ZTE Hardware Description

ZXWM M920
Backbone DWDM Equipment

Product Descriptions
Version: 4.20
ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: (86) 755 26771900
Fax: (86) 755 26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn
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The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Revision No. Revision Date Revision Reason
R1.5 20101201 Version update
Serial Number: SJ-20100512144809-004
Publishing Date: 20101201

Tables of Contents
Preface............................................................................................................. I
Chapter 1 Product Characteristics ........................................................... 1-1
1.1 Product Technical Characteristics ........................................................................ 1-1
1.1.1 FEC/AFEC Function ................................................................................. 1-1
1.1.2 APSD/APR Function................................................................................. 1-2
1.1.3 Erbium-Doped Fiber Amplifier (EDFA) ...................................................... 1-2
1.1.4 RAMAN Amplifiers.................................................................................... 1-2
1.1.5 HUB-type ROADM ................................................................................... 1-2
1.1.6 RPOA Technology .................................................................................... 1-3
1.2 Upgrade and Maintenance Characteristics ........................................................... 1-5
1.2.1 Master/Slave Subrack............................................................................... 1-5
1.2.2 Compatibility ............................................................................................ 1-5
1.2.3 Smooth Expansion and Upgrade ............................................................... 1-5
1.2.4 Online Upgrade........................................................................................ 1-6
1.2.5 Pluggable Optical Module ......................................................................... 1-6
Chapter 2 Interfaces ................................................................................... 2-1

2.1 Transmission Subrack Backplane Description ...................................................... 2-1
2.2 Board Interface .................................................................................................. 2-2
Chapter 3 Technical Specifications .......................................................... 3-1

3.1 Physical Specifications ....................................................................................... 3-1
3.1.1 Dimension and Weight.............................................................................. 3-1
3.1.2 Bearing Requirements for Equipment Room .............................................. 3-4
3.2 Power Supply Specifications ............................................................................... 3-4
3.2.1 Power Supply Requirement....................................................................... 3-4
3.2.2 Power Consumption Specifications............................................................ 3-5
3.3 Grounding Requirement.................................................................................... 3-10
3.4 Environment Specifications ............................................................................... 3-10
3.4.1 Storage Environment.............................................................................. 3-10
3.4.2 Transportation Environment .................................................................... 3-12
3.4.3 Running Environment ............................................................................. 3-13
3.5 Lightning Protection Requirements .................................................................... 3-15
3.6 Electro Magnetic Compatibility Requirements..................................................... 3-16
3.6.1 Electro-Magnetic Susceptibility................................................................ 3-16
I
3.6.2 Electro-Magnetic Interference (EMI) ........................................................ 3-16
3.7 Requirements on Operating Wavelength............................................................ 3-16
3.7.1 Wavelength Allocation in 8/16/32/40-Channel Systems............................. 3-16
3.7.2 Wavelength Allocation in 48/96 Wavelength System ................................. 3-17
3.7.3 Wavelength Allocation in 80/160 Wavelength System ............................... 3-19
3.7.4 Wavelength Allocation in 176-Channel Systems ....................................... 3-22
3.7.5 Wavelength Allocation in 192-Channel Systems ....................................... 3-22
3.8 Service Access and Convergence Subsystem Specifications .............................. 3-26
3.8.1 Optical Transponder Unit Specifications................................................... 3-26
3.8.2 Convergence Unit Specifications ............................................................. 3-33
3.9 Optical Mux/DeMux Subsystem Specifications .................................................. 3-49
3.9.1 Fixed Add/Drop Multiplexer Unit Specifications......................................... 3-49
3.9.2 Reconfigurable Add/Drop Multiplexer Unit Specifications .......................... 3-52
3.9.3 Multiplex/Demultiplex Unit Specifications ................................................. 3-56
3.9.4 Group Mux/DeMux Unit Specifications..................................................... 3-63
3.10 Optical Amplification Subsystem Specifications ............................................... 3-64
3.10.1 Specifications of the EOA Board............................................................ 3-64
3.10.2 Specifications of the DRA Board............................................................ 3-77
3.10.3 Specifications of the LAC Board ............................................................ 3-79
3.11 Optical Cross-Connect Subsystem Specifications ............................................. 3-79
3.11.1 Specifications of the DSAC Board ......................................................... 3-79
3.11.2 Specifications of the SAUC Board ......................................................... 3-80
3.11.3 Specifications of the SMUB Board ........................................................ 3-81
3.12 Optical Layer Management Subsystem Specifications ...................................... 3-82
3.12.1 Specifications of the OPM Board ........................................................... 3-82
3.12.2 Specifications of the OWM Board .......................................................... 3-84
3.12.3 Specifications of the DCU Board ........................................................... 3-84
3.12.4 Specifications of the EOWM Board ........................................................ 3-85
3.12.5 Specifications of the EOPM Board ......................................................... 3-85
3.13 Protection Subsystem Specifications ............................................................... 3-86
3.13.1 Specifications of the SOP Board............................................................ 3-86
3.13.2 Specifications of the SOPCS Board ....................................................... 3-87
3.13.3 Specifications of the SOPMS Board....................................................... 3-87
3.14 Supervision Subsystem Specifications ............................................................. 3-88
3.14.1 Specifications of the SOSC Board ......................................................... 3-88
3.15 RPOA Subsystem Specifications ..................................................................... 3-89
3.15.1 Applicable Transmission Codes............................................................. 3-89
II
3.15.2 Specifications of the RPOA Subsystem ................................................. 3-90
3.16 Specifications of APO Function ....................................................................... 3-90
3.17 Specifications of the IWF Function .................................................................. 3-93
Chapter 4 C-Band DWDM System over G.653 Fiber................................ 4-1

4.1 Overview ........................................................................................................... 4-1
4.2 Wavelength Allocation ........................................................................................ 4-1
4.3 Configuration Principles ...................................................................................... 4-3
4.4 Transmission Codes ........................................................................................... 4-3
4.5 Typical Configurations ........................................................................................ 4-4
4.5.1 Configuration of 2.5 Gbit/s System ............................................................ 4-4
4.5.2 Configuration of 10 Gbit/s System ............................................................. 4-5
Figures............................................................................................................. I
Tables ............................................................................................................ III
Glossary .......................................................................................................VII
III
IV
Preface
Applicable Product
This manual is applicable to Unitrans ZXWM M920 (V4.20) backbone DWDM equipment
(ZXWM M920 in short hereinafter).
What is in This Manual

This manual is Unitrans ZXWM M920 (V4.20) Backbone DWDM Equipment Product
Descriptions. The following table describes the chapters in this manual.
Chapter Description
Chapter 1 Product Introduces the product characteristics of ZXWM M920, including

Description technical characteristics and upgrade maintenance characteristics.
Chapter 2 Interface Introduces the interfaces of ZXWM M920 equipment, including

Description service interfaces and non-service interfaces.
Chapter 3 Technical Lists the parameters and technical specifications of the ZXWM
Specification M920 equipment, including physical parameters, power supply
requirements, environment requirements, lightning protection
requirements, electromagnetic compatibility requirements, operating
wavelengths and specifications of each sub-system.
Chapter 4 C-Band DWDM Describes functions of C-band 16/40–wavelength system over

System over G.653 Fiber G.653 fiber, including wavelength allocation, configuration principle,
transmission code and typical configuration.
Revision History
Version No. Serial No. Description
V4.20 SJ-20100512144809- Applicable to ZXWM M920 (V4.20), Version update

004
I
II
Chapter 1
Product Characteristics
Table of Contents
Product Technical Characteristics...............................................................................1-1
Upgrade and Maintenance Characteristics .................................................................1-5
1.1 Product Technical Characteristics

1.1.1 FEC/AFEC Function
ZXWM M920 provides forward error correction function. This function can improve the
error tolerance capability of transmission signals, reduce the system requirement for
OSNR, and enhance the transmission distance. There are two types of forward error
connection functions: ordinary FEC and AFEC.
l Ordinary FEC: The frame structure complies with ITU-T G.975/G.709
Recommendation.
à In the 40G system, the rate of coded STM-256 service signal is 43.018Gbit/s.
à In the 10G system, the rate of coded STM-64 service signal is 10.709 Gbit/s and
the rate of coded 10GE service signal is 11.1 Gbit/s.
à In the 2.5G system. the rate of coded service signal is 2.66 Gbit/s.
à Ordinary FEC can improve OSNR by 5 dB to 7 dB.
l AFEC: It uses improved FEC coding/decoding algorithm.
à In the 40G system, the rate of coded STM-256 service signal is 43.018Gbit/s.
à In the 10G system, the rate of coded STM-64 service signal is 10.709 Gbit/s and
the rate of coded 10GE service signal is 11.1 Gbit/s.
à AFEC can improve OSNR by 7 dB to 9 dB.
Note
2.5G system does not support AFEC.
In ZXWM M920, boards of 2.5G system, including SOTU2.5G, GEMF, and DSAF, support
FEC function. Boards of 10G system, including EOTU10G, EOTU10GB, OTU10G,
SOTU10G, SRM41, GEM8, and FCA, support either FEC or AFEC function. Boards of
40G system, including TST3, MQT3 and MQ1, support either FEC or AFEC function.
1-1
SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

ZXWM M920 Product Descriptions
1.1.2 APSD/APR Function

With the cooperation of the NMS software, ZXWM M920 supports two modes of auto power
control functions: auto power shutdown (APSD) and auto power reduction (APR). When
no input optical is detected by the detection board which has optical performance detection
function (such as the OPM board), the detection board will send the message to the SNP
board. And then the SNP board will control the execution board (such as the EOA board)
to automatically reduce the power or shutdown the power, so as to prevent human eyes
from being burnt by the laser. The system can be automatically or manually recovered
after the fault recovery.
1.1.3 Erbium-Doped Fiber Amplifier (EDFA)

The ZXWM M920 adopts EDFA technology to improve the transmission distance of the
system without the electric regenerator.
EDFA technology replaces the traditional regeneration mode of optical-electrical-optical to

implement the simultaneous amplification for the multiple optical signals in the fiber. This
technology can greatly reduce the cost of optical regeneration, and realize the coupling
with transmission fiber. It also provides various benefits, such as high gain, low noise, large
bandwidth, high output power, high pump efficiency, low insertion loss, and insensitive for
polarization.
1.1.4 RAMAN Amplifiers

In the DWDM system with the long-haul transmission distance, only adopting EDFA
technology to implement the amplification will cumulate spontaneous radiation and restrict
the performance of the system. ZXWM M920 adopts the distributed RAMAN amplification
(DRA) board to effectively improve optical amplification performance of the long-haul
transmission system through the combination of EDFA and DRA (the combination of EOA
board and DRA board).
1.1.5 HUB-type ROADM

ZXWM M920 provides an intelligent HUB-type ROADM, supporting multi-direction and
service broadcast functions, which is implemented via the power distribution unit (PDU)
and the wavelength selection unit (WSU). HUB-type ROADM improves the flexibility of
the WDM network to ensure that the operator can dynamically control the wavelength
transmission path in a long distance, and effectively reduce the operation and the running
cost. The detailed functions provided by HUB-type ROADM are illustrated as follows:
l Realizes the wavelength scheduling for signals in different directions.

l Provides local adding/dropping functions.
l Supports the wavelength scheduling in ten optical directions.
l It can be configured to be wavelength-related or direction-related.
1-2

Chapter 1 Product Characteristics
1.1.6 RPOA Technology

l Remotely Pumped Optical Amplifier (RPOA) is a ultra-long distance transmission
technology applied in the ZXWM M920 system.
l In the RPOA system, a segment of Erbium-Doped Fiber (EDF) is inserted in the trans-
mission optical cables, which provides pumped light at a far-end site to amplify optical
signals.
l The RPOA system is developed to implement ultra-long single-span transmission
when power supply is not available in the system.
It is usually applied in the following cases:

l Power supply is unavailable, or regenerator sites can not be established when optical
cables stride across channels, offing or pass through depopulated areas, such as
desert, morass and forest.
l The construction and maintenance of regenerator sits is difficult in remote areas due
to territory limits.
1.1.6.1 Unidirectional Pump Application through the Same Fiber

The unidirectional pump application through the same fiber illustrates that the signal light
and pumped light are transferred through the same fiber, as shown in Figure 1-1.
Figure 1-1 RPOA Unidirectional Pump Application through the Same Fiber
The RPU board is located in the OTM site. It provides the pumping energy to the
corresponding RGU module on the line through the line fiber.
When the DRA board is adopted at transmitting site, the unidirectional pump application
through the same fiber is illustrated in Figure 1-2.
1-3

Figure 1-2 RPOA Unidirectional Pump Application through the Same Fiber (with DRA
board)
1.1.6.2 Unidirectional Pump Application through Different Fiber

The unidirectional pump application through different fiber illustrates that the signal light
and pumped light are transferred through different fibers, as shown in Figure 1-3.
Figure 1-3 RPOA Unidirectional Pump Application through Different Fiber
The RPU board is located in the OTM site. The pumped light from the RPU board is
transferred to the corresponding RGU module on the line through a special fiber. In this
transmission mode, the system gets better gain flatness. It is applicable to large-capacity
DWDM transmission without regenerator.
1.1.6.3 Bidirectional Pump Application through Two Fiber

The bidirectional signal light and pumped light are transferred through two fibers. Based
on the application of unidirectional light transmission in the same fiber, this application
mode uses different fibers to forward the pump signals of another RPU module to the end
of the RGU module. And then it proceeds the reverse pump for the RGU module in order
to forward the pump signal with higher power to the RGU module for higher gain. This
kind of application mode can meet the requirement of higher span. Figure 1-4 illustrates
the bidirectional transmission of signal light and pumped light through two fibers.
1-4

Chapter 1 Product Characteristics
Figure 1-4 RPOA Bidirectional Pump Application through Two Fiber
1.2 Upgrade and Maintenance Characteristics

1.2.1 Master/Slave Subrack
ZXWM M920 supports the configuration of master/slave subrack. One side of the
equipment can configure a master subrack, in which a master subrack supports several
salve subracks. A master subrack can support 127 cascaded slave subracks.
Note
The master subrack refers to subrack configured with the semi-height SNP board, while
the slave subrack refers to the subrack without the SNP board.
1.2.2 Compatibility
The optical supervision channel of ZXWM M920 can be connected with the supervision
channel of ZXMP M820 and ZXMP M720 through 100M optical interface.
1.2.3 Smooth Expansion and Upgrade

ZXWM M920 supports the function of multi-subrack management, and provides the ability
of smooth expansion and upgrade described as follows:
l In the mixed transmission system with the rate at 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s,
ZXWM M920 supports the smooth upgrade to the system with the rate at 40 Gbit/s.
l When configuring 192-channel Mux/DeMux system, ZXWM M920 can implement the
smooth upgrade to the system with 192 wavelengths by adding optical transponder
unit and other boards.
1-5

1.2.4 Online Upgrade

ZXWM M920 supports online upgrade described as follows:
l ZXWM M920 can implement online upgrade for the NMS software and embedded
software in each board without interrupting services.
l The system can be upgraded to the system with 192 wavelengths.
1.2.5 Pluggable Optical Module

For service signals with the rate at 40 Gbit/s (STM-256), the optical interfaces at both client
side and line side support MSA300PIN optical module.
For service signals with the rate at 10 Gbit/s (STM-64/OC-192/10GE), the optical interfaces
at client side support hot pluggable optical module (XFP) and those at line side and client
side support MSA300PIN optical module.
For service signals with the rate at 2.5 Gbit/s or below, the optical interfaces at client side
supports hot pluggable optical module (SFP).
Pluggable optical modules support the position detection function for optical modules. The
system configuration of ZXWM M920 is flexible with the use of pluggable optical modules.
1-6

Chapter 2
Interfaces
Table of Contents
Transmission Subrack Backplane Description ............................................................2-1
Board Interface...........................................................................................................2-2
2.1 Transmission Subrack Backplane Description

As an internal communication platform for various boards, the subrack backplane provides
power socket and signal socket for boards. The structure of backplane is illustrated in
Figure 2-1.
Figure 2-1 Structure of Subrack Backplane
1. DIP switch for subrack No.
An 8-pin DIP switch on backplane (identified as S1) is used to configure the subrack
number. The description of subrack number is illustrated in Table 2-1.
Table 2-1 Description of Subrack No.
DIP
Subrack
2 3 4 5 6 7 8
Subrack 1 up up up up up up down
2-1

DIP
Subrack
2 3 4 5 6 7 8
Subrack 2 up up up up up down up
Subrack 3 up up up up up down down
┇ ┇ ┇ ┇ ┇ ┇ ┇ ┇
Subrack
down down down down down down down
127
1. The pin 1 of the DIP switch is reserved.

2. “up” refers to turn on the DIP switch, which also means 0 in binary code.
3. “down” refers to turn down the DIP switch, which also means 1 in binary code.
4. ZXWM M920 supports at most 127 subracks (including the master subrack). A single-NE supports 16 subracks at
most, including the master subrack.
2.2 Board Interface

l Distributed Raman Amplifier (DRA)
The IN interface of the DRA_P board is E2000/APC connector, while the other optical
interfaces are LC/UPC connectors.
The IN interface and OUT interface of the DRA_B board is E2000/APC connector,
while the other optical interfaces are LC/UPC connectors.
l Enhanced Optical Amplifier (EOBA/EOLA/EOPA)
The OUT interface of the EOBAH/EONAH board is E2000/APC connector, while the
other optical interfaces are LC/UPC connectors. Other optical interfaces of other
EOBA/EOLA/EOPA boards are LC/UPC connectors.
l Semi-height Node Process Board (SNP)
The interface of the SNP board for outputting board debugging information is RS232.
l Semi-height Communication Control Board (SCC)
The interface of the SCC board for outputting board debugging information is RS232.
l Power Supply Supervision Board (SPWA)

The interface of the SPWA board for outputting board debugging information is RS232.
l Other Board
The optical interfaces of other boards are LC/UPC connectors.
2-2

Chapter 3
Technical Specifications
Table of Contents
Physical Specifications ...............................................................................................3-1
Power Supply Specifications ......................................................................................3-4
Grounding Requirement ...........................................................................................3-10
Environment Specifications ......................................................................................3-10
Lightning Protection Requirements...........................................................................3-15
Electro Magnetic Compatibility Requirements...........................................................3-16
Requirements on Operating Wavelength ..................................................................3-16
Service Access and Convergence Subsystem Specifications ...................................3-26
Optical Mux/DeMux Subsystem Specifications ........................................................3-49
Optical Amplification Subsystem Specifications .......................................................3-64
Optical Cross-Connect Subsystem Specifications ....................................................3-79
Optical Layer Management Subsystem Specifications..............................................3-82
Protection Subsystem Specifications ........................................................................3-86
Supervision Subsystem Specifications .....................................................................3-88
RPOA Subsystem Specifications..............................................................................3-89
Specifications of APO Function ................................................................................3-90
Specifications of the IWF Function ..........................................................................3-93
3.1 Physical Specifications

3.1.1 Dimension and Weight
The dimension and weight of the structural parts of the ZXWM M920 are shown in Table
3-1 and Table 3-2.
Table 3-1 Dimensions and Weights of Structural Parts of ZXWM M920
Structural Part Dimensions (Unit: mm) Weight (kg)
2000 (height) × 600 (width) × 300 (depth) 58.50

ZTE transmission equipment
cabinet
Subrack 422 (height) × 533 (width) × 286 (depth) 12.50
Power supply distribution box 43.6 (height) × 533 (width) × 233.1 (depth) 6.50
DCM plug-in box 47 (height) × 533 (width) × 286.5 (depth) 5.60
3-1

Structural Part Dimensions (Unit: mm) Weight (kg)
Conversion bracket 29.6 (height) × 345.6 (width) 0.30
Fan unit 30 (height) × 122.9 (width) × 276.8 (depth) 0.68
SPWA board Front panel: 235 (height)× 43.3 (width) 1.80
SEIA board Front panel: 95.2 (height)× 87.1 (width) 0.45
PCB: 320 (width) × 210 (depth)

Full-height board -
Front panel: 345.6 (height) × 29.8 (width)
PCB: 152 (width) × 210 The weight of board is

Semi-height board
Front panel: 155.6 (height) × 25.1 (width) illustrated in Table 3-2
• The subrack dimensions include the dimension of flange and front door. The subrack weight listed in the table is
that of an empty subrack.
Table 3-2 ZXWM M920 Board Weight
Board Board ID Weight (kg)
Semi-height Node Process Board SNP 0.60
Semi-height Communication Control Board SCC 0.47
Semi-height Optical Supervision Channel

SOSC 0.60
Board
Semi-height OTU 10Gb/s Transceiver SOTU10G 0.70
Semi-height Optical Group Mux/DeMux

SOGMD 0.60
Board
Semi-height Optical Adding/Dropping

SOAD1 0.60
Board of 1 Wavelength

SOAD2 0.60

SOAD4 0.60
Semi-height Optical Protection Board SOP 0.60
Semi-height Optical Protection Board for

SOPCS 0.60
Channel Section
Semi-height Optical Protection Board for

SOPMS 0.60
Mux Section
Semi-height Supervisory Division Multi-

SSDM 0.60
plexing Board
Semi-height Power Supply Board (A-type) SPWA 1.80
Semi-height Extension Interface Board SEIA 0.45
Semi-height Fan Board SFANA 0.68
3-2

Chapter 3 Technical Specifications
Optical Transparent Unit OTU 1.55
Semi-height Optical Transponder Unit for

SOTU2.5G 0.60
2.5 Gbit/s
Optical Transponder Unit for 10 Gb/s OTU10G 1.65
Enhanced Optical Transponder Unit for 10

EOTU10G 1.65
Gbit/s
Type B Enhanced Optical Transponder

EOTU10GB 1.65
Unit for 10 Gbit/s
TST3 (using DPSK module) 3.3

Optical Transponder Unit for 40 Gb/s
TST3 (using DQPSK module) 3.5
Gigabit Ethernet Mux Board with FEC GEMF 1.50
Two Gigabit Ethernet Mux Board GEM2 1.50
Eight Gigabit Ethernet Mux Board GEM8 2.05
Data Service Aggregation with FEC DSAF 1.40
Four 622 M/155 M SubRate Mux Board SRM42 1.25
Four 2.5 G SubRate Mux Board SRM41 1.25
Type A Convergence Switching Board ASMA 0.6
FC service Access unit FCA 1.50
MQT3 (using DPSK module) 3.05

Four 10 G SubRate Mux Board
MQT3 (using DQPSK module) 3.25
Enhanced Optical Booster Amplifier EOBA 1.80
Enhanced Optical Pre-Amplifier EOPA 1.80
Enhanced Optical Line Amplifier EOLA 1.80
Enhanced Optical Node Amplifier EONA 2.00
Enhanced Optical Booster Amplifier SEOBA 0.60
Enhanced Optical Pre-Amplifier SEOPA 0.60
Enhanced Optical Line Amplifier SEOLA 0.60
DRA_P 2.00
Distributed Raman Amplifier
DRA_B 2.00
Line Attenuation Compensator LAC 1.10
Data Service Aggregation Board DSA 1.60
Data Service Aggregation Board DSAC 0.6
SDH Service Access Unit SAUC 0.6
3-3

SDH Service Aggregate Multiplexer Board SMUB 1.30
Optical Multiplexing Unit OMU 1.60
Optical De-Multiplexing Unit ODU 1.60
Optical De-Multiplexing Unit ODU 1.60
Optical De-Multiplexing Unit (B Type) ODUB 1.60
Optical Channel Interleaver OCI 1.95
Variable Insertion Loss Multiplexer VMUX 2.10
Variable Insertion Loss Multiplexer (B

VMUXB 2.10
Type)
Power Distribution Unit PDU 1.40
Wavelength Blocking Unit WBU 2.60
Wavelength Selective Unit WSU 2.60
Wavelength Blocking Multiplexer WBM 2.10
Optical Multi-Channel Protection OMCP 1.25
Optical Performance Monitor OPM 1.15
Optical Wavelength Monitor OWM 1.10
Remote Pump Unit RPU 2.50
Remote Gain Unit RGU 1.50
Dispersion Compensation Board DCU 0.55
Enhanced Optical Wavelength Monitor

EOWM 0.90
Board
Enhanced Optical Channel Performance

EOPM 0.96
Monitor
10G Optical Convergence Board MQ1 1.50
3.1.2 Bearing Requirements for Equipment Room

The bearing capacity of equipment room should be greater than 450 kg/m2 so as to hold
the ZXWM M920 equipment.
3.2 Power Supply Specifications

3.2.1 Power Supply Requirement
The power supply requirements of ZXWM M920 are described as follows:
3-4

l Input voltage: -48 VDC

l Allowable fluctuation range: -60 VDC to -36 VDC
3.2.2 Power Consumption Specifications

The power consumption specifications of each board and unit of the ZXWM M920 are
shown in Table 3-3.
Table 3-3 Power Consumption of ZXWM M920
Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃
Optical Transponder Unit OTU 14 21 -
Semi-height Optical
Transponder Unit for 2.5 SOTU2.5G 24 27 -
Gbit/s
Optical Transponder Unit for

OTU10G 29.2 41 -
10 Gb/s
Optical Transponder Unit for OTU10G (re-

22.2 31 -
10 Gb/s generator)
Enhanced OTU 10Gbit/s

EOTU10G 28 39 -
Transceiver
Type B Enhanced OTU

EOTU10GB 28 39
10Gbit/s Transceiver
Enhanced OTU 10Gbit/s EOTU10G (re-

Board 21 29 -
Transceiver generator)
Semi-height OTU 10Gbit/s

SOTU10G 25 30 -
Transceiver
Optical Transponder Unit for

TST3 90 117 -
40 Gb/s
Optical Transponder Unit for TST3 (regen-

78 101.4 -
40 Gb/s erator)
Two Gigabit Ethernet Mux

GEM2 13 20 -
Board
Gigabit Ethernet Mux Board

GEMF 18 27 -
with FEC
Eight Gigabit Ethernet Mux

GEM8 35 53 -
Board
3-5

Maximum Maximum
Power Power
℃) (W)
in (25℃ ℃) (W)
(55℃
Data Service Aggregation

DSA 25 38 -
Board

DSAF 22 33 -
with FEC
Four 622 M/155 M SubRate

SRM42 20 30 -
Mux Board
Four 2.5 G SubRate Mux

SRM41 33 50 -
Board
Type A Convergence
ASMA 80 85 -
Switching Board
FC service Access unit FCA 40 50 -
Four 10 G SubRate Mux

MQT3 120 150 -
Board
The maximum
14.5 (EOBAS) 20 output power is
20 dBm
The maximum
20 (EOBA) 30 output power is 21
Enhanced Optical Booster dBm
EOBA
Amplifier The maximum
30 (EOBAH) 45 output power is 24
dBm
The maximum
40 (EOBAH) 60 output power is 26
dBm
The maximum
11 (EOPAS) 15 output power is
12dBm
The maximum
Enhanced Optical PreAmpli-
EOPA 11 (EOPAS) 15 output power is 17
fier
dBm
The maximum
14.5 (EOPAS) 22 output power is 20
dBm
3-6

Maximum Maximum
Power Power
℃) (W)
in (25℃ ℃) (W)
(55℃
Enhanced Optical Line Am-

EOLA 14.5 20 -
plifier
The maximum
25 38 output power is 20
Enhanced Optical Node Am- dBm
EONA
plifier The maximum
26 39 output power is 21
dBm
Enhanced Optical Booster

SEOBA 14 20 -
Amplifier
Enhanced Optical PreAmpli-

SEOPA 11 15 -
fier
Enhanced Optical Line Am-

SEOLA 14 20 -
plifier
Distributed RAMAN Ampli- DRA_P 35 53 -

fier
DRA_B 35 53 -
Line Attenuation Board LACG/LACT 3 4 -
3 (TFF or 4 (TFF or
Optical Multiplexing Unit OMU coupler) coupler) -
13.2 (AWG) 16 (AWG)
3 (TFF) 4 (TFF)
Optical De-Multiplexing Unit ODU -
13.2 (AWG) 16 (AWG)
Optical De-Multiplexing Unit

ODUB 38 (AWG) 46 (AWG) -
(B Type)
Semi-height Optical Group

SOGMD 5 6 -
Mux/DeMux Board
Optical Channel Interleaver OCI 3 4 -
Variable Insertion Loss Mul-

VMUX 30 36 -
tiplexer
Variable Insertion Loss Mul-

VMUXB 30 36 -
tiplexer (B Type)
Optical Broadband Multi-

OBM 3 4 -
plexer
3-7

Maximum Maximum
Power Power
℃) (W)
in (25℃ ℃) (W)
(55℃
Semi-height Optical
Add/Drop Board of 1 SOAD1 4 5 -
Wavelength
Semi-height Optical
Wavelength
Semi-height Optical
Wavelength
Wavelength Blocking Unit WBU 15 18 -
Wavelength Selective Unit WSU 15 18 -
Wavelength Blocking Multi-

WBM 32 38 -
plexing
Power Distribution Unit PDU 3 4 -
Optical Protect Board SOP 5 6 -
Semi-height Optical Protec-

tion Board for Channel Sec- SOPCS 3 4 -
tion
Semi-height Optical Protec-

SOPMS 3 4 -
tion Board for Mux Section
Optical Protect for Mux Sec-

OMCP 5 6 -
tion
Optical Wavelength Monitor OWM 3 4 -
Optical Performance Moni-

OPM 5 6 -
tor
Semi-height Fan Board SFANA 10 20 -
Semi-height Power Box

SPWA 28 55 -
Board (A-type)
Semi-height Node Proces-

SNP 10 12 -
sor Board
Semi-height Optical Super-

SOSC 12 14 -
vision Channel Board
Semi-height Extension Inter-

SEIA 5 6 -
face Board
3-8

Maximum Maximum
Power Power
℃) (W)
in (25℃ ℃) (W)
(55℃
Communication Control
SCC 10 12 -
Board

DSAC 34 41 -
Board
SDH Service Access Unit SAUC 32 38 -
SDH Service Aggregate

SMUB 40 48 -
Multiplexer Board
Dispersion Compensation
DCU 17 19 -
Board
10G Optical Convergence

MQ1 41 45 -
Board
Enhanced Optical Wave-

EOWM 10 12 -
length Monitor Board
Enhanced Optical Channel

EOPM 10 12 -
Performance Monitor
Eight GE/STM-16 SubRate

COMB 35 38 -
Mux Unit(Type B)
Eight GE/STM-16 SubRate

COM 32 38 -
Mux Unit
Cross switch and Syn-

CSUB 12 14 -
chronous clock Unit
Line side board with double

LD2 28 39 -
ports: OTU2 level
Client side board with dou-

CD2 28 39 -
ble ports: OTU2 level
Client side board with 4 ports LQ2 28 39 -
Line side board with 4 ports CQ2 85 91 -
Master subrack - 733 954 -

Subrack
Slave subrack - 721 940 -
3-9

3.3 Grounding Requirement

Grounding Requirements for Equipment Internal
l Each board in ZXWM M920 equipment should be grounded through the contact
between its panel and equipment cover. Make sure there is no electrical connection
inside each board.
l The outer cases of cabinet and subracks should be connected to the protection ground
in the equipment room.
Note
One side of the protection ground should be connected to the grounding copper
busbar at the right side of rack, while the other side should be connected to the
protection ground of the cabinet.
Grounding Requirements for Equipment Room

l AC working ground resistance ≤ 4 Ω
l DC working ground resistance ≤ 4 Ω
l Security protection ground resistance ≤ 4 Ω
l Lightning protection ground resistance ≤ 4 Ω
l Joint grounding resistance ≤ 1 Ω
l If the equipment room provides working ground and protection ground separately,
the working ground and protection ground of ZXWM M920 equipment should be
connected to corresponding grounding copper busbar.
l If the equipment room provides only one grounding copper busbar, the working ground
and protection ground of ZXWM M920 equipment can be jointed for grounding. The
ground resistance should meet the above requirements.
3.4 Environment Specifications

The environment requirements for ZXWM M920 equipment can be classified into three
aspects: storage environment, transportation environment, and running environment.
3.4.1 Storage Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 3-4.
Table 3-4 Requirements for Climate (Storage Environment)
Item Specifications
Altitude ≤4000 m
3-10

Item Specifications
Air pressure 70 kPa to 106kPa
Temperature -40 ℃ to +70 ℃
Temperature variance ratio ≤1 ℃/min
Relative humidity 5% to 100%
Solar radiation ≤1120 W/s2
Hot radiation ≤600 W/s2
Wind speed ≤20 m/s
Water-proof Requirement
l Keep the equipment indoor.
l Ensure that there is no water on the storage room floor, so that the water will not leak
on the packing container of the equipment. Furthermore, the storage position should
be far away from the leaking places of the fire fighting equipment and heating system.
l If the equipment should be stored outside, the requirements are listed as follows:
à Ensure that the packing of the equipment is in good condition without any
damages.
à Rainwater-proof measures should be provided, so that the rainwater can not
damage the pack of the equipment.
à Ensure that no water on the floor, so that the packing container of the equipment
will not be leaked.
à Do not expose the packing to direct sunlight.
Biology Environment
l Avoid the propagation of microorganism, such as fungi or mould.
l Avoid rodent (such as mice) to damage the equipment.
Air Cleanness Requirement

l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of mechanical activity material is illustrated in Table 3-5.
l The concentration of chemical activity material is illustrated in Table 3-6.
Table 3-5 Concentration of Mechanical Activity Material (Storage Environment)
Mechanical Activity Material Content
Suspended dust ≤5.00 mg/m3
Degraded dust ≤20.0 mg/m2•h
Sand ≤300 mg/m3
3-11

Table 3-6 Concentration of Chemical Activity Material (Storage Environment)
Chemical Activity Material Content
SO2 ≤0.30 mg/m3
H2S ≤0.10 mg/m3
NO2 ≤0.50 mg/m3
NH3 ≤1.00 mg/m3
Cl2 ≤0.10 mg/m3
HCI ≤0.10 mg/m3
HF ≤0.01 mg/m3
O3 ≤0.05 mg/m3
3.4.2 Transportation Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 3-7.
Table 3-7 Requirements for Climate
Item Specifications
Altitude ≤4000 m
Temerature -40 ℃ to +70 ℃
Relative humidity 5% to 100%
Wind speed ≤20 m/s
Water-proof Requirement
l Ensure that the packing of the equipment is in good condition without any damages.
l Rainwater-proof transportation tools should be provided, so that the rainwater can not
damage the pack of the equipment.
l Ensure that no water in the transportation tools, so that the packing container of the
equipment will not be leaked.
Biology Environment
3-12


Table 3-8 Concentration of Mechanical Activity Material
Suspended dust No special requirements
Degraded dust ≤3.0 mg/m2•h
Sand ≤100 mg/m3
Table 3-9 Concentration of Chemical Activity Material
SO2 ≤0.30 mg/m3
H2S ≤0.10 mg/m3
NO2 ≤0.50 mg/m3
NH3 ≤1.00 mg/m3
Cl2 ≤0.10 mg/m3
HCI ≤0.10 mg/m3
HF ≤0.01 mg/m3
O3 ≤0.05 mg/m3
3.4.3 Running Environment

Climate Requirements
The climate requirements for the ZXWM M920 equipment are described in Table 3-10 and
Table 3-11.
Table 3-10 Climate Requirements
Item Specification
Long term running: 0 ºC to +45 ºC

Ambient temperature
Short term running: -5 ºC to +50 ºC
Long term running: 10% to 90%

Relative humidity (35 ºC)
Short term running: 5% to 95%
• Temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipment.
• Short term running means that the equipment works continuously for no more than 96 hours and
works for no more than 15 days in one year.
3-13

Table 3-11 Requirements for Climate
Item Specifications
Altitude ≤4000 m
Wind speed ≤5 m/s
Biology Environment

Table 3-12 Concentration of Mechanical Activity Material
Suspended dust ≤0.2 mg/m3
Degraded dust ≤15 mg/m2•h
Sand ≤100 mg/m3
Dust particle ≤3×105 /m3
Table 3-13 Concentration of Chemical Activity Material
SO2 ≤0.30 mg/m3
H2S ≤0.10 mg/m3
NO2 ≤0.50 mg/m3
NH3 ≤3.00 mg/m3
Cl2 ≤0.10 mg/m3
HCI ≤0.10 mg/m3
HF ≤0.01 mg/m3
O3 ≤0.05 mg/m3
NOx ≤0.5 mg/m3
3-14

3.5 Lightning Protection Requirements

Typical power supply lightning protection can be divided in to three classes as shown in
Table 3-14.
Table 3-14 Typical Power Supply Lighting Protection Classification
Location of Lightning
Class Parameter
Protection Circuit
AC power distribution
Class B 40 kA (8 μs /20 μs)
board/unit
Class C 20 kA (8 μs/20 μs) DC power cabinet
Class D 6000 V (combination wave) -48 V power rectifier
ZXWM M920 must meet the following lightning protection requirements:

l In central equipment room:
à AC power cables should be led into the cable vault or power room underground.
à Since the AC power distribution board/unit and the DC power cabinet are in
the same equipment room, the distance between Class B and Class C lightning
protection units should meet the following decoupling distance requirements:
When the protection grounding bar is laid independently, the distance between
Class B and Class C lightning protection units should be no less than 5 m.
When the protection grounding bar and the power cords are laid in parallel, the
distance between Class B and Class C lightning protection units should be no
less than 15 m.
à If the required decoupling distance can not be satisfied due to some restrictions
in the equipment room, additional decoupling inductance(s) should be installed
before the Class C lightning protection unit by 1.5μH/m.
à Bunched copper wires with cross section area no less than 95 mm2 which are
joined by MET (Main Earthing Terminal) or FEB (Floor Equipotential Earthing
Terminal Board) should be used as the grounding cables of the Class B lightning
protection unit (AC power distribution board/unit), and the protection grounding
cables and working grounding cables of the Class C lightning protection unit
(DC power cabinet), which are connected to the protection grounding bar in the
equipment room. Keep the length of grounding cables as short as possible.
l The lightning requirements of ZXWM M920 power supply input/output ports are listed
in Table 3-15.
Table 3-15 ZXWM M920 Port Lighting Requirements
Ports Requirements
DC power input port 1 kV (1.2/50 µs)
Signal input/output port 1 kV (1.2/50 µs)
3-15

3.6 Electro Magnetic Compatibility Requirements

3.6.1 Electro-Magnetic Susceptibility
The Electro-magnetic susceptibility specifications of ZXWM M920 are illustrated in Table
3-16.
Table 3-16 Electro-Magnetic Susceptibility Specifications
Test Item Standard
Electronic Static Discharge Susceptibil-

GB/T 17626.2 or IEC 61000-4-2
ity
RF Electromagnetic Radiation Suscep-

GB/T 17626.3 or IEC 61000-4-3
tibility
Electrical Fast Transient Susceptibility GB/T 17626.4 or IEC 61000-4-4
Surge Susceptibility GB/T 17626.5 or IEC 61000-4-5
RF Filed Conduct Susceptibility GB/T 17626.6 or IEC 61000-4-6
3.6.2 Electro-Magnetic Interference (EMI)

Electro-Magnetic Interference (EMI) specifications of ZXWM M920 include conduction
disturbance and radiation disturbance, which are in compliance with GB 9254 or CISPR
22 (A-level ITE).
3.7 Requirements on Operating Wavelength

3.7.1 Wavelength Allocation in 8/16/32/40-Channel Systems
Table 3-17 lists the wavelength allocation in a system consisting of ZXWM M920 with no
more than 40 wavelengths in C band. The spacing between wavelengths is 100 GHz (The
spacing for 8-channel system is 200 GHz).
Table 3-17 Wavelength Allocation (8/16/32/40-channel, C band)
Central Central Central Central

Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)
1 C 192.10 1560.61 21 C 194.10 1544.53
2 C 192.20 1559.79 22 C 194.20 1543.73
3 C 192.30 1558.98 23 C 194.30 1542.94
4 C 192.40 1558.17 24 C 194.40 1542.14
5 C 192.50 1557.36 25 C 194.50 1541.35
3-16


Sub-band Sub-band
Name Name )
6 C 192.60 1556.55 26 C 194.60 1540.56
7 C 192.70 1555.75 27 C 194.70 1539.77
8 C 192.80 1554.94 28 C 194.80 1538.98
9 C 192.90 1554.13 29 C 194.90 1538.19
10 C 193.00 1553.33 30 C 195.00 1537.4
11 C 193.10 1552.52 31 C 195.10 1536.61
12 C 193.20 1551.72 32 C 195.20 1535.82
13 C 193.30 1550.92 33 C 195.30 1535.04
14 C 193.40 1550.12 34 C 195.40 1534.25
15 C 193.50 1549.32 35 C 195.50 1533.47
16 C 193.60 1548.51 36 C 195.60 1532.68
17 C 193.70 1547.72 37 C 195.70 1531.9
18 C 193.80 1546.92 38 C 195.80 1531.12
19 C 193.90 1546.12 39 C 195.90 1530.33
20 C 194.00 1545.32 40 C 196.00 1529.55
• Sub-band C refers to the first sub-band in C band with the wavelength spacing at 100 GHz.
3.7.2 Wavelength Allocation in 48/96 Wavelength System

Table 3-18 lists the wavelength allocation in a system consisting of ZXWM M920 with 48/96
wavelengths in C band. The spacing between wavelengths is 100 GHz/50 GHz.
Table 3-18 Wavelength Allocation (48/96-channel,C band)

Sub-band Sub-band
Name Name )
1 C1002 196.05 1529.16 49 C1002 193.65 1548.11
2 C1001 196.00 1529.55 50 C1001 193.60 1548.51
3 C1002 195.95 1529.94 51 C1002 193.55 1548.91
4 C1001 195.90 1530.33 52 C1001 193.50 1549.32
5 C1002 195.85 1530.72 53 C1002 193.45 1549.72
6 C1001 195.80 1531.12 54 C1001 193.40 1550.12
7 C1002 195.75 1531.51 55 C1002 193.35 1550.52
3-17


Sub-band Sub-band
Name Name )
8 C1001 195.70 1531.9 56 C1001 193.30 1550.92
9 C1002 195.65 1532.29 57 C1002 193.25 1551.32
10 C1001 195.60 1532.68 58 C1001 193.20 1551.72
11 C1002 195.55 1533.07 59 C1002 193.15 1552.12
12 C1001 195.50 1533.47 60 C1001 193.10 1552.52
13 C1002 195.45 1533.86 61 C1002 193.05 1552.93
14 C1001 195.40 1534.25 62 C1001 193.00 1553.33
15 C1002 195.35 1534.64 63 C1002 192.95 1553.73
16 C1001 195.30 1535.04 64 C1001 192.90 1554.13
17 C1002 195.25 1535.43 65 C1002 192.85 1554.54
18 C1001 195.20 1535.82 66 C1001 192.80 1554.94
19 C1002 195.15 1536.22 67 C1002 192.75 1555.34
20 C1001 195.10 1536.61 68 C1001 192.70 1555.75
21 C1002 195.05 1537 69 C1002 192.65 1556.15
22 C1001 195.00 1537.4 70 C1001 192.60 1556.55
23 C1002 194.95 1537.79 71 C1002 192.55 1556.96
24 C1001 194.90 1538.19 72 C1001 192.50 1557.36
25 C1002 194.85 1538.58 73 C1002 192.45 1557.77
26 C1001 194.80 1538.98 74 C1001 192.40 1558.17
27 C1002 194.75 1539.37 75 C1002 192.35 1558.58
28 C1001 194.70 1539.77 76 C1001 192.30 1558.98
29 C1002 194.65 1540.16 77 C1002 192.25 1559.39
30 C1001 194.60 1540.56 78 C1001 192.20 1559.79
31 C1002 194.55 1540.95 79 C1002 192.15 1560.2
32 C1001 194.50 1541.35 80 C1001 192.10 1560.61
33 C1002 194.45 1541.75 81 C1002 192.05 1561.02
34 C1001 194.40 1542.14 82 C1001 192.00 1561.42
35 C1002 194.35 1542.54 83 C1002 191.95 1561.83
36 C1001 194.30 1542.94 84 C1001 191.90 1562.24
37 C1002 194.25 1543.33 85 C1002 191.85 1562.64
38 C1001 194.20 1543.73 86 C1001 191.80 1563.05
3-18


Sub-band Sub-band
Name Name )
39 C1002 194.15 1544.13 87 C1002 191.75 1563.46
40 C1001 194.10 1544.53 88 C1001 191.70 1563.87
41 C1002 194.05 1544.92 89 C1002 191.65 1564.27
42 C1001 194.00 1545.32 90 C1001 191.60 1564.68
43 C1002 193.95 1545.72 91 C1002 191.55 1565.09
44 C1001 193.90 1546.12 92 C1001 191.50 1565.5
45 C1002 193.85 1546.52 93 C1002 191.45 1565.91
46 C1001 193.80 1546.92 94 C1001 191.40 1566.32
47 C1002 193.75 1547.32 95 C1002 191.35 1566.73
48 C1001 193.70 1547.72 96 C1001 191.30 1567.14
• Sub-band C1001 and C1002 respectively refer to the first and the second sub-bands in C band with the wavelength
spacing at 100 GHz. Each sub-band includes 48 wavelengths.
3.7.3 Wavelength Allocation in 80/160 Wavelength System

1. Table 3-19 lists the wavelength allocation in a system consisting of ZXWM M920 with
80 wavelengths in C band. The spacing between wavelengths is 50 GHz.
Table 3-19 Wavelength Allocation (80-channel, C band)

Sub-band Sub-band
Name Name )
1 C+ 196.05 1529.16 41 C+ 194.05 1544.92
2 C 196.00 1529.55 42 C 194.00 1545.32
3 C+ 195.95 1529.94 43 C+ 193.95 1545.72
4 C 195.90 1530.33 44 C 193.90 1546.12
5 C+ 195.85 1530.72 45 C+ 193.85 1546.52
6 C 195.80 1531.12 46 C 193.80 1546.92
7 C+ 195.75 1531.51 47 C+ 193.75 1547.32
8 C 195.70 1531.90 48 C 193.70 1547.72
9 C+ 195.65 1532.29 49 C+ 193.65 1548.11
10 C 195.60 1532.68 50 C 193.60 1548.51
11 C+ 195.55 1533.07 51 C+ 193.55 1548.91
12 C 195.50 1533.47 52 C 193.50 1549.32
3-19


Sub-band Sub-band
Name Name )
13 C+ 195.45 1533.86 53 C+ 193.45 1549.72
14 C 195.40 1534.25 54 C 193.40 1550.12
15 C+ 195.35 1534.64 55 C+ 193.35 1550.52
16 C 195.30 1535.04 56 C 193.30 1550.92
17 C+ 195.25 1535.43 57 C+ 193.25 1551.32
18 C 195.20 1535.82 58 C 193.20 1551.72
19 C+ 195.15 1536.22 59 C+ 193.15 1552.12
20 C 195.10 1536.61 60 C 193.10 1552.52
21 C+ 195.05 1537.00 61 C+ 193.05 1552.93
22 C 195.00 1537.40 62 C 193.00 1553.33
23 C+ 194.95 1537.79 63 C+ 192.95 1553.73
24 C 194.90 1538.19 64 C 192.90 1554.13
25 C+ 194.85 1538.58 65 C+ 192.85 1554.54
26 C 194.80 1538.98 66 C 192.80 1554.94
27 C+ 194.75 1539.37 67 C+ 192.75 1555.34
28 C 194.70 1539.77 68 C 192.70 1555.75
29 C+ 194.65 1540.16 69 C+ 192.65 1556.15
30 C 194.60 1540.56 70 C 192.60 1556.55
31 C+ 194.55 1540.95 71 C+ 192.55 1556.96
32 C 194.50 1541.35 72 C 192.50 1557.36
33 C+ 194.45 1541.75 73 C+ 192.45 1557.77
34 C 194.40 1542.14 74 C 192.40 1558.17
35 C+ 194.35 1542.54 75 C+ 192.35 1558.58
36 C 194.30 1542.94 76 C 192.30 1558.98
37 C+ 194.25 1543.33 77 C+ 192.25 1559.39
38 C 194.20 1543.73 78 C 192.20 1559.79
39 C+ 194.15 1544.13 79 C+ 192.15 1560.2
40 C 194.10 1544.53 80 C 192.10 1560.61
• Sub-band C and C+ respectively refer to the first and the second sub-bands in C band with the wavelength spacing
at 100 GHz. Each sub-band includes 40 wavelengths.
2. Table 3-20 lists the wavelength allocation in a system consisting of ZXWM M920 with
80 wavelengths in L band. The spacing between wavelengths is 50 GHz.
3-20

Table 3-20 Wavelength Allocation (80-channel, L band)

Sub-band Sub-band
Name Name )
1 L 190.90 1570.42 41 L 188.90 1587.04
2 L+ 190.85 1570.83 42 L+ 188.85 1587.46
3 L 190.80 1571.24 43 L 188.80 1587.88
4 L+ 190.75 1571.65 44 L+ 188.75 1588.30
5 L 190.70 1572.06 45 L 188.70 1588.73
6 L+ 190.65 1572.48 46 L+ 188.65 1589.15
7 L 190.60 1572.89 47 L 188.60 1589.57
8 L+ 190.55 1573.30 48 L+ 188.55 1589.99
9 L 190.50 1573.71 49 L 188.50 1590.41
10 L+ 190.45 1574.13 50 L+ 188.45 1590.83
11 L 190.40 1574.54 51 L 188.40 1591.26
12 L+ 190.35 1574.95 52 L+ 188.35 1591.68
13 L 190.30 1575.37 53 L 188.30 1592.10
14 L+ 190.25 1575.78 54 L+ 188.25 1592.52
15 L 190.20 1576.20 55 L 188.20 1592.95
16 L+ 190.15 1576.61 56 L+ 188.15 1593.37
17 L 190.10 1577.03 57 L 188.10 1593.79
18 L+ 190.05 1577.44 58 L+ 188.05 1594.22
19 L 190.00 1577.86 59 L 188.00 1594.64
20 L+ 189.95 1578.27 60 L+ 187.95 1595.06
21 L 189.90 1578.69 61 L 187.90 1595.49
22 L+ 189.85 1579.10 62 L+ 187.85 1595.91
23 L 189.80 1579.52 63 L 187.80 1596.34
24 L+ 189.75 1579.93 64 L+ 187.75 1596.76
25 L 189.70 1580.35 65 L 187.70 1597.19
26 L+ 189.65 1580.77 66 L+ 187.65 1597.62
27 L 189.60 1581.18 67 L 187.60 1598.04
28 L+ 189.55 1581.60 68 L+ 187.55 1598.47
29 L 189.50 1582.02 69 L 187.50 1598.89
30 L+ 189.45 1582.44 70 L+ 187.45 1599.32
3-21


Sub-band Sub-band
Name Name )
31 L 189.40 1582.85 71 L 187.40 1599.75
32 L+ 189.35 1583.27 72 L+ 187.35 1600.17
33 L 189.30 1583.69 73 L 187.30 1600.60
34 L+ 189.25 1584.11 74 L+ 187.25 1601.03
35 L 189.20 1584.53 75 L 187.20 1601.46
36 L+ 189.15 1584.95 76 L+ 187.15 1601.88
37 L 189.10 1585.36 77 L 187.10 1602.31
38 L+ 189.05 1585.78 78 L+ 187.05 1602.74
39 L 189.00 1586.20 79 L 187.00 1602.17
40 L+ 188.95 1586.62 80 L+ 186.95 1603.57
• Sub-band L and L+ respectively refer to the first and the second sub-bands in L band with the wavelength spacing
at 100 GHz. Each sub-band includes 40 wavelengths.
3. Table 3-19 and Table 3-20 lists the wavelength allocation in a system consisting of
ZXWM M920 with 160 wavelengths in C+L band. The spacing between wavelengths
is 50 GHz.
3.7.4 Wavelength Allocation in 176-Channel Systems

When the system is extended to 176-channel system (C+L band) with the spacing at 50
GHz, wavelength allocations in 96-channel band (C band) and 80-channel system (L band)
are adopted.
3.7.5 Wavelength Allocation in 192-Channel Systems

Table 3-21 lists the wavelength allocation in a system consisting of ZXWM M920 with 192
wavelengths in C band. The spacing between wavelengths is 25 GHz.
Table 3-21 Wavelength Allocation (192-channel, C band)

Sub-band Sub-band
Name Name )
1 C1004 196.075 1528.97 97 C1004 193.675 1547.92
2 C1002 196.05 1529.16 98 C1002 193.65 1548.11
3 C1003 196.025 1529.36 99 C1003 193.625 1548.31
4 C1001 196 1529.55 100 C1001 193.6 1548.51
5 C1004 195.975 1529.75 101 C1004 193.575 1548.71
3-22


Sub-band Sub-band
Name Name )
6 C1002 195.95 1529.94 102 C1002 193.55 1548.91
7 C1003 195.925 1530.14 103 C1003 193.525 1549.11
8 C1001 195.9 1530.33 104 C1001 193.5 1549.32
9 C1004 195.875 1530.53 105 C1004 193.475 1549.52
10 C1002 195.85 1530.72 106 C1002 193.45 1549.72
11 C1003 195.825 1530.92 107 C1003 193.425 1549.92
12 C1001 195.8 1531.12 108 C1001 193.4 1550.12
13 C1004 195.775 1531.31 109 C1004 193.375 1550.32
14 C1002 195.75 1531.51 110 C1002 193.35 1550.52
15 C1003 195.725 1531.7 111 C1003 193.325 1550.72
16 C1001 195.7 1531.9 112 C1001 193.3 1550.92
17 C1004 195.675 1532.09 113 C1004 193.275 1551.12
18 C1002 195.65 1532.29 114 C1002 193.25 1551.32
19 C1003 195.625 1532.49 115 C1003 193.225 1551.52
20 C1001 195.6 1532.68 116 C1001 193.2 1551.72
21 C1004 195.575 1532.88 117 C1004 193.175 1551.92
22 C1002 195.55 1533.07 118 C1002 193.15 1552.12
23 C1003 195.525 1533.27 119 C1003 193.125 1552.32
24 C1001 195.5 1533.47 120 C1001 193.1 1552.52
25 C1004 195.475 1533.66 121 C1004 193.075 1552.73
26 C1002 195.45 1533.86 122 C1002 193.05 1552.93
27 C1003 195.425 1534.05 123 C1003 193.025 1553.13
28 C1001 195.4 1534.25 124 C1001 193 1553.33
29 C1004 195.375 1534.45 125 C1004 192.975 1553.53
30 C1002 195.35 1534.64 126 C1002 192.95 1553.73
31 C1003 195.325 1534.84 127 C1003 192.925 1553.93
32 C1001 195.3 1535.04 128 C1001 192.9 1554.13
33 C1004 195.275 1535.23 129 C1004 192.875 1554.34
34 C1002 195.25 1535.43 130 C1002 192.85 1554.54
35 C1003 195.225 1535.63 131 C1003 192.825 1554.74
36 C1001 195.2 1535.82 132 C1001 192.8 1554.94
3-23


Sub-band Sub-band
Name Name )
37 C1004 195.175 1536.02 133 C1004 192.775 1555.14
38 C1002 195.15 1536.22 134 C1002 192.75 1555.34
39 C1003 195.125 1536.41 135 C1003 192.725 1555.55
40 C1001 195.1 1536.61 136 C1001 192.7 1555.75
41 C1004 195.075 1536.81 137 C1004 192.675 1555.95
42 C1002 195.05 1537 138 C1002 192.65 1556.15
43 C1003 195.025 1537.2 139 C1003 192.625 1556.35
44 C1001 195 1537.4 140 C1001 192.6 1556.55
45 C1004 194.975 1537.59 141 C1004 192.575 1556.76
46 C1002 194.95 1537.79 142 C1002 192.55 1556.96
47 C1003 194.925 1537.99 143 C1003 192.525 1557.16
48 C1001 194.9 1538.19 144 C1001 192.5 1557.36
49 C1004 194.875 1538.38 145 C1004 192.475 1557.57
50 C1002 194.85 1538.58 146 C1002 192.45 1557.77
51 C1003 194.825 1538.78 147 C1003 192.425 1557.97
52 C1001 194.8 1538.98 148 C1001 192.4 1558.17
53 C1004 194.775 1539.17 149 C1004 192.375 1558.38
54 C1002 194.75 1539.37 150 C1002 192.35 1558.58
55 C1003 194.725 1539.57 151 C1003 192.325 1558.78
56 C1001 194.7 1539.77 152 C1001 192.3 1558.98
57 C1004 194.675 1539.96 153 C1004 192.275 1559.19
58 C1002 194.65 1540.16 154 C1002 192.25 1559.39
59 C1003 194.625 1540.36 155 C1003 192.225 1559.59
60 C1001 194.6 1540.56 156 C1001 192.2 1559.79
61 C1004 194.575 1540.76 157 C1004 192.175 1560
62 C1002 194.55 1540.95 158 C1002 192.15 1560.2
63 C1003 194.525 1541.15 159 C1003 192.125 1560.4
64 C1001 194.5 1541.35 160 C1001 192.1 1560.61
65 C1004 194.475 1541.55 161 C1004 192.075 1560.81
66 C1002 194.45 1541.75 162 C1002 192.05 1561.01
67 C1003 194.425 1541.94 163 C1003 192.025 1561.22
3-24


Sub-band Sub-band
Name Name )
68 C1001 194.4 1542.14 164 C1001 192 1561.42
69 C1004 194.375 1542.34 165 C1004 191.975 1561.62
70 C1002 194.35 1542.54 166 C1002 191.95 1561.83
71 C1003 194.325 1542.74 167 C1003 191.925 1562.03
72 C1001 194.3 1542.94 168 C1001 191.9 1562.23
73 C1004 194.275 1543.13 169 C1004 191.875 1562.44
74 C1002 194.25 1543.33 170 C1002 191.85 1562.64
75 C1003 194.225 1543.53 171 C1003 191.825 1562.84
76 C1001 194.2 1543.73 172 C1001 191.8 1563.05
77 C1004 194.175 1543.93 173 C1004 191.775 1563.25
78 C1002 194.15 1544.13 174 C1002 191.75 1563.45
79 C1003 194.125 1544.33 175 C1003 191.725 1563.66
80 C1001 194.1 1544.53 176 C1001 191.7 1563.86
81 C1004 194.075 1544.72 177 C1004 191.675 1564.07
82 C1002 194.05 1544.92 178 C1002 191.65 1564.27
83 C1003 194.025 1545.12 179 C1003 191.625 1564.47
84 C1001 194 1545.32 180 C1001 191.6 1564.68
85 C1004 193.975 1545.52 181 C1004 191.575 1564.88
86 C1002 193.95 1545.72 182 C1002 191.55 1565.09
87 C1003 193.925 1545.92 183 C1003 191.525 1565.29
88 C1001 193.9 1546.12 184 C1001 191.5 1565.5
89 C1004 193.875 1546.32 185 C1004 191.475 1565.7
90 C1002 193.85 1546.52 186 C1002 191.45 1565.9
91 C1003 193.825 1546.72 187 C1003 191.425 1566.11
92 C1001 193.8 1546.92 188 C1001 191.4 1566.31
93 C1004 193.775 1547.12 189 C1004 191.375 1566.52
94 C1002 193.75 1547.32 190 C1002 191.35 1566.72
95 C1003 193.725 1547.52 191 C1003 191.325 1566.93
96 C1001 193.7 1547.72 192 C1001 191.3 1567.13
• Sub-band C1001, C1002, C1003 and C1004 respectively refer to the first, second, third and fourth sub-bands in
C band with the wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths. Sub-band C501 with
wavelength spacing at 50 GHz is composed of sub-band C1001 and C1002, while sub-band C502 with wavelength
spacing at 50 GHz is composed of sub-band C1003 and C1004.
3-25

3.8 Service Access and Convergence Subsystem

Specifications
3.8.1 Optical Transponder Unit Specifications
3.8.1.1 Specifications of the 2.5G Board
Technical Specifications of the 2.5G Board

Technical specifications of the 2.5G board interface at client side and wavelength division
side are listed in Table 3-22 and Table 3-23.
Table 3-22 Technical Specifications of the Client-Side 2.5G Board
Item Unit Specification
Parameters of client-side optical receive port (S point)
Receiver sensitivity (BER=10-12) dBm <-18
Receiver reflectance dB <-27
Overload power dBm >0
Wavelength range of input signal nm 1280-1625
Parameters of client-side optical receive port (R point)
Mean launched power Maximum dBm 0

(near-end optical port
Minimum dBm -5
S-16.1)
(near-end optical port
Minimum dBm -2
L-16.2)
Minimum extinction ratio dB 8.2
Eye diagram - Complies with ITU-T G.957
1. Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
2. Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
transmit/receive part of regenerator in a DWDM system.
Table 3-23 Technical Specifications of the 2.5G Board at Wavelength Division Side
Parameters of optical transmit port at wavelength division side (Sn point)
Nominal light source type - DFB-LD
3-26

Maximum -20 dB band- 0.2 (EA)

nm
width 0.4 (direct modulation)
Spectral characteristics
Minimum side mode
compression ratio dB 35
(SMCR)
192.10-196.05 (C band)
Nominal central fre-
THz 191.30-196.075 (CE band)
quency
186.95-190.90 (L band)
Central frequency
≤±12.5 (wavelength spacing: 100
Central frequency off-
GHz GHz)
set
≤±5 (wavelength spacing: 50 GHz)
Maximum dBm 0
Mean launched power
Minimum dBm -10
10 (EA)
Minimum extinction ratio dB
8.2 (direct modulation)
12800 (EA)
Dispersion tolerance ps/nm
6400 (direct modulation)
Parameters of optical receive port at wavelength division side (Rn point)
Receiver sensitivity (BER=10-12) dBm <-25
Receiver reflection dB <-27
Overload power dBm >-9
Jitter Generation Specifications

When the 2.5G board uses the specified filter, the maximum jitter generation value got
during the test period of one minute does not exceed the reference value given in Table
3-24.
Table 3-24 Jitter Generation Specifications
Test Bandwidth
Optical Port High-pass Filter Low-pass Filter (MHz, Peak-peak Jitter (UIpp)
(kHz -60 dB/dec)
STM-1 optical 0.5 1.3 0.30

port 6.5 1.3 0.10
3-27

Test Bandwidth
Optical Port High-pass Filter Low-pass Filter (MHz, Peak-peak Jitter (UIpp)
(kHz -60 dB/dec)
STM-4 optical 1 5 0.30

port 250 5 0.10

port 1000 20 0.10
• For transfer functions of high-pass and low-pass filters, refer to clause 35 of ITU-T G.825 Recomme
ndation.
• For STM-1, 1 UI = 6.43 ns. For STM-4, 1 UI = 1.61 ns . For STM-16, 1 UI = 0.40 ns .
Jitter Transfer Characteristics

The jitter transfer characteristics of optical port at wavelength division side comply with
ITU-T G.783 Recommendation. Table 3-25 lists the jitter transfer characteristics of 3R
line-side optical port that carries SDH signal. Its jitter transfer function curve is below the
curve shown in Figure 3-1.
Table 3-25 Jitter Transfer Characteristics of 3R Line-Side Optical Port That Carries
SDH Signal
Optical Port fL (kHz) fC (kHz) fH (kHz) P (dB)
STM-1 1.3 130 1300 0.1
STM-4 5 500 5000 0.1
STM-16 20 2000 20000 0.1
Figure 3-1 Jitter Transfer Characteristics of Line-side Optical Port
3.8.1.2 Specifications of the 10G Board
Technical Specifications of the 10G Board

Technical specifications of the 10 Gboard interface at client side and wavelength division
3-28

Table 3-26 Technical Specifications of the Client-Side 10G Board (with FEC)
<-14 (I-64.1)
<-16 (S-64.2b)
Receiver sensitivity dBm <-14 (10GBASE-LR/LW) (only supported by
SOTU10G board)
<-16 (10GBASE-ER/EW)
<-14 (I-64.1)
<-27 (S-64.2b)
Receiver reflectance dB <-14 (10GBASE-LR/LW) (only supported by

SOTU10G board)
>0 (PIN)
Overload power dBm
>-9 (APD)
Maxi-
Mean launched power dBm -1
mum
(far-end optical port S-64.2a)
Minimum dBm -5
Maxi-
Mean launched power dBm 2
mum
(far-end optical port S-64.2b)
Minimum dBm -1
Maxi-
Mean launched power (near- dBm -1
mum
end optical port I-64.2r)
Minimum dBm -5
Maxi-
Mean launched power (near- dBm -1
mum
end optical port I-64.1) Minimum dBm -6
Minimum extinction ratio dB 10/8.2
system.
3-29

Table 3-27 Technical Specifications of the 10G Board at Wavelength Division Side
(with FEC)
Nominal light source type - MQW-DFB
Maximum -20 dB
nm 0.3
bandwidth
Spectral char-
Minimum side mode
acteristics
(SMCR)
192.10-196.05 (C band)
THz 191.30-196.075 (CE band)
Central frequency
186.95-190.90 (L band)
quency
Central frequency off- ≤±12.5 (wavelength spacing: 100 GHz)
GHz
set ≤±5 (wavelength spacing: 50 GHz)
Mean Maximum dBm 0

launched
Minimum dBm -5
power
Minimum extinction ratio dB 10
Dispersion tolerance ps/nm 800
<-14 (STM-64)
PIN
<-12.6 (10GE)
Receiver sensitivity dBm
<-21 (STM-64)
APD
<-19.6 (10GE)
>0 (PIN)
Overload power dBm
>-9 (APD)
Jitter Generation Specifications

When the 10G board uses the specified filter, the maximum jitter generation value got
during the test period of one minute does not exceed the reference value given in Table
3-28.
3-30

Table 3-28 Jitter Generation Specifications
Test Bandwidth
Optical Port High-pass Filter Peak-peak Jitter (UIpp)
Low-pass Filter (MHz)
(kHz

port 4000 80 0.10
• For STM-64, 1 UI = 0.10 ns.
3.8.1.3 Specifications of the 40G Board

Technical specifications of the 40G board interface at client side and wavelength division
Table 3-29 Technical Specifications of the Client-Side 40G Board
Bit rate (optical modulation

Gbps 39.813 (NRZ), 43.018 39.813 (NRZ), 43.018
mode)
Optical interface category - VSR2000-3R2 P1I13D1 and 1I13D1F
Goal distance km 2 10
Frequency range nm 1280-1625 1280-1625
Sensitivity (BER=1×10-12) dBm <-6 <-7
Overload power (BER=1×10-12) dBm >+3 >+4
Receiver reflectance dB <-27 <-27
Frequency range - 1280-1625 1307-1317
Mean Maximum +3 +4
launched dBm
Minimum 0 0
power
Minimum side mode

dB 35 35
compression ratio (SMCR)
Minimum extinction ratio dB 8.2 8.2
Complies with GR-253, Complies with GR-253,

Jitter transfer characteristics -
Issue 4 Issue 4
Complies with G.959.1 Complies with G.959.1

Eye diagram -
NRZ 40G NRZ 40G
system.
3-31

Table 3-30 Technical Specifications of the 40G Board at Line-Side
Optical signal modulation mode - P-DPSK RZ-DQPSK
Bit rate Gbps 43.018 43.018
192.10-196.05 (C band)
Frequency range THz 191.30-196.075 (CE 192.10-196.05 (C band)
band)
sensitivity (BER=1×10-12) dBm ≤-18 ≤-18
Minimum overload power

dBm ≥0 0
(BER=1×10-12)
Dispersion tolerance (including

ps/nm -700-+700 -700-+700
TDC)
Jitter transfer characteristics - Complies with G.8251 Complies with G.8251
FEC gain dB >8 (AFEC) >8 (AFEC)
192.10-196.05 (C band) 192.10-196.05 (C band)

191.30-196.075 (CE 191.30-196.075 (CE
Nominal central frequency THz
band) band)
186.95-190.90 (L band) 186.95-190.90 (L band)
Channel spacing GHz 50 50
Maximum central frequency

GHz ±2.5 ±2.5
offset
Mean Maximum +5 +5
launched dBm
Minimum -5 -10
power
Launched power offset dB ±1 ±1
Spectral char- Maximum -20

GHz 0.7 0.7
acteristics dB bandwidth
Minimum side mode

dB 35 35
compression ratio (SMCR)
l Client side refers to the receive part at transmit end and the transmit part at receive
end in a DWDM system.
3-32

l Line side refers to the receive part at receive end, the transmit part at transmit end,
as well as the transmit/receive part of regenerator in a DWDM system.
3.8.2 Convergence Unit Specifications

3.8.2.1 Specifications of the SRM41 Board
Technical specifications of the SRM41 board are listed in Table 3-31.
Table 3-31 Technical Specifications of the SRM41 Board
Parameters of line-side optical receive port (Rn point)
<-14 (PIN)
<-21 (APD)
>0 (PIN)
Overload power dBm
>-9 (APD)
Parameters of line-side optical transmit port (Sn point)
Maximum -20 dB
nm 0.3
bandwidth
Spectral charac-
Minimum side
teristics
mode compression dB 35
ratio (SMCR)
192.10-196.05 (C band)
Nominal central
THz 191.30-196.075 (CE band)
frequency
Central fre- 186.95-190.90 (L band)
quency ≤±12.5 (wavelength spacing is 100 GHz)
Central frequency
GHz ≤±5 (wavelength spacing is 50 GHz)
offset
≤±2.5 (wavelength spacing is 25 GHz)
Mean launched power dBm -5 to 0
Eye diagram - Complies with ITU-T G.959.1
3-33

<-18 (I-16)
<-18 (S-16)
Receiver sensitivity dBm <-27 (L-16.1)
<-28 (L-16.2)
<-27 (L-16.3)
>-3 I-16
Overload power dBm >0 S-16
>-9 L-16
Parameters of client-side optical transmit port (R point)
-10 to -3 (I-16)
Mean launched power dBm -5 to 0 (S-16)
-2 to +3 (L-16)
3.8.2.2 Specifications of the SRM42 Board

Technical specifications of the SRM42 board are listed in Table 3-32.
Table 3-32 Technical Specifications of the SRM42 Board
<-18 (PIN)
<-25 (APD)
>0 (PIN)
Overload power dBm
>-9 (APD)
3-34

Maximum -20 dB band- 0.2 (EA)

nm
width 0.4 (direct modulation)
Spectral charac-
teristics Minimum side mode
(SMCR)
192.10-196.05 (C band)
THz 191.30-196.075 (CE band)
quency
186.95-190.90 (L band)
≤±12.5 (wavelength spacing is 100

Central frequency GHz)
Central frequency off- ≤±5 (wavelength spacing is 50
GHz
set GHz)
GHz)
10 (EA)
12800 (EA)
<-23 (I-4)
<-18 (S-4)
<-28 (L-4)
<-23 (I-1)
<-28 (S-1)
<-34 (L-1)
<-27 (S-4.2)
<-14 (L-4.1)
<-27 (L-4.2)
Receiver reflectance dB
<-14 (L-4.3)
<-25 (L-1.2)
NA (for others)
3-35

>-8 (I-4)
>-8 (S-4)
>-8 (L-4)
Overload power dBm
>-8 (I-1)
>-8 (S-1)
>-10 (L-1)
-15 to -8 (I-4)
-15 to -8 (S-4)
-3 to +2 (L-4)
Mean launched power dBm
-15 to -8 (I-1)
-15 to -8 (S-1)
-5 to 0 (L-1)
8.2 (I-4)
8.2 (S-4)
10 (L-4)
8.2 (I-1)
8.2 S-1
10 L-1
• NA means there is no requirement for the parameter.
3.8.2.3 Specifications of the DSA Board

Technical specifications of the DSA board are listed Table 3-33.
Table 3-33 Technical Specifications of the DSA Board
<-18 (PIN)
<-25 (APD)
3-36

>0 (PIN)
Overload power dBm
>-9 (APD)
Maximum -20 dB 0.2 (EA)

nm
bandwidth 0.4 (direct modulation)
Minimum side mode
(SMCR)
192.10-196.05 (C band)
THz 191.30-196.075 (CE band)
quency
186.95-190.90 (L band)
≤±12.5 (wavelength spacing is

Central frequency 100 GHz)
Central frequency ≤±5 (wavelength spacing is 50
GHz
offset GHz)
25 GHz)
10 (EA)
12800 (EA)
<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-20 (1000BASE-LH1)
Receiver sensitivity dBm <-22 (1000BASE-ZX)
<-25 (100-SM-LL-L)
<-20 (100-SM-LL-I)
<-13100-M5-SL-I
3-37

>0 (1000BASE-SX)
>-3 (1000BASE-LX)
>-3 (1000BASE-LH1)
Overload power dBm >-3 (1000BASE-ZX)
>-3 (100-SM-LL-L)
>-3 (100-SM-LL-I)
>-1.3 (100-M5-SL-I)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
Mean launched power dBm -2 to +3 (1000BASE-ZX)
-9 to -3 (100-SM-LL-L)
-12 to -3 (100-SM-LL-I)
-7.3 to +1.3 (100-M5-SL-I)
3.8.2.4 Specifications of the DSAF Board

Technical specifications of the DSAF board are listed Table 3-34.
Table 3-34 Technical Specifications of the DSAF Board
<-21 (PIN)
<-28 (APD)
>0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength area of input sig-

nm 1280-1565
nals
3-38

Maximum -20 0.2 (EA)

nm
dB bandwidth 0.5 (DM)
Spectral
characteris- Minimum side
tic mode com-
dB 30
pression ratio
(SMCR)
192.10-196.05 (C band)
Nominal cen-
THz 191.30-196.075 (CE band)
tral frequency
quency ≤±12.5 (wavelength spacing: 100 GHz)
Central fre-
GHz ≤±5 (wavelength spacing: 50 GHz)
quency offset
≤±2.5 (wavelength spacing: 25 GHz)
Mean launched power dBm -10 to +7
10 (EA)
8.2 (DM)
12800 (EA)
6500 (DM)
Eye diagram - Compliance with ITU-T G.957
<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-20 (1000BASE-LH1)
<-22 (1000BASE-ZX)
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
Overload power dBm
>-3 (1000BASE-LH1)
>-3 (1000BASE-ZX)
-9.5 to -31000BASE-SX)
-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
-2 to +3 (1000BASE-ZX)
3-39

3.8.2.5 Specifications of the GEM2 Board

Technical specifications of the GEM2 board are listed Table 3-35.
Table 3-35 Technical Specifications of the GEM2 Board
<-21 (PIN)
<-25 (APD)
>0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength area of input signals nm 1280-1625

nm
bandwidth 0.4 (DM)
Minimum side mode
(SMCR)
192.10-196.05 (C
band)
Nominal central
THz 191.30-196.075 (CE
frequency
band)
186.95-190.90 (L band)
Central frequency ≤±12.5 (wavelength
spacing: 100 GHz)
Central frequency ≤±5 (wavelength
GHz
offset spacing: 50 GHz)
≤±2.5 (wavelength
spacing: 25 GHz)
10 (EA)
8.2 (DM)
12800 (EA)
3200 (DM)
Compliance with ITU-T

Eye diagram -
G.957
3-40

<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-20 (1000BASE-LH1)
<-22 (1000BASE-ZX)
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
Overload power dBm
>-3 (1000BASE-LH1)
>-3 (1000BASE-ZX)
-9.5 to -3 (1000BASE-
SX)
-11 to -3 (1000BASE-
Mean launched power dBm LX)
-4 to 0 (1000BASE-
LH1)
-2 to 3 (1000BASE-ZX)
3.8.2.6 Specifications of the GEM8 Board

Technical specifications of the GEM8 board are listed Table 3-36.
Table 3-36 Technical Specifications of the GEM8 Board
<-14 (PIN)
<-21 (APD)
>0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength area of input signals nm 1280-1565
3-41

Maximum -20 dB
nm 0.3
Spectral bandwidth
characteris- Minimum side mode
tics compression ratio dB 35
(SMCR)
192.10-196.05 (C band)
THz 191.30-196.075 (CE band)
quency
quency ≤±12.5 (wavelength spacing:100GHz
Central frequency
GHz ≤±5(wavelength spacing:50 GHz
offset
≤±2.5 (wavelength spacing:25 GHz
Eye diagram - Compliance with ITU-T G.959.1
<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
>0 (1000BASE-SX)
Overload power dBm
>-3 (1000BASE-LX)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
3.8.2.7 Specifications of the GEMF Board

Technical specifications of the GEMF board are listed Table 3-37.
Table 3-37 Technical Specifications of the GEMF Board
<-21 (PIN)
<-25 (APD)
3-42

>0 (PIN)
Overload power dBm
>-9 (APD)

nm
bandwidth 0.4 (direct modulation)
Minimum side
mode compres- dB 35
sion ratio (SMCR)
192.10-196.05 (C band)
Nominal central
THz 191.30-196.075 (CE band)
frequency
186.95-190.90 (L band)

Central frequency 100 GHz)
Central frequency ≤±5 (wavelength spacing is 50
GHz
offset GHz)
GHz)
10 (EA)
12800 (EA)
<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-20 (1000BASE-LH1)
<-22 (1000BASE-ZX)
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
Overload power dBm
>-3 (1000BASE-LH1)
>-3 (1000BASE-ZX)
3-43

-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
-2 to +3 (1000BASE-ZX)
3.8.2.8 Specifications of the FCA Board

Technical specifications of the FCA board are listed Table 3-38.
Table 3-38 Technical Specifications of the FCA Board
Item Unit Specifications
Parameters of line-side optical receive port
Transmission distance Transmission distance at 40

at 80 km km
Receiver sensitivity dBm -24 to -17 -24 to -17
>0.5(PIN) >0.5(PIN)
Overload power dBm
>-8(APD) >-8(APD)
Wavelength area of input sig-

nm 1280-1625 1280-1625
nals
Parameters of line-side optical transmit port
Maximum -20
nm ≤0.3 ≤0.3
dB bandwidth
Spectral
Minimum side
characteris-
mode com-
tic dB 35 35
pression ratio
(SMCR)
Central Central fre-

GHz 2.5 2.5
frequency quency offset
Mean launched power dBm 0 to 5 0 to 5
Minimum extinction ratio dB ≥10 ≥10
Dispersion tolerance ps/nm 1600 1600
Compliance with ITU-T Compliance with ITU-T

Eye diagram -
G.691 G.691
3-44

Item Unit Specifications
Parameters of client-side optical receive port
Transmission distance at 10km
FC dBm <-18
Receiver
2GFC dBm <-18
sensitivity
4GFC dBm <-18
FC dBm >0
Overload
2GFC dBm >0
power
4GFC dBm >0
Parameters of client-side optical transmit port
FC dBm -4.5
Output
2GFC dBm -4.5
power
4GFC dBm -4.5
3.8.2.9 Specifications of the MQT3 Board

Technical specifications of the MQT3 board interface at client side and line side are listed
in Table 3-39 and Table 3-40.
Table 3-39 Technical Specifications of the Client-Side MQT3 Board
<-14 (I64.1)
<-16 (S64.2b)
Receiver sensitivity (BER≤10-12) ) dBm
<-14 (10GBASE-LR/LW)
<-14 (I64.1)
<-27 (S64.2b)
Receiver reflectance dB
>0 (I64.1)
>-1 (S64.2b)
Overload power dBm
>0 (10GBASE-LR/LW)
>-1 (10GBASE-ER/EW)
3-45

Wavelength range of receiving signal nm 1280-1625
-6 to -1 (I64.1)
-1 to 2 (S64.2b)
-6 to -1 (10GBASE-LR/LW)
-1 to 2 (10GBASE-ER/EW)
6 (I64.1)
8.2 (S64.2b)
6 (10GBASE-LR/LW)
8.2 (10GBASE-ER/EW)
system.
Table 3-40 Technical Specifications of the Line-Side MQT3 Board
Optical signal modulation

- P-DPSK RZ-DQPSK
moede
Bit rate Gbps 43.018 43.018
192.10-196.05 (C band) 192.10-196.05 (C band)

THz 191.30-196.075 (CE band) 191.30-196.075 (CE band)
quency
186.95-190.90 (L band) 186.95-190.90 (L band)
Wavelength spacing GHz 50 50

Maximum central
GHz ±2.5 ±2.5
frequency offset
Maxi-
Mean +5 +5
mum
launched dBm
Mini-
power -5 -10
mum
Launched power offset dB ±1 ±1

Maxi-
mum
Spectral char-
-20 dB GHz 0.7 0.7
acteristics
band-
width
3-46

Minimum side mode

compression ratio dB 35 35
(SMCR)
192.10-196.05 (C band)
Frequency range THz 192.10-196.05 (C band)
191.30-196.075 (CE band)
Sensitivity (BER=1×10-
dBm ≤-18 ≤-18
12)
Minimum overload
dBm ≥0 0
(BER=1×10-12)
Max. reflectance dB <-27 <-27
Dispersion tolerance
ps/nm -700 to +700 -700 to +700
(including TDC)
Jitter Transfer
- Complies with ITU-T G.8251 Complies with ITU-T G.8251
Characteristics
FEC code gain dB >8 (AFEC) >8 (AFEC)
system.
3.8.2.10 Specifications of the MQ1 Board

Table 3-41 lists the specifications of interfaces at client side of MQ1 board. Table 3-42 lists
the specifications of interfaces at line side of the MQT3 board.
Table 3-41 Technical Specifications of the Client-Side MQ1 Board
Project Unit Parameter
<-18 (I-16)
<-18 (S-16)
Receiver sensitivity (BER≤10-12)) dBm <-27 (L-16.1)
<-28 (L-16.2)
<-27 (L-16.3)
Receiver Reflection dB <-27
3-47

>-3 (I-16)
Overload power dBm >0 (S-16)
>-9 (L-16)
-10 to -3 (I-16)
Mean launched power dBm -5 to 0 (S-16)
-2 to +3 (L-16)
Eye diagram mask Comply with ITU-T G.957 Recommenda-

-
tion
• Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
• Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
Table 3-42 Technical Specifications of the Line-Side MQ1 Board
<-14 (I-16)
Receiver sensitivity (BER≤10-12)) dBm
<-21 (S-16)
Receiver Reflection dB <-27
>0 (PIN)
Overload power dBm
>-9 (APD)
Parameters of line-side optical receive port (Sn point)
3-48

Maximum
-20 dB 0.3
Spectral characteris- bandwidth
GHz
tics Maximum
-3 dB 35
bandwidth
Nominal 192.10 to 196.05 (C band)

central THz 191.30 to 196.075 (CE band)
frequency 186.95 to 190.90(L band)
Central frequency
Central ≤±12.5 (wavelength spacing: 100GHz)
frequency GHz ±5 (wavelength spacing: 50GHz)
offset ≤±2.5 (wavelength spacing: 25GHz)
Maximum +5
Minimum 0
Minimum side mode suppression

dB 10
ratio
Dispersion tolerance (including TDC) ps/nm 800
Eye diagram mask Comply with ITU-T G.959.1 Recommenda-

-
tion
• Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
• Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
3.9 Optical Mux/DeMux Subsystem Specifications

3.9.1 Fixed Add/Drop Multiplexer Unit Specifications
3.9.1.1 Specifications of the SOAD Board
Technical specifications of the SOAD1 board, the SOAD2 board and the SOAD4 board
are illustrated in Table 3-43, Table 3-44 and Table 3-45.
Table 3-43 Technical Specifications of the SOAD1 Board
192.10-196.05 (C band)
Central frequency range THz
191.30-196.075 (CE band)
Add/Drop channel - 1
-1 dB bandwidth (Drop) nm >0.2
3-49

-20 dB bandwidth (Drop) nm <1.20
Channel spacing GHz 100
IN-D1@ other channels dB >25
IN-MID1@ drop chan-

Isolation dB >14
nel
IN-OUT@ drop channel dB >28
Optical return loss dB >40
Drop wavelength (IN-

dB <3
D1)
Add wavelength (A1-

Insertion loss dB <3
OUT)
Pass-through wave-
dB <3
length (IN-OUT)
Polarization dependent loss (PDL) dB <0.2
Polarization mode dispersion (PMD) ps <0.1
Maximum allowed optical power mW <500
192.10-196.05 (C band)
191.30-196.075 (CE band)
IN-D1/D2@ adjacent chan-

dB >25
nels
IN-D1/D2@ nonadjacent
Isolation dB >35
channel
IN-MID1@ drop channel dB >14
IN-OUT@ drop channel dB >28
3-50

Drop wavelength (IN-D1/D2) dB <3
Add wavelength (A1/A2-OUT) dB <3

Insertion loss
Pass-through wavelength (IN-
dB <4
OUT)
192.10-196.05 (C band)
191.30-196.075 (CE band)
IN-D1/D2/D3/D4@adjacent chan-
dB >25
nels
IN-D1/D2/D3/D4@nonadjacent
Isolation dB >35
channel
IN-MID1@drop channel dB >14
IN-OUT@drop channel dB >28
Drop wavelength (IN-D1/D2/D3/D4) dB <4.0
Insertion Add wavelength (A1/A2/A3/A4-

dB <4.0
loss OUT)
Pass-through wavelength (IN-OUT) dB <5.0
Directional dB >60
3-51

3.9.2 Reconfigurable Add/Drop Multiplexer Unit Specifications

3.9.2.1 Specifications of the WBU Board
Technical specifications of the WBU board are illustrated in Table 3-46.
Table 3-46 Technical Specifications of the WBU Board
1529-1561 (C band)
Operating wavelength range nm
1529-1568 (CE band)
100
Channel spacing GHz
50
40/48 (channel spacing: 100 GHz)

Channel quantity -
80/96 (channel spacing: 50 GHz)
A1-OUT <2
Insertion loss of IN-D1 <4

dB
WBU/AD1 EXIN-OUT <14
IN-EXOUT <4
A1-OUT <12
A2-OUT <2
Insertion loss of IN-D1 <12

dB
WBU/AD2 IN-D2 <2
EXIN-OUT <18
IN-EXOUT 12
Attenuation adjustment range dB 0-15
< (0.5 or ±10% of the configured value,

Attenuation adjustment precision dB
select the larger one)
Blocking extinction ratio dB >35
Maximum total optical input power dBm ≤25
Maximum single-channel optical input

dBm ≤16
power
3.9.2.2 Specifications of the WSU Board

Technical specifications of the WSUD are illustrated in Table 3-47.
3-52

Table 3-47 Technical Specifications of the WSUD Board
Operating wavelength range nm 1529-1561 (C band)
100
Channel spacing GHz
50
40 (channel spacing: 100 GHz)

Channel quantity -
A1-OUT dB <2
IN-D1~D8 dB <6
WSUD /MA1
EXIN-OUT dB <9
IN-EXOUT dB <6
Inser-
tion A1-OUT dB <10
loss
A2-OUT dB <2
WSUD /MA2 IN-D1~D8 dB <6
EXIN-OUT dB <16
IN-EXOUT dB <6
WSUD/E dB 6

Maximum single-channel optical input power dBm ≤16
Technical specifications of WSUA are illustrated in Table 3-48.
Table 3-48 Technical Specifications of WSUA
100
Channel spacing GHz
50
3-53


Channel quantity -
IN-D1 dB <2
A1~A8-OUT dB <6
WSUA /MD1
EXIN-OUT dB <6
IN-EXOUT dB <9
Inser-
IN-D1 dB <2
tion
loss IN-D2 dB <10
WSUA /MD2 A1~A8-OUT dB <6
EXIN-OUT dB <6
IN-EXOUT dB <16
WSUA/E dB 6

Maximum single-channel optical input power dBm ≤16
3.9.2.3 Specifications of the WBM Board

Technical specifications of the WBM board are illustrated in Table 3-49.
Table 3-49 Technical Specifications of the WBM Board
Channel quantity - 40 (channel spacing: 100 GHz)
An-OUT (n=1-40) dB <8
Insertion loss IN-DROP dB <7
EXIN-OUT <13
dB
IN-EXOUT <3
3-54


3.9.2.4 Specifications of the PDU Board

Technical specifications of the PDU-4-x are listed in Table 3-50. Technical specifications
of the PDU-5-x are listed in Table 3-51. Technical specifications of the PDU-8-x are listed
in Table 3-52. Technical specifications of the PDU-9-x are listed in Table 3-53. Technical
specifications of the PDU-16-1 are listed in Table 3-54.
Table 3-50 Technical Specifications of the PDU-4-x Board
1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)
Insertion
INx→Ox-1/2/3/4 dB <8.0
loss
Table 3-51 Technical Specifications of PDU-5-x Board
1529-1561 (C band)
1570-1605 (L band)
Insertion INx→Ox-1/2/3/4 dB <12.0

loss INx→Dx dB <4.0
1529-1561 (C band)
1570-1605 (L band)
3-55

Insertion
INx→Ox-1/2/3/4/5/6/7/8 dB <11.0
loss
1529-1561 (C band)
1570-1605 (L band)
Insertion INx→Ox-1/2/3/4/5/6/7/8 dB <15.0

loss INx→Dx dB <4.0
1529-1561 (C band)
1570-1605 (L band)
Insertion IN→O-1/2/3/4/5/6/7
dB <14.0
loss /8/9/10/11/12 /13/14/15/16
3.9.3 Multiplex/Demultiplex Unit Specifications

3.9.3.1 Specifications of the OMU Board
Technical specifications of the OMU board are listed in Table 3-55.
3-56

Table 3-55 Technical Specifications of the OMU Board
Sp-
Spec- Spec-
eci-
ifica- ifica-
fica-
tions Specifications Specifications tions Specifications
tions
(8 - (32-Channel) (40-Channel) (48- (80-Channel)
Item Unit (16 -
Cha- Chan-
Cha-
nnel) nel)
nnel)
Cou- Cou- Cou- Cou- Cou-

AWG TFF AWG TFF AWG AWG
pler pler pler pler pler
Inser-
tion dB <11 <14 <17 <10 <10 <19 <10 <10 <10 <23 <10
loss
Maxi-
mum in-
sertion
loss dif-
ference dB <3 <3 <3 <3 <3 <3 <3 <3 <3 <3.5 <3
be-
tween
chan-
nels
Chan-
nel GHz - - - 100 100 - 100 100 100 - 50
spacing
Optical
return dB >40 >40 >40 >40 >40 >40 >40 >40 >40 >40 >40
loss
Oper- 1529 - 1529 1529 - 1529 - 1529 -

ating 1529 152 1561 -1561 1561 1561 1561
1529 - 1529 - 1529 - 1529 -
wave- nm - 156 9 -
1561 1570 - 1570 - 1561 1570 - 1570 - 1568 1561 1570 -
length 1 1561
1605 1605 1605 1605 1605
range
Polar-
ization
depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.5 <0.7 <0.5
dent
loss
(PDL)
3-57

Sp-
Spec- Spec-
eci-
ifica- ifica-
fica-
tions Specifications Specifications tions Specifications
tions
(8 - (32-Channel) (40-Channel) (48- (80-Channel)
Item Unit (16 -
Cha- Chan-
Cha-
nnel) nel)
nnel)
Cou- Cou- Cou- Cou- Cou-

pler pler pler pler pler
Polar-
ization
mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
disper-
sion
(PMD)
Tem-
per-
nm < <
ature - - - - - - - - -
/℃ 0.005 0.005
charac-
teristics
3.9.3.2 Specifications of the ODU Board

Technical specifications of the ODU board are listed in Table 3-56.
Table 3-56 Technical Specifications of the ODU Board
Specifi- Specifi-
Specifications Specifications cations cations
Item Unit (32-Channel) (40-Channel) (48-Chan- (80-Chan-
nel) nel)
Insertion loss dB <10 <10 <10 <10 <10 <10
Maximum inser-
tion loss difference dB <2 <2 <2 <2 <2 <2
between channels
Channel spacing GHz 100 100 100 100 100 50
Optical return loss dB >40 >40 >40 >40 >40 >40
Operating wave- 1529 - 1561 1529 - 1561 1529 - 1561 1529 - 1561 1529 - 1561
nm 1529 - 1568
length range
1570 - 1605 1570 - 1605 1570 - 1605 1570 - 1605 1570 - 1605
3-58

Specifi- Specifi-
Specifications Specifications cations cations
Item Unit (32-Channel) (40-Channel) (48-Chan- (80-Chan-
nel) nel)
Isolation of adja-
dB >25 >25 >25 >25 >25 >25
cent channel
Isolation of non-
dB >30 >30 >30 >30 >30 >30
adjacent channel
Polarization de-
pendent loss dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
(PDL)
Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion (PMD)
Temperature char-
nm/℃ - <0.005 - <0.005 - -
acteristics
-1 dB bandwidth nm >0.2 >0.2 >0.2 >0.2 >0.2 >0.2
3.9.3.3 Specifications of the ODUB Board

Technical specifications of the ODUB board are listed in Table 3-57.
Table 3-57 Technical Specifications of the ODUB Board
Item Unit Specifications (40-Channel)
Insertion loss dB <10
Maximum insertion loss difference between channels dB <2
1529 - 1561
1570 - 1605
Isolation of adjacent channel dB >25
Isolation of non-adjacent channel dB >30
Temperature characteristics nm/℃ -
-1 dB bandwidth nm >0.2
3-59

3.9.3.4 Specifications of the OCI Board

Technical specifications of the OCI board are illustrated in Table 3-58 and Table 3-59.
Table 3-58 Technical Specifications of the OCI Board (100GHz-50GHz)
Item Unit Specification Remarks
Operating wavelength
nm 1529-1561 -
range (C band)
nm 1529-1568 -
range (CE band)
nm 1570-1605 -
range (L band)
Input channel spacing GHz 100 Multiplexing procedure
Output channel spacing GHz 50 Multiplexing procedure
Insertion loss dB <2.5 -
Maximum insertion loss

dB <1 -
offset
Demultiplexing proce-
Isolation dB >25
dure
Optical return loss dB >40 -
Polarization dependent
dB <0.5 -
loss (PDL)
Polarization mode disper-

ps <0.5 -
sion (PMD)
Table 3-59 Technical Specifications of the OCI Board (50GHz-25GHz)
nm 1529-1568 -
range (CE band)
Input channel spacing GHz 50 Multiplexing procedure
Output channel spacing GHz 25 Multiplexing procedure
Insertion loss dB <3.2 -
Maximum insertion loss

dB <0.6 -
difference
Demultiplexing proce-
>21
Isolation dB dure
>16 Multiplexing procedure
Optical return loss dB >40 -
3-60

dB <0.5 -
loss (PDL)
Polarization mode disper-

ps <0.2 -
sion (PMD)
3.9.3.5 Specifications of the OBM Board

Technical specifications of the OBM board are illustrated in Table 3-60.
Table 3-60 Technical Specifications of the OBM Board
Operating wavelength range (C

nm 1529-1561
band)
Operating wavelength range (CE

nm 1529-1568
band)
Operating wavelength range (L

nm 1570-1605
band)
Insertion loss (C band) dB <1.5
Insertion loss (CE band) dB <1.5
Insertion loss (L band) dB <1.5
Isolation dB 15
Polarization mode dispersion

ps <0.5
(PMD)
3.9.3.6 Specifications of the VMUX Board

Technical specifications of the VMUX board are illustrated in Table 3-61.
Table 3-61 Technical Specifications of the VMUX Board
Channel quantity - 40/48
40-channel: 1529-1561/1570-1605
48-channel: 1529-1568
3-61

Insertion loss dB <8 (before adjustment)

ps 0.5
(PMD)
Polarization dependent loss (PDL) dB 0.8
Channel adjustment range dB 0-10
VOA adjustment precision dB 0.5
3.9.3.7 Specifications of the VMUXB Board

Technical specifications of the VMUXB board are illustrated in Table 3-62.
Table 3-62 Technical Specifications of the VMUXB Board
Channel quantity - 40
Operating wavelength range nm 40-channel: 1529-1561/1570-1605
Insertion loss dB <8 (before adjustment)

ps 0.5
(PMD)
Polarization dependent loss (PDL) dB 0.8
Channel adjustment range dB 0-10
VOA adjustment precision dB 0.5
3.9.3.8 Specifications of the SSDM Board

Technical specifications of the SSDMT board are illustrated in Table 3-63. And technical
specifications of the SSDMR board are illustrated in Table 3-64.
Table 3-63 Technical Specifications of the SSDMT Board
C band 1529-1561
Operating nm
CE band 1529-1568
wavelength range
nm C/CE band supervision channel 1500-1520
3-62

dB IN→OUT <1.5
Insertion loss
dB SIN→OUT <1.5
dB IN→OUT (@λSIN) >12

Isolation
dB SIN→OUT (@λIN) >20
Polarization
dependent loss dB <0.2
(PDL)
Input optical power mW <500
Table 3-64 Technical Specifications of the SSDMR Board
C band 1529-1561
Operating nm
CE band 1529-1568
wavelength range
nm C/CE band supervision channel 1500-1520
dB IN→OUT <1.5
Insertion loss
dB IN→SOUT <1.5
dB IN→OUT (@λSOUT) >12

Isolation
dB IN→SOUT (@λOUT) >40
Polarization
dependent loss dB <0.2
(PDL)
Input optical power mW <500
3.9.4 Group Mux/DeMux Unit Specifications

3.9.4.1 Specifications of the SOGMD Board
Technical specifications of the SOGMD board are illustrated in Table 3-65.
Table 3-65 Technical Specifications of the SOGMD Board
3-63

IN→RRO dB <2.5
IN→RBO dB <2.5
IN→BRO dB <2.5
IN→BBO dB <2.5
Insertion loss
RRI→OUT dB <2.5
RBI→OUT dB <2.5
BRI→OUT dB <2.5
BBI→OUT dB <2.5
Isolation dB >12
Reflectance dB <-40
Maximum optical power mW <500
3.10 Optical Amplification Subsystem Specifications

3.10.1 Specifications of the EOA Board
Short Description
To achieve smooth expansion of DWDM systems from 2.5 Gbit/s and 10 Gbit/s to 40 Gbit/s,
the EOA board in the ZXWM M920 are compatible with 2.5 Gbit/s, 10 Gbit/s and 40 Gbit/s
systems.
Enhanced Optical Booster Amplifier (EOBA)

l 40-channel EOBA board at C/L band
The specifications of 40-channel EOBA board at C/L band are listed in Table 3-66. The
specifications of 32-channel EOBA are same as those of 40-channel EOBA except the
single-channel optical power, which is 1 dB more than that of 40-channel EOBA.
Table 3-66 Technical Specifications of 40-channel EOBA Board (C/L-band)
Specification (40-Channel System)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24
1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561
Operating wave- (C band) (C band) (C band) (C band) (C band)
nm
length range 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605
(L band) (L band) (L band) (L band) (L band)
3-64


Item Unit
Total input power

dBm -32 to 3 -32 to 2 -32 to 1 -32 to 3 -32 to 3
range
Channel input power

dBm -32 to -13 -32 to -14 -32 to -15 -32 to -13 -32 to -13
range
Channel output
dBm -2 to 4 7 to 13 1 to 7 1 to 7 5 to 11
power range
Total output power

dBm -2 to 17 7 to 26 1 to 20 1 to 20 5 to 24
range
Maximum total out-

dBm 17 26 20 20 24
put power
Noise figure dB <6 <6 <6 <6 <6
Polarization depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5
dent loss
Pump leakage at in-

dBm <-30 <-30 <-30 <-30 <-30
put
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30
output
Input return loss dB >40 >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40 >40
Channel gain dB 17 27 22 20 24
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
input reflectance
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
output reflectance
Gain flatness dB ±1 ±1 ±1 ±1 ±1
Gain response time

while adding/reduc-
ms <10 <10 <10 <10 <10
ing channels (stable
status)
Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion
l 80-channel EOBA board at C/L band

The specifications of 80-channel EOBA board at C band are listed in Table 3-67.
3-65

Table 3-67 Technical Specifications of 80-channel EOBA Board (C-band)

Item Unit
1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561
Operating wave- (C band) (C band) (C band) (C band) (C band)
nm
length range 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605
(L band) (L band) (L band) (L band) (L band)
Total input power

dBm -32 to 3 -32 to 2 -32 to 1 -32 to 3 -32 to 3
range
Channel input power

dBm -32 to -16 -32 to -17 -32 to -18 -32 to -16 -32 to -16
range
Channel output
dBm -5 to 1 4 to 10 -2 to 4 -2 to 4 2 to 8
power range
Total output power

dBm -5 to 17 4 to 26 -2 to 20 -2 to 20 2 to 24
range
Maximum total out-

dBm 17 26 20 20 24
put power
Noise figure dB <6 <6 <6 <6 <6
Polarization depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5
dent loss
Pump leakage at in-

dBm <-30 <-30 <-30 <-30 <-30
put
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30
output
Input return loss dB >40 >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40 >40
Channel gain dB 17 27 22 20 24
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
input reflectance
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
output reflectance
Gain flatness dB ±1 ±1 ±1 ±1 ±1
Gain response time

while adding/reduc-
ms <10 <10 <10 <10 <10
ing channels (stable
status)
Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion
3-66

l 48-channel EOBA board at CE band

The specifications of 48-channel EOBA board at CE band are listed in Table 3-68.
Table 3-68 Technical Specifications of 48-channel EOBA Board (CE-band)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26
Operating wavelength 1529 to 1568 1529 to 1568 1529 to 1568 (CE 1529 to 1568 (CE
nm
range (CE band) (CE band) band) band)
Total input power range dBm -32 to 3 -32 to 1 -32 to 1 -32 to 1
Channel input power

dBm -32 to -13 -32 to -16 -32 to -16 -32 to -16
range
Channel output power

dBm -2 to 4 1 to 7 4 to 10 6 to 12
range
Total output power range dBm -2 to 17 1 to 21 4 to 24 6 to 26
Maximum total output

dBm 17 21 24 26
power
Noise figure dB <6 <6 <6 <6
dB <0.5 <0.5 <0.5 <0.5
loss
Pump leakage at input dBm <-30 <-30 <-30 <-30
Pump leakage at output dBm <-30 <-30 <-30 <-30
Input return loss dB >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40
Channel gain dB 17 23 26 28
Allowed maximum input

dB <-30 <-30 <-30 <-30
reflectance
Allowed maximum output

dB <-30 <-30 <-30 <-30
reflectance
Gain flatness dB ±1 ±1 ±1 ±1
Gain response time while

adding/reducing chan- ms <10 <10 <10 <10
nels (stable status)
Polarization mode dis-

ps <0.5 <0.5 <0.5 <0.5
persion
l 96-channel EOBA board at CE band

The specifications of 96-channel EOBA board at CE band are listed in Table 3-69.
3-67

Table 3-69 Technical Specifications of 96-channel EOBA Board (CE-band)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26
Operating wavelength 1529 to 1568 (CE 1529 to 1568 (CE 1529 to 1568 (CE 1529 to 1568 (CE
nm
range band) band) band) band)
Total input power range dBm -32 to 3 -32 to 1 -32 to 1 -32 to 1
Channel input power

dBm -32 to -16 -32 to -19 -32 to -19 -32 to -19
range

dBm -5 to 1 -2 to 1 1 to 7 3 to 9
range
Total output power

dBm -5 to 17 -2 to 21 1 to 24 3 to 26
range

dBm 17 21 24 26
power
Noise figure dB <6 <6 <6 <6
dB <0.5 <0.5 <0.5 <0.5
loss
Pump leakage at input dBm <-30 <-30 <-30 <-30
Pump leakage at output dBm <-30 <-30 <-30 <-30
Input return loss dB >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40
Channel gain dB 17 23 26 28

dB <-30 <-30 <-30 <-30
reflectance
Allowed maximum out-

dB <-30 <-30 <-30 <-30
put reflectance
Gain flatness dB ±1 ±1 ±1 ±1
Gain response time

while adding/reducing ms <10 <10 <10 <10
channels (stable status)
Polarization mode dis-

ps <0.5 <0.5 <0.5 <0.5
persion
Enhanced Optical Line Amplifier (EOLA)

The specifications of 40/80-channel EOLA board at C/L band are listed in Table 3-70. The
specifications of 32-channel EOLA are the same as those of 40-channel EOLA except
the single-channel optical power, which is 1 dB more than that of 40-channel EOLA. In
48/96-channel system, EOLA board is replaced by EONA board.
3-68

Table 3-70 Technical Specifications of 40/80-channel EOLA (C/L-band)
Specification (40-Channel System) Specification (80-Channel System)

Item Unit EOLA22 EOLA27 EOLA32 EOLA22 EOLA27 EOLA32
/20 /20 /20 /20 /20 /20
1529 to 1529 to 1529 to 1529 to 1529 to 1529 to

1561 (C 1561 (C 1561 (C 1561 (C 1561 (C 1561 (C
Operating band) band) band) band) band) band)
nm
wavelength range 1570 to 1570 to 1570 to 1570 to 1570 to 1570 to
1605 (L 1605 (L 1605 (L 1605 (L 1605 (L 1605 (L
band) band) band) band) band) band)
Total input power

dBm -35 to 1 -35 to -4 -35 to -9 -35 to 1 -35 to -4 -35 to -9
range
Channel input power

dBm -35 to -15 -35 to -20 -35 to -25 -35 to -18 -35 to -4 -35 to -28
range
Channel output
dBm 1 to 7 1 to 7 1 to 7 -2 to 4 -2 to 4 -2 to 4
power range
Total output power

dBm 1 to 20 1 to 20 1 to 20 -2 to 20 -2 to 20 -2 to 20
range
Maximum total
dBm 20 20 20 20 20 20
output power
Noise figure dB <6 <6 <6 <6 <6 <6
Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output
Input return loss dB >40 >40 >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40 >40 >40
Channel gain dB 22 27 32 22 27 32
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
input reflectance
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
output reflectance
Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1
3-69


Item Unit EOLA22 EOLA27 EOLA32 EOLA22 EOLA27 EOLA32
/20 /20 /20 /20 /20 /20
Gain response
time while
adding/reducing ms <10 <10 <10 <10 <10 <10
channels (stable
status)
Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion
Enhanced Optical Pre-Amplifier (EOPA)

l 40-channel EOPA board at C/L band
The specifications of 40-channel EOPA board at C/L band are listed in Table 3-71.
The specifications of 32-channel EOPA are the same as those of 40-channel EOPA
except the single-channel optical power, which is 1 dB more than that of 40-channel
EOPA.
Table 3-71 Technical Specifications of 40-channel EOPA (C/L-band)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17
1529 to 1561 (C 1529 to 1561 (C 1529 to 1561 (C

Operating wavelength band) band) band)
nm
range 1570 to 1605 (L 1570 to 1605 (L 1570 to 1605 (L
band) band) band)
Total input power range dBm -35 to 3 -35 to -2 -35 to -7
Channel input power range dBm -35 to -13 -35 to -18 -35 to -23

dBm -2 to 4 -2 to 4 -2 to 4
range
Total output power range dBm -2 to 17 -2 to 17 -2 to 17

dBm 17 17 17
power
Noise figure dB <5.5 <5.5 <5.5
dB <0.5 <0.5 <0.5
loss
Pump leakage at input dBm <-30 <-30 <-30
Pump leakage at output dBm <-30 <-30 <-30
Input return loss dB >40 >40 >40
Output return loss dB >40 >40 >40
3-70


Item Unit
Channel gain dB 17 22 27

dB <-30 <-30 <-30
reflectance

dB <-30 <-30 <-30
reflectance
Gain flatness dB ±1 ±1 ±1

adding/reducing channels ms <10 <10 <10
(stable status)
Polarization mode
ps <0.5 <0.5 <0.5
dispersion
l 80-channel EOPA board at C/L band

The specifications of 80-channel EOPA board at C/L band are listed in Table 3-72.
Table 3-72 Technical Specifications of 80-channel EOPA (C/L-band)

Item Unit
1529 to 1561 (C 1529 to 1561 (C 1529 to 1561 (C

Operating wavelength band) band) band)
nm
range 1570 to 1605 (L 1570 to 1605 (L 1570 to 1605 (L
band) band) band)
Channel input power

dBm -35 to -16 -35 to -21 -35 to -26
range

dBm -2 to 1 -5 to 1 -5 to 1
range

dBm 17 17 17
power
dB <0.5 <0.5 <0.5
loss
3-71


Item Unit

dB <-30 <-30 <-30
reflectance

dB <-30 <-30 <-30
reflectance

(stable status)
Polarization mode
ps <0.5 <0.5 <0.5
dispersion
l 48-channel EOPA board at CE band

The specifications of 48-channel EOPA board at CE band are listed in Table 3-73.
Table 3-73 Technical Specifications of 48-channel EOPA (CE-band)

Item Unit
Operating wavelength 1529 to 1568 1529 to 1568 1529 to 1568

nm
range (CE band) (CE band) (CE band)
Channel input power range dBm -35 to -13 -35 to -18 -35 to -23

dBm -2 to 4 -2 to 4 -2 to 4
range

dBm 17 17 17
power
dB <0.5 <0.5 <0.5
loss
3-72


Item Unit

dB <-30 <-30 <-30
reflectance

dB <-30 <-30 <-30
reflectance

(stable status)
Polarization mode
ps <0.5 <0.5 <0.5
dispersion
l 96-channel EOPA board at CE band

The specifications of 96-channel EOPA board at CE band are listed in Table 3-74.
Table 3-74 Technical Specifications of 96-channel EOPA (CE-band)

Item Unit
Operating wavelength 1529 to 1568 1529 to 1568 (CE 1529 to 1568

nm
range (CE band) band) (CE band)
Channel input power

dBm -35 to -16 -35 to -21 -35 to -26
range

dBm -5 to 1 -5 to 1 -5 to 1
range

dBm 17 17 17
power
dB <0.5 <0.5 <0.5
loss
3-73


Item Unit

dB <-30 <-30 <-30
reflectance

dB <-30 <-30 <-30
reflectance

(stable status)
Polarization mode
ps <0.5 <0.5 <0.5
dispersion
Enhance Optical Node Amplifier (EONA)

l 40/80-channel EONA board at C/L band
The specifications of 40/80-channel EONA board at C/L band are listed in Table 3-75.
The specifications of 32-channel EONA are the same as those of 40-channel EONA
except the single-channel optical power, which is 1 dB more than that of 40-channel
EONA.
Table 3-75 Technical Specifications of 40/80-channel EONA (C/L-band)

Item Unit EONA25 EONA33
EONA25/20 EONA33/20 EONA27/24 EONA27/24
/20 /20
1529 to 1529 to 1529 to 1529 to 1529 to

1529 to 1561
1561 (C 1561 (C 1561 (C 1561 (C 1561 (C
(C band)
Operating band) band) band) band) band)
nm
wavelength range 1570 to 1570 to 1570 to 1570 to 1570 to
1570 to 1605
1605 (L 1605 (L 1605 (L 1605 (L 1605 (L
(L band)
band) band) band) band) band)
Total input power

dBm -35 to -2 -35 to -10 -35 to 0 -35 to -2 -35 to -10 -35 to 0
range
Channel input
power range
Channel output
dBm 1 to 7 1 to 7 5 to 11 -2 to 4 -2 to 4 2 to 8
power range
3-74


Item Unit EONA25 EONA33
EONA25/20 EONA33/20 EONA27/24 EONA27/24
/20 /20
Total output
power range
Maximum total
dBm 20 20 24 20 20 24
output power
20 to 22:
8.0 28 to 30:
20 to 22: 8.0 22 to 24: 8.5 22 to 24: 8.5
28 to 30: 6.5 22 to 25: 6.5
Noise figure dB 22 to 25: 7.0 24 to 27: 7.5 24 to 27: 7.5
30 to 38: 6.0 7.0 30 to 38:
25 to 30: 6.5 27 to 32: 6.5 27 to 32: 6.5
25 to 30: 6.0
6.5
Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output
Channel gain dB 25 33 27 25 33 27
Allowed
maximum input dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance
Allowed
maximum output dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance
Gain response
time while
channels (stable
status)
Polarization
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
mode dispersion
l 48/96-channel EONA board at CE band
The specifications of 48/96-channel EONA board at CE band are listed in Table 3-76.
3-75

Table 3-76 Technical Specifications of 48/96-channel EONA (CE-band)

Item Unit EONA25 EONA33 EONA33 EONA27
EONA27/24 EONA25/21
/21 /21 /21 /24
1529 to 1529 to 1529 to 1529 to 1529 to 1529 to

Operating
nm 1568 (CE 1568 (CE 1568 (CE 1568 (CE 1568 (CE 1568 (CE
wavelength range
band) band) band) band) band) band)
Total input power

dBm -35 to -4 -35 to -12 -35 to 3 -35 to -4 -35 to -12 -35 to -3
range
Channel input
power range
Channel output
power range
Total output power

range
Maximum total
dBm 21 21 24 21 21 24
output power
Noise figure dB <6 <6 <6 <6 <6 <6
Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input
Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output
Channel gain dB 25 33 27 25 33 27
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
input reflectance
Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
output reflectance
Gain response
time while
channels (stable
status)
3-76


Item Unit EONA25 EONA33 EONA33 EONA27
EONA27/24 EONA25/21
/21 /21 /21 /24
Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion
3.10.2 Specifications of the DRA Board

The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 3-77.
Table 3-77 Technical Specification of the DRA_P Board
C band: 2-3
Pump wavelength and quantity nm/piece CE band: 2-3
L band: 2-3
Pump power mW 750
Total output power dBm ≥12
C/CE/L/C+L band gain (G.652) dB 10/10/10/10
C/CE/L/C+L band (LEAF) dB 12/12/12/12
C/CE/L/C+L band (TW RS) dB 13/13/13/13
C/CE/L/C+L band equated noise figure

dB 0/0/0/0
(G.652)

dB -1/-1/-1/-1
(LEAF)

dB -1.5/-1.5/-1.5/-1.5
(TW RS)
Polarization dependent gain dB <0.5
Temperature characteristics pm/°C <500
Practically, we adopt EDFA+RAMAN technologies, which is the combination of the EOA

board and the DRA_P board, to amply the optical signals. The specifications are listed in
Table 3-78.
3-77

Table 3-78 Technical Specifications of the Combination of the EOA Board and the
DRA_P Board
1529-1561 (C band)
1570-1605 (L band)
Total output power range dBm >20
Noise figure dB <3
Polarization dependent loss dB <0.5
Pump leakage at output dBm <-30
Input return loss dB >40
Output return loss dB >40
Allowed maximum input reflectance dB <-30
Allowed maximum output reflectance dB <-30
Gain flatness dB ±1
Gain response time while adding/re-

ms <10
ducing channels (stable status)
Polarization mode dispersion ps <0.5
The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 3-79.
Table 3-79 Technical Specification of the DRA_B Board
1529-1561 (C band)
Pump wavelength and quantity nm/piece 1529-1568 (CE band)
1570-1605 (L band)
Pump power mW 850
Total output power dBm ≥12
Band gain (G.652) dB 1-6
Noise figure dB <1
Polarization dependent loss dB <0.2
Input return loss dB >45
Output return loss dB >45
Gain flatness dB <4
3-78

Polarization mode dispersion ps <0.5
Insertion loss dB <1.5
3.10.3 Specifications of the LAC Board

Technical specifications of the LAC board are listed in Table 3-80.
Table 3-80 Technical Specifications of the LAC Board
1529-1561 (C band)
Application wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)
Input power detection range dBm -39 to +20
Output power detection range dBm -40 to +18
Optical power detection precision dB ≤±0.5
Attenuation adjustment precision dB ≤±0.5
Attenuation adjustment step length dB ≤±0.2
Attenuation adjustment range dB ≥20
Attenuation adjustment rate dB/s ≤10
3.11 Optical Cross-Connect Subsystem Specifications

3.11.1 Specifications of the DSAC Board
The technical specifications of the DSAC board are listed in Table 3-81.
Table 3-81 Technical Specifications of the DSAC Board
3-79

<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-20 (1000BASE-LH1)
Receiver sensitivity dBm <-22 (1000BASE-ZX)
<-25 (100-SM-LL-L)
<-20 (100-SM-LL-I)
<-13 (100-M5-SL-I)
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
>-3 (1000BASE-LH1)
Overload power dBm >-3 (1000BASE-ZX)
>-3 (100-SM-LL-L)
>-3 (100-SM-LL-I)
>-1.3 (100-M5-SL-I)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
Mean launched power dBm -2 to +3 (1000BASE-ZX)
-9 to -3 (100-SM-LL-L)
-12 to -3 (100-SM-LL-I)
-7.3 to +1.3 (100-M5-SL-I)
3.11.2 Specifications of the SAUC Board

The technical specifications of the SAUC board are listed in Table 3-82.
Table 3-82 Technical Specifications of the SAUC Board
Parameters of client-side optical receive port
Receiver sensitivity dBm <-18
Mean received power dBm >-3
Parameters of client-side optical transmit port
Mean launched power dBm -9.5 to -3
3-80

Wavelength range nm 1285 to 1340
3.11.3 Specifications of the SMUB Board

The technical specifications of the SMUBC board and the SMUBL board are respectively
listed in Table 3-83 and Table 3-84.
Table 3-83 Technical Specifications of the SMUBC Board
<-14 (I-64.1)
<-16 (S–64.2b)
>14 (I-64.1)
>27 (S–64.2b)
Receiver reflection dB
>14 (10GBASE-LR/LW)
>27 (10GBASE-ER/EW)
<0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength range of input signal nm 1280 to 1625
Mean launched power Maximum dBm -1

(long-distance optical
Minimum dBm -5
interface S-64.2a)

(long-distance optical
Minimum dBm -1
interface S-64.2b)

(short-distance optical
Minimum dBm -5
interface I-64.2r)

(short-distance optical
Minimum dBm -6
interface I-64.1)
Minimum extinction ratio dB 10/8.2
3-81

Comply with ITU-T G.691

Eye diagram -
Recommendation
Table 3-84 Technical Specifications of the SMUBL Board
<-14 (PIN)
<-21 (APD)
Receiver reflection dB >27
>0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength range of input signal nm 1280 to 1565
Maximum -20 dB
nm 0.3
Spectral bandwidth
characteristic Minimum side mode
dB 35
suppression ratio
Nominal central 192.10 to 196.05 (C band)

THz
frequency 191.30 to 196.05 (CE band)
Central
frequency ≤±12.5 (channel spacing: 100 GHz)
Central frequency offset GHz
≤±5 (channel spacing: 50 GHz)
Mean launched power dBm -5 to -1
Comply with ITU-T G.691 Recommenda-

Eye diagram -
tion
3.12 Optical Layer Management Subsystem

Specifications
3.12.1 Specifications of the OPM Board
Technical specifications of the OPM board at 25GHz, 50GHz and 100GHz are listed in
Table 3-85, Table 3-86 and Table 3-87.
3-82

Table 3-85 Technical Specifications of the OPM Board (25 GHz)
Application wavelength
nm 1528-1568 (CE band)
range
Wavelength resolution nm 0.02
Wavelength detection
nm ±0.1
precision
Input power range dBm -40 to -10
Power resolution dBm 0.05
Power detection preci-

dBm ±0.5
sion
OSNR range dB ≤25
OSNR detection preci-

dB ±1.5
sion
Input optical return loss dB 30
Detection signal time s ≤1
Application wavelength 1529-1561 (C band)

nm
range 1570-1605 (L band)
nm ±0.05
precision

dBm ±0.5
sion
OSNR range dB ≤25

dB ±1.5
sion
Application wavelength 1529-1561 (C band)

nm
range 1570-1605 (L band)
3-83

nm ±0.1
precision

dBm ±0.5
sion
OSNR range dB ≤25

dB ±1.5
sion
3.12.2 Specifications of the OWM Board

The technical specifications of the OWM board are listed in Table 3-88.
Table 3-88 Technical Specifications of the OWM Board
1529-1561 (C band)
Wavelength detection range nm 1529-1568 (CE band)
1570-1605 (L band)
Input optical power dBm -45 to -15
Capture range of wavelength

GHz -5 to +5
offset
Alarm range of wavelength off-

GHz >±5
set
3.12.3 Specifications of the DCU Board

The technical specifications of the DCU board are listed in Table 3-89.
Table 3-89 Technical Specifications of the DCU Board
Item Unit Parameter
Dispersion adjustment range ps/nm

+/-700
Optical input power dBm 1~-12
3-84

3.12.4 Specifications of the EOWM Board

The technical specifications of the EOWM board are listed in Table 3-90.
Table 3-90 Technical Specifications of the EOWM Board
1529 to 1561 (C band)
Wavelength detection range nm 1529 to 1568 (CE band)
1570 to 1605 (L band)
Optical input power dBm -45 to -15
Wavelength offset capture

GHz -5 to +5
range
Wavelength offset alarm range GHz >±5
3.12.5 Specifications of the EOPM Board

The technical specifications of the EOPM board at 50 GHz and 100 GHz are respectively
listed in Table 3-91 and Table 3-92.
Table 3-91 Technical Specifications of the EOPM Board (50 GHz)
1529 to 1561 (C band)

Wavelength range
nm 1570 to 1605 (L band)
(band)
1529 to 1568 (CE band)
nm
range ±0.05

sion dBm ±0.5
OSNR range dB ≤25

sion dB ±1.5
Input return loss dB 30
Signal detection time s ≤1
3-85

Table 3-92 Technical Specifications of the EOPM Board (100 GHz)
1529 to 1561 (C band)

Wavelength range
nm 1570 to 1605 (L band)
(band)
1529 to 1568 (CE band)
nm
range ±0.1

sion dBm ±0.5
OSNR range dB ≤25

sion dB ±1.5
Input return loss dB 30
Signal detection time s ≤1
3.13 Protection Subsystem Specifications

3.13.1 Specifications of the SOP Board
The specifications of the SOP board are listed in Table 3-93.
Table 3-93 Technical Specifications of the SOP Board
1280-1625
Operating Wavelength Range nm
1510-1625 1280-1510
T1_I->T1_O1 dB <4.4 <5.0
T2_I->T2_O1 dB <4.4 <5.0
T1_I->T1_O2 dB <4.4 <5.0
T2_I->T2_O2 dB <4.4 <5.0

Insertion Loss
R1_I1-> R1_O dB <2.1 <2.7
R2_I1-> R2_O dB <2.1 <2.7
R1_I2-> R1_O dB <2.1 <2.7
R2_I2-> R2_O dB <2.1 <2.7
Optical Return Loss dB >40
3-86

Polarization Dependent Loss dB <0.2
Optical Input Power mW <200
Switching Time ms 50
3.13.2 Specifications of the SOPCS Board

The technical specifications of the SOPCS board are listed in Table 3-94.
Table 3-94 Technical Specifications of the SOPCS Board
Operating
nm 1280-1625 - -
Wavelength Range
nm - 1510-1625 1280-1510
dB API → BPO <2.1 <2.7
dB API→BOUT <2.7 <3.3
dB AWI→AOUT <2.1 <2.7
dB AIN → AWO <4.4 <5.0
Insertion Loss dB AIN→BPO <5.1 <5.7
dB BIN→ BWO <4.4 <5.0
dB BIN→APO <5.1 <5.7
dB BWI→BOUT <2.1 <2.7
dB BPI→AOUT <2.7 <3.3
dB BPI→APO <2.1 <2.7
Optical Return Loss dB >40 - -
Polarization
dB <0.3 - -
Dependent Loss
Optical Input Power mW <200 - -
Switching Time ms <50 - -
3.13.3 Specifications of the SOPMS Board

The technical specifications of the SOPMS board are listed in Table 3-95.
3-87

Table 3-95 Technical Specifications of the SOPMS Board
Operating
Wavelength nm 1510-1610 -
Range
dB API→BPO <3.2
dB AWI→AOUT <1.7
dB BWI→BOUT <1.7
dB BPI→APO <3.2
dB AIN→AWO <1.7
dB BIN→BWO <1.7
dB API→AWO <3.2
Insertion Loss
dB AWI→APO <3.2
dB AIN→BPO <1.7
dB BPI→AOUT <1.7
dB BWI→BPO <3.2
dB BPI→BWO <3.2
dB BIN→APO <1.7
dB API→BOUT <1.7
Optical return
dB >40 -
Loss
Polarization
dB <0.3 -
Dependent Loss
Optical Input
mW <200 -
Power
Switching Time ms <50 -
3.14 Supervision Subsystem Specifications

3.14.1 Specifications of the SOSC Board
The SOSC board supports 100 M optical supervision channel. The technical specifications
of the SOSC board are listed in Table 3-96.
3-88

Table 3-96 Technical Specifications of the SOSC Board
Optical signal type - 100BASE-FX
Operating wavelength nm 1510±10
Signal code - 4B/5B
Supervision rate Mbit/s 100
Signal transmission
dBm -5 to 0 -1 to 6 ≥+4
power
Minimum receiving
dBm -34 -35 -43
sensitivity
3.15 RPOA Subsystem Specifications

3.15.1 Applicable Transmission Codes
RPOA subsystem is designed for ultra-long transmission. It only supports the transmission
over a single span because the Signal-to-Noise Ratio (SNR) of the system decreases
greatly if the fiber is too long.
Since the amplification range of EDF does not include 1510 nm wavelength, the
supervisory information can not be transmitted over a long distance. Therefore, the
RPOA subsystem needs a wavelength originally used for service transmission to transfer
the supervision signal.
Table 3-97 describes the transmission codes supported by RPOA subsystem over single
span. Notice that the system capacity listed in the table already includes a supervisory
channel.
Table 3-97 Transmission Codes Supported by RPOA Subsystem (over single span)
Single-Span Line Attenuation Maximum System Capacity

Fiber Type
dB Gbit/s
≤73 4×2.5
≤72 8×2.5
≤69 16×2.5
≤63 40×2.5
G.652 fiber
≤67 4×10
≤67 8×10
≤67 16×10
≤63 40×10
3-89

Single-Span Line Attenuation Maximum System Capacity

Fiber Type
dB Gbit/s
≤68.5 4×2.5
≤67 8×2.5
≤64 16×2.5
≤63 40×2.5
G.655 fiber
≤66 4×10
≤66 8×10
≤66 16×10
≤63 40×10
3.15.2 Specifications of the RPOA Subsystem

The optical specifications of the RPOA subsystem are listed in Table 3-98.
Table 3-98 Optical Specifications of the RPOA Subsystem
Item Unit RPOA Subsystem with GFF RPOA Subsystem without GFF
Amplification range nm 1529-1561 1546-1561
Noise figure dB <7 (within amplification range) <7 (within amplification range)
Gain dB >17 >17
Gain flatness dB <2 <2
Optical received
dBm -44 to -18 -44 to -18
power
Optical launched
dBm -30 to +2 -34 to 8
power
Working tempera-
°C -40 to 65 (RGU), -10 to 60 (RPU) -40 to 65 (RGU), -10 to 60 (RPU)
ture range
Storage tempera-
°C -40 to 85 -40 to 85
ture range
• The RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below
16 wavelengths, while the RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wa
velengths.
3.16 Specifications of APO Function

Technical specifications of Automatic Power Optimization (APO) function at OMS illustrate
in Table 3-99. Technical specifications of Automatic Power Optimization (APO) function at
3-90

OCH (power mode) illustrate in Table 3-100. Technical specifications of Automatic Power
Optimization (APO) function at OCH (OSNR mode) illustrate in Table 3-101.
Table 3-99 Technical Specifications of APO Function at OMS
Item Unit Specification Remark
It is the default value in

the automatic mode without
Sub-OTS section gain manual intervention. In the
dB 2–3
attenuation semi-automatic mode with
manual intervention, there is no
specification restriction.

the automatic mode without
System allowed OMS section gain manual intervention. In the
dB 3–4
optimization range attenuation semi-automatic mode with
manual intervention, there is no

Difference between the the automatic mode without
optical power of initial manual intervention. In the
dB 2–3
OA and terminal OA in semi-automatic mode with
OMS section (ΔP) manual intervention, there is no
dB LAC attenuation 2–20 -

Allowed
dB OA gain adjustment -2 – +2 -
optimization
dB EONA gain adjustment -5 – +5 -
adjustment range
dB DRA gain 6–12 -
Depends on the adjustment

of system performer
(LAC/OA/EONA/DRA). If
Sub-OTS section gain
dB -1 – +1 the performer adjustment
attenuation
compensates the system
degrade, it meets the
Optimization specifications.
accuracy Depends on the adjustment
of system performer
OMS section gain
attenuation
specifications.
3-91

Depends on the adjustment

of system performer
Difference between the
optical power of initial
OA and terminal OA in
OMS section (ΔP)
specifications.
• OA board mentioned in the above table includes EOPA, EOBA. EOLA, OPA, OBA and OLA.
Table 3-100 Technical Specifications of APO Function at OCH (optical power mode)
System allowed
Optical power deviation >+1.5 or
optimization dB Default
of wavelength channel <-1.5
range
Allowed dB VMUX attenuation 0–10 -

optimization WSU/WBM/WBU
dB 0–15 -
adjustment range attenuation
Default. Depends on the

adjustment of system performer
(VMUX/WSU/WBM /WBU).
Optimization Optical power deviation
dB -1 – +1 If the performer adjustment
accuracy of wavelength channel
specifications.
Table 3-101 Technical Specifications of APO Function at OCH (OSNR mode)
System allowed
OSNR of wavelength 14–18 or
optimization dB Default
channel 21–25
range
VMUX/VMUXB
Allowed dB 0–10 -
attenuation
optimization
WSU/WBM/WBU
adjustment range dB 0–15
attenuation -
3-92

Default. Depends on the

adjustment of system performer
(VMUX/VMUXB/WSU/WBM
Optimization OSNR of wavelength
dB 19–20 /WBU). If the performer
accuracy channel
adjustment compensates the
system degrade, it meets the
specifications.
3.17 Specifications of the IWF Function

Technical specifications of the IWF function are illustrated in Table 3-102.
Table 3-102 Technical Specifications of the IWF Function
1529-1561 (C band)
Operating
nm 1529-1568 (CE band)
wavelength rage
1570-1605 (L band)
Input optical
power range of dBm -45 to -15
single-wavelength
Detection range of
GHz -10 to +10
wavelength offset
Control accuracy of
GHz ±5
wavelength offset
3-93

This page intentionally left blank.
3-94

Chapter 4
C-Band DWDM System over
G.653 Fiber
Table of Contents
Overview ....................................................................................................................4-1
Wavelength Allocation ................................................................................................4-1
Configuration Principles..............................................................................................4-3
Transmission Codes...................................................................................................4-3
Typical Configurations ................................................................................................4-4
4.1 Overview
G.653 fiber is a kind of small dispersion coefficient fiber with its zero-dispersion point
locating in C band. In a DWDM system over G.653 fiber, Four Wave Mixing (FWM) effect
appears because large numbers of wavelengths are used in the system. The FWM effect
causes the reduction of optical power and the increment of crosstalk, influencing the
transmission performance of the whole system as a result. In order to ease the impact of
FWM effect on the system transmission performance, two methods are generally used:
using fewer channels and reducing optical power launched into fibers.
l At present, C-band DWDM system over G.653 fiber consisting of ZXWM M920
supports the use of 16 wavelengths and 40 wavelengths.
l The maximum transmission capacity of a C-band system over G.653 fiber is 640G/1.6
Tbit/s. In addition, convergence boards provided by ZXWM M920, such as MQT3,
SRM41 and SRM42, can be used to support the access of more than 16/40 channels
of service signals.
Taking SRM41 for example, 40–channel system supports the access of up to 160
channels of 10 Gbit/s service signals.
4.2 Wavelength Allocation

Table 4-1 lists the wavelengths used in a ZXWM M920 C-band 16-channel DWDM
system over G.653 fiber. Table 4-2 lists the wavelengths used in a ZXWM M920 C-band
40-channel DWDM system over G.653 fiber.
4-1

Table 4-1 Wavelength Allocation in C-Band 16-Channel System Over G.653 Fiber
Central Central Wavelength

No. Wavelength (nm) No.
Frequency (THz) Frequency (THz) (nm)
1 192.10 1560.61 9 194.85 1538.58
2 192.20 1559.79 10 195.00 1537.40
3 192.45 1557.77 11 195.30 1535.04
4 192.75 1555.34 12 195.45 1533.86
5 192.95 1553.73 13 195.70 1531.90
6 193.95 1545.72 14 195.90 1530.33
7 194.00 1545.32 15 196.00 1529.55
8 194.40 1542.14 16 196.05 1529.16
Table 4-2 Wavelength Allocation in C-Band 40-Channel System Over G.653 Fiber
Central Central
Wavelength Wavelength
No. Frequency No. Frequency
(nm) (nm)
(THz) (THz)
1 192.10 1560.61 21 194.70 1539.77
2 192.15 1560.20 22 194.85 1538.58
3 192.25 1559.39 23 194.90 1538.19
4 192.30 1558.98 24 195.00 1537.40
5 192.40 1558.17 25 195.05 1537.00
6 192.50 1557.36 26 195.15 1536.22
7 192.60 1556.55 27 195.20 1535.82
8 192.70 1555.75 28 195.30 1535.04
9 192.75 1555.34 29 195.35 1534.64
10 192.90 1554.13 30 195.40 1534.25
11 193.10 1552.52 31 195.50 1533.47
12 193.75 1547.32 32 195.55 1533.07
13 193.85 1546.52 33 195.60 1532.68
14 194.05 1544.92 34 195.70 1531.90
15 194.20 1543.73 35 195.75 1531.51
16 194.30 1542.94 36 195.80 1531.12
17 194.35 1542.54 37 195.90 1530.33
18 194.45 1541.75 38 195.95 1529.94
4-2

Chapter 4 C-Band DWDM System over G.653 Fiber
Central Central
Wavelength Wavelength
No. Frequency No. Frequency
(nm) (nm)
(THz) (THz)
19 194.55 1540.95 39 196.00 1529.55
20 194.65 1540.16 40 196.05 1529.16
4.3 Configuration Principles

The basic configuration principles of a C-band 16/40-channel DWDM system over G.653
fiber ZXWM M920 are as follows:
l ZXWM M920 only supports the application of G.653 fiber in DWDM systems with 16/40
C-band wavelengths.
l The services that can be accessed to the system include: STM-1, STM-4, STM-16,
STM-64, GE, 10GE, STM-256, OUT2, OTU3 and other data services.
l The system supports the access of 40 channels of STM-64 or 10GE service signals,
320 channels of GE service signals or 160 channels of STM-16 service signals. The
maximum system capacity is up to 1.6 Tbit/s.
l The type and quantity of EOA board used at the transmitting end of an ultra-long
span depend on the attenuation over the span and the Optical Signal-to-Noise
Ratio (OSNR) tolerance of service signals. If the application of EOA boards can not
satisfy the OSNR requirement, use the Remotely Pumped Optical Amplifier (RPOA)
technology instead.
l For a system over which both 10 Gbit/s and 2.5 Gbit/s service signals are transmitted
or a system that needs to be upgraded to a 10 Gbit/s system in the future, regard it
as a 10 Gbit/s system during the design, and regard it as a 40 Gbit/s system for mix
transmission of 40G service.
l If a C-band 16/40-channel DWDM system uses DRA board, OPM boards must be
configured at OTM site at the receiving end to monitor the optical power of signals
and OSNR, and implement the Automatic Power Reduction (APR) function.
l Dispersion compensation module is needed in a 40Gbit/s or 10 Gbit/s system.
4.4 Transmission Codes

The ZXWM M920 C-band 16/40-channel DWDM system over G.653 fiber supports the
transmission of signals at the single-channel rate of 2.5 Gbit/s, 10 Gbit/s or 10GE.
For the system with the single-channel rate at 10 Gbit/s, the maximum transmission
capacity is 400 Gbit/s.
For the system with the single-channel rate at 2.5 Gbit/s, the maximum transmission
capacity is 100 Gbit/s.
For the system with the single-channel rate at 10GE, the maximum transmission capacity
is about 400 Gbit/s.
4-3

Note
STM-1, STM-4, GE and other data service signals can be multiplexed into signals with the
single-channel rate at 2.5 Gbit/s for transmission.
This guide only gives the transmission codes of C-band 16-channel and 40-channel DWDM
systems over G.653 fiber with the single-channel rate at 2.5 Gbit/s and 10 Gbit/s, as listed
in Table 4-3 and Table 4-4 respectively.
Table 4-3 Transmission Codes of C-Band 16-Channel DWDM System over G.653 Fiber
System Type Transmission Code Transmission Distance (km)
1×48 dB 1×174 km
2.5 Gbit/s system with FEC func- 3×34 dB 3×123 km (369 km)
tion 6×26 dB 6×94 km (564 km)
10×22 dB 10×80 km (800 km)
1×48 dB 1×174 km
10 Gbit/s system with AFEC 3×34 dB 3×123 km (369 km)

function and ERZ 6×26 dB 6×94 km (564 km)
10×22 dB 10×80 km (800 km)
Table 4-4 Transmission Codes of C-Band 40-Channel DWDM System over G.653 Fiber
System Type Transmission Code Transmission Distance (km)
2.5 Gbit/s system with FEC func- 1×35dB 1×127 km

tion and DRA 3×26 dB 3×94 km (282 km)
10 Gbit/s system with AFEC 1×35 dB 1×127 km

function, ERZ and DRA board 3×26 dB 3×94 km (282 km)
• The data listed in the above table is based on the assumption that the attenuation coefficient of fibers
is 0.275 dB/km.
4.5 Typical Configurations

4.5.1 Configuration of 2.5 Gbit/s System
Take 1×48 dB system configured with DRA board and 3×34 dB system as example. Figure
4-1 illustrate the board configuration of a C-band 2.5 Gbit/s 16-channel system (1×48
dB) in one direction. Figure 4-2 illustrates the board configuration of a C-band 2.5 Gbit/s
16-channel system (3×34 dB) in one direction.
4-4

Chapter 4 C-Band DWDM System over G.653 Fiber
Figure 4-1 C-Band 2.5 Gbit/s System over G.653 Fiber (1×48 dB with DRA board,
unidirectional 16–channel)
unidirectional 16–channel)
4.5.2 Configuration of 10 Gbit/s System

Take 1×48 dB 10 Gbit/s system configured with DRA board and 3×34 dB 10 Gbit/s system
for example. Figure 4-3 illustrates the board configuration of a C-band 40 Gbit/s and 10
Gbit/s 16-channel system (1×48 dB) in one direction. Figure 4-4 illustrates the board
configuration of a C-band 40 Gbit/s and 10 Gbit/s 16-channel system (3×34 dB) in one
direction.
Figure 4-3 C-Band 40 Gbit/s and 10 Gbit/s System over G.653 Fiber (1×48 dB with
DRA board, unidirectional 16–channel)
DRA board, unidirectional 16–channel)
4-5

4-6

Figures
Figure 1-1 RPOA Unidirectional Pump Application through the Same Fiber .............. 1-3
Figure 1-2 RPOA Unidirectional Pump Application through the Same Fiber (with
DRA board) ........................................................................................... 1-4
Figure 1-3 RPOA Unidirectional Pump Application through Different Fiber................ 1-4
Figure 1-4 RPOA Bidirectional Pump Application through Two Fiber......................... 1-5
Figure 2-1 Structure of Subrack Backplane............................................................... 2-1
Figure 3-1 Jitter Transfer Characteristics of Line-side Optical Port .......................... 3-28
unidirectional 16–channel) ..................................................................... 4-5
unidirectional 16–channel) .................................................................... 4-5
DRA board, unidirectional 16–channel).................................................. 4-5
DRA board, unidirectional 16–channel).................................................. 4-5
I
Figures

Tables
Table 2-1 Description of Subrack No. ........................................................................ 2-1
Table 3-1 Dimensions and Weights of Structural Parts of ZXWM M920..................... 3-1
Table 3-2 ZXWM M920 Board Weight ....................................................................... 3-2
Table 3-3 Power Consumption of ZXWM M920......................................................... 3-5
Table 3-4 Requirements for Climate (Storage Environment).................................... 3-10
Table 3-5 Concentration of Mechanical Activity Material (Storage
Environment) ....................................................................................... 3-11
Table 3-6 Concentration of Chemical Activity Material (Storage Environment) ........... 3-12
Table 3-7 Requirements for Climate ........................................................................ 3-12
Table 3-8 Concentration of Mechanical Activity Material.......................................... 3-13
Table 3-9 Concentration of Chemical Activity Material ............................................. 3-13
Table 3-10 Climate Requirements ........................................................................... 3-13
Table 3-11 Requirements for Climate ...................................................................... 3-14
Table 3-12 Concentration of Mechanical Activity Material........................................ 3-14
Table 3-13 Concentration of Chemical Activity Material ........................................... 3-14
Table 3-14 Typical Power Supply Lighting Protection Classification......................... 3-15
Table 3-15 ZXWM M920 Port Lighting Requirements .............................................. 3-15
Table 3-16 Electro-Magnetic Susceptibility Specifications ....................................... 3-16
Table 3-17 Wavelength Allocation (8/16/32/40-channel, C band)............................. 3-16
Table 3-18 Wavelength Allocation (48/96-channel,C band) ..................................... 3-17
Table 3-19 Wavelength Allocation (80-channel, C band) ......................................... 3-19
Table 3-20 Wavelength Allocation (80-channel, L band) .......................................... 3-21
Table 3-21 Wavelength Allocation (192-channel, C band) ....................................... 3-22
Table 3-22 Technical Specifications of the Client-Side 2.5G Board.......................... 3-26
Table 3-23 Technical Specifications of the 2.5G Board at Wavelength Division
Side..................................................................................................... 3-26
Table 3-24 Jitter Generation Specifications ............................................................. 3-27
Table 3-25 Jitter Transfer Characteristics of 3R Line-Side Optical Port That Carries
SDH Signal.......................................................................................... 3-28
Table 3-26 Technical Specifications of the Client-Side 10G Board (with FEC) ........... 3-29
Table 3-27 Technical Specifications of the 10G Board at Wavelength Division Side
(with FEC) ........................................................................................... 3-30
Table 3-28 Jitter Generation Specifications ............................................................. 3-31
III
Table 3-29 Technical Specifications of the Client-Side 40G Board .......................... 3-31
Table 3-30 Technical Specifications of the 40G Board at Line-Side ......................... 3-32
Table 3-31 Technical Specifications of the SRM41 Board........................................ 3-33
Table 3-32 Technical Specifications of the SRM42 Board........................................ 3-34
Table 3-33 Technical Specifications of the DSA Board ............................................ 3-36
Table 3-34 Technical Specifications of the DSAF Board .......................................... 3-38
Table 3-35 Technical Specifications of the GEM2 Board.......................................... 3-40
Table 3-36 Technical Specifications of the GEM8 Board.......................................... 3-41
Table 3-37 Technical Specifications of the GEMF Board ......................................... 3-42
Table 3-38 Technical Specifications of the FCA Board ............................................ 3-44
Table 3-39 Technical Specifications of the Client-Side MQT3 Board ....................... 3-45
Table 3-40 Technical Specifications of the Line-Side MQT3 Board ......................... 3-46
Table 3-41 Technical Specifications of the Client-Side MQ1 Board.......................... 3-47
Table 3-42 Technical Specifications of the Line-Side MQ1 Board ............................ 3-48
Table 3-43 Technical Specifications of the SOAD1 Board........................................ 3-49
Table 3-46 Technical Specifications of the WBU Board ........................................... 3-52
Table 3-47 Technical Specifications of the WSUD Board......................................... 3-53
Table 3-48 Technical Specifications of WSUA ........................................................ 3-53
Table 3-49 Technical Specifications of the WBM Board ........................................... 3-54
Table 3-50 Technical Specifications of the PDU-4-x Board ...................................... 3-55
Table 3-51 Technical Specifications of PDU-5-x Board ............................................ 3-55
Table 3-54 Technical Specifications of the PDU-16-x Board .................................... 3-56
Table 3-55 Technical Specifications of the OMU Board ........................................... 3-57
Table 3-56 Technical Specifications of the ODU Board ........................................... 3-58
Table 3-57 Technical Specifications of the ODUB Board ........................................ 3-59
Table 3-58 Technical Specifications of the OCI Board (100GHz-50GHz) ................. 3-60
Table 3-59 Technical Specifications of the OCI Board (50GHz-25GHz) .................. 3-60
Table 3-60 Technical Specifications of the OBM Board............................................ 3-61
Table 3-61 Technical Specifications of the VMUX Board ......................................... 3-61
Table 3-62 Technical Specifications of the VMUXB Board ....................................... 3-62
Table 3-63 Technical Specifications of the SSDMT Board ...................................... 3-62
IV
Tables
Table 3-64 Technical Specifications of the SSDMR Board....................................... 3-63

Table 3-65 Technical Specifications of the SOGMD Board ...................................... 3-63
Table 3-66 Technical Specifications of 40-channel EOBA Board (C/L-band)............ 3-64
Table 3-67 Technical Specifications of 80-channel EOBA Board (C-band)............... 3-66
Table 3-68 Technical Specifications of 48-channel EOBA Board (CE-band) ............ 3-67
Table 3-69 Technical Specifications of 96-channel EOBA Board (CE-band) ............ 3-68
Table 3-70 Technical Specifications of 40/80-channel EOLA (C/L-band) ................. 3-69
Table 3-71 Technical Specifications of 40-channel EOPA (C/L-band) ...................... 3-70
Table 3-72 Technical Specifications of 80-channel EOPA (C/L-band) ...................... 3-71
Table 3-73 Technical Specifications of 48-channel EOPA (CE-band)....................... 3-72
Table 3-74 Technical Specifications of 96-channel EOPA (CE-band)....................... 3-73
Table 3-75 Technical Specifications of 40/80-channel EONA (C/L-band) ................ 3-74
Table 3-76 Technical Specifications of 48/96-channel EONA (CE-band) ................. 3-76
Table 3-77 Technical Specification of the DRA_P Board.......................................... 3-77
Table 3-78 Technical Specifications of the Combination of the EOA Board and the
DRA_P Board...................................................................................... 3-78
Table 3-79 Technical Specification of the DRA_B Board.......................................... 3-78
Table 3-80 Technical Specifications of the LAC Board............................................. 3-79
Table 3-81 Technical Specifications of the DSAC Board.......................................... 3-79
Table 3-82 Technical Specifications of the SAUC Board.......................................... 3-80
Table 3-83 Technical Specifications of the SMUBC Board....................................... 3-81
Table 3-84 Technical Specifications of the SMUBL Board ....................................... 3-82
Table 3-85 Technical Specifications of the OPM Board (25 GHz) ............................ 3-83
Table 3-86 Technical Specifications of the OPM Board (50 GHz) ........................... 3-83
Table 3-87 Technical Specifications of the OPM Board (100 GHz) ......................... 3-83
Table 3-88 Technical Specifications of the OWM Board........................................... 3-84
Table 3-89 Technical Specifications of the DCU Board ............................................ 3-84
Table 3-90 Technical Specifications of the EOWM Board ........................................ 3-85
Table 3-91 Technical Specifications of the EOPM Board (50 GHz) ......................... 3-85
Table 3-92 Technical Specifications of the EOPM Board (100 GHz) ....................... 3-86
Table 3-93 Technical Specifications of the SOP Board ............................................ 3-86
Table 3-94 Technical Specifications of the SOPCS Board ....................................... 3-87
Table 3-95 Technical Specifications of the SOPMS Board....................................... 3-88
Table 3-96 Technical Specifications of the SOSC Board.......................................... 3-89
Table 3-97 Transmission Codes Supported by RPOA Subsystem (over single
span) ................................................................................................... 3-89
V
Table 3-98 Optical Specifications of the RPOA Subsystem ..................................... 3-90

Table 3-99 Technical Specifications of APO Function at OMS ................................ 3-91
Table 3-100 Technical Specifications of APO Function at OCH (optical power
mode) .................................................................................................. 3-92
Table 3-101 Technical Specifications of APO Function at OCH (OSNR mode) ........... 3-92
Table 3-102 Technical Specifications of the IWF Function ....................................... 3-93
Table 4-1 Wavelength Allocation in C-Band 16-Channel System Over G.653
Fiber...................................................................................................... 4-2
Table 4-2 Wavelength Allocation in C-Band 40-Channel System Over G.653
Fiber...................................................................................................... 4-2
Table 4-3 Transmission Codes of C-Band 16-Channel DWDM System over G.653
Fiber...................................................................................................... 4-4
Table 4-4 Transmission Codes of C-Band 40-Channel DWDM System over G.653
Fiber...................................................................................................... 4-4
VI
Glossary
AFEC
- Advanced Forward Error Correction
APR
- Automatic Power Reduction
APSD
- Automatic Power Shutdown
AWG
- Array Waveguide Grating
DCM
- Dispersion Compensation Module
DFB-LD
- Distributed Feedback Laser Diode
DWDM
- Dense Wavelength Division Multiplexing
EA
- Electrical Absorption
EDFA
- Erbium Doped Fiber Amplifier
EMI
- Electromagnetic Interference
ERZ
- Electrical Return to Zero
FC
- Fiber Channel
FEC
- Forward Error Correction
GE
- Gigabit Ethernet
NRZ
- Non-Return to Zero
OMS
- Optical Multiplex Section
OSNR
- Optical Signal-Noise Ratio
VII
OTM
- Optical Terminal Multiplexer
ROADM
- Reconfigurable Optical Add/Drop Multiplexer
SDH
- Synchronous Digital Hierarchy
TFF
- Thin Film Filter
VOA
- Variable Optical Attenuator
XFP
- 10-Gigabit Samll Form-Factor Pluggable
VIII

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ZXWM M920

Backbone DWDM Equipment

Revision No. Revision Date Revision Reason

R1.5 20101201 Version update

Serial Number: SJ-20100512144809-004

Publishing Date: 20101201

Chapter 2 Interfaces ................................................................................... 2-1

Chapter 3 Technical Specifications .......................................................... 3-1

Chapter 4 C-Band DWDM System over G.653 Fiber................................ 4-1

What is in This Manual

Chapter 1 Product Introduces the product characteristics of ZXWM M920, including

Chapter 2 Interface Introduces the interfaces of ZXWM M920 equipment, including

Chapter 4 C-Band DWDM Describes functions of C-band 16/40–wavelength system over

Version No. Serial No. Description

V4.20 SJ-20100512144809- Applicable to ZXWM M920 (V4.20), Version update

1.1 Product Technical Characteristics

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

1.1.2 APSD/APR Function

1.1.3 Erbium-Doped Fiber Amplifier (EDFA)

EDFA technology replaces the traditional regeneration mode of optical-electrical-optical to

1.1.4 RAMAN Amplifiers

1.1.5 HUB-type ROADM

l Realizes the wavelength scheduling for signals in different directions.

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

1.1.6 RPOA Technology

It is usually applied in the following cases:

1.1.6.1 Unidirectional Pump Application through the Same Fiber

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

1.1.6.2 Unidirectional Pump Application through Different Fiber

Figure 1-3 RPOA Unidirectional Pump Application through Different Fiber

1.1.6.3 Bidirectional Pump Application through Two Fiber

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

Figure 1-4 RPOA Bidirectional Pump Application through Two Fiber

1.2 Upgrade and Maintenance Characteristics

1.2.3 Smooth Expansion and Upgrade

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

1.2.4 Online Upgrade

1.2.5 Pluggable Optical Module

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

2.1 Transmission Subrack Backplane Description

Figure 2-1 Structure of Subrack Backplane

1. DIP switch for subrack No.

Table 2-1 Description of Subrack No.

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

Subrack 3 up up up up up down down

1. The pin 1 of the DIP switch is reserved.

2.2 Board Interface

l Power Supply Supervision Board (SPWA)

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

3.1 Physical Specifications

Table 3-1 Dimensions and Weights of Structural Parts of ZXWM M920

Structural Part Dimensions (Unit: mm) Weight (kg)

2000 (height) × 600 (width) × 300 (depth) 58.50

Subrack 422 (height) × 533 (width) × 286 (depth) 12.50

DCM plug-in box 47 (height) × 533 (width) × 286.5 (depth) 5.60

SJ-20100512144809-004|20101201 ZTE Proprietary and Confidential

Structural Part Dimensions (Unit: mm) Weight (kg)

Conversion bracket 29.6 (height) × 345.6 (width) 0.30

Fan unit 30 (height) × 122.9 (width) × 276.8 (depth) 0.68

SPWA board Front panel: 235 (height)× 43.3 (width) 1.80

SEIA board Front panel: 95.2 (height)× 87.1 (width) 0.45

PCB: 320 (width) × 210 (depth)

PCB: 152 (width) × 210 The weight of board is

Table 3-2 ZXWM M920 Board Weight