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ORDERING INFORMATION
Package Case # of Ports Pressure Type Device
Device Name
Options No. None Single Dual Gauge Differential Absolute Marking
Small Outline Package (MPXV7025 Series)
MPXV7025GC6U Rails 482A MPXV7025G
MPXV7025GC6T1 Tape & Reel 482A MPXV7025G
MPXV7025GP Trays 1369 MPXV7025GP
MPXV7025DP Trays 1351 MPXV7025DP
Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)
MPVZ7025GC6T1 Tape & Reel 482A MPVZ7025G
MPVZ7025GC6U Rails 482A MPVZ7025G
MPVZ7025GP Trays 1369 MPVZ7025GP
MPVZ7025G6T1 Tape & Reel 482 MPVZ7025G
MPVZ7025G6U Rails 482 MPVZ7025G
MPVZ7025DP Trays 1351 MPVZ7025DP
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic Symbol Min Typ Max Unit
Warm-Up Time(7) 20 - ms
MPXV7025
Sensors
2 Freescale Semiconductor
Pressure
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Maximum Ratings
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 2
MPXV7025
Sensors
Freescale Semiconductor 3
Pressure
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On-chip Temperature Compensation and Calibration
The MPXV7025 series pressure sensor operating curves are shown for operation over a temperature range of
characteristics, and internal reliability and qualification tests 0 to 85C using the decoupling circuit shown in Figure 3. The
are based on use of dry air as the pressure media. Media, output will saturate outside of the specified pressure range.
other than dry air, may have adverse effects on sensor Figure 3 shows the recommended decoupling circuit for
performance and long-term reliability. Contact the factory for interfacing the output of the integrated sensor to the A/D input
information regarding media compatibility in your application. of a microprocessor or microcontroller. Proper decoupling of
Figure 2 shows the sensor output signal relative to the power supply is recommended.
pressure input. Typical, minimum, and maximum output
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.5) ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85C
TYPICAL
3.0
Output (V)
2.5
MAX
2.0
MIN
1.5
1.0
0.5
0 -25 0 25
Differential Pressure (kPa)
+5 V
Vout OUTPUT
Vs
IPS
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Sensors
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Pressure
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Transfer Function
4.0
Temp Multiplier
3.0
40 3
Temperature 0 to 85 1
Error 2.0 +125 3
Factor
1.0
0.0
40 20 0 20 40 60 80 100 120 140
Temperature in C
NOTE: The Temperature Multiplier is a linear response from 0 to 40C and from 85 to 125C.
2.0
Pressure Error (kPa)
1.0
2.0
MPXV7025
Sensors
Freescale Semiconductor 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE www.DataSheet4U.com
Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential
as the Pressure (P1) side and the Vacuum (P2) side. The pressure applied, P1 > P2.
Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the
which protects the die from harsh media. The pressure following table:
Pressure (P1)
Part Number Case Type
Side Identifier
MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1 482A Side with Port Attached
MPXV7025GP, MPVZ7025GP 1369 Side with Port Attached
MPXV7025DP, MPVZ7025DP 1351 Side with Part Marking
MPVZ7025G6U/T1 482 Side with Part Marking
0.100 TYP 8X
0.660 2.54
16.76
0.060 TYP 8X
1.52 0.300
7.62
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Sensors
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Pressure
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PACKAGE DIMENSIONS
-A- D 8 PL
4 0.25 (0.010) M T B S A S NOTES:
5 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
G 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
8
1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
S A 0.415 0.425 10.54 10.79
W B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
V J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
C M 0 7 0 7
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
H V 0.245 0.255 6.22 6.48
J W 0.115 0.125 2.92 3.17
-T-
PIN 1 IDENTIFIER SEATING
M PLANE
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
-A-
D 8 PL
4 0.25 (0.010) M T B S A S
5 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
G 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
8 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
1
INCHES MILLIMETERS
S DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
C 0.212 0.230 5.38 5.84
N D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
C H
K 0.061 0.071 1.55 1.80
J
-T- M 0 7 0 7
N 0.405 0.415 10.29 10.54
PIN 1 IDENTIFIER SEATING S 0.709 0.725 18.01 18.41
PLANE
K M
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025
Sensors
Freescale Semiconductor 7
Pressure
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PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B
A E
GAGE
e PLANE
5 4
e/2
.014 (0.35) L
D A1
DETAIL G
8 1
NOTES:
8X b 1. CONTROLLING DIMENSION: INCH.
F STYLE 1: STYLE 2: 2. INTERPRET DIMENSIONS AND TOLERANCES PER
0.004 (0.1) M C A B PIN 1. GND PIN 1. N/C ASME Y14.5M, 1994.
2. +Vout 2. Vs
3. Vs 3. GND 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
4. -Vout 4. Vout MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
5. N/C 5. N/C PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
B E1 6. N/C 6. N/C PER SIDE.
7. N/C 7. N/C 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
8. N/C 8. N/C
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
T A 0.370 0.390 9.39 9.91
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E 0.680 0.700 17.27 17.78
E1 0.465 0.485 11.81 12.32
A M e 0.100 BSC 2.54 BSC
F 0.240 0.260 6.10 6.60
K 0.115 0.135 2.92 3.43
L 0.040 0.060 1.02 1.52
8X 0.004 (0.1) M 0.270 0.290 6.86 7.37
P K N 0.160 0.180 4.06 4.57
DETAIL G P 0.009 0.011 0.23 0.28
SEATING T 0.110 0.130 2.79 3.30
C PLANE 0 7 0 7
CASE 1351-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025
Sensors
8 Freescale Semiconductor
Pressure
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PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B
A E
GAGE
e PLANE
5 4
e/2
.014 (0.35) L
D A1
DETAIL G
8 1 NOTES:
1. CONTROLLING DIMENSION: INCH.
8X b 2. INTERPRET DIMENSIONS AND TOLERANCES PER
F 0.004 (0.1) M C A B ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
E1 PER SIDE.
B 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
T A 0.300 0.330 7.11 7.62
K A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E 0.717 BSC 18.21 BSC
E1 0.465 0.485 11.81 12.32
A M e 0.100 BSC 2.54 BSC
F 0.245 0.255 6.22 6.47
K 0.120 0.130 3.05 3.30
8X 0.004 (0.1) L 0.061 0.071 1.55 1.80
P M 0.270 0.290 6.86 7.36
DETAIL G N 0.080 0.090 2.03 2.28
P 0.009 0.011 0.23 0.28
SEATING T 0.115 0.125 2.92 3.17
C PLANE 0 7 0 7
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025
Sensors
Freescale Semiconductor 9
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Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
MPXV7025
Rev. 5
1/2009