IMM Qualification Results Summary

Objective: 68HC908LJ24 SND Fab Transfer to CHD FAB Qualification

Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

U050FXXD(85%UDRSST)
Technology: 6019/QFP 80 14*14*2.2P0.65
Package:
Fab / Design Engr: Carlquist Jim-RMSD80 QUARTZ Tracking #: 214981
Assembly / Sanmugam M.Kuppannan-R63803/ Ching Wan Yin- (Signature/Date shown below
Final Test TSMC2-FAB/ FSL-KLM-FM / No Change Product Engr: B04720 may be electronic)

PPE Approval (for

Maskset#: N86E DIM/BOM results) Tran Ziep-RSJP50
Die Size (in 0
Rev#: Prod. Package Engr: Tran Ziep-RSJP50 Signature & Date: 25 Nov 2011
mm) NPI PRQE Approval Nurazah Ahmad
W x L x T 4.2672 x 4.2416 NPI PRQE: Gary Westerman/ Nurazah Ahmad-R63712 Signature & Date: 25 Nov 2011

Part LOT A
Operating WEMHA1J90100 CAB Approval 11241980M
Temp. Grade: -40C to +85C Trace/DateCode: PSQ Q AC1140C Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

Example: TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale KLM unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results
TEST J=JESD22 (Surface Mount Devices Only - PC required Requirements Size including LotID-(#Rej/SS) Comments or Generic Data
for THB, HAST, AC, UHST, TC, PC+PTC) Note 1 spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount devices prior to THB, HAST, AC, Pass Use parts with BI for all
A113 PC required for SMDs only. UHST, TC, PC+PTC and as required per test conditions. package data, if there is a BI
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification) flow option.

Generic data:
PC Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 693
Q190677, 68HC908AZ60A
CHD: 0/693

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 0 0 Pass Generic data:
A101 PC before HAST (for SMDs only): Required Q190677, 68HC908AZ60A
A110 HAST = 130C/85%RH for 96 hrs CHD: 0/231
Bias = 5.0V
Q214026, 68HC908GZ60
Timed RO of 48hrs. MAX (0N55E), TSMC2: 0/231

AC JESD22- Autoclave (AC): TEST @ R 77 0 0 Pass Generic data:

A102 PC before AC (for SMDs only): Required Q190677, 68HC908AZ60A
A118 AC = 121C/100%RH/15 psig for 96 hrs CHD: 0/231

Timed RO of 2-48hrs. MAX Q214026, 68HC908GZ60

(0N55E), TSMC2: 0/ 231

TC JESD22- Temperature Cycle (TC): TEST @ H 77 0 0 Pass Generic data:

A104 PC before TC (for SMDs only): Required Q190677, 68HC908AZ60A
AEC Q100- CHD: 0/231 WP: 0/15, Min>3
Appendix 3 TC = -65C to 150C for 500 cycles
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231
WP: Min > 5gram

HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RH 77 1 0 Pass Generic data:
A103 AEC Grade 1: +150C for 1000 hours or +175C for 500 hours Q190677, 68HC908AZ60A
CHD: 0/77@150C, 1008Hrs
Timed RO = 96hrs. MAX

Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 77

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
A108 Ta = 125C for 168hrs
Bias = 6.0V Q212936 908AZ60A 0/231
Q214026 68HC908GZ60
Timed RO of 96hrs. MAX (0N55E), TSMC2 0/231

Q214945 68HC908LK24
(N85E), TSMC2 0/77

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RH 611 1 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs
Bias = 6.0V Q214205, GZ60(TSMC2,
LQFP48): 0/1833
Timed RO of 48 hrs MAX, 6V
ELFR

AEC Q100-005 NVM Endurance at Hot, Data Retention, and Operational Life (EDR): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling).
Test R, H, C after W/E cycling. Q212936 908AZ60A 3lots 3
77
Q214025 68HC908GZ60
10K W/E @ 125oC and 5V followed by 150oC for 168hrs DRB (0N55E), TSMC2 0/231
EDR
Timed RO of 96hrs. MAX

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 1 5 Pass Generic Data:
from minimum 5 Q190677, 68HC908AZ60A
units CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 1 5 Pass Generic Data:
2011 Cond. C or D from minimum 5 Q190677, 68HC908AZ60A
units CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

FORMPPAP004XLS 1 of 2 Freescale Rev S

 Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

SD JESD22- Solderability; >95% lead coverage of 15 0 0 Not required for Fab Site
B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test. critical areas Transfer
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0 Not required for Fab Site
B100 PD per FSL 98A drawing Transfer

DIMENSIONA Dimensional (DIM):

L PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATIO
N

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Results
TEST Requirements Size including LotID-(#Rej/SS) LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All Pass
For AEC, test software shall meet requirements of AEC-Q100-007.
TEST Testing performed to the limits of device specification in temperature and limit value.

AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 1 12 Lot A:

JESD22-A114E Jan 2007 Human Body Model Classification (HBM): 2KV min. level 500V: 0/3
Test @ 500/1000/1500/2000Volts 1000V: 0/3
HBM For AEC, see AEC-Q100-002 for classification levels. 1500V: 0/3
2000V: 0/3

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 1 3 Lot A:

or JESD22 Machine Model Classification m(MM): 200V min. level 200V: 0/3
MM Test @ 200 Volts
For AEC, see AEC-Q100-003 for classification levels.

AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 1 9 Lot A:

Charged Device Model Classification (CDM): All pins =/> 500V level 250V: 0/3
CDM Test @ 250/500/750Volts 500V: 0/3
For AEC, see AEC-Q100-011 for classification levels. 750V: 0/3
Timed RO of 96hrs MAX.

JESD78 Latch-up (LU): TEST @ RH 6 1 6 Lot A: 0/6

plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.
AEC-Q100- Ta= 85oCMaximum operating temperature
LU 004 for AEC Vsupply = 5.5V Maximum operating voltage

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 1 5 Pass Generic TSMC2 Data:
Freescale 48A spec
For AEC, Q212936 908AZ60A 3lots 3
Cpk target > 1.67 77
Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
ED
Q214945 68HC908LK24
(N85E) 80 QFP, 0/6

For AEC, AEC-Q100-007 Fault Grading (FG) FG shall be = or > No Change

FG 90% for qual units

For AEC, AEC-Q003 Characterization (CHAR):

Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC-Q100-006 Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 1 6 Not required for IMM
155C, 2.0 min, +400/-400 V
GL (for Per AEC Q100 Rev G, this test is performed for information only.
information Timed RO of 96 hrs MAX.
only) For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C) and retest;
recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 1 1
Radiated Emissions (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per 150KHz - 1GHz
EMC customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96
214945 N85E 68HC908LK24 85% UDRSST TSMC2FAB 18.12

80 QFP Package Qual Vehicles

Die Area Pkg Mold

Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code EPOXY Description Wire Description
(mm2) Description Description

QFP 64 DA SUMITOMO CRM-

214026 0N55E 68HC908GZ60 22.00 6057 MC HITACHI 9200HF10M 25um
14*14*2.2P0.8 1064MBL
QFP 80 DA SUMITOMO CRM-
190677 M73Y (CHD) 908AZ60A 28.97 6019 MC HITACHI 9200HF10M
14*14*2.2P0.65 25um
1064MBL

Revision
Revision Revision Date Description Approver
1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Revised NVM requirements, applied ELFR generic data, adjusted ESD requirements on 80QFP vehicle. L. Peters
4.0 22-Aug-11 Edit the Qual Plan- EDR 64QFP to be perform to 80QFP. No BIB to perform W/E cycling. This is same as Chandler Qual. Nurazah Ahmad
5.0 23-Sep Edit Au wire to 1mils as Nurazah Ahmad
6.0 27-Sep-11 Edit QBS for 64QFP and 80QFP to GZ60- TSMC2 package qualification data and remove re-use data from AS60- TSMC Nurazah Ahmad

7.0 12-Oct-11 Add ELFR (from 0 to 3 lots) and HTOL increase from 168 to 412 hrs since GZ60 qualification risk to re-use the data and Nurazah Ahmad
update EMC test not required.

8.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
9.0 9-Nov-11 64QFP package for GZ60 pass and this will eliminate package qual for 64QFP and 80QFP. EDR and HTOL was eliminated as Nurazah Ahmad
well by re-use a data from GZ60. Edit Program and Read Distrub requirement as well.

10.0 23-Nov-11 Final Qual Report Nurazah Ahmad

FORMPPAP004XLS 2 of 2 Freescale Rev S

 IMM Qualification Results Summary
Objective: 68HC908LJ24 SND Fab Transfer to CHD FAB Qualification
Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

Technology: U050FXXD(85%UDRSST)
Fab / 6057/ QFP 64 14*14*2.2P0.8
Package: Design Engr: Carlquist Jim-RMSD80 QUARTZ Tracking #: 215003
Assembly / Sanmugam M.Kuppannan-R63803/ Ching Wan Yin- (Signature/Date shown below
Final Test TSMC2-FAB/ FSL-KLM-FM / No Change Product Engr: B04720 may be electronic)

PPE Approval (for

Maskset#: N86E DIM/BOM results) Tran Ziep-RSJP50
Die Size (in 0
Rev#: Prod. Package Engr: Tran Ziep-RSJP50 Signature & Date: 25 Nov 2011
mm) NPI PRQE Approval Nurazah Ahmad
W x L x T 4.2672 x 4.2416 NPI PRQE: Gary Westerman/ Nurazah Ahmad-R63712 Signature & Date: 25 Nov 2011
LOT A
Part WEMHA1J8YE00
Operating PSQ Q AC1140A CAB Approval 11241980M
Temp. Grade: -40C to +85C Trace/DateCode: Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

Example: TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale KLM unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions Minimum Sample # of Lots Total Units Results
TEST J=JESD22 (Surface Mount Devices Only - PC required Size including LotID-(#Rej/SS) Comments or Generic Data
for THB, HAST, AC, UHST, TC, PC+PTC) Note 1 spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount devices prior to THB, HAST, AC, Pass Use parts with BI for all
A113 PC required for SMDs only. UHST, TC, PC+PTC and as required per test conditions. package data, if there is a BI
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification) flow option.

Generic data:
PC Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 693
Q190677, 68HC908AZ60A
CHD: 0/693

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 0 0 Pass Generic data:
A101 PC before HAST (for SMDs only): Required Q190677, 68HC908AZ60A
A110 HAST = 130C/85%RH for 96 hrs CHD: 0/231
Bias = Max Vdd (or justify othrwise)
Timed RO of 48hrs. MAX Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231

AC JESD22- Autoclave (AC): TEST @ R 77 0 0 Pass Generic data:

A102 PC before AC (for SMDs only): Required Q190677, 68HC908AZ60A
A118 AC = 121C/100%RH/15 psig for 96 hrs CHD: 0/231
Timed RO of 2-48hrs. MAX
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 231

TC JESD22- Temperature Cycle (TC): TEST @ HC 77 0 0 Pass Generic data:

A104 PC before TC (for SMDs only): Required Q190677, 68HC908AZ60A
AEC Q100- CHD: 0/231 WP: 0/15, Min>3
Appendix 3 TC = -65C to 150C for 500 cycles
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231
WP: Min > 5gram

HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RHC 77 1 0 Pass Generic data:
A103 Q190677, 68HC908AZ60A
AEC Grade 1: +150C for 1000 hours or +175C for 500 hours CHD: 0/77@150C, 1008Hrs

Timed RO = 96hrs. MAX

Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 77

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
A108 Ta = 125C for 168hrs
Bias = 6.0V Q212936: 908AZ60A , 0/231
Q214026 68HC908GZ60
Timed RO of 96hrs. MAX (0N55E), TSMC2 0/231

Q214945 68HC908LK24
(N85E), TSMC2 0/77

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RH 611 1 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs
Bias = 6.0V Q214205, GZ60(TSMC2,
LQFP48): 0/1833
Timed RO of 48 hrs MAX, 6V
ELFR

AEC Q100-005 NVM Endurance at Cold, Data Retention, and Operational Life (EDR): TEST @ RHC 77+3 0 0 Pass Generic TSMC2 Data:
Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling).
Test R, H, C after W/E cycling. Q212936 908AZ60A 3lots 3
77
GZ60 48 LQFP Auto Qual
10K W/E @ -40oC and 5V followed by 150oC for 168hrs DRB Q214025, GZ60: 0/231
EDR
Timed RO of 96hrs. MAX

AEC Q100-005 NVM Endurance at Hot, Data Retention, and Operational Life (EDR): TEST @ RHC 77+3 0 0 Pass Generic TSMC2 Data:
Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling).
Test R, H, C after W/E cycling. Q212936 908AZ60A 3lots 3
77
Q214025 68HC908GZ60
10K W/E @ 125oC and 5V followed by 150oC for 168hrs DRB (0N55E), TSMC2 0/231
EDR
Timed RO of 96hrs. MAX

FORMPPAP004XLS 1 of 4 Freescale Rev S

 Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 1 5 Pass Generic Data:
from minimum 5 Q190677, 68HC908AZ60A
units CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 1 5 Pass Generic Data:
2011 Cond. C or D from minimum 5 Q190677, 68HC908AZ60A
units CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

SD JESD22- Solderability; >95% lead coverage of 15 0 0

B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test. critical areas
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0

B100 PD per FSL 98A drawing
DIMENSIONA Dimensional (DIM):
L PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATIO
N

FORMPPAP004XLS 2 of 4 Freescale Rev S

 Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All This action refers to Final Generic TSMC2 Data:
For AEC, test software shall meet requirements of AEC-Q100-007. Testing of all qualification
TEST Testing performed to the limits of device specification in temperature and limit value. units. Q214981, 68HC908LJ24
(N86E) TSMC2 : Pass

AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
JESD22-A114E Jan 2007 Human Body Model Classification (HBM): 2KV min. level
Test @ 500/1000/1500/2000Volts Q214981, 68HC908LJ24
HBM For AEC, see AEC-Q100-002 for classification levels. (N86E) TSMC2 : Pass all
voltage level

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
or JESD22 Machine Model Classification m(MM): 200V min. level
Test @ 200 Volts Q214981, 68HC908LJ24
For AEC, see AEC-Q100-003 for classification levels. (N86E) TSMC2 : Pass all
MM
voltage level

AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
Charged Device Model Classification (CDM): All pins =/> 500V level
CDM Test @ 250/500/750Volts Q214981, 68HC908LJ24
For AEC, see AEC-Q100-011 for classification levels. (N86E) TSMC2 : Pass all
Timed RO of 96hrs MAX. voltage level

JESD78 Latch-up (LU): TEST @ RH 6 0 0 Generic TSMC2 Data:

plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.
AEC-Q100- o Q214981, 68HC908LJ24
Ta= 85 CMaximum operating temperature
LU 004 for AEC Vsupply = 5.5V Maximum operating voltage (N86E) TSMC2 : 0/6

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 1 5 Pass Generic TSMC2 Data:
Freescale 48A spec
ED For AEC, Q212936 908AZ60A 3lots 3
Cpk target > 1.67 77
Q214026 68HC908GZ60
For AEC, AEC-Q100-007 Fault Grading (FG) FG shall be = or >
FG 90% for qual units

For AEC, AEC-Q003 Characterization (CHAR):

Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC-Q100-006 Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 1 6 Not required for IMM
155C, 2.0 min, +400/-400 V
GL (for Per AEC Q100 Rev G, this test is performed for information only.
information Timed RO of 96 hrs MAX.
only) For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C) and retest;
recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 0 0
Radiated Emissions (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per 150KHz - 1GHz
EMC customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96
214945 N85E 68HC908LK24 85% UDRSST TSMC2FAB 18.12

80 QFP Package Qual Vehicles

Die Area Pkg Mold

Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code EPOXY Description Wire Description
(mm2) Description Description

QFP 64 DA SUMITOMO CRM-

214026 0N55E 68HC908GZ60 22.00 6057 MC HITACHI 9200HF10M 25um
14*14*2.2P0.8 1064MBL
QFP 80 DA SUMITOMO CRM-
190677 M73Y (CHD) 908AZ60A 28.97 6019 MC HITACHI 9200HF10M
14*14*2.2P0.65 25um
1064MBL

Revision
Revision Revision Date Description Approver
1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Revised NVM requirements, applied ELFR generic data, adjusted ESD requirements on 80QFP vehicle. L. Peters
4.0 22-Aug-11 Edit the Qual Plan- EDR 64QFP to be perform to 80QFP. No BIB to perform W/E cycling. This is same as Chandler Qual. Nurazah Ahmad

FORMPPAP004XLS 3 of 4 Freescale Rev S

 Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

5.0 23-Sep Edit Au wire to 1mils as Nurazah Ahmad

6.0 27-Sep-11 Edit QBS for 64QFP and 80QFP to GZ60- TSMC2 package qualification data and remove re-use data from AS60- TSMC Nurazah Ahmad

7.0 12-Oct-11 Add ELFR (from 0 to 3 lots) and HTOL increase from 168 to 412 hrs since GZ60 qualification risk to re-use the data and Nurazah Ahmad
update EMC test not required.

8.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
9.0 9-Nov-11 64QFP package for GZ60 pass and this will eliminate package qual for 64QFP and 80QFP. EDR and HTOL was eliminated as Nurazah Ahmad
well by re-use a data from GZ60. Edit Program and Read Distrub requirement as well.

10.0 23-Nov-11 Final Qual Report Nurazah Ahmad

FORMPPAP004XLS 4 of 4 Freescale Rev S

 IMM Qualification Results Summary
Objective: 68HC908LJ24 SND Fab Transfer to CHD FAB Qualification
Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

Technology: U050FXXD(85%UDRSST)
ab / 8426/LQFP 64 10*10*1.4P0.5
Package: Design Engr: QUARTZ Tracking #: 214560
Assembly / (Signature/Date shown below
Final Test TSMC2-FAB/ FSL-KLM-FM / No Change Product Engr: Tune Li Ting - B16387 may be electronic)

PPE Approval (for

Maskset#: N86E DIM/BOM results) Tran Ziep-RSJP50
Rev#: 0 Prod. Package Engr: Ziep Tran/512-895-7922 Signature & Date: 25 Nov 2011

Die Size (in

mm) NPI PRQE Approval Nurazah Ahmad
W x L x T 4.2672 x 4.2416 NPI PRQE: Gary Westerman/ Nurazah Ahmad-R63712 Signature & Date: 25 Nov 2011
Operating LOT A CAB Approval 11241980M
Temp. Grade: -40C to +85C Trace/DateCode: ME0066CB00 Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

Example: TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale TJN unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results
TEST J=JESD22 (Surface Mount Devices Only - PC required Requirements Size including LotID-(#Rej/SS) Comments or Generic Data
for THB, HAST, AC, UHST, TC, PC+PTC) Note 1 spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount 1 231 Lot A: 0/231 Generic Data:
A113 PC required for SMDs only. devices prior to THB,
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification) HAST, AC, UHST, Q205378-68HC908LK24
TC, PC+PTC and as M37Z CHD 0/693
required per test
conditions.
PC

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 1 77 Lot A: 0/77 Generic Data:
A101 PC before HAST (for SMDs only): Required
A110 HAST = 130C/85%RH for 96 hrs Q205378-68HC908LK24
Bias = Max Vdd (or justify othrwise) M37Z CHD 0/231
Timed RO of 48hrs. MAX

AC JESD22- Autoclave (AC): TEST @ R 77 1 77 Lot A: 0/77 Generic Data:

A102 PC before AC (for SMDs only): Required
A118 AC = 121C/100%RH/15 psig for 96 hrs Q205378-68HC908LK24
Timed RO of 2-48hrs. MAX M37Z CHD 0/6231

TC JESD22- Temperature Cycle (TC): TEST @ HC 77 1 77 Lot A: 0/77 Generic Data:

A104 PC before TC (for SMDs only): Required
AEC Q100- Q205378-68HC908LK24
Appendix 3 TC = -65C to 150C for 500 cycles M37Z CHD 0/231

HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RHC 77 1 77 Lot A: 0/77 Generic Data:
A103 AEC Grade 1: +175C for 504 hours
Q205378-68HC908LK24
Timed RO = 96hrs. MAX M37Z CHD 0/77

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
A108 Ta = 125C for 168hrs
Bias = 6.0V Q212936: 908AZ60A 0/231
Q214026 68HC908GZ60
Timed RO of 96hrs. MAX (0N55E), TSMC2 0/231

Q214945 68HC908LK24
(N85E), TSMC2 0/77

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RH 611 1 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs
Bias = 6.0V Q214205, GZ60(TSMC2,
LQFP48): 0/1833
Timed RO of 48 hrs MAX, 6V
ELFR

AEC Q100-005 NVM Endurance at Hot, Data Retention, and Operational Life (EDR): TEST @ RHC 77+3 0 0 Pass Generic TSMC2 Data:
Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling).
Test R, H, C after W/E cycling. Q212936 908AZ60A 3lots 3
77
Q214025 68HC908GZ60
o o (0N55E), TSMC2 0/231
10K W/E @ 125 C and 5V followed by 150 C for 168hrs DRB
EDR
Timed RO of 96hrs. MAX

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 1 5 Lot A: Cpk >1.67 Generic Data:
from minimum 5 Q205378-68HC908LK24
units M37Z CHD Cpk> 1.67
WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 1 5 Lot A: Cpk >1.67 Generic Data:
2011 Cond. C or D from minimum 5 Q205378-68HC908LK24
units M37Z CHD Cpk> 1.67
SD JESD22- Solderability; >95% lead coverage of 15 0 0
B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test. critical areas
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0

B100 PD per FSL 98A drawing

FORMPPAP004XLS 1 of 2 Freescale Rev S

 Freescale PN: 68HC908LJ24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LJ24" PN(s): PB or "Varies" Revision # & Date: Reference Revision History

DIMENSIONA Dimensional (DIM):

L PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATIO
N

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Minimum Sample # of Lots Total Units Results Comments or Generic Data
TEST Requirements Size including LotID-(#Rej/SS)
Note 1 spares NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All This action refers to Final Generic TSMC2 Data:
For AEC, test software shall meet requirements of AEC-Q100-007. Testing of all qualification
TEST Testing performed to the limits of device specification in temperature and limit value. units. Q214981, 68HC908LJ24
(N86E) TSMC2 : Pass

AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
JESD22-A114E Jan 2007 Human Body Model Classification (HBM): 2KV min. level
Test @ 500/1000/1500/2000Volts Q214981, 68HC908LJ24
HBM For AEC, see AEC-Q100-002 for classification levels. (N86E) TSMC2 : Pass all
voltage level

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
or JESD22 Machine Model Classification m(MM): 200V min. level
MM Test @ 200 Volts Q214981, 68HC908LJ24
For AEC, see AEC-Q100-003 for classification levels. (N86E) TSMC2 : Pass all
voltage level
AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage 0 0 Pass Generic TSMC2 Data:
Charged Device Model Classification (CDM): All pins =/> 500V level
CDM Test @ 250/500/750Volts Q214981, 68HC908LJ24
For AEC, see AEC-Q100-011 for classification levels. (N86E) TSMC2 : Pass all
Timed RO of 96hrs MAX. voltage level

JESD78 Latch-up (LU): TEST @ RH 6 0 0 Pass Generic TSMC2 Data:

plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.
AEC-Q100- Ta= 85oCMaximum operating temperature Q214981, 68HC908LJ24
LU 004 for AEC Vsupply = 5.5V Maximum operating voltage (N86E) TSMC2 : 0/6

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 1 5 Pass Generic TSMC2 Data:
Freescale 48A spec
ED For AEC, Q212936 908AZ60A 3lots 3
Cpk target > 1.67 77
Q214026 68HC908GZ60
For AEC, AEC-Q100-007 Fault Grading (FG) FG shall be = or >
FG 90% for qual units

For AEC, AEC-Q003 Characterization (CHAR):

Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC-Q100-006 Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 1 6 Not required for IMM
155C, 2.0 min, +400/-400 V
GL (for Per AEC Q100 Rev G, this test is performed for information only.
information Timed RO of 96 hrs MAX.
only) For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C) and retest;
recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 1 1
Radiated Emissions (see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per 150KHz - 1GHz
EMC customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96
214945 N85E 68HC908LK24 85% UDRSST TSMC2FAB 18.12

80 QFP Package Qual Vehicles

Die Area Pkg Mold

Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code EPOXY Description Wire Description
(mm2) Description Description

LQFP 64 MC HITACHI DA SUMITOMO CRM-

205378 M37Z 68HC908LJ24 18.10 8426 25um
10*10*1.4P0.5 9200HF10M 1064MBL

Revision Revision Date Description Approver

1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Revised NVM requirements, applied ELFR generic data, adjusted ESD requirements on 80QFP vehicle. L. Peters
4.0 22-Aug-11 Edit the Qual Plan- EDR 64QFP to be perform to 80QFP. No BIB to perform W/E cycling. This is same as Chandler Qual. Nurazah Ahmad
5.0 23-Sep Edit Au wire to 1mils as Nurazah Ahmad
6.0 27-Sep-11 Edit QBS for 64QFP and Nurazah Ahmad
80QFP to GZ60- TSMC2
7.0 12-Oct-11 AddkELFR (from
lifi 0ti to 3d t Nurazah Ahmad
lots) and HTOL increase
from 168 to 412 hrs since
8.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
9.0 9-Nov-11 64QFP package for GZ60 Nurazah Ahmad
pass and this will eliminate
package qual for 64QFP
10.0 23-Nov-11 Final Qual Report Nurazah Ahmad

FORMPPAP004XLS 2 of 2 Freescale Rev S

 IMM Qualification Results Summary
Objective: 68HC908LK24 TSMC2 FAB Qualification
Freescale PN: 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below

Technology:
Package: U050FXXD(85%UDRSST)/80QFP Design Engr: Not applicable QUARTZ Tracking #: 214945
Fab /
Assembly / (Signature/Date shown below may
Final Test TSMC2-FAB/KLM /KLM Product Engr: Ching Wan Yin-B04720 be electronic)
PPE Approval (for
Maskset#: DIM/BOM results) Tran Ziep-RSJP50
Rev#: N85E Prod. Package Engr: Tran Ziep-RSJP50 Signature & Date: 25 Nov 2011
Die Size (in NPI PRQE Approval Signature Nurazah Ahmad
mm) 4.2693x4.2438 NPI PRQE: Gary Westerman/ Nurazah Ahmad- R63712 & Date: 25 Nov 2011

Part LOT A
Operating WEMHA1HVW400 CAB Approval 11251986M
Temp. Grade: -40C to +125C Trace/DateCode: PSQ Q AA1136C Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale KLM unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST J=JESD22 (Surface Mount Devices Only - PC required Note 1 including LotID-(#Rej/SS) Comments or Generic Data
for THB, HAST, AC, UHST, TC, PC+PTC) spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as Pass Use parts with BI for all package
A113 PC required for SMDs only. required per test conditions. data, if there is a BI flow option.
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification)
Generic data:
Q214026, 68HC908GZ60
PC
(0N55E), TSMC2: 0/ 693
Q190677, 68HC908AZ60A CHD:
0/693

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 0 0 Pass Generic data:
A101 PC before HAST (for SMDs only): Required Q190677, 68HC908AZ60A CHD:
A110 HAST = 130C/85%RH for 96 hrs 0/231
Bias = Max Vdd (or justify othrwise)
Timed RO of 48hrs. MAX Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231

AC JESD22- Autoclave (AC): TEST @ R 77 0 0 Pass Generic data:

A102 PC before AC (for SMDs only): Required Q190677, 68HC908AZ60A CHD:
A118 AC = 121C/100%RH/15 psig for 96 hrs 0/231
Timed RO of 2-48hrs. MAX
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 231
TC JESD22- Temperature Cycle (TC): TEST @ H 77 0 0 Pass Generic data:
A104 PC before TC (for SMDs only): Required Q190677, 68HC908AZ60A CHD:
AEC Q100- 0/231 WP: 0/15, Min>3
Appendix 3 TC = -65C to 150C for 500 cycles
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231
WP: Min > 5gram
HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RH 77 0 0 Pass Generic data:
A103 Q190677, 68HC908AZ60A CHD:
AEC Grade 1: +150C for 1000 hours or +175C for 500 hours 0/77@150C, 1008Hrs

Timed RO = 96hrs. MAX

Q214026, 68HC908GZ60

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS)
Comments or Generic Data
spares NA=Not Applicable

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 1 80 Lot 1: 0/80 Generic TSMC2 Data:
A108
Ta = 125C for 168hrs Q212936 908AZ60A 0/231
Bias = 6.0V Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
Timed RO of 96hrs. MAX

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RH 611 1 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs or 150C for 24 hrs
Q214205, GZ60(TSMC2,
Bias = 6.0V LQFP48): 0/1833
ELFR
Timed RO of 48 hrs MAX

AEC Q100-005 NVM Endurance at Cold, Data Retention, and Operational Life TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
(EDR):
Devices incorporating NVM shall receive 'NVM endurance Q212936 908AZ60A 3lots 3 77
preconditioning'(W/E cycling). Test R, H, C after W/E cycling. GZ60 48 LQFP Auto Qual
Q214025, GZ60: 0/231
EDR
10K W/E @ -40oC and 5V followed by 150oC for 168hrs DRB

Timed RO of 96hrs. MAX

FORMPPAP004XLS 1 of 2 Freescale Rev S

 Freescale PN: 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
Part Name: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS)
Comments or Generic Data
spares NA=Not Applicable

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
from minimum 5 units Q190677, 68HC908AZ60A CHD:
Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
2011 Cond. C or D from minimum 5 units Q190677, 68HC908AZ60A CHD:
Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk > 1.67

SD JESD22- Solderability; >95% lead coverage of critical areas 15 0 0

B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test.
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0

B100 PD per FSL 98A drawing
DIMENSION Dimensional (DIM):
AL PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATIO
N
SBS AEC-Q100-010 Solder Ball Shear (SBS): Cpk = or >1.67 10
Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, (5 balls from a min. of 10
Micro Lead Frame (but NOT Flip Chip). devices)
Two reflow cycles at MSL reflow temperature before shear.

LI JESD22- Lead Integrity (LI): No lead breakage or cracks 5

B105 Not required for surface mount devices; (10 leads from each of 5 parts)
Only required for through-hole devices.

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results Comments or Generic Data
TEST Note 1 including LotID-(#Rej/SS)
spares NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All Pass
For AEC, test software shall meet requirements of AEC-Q100-007.
TEST Testing performed to the limits of device specification in temperature and
limit value.

AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 1 12 Lot A:

JESD22-A114E Human Body Model Classification (HBM): 2KV min. 500V: 0/3
Jan 2007 Test @ 500/1000/1500/2000Volts 1000V: 0/3
HBM For AEC, see AEC-Q100-002 for classification levels. 1500V: 0/3
2000V: 0/3

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 1 9 Lot A:

or JESD22 Machine Model Classification m(MM): 200V min. 50V: 0/3
Test @ 50/100/200Volts 100V: 0/3
For AEC, see AEC-Q100-003 for classification levels 200V: 0/3
MM

AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 1 9 Lot A:

Charged Device Model Classification (CDM): All pins =/> 500V 250V: 0/3
CDM Test @ 250/500/750Volts 500V: 0/3
For AEC, see AEC-Q100-011 for classification levels. 750V: 0/3
Timed RO of 96hrs MAX.
JESD78 Latch-up (LU): TEST @ RH 6 1 6 Lot A: 0/6
plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.
AEC-Q100- Ta= 85oCMaximum operating temperature and room temp (Japan
LU 004 for AEC Customer base)
Vsupply = 5.5V Maximum operating voltage

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 1 5 Pass Generic TSMC2 Data:
Freescale 48A
spec For AEC, Q212936 908AZ60A 3lots 3 77
Cpk target > 1.67 Q214026 68HC908GZ60
(0N55E), TSMC2 0/231

ED

For AEC, AEC- Fault Grading (FG) FG shall be = or > 90% for qual units
FG Q100-007

For AEC, AEC- Characterization (CHAR):

Q003 Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC- Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 0 0

Q100-006 155C, 2.0 min, +400/-400 V
GL (for
Per AEC Q100 Rev G, this test is performed for information only.
information
Timed RO of 96 hrs MAX.
only)
For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C) and
retest; recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 0 0
Radiated (see AEC Q100 Appendix 5 for test applicability; done on case-by-case 150KHz - 1GHz
EMC Emissions basis per customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)
Set

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96

80 QFP Package Qual Vehicles

Die Area
Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code Pkg Description Mold Description EPOXY Description Wire Description
(mm2)
QFP 64 DA SUMITOMO CRM-
214026 0N55E 68HC908GZ60 22.00 6057 MC HITACHI 9200HF10M 25um
14*14*2.2P0.8 1064MBL
QFP 80 DA SUMITOMO CRM-
190677 M73Y (CHD) 908AZ60A 28.97 6019 14*14*2.2P0.65 MC HITACHI 9200HF10M 25um
1064MBL

Revision
Revision Revision Date Description Approver
1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Updated NVM requirements and ELFR generic data allowance L. Peters
4.0 23-Sep-11 Edit the Au wire using1 mils wire- Qual Nurazah Ahmad
5.0 12-Oct-11 Add ELFR (from 0 to 3 lots) and HTOL increase from 168 to 412 hrs since GZ60 qualification risk to re-use the data and update EMC test not required Nurazah Ahmad
6.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
7.0 9-Nov-11 pass and this will eliminate package qual for 64QFP and 80QFP. EDR and HTOL was eliminated as well by re-use a data from GZ60. Edit Program and Read D Nurazah Ahmad

8.0 23-Nov-11 Final Report Nurazah Ahmad

FORMPPAP004XLS 2 of 2 Freescale Rev S

 IMM Qualification Results Summary
Objective: 68HC908LK24 TSMC2 FAB Qualification
Freescale 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
PN: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below
Part Name:
Technology:
Package: U050FXXD(85%UDRSST)/64QFP Design Engr: Not applicable QUARTZ Tracking #: 214944
Assembly / (Signature/Date shown
Final Test TSMC2-FAB/KLM /KLM Product Engr: Ching Wan Yin-B04720 below may be electronic)
PPE Approval (for
Maskset#: DIM/BOM results) Tran Ziep-RSJP50
Rev#: N85E Prod. Package Engr: Tran Ziep-RSJP50 Signature & Date: 25 Nov 2011
Die Size (in NPI PRQE Approval Signature Nurazah Ahmad
mm) 4.2693x4.2438 NPI PRQE: Gary Westerman/ Nurazah Ahmad- R63712 & Date: 25 Nov 2011
Part CAB Approval 11251986M
Operating -40C to +85C Trace/DateCode: Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale KLM unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
Comments or Generic
TEST J=JESD22 (Surface Mount Devices Only - PC required Note 1 including LotID-(#Rej/SS)
Data
for THB, HAST, AC, UHST, TC, PC+PTC) spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as Pass Use parts with BI for all
A113 PC required for SMDs only. required per test conditions. package data, if there is a BI
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification) flow option.

Generic data:
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 693
PC Q190677, 68HC908AZ60A
CHD: 0/693

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 0 0 Pass Generic data:
A101 PC before HAST (for SMDs only): Required Q190677, 68HC908AZ60A
A110 HAST = 130C/85%RH for 96 hrs CHD: 0/231
Bias = Max Vdd (or justify othrwise)
Timed RO of 48hrs. MAX Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231

AC JESD22- Autoclave (AC): TEST @ R 77 0 0 Pass Generic data:

A102 PC before AC (for SMDs only): Required Q190677, 68HC908AZ60A
A118 AC = 121C/100%RH/15 psig for 96 hrs CHD: 0/231
Timed RO of 2-48hrs. MAX
Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/ 231
TC JESD22- Temperature Cycle (TC): TEST @ HC 77 0 0 Pass Generic data:
A104 PC before TC (for SMDs only): Required Q190677, 68HC908AZ60A
AEC Q100- CHD: 0/231 WP: 0/15,
Appendix 3 TC = -65C to 150C for 500 cycles Min>3

Q214026, 68HC908GZ60
(0N55E), TSMC2: 0/231
WP: Min > 5gram
HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RHC 77 0 0 Pass Generic data:
A103 Q190677, 68HC908AZ60A
AEC Grade 1: +150C for 1000 hours or +175C for 500 hours CHD: 0/77@150C, 1008Hrs

Timed RO = 96hrs. MAX

Q214026, 68HC908GZ60

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS) Comments or Generic
spares NA=Not Applicable Data

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
A108
Ta = 125C for 168hrs Q212936 908AZ60A 0/231
Bias = 6.0V Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
Timed RO of 96hrs. MAX
Q214945 68HC908LK24
(N85E) 80 QFP, 0/77

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RHC 611 0 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs or 150C for 24 hrs
Q214205, GZ60(TSMC2,
Bias = 6.0V LQFP48): 0/1833
ELFR
Timed RO of 48 hrs MAX

AEC Q100-005 NVM Endurance at Hot , Data Retention, and Operational Life TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
(EDR):
Devices incorporating NVM shall receive 'NVM endurance Q212936 908AZ60A 3lots 3
preconditioning'(W/E cycling). Test R, H, C after W/E cycling. 77
GZ60 48 LQFP Auto Qual
Q214025, GZ60: 0/231
EDR
10K W/E @ 125oC and 5V followed by 150oC for 168hrs DRB

Timed RO of 96hrs. MAX

FORMPPAP004XLS 1 of 2 Freescale Rev S

 Freescale 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
PN: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below
Part Name:
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS) Comments or Generic
spares NA=Not Applicable Data

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
from minimum 5 units Q190677, 68HC908AZ60A
CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk >
1.67

WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
2011 Cond. C or D from minimum 5 units Q190677, 68HC908AZ60A
CHD: Cpk >1.67

Q214026, 68HC908GZ60
(0N55E), TSMC2: Cpk >
1.67
SD JESD22- Solderability; >95% lead coverage of critical areas 15 0 0 Not required
B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test.
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0 Not required

B100 PD per FSL 98A drawing
DIMENSION Dimensional (DIM): 0 0 Not required
AL PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATI
ON
SBS AEC-Q100-010 Solder Ball Shear (SBS): Cpk = or >1.67 10 0 0 Not required
Performed on all solder ball mounted packages e.g. PBGA, Chip (5 balls from a min. of 10
Scale, Micro Lead Frame (but NOT Flip Chip). devices)
Two reflow cycles at MSL reflow temperature before shear.

LI JESD22- Lead Integrity (LI): No lead breakage or cracks 5 0 0 Not required

B105 Not required for surface mount devices; (10 leads from each of 5
Only required for through-hole devices. parts)

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results Comments or Generic
TEST Note 1 including LotID-(#Rej/SS) Data
spares NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All 0 0 Pass Generic TSMC2 Data:
For AEC, test software shall meet requirements of AEC-Q100-007.
TEST Testing performed to the limits of device specification in temperature Q214945 68HC908LK24
and limit value. (N85E) 80 QFP, Pass all
voltage level.
AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
JESD22-A114E Human Body Model Classification (HBM): 2KV min.
Jan 2007 Test @ 500/1000/1500/2000Volts Q214945 68HC908LK24
HBM For AEC, see AEC-Q100-002 for classification levels. (N85E) 80 QFP, Pass all
voltage level.

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
or JESD22 Machine Model Classification m(MM): 200V min.
Test @ 50/100/200Volts Q214945 68HC908LK24
MM For AEC, see AEC-Q100-003 for classification levels. (N85E) 80 QFP, Pass all
voltage level.

AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
Charged Device Model Classification (CDM): All pins =/> 500V
Test @ 250/500/750Volts Q214945 68HC908LK24
For AEC, see AEC-Q100-011 for classification levels. (N85E) 80 QFP, Pass all
CDM
Timed RO of 96hrs MAX. voltage level.

JESD78 Latch-up (LU): TEST @ RH 6 0 0 Pass Generic TSMC2 Data:

plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for
AEC-Q100- AEC. Q214945 68HC908LK24
LU 004 for AEC Ta= 85oCMaximum operating temperature and room temp (Japan (N85E) 80 QFP, 0/6
Customer base)
Vsupply = 5.5V Maximum operating voltage

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 0 0 Pass Generic TSMC2 Data:
Freescale 48A
spec For AEC, Q212936 908AZ60A 3lots 3
Cpk target > 1.67 77
Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
ED
Q214945 68HC908LK24
(N85E) 80 QFP, 0/6

For AEC, AEC- Fault Grading (FG) FG shall be = or > 90% for qual units N/A N/A Not required
FG Q100-007

For AEC, AEC- Characterization (CHAR): N/A N/A Not required

Q003 Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC- Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 N/A N/A Not required
Q100-006 155C, 2.0 min, +400/-400 V
GL (for
Per AEC Q100 Rev G, this test is performed for information only.
information
Timed RO of 96 hrs MAX.
only)
For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C)
and retest; recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 0 0 Not required
Radiated (see AEC Q100 Appendix 5 for test applicability; done on case-by-case 150KHz - 1GHz
EMC Emissions basis per customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)
Set

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96
214945 N85E 68HC908LK24 85% UDRSST TSMC2FAB 18.12

80 QFP Package Qual Vehicles

Die Area
Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code Pkg Description Mold Description EPOXY Description Wire Description
(mm2)
QFP 64 DA SUMITOMO CRM-
214026 0N55E 68HC908GZ60 22.00 6057 MC HITACHI 9200HF10M 25um
14*14*2.2P0.8 1064MBL
QFP 80 DA SUMITOMO CRM-
190677 M73Y (CHD) 908AZ60A 28.97 6019 14*14*2.2P0.65 MC HITACHI 9200HF10M 25um
1064MBL

Revision
Revision Revision Date Description Approver
1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Updated NVM requirements and ELFR generic data allowance L. Peters
4.0 23-Sep-11 Edit the Au wire using1 mils wire- Qual vehilce Nurazah Ahmad
5.0 12-Oct-11 Add ELFR (from 0 to 3 lots) and HTOL increase from 168 to 412 hrs since GZ60 qualification risk to re-use the data and update EMC test not required Nurazah Ahmad
6.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
7.0 9-Nov-11 64QFP package for GZ60 pass and this will eliminate package qual for 64QFP and 80QFP. EDR and HTOL was eliminated as well by re-use a data from GZ60. Edit Program and Nurazah Ahmad
Read Distrub requirement as well.
8.0 23-Nov-11 Final Qual Report Nurazah Ahmad

FORMPPAP004XLS 2 of 2 Freescale Rev S

 IMM Qualification Results Summary
Objective: 68HC908LK24 TSMC2 FAB Qualification
Freescale 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
PN: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below
Part Name:

Technology:
Package: U050FXXD(85%UDRSST)/V64LQFP Design Engr: QUARTZ Tracking #: 214550
Assembly / (Signature/Date shown
Final Test TSMC2-FAB/TJN/TJN Product Engr: Ching Wan Yin-B04720 (KLM) below may be electronic)
PPE Approval (for
Maskset#: DIM/BOM results) Tran Ziep-RSJP50
Rev#: N85E Prod. Package Engr: Ziep Tran/512-895-7922 Signature & Date: 25 Nov 2011
Die Size (in NPI PRQE Approval Signature Nurazah Ahmad
mm) 4.2693x4.2438 NPI PRQE: Gary Westerman/ Nurazah Ahmad- R63712 & Date: 25 Nov 2011
Part CAB Approval 11251986M
Operating -40C to +85C Trace/DateCode: Signature & Date: 25 Nov 2011

Customer Approval
Signature & Date: Not applicable

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

This testing is performed by the Freescale TJN unless otherwise noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
Comments or Generic
TEST J=JESD22 (Surface Mount Devices Only - PC required Note 1 including LotID-(#Rej/SS)
Data
for THB, HAST, AC, UHST, TC, PC+PTC) spares NA=Not Applicable
JESD22- Preconditioning (PC) : TEST @ RH All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as Pass Generic Data:
A113 PC required for SMDs only. required per test conditions. Q205378-68HC908LK24
J-STD-020 MSL 3 @ 260C, +5/-0C (or document otherwise with justification) M37Z CHD 0/693

Q214560, 68HC908LJ24
PC (N86E) TSMC2; 0/231

HAST JESD22- Highly Accelerated Stress Test (HAST): TEST @ RH 77 0 0 Pass Generic Data:
A101 PC before HAST (for SMDs only): Required Q205378-68HC908LK24
A110 HAST = 130C/85%RH for 96 hrs M37Z CHD- 0/231
Bias = Max Vdd (or justify othrwise)
Timed RO of 48hrs. MAX Q214560, 68HC908LJ24
(N86E) TSMC2; 0/77

AC JESD22- Autoclave (AC): TEST @ R 77 0 0 Pass Generic Data:

A102 PC before AC (for SMDs only): Required Q205378-68HC908LK24
A118 AC = 121C/100%RH/15 psig for 96 hrs M37Z CHD- 0/231
Timed RO of 2-48hrs. MAX
Q214560, 68HC908LJ24
(N86E) TSMC2; 0/77
TC JESD22- Temperature Cycle (TC): TEST @ HC 77 0 0 Pass Generic Data:
A104 PC before TC (for SMDs only): Required Q205378-68HC908LK24
AEC Q100- M37Z CHD- 0/231
Appendix 3 TC = -65C to 150C for 500 cycles
Q214560, 68HC908LJ24
(N86E) TSMC2; 0/77
HTSL JESD22- High Temperature Storage Life (HTSL): TEST @ RHC 77 0 0 Pass Generic Data:
A103 Q205378-68HC908LK24
AEC Grade 1: +150C for 1000 hours or +175C for 500 hours M37Z CHD- 0/77

Timed RO = 96hrs. MAX Q214560, 68HC908LJ24

(N86E) TSMC2; 0/77

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS) Comments or Generic
spares NA=Not Applicable Data

HTOL JESD22- High Temperature Operating Life (HTOL): TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
A108
Ta = 125C for 168hrs Q212936 908AZ60A 0/231
Bias = 6.0V Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
Timed RO of 96hrs. MAX
Q214945 68HC908LK24
(N85E) 80 QFP, 0/77

AEC Q100-008 Early Life Failure Rate (ELFR): TEST @ RH(C) 611 0 0 Pass Generic TSMC2 Data:
AEC Ta = 125C for 48 hrs or 150C for 24 hrs
Q214205, GZ60(TSMC2,
Bias = 6.0V LQFP48): 0/1833
ELFR
Timed RO of 48 hrs MAX

AEC Q100-005 NVM Endurance at Hot , Data Retention, and Operational Life TEST @ RHC 77 0 0 Pass Generic TSMC2 Data:
(EDR):
Devices incorporating NVM shall receive 'NVM endurance Q212936 908AZ60A 3lots 3
preconditioning'(W/E cycling). Test R, H, C after W/E cycling. 77
GZ60 48 LQFP Auto Qual
Q214025, GZ60: 0/231
EDR
10K W/E @ 125oC and 5V followed by 150oC for 168hrs DRB

Timed RO of 96hrs. MAX

FORMPPAP004XLS 1 of 2 Freescale Rev S

 Freescale 68HC908LK24 Customer Name(s): Name or "Varies" Plan or Results:
PN: "908LK24" PN(s): PB or "Varies" Revision # & Date: See Revision History Below
Part Name:
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results
TEST Note 1 including LotID-(#Rej/SS) Comments or Generic
spares NA=Not Applicable Data

WBS AEC Q100-001 Wire Bond shear Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
from minimum 5 units Q205378-68HC908LK24
M37Z CHD Cpk >1.67

Q214560, 68HC908LJ24
(N86E) TSMC2; Cpk >1.67

WBP MilStd883- Wire Bond Pull Cpk = or > 1.67 30 bonds 0 0 Pass Generic Data:
2011 Cond. C or D from minimum 5 units Q205378-68HC908LK24
M37Z CHD Cpk >1.67

Q214560, 68HC908LJ24
(N86E) TSMC2; Cpk >1.67

SD JESD22- Solderability; >95% lead coverage of critical areas 15 0 0 Not required

B102 8hr. Steam age (1 hr. for Au-plated leads) prior to test.
If production burn-in is done, samples must also undergo burn-in.

PD JESD22- Physical Dimensions(PD): Cpk = or > 1.67 10 0 0 Not required

B100 PD per FSL 98A drawing
DIMENSION Dimensional (DIM): Not required
AL PPE to verify PD results against valid 98A drawing.
& BOM Verification (BOM):
BOM PPE to verify qual lot ERF BOM is accurate.
VERIFICATI
ON
SBS AEC-Q100-010 Solder Ball Shear (SBS): Cpk = or >1.67 10 0 0 Not required
Performed on all solder ball mounted packages e.g. PBGA, Chip (5 balls from a min. of 10
Scale, Micro Lead Frame (but NOT Flip Chip). devices)
Two reflow cycles at MSL reflow temperature before shear.

LI JESD22- Lead Integrity (LI): No lead breakage or cracks 5 0 0 Not required

B105 Not required for surface mount devices; (10 leads from each of 5
Only required for through-hole devices. parts)

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

STRESS Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results Comments or Generic
TEST Note 1 including LotID-(#Rej/SS) Data
spares NA=Not Applicable

Freescale 48A Pre- and Post Functional / Parametrics (TEST): 0 Fails All All All Pass
For AEC, test software shall meet requirements of AEC-Q100-007.
TEST Testing performed to the limits of device specification in temperature
and limit value.

AEC-Q100-002 / ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
JESD22-A114E Human Body Model Classification (HBM): 2KV min.
Jan 2007 Test @ 500/1000/1500/2000 Volts Q214945 68HC908LK24
HBM For AEC, see AEC-Q100-002 for classification levels. (N85E) 80 QFP, Pass all
voltage level.

AEC-Q100-003 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
or JESD22 Machine Model Classification m(MM): 200V min.
Test @ 50/100/200 Volts Q214945 68HC908LK24
For AEC, see AEC-Q100-003 for classification levels. (N85E) 80 QFP, Pass all
MM
voltage level.

AEC-Q100-011 ElectroStatic Discharge/ TEST @ RH 3 units per Voltage level 0 0 Pass Generic TSMC2 Data:
Charged Device Model Classification (CDM): All pins =/> 500V
Test @ 250/500/750Volts Q214945 68HC908LK24
CDM For AEC, see AEC-Q100-011 for classification levels. (N85E) 80 QFP, Pass all
Timed RO of 96hrs MAX. voltage level.

JESD78 Latch-up (LU): TEST @ RH 6 0 0 Pass Generic TSMC2 Data:

plus Test per JEDEC JESD78 with the AEC-Q100-004 requirements for
AEC-Q100- AEC. Q214945 68HC908LK24
LU 004 for AEC Ta= 85oCMaximum operating temperature and room temp (Japan (N85E) 80 QFP, 0/6
Customer base)
Vsupply = 5.5V Maximum operating voltage

AEC-Q100-009, Electrical Distribution (ED) TEST @ RHC 5 0 0 Pass Generic TSMC2 Data:
Freescale 48A
spec For AEC, Q212936 908AZ60A 3lots 3
Cpk target > 1.67 77
Q214026 68HC908GZ60
(0N55E), TSMC2 0/231
ED
Q214945 68HC908LK24
(N85E) 80 QFP, 0/6

For AEC, AEC- Fault Grading (FG) FG shall be = or > 90% for qual units Not required
FG Q100-007

For AEC, AEC- Characterization (CHAR): Not required

Q003 Ony performed on new technologies and part families per AEC Q003.
CHAR

For AEC, AEC- Electro-Thermally Induced Gate Leakage (GL): TEST @ R 6 0 0 Not required
Q100-006 155C, 2.0 min, +400/-400 V
GL (for
Per AEC Q100 Rev G, this test is performed for information only.
information
Timed RO of 96 hrs MAX.
only)
For all failures, perform unbiased bake (4hrs/125C, or 2hrs/150C)
and retest; recovered units are GL failures.
SAE J1752/3 - Electromagnetic Compatibility (EMC) <40dBuV 0 0 0 Not required
Radiated (see AEC Q100 Appendix 5 for test applicability; done on case-by-case 150KHz - 1GHz
EMC Emissions basis per customer/Freescale agreement)

Generic Data List for Die Qual:

Quartz # TSMC2 Mask Product-Qual Description / Part Number(s) Technology Fab Die Size (mm2)
Set

214026 0N55E 68HC908GZ60 85% UDRSST TSMC2FAB 22.00

212936 3K85K 908AZ60A 85% UDRSST TSMC2FAB 28.96
214945 N85E 68HC908LK24 85% UDRSST TSMC2FAB 18.12

80 QFP Package Qual Vehicles

Die Area
Quartz# TSMC2 Maskset Product-Qual Description/Part Number (s) Pkg Code Pkg Description Mold Description EPOXY Description Wire Description
(mm2)
LQFP 64 MC HITACHI 9200HF10M DA SUMITOMO CRM-
214560 N86E 68HC908LJ24 18.10 8426 25um
10*10*1.4P0.5 1064MBL
LQFP 64 MC HITACHI 9200HF10M DA SUMITOMO CRM-
205378 M37Z 68HC908LJ24 18.10 8426 25um
10*10*1.4P0.5 1064MBL

Revision
Revision Revision Date Description Approver
1.0 1-Jun-11 Generated preliminary qual plans. G. Westerman
2.0 13-Jun-11 Docuemnted package qual and generic data requirements L. Peters
3.0 30-Jun-11 Updated NVM requirements and ELFR generic data allowance L. Peters
4.0 23-Sep-11 Edit the Au wire using1 mils wire- Qual Nurazah Ahmad
5.0 12-Oct-11 Add ELFR (from 0 to 3 lots) and HTOL increase from 168 to 412 hrs since GZ60 qualification risk to re-use the data and update EMC test not required Nurazah Ahmad
6.0 13-Oct-11 Edit ELFR to one lot with 611 unit and HTOL 1 lot with 412hrs with equivalent to 10 years applicstion Nurazah Ahmad
7.0 9-Nov-11 64QFP package for GZ60 pass and this will eliminate package qual for 64QFP and 80QFP. EDR and HTOL was eliminated as well by re-use a data Nurazah Ahmad
from GZ60. Edit Program and Read Distrub requirement as well.
8.0 23-Nov-11 Final Report Nurazah Ahmad

FORMPPAP004XLS 2 of 2 Freescale Rev S