-2 ...................................................................................................................................................................... 244
X2-WLB1608-3 ...................................................................................................................................................................... 245
U-WLB1818-4 ........................................................................................................................................................................ 246
X1-WLB1818-4 ...................................................................................................................................................................... 247
X2-WLB2010-2 ...................................................................................................................................................................... 248

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 7 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
X2-WLB2718-6 ...................................................................................................................................................................... 249
X4-WLCUP0505-3 .................................................................................................................................................................. 250
X2-WLCUP2010-2 .................................................................................................................................................................. 251
X4-WLCUS0603-2 .................................................................................................................................................................. 252
X3-WLCUS0603-3 .................................................................................................................................................................. 253
X4-WLCUS1006-2 .................................................................................................................................................................. 254
X4-WLCUS1406-2 .................................................................................................................................................................. 255
X4-WLCUS1408-2 .................................................................................................................................................................. 256
A-405 .................................................................................................................................................................................... 257
DO-35 ................................................................................................................................................................................... 258
DO-41 PLASTIC ...................................................................................................................................................................... 259
DO-41 GLASS......................................................................................................................................................................... 260
DO-15 ................................................................................................................................................................................... 261
DO-201 ................................................................................................................................................................................. 262
DO-201AD ............................................................................................................................................................................. 263
R-6 ........................................................................................................................................................................................ 264
T-1 ........................................................................................................................................................................................ 265
DF-M ..................................................................................................................................................................................... 266
E-LINE ................................................................................................................................................................................... 267
GBJ ....................................................................................................................................................................................... 268
GBPC ..................................................................................................................................................................................... 269
GBPC-W ................................................................................................................................................................................ 270
GBU ...................................................................................................................................................................................... 271
ITO220AB .............................................................................................................................................................................. 272
ITO220AB (TYPE E) ................................................................................................................................................................ 273
ITO220AB (TO220F-3) ........................................................................................................................................................... 274
ITO220S ................................................................................................................................................................................ 275
ITO220AC-S ........................................................................................................................................................................... 276
KBJ ........................................................................................................................................................................................ 277
KBP ....................................................................................................................................................................................... 278
MB ........................................................................................................................................................................................ 279
MB-W ................................................................................................................................................................................... 280
PBPC-3 / PBPC-6 ................................................................................................................................................................... 281
PBPC-8 .................................................................................................................................................................................. 282

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 8 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
PBU ....................................................................................................................................................................................... 283
PDIP-8 ................................................................................................................................................................................... 284
PDIP-14 ................................................................................................................................................................................. 285
PDIP-16 ................................................................................................................................................................................. 286
SIPAK (TYPE TH) .................................................................................................................................................................... 287
SIP-3 (AMMO PACK) ............................................................................................................................................................. 288
SIP-3 (BULK PACK) ................................................................................................................................................................. 289
SIP-4 ..................................................................................................................................................................................... 290
SIP-5 ..................................................................................................................................................................................... 291
TO126 ................................................................................................................................................................................... 292
TO220-3 ................................................................................................................................................................................ 293
TO220-5 ................................................................................................................................................................................ 294
TO220-5(R) ........................................................................................................................................................................... 295
TO220AB ............................................................................................................................................................................... 296
TO220AB(TYPE C) .................................................................................................................................................................. 297
TO220AB (TYPE TH) ............................................................................................................................................................... 298
TO220AC ............................................................................................................................................................................... 299
TO220AC (13.7MM MIN LEAD LENGTH) .............................................................................................................................. 300
TO220AC (TYPE A4) ............................................................................................................................................................... 301
TO220AC (TYPE BR) ............................................................................................................................................................... 302
TO220AC (TYPE BR) ............................................................................................................................................................... 303
TO247 ................................................................................................................................................................................... 304
TO251 ................................................................................................................................................................................... 305
TO251 (TYPE TH) ................................................................................................................................................................... 306
TO262 ................................................................................................................................................................................... 307
TO3P ..................................................................................................................................................................................... 308
TO92 ..................................................................................................................................................................................... 309
TO92 (TYPE B) ....................................................................................................................................................................... 310
TO92 (TYPE C) ....................................................................................................................................................................... 311
TO92L ................................................................................................................................................................................... 312
TO92S (TYPE A ...................................................................................................................................................................... 313
TO92S (TYPE B) ..................................................................................................................................................................... 314
TO94 ..................................................................................................................................................................................... 315
WOG ..................................................................................................................................................................................... 316

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 9 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 10 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
SURFACE MOUNT PACKAGES

Package Outline Dimensions

X4-DFN0402-2/SWP

A2
A1
A
X4-DFN0402-2/SWP
Seating Plane
Dim Min Max Typ
A 0.150 0.200 0.175
D A1 0.00 0.020 0.010
A2 0.010 0.040 0.025
Polarity ID e
b 0.110 0.170 0.140
D 0.375 0.425 0.400
E 0.175 0.225 0.200
e - - 0.260
L 0.080 0.100 0.090
E b z 0.010 0.040 0.025
All Dimensions in mm

L z

Suggested Pad Layout

X4-DFN0402-2/SWP

X1

Value
Dimensions
(in mm)
G 0.110
Y
X 0.200
X1 0.510
Y 0.200
X G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 11 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN0603-2

X2-DFN0603-2
Seating Plane Dim Min Max Typ
A 0.27 0.35 0.30
D
A1 0.00 0.03 0.02
e
b 0.19 0.29 0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e - - 0.355
L3 0.14 0.24 0.19
E
b(2x) All Dimensions in mm

L3(2x)

Suggested Pad Layout

X2-DFN0603-2

X1

Value
Dimensions
(in mm)
Y X 0.230
X1 0.610
Y 0.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 12 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X3-DFN0603-2

A
A1 X3-DFN0603-2
Dim Min Max Typ
A 0.27 0.35 0.30
D A1 0.00 0.03 0.02
e b 0.19 0.29 0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e - - 0.355
E b (2X) L 0.14 0.24 0.19
All Dimensions in mm

L (2x)

Suggested Pad Layout

X3-DFN0603-2
X1
X

Value
Dimensions
(in mm)
C 0.380
Y
X 0.230
X1 0.610
Y 0.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 13 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN0606-3

X2-DFN0606-3
A
A1 Dim Min Max Typ
A 0.36 0.42 0.39
Seating Plane
A1 0 0.05 0.02
b 0.10 0.20 0.15
D D 0.57 0.67 0.62
D2 D2 0.155 BSC
D3 D3 0.185 BSC
e/2
E 0.57 0.67 0.62
E2 0.40 0.60 0.50
e 0.35 BSC
e E2
E k 0.16 REF
L 0.09 0.21 0.15
L2 0.11 0.31 0.21
b(2x) k All Dimensions in mm
L2
L(2x)

Suggested Pad Layout

X2-DFN0606-3

Dimensions Value (in mm)


C 0.350
X 0.280
X1 0.350
X2 0.760
Y 0.200
Y1 0.600

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 14 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN0806-3

A1
A3
A X2-DFN0806-3
Dim Min Max Typ
Seating Plane A 0.375 0.40 0.39
A1 0 0.05 0.02
D
A3 - - 0.10
e b 0.10 0.20 0.15
D 0.55 0.65 0.60
D1 0.35 0.45 0.40
L (2x)
E 0.75 0.85 0.80
E1 0.20 0.30 0.25
K b (2x)
E e - - 0.35
K - - 0.20
E1 L 0.20 0.30 0.25
Pin#1
R0.075 All Dimensions in mm

D1

Suggested Pad Layout

X2-DFN0806-3
X1

Value
Y1 Dimensions
(in mm)
C 0.350
Y2 X 0.200
X X1 0.450
X2 0.550
Y 0.375
Y
Y1 0.475
Y2 1.000
C
X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 15 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN0808-4

A3

A A1

Seating Plane X2-DFN0808-4


Dim Min Max Typ
A 0.25 0.35 0.30
A1 0 0.04 0.02
D
A3 - - 0.13
Pin #1 ID
e b 0.17 0.27 0.22
R0.05 TYP
D 0.75 0.85 0.80
D2 0.15 0.35 0.25
E 0.75 0.85 0.80
k
E2 0.15 0.35 0.25
e - - 0.48
k 0.20 - -
E L 0.17 0.27 0.22
L1 L1 0.02 0.12 0.07
E2 D2 z - - 0.05
L All Dimensions in mm

Z b

Suggested Pad Layout

X2-DFN0808-4
X3
C
Y2
Dimensions Value
C (in mm)
0.480
X 0.320
X1 0.300
X2 0.106
X2 X3 0.800
Y1

Y3 Y 0.320
Y1 0.300
Y2 0.106
Y Y3 0.900
X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 16 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN0910-6
A1
X2-DFN0910-6
A
Seating Plane Dim Min Max Typ
A - 0.35 0.30
A1 0 0.03 0.02
D b 0.10 0.20 0.15
D 0.85 0.95 0.90
e Z1
E 0.95 1.05 1.00
Z
e - - 0.30
K 0.20 - -
K1 0.25 - -
L 0.25 0.35 0.30
E K1 K
L1 0.30 0.40 0.35
L L1 Z - - 0.075
Z1 - - 0.075
All Dimensions in mm
(Pin #1 ID)
b C0.5X45

Suggested Pad Layout

X2-DFN0910-6

X1

Value
Dimensions
Y1 (in mm)
G 0.100
G1 G1 0.050
G G2 0.150
Y2
X 0.150
X1 0.750
Y
Y 0.525
Y1 0.475
Y2 1.150
Pin1
G2 X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 17 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1006-2/SWP

A c U-DFN1006-2/SWP
A1 Dim Min Max Typ
h A 0.47 0.53 0.50
Seating Plane
A1 0.0 0.05 0.03
D b 0.45 0.55 0.50
Pin #1 ID
c 0.55 REF
D 0.95 1.05 1.00
E 0.55 0.65 0.60
h 0.17 REF
E b(2x) k 0.37 REF
L 0.25 0.35 0.30
All Dimensions in mm

k L(2x)

Suggested Pad Layout

U- DFN1006-2/SWP

X1

X (2x)

Dimensions Value (in mm)


X 0.45
Y X1 1.20
Y 0.60

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 18 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1006-2

A1 X1-DFN1006-2
Dim Min Max Typ
D A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50
D 0.95 1.075 1.00
R E 0.55 0.675 0.60
E b e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm

L e

Suggested Pad Layout

X1-DFN1006-2

X1

X
Value
Dimensions
(in mm)
C 0.70
Y G 0.30
X 0.40
X1 1.10
G Y 0.70

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 19 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1006-2

A
X2-DFN1006-2
Dim Min Max Typ
A1 A 0.34 0.4 0.37
A1 0 0.05 0.03
D b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
R L 0.20 0.30 0.25
E b R 0.05 0.15 0.10
All Dimensions in mm

L e

Suggested Pad Layout

X2-DFN1006-2

X1

X
Value
Dimensions
(in mm)
C 0.70
Y G 0.30
X 0.40
X1 1.10
G Y 0.70

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 20 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1006-3

A
A1 X1-DFN1006-3
Dim Min Max Typ
Seating Plane A 0.47 0.53 0.50
A1 0.00 0.05 0.03
D b 0.10 0.20 0.15
Pin #1 ID b b2 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.35
L1 0.20 0.30 0.25
E b2 e L2 0.20 0.30 0.25
L3 - - 0.40
z 0.02 0.08 0.05
All Dimensions in mm
z
L2 L3 L1

Suggested Pad Layout

X1-DFN1006-3

Y C

Dimensions Value (in mm)


Y1 C 0.70
G1 0.30
G2 G2 0.20
X 0.40
X1 1.10
X G1 Y 0.25
Y1 0.70
X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 21 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1006-3

A
A1 X2-DFN1006-3
Dim Min Max Typ
Seating Plane
A 0.40
A1 0 0.05 0.03
D
b1(2X) b1 0.10 0.20 0.15
Pin #1 ID
b2 0.45 0.55 0.50
D 0.95 1.05 1.00
E 0.55 0.65 0.60
e - - 0.35
E b2 e L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3 - - 0.40
All Dimensions in mm
Z
L2 L3 L1

Suggested Pad Layout

X2-DFN1006-3

C
Value
Dimensions
X1 (in mm)
Z 1.1
G2 G1 0.3
X
G2 0.2
X 0.7
X1 0.25
Y 0.4
G1
Y C 0.7
Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 22 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1010-3
A3
A A1 X2-DFN1010-3
Dim Min Max Typ
Seating Plane
A - 0.40 0.39
D A1 0.00 0.05 0.02
A3 - - 0.13
b 0.18 0.28 0.23
(Pin #1 ID)
D 0.95 1.05 1.00
E2 D2 0.70 0.90 0.80
E E 0.95 1.05 1.00
D2 K E2 0.36 0.56 0.46
e - - 0.50
L K - - 0.20
L 0.195 0.295 0.245
b All Dimensions in mm
e

Suggested Pad Layout

X2-DFN1010-3
X

Y2
X2-DFN1010-3
Dimensions Value
X1 Y1 C 0.500
G 0.150
X 0.330
G X X1 0.900
Y 0.445
Y1 0.505
Y Y2 0.200
All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 23 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
X2-DFN1010-4

A3
A1 X2-DFN1010-4
A Dim Min Max Typ
A - 0.40 0.39
Seating Plane
A1 0.00 0.05 0.02
D A3 - - 0.13
b 0.20 0.30 0.25
e
D 0.95 1.05 1.00
) D2 0.38 0.58 0.48
3x
(

E 0.95 1.05 1.00


C0

L1
.18

E2 0.38 0.58 0.48


.25

C0

e - - 0.65
E L 0.20 0.30 0.25
L2 L1 0.27 0.37 0.32
D2
E2

L2 0.02 0.12 0.07


L
Z - - 0.050
All Dimensions in mm

Z b

Suggested Pad Layout

X2-DFN1010-4

X2
C Value
Dimensions
(in mm)
Y2 C 0.650
X 0.250
Y1 X1 0.480
Y3 X2 0.900
X3
X3 0.070
Y4 Y 0.400
Y1 0.470
Y2 0.220
X1
Y3 0.480
Y5
Y4 1.300
Y
Y5 0.180

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 24 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1010-6 (Type B)

A1
A
Seating Plane
X1-DFN1010-6
(Type B)
Dim Min Max Typ
D A - 0.50 0.39
A1 - 0.04 -
L3a e
L3(5x) b 0.12 0.20 0.15
D 0.95 1.050 1.00
E 0.95 1.050 1.00
e 0.35 BSC
e1 0.55 BSC
E e1 L3 0.27 0.30 0.30
(Pin #1 ID) L3a 0.32 0.40 0.35
All Dimensions in mm

Suggested Pad Layout

X1-DFN1010-6 (Type B)

X1
C
Y(4x) Value
Dimensions
(in mm)
C 0.350
Y2 G 0.150
G1 0.150
X 0.200
Y3 X1 0.900
Y 0.500
G
Y1 G1 Y1 0.525
Y2 0.475
Y3 1.150
Pin1
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 25 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1010-6

A A1 X2-DFN1010-6
A3 Dim Min Max Typ
A 0.40 0.39
A1 0.00 0.05 0.02
D A3 0.13
(Pin #1 ID) e b 0.14 0.20 0.17
b1 0.05 0.15 0.10
D 0.95 1.05 1.00
b1 E 0.95 1.05 1.00
e 0.35
E K L 0.35 0.45 0.40
K 0.15
L(6x) Z 0.065
All Dimensions in mm

Z(4x) b(6x)

Suggested Pad Layout

X1
C

Value
Dimensions
(in mm)
Y(6x)
C 0.350
G 0.150
Y1
X 0.200
X1 0.900
Y 0.550
1 Y1 1.250

G(4x) X(6x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 26 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1010-6 (Type C)

A A1
Seating Plane X2-DFN1010-6
(Type C)
Dim Min Max Typ
D A - 0.35 -
L3(5x) A1 - 0.04 -
L3a e b 0.12 0.20 0.15
D 0.95 1.050 1.00
E 0.95 1.050 1.00
e 0.35 BSC
e1 0.55 BSC
E e1 L3 0.27 0.30 0.30
(Pin #1 ID) L3a 0.32 0.40 0.35
All Dimensions in mm

Suggested Pad Layout

X2-DFN1010-6 (Type C)

X1
C
Y(4x) Value
Dimensions
(in mm)
C 0.350
Y2 G 0.150
G1 0.150
X 0.200
Y3 X1 0.900
Y 0.500
G
Y1 G1 Y1 0.525
Y2 0.475
Y3 1.150
Pin1
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 27 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN1114-3

A1
A A3

W-DFN1114-3
Seating Plane Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0 0.05 0.02
L A3 - - 0.152
e
b 0.25 0.35 0.30
D 1.05 1.15 1.10
D1 0.70 0.80 0.75
Pin #1 ID
(0.265) e - - 0.55
b(2x)
E 1.35 1.45 1.40
E E1 0.66 0.76 0.71
L 0.20 0.30 0.25
R0

E1
.15

All Dimensions in mm
0

D1

Suggested Pad Layout

W-DFN1114-3

X1 Y1 Dimensions Value(in mm)


C 0.550
X 0.400
Y2 X1 0.750
X X2 0.950
Y 0.450
Y Y1 0.710
Y2 1.375

C
X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 28 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1210-6

A3
A A1

Seating Plane
X2-DFN1210-6
Dim Min Max Typ
D A - 0.40 -
A1 0.00 0.05 0.03
Pin 1 ID A3 - - 0.13
b 0.15 0.25 0.20
D 1.15 1.275 1.20
E 0.95 1.075 1.00
E e - - 0.40
L 0.325 0.425 0.375
z - - 0.100
All Dimensions in mm
z L
e
b

Suggested Pad Layout

X2-DFN1210-6

X1
C
G1
Value
Dimensions
(in mm)
C 0.400
G 0.230
G1 0.180
Y1 G X 0.220
X1 1.020
Y 0.420
Y Y1 1.070

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 29 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1210-8

A1
A X2-DFN1210-8
Seating Plane Dim Min Max Typ
A - 0.35 0.30
A1 0 0.03 0.02
(Pin #1 ID) D b 0.10 0.20 0.15
C0.5X45 e D 1.15 1.25 1.20
Z(4X)
E 0.95 1.05 1.00
e - - 0.30
L1
K - - 0.25
Z1(4X)
K1 - - 0.20
L 0.25 0.35 0.30
E K1 K
L1 0.30 0.40 0.35
Z 0.050 0.100 0.075
Z1 0.050 0.100 0.075
All Dimensions in mm

L(7x) b

Suggested Pad Layout

X2-DFN1210-8

X1

Value
Dimensions
(in mm)
C 0.300
G 0.150
Y1 G
X 0.150
X1 1.050
Y 0.500
Y Y1 1.150

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 30 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1212-3
A
A3
A1
X1-DFN1212-3
Seating Plane
Dim Min Max Typ
A 0.47 0.53 0.50
D A1 0 0.05 0.02
e A3 - - 0.13
b 0.27 0.37 0.32
b1 0.17 0.27 0.22
b1(2x) D 1.15 1.25 1.20
E 1.15 1.25 1.20
E e - - 0.80
L 0.25 0.35 0.30
All Dimensions in mm

b L(3x)

Suggested Pad Layout

X1-DFN1212-3

Y Dimensions Value (in mm)


C 0.80
X 0.42
Y2 X1 X1 0.32
(2x) Y 0.50
Y1 0.50
Y1
Y2 1.50
(2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 31 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1212-3(Type B)

A X1-DFN1212-3
A1 A3 Type B
Dim Min Max Typ
A 0.47 0.53 0.50
D A1 0 0.05 0.02
A3 - - 0.13
e
b 0.27 0.37 0.32
b1 0.17 0.27 0.22
b1(2x)
D 1.15 1.25 1.20
D2 0.70 0.90 0.80
E E2 E 1.15 1.25 1.20
E2 0.10 0.30 0.20
D2
e - - 0.80
L(3x) L 0.25 0.35 0.30
All Dimensions in mm
b

Suggested Pad Layout

X1-DFN1212-3 (Type B)

X
Dimensions Value (in mm)
Y C 0.80
X 0.42
X2
X1 0.32
Y3 Y2 X2 0.90
X1(2x) Y 0.50
Y1 0.50
Y1
Y2 0.20
(2x)
Y3 1.50
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 32 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1212-6

A1 A3
A X2-DFN1212-6
Seating Plane
Dim Min Max Typ
A - 0.40 0.39
D A1 0.00 0.05 0.020
Pin 1 ID C0.15 A3 - - 0.13
D2 z1 b 0.13 0.23 0.18
D 1.15 1.25 1.20
D2 0.89 0.99 0.94
E2 E 1.15 1.25 1.20
k
E2 0.25 0.35 0.30
E e - - 0.40
k 0.15 0.25 0.20
L 0.15 0.25 0.20
L z - - 0.11
z1 - - 0.05
All Dimensions in mm
z b
e

Suggested Pad Layout

X2-DFN1212-6

X2
C
Value
Dimensions
(in mm)
C 0.400
Y1 G 0.150
X1 G
X 0.250
Y2 X1 0.940
X2 1.050
Y 0.400
Y
Y1 0.300
Y2 1.400

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 33 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1212-3 (Type C)

U-DFN1212-3
A3
A1 Type C
A Dim Min Max Typ
Seating Plane A 0.47 0.53 0.50
A1 0 0.05 0.02
D
A3 - - 0.13
L e
b 0.27 0.37 0.32
b1 b1 0.17 0.27 0.22
D 1.15 1.25 1.20
D2 0.75 0.95 0.85
e - - 0.80
E 1.15 1.25 1.20
E
D2 E2 E2 0.40 0.60 0.50
L1 L 0.25 0.35 0.30
L1 0.65 0.75 0.70
All Dimensions in mm
b

Suggested Pad Layout

U-DFN1212-3 (Type C)

X2
Y1
X1 Value
Dimensions
(in mm)
C 0.800
Y2 G 0.200
X 0.320
X1 0.520
G X
X2 1.050
Y 0.450
Y Y1 0.250
Y2 0.850
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 34 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1216-4
A
A1 A3

Seating Plane
X1-DFN1216-4
Dim Min Max Typ
A 0.47 0.53 0.50
D A1 0.00 0.05 0.02
e A3 -- -- 0.13
b 0.15 0.25 0.20
(Pin #1 ID) D 1.15 1.25 1.20
C'0.2x45 D2 0.75 0.95 0.85
E 1.55 1.65 1.60
E2 0.55 0.75 0.65
E E2
e - - 0.65
L L 0.20 0.30 0.25
D2 Z - - 0.175
All Dimensions in mm

b
Z

Suggested Pad Layout

X1-DFN1216-4
X1
C

X1-DFN1216-4
Value
Dimensions
(in mm)
C 0.65
Y2 Y1 X 0.25
X1 0.90
Y 0.50
Y1 0.70
Y2 2.00
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 35 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1310-6

X2-DFN1310-6
Dim Min Max Typ
A3 A - 0.40 -
A1
A
A1 0 0.05 0.02
Seating Plane
A3 - - 0.13
D b 0.10 0.20 0.15
D 1.25 1.38 1.30
D2
f d - - 0.25
z b f
D2 0.30 0.50 0.40
R0. E 0.95 1.075 1.00
150 e - - 0.35
E2
E(Pin #1 ID) E2 0.30 0.50 0.40
d f - - 0.10
L L 0.20 0.30 0.25
Z - - 0.05
f d z
f All Dimensions in mm
e

Suggested Pad Layout

X2-DFN1310-6

G2 X2
Dimensions X2- DFN1310-6
G1 0.16
Y2
G2 0.17
G3 0.15
G1
X1 0.52
b
X2 0.20
Y1 Y1 0.52
Y2 0.375
a 0.09
a X1 b 0.06
G3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 36 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1409-6
A3
A1
A
X2-DFN1409-6
Seating Plane
Dim Min Max Typ
A - 0.40 0.39
D A1 0 0.05 0.02
A3 - - 0.13
e1 (6x) 0.20 0.30 0.25
(Pin #1 ID)
D 1.35 1.45 1.40
e2
E 0.85 0.95 0.90
e1 - - 0.50
E
e2 - - 0.50
Z1 - - 0.075
Z2 - - 0.075
All Dimensions in mm
Z1(4x) Z2(4x)

Suggested Pad Layout

X2-DFN1409-6

C
Value
Dimensions
D (6x) (in mm)
C 1.000
Y C1 0.500
C1 D 0.300
G 0.200
G1 G1 0.200
Pin1 X 0.400
Y 0.150
X G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 37 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1410-6

A3
A1
A
X2-DFN1410-6
Dim Min Max Typ
Seating Plane A 0.40 0.39
A1 0.00 0.05 0.02
D A3 0.13
(Pin #1 ID)
e b 0.15 0.25 0.20
D 1.35 1.45 1.40
E 0.95 1.05 1.00
L(6x)
e 0.50
E L 0.25 0.35 0.30
Z 0.10
Z1(4x) Z1 0.045 0.105 0.075
All Dimensions in mm

Z(4x) b(6x)

Suggested Pad Layout

X2-DFN1410-6
X1
C

Value
Dimensions
(in mm)
Y
C 0.500
G 0.250
Y1 X 0.250
X1 1.250
Y 0.525
Y1 1.250

1
G X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 38 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1411-3

A
X1-DFN1411-3
Dim Min Max Typ
A1 A 0.47 0.53 0.50
A1 0 0.05 0.02
D b 0.25 0.35 0.30
D 1.35 1.475 1.40
D2 0.65 0.85 0.75
b E 1.05 1.175 1.10
E2 0.65 0.85 0.75
E E2 e e - - 0.55
L 0.225 0.325 0.275
L1 - - 0.20
All Dimensions in mm
D2 L1 L

Suggested Pad Layout

X1-DFN1411-3
C
Dimensions Value (in mm)
Z 1.38
X2 G1 0.15
G2 0.15
X1 G2 X X 0.95
X1 0.75
X2 0.40
Y 0.75
Y G1 C 0.76
Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 39 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1510-6

A1
A
A3
Seating Plane U-DFN1510-6
Dim Min Max Typ
A 0.545 0.605 0.575
D
A1 - 0.05 0.03
A3 - - 0.13
b 0.20 0.30 0.25
D 1.40 1.525 1.45
E 0.95 1.075 1.00
E
e - - 0.50
L 0.325 0.425 0.375
Z - - 0.100
All Dimensions in mm
L
Z
e b

Suggested Pad Layout

U-DFN1510-6

X C

Value
Dimensions
(in mm)
C 0.500
Y1 X 0.350
X1 1.350
Y Y 0.575
Y1 1.300

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 40 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
U-DFN1608-2

A3
A1 U-DFN1608-2
A
Dim Min Max Typ
Seating Plane A 0.47 0.53 0.50
A1 0.00 0.05 0.02
A3 - - 0.127
D k1
b 0.65 0.75 0.70
D 0.75 0.85 0.80
E 1.55 1.65 1.60
k 0.38 BSC
L k1 0.05 BSC
L 0.76 0.86 0.81
E L1 0.36 0.46 0.41
k
All Dimensions in mm

L1
b(2x)

Suggested Pad Layout


U-DFN1608-2

Y1
Value
Dimensions
(in mm)
Y2
X 0.800
Y 0.610
Y1 1.010
Y2 1.900
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 41 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1610-6

U-DFN1610-6
A1 A3
A Dim Min Max Typ

Seating Plane A 0.545 0.605 0.575


A1 0.00 0.05 0.03
D A3 - - 0.13
e b 0.15 0.25 0.20
5
.12
R0 b2 0.35 0.45 0.40
R0
.0 D 1.550 1.675 1.600
75
E E 0.950 1.075 1.000
e 0.50 BSC
L
L 0.325 0.425 0.375
z - - 0.150
Z b2
b All Dimensions in mm

Suggested Pad Layout

U-DFN1610-6

X2
C

Value
Dimensions
(in mm)
C 0.500
X 0.250
Y1 X1 0.450
X2 1.350
Y 0.625
Y
Y1 1.400

X X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 42 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1612-6

X1-DFN1612-6
A3
A1 Dim Min Max Typ
A
A 0.47 0.53 0.50
Seating Plane
A1 0 0.05 0.02
D A3 - - 0.13
D2 b 0.15 0.25 0.20
z b f f D 1.55 1.675 1.60
d - - 0.25
R0. D2 0.40 0.60 0.50
150
E 1.15 1.28 1.20
E2
E(Pin #1 ID) e - - 0.40
d E2 0.45 0.65 0.55
L f - - 0.15
L 0.20 0.30 0.25
f d z
f e Z - - 0.10
All Dimensions in mm

Suggested Pad Layout

X1-DFN1612-6

G2 X2
Dimensions X1-DFN1612-6
G1 0.15
Y2
G2 0.175
G3 0.15
G1
X1 0.60
b
X2 0.25
Y1 Y1 0.65
Y2 0.45
a 0.10
a X1 b 0.15
G3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 43 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN1612-8

A1
A X2-DFN1612-8
Seating Plane Dim Min Max Typ
A 0.40 0.39
D
A1 0.00 0.05 0.02
b 0.13 0.23 0.18
D2 D 1.55 1.65 1.60
D2 1.25 1.35 1.30
E 1.15 1.25 1.20
E2 0.25 0.35 0.30
e 0.40
E E2 L
L 0.15 0.25 0.20
C0.15
z 0.11
z1 0.05
All Dimensions in mm
z
z1
e b

Suggested Pad Layout

X2-DFN1612-8

X2
C

Value
Dimensions
(in mm)
Y1 C 0.400
X1 X 0.230
X1 1.300
Y2
X2 1.430
Y Y 0.400
Y1 0.300
Y2 1.400

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 44 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1616-6

A
A3
A1
D U-DFN1616-6
Dim Min Max Typ
e A 0.545 0.605 0.575
A1 0 0.05 0.02
A3 - - 0.13
b 0.20 0.30 0.25
E E2 D 1.55 1.675 1.60
D2 1.10 1.30 1.20
E 1.55 1.675 1.60
L e - - 0.50
E2 0.30 0.50 0.40
b
L 0.275 0.375 0.325
D2 All Dimensions in mm

Suggested Pad Layout

U-DFN1616-6
Y
C

X2 Dimensions Value (in mm)


Z 1.3
G
G 0.175
X1 X1 0.50
X2 0.525
Y 0.30
C 0.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 45 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1616-6 (Type E)
X1-DFN1616-6
A3 Type E
A1
Dim Min Max Typ
A 0.47 0.53 0.50
A A1 0 0.05 0.02
D A3 0.13
b 0.20 0.30 0.25
D2 b1 0.10 0.30 0.20
D 1.55 1.65 1.60
D2 0.57 0.77 0.67
b1 E 1.55 1.65 1.60
E2 1.30 1.50 1.40
E E2 L1 e 0.50
L 0.25 0.35 0.30
L1 0.52 0.72 0.62
L(2X) Z 0.175
e All Dimensions in mm
Z(4X) b(6X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 46 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN1616-6 (Type E)

X1-DFN1616-6
A3 Type E
A1 Dim Min Max Typ
A 0.47 0.53 0.50
A A1 0 0.05 0.02
D A3 0.13
b 0.20 0.30 0.25
D2 b1 0.10 0.30 0.20
D 1.55 1.65 1.60
b1 D2 0.57 0.77 0.67
E 1.55 1.65 1.60
E E2 L1 E2 1.30 1.50 1.40
e 0.50
L 0.25 0.35 0.30
L(2X)
L1 0.52 0.72 0.62
e Z 0.175
Z(4X) b(6X) All Dimensions in mm

Suggested Pad Layout

X1-DFN1616-6 (Type E)
X3
Y (2x)
Value
Dimensions
(in mm)
C 0.500
X 0.300
X1 0.200
Y2 Y1
X2 0.720
X2
X1 X3 0.400
Y 0.475
Y1 0.620
Y2 1.900
X (6x) C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 47 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1616-6 (Type F)

A1
A3 U-DFN1616-6
A Type F
Seating Plane Dim Min Max Typ
A 0.45 0.55 0.50
D A1 0 0.05 0.02
D1 A3 0.127
D2(2X)
b 0.20 0.30 0.25
D 1.55 1.65 1.60
Pin #1 ID D1 1.14 1.34 1.24
D2 0.38 0.58 0.48
R
E 1.55 1.65 1.60
E 0.
10 E2(2x) E2 0.54 0.74 0.64
0
e 0.50
K K 0.23
L 0.15 0.35 0.25
Z 0.175
e All Dimensions in mm
L
Z(4x) b

Suggested Pad Layout

U-DFN1616-6 (Type F)
X2
G1

Dimensions Value(in mm)


C 0.500
G 0.150
X1
G1 0.180
G X 0.320
Y1 Y2 X1 0.580
X2 1.320
Y 0.450
Y
Y1 0.700
Y 1.900

C
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 48 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1616-6 (Type G)

A3
A1
A
Seating Plane U-DFN1616-6
(Type G)
Dim Min Max Typ
D A 0.50 0.60 0.56
D2 A1 0.00 0.05 0.02
A3 -- -- 0.203
b 0.15 0.25 0.20
D 1.55 1.65 1.60
k D2 1.20 1.40 1.30
e -- -- 0.50
E E2 E 1.55 1.65 1.60
E2 0.60 0.80 0.70
(Pin #1 ID) k -- -- 0.20
C0.1 L 0.20 0.30 0.25
L z -- -- 0.20
All Dimensions in mm
e
Z b

Suggested Pad Layout

U-DFN1616-6 (Type G)

X2
C
Y
Value
Dimensions
(in mm)
C 0.500
G 0.150
X 0.300
Y2 Y1 X1 1.300
G X2 1.300
X1
Y 0.450
Y1 0.700
Y2 1.900

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 49 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN1616-8

A
A3 U-DFN1616-8
A1 Dim Min Max Typ
A 0.545 0.605 0.575
D A1 0 0.05 0.02
e A3 - - 0.13
L b 0.15 0.25 0.20
D 1.55 1.675 1.60
D2 0.35 0.55 0.45
E2 E 1.55 1.675 1.60
E D2
e - - 0.40
E2 0.90 1.10 1.00
L 0.25 0.35 0.30
All Dimensions in mm
e
b

Suggested Pad Layout

U-DFN1616-8
X2 a
G2
Dimensions Value (in mm)
Y2 G1 0.15
G2 0.20
X1 0.65
X2 0.25
Y1
Y1 1.25
G1 Y2 0.50
C 0.40
a 0.10
X1 C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 50 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN2015-3

A3
A
SEATING PLANE X2-DFN2015-3
Dim Min Max Typ
A1 A - 0.40 -
D
z A1 0 0.05 0.02
A3 - - 0.13
e L b 0.20 0.30 0.25
D 1.45 1.575 1.5
D2 1.00 1.20 1.10
e - - 0.50
E E2 E 1.95 2.075 2.00
D2 E2 0.70 0.90 0.80
L 0.25 0.35 0.30
z - - 0.125
All Dimensions in mm
b

Suggested Pad Layout

X2-DFN2015-3

X2-DFN2015-3
Y1
Value
Dimensions
(in mm)
C 1.000
G 0.150
Y2 X 0.310
X1 X1 1.300
Y 0.500
Y1 0.650
Y(2x) Y2 1.000
G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 51 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN2015-6
A1
A3
X2-DFN2015-6
A
Seating Plane
Dim Min Max Typ
A 0.375 0.40 0.390
D A1 0 0.05 0.02
L
z A3 - - 0.13
b 0.20 0.30 0.25
R0 D 1.45 1.575 1.50
.20
0
D2 1.00 1.20 1.10
(Pin #1 ID) e - - 0.50
E 1.95 2.075 2.00
E E2
E2 0.70 0.90 0.80
D2
L 0.25 0.35 0.30
z1 Z - - 0.125
Z1 - - 0.075
All Dimensions in mm
e b

Suggested Pad Layout

X2-DFN2015-6

X2

X C
X2-DFN2015-6
Value
Y Dimensions
(in mm)
C 0.500
X 0.350
Y1 Y2 X1 1.150
X2 1.350
Y 0.500
Y1 0.850
Y2 2.150

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 52 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN2015-8

X2-DFN2015-8
A Dim Min Max Typ
A3 D 1.95 2.05 2.00
SIDE VIEW A1 E 1.45 1.55 1.50
D D1 0.23 0.43 0.33
D1 E1 0.55 0.75 0.65
D2 0.52 0.72 0.62
L E2 0.38 0.58 0.48
E1 D3 0.40 0.60 0.50
E3 0.35 0.55 0.45
D2 D3 E3
A - 0.40 0.39
E E2
A1 0 0.05 0.02
A3 - - 0.127
b 0.20 0.30 0.25
L 0.25 0.35 0.30
e
e - - 0.65
Z b Z - - 0.225
BOTTOM VIEW
All Dimensions in mm

Suggested Pad Layout

X2-DFN2015-8

C
Dimensions Value (in mm)
X1 (4x) X C 0.650
G 0.150
Y1 (4x)
G1 0.150
Y
G (4x) X 0.410
X2 X1 0.350
Y2 G1 X3 Y3 X2 0.795
X3 0.700
R Y 0.825
Y
Y1 0.500
Y2 0.480
Y3 0.500
X R R0.125

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 53 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2018-6

A3
A
SEATING PLANE U-DFN2018-6
Dim Min Max Typ
A1 A 0.545 0.605 0.575
Pin#1 ID D A1 0 0.05 0.02
A3 - - 0.13
D2
b 0.15 0.25 0.20
L D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e - - 0.50
E2
E 1.95 2.075 2.00
E E2 0.90 1.10 1.00
L 0.20 0.30 0.25
z - - 0.30
z
All Dimensions in mm
e b

Suggested Pad Layout

U-DFN2018-6

X C

Y
Value
Dimensions
(in mm)
C 0.50
G 0.20
Y1
X 0.25
X1 1.60
Y 0.35
G
Y1 1.20

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 54 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN2018-8

G H F

SIDE VIEW X2-DFN2018-8


Dim Min Max Typ
B A 1.95 2.08 2.00
D B 1.75 1.88 1.80
C C 0.25 0.35 0.30
D L3 D - - 0.20
L4 L1 E - - 0.30
D
F - - 0.26
A E L5 L2 G 0.36 0.40 0.39
N
L6 H 0 0.05 0.02
D K 0.15 0.25 0.20
L1 0.40 0.60 0.50
K D L2 0.90 1.10 1.00
M
L3 0.50 0.70 0.60
BOTTOM VIEW
L4 0.30 0.50 0.40
L5 0.25 0.45 0.35
L6 0.20 0.40 0.30
M - - 0.40
N - - 0.30
All Dimensions in mm

TOP VIEW

Suggested Pad Layout

X2-DFN2018-8
X C
Dimensions Value (in mm)
C 0.40
Y G1 0.10
G3 G2 0.20
X3 G3 0.10
Y3 G4 0.20
X2
G4 X 0.25
Y2 X1 0.60
G1 X1 X2 0.50
Y1 G2 X3 0.35
Y 0.50
Y1 0.40
Y2 1.00
Y3 0.30

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 55 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-2 (Type B)

A1
Seating Plane U-DFN2020-2
(Type B)
Dim Min Max Typ
D
A 0.47 0.53 0.50
D2 Z1 A1 0.00 0.05 0.02
b 1.55 1.65 1.60
D 1.95 2.05 2.00
D2 1.50 1.70 1.60
E 1.95 2.05 2.00
E2 E2 1.22 1.42 1.32
E k 0.25 BSC
k
L 0.23 0.33 0.28
Z 0.20 BSC
Z1 0.075 BSC
L All Dimensions in mm

b
Z

Suggested Pad Layout

U-DFN2020-2 (Type B)

X
Y

Value
Dimensions
(in mm)
G 0.150
G X 1.700
Y2 X1 1.700
Y1 Y 0.480
Y1 1.520
Y2 2.150

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 56 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-3

A3
A A1

Seating Plane U-DFN2020-3


Dim Min Max Typ
A 0.57 0.63 0.60
D
A1 0 0.05 0.02
D2 A3
L - - 0.152
b 0.20 0.30 0.25
R0 D 1.950 2.075 2.00
.20
0 D2 1.10 1.30 1.20
Pin #1 ID E3 D3 0.325 REF
e - - 0.50
E
E2 E 1.950 2.075 2.00
E2 0.80 1.00 0.90
D3
E3 0.138 REF
L 0.35 0.45 0.40
All Dimensions in mm
b L
e

Suggested Pad Layout

U-DFN2020-3

X3

X1
Y1
Value
0 00 Dimensions
R0.05 .2 (in mm)
R0
C 1.000
5 G 0.150
. 22
R0 X 0.350
X2
X1 0.450
Y2 0
.20 Y4 X2 1.400
G R0
X3 1.724
Y3 Y 0.600
Y1 0.450
Y2 1.100
Y Y3 0.450
Y4 2.300

X
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 57 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-3 (Type B)

A1 A3
A
U-DFN2020-3
Seating Plane (Type B)
Dim Min Max Typ
D A 0.57 0.63 0.60
e e
A1 0.00 0.05 0.02
Z A3 0.152
b 0.20 0.30 0.25
L
D 1.950 2.075 2.00
D2 1.22 1.42 1.32
D4 D4 0.56 0.76 0.66
E 1.950 2.075 2.00
E E2 0.79 0.99 0.89
E2
D2 E4 0.48 0.68 0.58
e 0.65
L 0.25 0.35 0.30
E4
Z 0.225
All Dimensions in mm

Suggested Pad Layout

U-DFN2020-3 (Type B)

Y1
Value
Dimensions
(in mm)
C 1.300
X1
G 0.240
Y2 X 0.350
X1 1.520
X2 1.700
Y 0.500
G
Y1 0.470
Y2 1.090
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 58 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Suggested Pad Layout

V-DFN2020-3

C C X (3x) Value
Dimensions
(in mm)
Y (2x) C 0.65
G 0.20
G
X 0.35
Y4 X1 1.52
Y1
Y3 Y 0.55
Y1 0.98
Y2 Y2 0.47
Y3 0.63
X1 Y4 2.20

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 59 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6

A1
A3

A
Seating Plane
U-DFN2020-6
D Dim Min Max Typ
A 0.57 0.63 0.60
D2
A1 0 0.05 0.03
D2/2 A3 - - 0.15
b 0.20 0.30 0.25
D 1.95 2.075 2.00
0
. 10
R0
D2 1.45 1.65 1.55
e - - 0.65
E2/2
E 1.95 2.075 2.00
E E2 E2 0.76 0.96 0.86
Pin #1 ID L 0.30 0.40 0.35
All Dimensions in mm

e b

Suggested Pad Layout

U-DFN2020-6

X
C

G
Y
Value
Dimensions
(in mm)
C 0.65
Y1 G 0.15
X 0.37
X1 1.67
Y 0.45
Y1 0.90
G

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 60 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6/SWP

A3
A1
A
A
Seating Plane U-DFN2020-6/SWP
Dim Min Max Typ
A 0.59 0.65 0.62
A1 0 0.05 0.03
A3 - - 0.19
D
b 0.28 0.38 0.33
D 1.95 2.05 2.00
D2 Detail A D2 0.87 1.07 0.97
D2a 0.205 0.305 0.255
E 1.95 2.05 2.00
k
E2 1.42 1.62 1.52
D2a E2a 0.69 0.79 0.74
e 0.65 BSC
E E2
L 0.28 0.38 0.33
E2a k1 k 0.450 BSC
L(2x) k1 0.225 BSC
Z - - 0.20
All Dimensions in mm

e
z b

Suggested Pad Layout

U-DFN2020-6/SWP

X1
Y1

G1 Value
Dimensions
(in mm)
C 0.650
G 0.125
G1 0.350
Y3 X 0.400
Y2 X1 1.700
Y 0.365
Y1 0.515
Y2 0.825
G Y Y3 2.330

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 61 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6 (Type B)
U-DFN2020-6
A A3
Type B
SEATING PLANE
Dim Min Max Typ
A1 A 0.545 0.605 0.575
A1 0 0.05 0.02
D
A3 - - 0.13
Pin#1 ID b 0.20 0.30 0.25
D2
D 1.95 2.075 2.00
z d - - 0.45
D2 0.50 0.70 0.60
d
e - - 0.65
E E2
f f
E 1.95 2.075 2.00
E2 0.90 1.10 1.00
f - - 0.15
L
L 0.25 0.35 0.30
e b z - - 0.225
All Dimensions in mm

Suggested Pad Layout

U-DFN2020-6 (Type B)

Y C

Value
G Dimensions
X2 (in mm)
Z 1.67
G1 G 0.20
X1 G1 0.40
X1 1.0
X2 0.45
Y 0.37
G Y1 0.70
Y1 C 0.65
Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 62 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6 (Type C)

A1
A
A3 U-DFN2020-6
Seating Plane
Type C
D
Dim Min Max Typ
A 0.57 0.63 0.60
D2 A1 0.00 0.05 0.02
Pin #1 ID
A3 0.15
b 0.25 0.35 0.30
D 1.95 2.075 2.00
D2 1.55 1.75 1.65
E 1.95 2.075 2.00
E
E2 0.86 1.06 0.96
E2
e 0.65
L 0.25 0.35 0.30
Z 0.20
Z(4x) All Dimensions in mm
L

e b

Suggested Pad Layout

U-DFN2020-6 (Type C)

X2
X1

Y Value
Dimensions
(in mm)
C 0.650
X 0.350
X1 1.650
Y2 Y1 X2 1.700
Y 0.525
Y1 1.010
Y2 2.400

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 63 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6 (Type E)

U-DFN2020-6
Type E
A3 Dim Min Max Typ
A1
A A 0.57 0.63 0.60
A1 0 0.05 0.03
A3 0.15
D b 0.25 0.35 0.30
b1 0.185 0.285 0.235
D 1.95 2.05 2.00
b1 D2 0.85 1.05 0.95
K1
D2
E 1.95 2.05 2.00
E2 1.40 1.60 1.50
E E2 L1
L(2X)
e 0.65
L 0.25 0.35 0.30
K2 L1 0.82 0.92 0.87
K1 0.305
Z(4X)
K2 0.225
e b(6X)
Z 0.20
All Dimensions in mm

Suggested Pad Layout

U-DFN2020-6 (Type E)

Value
Dimensions
(in mm)
C 0.650
X2
X 0.400
Y3 Y2 Y1 X1 0.285
X2 1.050
Y 0.500
X1 Y1 0.920
Y2 1.600
Y3 2.300

X(6x) C Y (2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 64 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-6 (Type F)

A
A1
A3
U-DFN2020-6
(Type F)
Seating Plane Dim Min Max Typ
A 0.57 0.63 0.60
D A1 0 0.05 0.03
A3 - - 0.15
b 0.25 0.35 0.30
D 1.95 2.05 2.00
D2 0.85 1.05 0.95
E3 D3
D3 0.33 0.43 0.38
e 0.65 BSC
D2 e2 0.863 BSC
E E2 E 1.95 2.05 2.00
E2 1.05 1.25 1.15
e2 L E3 0.65 0.75 0.70
Z1 L 0.225 0.325 0.275
Z 0.20 BSC
Z1 0.110 BSC
All Dimensions in mm
e b
Z(4X)

U-DFN2020-6 (Type F)

A
A1
A3
U-DFN2020-6
(Type F)
Seating Plane Dim Min Max Typ
A 0.57 0.63 0.60
D A1 0 0.05 0.03
A3 - - 0.15
b 0.25 0.35 0.30
D 1.95 2.05 2.00
D2 0.85 1.05 0.95
E3 D3
D3 0.33 0.43 0.38
e 0.65 BSC
D2 e2 0.863 BSC
E E2 E 1.95 2.05 2.00
E2 1.05 1.25 1.15
e2 L E3 0.65 0.75 0.70
Z1 L 0.225 0.325 0.275
Z 0.20 BSC
Z1 0.110 BSC
All Dimensions in mm
e b
Z(4X)

Suggested Pad Layout

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 65 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
U-DFN2020-6 (Type F)

X3

C X Y
Value
Dimensions
(in mm)
C 0.650
X 0.400
X1 0.480
X2 0.950
Y3 Y2 Y1 Y4 X3 1.700
Y 0.425
Y1 0.800
X1 Y2 1.150
Y3 1.450
Pin1 Y4 2.300

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 66 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X2-DFN2020-6
X2-DFN2020-6
A3
Dim Min Max Typ
A1
A A 0.40
A1 0 0.05 0.03
D
A3 0.13
e b 0.25 0.35 0.30
D 1.95 2.05 2.00
D2 0.85 1.05 0.95
L
E 1.95 2.05 2.00
E2 1.40 1.60 1.50
D2
e 0.65
E E2 L 0.25 0.35 0.30
L1 L1 1.35 1.45 1.40
Z 0.20
All Dimensions in mm

Z(3X) e b(6X)

Suggested Pad Layout

X2-DFN2020-6

X2
X1

Value
Dimensions
Y (in mm)
C 0.650
X 0.400
X1 1.050
Y3 Y2 X2 1.700
Y 0.500
Y1 Y1 1.600
Y2 1.600
Y3 2.300

X (6x) C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 67 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-8

A1 A3
A
U-DFN2020-8
Seating Plane
Dim Min Max Typ
A 0.57 0.63 0.60
D A1 0 0.05 0.02
D2 A3 - - 0.152
b 0.20 0.30 0.25
D 1.95 2.05 2.00
Pin #1 ID
D2 0.54 0.74 0.64
K1 K
e 0.500 BSC
R
E 1.95 2.05 2.00
0.
E 15 E2 0.86 1.06 0.96
E2 0
K - - 0.23
K1 - - 0.32
L 0.24 0.34 0.29
Z - - 0.125
L All Dimensions in mm

b
Z e

Suggested Pad Layout

U-DFN2020-8

X3

X C

G Value
Y Dimensions
(in mm)
C 0.500
G 0.150
X1 X 0.350
Y2 Y1 X1 0.700
X2 1.660
Y 0.490
Y1 1.020
Y1 2.300

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 68 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2020-8 (Type E)

A1 A3
A

Seating Plane U-DFN2020-8


(Type E)
D Dim Min Max Typ
A 0.50 0.60 0.56
D2
A1 0.00 0.05 0.02
D2/2 A3 - - 0.203
b 0.20 0.30 0.25
D 1.950 2.075 2.00
Pin #1 ID z D2 1.60 1.80 1.70
e 0.500 BSC
R0 E2/2 E 1.950 2.075 2.00
E E2 .2
00 E2 0.80 1.00 0.90
0 L 0.25 0.35 0.30
.12
R0 z - - 0.125
All Dimensions in mm
L

e b

Suggested Pad Layout

U-DFN2020-8 (Type E)

X2

C
Value
Dimensions
G (in mm)
C 0.500
G 0.150
X 0.350
Y2 Y1 X1 1.800
G X2 1.850
X1
Y 0.500
Y1 1.000
Y Y2 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 69 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN2020-6 (Type US)

A A1

A3
Seating Plane W-DFN2020-6
(Type US)
Dim Min Max Typ
D A 0.70 0.80 0.75
Pin #1 ID D2 A1 0.00 0.05 --
A3 0.20 REF
b 0.25 0.35 0.30
D 1.95 2.075 2.00
D2 1.35 1.60 1.50
E 1.95 2.075 2.00
E E2
E2 0.65 0.90 0.80
e 0.65 BSC
L 0.25 0.45 0.35
All Dimensions in mm
L

e b

Suggested Pad Layout

W-DFN2020-6 (Type US)

X1
X2

Y
Value
Dimensions
(in mm)
C 0.650
X 0.350
Y2 X1 1.650
X2 1.550
Y 0.545
Y1 Y1 0.850
Y2 2.350

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 70 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN2020-8 (Type C)

A A1

A3 W-DFN2020-8
Seating Plane Type C
Dim Min Max Typ
*D
A 0.770 0.830 0.800
D2 A1 0 0.05 0.02
D2/2 A3 - - 0.152
b 0.20 0.30 0.25
K
D 1.950 2.075 2.000
Pin #1 ID D2 1.50 1.70 1.60
E 1.950 2.075 2.000
R0 E2/2 E2 0.80 1.00 0.90
E .2 E2
00 e - - 0.50
K - - 0.125
L 0.240 0.340 0.290
All Dimensions in mm
L

e b

Suggested Pad Layout

W-DFN2020-8

X2 Y
G

Dimensions Value (in mm)


C 0.500
G 0.200
G1 0.210
G1 X 0.300
Y2 Y1 X1 1.600
X1 X2 1.750
Y 0.490
Y1 0.900
Y2 2.300

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 71 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2030-6 (Type B)
A1
A3
U-DFN2030-6
A Type B
Seating Plane
Dim Min Max Typ
D A 0.55 0.65 0.60
e A1 0 0.05 0.02
(Pin #1 ID) A3 - - 0.15
b 0.25 0.35 0.30
D 1.95 2.05 2.00
D2 1.40 1.60 1.50
E 2.95 3.05 3.00
E E2
E2 1.74 1.94 1.84
L
D2 e - - 0.65
L 0.28 0.38 0.33
Z - - 0.20
All Dimensions in mm
b
Z(4x)

Suggested Pad Layout

U-DFN2030-6 (Type B)

X2
Y

G
Value
Dimensions
(in mm)
C 0.650
X1 G 0.150
X 0.400
Y2 Y1
X1 1.600
X2 1.700
Y 0.530
Y1 1.940
Y2 3.300

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 72 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2030-6 (Type C)

A1 A3
A
U-DFN2030-6
Seating Plane (Type C)
Dim Min Max Typ
A 0.50 0.60 --
D A1 0.00 0.05 0.02
L A3 -- -- 0.127
e1 e
1 b 0.25 0.35 0.30
R0.1 b2 0.60 0.70 0.65
50
Pin1
ID D 1.90 2.10 2.00
D2 1.60 1.80 1.70
E 2.90 3.10 3.00
E2 E2 1.60 1.80 1.70
E e -- -- 0.60
D2
e1 -- -- 0.775
L 0.25 0.35 0.30
z
z 0.0500 Ref
All Dimensions in mm

b2 b

Suggested Pad Layout

U-DFN2030-6 (Type C)

G1
X1 X

Y
Value
Dimensions
(in mm)
C 0.600
G C1 0.775
G 0.200
Y1
G1 0.200
X 0.400
X1 0.750
X2 X2 1.800
Y 0.500
Y1 1.800

C1 C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 73 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2030-8
A
A1 U-DFN2030-8
A3
Dim Min Max Typ
Seating Plane A 0.57 0.63 0.60
A1 0 0.05 0.02
D A3 - - 0.15
e L
b 0.20 0.30 0.25
D 1.95 2.05 2.00
(Pin #1 ID)
D2 1.40 1.60 1.50
e - - 0.50
C'0.25*45
E 2.95 3.05 3.00
E E2
D2 E2 1.50 1.70 1.60
L 0.35 0.45 0.40
Z - - 0.125
All Dimensions in mm
Z b

Suggested Pad Layout

U-DFN2030-8

X2

C Y

Value
Dimensions
(in mm)
C 0.500
G 0.250
Y2 Y1
X 0.350
X1 1.500
X1 X2 1.850
Y 0.600
Y1 1.600
Y2 3.300
G

Pin1 X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 74 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN2030-8

A A1
Seating Plane
X1-DFN2030-8
D Dim Min Max Typ
(Pin #1 ID) Z(4X) Z1(4X) A 0.470 0.530 0.50
C0.5X45 e
A1 0 0.05 0.02
b 0.20 0.30 0.25
L1 D 1.95 2.05 2.00
E 2.95 3.05 3.00
e - - 0.50
K 2.00 - -
K1 1.90 - -
E K1 K L 0.35 0.45 0.40
L1 0.45 0.55 0.50
Z - - 0.125
Z1 - - 0.100
All Dimensions in mm
L(7x)

Suggested Pad Layout

X1-DFN2030-8

X1

Value
Dimensions
Y1 (in mm)
C 0.500
G 1.900
Y2 G X 0.350
X1 1.850
Y Y 0.500
Y1 0.700
Y2 3.100

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 75 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2510-10

A3
A1 U-DFN2510-10
A Dim Min Max Typ
Seating Plane A 0.545 0.605 0.575
A1 0 0.05 0.03
D A3 - - 0.13
b1
b 0.15 0.25 0.20
b1 035 0.45 0.40
D 2.450 2.575 2.500
e - - 0.50
R0.075
E 0.950 1.075 1.000
E
L 0.325 0.425 0.375
L Z - - 0.150
All Dimensions in mm
Z
R0.1

e b
25

Suggested Pad Layout

U-DFN2510-10

X2
X1 X
Value
Dimensions
(in mm)
Y1 Y C 0.500
X 0.250
Y3 X1 0.450
X2 2.250
Y 0.625
Y2
Y1 0.575
Y2 0.700
Y3 1.400
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 76 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2535-6

A
A1 A3

Seating Plane U-DFN2535-6


Dim Min Max Typ
D A 0.50 0.60 --
L
(Pin #1 ID) e A1 0.00 0.05 0.02
1 A3 - - 0.127
b 0.25 0.35 0.30
D 2.45 2.55 2.50
D2 1.87 2.07 1.97
E 3.45 3.55 3.50
E 50
E2 1.20 1.40 1.30
.1 E2
R0
e - - 0.65
D2 L 0.33 0.43 0.38
Z - - 0.45
All Dimensions in mm

Z b

Suggested Pad Layout

U-DFN2535-6

G Value
Dimensions
(in mm)
C 0.650
G 0.620
Y1
X 0.400
X1 2.070
Y 0.610
X1 Y1 1.400

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 77 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2535-6(Type B)

A3
A
Seating Plane

D U-DFN2535-6
A1
e1 (Type B)
L(X6)
e Dim Min Max Typ
R0. A 0.50 0.60 -
(P 150
in # A1 0.00 0.05 0.02
1 ID
) A3 - - 0.127
b 0.25 0.35 0.30
b2 1.05 1.15 1.10
D 2.45 2.55 2.50
D2 2.01 2.21 2.11
E E2
E 3.45 3.55 3.50
E2 2.20 2.40 2.30
D2 e - - 0.55
e1 - - 0.95
L 0.25 0.35 0.30
z - - 0.15
All Dimensions in mm
z b
b2

Suggested Pad Layout


U-DFN2535-6
(Type B)

X1 X

X2 Value
Dimensions
(in mm)
C 0.550
C1 0.950
X 0.400
X1 1.200
Y1
X2 2.210
Y 0.500
Y Y1 2.400

C1 C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 78 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN2050-4

A1
A3
A
Seating Plane

V-DFN2050-4
D
Dim Min Max Typ
Pin #1 ID e A 0.75 0.85 0.80
A1 0 0.05 0.02
A3 - - 0.15
b 0.20 0.30 0.25
b1 0.70 0.80 0.75
D2
D 1.90 2.10 2.00
D2 1.40 1.60 1.50
E 4.90 5.10 5.00
E2 3.46 3.66 3.56
E E2
e 0.50 BSC
L 0.35 0.65 0.50
Z - - 0.375
All Dimensions in mm

L
Z b
b1

Suggested Pad Layout

V-DFN2050-4

X1
X

Y G

C
Value
Dimensions
(in mm)
C 0.500
G 0.150
Y1
X 0.350
Y2 X1 0.850
X2 1.540
X2 X3 0.175
Y 0.700
Y1 3.600
Y2 5.300

X3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 79 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2116-8

A3
A A1 U-DFN2116-8

Seating Plane Dim Min Max Typ


A 0.545 0.605 0.575
A1 0.000 0.050 0.020
D
D2 A3 - - 0.130
(Pin #1 ID) D2/2
b 0.200 0.300 0.250
C'0.2x45
D 2.050 2.175 2.100
0
E2/2 .10
R0
D2 1.600 1.800 1.700
E 1.550 1.675 1.600
E E2 E2 0.300 0.500 0.400
e - - 0.500
(0.600) L 0.275 0.375 0.325
L
Z - - 0.175

b
All Dimensions in mm
e
Z

Suggested Pad Layout

U-DFN2116-8

X2
Value
Dimensions
C (in mm)
Y C 0.500
X 0.300
X1 1.750
Y1 X2 1.800
Y 0.600
Y2
X1 Y1 0.450
Y2 2.050

Pin1
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 80 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2523-6

A U-DFN2523-6
A3
Dim Min Max Typ
A1
D A 0.57 0.63 0.60
e A1 0 0.05 0.02
A3 - - 0.152
L (3x) b 0.25 0.35 0.30
D 2.45 2.55 2.50
D1 1.55 1.65 1.60
Pin #1 ID
R0.150 e - - 0.65
E
E1 E 2.25 2.35 2.30
D1 E1 1.18 1.28 1.23
L 0.30 0.40 0.35
L1 0.30 0.40 0.35
All Dimensions in mm
L1 (2x)
b (6x)

Suggested Pad Layout

U-DFN2523-6

X1

Y1
Dimensions Value (in mm)
Y2 C 0.650
X 0.400
Y3
X1 1.700
Y 0.650
Y1 0.450
Y2 1.830
Y
Y3 2.700
C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 81 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN2626-10
A
A3
A1

Seating Plane

D
D2
U-DFN2626-10
Dim Min Max Typ
A 0.57 0.63 0.60
A1 0 0.05 0.03
C'0.2x45
(Pin #1 ID) A3 - - 0.15
b 0.20 0.30 0.25
D2/2 E2/2 D 2.55 2.675 2.60
E E2 D2 2.05 2.25 2.15
E 2.55 2.675 2.60
0
E2 1.16 1.36 1.26
.10
R0 e 0.50 BSC
L L 0.30 0.40 0.35
All Dimensions in mm
e
b

Suggested Pad Layout

U-DFN2626-10

X2

Value
Dimensions
(in mm)
X1 C 0.500
X 0.300
Y2 X1 2.250
Y1 X2 2.300
Y 0.600
Y1 1.360
Y2 3.000

Pin1
C
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 82 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3016-12

A
A3 U-DFN3016-12
Dim Min Max Typ
A1
A 0.545 0.605 0.575
D
A1 0 0.05 0.02
A3 - - 0.13
b 0.20 0.30 0.25
D 2.95 3.075 3.00
D2 2.10 2.30 2.20
e - - 0.50
E D2 E2 E 1.55 1.675 1.60
E2 0.30 0.50 0.40
L 0.28 0.38 0.33
L (12x) All Dimensions in mm

e b (12x)

Suggested Pad Layout

U-DFN3016-12

X1

Y Value
Dimensions
(12x) (in mm)
C 0.500
X 0.300
X1 2.800
X2 Y1 Y2
X2 2.250
Y 0.600
Y1 0.450
Y2 2.050

C X
(12x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 83 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions

X2-DFN3020-6

A
X2-DFN3020-6
A1 D A3
e
Dim Min Max Typ
A - 0.40 -
A1 0 0.05 0.02
A3 - - 0.15
Pin #1 ID
b 0.20 0.30 0.25
D1 D 1.95 2.075 2.00
E D1 0.942 1.142 1.042
E1 e - - 0.50
E 2.95 3.075 3.00
E1 1.124 1.324 1.224
L 0.50 0.60 0.55
Z - - 0.375
L All Dimensions in mm

Z b

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 84 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3020-8
A
A3
A1

Seating Plane V-DFN3020-8


Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0 0.05 0.02
A3 - - 0.203
e b 0.25 0.35 0.30
D 2.95 3.05 3.00
(Pin #1 ID) e - - 0.65
E 1.95 2.05 2.00
E L 0.30 0.40 0.35
Z - - 0.375
All Dimensions in mm
L

Z b

Suggested Pad Layout

V-DFN3020-8

X1
X
Y

Dimensions Value (in mm)


C 0.650
G 1.000
Y1 G X 0.400
X1 2.350
Y 0.650
Y1 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 85 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN3020-8 (Type B)
A
A3 W-DFN3020-8
A1
Type B
Seating Plane Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0 0.05 0.02
A3 - - 0.15
D4 D4
b 0.25 0.35 0.30
D 2.95 3.075 3.00
(Pin #1 ID)
D2 0.82 1.02 0.92
D4 1.01 1.21 1.11
E2 e - - 0.65
E E2 E 1.95 2.075 2.00
D2 D2 E2 0.43 0.63 0.53
L 0.25 0.35 0.30
L
Z - - 0.375
e e e All Dimensions in mm
Z b

Suggested Pad Layout

W-DFN3020-8 (Type B)

C X
Dimensions Value (in mm)
Y1 C 0.650
G1 G 0.285
G G1 0.090
Y2 X 0.400
Y X1 1.120
Y 0.730
X1 Y1 0.500
Y2 0.365

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 86 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN3020-8 (Type K)

A
A3
W-DFN3020-8
Type K
A1
Dim Min Max Typ Dim Min Max Typ
D A 0.77 0.83 0.80 E1 0.56 0.76 0.66
e A1 0.00 0.05 0.02 E2 0.26 0.46 0.36
D3
A3 - - 0.15 E3 0.605 0.805 0.705
L1 b 0.25 0.35 0.30 E4 0.275 0.475 0.375
L2 D 2.95 3.05 3.00 L 0.425 0.525 0.475
D1 1.025 1.225 1.125 L1 0.30 0.40 0.35
E E3 E1 D2 1.05 1.25 1.15 L2 0.60 0.70 0.65
E2
D3 0.375 0.575 0.475 Z - - 0.375
D2 D1
E4 D4 0.40 0.60 0.50 e - - 0.65
(2x) L (4x) E 1.95 2.05 2.00
D4 (2x)
All Dimensions in mm
Z (4x) b

Suggested Pad Layout

W-DFN3020-8 (Type K)

Dimensions Value (in mm)


X5 C 0.650
X 0.600
C X (2x)
X1 0.400
X2 0.825
Y (4x) X3 0.675
X4 1.250
X5 2.750
X4 Y 0.675
Y8 X3 Y3 Y1 0.550
X2 Y2 0.850
Y7 Y4
Y5 Y3 0.755
Y2
Y6 Y4 1.455
Y5 1.000
Y1 Y6 0.650
X1 (6x) Y7 1.455
Y8 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 87 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3020-8 (Type N)

A3
A1 V-DFN3020-8
A
(Type N)
Seating Plane
Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0 0.05 0.02
A3 - - 0.203
e
(Pin #1 ID) b 0.24 0.34 0.29
D 2.95 3.05 3.00
L D2 0.84 1.04 0.94
D2 e - - 0.65
K
E 1.95 2.05 2.00
E
L1 E2 0.70 0.90 0.80
E2 L 0.27 0.37 0.32
L1 0.15 0.25 0.20
K - - 0.68
Z - - 0.38
b All Dimensions in mm
Z(4x)

Suggested Pad Layout

V-DFN3020-8
(Type N)

X2
C X Value
Y Dimensions
(in mm)
G C 0.650
G 0.580
X 0.390
X1
X1 1.040
Y3 X2 2.340
Y1 Y 0.520
Y1 0.900
Y2 0.300
Y2 Y3 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 88 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
V-DFN3020-8 (Type P)

V-DFN3020-8
(Type P)
A3 Dim Min Max Typ
A A1
A 0.77 0.83 0.80
Seating Plane A1 0.00 0.05 0.02
A3 - - 0.152
b 0.25 0.35 0.30
D D 2.95 3.05 3.00
D2 0.38 0.58 0.48
e z
(Pin #1 ID) D2a 0.34 0.54 0.44
k D2b 0.85 1.05 0.95
E 1.95 2.05 2.00
k1 E2 0.70 0.90 0.80
E2a 1.08 1.28 1.18
D2a
E E2a E2 E2b E2b 0.70 0.90 0.80
D2 D2b e - - 0.65
k - - 0.11
k1 - - 0.30
k2 - - 0.28
k3 k3 - - 0.28
z1 L L 0.25 0.35 0.30
b z - - 0.375
k2
z1 - - 0.195
All Dimensions in mm

Suggested Pad Layout


V-DFN3020-8 (Type P)

X5
X4
X3 C

G2 Value
Dimensions
(in mm)
C 0.650
G 0.180
X2 G1 0.180
Y2 Y1 Y3 G2 0.200
X1 X 0.400
X1 0.580
Y(6x)
X2 1.050
X3 0.540
X4 2.350
G1 X(6x) X5 2.530
G Y 0.500
Y1 0.900
Y2 0.900
Y3 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 89 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3020-10

U-DFN3020-10
A3
A A1 Dim Min Max Typ
Seating Plane A 0.57 0.63 0.60
A1 0 0.05 0.02
A3 - - 0.15
D
b 0.15 0.25 0.20
e D 2.95 3.05 3.00
C'0.2X45
D1 0.25 0.45 0.35
(Pin #1 ID)
D1(3x) E 1.95 2.05 2.00
E1 0.90 1.10 1.00
e - - 0.60
E E1(3x)
L(10x) e1 - - 0.65
e2 e2 0.50 0.70 0.60
L 0.25 0.35 0.30
Z - - 0.15
e1 All Dimensions in mm
Z(4x) b(10x)

Suggested Pad Layout

U-DFN3020-10

X2

Value
Dimensions
(in mm)
G1
C 0.650
Y G 0.150
Y1
G1 0.600
Y2 X 0.300
G X1 0.350
X1
X2 2.800
Y 0.500
Y1 1.000
Y2 2.300
C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 90 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3020-10

V-DFN3020-10
A3 Dim Min Max Typ
A1
A A 0.75 0.85 0.80
Seating Plane
A1 0 0.05 0.02
A3 - - 0.15
b 0.15 0.25 0.20
D D 2.95 3.075 3.00
e D2 - - 1.000
Lc La D2a - - 0.400
D2b - - 0.500
(P R0. D2c - - 0.850
in 150
#1
ID
) E2 D2d - - 0.320
E2 D2e
E2 - - 0.400
D2a E 1.95 2.075 2.00
D2
E E2 - - 0.200
D2c D2d
E2a La E2a - - 0.450
E2
e - - 0.60
D2b
L 0.25 0.35 0.30
E2 La - - 0.460
Lb - - 0.550
Lb D2e
L(6x) Lc - - 0.548
Z(4x) b(10x)
Z 0.175 0.225 0.20
All Dimensions in mm

Suggested Pad Layout

V-DFN3020-10
Value
Dimensions
(in mm)
Y(6x) X(10x) C 0.600
G, G2, G3 0.150
G1 0.240
Y2
X 0.300
Y1
X1 0.950
G X2 0.500
Y5 X3 0.600
G3 Y4
Y3 X4 1.100
G1 X2
X1
Y11 X5 0.500
X3 X5 Y6 X6 0.420
X4 Y8 Y 0.500
Y9 X6
Y1 0.650
G2
Y2 0.560
Y7 Y10 Y3 0.550
Y4, Y5, Y6 0.300
Y7 0.650
C Y8, Y9 0.300
Y10 0.560
Y11 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 91 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3020-14

A1 A3
A
V-DFN3020-14
Seating Plane Dim Min Max Typ
A 0.77 0.83 0.80
D
e
A1 0 0.05 0.02
A3 - - 0.15
b 0.15 0.25 0.20
(Pin #1 ID)
D2
D 2.95 3.05 3.00
R0 D2 2.40 2.60 2.50
.20
E E1 0 E 1.95 2.05 2.00
E1 0.80 1.00 0.90
e - - 0.40
L L 0.30 0.40 0.35
Z - - 0.20
All Dimensions in mm
Z b

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 92 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-4

A A3

U-DFN3030-4
A1 Side View Dim Min Max Typ Dim Min Max Typ
D A 0.57 0.63 0.60 E1 0.615 0.815 0.715
e A1 0 0.05 0.02 E2 1.78 1.98 1.88
A3 - - 0.15 E3 0.715 0.915 0.815
H B H
0.35 0.45 0.40 0.05 0.15 0.10
D3 D 2.90 3.10 3.00 I 0.20 0.30 0.25
E3 I
E2 D1 1.075 1.275 1.175 J 0.185 0.285 0.235
E K J D2 0.925 1.125 1.025 K 0.065 0.165 0.115
D2
D1 D3 1.075 1.275 1.175 L 0.30 0.60 0.45
E1 M E 2.90 3.10 3.00 M 0.05 0.15 0.10
e - - 1.30 Z - - 0.65
L All Dimensions in mm

Z b
Bottom View

Suggested Pad Layout

U-DFN3030-4
C Dimensions Value (in mm)
C 1.300
Y3 (2x) G1 0.100
G6 G2 0.150
G3 0.830
G4 G4 0.115
Y2 G1 G3
X3 G5 0.135
R G6 0.170
Y G7 0.500
G2 G8 0.500
Y1 G5 R 0.150
X2 X 0.500
X1 X1 1.375
G7 G8 X2 1.225
X3 1.175
Y 1.980
X (4x) Y1 1.015
Y2 0.715
Y3 0.650

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 93 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-6

A1 A3
A U-DFN3030-6
Seating Plane Dim Min Max Typ
A 0.57 0.63 0.60
D A1 0 0.05 0.02
(Pin #1 ID) D2 A3 - - 0.15
b 0.35 0.45 0.40
D 2.95 3.05 3.00
D2 2.25 2.45 2.35
45(0.35*0.35) E 2.95 3.05 3.00
E2 1.48 1.68 1.58
E2

L
E

e - - 0.95
L 0.35 0.45 0.40
Z - - 0.35
All Dimensions in mm
e
Z(4x) b

Suggested Pad Layout

U-DFN3030-6

X2
X1
C
Value
Dimensions
(in mm)
C 0.950
X 0.500
X1 2.400
Y1 Y2 X2 2.550
Y 0.600
Y1 1.780
C-0.409
Y2 3.300
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 94 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-6 (Type B)

A1
A
Seating Plane U-DFN3030-6 (Type B)
Dim Min Max Typ
D A 0.57 0.63 0.60
A1 0.00 0.05 0.02
D2 b 0.45 0.55 0.50
D 2.95 3.05 3.00
D2 2.30 2.50 2.40
C0.35
PIN1#ID e - - 0.95
E 2.95 3.05 3.00
E2 0.90 1.10 1.00
E E2 k
L 0.55 0.65 0.60
k - - 0.35
z - - 0.30
L z1 - - 0.05
All Dimensions in mm
z
z1
e b

Suggested Pad Layout

X2
X1
Value
Dimensions
(in mm)
C 0.950
G 0.200
X 0.600
Y2 Y1 X1 2.500
G
X2 2.600
Y 0.800
Y1 1.200
Y Y2 3.200

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 95 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-6

A1
A3 V-DFN3030-6
Dim Min Max Typ
Seating Plane
A 0.80 0.90 0.85
A D A1 0 0.05 -
e A3 - - 0.203
L b 0.30 0.40 0.35
D 2.95 3.05 3.00
D2 1.95 2.05 2.00
D2
E 2.95 3.05 3.00
E E2
E2 1.15 1.25 1.20
e - - 0.95
e1 - - 1.90
Pin #1 ID
L 0.45 0.55 0.50
Chamfer 0.300X45
b All Dimensions in mm
e1

Suggested Pad Layout

V-DFN3030-6

Y
Value
Dimensions
(in mm)
X1 C 0.950
X 0.450
Y2 Y1 X1 2.100
Y 0.630
Y1 1.300
C - 0.329 Y2 3.160

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 96 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-8

A1
A3
A
Seating Plane U-DFN3030-8
Dim Min Max Typ
D
A 0.57 0.63 0.60
D2
A1 0 0.05 0.02
A3 - - 0.15
b 0.29 0.39 0.34
D 2.90 3.10 3.00
E E2 D2 2.19 2.39 2.29
e - - 0.65
E 2.90 3.10 3.00
200
R0. L E2 1.64 1.84 1.74
(Pin #1 ID) L 0.30 0.60 0.45
e b All Dimensions in mm

Suggested Pad Layout

U-DFN3030-8

X C

Y
Value
Dimensions
(in mm)
C 0.650
Y2
X 0.390
Y1 X1 2.590
Y 0.650
Y1 2.490
Y3 3.300
X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 97 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-8 (Type D)
A
A1 A3

Seating Plane
U-DFN3030-8
D Type D
D/2 Dim Min Max Typ Dim Min Max Typ
e D3
A 0.570 0.630 0.600 E 2.950 3.075 3.000
A1 0 0.050 0.020 E1 1.800 2.000 1.900
E4 E3 A3 - - 0.150 E2 0.290 0.490 0.390
b 0.290 0.390 0.340 E3 0.175 0.375 0.275
D4 D 2.950 3.075 3.000 E4 - - 0.550
D1 E5
D1 2.175 2.375 2.275 E5 - - 0.815
E7 D2 0.980 1.180 1.080 E6 - - 0.150
E
E1 D3 0.105 0.305 0.205 E7 - - 0.135
E2 D4 - - 0.925 L 0.300 0.40 0.350
D2
E/2 D5 - - 1.330 Z - - 0.355
E6
e - - 0.650
L All Dimensions in mm
D5
Z
b(8X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 98 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-8 (Type E)

A
A3 U-DFN3030-8
A1 Type E
Dim Min Max Typ
D A 0.57 0.63 0.60
D2
A1 0 0.05 0.02
A3 - - 0.15
L (x8) b 0.20 0.30 0.25
D 2.95 3.05 3.00
D2 2.15 2.35 2.25
E 2.95 3.05 3.00
E E2 e - - 0.65
E2 1.40 1.60 1.50
L 0.30 0.60 0.45
Z - - 0.40
All Dimensions in mm

Z (x4) e b (x8)

Suggested Pad Layout

U-DFN3030-8 (Type E)

X (x8) C

Y
(x8)
Dimensions Value (in mm)
C 0.65
C1 2.35
Y1 Y2 X 0.30
Y 0.65
Y1 1.60
Y2 2.75

C1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 99 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-8

A
A1 A3

Seating Plane
V-DFN3030-8
Dim Min Max Typ
D
A 0.75 0.85 0.80
e A1 0.00 0.05 0.02
A3 - - 0.203
L b 0.25 0.35 0.30
D 2.95 3.05 3.00
Pin#1 E 2.95 3.05 3.00
C0.10 e - - 0.65
E
L 0.55 0.65 0.60
Z - - 0.375
All Dimensions in mm

Z(4X) b

Suggested Pad Layout

V-DFN3030-8

Value
Dimensions
(in mm)
C 0.650
Y1 X 0.400
Y 0.850
X Y1 3.400

Pin1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 100 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-8 Type H

A3
A1
A V-DFN3030-8
(Type H)
Seating Plane
Dim Min Max Typ
A 0.75 0.85 0.80
A1 0 0.05 0.02
D A3 0.203 BSC
b 0.27 0.37 0.32
e Z1
D 2.95 3.05 3.00
D2 2.50 2.70 2.60
e 0.65 BSC
E 2.95 3.05 3.00
E2 0.59 0.79 0.69
K L 0.30 0.40 0.35
E K1 K 0.28 BSC
K1 0.36 BSC
E2 D2 Z 0.365 BSC
Z1 0.24 BSC
L All Dimensions in mm

Z b(8x)

Suggested Pad Layout

V-DFN3030-8 Type H

X3
C

G
Dimensions Value (in mm)
C 0.650
G 0.180
Y1 X2 G1 0.260
X 0.420
Y2 G1 X1 1.920
X2 2.700
Y1 X3 2.495
Y 0.550
Y1 0.790
Y Y2 3.300

X1
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 101 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-8 Type J

A1
A3
A
V-DFN3030-8
Seating Plane (Type J)
Dim Min Max Typ
A 0.77 0.83 0.80
D A1 0.00 0.05 0.02
D/2 e
A3 0.203 BSC
PIN1# ID b 0.20 0.30 0.25
D 2.95 3.050 3.00
D2 0.90 1.10 1.00
D2a D2a 0.90 1.10 1.00
L E 2.95 3.050 3.00
E2 E2 1.72 1.92 1.82
k E2a 1.72 1.92 1.82
E e 0.65BSC
L 0.27 0.38 0.33
E2a
La 0.15 0.25 0.20
E/2 D2 k 0.35 TYP
z 0.40 BSC
All Dimensions in mm

z b La

Suggested Pad Layout

V-DFN3030-8 Type J

Y1 Value
Dimensions
(in mm)
C 0.650
Y4 G1 G 0.250
G1 0.550
Y3 X 0.350
X1 1.100
Y5 X2 1.100
X1 X3 1.225
Y2 X4 2.375
G Y 0.530
X2 X Y1 0.300
Y2 1.920
Y3 1.920
Y
Y4 1.650
Y5 3.300
X3 C
X4

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 102 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-8 Type K

A3
A1
A

Seating Plane V-DFN3030-8


(Type K)
Dim Min Max Typ
D
A 0.77 0.83 0.80
D/2 A1 0 0.05 0.02
e A3 0.20BSC
b 0.35 0.45 0.40
D 2.95 3.050 3.00
D2 2.30 2.50 2.40
D2a 2.30 2.50 2.40
E2
E 2.95 3.050 3.00
D2 k E2 0.42 0.62 0.52
E E2a 0.89 0.109 0.99
e 0.65BSC
D2a E2a k - - 0.35
E/2 L 0.30 0.40 0.35
z 0.325BSC
L
All Dimensions in mm

b
Z

Suggested Pad Layout

V-DFN3030-8 Type K

X1

X C

Value
Dimensions
Y (in mm)
C 0.650
G 0.195
Y4 G1 0.200
Y5 X 0.450
Y1
X1 2.550
Y 0.450
Y6
Y3 Y1 1.044
Y2 0.566
Y3 0.389
Y2
Y4 0.089
Y5 1.150
Y6 3.200

G1 G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 103 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3030-8 Type M

A1
A A3

V-DFN3030-8
Seating Plane
(Type M)
Dim Min Max Typ
A 0.75 0.85 0.80
D A1 0.00 0.05 0.02
D/2 A3 0.203 BSC
k b 0.27 0.37 0.32
k1
D 2.95 3.05 3.00
D2 2.50 2.70 2.60
E2 D2a 2.50 2.70 2.60
e 0.65 BSC
E 2.95 3.05 3.00
D2 E2 0.59 0.79 0.69
E E2a E2a 0.59 0.79 0.69
L 0.30 0.40 0.35
k 0.180 0.280 0.230
E/2 D2a k1 0.205 0.305 0.255
z 0.365 BSC
All Dimensions in mm
L

e
z b

Suggested Pad Layout

V-DFN3030-8 Type M

X3
X X2
Y X1
Dimensions Value (in mm)
C 0.650
C1 0.688
G 0.260
G1 0.180
Y1 G2 0.325
X 0.370
Y3 G X1 0.470
X2 0.545
Y2 X3 2.700
G2 X4 2.470
Y 0.550
Y1 0.790
G1 Y2 0.790
Y3 3.300
C C1
X4

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 104 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-10

A3
A
SEATING PLANE
U-DFN3030-10
A1 Dim Min Max Typ
A 0.57 0.63 0.60
Pin#1 ID D A1 0 0.05 0.02
D2 A3 - - 0.15
b 0.20 0.30 0.25
D 2.90 3.10 3.00
D2 2.30 2.50 2.40
e - - 0.50
E E2
E 2.90 3.10 3.00
E2 1.50 1.70 1.60
L 0.25 0.55 0.40
z - - 0.375
L
All Dimensions in mm
b
z e

Suggested Pad Layout

U-DFN3030-10

Y C

X1 Dimensions Value (in mm)


G Z 2.60
G 0.15
X 1.80
X
X1 0.60
Y 0.30
G C 0.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 105 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-12
A
A3

Seating Plane

A1 U-DFN3030-12
D Dim Min Max Typ
D2 A 0.57 0.63 0.60
A1 0 0.05 0.02
R0 A3 - - 0.15
.30
0 b 0.18 0.28 0.23
(Pin #1 ID)
D 2.90 3.10 3.00
D2 2.30 2.50 2.40
e - - 0.45
E 2.90 3.10 3.00
E E2
E2 1.50 1.70 1.60
L 0.25 0.55 0.40
All Dimensions in mm

e b

Suggested Pad Layout

U-DFN3030-12

Dimensions Value (in mm)


C 0.45
G 0.15
Y1 X 0.28
X1 2.60
G Y 0.60
X1 Y1 1.80

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 106 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN3030-12

A3
A

Seating Plane

A1
D W-DFN3030-12
Dim Min Max Typ
D2 A 0.70 0.80 --
A1 0 0.05 --
A3 0.175 0.250 --
Pin #1 ID b 0.150 0.250 --
D 2.950 3.050 --
D2 2.30 2.65 --
e - - 0.45
E 2.950 3.050 --
E E2 E2 1.40 1.75 --
L 0.35 0.45 --
All Dimensions in mm

e b

Suggested Pad Layout

W-DFN3030-12

Dimensions Value (in mm)


C 0.45
G 0.15
Y1 X 0.28
X1 2.60
G Y 0.60
X1 Y1 1.80

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 107 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3030-14
A3
A1
A
DFN3030-14
Dim Min Max Typ
D
A 0.57 0.63 0.60
e
A1 0 0.05 0.02
A3 - - 0.15
(Pin #1 ID)
b 0.15 0.25 0.20
D 2.95 3.05 3.00
D2 2.20 2.40 2.30
E E2
E 2.95 3.05 3.00
E2 1.60 1.80 1.70
D2 e - - 0.40
L 0.30 0.40 0.35
Z - - 0.20
L(14x) All Dimensions in mm
Z(4x) b (14x)

Suggested Pad Layout

U-DFN3030-14
X2
Y (14x)

Value
Dimensions
(in mm)
X1 C 0.400
X 0.250
Y2 X1 2.350
Y1 X2 2.650
Y 0.600
Y1 1.750
Y2 3.400

Pin1
C X (14x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 108 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN3030-16 (Type US)


D

E Pin #1 ID
(Laser Mark)

W-DFN3030-16
(Type US)
Dim Min Max Typ
A3 A 0.70 0.80 0.75
A1 0 0.05 0.02
A
Seating Plane
A3 0.20 REF
b 0.18 0.30 0.25
A1 D 2.90 3.10 3.00
D2 D2 1.55 1.80 1.70
e/2 e 0.50 BSC
E 2.90 3.10 3.00
E2 1.55 1.80 1.70
E/2 L 0.30 0.50 0.40
All Dimensions in mm
E2
L

e b
D/2

Suggested Pad Layout

W-DFN3030-16 (Type US)

X3
X1

Dimensions Value (in mm)


C 0.500
X 0.350
X1 0.570
Y2 Y1 X2 1.800
X3 3.300
X2 Y 0.570
Y1 1.800
Y2 3.300
Y

C
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 109 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-QFN3030-16 (Type B)

A1 A3
A
U-QFN3030-16
Type B
Side View Dim Min Max Typ
D A 0.55 0.65 0.60
e A1 0 0.05 0.02
A3 - - 0.15
b 0.18 0.28 0.23
(Pin #1 ID)
D 2.95 3.05 3.00
0.450 D2 1.40 1.60 1.50
00
R0.2 E 2.95 3.05 3.00
E E2
E2 1.40 1.60 1.50
D2
e - - 0.50
L 0.35 0.45 0.40
L (16x) Z - - 0.625
Z (8x) b (16x) All Dimensions in mm

Bottom View

Suggested Pad Layout

U-QFN3030-16(Type B)
C
G

G1 Value
Dimensions
(in mm)
C 0.500
G 0.150
Y1 G1 0.150
X 0.350
X1 1.800
X1 Y 0.600
Y1 1.800

Y (16x)

X (16x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 110 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-QFN3030-20

A1
A3
A
Seating Plane

U-QFN3030-20
D Dim Min Max Typ
A 0.57 0.63 0.60
D2
A1 0.00 0.05 0.02
(Pin #1 ID) A3 - - 0.15
e
b 0.16 0.26 0.21
D 2.95 3.05 3.00
D2 1.70 1.90 1.80
C'0

E 2.95 3.05 3.00


e
.2

E2 1.70 1.90 1.80


X4

e - - 0.40
5

E E2 L 0.30 0.40 0.35


z - - 0.595
All Dimensions in mm
L

z b

Suggested Pad Layout

U-QFN3030-20

X C

Dimensions Value (in mm)


C 0.400
Y1 X 0.250
Y2 X1 1.900
X2 3.300
Y 0.550
X1
Y1 1.900
Y2 3.300

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 111 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN3216-14

A1 A3 U-DFN3216-14
A Dim Min Max Typ
Seating Plane A 0.545 0.605 0.575
A1 0 0.05 0.02
D
A3 - - 0.127
(Pin #1 ID) D2
C 0.2x45
b 0.15 0.25 0.20
D 3.15 3.275 3.20
D2 2.70 2.90 2.80
E 1.55 1.675 1.60
E2/2 E2 0.45 0.65 0.55
E E2
e - - 0.40
L 0.275 0.375 0.325
L Z 0.25 0.35 0.30
All Dimensions in mm
b e Z

Suggested Pad Layout

U-DFN3216-14

X2
C
Y
Value
Dimensions
(in mm)
C 0.400
X 0.250
Y1 Y2
X1 2.850
X2 2.650
Y 0.525
Y1 0.550
Pin1 X Y2 1.900

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 112 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

DFN322
e e
D b (3x)
DFN322
L (3x) Dim Min Max Typ
A 0.800 1.00 0.850
A - 0.050 -
A3 0.153 0.253 0.203
E b 0.180 0.300 0.230
E2 D 1.900 2.100 2.000
E4
D2 1.220 1.420 1.320
e - - 0.650
E 1.900 2.100 2.000
E2 0.780 0.990 0.880
D2 E4 0.480 0.680 0.580
A1 L 0.300 0.500 0.400
A3
A All Dimensions in mm

Suggested Pad Layout

DFN322

C C X (3x) Value
Dimensions
(in mm)
Y (2x) C 0.65
G 0.20
G X 0.35
Y4 X1 1.52
Y1 Y 0.55
Y3
Y1 0.98
Y2
Y2 0.47
Y3 0.63
X1 Y4 2.20

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 113 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

X1-DFN3313-8

A
A1 A3

Seating Plane X1-DFN3313-8


Dim Min Max Typ
A 0.37 0.48 0.42
D A1 0 0.05 0.02
1
A3 - - 0.13
L(6x) b 0.20 0.30 0.25
D 3.25 3.38 3.30
e E
E 1.25 1.38 1.30
e 0.50 BSC
e1 1.25 BSC
L 0.30 0.43 0.38
8
La 0.57 0.70 0.65
La(2x) e1
All Dimensions in mm
b

Suggested Pad Layout

X1-DFN3313-8

A
A1 A3

Seating Plane
X1-DFN3313-8
Dim Min Max Typ
D A 0.37 0.48 0.42
1 A1 0 0.05 0.02
A3 - - 0.13
L(6x) b 0.20 0.30 0.25
D 3.25 3.38 3.30
e
E E 1.25 1.38 1.30
e 0.50 BSC
e1 1.25 BSC
L 0.30 0.43 0.38
8 La 0.57 0.70 0.65
La(2x) e1 All Dimensions in mm
b

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 114 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN3535-14

A1
A3
A

Seating Plane V-DFN3535-14


Dim Min Max Typ
D
A 0.75 0.85 0.80
e
A1 0.00 0.05 0.02
A3 - - 0.15
b 0.20 0.30 0.25
D 3.45 3.55 3.50
D2 1.90 2.10 2.00
(Pin #1 ID)
E 3.45 3.55 3.50
E E2
e1 E2 1.90 2.10 2.00
e - - 0.50
e1 - - 1.50
D2 L 0.35 0.45 0.40
Z - - 0.625
All Dimensions in mm

Z b L

Suggested Pad Layout

V-DFN3535-14

X3
C
Value
G1 Dimensions
(in mm)
C 0.500
X1 C1 1.500
G 0.250
Y1 X2 G1 0.250
X 0.350
C1 X1 0.600
Y3 Y2 X2 2.100
X3 2.350
Y 0.600
G Y1 0.350
Y2 2.100
Y Y3 3.800

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 115 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN4030-12

A1
A
A3
U-DFN4030-12
D Dim Min Max Typ
e A 0.55 0.65 0.60
A1 0 0.05 0.02
A3 - - 0.15
b 0.20 0.30 0.25
D 3.95 4.05 4.00
D2 3.20 3.40 3.30
E E2 e - - 0.50
E 2.95 3.05 3.00
D2
E2 1.60 1.80 1.70
L 0.30 0.40 0.35
Z - - 0.625
L (12x)
All Dimensions in mm
Z (4x) b (12x)

Suggested Pad Layout

U-DFN4030-12

X2

Y (12x)
Value
Dimensions
X1
(in mm)
C 0.500
X 0.300
Y1 Y2 X1 2.800
X2 3.350
Y 0.600
Y1 1.750
Y2 3.400

Pin1
C X (12x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 116 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN4030-12 (Type B)

A
A3
U-DFN4030-12
A1 Type B
D Dim Min Max Typ Dim Min Max Typ
e D4 (4x) A e
0.55 0.65 0.60 - - 0.50
L1 (6x)
A1 0.00 0.05 0.02 E1 1.51 1.71 1.61
E5
A3 - - 0.15 E2 0.35 0.55 0.45
E2 D1 (2x) B 0.20 0.30 0.25 E3 0.74 0.94 0.84
D 3.95 4.05 4.00 E4 0.30 0.50 0.40
E E1 D1 1.52 1.72 1.62 E5 0.15 0.35 0.25
D2 (2x) D2 L 0.45
E3 D3 0.96 1.16 1.06 0.55 0.50
D3 0.70 0.90 0.80 L1 0.30 0.40 0.35
D4 0.65 0.85 0.75 L2 0.72 0.82 0.77
L2 E4 L (5x) E 2.95 3.05 3.00 Z - - 0.625
All Dimensions in mm
Z (4x) b (12x)

Suggested Pad Layout

U-DFN4030-12 (Type B)

Value
Dimensions
C X (12X) (in mm)
C 0.500
Y
X 0.350
Y1 Y2 X1 1.160
X2 0.900
X1(2x) X2 X3 1.720
Y6
X4 0.850
Y7 Y5 (2x) X5 3.700
Y 0.700
X3 (2x)
Y1 0.870
Y2 0.500
Y3 Y3 0.550
1 Y4 0.350
X4 Y4
Y5 1.710
X5 Y6 0.940
Y7 3.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 117 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN4030-12 (Type C)

A3
A
U-DFN4030-12
Type C
A1 Dim Min Max Typ Dim Min Max Typ
D
A 0.57 0.63 0.60 E1 1.60 1.80 1.70
e b (12x) A1 0 0.05 0.02 E2 0.88 1.08 0.98
Pin1
A3 0.015 E3 0.29 0.49 0.39
L B 0.20 0.30 0.25 E4 1.60 1.80 1.70
K1
R0 D 3.95 4.05 4.00 e 0.50
.1 50
D2 D1 0.74 0.94 0.84 L 0.30 0.40 0.35
E2
D1 D2 1.00 1.20 1.10 L1 0.05 0.15 0.10
E E1 E4
D3 1.00 1.20 1.10 K1 0.30
D3
D4 0.84 1.04 0.94 K2 0.33
E3
L1 E 2.95 3.05 3.00 Z 0.23
D4
All Dimensions in mm

Z K2

Suggested Pad Layout

U-DFN4030-12 (Type C)

X5 Value
Dimensions
G (in mm)
Y6 X1
C 0.500
G 0.225
Y
X 0.300
X1 0.800
Y2 X2 0.890
X2 X3 X3 0.990
X4 1.150
Y4 Y5
X5 3.590
Y3 Y 0.600
X4 Y1 0.600
Y2 0.440
Y3 1.030
Y1 (6x)
Y4 1.750
1 C
Y5 3.400
X (12x) Y6 0.275

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 118 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN4030-12 (Type D)

A1 A3
A U-DFN4030-12
Seating Plane Type D
D
Dim Min Max Typ
e A 0.55 0.65 0.60
A1 0 0.05 0.02
A3 - - 0.15
(Pin #1 ID) b 0.23 0.33 0.28
D 3.95 4.05 4.00
D2 3.46 3.66 3.56
E E2 E 2.95 3.05 3.00
D2 E2 1.043 1.243 1.143
e - - 0.65
L
L 0.40 0.50 0.45
Z - - 0.235
All Dimensions in mm
Z b

Suggested Pad Layout

U-DFN4030-12 (Type D)

X2

Y
Value
Dimensions
C (in mm)
C 0.650
X 0.330
Y1 Y2 X1 3.610
X1
X2 3.580
Y 0.700
Y1 1.193
Y2 3.400

Pin1 C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 119 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN4030-14

D L

V-DFN4030-14
Dim Min Max Typ
D2 A 0.80 0.90 0.85
E E2
A1 0 0.05 0.02
A3 - - 0.203
b 0.20 0.30 0.25
D 3.95 4.05 4.00
D2 3.15 3.25 3.20
PIN 1 DOT e b E 2.95 3.05 3.00
BY MARKING
E2 1.65 1.75 1.70
A3 PIN #1 ID e - - 0.50
A1 CHAMFER 0.300X45

A L 0.35 0.45 0.40


All Dimensions in mm

Suggested Pad Layout

V-DFN4030-14

X1

G
Y
Value
Dimensions
(in mm)
C 0.50
G 0.20
Y1 Y2 X 0.30
G X1 3.30
Y 0.55
Y1 1.80
Y2 3.30

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 120 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN4030-14

D L

W-DFN4030-14
Dim Min Max Typ
D2 A 0.70 0.80 0.75
E E2 A1 0 0.05 0.02
A3 - - 0.203
b 0.20 0.30 0.25
D 3.95 4.05 4.00
D2 3.15 3.25 3.20
PIN 1 DOT e b E 2.95 3.05 3.00
BY MARKING E2 1.65 1.75 1.70
A3 PIN #1 ID e - - 0.50
A1 CHAMFER 0.300X45
L 0.35 0.45 0.40
A All Dimensions in mm

Suggested Pad Layout

W-DFN4030-14

X1

G
Y
Value
Dimensions
(in mm)
C 0.50
G 0.20
Y1 Y2 X 0.30
G X1 3.30
Y 0.55
Y1 1.80
Y2 3.30

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 121 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN4040-8
A1 A3

A
Seating Plane U-DFN4040-8
Dim Min Max Typ
A 0.57 0.63 0.60
D A1 0 0.05 0.02
(Pin #1 ID) e A3 - - 0.15
b 0.20 0.30 0.25
D 3.95 4.05 4.00
D1 2.05 2.25 2.15
D2 0.90 1.10 1.00
E 3.95 4.05 4.00
E1 1.00 1.20 1.10
E E2 E2 2.50 2.70 2.60
e - - 0.80
D2
L 0.35 0.45 0.40
Z - - 0.675
All Dimensions in mm

Z b

Suggested Pad Layout

U-DFN4040-8
X C
1

X1 Y Value
C-0.279 Dimensions
(in mm)
C 0.800
X2 Y2 X 0.350
X3 X1 1.150
X2 1.100
Y3 Y4 X3 2.250
Y1 X4 2.750
Y2 X5 3.650
X3 Y 0.600
Y1 2.700
Y2 1.200
Y3 2.700
X1
Y4 4.300
X4
X5

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 122 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-DFN5020-6

A
A3
A1 W-DFN5020-6
D Dim Min Max Typ
e A 0.75 0.85 0.80
A1 0 0.05 0.02
D2 A3 - - 0.15
b 0.20 0.30 0.25
Pin 1 ID D 1.90 2.10 2.00
D2 1.40 1.60 1.50
E E2 e - - 0.50
E 4.90 5.10 5.00
E2 2.80 3.00 2.90
L 0.35 0.65 0.50
Z - - 0.375
All Dimensions in mm
L
Z b

Suggested Pad Layout

W-DFN5020-6

Y
Value (in
X C G Dimensions
mm)
C 0.50
X1 Y2 G 0.35
X 0.35
Y3
X1 0.90
X2 X2 1.80
Y 0.70
Y2 1.60
Y3 3.20

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 123 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN5045-12

A3
A1
A
Seating Plane V-DFN5045-12
Dim Min Max Typ
A 0.75 0.85 0.80
D A1 0.00 0.05 0.02
D2(4x) A3 - - 0.203
b 0.25 0.35 0.30
D 4.95 5.05 5.00
D2 1.80 2.00 1.90
k1 E 4.45 4.55 4.50
E2 0.90 1.10 1.00
E2(4x) e - - 0.80
k - - 0.50
E k
k1 - - 0.50
k2 - - 0.50
L 0.45 0.55 0.50
z - - 0.35
All Dimensions in mm
L

z k2
e b

Suggested Pad Layout

V-DFN5045-12

X2

X1(4x) C

Dimensions Value (in mm)


C 0.800
X 0.400
Y1(4x) X1 2.100
X2 4.500
Y2 Y3 Y 0.700
Y1 1.200
Y2 2.700
Y3 4.800

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 124 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN5045-12 (Type B)

A1 A3
A V-DFN5045-12
Seating Plane (Type B)
Dim Min Max Typ
A 0.75 0.85 0.80
D A1 0.00 0.05 0.02
D2a D2(2x) A3 - - 0.203
b 0.25 0.35 0.30
D 4.95 5.05 5.00
E2(2x)
D2 2.00 2.20 2.10
D2a 1.60 1.80 1.70
E 4.45 4.55 4.50
E2 0.90 1.10 1.00
E2a 2.40 2.60 2.50
E E2a k1
e - - 0.80
k - - 0.50
k1 - - 0.50
k2 - - 0.50
k2
L 0.45 0.55 0.50
L z - - 0.35
All Dimensions in mm
k b

z e

Suggested Pad Layout

V-DFN5045-12 (Type B)

X3
C

G1
Dimensions Value (in mm)
C 0.800
G2 G 0.40
G1 0.40
X2 X1 Y1 G2 0.40
X 0.40
Y3 Y2 X1 2.20
X2 1.80
X3 4.40
G
Y 0.700
Y1 1.100
Y2 2.600
Y3 4.800
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 125 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN5060-4

A1
A3
A
Seating Plane

D
e L1 W-DFN5060-4
1
Dim Min Max Typ
A 0.75 0.85 0.80
L A1 0 0.05 0.02
A3 - - 0.203
Pin #1 ID
b 0.65 0.75 0.70
D 4.95 5.05 5.00
e - - 4.00
E E 5.95 6.05 6.00
L 0.65 0.75 0.70
L1 0.05 0.15 0.10
All Dimensions in mm

4
b

Suggested Pad Layout

V-DFN5060-4
Z
C

Value (in
Dimensions
mm)
Y1 C 4.00
X 0.75
Y 0.95
X (4x) Y1 6.20
Z 4.75
Y (4x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 126 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-DFN6040-12

A1 A3
U-DFN6040-12
A Dim Min Max Typ
Seating Plane
A 0.55 0.65 0.60
A1 0 0.05 0.02
D A3 - - 0.15
e b 0.35 0.45 0.40
D 5.95 6.05 6.00
D1 1.95 2.15 2.05
D2 2.35 2.55 2.45
D2 e - - 1.00
D1
E2 E 3.95 4.05 4.00
E E1
E1 2.10 2.30 2.20
L E2 1.80 2.00 1.90
L 0.35 0.45 0.40
Z - - 0.30
All Dimensions in mm
Z b

Suggested Pad Layout

U-DFN6040-12

X3
Value
C Y Dimensions
(in mm)
G C 0.500
G 0.650
G1 0.350
X 0.250
X1 1.075
Y1 Y2 Y3 X2 1.275
G1
X1 X2 X3 2.750
Y 0.400
Y1 1.150
Y2 1.000
Pin1 Y3 2.300
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 127 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

V-DFN6040-22

A1
A3

A
Seating Plane V-DFN6040-22
Dim Min Max Typ
D
A 0.75 0.85 0.80
e
A1 0.00 0.05 0.02
A3 0.203 BSC
L
b 0.20 0.30 0.25
D 5.95 6.05 6.00
D2 3.82 4.02 3.92
D2 D2a 1.10 1.30 1.20
E 3.95 4.05 4.00
E E2 E2 2.44 2.64 2.54
D2a e 0.50 BSC
L 0.35 0.45 0.40
Z - - 0.375
All Dimensions in mm
PIN#1 I.D.
C0.3

Z b

Suggested Pad Layout

V-DFN6040-22

X3

X1 X2
G1 Value
Dimensions
(in mm)
C 0.500
G 0.280
G1 0.200
G X 0.350
X1 1.330
Y1 Y2
X2 4.050
X3 5.660
Y 0.650
Y1 0.270
Y2 4.400
Y

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 128 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

D-FLAT

HE L k
E
D-FLAT
b Dim Min Max
A 0.90 1.10
D b 1.25 1.65
c 0.10 0.40
D 2.25 2.95
E 3.95 4.60
A k 2.80 -
HE 5.00 5.60
c
L 0.50 1.30
All Dimensions in mm

Suggested Pad Layout

D-FLAT

X1
X Value
Dimensions
(in mm)
C 4.65
Y G 2.80
X 1.85
X1 6.50
G Y 1.70
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 129 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

DF-S
L
G
DF-S
Dim Min Max
A 7.40 7.90
B 6.20 6.50
A B D E
C 0.22 0.30
D 0.076 0.33
E - 10.40
G 1.02 1.53
H 8.13 8.51
H C
J 2.40 2.60
K 5.00 5.20
J L 1.00 1.20
All Dimensions in mm
K

Suggested Pad Layout

DF-S
X

Dimensions DF-S
Z 10.26
Z X 1.2
Y 1.52
C 5.2
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 130 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-FLGA1515-9

A1 A3
A

Seating Plane

D U-FLGA1515-9
e Dim Min Max Typ
A 0.55 0.65 0.60
A1 0 0.05 0.02
1 A3 0.13 BSC
0.
R b 0.20 0.30 0.25
E D 1.45 1.55 1.50
E 1.45 1.55 1.50
(Pin #1 ID) e
e 0.50 BSC
Z 0.125 BSC
All Dimensions in mm
Z
b SQ.

Suggested Pad Layout

U-FLGA1515-9

X1
X
G Y Value
Dimensions
(in mm)
C 0.587
G 0.150
G1 0.150
Y2 Y1 X 0.525
G1 X1 0.350
X2 1.700
Y 0.525
Y1 0.350
Y2 1.700
C

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 131 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions

W-FLGA2520-17
A3
A1

Seating Plane
A e W-FLGA2520-17
E Pin #1 ID Dim Min Max
Pin #1 ID A 0.700 0.800
L A1 0 0.050
A3 0.0203REF
b 0.200 0.300
D 2.420 2.580
E 1.950 2.050
D e 0.500TYP
La
L 0.320 0.480
La 0.424 0.576
All Dimensions in mm

Suggested Pad Layout

W-FLGA2520-17

X3
X2

Value
Dimensions
(in mm)
C 0.500
X 0.350
X1 0.600
X2 1.850
X1(9x) Y2 Y3 X3 2.320
Y 0.600
Y1(9x) Y1 0.350
Y2 1.350
Y3 2.800
Y(8x)

X(8x) C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 132 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions

MiniDIP

L
G
MiniDIP
Dim Min Max
A 5.43 5.75
B 3.6 4.0
A B D E C 0.15 0.35
D 0.05 0.20
E - 7.0
G 0.70 1.10
H 4.5 4.9
H C J 2.3 2.7
K 2.3 2.7
J L 0.50 0.80
All Dimensions in mm

Suggested Pad Layout

MiniDIP
X

Dimensions DF-S MiniDIP


Z 10.26 6.91
Z X 1.2 0.60
Y 1.52 0.76
C 5.2 2.67
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 133 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions

MiniMELF

A MiniMELF
Dim Min Max
A 3.30 3.70
B B 1.30 1.60
C 0.28 0.50
All Dimensions in mm
C

Suggested Pad Layout

MiniMELF

X1
X

Value (in mm)


Dimensions
MiniMELF
Y C 3.50
G 2.10
X 1.30
G X1 4.70
Y 1.70
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 134 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

MELF

A MELF
Dim Min Max
A 4.80 5.20
B
B 2.40 2.60
C 0.55 Typ
All Dimensions in mm
C

Suggested Pad Layout

MELF

X1
X Value (in mm)
Dimensions
MELF
C 4.80
Y G 3.30
X 1.50
X1 6.30
Y 2.70
G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 135 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

MSB

D Seating Plane

A4 MSB
x
A1 Dim Min Max Typ
A 1.10 1.30 1.20

10

7
A1 0.00 0.05 0.02
y
A4 0.05 0.08 -
A5 0.03 0.08 0.05
b 0.55 0.70 0.60
E1 E Pin#1 E3 c 0.12 0.18 0.15
D 4.40 4.60 4.50
E 4.90 5.10 5.00
A5
E1 5.60 5.80 5.70
E3 2.95 3.05 3.00
e 3.45 3.55 3.50
c L 0.65 0.75 0.70
e x 0.60 0.70 0.65
y 0.60 0.70 0.65
A
b All Dimensions in mm

Suggested Pad Layout

MSB

Value
Dimensions
(in mm)
C 3.55
Y1
X 0.90
Y 1.05
Y1 6.10
Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 136 of 316 Package Outline Dimensions
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Package Outline Dimensions

MSOP-8

MSOP-8
4X Dim Min Max Typ
10
A - 1.10 -
0.25 A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
E
x Gauge Plane A3 0.29 0.49 0.39
Seating Plane b 0.22 0.38 0.30
y
c 0.08 0.23 0.15

a
L D 2.90 3.10 3.00
4X10 E 4.70 5.10 4.90
E1 2.90 3.10 3.00
Detail C
E3 2.85 3.05 2.95
1
b e - - 0.65
E3
L 0.40 0.80 0.60
A3 a 0 8 4
A2 A
x - - 0.750
y - - 0.750
All Dimensions in mm
e
E1
A1 c
See Detail C

Suggested Pad Layout

MSOP-8

X C

Y
Value
Dimensions
(in mm)
C 0.650
X 0.450
Y1
Y 1.350
Y1 5.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 137 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

MSOP-8EP

D
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
D1 4X A2 0.75 0.95 0.86
10

A3 0.29 0.49 0.39

0.25
x
E E2
b 0.22 0.38 0.30
Gauge Plane c 0.08 0.23 0.15
Seating Plane D 2.90 3.10 3.00
y
D1 1.60 2.00 1.80

a
E 4.70 5.10 4.90
4X
10 L
E1 2.90 3.10 3.00
1 E2 1.30 1.70 1.50
e 8Xb
E3 Detail C E3 2.85 3.05 2.95
A1 e - - 0.65
A3
c L 0.40 0.80 0.60
A A2 a 0 8 4
x - - 0.750
D E1 y - - 0.750
All Dimensions in mm
See Detail C

Suggested Pad Layout

MSOP8-EP

X C

G Y Value
Dimensions
(in mm)
C 0.650
G 0.450
X 0.450
Y2 Y1 X1 2.000
X1 Y 1.350
Y1 1.700
Y2 5.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 138 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

MSOP-10
D

4X10
MSOP-10
Dim Min Max Typ
E 0.25 a 0 8 4
A - 1.10 -
X A1 0.05 0.15 0.10
Gauge Plane
A 0.75 0.95 0.86
Y Seating Plane b 0.17 0.27 0.20
4X1 c
L 0.08 0.23 0.15

a
0
1 D 2.95 3.05 3.00
e - - 0.50
e E 4.80 5.00 4.90
b (10X) E1 2.95 3.05 3.00
E3 L 0.40 0.80 0.60

A2
All Dimensions in mm
A
A1 D A3 E1
c

Suggested Pad Layout

MSOP-10

X
Value
Dimensions
(in mm)
C1 X 0.30
Y 1.4
C1 4.4
C2 C2 0.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 139 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions


POWERDI 5
E1
E1/2 A1

1
b2 D

10
POWERDI 5
2X b1
Dim Min Max Typ
A 1.05 1.15 1.10
E/2 A
A2 0.33 0.43 0.381
b1 0.80 0.99 0.89
E

5
1
b2 1.70 1.88 1.78
A2


D 3.90 4.05 3.966
D2 - - 3.054
10

E 6.40 6.60 6.504


1
5

e - - 1.84

1

E1 5.30 5.45 5.37


E2 - - 3.549
E2
L1 L 0.75 0.95 0.85
L1 0.50 0.65 0.57
L1 W 1.10 1.41 1.255
W All Dimensions in mm
D2

L L

Suggested Pad Layout


POWERDI5

Dimensions Value (in mm)


C 1.840
G 0.852
Y X 3.360
X1 1.390
Y 4.860
Y1 1.400

X1
(2x) G

Y1
(2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 140 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

POWERDI123

POWERDI123
E1
Dim Min Max Typ
A 0.93 1.00 0.98
A3 A3 0.15 0.25 0.20
A
b 0.85 1.25 1.00
b2 1.025 1.125 1.10
D 1.63 1.93 1.78
E 3.50 3.90 3.70
L(2X) E1 2.60 3.00 2.80
L1
L 0.40 0.50 0.45
L1 1.25 1.40 1.35
L3 0.125 0.275 0.20
All Dimensions in mm
b b2

L3 L3

Suggested Pad Layout

POWERDI123

X2 Value
Dimensions
(in mm)
G 0.65
X 1.05
Y Y1 X1 2.40
X2 4.10
Y 1.50
X G X1 Y1 1.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 141 of 316 Package Outline Dimensions
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Diodes Incorporated
Package Outline Dimensions


POWERDI 123(Type B)


POWERDI 123
C E Type B
Dim Min Max Typ
B A 3.50 3.90 3.70
H B 2.60 3.00 2.80
D C 1.63 1.93 1.78
D 0.93 1.00 0.98
E 0.85 1.25 1.00
L H 0.15 0.25 0.20
L 0.50 0.80 0.65
All Dimensions in mm
E

Suggested Pad Layout

POWERDI123 (Type B)

Value
Dimensions
(in mm)
Y
G 2.000
X 1.050
X1 4.100
G Y 1.500
X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 142 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 323
C


B POWERDI 323
Dim Min Max Typ
A 2.40 2.60 2.50
B 1.85 1.95 1.90
D
C 1.20 1.30 1.25
H
D 0.60 0.70 0.65
E 0.78 0.98 0.88
L
E1 0.50 0.70 0.60
L
E2 0.60 1.00 0.80
H 0.08 0.18 0.13
L 0.20 0.40 0.30
E E2 E1
L4 L1 - - 1.40
L3 - - 0.20
L4 0.40 0.80 0.60
L1
L1
L3 All Dimensions in mm
A

Suggested Pad Layout

POWERDI323

X
1 G X
2
Dimensions POWERDI123 POWERDI323
G 1.0 0.5
Y
2 X1 2.2 2.0
Y
1
X2 0.9 0.8
Y1 1.4 0.8
Y2 1.4 1.1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 143 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 3333-8
A1
A3
A
Seating Plane
PowerDI3333-8/SWP
Dim Min Max Typ
D2 L(4x) D A 0.77 0.87 0.82
1 A1 0.00 0.05 0.02
A1 -- -- 0.203
Pin #1 ID
b 0.27 0.37 0.32
b2(4x) b2 -- -- 0.20
D 3.25 3.35 3.30
E D2 2.22 2.32 2.27
E2 L1(3x) E 3.25 3.35 3.30
E2 1.56 1.66 1.61
e -- -- 0.65
L 0.35 0.45 0.40
L1 -- -- 0.39
z -- -- 0.515
z(4x) b All Dimensions in mm
e

Suggested Pad Layout

POWERDI3333-8
X2
G

Value
Dimensions
(in mm)
Y2 X1 C 0.650
Y3 G 0.230
X 0.420
X1 0.420
Y1
X2 2.370
Y 0.700
Y1 3.700
Y Y2 1.850
Y3 2.250

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 144 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 3333-8(Type B)
POWERDI3333-8
Type B
Dim Min Max Typ
A A 0.75 0.85 0.80
A3 A1 0 0.05 0.02
A1
A3 0.203
D b 0.27 0.37 0.32
D1 b2 0.20
D 3.25 3.35 3.30
L (5x)
D1 2.55 2.66 2.61
K1 D2 1.74 1.84 1.79
e 0.65
E1
E b2 (4x) E 3.25 3.35 3.30
K2 E1 1.14 1.24 1.19
E2 0.61 0.71 0.66
D2
E2 K1 0.41
L1 (2x) K2 0.38
L 0.35 0.45 0.40
Z (4x) e b (8x) L1 0.25
Z 0.515
All Dimensions in mm

Suggested Pad Layout

POWERDI3333-8 (Type B)

X1
Dimensions Value (in mm)
G X2 (3x) C 0.650
G 0.230
Y1 X 0.420
Y2 X1 2.370
X3
Y3 X2 0.420
X3 1.890
Y4 Y6 X4 2.710
Y5 Y 0.700
X4 Y1 0.400
Y2 1.160
Y Y3 1.850
(5x) Y4 0.405
Y5 1.295
Y6 3.700
X (5x) C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 145 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
PowerDI3333-8 (Type UX)

D
A
D1 A1
PowerDI3333-8
(Type UX)
Dim Min Max Typ
A 0.75 0.85 0.80
E1 E A1 0.00 0.05 --
b 0.25 0.40 0.32
c 0.10 0.25 0.15

0
D 3.20 3.40 3.30
D1 2.95 3.15 3.05
D2 2.30 2.70 2.50
c
E 3.20 3.40 3.30
L E1 2.95 3.15 3.05
E2 1.60 2.00 1.80
E2a 0.95 1.35 1.15
E2a E2b
E2 E2b 0.10 0.30 0.20
e 0.65 BSC
k 0.50 0.90 0.70
L 0.30 0.50 0.40
k D2 0 12 10
L
All Dimensions in mm

b
e

Suggested Pad Layout


PowerDI3333-8 (Type UX)

X2
G

Value
X1 Dimensions
Y2 (in mm)
Y3 C 0.650
G 0.230
X 0.420
Y1
X1 0.420
X2 2.370
Y 0.700
Y Y1 3.700
Y2 1.850
Y3 2.250
1

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 146 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 5060-8

POWERDI 5060-8
D Dim Min Max Typ
D1 Detail A A 0.90 1.10 1.00
0(4X) A1 0.00 0.05
b 0.33 0.51 0.41
c b2 0.200 0.350 0.273
A1 b3 0.40 0.80 0.60
E1 E
c 0.230 0.330 0.277
D 5.15 BSC
e
D1 4.70 5.10 4.90
D2 3.70 4.10 3.90
1 01 (4X) D3 3.90 4.30 4.10
E 6.15 BSC
E1 5.60 6.00 5.80
b (8X) e/2
E2 3.28 3.68 3.48
1 E3 3.99 4.39 4.19
L b2 (4X) e 1.27 BSC
D3 K G 0.51 0.71 0.61
K 0.51
A D2
L 0.51 0.71 0.61
E3 E2 b3 (4X)
M L1 0.100 0.200 0.175
M 3.235 4.035 3.635
M1
Detail A M1 1.00 1.40 1.21
10 12 11
G L1 1 6 8 7
All Dimensions in mm

Suggested Pad Layout

POWERDI5060-8
X4
Y2 Dimensions Value (in mm)
X3
C 1.270
Y3 Y1 G 0.660
G1 0.820
X 0.610
X1 4.100
X2 0.755
X2
Y5 X3 4.420
Y4 X1 X4 5.610
Y7
Y 1.270
Y1 0.600
Y2 1.020
C G1 Y3 0.295
Y6 Y4 1.825
Y5 3.810
Y6 0.180
Y(4x)
Y7 6.610
X G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 147 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

POWERDI5060-8 (Type B)

POWERDI 5060-8
TYPE B
D b (8X) Dim Min Max Typ
D1 e/2 K A 0.90 1.10 1.00
L
A1 0.00 0.05
b2(4X) b 0.33 0.51 0.41
D2 b2 0.20 0.40 0.273
E2
E1 E
c 0.230 0.330 0.273
1.400
K1
D 5.15 BSC
1.900 M
E3 D1 4.70 5.10 4.90
M1 D2 3.50 4.40 3.90
E 6.15 BSC
G e L1 E1
1.000 Depth 0.070.030
5.60 6.00 5.80
E2 2.25 2.65 2.45
E3 0.595 0.995 0.795
X
e 1.27 BSC
G 0.51 0.71 0.61
c K 0.51
A A1
K1 0.51
L 0.51 0.71 0.61
DETAIL A
L1 0.05 0.20 0.175
M 3.235 4.035 3.635
X M1 1.00 1.40 1.21
1 10 12 11
2 6 8 7
All Dimensions in mm

Suggested Pad Layout

POWERDI5060-8 (Type B)

X1

Y1
Y3
Dimensions Value (in mm)
C 1.270
Y2 X 0.610
X1 4.420
Y 0.910
Y6 Y1 0.910
Y4 Y2 0.895
Y5
Y3 2.130
Y4 0.585
Y5 2.550
Y6 6.550
Y (5x)

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 148 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
PowerDI5060-8 (Type C)

PowerDI5060-8 (Type C)
Dim Min Max Typ
D
A 0.90 1.10 1.00
D1 A1 0 0.05 0.02
b 0.33 0.51 0.41
0(4x)
b1 0.300 0.366 0.333
b2 0.20 0.35 0.25
x c
A1 c 0.23 0.33 0.277
E1 E
D 5.15 BSC
y Seating Plane D1 4.85 4.95 4.90
e D2 1.40 1.60 1.50
1 D3 - - 3.98
1.000 Depth 0.070.030
01(4x) E 6.15 BSC
E1 5.75 5.85 5.80
b1(8x)
E2 3.56 3.76 3.66
DETAIL A
e/2 e 1.27BSC
b(8x)
k - - 1.27
1
k1 0.56 - -
b2(2x)
D3 L 0.51 0.71 0.61
L k

k1 A La 0.51 0.71 0.61


L1 0.05 0.20 0.175
L4
E2 D2 L4 - - 0.125
M DETAIL A
D2 M 3.50 3.71 3.605
x - - 1.400
y - - 1.900
La L1
10 12 11
1 6 8 7
All Dimensions in mm

Suggested Pad Layout


PowerDI5060-8 (Type C)
X4
8
Value
Dimensions
(in mm)
C 1.270
Y1 G 0.660
X3 X2
G1 0.820
Y2 X 0.610
X1 3.910
Y3
G1 X2 1.650
X3 1.650
X1
X4 4.420
Y 1.270
Y1 1.020
Y(4x)
Y2 3.810
Y3 6.610
1 G
X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 149 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions
PowerDI5060-8 (Type D)

D PowerDI5060-8
D1 (Type D)
Dim Min Max Typ
A 0.90 1.10 1.00
0(4x) A1 0.00 0.05 0.02
b 0.33 0.51 0.41
c
b2 0.200 0.350 0.273
E1 E A1 b3 0.48 0.88 0.68
c 0.230 0.330 0.277
Seating Plane D 5.15 BSC
D1 4.70 5.10 4.90
e
D2 1.45 1.85 1.65
1 01(4x) E 6.15 BSC
E1 5.60 6.00 5.80
0.880 Depth 0.070.030 E2 3.28 3.68 3.48
DETAIL A
E2a 3.99 4.39 4.19
b(8x) e/2 e 1.27BSC
1
k 0.51 - -
L b2(4x) k1 0.60 BSC
L 0.51 0.71 0.61
D2 D2 k La 0.51 0.71 0.61
A L1 0.10 0.20 0.175
M 3.235 4.035 3.635
k1 b3(4x) M1 1.00 1.40 1.21
E2a E2 M 10 12 11
DETAIL A
1 6 8 7
M1 All Dimensions in mm

La L1

Suggested Pad Layout

X2
X1
Value
Dimensions
(in mm)
Y2 C 1.270
G 0.820
X 0.610
X1 4.420
Y4 X2 5.610
Y3
Y 1.270
Y5 Y1 Y1 0.180
Y2 0.600
Y3 1.825
C G Y4 3.810
Y5 6.610
Y(4x)

X(8x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 150 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 5SP

E
POWERDI 5SP
E/2
Dim Min Max Typ
b 2x K 4x R1
J 4x A 0.75
M 4x b 4.30 4.50 4.40
c

R3
c 0.155 0.195
D N 8x
D 5.70 5.90 5.80
D2 4.40
E 23.6 24.0 23.8
R2 E1 5.70 5.90 5.80
E1
TOP VIEW E2 2.74
H1 0.19 0.21 0.20
? Cutting Burr Side J 0.20
A K 0.30
L 9.00
L1 2.50
H1
' ?1 M 0.30
8x cut faces are not
tin plated E2
N 0 0.20
L 2x R 0.40
R1 0.15
R2 0.25
R

R3 0.40
D2 W 1.66 2.06
8 12
1 3 7
W L1 All Dimensions in mm
BOTTOM VIEW

Suggested Pad Layout

X G
Value
Dimensions
(in mm)
G 8.101
Y
X 8.100
Y 5.100

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 151 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions


POWERDI 5SP (Type B)

E POWERDI 5SP

E1/2 E/2
K 4x Type B
J 4x R1 Dim Min Max Typ
M 4x A 0.75
c
N 8x b 4.30 4.50 4.40

R3
D b 2x c 0.155 0.191
D 5.70 5.90 5.80
D2 4.40
R2 E 20.8 21.2 21.0
E1
E1 5.70 5.90 5.80
A TOP VIEW H1 E2 2.90
Cutting Burr Side H1 0.19 0.21 0.20
J 0.20
K 0.30
8x cut faces are not 1 L 7.60
V Groove Inner Line
tin plated L1 2.50
E2 M 0.30
L 2x N 0 0.20
R 0.40
R1 0.15
R

D2 R2 0.25
R3 0.40
W 1.63 1.97 1.80
W L1 8 12
1 3 7
BOTTOM VIEW All Dimensions in mm

Suggested Pad Layout

X G
Value
Dimensions
(in mm)
G 8.101
Y
X 8.100
Y 5.100

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 152 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

W-QFN3020-12
E L1
L
PIN#1 ID
-QFN3020-12
L2 Dim Min Max Typ
A 0.700 0.800 -
b A1 0 0.05 -
e A3 0.203REF
D
b 0.200 0.300 -
b1 0.350 0.450 -
D 1.900 2.100 2.000
e1
E 2.900 3.100 3.000
b1
e - - 0.500
e1 - - 0.575
L 0.350 0.450 -
b L1 0.450 0.550 -
A A3
A L2 0.750 0.850 -
All Dimensions in mm

Suggested Pad Layout

W-QFN3020-12

X1 X

Value
Dimensions
(in mm)
C 0.500
Y G 0.575
C X 0.650
Y2 X1 0.750
Y4
X2 0.350
X3 2.400
C1 Y 0.300
Y1 Y1 0.450
Y3 Y2 0.900
Y3 1.050
Y4 3.400
X2
X3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS


Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the Z dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90 153 of 316 Package Outline Dimensions
www.diodes.com Suggested Pad Layout
Diodes Incorporated
Package Outline Dimensions

U-QFN4040-16 (Type C)
A1
A3
U-QFN4040-16
A Type C
Dim Min Max Typ
A 0.57 0.63 0.60
D
Pin #1 ID A1 0 0.05 0.02
C 0.2 K1
1
A3 - - 0.15
b 0.25 0.35 0.30
K D 3.95 4.05 4.00
D2 1.04 1.24 1.14
E2(4x)
E 3.95 4.05 4.00
E2 1.01 1.21 1.11
E e K2
e - - 0.65
D2(4x)
K - - 0.30