Beruflich Dokumente
Kultur Dokumente
REV 16
Networking
and Computing
Systems Group
Selector Guide
NCSG
Quarter 3, 2001
www.motorola.com/smartnetworks
DTThin Small Shrink Outline Package DWSmall Outline Integrated Circuit EMPlastic Quad (Gull Wing)
(TSSOP) (SOIC)
FCPlastic Quad (Gull Wing) FECeramic Quad (Gull Wing) FGPlastic Quad Flat Pack (PQFP)
SCALE 1:1
FTPlastic Flat Pack FUPlastic Quad Flat Pack PBLQFP Plastic
PUThin Quad Flat Pack (Plastic) PVTQFP (Plastic) RCPin Grid Array, Gold Lead Finish
2
MPC2605 MPC2605
MPC2605
ZP PACKAGE ZP PACKAGE
PBGA ZP PACKAGE PBGA
CASE 1138-01 PBGA CASE 1138-01
CASE 1138-01
ZCGTPAC ZPPlastic Ball Grid Array ZTPlastic Ball Grid Array
3
PowerPC Host Processors
Voltage
Apps Voltage
Device No. Package Speeds Rev Process IO/tol SOG MPG POG Description
Modr Core
(V)
4
PowerPC Host Processors (continued)
Voltage
Apps Voltage
Device No. Package Speeds Rev Process IO/tol SOG MPG POG Description
Modr Core
(V)
XPC180 100-Lead LM 50, 66 A 1.8 10% 3.3 V 10% Now Security co-processor which interfaces gluelessly to
(QFP) 8xx system bus and 8260 local bus. Ideal for DSL type
applications.
MPC190VP 252-Pin 33, 66 0 1.8 10% 3.3 V 10% Sampling High performance security co-processor that interfaces
MAPBGA Q3 2001 to 32- or 64-bit PCI.
MPC823 Integrated PowerPC Microprocessors for Portable Systems Standard Temperature: 0 to 95C Tj (Junction Temperature)
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC823 256-Lead ZT 66, 75, 81 B2T Portable System CZT66 0 60 300 PowerPC MPU for mobile computing.
MPU 256-lead ZT is the preferred package. 823E
XPC823 256-Lead ZC 66, 75, 81 B2 CZC66 0 90 420
has 16 KI cache and 8 KD cadre.
XPC832 256-Lead VF 66, 75, 81 B2 CVF66 0 60 300
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC850 256-Lead ZT 50, 66, 80 BU Low-Cost CZT50 0 60 300 Low cost, integrated PowerPC MPU with
XPC850DE 256-Lead ZT 50, 66, 80 BU Integrated CZT50 0 60 300 tailored Communication Processing Module
PowerPC MPU (CPM) including Universal Serial Bus (USB).
XPC850SR 256-Lead ZT 50, 66, 80 BU CZT50 0 60 300
XPC850DSL 256-Lead ZT 50 BU CZT50 0 60 300
For samples order: KXPC850SRZT80BT, KXPC850SRZT80BU, KXPC850DSLZT60BU
NOTE: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.
MPC855T and MPC857T Integrated PowerPC Communications Processors Standard Temperature: 0 to 95C Tj
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC855T 357-Lead ZP 50, 66, 80 D4 Low-Cost CZP50,66 0 44 220 Low cost, integrated PowerPC MPU with
Integrated tailored CPM including Fast Ethernet.
PowerPC MPU
For samples order: KXPC855TZP50D4, KXPC855TZP66D4, KXPC855TZP80D4
XPC857T 357-Lead ZP 50, 66, 80 0 Low-Cost CZP50,66 0 44 220 Low cost, integrated PowerPC MPU with
Integrated tailored CPM simultaneous operation of Fast
PowerPC MPU Ethernet (MII) and Parallel ATM (Utopia).
For samples order: KXPC857TZP50, KXPC8857TZP66, KXPC857TZP80
5
MPC860 and MPC862 Integrated PowerPC Communications Processors Standard Temperature: 0 to 95C Tj
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC860DE 357-Lead ZP 50,66,80 D4 PowerQUICC CZP50,66 0 44 220 PowerQUICC family with embedded
PowerPC MPU PowerPC superscalar MPUwith 4KB
XPC860DP 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220
I-cache, 4KB D-cache, and MMUs integrated
XPC860DT 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220 with CPM of earlier generation 68360
QUICC. 860P and 860DP has 16K I-cache
XPC860EN 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220 and 8K D-cache.
XPC860P 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220
XPC862DP 357-Lead ZP 50,66,80 0 PowerQUICC CZP50,66 0 44 220 Rev 0 of the 862 PowerQUICC family
PowerPC MPU including simultaneous operations of Fast
XPC862DT 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220
Ethernet (MII) and Parallel ATM (UTOPIA).
XPC862P 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220
Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.
XPC860 357-Lead ZP 50,66,80 C1 Low-Cost CZP50,66 0 44 220 These devices should be ordered for
Integrated INVENTORY DEPLETION ONLY.
XPC860DC 357-Lead ZP 50,66,80 C1 CZP50,66 0 44 220
PowerQUICC If you can use these revisions, please order
XPC860DE 357-Lead ZP 50,66,80 C1, D3 CZP50,66 0 44 220 for quick turns.
XPC860DH 357-Lead ZP 50,66,80 C1 CZP50,66 0 44 220 For new designs, please order the current
XPC860DP 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220 D4 revision listed above.
6
MPC823/MPC850/MPC855/MPC857/MPC860/MPC862 Processor Derivatives and Features
MPC860DT 4 4 Up to 2 1 Y Up to 64 2 0 0 2
MPC860EN 4 4 Up to 4 4 0 0
MPC860P 16 8 Up to 4 1 Y Up to 64 4 0 0 2
MPC860SR 4 4 Up to 4 Y Up to 64 4 0 0 2
MPC860T 4 4 Up to 4 1 Y Up to 64 4 0 0 2
MPC862DT 4 4 Up to 2 1 Y Up to 64 2 0 0 2
MPC862P 16 8 Up to 4 1 Y Up to 64 4 0 0 2
MPC862SR 4 4 Up to 4 Y Up to 64 4 0 0 2
MPC862T 4 4 Up to 4 1 Y Up to 64 4 0 0 2
MPC8255/MPC8260/MPC8264/MPC8265/MPC8266 PowerQUICC II
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 105C)
XPC8255 480-Lead ZU IEA A1 PowerQUICC II CZUIEA 0 21 105 Next Generation of PowerQUICC product
family. 603e CPU, Fast Ethernet, OC-3 ATM,
256 HDLC Channels.
For samples order: KXPC8255ZUIEAA1
XPC8260 480-Lead ZU 133,166,200 A CZU133,166 0 21 105 Next Generation of PowerQUICC product
XPC8260 480-Lead ZU FFB,HFB,IFB,I B3 CZUFFB family. 603e CPU, Fast Ethernet, OC-3
GA ATM, 256 HDLC Channels.
7
68K Integrated Communication Processors
For samples order: KMC68EN302PV25B
MC68LC302 100-Lead PU 16,20,25 @ 5 V CT Low-Cost CPU16,20 0 84 420 420 Static EC000 Core Processor with
Intergrated two high-performance multiprotocol
16,20 @ 3.3 V CT CPU16V
Multiprotocol serial channels; also on-chip DMA,
Processor RAM, timers, I/O, chip selects, and
wait state interrupt controller.
For PU samples order: KMC68LC302PU16CT,
KMC68LC302PU20CT, KMC68LC302PU25CT,
KMC68LC302PU16VCT, KMC68LC301PU20VCT
MC68360 240-Lead EM 25,33 @ 5.0 V L QUICC Quad CEM25 0 24 120 CPU32 + core with System
Intergrated Intergration Module (SIM) and four
357-Lead ZP L CZP25 0 44 220
Communications high-performance SCCs support
241-Lead RC K Controller CRC25 0 10 50 numerous protocols. Two SCCs
support Ethernet on "EN" version.
MC68360V 240-Lead EM 25 @ 3.3 V L 0 24 120
357-Lead ZP L 0 44 220
MC68EN360 240-Lead EM 25, 33 @ 5.0 V L CEM25 0 24 120
357-Lead ZP L CZP25 0 44 220
241-Lead RC K CRC25 0 10 50
MC68EN360V 240-Lead EM 25 @ 3.3 V L 0 24 120
357-Lead ZP L 0 44 220
For EM sample order: KMC68360EM25L, KMC68360EM33L, KMC68360EM25VL,
KMC68360CEM25L, KMC68EN360EM25L, KMC68EN360EM33L,
KMC68360EN360EM25VL, KMC68EN360CEM25L.
For ZP sample order: KMC68360ZP25L, KMC68360ZP25VL, KMC68360ZP33L,
KMC68360CZP25L, KMC68EN360ZP25L, KMC68EN360ZP33L,
KMC68EN360ZP25VL, KMC68EN360CZP25L
MC68MH360 240-Lead EM 25, 33 @ 5.0 V L CEM25 0 24 120 One-chip intergrated
microprocessor and peripheral
357-Lead ZP L CZP25 0 44 220
combination with four SCCs, two
241-Lead RC K CRC25 0 10 50 serial management controllers
(SMCs), and one serial peripheral
MC68MH360V 240-Lead EM 25 @ 3.3 V L 0 24 120
interface (SPI).
357-Lead ZP L 0 44 220
For EM sample order: KMC68MH360EM25L, KMC68MH360EM33L,
KMC68MH360EM25VL, KMC68MH360CEM25L
For ZP sample order: KMC68MH360ZP25L, KMC68MH360ZP25VL,
KMC68MH360ZP33L, KMC68MH360CZP25L
MC68606 84-Lead FN 12, 16 C CFN12, 16 1 1 15 Implements CCITT Q.920/Q.921
link access procedure (LAPB)
specified at ISO level 2 for both
signaling and data applications in
an ISDN.
Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.
Clock Generator
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MPC930FA Pentium or PowerPC 603/740/750 3.3 32 LQFP 16 to 140 400 100 LVCMOS 6 P
Class Processor Designs (On-Board
Crystal Oscillator)
MPC931FA Pentium or PowerPC 603/740/750 3.3 32 LQFP 16 to 140 400 100 LVCMOS 6 P
Class Processor Designs (Faster VCO
than 930)
MPC9315FA Telecom/Networking Applications 40 to 85 3.3/ 32 LQFP 18 to 200 200 8 Two 8 S
2.5 (rms) Selectable LVCMOS
LVCMOS
8
Clock Generator (continued)
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MPC932FA Zero Delay Applications, Six Input 3.3 32 TQFP 33 to 120 600 100 LVCMOS 7 P
Clock Multipliers (Independent Output LVCMOS
Enable/ Disable for Lo-Power
Scheme)
MPC9350FA Networking and Telecommunications 40 to 85 3.3/ 32 LQFP 25 to 240 200 XTAL or 9 S
Ideal for PowerQUICC II and PowerPC 2.5 LVCMOS LVCMOS
MPC74XX Applications
MPC9351FA Networking and Telecommunications 40 to 85 3.3/ 32 LQFP 25 to 240 200 LVCMOS or 9 S
Ideal for PowerQUICC II and PowerPC 2.5 LVPECL LVCMOS
MPC74XX Applications
MPC950FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 375 100 XTAL or 9 P
Processor Designs (Scan Chain Clock LVCMOS
Distribution)
MPC951FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 375 100 LVCMOS 9 P
Processor Designs (Zero Delay, Low
Skew Fanout Buffer)
MPC952FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 450 100 LVCMOS 11 P
Processor Designs (Terminated
Transmission Line Driver)
MPC9600FA General Purpose 2.5 V, High Fanout 3.3/ 48 LQFP 50 to 200 150 50 LVCMOS or 21 S
Zero Delay Buffer 2.5 LVPECL LVCMOS
MPC972FA General Purpose or RISC/CSIC Class 3.3 52 LQFP 25 to 125 550 100 LVCMOS or 12 P
Designs (Independent Output Enable/ LVPECL
Disable Lo-Power Scheme)
MPC973FA Pentium or PowerPC603/740/750 3.3 52 LQFP 125 550 100 LVCMOS 12 P
Class Designs (Output Enable/Disable
Lo-Power Scheme)
MPC974FA Fault Tolerant (Redundant Clock 3.3 52 LQFP 16 to 125 350 100 LVCMOS 15 P
Source Needed) Pentium/PowerPC
603/740/ 750/RISC Class Processor
Designs
MPC980FA Processor and System Clock for 3.3 52 LQFP 66 350 150 XTAL 10 P
Pentium and PowerPC603
PCDesigns, PCI Clock, SCSI Clock,
Dual PLL
MPC991FA Telecom Applications, Work Station, 40 to 85 3.3 52 LQFP 400 250 50 LVPECL 14 Different P
Mainframe (Differential Input Locks Pairs
onto External Clock Reference)
MPC992FA Telecom, Work Station, Mainframe, 3.3 32 LQFP 375 300 25 LVPECL 7 Different P
Instrumentation (On-Board XTL Pairs
Oscillator, or Lock onto External Clock)
MPC993FA Systems with cLock Redundancy 40 to 85 3.3 32 LQFP 50 to 180 150 50 LVPECL 5 Different P
Needs (High-End Computing and Pairs
Telecomm) Differential LVPECL 50
MHz to 90 MHz Input Frequency
MPC9857FA Clock Driver for 184-pin DDR SDRAM 3.3/ 48 167 100 SSTL2 11 Q2/01
Modules 2.5 TSSOP
MPC9952FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 450 100 LVCMOS 11 P
Processor Designs9952 is based on
the MPC952; removing the power-on
reset function
MPC9990FA IA64, HSTL Clock Generator 3.3/ 75 to 300 50 75 LVPECL 10 HSTL+ IN
2.5 LVPECL
Feedback
MC88915TFN55 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 55 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN70 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 70 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN100 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 100 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
9
Clock Generator (continued)
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MC88915TFN133 PC, Work Station, Servers, Memory 5.0 28 PLCC 133 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN160 PC, Work Station, Servers, Memory 5.0 28 PLCC 160 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88LV915TFN MC88LV915TFN is the 3.3 V version of 3.3 28 PLCC 100 500 CMOS 8 P
MC88915TFN100
MC88916DW70 MC68030/EC030/LC030, 5.0 20 SOIC 70 500 CMOS 6 P
MC68040/EC040/LC040 (33 MHz)
MC88916DW80 MC68030/EC030/LC030, 5.0 20 SOIC 80 500 CMOS 6 P
MC68040/EC040/LC040 (40 MHz)
MC88920DW MC68020/EC020/030/EC030/LC030/0 5.0 20 SOIC 50 500 CMOS 6 P
40/EC040/LC040 (20 and 25 MHz),
i960 (16,25,33 MHz)
MC88921DW MC68040/EC040/LC040 (20, 25, 33 5.0 20 SOIC 80 500 CMOS 3 P
MHz), Pentium (Input Clock and Bus
Logic Clock), i960 (16, 25, 33 MHz)
MC88LV926DW MC68030/EC030/LC030, 3.3 20 SOIC 66 500 CMOS 5 P
MC68040/EC040/LC040,
MC68060/EC060/LC060, CISC
Processors
Clock Synthesizer
Max
Extended Frequency
VCC Frequency Period
Device Processor and Application Temp. Package Range Input Outputs Status
(V) Steps Jitter
(C) (MHz)
(ps)
MC12429FN Clock Source for 25 MHz to 400 MHz 3.3 28 PLCC 25 to 400 1 MHz 25 XTAL LVPECL P
Processor Designs (Serial and/or
Parallel) 1 MHz Steps
MC12430FN Clock Source for 50 MHz to 800 MHz 3.3 28 PLCC 50 to 800 1 MHz 25 to XTAL or LVPECL P
Processor Designs (Serial and/or 65 External
Parallel) 1 MHz Steps
MC12439FN Clock Source for 50 MHz to 800 MHz 3.3 28 PLCC 50 to 800 16 MHz 25 to XTAL or LVPECL P
Processor Designs (Serial and/or 65 External
Parallel) 16.66 MHz Steps
MPC998FA HP PA and Intel 64-Bit Architectures 3.3 Core/ 32 LQFP 520 to 840 50 ps 5% of HSTL or 2+ P
(Itanium): 520 MHz to 840 MHz 1.8 Output Clock LVPECL Feedback
High-End Computing/Telecomm HSTL Period HSTL
Clock Trees/Clock Synthesis
MPC9994FA HP PA and Intel 64-Bit Architectures 3.3 Core/ 32 LQFP 340 to 640 50 ps 5% of HSTL or 2+ P
(Itanium): 340 MHz to 640 MHz 1.8 Output Clock LVPECL Feedback
High-End Computing/Telecomm HSTL Period HSTL
Clock Trees/Clock Synthesis
Legend: IN = In Development P = Production S = Sampling
10
Zero-Delay Buffer
Output Max Max
Extended
VCC Frequency Output Period
Device Processor/Application Temp. Package Input Outputs Status
(V) Range Skew Jitter
(C)
(MHz) (ps) (ps)
MPC953FA High Performance Clock Tree Design, 3.3 32 LQFP 25 to 110 150 100 LVPECL Ref 8+ P
PC100 LVCMOS Fdbk Feedback
LVCMOS
MPC954DT High Performance Clock Tree Design 3.3 24 TSSOP 50 to 100 200 50 LVCMOS Ref 10 + P
(Clock Signal Retiming Without Insertion LVCMOS Fdbk Feedback
Delay) in the 50 MHz to 100 MHz Range LVCMOS
MPC958FA Very High Performance Clock Tree 3.3 32 LQFP 50 to 200 200 100 LVPECL Ref 10 + P
Design up to 200 MHz LVCMOS Fdbk Feedback
LVCMOS
MPC961CFA General Purpose also PowerQUICC: 3.3/ 32 LQFP 50 to 200 150 10 LVCMOS Ref 17 + P
Zero-Delay Applications (CMOS Clock 2.5 LVCMOS Fdbk Feedback
Signal Retiming Without Insertion Delay) LVCMOS
DRAM Driver
MPC961PFA Zero-Delay Applications (PECL Clock 3.3/ 32 LQFP 50 to 200 150 10 LVCMOS Ref 17 + P
Signal Retiming Without Insertion Delay) 2.5 LVCMOS Fdbk Feedback
LVCMOS
11
Differential Fanout Buffer
Max Max
Extended Part-Part Output
Temp. VCC Skew Skew Output
Device Processor and Application (C) (V) Package (ps) (ps) Technology Input Outputs Status
MC100EP111FA Clock Distribution Schemes Requiring 40 to 70 3.3/ 32 LQFP 100 35 LVPECL ECL/PECL 1:10 P
Extremely Low Part-to-Part and 2.5 or HSTL
Output-to-Output Skews
MC100EP210FA Clock Distribution Schemes Requiring 40 to 70 3.3/ 32 LQFP 150 35 LVPECL ECL/PECL Dual 1:5 P
Very Low Part-to-Part and Output-to- 2.5
Output Skews
MC100EP220TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 DIFF LVPECL ECL/PECL Dual 1:10 S
Telecom Backbone Equipment, Semi 2.5 Exposed DIFF
Test Equipment Pad
MC100EP221TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 LVPECL ECL/PECL 1:20 DIFF S
Telecom Backbone Equipment, Semi 2.5 Exposed
Test Equipment Pad
MC100EP222TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 DIFF LVPECL ECL/PECL 1:15 DIFF S
Telecom Backbone Equipment, Semi 2.5 Exposed
Test Equipment Pad
MC100EP223TC ECL/PECL Designs Needing Low Skew. 0 to 85 3.3/ 64 LQFP 150 50 DIFF ECL/PECL 1:22 DIFF P
Telecom Backbone Equipment, Semi 2.5 Exposed PECL/HTSL or HSTL
Test Equipment Pad
Legend: IN = In Development P = Production S = Sampling
12
CellularTo 1.0 GHzLateral MOSFETs
Gain
Frequency Pout Test VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) Signal (V) (C/W)
(dB/MHz) (%)
18051990 MHz, Class ABLDMOS Die (GSM1800, GSM1900, GSM EDGE, and PCS TDMA)
MRF18060A M 18051880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465/1
MRF18060AS M 18051880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465A/1
MRF18060B M 19301990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465/1
MRF18060BS M 19301990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465A/1
MRF18085A 4a M 18051880 85 CW 1-Tone 26 13/1805,1880 53 0.64 465/1
4a
MRF18085AS M 18051880 85 CW 1-Tone 26 13/1805,1880 53 0.64 465A/1
MRF18085B 4a M 19301990 85 CW 1-Tone 26 13/1930,1990 52 0.64 465/1
4a
MRF18085BS M 19301990 85 CW 1-Tone 26 13/1930,1990 52 0.64 465A/1
MRF18090A M 18051880 90 CW 1-Tone 26 13.5/1805,1880 52 0.7 465B/1
MRF18090AS M 18051880 90 CW 1-Tone 26 13.5/1805,1880 52 0.7 465C/1
MRF18090B M 19301990 90 CW 1-Tone 26 13.5/1930,1990 45 0.7 465B/1
MRF18090BS M 19301990 90 CW 1-Tone 26 13.5/1930,1990 45 0.7 465C/1
13
PCS and 3GTo 2.1 GHzLateral MOSFETs (continued)
Gain
Frequency Pout Test VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) Signal (V) (C/W)
(dB/MHz) (%)
14
RF LDMOS Amplifier Modules/ICs
Base Stations
Supply
Frequency P1dB Gain (Min) System Die
Device Voltage Class Package/Style
(MHz) (W) (dB) Application Technology
(V)
MHVIC910HR2 2e 921960 10 38 26 AB GSM900 LDMOS-IC 978/
MHW18101 18051880 10 24 26 AB GSM1800 LDMOS 301AW/1
MHW18102 18051880 10 32 26 AB GSM1800 LDMOS 301AW/1
MHW19101 19301990 10 24 26 AB GSM1900 LDMOS 301AW/1
MHPA19030 4a 19002000 30 25 26 AB PCS1900 LDMOS 301AP/1
MHPA21030 4a 21002200 30 25 28 AB W-CDMA LDMOS 301AP/1
15
Networking DSPs
DSP Products
Sample Part Number Voltage
Device MOQ Package Performance (2-Unit Core, Internal Memory Peripherals Applications
Sample Pack) I/O
DSP56301VF80 126 252-pin 80 MHz SPAKDSP301VF100 3.3, 24K Bytes 32-bit Host, High-bandwidth 32-bit PCI
MAP-BGA 80 MIPS 3.3 V 4K words program ESSI, SCI, interface is particularly
4K words data Triple Timer useful in multimedia and
DSP56301VF100 126 252-pin 100 MHz
telecommunication
MAP-BGA 100 MIPS
applications such as video
DSP56301PW80 84 208-pin 80 MHz SPAKDSP301PW100 conferencing and base
TQFP 80 MIPS transceiver stations.
DSP56301PW100 84 208-pin 100 MHz
TQFP 100 MIPS
DSP56303VF100 126 196-pin 100 MHz SPAKDSP303VF100 3.3, 24K Bytes 8-bit Host, Networking applications
MAP-BGA 100 MIPS 3.3 V 4K words program ESSI, SCI, requiring low-cost, high-
4K words data Triple Timer performance digital signal
DSP56303PV100 60 144-pin 100 MHz SPAKDSP303PV100
processing such as voice/
TQFP 100 MIPS
data/fax processing, video-
XC56309VF100A 126 196-pin 100 MHz SPAKXC309VF100A 3.3, 102K Bytes conferencing, audio
MAP-BGA 100 MIPS 3.3 V 20K words program applications, and control.
5 V I/O 14K words data
XC56309PV100A 60 144-pin 100 MHz SPAKXC309PV100A
Tolerant
TQFP 100 MIPS
XC56L307VF160 126 196-pin 160 MHz SPAKXCL307VF160 1.8, 192K Bytes 8-bit Host, Networking applications
MAP-BGA 290 MIPS 3.3 V 1648K words program ESSI, SCI, requiring high-performance
4816K words data Triple Timer, and large internal memory
5 memory switch ESSI, EFCOP such as wireline and
options wireless communications
infrastructure equipment,
XC56311VF150A 126 196-pin 150 MHz SPAKXC311VF150A 1.8, 384K Bytes
packet telephony, and
MAP-BGA 270 MIPS 3.3 V 3296K words program
modem banks.
9632K words data
EFCOP provides hardware
5 memory switch
acceleration for filtering
options
operations.
XC56321FC200 126 196-pin 200 MHz SPAKXC321FC200 1.5, 576K Bytes
Available 4Q2001 FC-BGA 360 MIPS Available 4Q2001 3.3 V 32160K words
program
16032K words data
8 memory switch
options
XC8101M1375B 90 332-pin 275 MHz SPAKXC8101M1375B 1.5, 512K Bytes 4 ALUs, Networking infrastructure
Available 4Q2001 FC-BGA 1375 MIPS Available 4Q2001 3.3 V Unified program and 137 MHz CPM, applications such as 2.5G
1375 MMACS data memory 16-channel DMA and 3G wireless
configurable by the 68 MHz, 64-bit infrastructure, IP telephony
application PowerPC bus (voice, fax, modem, and
interface, video IP gateways), ATM
275 MHz Edge/Carrier switches,
EFCOP modem banks, WAN
switching and transmission,
and centralized DSP
services (compression and
echo cancellation).
16
Applications Software http://www1.motorola-dsp.com/3rd/3rdparty.html
Partner Description Contact
Signals and Software Limited Embedded communications software including speech coders, www.sasl.com
modems, and echo cancellers for applications such as cellular and
PCS telephones, pagers, and wireless basestations.
VoicePump Off-the-shelf licensable software modules suitable for use in the http://www.voicepump.com/index.html
(Formerly Analogical Systems) wireless communications, satellite communications, networking,
and computer industries.
Lake Communications Lake Genus suite of DSP algorithms provide many common http://www.lakecommunications.com
modem and vocoder combinations using a common API, enabling
easy integration into products.
Surf Communication Solution, Ltd. Advanced universal port solution for converged packet voice, http://www.surf-com.com
packet fax, V.9x modems, and high-speed data services.
17
Third Party Tools http://www1.motorola-dsp.com/3rd/3rdparty.html
Tools Description Partner Contact
Real-Time Operating System Eonic Systems www.eonics.com
Embedded Power Corporation http://www.embeddedpower.com/
Precise Software Technologies www.psti.com
Wind River Systems www.windriver.com
Integrated Development Environment Green Hills www.greenhills.com
MetroWerks www.metrowerks.com
Signalogic http://www.signalogic.com
Tasking http://www.tasking.com
Optimizing Compilers / Assembler / Linker Green Hills www.greenhills.com
Tasking http://www.tasking.com
Wind River Systems www.windriver.com
Debugger Domain Technologies http://www.domaintec.com
Green Hills www.greenhills.com
Precise Software Technologies www.psti.com
Tasking http://www.tasking.com
Wind River Systems www.windriver.com
Simulator Precise Software Technologies www.psti.com
Tasking http://www.tasking.com
Wind River Systems www.windriver.com
DSP Algorithm Development Mathworks http://www.mathworks.com
Hyperception http://www.hyperception.com
System Simulation and Verification Cadence http://www.cadence.com/alta
Mentor Graphics www.mentorgraphics.com
Synopsys www.synopsys.com
Hardware Debug Connections/ Analyzers Corelis/HP http://www.corelis.com/
Macraigor Systems www.macraigor.com
Signalogic http://www.signalogic.com
Wind River Systems www.windriver.com
Hardware Development Tools CDA Systems www.cdasys.com
P&E Microcomputer Systems www.pemicro.com
United Electronic Industries www.ueidaq.com
White Electronic Designs www.whiteedc.com
18
Network Memory Products
CAMs (Content Addressable Memory)
Pin Prod
Device No. Organization VDD Package Speeds Description
Count Status
MCM69C432 16K x 64 3.3 V 100 TQ (TQFP) 20 ns Now Content addressable memory for communication
applications. 16K connections, 180 ns match time.
MCM69C433 100 TQ (TQFP) 15 ns Now 66 MHz for PowerQUICC II applications. 240 ns
match time.
MCM69C232 32K x 36 3.3 V 100 TQ (TQFP) 20 ns Now Content addressable memory for communication
applications. 16K connections, 160 ns match time.
MCM69C233 100 TQ (TQFP) 15 ns Now 66 MHz for PowerQUICC II applications. 210 ns
match time.
ISDN
Device Description Leads-Package Samples Production Document No.
MC145572 ISDN U-Interface Transceiver II 44-Lead PLCC, Now Now MC145572/D
44-Lead TQFP
MC145572A ISDN U-Interface Transceiver II with Micro Interruptions 44-Lead PLCC, Now Now Note 1
Feature 44-Lead TQFP
MC145574A ISDN S/T-Interface Transceiver II 28-Lead SOG, Now Now MC145574/D
32-Lead TQFP
MC145576 ISDN Single-Chip NT1 44-Lead TQFP Now Now MC145576/D
19
Voice and Data Coding
Device Description Leads-Package Samples Production Document No.
MC14LC5480 5.V PCM Codec-Filter 20-Lead PDIP, 20-Lead SOG, Now Now MC14LC5480/D
20-Lead SSOP,
20-Lead TSSOP
MC145481 3 V PCM Codec-Filter 20-Lead SOG, Now Now MC14LC5481/D
20-Lead SSOP,
MC145482 5 V Linear Codec-Filter Now Now MC145482/D
20-Lead TSSOP
MC145483 3 V Linear Codec-Filter Now Now MC145483/D
MC145484 5 V PCM Codec-Filter Now Now MC145484/D
MS140131KT Short Loop Dual PCM Codec-Filter/SLIC N/A Now Now MS140131KT/D
Chipset with GCI
MS140132KT Short Loop Dual PCM Codec-Filter/SLIC N/A Now Now MS140132KT/D
Chipset with SPI
Development Tools
Device Description Key Device Production Document No.
MC14LC5480EVK PCM Codec-Filter Evaluation Kit MC14LC5480, MC145481, Now MC14LC5480EVK/D
MC145482, MC145483,
MC145484
MC145537EVK ADPCM Codec Evaluation Kit MC14LC5540 Now MC145537EVK/D
MC145572EVK ISDN U-Interface Transceiver Evaluation Kit MC145572 Now Note 1
MC145574EVK ISDN S/T-Interface Transceiver Evaluation Kit MC145574 Now Note 1
MC145576EVK ISDN Single-Chip NT1 Evaluation Kit MC145576 Now Note 1
MC145572DRV Driving Board for the MC145576EVK for Smart NT1 MC145576 Now Note 1
Evaluation
Hipster Hipster Reference Design for SOHO Router MC145572, MC145574, Now Note 1
MPC850DH
Note 1: For details or preliminary document, contact your NCSG regional marketing representative.
End-Of-Life Devices
PowerPC End of Life
Device Last Buy Date Last Ship Date Replacement
MPC603EFE133LN 1/24/01 6/30/01 MPC603RRXLC/XPC603RZTLC
MPC603ERX133LN 1/24/01 6/30/01 MPC603RRXLC/XPC603RZTLC
XPC740P 3/14/02 9/14/02 XPC745B
XPC750P 3/14/02 9/14/02 XPC755B
20
Network Memory
Device Last Buy Date Last Ship Date Replacement
MCM67A618BFN 12/21/01 6/21/02 N/A
MCM67B618BFN 12/21/01 6/21/02 N/A
MCM67H618BFN 12/21/01 6/21/02 N/A
MCM67M618BFN 12/21/01 6/21/02 N/A
MCM63Z736TQ 3/24/01 9/24/01 N/A
MCM63Z737TQ 3/24/01 9/24/01 N/A
MCM63Z818TQ 3/24/01 9/24/01 N/A
MCM63Z819TQ 3/24/01 9/24/01 N/A
MCM69F536CTQ10 3/11/01 9/11/01 N/A
MCM69F618CTQ10 3/11/01 9/11/01 N/A
MCM69P536CTQ 3/11/01 9/11/01 N/A
MCM69P618CTQ 3/11/01 9/11/01 N/A
MCM69T618TQ 1/15/02 7/16/02 N/A
MCM63R736FC 1/23/02 7/24/02 N/A
MCM63R818FC 1/23/02 7/24/02 N/A
MCM63R836FC 1/23/02 7/24/02 N/A
MCM63R918FC 1/23/02 7/24/02 N/A
MCM67Q909ZP 1/10/02 7/11/02 N/A
MCM67Q709AZP 1/10/02 7/11/02 N/A
MCM69R818CZP 3/1/01 9/1/01 N/A
MCM69R736CZP 3/1/01 9/1/01 N/A
MCM63D736ATQ 1/27/02 7/27/02 N/A
MCM6343 12/7/00 6/7/01 N/A
MCM63F733ATQ 3/24/01 9/24/01 N/A
MCM63P733ATQ 3/24/01 9/24/01 N/A
MCM64E836FC 1/23/02 7/24/02 N/A
MCM64E918FC 1/23/02 7/24/02 N/A
21
Microprocessor Part Number Schemes
PowerPC 1xx, 6xx, and 7xx Processor Part Numbering Scheme
MPC 603 R RX 300 L C
Product Code 100, 600, or 700 Series Device Package Frequency Application Modifier Revision
PPC Sample (106, 107, 603, 740, 750, 7400) (see page 4) 23 Digits Bus Ratio
XPC XC Qualified C 2:1 (106 Only)
Part/Module Modifier
MPC Qualified D 5:2 (106 Only)
A 106/107/740/750 Alpha (Original)
PPE EC-Sample L Full Spec all Modes
E 603 Enhanced Performance
XPE XC Qualified EC CPU Temp./Spec.
P 740/750 Enhanced and Lower Voltage
MPE Qualified EC CPU N 65C, 2.1 V
R 603e in HIP3 Process
P 65C, 2.05 V (750); 2.15 V (7400)
(not used for 7400)
R 105C, 2.05 V
T Ext. Temp. (40 to 105C Tj)
22
World Wide Web and Documentation
Support
http://www.motorola.com/semiconductors/support/index.html
News
http://www.motorola.com/semiconductors/news_center
23
DigitalDNA, Hipster, PowerQUICC, and PowerQUICC II are trademarks of Motorola, Inc.
The PowerPC name, the PowerPC logotype, and PowerPC 603e are trademarks of International Business Machines Corporation used by Motorola
under license from International Business Machines Corporation.
All brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee
regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters
which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as
components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application
in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola
products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries,
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
HOW TO REACH US:
USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or
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