Cadence Allegro (OrCAD) PCB Editor ~

Gerber & Drill Output

by Terri Miller Mon May 14, 2012 9:30 am

Hello all!

To generate Gerber & NC Drill files from OrCAD

(Cadence Allegro) PCB Editor, Open the native file
(.BRD) in OrCAD PCB Editor;

Gerber Files: From the Editors window, go to

Manufacture > Artwork; on the Artwork Control Form,
click on the General Parameters tab to make active
and then confirm the following settings:

Device Type ~ Gerber RS274X

Film Size Limits ~ 14 x 16

Leave remaining default settings to keep outputs

consistent. Now, click on the Film Control tab and
choose Select all from the bottom of the Available
Films section and then Create Artwork. Choose OK to
close this window. The artwork (Gerber files) should
now reside in the originating folder (where your .brd
file is located).

NC Drill File : From the Editors window, go to

Manufacture > NC > NC Drill. The NC Drill dialog box
will open. Confirm that the root file name is present
(board name.drl) and choose 'Auto Tool Select'. Leave
remaining default selections. Click on the Drill button
to generate the NC Drill file. The NC Drill file should
now reside in the originating folder.

Please review attached document Allegro OrCAD PCB

Editor_Gerber-Drill Output.pdf for screenshots and
easy reference.

If you have any comments or suggestions about this

post or any other, please leave a reply here on our
forums or contact one of our Customer Service
Representatives and we will do our best to assist you!

Terri Miller
How to Create a Proper Drill File from Allegro/APD
The NC Drill Parameter
There are some things you can do when producing the Drill Tape from APD that will make
the file a bit more usable for the rest of the world though it involves much user intervention.
The APD Parameter Setup for NC
Drill

Paper Tape

File Name: Enter the file name

you wish to create here.

Header, Leader and Length -

don't care

Code - ASCII

Plated/Non Plated - always check

this -- you don't want plated and
non-plated holes in the same drill
file.

Drill

File Name - this is the default

parameter file name. Leave it at
nc_param.txt.

Format - if your units are metric, use

3.3. If English (inches) use 2.4.

Offset - leave it a 0,0. Otherwise your

Gerber data and Drill data might not
line up.

Route Feedrate - don't care

Coordinates - either will work but we The nc_tools.txt File

recommend Absolute.
Output Units - APD always defaults
to English. Doesn't make sense if your
design is in microns or mm. Select
metric if your design is in metric units.
The Auto Tool Select Option is needed to produce a
proper drill file but APD forces the user to do most of
the heavy lifting. You will need to create and edit a
file called nc_tools.txt that contains the following
information:

Tool Sequence - don't care Tool Diameter P Tool Change Command

Repeat Codes - don't use it, some
CAM stations don't read it.
Leading Zero Suppression - check
it.
Trailing Zero Suppression - don't
check it.
First you must figure out manually which drill hole
sizes need to be defined in this table. To do this open
you list of padstacks and check each stack to see
whether it generates a plated through hole. If so,
note down the diameter of the via hole (the units of
the hole must match the design units -- not the drill
file units ...)

Equal Coordinate Suppression - if Example - in my design I have a padstack called

you check it the data file is smaller but
harder to read.
Auto Tool Select - Check it. You will
then have to create the nc_tools.txt
file or APD will generate an error upon
attempting to output a drill file.
Pattern for DIPs - don't check it.
VIA350 that has a 200 um diameter plated through
hole. I also have a second via called VIA100 that has
a 30 um plated through hole. My nc_tools.txt file
would look like:
200 P T01C0.200
30 P T02C0.030
Be careful. The first entry is the diameter in the
design units (for example microns for a typical IC
package) but the third column must show the diamter
in the drill file units (either mm or inch.).

What is a Gerber file?

A Gerber file (also known as artwork) is a 2-D graphical representation of a single layer
of a PCB. A typical design will have individual Gerber files for each layer (e.g., top
copper, bottom copper, top silkscreen, bottom silkscreen, top soldermask, bottom
soldermask) of a PCB.
What is a drill file?
A drill file (also known as a NC Drill file) stores both the specific sizes and types of drill
bits that will be used in manufacturing a PCB in addition to the specific coordinate
locations where each hole must be drilled. Our equipment uses files that are in Excellon
format.

You need both Gerber files for each layer and a single drill file in order to successfully
submit your design for manufacturing.

How do I export Gerber files from

Cadence?
1. Open your PCB layout in Allegro PCB Designer
2. Choose "Manufacture > Artwork..." The Artwork Control Form window (see Figure 1)
appears.

Figure 1: Artwork window

3. Next, a board outline must be added. Right-click on the TOP folder and choose "Add
Manual" (see Figure 2).

Figure 2: Right-click on TOP and choose "Add Manual"

4. Enter a film name of OUTLINE and click "OK" (see Figure 3).

Figure 3: Film Name window

5. In the Subclass Selection window (see Figure 4), expand the BOARD GEOMETRY folder
and check the box next to OUTLINE. Click "OK".
 Figure 4: Subclass Selection window

6. Select the OUTLINE checkbox (see Figure 5). Make sure in Film options that "Film name:
OUTLINE" appears (if it does not, select the OUTLINE checkbox again). Set the Undefined line
width to 0.1.
 Figure 5: Artwork Control Form

7. Click the "Select all" button to output all of the layers

8. Click "Create Artwork" to export the Gerber files
9. Click "OK" to return to the layout

How do I export solder mask files from

Cadence?
See the Adding Soldermask to a PCB Layout tutorial

How do I export drill files from Cadence?

1. Open your PCB layout in Allegro PCB Designer
2. Choose "Manufacture > NC > NC Drill..." The NC Drill window (see Figure 6) appears.

Figure 6: NC Drill window

3. Click "NC Parameters..." The NC Parameters window (see Figure 7) appears.

 Figure 7: NC Parameters window

4. Select "Enhanced Excellon format" and click "Close"

5. Name the drill file and save it in the same directory as your project
6. Select "Auto tool select" and "Repeat codes"
7. Click "Drill" to export the drill file
8. Click "Close" to return to the layout
Terminology
Now that youve got an idea of what a PCB structure is, lets define some terms
that you may hear when dealing with PCBs:

Annular ring - the ring of copper around a plated through hole in a PCB.

Examples of annular rings.

DRC - design rule check. A software check of your design to make sure the
design does not contain errors such as traces that incorrectly touch,
traces too skinny, or drill holes that are too small.
 Drill hit - places on a design where a hole should be drilled, or where they
actually were drilled on the board. Inaccurate drill hits caused by dull bits
are a common manufacturing issue.

Not so accurate, but functional drill hits.

Finger - exposed metal pads along the edge of a board, used to create a
connection between two circuit boards. Common examples are along the
edges of computer expansion or memory boards and older cartridge-based
video games.
Mouse bites - an alternative to v-score for separating boards from panels.
A number of drill hits are clustered close together, creating a weak spot
where the board can be broken easily after the fact. See the SparkFun
Protosnap boards for a good example.

Mouse bites on the LilyPad ProtoSnap allow the PCB to be snapped apart easily.
 Pad - a portion of exposed metal on the surface of a board to which a
component is soldered.

PTH (plated through-hole) pads on the left, SMD (surface mount device) pads on
the right.
Panel - a larger circuit board composed of many smaller boards which will
be broken apart before use. Automated circuit board handling equipment
frequently has trouble with smaller boards, and by aggregating several
boards together at once, the process can be sped up significantly.
Paste stencil - a thin, metal (or sometimes plastic) stencil which lies over
the board, allowing solder paste to be deposited in specific areas during
assembly.

Abe does a quick demonstration of how to line up a paste stencil and apply
solder paste.
Pick-and-place - the machine or process by which components are placed
on a circuit board.

Bob shows us the SparkFun MyData Pick and Place machine. Its pretty
awesome.
Plane - a continuous block of copper on a circuit board, define by borders
rather than by a path. Also commonly called a pour.
 Various portions of the PCB that have no traces but has a ground pour instead.
Plated through hole - a hole on a board which has an annular ring and
which is plated all the way through the board. May be a connection point
for a through hole component, a via to pass a signal through, or a mounting
hole.

A PTH resistor inserted into the FabFM PCB, ready to be soldered. The legs of the
resistor go through the holes. The plated holes can have traces connected to
them on the front of the PCB and the rear of the PCB.
Pogo pin - spring-loaded contact used to make a temporary connection for
test or programming purposes.
The popular pogo pin with pointed tip. We use tons of these on our test beds.
Reflow - melting the solder to create joints between pads and component
leads.
Silkscreen - the letters, number, symbols, and imagery on a circuit board.
Usually only one color is available, and resolution is usually fairly low.

Silkscreen identifying this LED as the power LED.

Slot - any hole in a board which is not round. Slots may or may not be
plated. Slots sometimes add to add cost to the board because they require
extra cut-out time.
 Complex slots cut into the ProtoSnap - Pro Mini. There are also many mouse
bites shown. Note: the corners of the slots cannot be made completely square
because they are cut with a circular routing bit.
Solder paste - small balls of solder suspended in a gel medium which, with
the aid of a paste stencil, are applied to the surface mount pads on a PCB
before the components are placed. During reflow, the solder in the paste
melts, creating electrical and mechanical joints between the pads and the
component.

Solder paste on a PCB shortly before the components are placed. Be sure to read
about paste stencil above as well.
 Solder pot - a pot used to quickly hand solder boards with through hole
components. Usually contains a small amount of molten solder into which
the board is quickly dipped, leaving solder joints on all exposed pads.
Soldermask - a layer of protective material laid over the metal to prevent
short circuits, corrosion, and other problems. Frequently green, although
other colors (SparkFun red, Arduino blue, or Apple black) are possible.
Occasionally referred to as resist.

Solder mask covers up the signal traces but leaves the pads to solder to.
Solder jumper - a small, blob of solder connecting two adjacent pins on a
component on a circuit board. Depending on the design, a solder jumper
can be used to connect two pads or pins together. It can also cause
unwanted shorts.
Surface mount - construction method which allows components to be
simply set on a board, not requiring that leads pass through holes in the
board. This is the dominant method of assembly in use today, and allows
boards to be populated quickly and easily.

Thermal - a small trace used to connect a pad to a plane. If a pad is not

thermally relieved, it becomes difficult to get the pad to a high enough
temperature to create a good solder joint. An improperly thermally relieved
pad will feel sticky when you attempt to solder to it, and will take an
abnormally long time to reflow.
On the left, a solder pad with two small traces (thermals) connecting the pin to
the ground plane. On the right, a via with no thermals connecting it completely
to the ground plane.
Thieving - hatching, gridlines, or dots of copper left in areas of a board
where no plane or traces exist. Reduces difficulty of etching because less
time in the bath is required to remove unneeded copper.
Trace - a continuous path of copper on a circuit board.

A small trace connecting the Reset pad to elsewhere on the board. A larger,
thicker trace connects to the 5V power pin.
V-score- a partial cut through a board, allowing the board to be easily
snapped along a line.
Via - a hole in a board used to pass a signal from one layer to
another. Tented vias are covered by soldermask to protect them from being
soldered to. Vias where connectors and components are to be attached
are often untented (uncovered) so that they can be easily soldered.

Front and back of the same PCB showing a tented via. This via brings the signal
from the front side of the PCB, through the middle of the board, to the back side.
Wave solder - a method of soldering used on boards with through-hole
components where the board is passed over a standing wave of molten
solder, which adheres to exposed pads and component leads.
 Hi,

I am new to PADS SOFTWARE.

I am designing a 4 layer PCB using PADS software.

I need to know about drafting toolbar of PADS layout.

what is the difference between copper pour/copper/plane area/plane cut

out/flood/hatch???

I tried plane cutout which is nothing but islands of copper in pcb layers. Right?

what about copper. Is it the same or not???

Can anyone help me in understandVivek Alaparthiing this.

Regards
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1. Re: Layout copper pour/copper/plane area/plane cut out/flood/hatch

vial1001 Jan 19, 2013 5:38 AM (in response to vial1001)

I am keeping all the things together

plane area is only on split/mixed planes and the outline only

copper and plane area are the same (plane area shows only outline whereas copper
area shows the copper fill area)
copper pour is used to create solid power or ground planes for better noise
performance. It also reduces the amount of copper to be etched if you are etching the
board yourself.

Flood is nothing but solid copper whereas hatch is thin copper

We can specify "keep out" areas where you do not want copper pour, negating the
copper pour

Correct me if I am wrong
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2. Re: Layout copper pour/copper/plane area/plane cut out/flood/hatch

dcox Apr 17, 2015 7:19 AM (in response to vial1001)

First, regardless of what type of copper you create, you are making it with a specific line
width. You can select this before you draw the copper or change it afterwards. You then
set the copper hatch grid to define how far apart these lines are when the copper is
drawn and whether this hatch is diagonal or orthogonal. If you draw the copper with a
10 mil grid and set the copper hatch grid to 10 mils, the copper will be solid. If you set
the hatch grid to 20 mils, your copper will draw with 10 mil gaps and look like a net, or a
chain link fence if the hatch is set to diagonal. Copper drawn with 5 mils, hatched at 20,
will have 15 mil gaps in coverage.

-Copper is plain static copper. The edge you define is the edge you get. You assign a
netname to it so Pads can use it to check spacing to other features.
When copper pour or split mixed plane areas are created, you define a native outline.
When these areas are flooded, the native outline is not deleted or changed, but
replaced with a new outline with dynamically drawn edges. These edges move when the
copper is reflooded due to circuitry changes or spacing values are changed. Hatching
the copper does not change the copper edges, but changes the way the copper looks
and its coverage. You can edit the edges of a flooded copper area, but these changes
will be undone when the copper is reflooded.

-Copper pour is an area that is flooded with copper after you create it. The native edge
is dynamically replaced with a drawn edge created based on the spacings you set up in
the Design Rules. The smaller the line is when the copper is drawn, the tighter it will
flood into corners and between pads, but it will not violate spacing. If you create copper
with a 5 mil line, but your design rules are such that only a 4 mil gap is available
between pads, the copper will not flood between the pads. You could reduce the line
size used to draw the copper or reduce the copper spacing. Although some fab houses
can maintain a 2.5 mil line, my standard designs limit the lower size to 5 mils for
copper, mostly because of the points that the copper makes in the corners. (a sharp
point can shift when the board is imaged, potentially causing shorts) When you save
the job and during other aspects of the design, the hatched copper is removed, but the
flooded edge remains. Make sure to rehatch the copper before making photoplots or
you will only get the outline.
-plane areas are copper pours that are created on split mixed layers. They can be
manually drawn, or created based on the board outlilne. The difference is in how they
flood. Whereas a copper pour will flood based on the pads present on the layer with all
pads present on the photoplot, a plane area pours up to the pads only if they are tied to
the plane and are part of a thermal. On pins that are not tied to the plane, the flooded
edge backs away from the hole, not the pad. This gets more plane coverage between
pads that are not tied to the plane. The photoplot for split mixed planes only contains
pads that are part of thermals and clearance voids for all the other pins. The copper-
drill spacing is set up in the rules. The value for the drill is created by adding the hole
size specified in the decal to the Drill Oversize value setup in the options. The drill
oversize value defaults to 3 mils which allows for up to 1 oz of copper to be plated
inside the hole barrel.
-a plane cutout is just a clear area in a split mixed plane. a copper pour cutout is a clear
area inside a copper pour area. This is usually created in areas where the signals should
not coupled to planes such as bd areas that contain high intensity noise or AC.

Copper areas can be imbedded in other copper areas, but if that happens, each native
copper area needs to have its priority set so Pads knows which plane to flood first, then
second and so on. If two planes are in the same area with the same priority, Pads will
not flood either plane.
1 of 1 people found this helpful
https://learn.sparkfun.com/tutorials/how-to-read-a-
schematic

Overview
Schematics are our map to designing, building, and troubleshooting circuits.
Understanding how to read and follow schematics is an important skill for any
electronics engineer.

This tutorial should turn you into a fully literate schematic reader! Well go over
all of the fundamental schematic symbols:
Then well talk about how those symbols are connected on schematics to create
a model of a circuit. Well also go over a few tips and tricks to watch out for.

Suggested Reading
Schematic comprehension is a pretty basic electronics skill, but there are a few
things you should know before you read this tutorial. Check out these tutorials, if
they sound like gaps in your growing brain:

What is Electricity?
What is a Circuit?

Voltage, Current, Resistance, and Ohms Law

Schematic Symbols (Part 1)
Are you ready for a barrage of circuit components? Here are some of the
standardized, basic schematic symbols for various components.

Resistors
The most fundamental of circuit components and symbols! Resistors on a
schematic are usually represented by a few zig-zag lines, with two
terminals extending outward. Schematics using international symbols may
instead use a featureless rectangle, instead of the squiggles.

Potentiometers and Variable Resistors

Variable resistors and potentiometers each augment the standard resistor
symbol with an arrow. The variable resistor remains a two-terminal device, so the
arrow is just laid diagonally across the middle. A potentiometer is a three-
terminal device, so the arrow becomes the third terminal (the wiper).

Capacitors
There are two commonly used capacitor symbols. One symbol represents
a polarized (usually electrolytic or tantalum) capacitor, and the other is for non-
polarized caps. In each case there are two terminals, running perpendicularly
into plates.
The symbol with one curved plate indicates that the capacitor is polarized. The
curved plate represents the cathode of the capacitor, which should be at a lower
voltage than the positive, anode pin. A plus sign might also be added to the
positive pin of the polarized capacitor symbol.

Inductors
Inductors are usually represented by either a series of curved bumps, or loopy
coils. International symbols may just define an inductor as a filled-in rectangle.

Switches
Switches exist in many different forms. The most basic switch, a single-
pole/single-throw (SPST), is two terminals with a half-connected line
representing the actuator (the part that connects the terminals together).

Switches with more than one throw, like the SPDT and SP3T below, add more
landing spots for the the actuator.
Switches with multiple poles, usually have multiple, alike switches with a dotted
line intersecting the middle actuator.

Power Sources
Just as there are many options out there for powering your project, there are a
wide variety of power source circuit symbols to help specify the power source.

DC or AC Voltage Sources
Most of the time when working with electronics, youll be using constant voltage
sources. We can use either of these two symbols to define whether the source is
supplying direct current (DC) or alternating current (AC):
Batteries
Batteries, whether theyre those cylindrical, alkaline AAs or
rechargeable lithium-polymers, usually look like a pair of disproportionate,
parallel lines:

More pairs of lines usually indicates more series cells in the battery. Also, the
longer line is usually used to represent the positive terminal, while the shorter
line connects to the negative terminal.

Voltage Nodes
Sometimes on really busy schematics especially you can assign special
symbols to node voltages. You can connect devices to these one-
terminal symbols, and itll be tied directly to 5V, 3.3V, VCC, or GND (ground).
Positive voltage nodes are usually indicated by an arrow pointing up, while
ground nodes usually involve one to three flat lines (or sometimes a down-
pointing arrow or triangle).
Schematic Symbols (Part 2)

Diodes
Basic diodes are usually represented with a triangle pressed up against a line.
Diodes are also polarized, so each of the two terminals require distinguishing
identifiers. The positive, anode is the terminal running into the flat edge of the
triangle. The negative, cathode extends out of the line in the symbol (think of it
as a - sign).

There are a all sorts of different types of diodes, each of which has a special riff
on the standard diode symbol. Light-emitting diodes (LEDs) augment the diode
symbol with a couple lines pointing away. Photodiodes, which generate energy
from light (basically, tiny solar cells), flip the arrows around and point them
toward the diode.

Other special types of diodes, like Schottkys or zeners, have their own symbols,
with slight variations on the bar part of the symbol.
Transistors
Transistors, whether theyre BJTs or MOSFETs, can exist in two configurations:
positively doped, or negatively doped. So for each of these types of transistor,
there are at least two ways to draw it.

Bipolar Junction Transistors (BJTs)

BJTs are three-terminal devices; they have a collector (C), emitter (E), and a
base (B). There are two types of BJTs NPNs and PNPs and each has its own
unique symbol.

The collector (C) and emitter (E) pins are both in-line with each other, but the
emitter should always have an arrow on it. If the arrow is pointing inward, its a
PNP, and, if the arrow is pointing outward, its an NPN. A mnemonic for
remembering which is which is NPN: not pointing in.

Metal Oxide Field-Effect Transistors (MOSFETs)

Like BJTs, MOSFETs have three terminals, but this time theyre named source
(S), drain (D), and gate (G). And again, there are two different versions of the
symbol, depending on whether youve got an n-channel or p-channel MOSFET.
There are a number of commonly used symbols for each of the MOSFET types:
The arrow in the middle of the symbol (called the bulk) defines whether the
MOSFET is n-channel or p-channel. If the arrow is pointing in means its a n-
channel MOSFET, and if its pointing out its a p-channel. Remember: n is in
(kind of the opposite of the NPN mnemonic).

Digital Logic Gates

Our standard logic functions AND, OR, NOT, and XOR all have unique
schematic symbols:

Adding a bubble to the output negates the function, creating NANDs, NORs, and
XNORs:

They may have more than two inputs, but the shapes should remain the same
(well, maybe a bit bigger), and there should still only be one output.

Integrated Circuits
Integrated circuits accomplish such unique tasks, and are so numerous, that
they dont really get a unique circuit symbol. Usually, an integrated circuit is
represented by a rectangle, with pins extending out of the sides. Each pin should
be labeled with both a number, and a function.

Schematic symbols for an ATmega328 microcontroller (commonly found

on Arduinos), an ATSHA204 encryption IC, and an ATtiny45 MCU. As you can see,
these components greatly vary in size and pin-counts.
Because ICs have such a generic circuit symbol, the names, values and labels
become very important. Each IC should have a value precisely identifying the
name of the chip.

Unique ICs: Op Amps, Voltage Regulators

Some of the more common integrated circuits do get a unique circuit symbol.
Youll usually see operation amplifiers laid out like below, with 5 total terminals:
a non-inverting input (+), inverting input (-), output, and two power inputs.
Often, there will be two op amps built into one IC package requiring only one pin
for power and one for ground, which is why the one on the right only has three
pins.
Simple voltage regulators are usually three-terminal components with input,
output and ground (or adjust) pins. These usually take the shape of a rectangle
with pins on the left (input), right (output) and bottom (ground/adjust).

Miscellany
Crystals and Resonators
Crystals or resonators are usually a critical part of microcontroller circuits. They
help provide a clock signal. Crystal symbols usually have two terminals, while
resonators, which add two capacitors to the crystal, usually have three
terminals.

Headers and Connectors

Whether its for providing power, or sending out information, connectors are a
requirement on most circuits. These symbols vary depending on what the
connector looks like, heres a sampling:
Motors, Transformers, Speakers, and Relays
Well lump these together, since they (mostly) all make use of coils in some
way. Transformers (not the more-than-meets-the-eye kind) usually involve two
coils, butted up against each other, with a couple lines separating them:

Relays usually pair a coil with a switch:

Speakers and buzzers usually take a form similar to their real-life counterparts:
And motors generally involve an encircled M, sometimes with a bit more
embellishment around the terminals:

Fuses and PTCs

Fuses and PTCs devices which are generally used to limit large inrushes of
current each have their own unique symbol:

The PTC symbol is actually the generic symbol for a thermistor, a temperature-
dependent resistor (notice the international resistor symbol in there?).

No doubt, there are many circuit symbols left off this list, but those above should
have you 90% literate in schematic reading. In general, symbols should share a
fair amount in common with the real-life components they model. In addition to
the symbol, each component on a schematic should have a unique name and
value, which further helps to identify it.

Name Designators and Values

One of the biggest keys to being schematic-literate is being able to recognize
which components are which. The component symbols tell half the story, but
each symbol should be paired with both a name and value to complete it.
Names and Values
Values help define exactly what a component is. For schematic components like
resistors, capacitors, and inductors the value tells us how many ohms, farads, or
henries they have. For other components, like integrated circuits, the value may
just be the name of the chip. Crystals might list their oscillating frequency as
their value. Basically, the value of a schematic component calls out its most
important characteristic.

Component names are usually a combination of one or two letters and a number.
The letter part of the name identifies the type of component Rs for
resistors, Cs for capacitors, Us for integrated circuits, etc. Each component
name on a schematic should be unique; if you have multiple resistors in a circuit,
for example, they should be named R1, R2, R3, etc. Component names help us
reference specific points in schematics.

The prefixes of names are pretty well standardized. For some components, like
resistors, the prefix is just the first letter of the component. Other name prefixes
are not so literal; inductors, for example, are Ls (because current has already
taken I [but it starts with a Celectronics is a silly place]). Heres a quick table of
common components and their name prefixes:

Name Identifier Component

R Resistors

C Capacitors

L Inductors

S Switches

D Diodes

Q Transistors

U Integrated Circuits

Crystals and
Y
Oscillators
Although theses are the standardized names for component symbols, theyre
not universally followed. You might see integrated circuits prefixed
with IC instead of U, for example, or crystals labeled as XTALs instead of Ys.
Use your best judgment in diagnosing which part is which. The symbol should
usually convey enough information.

Reading Schematics
Understanding which components are which on a schematic is more than half
the battle towards comprehending it. Now all that remains is identifying how all
of the symbols are connected together.

Nets, Nodes and Labels

Schematic nets tell you how components are wired together in a circuit. Nets are
represented as lines between component terminals. Sometimes (but not always)
theyre a unique color, like the green lines in this schematic:

Junctions and Nodes

Wires can connect two terminals together, or they can connect dozens. When a
wire splits into two directions, it creates a junction. We represent junctions on
schematics with nodes, little dots placed at the intersection of the wires.
Nodes give us a way to say that wires crossing this junction are connected.
The absences of a node at a junction means two separate wires are just passing
by, not forming any sort of connection. (When designing schematics, its usually
good practice to avoid these non-connected overlaps wherever possible, but
sometimes its unavoidable).

Net Names
Sometimes, to make schematics more legible, well give a net a name and label
it, rather than routing a wire all over the schematic. Nets with the same name
are assumed to be connected, even though there isnt a visible wire connecting
them. Names can either be written directly on top of the net, or they can be
tags, hanging off the wire.
 Each net with the same name is connected, as in this schematic for an FT231X
Breakout Board. Names and labels help keep schematics from getting too
chaotic (imagine if all those nets were actually connected with wires).
Nets are usually given a name that specifically states the purpose of signals on
that wire. For example, power nets might be labeled VCC or 5V, while serial
communication nets might be labeled RX or TX.

Schematic Reading Tips

Identify Blocks
Truly expansive schematics should be split into functional blocks. There might be
a section for power input and voltage regulation, or a microcontroller section, or
a section devoted to connectors. Try recognizing which sections are which, and
following the flow of circuit from input to output. Really good schematic
designers might even lay the circuit out like a book, inputs on the left side,
outputs on the right.
 If the drawer of a schematic is really nice (like the engineer who designed
this schematic for the RedBoard), they may separate sections of a schematic
into logical, labeled blocks.

Recognize Voltage Nodes

Voltage nodes are single-terminal schematic components, which we can connect
component terminals to in order to assign them to a specific voltage level. These
are a special application of net names, meaning all terminals connected to a like-
named voltage node are connected together.
 Like-named voltage nodes like GND, 5V, and 3.3V are all connected to their
counterparts, even if there arent wires between them.
The ground voltage node is especially useful, because so many components need
a connection to ground.

Reference Component Datasheets

If theres something on a schematic that just doesnt make sense, try finding a
datasheet for the most important component. Usually the component doing the
most work on a circuit is an integrated circuit, like a microcontroller or sensor.
These are usually the largest component, oft-located at the center of the
schematic.

Resources and Going Further

Thats all there is to schematic reading! Knowing component symbols, following
nets, and identifying common labels. Understanding how a schematic works
opens up the whole world of electronics to you! Check out some of these tutorial,
to practice your new-found schematic knowledge:

Voltage Dividers - This is one of the most basic, fundamental circuits.

Learn how to turn a big voltage into a smaller one, with just two resistors!
How to Use a Breadboard - Now that you know how to read schematics,
why not make one! Breadboards are a great way to make temporary,
functional, prototype circuits.
 Working with Wire - Or, skip the breadboard and jump straight into wiring
stuff up. Knowing how to cut, strip, and connect wire is an important
electronics skill.

Series and Parallel Circuits - Building circuits in series or parallel requires

a good understanding of schematics.

Sewing with Conductive Thread - If you dont want to work with wire, how
about building an e-textiles circuit with conductive thread? Thats the
beauty of schematics, the same schematic circuit can be built in a number
of different ways with a number of different mediums.
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Fabrication - Assembly
Printed Circuit Design

PC UNIQUE
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Links to PC Unique Standards and Reference Materials:
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PC UNIQUE STANDARD FOOTPRINT CONSTRUCTION

All Footprints to be constructed per IPC-7351 nominal standards.

The symbol units, English or Metric, shall be determined by the datasheet with preference given to the unit
of measurement that is native to the datasheet.
Mils is the preferred unit of measure with an accuracy level of 2 decimal places.
If Metric is to be used, select millimeters with an accuracy level of 3 decimal places.

1. SQUARE PIN IDENTIFICATION, THROUGH HOLE

All through hole pads shall be round. Where orientation identification is required, a square pad for through-hole
components shall depict the following:
Cathode end of an axial lead diode (pin 1)
Plus side of a polarized axial lead capacitor (pin 1)
Pin 1 or A1 of a through hole connector
Pin 1 of a dual-inline package or the first alphanumeric pin of a through hole array

2. FOOTPRINT ORIENTATION
Refer to IPC-7351 Zero Component Orientations for proper component orientations.
 All axial lead components and surface mount discrete components are to be drawn longest length
horizontally. If a pin has polarity, that pin (Pin 1) shall be on the left. Polarity examples are the positive + side of a
capacitor, or the cathode side of a diode.
All sips and dips shall be oriented vertically with pin 1 at the upper left.
All BGAs shall be oriented with pin A1 located top left so that rows and columns are numbered left to right,
lettered top to bottom.
All other components shall be oriented with pin 1 or the first alphanumeric pin located in the upper left corner
of the device as viewed from the component side. If pin is not in a corner, then it shall be located on the upper (top)
side of the device as viewed from the component side.

3. PIN NUMBERING
Pin numbers shall reflect the component data sheet and the schematic symbol.
Mounting holes and other lands such as thermal or case ground pads that have potential of electrical
connection shall be assigned pins with the next available pin number.
Mounting holes and other lands that will not be electrically connected shall be entered as stand alone pins
and shall not be assigned pin numbers.

4. ASSEMBLY GRAPHICS
Outline
The Assembly Outline shall be drawn with 3 mil width lines and profile the maximum body dimensions.
Orientation / Polarization Indicator
The Assembly Outline shall include an orientation and/or polarization indicators if applicable. If the actual
part has an indicator such as a dot, chamfer, stripe or text, incorporate that indicator into the assembly graphics in the
same location and style as on the actual part if possible.

5. SILK SCREEN GRAPHICS

Minimum Space To Exposed Pads
The gap between any silkscreen graphics and an exposed pad shall be 7 mil minimum.
Outline and Orientation Indicator
The outline shall be drawn with a line width of 8 mils and shall appear on the component side only. It shall
profile the maximum body dimensions including any features that identify orientation (i.e. corner chamfer indicating
pin 1) but shall avoid any exposed lands by 7 mil minimum.
Pin 1 Indicator
For all multi-pin surface mount components such as integrated circuits, a 20 mil diameter circle with a line
width of 8 mils shall be placed close pin 1 of the component in addition to any other indicator used.
Polarization Indicator
Polarized capacitors and diodes shall have an 15 mil wide rectangle placed at the end of the appropriate pin,
with a distance of 5 mil minimum to the pad. This method is preferred over the use of a plus sign (+).

6. REFERENCE DESIGNATORS
Silkscreen Legend Reference Designators
The size (height) of the characters used for Reference Designators on the Silkscreen Legend shall be
greater than or equal to .035 with a minimum line width of .006.
The preferred size for dense boards is: Width 35.00, Height: 35.00, Stroke Width: 6.00.
Reference text such as labels for powers, SMA connectors, or potentiometers shall be .050 high whenever
possible.
No silk-screen shall appear on any exposed lands, pads or other non-solder masked areas.
Assembly Reference Designators
The Assembly Reference Designator (.Designator) shall be 35 mil high characters, center justified, and
placed in the center of the component if possible. 20 mil shall be the absolute minimum character size.
 7. SOLDER MASK
The Solder Mask shall provide an annular resist clearance of .0025 around any exposed lands or shapes.
All lands and shapes shall be non solder mask defined, unless otherwise specified.

8. SOLDER PASTE MASK

The Solder Paste Mask shall be the same size as the surface mount component pad.or shape.
Solder Paste Mask shall not appear on thru hole pads.

9. PLACEMENT BOUNDARY (COURTYARD) AND COMPONENT HEIGHT

Placement Boundary shall be per IPC 7351, nominal.
For parts not covered in IPC7351, the boundary shall extend 5 mils beyond than the maximum outline of the
part not including the pin footprints.
If the parts are designed to be stacked together, the Placement Boundary shall be the nominal outline of the
part. Part Height shall be included at the maximum.

10. KEEPOUTS
To insure traces and planes do not get too close to unplated holes and other protected features, create
proper keepout zones on all layers by drawing appropriate route keepout graphics.
Other route and via keep outs shall be determined by the data sheet or design engineer.

11. COMPONENT FIDUCIALS

Ball Grid Arrays (BGAs) and components with a pin pitch of less than 15 mils (0.40mm) shall have fiducials.
The fiducials shall be placed outside the component, equally spaced diagonally in opposite corners.
Fiducial pads shall be a 40 mil diameter round pad with a 80 mil diameter solder mask clearance and a 100
mil route keepout unless specific requirements dictate otherwise.

12. POINT OF ORIGIN

The 0,0 origin of the footprint symbol for through hole devices shall be pin 1 or the first alphanumeric pin.
For surface mount devices the 0,0 origin of the symbol shall be the body center as defined by the center of
the pin footprint pattern.
Do not use the package body to determine the body center.

13. BODY CENTER

The body center graphics shall be located at the center of the footprint. This is defined as the center of the
padstack array.
Do not use the package body to determine the body center.
For through hole components the body center will likely not be the same as the 0,0 origin.

14. CHECK DATA

The footprint(s) created shall be checked and verified against the manufacture data sheets for such features as pin
numbering, pin spacing, mechanical dimensions and tolerances, pad and drill sizes, package height, keep-out
graphics, orientation indicators on both assembly and silkscreen graphics, fiducials if required and proper symbol
origin.

15. RELEASE FOOTPRINT

All footprints shall be released into the PC Unique Footprint Library after the check cycle has been completed.