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REVISIONS

ECN NO. DATE DESCRIPTION APPROVED

5/14/10 INITIAL RELEASE SS

PIN #1 ID 7.000
0.400 X 45
CHAMFER 3.500 5.500
3X R 0.500
0.203 REF

C A A PIN #1 ID C

6.579 A 5.100
5.300

0.150

0.320
0.362 REF 0.800 0.230 0.500 TYP
0.512
TOP VIEW
d 0.08
BOTTOM VIEW

6.325

12

0.800

5.100
5.300
0.597
5.600
6.300

A NOTES SECTION A-A A

1. MATERIALS:

LEAD FRAME: COPPER 194FH, THK = 0.2030.008

BODY: SEMICONDUCTOR MOLDING EPOXY, CONTACT QUIK-PAK FOR DETAILS. QUIK-PAK
2. FINISH:
www.icproto.com
LEAD FRAME: ELECTROLESS NICKEL PER MIL-C-26074, CLASS 1,
10987 VIA FRONTERA
SAN DIEGO, CA. 92127
100 TO 300 MICROINCHES (2.5um - 7.6um) THICK. DRAWN DATE PHONE: (858) 674-4676 FAX: (858) 674-4681
GOLD PLATE PER MIL-G-45204, TYPE 3, GRADE A, CLASS 1 THIRD ANGLE BY CAD DEPT. 3/15/10
(40 TO 80 MICROINCHES (1um - 2um) THICK). PROJECTION

BODY SURFACE FINISH: VDI 21-24 (1.12-1.6 Ra).

APP DATE
7mm X 7mm
BY STEVE S. 3/15/10
UNLESS OTHERWISE SPECIFIED
3. PACKAGE MISMATCH: BODY OFFSET TO LEAD FRAME = 0.076mm MAX DIMENSIONS ARE IN MILLIMETER CUSTOMER QFN 48 LEAD OmPP
---
TOLERANCES ARE:
4. UNLESS OTHERWISE SPECIFIED, RADIUS ON ALL MOLDED EDGES SIZE PART NO. REV

A
X.XX 0.15 X.XXXX ---
AND CORNERS = 0.25mm MAX. THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY QP-QFN48-7MM-.5MM A2
5. PACKAGE CONFORMS TO JEDEC MO-220. X.XXX 0.050 ANGLES: 1 TO QUIK-PAK, AND REPRODUCTION IN ANY FORM
IS NOT PERMITTED WITHOUT WRITTEN AUTHORIZATION
CAD
DO NOT SCALE DRAWING FROM QUIK-PAK, DIV OF DELPHON IND. SCALE NONE FILE
SHEET 1 OF 1

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