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1.

Which of the following A) voltage, voltage C) IG is zero


controls the level of ID?
B) voltage, current D) All of the above
A) VGS
C) current, voltage 10. At which of the following
B) VDS condition(s) is the depletion
D) current, current region uniform?
C) IG
6. The BJT is a _____ device. A) No bias
D) VDG The FET is a _____ device.
B) VDS > 0 V
2. Which of the following is
(are) not an FET? C) VDS = VP
A) bipolar, bipolar
A) n-channel D) None of the above
B) bipolar, unipolar
B) p-channel 11. Refer to the following
C) unipolar, bipolar characteristic curve.
C) p-n channel Calculate the resistance of
D) unipolar, unipolar
the FET at VGS = –0.25 V if ro
D) n-channel and p-channel
7. Which of the following is = 10 kΩ.
3. What is the range of an (are) the terminal(s) of a
MCQs in Field Effect
FET’s input impedance? field-effect transistor (FET).
Transistor Devices Fig. 01
A) Drain

A) 10 Ω to 1 kΩ B) Gate
A) 1.1378 kΩ
B) 1 kΩ to 10 kΩ C) Source
B) 113.78 Ω
C) 50 kΩ to 100 kΩ D) All of the above
C) 11.378 Ω
D) 1 MΩ to several hundred 8. What is the level of IG in
D) 11.378 kΩ
MΩ an FET?
12. What is the level of drain
4. Which of the following
current ID for gate-to-source
transistor(s) has (have)
A) Zero amperes voltages VGS less than (more
depletion and enhancement
negative than) the pinch-off
types?
B) Equal to ID level?
A) BJT
C) Depends on VDS A) zero amperes
B) JFET
D) Undefined B) IDSS
C) MOSFET
9. At which of the following C) Negative value
D) None of the above is the level of VDS equal to
the pinch-off voltage? D) Undefined
5. A BJT is a _____-controlled
A) When ID becomes equal 13. The three terminals of
device. The JFET is a _____ –
to IDSS the JFET are the _____,
controlled device.
_____, and _____.
B) When VGS is zero volts
MCQs in Field Effect C) three-fourths
Transistor Devices Fig. 02
A) gate, collector, emitter D) None of the above

B) base, collector, emitter 21. Which of the following


A) 2.54 V ratings appear(s) in the
C) gate, drain, source specification sheet for an
B) –2.54 V FET?
D) gate, drain, emitter
C) –12 V A) Voltages between specific
14. The level of VGS that
terminals
results in ID = 0 mA is D) Undefined
defined by VGS = _____. B) Current levels
18. Referring to this transfer
A) VGS(off) curve, determine ID at VGS = C) Power dissipation
2 V.
B) VP D) All of the above
MCQs in Field Effect
C) VDS Transistor Devices Fig. 03 22. Refer to this portion of a
specification sheet.
D) None of the above
Determine the values of
15. The region to the left of reverse-gate-source voltage
A) 0.444 mA
the pinch-off locus is and gate current if the FET
referred to as the _____ B) 1.333 mA was forced to accept it.
region.
C) 0.111 mA MCQs in Field Effect
A) saturation Transistor Devices Fig. 04
D) 4.444 mA
B) cutoff
19. What is the ratio of ID /
C) ohmic IDSS for VGS = 0.5 VP? A) 25 Vdc, –200 nAdc

D) All of the above B) –25 Vdc, 10 mAdc

16. Which of the following A) 0.25 C) –6 Vdc, –1.0 nAdc


represent(s) the cutoff
B) 0.5 D) None of the above
region for an FET?
C) 1 23. Hand-held instruments
are available to measure
A) ID = 0 mA D) 0 _____ for the BJT.

B) VGS = VP 20. The drain current will


always be one-fourth of IDSS
C) IG = 0 as long as the gate-to-source A) βdc
voltage is _____ the pinch-
D) All of the above B) IDSS
off value.
17. Referring to this transfer C) VP
A) one-fourth
curve. Calculate (using
D) All of the above
Shockley’s equation) VGS at B) one-half
ID = 4mA.
24. How many terminals can MCQs in Field Effect C) enhancement-type
a MOSFET have? Transistor Devices Fig. 06 MOSFET

D) BJT

A) 2 A) 8.167 mA 31. Which of the following


applies to a safe MOSFET
B) 3 B) 4.167 mA handling?
C) 4 C) 6.167 mA

D) 3 or 4 D) 0.616 mA A) Always pick up the


transistor by the casing.
25. Which of the following 28. It is the insulating layer of
applies to MOSFETs? _____ in the MOSFET B) Power should always be
construction that accounts off when network changes
for the very desirable high are made.
input impedance of the
A) No direct electrical
device. C) Always touch ground
connection between the gate
before handling the device.
terminal and the channel A) SiO
D) All of the above
B) Desirable high input B) GaAs
impedance 32. What is the purpose of
C) SiO2 adding two Zener diodes to
C) Uses metal for the gate,
the MOSFET in this figure?
drain, and source D) HCl
connections MCQs in Field Effect
29. Refer to the following
Transistor Devices Fig. 08
D) All of the above figure. Calculate VGS at ID =
8 mA for k = 0.278 × 10–2
26. Referring to the following A/V2.
transfer curve, determine A) To reduce the input
the level of VGS when the MCQs in Field Effect impedance
drain current is 20 mA. Transistor Devices Fig. 07
B) To protect the MOSFET
MCQs in Field Effect for both polarities
Transistor Devices Fig. 05
A) 3.70 V C) To increase the input
impedance
B) 5.36 V
A) 1.66 V D) None of the above
C) 7.36 V
B) –1.66 V 33. Which of the following is
D) 2.36 V
(are) the advantage(s) of
C) 0.66 V
30. The transfer curve is not VMOS over MOSFETs?
D) –0.66 V defined by Shockley’s
A) Reduced channel
equation for the _____.
27. Refer to the following resistance
curves. Calculate ID at VGS = A) JFET
B) Higher current and power
1 V.
B) depletion-type MOSFET ratings
C) Faster switching time electron (n-channel) or hole 6. In an FET transistor, the
(p-channel) conduction. depletion region is _____
D) All of the above near the top of both p-type
A) unipolar materials.
34. Which of the following
FETs has the lowest input B) bipolar A) wider
impedance?
C) tripolar B) narrower
D) None of the above C) the same as the rest of the
A) JFET depletion region
3. One of the most important
B) MOSFET depletion-type characteristics of the FET is D) None of the above
its _____ impedance.
C) MOSFET enhancement- 7. The pinch-off voltage
type A) low input continues to drop in a _____
manner as VGS becomes
D) None of the above B) medium input
more and more negative.
35. Which of the following C) high input
A) linear
input impedances is not valid
for a JFET? D) None of the above
B) parabolic
4. The _____ transistor has
C) cubic
become one of the most
A) 1010 Ω important devices used in D) None of the above
the design and construction
B) 109 Ω of integrated circuits for 8. The region to the right of
digital computers. the pinch-off locus is
C) 108 Ω
commonly referred to as the
A) MOSFET _____ region.
D) 1011 Ω
B) BJT A) constant-current
Fill-in-the-blanks Questions
C) JFET B) saturation
D) None of the above C) linear amplification
1. A junction field-effect
transistor (JFET) is a _____ 5. In the n-channel transistor, D) All of the above
device. the drain and source are
connected to the _____ 9. As VGS becomes _____
channel while the gate is negative, the slope of each
A) current-controlled connected to the two layers curve in the characteristics
of _____ material. becomes _____ horizontal
B) voltage-controlled corresponding with an
A) p-type, n-type increasing resistance level.
C) voltage-current controlled
B) p-type, p-type A) less, more
D) None of the above
C) n-type, p-type B) more, less
2. The FET is a _____ device
depending solely on either D) n-type, n-type C) more, more
D) None of the above C) Per step A) VDD

10. The transfer curve can be D) gm B) VDS


obtained by _____.
14. In an FET circuit, _____ is C) VGS
normally the parameter to
be determined first. D) VDG
A) using Shockley’s equation
A) VGS 18. In an n-channel
B) using both Shockley’s enhancement-type MOSFET
equation and by output B) VDS with a fixed value of VT’, the
characteristics _____ the level of VGS’, the
C) VDG _____ the saturation level
C) characteristics for VDS’.
D) ID
D) None of the above A) higher, more
15. The primary difference
11. The active region of an between the construction of B) higher, less
FET is bounded by _____. a MOSFET and an FET is the
_____. C) lower, lower

A) construction of the gate D) None of the above


A) ohmic region connection
19. The enhancement-type
B) cutoff region B) low input impedance MOSFET is in the cutoff
region if _____.
C) power line C) threshold voltage
D) All of the above D) None of the above
A) applied VGS is larger than
12. A(n) _____ can be used 16. The primary difference VGS(Th)
to check the condition of an between the construction of
FET. depletion-type and B) applied VGS is less than
enhancement-type MOSFETs or equal to VGS(Th)
is _____.
C) VGS has a positive level
A) digital display meter
A) the size of the transistor
(DDM) D) None of the above
B) the absence of the
B) ohmmeter (VOM) 20. The specification sheet
channel
provides _____ to calculate
C) curve tracer
C) the reverse bias junction the value of k for
D) All of the above enhancement-type
D) All of the above MOSFETs.
13. In a curve tracer, the
17. The level of _____ that A) VGS(on)
_____ reveals the distance
results in the significant
between the VGS curves for
increase in drain current in B) ID(on)
the n-channel device.
enhancement-type MOSFETs
is called threshold voltage C) VGS(Th)
A) vertical sens.
VT’.
D) All of the above
B) horizontal sens.
21. _____ has high input B) enhancement,
impedance, fast switching enhancement
speeds, and lower operating
power levels. C) enhancement, depletion

A) CMOS D) None of the above

B) FET 25. VMOS FETs have a _____


temperature coefficient that
C) BJT will combat the possibility of
thermal runaway.
D) None of the above

22. The FET resistance in the


ohmic region is _____ at VP A) positive
and _____ at the origin.
B) negative
A) smallest, largest
C) zero
B) largest, smallest
D) None of the above
C) larger, smaller

D) smaller, larger

23. The silicon dioxide (SiO2)


layer used in a MOSFET is
_____.

A) an insulator

B) a conductor

C) a semiconductor

D) None of the above

24. In an n-channel
depletion-type MOSFET the
region of positive gate
voltages on the drain or
transfer characteristics is
referred to as the _____
region with the region
between cutoff and the
saturation level of ID
referred to as the _____
region.

A) depletion, enhancement

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