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Vishay Semiconductors
High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH
VSMB2000X01 VSMB2020X01 FEATURES
Package type: surface mount
Package form: GW, RGW
Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
AEC-Q101 qualified
Peak wavelength: p = 940 nm
21725-4
High reliability
High radiant power
DESCRIPTION
High radiant intensity
VSMB2000X01 series are infrared, 940 nm emitting diodes
Angle of half intensity: = 12
in GaAlAs (DH) technology with high radiant power and high
speed, molded in clear, untinted plastic packages (with lens) Low forward voltage
for surface mounting (SMD). Suitable for high pulse current operation
Terminal configurations: gullwing or reserve gullwing
APPLICATIONS
Package matches with detector VEMD2000X01 series
IrDA compatible data transmission
Floor life: 4 weeks, MSL 2a, acc. J-STD-020
Miniature light barrier
Compliant to RoHS Directive 2002/95/EC and in
Photointerrupters accordance to WEEE 2002/96/EC
Optical switch Note
Control and drive circuits ** Please see document Vishay Material Category Policy:
www.vishay.com/doc?99902
Shaft encoders
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) (deg) P (nm) tr (ns)
VSMB2000X01 40 12 940 15
VSMB2020X01 40 12 940 15
Note
Test conditions see table Basic Characteristics
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMB2000X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing
VSMB2020X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing
Note
MOQ: minimum order quantity
120
180
160
100
PV - Power Dissipation (mW)
120 80
100
60
80 RthJA = 250 K/W RthJA = 250 K/W
40
60
40
20
20
0
0
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
21343 Tamb - Ambient Temperature (C) 21344 Tamb - Ambient Temperature (C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
1000 180
140
100
120
IF = 100 mA
100
10
80
tp = 100 s
tp/T= 0.001 60
tp = 20 ms
1 40
0 1 2 3 - 60 - 40 - 20 0 20 40 60 80 100
21534 VF - Forward Voltage (V) 21444 Tamb - Ambient Temperature (C)
Fig. 3 - Forward Current vs. Forward Voltage Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
110 100
VF, rel - Relative Forward Voltage (%)
104 70
102 60
IF = 100 mA
100 50
IF = 10 mA
98 40
96 tp = 20 ms 30
94 20
IF = 1 mA
92 10
90 0
- 40 - 20 0 20 40 60 80 100 840 880 920 960 1000 1040
21443 Tamb - Ambient Temperature (C) 21445 - Wavelength (nm)
Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Power vs. Wavelength
0 10 20
1000 30
tp = 100 s
Ie rel - Relative Radiant Intensity
Ie - Radiant Intensity (mW/sr)
tp/T= 0.001
- Angular Displacement
100
40
1.0
10 50
0.9
60
1 0.8
70
0.7 80
0.1
1 10 100 1000 0.6 0.4 0.2 0
21550
IF - Forward Current (mA)
Fig. 5 - Radiant Intensity vs. Forward Current Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
200 Floor life (time between soldering and removing from MBB)
max. 30 s
must not exceed the time indicated on MBB label:
150
Floor life: 4 weeks
max. 120 s max. 100 s
Conditions: Tamb < 30 C, RH < 60 %
100
Moisture sensitivity level 2a, acc. to J-STD-020.
50 max. ramp up 3 C/s max. ramp down 6 C/s
DRYING
0 In case of moisture absorption devices should be baked
0 50 100 150 200 250 300
before soldering. Conditions see J-STD-020 or label.
19841 Time (s) Devices taped on reel dry using recommended conditions
Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 192 h at 40 C (+ 5 C), RH < 5 %.
0.3
Z
2.77 0.2
0.19
1.6
2.2 2.2
5.8 0.2
Z 20:1
1.1 0.1
0.5
0.4
technical drawings
1.7 according to DIN
Solder pad proposal
0.75
specifications
acc. IPC 7351
2.3 0.1
6.7
Drawing-No.: 6.544-5391.02-4
Issue: 2; 18.03.10
21517
0.3
2.77 0.2
X
1.6
0.05
0.19
2.2 2.2
4.2 0.2
X 20:1
exposed copper
2.3 0.2
0.5
0.4
2.3 0.2
0.254
0.6
Cathode Anode
Pin ID
technical drawings
according to DIN
specifications
Solder pad proposal
0.75
2.45
5.15
Drawing-No.: 6.544-5383.02-4
Issue: 4; 18.03.10
21488
62 0.5
2.
5
Tape position
0
coming out from reel
.5
6000 pcs/reel
330 1
0.5
13
Technical drawings
according to DIN
specifications
Label posted here
12.4 1.5
1.75 0.1
Terminal position in tape
1.55 0.05 4 0.1
Devicce Lead I Lead II I
X 2:1 2 0.05
VEMT2000
VEMT2500 Collector Emitter
12 0.3
VEMD2000
VEMD2500
Cathode Anode
5.5 0.05
VSMB2000
VSMG2000
VSMY2850RG Anode Cathode 3.05 0.1
II 4 0.1
Drawing-No.: 9.800-5100.01-4
Issue: 2; 18.03.10
21572
2.
62 0.5
5
Tape position
0.5
coming out from reel
6000 pcs/reel
330 1
0.5
13
technical drawings
according to DIN
Label posted here specifications
12.4 1.5
1.75 0.1
Terminal position in tape
1.55 0.05 4 0.1
Devicce Lead I Lead II I 2 0.05
X 2:1
VEMT2020
VEMT2520 Collector Emitter
VSMB2020 12 0.3
VSMG2020
Cathode Anode
5.5 0.05
VEMD2020
VEMD2520
VSMY2850G Anode Cathode 3.05 0.1
4 0.1
II
Drawing-No.: 9.800-5091.01-4
Issue: 3; 18.03.10
21571
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