Design Review II Report

Team #4: Stone Cold Chillers

Members: Nick Barclay, Avi Steinberg, Nick Burgess, Ben Kunrath, Connor Rigg

Executive Summary:
A peltier thermoelectric cooling and heating device that uses a dial to adjust the water
temperature, and reverses the current to alternate between heating and cooling. This device is
intended to be used on injuries that require long periods of icing or heating, and is capable of
hitting the ideal cooling temperature of 55°F. We set out to create a working prototype that
maximizes efficiency, portability, and visual appeal, while also minimizing the size and price.

Introduction:
Our design is a peltier thermoelectric-powered iceless cooling and heating device that
has a temperature dial to adjust the water temperature as needed (bluetooth app controlled).
The device will have a switch to go from heating to cooling, which is executed by reversing the
current. The motivation for this project is to help people with injuries that require icing with more
precise temperatures. Our design is meant to be portable so that people do not need to carry
around ice packs that are prone to leaks and have trouble maintaining the correct temperatures.
What separates our device from traditional methods is that we can hit the ideal cooling
temperature of 55°F for wound healing and pain management. These traditional methods are
also expensive, prone to leaks, non-portable and require constant attention.
The design problems that are being addressed are portability, miniaturization,
aesthetics, and price. We are trying to make a working prototype of a heating and cooling pad
that maximizes portability and visual appeal, while minimizing the size and price. Our
constraints are the noise level of the fan and pump, temperature limits for both hot and cold,
heat dissipation rates, thermal conductivities of our materials, and the self-imposed size
constraint.

Concept Generation:
There were many different approaches that we considered for our heating and cooling
pad. The very first idea was to make something like a tile mesh pad composed of peltier coolers
and wires. This mesh would have been flexible enough to allow the pad to form around body
parts and when current passed through the coolers they would either cool or heat the surface of
the patient’s skin. It would be a standalone pad with a battery pack connected either on the pad
or small enough to fit in the user’s pocket. If the power was too much, we would have to resort
to plugging it into the wall.
Another idea we had was to use water as a working fluid to bring heat away from the
peltier cooler pad. By circulating water through the exterior of the pad we could draw the heat
from the coolers and dissipate it in a separate heat exchanger away from the user. This
separate heat exchanger could then house the battery and electronics making the pad lighter.
The heat exchanger could then be optimized for releasing the heat into the environment without
having to worry about the comfort of the user.
From this point we realized that the heat exchanging unit could be used to house the
peltier coolers as well. Water would still be used as a working fluid, however the water would be
cooled by the peltier coolers and move into a flexible plastic pad to absorb heat from the user.
Water block heat exchangers could be placed on the cold side of the peltier coolers, and heat
dissipating thermal fins could be placed on the hot side.

We initially thought this was a great idea, but decided having electrical components and water
both on the body of the user at the same time would be dangerous and realized there really was
no need to keep the thermoelectric coolers on the body.

Concept Selection:
The process of generating and discarding ideas occurred naturally with each subsequent
idea having its own improvements and pitfalls. In the end we came up with a design similar to,
but not the same as, the product that can be found for over $500 online.
There were several reasons that we decided not to go with our first idea, the mesh pad
made of peltier coolers. Our main problem with this design was heat rejection, it was going to be
difficult to perform heat transfer with the surrounding air. Our ideas included heat conducting
fabric, small fans on the exterior of the pad, thermal fins, etc. None of these ideas would be
small, safe, or comfortable enough for the pad. The amount of heat that would need to be
rejected in order to maintain a cold temperature on the pad and prevent the cooler from
overheating would require a dedicated heat exchanger unit.
This roadblock lead us to the next idea, using water as a working fluid to bring the heat
from the pad so it could be dissipated away from the user. This would remove the limitations
that come with dissipating the heat on the pad and a hot water radiator would be much more
simple to design. Since there are so many applications of radiators in the real world, it wouldn’t
be hard to find something to suit our needs. With water and electric components both on the
user, safety became a concern. If there were any leaks in the pad we could short circuit our
cooling units or electrocute the user.
Our final concept solved most of the problems that were holding us up: safety of the
patient, bulkiness of the pad, and heat dissipation. By putting the coolers in the heat exchanger
unit, the pad would be more flexible and there would no longer be electrical components on the
body of the user. The heat exchanger could be optimized to perform heat transfer - both with the
air and with the water - shrinking the overall size of our device. One problem it didn’t solve was
power consumption. We decided to make a portable unit one of the last levels of success
because at this point we knew enough about the coolers to know that they would likely not be
efficient enough to do the job and run on a reasonably sized and priced battery.
Final Concept Description:
Our final design incorporates the lessons learned from reviewing previous cooling and
heating pads, analyzing their strengths and weaknesses to create a product that provides
adjustable therapeutic temperature control in an attractively designed package without the
downsides of ice.

Our final concept design incorporates a separate cooling pad, joined by insulated tubes
to a heat transfer, power and control block. The cooling pad will be iterated, initially using
industry standard materials and thicknesses for comfort and safety. The block contains parallel
peltier coolers to cool the water which serves as out working fluid. The peltier coolers are
oriented with their cool sides able to transfer heat from the working fluid, and their hot sides
attached to a circular fin radiator for heat dissipation. A circular fan will allow increased heat
transfer from the radiative fins. Temperature sensors at the entrances and exit of the block allow
for automatic adjustment of the current supplied to the peltier coolers and therefore form a
control system to permit constant adjustments based on heat transfer calculations.
Commercially available aquarium pumps circulate the water through the system. The pumps
work at a constant rate, as we realized that the complexity of the system would increase
dramatically with multiple control system variables, without an increase of similar magnitude in
temperature control ability. An Arduino control system will be implemented to read temperature
sensor data and control current to the peltier coolers. Reversing the current also has potential
therapeutic options for cool/heat cycles, to be set by a user control panel. Temperature
adjustments will also be controlled through this panel.

Lastly, our design incorporates sleek aesthetics for a more modern, consumer-friendly
look. By developing the overall shape around the circular fans and radiators, we have
developed a more compact and elegant cooling device than what is currently available on the
market.

Literature Search Results:

An internet keyword search of waterblocks informed us that a large piece of metal will
not necessarily work better than a small piece of metal. All of the cooling is provided through a
single trough/channel, making the rest of the metal block a waste since air is less efficient than
water. In addition, the best waterblock coolers contain ridges or fins which increase the surface
area, and therefore the cooling potential.
A similar design that cooled water by passing it through a block that was in contact with
the cold side of the thermoelectric module was found, and the following are a few of the key
takeaways: Ethylene glycol has multiple advantages over water as a coolant, inlet velocity of the
working fluid affects heat transfer performance, and increasing the number of fins and
dimensions of the block increases the achievable temperature differential up to a point of
diminishing gains (A Novel Cooling System Design for Water Block in Liquid Cooling Garment).
A few of some relevant patents can be found below.
[OPTIONAL
Patent Name: Heating and Cooling Pad
Patent Number: US08518035
Although this patent has peltier modules embedded on the inside of the pad with heat sinks on
top of the coolers, there are many similarities that we can learn from. This pad can head and
cool, and contains thermally conductive material on the body and air sides. There are heat sinks
on air side of the coolers and a rheostat with reversing switch to change between hot and cold.
Most importantly, there is a thermistor to control an automatic high temperature shut off.
Finally,mesh sides to allow air/heat flow and fans on the pad and the power source
]

Patent Name: Temperature controlled cooling system

Patent Number: US07495406

This patent has a separate cooling pad from the cooling device, similar to ours. There are
temperature sensors at the inlet and outlet of the working fluid so that the microcontroller can
control the temperature. The temperature is also controlled by pulse-width modulated electrical
signals.

Patent Name: Temperature Controlled Cooling System

Expired, Inventor: Tony Quisenberry, Patent Number: 5097829A

A thermal blanket with fluid on the interior. Energy is removed from fluid that comes into contact
with the cold side of the thermoelectric cooler. Temperature is controlled by a microprocessor
which adjust the percentage of time that current is flowing through the thermoelectric cooling
device. It used pulse width modulation to manage the energy removed from the fluid. The
blanket maintains a temperature between 50 and 55 degrees Fahrenheit (10-13 degrees
Celsius).

The following are the fields of search that we found in our patents: 219/494, 497, 219/209, 210,
501, 499; 62/3.2, 3.7. The general category is Electric Cooling and Medical Devices.

Journal articles (optional):

We found a journal article titled Study and Fabrication of Thermoelectric Air Cooling and
Heating System which stated that the cooling fan should blow towards the heat sink and not
away from it. There was another article A Novel Cooling System Design for Water Block in
Liquid Cooling Garment discussed a liquid cooling garment that uses thermoelectric coolers with
a waterblock system to transfer heat away from the human body.

Engineering Analysis and Final Design:

1. Calculate amount of heat needed to be removed to cool largest body part (surface area
of pad and 1 inch deep)
2. Body-side analysis by Burgess
 The engineering analysis for our design mainly consisted of a heat transfer analysis of
the water-pad system and of the TEC (thermo-electric cooler) cooling module. We found that
the ideal temperature to cool a body part for therapeutic purposes is 55 degrees Fahrenheit and
the cooling should permeate approximately 1 inch into the muscle tissue. As a design
constraint, We designed our cooling system to be able to cool the largest body part,
shoulder/back, to 55 degree Fahrenheit in less than 5 minutes.
Our heat transfer model for the pad system was broken down into two parts:
1) Calculating the amount of energy required to cool the maximum volume of skin/muscle tissue
from the initial body temperature to our ideal cooling temperature in 5 minutes. 2) Estimating the
heat generation rate inside of the body. In order to cool the body we need to remove enough
heat to both counter the heat being generated by the body and to remove the heat energy
initially stored in the body.
To calculate the amount of heat energy stored inside of the largest body part we want to
cool, we used the equation:

𝑄ℎ𝑒𝑎𝑡𝑆𝑡𝑜𝑟𝑒𝑑 = 𝜌ℎ𝑢𝑚𝑎𝑛,𝑡𝑖𝑠𝑠𝑢𝑒 ∗ 𝑉𝑡𝑖𝑠𝑠𝑢𝑒 ∗ 𝐶𝑝,𝑡𝑖𝑠𝑠𝑢𝑒 ∗ (𝑇𝑏𝑜𝑑𝑦 − 𝑇𝑖𝑑𝑒𝑎𝑙 ) (1)

Where, 𝑄ℎ𝑒𝑎𝑡𝑆𝑡𝑜𝑟𝑒𝑑 represents the total amount of heat energy stored in the portion of body we
are trying to cool, 𝜌ℎ𝑢𝑚𝑎𝑛,𝑡𝑖𝑠𝑠𝑢𝑒 𝑖𝑠 𝑡ℎ𝑒 𝑑𝑒𝑛𝑠𝑖𝑡𝑦 𝑜𝑓 ℎ𝑢𝑚𝑎𝑛 𝑡𝑖𝑠𝑠𝑢𝑒, 𝑉𝑡𝑖𝑠𝑠𝑢𝑒 is the maximum volume of
a body part we will try to cool, 𝐶𝑝,𝑡𝑖𝑠𝑠𝑢𝑒 is the specific heat of human muscle tissue, 𝑇𝑏𝑜𝑑𝑦 is the
initial internal temperature of the body and 𝑇𝑖𝑑𝑒𝑎𝑙 is the final ideal cooling temperature of the
body part.
To get the volume of the body part to cool, we multiplied the surface area of the cooling
pad we ordered by 1 inch as an approximation. After calculating the amount of heat necessary
to remove, we can calculate the heat removal rate of stored energy, 𝑞𝑐,𝑠𝑡𝑜𝑟𝑒𝑑 , by dividing by the
cooling time, 𝑡𝑐𝑜𝑜𝑙𝑖𝑛𝑔 :

𝑞𝑐,𝑠𝑡𝑜𝑟𝑒𝑑 = 𝑄ℎ𝑒𝑎𝑡𝑆𝑡𝑜𝑟𝑒𝑑 /𝑡𝑐𝑜𝑜𝑙𝑖𝑛𝑔 (2)

According to our Matlab calculations, the maximum 𝑞𝑐,𝑠𝑡𝑜𝑟𝑒𝑑 is 153 W; this is the heat
transfer rate necessary to remove the heat stored in the largest body part we seek to cool in 5
minutes. Our cooling system needs to achieve this cooling rate in addition to compensating for
the heat production rate of the body. The body constantly produces heat in order to maintain the
internal body temperature through a process called the Basic Metabolism Rate(BMR).
According to our research, the BMR for a 70 kg male is approximately 1.2 W/kg. We put an
upper limit on the amount of kg contained in the largest body part we could cool to be 15 kg.
With this assumption, we were able to estimate the heat generation rate, 𝑞𝑔𝑒𝑛 , for the body part
to be approximately 18 W. Added these two heat transfer rates together, we can estimate the
total heat load necessary to cool largest body part in 5 minute𝑞𝑐,𝑡𝑜𝑡𝑎𝑙 𝑡𝑜 𝑏𝑒 171 𝑊.

𝑞𝑐,𝑡𝑜𝑡𝑎𝑙 = 𝑞𝑐,𝑠𝑡𝑜𝑟𝑒𝑑 + 𝑞𝑔𝑒𝑛 (3)

 We need to design a cooling system that will transfer 171 W until the body reaches
steady state temperature, at which point the cooling system will just need to counteract the heat
produced by the body. So once we hit steady state, we will have our control system adjust the
input electricity so that only 18 W of heat are being transferred from the body.
In the cooling system we plan to have two water block coolers in series, each with a
copper plate thermally sealed to both sides, where each copper plate has the cold side of the
TEC sealed to it. The hot side of each TEC is attached to a copper plate with a heat seat and a
fan attached to it in order to efficiently transfer away the heat generated by the TEC.
Transferring away the heat is crucial so that the cold side can become as cold as possible
because the TEC just causes a temperature difference between hot and cold sides. We chose
TECs with 𝑄𝑚𝑎𝑥 = 154 𝑊 𝑎𝑛𝑑 𝐼𝑚𝑎𝑥 = 10 𝐴and then calculated how much heat would be
transferred with a single TEC with the heat sink attached to it.
To properly model the actual heat transferred from the TEC, we first need to calculate
the hot side temperature, 𝑇ℎ𝑜𝑡 , the cold side temperature, 𝑇𝑐𝑜𝑙𝑑 , and pick a certain input voltage
to use a graph to correlate actual heat transferred, 𝑞𝑐,𝑇𝐸𝐶 . To find 𝑇ℎ , we note that the heat
generated on the hot side is first transferred through conduction in the copper plate. The fan
blows cold air at ambient temperature through the heat sink which is attached to the copper
plate, which causes the heat to be transferred away from the copper plate by forced convection.
We can model this heat transfer process by a thermal circuit, which leads us to be able to solve
for 𝑇ℎ𝑜𝑡 .

(4)

We can rearrange this equation and solve for 𝑇ℎ𝑜𝑡 . We got

𝐿𝐶𝑜𝑝𝑝𝑒𝑟𝑃𝑙𝑎𝑡𝑒 , 𝑘𝐶𝑜𝑝𝑝𝑒𝑟𝑃𝑙𝑎𝑡𝑒 , 𝐴𝐶𝑜𝑝𝑝𝑒𝑟𝑃𝑙𝑎𝑡𝑒 , 𝐴𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 by looking at the product specs and online tables.
We can determine 𝑞ℎ , the heat transferred from the hot side of the TEC cooler by placing and
upper bound and assuming that all of the electricity inputted is transferred to Joule heat. And the
heat generated by joule heating is given by the equation,

𝑞ℎ = 𝑃 = 𝐼 2 𝑅 (5)

We can get R from the TEC specs by,

𝑉𝑚𝑎𝑥
𝑅 = 𝐼𝑚𝑎𝑥
(6)

To get ℎ𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 , we first need to find the Reynold’s number, which we can find using,

( 𝑉𝑎𝑖𝑟 ∗𝑑𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 )
𝑅𝑒𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 = 𝜈𝑎𝑖𝑟
(7)
Where 𝑑𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 is the hydraulic diameter of the heat sink, 𝜈𝑎𝑖𝑟 is the kinematic viscosity of air,
and 𝑉𝑎𝑖𝑟 is the velocity of the air traveling through the heat sink. 𝑑𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 can be modeled as
twice the width between two parallel plates of the heat sink, w.

𝑑𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 = 2 ∗ 𝑤 (8)

We can get the average flow velocity by dividing the fan volumetric flow rate, 𝑄𝑓𝑎𝑛 ,by the cross
section area of the heat sink, A.

(𝑄𝑓𝑎𝑛 )
𝑉𝑎𝑖𝑟 = 𝐴
(9)

Now, we can use the Reynold’s number to find the Nusselt number, which we can then
use to find the convective heat transfer coefficient. According to the flow equation for laminar
flow over a heat sink,

𝑁𝑢𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 = .664 𝑅𝑒𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 1/2 𝑃𝑟𝑎𝑖𝑟 1/3 (10)

And then finally, we can find the convective heat transfer coefficient according to,

𝑁𝑢𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 ∗𝑘
ℎ𝐻𝑒𝑎𝑡𝑆𝑖𝑛𝑘 = 𝐿
(11)

Where L is the length of the plate in the heat sink and Pr is the Prandlt number for air, the
dimensionless number that relates momentum diffusivity to thermal diffusivity. Rearranging Eq.
4 and plugging in all of the values we obtained 𝑇ℎ𝑜𝑡 = 22.6 𝐶 . In appendix A, we put the values
for each of the variables.
Now the last thing that we need in order to determine 𝑞𝑐,𝑇𝐸𝐶 , the actual heat transferred
by a single TEC system, is the temperature difference between the 𝑇ℎ𝑜𝑡 and 𝑇𝑐𝑜𝑙𝑑 of the TEC.
Since the ideal coolest temperature of the skin is 55 F = 12.8 C, our goal is to make the cold
side temperature of the TEC be as low as 2 C. In Peltier cells the heat flux, 𝑞𝑐,𝑇𝐸𝐶 , is a function
of both the temperature differential between the hot and cold sides of the TEC and the operating
amperage applied to the cell. THE chart below displays the variable performance of the Peltier
Cell:
 Figure 1: Chart of Peltier Cell Performance
If we set our operating amperage to be 4.5 A, the I/Imax = .45 and above we showed that
our temperature difference, dT = 20 K so we can correlate to find the ratio of Qc/Qmax ~ .38.
Since we know that Qmax = 154 W for the TEC cooler we got, we can solve to show 𝑞𝑐,𝑇𝐸𝐶 = Qc
= 58.52 W is that actual heat that would be transferred by a single one of our TEC cooling
systems. Since we have this same configuration set up twice on each water block and we have
two waterblocks, the actual heat transferred for our entire cooling system is four times 𝑞𝑐,𝑇𝐸𝐶 . So
the total heat transferred by our system cooling system, 𝑞𝑐𝑜𝑜𝑙𝑖𝑛𝑔,𝑡𝑜𝑡𝑎𝑙 = 234 𝑊. Recall above that
to meet our maximum cooling requirements for cooling the skin in 5 minutes, we required our
cooling system to pump at least 171 W so our design should satisfy cooling requirements with
some room for error. See Appendix A for matlab code and values for different variables.
The four peltier devices used in the cooling module mean that the it will require a
substantial amount of current to operate all components. Each of the four TECs can draw up to
10A of current, both fans require .2A, and both pumps require 1A. The arduino operates using
far less current comparatively at 45mA. Our power source must be capable of providing
approximately 43A of current. Since all of these components operate on 12 volts, the power
required when all components are operating at maximum is 516W. This means that using a
battery to create a mobile device in unreasonable due to the weight of a battery that could
power this device for any length of time. Therefore, we will power the cooling module using a
standard wall outlet coupled with a 120V AC to 12V DC power converter.
All of the components will run in parallel to one another because they all operate on 12
volts. There will be a separate fuse for each type of component. A 50 Amp fuse for the four
TECs, a 5 Amp fuse for the two pumps, and a 1 Amp fuse for the two fans. These will ensure
that we do not destroy any of our hardware should we have some kind of electrical failure.
 Because the current in the pumps and TECs is two high for our arduino control unit, it
will control the TECs and pumps indirectly via two relays, one 60 Amp relay and one 5 Amp
relay. Additionally, the arduino will monitor three different temperature sensors, one for the inlet
water temperature of the pad (outlet of the cooling module), one for the outlet water temperature
of the pad (inlet of the cooling module), and one for the temperature of heat sinks on the hot
side of the TECs. The inlet and outlet temperatures will be used to determine if more or less
power is need to maintain the optimum temperature in the body, while the heat sink temp will be
used to prevent the system from overheating and damaging itself. These sensors will run on the
arduino’s built in 5.5V power source.

Problem Analysis (Risks):

The following are potential problems/risks from which we plan to do analysis on going
forward: overheating, burning, fouling, leaking of the working fluid, leaking of the working fluid
onto the electrical components, and pump failure.
In order to counteract water fouling and freezing, we plan to mix the water with
approximately 12.5% ethylene glycol. Mixing with 12.5% ethylene glycol will turn the solution
into an antifreeze that will have a freezing temperature of -4 C which mitigates the risk of the
water freezing because of the low temperature. Also, this mixture will help prevent internal
corrosion of the water block. Water itself has the best heat transfer properties, but it is still worth
it for us to mix with a small proportion of ethylene glycol for its anti-corrosion and antifreeze
properties[3].
To address the potential problem of leaking of the working fluid, we decided to use
permanent connections for the tubing. The original idea was to have a modular device from
which you could switch out the pads, depending on what size was needed. We decided that this
would introduce air bubbles to our system, and also increase our chances of leaking of the
working fluid. Therefore, the tubing connections and secure and non removable.
For the issue of pump failure, we decided to use an Anself Ultra-quiet Mini 4.8W DC12V
Micro Brushless Water Oil Pump because it is low in noise output, but most importantly because
it is an extremely reliable pump that is not known to fail often. Finally, we plan to have
temperature sensors in the heat sinks and water to prevent the issues of overheating and
burning. If any of the sensors reaches a certain temperature, the system will automatically shut
off and begin cooling down.

Conclusion:
Our analysis shows that using 4 154Wmax peltier devices we can provide a heat
transfer rate of 234W, allowing us to achieve optimal therapeutic temperature at depth of one
inch below the skin in less than 5 minutes. The device will require a significant amount of
electrical power and therefore will be powered using a wall outlet instead of a battery pack.
The module will be controlled by an arduino using 3 different temperature sensors to
monitor the temperature of the water, the heat transfer rate, and the temperature of the heat
sinks in order to avoid overheating hardware.
 We will run an ethylene-glycol mix in our water to prevent fouling in the channels and
increase reliability of the system. Using known reliable pumps, monitoring heat sink
temperatures, and shielding the electronics from condensation will also increase the overall
reliability of the cooler.

Reference List:
1. https://wiki.ece.cmu.edu/ddl/images/Thermal_Analysis2.pdf
2. https://www.meerstetter.ch/compendium/tec-peltier-element-design-guide
3. http://www.erareplicas.com/427man/engine/antifreeze.htm
4. http://people.seas.harvard.edu/~jones/cscie129/pages/health/thermreg.htm
5. https://www.bit-
tech.net/reviews/modding/watercooling_201_understanding_waterblocks/1/

Appendix A:

Matlab Code:
% Senior Design Engineering Analysis
% Team 4: Avi Steinberg, Connor Rigg, Nick Barclay, Nick Burgess and Ben
% Kunrath
% 02/04/2018

%Pad heat transfer analysis

%Givens

%specific heat of tissue

c_tis = 3.75; %kJ/kg
%density of tissue
rho_tis = 1000; %kg/m^3

%change in temperature between center of body and final cooling temp

T_delta = 23.9; %Celsius
%hydraulic diameter of pad
hydd = .017; % meters assuming 2/3 x 2/3 inches
%kinematic viscosity of water
visc_w = 4.116.*(10.^(-7)); % m^2*s^-1
%volumetric flow of pump
flow_p = .00042; % m^3/s
%Prandtl number assuming 35 deg F
Pr = 13;
%length of pad (basing off universal pad on amazon ~ 32 in.
L = .82; % meters
%viscosity ratio
mu = 1;
%thermal conductivity of water
k_w = .58; %W/m.*K
%thermal conductivity of flesh (mix of fat and muscle)
k_f = .375; %W/m.*K
 %desired 55 deg F distance to heat source depth
depth = .05; % m

%contact area = Length water travels x width of pass

% width of pass in pad
w = .025; % looking at universal pad, width seems to be 1 in. ~ .025 m
A = L*w; %m^2

%volume of tissue contained 1 inch beneath pad

V_tis = A*.025; %m^3
% difference in temp between water in pad and ideal cooling temp of 55F

%Calculations
%skin contact
%initial energy (J)
q_c = 1000*(c_tis.*rho_tis.*V_tis.*T_delta);
%Reynold's number
%flow velocity through pad
v_flow = flow_p./(pi.*(hydd.^2)./4);
Re = v_flow.*L/(visc_w);
%Average Nu for turbulent flow over a flat plate:
https://www.sfu.ca/~mbahrami/ENSC%20388/Notes/Forced%20Convection.pdf
Nu = 0.037.*(Re.^0.8).*(Pr.^(1./3));

%for laminar flow Re < 10000

%Graetz number
% Gr = hydd.*Re.*Pr./L;
%Nusselt number
% Nu = (3.66 + (.085.*Gr)./(1 + (.047.*Gr).^(2/3))).*(mu.^.14);

%inside tissue
% power generated inside of tissue (W)
%q = k_f.*T_delta./depth;
q = 18; % body generates 100-120 W of heat so we assume that
% largest body part to cool will generate ~ 10 W
%time (let's set this to 5 minutes
t = 300; %s
%Let's estimate the power needed in order to cool
% the skin to desired temp in 5 minutes. q_h
q_h = (q_c/t) + q;

% Let's calculate Temperature Difference, T_d for

%heat transfer coefficient
h = Nu.*k_w./hydd;

T_d = q_h/(A*h); % Temp. difference between surface of pad

% and water temp

% Let's calculate the temperature difference between inlet and

%o outlet of the pad

t_pad = L/v_flow; %time water is in pad

rho_water = 1000; %density of water
C_p = 4185.5; %Specific heat of water J/(Kg*K)
V_water_pad = L*(pi * hydd^2)/4; % Volume of water in pad
m = rho_water*V_water_pad; %mass of water in pad
T_dif_pad = (q_h*t_pad)/(m*C_p); % Temp dif. between water inlet and outlet of pad

% Waterblock Heat Transfer Analysis:

% We want the temperature between inlet and oulet of waterblock
% to be atleast T_dif_pad. Now let's start calculating it
% There are 4 zones of heat transfer
% Zone 1: Heat Transfer from the Cooling Channels to the Water Bath

% This heat transfer occurs my forced convection of the water traveling

% through the pad. q = hA(T_dif)

% We need to calculate the area and convective heat transfer coefficient

% inside the pad

%Givens:
% diameter of waterblock inlet--units in meters. Specs from amazon waterblock
d_wb = .0095; % m
% Cross-sectional area of inlet m^2
A_c = (pi*d_wb^2)/4; %m^2
% Length of single pass of water block. To get the total length water travels,
% we need to multiply this by number of passes water takes in water block
L_pass = .042; % m
% I got this number from looking at an image of the inside
% of a waterblock and saw it had 8 passes
N_pass = 8; % unitless
% Total length water travels
L_wb = L_pass*N_pass; %m
% Perimeter of cooling channel. Same as total surface area of block channels
% touching the water
P = (pi*d_wb)*L_wb; % m
% hydraulic diameter of water block
hydd_wb = 4*A_c/P; % m
% speed of water through water block
v_flow_wb = flow_p/A_c; % m/s
% Reynold's number of flow through water block
Re_wb = (v_flow_wb*hydd_wb)/visc_w; % Re > 10^5 so flow is turblent

k_copper = 401; % W/(m*K)

A_copperplate = 0.0018 ; % in m^2 based off dimensions of amazon water block(42mm x 42mm)
t_copper = .00065; % thickness of copper plate in meters
% Use Dittus Boelter equation to get Nusselt Number for turbulent flow
% in pipe
Nu_wb = .023*Re_wb^.8*Pr^.3;

% calculate convective heat transfer coefficient from Nu_wb

h_wb = (Nu_wb*k_w)/hydd_wb;

% q_cwb = h_wb*P*(T_s - T_in) where T_s is surface temp of water block

% and T_in is inlet temperature of water

% For a given inlet temperature we can estimate T_cold of peltier

% cell. We can also calculate the T_hot in a future step. We can use
% this temperature difference together with the applied amperage to
% estimate Q_c from the TEC correlation chart and see if this is too
% high.

% Here our goal is to find the hot side temperature of the copper plate

% First we need to find the rate at which heat is transferred

% from hot side to air. This heat transfer invovles conduction through
% the copper plate and forced convection of the air traveling through the
% heat sink

% Reynold's number for air flow:

% We need volumetric flow rate to get reynold's number

% I estimate volumetric flow rate from the specs for a fan I found on
% amazon. Range is between 15.7-54.8 CFM(ft^3/min) = .216- .91 m^3/s
% Here is link to fan: https://www.amazon.com/dp/B00K7809O2/ref=psdc_11036281_t2_B004PLXV8S
% I will pick .5 as average flow rate
flow_fan = .5 ; % m^3/s

% Heat sink has dimensions 90 x 140 mm = .0126 m^2

A_heatsink = .0126; % m^2
% Length of the heat sink is obtained from specs:
L_heatsink = .051; %m
% Spacing between fins in heat sink. Taken from estimates online
w = .0075; % m
hydd_heatsink = 2*w; %m
% kinematic viscosity of air
visc_air = 1.48*(10^-5);% m^2/s
% Get prantl number and conductivity for air from engineering toolbox
Pr_air = .7;
k_air = 1.4;
%Temperature of ambient air
T_ambient = 22;
Re_heatsink = ((flow_fan/A_heatsink)*hydd_heatsink)/visc_air;
% Since Reynold's number is less than 10^5 the flow is laminar
% For laminar flow across parallel plates, we can calculate the Nu

Nu_heatsink = .664*(Re_heatsink^.5)*(Pr_air)^(1/3);
h_heatsink = (k_air*Nu_heatsink)/L_heatsink;

% Calculate thermal resistance as heat travels from hot side of TEC to

% ambient air. This involves conduction through copper plate and
% convection of air through heat sink

R_Hot=(1/(h_heatsink*A_heatsink))+(t_copper/(k_copper*A_copperplate));

% we can calculate the rate that heat is generated inside of the TEC by
% using the upper limit which is calculated as P=I^2*R
% We can calculate R from product Specs. For one of the ones we ordered
% the V_max = 15.9 V and I_Max = 6A and V=IR -->
% R = V_max/I_max = 2.65 ohms.

% let's set an arbitrary current to be 3A

I = 3; % A
R = 2.65; % ohms
q_hotside = I^2*R;

% Since we now Q generated from hot side, we now can solve for T_hotside

T_hotside = q_hotside*R_Hot + T_ambient;

Values of Workspace Variables after running Matlab Code(see matlab comments for
details):