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GlobalOptoisolator  

     


  !   
(400 Volts Peak)  
The MOC3041, MOC3042 and MOC3043 devices consist of gallium arsenide
infrared emitting diodes optically coupled to a monolithic silicon detector
performing the function of a Zero Voltage Crossing bilateral triac driver.
They are designed for use with a triac in the interface of logic systems to
equipment powered from 115 Vac lines, such as solidstate relays, industrial
controls, motors, solenoids and consumer appliances, etc.
Simplifies Logic Control of 115 Vac Power
Zero Voltage Crossing 6
1
dv/dt of 2000 V/s Typical, 1000 V/s Guaranteed
STANDARD THRU HOLE
To order devices that are tested and marked per VDE 0884 requirements, the
suffix V must be included at end of part number. VDE 0884 is a test option.
Recommended for 115/240 Vac(rms) Applications:
Solenoid/Valve Controls Temperature Controls
Lighting Controls E.M. Contactors COUPLER SCHEMATIC
Static Power Switches AC Motor Starters
1 6
AC Motor Drives Solid State Relays
MAXIMUM RATINGS (TA = 25C unless otherwise noted) 2 5
Rating Symbol Value Unit ZERO
3 CROSSING 4
INFRARED EMITTING DIODE CIRCUIT
Reverse Voltage VR 6 Volts
Forward Current Continuous IF 60 mA 1. ANODE
2. CATHODE
Total Power Dissipation @ TA = 25C PD 120 mW 3. NC
Negligible Power in Output Driver 4. MAIN TERMINAL
Derate above 25C 1.41 mW/C
5. SUBSTRATE
OUTPUT DRIVER 5. DO NOT CONNECT
6. MAIN TERMINAL
OffState Output Terminal Voltage VDRM 400 Volts
Peak Repetitive Surge Current ITSM 1 A
(PW = 100 s, 120 pps)
Total Power Dissipation @ TA = 25C PD 150 mW
Derate above 25C 1.76 mW/C
TOTAL DEVICE
Isolation Surge Voltage(1) VISO 7500 Vac(pk)
(Peak ac Voltage, 60 Hz, 1 Second Duration)
Total Power Dissipation @ TA = 25C PD 250 mW
Derate above 25C 2.94 mW/C
Junction Temperature Range TJ 40 to +100 C
Ambient Operating Temperature Range(2) TA 40 to +85 C
Storage Temperature Range(2) Tstg 40 to +150 C
Soldering Temperature (10 s) TL 260 C

1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.


1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
MOC3041, MOC3042, MOC3043

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)


Characteristic Symbol Min Typ Max Unit
INPUT LED
Reverse Leakage Current IR 0.05 100 A
(VR = 6 V)
Forward Voltage VF 1.3 1.5 Volts
(IF = 30 mA)
OUTPUT DETECTOR (IF = 0 unless otherwise noted)
Leakage with LED Off, Either Direction IDRM1 2 100 nA
(Rated VDRM(1))
Peak OnState Voltage, Either Direction VTM 1.8 3 Volts
(ITM = 100 mA Peak)
Critical Rate of Rise of OffState Voltage(3) dv/dt 1000 2000 V/s
COUPLED
LED Trigger Current, Current Required to Latch Output IFT mA
(Main Terminal Voltage = 3 V(2)) MOC3041 15
MOC3042 10
MOC3043 5
Holding Current, Either Direction IH 250 A
Isolation Voltage (f = 60 Hz, t = 1 sec) VISO 7500 Vac(pk)
ZERO CROSSING
Inhibit Voltage VIH 5 20 Volts
(IF = Rated IFT, MT1MT2 Voltage above which device will
not trigger.)
Leakage in Inhibited State IDRM2 500 A
(IF = Rated IFT, Rated VDRM, Off State)
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between IFT
2. (15 mA for MOC3041, 10 mA for MOC3042, 5 mA for MOC3043) and absolute max IF (60 mA).
3. This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the loaddriving thyristor(s) only.

TYPICAL ELECTRICAL CHARACTERISTICS


TA = 25C

+800
OUTPUT PULSE WIDTH 80 s NORMALIZED TO
1.5
ITM , ON-STATE CURRENT (mA)

+600 IF = 30 mA TA = 25C
1.4
+400 f = 60 Hz
TA = 25C 1.3
NORMALIZED IFT

+200 1.2
0 1.1
200 1
0.9
400
0.8
600
0.7
800

4 3 2 1 0 1 2 3 4 5 40 20 0 20 40 60 80
VTM, ONSTATE VOLTAGE (VOLTS) TA, AMBIENT TEMPERATURE (C)

Figure 1. OnState Characteristics Figure 2. Trigger Current versus Temperature


MOC3041, MOC3042, MOC3043
500 1.5
I DRM1, PEAK BLOCKING CURRENT (nA)

1.4
200 IF = 0 1.3 IF = RATED IFT

IDRM2, NORMALIZED
1.2
100
1.1
50 1
0.9
20 0.8
0.7
10
0.6
5
40 20 0 20 40 60 80 100 40 20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)

Figure 3. IDRM1, Peak Blocking Current Figure 4. IDRM2, Leakage in Inhibit State
versus Temperature versus Temperature

25
IFT, NORMALIZED LED TRIGGER CURRENT
1.5 NORMALIZED TO:
q
NORMALIZED TO 20
1.4 TA = 25C PWin 100 s
IFT, NORMALIZED

1.3 TA = 25C
1.2 15
1.1
1 10
0.9
0.8
5
0.7

0
40 20 0 20 40 60 80 100 1 2 5 10 20 50 100
TA, AMBIENT TEMPERATURE (C) PWin, LED TRIGGER PULSE WIDTH (s)

Figure 5. Trigger Current versus Temperature Figure 6. LED Current Required to Trigger
versus LED Pulse Width

+400
Vdc RTEST 1. The mercury wetted relay provides a high speed repeated
R = 10 k pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
PULSE CTEST 3. The worstcase condition for static dv/dt is established by
INPUT MERCURY triggering the D.U.T. with a normal LED input current, then
X100
WETTED removing the current. The variable RTEST allows the dv/dt to be
SCOPE
RELAY D.U.T. gradually increased until the D.U.T. continues to trigger in
PROBE
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering. tRC is measured at this point and
recorded.

Vmax = 400 V
APPLIED VOLTAGE
WAVEFORM 252 V

0 VOLTS + 0.63 RCVmax + 252


dv dt
RC t t
tRC

Figure 7. Static dv/dt Test Circuit


MOC3041, MOC3042, MOC3043

Typical circuit for use when hot line switching is required.


VCC Rin 1 6 360 In this circuit the hot side of the line is switched and the
HOT
load connected to the cold or neutral side. The load may be
MOC3041/
2 3042/
5 connected to either the neutral or hot line.
39 Rin is calculated so that IF is equal to the rated IFT of the
3043
3 240 Vac part, 5 mA for the MOC3043, 10 mA for the MOC3042, or
4
15 mA for the MOC3041. The 39 ohm resistor and 0.01 F
0.01 capacitor are for snubbing of the triac and may or may not
330
be necessary depending upon the particular triac and load
LOAD NEUTRAL
used.
* For highly inductive loads (power factor < 0.5), change this value to
360 ohms.

Figure 8. HotLine Switching Application Circuit

240 Vac

R1 D1
Suggested method of firing two, backtoback SCRs,
1 6 with a Motorola triac driver. Diodes can be 1N4001; resis-
VCC
tors, R1 and R2, are optional 330 ohms.
Rin 2 MOC3041/
5 SCR
3042/
SCR
3043
3 4 360
NOTE: This optoisolator should not be used to drive a load directly.
It is intended to be a trigger device only.

D2
R2

LOAD

Figure 9. InverseParallel SCR Driver Circuit


MOC3041, MOC3042, MOC3043

PACKAGE DIMENSIONS

A
NOTES:
6 4 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
1 3 FORMED PARALLEL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F 4 PL C L A 0.320 0.350 8.13 8.89
N B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
T K G 0.100 BSC 2.54 BSC
SEATING J 0.008 0.012 0.21 0.30
PLANE
G J 6 PL K 0.100 0.150 2.54 3.81
L 0.300 BSC 7.62 BSC
M 0.13 (0.005) M T B M A M
M 0_ 15 _ 0_ 15 _
E 6 PL
N 0.015 0.100 0.38 2.54
D 6 PL
0.13 (0.005) M T A M B M STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL

THRU HOLE

6 4
B S NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1 3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
F 4 PL
H A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
C D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
T F 0.010 0.014 0.25 0.36
G G 0.100 BSC 2.54 BSC
J SEATING
H 0.020 0.025 0.51 0.63
PLANE
E 6 PL K 6 PL J 0.008 0.012 0.20 0.30
K 0.006 0.035 0.16 0.88
D 6 PL 0.13 (0.005) M T B M A M
L 0.320 BSC 8.13 BSC
S 0.332 0.390 8.43 9.90
0.13 (0.005) M T A M B M

*Consult factory for leadform


option availability
SURFACE MOUN T
MOC3041, MOC3042, MOC3043

A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
6 4 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
B
1 3 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
L C 0.115 0.200 2.93 5.08
F 4 PL N D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
C G 0.100 BSC 2.54 BSC
J 0.008 0.012 0.21 0.30
T K 0.100 0.150 2.54 3.81
SEATING L 0.400 0.425 10.16 10.80
PLANE G N 0.015 0.040 0.38 1.02
K J
D 6 PL
E 6 PL 0.13 (0.005) M T A M B M

0.4 LEAD SPACING


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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, and (c) whose failure to reasonably expected to cause the failure of the life support
perform when properly used in accordance with device or system, or to affect its safety or effectiveness.
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.

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