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Step
Material Property
- Unlike stress analysis, enter thermal conductivity and Type of
Property Behavior Action
specific heat only for heat transfer analysis. Analysis
Stress
Stiffness Displacement Energy
Analysis
Heat Source
Boundary/Load Condition Setting
Convection Thermal (Generation,
Temperature
- Enter fixed temperature, convection and radiation condition. Analysis Conductivity Gradient,
Thermal Flux)
- Enter internal heating and heat flux.
Fluid Analysis Viscosity Flux Water channel
Electronic
Model Conductivity Tension Current load
Analysis Chip 2
Step
• It is the state of equilibrium of energy at which the amount of inflow and outflow energy are equal.
• As a structure is heated, the temperature of the structure increases with time. This is called the transient state
at which conditions vary over a period of time.
• Over a period of time, the amount of inflow and outflow energy become equal and, thus, no more temperature
change occurs.
• This is called the steady state and the analysis of such a state is called steady state heat transfer analysis.
• All cases except steady state, the temperature of a structure varies with respect to time.
• In such a case, the internal temperature of a material changes with respect to its location and time. Therefore,
a function of the location and time is needed to perform the analysis.
Chip 3
Step
Initial Temperature
• The temperature of a structure at its time of creation is defined as an initial condition of heat
transfer analysis.
• Can be entered as an analysis control data and apply it on entire structure.
• It is unnecessary to establish the initial temperature in steady state heat transfer analysis;
however, it is required in unsteady state heat transfer analysis.
Specified Temperature
• Specified temperature forms a boundary condition in heat transfer analysis, and the location at
which a specific temperature is assigned maintains the given temperature.
• Play a similar role as in structural analysis.
Chip 4
Step
Heat Generation
• Simulate the internal heat generation in a solid and is used as a load vector in heat transfer
analysis.
• Heat generation is defined as the energy per unit time per unit volume.
• As the volume of a structure increases, total heat generation rate increases.
• Play a similar role as the self-weight in the structural analysis.
Heat Flux
• Simulate the heat flowing into a face and is used as a load vector in heat transfer analysis.
• Heat flux is defined as the energy per unit time per unit area.
• As the surface area of a structure increases, the amount of generated energy increases.
• Play a similar role as the pressure load in the structural analysis.
Chip 5
Step
Conduction
• When the temperature of a body increases, the heat flows into the body as its molecules gain
kinetic energy and move more vigorously.
• If a specific part of the body is heated, the molecules gain energy and become vigorous as
they collide with each other, which causes vibration.
• The chain reaction remains active until there is no temperature change. The energy is
transferred by the movement of neighboring molecules in a stationary fluid or solid matter.
• Thermal Conductivity is the property of a material’s ability to conduct heat.
• The heat flux by conduction is measured using Fourier’s Law.
Convection
• Heat is transferred as liquid or air with high and low temperature parts move around.
• Forced Convection is the artificial convection in which a fluid is forced to flow above the surface
of a body using a pump. Free Convection occurs when the buoyancy of a fluid is caused by the
variation of density within the fluid due to the temperature c.
• The heat flow rate of convection is directly proportional to temperature change.
• The heat flux by convection is calculated using Newton’s Law.
q
hf TTBS TB = Heat flow rate per unit area between surface and fluid
Chip 7
Step
Radiation
• Exchange of energy between two distant objects, separated by no particular medium, via
electromagnetic waves.
• The radiation heat flow between the faces of two objects is calculated using Stefan-
Boltzmann Law.
A i Fij Ti Tj
4 4
Q
= Heat flow rate from surface i to surface j
σ = Stefan-Boltzmann constant
ε = emissivity
Ai = area of surface I
Fij = form factor from surface I to surface j
Ti = absolute temperature of surface I
Tj = absolute temperature of surface j
Chip 8
Step
Thermal Strain
Thermal Stress
• The stress caused by the deformation of an object due to the temperature change.
• For statically determinate structures, only deformation occurs; stress is ignored.
• For statically indeterminate structures, thermal stress occurs.
t E ( T ) = Thermal Stress
α = Coefficient of thermal expansion
ΔT = temperature
E = Elastic Modulus
Chip 9
Step
00 Summary
Summary
Heat Transfer Analysis
-
Unit: N, mm
Glass
Transfer Analysis
Loads and Boundary Conditions
- Convection Condition
Convection Coefficient :
10 W/m2[T]
Results Verification
- Temperature
Lamp 10
Step
Objectives of Tutorial
Understanding Heat Transfer Analysis
- Perform heat transfer analysis.
- Understand and verify the analysis conditions.
Analysis Summary
Target Model Boundary Condition (Temperature Condition,
Finite Element model
Convection Condition)
Lamp 11
Step
Meshes are
generated as if there
are no “MIDAS IT”
edges.
If mesh is generated without considering
“Midas IT” edges, a messy meshing will Mesh generated
result around it. by including all
Fortunately, some edges can be neglected edges
before meshing by using Suppress Edge
feature. When edges of
“MIDAS IT” are not
ignored, the quality of
meshing will be very
poor.
Lamp 12
Step
Procedure
1 Click [ ] (New) Icon.
2 Click [Geometry] - [Import].
5 Click [Open].
3
Note: Tutorial models are
Lamp 13
Step
Procedure
1 Click [Geometry] - [Material].
2 In the Material Library, select the
Lamp 14
Step
Procedure
1 In the Material Library, select the
2 Select Glass.
3 Click [OK]. 1
Lamp 15
Step
Procedure
1 Click all parts
1
2 Click F2 on keyboard then modify
Lamp1,2,3
Lamp Case
Lamp Support
Lamp 16
Step
Procedure
1 Open the model tab in the working
Lamp 17
Step
Procedure
1 Open the model tab in the working
Select Glass.
Lamp 18
Step
Procedure
1 Click [Thermal Load] - [Temp.] 1
2 Name: Enter “Lamp Temp”.
(Refer to Picture).
4
Temperature: Enter “60”.
5
Click [OK].
2
Lamp 19
Step
07 Model Works Tree > Geometry > Hide Parts and Unit Change
Procedure
1 In [Model Works Tree] -
Refer to Picture)
2
Select [N-m-kg-sec-J] in Unit Bar.
1
By hiding unnecessary parts for
1
convection, the needed parts can
be selected more easily.
Lamp 20
Step
Procedure
1 Click [Thermal Load] -
[Convection] Icon.
2 Name: Enter “Convection”.
3 Target: Select 63 faces 1
(Refer to Picture).
2
2
4
Ambient Temperature: Enter “20”.
5 Film Coefficient: “10”. 3
6 Click [OK].
7 right-click in the working window 4
view)
Lamp 21
Step
09 Model Works Tree > Geometry > Hide Parts and Unit Change
Procedure
1 In [Model Works Tree] -
hidden parts.
Refer to Picture)
2
Select [N-mm-kg-sec-J] in Unit
Bar.
1
.
Lamp 22
Step
Procedure
1 Click [Geometry]-[Simplify]
2 Click [ ](Top) Icon.
3 Click “Manual” 1
(Refer to Picture).
2
4 Select target “Small Edge” 3
5 Click “Remove” 4
6 Click [OK].
Lamp 23
Step
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Select all the models as target.
Lamp 24
Step
Procedure
1 Click [Geometry]->Contact
2 Click “Auto. Cont.” 1
5 Click [OK].
2
Lamp 25
Step
Procedure
1 Click [Analysis Case] - [General]. 1
3 Click [OK].
Lamp 26
Step
Procedure
1 Click [Analysis] - [Perform]. 1
2 Click [OK]..
4 Click [Save(S)].
Lamp 27
Step
14 Analysis & Results Works Tree > Lamp > Heat Transfer Analysis (Steady State) > Temperature
Procedure
1 Click [ ] (Top) Icon.
Lamp 28
Step
00 Summary
Summary
Heat Transfer Analysis
-
Unit: N, mm
Geometric Model:
Heat Static Case Heat
-
Heat Case.x_t
Material : Brass
Transfer Analysis
Al60635 (user defined)
0.22W/mm3
- Convection Condition
W/mm2[T]
Results Verification
- Temperature
Heat Case 29
Step
00
Objectives of Tutorial
Understand Heat Transfer Analysis
- Perform heat transfer analysis.
- Understand and verify the analysis conditions.
Analysis Summary
Target Model Boundary Condition
Finite Element model
(Heat Generation Condition, Convection Condition)
0.22W/mm3
Convection Condition
External Temperature : 55˚C
Convection Coefficient : 3e-5 W/m2[T]
Heat Case 30
Step
00
User defined material
Material properties
- Unlike the stress analysis, only enter thermal conductivity, specific heat
and density in heat transfer analysis.
Heat Case 31
Step
Procedure 1
5 Click [Open].
4
If the option [Search Contact
Faces] is checked when importing
the CAD model, all contact faces will
be automatically defined as welded
contacts. • Check File type and Length Unit
Heat Case 32
Step
Procedure
1 Click [Geometry] - [Material].
2 In the Material Library, select
Heat Case 33
Step
Procedure
1 Name: Enter Al 60635.
2 Elastic Modulus: Enter 69000,
Enter 2.4e-5,
Heat Case 34
Step
Procedure
1 After selection of the model in
Heat Case 35
Step
05 Model & LBC > Geometry > Material (Material Assignment-Al 60635)
Procedure
1 After selection of the model in
Heat Case 36
Step
Procedure
1 Click [Thermal Load] – 1
[Heat Generation].
(Refer to Picture)
Heat Case 37
Step
Procedure
1 Click [Thermal Load] -
[Convection].
(Refer to picture).
2 2
4 Ambient Temperature: Enter“55”.
6 Click [OK].
the view)
Heat Case 38
Step
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Select all the models as target.
Heat Case 39
Step
Procedure
1 Click [Analysis case] - [General]. 1
3 Click [OK].
Heat Case 40
Step
Procedure
1 Click [Analysis] - [Perform]. 1
2 Click [OK].
4 Click [Save(S)].
3
4
Heat Case 41
Step
11 Analysis & Results Works Tree> Heat Case > Nonlinear Steady Heat Transfer >Temperature
Procedure
1 In the Analysis and Result Tree,
double-click TEMPERATURE.
Heat Case 42
Step
00 Summary
Summary
Heat Transfer Analysis
-
Unit: N, mm
Ceramic
Analysis
Load and Boundary Condition
0.01W/mm3
- Convection Condition
W/mm 2[T]
Results Verification
- Temperature
- Displacement
- Stress
Chip 43
Step
00
Objectives of Tutorial
Analysis Summary
Target Model Boundary Condition (Fixed) Finite Element model
Fixed
Convection Condition
Heat Generation Condition :
External Temperature : 20 ˚C
0.01W/mm3
Convection Coefficient : 2e-5 W/mm2[T]
Chip 44
Step
00
Thermal Stress
The type of stress caused by the deformation of an object due to temperature change
For statically determinate structures, only deformation occurs; stress is ignored.
For statically indeterminate structures, thermal stress occur.
t E ( T ) = Thermal Stress
α = Coefficient of thermal expansion
ΔT = temperature
E = Elastic Modulus
Thermal Strain
t ( T ) = Thermal Strain
Chip 45
Step
1
Procedure
1 Click [ ] (New) Icon.
2 Click [Geometry] - [Import].
5 Click [Open]
3
Note: Tutorial models are
Chip 46
Step
Procedure
1 Click [Geometry] - [Material].
2 In the Material Library, select
Chip 47
Step
Procedure
1 In the Material Library, select
Other Non-metals.
Chip 48
Step
04 Model & LBC > Geometry > Material (Material Assignment-Ceramic Porc.)
Procedure
1 In Model Works Tree window,
model.
2
right-click them, and select
1
[Material] > [Ceramic Porcelain].
Chip 49
Step
Procedure
1 In Model Works Tree window,
model.
2
right-click them and select
Chip 50
Step
Procedure
1 Click [Boundary] - [Support]. 1
Chip 51
Step
Procedure
1
1 Click [Thermal Load] –
[Heat Generation].
2 Name: Enter “Heat Source”.
3 Target: Select 1 Part
(Refer to Picture)
Chip 52
Step
Procedure
1 Click [Thermal Load] -
[Convection].
(Refer to Picture).
3
4
3 Ambient Temperature: Enter“20”.
2
5 Film Coefficient: “2e-5”.
6 Click [OK]. 3
7
right-click in the working window
view)
Chip 53
Step
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Select all the models as target.
4 Click [OK].
2
Chip 54
Step
Procedure
1 Click [Analysis case] - [General].
1
2 Name: Enter “Chip”.
Sate)].
3 Click [OK].
Chip 55
Step
Procedure
1 Click [Analysis] - [Perform].
1
2 Click [OK].
4 Click [Save(S)].
3
4
Chip 56
Step
12 Analysis & Results Works Tree > Chip > Nonlinear Steady Heat Transfer > Temperature
Procedure
1 In the Analysis & Results Works
Tree, double-click
1
TEMPERATURE.
Chip 57
Step
13 Analysis & Results Works Tree > Chip > Linear Static > Total Displacement
Procedure
1 In the Analysis & Results Works
Tree, double-click
Chip 58
Step
14 Analysis & Results Works Tree > Chip > Linear Static > Von Mises Stresses
Procedure
1 In the Analysis & Results Works
Tree, double-click
Chip 59
Step
00 Summary
Summary
Static Heat Stress Analysis
Analysis
Material
- PCB
- Gravity
Generation conditions
Results Verification
- Temperature distribution
Mises Stresses
Board 60
Step
00
Objectives of Tutorial
Applying necessary conditions for thermal stress analysis and verifying the results of the analysis
- Thermal load application (constant temperature, convection, heat flux, heat generation)
- Static load application (gravity)
- Boundary Condition application (fixed)
Analysis Summary
Target Model Boundary Condition (Fixed)
Temperature Condition : 80 ˚C
Fixed (8 Holes)
Temperature Condition : 50˚C Heat Flux : 0.007W/mm2
Force
Convection Condition Heat Generation : 0.0003W/mm3
External Temperature : 40 ˚C
Board 61
Step
00
Necessary Conditions for Thermal Stress Analysis
Temperature
Condition : 80
˚C
Board 62
Step
Procedure 1
5 Click [Open].
Board 63
Step
Procedure
1 Click [Geometry] - [Material].
2 Name: Enter “Thermal”.
2
3 Elastic Modulus: Enter “2.1e5”.
Enter “1.1e-5”.
4 Click [Apply].
Board 64
Step
Procedure
1 In the Material Library,
Select Plastics.
2 Select “PCB”. 1
3 Click [OK].
Board 65
Step
(Refer to Picture)
2
Select [Material] > [PCB].
1
Board 66
Step
Board 67
Step
Procedure
1 Click [Boundary] - [Support]. 1
(Refer to Picture).
5 Click [OK].
3
Board 68
Step
Procedure
1
1 Click [Thermal Load] - [Temp.].
(Refer to picture)
4
Temperature: Enter “80”.
5
Click [Apply].
2
Board 69
Step
Procedure
1
1 Name: Enter “Temp2”.
2 Target: Select 6 Parts
(Refer to picture)
3 Temperature: Enter “80”.
4 Click [OK].
Board 70
Step
Procedure
1
1 Click [Thermal Load] –
[Heat Generation].
2 Name: Enter “Heat Source”.
3 Target: Select 1 Part
(Refer to Picture).
4 Heat Generation: Enter “0.0003”.
2
5 Click [OK].
Board 71
Step
Procedure
1 Click [Thermal Load] - [Heat Flux]. 1
2 Name: Enter “Heat”.
(Refer to Picture)
4
Heat Flux: Enter “0.007”.
5
Click [OK].
2
Board 72
Step
Procedure
1 Click [Thermal Load] -
[Convection].
6 Click [OK].
3
Board 73
Step
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Target: Select All the Models
3
3D Mesher: Select Hybrid Mesher.
4
Increase the number of elements
2
by moving the scroll bar towards
More.
5 2
Click [OK].
Board 74
Step
Procedure
1 Click [Analysis Case] - [Generate]. 1
Board 75
Step
Procedure
1 Click [Analysis] - [Perform]. 1
2 Click [OK].
4 Click [Save(S)].
3
4
Board 76
Step
16 Analysis & Results Works Tree> Board > Nonlinear Steady Heat Transfer > Temperature
Procedure
1 In the Nonlinear Steady Heat
Board 77
Step
17 Analysis & Results Works Tree > Board > Linear Static > Total Displacement
Procedure
1 Select Auto Scale(*0.5).
2 In the Linear Static tab of the
double-click
TOTAL DISPLACEMENT.
2
Board 78
Step
18 Analysis & Results Works Tree> Board > Linear Static > Von Mises Stresses
Procedure
1 In the Linear Static tab of the
double-click
Board 79
Transient Heat Transfer
Step
00 Summary
Summary
Transient Heat Transfer
Analysis
- Unit: N, mm
Board Transient Heat
- Geometric Model: Board.x_t
Transfer Analysis
Material
Thermal Load
Generation
Results Verification
- Temperature Distribution
Board 81
Step
00
Objectives of Tutorial
Applying necessary conditions for transient heat transfer analysis and verifying the results of the analysis
- Apply thermal transient load (fixed temperature, gradient, heat flux, heat generation)
- Apply condition terminating the analysis (Sensor)
Analysis Summary
Target Model Boundary Condition (Transient) Temperature Condition :
Temperature Condition : 20 50˚C 20 60˚C Heat Flux : 0 0.01W/mm2
Convection:
Heat generation : 0 0.0005W/mm3
External Temperature : 20 30 ˚C
Board 82
Step
00
Necessary conditions for Heat Transfer Analysis
Convection Condition
External Temperature : 20 30 ˚C
Heat Generation : 0 0.0005W/mm3
Convection Coefficient : 2e-5 W/mm2[T]
Heat flux is the heat flowing through the
Heat generation is defined as the energy
surface of an object and is defined as the The location at which a specific
per unit time per unit volume.
energy per unit time per unit area. temperature is assigned maintains the
It plays a similar role as the self-weight in
It plays a similar role as the pressure given temperature.
the structural analysis.
load in the structural analysis. It plays a similar role as the boundary
condition in the structural analysis.
20 50 ˚C Condition : 20 60
˚C
Board 83
Step
Procedure 1
Select [mm].
6 Click [Open].
Board 84
Step
Procedure
1 Click [Geometry] - [Material].
2 Name: select “PCB”.
2
3 Elastic Modulus: Enter “113000”.
1
Poisson's Ratio: Enter “0.42”.
3
Mass Density: Enter “1.68e-006”.
Enter “4.2e-007”.
4 Click [Apply].
Chip 85
Step
Procedure
1 Name: Enter “Component”.
2 Elastic Modulus: Enter “2.1e5”.
1
Poisson's Ratio: Enter “0.3”.
Enter “7.8e-6”.
Chip 86
Step
Chip 87
Step
Chip 88
Step
Procedure
1 In the LBC window, right-click
Time Function…
same order:
“0”, “20”
“15”, “30” 2
“50”, “30”
3
4 Click [OK]..
Chip 89
Step
Procedure
1 In the LBC window, right-click
Time Function…
same order:
“0”, “0.000”
“5”, “0.008”
“10”, “0.008”
3
“15”, “0.010”
“50”, “0.010”
4 Click [OK].
Chip 90
Step
Procedure
1 In the LBC window, right-click
Time Function…
same order:
“0”, “0.0000”
2
“2”, “0.0003”
“10”, “0.0003”
“15”, “0.0005”
“50”, “0.0005” 3
4 Click [OK].
Chip 91
Step
Procedure
1
In the LBC window, right-click
Time Function…
2 Name: Enter “temp_50”. 1
3 Enter the following values in the
same order:
“0”, “20”
“10”, “50”
“50”, “50” 2
4 Click [OK].
Repeat input Name: “temp_60”.
Enter the following values in the
same order:
“0”, “20” 3
“10”, “60”
“50”, “60”
Click [OK].
Chip 92
Step
Procedure
1 Click [Boundary] - [Support]. 1
(Refer to Picture)
4 Condition: Select [Fixed].
5 Click [OK].
2
Chip 93
Step
Procedure
1
1 Click [Static Load] - [Gravity].
2 Name: Enter “Gravity”.
4 Click [OK].
Chip 94
Step
12 Model & LBC > Transient Thermal Load > Transient Temperature
Procedure
1 Click [Transient Thermal] – 1
[Trans. Temp.].
Temperature-50”.
(Refer to Picture)
2
4 Temperature: Enter “1”.
5 Time Function: Select [temp_50].
6 Click [OK]. 3
Chip 95
Step
13 Model & LBC > Transient Thermal Load > Transient Temperature
Procedure
1 Name: Enter “Transient Fixed
temperature_60”.
2 Target: Select 6 Parts
(Refer to Picture)
Chip 96
Step
14 Model & LBC > Transient Thermal Load > Transient Heat Generation
Procedure
1
1 Click [Transient Thermal] -
Generation”.
3 Target: Select 1 Parts
(Refer to Picture)
2
4 Heat generation: Enter “1”.
5 Time Function: Select [heat gen]. 3
5 Click [OK].
4
Chip 97
Step
15 Model & LBC > Transient Thermal Load > Transient Heat Flux
Procedure
1 Click [Transient Thermal] -
1
[Transient Heat Flux].
(Refer to Picture)
4
Heat Flux : Enter “1”.
2
5 Time Function: Select [heat flux].
6
Click [OK]. 3
Chip 98
Step
Procedure
1 Click [Transient Thermal] –
[Transient Convection]. 1
(Refer to Picture)
4 Ambient Temperature: Enter “1”.
2
5 Time Function: Select [ambient temp)]
6 Convection Coefficient: Enter “2e-5”. 3
7
Click [OK].
4
Chip 99
Step
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Target: Select All Models (16
Models).
3 3D Mesher: Select Hybrid Mesher.
Chip 100
Step
Procedure
1 In the Model Works Tree, right-click 2
(Refer to Picture)
5 Click [OK].
5
1
Chip 101
Step
Procedure
1 Click [Analysis Case] - [General]. 1
Chip 102
Step
Procedure
1 Click Contact tab. 1
4 Click [OK]. 5
5 Check the option [Initial Tolerance]
6 Click [Add]
4
7 Click [OK].
8 In the window Analysis Case
Chip 103
Step
Procedure
1 In the window Analysis Case
Control.
2
2 Click the button [ ](Subcase 1
Control).
Chip 104
Step
Procedure
1 Click Nonlinear Transient tab. 1
2 Time Duration: Enter “50”.
Enter “20”.
4 Check Sensor ,then select [Sensor],
“100”.
“0.001”.
5 Click [OK].
4
6 In the window Analysis case
Chip 105
Step
Procedure
1 Click [Analysis] - [Perform]. 1
2 Click [OK].
3
4
Chip 106
Step Analysis & Results Works Tree> Nonlinear Transient Thermal Stress > Heat Transfer
Procedure
1 From the results displayed in the
double-click TEMPERATURE.
Chip 107
Step
Procedure
1 Result: Select
2
Click [Select All]
3
Nodal Result Extraction:
the results.
Chip 108
Step
26 Analysis & Results Works Tree> Nonlinear Transient Thermal Stress > Linear Static (Required) >
Total Displacement
Procedure
1 Linear Static (Required) :
double-click
Select [Real].
Chip 109
Step
27 Analysis & Results Works Tree> Nonlinear Transient Thermal Stress > Linear Static (Required) >
Von-MISES Stresses
Procedure
1 Linear Static (Required) :
double-click
Board 110
Step
00 Summary
Summary
Transient Heat Transfer
Analysis
- Unit: N, mm
Heat Case Transient Heat
- Geometric Model:
Heat Case.STEP
Transfer Analysis
Material
Thermal Load
Results Verification
- Temperature distribution
00
Objectives of Tutorial
Applying necessary conditions for transient heat transfer analysis and verifying the results of the analysis
- Apply thermal transient load (fixed temperature, gradient, heat flux, heat generation)
- Apply conditions terminating the analysis (Sensor)
Analysis Summary
Target Model Boundary Condition (Transient)
Heat Generation Condition : 0 0.20W/mm3
Heat Generation Condition : 0 0.15W/mm3 Use of load scale factor
Convection Condition
Procedure 1
Select [mm].
6
Click [Open].
Procedure
1 Model Works Tree: right-click
select [Edit…]
4
Heat Case 114
Step
Procedure
1 Click [Geometry] – [Material].
Enter “2.4e-5”.
04 Model & LBC > Geometry > Material (Material Assignment-Al 60635)
Procedure
1 Select the corresponding part of
(Refer to picture).
2 Select [Material] > [Al 60635].
(Refer to picture).
2
Select [Material] > [Brass].
1
2
Procedure
1
In the LBC window, right-click
Time Function…
2 Name: Enter
“Transient Heat Generation_1”.
3
Enter the following values in the
same order:
“0”, “0.00”
2
“5”, “0.10”
“10”, “0.14”
“15”, “0.15”
“20”, “0.15”
“30”, “0.15”
“50”, “0.15”
4
Click [Apply].
3
Procedure
1 Name: Enter “Transient Heat
Generation_2”. 1
2 Enter the following values in the
same order:
“0”, “0.00”
“1”, “0.15”
2
“5”, “0.20”
“50”, “0.20”
3 Click [Apply].
Procedure
1 Name:
“0”, “50”
“20”, “70”
2
“30”, “70”
“50”, “70”
3 Click [OK].
09 Model & LBC > Transient Thermal Load > Transient Heat Generation
Procedure
1 Click [Transient Thermal] - 1
2 Name: Enter
(Refer to picture)
2
4 Heat Generation: Enter “1”.
5 Time Function: Select 3
10 Model & LBC > Transient Thermal Load > Transient Heat Generation
Procedure
1 Name: Enter
(Refer to picture)
5 Click [OK]. 2
3
4
11 Model & LBC > Transient Thermal Load > Transient Convection
Procedure
1 Model Tree : Select the specified
[Transient Convection].
(Refer to picture) 4
1 6
Select [External Temperature].
8
Select all faces, except the contact
faces between the parts.
11 Model & LBC > Transient Thermal Load > Transient Convection
Procedure
1 Model Tree:
[Transient Convection].
3
3 Name:
(Refer to Picture) 5
1
5
6
Ambient Temperature: Enter“1”.
6 Time Function: Select
7
[External Temperature].
8 Click [OK]. 8
Procedure
1 Click [Mesh] - [Size Control].
2 5
Procedure
1 Click [Mesh] - [Auto Mesh].
1
2 Target: Select All the models (3
Models).
3 Click [Option>>].
6 Miscellaneous:
7 Click [OK].
Procedure
1
1 Click [Analysis Case] - [General]
Transient”.
Control).
3
Procedure
1 Click Nonlinear Transient tab. 1
2 Time Duration: Enter “60”.
enter “50”.
4 Check [When Temperature
enter “0.001”.
5 Click [OK].
Procedure
1 Click [Analysis] - [Perform]. 1
2 Click [OK].
3 Save As:
3
4
double-click TEMPERATURE.
Procedure
1 Name: Enter “Diagram”.
4 Click [OK].
00 Summary
Summary
Transient Heat Transfer
Analysis
- Unit: N, mm
Ball Valve
- Geometric Model:
Ball Valve.STEP
Material
Thermal Load
Heat generation
Results Verification
- Temperature distribution
Procedure 1
Select [mm].
6 3
Click [Open].
Procedure
1 In the database, select [Steel].
2 Select [SUS316].
3 Click [Apply]. 1
Procedure
1 In the database, select [Steel].
2 Select [SUS304].
3 Click [OK]. 1
Procedure
1 Select the shown parts in the work
window
Picture)
3
3 Select [Material] > [SUS316].
Procedure
1 Select the shown parts in the work
window
Picture)
Procedure
1
1 In LBC Works Tree, right-click
Function].
2 Name: Enter “Fluid
Temperature”.
3
Enter the given times and values.
(Refer to Picture)
2
4 Click [OK].
Procedure
1
1 In LBC Works Tree, right-click
Function].
2 Name: Enter “External
Temperature”.
3
Enter the given times and values.
(Refer to Picture)
2
4 Click [OK].
10 Model & LBC > Transient Thermal Load > Transient Temperature
Procedure
1 Name: Enter “Transient Fixed
Temperature”.
Temperature]. 2
6 Click [OK].
3
14 Model & LBC > Transient Thermal Load > Transient Convection
Procedure
1 Name: Enter “Transient
Convection”.
Procedure
1 Select All 6 Objects. (Refer to
Picture)
Tetra Mesher].
Less.
4 Click [OK]. 2
Procedure
1 Name: Enter “Transient Heat
Transfer Analysis”.
button. 3
2
Procedure
1
1 Select [Nonlinear Transient] tab.
enter “50”.
Procedure
1 Save As: Enter “Ball Valve”.
2 Click [OK].
Procedure
1 From the result of Nonlinear
double-click TEMPERATURE.
Procedure
1 Edge Type: Select [Mesh edge].