DFM/A CHECKLIST - OPPORTUNITES FOR IMPROVEMENT

1.1 PRODUCT DESIGN - General 4.1 PACKAGING - Package Design (Materials/Structure)

1.1.1 Are there standard parts that can be used? 4.1.1 Are there packaging materials that are considered standard that are not being used?
1.1.2 Are there existing parts from similar products that are not being used? 4.1.2 Is the package structure non-standard?
1.1.3 Can multiple parts be combined into one to reduce the number of parts in the assembly? 4.1.3 Are the intended package structure construction and packout methods not clearly defined?
1.1.4 Are there complicated mechanisms that can be simplified? 4.1.4 Is there an opportunity to reduce any package material thickness?
1.1.5 Are there areas of marginal strength that should be improved/ strengthened? 4.1.5 Are the package die lines optimized to best utilize sheet or roll sizes of paper and plastic material?
1.1.6 Are there materials that are considered standard that are not being used? 4.1.6 Is draft not adequate for a blister design?
1.1.7 Are the materials not suitable for the intended process? 4.1.7 Is flange not adequate for a blister design?
1.1.8 Can the part be confused with other parts of similar shape? (i.e. asymmetrical parts) 4.1.8 Does design tolerance meet process capability?
1.1.9 Are parts too small to handle or require a tool to pick it up? 4.1.9 Can instructions be printed on the package?
1.1.10 Can die cut components be reduced or eliminated? 4.1.10 Can existing instructions be used instead of creating new instructions?
1.2 PRODUCT DESIGN - Electronics 4.1.11 Can number of inserts/attachments be reduced?
1.2.1 Can the quantity of off-board components/assemblies be reduced? (i.e. switches, LEDs, PCBA, etc.) 4.1.12 Can double sided printing reduce the amount of cardboard used?
1.2.2 Are there opportunities for more cost-effective components? (i.e. speaker size, cheaper PCB, battery quantity, etc.) 4.1.13 Can tab-ins and clip art be combined and/or reduced?
1.2.3 Can the number of manual soldering operations be reduced? 4.1.14 Is package using new materials or printing process?
1.2.4 Are there electronic parts/components/ assemblies that are considered standard that are not being used? 4.2 PACKAGING - Assembly/Packout
1.2.5 Are there wire assemblies that are not color coded? 4.2.1 Can glue or tape for chip art be replaced with a standard mechanical locking approach?
1.2.6 Can the quantity of heat stakes and screws be reduced? 4.2.2 Is the product not being secured utilizing existing methods?
1.2.7 Can the number of wire harness interconnections be reduced or eliminated? (Keep in mind assembly or field service) 4.2.3 Is access restricted during assembly?
1.2.8 Can testing operations be automated, simplified or reduced? 4.2.4 Can the product be secured in a less labor intensive method?
2. ASSEMBLY 4.2.5 Can package structure be assembled in a less labor intensive method?
2.1 Do joining or assembly processes compromise the aesthetics? (i.e. sink marks) 4.2.6 Will the use of keylocks for securement be beneficial?
2.2 Can part materials be changed to improve the joining process? 4.2.7 Is there an opportunity for automation of packaging operations?
2.3 Are there parts design that do not allow for proper location and alignment? 4.2.8 If a J hook is required, are existing parts and attachment methods not being used?
2.4 Are there parts that do not nest properly? 4.2.9 Will packout potentially damage the product?
2.5 Are there parts not designed to meet mistake-proof Poke-Yoke assembly? 4.2.10 Can product components be easily detached or damaged by consumer?
2.6 Are there parts that are not designed to meet stack assembly requirements? 4.2.11 Can product be placed to make it easier to remove for end consumer?
2.7 Is part loading access restricted? 4.2.12 Can spot welding be used instead of glue?
2.8 Can the part design be improved for efficient joining and fastening? (i.e. screw reduction/removal, snap, cold/heat staker, rivet) 4.2.13 Is there a more cost-effective tie down material that can be used?
2.9 Are there any parts that can be confused with other parts of similar shape? 4.3 PACKAGING - Master Carton
2.10 Are there parts that are too large and/or heavy which can lead to worker fatigue? 4.3.1 Does master carton not use the optimum retail package arrangement for pallet, blank size and cube efficiency?
2.11 Are there parts/labels that are not easy to grasp, pick up, hold and/or require a tool for assembly? 4.3.2 Have appropriate precautions not been taken to avoid damage to window printing? (scratching in transit)
2.12 Are there parts that can tangled during assembly? 4.3.3 Have higher end collector quality items not been thoroughly protected to ensure zero defects (i.e. protective boxes)?
2.13 Is there no large base part where other parts can be added? 4.4 PACKAGING - Miscellaneous
2.14 Are there parts that will fall off easily during assembly? 4.4.1 Can parts be combined for multiple uses?
2.15 Are there partially- completed assemblies that require undesirable repositioning? 4.4.2 Can parts be designed to meet Mistake Proof assembly- Poke- Yoke requirements?
2.16 Are there assemblies that require two-hand operation? 4.4.3 Can parts be designed to meet Stack Assemblies requirements?
2.17 Are there multiple parts that can be modularized into single subassemblies for easier final assembly. 4.4.4 Can small product modifications result in packaging savings in labor or materials?
2.18 Are there any special cleanliness requirements that should be considered? 5. SAFETY AND RELIABILITY CONCERNS
2.19 Do any parts or assemblies require a special environment during manufacturing? (i.e. dust proofing, grounding, etc.) 5.1 Are there any "under 3" assemblies without a redundant system that may pose safety concerns?
3. TOOLING 5.2 Are there areas of potential sharp points or edges?
3.1 Are there parts that can be cored out with reasonably thin walls? 5.3 Are there any step on hazards?
3.2 Can the application of mini tools be applied? 5.4 Are there any areas of entrapment?
3.3 Are there any areas where parting line definition must be defined? 5.5 Are there any projectile concerns?
3.4 Are there any missing surface finishes/textures? 5.6 Are there any electrical safety hazards?
3.5 Are there parts that need better definition for ejector pin location/size? 5.7 Is the noise level unacceptable?
3.6 Are there any component materials incompatible with intended processes? 5.8 Are there undesired material interactions? (i.e. Color Migration, Galvanic Corrosion, Mechanical Deterioration)
3.7 Do parts require special cooling systems and/or mold design for deep or critical area? 5.9 Are there small parts that may cause safety concerns?
3.8 Are there alternate resins that result in cost-saving that can be used? (i.e. ABS to PP) 5.10 Are there any mechanisms of the product that may not meet life-cycle requirement?
3.9 Are there areas where gating locations will cause aesthetic issues? 5.11 Are there concerns with the comfort and the safety of the seating compartment?
3.10 Are there any molded parts with inadequate draft angles? 6. OTHER
3.11 Can irregular parting lines be eliminated?

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