Advances in miniature

spectrometer and sensor

development
Jouko Malinen

VTT Technical Research Centre of Finland

Click to edit Master title style
Co-authors

Click
Dr. to Rissanen
Anna edit Master text MEMSstyles
FPI technoloy
Second
Dr. Heikki level
Saari Piezo-actuated FPI and hyperspectral
Third level technology
Fourth level
Dr. Mikko Karppinen Spectrometer integration
Fifth level
Dr. Pentti Karioja R2R printed sensors
Dr. Timo Aalto Silicon photonics
Mr. Kari Tukkiniemi ASIC design

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Click to edit Master title style
Outline

Clickminiature
Why to edit Master text styles
Second level
Fabry-Perot tunable filter
Third level
MEMS spectral engines
Fourth level
Spectrometer integration
Fifth level

Piezo-actuated FPI
Emerging sensor developments

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Click to editfor
Motivation Master
miniaturization
title style

• Miniaturizing spectrometers into hand held-mobile-connected sensors

Click toopportunity
creates edit Master text applications:
for novel styles
Second level
Third level
Cost critical process on-line measurements
Fourth level
Environmental sensing (Internet of Things)
Fifth
Gas level
sensing
Health and wellness, diagnostics

From benchtop to handheld

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 Introduction
Click – Fabry
to edit Master Perot interferometer
title style

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Second level
Third level
Fourth level
Fifth level

Basic equation for transmitted wavelengths:

= 2d/m

Passband = 430 nm

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 Click to edit
The two Master
filter title style
platforms - summary

ClickPIEZO-ACTUATED
to edit Master text styles
MEMS
Second level
Third level
Fourth level
Fifth level

Large aperture sizes, ~20 mm Optical apertures up to ~2 mm

Accurate gap control through integrated Superior mirror flatness
capacitance measurement Insensitive to vibrations or positioning
Easily customized Low operational voltages
For low to medium annual volumes For medium to high annual volumes
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MEMS spectral engines
 MEMS
Click tospectrometer development
edit Master title style and
commercialization at VTT
20 year development effort, 15M€+ investment, 100 man years
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MEMS-FPI Master
solutions coveringtext styles
UV-VIS-NIR-IR-TIR, 350nm – 12 µm
Second
Supporting level
patent portfolio
Partners: Vaisala, VTT Memsfab, Spectral Engines …
Third level
Fourth level
Fifth level

1997 - 2003 2006 2009 2012 2013 2014

Pen Fuel quality GasSensor memsNIR
Imager
spectrometer sensor
Ethylene
sensor for Imaging
platform dvlpt
ESA
Vaisala
CarboCap
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 Click
MEMStoFPI
edit Master platforms
process title style & wavelengths

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UV/visible FPI NIR/MIR FPI MIR/TIR FPI
Second level
Third level
Fourth level
Fifth level

Ultra-compact chip spectrometer

Wavelength

UV Visible Low NIR Near IR Mid IR Thermal IR

200 – 350 nm 350 – 800 nm 0.8 – 1.1µm 1,1 – 2,5 µm 3 – 7 µm 7 – 12 µm

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NIR
Clickspectrometer engine
to edit Master title style

1.3 - 1.7 µm
Click toranges
Wavelength edit Master text styles 1.6 - 2.0 µm
1.7 - 2.2 µm
Second level
Resolution
0.7-1.4 %
Third
(% of wavelength) 1
level
Wavelength settling time
Fourth level < 0.8 ms
memsNIR prototype
SNR (typical) Fifth level 3000
Power consumption <1W
Optical interface SMA 905
Input fiber core diameter Max. 400 µm diam.
Numerical aperture 0.22
Wavelength stability < 0.1 nm / C
Dynamic range > 15 bits
Size 50 x 35 x 20 mm3
Weight < 50 g
Operating temperature range +10..+35 C Moisture in paper (0.1, 3.5 and 10.1%)

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Click tohydrocarbon
MEMS edit Master title
gas style
sensor

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Main characteristics
Second level
Wavelength range
Third level 3000-3500 nm
Fourth level
Spectral resolution 50-60 nm
Optical path length Fifth level
17 mm
Spectrum acquisition 2 s (10 spectral
time points)
Power consumption
<2W
(continuous mode)

Size 77 x 38 x25 mm
Weight 95 g

Mannila R., Tuohiniemi , M., Mäkynen, J., Näkki, I., Antila, J., "Hydrocarbon gas detection with
microelectromechanical Fabry-Perot interferometer ", Proc. SPIE 8726, 872608 (2013).

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 Thermal IR MEMS Fabry-Perot
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Interferometer

Wavelength range from 7.5 µm to 9.5 µm MEMS FPI characterization

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Control voltage from 0-30V
FWHM Second level
of 140nm
Third1.2
Aperture size level
mm
Fourth level
/4 layers of polysilicon-air-polysilicon
Fifth level
Mirror
structure

MEMS FPI cross section

Tuohiniemi, M., Blomberg, M., Akujärvi, A., Antila, J., Saari, H., “Optical transmission performance of a surface-micromachined
Fabry-Pérot interferometer for thermal infrared” J. Micromech. Microeng. Vol. 22(11), 115004, (2012).

Tuohiniemi, M., Näsilä, A., Mäkynen, J., “Characterization of the tuning performance of a micro-machined Fabry-Pérot
interferometer for thermal infrared”, J. Micromech. Microeng. Vol. 23 (7), 075011, (2013).

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Click to edit Master title style
Spin-off starting from VTT

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Second level
Third level
Fourth level
Fifth level

Spectrometer performance
at sensor price point

www.spectralengines.com
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Click to edit Master title style

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Second level
Third level
Fourth level
Fifth level

Spectrometer integration

14
 Competences and challenges for miniaturization
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High-precision 3D integration and
alignment packaging
(passive or active;
Click to edit Master text styles (electronics,
e.g. fiber pigtailing) bare die mounting
Second level gas/liquid channels,…)
Third level
Thermal management Fourth level Encapsulation
(CTE matching, Fifth level (hermetic sealing,
temperature control, windows)
minimized dissipation)

Electronics Silicon photonics

integration (propagation losses,
(performance, EMI optical throughput,
issues) polarization)

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 Click to edit Master title mid-IR
System-on-package: style gas analyzer

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Second level
Third level
Fourth level
Fifth level

Test setup

Proto
sensor head

10 cm

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Click to edit Master title style

Click to edit Master text styles

Second level
Third level
Fourth level
Fifth level

Piezo-actuated FPI -
spectrometers and
hyperspectral cameras
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 Click to edit
Piezo-FPI Master title style
platform

Piezo-actuator tuneable FPI assembled from MEMS-

Clickreflectors
based to edit Master text styles
Small- to medium
Second volume production
level
Easy customization
Third leveland fast device prototyping
compared to MEMS
Fourth level
Large optical aperture provides excellent sensitivity
Fifth level
Large tuning range with single element
Robust construction (tested for space requirements)
Wavelengths from UV to thermal IR
Wavelength

UV Visible Low NIR Near IR Mid IR Thermal IR

200 – 350 nm 350 – 800 nm 0.8 – 1.1µm 1,1 – 2,5 µm 3 – 7 µm 7 – 12 µm

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 VIS-VNIR hyperspectral
Click to edit Master titlecamera
style
Light-weight (~0.5 kg): can be
operated with low-cost UAVs
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Wavelength range 500 - 900 nm
Second level
Third level Wavelength resolution 10 nm
Fourth level CMOS image sensor 1 – 5 Mpix
Fifth level
Small
biomass

Commercially
Large
biomass available:

Publications: www.rikola.fi
Saari, H et al, “Unmanned Aerial Vehicle
(UAV) operated spectral camera system for
forest and agriculture applications”, Proc.
SPIE 8174 (2011).
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 Click to edit
VIS-VNIR Master title camera
hyperspectral style in medical
application studies
VTT’s
Click to edit Master textcamera
styles can detect skin cancer within seconds
Second level Easy-to-use hand held instrument
Third level Fast screening and early detection of skin cancer
Application being studied at the University of Jyväskylä
Fourth level
Fifth level
Wavelength range:
500-900 nm

Wavelength resolution:
Ca. 10-30 nm

Spatial resolution:
2 Mpix

Development status:
• 1st generation
Neittaanmäki-Perttu, N., Grönroos, M., Tani, T., Pölönen, I., Ranki, A., Saksela, O. prototype done
and Snellman, E., “Detecting Field Cancerization using Hyperspectral Imaging • Application studies
System”, accepted for publication in Lasers in Surgery & Medicine Journal in June ongoing
2013.
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Wavelength ranges of Piezo-FPI Available, dielectric mirrors
Click
and to edit
image Master title style
sensors Available, metallic mirrors
Customizable, dielectric mirrors

Click FPI
Dielectric to edit Master text styles
mirrors
Second level
Metallic FPI
mirrors Third level
Dielectric FPI Fourth level
mirrors Fifth level
.2 .3 .4 .6 .8 11 2 3 4 6 10
8 10 11 12 14
Wavelength (µm)

CMOS&CCD

InGaAs
Ext-InGaAs
InSb
MCT
.2 .3 .4 .6 .8 11 2 3 4 6 10
8 10 11 12 14

Wavelength (µm)
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Click to edit
Stand-off Master
Raman title style at FOI with
spectroscopy
UV-FPI
Click toselection
Precise edit Master
of Raman textshifts
styles
Second level
in combination with high out-of-
band blocking
Third level
Works in the UV range
Fourth levelwhere no
comparable filtering systems
Fifth level are
commercially available
Compact, high resolution (~0.2 nm
@ FWHM) UV-FPI
Module operation stable under
varying environmental conditions

Glimtoft, M., Bååth, P., Östmark , H., Saari, H., Mäkynen, J., Näsilä, A.,
“Towards eye-safe standoff Raman imaging systems”, SPIE Proceedings 9072,
(2014).

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Click to
Large edit Master
aperture title style
piezo-FPI gas sensors

Separately assembled Mid-IR FPI tunable filter platforms for

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Multi-gas measurements
Second level
Correlation spectroscopy
Third level
Large apertures provide high optical throughput
Fourth level
Application testing
Fifthwith
level an industrial gas analysis system
Quantitative multi-gas analysis possible

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Click to edit Master
Single-Band Tunabletitle
FPIstyle
Filter Platform
Air gap
Electrodes
Replacement for filter wheel
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Bragg mirrors fabricated on Piezo n=1..2
Second level
silicon wafers actuation air gap=2..3 µm
Third level
Capacitive air gap
Fourth level
measurement and off-the-
Fifth level
shelf piezos for actuation
Dedicated assembly and
calibration procedure
Tunability: 4-5 µm
Spectral resolution (wide
band due to application
need): ~70 nm (FWHM)

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Click to editSpectroscopy
Correlation Master title style
FPI Platform
Air gap
Electrodes
Correlation spectroscopy for
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high sensitivity Piezo
Second level actuation n=~550
Air gap in millimeters (high air gap=~1.2 mm
diffractionThird level
order) Spacers
Fourth level
Spacers provide Fifth
small gap for
level
accurate capacitive
measurement
Transmission pattern mimics
absorption of CO
Tunability for correlation and
anti-correlation with CO

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Click to edit Master title style

Click to edit Master text styles

Second level
Third level
Fourth level
Fifth level

Emerging sensor
developments

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Printed
Clickand Hybrid
to edit Functionalities
Master title style research at VTT
Research Focus
From printed components to printed and hybrid systems
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Solutions edit Master text styles
Technology
Second(material
level development and tuning, process planning and design,
device and systems designs and modelling) and business development services,
examples:Third level
Printed Fourth
solar cells,
levellighting solutions (ILEDs, OLEDs), printed transistors,
printed sensors and
Fifth indicators, printed power sources, nanoparticles and
level
functional inks
Scaling up services using printing and hybrid pilot lines

Benefit to Customers
New thin flexible product concepts made possible
Help in finding new business opportunities available
Low risk for scaling up production

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Nanoimprint lithography
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title style
UV nanoimprint process Roll to roll UV-imprinting process

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Second level
Third level
Fourth level
Fifth level

Aspect ratios for different

processes at present day Sheet level R2R UV-replication

Current status 3…5 1.5 … 2

R&D status 4…7 2…3

Best results in the field 6 … 10 3

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 R2R waveguide sensors
Sensor roll Sensor chip Sensor waveguide

Sensor roll length is some hundreds of meters

Sensor chip dimensions are in centimeters mostly due to robust sample
handling
-> one roll can contain tens of thousands of sensor chips
Typical waveguide width is 1…3 µm
Sensor elements are functionalized/passivated in post-process
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 R2R SERS sensor chip development in
Photosens consortium project

Nanoimprinted roll of substrate

Nanoimprinted roll of substrate
showing and cut out 96 well
showing continuous SERS array
plate (gold coated)

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Enabling technology: Silicon photonics

Photonic integrated circuits on SOI wafers

VTT has developed a unique µm-scale SOI waveguide platform
Dense integration and low-cost volume production
Low propagation losses (0.1 dB/cm)
Small polarisation dependency
Single-mode operation over an ultra-wide wavelength range

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Click to edit Master title
Microspectrometers withstyle
silicon photonics ?

Emerging technology
Click to edit Master text forstyles
microspectrometers in the future
Multiple wavelength
Second level filters in a single circuit
Wideband & level
Third narrowband filtering combined
Fourthswitching
Filter tunability, level and modulation
Fifth level
Light sources and detectors can be hybrid
integrated on SOI chips

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Thank you for your attention !

jouko.malinen@vtt.fi