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SMT / SMD Component

- an overview of the different SMD component
packages used for surface mount technology, SMT


SMT overview (/info/data/smt/what-is-surface-mount-

SMD component packages (/info/data/smt/smt_packages.php)
SMD resistor (/info/data/resistor/smd_resistor
SMD resistor markings (/info/data/resistor/smd_resistor
MELF SMD resistor (/info/data/resistor/smd_resistor/melf-
SMD capacitor (/info/data/capacitor/smd_capacitor.php)
Latest news
Quad Flat Package, QFP (/info/data/smt/smd-qfp-quad-flat-
package.php) Multi-protocol SoCs reduce cost of
industrial Ethernet communication
BGA, Ball Grid Array (/info/data/smt/smd-bga-ball-grid-array-
SMD PLCC (/info/data/smt/smd-plcc-plastic-leaded- industrial-8422)
Qualcomm Technologies and Keysight
collaborate on 5G tesing (/news
Surface mount technology, SMT components come in a variety of /telecoms-networks/qualcomm-
packages. technologies-and-keysight-collaborate-
As surface mount technology has improved many packages have
decreased in size. Additionally there is a variety of different SMT Wideband RF mixers simplify industrial
packages for integrated circuits dependent upon the design to speed time to market (/news
interconnectivity required, the technology being used and a variety /electronics-components/wideband-
of other factors. rf-mixers-simplify-industrial-design-8418)
Ultra-capacitor energy storage system is
for UPS (/news/power-management
Standards for surface mount packages is-for-8419)

To provide some degree of uniformity, sizes of most SMT V2X transceiver accelerates ADAS (/news

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SMT Packages | Surface Mount SMD Component | S...

components conform to industry standards, many of which are accelerates-adas-8417)

JEDEC specifications. Obviously different SMT packages are used for
. . . . More News (
different types of components, but the fact that there are standards
enables activities such as printed circuit board design to be
simplified. Additionally the use of standard size packages simplifies
the manufacture because pick and place machines can use standard FOCUS ON WIRELESS (/TECH-
feed for the SMT components, considerably simplifying the ZONE/DIGIKEY/)
manufacturing process and saving costs.
Jumpstart IoT Product Development with
The different SMT packages can be categorised by the type of the Electric Imp Platform
component, and there are standard packages for each. (
Passive rectangular components development-electric-imp-platform)
These SMT components are mainly resistors and capacitors which Dev Platform Speeds Development of
form the bulk of the number of components used. There are several Low-Power Bluetooth-Enabled IoT
different sizes which have been reduced as technology has enabled Designs (
smaller components to be manufactured and used /ddm/clk/321915269;151378141;e?https:
1812 4.6 x 3.0 0.18 x 0.12
1206 3.0 x 1.5 0.12 x 0.06 V2X Communication for Autonomous
0805 2.0 x 1.3 0.08 x 0.05
Vehicles (
0603 1.5 x 0.8 0.06 x 0.03
0402 1.0 x 0.5 0.04 x 0.02
0201 0.6 x 0.3 0.02 x 0.01

Of these sizes, the 1812, and 1206 sizes are now only used for Understanding Antenna Specifications
specialised components or ones requiring larger levels of power to and Operation (
be dissipated The 0603 and 0402 SMT sizes are the most widely /ddm/clk/321914362;151378141;x?https:
used. //
Read more about SMD capacitors (/info/data/capacitor specifications-and-operation)
More Focus on Wireless (/tech-
Read more about SMD resistors (/info/data/resistor/smd_resistor zone/digikey/)


Tantalum capacitors SMD packages
As a result of the different construction and requirements for
tantalum SMT capacitors, there are some different packages that are
used for them. These conform to EIA specifications.


Size A 3.2 x 1.6 x 1.6 EIA 3216-18
Size B 3.5 x 2.8 x 1.9 EIA 3528-21
Nick Robins | Alpha Micro Components
Size C 6.0 x 3.2 x 2.2 EIA 6032-28
A flexible approach to better antennas
Size D 7.3 x 4.3 x 2.4 EIA 7343-31
Size E 7.3 x 4.3 x 4.1 EIA 7343-43
For the Internet of Things to become as
ubiquitous as forecasts suggests, a lot of
Things are going to need Internet
connections, many of them wireless.
Semiconductor SMD packages
There is a wide variety of SMT packages used for semiconductors
including diodes, transistors and integrated circuits. The reason for
the wide variety of SMT packages for integrated circuits results from
the large variation in the level of interconnectivity required. Some of
the main packages are given below

Transistor & diode packages

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SMT Packages | Surface Mount SMD Component | S...

SMD transistors and diodes often share the same types of package. Online - Fundamentals
While diodes only have two electrodes a package having three of Modern RF and
enables the orientation to be correctly selected. Wireless
This on-line course enables
you to quickly get
up-to-speed & understand Forthcoming
SMD diodes on a printed circuit key concepts of modern Events
radio frequency, RF &
Although a variety of SMT transistor and diode packages are wireless communications UK Aerospace and
available, some of the most popular are given in the list below. systems Defence Forum
More training courses
SOT-23 - Small Outline Transistor: This is SMT package has /uk-aerospace-
three terminals for a diode of transistor, but it can have more and-defence-
pins when it may be used for small integrated circuits such as forum-75)
an operational amplifier, etc. It measures 3 mm x 1.75 mm x New External Power
LAPC 2017:
1.3 mm. Supply Regulations
Are Coming in 2016
SOT-223 - Small Outline Transistor: This package is used for Antennas and
higher power devices. It measures 6.7 mm x 3.7 mm x 1.8 Propagation
mm. There are generally four terminals, one of which is a large Conference (/event
heat-transfer pad. /lapc-
Integrated circuit SMD packages In this whitepaper, power
supply experts CUI look at productronica
There are many forms of package that are used for SMD ICs. the standards & (/event
requirements for power /productronica-11)
Although there is a large variety, each one has the areas where its
supplies around the globe
use is particularly applicable. Mobile World
that will hit the industry by
2016. Congress (/event
SOIC - Small Outline Integrated Circuit : This SMD IC
package has a dual in line configuration and gull wing leads More whitepapers
with a pin spacing of 1.27 mm (/whitepapers.php)
Embedded World
SOP - Small Outline Package: There are several versions of (/event/embedded-world-65)
this SMD package:
NIWeek (/event/niweek-60)

TSOP - Thin Small Outline Package: This SMD package . . . . More Events (
is thinner than the SOIC and has a smaller pin spacing
of 0.5 mm trade-shows/)
SSOP - Shrink Small Outline Package: This package has
a pin spacing of 0.635 mm

TSSOP - Thin Shrink Small Outline Package: Popular Articles

QSOP - Quarter-size Small Outline Package: It has a pin Beam forming for 5G communication
spacing of 0.635 mm systems (/articles/antennas-propagation
VSOP - Very Small Outline Package: This is smaller than systems-179)
the QSOP and has pin spacing of 0.4, 0.5, or 0.65 mm.
2017 Forecast For Electronic Components
Market (/articles/electronics-components
Measuring Noise Figure on RF systems
Resolving EMI common mode & normal
mode noise (/articles/circuit-design
Practical PCB Design using DesignSpark
PCB (/articles/circuit-design/practical-

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SMT Packages | Surface Mount SMD Component | S...

QFP- Quad flat pack: The QFP is the generic type of flat . . . . More Articles (
package for ICs. There are several variants as detailed below.

LQFP - Low profile Quad Flat Pack: This package has

pins on all four sides. Pin spacing varies according to
the IC, but the height is 1.4 mm.

PQFP - Plastic Quad Flat Pack: A square plastic package

with equal number of gull wing style pins on each side.
Typically narrow spacing and often 44 or more pins.
Normally used for VLSI circuits.

CQFP - Ceramic Quad Flat Pack: A ceramic version of

the PQFP.

TQFP - Thin Quad Flat Pack: A thin version of the PQFP.

Read more about the QFP - Quad Flat Pack (/info/data/smt
BGA - Ball Grid Array: A package that uses pads underneath
the package to make contact with the printed circuit board.
Before soldering the pads appear as solder balls, giving rise to
the name.

By placing the pads underneath the package there is more

room for them, thereby overcoming some of the problems of
the very thin leads required for the quad flat packs. The ball
spacing on BGAs is typically 1.27 mm. Read more about the
Ball Grid Array ( smd-bga-ball-grid-array-package.php)
PLCC - Plastic Leaded Chip Carrier: This type of package is
square and uses J-lead pins with a spacing of 1.27 mm. Read
more about the PLCC Plastic Leaded Chip Carrier (

SMD package applications

SMT surface mount technology packages are used for most printed
circuit designs that are going to be manufactured in any quantity.
Although it may appear there is a relatively wide number of different
packages, the level of standardisation is still sufficiently good. In any
case it arises mainly out of the enormous variety in the function of
the components.

By Ian Poole (


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Capacitor types (/info/data/capacitor/capacitor_types.php)

Diodes (/info/data/semicond/diodes/types-of-diodes.php)
SMD resistor (/info/data/resistor/smd_resistor
Inductors (/info/data/inductors/inductor-types.php)
Quartz crystals (/info/data/crystals/quartz-crystals-
Resistors (/info/data/resistor/resistor-types.php)
SMD Technology (/info/data/smt/what-is-surface-mount-
Switches (/info/data/switches/types-basics-tutorial.php)
Electronic Components (/info/data/)


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