Beruflich Dokumente
Kultur Dokumente
10:30 - 11:45
Thermal Management of Electronics using Pulsating Heat Pipe
- Dr. K Rama Narasimha
Professor and Head, Dept. Of ME, KS Institute of Technology, Bangalore
11:45 - 13:00
Tailoring of Surface-Thermal-Fluid Interactions for Managing Heat in
Electronics
- Dr. Krishna Kota
New Mexico State University, USA
Sri. Amrit Ambirajan received his B.Tech and M.S in Mechanical Engineering
from Indian Institute of Technology, Chennai. Later, he took his Ph.D. in
Mechanical Engineering from the University of Missouri, Rolla in 1997. After a one
year stint as a post-doctoral researcher at Penn State University, he joined the
ISRO Satellite Centre (ISAC) in 1998. His initial assignment at ISAC was as a
member of the thermal design and analysis team for INSAT-3A. Presently, he is a
Senior Scientist/Engineer “G” at ISAC and heads the Experimental Heat Transfer
Section of Thermal Systems Group(TSG), ISRO Satellite Centre, Bangalore. His
engineering research interests include thermal property measurements, contact
conduction, radiation heat transfer, thin-film evaporation, loop heat pipes and
pulse tube cryo-coolers. He has co-authored more than 50 papers in various
journals and conferences. He has guided 4 Scientists/Engineers of TSG, ISAC
for their doctoral (Ph.D) degree submission at IISc, Bangalore.
Thermal Management using Micro Channel Heat Sink
The challenging thermal problem of significantly increased localized and average heat
fluxes per chip footprint area has been an obstacle to the development of electronic
devices. Efficient dissipation method for the generated waste-heat has been a crucial
requirement for the normal operation and lifespan of electronic devices. Liquid cooled
Micro-channel heat sink is an efficient solution for dissipating the waste-heat generated
by electronic component.
In this presentation, we present an overview of our recent advances in investigations
of fluid flow and heat transfer in micro-channel heat sinks. Firstly, the micro-channel heat
sinks with several specially designed configurations, including wavy channel heat sink,
dimple heat sink and wavy-dimple heat sink, for improving the heat transfer and
reducing pressure drop of fluid flowing through the channel, are introduced in detail.
Subsequently, we mainly focus on the heat transfer enhancement of high powered
microprocessors by employing the novel metal foam heat sink. The metal foam heat
sinks with various configurations, such as Bi-porous metal foam heat sink, non-uniform
metal foam heat sink, metal foam and solid fin compound fin heat sink, and metal foam
heat sink with solid fins are verified. Finally, we present some results regarding the basic
MCM-BGA model with “hotspot”, which is linked to the overall packaging of electronics.
Dr. K. Rama Narasimha obtained his Ph.D. from VTU. He is presently working as
the Professor & Head in the Department of Mechanical Engineering at K.S.
Institute of Technology, Bangalore. He has more than 20 years of teaching
experience at Graduate level of Engineering. Dr. Rama Narasimha has published
twelve papers in International Journals and few in International and National
conferences. He has received the award of most impressive paper of the year for
2011 from Emerald Publications for one his publications. He is the consultant
and is associated with many of the industries like M/S TUV Rheiland, a German
Certification company and M/s Avasarala Automation Ltd. He is working with
these organizations for many projects like development of Sodium Heat Pipe, the
development of hybrid solar – wind power generation. He is also a referee in an
international Journal by name Journal of Applied Fluid Mechanics. His areas of
interests are Heat Pipes, Solar and Wind Energy, CFD and Heat Exchangers.
Tailoring of Surface-Thermal-Fluid Interactions for
Managing Heat in Electronics
Convective heat transfer, either with or without phase change, involves momentum and
thermal based interactions between a surface and a fluid. Significant enhancements can
be achieved in convective cooling of electronics by tailoring these surface-thermal-fluid
interactions. This topic focuses on some of the recent and emerging developments in
engineered surfaces with tailored roughness and/or geometrical features, manufacturing
of these surfaces and their impact on convective cooling of electronics.