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HBD-E370/E470/

E570/E870/T57
SERVICE MANUAL US Model
HBD-E370/E570/T57
Ver. 1.1 2010.04 Canadian Model
HBD-E370/E470/E870

AEP Model
UK Model
Australian Model
Taiwan Model
HBD-E370/E870

E Model
HBD-E370
Photo: HBD-E370

• HBD-E370 is the amplifier, video, BD/DVD/Super Audio CD/CD Model Name Using Similar Mechanism BDP-S370
system, USB, LAN and tuner section in BDV-E370.
• HBD-E470 is the amplifier, video, BD/DVD/Super Audio CD/CD Mechanism Type BPX-5
system, USB, LAN and tuner section in BDV-E470. Optical Pick-up Block Name KEM-460AAA
• HBD-E570 is the amplifier, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E570.
• HBD-E870 is the amplifier, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-E870.
• HBD-T57 is the amplifier, video, BD/DVD/Super Audio CD/CD
system, USB, LAN and tuner section in BDV-T57.

SPECIFICATIONS
Amplifier Section Inputs (Analog) Tuner Section
U.S. models: AUDIO (AUDIO IN) Sensitivity: 450/250 mV System PLL quartz-locked digital
POWER OUTPUT AND TOTAL HARMONIC Inputs (Digital) synthesizer
DISTORTION: SAT/CABLE (COAXIAL), TV (OPTICAL) FM tuner section
(FTC) Supported formats: LPCM Tuning range
Front L + Front R: With 3 ohms loads, both 2CH (up to 48 kHz), Dolby North American models: 87.5 MHz - 108.0 MHz
channels driven, from 180 Digital, DTS (100 kHz step)
- 20,000 Hz; rated 60 watts Other models: 87.5 MHz - 108.0 MHz
Video Section
per channel minimum (50 kHz step)
Outputs VIDEO: 1 Vp-p 75 ohms
RMS power, with no more Antenna (aerial) FM wire antenna (aerial)
COMPONENT:
than 1% total harmonic Antenna (aerial) terminals 75 ohms, unbalanced
Y: 1 Vp-p 75 ohms
distortion from 250 milli Intermediate frequency 10.7 MHz
PB/CB, PR/CR: 0.7 Vp-p
watts to rated output.
75 ohms General
Other models:
HDMI OUT: Type A (19 Power requirements
POWER OUTPUT (rated)
pin) North American and Mexican models:
Front L/Front R: 108 W + 108 W (at 3 ohms,
1 kHz, 1% THD) BD/DVD/Super Audio CD/CD System 120 V AC, 60 Hz
HBD-E370: Signal format system NTSC (US, Canadian, Latin American models: 110 - 240 V AC,
POWER OUTPUT (reference) Latin American and 50/60 Hz
Front L/Front R/Center/Surround L/Surround R: Mexican models) Taiwan model: 120 V AC, 50/60 Hz
142 W (per channel at 3 PAL/NTSC (Other Other models: 220 - 240 V AC,
ohms, 1 kHz) models) 50/60 Hz
Subwoofer: 140 W (at 3 ohms, 80 Hz) Power consumption On: 170 W
USB Section
HBD-E870/HBD-E570/HBD-E470/HBD-T57: Standby: 0.3 W (at the
(USB) port: Type A (For connecting
POWER OUTPUT (reference) Power Saving mode)
USB memory, memory
Front L/Front R/Center/Surround L/Surround R: Dimensions (approx.) 430 mm × 85 mm × 335
card reader, digital still
167 W (per channel at 3 mm (17 in × 3 3/8 in ×
camera, and digital video 13 1/4 in) (w/h/d) incl.
ohms, 1 kHz)
camera) projecting parts
Subwoofer: 165 W (at 3 ohms, 80 Hz) Maximum current: 500 mA Mass (approx.) 4.8 kg (10 lb 10 oz)
LAN Section
LAN (100) terminal 100BASE-TX Terminal Design and specifications are subject to change
without notice.

BLU-RAY DISC/DVD RECEIVER


9-889-770-02 Sony Corporation
2010D05-1 Audio&Video Business Group
© 2010.04 Published by Sony Techno Create Corporation
HBD-E370/E470/E570/E870/T57

• This product incorporates copyright protection technology that is protected by NOTES ON CHIP COMPONENT REPLACEMENT
U.S. patents and other intellectual property rights.
Use of this copyright protection technology must be authorized by Macrovision,
• Never reuse a disconnected chip component.
and is intended for home and other limited viewing uses only unless otherwise • Notice that the minus side of a tantalum capacitor may be dam-
authorized by Macrovision. aged by heat.
Reverse engineering or disassembly is prohibited.
• This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive
matrix surround decoder and the DTS** Digital Surround System. FLEXIBLE CIRCUIT BOARD REPAIRING
* Manufactured under license from Dolby Laboratories. • Keep the temperature of soldering iron around 270 °C during
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Labora- repairing.
tories.
**Manufactured under license under U.S. Patent #’s:
• Do not touch the soldering iron on the same conductor of the
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; circuit board (within 3 times).
7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide • Be careful not to apply force on the conductor when soldering
patents issued & pending. DTS is a registered trademark and the DTS logos, or unsoldering.
Symbol, DTS-HD and DTS-HD Master Audio are trademarks of DTS, Inc.
© 1996-2008 DTS, Inc. All Rights Reserved.
• This system incorporates High-Definition Multimedia Interface (HDMI™) tech- CAUTION
nology.
Use of controls or adjustments or performance of procedures
HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks
or registered trademarks of HDMI Licensing LLC. other than those specified herein may result in hazardous radia-
• Java and all Java-based trademarks and logos are trademarks or registered trade- tion exposure.
marks of Sun Microsystems, Inc.
• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
• “Blu-ray Disc” is a trademark. SAFETY CHECK-OUT
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD After correcting the original service problem, perform the follow-
VIDEO,” and “CD” logos are trademarks.
• “BRAVIA” is a trademark of Sony Corporation.
ing safety check before releasing the set to the customer:
• “AVCHD” and the “AVCHD” logo are trademarks of Matsushita Electric Indus- Check the antenna terminals, metal trim, “metallized” knobs,
trial Co., Ltd. and Sony Corporation. screws, and all other exposed metal parts for AC leakage.
• “S-AIR” and its logo are trademarks of Sony Corporation. Check leakage as described below.
• , “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony
Computer Entertainment Inc.
• “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc. LEAKAGE TEST
• DivX®, DivX Certified® and associated logos are registered trademarks of DivX, The AC leakage from any exposed metal part to earth ground and
Inc. and are used under license. (Except for U.S. models.)
• Music and video recognition technology and related data are provided by Grace- from all exposed metal parts to any exposed metal part having a
note®. return to chassis, must not exceed 0.5 mA (500 microamperes.).
Gracenote is the industry standard in music recognition technology and related Leakage current can be measured by any one of three methods.
content delivery. For more information, please visit www.gracenote.com.
CD, DVD, Blu-ray Disc, and music and video-related data from Gracenote, Inc.,
1. A commercial leakage tester, such as the Simpson 229 or RCA
copyright © 2000-present Gracenote. WT-540A. Follow the manufacturers’ instructions to use these
Gracenote Software, copyright © 2000-present Gracenote. One or more patents instruments.
owned by Gracenote apply to this product and service. See the Gracenote website 2. A battery-operated AC milliammeter. The Data Precision 245
for a nonexhaustive list of applicable Gracenote patents. Gracenote, CDDB,
MusicID, MediaVOCS, the Gracenote logo and logotype, and the “Powered by digital multimeter is suitable for this job.
Gracenote” logo are either registered trademarks or trademarks of Gracenote in 3. Measuring the voltage drop across a resistor by means of a
the United States and/or other countries. VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
This appliance is classified as a
CLASS 1 LASER product. This
To Exposed Metal
marking is located on the rear Parts on Set
exterior.

SAFETY-RELATED COMPONENT WARNING!


AC
0.15 μF 1.5 kΩ voltmeter
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE (0.75 V)
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR


LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.

2
HBD-E370/E470/E570/E870/T57
Ver. 1.1

TABLE OF CONTENTS

1. SERVICING NOTES ............................................. 4 5-17. Schematic Diagram - MB-134 Board (11/13) - .............. 45
5-18. Schematic Diagram - MB-134 Board (12/13) - .............. 46
2. DISASSEMBLY 5-19. Schematic Diagram - MB-134 Board (13/13) - .............. 47
2-1. Disassembly Flow ........................................................... 11 5-20. Printed Wiring Board
2-2. Case (EZ) ........................................................................ 11 - MB-134 Board (Component Side) - ............................. 48
2-3. MB-134 Board ................................................................ 12 5-21. Printed Wiring Board
2-4. Bracket (MB) Block........................................................ 13 - MB-134 Board (Conductor Side) - ............................... 49
2-5. Fuse (F901), POWER Board .......................................... 13 5-22. Printed Wiring Board - AUDIO Board - ......................... 50
2-6. Front Panel Block ........................................................... 14 5-23. Schematic Diagram - AUDIO Board - ............................ 51
2-7. CONNECT Board ........................................................... 14 5-24. Printed Wiring Board
2-8. BD Drive (BPX-5) .......................................................... 15 - MAIN Board (Component Side) - ................................ 52
2-9. Back Panel Block ............................................................ 15 5-25. Printed Wiring Board
2-10. MAIN Board ................................................................... 16 - MAIN Board (Conductor Side) - .................................. 53
2-11. AUDIO Board ................................................................. 16 5-26. Schematic Diagram - MAIN Board (1/5) - ..................... 54
2-12. Optical Pick-up Block (KEM-460AAA), 5-27. Schematic Diagram - MAIN Board (2/5) - ..................... 55
Wire (Flat Type) .............................................................. 17 5-28. Schematic Diagram - MAIN Board (3/5) - ..................... 56
5-29. Schematic Diagram - MAIN Board (4/5) - ..................... 57
3. TEST MODE ............................................................ 18 5-30. Schematic Diagram - MAIN Board (5/5) - ..................... 58
5-31. Printed Wiring Board - CONNECT Board - ................... 59
5-32. Schematic Diagram - CONNECT Board -...................... 59
4. ELECTRICAL CHECK ......................................... 27
5-33. Printed Wiring Board - REG Board -.............................. 60
5-34. Schematic Diagram - REG Board - ................................ 61
5. DIAGRAMS 5-35. Printed Wiring Board - FL Board - ................................. 62
5-1. Block Diagram - SERVO Section - ................................ 28
5-36. Schematic Diagram - FL Board - .................................... 63
5-2. Block Diagram - MEMORY Section -............................ 29
5-37. Printed Wiring Board - POWER Board -........................ 64
5-3. Block Diagram - TUNER, S-AIR Section -.................... 30
5-38. Schematic Diagram - POWER Board - .......................... 65
5-4. Block Diagram - AUDIO Section -................................. 31
5-39. Printed Wiring Boards - KEY Section - .......................... 66
5-5. Block Diagram - REGULATOR Section -...................... 32
5-40. Schematic Diagram - KEY Section - .............................. 66
5-6. Block Diagram
- PANEL, POWER SUPPLY Section - ........................... 33
5-7. Schematic Diagram - MB-134 Board (1/13) - ................ 35
6. EXPLODED VIEWS
6-1. Case, Front Panel Section ............................................... 91
5-8. Schematic Diagram - MB-134 Board (2/13) - ................ 36
6-2. MB-134 Board Section ................................................... 92
5-9. Schematic Diagram - MB-134 Board (3/13) - ................ 37
6-3. Back Panel Section ......................................................... 93
5-10. Schematic Diagram - MB-134 Board (4/13) - ................ 38
6-4. MAIN Board Section ...................................................... 94
5-11. Schematic Diagram - MB-134 Board (5/13) - ................ 39
6-5. BD Drive Section (BPX-5) ............................................. 95
5-12. Schematic Diagram - MB-134 Board (6/13) - ................ 40
5-13. Schematic Diagram - MB-134 Board (7/13) - ................ 41
5-14. Schematic Diagram - MB-134 Board (8/13) - ................ 42 7. ELECTRICAL PARTS LIST .............................. 96
5-15. Schematic Diagram - MB-134 Board (9/13) - ................ 43
5-16. Schematic Diagram - MB-134 Board (10/13) - .............. 44 Accessories are given in the last of the electrical parts list.

3
HBD-E370/E470/E570/E870/T57
SECTION 1
SERVICING NOTES
NOTE THE IC101, IC104, IC105, IC204, IC205, IC307,
NOTES ON HANDLING THE OPTICAL PICK-UP
IC311, IC501 AND IC502 ON THE MB-134 BOARD
BLOCK OR BASE UNIT
REPLACING
The laser diode in the optical pick-up block may suffer electro- IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and
static break-down because of the potential difference generated by IC502 on the MB-134 board cannot exchange with single. When
the charged electrostatic load, etc. on clothing and the human body. these parts are damaged, exchange the entire mounted board.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the TEST DISC
repair parts.
Part No. Description Layer
The flexible board is easily damaged and should be handled with
care. J-6090-199-A BLX-104 Single Layer
J-6090-200-A BLX-204 Dual Layer
NOTES ON LASER DIODE EMISSION CHECK J-2501-307-A CD (HLX-A1)
The laser beam on this model is concentrated so as to be focused J-2501-305-A HLX-513 Single Layer (NTSC)
on the disc reflective surface by the objective lens in the optical
J-2501-306-A HLX-514 Dual Layer (NTSC)
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens. J-6090-077-A HLX-506 Single Layer (PAL)
J-6090-078-A HLX-507 Dual Layer (PAL)
UNLEADED SOLDER
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
Boards requiring use of unleaded solder are printed with the lead- 989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with Operation and Display:
the lead free mark due to their particular size)
1. BLX-104
: LEAD FREE MARK Procedure:
Unleaded solder has the following characteristics. 1. Select 23.976Hz/1080p.
• Unleaded solder melts at a temperature about 40 °C higher 2. Play “4.Motion picture”.
than ordinary solder. 3. Check whether player can play back or not.
Ordinary soldering irons can be used but the iron tip has to be 4. Check each outputs.
applied to the solder joint for a slightly longer time. Video:
Soldering irons using a temperature regulator should be set to Composite/S Video/component/HDMI.
about 350 °C. Audio:
Caution: The printed pattern (copper foil) may peel away if Speaker out.
the heated tip is applied for too long, so be careful! * When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
• Strong viscosity can use instead of 1080/24p.
Unleaded solder is more viscous (sticky, less prone to flow) However this is temporary correspondence.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc. 2. BLX-204
• Usable with ordinary solder Procedure:
It is best to use only unleaded solder but unleaded solder may 1. Select 1080i (59.94Hz or 50Hz).
also be added to ordinary solder. 2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
RELEASING THE DISC TRAY LOCK and sound output).
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped. 3. CD (HLX-A1)
Procedure:
Releasing Procedure: Check whether player can play back or not (Check the sound out-
1. Press the [?/1] button to turn on the system. put).
2. Press the [FUNCTION] button to select “BD/DVD”.
3. Press the [x] and [Z] buttons simultaneously and hold down 4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
unit “DEMO OFF” displayed on the fluorescent indicator tube Procedure:
(around 5 seconds). 1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound out-
Note: When “DEMO ON” is displayed, the disc tray lock is not released put).
by turning power on/off with the [?/1] button.
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
ABOUT THE LENS CLEANING
picture and sound output).
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.

4
HBD-E370/E470/E570/E870/T57

CAPACITOR ELECTRICAL DISCHARGE PROCESSING 1. Preparation


When checking the board, the electrical discharge is necessary for 1-1. ESD Countermeasure
the electric shock prevention. It is necessary to confirm the state of static electricity in the work
Connect the resistors referring to the figure below. space before the repair is started.
The static electricity resistance of the BD laser is weaker than that
• MAIN board (C3115, C3125, C3215, C3315, C3415, C3425) of the DVD/CD laser.
Both ends of CN3001. Do work space and worker’s ESD countermeasures to prevent de-
– MAIN Board (Conductor Side) – struction by ESD.

4 1-2. Jig
800 :/2 W 1 • Digital camera (Recommend with macro mode)
CN3001 • USB memory
• PC
• Barcode decoder (Refer to “1-3. Barcode decoder
(BDBUDEC)”)
C3415 C3215 C3115
1-3. Barcode decoder (BDBUDEC)
C3425 C3315 C3125 Part No. : J-6090-212-A
Jig name : BDBUDec.exe
Release : 2009.02.19
• POWER board (C903, C932, C933) Version : 1.0.0.0
Both ends of respective capacitors. Software contents :
– POWER Board (Conductor Side) – • BDBUDec.exe : Barcode decoder software
• SavePath.ini : Decoded file destination setting file (Ini-
tial destination is “C:\BuData.txt”)
800 :/2 W • TasmanBars.dll : Decode dll
• Uninst.exe : Uninstall the “BDBUDec.exe” from PC
C903
Install procedure:
1. Unzip the barcode decoder files to any PC folder.
2. Check the taken barcode photo click & drop onto “BDBUDec.
C932 C933 exe”.
800 :/2 W 800 :/2 W When the barcode decoder is used for the first time, the pass-
word is necessary. It is unnecessary since the second times.

NOTE OF REPLACING THE OPTICAL PICK-UP BLOCK Note 1: The password will be supplied to only service headquarters, and
(KEM-460AAA) OR MB-134 BOARD service center name/q’ty/all of software registered information
Optical pick-up block (KEM-460AAA) for BD requires precise should be maintained by service headquarters.
Note 2: Do not change the decoded file name “BuData.txt”.
read out functions and secure contents protection system for more
than past DVD/CD.
3. When “.NET frame work requirements” is displayed, down-
Therefore, in the case repaired as follows, the writing work of the
load following applications from Microsoft download site.
OP data is necessary.
• Microsoft .NET Framework Version 2.0 Redistributable Pack-
• When the optical pick-up block (KEM-460AAA) is replaced
age (x86)
(The MB-134 board doesn’t replace).
http://www.microsoft.com/downloads/details.aspx?displaylan
• When both the optical pick-up block (KEM-460AAA) and
g=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
MB-134 board are replaced.
• When the MB-134 board is replaced (The optical pick-up block
• Microsoft .NET Framework 2.0 Service Pack 1 (x86)
(KEM-460AAA) doesn’t replace) (In this case, do the work
http://www.microsoft.com/downloads/details.aspx?displaylan
of “3. Optical pick-up block (KEM-460AAA) replacement”
g=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
other than the replacement of new optical pick-up block).

Note: The servo adjustment is done while writing the OP data. The manual
adjustment is unnecessary.
LD ON TIME history doesn’t carry over.
Do not touch any optical block parts, turn table and during replac-
ing. BD laser diode is very sensitive.

5
HBD-E370/E470/E570/E870/T57

2. Pass-fail judgment of the optical pick-up block (KEM-460AAA)


Perform pass-fail judgment to judge whether the repair of the optical pick-up block (KEM-460AAA) is necessary.

2-1. Flow of drive section check

Confirm whether Confirm whether the Confirm PS301 to


NO drive voltage is the NO PS304 on the MB-134
BD (BLX-104) can be
reproduced following values board, and replace it
CN301 pin 2 : 12 V when it has been
CN301 pin 6 : 5 V damaged
YES
YES

Confirm OP FFC cable Confirm whether the Repalece the


(Part No. 1-837-494-11) NO optical pick-up block NO optical pick-up block
and SPDL FFC cable IOP is normal in the (KEM-460AAA)
(Part No. 1-837-495-11), service mode (Refer to “3. Optical
and replace it when it (Refer to “2-2. Flow pick-up block
has been damaged of optical pick-up (KEM-460AAA)
block IOP check”) replacement”)
Then, confirm whether
this set operates
normally

YES

OK
Confirm whether
DVD (HLX-513)/ NO
CD (HLX-A1) can be
reproduced

Note: Refer to “2-12. OPTICAL PICK-UP BLOCK (KEM-460AAA), WIRE (FLAT TYPE)” (page 17) about how to remove the FFC HOLDER (REAR).

2-2. Flow of optical pick-up block IOP check

Turn the power on, Confirm whether Repalece the


value is the NO optical pick-up block
and change function
to “BD/DVD” specification value (Refer to “3. Optical
pick-up block
Specification value: (KEM-460AA)
BD: 6 mA replacement”)
DVD/CD: 9 mA
Press the buttons on
the remote commander YES
in order of [RETURN],
[0], [2], [1] [SUBTITLE],
OK
and enter the service
mode

Press the buttons on


the remote commander
in order of [8], [7], [3],
[ENTER], and the
dIOP value is displayed

6
HBD-E370/E470/E570/E870/T57

3. Optical pick-up block (KEM-460AAA) replacement


Flow of replacement:
Note: The photo in flow is an image.

Save the text data


to USB memory
Barcode label on (memory capacity
new optical pick-up need not be 8GB)
block (KEM-460AAA)
bottom side
Connect USB memory
with rear USB connector
on this set, and read the
text data by the service mode

Take photo (JPEG)


by digital camera

Change photo into


the text data with
the barcode decoder

Procedure: 7. Press the [FUNCTION] button to select “BD/DVD”.


1. Remove the INSULATOR (4 pieces) and broken optical pick- 8. Press the buttons on the remote commander in order of
up block (KEM-460AAA) from LOADING ASSY. [RETURN], [0], [2], [1], [SUBTITLE], and enter the service
2. Take photo of the barcode on new optical pick-up block (KEM- mode.
460AAA) bottom side by digital camera. 9. Press the buttons on the remote commander in order of [8], [1],
[ENTER], and execute “[1] Drive OP data Write”.
10. Turn the power off after writing the OP data.
11. Turn the power on, and enter the service mode again.
12. Press the buttons on the remote commander in order of [8], [7],
[3], [ENTER], and the dIOP value is displayed.
13. Confirm value is the following specification value, and turn the
power off.

Specification value:
BD : 6 mA
DVD/CD : 9 mA
3. Assemble the INSULATOR (4 pieces) to new optical pick-
up block (KEM-460AAA), fix (Torq0ue value: 2 kgf) it to 14. Turn the power on, confirm playback performance of the BD
LOADING ASSY with screw, and assemble this set. (BLX-104)/DVD (HLX-513)/CD (HLX-A1).
4. Drag & drop the taken photo by step 2 to “BDBUDec.exe”, 15. Completely assemble this set, and complete the repair.
and make the text data (File name: BuData.txt).
5. Save the text data to USB memory.
6. Connect USB memory with rear USB connector on this set,
and turn the power on.

Rear USB connector

7
HBD-E370/E470/E570/E870/T57
Ver. 1.1

NOTE THE BD DRIVE (BPX-5) PARTS REPLACING MODEL IDENTIFICATION


– Rear Chassis –
The mechanism blocks except optical pick-up block of BD drive
(BPX-5) are chiefly composed of the following parts.
• CHUCK HOLDER ASSY Part No.
• LOADING ASSY
• HOLDER, FFC (REAR)

These parts are produced by two venders, it is not compatible. Model Part No.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
E370: AEP and UK models 4-161-684-1[]
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time. E370: Latin American models 4-161-684-2[]
E370: US model 4-161-685-1[]
HOLDER FFC (REAR) need not be exchanged at the same time. E370: Canadian model 4-161-685-2[]
E370: Russian model 4-161-685-3[]
Note: The laser caution label is not pasted to LOADING FOR SERVICE
(Part No. A-1750-926-A). Please peel off an original laser caution E370: Singapore model 4-161-685-4[]
label, and paste it to LOADING FOR SERVICE when you use E370: Thai and Australian
LOADING FOR SERVICE. 4-161-685-5[]
models

LASER CAUTION LABEL E370: Taiwan model 4-161-685-7[]


E370: Mexican model 4-161-685-8[]
LOADING FOR SERVICE E470: Canadian model 4-161-686-1[]
E570: US model 4-161-684-3[]
E870: Canadian model 4-161-684-5[]
CHUCK HOLDER ASSY
E870: AEP and UK models 4-161-686-5[]
E870: Russian model 4-161-686-6[]
E870: Australian model 4-161-686-7[]
E870: Taiwan model 4-161-686-8[]
LOADING ASSY T57: US model (for Costco) 4-161-686-0[]

NOTE OF REPLACING THE THE IC3100, IC3200 AND


IC3400 ON THE MAIN BOARD AND THE COMPLETE
MAIN BOARD
When IC3100, IC3200 and IC3400 on the MAIN board and the
complete MAIN board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-
221-A ) between parts and heat sink.
Spread the compound referring to the figure below.
HOLDER, FFC (REAR)
– MAIN Board (Component Side) –

IC3100 IC3200 IC3400

IC3100 IC3200 IC3400

8
HBD-E370/E470/E570/E870/T57

NOTE OF REPLACING THE D913, D931, IC901 AND IC921 ON THE POWER BOARD AND THE COMPLETE
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the figure below.

IC901
D913

– POWER Board
(Component Side) – HS901

HS921

IC901 D913 IC921

HS931

D931

IC921

D931

9
HBD-E370/E470/E570/E870/T57

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF


Note 1: After the case is removed, this mark is done.
Note 2: Please prepare the thin wire (clip etc.).

1 Remove the case.


(Illustration of disassembly is omitted.)

clip etc.

3
tray

PROCESSING OF HARNESS (USB)

– Top view –

Note: There is a set that does not use clamp


installed in MB-134 board either.

10
HBD-E370/E470/E570/E870/T57
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.

2-1. DISASSEMBLY FLOW

SET

2-2. CASE (EZ)


(Page 11)

2-3. MB-134 BOARD 2-6. FRONT PANEL BLOCK 2-7. CONNECT BOARD
(Page 12) (Page 14) (Page 14)

2-4. BRACKET (MB) BLOCK


(Page 13)

2-8. BD DRIVE (BPX-5)


(Page 15)

2-12. OPTICAL PICK-UP


BLOCK (KEM-460AAA),
WIRE (FLAT TYPE)
(Page 17)

2-5. FUSE (F901), 2-9. BACK PANEL BLOCK


POWER BOARD (Page 15)
(Page 13)

2-10. MAIN BOARD 2-11. AUDIO BOARD


(Page 16) (Page 16)

Note: Follow the disassembly procedure in the numerical order given.

2-2. CASE (EZ)

6 case (EZ)
3

1 four screws
(BV3)

5 seven hooks
3

2 five screws
(BV/RING)

– Bottom view –

11
HBD-E370/E470/E570/E870/T57

2-3. MB-134 BOARD

9 screw (BV3) 0 clamp


Note: There is a set not used either.
9 four screws (BV3)

qd MB-134 board

4 wire (flat type) (18 core)


6 wire (flat type) (45 core) (CN902)
(CN1401)

7 wire (flat type) (9 core) 5 wire (flat type) (16 core)


(CN2460) (CN901)
8 wire (flat type) (5 core)
(CN2470)
qa screw (B3 u 5)
2 two connectors
(CN601, CN602) qs two screws (BV3)

1 connector (CN303)

3 wire (flat type) (27 core)


(CN1505)

12
HBD-E370/E470/E570/E870/T57
Ver. 1.1

2-4. BRACKET (MB) BLOCK

8 three screws (BV3) 1 power cord connector


(CN901)

3 power-supply cord (US, CND, MX, TW)


power cord (except US, CND, MX, TW)

8 two screws (BV3)

9 bracket (MB) block

5 connector (CN400)

7 screw 2 cord bush (2104) (except TH)


(BV3) cord bushing (TH)
6 screw (P3 u 6)

4 connector (CN403)

2-5. FUSE (F901), POWER BOARD

9 fuse label (T. H)


(EXCEPT US, CND, MX, TW)
7 eight screws
0 POWER board (BV3)
1 glass fuse (DIA. 5) (8A/125V)
(F901) (US, CND, MX, TW)
fuse (H. B. C.) (T5AH/250V)
4 bracket R (MB foot) (F901) (AEP, RU, UK, SP, TH, AUS)
fuse (H. B. C.) (T6.3AH/250V)
(F901) (E32)
6 connector 2 screw (BV3)
(CN17) 5 connector
(CN904)
3
• Abbreviation
AUS : Australian model
CND : Canadian model
E32 : Latin American models
MX : Mexican model
RU : Russian model
SP : Singapore model
TH : Thai model
TW : Taiwan model

8 Remove the POWER board


from PC board holder.

13
HBD-E370/E470/E570/E870/T57

2-6. FRONT PANEL BLOCK

Note: Please prepare the thin wire (clip etc.).

5 three screws
(BV3)

6 three ground plates (front)

7 three screws
(BV3)
q; connector
9
(CN700)

8 three claws

2 qa front panel block


8 two claws

7 three screws
(BV3)
1 8 three claws
3 claw 3 three claws
clip etc.
4 loading panel assy
(10EZ)

2-7. CONNECT BOARD

3 four screws
(BV3)

5 CONNECT board 1 connector (CN301)

4
2 wire (flat type) (15 core)
(CN300)
four claws

14
HBD-E370/E470/E570/E870/T57
Ver. 1.1

2-8. BD DRIVE (BPX-5)


5 three screws (BV3)

0 four screws (BV3) 6 bracket (S-AIR UME)


qs sound sheet

qd BD drive (BPX-5)

1 screw (BV3)

7 screw (BV3) 3 bracket L (MB foot)

qa
9 bracket 2
(S-AIR foot) 4 screw (BV3)

2-9. BACK PANEL BLOCK

2 three screws (BV3)

3 bracket (S-AIR UME)

7 screw (BV3)

4 wire (flat type) (9 core)


(CN10) (except AEP, RU, UK) 1 screw (BV3)
wire (flat type) (11 core) 6 screw (BV3)
7 screw (BV3)
(CN11) (AEP, RU, UK)
7 two screws (BV3)

7 screw (BV3)

5 fan connector
(CN3000) 7 screw (BV3)

8 back panel block

• Abbreviation
RU : Russian model

15
HBD-E370/E470/E570/E870/T57
Ver. 1.1

2-10. MAIN BOARD


8 wire (flat type) (15 core)
(CN702)
9 wire (flat type) (18 core) q; wire (flat type) (16 core)
(CN701) (CN703)
7 wire (flat type) (15 core) (CN504) (except AEP, RU, UK) qa four screws
wire (flat type) (17 core) (CN502) (AEP, RU, UK) (BV3)
qd six screws
(BV3) qs heat sink
(S-master DDV)

5 wire (flat type) (27 core) qd two screws


(CN505) (BV3)

qf MAIN board
1 screw
6 wire (flat type) (15 core) (BV3)
(CN508)

4 connector
2 (CN904)

3 bracket R
(MB foot)

• Abbreviation
RU : Russian model

2-11. AUDIO BOARD

6 three screws (BV3)

7 AUDIO board

1 screw (BV3)
4 connector
3 bracket L (MB foot) (CN17)

5 wire (flat type) (15 core) (CN13) (except AEP, RU, UK)
2 wire (flat type) (17 core) (CN15) (AEP, RU, UK)

• Abbreviation
RU : Russian model

16
HBD-E370/E470/E570/E870/T57

2-12. OPTICAL PICK-UP BLOCK (KEM-460AAA), WIRE (FLAT TYPE)

Note: Please prepare the thin wire (clip etc.).

4 chuck holder assy (D)


1 two screws 3 two claws
(BVTP 2.6)

2 two claws

qa insulator
7 two float screws (S) qs optical pick-up block qh ffc holder (rear)
(KEM-460AAA)
qk wire (flat type)
(45 core)

qa insulator
qa insulator 9 qg
8
5 Insert the thin 0
wire (clip etc.).
qd non-halogene tape
qf wire (flat type) (5 core)
qj wire (flat type)
(9 core)

qa insulator

6
loading assy (D)

– Bottom view –

‡,QVWDOODWLRQRIZLUH IODWW\SH  FRUH DQGZLUH IODWW\SH  FRUH


Note: This illustration sees the loading assy (D) from bottom side.

1 wire (flat type) (45 core)


3 wire (flat type) (9 core)

4 Through the hole.


Fold.

2 Through the hole. 7 two claws


5 ffc holder (rear)

7 three claws
boss
terminal face 6

Under the guide.


terminal face
loading assy (D)

Under the guide.


(Fold area)
boss

17
HBD-E370/E470/E570/E870/T57
SECTION 3
TEST MODE
COLD RESET AMP TEST
The cold reset clears data except BD/DVD data stored in the RAM Procedure:
to initial conditions. Execute this mode when returning the set to 1. Press the [?/1] button to turn the power on.
the customers. 2. Press button in order of the [RETURN] → [0] → [1] → [1]
Procedure: → [SUBTITLE] on the remote commander (Make the interval
1. Press the [?/1] button to turn the power on. when each button is pressed within two seconds).
2. Press the [x] and [VOLUME –] buttons simultaneously and 3. The message “MEASURE” appears on the fluorescent indica-
hold down (around 5 seconds). tor tube and enter the AMP test mode.
3. The message “COLD RESET” appears on fluorescent indica- 4. Press the [BLUE] button on the remote commander, the state
tor tube, then becomes standby states. of D.C.A.C. microphone is displayed on the fluorescent indica-
tor tube.
DEMO MODE
This mode let you lock the disc tray. When this mode is activated, *** @@ $$$
the disc will not eject when the [Z] button is pressed. The message
“LOCKED” will be displayed on the fluorescent indicator tube. *** : Either of “IN”/“NON” is displayed by the state of
Procedure: detection of the microphone.
1. Press the [?/1] button to turn the power on. @@ : Either of “OK”/“NG” is displayed by the state of
2. Press the [FUNCTION] button to select the “BD/DVD”. digital audio data input.
3. Press the [x] and [Z] buttons simultaneously and hold down $$$ : Microphone input audio data A/D value (0 – 255).
until “DEMO ON” or “DEMO OFF” displayed on the fluores-
cent indicator tube (around 5 seconds). 5. Press the [MUTING] button on the remote commander, “VOL
N” (The change in the volume is usual)/“VOL MSM” (The
S-AIR ID SETTING CHANGE change in the volume is a switch of MIN/1/20/MAX) can be
Procedure: switched.
1. Press the [?/1] button to turn the power on. 6. Press the [SUBTITLE] button on the remote commander, the
2. Press the [FUNCTION] and [VOLUME +] buttons simultane- message “VACS ON” or “VACS OFF” appears on the fluores-
ously and hold down (around 5 seconds). cent indicator tube and thus the VACS on/off are changed.
3. S-AIR ID setting is changed (A → B → C → A...). 7. To release from this mode, press the [?/1] button.

PANEL TEST BD SERVICE MODE


Procedure: Note: The operation in this mode must use a remote commander.
1. Press the [?/1] button to turn the power on.
2. Press button in order of the [RETURN] → [0] → [0] → [1] Setting method of the BD service mode:
→ [SUBTITLE] on the remote commander (Make the interval 1. Press the [?/1] button to turn the power on.
when each button is pressed within two seconds). 2. Press button in order of the [RETURN] → [0] → [2] → [1] →
3. All segments in fluorescent indicator tube are lighted up. And [SUBTITLE] on the remote commander. (Make the interval
half segments in fluorescent indicator tube are lighted up, oth- when each button is pressed within two seconds)
ers half segments in fluorescent indicator tube are lighted up, 3. Enter the BD service mode.
then all segments in fluorescent indicator tube are lighted up.
This operation is repeated. 1. Main Functions
4. When all segments in fluorescent indicator tube are lighted up • ErrorLog display
in the state of step 3, press the [VOLUME +] button on the Display the error log. Displayed contents can also be saved in
remote commander and model information is displayed on the an USB memory device.
fluorescent indicator tube. • Diag
Each time the [VOLUME +] button on the remote commander Performs unit test of devices installed on the board.
is pressed, the display changes from destination information, • Factory Initialize
STR version, SYS version, UI version, BDLIB version, ST Restores the set to its factory settings.
version, TA version, DSP version, TM version, CEC version, • Network
SAIR version, PF version in this order, and returns to the mod- Checks the wired network connection.
el information display. • Version Up (version update)
Each time the [VOLUME –] button on the remote commander Not used.
is pressed, the version and date are switched. • System Information
5. In the state of step 3, press the [FUNCTION] button on the Displays the system information of the set.
remote commander and “K 0” is displayed on the fluorescent Displays information such as the software version, drive infor-
indicator tube. mation, etc.
“K 0” value increases whenever a button on the set is pressed. • EMC Test Mode
However, once a button has been pressed, it is no longed taken Not used.
into account. • Drive
All buttons on the set are pressed, “OK” and “K 7” are alter- Write drive OP data and check drive.
nately displayed on the fluorescent indicator tube.
6. To release from this mode, press the [?/1] button.

18
HBD-E370/E470/E570/E870/T57

2. Menu Tree

Service
Service Mode
Mode Menu
Menu Diag Device Test
[1]
[1] Diag
Diag ‡'LDJ7HVW ‡86%'$&,)FRQWHVW
[2]
[2] Log
Log
[3]
[3] Factory
FactoryInitialize
Initialize
[4] Network
[4] Network Video Test
[5] Version Up
[5] Version Up ‡Video output test
[6]
[6] System
System Information
Information
[7] EMC Test Mode
[8] Drive
$udio Test
‡$udio output test

$udio Input Test


‡$XGLR,QSXW7HVW

:LUHOHVV/$17HVW
‡Not used

Log Error Log


Displays Error Log ‡Displays error log

Factory Initialize Start Initialize


‡5Hstores set to factory settings ‡,QLWLDOL]HGHIDXOWVHWWLQJIRU%'SOD\HU

Start Initialize for TV


‡1RWXVHG

Network Ifconfig
‡1Htwork diagnosis for wired ‡View network status

Ping
‡&RQILUPQHWZRUNFRQQHFWLRQ

Version Up
‡Not used

System Information
‡Displays system information

EMC Test Mode


‡Not used

Drive
‡Write drive OP data and check drive

19
HBD-E370/E470/E570/E870/T57

3. Service Mode Menu (Top Menu) • Device Test: List of devices


This is the top menu of service mode. USB Host (*1)
Each function is accessed from this screen.
*1) USB media check (front and rear). Only one time.
Operation: * For details concerning device test, see the Diag reference.
[1] Moves to Diag screen
[2] Moves to Log screen Diag
[3] Moves to Factory Initialize screen
[4] Moves to Network screen Category: Device Test

[5] Moves to Version Up (DISC version update) screen (Not


used) Diag
[6] Moves to System Information screen
Category: Device Test
[7] Moves to EMC test mode screen (Not used) Device: USB Host
[8] Moves to Drive screen
[M]/[m] Moves the cursor Rear USB Media check ... OK
Front USB Media check ... OK
[3] Moves to the screen of the item selected with the cursor
Checking...
* Cursor is not displayed when the menu is first displayed.
(Screen 1)
Service Mode Menu

[1]
[1]Diag
Diag
[2] Log HELP: [RIGHT] [UP] [ENT] [RET]
[3] Factory Initialize (Screen 2)
[4] Network
[5] Version Up
[6] System Information 5. Diag (Video/Audio Test)
[7] EMC Test Mode
[8] Drive
This screen performs video and audio tests.

Screen 1: When video test category is selected


Operation:
[3] Shows/hides the color bar
[M]/[RETURN] Returns to the selection of test category
HELP : [DOWN] [ENT] [(NUM)]

Screen 2: When audio test category is selected


Operation:
[3] Plays back/stops the tone sound
HELP (currently available keys, etc.) is displayed [M]/[RETURN] Returns to the selection of test category

4. Diag (Device Test) • Video test:


This screen is used to test devices mounted on the board. Outputs a color bar (composite & component & HDMI).

Screen 1: Selects the test category • Audio test:


Operation: TONE sound output (speaker (8 ch) & HDMI (2 ch)).
[<]/[,] Selects the category
[m]/[3] Moves to the selected category
Diag

Screen 2: Device test Category: Video Test


Selects the device to test after selecting Device Test in screen 1.
Operation:
[<]/[,] Selects the device to test
[ENT] Show Color Bar
[3] Executes the test
[M] Returns to selection of test category
Diag
• List of test categories
Device Test Category: Audio Test
Video Test HELP: [UP][ENT][RET]
Audio Test (Screen 1)
Audio Input Test
[ENT] Generate TONE Sound
Wireless LAN Test (not used)

HELP: [UP] [ENT] [RET]


(Screen 2)

20
HBD-E370/E470/E570/E870/T57

6. Diag (Audio Input Test) 8. Log: Error Log (Output of each Log)
This screen performs audio input test. This screen displays the contents of each log.
Note: Do not refer to the displayed date.
Screen 1: Selects the test category
Operation: Screen 1: Selects log
[<]/[,] Selects the category Operation:
[m]/[3] Moves to the selected category [1]/[3] Moves to the Error Log output screen
[RETURN] Returns to the top menu of the service mode
Screen 2: Select Audio Input Test
Operation: Screen 2: Displays the Error Log
[M]/[m] Select test Operation:
[3] Start/stop input sound [ <] Returns to the previous page
[RETURN] Returns to the selection of test category [ ,] Moves to the next page
[RETURN] Returns to the screen (screen 1) that selects the log
• Digital Input type
Input : SPDIF (optical, 48 kHz, 2 ch only). [RED] Writes the log contents to an USB memory device
Sound output : Speaker (2 ch).
• Viewing the log display
• Analog Input Error Log:
Input : Line In (2 ch). 001 08/01/01 00: 53: 19: [ErrCode: 080400000000]
Sound output : Speaker (2 ch). [Number (starting from old log) ] [date] [time] [error code]

About copying log to USB memory device:


Diag Press the [RED] button in each log display screen with the USB
Category: Audio Input Test
memory device inserted into the set
Note: Please do not press the [RED] button immediately after USB mem-
ory is inserted.
Please do not pull out USB memory immediately after the [RED]
Diag button was pressed.
Category: Audio Input Test
Error Log:
Device: Digital Input When “getErrLogFile.trm file” exists in the USB memory de-
Analog Input
vice, errlog.log file is output.
[ENT] Start Input Sound

HELP: [UP][ENT][RET] Select Log


(Screen 1)
[1] Error Log

HELP: [UP] [ENT] [RET]


(Screen 2) Error Log

001 08/01/01 00: 53: 19: [ErrCode: 080400000000]


7. Diag (Wireless LAN Test) 002 08/01/01 00: 53: 45: [ErrCode: 080400252100]
003 08/01/01 00: 54: 00: [ErrCode: 080400005555]
This screen performs wireless LAN test.
:
Note: Not used for the servicing. :

HELP : [DOWN][ENT][(NUM)]
(Screen 1)

(Screen 2)

21
HBD-E370/E470/E570/E870/T57

9. Factory Initialize (Factory Settings) 10. Network (Network Test Diagnosis Screen: Ifconfig)
Return all of the player setting to their factory defaults. Network menu for the wired ethernet.

Operation: Screen 1: Ifconfig Test


Screen 1 Operation:
Press the [1] button in this screen when restoring the set to its fac- [3] Activate Ifconfig (Display network setting)
tory settings. [,] Select ping test
All saved titles will also be deleted. [RETURN] Returns to the top menu of the service mode
[1] Start Factory Initialize
[2] Start Factory Initialize for TV (Not used) Screen 2: Ping Test
[M]/[m] Moves the cursor Operation:
[3] Activate the selected cursor [<] Select Ifconfig test
[RETURN] Returns to the top menu of the service mode [RETURN] Returns to the top menu of the service mode
(The details of a Ping test are “11. Network (Network Test Diagno-
Screen 2 sis Screen: Ping)”)
It is a screen of the end of initialization.
[RETURN] Returns to the top menu of the service mode Screen 3: Ifconfig Test Active
Display Ifconfig command results.
To complete factory initialize, process COLD RESET subsequent- Operation:
ly. [3] Ifconfig retry
Please disconnect AC power cord, and connect AC again. Then [,] Select ping test
press the [?/1] button to turn the power on, and press the [x] and [RETURN] Returns to the top menu of the service mode
[VOLUME –] buttons simultaneously and hold down (around 5
seconds) to execute COLD RESET. Network

Test: Ifconfig Ping


Remove the AC power cord and insert the AC power cord again.
* Operations in other service menus can also be performed.
Network

Factory Initialize Test: Ifconfig Ping


[1] Start Initialize Ping To:
[2] Start Initialize for TV [START]

[RET] Return to Top Menu Network

HELP : [DOWN][ENT][(NUM)]
Test: Ifconfig Ping
(Screen 1)
Factory Initialize
IP 192. 168. 11. 2 MAC 00-16-01-85-21-A3

Reboot to complete. HELP : [DOWN][ENT][(NUM)]


(Screen 2)

(Screen 1) [RET] Return to Top Menu

HELP : [ENT]: Re/Exe [RIGHT]


(Screen 3)

HELP: [RET]
(Screen 2)

22
HBD-E370/E470/E570/E870/T57

11. Network (Network Test Diagnosis Screen: Ping) Screen 2: Drive Information Menu
Ping test for the wired ethernet. Operation:
[<] Basic Information displayed (go to screen 1)
Screen 1: Ping Test [RETURN] Returns to the top menu of the service mode
Operation:
[<] Select Ifconfig test When delta IOP is measured, it becomes impossible to use the Ver-
[m] Ping execution preparation sion Up function.
[RETURN] Returns to the top menu of the service mode
Contents List:
Screen 2: The IP address of the Ping point is set up Model
(IP address input mode) Destination
When “Ping to :>” is reversed, the [3] button is pressed and IP is Sequence Number
inputted. MAC
Operation: IP
[3] Finish to input IFCON IFCON Version
[RETURN] Finish to input Bootloader Bootloader Version
[<] Finish to input and Select Ifconfig Test Host Main Host Main Version
[0] to [9] Input Character sting ‘0-9’ Host Sub Host Sub Version
[TIME] Input Character sting ‘.’ Middleware Middleware Version
[CLEAR] Backspace ADSP ADSP Version
IF Model
Screen 3: Ping Test Active IF Dest
When [START] is reversed, the [3] button is pressed and execute
ping . Drive Firm Revision
Operation: CD DIOP Delta IOP
[3] Activate ping test DVD DIOP Delta IOP
[M] The IP address of the ping point is set up BD DIOP Delta IOP
[RETURN] Returns to the top menu of the service mode CD LD TIME LD Time
DVD LD TIME LD Time
Network BD LD TIME LD Time
Test: Ifconfig Ping (Screen 1)
Ping To :
System Information
[START]
Model :
Network Destination :
Sequence Number :
Test: Ifconfig Ping MAC :
Ping to :> 192. 168. 200. 13 IP :
IF-con Block0 Version : Block1 Version :
[ENT] : Release
Bootloader Version :
[RET] : Release Host Main Version :
Host Sub Version :
Network Middleware Version :
(Screen 1) ADSP Version :
Test: Ifconfig Ping
Ping to : 192. 168. 200. 13
[START]
IF_MODEL :
PING 192. 168. 200. 13 OK! IF_DEST :
HELP: [RET] [RIGHT]
(Screen 2)

(Screen 2)

System Information

Drive Firm Revision :


CD DIOP :
HELP: [ENT] : Start [UP] [LEFT]
(Screen 3) DVD DIOP :
BD DIOP :
CD LD TIME :
DVD LD TIME :
BD LD TIME :
12. System Information (System Information Display)
This screen displays system information.

Screen 1: Basic Information


Operation:
[,] Drive information (delta IOP of a drive is measured)
displayed (go to screen 2)
[RETURN] Returns to the top menu of the service mode HELP: [RET] [LEFT]

23
HBD-E370/E470/E570/E870/T57

13. Drive Screen 3: *Drive OP data Write


This menu is used to operate the drive using drive-related diagnos- Purpose: Write OP data into flash IC
tic and tools. [M]/[m] Move the cursor up and down
[3] Start the selected cursor item
Screen 1: Selecting items under *Service Menu [RETURN] Returns to the top menu of the service mode
(Screen 1) (Screen 3)

Service Menu Drive OP data Write


[1] Diag Insert USB StorageDevice...
[2] Log Remove DISC and Close tray.
[3] Factory Initialize [1]Disc: Eject
[4] Network [ENT] Start
[5] Version Up
[6] System Information
[7] EMC Test Mode
[8] Drive

Screen 2: Selecting items under *Drive Screen 4: *Servo Parameter Check Menu (Not Used)
(Screen 2) (Screen 4)

Drive
Servo Parameter Check Menu
[1]Drive OP data Write [1] Disc: Eject
[2]Servo Parameter Check Menu [2] Show Parameters
[3]Servo Signal Check Menu
[4]S - Curve Check Menu
[5]Readability Check Menu
[6]OP Position Check Menu
[7]OP Check Menu
[8]Load Eject Aging
[9]Spindle Control Check Menu
[10]FA Test Mode

Operation: Not used for the servicing.


[M]/[m] Move the cursor up and down Press the [RETURN] button if having entered this mode.
[3] Open the selected cursor item
[RETURN] Returns to the top menu of the service mode Screen 5: *Servo Signal Check Menu (Not Used)
(Screen 5)
• Test item list
[1] Drive OP data Write
Servo Signal Check Menu
[2] Servo Parameter Check Menu [1] Disc: Eject
[3] Servo Signal Check Menu [2] Servo Signal Monitor out: OFF
[3] RTADJ: OFF
[4] S-Curve Check Menu [4] FocusBias: 0000
[5] Readability Check Menu [5] SA -Act.move: FWD 00 step
[6] OP Position Check Menu
[6] Pl Level: 0000
[7] OP Check Menu [7] RF Level: 0000
[8] Load Eject Aging [8] TRV Level: 0000
[9] Spindle Control Check Menu [9] Current FB: 0000 SA: 0000

[10] FA Test Mode

Not used for the servicing.


Press the [RETURN] button if having entered this mode.

24
HBD-E370/E470/E570/E870/T57

Screen 6: *S-Curve Check Menu (Not Used) Screen 9: *OP Check Menu
(Screen 6) Purpose: Verify OP related such as delta IOP and LD time
[M]/[m] Move the cursor up and down
[3] Start the selected cursor item
S - Curve Check Menu
[1] Disc: Eject [RETURN] Returns to the top menu of the service mode
(Screen 9)
[2] Media Type: BD - ROM SL
[3] Layer: L0
[4] SLD move to Home
OP Check Menu
[5] SLD move: FWD 00 step
Remove DISC and Close tray
[1] Disc Eject
[6] FCS Search start
[2] OP Serial: xxxxxxxxxxxxxx
[3] dIOP
BD: x[xx]
DVD: x[xx]
CD: x[xx]
TEMP: xx.x deg
[4] LD ON Time
BD: xxxxh xxm
DVD: xxxxh xxm
CD: xxxxh xxm

Not used for the servicing.


Press the [RETURN] button if having entered this mode

Screen 7: *Readability Check Menu (Not Used)


(Screen 7) Screen 10: *Load Eject Aging (Not Used)
(Screen 10)
Readability Check Menu
[1] Disc: Eject Load Eject Aging
[1] Disc: Eject
[2] Address: 00000000 [2] Repeat set: 00000
[3] Length: 0000 [3] Mecha type: Tray mecha
[4] Aging type: Normal
[4] Execute
Jitter P: 0000 [5] Start
Jitter PR: 0000
Jitter DC: 0000
SER: 0000 0000

Not used for the servicing.


Press the [RETURN] button if having entered this mode. Not used for the servicing.
Press the [RETURN] button if having entered this mode.
Screen 8: *OP Position Check Menu (Not Used)
(Screen 8) Screen 11: *Spindle Control Check Menu (Not Used)
(Screen 11)
OP Position Check Menu
[1] Disc: Eject Spindle Control Check Menu
[1] Disc : Eject
[2] OP Position Check
[2] rpm: 0000 rpm

[3] Spindle: OFF

Not used for the servicing.


Press the [RETURN] button if having entered this mode. Not used for the servicing.
Press the [RETURN] button if having entered this mode.

25
HBD-E370/E470/E570/E870/T57

Screen 12: *FA Mode Test (Not Used) 3. CD (HLX-A1)


(Screen 12) Procedure:
Check whether player can play back or not.
(Check the sound output)
FA Mode Test
[1] Enter Repeat FA mode
Repeat number: 0000 4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
[2] Save FE log to USB
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%”.
(Check the picture and sound output)
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9”.
(Check the picture and sound output)

1-2. Playback operation confirmation


Confirm operation in each signal/output mode of test disc (BLX-
104/204) according to the content of the repair.
Note: “AV Sync.” doesn’t operate.

Not used for the servicing. 2. Networking Confirmation


Press the [RETURN] button if having entered this mode. Confirm it according to the following procedure when you confirm
the connection of the network.
CONFIRMATION ITEM Note: Do not execute “Network Connection Diagnostics” of “Network
1. Playback Operation Confirmation Settings” of the home menu with only the router connected.
1-1. Test Disc
Part No. Description Layer Procedure:
1. Connect the router with the set with LAN cable.
J-6090-199-A BLX-104 Single Layer
2. Turn on the power of the set and the router.
J-6090-200-A BLX-204 Dual Layer 3. Press the [HOME] button on the remote commander, and the
J-2501-307-A CD (HLX-A1) home menu is displayed.
J-2501-305-A HLX-513 Single Layer (NTSC) 4. Select “Setup” → “Network Settings” → “Internet Settings”,
and press the [3] button on the remote commander.
J-2501-306-A HLX-514 Dual Layer (NTSC)
5. Select “View Networks Status” and press the [3] button on the
J-6090-077-A HLX-506 Single Layer (PAL) remote commander.
J-6090-078-A HLX-507 Dual Layer (PAL) 6. Confirm IP address are displayed in “IP Address”, “Subnet
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883- Mask” and “Default Gateway”.
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Physical Connection: XXXX
Operation and Display:
Internet Access: XXXX
1. BLX-104 IP Address Setting: XXXX
Procedure:
IP Address: XXX.XXX.XXX.XXX
1. Select 23.976Hz/1080p.
2. Play “4.Motion picture”. Subnet Mask: XXX.XXX.XXX.XXX
3. Check whether player can play back or not. Default Gateway: XXX.XXX.XXX.XXX
4. Check each outputs. DNS Settings: XXXX
Video:
Primary DNS: XXX.XXX.XXX.XXX
Composite/S Video/component/HDMI.
Audio: Secondary DNS: XXX.XXX.XXX.XXX
Speaker out. MAC Address: XXX.XXX.XXX.XXX
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
* When the output of HDMI is 1080p, the signal of Composite/S
Video/Component are not output.
It is necessary to lower the output of HDMI to 1080i or less.

2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
(Check the picture and sound output)

26
HBD-E370/E470/E570/E870/T57
SECTION 4
ELECTRICAL CHECK
FM TUNER LEVEL CHECK

signal
generator
set

Procedure:
1. Turn on the set.
2. Input the following signal from Signal Generator to FM antenna
input directly.

Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz


Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)

Note: Use 75 ohm coaxial cable to connect signal generator and the set.
You cannot use video cable for checking.
Use signal generator whose output impedance is 75 ohm.

3. Set to FM tuner function and tune A, B and C signals.


4. Confirm “TUNED” is lit on the display for A, B and C signals.

When the selected station signal is received in good condition,


“TUNED” is displayed.

HBD-E370/E470/E570/E870/T57
27 27
HBD-E370/E470/E570/E870/T57
SECTION 5
DIAGRAMS
5-1. BLOCK DIAGRAM - SERVO Section -

9,'(2$03
%''5,9( ,& -
%3;
'$&287 ' 1 9LQ 9RXW 15 9,'(2287
%'B5) < )(B5),3 '$&287 & 7 3<LQ
3<RXW 10 <
%'B5) < )(B5),1 '$&287 % 5 3ELQ
%''(&2'(5
,&  '$&287 $ 3 3ULQ 3ERXW 11 3%&% &20321(17
'9'B5) W1 )(B5),3 9,1' *  6'+' 9,'(2287
'9'B5) W3 )(B5),1 9,1' + 8 0XWH 3URXW 13 35&5

% 3 )(B,1$
$ 1 )(B,1%
' 5 )(B,1&
& 7 )(B,1' 70'6'$7$ 7
)(B03;287 / . 16B5),3 &+B3 '
* V6 )(B,1( 70'6'$7$± 9
)(B03;287 . + 16B5),1 &+B0 %
H 8 )(B,1) 70'6'$7$ 
)(B*,2 ( ) 16B&.,1 &+B3 &
( 5 )(B,1* 70'6'$7$± 6
&+B0 $
) 7 )(B,1+ 70'6'$7$ 1
&+B3 '
70'6'$7$± 3
&+B0 %
6',2 $' )(B&)5(4 70'6&/2&. 10 &1
&/.B3 &
6&/. $( )(B262(1 70'6&/2&.± 12
&/.B0 $ +'0,
6(1B/'' $) )(B&02' $5&287
&1 6&/ 15
7(67B9 7 )(B)3'2'9' +'0,6&. )
6'$ 16
9&B3' - )(B+$9& +'0,6' (
7+(502 0 )(B$8;
6$B,1,7 / )(B9'$& 3 $0 86%B'3 +3' 19
+73/* *
02'(B$ - )(B*,2 2 $/ 86%B'0
02'(B% - )(B*,2 5(6(59(' $5& 
02'(B& * )(B*,2
&1
/'(1 * )(B*,2 13
%8))(5 &(&
02725'5,9(5 4
,& 3 $/ 86%B'3
2 $. 86%B'0 &(&
% 52 6/('B3 96/(' 16 $) )(B)02
% 53 6/('B1 96/(' 17 $( )(B)02 :$9(
$ 55 6/('B3 963,1 18 $) )(B'02 6+$3(5 $5&B63',)
$ 56 6/('B1 9/2$' 19 $( )(B75$<3:0 ,&
975. 20 $+ )(B752 &1
(7+(51(7 0&,1 ) '$7$B,
W  8 9)&6 21 $' )(B)22
&211(&725
V  V 97/7 22 $0 )(B7/2 (7+(51(7,17(5)$&(
/$1  ,& ,5 % ',5B(5525
8  W
&20021  0&20 ;)* 11 * )(B)* 9,1' ( &6,B'$7$,1
021,725 12 $* )(B/,0,7 6 28 7;1 7;' 23 & (77;' 9,1' ' &6,B'$7$287
/2$' 32 /2$'B3 ;087( 13 $' )(B*,2 5 29 7;3 7;'  ' (77;' 9,1' $ &6,B&/.
/2$' 33 /2$'B1 ;087(  $* )(B*,2 2 31 5;1 7;' 26 ' (77;' 9,1' ) &6,B;&6B',5
*& 15 $' )(B*$,16: 1 32 5;3 7;' 27 ( (77;' 9,1' ( ',5B;67$7(
75 29 75.B3 9,1' $ ',5B&6)/$*
7' 30 75.B1 5;' 18 $ (75;' 9,1' * ',5B$8',2 $ (Page 31)
5;' 17 % (75;' 9,1' % ',5B;567
)' 27 )&6B3 5;' 16 & (75;'
)5 28 )&6B1 5;' 15 $ (75;' 63'$7$ * 63B'$7$
630&/. & 63B0&.
)'  7/7B3 0',2  % (70',2 63%&. $ 63B%&.
)5 25 7/7B1 0'& 2 ) (70'& 63/5&. % 63B/5&.
7;&/. 22 & (77;&/.
5;B&/. 20 $ (75;&/. $26'$7$ & $26'$7$
75$<,1 $- )(B75$<,1 7;B(5 1 ( (77;(5 $26'$7$ * $26'$7$
75$<287 $. )(B75$<287 5;B(5 21 % (75;(5 $26'$7$ H22 $26'$7$
7;B(1 6 ' (77;(1 $26'$7$ ) $26'$7$ ‡6,*1$/3$7+
02725'5,9(55(*8/$725 &2/ 36 & (7&2/ $26'$7$ ( $26'$7$ $8',2
,& &56 3 + (7&56 $20&/. ' $20&.
13 ;7$/ 5;B'9 19 ) (75;'9 $2%&. % $2%&. 9,'(2
6$B% 16 673 673B,1 8 X1201
$) )(B)02 $2/5&. ( $2/5&.
6$B% 17 673 673B,1 9 $* )(B)02
25MHz
Q567 5
',6&3/$<
 &/.,1
6$B$ 18 673 86%
6$B$ 19 673 67(3B(1$ 7 $( )(B*$,16:
/$1
6<6&21B567 % (Page 30)

)(9  5(*39
)(9 22 5(*3[9

HBD-E370/E470/E570/E870/T57
28 28
HBD-E370/E470/E570/E870/T57

5-2. BLOCK DIAGRAM - MEMORY Section -

BD DECODER
IC101 (2/2)

EEPROM
A25 NS_XTALI FE_SFDO E1 A1 FESFDO IC1101
X401
FE_SFDI F2 C3 FESFDI
27MHz I2C_SDA 13 AV14 SDA
C25 NS_XTALO FE_SFCLK C1 D4 FESFCK VIND5 F14 USB_VBUS_PCONT1
FE_SFCS# K6 B2 FESFCS I2C_SCL 12 AT12 SCL GPIO3 B18 USB_VBUS_PCONT2
C (Page 32)
BA9 XTAL25MO RESET 4
X802
25MHz STXP_1 BC3 AR1 FE_SRXP LCDRD G33 IF_SDI
BB8 XTAL25MI STXN_1 BA3 AR3 FE_SRXN NAND FLASH VDATA B34 IF_SDO
SRXP_1 BC1 AN1 FE_STXP IC501 VCLK A35 IF_SCK
SRXN_1 BB2 AP2 FE_STXN GPIO2 C19 XIF_CS
IO1 - IO8 NFD0 - NFD7
VCLK25MI AJ9 AJ3 FE_XTAL25MI GPIO1 A17 IF_START_BIT
XWE 18 G43 NFWEN GPIO0 C17 SYSCON_REQ
MRESET_ C35 M6 FE_RSTI XRE 8 M36 NFREN GPIO6 AV12 UPG_STATUS
XCE 9 M38 NFCEN OPWRSB F34 OPWRSB
SD-RAM
IC104
SD-RAM
RY/XBY 7 P38 NFRBN FE_EJECT# AH4 FE_EJECT D (Page 30)
IC204
ALE 17 L37 NFALE
DQ0 - DQ15 A_RDQ0 - A_RDQ15 DQ0 - DQ15 B_RDQ0 - B_RDQ15 CLE 16 K38 NFCLE RESET_ E35
A_RA0 - A_RA13 B_RA0 - B_RA13 CORE_RESETB AP4
A0 - A12, NC A_RA0 - A_RA13 A0 - A12, NC B_RA0 - B_RA13 XWP 19 SYSCON_RST
CPU_PRERST
BA0 L2 BB28 A_RBA0 BA0 L2 AD40 B_RBA0
B_RBA1 SERIAL FLASH
BA1 L3 AU27 A_RBA1 BA1 L3 AD36
IC502
BA2 L1 AT28 A_RBA2 BA2 L1 AC39 B_RBA2 TH1501 TEMP
/WE K3 BC29 A_RWEB /WE K3 AC43 B_RWEB D 5 F42 SFDO
/CS L8 AV24 A_RCSB /CS L8 AD42 B_RCSB Q 2 H40 SFDI
/CAS L7 AU23 A_RCASB /CAS L7 AH40 B_RCASB C 6 G41 SFCK
/RAS K7 BB24 A_RRASB /RAS K7 AJ41 B_RRASB S 1 J39 SFCS
ODT K9 AW23 A_RODT ODT K9 AG41 B_RODT
CKE K2 BA29 A_RCKE CKE K2 AC41 B_RCKE
HOLD 7
CK J8 BC21 A_RCLK0 CK J8 AL43 B_RCLK0
/CK K8 BA21 A_RCLK0B /CK K8 AL41 B_RCLK0B
UDM B3 AV18 A_RDQM1 UDM B3 AM36 B_RDQM1
UDQS B7 BC17 A_RDQS1 UDQS B7 AR43 B_RDQS1
/UDQS A8 BA17 A_RDQS1B /UDQS A8 AR41 B_RDQS1B
LDM F3 AT18 A_RDQM0 LDM F3 AP38 B_RDQM0
LDQS F7 AY16 A_RDQS0 LDQS F7 AT40 B_RDQS0
/LDQS E8 BB16 A_RDQS0B /LDQS E8 AT42 B_RDQS0B

SD-RAM SD-RAM
IC105 IC205

DQ0 - DQ15 A_RDQ16 - A_RDQ31 DQ0 - DQ15 B_RDQ16 - B_RDQ31

A_RA0 -
A_RA13 B_RA0 - B_RA13
A0 - A12, NC A0 - A12, NC

BA0 L2 BA0 L2
BA1 L3 BA1 L3
BA2 L1 BA2 L1
/WE K3 /WE K3
/CS L8 /CS L8
/CAS L7 /CAS L7
/RAS K7 /RAS K7
ODT K9 ODT K9
CKE K2 CKE K2
CK J8 BA39 A_RCLK1 CK J8 N41 B_RCLK1
/CK K8 BC39 A_RCLK1B /CK K8 N43 B_RCLK1B
UDM B3 AU35 A_RDQM3 UDM B3 V36 B_RDQM3
UDQS B7 BC35 A_RDQS3 UDQS B7 U43 B_RDQS3
/UDQS A8 BA35 A_RDQS3B /UDQS A8 U41 B_RDQS3B
LDM F3 AV34 A_RDQM2 LDM F3 V38 B_RDQM2
LDQS F7 BA33 A_RDQS2 LDQS F7 W41 B_RDQS2
/LDQS E8 BC33 A_RDQS2B /LDQS E8 W43 B_RDQS2B

HBD-E370/E470/E570/E870/T57
29 29
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-3. BLOCK DIAGRAM - TUNER, S-AIR Section -


$8',26(/(&7
J11 ,&

$8',2 / 5 Y1 Y 3 $8/ ( (Page 31)


$8',2,1 1 Y0
5 5&+
$ B
10 9

&1
(=:7

6$,5B'  6' '0,;

6$,5B'  6' 6/65

(Page 31) F 6$,5B'  6' 6%/6%5

6$,5B%&. 15 %&.
 %&.
6$,5B/5&. 14 /5&.
 /5&.
$8',26(/(&7
,&

5 Y1 Y 3 4 /FK
1 Y0
5&+  5FK
$
10

Q13


Q13
 Q14
78
781(5 )0

/&+
$17(11$   
)0: 5&+ 5&+

$6(/B

$6(/B

$6(/B
&2$;,$/
',  67B', 6$,5B$'&B6(/ 34  $'&B6(/
'2  67B'2
&/  67B&/. 6$,5B65&B567  11 5(61
&(  67B&( 6$,5B6'$ 30 ,&B6'$
19
781('  781(' 6$,5B6&/  ,&B6&/

6$,5B*3,2 33  *3,2
5'6B'$7$  5'6B'$7$
5'6B&/2&.  5'6B&/.

($(35XVVLDQ8.($(35XVVLDQ8.

J10
0,&$03
$&$/0,&  $FDOB/Y
,&
(&0$&
Q10
6<67(0&21752//(5
 0,&B'(7 ,& 

,)B6',  %'B6'2
,)B6'2  %'B6%,
,)B6&. 49 %'B6&/.
;,)B&6  %'B&6
,)B67$57B%,7  %'B,)B67$57 5FKLVRPLWWHGGXHWRVDPHDV/FK
6<6&21B5(4  %'B,)B5(4 ‡6,*1$/3$7+
(Page 29) ' 83*B67$786  83*B67$786
$8',2
23:56%  23:56%
)(B(-(&7  )(B(-(&7 781(5
7(03 91 %'B7(03
&38B35(567  &38B35(567 0,&
6<6&21B567 35 %'B5(6(7

(Page 28) B 6<6&21B567

HBD-E370/E470/E570/E870/T57
30 30
HBD-E370/E470/E570/E870/T57

5-4. BLOCK DIAGRAM - AUDIO Section -


A/D CONVERTER
IC702 STREAM PROCESSOR POWER AMP
S-AIR_D3 IC3010 IC3100
S-AIR_D1 TB3001
E AU-L 13 VinL
R-CH 14 VinR S-AIR_D2
F (Page 30) 31 DATA (DATA1) OUTL2 (-) 9 8 PWM_B OUT_B 36 L.P.F. 
(Page 30) S-AIR_BCK 36 XFSIIN FRONT L
DATA_I 9 DOUT
S-AIR_LRCK 30 BCK
OUTL1 (+) 11 6 PWM_A OUT_A 39 L.P.F. +
6 SCKI 29 LRCK OUTR1 (+) 6 16 PWM_C OVER LOAD
8 BCK DETECT
SCDT OUTR2 (-) 4 18 PWM_D
7 LRCK 21 SCDT Q3102
SCSHIFT X3051
22 SCSHIFT CLOCK BUFFER
LAT1 XFSOIN 48 49.152MHz
23 SCLATCH IC3051
INIT
27 INIT
SOFTMUTE FSOCKO 37 7 /RST_AB
NSPMUTE
19 SOFTMUTE
FSOI 38 17 /RST_CD
OUT_C 31 L.P.F. + FRONT R
AOSDATA0 18 NSPMUTE
D3071 (1/2) OVF1
24 OVF FLAGR XFSOOUT 14
5 /SD OUT_D 28 L.P.F. 
AOSDATA1 25 OVF FLAGL OVER LOAD
D3072
DETECT
AOSDATA2 Q3101
D3071 (2/2)
BUFFER D3070
AOSDATA3 IC704 STREAM PROCESSOR POWER AMP
IC3020 IC3200
AOSDATA4
31 DATA (DATA3) OUTL2 (-) 9 8 PWM_B OUT_B 36 L.P.F. 
AOMCK 36 XFSIIN CENTER
AOBCK 30 BCK
OUTL1 (+) 11 6 PWM_A OUT_A 39 L.P.F. +
AOLRCK 29 LRCK OUTR1 (+) 6 16 PWM_C OVER LOAD
DETECT
SCDT OUTR2 (-) 4 18 PWM_D
21 SCDT Q3301
SCSHIFT
22 SCSHIFT
A DIGITAL AUDIO LAT3
23 SCLATCH
INTERFACE RECEIVER INIT SPEAKERS
(Page IC703 27 INIT
SOFTMUTE XFSOIN 48 7 /RST_AB
28) 19 SOFTMUTE OUT_C 31 L.P.F. +
NSPMUTE FSOI 38 17 /RST_CD SUBWOOFER
18 NSPMUTE
SP_DATA 21 RDATA OVF2
24 OVF FLAGR XFSOOUT 14
5 /SD OUT_D 28 L.P.F. 
SP_MCK 16 RMCK OVF1
25 OVF FLAGL OVER LOAD
SP_BCK 17 RBCK
DETECT D3551
SP_LRCK 20 RLRCK
Q3201

DIR_ERROR 36 RERR
CSI_DATAIN 37 DO
CSI_DATAOUT 38 DI
CSI_CLK 40 CL
STREAM PROCESSOR POWER AMP
CSI_XCS_DIR 39 CE
IC3030 IC3400
DIR_CSFLAG 35 INT TB3002
DIR_AUDIO
DIR_XSTATE
33
34
AUDIO
CKST
31 DATA (DATA2) OUTL2 (-) 9 8 PWM_B OUT_B 36 L.P.F. 
36 XFSIIN SUR L
DIR_XRST 41 XMODE
30 BCK
OUTL1 (+) 11 6 PWM_A OUT_A 39 L.P.F. +
29 LRCK OUTR1 (+) 6 16 PWM_C OVER LOAD
ARC_SPDIF 8 RX4 DETECT
SCDT OUTR2 (-) 4 18 PWM_D
21 SCDT Q3402
CEC SCSHIFT
22 SCSHIFT
LAT1
23 SCLATCH
INIT
27 INIT
SOFTMUTE XFSOIN 48 7 /RST_AB
TV OPTICAL
NSPMUTE
19 SOFTMUTE
FSOI 38 17 /RST_CD
OUT_C 31 L.P.F. + SUR R
DIGITAL IN RECEIVER 10 RX6 18 NSPMUTE
OPTICAL IC700 OVF1
24 OVF FLAGR
5 /SD OUT_D 28 L.P.F. 
25 OVF FLAGL OVER LOAD
J700
SAT/CABLE DETECT
DIGITAL IN 3 RX1 Q3401
COAXIAL
XOUT

XIN

28 29

X700
24.576MHz POWER CONTROL
Q507 EN. P H (Page 33)
LAT1
LAT3

LAT2
SCDT
SCSHIFT

INIT
SOFTMUTE
NSPMUTE
OVF1
OVF2

PROTECT DETECT DC DETECT FAN_PROTECT


Q3552 +32.5V
Q3551

17 68 1 2 55 57 53 54 83 51 52 56 50 67 66
G (Page 32)
DAMP_SHIFT/DIR_CL

OVERFLOW1
OVERFLOW2
DAMP_INT
DAMP_SCDT/DIR_DI

DAMP_LATCH1
DAMP_LATCH3

DAMP_SOFT_MUTE
NSPMUTE

DAMP_LATCH2
CEC (TX/RX)

DRIVER_SD/PVDD_DET
A.CAL_OUT

DRIVER_RST (EN)

DC_DET
FAN_ON 44 FAN_ON
FAN_CONT 45 FAN_CONT

R-ch is omitted due to same as L-ch.


SYSTEM CONTROLLER ‡6,*1$/3$7+
IC501 (2/4)
: AUDIO

HBD-E370/E470/E570/E870/T57
31 31
HBD-E370/E470/E570/E870/T57

5-5. BLOCK DIAGRAM - REGULATOR Section -

+12V
M3001
(FAN)
M REGULATOR
IC3011

FAN_ON

(Page 31) G FAN_PROTECT FAN CONTROL


FAN_CONT Q3001, 3556

+5V
FRONT VBUS REGULATOR
IC601

USB_VBUS_PCONT1

+5V
REAR VBUS REGULATOR
(Page 29) C
IC602

USB_VBUS_PCONT2

+3.3V
IC101, IC702 +3.3V REGULATOR
IC704

+5V
HDMI OUT +5V REGULATOR
IC705
VREF +0.9V DC/DC
CONVERTER
DDR2_VTT +0.9V
IC311
POWER
+3.3V
DDR2 +1.8V CONTROL FL +3.3V REGULATOR
IC310
IC801
B+ SWITCH
PANEL +4V
Q800, 802
+3.3V
+3.3VA REGULATOR
IC307
+5V
LED +5V REGULATOR
+1.2V IC508
+1.2VA REGULATOR
IC303

DC/DC +5V
CONVERTER A +5V REGULATOR
IC308 IC505
OVER +1.8V
VOLTAGE AMP +1.8V REGULATOR
IC3050

D406, 407
+8V DETECT D302 PS304
FE +8V REGULATOR +3.3V
Q301
IC1451 PS301 D +3.3V REGULATOR
B+ SWITCH B+ SWITCH IC400
FE_SW +12V
FE +3.3V Q302, 303 Q401, 402

DC/DC
FE_SW +5V CONVERTER B+ SWITCH
S-AIR +4V Q300, 301 E +4V
IC312
POWER
CORE +1.1V CONTROL
IC309
+3.3V
+9V
IC1003 +3.3V REGULATOR
AUDIO +9V REGULATOR
IC1001
IC14
PS302 +12V
A +12V REGULATOR
IC941

-5V PS303 -7V


SYSTEM CONTROLLER E +14V
IC1003 -5V REGULATOR REGULATOR
IC501 (3/4) IC1002 IC402 E +6V

BD_PCONT6 42 E -9V
BD_PCONT5 41
+5V
BD_PCONT3 39 IC206 +5V REGULATOR
BD_PCONT2 38 D15, R89
BD_PCONT1 37
PCONT_FL 27
PCONT1 43

HBD-E370/E470/E570/E870/T57
32 32
HBD-E370/E470/E570/E870/T57

5-6. BLOCK DIAGRAM - PANEL, POWER SUPPLY Section -

SYSTEM CONTROLLER
IC501 (4/4)

13 Xout
X500
6MHz
15 Xin

REMOTE
CONTROL
4 SIRCS_IN
RECEIVER
IC803
POWER CONTROL
IC901
T901 D906, 907
19 KEY_INT MAIN POWER
1 OCP/SYNC
TRANSFORMER
D506 D508
D908
RECT B+ SWICH
+32.5V 4 VCC
KEY0
KEY2
S700 - 705, 750 D931 Q901

97, 95, 94
3 D910
KEY0 - KEY2

(Page 31) H EN. P

3 D

MAIN POWER
ISOLATOR
ON/OFF SWITCH
PC903
Q943
T903
SUB POWER
D800 TRANSFORMER SHUNT
LED DRIVE ISOLATOR
(ILLUMINATION) 28 LED_PWM REGULATOR 5 FB/OLP
Q801 PC901
IC932
RECT
E +14V
D954
VOLTAGE
MAIN POWER
FLUORESCENT DETECTOR
ON/OFF SWITCH
INDICATOR IC506
RECT Q949, 950
TUBE DRIVER E +6V
D942 POWER CONTROL
IC802
VOLTAGE IC921
DETECTOR D902
DIN 7 5 FL_DOUT IC507 RIPPLE FILTER
16 3 Vcc/DVP
14 - 29

RECT Q922
SG1 - SG16 CLK 8 7 FL_CLK E -9V DZ903
D955
ND800 STB 9 3 FL_CS 6 BD
FLUORESCENT 10 5 FB/CLP
42 - 33

INDICATOR GR1 - GR10 RECT 1 D


TUBE E +4V
D943
GRID DRIVE RESET
32 GR11
Q804 SIGNAL
AC_CUT 20
GENERATOR TH901 LINE F901
IC503 RECT (AC IN)
VEE FILTER
RESET D901
SWITCH VOLTAGE LF901, 902
T800 RESET 12
Q504 DETECT
DC/DC CONVERTER Q969
TRANSFORMER
SHUNT
ISOLATOR
REGULATOR
PC902
IC923
OSC
D803, 804 Q803
RECT

HBD-E370/E470/E570/E870/T57
33 33
HBD-E370/E470/E570/E870/T57
Ver. 1.1

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. • Circuit Boards Location
(In addition to this, the necessary note is printed in each block.)
CONNECT board
For Printed Wiring Boards. For Schematic Diagrams.
Note: Note:
• X : Parts extracted from the component side. • All capacitors are in μF unless otherwise noted. (p: pF) 50 TUNER (FM) (TU1)
• Y : Parts extracted from the conductor side. WV or less are not indicated except for electrolytics and
• f : Internal component. tantalums.
• : Pattern from the side which enables seeing. • All resistors are in Ω and 1/4 W or less unless otherwise AUDIO board MB-134 board
(The other layers' patterns are not indicated.) specified.
• f : internal component.
Caution:
• 2 : nonflammable resistor.
Pattern face side: Parts on the pattern face side seen
• 5 : fusible resistor. R-USB board
(Conductor Side) from the pattern face are indicated.
• C : panel designation.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated. Note: Note:
The components identi- Les composants identifiés
• MAIN and MB-134 boards are multi-layer printed board. fied by mark 0 or dotted par une marque 0 sont
However, the patterns of intermediate-layers have not line with mark 0 are criti- critiques pour la sécurité.
been included in this diagrams. cal for safety. Ne les remplacer que par
• Indication of transistor. Replace only with part une piéce portant le nu-
number specified. méro spécifié.
C
• A : B+ Line.
P-KEY board
Q These are omitted. • B : B– Line.
• Voltages and waveforms are dc with respect to ground
B E MAIN board
under no-signal conditions.
– MB-134 board –
REG board
Q no mark : BD PLAY
* : Impossible to measure POWER board
– Other boards – KEY board
B C E no mark : TUNER
FL board F-USB board
These are omitted. * : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
• Abbreviation Voltage variations may be noted due to normal production
AUS : Australian model tolerances.
CND : Canadian model • Waveforms are taken with a oscilloscope.
E32 : Latin American models Voltage variations may be noted due to normal production
MX : Mexican model tolerances.
SP : Singapore model • Circled numbers refer to waveforms.
TH : Thai model • Signal path.
TW : Taiwan model F : AUDIO
• Lead layouts E : VIDEO
surface J : DISC PLAY
L : USB
d : LAN
f : TUNER
N : MIC
• Abbreviation
• Abbreviation
AUS : Australian model
CND : Canadian model
Lead layout of conventional IC CSP (Chip Size Package)
E32 : Latin American models
MX : Mexican model
Note 1: When the MAIN board is replaced, spread the com- SP : Singapore model
pound referring to “NOTE OF REPLACING THE TH : Thai model
IC3100, IC3200 AND IC3400 ON THE MAIN TW : Taiwan model
BOARD AND THE COMPLETE MAIN BOARD” • The voltage and waveform of CSP (chip size package)
on servicing notes (page 8). cannot be measured, becaise its lead layout is different
from that of conventional IC.
Note 2: When the POWER board is replaced, spread the
Note 1: When the MAIN board is replaced, spread the com-
compound referring to “NOTE OF REPLACING
pound referring to “NOTE OF REPLACING THE
THE D913, D931, IC901 AND IC921 ON THE
IC3100, IC3200 AND IC3400 ON THE MAIN
POWER BOARD AND THE COMPLETE POWER
BOARD AND THE COMPLETE MAIN BOARD”
BOARD” on servicing notes (page 9).
on servicing notes (page 8).

Note 2: When the POWER board is replaced, spread the


compound referring to “NOTE OF REPLACING
THE D913, D931, IC901 AND IC921 ON THE
POWER BOARD AND THE COMPLETE POWER
BOARD” on servicing notes (page 9).

HBD-E370/E470/E570/E870/T57
34 34
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-7. SCHEMATIC DIAGRAM - MB-134 Board (1/13) - • See page 77 for IC Pin Function Description.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

MB-134 BOARD (1/13)


A
C104
0.01
AY14 AV16 JL117 D0DQ0
VCC2IO A_RDQ0
C105 BB14 AW15 JL118 D0DQ1
0.01 VCC2IO A_RDQ1
AY18 BC13 D0DQ2
VCC2IO A_RDQ2
BB18 AU15 JL119 D0DQ3
C106
0.01 VCC2IO A_RDQ3
AR19 BA13 D0DQ4

B
VCC2IO A_RDQ4
AY22 AT16 JL120 D0DQ5
C107
0.01 VCC2IO A_RDQ5

C109
BB22
AY26
VCC2IO A_RDQ6
BA15
BC15 JL121
D0DQ6
D0DQ7
IC104 IC105 D0A8
RB101
100
C159
0.1

0.01 VCC2IO A_RDQ7 SD-RAM SD-RAM


BB26 AY20 D0DQ8 CSP CSP D0A0
VCC2IO A_RDQ8 (Chip Size Package) (Chip Size Package)
AY30 AU19 JL122 D0DQ9 D0ODT C161
C110 IC104 IC105
0.01 VCC2IO A_RDQ9 0.1
D0DQ10 K4T1G164QE-HCF8 K4T1G164QE-HCF8 D0A13
BB30 BB20 RB102
VCC2IO A_RDQ10 100
AR31 AT20 JL123 D0DQ11 D0BA0
C111
0.01 VCC2IO A_RDQ11
AY34 AW19 JL124 D0DQ12 D0BA1 C162

C
VCC2IO A_RDQ12 0.1
BB34 BC19 D0DQ13 D0A0 JL180 M8 G8 JL2108 D0DQ0 D0A0 JL2134 M8 G8 JL2162 D0DQ16 D0A10
C112
0.01 VCC2IO A_RDQ13 A0 DQ0 A0 DQ0
W35 AV20 JL125 D0DQ14 D0A1 JL181 M3 G2 D0DQ4 D0A1 JL2135 M3 G2 D0DQ22 D0BA2 RB103
VCC2IO A_RDQ14 A1 DQ1 A1 DQ1 100
AL35 BA19 D0DQ15 D0A2 JL182 M7 H7 JL2109 D0DQ7 D0A2 JL2136 M7 H7 JL2163 D0DQ21 D0A12 C164
C113
0.01 VCC2IO A_RDQ15 A2 DQ2 A2 DQ2 0.1
AY38 D0A3 JL183 N2 H3 D0DQ2 D0A3 JL2137 N2 H3 D0DQ19 D0A7
VCC2IO A3 DQ3 A3 DQ3
BB38 AT18 D0DM0 D0A4 JL184 N8 H1 JL2110 D0DQ3 D0A4 JL2138 N8 H1 D0DQ20 D0A3
VCC2IO A_RDQM0 A4 DQ4 A4 DQ4
P40 AY16 JL126 D0DQS0 D0A5 JL185 N3 H9 JL2111 D0DQ5 D0A5 JL2139 N3 H9 JL2164 D0DQ18 D0A9 RB104 C166
VCC2IO A_RDQS0 A5 DQ5 A5 DQ5 100 0.1
V40 BB16 JL127 D0DQS0B D0A6 JL186 N7 F1 D0DQ6 D0A6 JL2140 N7 F1 D0DQ17 D0A2
VCC2IO A_RDQS0B A6 DQ6 A6 DQ6
AB40 D0A7 JL187 P2 F9 JL2112 D0DQ1 D0A7 JL2141 P2 F9 JL2165 D0DQ23 D0RAS

D
VCC2IO A7 DQ7 A7 DQ7
AF40 AV18 D0DM1 D0A8 P8 C8 D0DQ13 D0A8 JL2142 P8 C8 D0DQ24 D0A4 C168
VCC2IO A_RDQM1 A8 DQ8 A8 DQ8 0.1
AK40 BC17 JL128 D0DQS1 D0A9 JL188 P3 C2 JL2113 D0DQ11 D0A9 JL2143 P3 C2 JL2166 D0DQ27 D0A6 RB105
VCC2IO A_RDQS1 A9 DQ9 A9 DQ9 100
AP40 BA17 JL129 D0DQS1B D0A10 JL189 M2 D7 D0DQ8 D0A10 JL2144 M2 D7 D0DQ29 D0CAS
VCC2IO A_RDQS1B A10 DQ10 A10 DQ10
AV40 D0A11 JL190 P7 D3 JL2114 D0DQ9 D0A11 JL2145 P7 D3 JL2167 D0DQ25 D0A11
VCC2IO A11 DQ11 A11 DQ11
P42 BC21 D0CK0 D0A12 JL191 R2 D1 JL2115 D0DQ12 D0A12 JL2146 R2 D1 JL2168 D0DQ28 D0CS
VCC2IO A_RCLK0 A12 DQ12 A12 DQ12
V42 BA21 D0CK0B D9 D0DQ10 D9 D0DQ26 D0A1 RB106
VCC2IO A_RCLK0B DQ13 DQ13 100
AB42 D0BA0 JL192 L2 B1 JL2116 D0DQ14 D0BA0 JL2147 L2 B1 JL2169 D0DQ30 D0A5
VCC2IO BA0 DQ14 BA0 DQ14
AF42 D0BA1 JL193 L3 B9 D0DQ15 D0BA1 JL2148 L3 B9 D0DQ31 D0WE

E
VCC2IO BA1 DQ15 BA1 DQ15
AK42 AV32 JL130 D0DQ16 D0BA2 JL194 L1 D0BA2 JL2149 L1 D0CKE
VCC2IO A_RDQ16 BA2 BA2
AP42 BB32 D0DQ17
VCC2IO A_RDQ17
AV42 AW31 JL131 D0DQ18
VCC2IO A_RDQ18
BB42 BC31 D0DQ19 D0DM1 JL195 B3 A2 D0DM3 JL2150 B3 A2
VCC2IO A_RDQ19 UDM NC UDM NC
BA43 BA31 D0DQ20 D0DQS1 JL196 B7 E2 D0DQS3 JL2151 B7 E2
VCC2IO A_RDQ20 UDQS NC UDQS NC
AU31 JL132 D0DQ21 D0DQS1B JL197 A8 R3 D0DQS3B JL2152 A8 R3
A_RDQ21 /UDQS NC /UDQS NC
AY32 D0DQ22 R7 R7
A_RDQ22 NC JL2117 NC JL2170
J9 AT32 JL133 D0DQ23 D0DM0 JL198 F3 R8 D0A13 D0DM2 JL2153 F3 R8 D0A13
JL101
F
DVSS A_RDQ23 LDM NC LDM NC
J11 AY36 D0DQ24 D0DQS0 JL199 F7 D0DQS2 JL2154 F7
JL102 DVSS A_RDQ24 LDQS LDQS
P12 AV36 JL134 D0DQ25 D0DQS0B JL2101 E8 D0DQS2B JL2155 E8
JL103 DVSS A_RDQ25 /LDQS /LDQS
T12 BA37 D0DQ26
JL104 DVSS A_RDQ26 R106 R107
JL135 100 100
V12 AU37 D0DQ27 D0CK0 J8 D0CK1 J8
JL105 DVSS A_RDQ27 CK CK
J13 AW35 JL136 D0DQ28 D0CK0B K8 D0CK1B K8
JL106 DVSS A_RDQ28 /CK /CK
U13 BC37 D0DQ29 D0CKE JL2102 K2 D0CKE JL2156 K2
JL107 DVSS A_RDQ29 CKE CKE
W13 AV38 JL137 D0DQ30
JL108 DVSS A_RDQ30
AW13 BB36 D0DQ31 D0CS JL2103 L8 D0CS JL2157 L8
JL109
G
DVSS A_RDQ31 /CS /CS
P14 D0RAS JL2104 K7 D0RAS JL2158 K7
JL110 JL2118 JL2171
DVSS /RAS /RAS
T14 AV34 D0DM2 D0CAS JL2105 L7 J2 D0CAS JL2159 L7 J2
JL111 DVSS A_RDQM2 /CAS VREF /CAS VREF
V14 BA33 JL138 D0DQS2 D0WE JL2106 K3 D0WE JL2160 K3
JL112 DVSS A_RDQS2 /WE /WE
JL139 C129 C142
Y14 BC33 D0DQS2B J1 J1 0.01
JL113 DVSS A_RDQS2B VDDL 0.1 VDDL
AT14 D0ODT JL2107 K9 J7 D0ODT JL2161 K9 J7
JL114 DVSS ODT VSSDL ODT VSSDL
U15 AU35 D0DM3
JL115 DVSS A_RDQM3
W15 BC35 JL140 D0DQS3
DVSS A_RDQS3
H16 BA35 JL141 D0DQS3B C118 C130 C143
H AR17
DVSS

DVSS
A_RDQS3B
JL165 A3
VSS VDD
A1
0.1
JL2119 A3
VSS VDD
A1
0.1 0.01

AU17 BA39 D0CK1 E3 E1 C119 E3 E1 C134 C144


DVSS A_RCLK1 JL166 VSS VDD JL2120 VSS VDD
0.1 0.1 1
AW17 BC39 D0CK1B J3 J9 J3 J9
DVSS A_RCLK1B JL167 VSS VDD JL2121 VSS VDD
J19 N1 M9 C120 N1 M9 C135 C145
DVSS JL168 VSS VDD JL2122 VSS VDD
0.1 0.1 0.01
AA21 BC23 JL142 D0A0 P9 R1 P9 R1
DVSS A_RA0 JL169 VSS VDD JL2123 VSS VDD
AC21 AT26 JL143 D0A1 C137 C146
JL170 C122 JL2124
DVSS A_RA1 0.1 0.1 0.01
AE21 AV26 JL144 D0A2 A7 A9 A7 A9
DVSS A_RA2 JL171 VSSQ VDDQ JL2125 VSSQ VDDQ
AG21 BC27 JL145 D0A3 B2 C1 C123 B2 C1 C138 C147
JL172 JL2126
I
DVSS A_RA3 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 0.01
AJ21 AY24 JL146 D0A4 B8 C3 B8 C3
DVSS A_RA4 JL173 VSSQ VDDQ JL2127 VSSQ VDDQ
AU21 AV28 JL147 D0A5 D2 C7 D2 C7 C139 C148
JL174 C124 JL2128
DVSS A_RA5 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 1
BC25 JL148 D0A6 D8 C9 D8 C9
A_RA6 JL175 VSSQ VDDQ JL2129 VSSQ VDDQ
AJ7 BA27 JL149 D0A7 E7 E9 C127 E7 E9 C140
JL176 C150
DVSS_XTAL A_RA7 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 0.01
BA23 JL150 D0A8 F2 G1 F2 G1
A_RA8 VSSQ VDDQ VSSQ VDDQ
AW27 JL151 D0A9 F8 G3 C128 F8 G3 C141 C151
A_RA9 VSSQ VDDQ 10 VSSQ VDDQ 10 1
19 AW39
A_RA10
A_AVDD12_MEMPLL
AY28
AT24
JL152
JL153
D0A10
D0A11
H2
H8
VSSQ VDDQ
G7
G9
H2

H8
VSSQ VDDQ
G7

G9 C153
J MB-134
BOARD
CPU_1.2VA
AY40
A_RA11
A_AVSS12_MEMPLL
A_RA12
BA25 JL154 D0A12
VSSQ VDDQ VSSQ VDDQ 1

(4/13) AV22 JL155 D0A13 C154


C102 C114
0.1 A_RA13 1
0.1
(Page 38) BB40
A_TP_MEMPLL
BC41 C156
A_TN_MEMPLL
1
BB28 JL156 D0BA0
A_RBA0
AU27 JL157 D0BA1 C170
A_RBA1 10
AT28 JL158 D0BA2
A_RBA2

K A_RCKE
BA29 JL159 D0CKE

AV24 JL160 D0CS


JL116 A_RCSB
AT30 BB24 JL161 D0RAS
A_RVREF A_RRASB
AU23 JL162 D0CAS
C115 A_RCASB
0.1 JL163 D0WE
BC29
A_RWEB
AV30
NC
C116
0.1
BC43 AW23 JL164 D0ODT

L
A_REXTDN A_RODT
R101 PT101
100

E
PT103

E
IC101 (1/15) PT104

BD DECODER

E
IC101 PT105
CXD9983GG (E370: US/E470/E570/T57)
CXD9984GG (EXCEPT E370: US/E470/E570/T57)

E
CSP

M
(Chip Size Package) PT106

20 VREF_0.9V

E
DDR2_VTT0.9V PT107
MB-134 DDR2_1.8V

E
BOARD
(3/13) GND
(CHASSIS)
(Page 37)

HBD-E370/E470/E570/E870/T57 Note: IC101, IC104 and IC105 on the MB-134 board cannot exchange with single.
35 35 When these parts are damaged, exchange the entire mounted board.
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-8. SCHEMATIC DIAGRAM - MB-134 Board (2/13) - • See page 77 for IC Pin Function Description.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

MB-134 BOARD (2/13)


A

AW21 AR39 JL217 D1DQ0


JL201 DVSS B_RDQ0
Y22 AW43 D1DQ1
JL202 DVSS B_RDQ1
AK22 AU43 D1DQ2
JL203 DVSS B_RDQ2
AT22 AU41 D1DQ3
JL204 DVSS B_RDQ3
J23 AW41 D1DQ4
JL205
B JL206 AC23
DVSS
DVSS
B_RDQ4
B_RDQ5
AT38 JL218 D1DQ5

IC204 IC205
AE23 AR37 JL219 D1DQ6
JL207 DVSS B_RDQ6
AG23 AP36 JL220 D1DQ7 RB201 C248
JL208 DVSS B_RDQ7 SD-RAM SD-RAM 100 0.1
Y24 AN43 D1DQ8 CSP CSP D1A0
JL209 DVSS B_RDQ8 (Chip Size Package) (Chip Size Package)
AB24 AK36 JL221 D1DQ9 D1ODT
JL210 IC204 IC205
DVSS B_RDQ9
D1DQ10 K4T1G164QE-HCF8 K4T1G164QE-HCF8 D1A13
AD24 AM40 C250
JL211 DVSS B_RDQ10 0.1
AF24 AL37 JL222 D1DQ11 D1A8 RB202
JL212 DVSS B_RDQ11 100
AH24 AM38 JL223 D1DQ12 D1A1
JL213
C JL214 AK24
DVSS
DVSS
B_RDQ12
B_RDQ13
AM42 D1DQ13 D1A0 JL279 M8
A0 DQ0
G8 JL2208 D1DQ0 D1A0 JL2233 M8
A0 DQ0
G8 JL2260 D1DQ18 D1A9 C252
0.1
AC25 AL39 JL224 D1DQ14 D1A1 JL280 M3 G2 D1DQ4 D1A1 JL2234 M3 G2 D1DQ20 D1A12
JL215 DVSS B_RDQ14 A1 DQ1 A1 DQ1
AE25 AN41 D1DQ15 D1A2 JL281 M7 H7 D1DQ2 D1A2 JL2235 M7 H7 JL2261 D1DQ23 D1A7 RB203
DVSS B_RDQ15 A2 DQ2 A2 DQ2 100
AG25 D1A3 JL282 N2 H3 D1DQ1 D1A3 JL2236 N2 H3 D1DQ19 D1BA0 C254
DVSS A3 DQ3 A3 DQ3 0.1
AR25 AP38 D1DM0 D1A4 JL283 N8 H1 JL2209 D1DQ6 D1A4 JL2237 N8 H1 D1DQ17 D1CS
DVSS B_RDQM0 A4 DQ4 A4 DQ4
AU25 AT40 JL225 D1DQS0 D1A5 JL284 N3 H9 JL2210 D1DQ5 D1A5 JL2238 N3 H9 JL2262 D1DQ16 D1BA1
DVSS B_RDQS0 A5 DQ5 A5 DQ5
AW25 AT42 JL226 D1DQS0B D1A6 JL285 N7 F1 D1DQ3 D1A6 JL2239 N7 F1 D1DQ22 D1A5 RB204 C256
DVSS B_RDQS0B A6 DQ6 A6 DQ6 100 0.1
AB26 D1A7 JL286 P2 F9 JL2211 D1DQ7 D1A7 JL2240 P2 F9 JL2263 D1DQ21 D1A11

D DVSS A7 DQ7 A7 DQ7


AD26 AM36 D1DM1 D1A8 JL287 P8 C8 D1DQ8 D1A8 JL2241 P8 C8 D1DQ24 D1A2
DVSS B_RDQM1 A8 DQ8 A8 DQ8
AF26 AR43 JL227 D1DQS1 D1A9 JL288 P3 C2 JL2212 D1DQ9 D1A9 JL2242 P3 C2 JL2264 D1DQ25 D1A6 C258
DVSS B_RDQS1 A9 DQ9 A9 DQ9 0.1
AH26 AR41 JL228 D1DQS1B D1A10 JL289 M2 D7 D1DQ10 D1A10 JL2243 M2 D7 D1DQ26 D1A10 RB205
DVSS B_RDQS1B A10 DQ10 A10 DQ10 100
AK26 D1A11 JL290 P7 D3 JL2213 D1DQ11 D1A11 JL2244 P7 D3 JL2265 D1DQ27 D1RAS
DVSS A11 DQ11 A11 DQ11
AC27 AL43 D1CK0 D1A12 JL291 R2 D1 JL2214 D1DQ12 D1A12 JL2245 R2 D1 JL2266 D1DQ28 D1A3
DVSS B_RCLK0 A12 DQ12 A12 DQ12
AE27 AL41 D1CK0B D9 D1DQ13 D9 D1DQ29 D1CAS
DVSS B_RCLK0B DQ13 DQ13
AG27 D1BA0 JL292 L2 B1 JL2215 D1DQ14 D1BA0 JL2246 L2 B1 JL2267 D1DQ30 D1A4 RB206
DVSS BA0 DQ14 BA0 DQ14 100
Y28 D1BA1 JL293 L3 B9 D1DQ15 D1BA1 JL2247 L3 B9 D1DQ31 D1BA2

E DVSS BA1 DQ15 BA1 DQ15


AB28 Y38 JL229 D1DQ16 D1BA2 JL294 L1 D1BA2 JL2248 L1 D1WE
DVSS B_RDQ16 BA2 BA2
AD28 AA41 D1DQ17 D1CKE
DVSS B_RDQ17
AF28 W37 JL230 D1DQ18
DVSS B_RDQ18
AH28 AA43 D1DQ19 D1DM1 JL295 B3 A2 D1DM3 JL2249 B3 A2
DVSS B_RDQ19 UDM NC UDM NC
AK28 Y40 D1DQ20 D1DQS1 JL296 B7 E2 D1DQS3 JL2250 B7 E2
DVSS B_RDQ20 UDQS NC UDQS NC
AC29 W39 JL231 D1DQ21 D1DQS1B JL297 A8 R3 D1DQS3B JL2251 A8 R3
DVSS B_RDQ21 /UDQS NC /UDQS NC
AE29 Y42 D1DQ22 R7 JL2216 R7 JL2268
DVSS B_RDQ22 NC NC
AG29 Y36 JL232 D1DQ23 D1DM0 JL298 F3 R8 D1A13 D1DM2 JL2252 F3 R8 D1A13

F DVSS B_RDQ23 LDM NC LDM NC


AR29 T40 D1DQ24 D1DQS0 JL299 F7 D1DQS2 JL2253 F7
DVSS B_RDQ24 LDQS LDQS
AU29 R37 JL233 D1DQ25 D1DQS0B JL2201 E8 D1DQS2B JL2254 E8
DVSS B_RDQ25 /LDQS /LDQS
AW29 R43 D1DQ26 R206 R207
DVSS B_RDQ26
JL234 D1DQ27 D1CK0 100 D1CK1 100
Y30 T38 J8 J8
DVSS B_RDQ27 CK CK
AK30 T36 JL235 D1DQ28 D1CK0B K8 D1CK1B K8
DVSS B_RDQ28 /CK /CK
AA31 R41 D1DQ29 D1CKE JL2202 K2 D1CKE K2
DVSS B_RDQ29 CKE CKE
AC31 R39 JL236 D1DQ30
DVSS B_RDQ30
AE31 T42 D1DQ31 D1CS JL2203 L8 D1CS JL2255 L8

G DVSS B_RDQ31 /CS /CS


AG31 D1RAS JL2204 K7 D1RAS JL2256 K7
JL2217 JL2269
DVSS /RAS /RAS
AJ31 V38 D1DM2 D1CAS JL2205 L7 J2 D1CAS JL2257 L7 J2
DVSS B_RDQM2 /CAS VREF /CAS VREF
AU33 W41 JL237 D1DQS2 D1WE JL2206 K3 D1WE JL2258 K3
DVSS B_RDQS2 /WE C215 /WE C231
AW33 W43 JL238 D1DQS2B J1 J1
0.01 0.1
DVSS B_RDQS2B VDDL VDDL
K34 D1ODT JL2207 K9 J7 D1ODT JL2259 K9 J7
DVSS ODT VSSDL ODT VSSDL
AT34 V36 D1DM3
DVSS B_RDQM3
R35 U43 JL239 D1DQS3
DVSS B_RDQS3
U35 U41 JL240 D1DQS3B C203 C216 C232
H AA35
DVSS

DVSS
B_RDQS3B
JL264
A3
VSS VDD
A1
0.1
JL2218 A3
VSS VDD
A1
0.1 0.01

AE35 N41 D1CK1 E3 E1 C204 E3 E1 C217 C233


DVSS B_RCLK1 JL265 VSS VDD JL2219 VSS VDD
0.1 0.1 1
AJ35 N43 D1CK1B J3 J9 J3 J9
DVSS B_RCLK1B JL266 VSS VDD JL2220 VSS VDD
AN35 JL267
N1 M9 C205 JL2221 N1 M9 C220 C234
DVSS VSS VDD 0.1 VSS VDD 0.1 1
H36 AG43 JL241 D1A0 P9 R1 P9 R1
DVSS B_RA0 JL268 VSS VDD JL2222 VSS VDD
AT36 AF38 JL242 D1A1 C206 C235
JL269 JL2223 C222
DVSS B_RA1 0.1 0.1 0.01
G37 AG37 JL243 D1A2 A7 A9 A7 A9
DVSS B_RA2 JL270 VSSQ VDDQ JL2224 VSSQ VDDQ
N37 AJ43 JL244 D1A3 B2 C1 B2 C1 C225 C236
JL271 C207 JL2225
I DVSS B_RA3 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 0.01
U37 AH42 JL245 D1A4 B8 C3 B8 C3
DVSS B_RA4 JL272 VSSQ VDDQ JL2226 VSSQ VDDQ
AA37 AC37 JL246 D1A5 D2 C7 D2 C7 C226 C239
JL273 C209 JL2227
DVSS B_RA5 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 0.01
AE37 AG39 JL247 D1A6 D8 C9 D8 C9
DVSS B_RA6 JL274 VSSQ VDDQ JL2228 VSSQ VDDQ
AJ37 AE43 JL248 D1A7 E7 E9 E7 E9 C227 C240
C211 JL2229
DVSS B_RA7 VSSQ VDDQ 0.1 VSSQ VDDQ 0.1 1
AN37 AH36 JL249 D1A8 F2 G1 F2 G1
DVSS B_RA8 VSSQ VDDQ VSSQ VDDQ
AW37 AD38 JL250 D1A9 F8 G3 C214 F8 G3 C228 C242
DVSS B_RA9 VSSQ VDDQ 10 VSSQ VDDQ 0.1 1
N39 AF36 JL251 D1A10 H2 G7 H2 G7
DVSS B_RA10 VSSQ VDDQ VSSQ VDDQ
U39 AH38 JL252 D1A11 H8 G9 H8 G9 C243
C230
J DVSS B_RA11 VSSQ VDDQ VSSQ VDDQ 10 1
AA39 AE41 JL253 D1A12
DVSS B_RA12
AE39 AK38 JL254 D1A13 C245
DVSS B_RA13 1
AJ39
DVSS
AN39 C246
DVSS 0.01
AU39 AD40 JL255 D1BA0
DVSS B_RBA0
BA41 AD36 JL256 D1BA1 C247
DVSS B_RBA1 0.01
AY42 AC39 JL257 D1BA2
DVSS B_RBA2
C259
K B_RCKE
AC41 JL258 D1CKE
10

AD42 JL259 D1CS


JL216 B_RCSB
AB36 B_RVREF AJ41 JL260 D1RAS
B_RRASB
AH40 JL261 D1CAS
C201 B_RCASB
0.1 JL262 D1WE
AC43
B_RWEB
AB38
NC
R201
100 B_REXTDN JL263
M42 AG41 D1ODT

L B_RODT

IC101 (2/15)
BD DECODER
IC101
CXD9983GG (E370: US/E470/E570/T57)
CXD9984GG (EXCEPT E370: US/E470/E570/T57)
CSP

M
(Chip Size Package)

21 VREF_0.9V
DDR2_VTT0.9V
MB-134 DDR2_1.8V
BOARD
(3/13) GND

(Page 37)

HBD-E370/E470/E570/E870/T57 Note: IC101, IC204 and IC205 on the MB-134 board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted board.
36 36
HBD-E370/E470/E570/E870/T57

5-9. SCHEMATIC DIAGRAM - MB-134 Board (3/13) - • See page 67 for IC Block Diagrams.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

MB-134 BOARD (3/13)


A L305
2.2uH
MB-134
24
UNSW6V
BOARD
(6/13) GND
JL314 JL313
(Page 40)
CORE_1.1V
R320 0
CORE_STB3.3V
MB-134
BOARD
(4/13)
22 3.3VA

1.2VA

B (Page 38) GND


R319
0
R327
1k
PCONT_CORE
MB-134
34
PCONT3
BOARD
(13/13) PCONT2

(Page 47) ATA_PCONT

IC B/D
IC309
C MB-134 POWER CONTROL

23
3.3VA
BOARD IC B/D IC B/D IC309
GND D303 TPS54325PWPR L303
(5/13) KDZTR3.9B 2.2uH
15
(Page 39) IC303 IC307 R330
8.2k
1.1


1 VO VCC 14
6.3

6.3 C349
+1.2V REGULATOR +3.3V REGULATOR 2 VFD VIN 13 0.1
C345 1 5.5 6.7
IC303 IC307 3
CORE_STB3.3V VREG5 VBST 12
MB-134 MM3141CNRE MM3293DNRE

30 C310 5.5 1.1


BOARD 3.3VA 10 4 SS SW2 11
(10/13) 3.7 1.2 3.7 3.3 C346 3300p 1.1
GND 1 VDD VOUT 5 1 VDD VOUT 5 5 GND SW1 10
R331
D (Page 44)
JL311
2 GND 2 GND 18k 6 PG PGND2 9
3.3 3.3 3.3
3 CE NC 4 3 CE NC 4 7 EN PGND1 8
R305 C330 C313 C335 C340 R332 C318 C353
MB-134 1k 10 10 10 10 150 22 22 D304

31
CORE_STB3.3V KDZTR3.9B
BOARD
(11/13) GND
C351 C352 C359 C365
(Page 45) R306
22 22 10 10 FL301 JL315
1k
EMI
1.2VA R355
MB-134 220
E 25
3.3VA
BOARD PS304
UNSW6V 3.15A R379 L306 L304
(7/13) 32V 0 2.2uH 2.2uH

(Page 41) GND

IC B/D JL316
FL302
IC B/D
MB-134 IC310 EMI DDR2_1.8V
BOARD
(8/13) 27 GND
POWER CONTROL IC311 C368
1 21
IC310
(Page 42) TPS54325PWPR DC/DC CONVERTER GND
MB-134
F 1.8
15
13.2
IC311
BD3539NUX-TR
DDR2_VTT0.9V BOARD
(2/13)
1 VO VCC 14 9 VREF_0.9V
R333
13.2
3.9k
C347 1 5.5
2 VFD VIN 13
7.4
C350
0.1
1.8 6.3
(Page 36)
3 VREG5 VBST 12 1 VTT_IN VCC 8
5.5 1.8 0.9 1.8

R334
C348 3300p
4

5
SS
GND
SW2 11
SW1 10
1.8
2

3
VTT

GND
VDDQ

VREF
7

6
0.9
DDR2_1.8V
VREF_0.9V
20
3.3 0.9
2.7k JL312 6 PG PGND2 9 4 EN VTTS 5 DDR2_VTT0.9V MB-134
BOARD
7 EN PGND1 8 GND (1/13)
G C341
10
R335
120
R343
1k (Page 35)
R329 C369 C363
1k 1 0.1

GND
C321
CN303 10
12P L302 C336 L301 R321
PS301 2.2uH 0.01 10uH 33k
JL301

32
1 2A
UNSW12V 50V
JL303
FE_UNSW12V 2
JL319 JL320
R374 FE_SW12V MB-134
H FE_GND_M 3
C301 33k BOARD
GND 4 0.01 (12/13)
JL302

E GND

FE_UNSW6V
5
6
JL305
FE_SW5V
(Page 46)
JL307
REG C302 FE_GND_M
UNSW6V 7 0.1
BOARD JL308

13.2

13.2

13.2
CN402 UNSW6V 8
JL309
PS302
13.2

(Page 61) UNSW6V 9


3.8

8.6

JL310 3.15A IC B/D 4 5 6


32V R318
UNSW-6V 10 1k S D D
JL306 4 3 2 1
IC B/D
I GND 11
IC308

FDC642P
BOOT
GND

SW

VIN

Q302
GND 12

PS303
DC/DC CONVERTER
IC308
R322
8.2k IC312
COMP

1A MP2301ENE-LF-Z G D D
32V DC/DC CONVERTER
D302
EN

SS
FB

9 3 2 1

28
UNSW-6V DZ2J047M0L IC312
5 6 7 8 MM1855AHBE

8.9

13.2

13.2
DAC3.3VA 9
MB-134

3.3

3.6

UNSW6V
BOARD 6.3 5
(9/13) GND 8 VIN VOUT 1
C373
0.01
J (Page 43) R312
4.7k
3.3 7 NC NC 2

0.6 6 NC GND 3
3.3 0.8
R375 Q302, 303 5 CONT CN 4 FE_SW12V
R376 C331 C323 C337 R323 Q301 68k B+ SWITCH
1k 4700p 8200p 22 560 RT1N141M-TP-1 FE_SW5V

33
OVER VOLTAGE Q303
RT1N141M-TP-1 C379 C311
DETECT 0 C377 0.01 10
1
5
GND MB-134
BOARD
R362 R363
2.2k 2.2k (13/13)

K FE_GND_M (Page 47)

HBD-E370/E470/E570/E870/T57 Note: IC307 and IC311 on the MB-134 board cannot exchange with single. When
37 37 these parts are damaged, exchange the entire mounted board.
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-10. SCHEMATIC DIAGRAM - MB-134 Board (4/13) - • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11

MB-134 BOARD (4/13)


A
CORE_STB3.3V

22 1.2VA
3.3VA
R402 0
MB-134 CSP
BOARD CORE_1.1V (Chip Size Package)
(3/13)
IC101
GND
(Page 37) R401 (3/15)
0
BD DECODER
IC101
B CXD9983GG (E370: US/E470/E570/T57)
CXD9984GG (EXCEPT E370: US/E470/E570/T57)

19 CPU_1.2VA
MB-134 C416 C427
10 0.1 CSP
BOARD Y20 VCCK AU13 (Chip Size Package)
(1/13) VCC3IO_1

(Page 35) C418


0.1
AB20
AD20
VCCK

VCCK
VCC3IO_2
L35
N35
C431
0.1 IC101 (4/15)
VCC3IO_2 BD DECODER
C403 AF20 VCCK H10 C433
5 VCC3IO_3 IC101
0.1 0.1 CXD9983GG (E370: US/E470/E570/T57)
C CPU_1.2VA
C405
AH20
AK20
VCCK
VCCK
VCC3IO_3
H12
J15
CXD9984GG (EXCEPT E370: US/E470/E570/T57)

MB-134 CPU_3.3VA VCC3IO_3


0.01
BOARD W21 VCCK H18
(6/13) VCC3IO_3
C423 AL21 VCCK
(Page 40) 0.1 E25 R403
AB22 VCCK J21 AVDD33_XTAL 820
VCC3IO_PWM C25
AD22 VCCK NS_XTALO

15 CPU_3.3VA
AF22 VCCK
VCC3IO_STB
J33 NS_XTALI
A25
E27
R404
100k
AH22 G35 TP_PLLG CL401
MB-134 VCCK C436
VCC3IO_STB F26 2
BOARD CL402 0.1
D W23 VCCK C424 TN_PLLG
(10/13) 0.1 G25 X401
AA23 VCCK AVSS33_XTAL
(Page 44) 27MHz
AJ23 VCCK
A23 1
AL23 VCCK AVDD12_27MPLL

7 CPU_1.2VA W25 VCCK AVSS12_27MPLL


J25

MB-134 CPU_3.3VA AA25 VCCK C437 C448 C447


B24 0.1 10p 10p
BOARD AJ25 VCCK AVDD12_DMPLL
(8/13) F24
AL25 VCCK AVSS12_DMPLL
(Page 42) C440
E AA27
AJ27
VCCK

VCCK AVDD12_APLL
D24
0.1

H24
AL27 VCCK AVSS12_APLL

W29 VCCK
H38
AA29 VCCK AVDD10_LDO
J37
AJ29 VCCK AVDD33_LDO
K36
AL29 VCCK AVSS33_LDO

AB30 VCCK

F AD30

AF30
VCCK
VCCK
AH30 VCCK
W31 VCCK
AL31 VCCK
Y32 VCCK
AB32 VCCK
AD32 VCCK

G AF32

AH32
VCCK
VCCK
AK32 VCCK

W27 VCCK_PWM Y26


DVSS_PWM

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
HBD-E370/E470/E570/E870/T57
38 38
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-11. SCHEMATIC DIAGRAM - MB-134 Board (5/13) - • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11

MB-134 BOARD (5/13)


A
MB-134
23
GND
BOARD
(3/13) 3.3VA
R523
(Page 37) 3.3k
CPU_XRST
CPU_NFREN R516
0
CPU_NFCEN

2 CPU_NFCLE

B MB-134
CPU_NFALE

BOARD
IC501
CPU_NFWEN
(10/13)
CPU_SFCK
(Page 44) NAND FLASH
CPU_NFCEN2 IC501
FE_SFDI K9GAG08U0D-PCB0T

1 NC NC 48

1 FE_SFCS
FE_SFDO 2 NC NC 47

C MB-134
BOARD
FE_SFDI
3 NC NC 46
(12/13) FE_SFCLK

(Page 46) 4 NC NC 45

0 CPU_NFD[7]
5 NC IO8 44

J39 JL516 0 CPU_NFD[6]


SFCS 6 NC IO7 43
G41 JL517
SFCK 3.3 RY/XBY 0 CPU_NFD[5]
H40 JL518 7 IO6 42
SFDI
JL519
D F42 3.3 0 CPU_NFD[4]
SFDO 8 XRE IO5 41

3.3
D4 JL501 9 XCE NC 40
FESFCK
C3 JL502
FESFDI 10 NC NC 39
A1 JL503
FESFDO
B2 JL504 11 NC NC 38
FESFCS
3.3 3.3
12 Vcc Vcc 37
M38 JL520 C504
0.1 R526 R528 R529
NFCEN 100k 10k
JL521 13 Vss Vss 36 47
E NFREN
M36

G43 JL522
NFWEN 14 NC NC 35
JL523 R530
P38 10k
NFRBN
L37 JL524 15 NC NC 34
NFALE
K38 JL525 0
NFCLE 16 CLE NC 33

0 0 CPU_NFD[3]
L39 JL505 17 ALE IO4 32
NFCEN2
P36 3.3 0 CPU_NFD[2]
NFRBN2 JL506 18 XWE IO3 31

F H42 JL507 CPU_NFD[0]


3.3
19 XWP IO2 30
0 CPU_NFD[1]
NFD0
J41 JL511 CPU_NFD[1] 0 CPU_NFD[0]
NFD1 20 NC IO1 29
J43 JL508 CPU_NFD[2]
NFD2
K40 JL512 CPU_NFD[3] 21 NC NC 28
NFD3
K42 JL509 CPU_NFD[4]
NFD4 22 NC NC 27

IC502
L41 JL513 CPU_NFD[5]
NFD5
L43 JL510 CPU_NFD[6] 23 NC NC 26
NFD6 SERIAL FLASH
JL514
G M40 CPU_NFD[7] IC502
NFD7 24 NC NC 25
MX25L1605DM2I-12G

R525 3.3 3.3


8 VCC S 1
0 3.3 1.2
7 HOLD Q 2
0 3.3

IC101 (5/15)
6 C W/Vpp 3
0
5 D VSS 4
BD DECODER
IC101 R531
CXD9983GG (E370: US/E470/E570/T57) 0
CXD9984GG (EXCEPT E370: US/E470/E570/T57)
H 3 CSP
(Chip Size Package)
JL515
C505 C506
CPU_PRERST 0.1 0.1
MB-134
BOARD
(13/13)
(Page 47)
Note: IC101, IC501 and IC502 on the MB-134 board cannot exchange with sin-
HBD-E370/E470/E570/E870/T57
gle. When these parts are damaged, exchange the entire mounted board.
39 39
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-12. SCHEMATIC DIAGRAM - MB-134 Board (6/13) - • See page 67 for IC Block Diagrams. • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10

MB-134 BOARD (6/13)


A
IC B/D IC B/D

IC601 IC602
+5V REGULATOR +5V REGULATOR

GND

GND
ADJ

ADJ
Vin

Vin
IC601 IC602
Vc

Vo

Vc

Vo
SI-3010KM-TLS SI-3010KM-TLS
1 2 3 4 5 1 2 3 4 5

B 1

1
3.3
6.3

5.1

3.3
6.3

5.1
R606
0
USB_VBUS_PCONT1

4 D601
DA2J10100L
D602
DA2J10100L

MB-134
BOARD
C (10/13)
(Page 44) USB_VBUS_PCONT2
R610 R613
2.2k 2.2k

R611 R614
39k 39k

24 C605
1
C609
1
R612
10k
C613
220
R618
10k
C606
1
C608
22
C610
1
R615
10k
R620
0
C614
220
R619
10k
D MB-134
UNSW6V
GND
10V 10V 10V

BOARD
(3/13) CSP
(Chip Size Package)
(Page 37) CN601
IC101 (6/15) 5P

BD DECODER 1 GND
IC101
CXD9983GG (E370: US/E470/E570/T57)
CXD9984GG (EXCEPT E370: US/E470/E570/T57) L604
JL601
JL602
2 DP C
10nH 3 DM R-USB
4 2 JL603
BOARD
E
4 VBUS
L607
JL604 CN151
5 GND
(Page 66)
AK8 AK2 3 1
AVDD12_USB
5
CPU_1.2VA L603
USB_DM0 10nH C619 D603 D605
AK6 AVSS12_USB AL1 10 PGB1010603NR PGB1010603NR
USB_DP0 CN602
MB-134 5P
BOARD AN3 AVDD33_USB AL3
(4/13) CPU_3.3VA 1 GND
B
USB_DM1 JL605
AL5 AVSS33_USB AM2
(Page 38) USB_DP1 2 DP
C604 L606 JL606
10 10nH 3 DM F-USB
4 2 JL607
4 VBUS BOARD
AM4 USB_VRT L608
JL608 CN101
F
5 GND
(Page 66)
3 1
L605
10nH

R601 C620 D604 D606


5.1k 10 PGB1010603NR PGB1010603NR

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.

HBD-E370/E470/E570/E870/T57
40 40
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-13. SCHEMATIC DIAGRAM - MB-134 Board (7/13) - • See page 67 for IC Block Diagrams. • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9

MB-134 BOARD (7/13)


A
UNSW6V
GND 25
CSP 1.2VA MB-134

6.3

3.3

6.3
BOARD

5
(Chip Size Package)
3.3VA (3/13)
IC B/D IC B/D
IC101 (7/15) 5 4 5 4
(Page 37)

VOUT

VOUT
VIN

VIN
BD DECODER
IC101 IC704 IC705
CXD9983GG (E370: US/E470/E570/T57)

NOISE

NOISE
+3.3V REGULATOR +5V REGULATOR

CONT

CONT
CXD9984GG (EXCEPT E370: US/E470/E570/T57)

GND

GND
IC704 IC705
TK11133CSCL-G TK11150CSCL-G

B
1 2 3 1 2 3

3.3

1.3

3.3

1.3
G29
AVDD12_HDMI

26
R739
F30 R734 15k
AVDD12_HDMI
15k HDMI_PCONT
H26
AVDD33_HDMI
J27 PCONT3 MB-134
AVDD33_HDMI
C703 C715 C702 C716
BOARD
C719 C713 C717 C720
0.01 0.22 0.01 0.01 0.01 0.22 0.22 0.22 (13/13)
H28 (Page 47)
AVSS12_HDMI
J29

C
AVSS12_HDMI
G27
AVSS33_HDMI
F28
AVSS33_HDMI

D26 TX2P
CH2_P
B26 TX2N R706
CH2_M

18
27k

C27 TX1P 3.3 S


CH1_P CEC
A27 TX1N 3.3 MB-134
BOARD
D
CH1_M
(13/13)
Q702 CN701
D28 TX0P
INK0001AC1 19P (Page 47)
CH0_P 6.3
B28 TX0N BUFFER
CH0_M HDMI
ARC
OUT
C29 TCKP
CLK_P TX2P
A29 TCKN 1 TMDS DATA2 +
CLK_M
2 TMDS DATA2 SHIELD
TX2N
F40 JL701 3 TMDS DATA2 -

E
HDMISCK TX1P
E41 JL702 4 TMDS DATA1 +
HDMISD
G39 JL703 5 TMDS DATA1 SHIELD
HTPLG TX1N
6 TMDS DATA1 -
TX0P
E43 JL704 7 TMDS DATA0 +
CEC
8 TMDS DATA0 SHIELD
C721 TX0N
B30 R749 9 TMDS DATA0 -
EXT_CAP JL705 0.1 47k TCKP
E29 10 TMDS CLOCK +
EXT_RES
R702 R703 11 TMDS CLOCK SHIELD

F 1k 1.5k TCKN
12 TMDS CLOCK -
R710
0 13 CEC
R735 R740 R743
0 14 RESERVED(ARC)
1.8k 0
15 SCL
R711
R701 220k
10k 16 SDA
R736 R741 R744
0 0 17 DDC/CEC GND
1.8k
18 +5V POWER

19 HPD
CL701 5 4
G
G C706
1.7 0 47
6 3 10V
1.7 2.7 R714 C707
7 2 1
0
3.3 1.7
8 V 1
R713

6
C705
470 0.1

IC701 ARC_SPDIF
MB-134
R712 BOARD
WAVE SHAPER
0
H C701
0.01
IC701
TC7WHU04FK
R709
0
R717
68
R715
47k R718 C708
1
R752
1k
(8/13)
(Page 42)
68

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.

HBD-E370/E470/E570/E870/T57
41 41
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-14. SCHEMATIC DIAGRAM - MB-134 Board (8/13) - • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11 12

MB-134 BOARD (8/13)


A CN901
16P
R903 0
DIR_ERROR 1 DIR_ERROR
JL923 R906 47 SP_MCK
SP_MCK 2 BDV_CSFLAG
JL924
GND 3 BDV_DIR_XSTATE
JL925 R907 47 SP_BCK
SP_BCK 4 CSI_DATAIN

DIR_CSFLAG 5
JL926
R911

R908
0

47 SP_LRCK
CSI_XCS_ADAC 9
SP_LRCK 6 CSI_CLK

B F DIR_XSTATE 7
JL927
R905

R909
0

47 SP_DATA
CSI_DATAOUT
MB-134
BOARD
(10/13)
MAIN SP_DATA 8 BDV_DATA_I
BOARD GND 9 BDV_DIR_AUDIO
(Page 44)
(5/5) R910 0
CN703 CSI_DATAIN 10 XAMUTE
R933 0
(Page 58) CSI_XCS_DIR 11
R916 0
DAC_XRST

CSI_CLK 12
R934 0
CSI_DATAOUT 13
R912
GND 14

6
JL928 47
C DATA_I 15
DIR_AUDIO 16 ARC_SPDIF
R904
MB-134
0 BOARD
CN902 (7/13)
18P R913
0 (Page 41)
XAMUTE 1
GND 2 R939
JL929 0
DIR_XRST 3
JL930
R917
D
GND 4
JL931 0
ARC_SPDIF 5
GND 6 R914
JL932 0 AOSDATA4
AOSDATA4 7

G GND 8
JL933
R918
0 AOBCK CPU_3.3VA
7
MAIN AOBCK 9
C815 CPU_1.2VA MB-134
BOARD GND 10 R919 R940 0.1 BOARD
(5/5) JL934 0 22 AOMCK CSP (4/13)
CN701 AOMCK 11 (Chip Size Package)

(Page 58) R920 (Page 38)


E
GND

AOSDATA2
12

13
JL935 0 AOSDATA2 IC101 (8/15)
JL936 R921 0 AOSDATA0 BD DECODER
AOSDATA0 14
JL937 R922 0 AOSDATA1 IC101
AOSDATA1 CXD9983GG (E370: US/E470/E570/T57)
15 CXD9984GG (EXCEPT E370: US/E470/E570/T57)
JL938 R923 0 AOSDATA3
AOSDATA3 16
JL939 R924 0 AOLRCK
AOLRCK 17
C810
GND 18 0.1
AV10 AVDD12_ST BB6
CL801
SVCTST
R936 AU7 AVDD33_ST
F 10k

AV6 AVDD12_SRX1 AV8


0 AVSS12_ST1
SPMCLK C21 R925 SP_MCK AW5 AVDD12_STX1
SPBCK A21 R926 0 SP_BCK BC1
SRXP_1 HR+0
SPLRCK
SPDATA
B20
G21
R927

R928
0

0
SP_LRCK

SP_DATA
SRXN_1
BB2
BA3
HR-0 8
STXN_1 HT-0
R929 22 BC3
MB-134
STXP_1 HT+0 BOARD
C927 (12/13)
G 10 FE_NS_RFIN
1
JL901 H4
NS_RFIN
AOMCLK D22 JL907 AOMCK AW7 AVDD12_SRX2
AVSS12_ST2
AU9
25M_BUF
(Page 46)
JL902 K8 AOBCK B22 JL908 R930 22 AOBCK AY6 AVDD12_STX2 AW9
MB-134 FE_NS_RFIP NS_RFIP AVSS12_ST2
BOARD JL903 BA1 AOLRCK E23 JL909 R931 22 AOLRCK
C928
(13/13) 1 NS_TSTP
JL904 AY2 AOSDATA0 C23 JL910 R935 22 AOSDATA0 AY4 JL803
(Page 47) JL905 NS_TSTN JL911 AOSDATA1
SRXP_2 JL804
F6 AOSDATA1 G23 BB4
NS_CKIN33 JL912 SRXN_2
AOSDATA2 H22 AOSDATA2 BA5
CL804
JL913 STXN_2 R806 R805
AV4 AOSDATA3 F22 AOSDATA3 BC5 680 100k
CL805 2
AVSS33_SACD STXP_2

H 11 AT6 AOSDATA4
AVSS12_ADC
AOSDATA5
E21
D20
JL914 R932 47 AOSDATA4

BA7
R807
100 X802
25MHz
FE_NS_CLKIN_33 JL915
MB-134 RREF
AU5 R808
BOARD AVDD33_SACD 12k 1
(12/13) AR7 SPDIF A19 JL922 BA9
AVDD12_ADC XTAL25MO
(Page 46) BB8
XTAL25MI JL801
AJ9
VCLK25MI
BC7
AVDD33_XTAL25M
AY8
IC101 (9/15) AVSS33_XTAL25M

BD DECODER

I IC101

27
CXD9983GG (E370: US/E470/E570/T57) C809 C806 C805
CXD9984GG (EXCEPT E370: US/E470/E570/T57) 0.1 12p 12p
CSP
(Chip Size Package) GND
MB-134
BOARD
(3/13)
(Page 37)

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
HBD-E370/E470/E570/E870/T57
42 42
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-15. SCHEMATIC DIAGRAM - MB-134 Board (9/13) - • See page 67 for IC Block Diagrams. • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11

MB-134 BOARD (9/13)


A

A33
DACOUT1
C33
DACOUT2
B32
DACOUT3
A31 JL1001
DACOUT4 IC B/D
C31 JL1002

B DACOUT5

DACOUT6
D30
IC1003
R1011 R1010 VIDEO AMP
150 150
IC1003
MM1797CVBE
E31 R1012
AVDD33_VDACR 150
H32 0.8 3.3
AVSS33_VDACR 1 Vin Vcc2 16 R1031 R1035
3.3 1 75 0
R1007 2 Vcc1 V out 15
150
G31 0.7 0 R1032
AVDD33_VDACY 3 Pr in SD/HD 14 R1028
75 0
H30 1.6 0
R1009 4 Bias Pr out 13
C AVSS33_VDACY
C1002
0.1
150 0.7
5 Pb in GND 12 R1029 R1033
0 J904
-5 0 75
D32 R1008
AVDD33_VDACBG 6 Vee 1 Pb out 11
150 VIDEO
F32 0.8 0 OUT
AVSS33_VDACBG 7 PY in PY out 10
3.3 -5 R1030 R1034
8 Mute Vee 2 9 75 0
E33 C1016 0.1
DACFS JL942
R1005 R1006 C1012 0.1 PR/CR
2.2k 0 JL941
C1009 1
JL940
C1010 0.1
C1001 COMPONENT
D 47
10V
C1015 0.1 PB/CB
VIDEO OUT

IC101 (10/15)
JL944
C1006 1

BD DECODER Y
JL946
IC101
CXD9983GG (E370: US/E470/E570/T57) C1017
CXD9984GG (EXCEPT E370: US/E470/E570/T57) 47
CSP 10V
(Chip Size Package)
C1014 C1018
47 22
10V 10V

E 12 XVMUTE
FORMAT1
MB-134
BOARD R1016
1k
(10/13)
(Page 44)

6.3

3.3

3.3
IC B/D IC B/D

29 IC1001
5 4 5 4

IC1002

CTL
F

CS
VI

VO
PCONT2
MB-134 PCONT3 +3.3V REGULATOR -5V REGULATOR
BOARD IC1001 IC1002
(13/13) NJM2878F3-33(TE2) NJM2828F3-05

GND

GND
CTL
(Page 47)

NC

VO
VI
1 2 3 1 2 3

-7

-5
3.3

DAC3.3VA

G 28 UNSW-6V

UNSW6V R1013
1k
MB-134 C1004 C1008
BOARD 1 0.1
(3/13)
GND
(Page 37)

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.

HBD-E370/E470/E570/E870/T57
43 43
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-16. SCHEMATIC DIAGRAM - MB-134 Board (10/13) - • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

MB-134 BOARD (10/13) CSI_DATAIN


CSI_CLK

A CSP
CSI_DATAOUT

(Chip Size Package) CSI_XCS_ADAC

IC101 (11/15)
DAC_XRST
9
BDV_CSFLAG
BD DECODER MB-134
IC101 BDV_DIR_AUDIO BOARD
CXD9983GG (E370: US/E470/E570/T57) (8/13)
CXD9984GG (EXCEPT E370: US/E470/E570/T57) BDV_DIR_XSTATE

XAMUTE (Page
B R1123
0 DIR_ERROR 42)
BDV_DATA_I
D8
VOUTD0
A3
VOUTD1
E7 15 14 13 12 11
VOUTD2
IC1101

I2C_SCL
NC

MODE0

I2C_SDA

VSS
B4
VOUTD3
C5 EEPROM
VOUTD4 R1141
0
A5 16 NC NC 10
VOUTD5
JL1122
C 17
D6 NC IC1101 NC 9
VOUTD6

30
MFI341S2161
B6 18 NC NC 8
VOUTD7 CSP CORE_STB3.3V
C7 19 NC (Chip Size Package) NC 7
VOUTD8 GND
20 NC NC 6 MB-134
A7
VOUTD9 3.3VA BOARD

MODE1

RESET
B8 R1125 R1124 RB1102 RB1101 (3/13)

VCC
VOUTD10

NC

NC
10k
VOUTD11
C9
0 47 10k
(Page 37)
A9 1 2 3 4 5
VOUTD12
D10
VOUTD13

D VOUTD14
B10
C11
R1162
47
R1163
47
CN1102
6P
VOUTD15 AT2 AT12 JL1129
XI_RTC
E11 SCL 1 3.3V
VOUTD16 AT4 AV14 JL1130
XO_RTC
F12 R1119 SDA 2 GND
VOUTD17 R1191 JL1131
47 0 AR5 RTCRBIAS
G13 3 RXD
VOUTD18 JL1158 D36 JL1120 JL1132 (NC)
E13 R1118 C1105 UATXD 4 TXD
VOUTD19 R1122 JL1121 JL1133
0 0 0.1 AU1 AVDD33_RTC A37
UARXD 5 JIG_MODE1
AU3 JL1134
AVSS33_RTC
G11 6 JIG_MODE0
VOUTVSYNC JL1101 AY12 JL1123
C1104 C1107 R1120 C1108 C1109
E VOUTHSYNC
F10
JL1102 100p 100p 10k 100p 100p
JL1117
TRST_
TCK
BA11 JL1126 R1169 10k

F20 BC11 JL1125


MCIN
E9 TMS
VOUTCLK1 JL1103 BB12 JL1124
F8 TDI
VOUTCLK2 JL1104 JL1110 H20 BB10 JL1128
AMUTE
C1103 TDO
100p

A11 JL1106 R1101 0 R1131


0
D34 VSTB
MRESET_
C35
MRESET
13
VIND0 JL1115 B34 E35
JL1107 R1102 0 VDATA MB-134
D12 RESET_
VIND1 JL1112 R1132 0 A35 VCLK R1156 BOARD
JL1105
F VIND2
E15
JL1113 R1133 0 G33 LCDRD AP4
100 (12/13)

VIND3
F16 JL1108 R1103 0
R1134
CORE_RESETB (Page 46)
B12 JL1109
JL1111 0 R1152 R1153
VIND4 C17 GPIO0
JL1145 4.7k 4.7k
F14
VIND5 JL1114 A17 AU11
JL1146 GPIO1
H14 EFPWRQ
VIND6 R1127 100 JL1116 C19
R1107 0 JL1147 GPIO2
F18
VIND7 JL1153 R1135 0 B18 GPIO3
16
JL1148 R1164
G15 10k
VIND8 JL1156 AY10 B36 JL1118
JL1149 GPIO4
J17 IR CPU_XRST
VIND9 JL1157 AW11
R1110 0 JL1150 R1136 GPIO5 MB-134
G VIND10
G17
C13 JL1151
JL1154 0
AV12 GPIO6 R1157
0
C1111
BOARD
(11/13)
VIND11 JL1119 100p
BC9 GPIO7 F34
VIND12
A13 JL1135
JL1155
OPWRSB
R1190
(Page 45)
D14 JL1136 R1165
VIND13 100
100
B14 JL1137
VIND14
C15 JL1138
C1102 C1101 R1121
VIND15
100p 100p 100
IC101 (12/15)
A15 JL1139
VIND16
D18 JL1140

H
VIND17
VIND18
G19 JL1141
BD DECODER
IC101
CXD9983GG (E370: US/E470/E570/T57)
CPU_3.3VA
15
E19 JL1142
VIND19
CXD9984GG (EXCEPT E370: US/E470/E570/T57) MB-134
R1116 R1115 CSP BOARD
0 0 (Chip Size Package) (4/13)
E17 JL1152
VINVSYNC
B16
(Page 38)
VINHSYNC JL1143

D16
VINCLK JL1144

I
MB-134
12
FORMAT1
BOARD
(9/13) XVMUTE

(Page 43)
MB-134
4
USB_VBUS_PCONT1 CPU_XRST
BOARD
(6/13) USB_VBUS_PCONT2 CPU_NFALE

J (Page 40) R1117


R1149
10k
CPU_SFCK

2
0
R1147
SYSCON_RST 10k
IF_SDO CPU_NFCEN2
MB-134
IF_SCK CPU_NFWEN BOARD
(5/13)
14 IF_SDI
SYSCON_REQ
CPU_NFCLE

CPU_NFREN (Page 39)


MB-134 START_BIT CPU_NFCEN
BOARD
FE_SFDI
K (13/13) XIF_CS

(Page 47) UPG_STATUS


R1189
100k
R1138
10k
RB1103
10k
R1139
10k
JIG_MODE1
OPWRSB
CORE_RST

Note: IC101 on the MB-134 board cannot exchange with single. When
HBD-E370/E470/E570/E870/T57 this part is damaged, exchange the entire mounted board.
44 44
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-17. SCHEMATIC DIAGRAM - MB-134 Board (11/13) - • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11

MB-134 BOARD (11/13)


A ETTXD3

ETTXD2
ETTXD0 JL1207 C43
ETTXD1 ETTXD0
ETTXD1 JL1208 D40
ETTXD0 ETTXD1
ETTXD2 JL1209 D42
ETTXD2
ETTXD3 JL1210 E39
ETTXD3
ETTXEN JL1211 D38
ETTXEN
ETMDC JL1212 F36
B R1201
10
R1204
49.9 C1208 C1206 C1210 C1218
0.01
R1232
10k
R1231
10k
ETMDIO JL1213 B38
ETMDC

ETMDIO
0.01 0.01 4.7 ETTXCLK JL1214 C41

49.9

49.9
49.9
ETTXCLK
ETRXCLK JL1215 A43
ETRXCLK
JL1216

R1206

R1205
R1207
ETCRS H34
R1217 100 ETTXCLK ETCRS
ETRXD0 JL1217 A41
R1216 100 ETRXER ETRXD0
CN1201 JL1218
ETRXD1 B40
8P R1220 100 ETRXCLK ETRXD1
ETHERNET ETRXD2 JL1219 C39
CONNECTOR R1218 100 ETRXDV ETRXD2
L1202 ETRXD3 JL1220 A39
LAN (100)
C 1 JL1201 3 1
ETRXD0
ETRXD1
ETCOL JL1221 C37
ETRXD3
ETCOL
ETRXDV JL1222 F38
3 ETRXD2 ETRXDV
ETTXER JL1223 E37
2 JL1202 27 26 25 24 23 22 21 20 19 ETRXD3 ETTXER
4 2 ETRXER JL1224 B42
5 JL1203

TXD3

TXD2

VDDIO
TXD1

TXD0

TXCLK
RX_ER
RX_CLK

RX_DV
ETRXER
RB1201
4 JL1204 L1201 100
6 JL1205 28 TXN RXD0 18
3 1
7 JL1206 29 TXP RXD1 17
CSP R1226
IC101
8
D
30 VDDA3.3 (Chip Size Package) RXD2 16 10k
(13/15)
IC1201
4 2 31 RXN RXD3 15
BD DECODER
32 RXP CLKIN 14 IC101
ETHERNET INTERFACE CXD9983GG (E370: US/E470/E570/T57)
C1201 33 VDDA3.3 IC1201 XTAL2 13 CXD9984GG (EXCEPT E370: US/E470/E570/T57)
0.022 LAN8700C-AEZG-CTI
34 EXRES1 PA3 12 CSP
R1208 R1209 (Chip Size Package)
2.4k 10k 35 VDDA3.3 PA2 11

VDD_CORE
36 COL PA1 10

TX_ER

TX_EN
VDD33
MDIO

nRST
MDC

CRS

PA0
E 1 2 3 4 5 6 7 8 9

X1201

16
25MHz
R1215
100
CPU_XRST 1
MB-134
BOARD
(10/13)
2
(Page 44)
F R1214
10k

CORE_STB3.3V

31 R1227
100k

MB-134
BOARD C1214 C1215 C1213 R1219 C1217 C1216
4.7 0.1 0.01 1.5k 15p 15p
(3/13)
(Page 37) GND
ETTXEN
R1247 100 ETMDIO

G R1213 100 ETCRS

ETMDC
ETTXER
R1210
100
ETCOL

Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.

HBD-E370/E470/E570/E870/T57
45 45
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-18. SCHEMATIC DIAGRAM - MB-134 Board (12/13) - • See page 67 for IC Block Diagrams. • See page 77 for IC Pin Function Description.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

MB-134 BOARD (12/13)


A
R2412 R2411 FB2403 C2403 C2470
33k 33k 2.2 0.1 0.1 CN2460
IC B/D C2401 9P
0.1
FE_SLED_A-
9 /A

IC2401 C2400
FE_SLED_A+

FE_SLED_B-
8 A

MOTOR DRIVER 100 7 /B


16V FE_SLED_B+
IC2401
B
6 B
TPIC1405DFDRG4 BD DRIVE
5 FGND BPX-5
19.7 C19V 0 FE_SLED_A- FE_SPDL_W (1/3)
1 56 4 U
SLED2_N
FE_SPDL_V
13.2 CP2 0 FE_SLED_A+ 3 V
C2402 2 55 FE_SPDL_U
0.1 SLED2_P
2 W
0 CP1 13.2 FE_SPDL_COMMON
C2404 3 54 1 COMMON
P12V_3
1 C2460
5 CA5V 0 FE_SLED_B- 0.1
4 53
SLED1_N
AGND_1 0 FE_SLED_B+
5 52
C 1.4 VREF
SLED1_P

6 51
C2405 PGND_3 C2450 C2499
2.2 13.2 0.1 10
TEST1 50
7
CV3P3
TEST2 FE_SPDL_COMMON
8 49
MCOM
R2496 R2487
TEST3 0 SL2497

1.8k
1.8k

1.8k
1.8k

1.8k
9 48 1.8k 0 CL2487
ISENSE C2495
CL2410 10
0
10 TEST4 47

R2442
R2492

R2444
R2494

R2446
CL2411 ICOM2
D FE_FG 0
11 XFG
W
46
FE_SPDL_W
SL2475
CN2470
5P
CL2412
FE_LIMIT 0 13.2 5 TRAY-OUT
12 MONITOR 45 CL1300
CL2413 P12V_2
4 GND
0 0 FE_SPDL_V BD DRIVE
13 XMUTE1 44 3 TRAY-IN BPX-5
CL2414 V R2447 C2491 CL2472 (2/3)
0.16 1/3W 10 SL2473 2
0 0 LOAD+
14 XMUTE2 43 CL2471
ICOM1
1 LOAD-
R2483
FE_GAINSW2 0 0 FE_SPDL_U
15 GC 42 0
R2416 U
CL2416
36k
E
FE_FMO2 0 13.2
16 VSLED1 41 CL2483
R2417 CL2417 P12V_1 C2440 C2438 R1372
36k 0.1 10 2.2k
FE_FMO 0 10
17 VSLED2 40
R2418 CL2418 C10V
CSP
FE_DMO 10k 0 5 (Chip Size Package)
18 VSPIN 39
P5V_2
IC101 (14/15)
R2419 CL2419
FE_TYPWM 0 0
19 VLOAD 38
R2420 CL2420 AGND_3
BD DECODER
FE_TRO 51k 0
20 VTRK 37 IC101
R2421 CL2421 TEST6 CXD9983GG (E370: US/E470/E570/T57)
FE_FOO 91k 0 CXD9984GG (EXCEPT E370: US/E470/E570/T57)
21 VFCS 36
F FE_TLO
R2422
91k
CL2422
0
TEST5

22 VTLT 35
AGND_2
JL1300 AD8 C1
23 PGND_1 FE_SFCLK

FE_TILT+ 0
PGND_2
34

0
JL1301 AG9
FE_GIO0
FE_SFDI F2
FE_SFCLK

FE_SFDI
1
24 TLT_P 33 JL1303 AG1
FE_GIO1
E1
LOAD_N FE_SFDO MB-134
FE_GIO3 FE_SFDO
FE_TILT- 0 0 JL1312 AE9 K6 BOARD
25 TLT_N 32 FE_SFCS#
FE_SFCS (5/13)
LOAD_P JL1313 FE_GIO12
FE_TRAYIN FE_EJECT AT10 FE_SFWP# L7
5
26 P5V_1
P5V12L
31
5
FE_TRAYOUT
R1302
FE_GIO13
FE_SFHOLD# F4
(Page 39)
G FE_FR+ 0
27 FCS_P
TRK_N
30
0
FB2481
0 FE_TR- 10k JL1302 E3
FE_GIO2
FE_GIO4 JL1304 J7 AH2 CL1398
FE_PLAY#
FE_FR- 0 0 FE_TR+
28 FCS_N 29 FE_GIO5 JL1305 J5
FE_GIO4
AH4 CL1399
TRK_P FE_EJECT#
FE_GIO5
2200p

FE_GIO6 JL1306 G9
470p

470p
68p

68p
68p

0.1

JL1307 FE_GIO6
FE_GIO7 G5
FE_GIO7
C2422

C2421
C2420

C2419

C2418
C2417

C2416

JL1308 L9
FE_GIO8
C2486
10
C2364
10
C2481
10
C2432
0.01
C2433
0.01
FE_SW12V
FE_SW5V
32 R1308
10k
JL1309

JL1310
E5

H8
FE_GIO9

H FE_GND_M MB-134
BOARD
JL1311 D2
FE_GIO10
FE_GIO11
R2307
47k
GND (3/13)
IC B/D
IC2301 (Page 37) CL1317
G7
FE_JTCLK
MOTOR DRIVER, REGULATOR AV2
JL1318
IC2301 JL1319 FE_JRTCLK
TPIC1391DBTRG4 AW3
FE_JTDI
H2
CL1315
CL2301 LEDO FE_JTDO C1398 C1399
CL2330 JL1316
1 Latch_RSOUT 30 AW1 0.1 0.1
FE_JTMS
Latch_SET H6
CL2302 CL2329 CL1314
I
2 29 FE_JTRST#
Latch_XRSOUT
Latch_CLR
CL2303 CL2328
3 CSW 28 FE_3.3V
5 SWR_SEQ1 C2324 AJ3
CL2327
4 CSWO 27 10 FE_XTAL25MI
AJ1
SWR_SEQ2 FE_XTAL25MO
5 TEST1 26
SWR_OUTSEL C2322
5 0 10
6 /XMUTE FB3P3V 25
AM6
FE_GAINSW 0 STEP_ENA 0 FE_SXVDD33
R2308
7 REG3P3V 24 AL7 C1387 C1389
(Page 42)
J
L2324 FE_SVDD33 0.01 0.01
FE_FMO4 22k 0 1.5uH
STP1_IN FE_STXP AN1
8 PGND_SW 23 HR+0
FE_FMO3 0
9
STP2_IN
REG1PxV 22
0
L2322
1.5uH
AN7
AP6
FE_STXN
FE_SPLLVDD12
FE_SRXN
AP2
AR3
C1386

C1383
0.01

0.01
C1388

C1385
0.01

0.01
HR-0 8
R2309 FE_STXVDD12 HT-0
22k
C2309 C2308
5 5 C1382 0.01 C1384 0.01 MB-134
470p 470p XLEDON AP8 FE_SRXP AR1
10 P5V_SW 21 FE_AVDD12_RX HT+0 BOARD
FE_V14REF
JL1370 (8/13)
0 FE_1.2V 25M_BUF
11 CSWON
FB1PxV 20 AN5 FE_RSTI M6
FE_SAGND
COLLIENDZ 0 FE_CO_A-
12 STP2- 19

K 13
XRESET
STP2+ 18
0 FE_CO_A+
FE_NS_CLKIN_33
11
5 0 FE_CO_B- C1362 C1361 C1363 C1326 C1366 C1367 C1365 C1370 R1370 MB-134
A5V 2.2 0.01 100p 0.01 2.2 0.01 100p 0.1 1k
14 STP1- 17 BOARD
(8/13)
0 FE_CO_B+
15 AGND
C2300 FB2300
STP1+ 16
C2371 C1305
(Page 42)
13
0.1 2.2 10 100 R1371
16V 10

17 MRESET
MB-134
L FE_BUS
MB-134
BOARD
(10/13)
BOARD
(13/13) (Page 44)
(Page 47)
Note: IC101 on the MB-134 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
HBD-E370/E470/E570/E870/T57
46 46
HBD-E370/E470/E570/E870/T57
Ver. 1.1

5-19. SCHEMATIC DIAGRAM - MB-134 Board (13/13) - • See page 67 for IC Block Diagrams. • See page 77 for IC Pin Function Description.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

MB-134 BOARD (13/13)


A
26
R1471 C1470
22k 0.1
HDMI_PCONT
PCONT3 C1468
MB-134
R1470 0.1
TH1501 BOARD V4 FE_REG_CAP P8
18
1.2k
(7/13) FE_AVDD12_1
K4 FE_EQBIAS R9 C1469

MB-134
CEC
UPG_STATUS
R1524
10k
(Page 41) FE_AVDD12_2
AB8
0.1

FE_AVDD12_3
BOARD FE_RFO+ CL1423 C1423 0.1 Y2 FE_RFIP AC7
(7/13) FE_AVDD12_4
29
R1613 FE_RFO- CL1422 C1422 0.1
100k Y4 FE_RFIN C1476
B (Page 41) XIF_CS PCONT3
PCONT2
FE_DRFO+ CL1426 C1426 0.1 W1 FE_RFIP2 V8
0.1

R1612 MB-134 CL1425 FE_AVDD33


FE_DRFO- C1425 0.1 W3 FE_RFIN2 U9 C1477
100k BOARD
START_BIT FE_AVDD33 0.1
(9/13) W9
R1562 FE_AVDD33
(Page 43) FE_IN_A CL1430 P2 FE_INA AA9
CN1505 SYSCON_REQ 100k
27P R1568 CL1432 FE_AVDD33_LVDS
FE_IN_B N1 FE_INB
JL1535 0
R1563 CL1420
TEMP 1 100k FE_IN_C R3 FE_INC W5
ATA_PCONT PCONT3 FE_AGND
34
GND 2 R1569 FE_IN_D CL1428
0 PCONT3 T6 FE_IND W7
JL1536 SYSCON_RST SYSCON_RST PCONT2 FE_AGND
XIF_RST 3 R1611 FE_IN_E CL1419
100k PCONT2 V6 FE_INE AA7
JL1537 R1570 0
C
START_BIT CORE_RST PCONT_CORE FE_AGND
IF_START_BIT 4 PCONT_CORE MB-134 FE_IN_F CL1417 U1 FE_INF Y8
JL1538 R1571 0 SYSCON_REQ R1554 ATA_PCONT BOARD FE_AGND
R1551 CL1431
SYSCON_REQ 5 0 100k