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  • CFD Simulations of Heat Transfer From A Heated Module in An

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    Mahesh J Rao
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    CFD,Heat transfer,

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    CFD Simulations of Heat Transfer From a Heated Module in an

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    235 Ansichten9 Seiten

    CFD Simulations of Heat Transfer From A Heated Module in An

    Hochgeladen von

    Mahesh J Rao
    CFD,Heat transfer,

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Als PDF herunterladen oder online auf Scribd lesen
    Markieren Sie unangemessene Inhalte
    von 9
    CED Simulations of Heat Transfer from a Heated Modul Experiments and a Parametric Study Masud Bebnia’, Wataru Nakayama”, and Jeffrey Wang” * Schoo! of Mechanical and Manufacturing Engineering ‘The University of New South Wales, Sydney 2052, Australia an Air Stream: Comparison with ‘** CALCE EPRC, University of Maryland, College Park, MD 20742,USA Abstract - In the last decade or so CFD simulations have ‘become more and more widely used in studies of electronic cooling. Validation of these simulations has been considered to be very important. Nakayama and Park have performed a series of experiments with the aim of measuring the heat ‘wansfer and flow field in a simple geometry of a heated chip in anair steam, They observed a number of complex features in both the flow field and heat transfer behavior. In this study, their experimental geometry has been used to simulate the flow and temperature fields in a parallel-plate channel with a Iheated block mounted on the floor. The channel inlet flow velocity has been varied between 1 and 7m/s. Various turbulence models have been tested, and the effect of the channel inlet flow on the heat transfer rate has been ‘determined by considering both a uniform and fully-developed condition, The substrate adiabatic heat transfer coefficient is also numerically determined. The results indicate that the flow in the vicinity of the module is three-dimensional, and exhibits flow separation and vortex formation, hence leading to.a complex distribution of the local heat transfer coefficient fon the substrate, The air temperature next 10 the floor is strongly affected by the heat transfer from the block, which leads to the formation of a thermal wake downstream of it, ‘The experimental dala is used to validate the CFD predictions ind the agreement for some parameters is shown to be INTRODUCTION ‘The evolution of the electronics has led to a growth of this industry and utilization of microprocessors in numerous applicaions. This in tum has made the microelectronic packaging an extremely important technology with a very Tapid Jace of evolution and diversification. The market demands of the information age are such that the cycle of product must become ever-increasingly shorter. ‘To meet such stringent demands, highly efficient tools are required forthe design and manufacturing. To this end, a host of techniques, design tools and software have been developed and are now indispensable tools for meeting the marketplace ‘demands. ‘These also need to be continuously improved and upgraded which leads to computers of today breeding Computers and other electronic devices of the next generation. It is perhaps fair to say that, the development and application of software tools in the electrical aspects of packaging has ‘been more advanced than those dealing with cooling problems. Those programs to deal with cooling problems ‘made relatively recent arivals inthe industry design room. With the advent of Computational Fluid Dynamics (CFD) in the recent years, flow and heat tansfer computations have 0-703-447589810 0001908 EEE 143 become quite readily possible. In particular, with the recent ‘nuoduction of high power workstations and personal computers the cost of such computations has been drastically reduced and as a result many CFD codes have come into the market. More recently, such computations have become very popular in the application area of cooling of electronic ‘components. In fact, this popularity has led to several purpose ‘developed CFD codes coming into the market which are specifically tailored for use by heat transfer engineers in the electronic industry. ‘The heat dissipation from gatearray chips continuously and sharply increased in the 1980's and this demanded more efficient and highly optimized cooling techniques. Although, this chip power tend halted in the 1990's (1), the circuit integration and size reduction of the systems reinforced the importance of thermal management and development of tools for this purpose (2]. From a modeling point of view, the progress of circuit integration technology as worked to simplify the geometric situation on printed circuits. In the ultimate situation all power-consuming functions are concentrated in a single module. To some extent, this has already become a reality in certain small systems, where a ‘micro-processor chip is a single intense heat source on a ‘board, and it is surrounded by memory modules which dissipate far less heat than the former. This simplification does not necessarily make the problem solution any simpler, a a concentrated heat source leads to an increase in reliance ‘on the heat spreading function ofthe substrate which requires ‘a conductive-convective conjugate analysis technique and this {ntum increases the numberof design parameters and solution time. ‘The problem of cooling of heated modules has been widely studied. In particular, in the last few years a number of researchers have used CFD w study various aspects of the flow and heat transfer in this geometry. An extensive survey of literature is not intended here, however some of the more recent studies [3,4 and 5] refer t0 previous relevant research. Some researchers have also compared their numerical simulations with experiments. One of the recent studies inthis category is by Anderson [6] who used a commercial CFD code to simulate a row of heated modules. Although, a reasonable agreement forthe adiabatic heat transfer coefficient Of the module was obtained, the supsrposition kemel function (hich is a measure of how hot one module becomes due 10 heating of another module) was as much as 50% higher than the experimental results. This was attributed to the fact that the code did not appropriately resolve the amount of cross channel mixing. The author notes thot this aspect needs to be 1998 interSoiety Conference oa Thermal Phesomest further studied and that obtaining accurate results for realistic applications may require a prohibitive number of grid points, ‘The relatively recent adoption of CFD simulation studies in electronic cooling applications has prompted some interes in validation of these codes for these types of problems. In ‘general, validation and benchmarking of CFD codes has been ‘an on-going research area attracting a Jot of attention from both users and code developers. To this end, a number of classical problems have been adopted and purpose-developed experimental databases have been constructed. for this purpose. One of the more recent reports on the validation of commercial CFD codes is presented by Freitas [7]. Benchmarking and validation for electronic cooling applications is also of great importance because of the ‘complexity of physical phenomena. This has been recognized as very important as evidenced by a number of recent publications (e.g. ASME HTD-Vol. 255 [8] and ASME HTD- Vol. 292 [9}) and panel discussions in conferences (e.g. Iherm’96, ASME-WAM'96 and ASME National Heat ‘Transfer Conference’97). One of these cases is proposed by Nakayama and Park [10] who studied a block (simulated module) mounted on the floor (substrate) of a rectangular channel, They developed a novel synthesized approach by considering the conjugate heat tansfer in two module/floor combinations, ie. a heated module on an adiabatic floor and ‘an adiabatic modale on a heated floor. ‘They also pesfoomed detailed measurements of velocity and temperature of air and cenain key features of their data set can be employed to test CED codes used for thermal design analysis. The details of heir experimental measurements and analysis can be found ‘elsewhere {10 and 11]. In our study, we have considered the problem of air cooting of ‘a heated module located on the floor of an adiabatic rectangular channel. “The geometry is similar to that of Nakayama and Park [10] s0 that comparison with their experimental measurements can be made, ‘Three-dimensional turbulent flow simulations are performed for a range of channel inlet velocities, Particular attention has been focussed fon the local flow and heat transfer behavior in the vicinity of the module. The local heat tansfer coefficient on the module land the local adiabatic heat transfer cooffcient on the floor hhave been computed. ‘The effects ofthe channel geometry and inlet condition on the heat transfer and flow have been ‘quantified. The results are useful in determining the merits and shortcomings of CFD simulations. Although, a conjugate Conduction-convection analysis has not been considered here, an extension of this stdy to property account for conjugate effects in the future is essential, 1. THE PROBLEM ‘Nakyama and Park performed their experiments using a Block (Gimulated module) mounted on the floor (substrate) of & parallel-plate channel. Heat was genorated uniformly over the Dottom surface of the block at the sate Qu and a part of the ‘heat generation was transferred from the Block's surface to the air flow over the block, called direct heat transfer and denoted 8 Q,. The rest, Q, {Gund its way through the block support, ‘the channel floor, then from the floor surface to the airflow in 144 the environment. ‘The bottom of the channel was made adiabatic, 50 that all Q, ended up inthe ar low in te channel. In prctical situations. seen in electonic equipment Q, ‘amounts 10 a substantial fraction of the total heat generation Qu. A dicct estimation of Q, is challenging ask. Fist of alll the flow near the module is thrs-dimensional and involves flow separation and vonex fomation, hence the Tocal heat transfer coefficient onthe floor has a complex distribution. Besides, the air wmperatue next 10 tho floor Surface is affected by the reas of Q, fom the block, taney, the covering ofthe floor by thermal wake originated from the block. ‘The two heat flow components, Q, and Q,, a coupled, and the partion of Q, into Q, and Q, is function ofthe block dimension, the air velocity the them resistance of the block support, the thickness ‘and thermal conductivity of the floor. The block support is a mode ofthe clectrcal interconnects between the electronic module and the Wiring subswate, henes, its thermal conductance varies with the numberof interconiecis and the material and dimensions ofthe eleecal leads. A high thermal conductance can be realized where adhesive or thermal paste is insemed at the ‘odule/ubsits interface in order 10 enhance heat transfer through the substrate, Meanwhile, te wiring substrate may have a varity of thermal conductance depending on the ‘ising capacity and the materials of electrical conductors and insulation matrix, Therefore, possible combinations of relevant parameters amount to avery large numer. ‘The computing time and memory capacity needed for the solution of a conjugate heat transfer problem are far greater than those for the solution of a non-conjugale counterpart. ‘Nakayama and Park proposed a scheme by which the demand on the computational or experimental resource can be reduced drastically. Their method of heat transfer estimation uses two basic quantities, the themnal wake function, F,, and the adiabatic heat transfer coefficient, hy, They determined these parameters experimentally using two combinations of block ‘and floor, a heated block on an adiabatic floor (HB/AF) and an ‘adiabatic’ block on a heated floor (AB/HF). The HB/AF experiment produced the information about F-. They used a copper block with a square footprint area of 31x 31 mm’, and a height of 7 mm which was located on the centerline of a parallel-plate channel whose cross section was 320 mm wide nd20 mm high. Their wind tunnel was a suction tne, with a bellsmouth atthe entrance located 120mm upstream of the block. They performed detailed turbulent velocity measurements by a hot-wire snemometer and liquid crystal thermography produced the information on the local adiabatic floor temperature and heat transfer coefficient. ‘They took maximum care in the experiments to impose the necessary thermal boundary conditions as accurately as Possible. However, certain compromises and assumptions ‘were inevitable to ease the conduct of experiment. The basic assumption was that h, can be approximately detemnined on the uniform q, floor. “Namely, the thermal wake originated from the upstream area of the floor has negligible influence on. hh on the downstream area instead the thermal wake from the block prevails. Meanwhile, a rigorous definition of h needs situation where only a spot area of the floor is heated, and all, the rest is made adiabatic. To determine the distribution of hy 1098 tterSocity Conference on Thera Phenomena ofthis definition, the heater spot has 1o be moved around over the floor area. This is a prohibitively demanding task, if one attempts to find a distribution experimentally. Besides. the Theat leakage from the heater to the surrounding thermal insulation introduces greater uncertainty asthe heater is made smaller. Considering these experimental difficulties and ‘uncertainties, a recourse to CFD simulations for determining the effect of these parameters seems inevitable. Also, the CED simulation can be used to justify the assumptions involved in the experimental set-up. The heated-block on an adiabatic floor configuration was simulated here. IIL THE GEOMETRY AND CFD MODELING In dhe simulation of many experiment, it i recognized that cone can not possibly perform the computations in the same domain as the experiments were performed because of the fxtent of tbe experimental domain. Therefore, @ sound jdgment is required for the selection of the computational domain such that the important flow and heat transfer characteristics revealed bythe experiments are nt affected by the computational boundaries. Once a. reasonable computational domain is selected it needs to be tested by changing the dimensions to ascenain its adequacy. For the above experiment, with the relatively large physical dimension of the duct compared to the chp it was necessary 10 choose & reduced size computational domain of 271x131x20 mm. In this geometry, the module was equally distanced from the inlet and outlet ofthe channel (Le. 120mm each), ‘The domain size in the x and y directions were doubled and it was noted that this made very litle difference on the ow and thermal fields. The block was an isothermal body of 31%31x7 mn at 353K placed on the adiabatic channel floor and the cooling air Entered the channel at 293K. The symmetry plane through the channel centerline was employed to reduce the computational effor.. The geometry and computational domain is showa in Fig. 1 Gin tis igure the distance berween the inlet and the chip is reduced to 29mm as will be explained later). For the CFD simulation we used the commercial package FLUENT [12] which is based on a boundary fitted Gite volume technique. It is @ general-purpose code with an in- built mesh generation capability for rectangular geometries. ‘There are two versions of this package available, structred and unstructured grid. We used the structured gyid version to ‘Generate the grid and obtain preliminary solutions. Then, the {rd and solution was imported into the unstructured version to focally refine the gid for a more accurate resolution of high velocity and temperature gradients near the heated block. ‘There are thee turbulence model options (ie. ke, RNG and Reynolds stress). The primitive-varables form of the Navier- Stokes or Reynolds-averaged Navier-Stokes equations are integrated in each control volume adopting the divergence theorem. For accuracy, we used the QUICK diseretizaton of the convective terms (eat least second order accurate). In turbulent flow calculations, the wall boundary conditions are extremely important for the accurate prediction of heat transfer. The heat transfer rate in a turbulent flow is strongly affected by the wall treatment (e.g. see Ciofalo and Collins [13] and Djilali etal (14). FLUENT has the option of either 14 Fig. 1. The geometry and computational domain. using a wall function ora two-layer zonal model which allows integration to the wall. In general, for the computations with the empirically-derived wall functions, the frst grid point should be placed outside the viscous sublayer (ie. y>I1). ‘This may not be feasible in some flows as the ply location ofthis grid point may be well into the computational domain. Further, the integration all the way to the wall (Le. ‘two-layer model) imposes a severe restriction onthe near-wall arid spacing by requlring several grid points in the viscous sublayer witha careful placement of the nodes. ‘The first grid pint is to be placed such that y" is ofthe order of unity at this ocation [12], We ensured that this was the case in our ‘computations. AIL the simulations presented here were performed on an HP9000 workstation. They are all three-dimensional ‘computations using non-uniform meshes with the grid lines ‘being appropriately biased 10 resolve the sharp gradient regions (@. near the solid boundaries). In order to obtain accurate solutions, local grid modification was performed by using a hanging-mode refinement. The area around the ‘module was in particular important for the resolution of the local gradients, Tt was insured thatthe restriction on y" noted above was satisfied, in addition to obtaining no more than a (0.5% change in the average Nusselt number on the module when the grid was refined. As a result of this mesh sensitivity analysis we ended up using up 10 180,000 elements (the surface grid on the module is shown in Fig. 2). This is indeed a fine gid and ensures an accurate resolution of the local velocity and temperature gradients. We performed some ‘preliminary computations and compared the ke and RNG turbulence models, There was not a significant difference Detween the two models and we chose the RNG model as it performs somewhat better for recirculating flows (12). As noted previously, for this flow, wall-functions are not suitable (this has also been noted by Anderson [6]) and the two-layer ‘model was adopted which meant a very fine grid requirement around the module and on the channel floor. For all of our simulations reported here, we made sure that this requirement was satisfied. IV. RESULTS. In our simulations we varied the inlet air velocity in accordance with the experiments in the range of 1 wo Tm/s. 10098 terSociety Conerence on Thermal Phenomena Fig. 2. The surface grid on the module, One of the difficulties encountered in these types of simulations for comparison with experiments isthe imposition ff the correct boundary conditions. This is in particular imponant when the geometry of the experimental setup can not be exactly replicated, In most studies itis customary to use a uniform inlet velocity (i.e. a plug profile). In the experiments as noted above, a bell-mouth was used and due to the boundary layer development on this surface, the inlet velocity profile would not be a uniform one. In order to examine the effect of this inlet velocity condition we performed two types of computations: @) uniform inlet ‘velocity and (ii) fully-developed inlet velocity. For both of ‘these, te inlet turbulence level was set to the measared value (ie. 10%). For the second type, the exact computational domain was as given in Fig. 1. ‘In the second series, we ‘biained a fully-developed velocity profile by using the same cross-section channel but without te module, In this channel, we perforned a number of repetitive computations by using ‘the outlet velocity as the inlet tla fully-developed profile was achieved. Then, this profile was used as the inlet to a channel ‘with the module. Since in these simulations the inlet profile \was fully-developed the inlet section length was shortened 10 29mm (instead of 120mm) in order to save on computational fost. The effect of the duct exit was also examined by using fn outlet boundary condition and a pressure. boundary condition. The effect for the domain considered here on the flow and heat transfer was marginal and we adopted the outlet condition forthe computations performed. Fig. 3 shows the velocity vectors on the symmetry plane for the uniform and fully-developed inlet velocity profiles. In ‘both cases, the recirculation zone behind the block is noted. FFor the uniform inlet velocity the length of this zone was slightly longer. In the front of the module, in both cases a ‘small recirculating zone was observed, with the uniform inlet 146 fully developed flow inet Fig. 3. The computed velocity vectors on the symmetry plane for an inlet velocity of Tin, ») fully detveloped flow inlet Fig. 4. The computed velocity vectors on a plane parallel to the channel floor at Z2=3mm for aninlet velocity of im/s. indicating a larger zone with higher velocities. On top of the ‘module, a its leading edge a small separation zone was noted with the uniform inlet exhibiting a larger one. “This is more Clearly evident in Fig. 4 showing the velocity vectors on a plane parallel to the flow channel floor half-way through the ‘block. The horseshoe vortex downstream of the module ‘observed in the experiments is clearly evident. “The computed axial velocity profiles at two y locations of 50, ‘and 65.Smm for the uniform inlet condition of 3mys is ‘compared with the experimental measurements in Fig. §. The two locations corespond to the side of the chip and the centerline, respectively. It is noted that there is a reasonable ‘agreement between the predictions and measurements. The flow recirculation right upsream of the module is evident in the simulated results whereas it is not evident in the ‘measurements. Further, right downstream of the module the flow reversal predicted in the simulation is not clearly measured by the hot wire anemometer. This is perhaps 1996 nrSacety Conference on Therma Pheomesa Velocity ofthe chp). V 23 (ove) x Com Velocity ‘Y= 85.5 mm (conrne ofthe chip), V=3 (ra) 4 3 co Tea toe 0 cm Fig. 5. The velocity profil at two y locations fora uniform inlet velocity of 3 mis. Velocity Y= 80 mm (de ofthe chip), Vn (rv) ae 70 78 Velocity mm (Centarine of he ep). Vn 3 (vad im) (mm) (amy Fig. 6. The velocity of profiles at two y locations fora flly developed inlet velocity (3m). attibuted to the accuracy of the measurements in this region of low and reversed velocity. The velocity profile recovery

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