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HIP4080A

Data Sheet July 2004 FN3658.7

80V/2.5A Peak, High Frequency Full Bridge Features


FET Driver Drives N-Channel FET Full Bridge Including High Side
The HIP4080A is a high frequency, medium voltage Full Chop Capability
Bridge N-Channel FET driver IC, available in 20 lead plastic Bootstrap Supply Max Voltage to 95VDC
SOIC and DIP packages. The HIP4080A includes an input
comparator, used to facilitate the hysteresis and PWM Drives 1000pF Load at 1MHz in Free Air at +50C with
modes of operation. Its HEN (high enable) lead can force Rise and Fall Times of Typically 10ns
current to freewheel in the bottom two external power User-Programmable Dead Time
MOSFETs, maintaining the upper power MOSFETs off.
Charge-Pump and Bootstrap Maintain Upper Bias
Since it can switch at frequencies up to 1MHz, the HIP4080A
Supplies
is well suited for driving Voice Coil Motors, switching power
amplifiers and power supplies. DIS (Disable) Pin Pulls Gates Low

HIP4080A can also drive medium voltage brush motors, and Input Logic Thresholds Compatible with 5V to 15V Logic
two HIP4080As can be used to drive high performance Levels
stepper motors, since the short minimum on-time can Very Low Power Consumption
provide fine micro-stepping capability.
Undervoltage Protection
Short propagation delays of approximately 55ns maximize
Pb-Free Available as an Option
control loop crossover frequencies and dead-times which
can be adjusted to near zero to minimize distortion, resulting Applications
in precise control of the driven load.
Medium/Large Voice Coil Motors
The similar HIP4081A IC allows independent control of all 4
FETs in a Full Bridge configuration. Full Bridge Power Supplies
Switching Power Amplifiers
The Application Note for the HIP4080A is AN9404.
High Performance Motor Controls
Ordering Information Noise Cancellation Systems
PART TEMPERATURE PKG.
NUMBER RANGE (C) PACKAGE DWG. #
Battery Powered Vehicles

HIP4080AIPZ -40 to +85 20 Ld PDIP E20.3 Peripherals


(Note 1) (Pb-Free) U.P.S.
HIP4080AIP -40 to +85 20 Ld PDIP E20.3
Pinout
HIP4080AIB -40 to +85 20 Ld SOIC M20.3
HIP4080A
HIP4080AIBZ -40 to +85 20 Ld SOIC M20.3 (PDIP, SOIC)
(Note 1) (Pb-Free) TOP VIEW
NOTES:
BHB 1 20 BHO
1. Intersil Pb-Free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin HEN 2 19 BHS
plate termination finish, which is compatible with both SnPb and DIS 3 18 BLO
Pb-free soldering operations. Intersil Pb-Free products are MSL
classified at Pb-free peak reflow temperatures that meet or VSS 4 17 BLS
exceed the Pb-free requirements of IPC/JEDEC J Std-020B. OUT 5 16 VDD
2. Add T suffix for Tape and Reel packing option. HIP4080AIP not IN+ 6 15 VCC
available in Tape and Reel.
IN- 7 14 ALS
HDEL 8 13 ALO
LDEL 9 12 AHS
AHB 10 11 AHO

1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Harris Corporation 1995, Copyright Intersil Americas Inc. 2003, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HIP4080A

Application Block Diagram


80V

12V

BHO

BHS
LOAD
HEN BLO
DIS
HIP4080A

IN+ ALO

IN- AHS
AHO

GND GND

Functional Block Diagram (1/2 HIP4080A)

AHB HIGH VOLTAGE BUS 80VDC


10

UNDER- DRIVER AHO


CHARGE LEVEL SHIFT
VOLTAGE 11 CBS
PUMP AND LATCH

AHS
VDD 16 12

HEN 2 TURN-ON
DELAY
TO VDD (PIN 16)
DBS
DIS 3
VCC
15

OUT 5 DRIVER
ALO +12VDC
TURN-ON 13 BIAS
IN+ 6 DELAY SUPPLY
+ CBF
- ALS
IN_ 7 14

HDEL 8

LDEL 9

VSS 4

2
HIP4080A

Typical Application (Hysteresis Mode Switching)


80V

1 BHB BHO 20
12V 2 HEN BHS 19
DIS 3 DIS BLO 18 LOAD

HIP4080A/HIP4080
4 VSS BLS 17
5 OUT VDD 16
6V 6 IN+ VCC 15 12V
7 IN- ALS 14
IN
8 HDEL ALO 13
9 LDEL AHS 12
10 AHB AHO 11

GND

-
+

6V

GND

3
HIP4080A

Absolute Maximum Ratings Thermal Information


Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . . . -0.3V to 16V Thermal Resistance (Typical, Note 3) JA (C/W)
Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25C to 125C) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Voltage on AHS, BHS . . . -6.0V (Transient) to 70V (-55C to 125C) Maximum Power Dissipation at +85C
Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .470mW
Voltage on AHB, BHB . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .530mW
Voltage on ALO, BLO. . . . . . . . . . . . .VALS, BLS -0.3V to VCC +0.3V Storage Temperature Range . . . . . . . . . . . . . . . . . .-65C to +150C
Voltage on AHO, BHO . . . . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V Operating Max. Junction Temperature. . . . . . . . . . . . . . . . . . +125C
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300C
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns (For SOIC - Lead Tips Only)
All Voltages relative to VSS, unless otherwise specified.

Operating Conditions
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . +9.5V to +15V
Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . .VAHS, BHS +5V to VAHS, BHS +15V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500A to -50A
Operating Ambient Temperature Range . . . . . . . . . .-40C to +85C

CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Electrical Specifications VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K, and
TA = +25C, Unless Otherwise Specified

TJ = - 40C
TJ = +25C TO +125C

PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS

SUPPLY CURRENTS AND CHARGE PUMPS

VDD Quiescent Current IDD IN- = 2.5V, Other Inputs = 0V 8 11 14 7 14 mA

VDD Operating Current IDDO Outputs switching f = 500kHz, No Load 9 12 15 8 15 mA

VCC Quiescent Current ICC IN- = 2.5V, Other Inputs = 0V, - 25 80 - 100 A
IALO = IBLO = 0

VCC Operating Current ICCO f = 500kHz, No Load 1 1.25 2.0 0.8 3 mA

AHB, BHB Quiescent Current - IAHB, IBHB IN- = 2.5V, Other Inputs = 0V, -50 -25 -11 -60 -10 A
Qpump Output Current IAHO = IBHO = 0,
VDD = VCC =VAHB = VBHB = 10V

AHB, BHB Operating Current IAHBO, f = 500kHz, No Load 0.62 1.2 1.5 0.5 1.9 mA
IBHBO

AHS, BHS, AHB, BHB Leakage Current IHLK VBHS = VAHS = 80V, - 0.02 1.0 - 10 A
VAHB = VBHB = 93V

AHB-AHS, BHB-BHS Qpump VAHB - IAHB = IAHB = 0, No Load 11.5 12.6 14.0 10.5 14.5 V
Output Voltage VAHS
VBHB -
VBHS

INPUT COMPARATOR PINS: IN+, IN-, OUT

Offset Voltage VOS Over Common Mode Voltage Range -10 0 +10 -15 +15 mV

Input Bias Current IIB 0 0.5 2 0 4 A

Input Offset Current IOS -1 0 +1 -2 +2 A

Input Common Mode Voltage Range CMVR 1 - VDD 1 VDD V


-1.5 -1.5

4
HIP4080A

Electrical Specifications VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K, and
TA = +25C, Unless Otherwise Specified (Continued)

TJ = - 40C
TJ = +25C TO +125C

PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS

Voltage Gain AVOL 10 25 - 10 - V/mV

OUT High Level Output Voltage VOH IN+ > IN-, IOH = -250A VDD - - VDD - V
-0.4 - 0.5

OUT Low Level Output Voltage VOL IN+ < IN-, IOL = +250A - - 0.4 - 0.5 V

Low Level Output Current IOL VOUT = 6V 6.5 14 19 6 20 mA

High Level Output Current IOH VOUT = 6V -17 -10 -3 -20 -2.5 mA

INPUT PINS: DIS

Low Level Input Voltage VIL Full Operating Conditions - - 1.0 - 0.8 V

High Level Input Voltage VIH Full Operating Conditions 2.5 - - 2.7 - V

Input Voltage Hysteresis - 35 - - - mV

Low Level Input Current IIL VIN = 0V, Full Operating Conditions -130 -100 -75 -135 -65 A

High Level Input Current IIH VIN = 5V, Full Operating Conditions -1 - +1 -10 +10 A

INPUT PINS: HEN

Low Level Input Voltage VIL Full Operating Conditions - - 1.0 - 0.8 V

High Level Input Voltage VIH Full Operating Conditions 2.5 - - 2.7 - V

Input Voltage Hysteresis - 35 - - - mV

Low Level Input Current IIL VIN = 0V, Full Operating Conditions -260 -200 -150 -270 -130 A

High Level Input Current IIH VIN = 5V, Full Operating Conditions -1 - +1 -10 +10 A

TURN-ON DELAY PINS: LDEL AND HDEL

LDEL, HDEL Voltage VHDEL,V IHDEL = ILDEL = -100A 4.9 5.1 5.3 4.8 5.4 V

GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO

Low Level Output Voltage VOL IOUT = 100mA 0.7 0.85 1.0 0.5 1.1 V

High Level Output Voltage VCC - VOH IOUT = -100mA 0.8 0.95 1.1 0.5 1.2 V

Peak Pullup Current IO+ VOUT = 0V 1.7 2.6 3.8 1.4 4.1 A

Peak Pulldown Current IO- VOUT = 12V 1.7 2.4 3.3 1.3 3.6 A

Under Voltage, Rising Threshold UV+ 8.1 8.8 9.4 8.0 9.5 V

Under Voltage, Falling Threshold UV- 7.6 8.3 8.9 7.5 9.0 V

Under Voltage, Hysteresis HYS 0.25 0.4 0.65 0.2 0.7 V

5
HIP4080A

Switching Specifications VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K,
CL = 1000pF, and TA = +25C, Unless Otherwise Specified

TJ = - 40C
TJ = +25C TO +125C

PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS

Lower Turn-off Propagation Delay (IN+/IN- to ALO/BLO) TLPHL - 40 70 - 90 ns

Upper Turn-off Propagation Delay (IN+/IN- to AHO/BHO) THPHL - 50 80 - 110 ns

Lower Turn-on Propagation Delay (IN+/IN- to ALO/BLO) TLPLH - 40 70 - 90 ns

Upper Turn-on Propagation Delay (IN+/IN- to AHO/BHO) THPLH - 70 110 - 140 ns

Rise Time TR - 10 25 - 35 ns

Fall Time TF - 10 25 - 35 ns

Turn-on Input Pulse Width TPWIN-ON 50 - - 50 - ns

Turn-off Input Pulse Width TPWIN-OFF 40 - - 40 - ns

Disable Turn-off Propagation Delay TDISLOW - 45 75 - 95 ns


(DIS - Lower Outputs)

Disable Turn-off Propagation Delay TDISHIGH - 55 85 - 105 ns


(DIS - Upper Outputs)

Disable to Lower Turn-on Propagation Delay TDLPLH - 45 70 - 90 ns


(DIS - ALO and BLO)

Refresh Pulse Width (ALO and BLO) TREF-PW 240 380 500 200 600 ns

Disable to Upper Enable (DIS - AHO and BHO) TUEN - 480 630 - 750 ns

HEN-AHO, BHO Turn-off, Propagation Delay THEN-PHL RHDEL = RLDEL = 10K - 40 70 - 90 ns

HEN-AHO, BHO Turn-on, Propagation Delay THEN-PLH RHDEL = RLDEL = 10K - 60 90 - 110 ns

TRUTH TABLE

INPUT OUTPUT

IN+ > IN- HEN U/V DIS ALO AHO BLO BHO

X X X 1 0 0 0 0

0 0 0 0 1 0 0 0

1 1 0 0 0 1 1 0

0 1 0 0 1 0 0 1

1 0 0 0 0 0 1 0

X X 1 X 0 0 0 0

6
HIP4080A

Pin Descriptions
PIN
NUMBER SYMBOL DESCRIPTION

1 BHB B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30A out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

2 HEN High-side Enable input. Logic level input that when low overrides IN+/IN- (Pins 6 and 7) to put AHO and BHO drivers
(Pins 11 and 20) in low output state. When HEN is high AHO and BHO are controlled by IN+/IN- inputs. The pin can
be driven by signal levels of 0V to 15V (no greater than VDD).

3 DIS DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs.
When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to
15V (no greater than VDD).

4 VSS Chip negative supply, generally will be ground.

5 OUT OUTput of the input control comparator. This output can be used for feedback and hysteresis.

6 IN+ Noninverting input of control comparator. If IN+ is greater than IN- (Pin 7) then ALO and BHO are low level outputs
and BLO and AHO are high level outputs. If IN+ is less than IN- then ALO and BHO are high level outputs and BLO
and AHO are low level outputs. DIS (Pin 3) high level will override IN+/IN- control for all outputs. HEN (Pin 2) low level
will override IN+/IN- control of AHO and BHO. When switching in four quadrant mode, dead time in a half bridge leg
is controlled by HDEL and LDEL (Pins 8 and 9).

7 IN- Inverting input of control comparator. See IN+ (Pin 6) description.

8 HDEL High-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both high-side drivers. The low-side drivers turn-off with no adjustable delay, so the HDEL resistor guarantees no
shoot-through by delaying the turn-on of the high-side drivers. HDEL reference voltage is approximately 5.1V.
9 LDEL Low-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both low-side drivers. The high-side drivers turn-off with no adjustable delay, so the LDEL resistor guarantees no
shoot-through by delaying the turn-on of the low-side drivers. LDEL reference voltage is approximately 5.1V.
10 AHB A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30A out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

11 AHO A High-side Output. Connect to gate of A High-side power MOSFET.

12 AHS A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.
13 ALO A Low-side Output. Connect to gate of A Low-side power MOSFET.

14 ALS A Low-side Source connection. Connect to source of A Low-side power MOSFET.

15 VCC Positive supply to gate drivers. Must be same potential as VDD (Pin 16). Connect to anodes of two bootstrap diodes.
16 VDD Positive supply to lower gate drivers. Must be same potential as VCC (Pin 15). De-couple this pin to VSS (Pin 4).

17 BLS B Low-side Source connection. Connect to source of B Low-side power MOSFET.

18 BLO B Low-side Output. Connect to gate of B Low-side power MOSFET.

19 BHS B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.

20 BHO B High-side Output. Connect to gate of B High-side power MOSFET.

7
HIP4080A

Timing Diagrams
TDT
THPHL
TLPLH
U/V = DIS 0

HEN 1

IN+ > IN-

ALO

AHO

BLO

BHO
THPLH
TLPHL
TDT TR TF
(10% - 90%) (90% - 10%)

FIGURE 1. BISTATE MODE

THEN-PHL THEN-PLH

U/V = DIS 0

HEN

IN+ > IN-

ALO

AHO

BLO

BHO

FIGURE 2. HIGH SIDE CHOP MODE

TDLPLH TDIS
TREF-PW
U/V or DIS

HEN

IN+ > IN-

ALO

AHO

BLO

BHO
TUEN

FIGURE 3. DISABLE FUNCTION

8
HIP4080A

Typical Performance Curves VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K, and TA = +25C, Unless Otherwise Specified
13
14.0

12.5

IDD SUPPLY CURRENT (mA)


IDD SUPPLY CURRENT (mA)

12.0

12.0
10.0

11.5
8.0

6.0 11.0

4.0 10.5

2.0 10
8 10 12 14 200 400 600 800 1000
VDD SUPPLY VOLTAGE (V) SWITCHING FREQUENCY (kHz)

FIGURE 4. QUIESCENT IDD SUPPLY CURRENT vs VDD FIGURE 5. IDDO NO-LOAD IDD SUPPLY CURRENT vs
SUPPLY VOLTAGE FREQUENCY (kHz)

5.0
+125C
FLOATING SUPPLY BIAS CURRENT (mA)

20.0
+75C
4.0
ICC SUPPLY CURRENT (mA)

+25C
15.0
0C
3.0
-40C
10.0
2.0

5.0 1.0

0.0 0.0
0 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 600 700 800 900 1000
SWITCHING FREQUENCY (kHz) SWITCHING FREQUENCY (kHz)
FIGURE 6. SIDE A, B FLOATING SUPPLY BIAS CURRENT vs FIGURE 7. ICCO, NO-LOAD ICC SUPPLY CURRENT vs
FREQUENCY (LOAD = 1000pF) FREQUENCY (kHz) TEMPERATURE

2.5
FLOATING SUPPLY BIAS CURRENT (mA)

COMPARATOR INPUT CURRENT (A)

1.0
2

1.5

1
0.5

0.5

0 200 400 600 800 1000 -40 -20 0 20 40 60 80 100 120


SWITCHING FREQUENCY (kHz) JUNCTION TEMPERATURE (C)
FIGURE 8. IAHB, IBHB NO-LOAD FLOATING SUPPLY BIAS FIGURE 9. COMPARATOR INPUT CURRENT IL vs
CURRENT vs FREQUENCY TEMPERATURE AT VCM = 5V

9
HIP4080A

Typical Performance Curves VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K, and TA = +25C, Unless Otherwise Specified (Continued)

-90 -180

LOW LEVEL INPUT CURRENT (A)


LOW LEVEL INPUT CURRENT (A)

-190

-100
-200

-210
-110

-220

-120 -230
-50 -25 0 25 50 75 100 125 -40 -20 0 20 40 60 80 100 120
JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)
FIGURE 10. DIS LOW LEVEL INPUT CURRENT IIL vs FIGURE 11. HEN LOW LEVEL INPUT CURRENT IIL vs
TEMPERATURE TEMPERATURE
NO-LOAD FLOATING CHARGE PUMP VOLTAGE (V)

80
15.0

70
PROPAGATION DELAY (ns)
14.0

60
13.0

50
12.0

40
11.0

10.0 30
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120

JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)


FIGURE 12. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP FIGURE 13. UPPER DISABLE TURN-OFF PROPAGATION
VOLTAGE vs TEMPERATURE DELAY TDISHIGH vs TEMPERATURE

525 80

70
PROPAGATION DELAY (ns)

PROPAGATION DELAY (ns)

500

60

475

50

450
40

425 30
-50 -25 0 25 50 75 100 125 150 -40 -20 0 20 40 60 80 100 120

JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)


FIGURE 14. DISABLE TO UPPER ENABLE TUEN FIGURE 15. LOWER DISABLE TURN-OFF PROPAGATION
PROPAGATION DELAY vs TEMPERATURE DELAY TDISLOW vs TEMPERATURE

10
HIP4080A

Typical Performance Curves VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
10K, and TA = +25C, Unless Otherwise Specified
450 80

70
REFRESH PULSE WIDTH (ns)

PROPAGATION DELAY (ns)


425
60

400 50

40
375
30

350 20
-50 -25 0 25 50 75 100 125 150 -40 -20 0 20 40 60 80 100 120
JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)

FIGURE 16. TREF-PW REFRESH PULSE WIDTH vs FIGURE 17. DISABLE TO LOWER ENABLE TDLPLH
TEMPERATURE PROPAGATION DELAY vs TEMPERATURE

90.0 90.0
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)

80.0 80.0

70.0 70.0

60.0 60.0

50.0 50.0

40.0 40.0

-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120


JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)

FIGURE 18. UPPER TURN-OFF PROPAGATION DELAY THPHL FIGURE 19. UPPER TURN-ON PROPAGATION DELAY THPLH
vs TEMPERATURE vs TEMPERATURE

90.0 90.0
PROPAGATION DELAY (ns)

PROPAGATION DELAY (ns)

80.0 80.0

70.0 70.0

60.0 60.0

50.0 50.0

40.0 40.0

-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120


JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)

FIGURE 20. LOWER TURN-OFF PROPAGATION DELAY TLPHL FIGURE 21. LOWER TURN-ON PROPAGATION DELAY TLPLH
vs TEMPERATURE vs TEMPERATURE

11
HIP4080A

Typical Performance Curves VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K, and TA = +25C, Unless Otherwise Specified
13.5 13.5

12.5 12.5
GATE DRIVE FALL TIME (ns)

TURN-ON RISE TIME (ns)


11.5 11.5

10.5 10.5

9.5 9.5

8.5 8.5
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)
FIGURE 22. GATE DRIVE FALL TIME TF vs TEMPERATURE FIGURE 23. GATE DRIVE RISE TIME TR vs TEMPERATURE

6.0 1500
HDEL, LDEL INPUT VOLTAGE (V)

1250
5.5
1000
VCC - VOH (mV)

5.0 750
-40C

500 0C
4.5 +25C
250
+75C

+125C
4.0 0
-40 -20 0 20 40 60 80 100 120 10 12 14
JUNCTION TEMPERATURE (C) BIAS SUPPLY VOLTAGE (V)

FIGURE 24. VLDEL, VHDEL VOLTAGE vs TEMPERATURE FIGURE 25. HIGH LEVEL OUTPUT VOLTAGE, VCC - VOH vs
BIAS SUPPLY AND TEMPERATURE AT 100A

1500 3.5

3.0
GATE DRIVE SINK CURRENT (A)

1250

2.5
1000
2.0
VOL (mV)

750
1.5
-40C
500
0C 1.0
+25C
250 0.5
+75C
+125C 0.0
0
10 12 14 6 7 8 9 10 11 12 13 14 15 16
BIAS SUPPLY VOLTAGE (V) VCC, VDD, VAHG, VBHB (V)

FIGURE 26. LOW LEVEL OUTPUT VOLTAGE VOL vs BIAS FIGURE 27. PEAK PULLDOWN CURRENT IO- BIAS SUPPLY
SUPPLY AND TEMPERATURE AT 100A VOLTAGE

12
HIP4080A

Typical Performance Curves VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K, and TA = +25C, Unless Otherwise Specified (Continued)
3.5 500

200

LOW VOLTAGE BIAS CURRENT (mA)


3.0
GATE DRIVE SINK CURRENT (A)

100 10,000

2.5 50 3,000

20 1,000
2.0
10 100
5
1.5
2
1.0 1
0.5
0.5
0.2
0.0 0.1
6 7 8 9 10 11 12 13 14 15 16 1 2 5 10 20 50 100 200 500 1000
VCC, VDD, VABH, VBHB (V) SWITCHING FREQUENCY (kHz)
FIGURE 28. PEAK PULLUP CURRENT IO+ vs SUPPLY FIGURE 29. LOW VOLTAGE BIAS CURRENT IDD AND ICC
VOLTAGE (LESS QUIESCENT COMPONENT) vs
FREQUENCY AND GATE LOAD CAPACITANCE

1000 9

UV+
BIAS SUPPLY VOLTAGE, VDD (V)

500
LEVEL-SHIFT CURRENT (A)

8.8

200

100 8.6

50
UV-
8.4
20

10 8.2
10 20 50 100 200 500 1000 50 25 0 25 50 75 100 125 150
SWITCHING FREQUENCY (kHz) TEMPERATURE (C)
FIGURE 30. HIGH VOLTAGE LEVEL-SHIFT CURRENT vs FIGURE 31. UNDERVOLTAGE LOCKOUT vs TEMPERATURE
FREQUENCY AND BUS VOLTAGE

150

120
DEAD-TIME (ns)

90

60

30

0
10 50 100 150 200 250
HDEL/LDEL RESISTANCE (k)
FIGURE 32. MINIMUM DEAD-TIME vs DEL RESISTANCE

13
IN2 IN1 +12V POWER SECTION
B+
14

2 C8
CONTROL LOGIC R21 Q1
+ DRIVER SECTION 1
SECTION R29

JMPR5
CR2
C6
3 2
HIP4080A/81A Q3
C4 R22 1
JMPR1 U1
1 2 OUT/BLI
U2 1 BHB BHO 20
2 HEN/BHI BHS 19 3
CD4069UB 3 DIS BLO 18 L1
4 V AO
12
JMPR2
IN+/ALI SS BLS 17 2
13 L2
U2 5 OUT/BLI 16 +12V Q2 C1
VDD R23 1 BO

HIP4080A
6 IN+/ALI V 15
CC
CD4069UB 7 IN-/AHI C2
ALS 14 3
JMPR3 8 HDEL ALO 13
5 6 HEN/BHI
U2 2
9 LDEL AHS 12
R24 Q4
10 AHB AHO 11 1
CD4069UB R33 R34
3 3
JMPR4 CR1 3
11 10 IN-/AHI 2 2
U2
CW 1 CW 1 C3
CD4069UB CX CY R30 R31

C5 COM

ALS BLS

NOTES:
1. DEVICE CD4069UB PIN 7 = COM. PIN 14 = +12V.
2. COMPONENTS L1, L2, C1, C2, CX, CY, R30, R31, ARE NOT
SUPPLIED. REFER TO APPLICATION NOTE FOR HELP IN
DETERMINING JMPR1 - JMPR4 JUMPER LOCATIONS.

FIGURE 33. HIP4080A EVALUATION PC BOARD SCHEMATIC


15

GND +12V
B+ COM

JMPR5
R29

R27
R28
R26

C1
C8

C7

C6
CR2
+ + AO

R32
Q1 Q3
C4 R22 1 1
U1
BHO
R24

C2
U2 DIS BLO

HIP4080/81
BO

L1

L2
IN1 BLS

HIP4080A
I JMPR1
JMPR2
O Q2 Q4
JMPR3 ALS R23
IN2 JMPR4 ALO 1 1
R21
O AHO
LDEL
C3
HDEL

C5
ALS

CX

CY
CR1

R33 R34

R30

R31
BLS

FIGURE 33. HIP4080A EVALUATION BOARD SILKSCREEN


HIP4080A

Dual-In-Line Plastic Packages (PDIP)

N
E20.3 (JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX INCHES MILLIMETERS
AREA 1 2 3 N/2
SYMBOL MIN MAX MIN MAX NOTES
-B-
A - 0.210 - 5.33 4
-A-
D E A1 0.015 - 0.39 - 4
BASE A2 0.115 0.195 2.93 4.95 -
PLANE A2
-C- A
B 0.014 0.022 0.356 0.558 -
SEATING
PLANE L C B1 0.045 0.070 1.55 1.77 8
L
D1 A1 eA C 0.008 0.014 0.204 0.355 -
D1
B1 e D 0.980 1.060 24.89 26.9 5
eC C
B
eB D1 0.005 - 0.13 - 5
0.010 (0.25) M C A B S
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
NOTES: e 0.100 BSC 2.54 BSC -
1. Controlling Dimensions: INCH. In case of conflict between English
eA 0.300 BSC 7.62 BSC 6
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982. eB - 0.430 - 10.92 7
3. Symbols are defined in the MO Series Symbol List in Section 2.2 L 0.115 0.150 2.93 3.81 4
of Publication No. 95. N 20 20 9
4. Dimensions A, A1 and L are measured with the package seated in
Rev. 0 12/93
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpen-
dicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dam-
bar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

16
HIP4080A

Small Outline Plastic Packages (SOIC) M20.3 (JEDEC MS-013-AC ISSUE C)


20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
N
INCHES MILLIMETERS
INDEX 0.25(0.010) M B M
AREA H SYMBOL MIN MAX MIN MAX NOTES
E
A 0.0926 0.1043 2.35 2.65 -
-B-
A1 0.0040 0.0118 0.10 0.30 -

1 2 3
B 0.014 0.019 0.35 0.49 9
L
C 0.0091 0.0125 0.23 0.32 -
SEATING PLANE D 0.4961 0.5118 12.60 13.00 3
-A- E 0.2914 0.2992 7.40 7.60 4
D A h x 45o
e 0.050 BSC 1.27 BSC -
-C- H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
e A1
C L 0.016 0.050 0.40 1.27 6
B 0.10(0.004)
N 20 20 7
0.25(0.010) M C A M B S
0o 8o 0o 8o -
Rev. 1 1/02

NOTES:
1. Symbols are defined in the MO Series Symbol List in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension D does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension E does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. L is the length of terminal for soldering to a substrate.
7. N is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width B, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.

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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

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17