Beruflich Dokumente
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DEVICE INFORMATION
Output Voltage
Operating Ambient
Package 3.0 V 3.3 V 5.0 V Adjustable Temperature Range
Input Output
5.0 V/100 mA
3 1
Battery or 1.0 mF
182 k
Unregulated DC
Error Amplifier 60 k
1.23 V
Reference
LP2950CZ5.0
GND 2
5.0 V/100 mA
Battery or Input 8 Output 1 Sense 2
1.0 mF
Unregulated DC
182 k
VO Tap
6
60 k
7 330 k
Error Feedback
Amplifier
Shutdown
From 3 60 k 75 mV/
CMOS/TTL 50 k Error
60 mV
Output
To CMOS/TTL
5
1.23 V Error Detection
Reference Comparator
LP2951CD or CN
GND 4
This device contains 34 active transistors.
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LP2950, LP2951, NCV2951
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LP2950, LP2951, NCV2951
ELECTRICAL CHARACTERISTICS
(Vin = VO + 1.0 V, IO = 100 mA, CO = 1.0 mF, TA = 25C [Note 3], unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Output Voltage, 5.0 V Versions VO V
Vin = 6.0 V, IO = 100 mA, TA = 25C
LP2950C5.0/LP2951C/NCV2951C* 4.950 5.000 5.050
LP2950AC5.0/LP2951AC/NCV2951AC* 4.975 5.000 5.025
TA = 40 to +125C
LP2950C5.0/LP2951C/NCV2951C* 4.900 5.100
LP2950AC5.0/LP2951AC/NCV2951AC* 4.940 5.060
Vin = 6.0 to 30 V, IO = 100 mA to 100 mA, TA = 40 to +125C
LP2950C5.0/LP2951C/NCV2951C* 4.880 5.120
LP2950AC5.0/LP2951AC/NCV2951AC* 4.925 5.075
Output Voltage, 3.3 V Versions VO V
Vin = 4.3 V, IO = 100 mA, TA = 25C
LP2950C3.3/LP2951C3.3 3.267 3.300 3.333
LP2950AC3.3/LP2951AC3.3/NCV2951AC3.3* 3.284 3.300 3.317
TA = 40 to +125C
LP2950C3.3/LP2951C3.3 3.234 3.366
LP2950AC3.3/LP2951AC3.3/NCV2951AC3.3* 3.260 3.340
Vin = 4.3 to 30 V, IO = 100 mA to 100 mA, TA = 40 to +125C
LP2950C3.3/LP2951C3.3 3.221 3.379
LP2950AC3.3/LP2951AC3.3/NCV2951AC3.3* 3.254 3.346
Output Voltage, 3.0 V Versions VO V
Vin = 4.0 V, IO = 100 mA, TA = 25C
LP2950C3.0/LP2951C3.0 2.970 3.000 3.030
LP2950AC3.0/LP2951AC3.0 2.985 3.000 3.015
TA = 40 to +125C
LP2950C3.0/LP2951C3.0 2.940 3.060
LP2950AC3.0/LP2951AC3.0 2.964 3.036
Vin = 4.0 to 30 V, IO = 100 mA to 100 mA, TA = 40 to +125C
LP2950C3.0/LP2951C3.0 2.928 3.072
LP2950AC3.0/LP2951AC3.0 2.958 3.042
1. The JunctiontoAmbient Thermal Resistance is determined by PCB copper area per Figure 29.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM), 2000 V, Class 2, JESD22 A114C
Machine Model (MM), 200 V, Class B, JESD22 A115A
Charged Device Model (CDM), 2000 V, Class IV, JESD22 C101C
3. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. VO(nom) is the part number voltage option.
5. Noise tests on the LP2951 are made with a 0.01 mF capacitor connected across Pins 7 and 1.
*NCV prefix is for automotive and other applications requiring site and change control.
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LP2950, LP2951, NCV2951
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LP2950, LP2951, NCV2951
DEFINITIONS
Dropout Voltage The input/output voltage differential Output Noise Voltage The RMS ac voltage at the
at which the regulator output no longer maintains regulation output, with constant load and no input ripple, measured
against further reductions in input voltage. Measured when over a specified frequency range.
the output drops 100 mV below its nominal value (which is Leakage Current Current drawn through a bipolar
measured at 1.0 V differential), dropout voltage is affected transistor collectorbase junction, under a specified
by junction temperature, load current and minimum input collector voltage, when the transistor is off.
supply requirements. Upper Threshold Voltage Voltage applied to the
Line Regulation The change in output voltage for a comparator input terminal, below the reference voltage
change in input voltage. The measurement is made under which is applied to the other comparator input terminal,
conditions of low dissipation or by using pulse techniques which causes the comparator output to change state from a
such that average chip temperature is not significantly logic 0 to 1.
affected. Lower Threshold Voltage Voltage applied to the
Load Regulation The change in output voltage for a comparator input terminal, below the reference voltage
change in load current at constant chip temperature. which is applied to the other comparator input terminal,
Maximum Power Dissipation The maximum total which causes the comparator output to change state from a
device dissipation for which the regulator will operate logic 1 to 0.
within specifications. Hysteresis The difference between Lower Threshold
Bias Current Current which is used to operate the voltage and Upper Threshold voltage.
regulator chip and is not delivered to the load.
10 6.0
LP2950/LP2951 BIAS CURRENT (mA)
LP2951C
5.0 TA = 25C
Vout , OUTPUT VOLTAGE (V)
1.0 4.0 RL = 50 kW
3.0 RL = 50 W
0.1 2.0
1.0
0.01 0
0.1 1.0 10 100 0 1.0 2.0 3.0 4.0 5.0 6.0
IL, LOAD CURRENT (mA) Vin, INPUT VOLTAGE (V)
5.00 6.0
LP2951C
5.0
4.99
Vout , OUTPUT VOLTAGE (V)
4.0
4.98
3.0
4.97
2.0
25C
4.96 1.0
LP2951C 125C 40C
4.95 0
-50 0 50 100 150 200 0 1.0 2.0 3.0 4.0 5.0 6.0
TA, AMBIENT TEMPERATURE (C) Vin, INPUT VOLTAGE (V)
Figure 4. Output Voltage versus Temperature Figure 5. 5.0 V Dropout Characteristics with
RL = 50 W
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LP2950, LP2951, NCV2951
250 400
350
200 TA = 25C
150 250
200
100 150
No Load
100
50
50
0 0
0 5.0 10 15 20 25 0.1 1.0 10 100
Vin, INPUT VOLTAGE (V) IO, OUTPUT CURRENT (mA)
550 55 5.0
LP2951C
Vin Decreasing
450 45 3.0
RL = 50
Vin Increasing
400 40 2.0
350 35 1.0
RL = 50 k
300 30 0
-50 0 50 100 150 4.70 4.74 4.78 4.82 4.86 4.90
T, TEMPERATURE (C) Vin, INPUT VOLTAGE (V)
Vin
OUTPUT VOLTAGE CHANGE (mV)
5.0
7.5 2.0 CL = 1.0 mF
Vin , INPUT VOLTAGE (V)
4.0
CL = 10 mF
7.0 0 3.0
Vout
2.0 TA = 25C
6.5 -2.0 IL = 10 mA
1.0 Vin = 8.0 V
TA = 25C
Vout = 5.0 V
6.0 CL = 1.0 mF -4.0 Shutdown Input
IL = 1.0 mA 0
VO = 5.0 V
5.5 -6.0 -1.0
0 100 200 300 400 500 600 700 800 -100 0 100 200 300 400
t, TIME (ms) t, TIME (ms)
Figure 10. Line Transient Response Figure 11. LP2951 Enable Transient
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LP2950, LP2951, NCV2951
200 80
CL = 1.0 mF
TA = 25C 60
200
Vout
100
IL= 0.1 mA
0 40
50
-200 TA = 25C
ILoad 20
0 CL = 1.0 mF
Vin = 6.0 V
-400 Vout = 5.0 V
-50 0
0 0.5 1 1.5 2 2.5 3 3.5 4 1.0 10 100 1.0 k 10 k 100 k
t, TIME (ms) f, FREQUENCY (Hz)
Figure 12. Load Transient Response Figure 13. Ripple Rejection
4.0 1.8
IL= 100 mA
3.0 LP2951C
1.4
2.0
Output Off"
1.2
Output On"
1.0 CL = 100 mF
1.0
0 0.8
100 1.0 k 10 k 100 k -40 -20 0 20 40 60 80 100 120 140 160
f, FREQUENCY (Hz) t, TEMPERATURE (C)
Figure 14. Output Noise Figure 15. Shutdown Threshold Voltage
versus Temperature
TA = 25C 1000
Vout , OUTPUT CURRENT (mA)
80 2.0
TA = 75C
Unstable Region
100 100 mF
ESR (ohms)
60 0
Stable Region
10 0.1 mF
40 -2.0
1
Unstable Region for 0.1 mF capacitor only
20 -4.0
LP2951CN 0.1
Lower unstable region is for 0.1 mF only.
1 mF and 100 mF show no instability with low ESR values.
0 -6.0 0.01
0 5.0 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 90 100
Vin, INPUT VOLTAGE (V) Output Current (mA)
Figure 16. Maximum Rated Figure 17. Output Stability versus Output Capacitor
Output Current Change
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LP2950, LP2951, NCV2951
APPLICATIONS INFORMATION
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LP2950, LP2951, NCV2951
GND FB
or about 0.01 mF. When doing this, the output capacitor must
4 7 be increased to 3.3 mF to maintain stability. These changes
reduce the output noise from 430 mV to 126 mVrms for a
R2
100 kHz bandwidth at 5.0 V output. With bypass
capacitor added, noise no longer scales with output voltage
so that improvements are more dramatic at higher output
voltages.
Figure 19. Adjustable Regulator
Unregulated
The complete equation for the output voltage is: Input
MTB23P06E
V + V (1 ) R1R2) ) I
out R1 1.0 mF 10 k 0.01 mF
ref FB
where Vref is the nominal 1.235 V reference voltage and IFB Vout
is the feedback pin bias current, nominally 20 nA. The 5.0 V 1.0%
8
minimum recommended load current of 1.0 mA forces an Vin
0 to 1.0 A
upper limit of 1.2 MW on the value of R2, if the regulator Error 5 Error Vout
1
Output
must work with no load. IFB will produce a 2% typical error
2
in Vout which may be eliminated at room temperature by SNS
LP2951CN
adjusting R1. For better accuracy, choosing R2 = 100 k Shutdown 3 6
SD VO T
reduces this error to 0.17% while increasing the resistor Input 220 mF
program current to 12 mA. Since the LP2951 typically draws GND FB
75 mA at no load with Pin 2 open circuited, the extra 12 mA 4 7
of current drawn is often a worthwhile tradeoff for 0.002 mF
eliminating the need to set output voltage in test.
1.0 M
2.0 k
Output Noise
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor is the only method Figure 20. 1.0 A Regulator with 1.2 V Dropout
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LP2950, LP2951, NCV2951
TYPICAL APPLICATIONS
+V = 2.0 to 30 V
IL
Load IL = 1.23/R
Unregulated Input
6.0 to 10 Vdc
8 0.1 mF
8
Vin
Vin 1N4001 4.2 V 0.025 V Error 5 1
5 Error 1 Error Vout
NC Vout Output
2
2 2.0 M SNS
SNS NC 330 pF
1.0% LP2951CN
0.1 mF LP2951CN Shutdown 3 6
3 6 NC SD VO T
SD VO T Input
806 k GND FB
GND FB 2.2 mF Lithium Ion
1.0%
4 7 Rechargeable 4 7
Cell
50 k 1.0 mF
R
GND
Figure 21. Lithium Ion Battery Cell Charger Figure 22. Low Drift Current Sink
+Vin
+Vin CMOS
*Sleep Gate
470 k 8 Input
Vin
5 1
2N3906 Error Vout Vout
470 k 8 470 k
47 k
2 Vin Vout
SNS NC 1 2N3906
LP2951CN Error 5 Vout
Reset Output Error
3 6 NC R1
SD VO T 2
SNS NC 200 k
Normally LP2951CN
Closed GND FB 1.0 mF Shutdown 3
SD VO T
6 NC 3.3 mF
4 7 Input
100 k 100 pF
GND FB
R2 4 7
Figure 23. Latch Off When Error Flag Occurs Figure 24. 5.0 V Regulator with 2.5 V Sleep Function
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LP2950, LP2951, NCV2951
+Vin
8
Vin D2
5 1 Memory
Error Vout
V+
D1
2 1.0 mF 20
SNS
LP2951CN 3.6 V
3 #1 6 NiCad
NC SD VO T
GND FB
4 7
Early Warning
27 k D3 All diodes are 1N4148.
Reset
Early Warning flag on low input voltage.
2.7 M mP
Q1 D4 VDD Main output latches off at lower input voltages.
2N3906
8 Battery backup on auxiliary output.
330 k Vin
5 1 Operation: Regulator #1s Vout is programmed one
Error Vout
Main diode drop above 5.0 V. Its error flag becomes active
2 Output when Vin < 5.7 V. When Vin drops below 5.3 V, the
SNS
LP2951CN error flag of regulator #2 becomes active and via Q1
3 #2 6 1.0 mF latches the main output off. When Vin again exceeds
SD VO T 5.7 V, regulator #1 is back in regulation and the early
warning signal rises, unlatching regulator #2 via D3.
GND FB
4 7
+Vin
Current Limit
Section
2N3906
MJE2955
10 k .33 mF
4.7 M 8
Vin
Error 5 1
Error Vout
Flag
2 Vout @ 2.0 A
SNS NC 47
LP2951CN
220 3 6 NC
SD VO T 4.7 mF
100 mF
Tant
20 k GND FB .01 mF R1
4 7
R2
0.033 mF
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LP2950, LP2951, NCV2951
+ 5.0 V
4.7 k
Output*
1 5
4 20 mA
8
Vin
5 1 2 4
NC Error Vout
2
SNS NC
LP2951CN * High for
NC 3 6 IL < 3.5 mA
SD VO T NC
1N457
1N457 360
1N457
8
Vin
2 5 1
NC Error Vout Main V+
1
MC34164P5
2
SNS Memory V+
3 LP2951CN
1.0 mF
3 6 20
SD VO T NC
NiCad Backup
Gnd FB Battery
4 7
NC
Figure 28. Low Battery Disconnect
100 2.4
PD, MAXIMUM POWER DISSIPATION (W)
90 Mounted 2.0
JUNCTIONTOAIR (C/W)
Vertically
2.0 oz. Copper
80 1.6
L
Minimum
70 Size Pad L 1.2
60
50
0.8
0.4
RqJA
40 0
0 5.0 10 15 20 25 30
L, LENGTH OF COPPER (mm)
Figure 29. DPAK Thermal Resistance and Maximum
Power Dissipation versus PCB Copper Length
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LP2950, LP2951, NCV2951
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LP2950, LP2951, NCV2951
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LP2950, LP2951, NCV2951
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LP2950, LP2951, NCV2951
MARKING DIAGRAMS
TO92 DPAK
Z SUFFIX DT SUFFIX
CASE 029 CASE 369C
2950 2950A
CZxx CZxx 50yG 50yyG 50AyG 50AyyG
ALYWWG ALYWWG ALYWW ALYWW ALYWW ALYWW
G G
SOIC8
D SUFFIX
CASE 751
8 8 8
51z * 51z33 * 51z3
ALYW ALYW ALYW
G G G
1 1 1
PDIP8 Micro8
N SUFFIX DM SUFFIX
CASE 626 CASE 846A
8 8 8 8 8 8
51CN 51ACN 51CNxx 51ACNxx PAyy Pyy
AWL AWL AWL AWL AYWG AYWG
YYWWG YYWWG YYWWG YYWWG G G
1 1 1 1 1 1
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LP2950, LP2951, NCV2951
PACKAGE DIMENSIONS
TO226AA/TO92
Z SUFFIX
CASE 2911
ISSUE AM
NOTES:
A B STRAIGHT LEAD 1. DIMENSIONING AND TOLERANCING PER ANSI
BULK PACK Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
P BEYOND DIMENSION K MINIMUM.
L
SEATING INCHES MILLIMETERS
PLANE K DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
X X D G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
G J 0.015 0.020 0.39 0.50
H J K 0.500 --- 12.70 ---
L 0.250 --- 6.35 ---
V C N 0.080 0.105 2.04 2.66
P --- 0.100 --- 2.54
SECTION XX R 0.115 --- 2.93 ---
1 N V 0.135 --- 3.43 ---
NOTES:
A B BENT LEAD
R 1. DIMENSIONING AND TOLERANCING PER
TAPE & REEL ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
AMMO PACK 3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
P AND BEYOND DIMENSION K MINIMUM.
T
MILLIMETERS
SEATING
PLANE K DIM MIN MAX
A 4.45 5.20
B 4.32 5.33
C 3.18 4.19
D 0.40 0.54
X X D G 2.40 2.80
J 0.39 0.50
G K 12.70 ---
J N 2.04 2.66
V P 1.50 4.00
C R 2.93 ---
V 3.43 ---
SECTION XX
1 N
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LP2950, LP2951, NCV2951
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C
ISSUE D
NOTES:
C 1. DIMENSIONING AND TOLERANCING PER ASME
A Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
E A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
4 5. DIMENSIONS D AND E ARE DETERMINED AT THE
L3 Z OUTERMOST EXTREMES OF THE PLASTIC BODY.
D 6. DATUMS A AND B ARE DETERMINED AT DATUM
DETAIL A H PLANE H.
1 2 3
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
L4 A 0.086 0.094 2.18 2.38
b2 A1 0.000 0.005 0.00 0.13
b c b 0.025 0.035 0.63 0.89
b2 0.030 0.045 0.76 1.14
e 0.005 (0.13) M C H b3 0.180 0.215 4.57 5.46
c 0.018 0.024 0.46 0.61
GAUGE SEATING c2 0.018 0.024 0.46 0.61
L2 PLANE C PLANE D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
H 0.370 0.410 9.40 10.41
L
A1 L 0.055 0.070 1.40 1.78
L1 L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
DETAIL A L3 0.035 0.050 0.89 1.27
ROTATED 905 CW L4 0.040 1.01
Z 0.155 3.93
SOLDERING FOOTPRINT*
6.20 3.00
0.244 0.118
2.58
0.102
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LP2950, LP2951, NCV2951
PACKAGE DIMENSIONS
SOIC8 NB
D SUFFIX
CASE 75107
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
X ANSI Y14.5M, 1982.
A 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5 PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S 0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1 IN EXCESS OF THE D DIMENSION AT
4 MAXIMUM MATERIAL CONDITION.
Y K 6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
MILLIMETERS INCHES
G
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
C N X 45 _ B 3.80 4.00 0.150 0.157
SEATING C 1.35 1.75 0.053 0.069
PLANE D 0.33 0.51 0.013 0.020
Z G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
0.10 (0.004) J 0.19 0.25 0.007 0.010
H M J K 0.40 1.27 0.016 0.050
D
M 0_ 8_ 0 _ 8 _
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
0.25 (0.010) M Z Y S X S
SOLDERING FOOTPRINT*
1.52
0.060
7.0 4.0
0.275 0.155
0.6 1.270
0.024 0.050
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LP2950, LP2951, NCV2951
PACKAGE DIMENSIONS
PDIP8
N SUFFIX
CASE 62605
ISSUE M
NOTES:
D A 1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
D1 2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION E IS MEASURED WITH THE LEADS RE-
STRAINED PARALLEL AT WIDTH E2.
E 4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
8 5 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
E1 DIM MIN NOM MAX MIN NOM MAX
A 0.210 5.33
1 4
A1 0.015 0.38
b 0.014 0.018 0.022 0.35 0.46 0.56
C 0.008 0.010 0.014 0.20 0.25 0.36
NOTE 5 D 0.355 0.365 0.400 9.02 9.27 10.02
F c D1 0.005 0.13
TOP VIEW E2 E 0.300 0.310 0.325 7.62 7.87 8.26
E1 0.240 0.250 0.280 6.10 6.35 7.11
END VIEW E2 0.300 BSC 7.62 BSC
NOTE 3 E3 0.430 10.92
e 0.100 BSC 2.54 BSC
e/2 A L 0.115 0.130 0.150 2.92 3.30 3.81
A1 SEATING
C PLANE
E3
e
8X b
0.010 M C A
SIDE VIEW END VIEW
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LP2950, LP2951, NCV2951
PACKAGE DIMENSIONS
Micro8E
DM SUFFIX
CASE 846A02
ISSUE H
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
HE E
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
PIN 1 ID
e MILLIMETERS INCHES
b 8 PL DIM MIN NOM MAX MIN NOM MAX
A 1.10 0.043
0.08 (0.003) M T B S A S
A1 0.05 0.08 0.15 0.002 0.003 0.006
b 0.25 0.33 0.40 0.010 0.013 0.016
c 0.13 0.18 0.23 0.005 0.007 0.009
D 2.90 3.00 3.10 0.114 0.118 0.122
SEATING E 2.90 3.00 3.10 0.114 0.118 0.122
T PLANE e 0.65 BSC 0.026 BSC
0.038 (0.0015) A L 0.40 0.55 0.70 0.016 0.021 0.028
HE 4.75 4.90 5.05 0.187 0.193 0.199
A1 c L
SOLDERING FOOTPRINT*
1.04 0.38
8X 8X
0.041 0.015
0.65
6X
0.0256 SCALE 8:1 inches
mm
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limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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