FACULTY OF MECHANICAL ENGINEERING

ADVANCED HEAT TRANSFER

MMCT 5113

“ASSIGNMENT 1”

1. AHMAD RAZIN BIN JASMI M041510003

PREPARED FOR:

DR. MOHD ZAID BIN AKOP

Transient Heat Conduction

With the consideration of the variation of the temperature with time constraints as well
as position in one and multidimensional systems, transient heat transfer can be describe as the
lumped body in which the temperature of the body varies with time but remains uniform
throughout at any time.

Lumped System Analysis

Interior temperatures of some bodies remain essentially uniform at all times during a
heat transfer process. The temperature of such bodies are only a function of time, T = T(t).
The heat transfer analysis based on this idealization is called lumped system analysis.
Consider a body of arbitrary shape of mass m, volume V, surface area A, density ρ and
specific heat Cp initially at a uniform temperature Ti. The lumped system analysis can be
simplified as figure below.

At time t = 0, the body is placed into a medium at temperature T∞ (T∞ >Ti) with a heat
transfer coefficient h. An energy balance of the solid for a time interval dt can be expressed
as:

heat transfer into the body during dt = the increase in the energy of the body during dt

h A (T∞ ‐ T) dt = m Cp dT

With m = ρV and change of variable dT = d(T ‐ T∞), we find:

Integrating from t = 0 to T = Ti:

Using above equation, we can determine the temperature T(t) of a body at time t, or
alternatively, the time t required for the temperature to reach a specified value T(t). Note that
the temperature of a body approaches the ambient temperature T∞ exponentially. A large
value of b indicates that the body will approach the environment temperature in a short time.
b is proportional to the surface area, but inversely proportional to the mass and the specific
heat of the body. The total amount of heat transfer between a body and its surroundings over a
time interval is:

Q = m Cp [T(t) – Ti]

Temperature of a lump system

Heat Pipe as the Laptop Cooling System

From my identification, one of the devices that involve heat transfer system is the heat
pipe inside the laptop. Basically, heat pipe is the device which looks like a copper pipe that
connected between the Central Processing Unit (CPU) and Graphic Processing Unit (GPU) to
the internal flow rate fans inside your laptop as shown in figure 1. The CPU and GPU is
known as the laptop brain which used to process all data input from the user. CPU and GPU
also is the main source of heat in the system that makes the user feel the heat from the
outsides which have to be cooling down in order to avoid the system from overheating.

Figure 1: Heat pipe position in the laptop

Overheating laptop can gives many negative impacts in term of slowing down the
performance of the laptop (lagging and hang), loss of data and even burn out the other
component inside including the motherboard. That is why cooling systems are very important
in other to provide the better performance for the user. Heat pipe is one of the commonly use
cooling system in the laptop. Heat pipe is basically is the heat transfer device that combines
the principles of both thermal conductivity and phase transition to efficiently manage the
transfer of heat between two solid interfaces. [13]
Heat Pipe and the Heat Transfer Phenomena.

Not only limited to the Laptop cooling system, heat pipe is widely used as the cooling
system in many areas which includes solar energy systems, heat recovery systems, air
conditioning systems, cooling of energy storage and electronic equipment, industrial
applications and space apparatus. Heat pipes can be designed and constructed with various
cross-sectional areas and geometries ranging from the small design for electronic device to the
large design for industrial application.

A heat pipes basically is a closed evaporator-condenser system consisting of a sealed,

hollow tube whose inside walls are lined with a capillary structure which filled with a liquid
coolant that moves heat by evaporating and condensing in an endless cycle. A heat pipe can be
considered a passive heat pump, moving heat as a result of the laws of physics. As the lower
end of the heat pipe is exposed to heat the coolant within it starts to evaporate as it absorbing
heat. As the coolant turns into vapour, the reduced molecular density forces the vaporized
coolant upwards, where it is exposed to the cold end of the heat pipe. The coolant then
condenses back into a liquid state, releasing the latent heat. Since the rate of condensation
increases with increased temperature difference between the vapour and heat pipe surface, the
gaseous coolant automatically streams towards the coldest spot within the heat pipe. As the
coolant condenses, and its molecular density increases once more, gravitational forces pull the
coolant towards the lower end of the heat pipe. The condensation of the vapour occurs
wherever the temperature is even slightly below that of the evaporation area. As it condenses,
the vapour gives up the heat it acquired during evaporation. The capillary surfaces within the
heat pipe break the coolants surface tension, distributing it evenly throughout the structure. As
soon as coolant evaporates on one end, the coolants surface tension automatically pulls in
fresh coolant from the surrounding area. As a result of the self-organizing streams of the
coolant in both phases, heat is actively convecting through Heat Pipes throughout the entire
coolant cycle, at a rate unmatched by solid Heat spreaders and Heat sinks.

In the laptop application, the heat pipe working principle can be describes base on
figure 2 below. The heat pipe is basically connected from the CPU as shown in condition 1 to
internal fan in condition 6. In 1, as the CPU produce heat, the heat is being absorb by the
working fluid and cause them to evaporate to vapour, the vapour then migrates along the
cavity (2), to the lower temperature end which toward the internal fan.
 Figure 2: the heat pipe thermal cycle

In 3, as the fan blow the air through the end of the heat pipe, it causes the heat to be
removes from the vapour and make it condense back to became fluid. The fluid is then
absorbed by the wick at the wick area as shown in figure 3. The fluid is the flow back to the
high temperature area due to the capillary pressure.

Figure 3: Heat pipe cross section

Heat Pipe: Recent Development

From the basic concept of the heat pipe which transport liquid through the capillary
wick and vaporized the fluid in vapour area. However, if the pipe are too long, the capillary
wick incur a large flow pressure drop. Furthermore, because liquid and vapour flow in
opposite directions, vapour can entrain liquid at high power rates and limit the operation of
the device. Therefore, there are many developments which involve in the design of the heat
pipe in order to overcome those problems. However, each of the development was tied to the
field of the application itself. Loop heat pipe (LHP) and Capillary pumped loop (CPL) as
example, were developed for large application which is for spacecraft where the design have
the capability to overcome the problem of unreliable application of long distance application
and have the ability to operate against gravity.

Both the CPL and LHP consist of an evaporator capillary pump for heat acquisition, a
reservoir for storing the working fluid, a condenser for condensation of vapour from the
reservoir, and vapour and liquid transport lines. Basic operational principles of a CPL and
LHP are very similar. CPLs are limited by their inability to tolerate vapour in the pump core
and have tedious and time-consuming start-up procedures. LHPs are capable of limited
system temperature regulation, but this feature is usually difficult to achieve [4]. Therefore,
the Innovation in terms of the loop heat pipe evaporator has been the major focus to improve
system efficiency and reduce the diameter of the evaporation section. Figure 4 show the
schematic diagram of the CLP system.

Figure 4: Schematic diagram of the CPL

 Not only limited for large application, the micro-loop heat pipe was developed to fix
with miniature of hi-tech product such as laptop which the heat dissipation is the main issue.
The micro-loop heat pipe comprises of a flexible metal film, which forms a closed space in
which fluid may circulate, and has a heat absorbing zone and a heat-dissipating zone
connected by a flow path. The wick is a flexible net structure arranged in the heat-absorbing
zone. The working fluid absorbs heat in the heat-absorbing zone, vaporizes into vapour state,
and generates a pressure that causes the working fluid to circulate inside the flexible metal
film. The vaporised working fluid is cooled (or heat-dissipated) in the heat-dissipating zone
and changed back to liquid state. [2]

Another recent technology which involve in the development of the heat pipe are the
Hybrid heat pipe. The hybrid heat pipe is used for advanced nuclear power plant as the
passive heat transfer device. As shown in figure 5, the hybrid heat pipe combines the
functions of a heat pipe and a control rod to simultaneously remove the decay heat generated
from the core and shutdown the reactor under accident conditions. Thus, the hybrid heat pipe
contains a neutron absorber in the evaporator section, which corresponds to the core of the
reactor pressure vessel. The presence of the neutron absorber material leads to differences in
the heated diameter and hydraulic diameter of the heat pipe. The cross-sectional areas of the
vapour paths through the evaporator, adiabatic, and condenser sections are also different. The
hybrid heat pipe must operate in a high-temperature, high-pressure environment to remove the
decay heat. In other words, the operating pressure must be higher than those of the
commercially available thermosyphons. [8]

Figure 5: Hybrid heat pipe in nuclear power plant

 Bubble-Actuated Circulating Heat pipe (BACH) is also one of the latest technology
develop by using heat pipe concept which can be defined as the new type of heat pipe. BACH
basically transports heat by liquid circulation induced by bubble buoyancy force. BACH is
strongly expected to have new features which may overcome defects on conventional heat
pipes.

Bubble-Actuated Circulating Heat pipe (BACH) is recently invented by Shingu and

Ohtani, 2007, in Wakasa-Wan Energy Research Centre. Its appearance is just like a closed-
loop thermosiphon-type heat pipe. The schematic diagram of the BACH are shown in Figure
6, the bubble generation part located at the heating section is designed to generate vapour
bubbles stably even if wall superheat of heating section is very small. As a result of
preliminary experiment, it was found that working fluid in pipe flows at several tens of
centimetres per second, and it was inferred that sensible heat transport was dominant judging
from its rather high speed of liquid flow. Although still in preliminary experiment stage, top
heat mode operation of BACH was found to work well with relatively simple contraption. If
high heat transport in top heat mode is realized, BACH can be applied to practical use such as
solar heat system on roof. [5]

Figure 6: Operating mechanism of BACH

References

[1] Trijo Tharayil, Lazarus Godson Asirvatham , Michel Jerome Dau, Somchai
Wongwises (2016) Entropy generation analysis of a miniature loop heat pipe with graphene–
water nanofluid: Thermodynamics model and experimental study. International Journal of
Heat and Mass Transfer 106 (2017) 407–421.

[2] W. Wu, ‘Micro-loop heat pipe’, United States Patent Application No. 20030192669,
October 16, 2003.

[3] Jiang Cheng, Gang Wang, Yong Zhang, Pihui Pi, Shouping Xu (2016) Enhancement of
capillary and thermal performance of grooved copper heat pipe by gradient wettability
surface. International Journal of Heat and Mass Transfer 104 (2017) 586–591

[4] T. T. Hoang, ‘Loop heat pipe method and apparatus’, United States Patent No
6810946, November 2, 2004.

[5] Niro Nagaia, Akikazu Iwamotoa, Toyoji Onishib, Hideo Shingub (2011) Advances
And Opportunities In Bubble-Actuated Circulating Heat Pipe (BACH). Global Digital Central
ISSN: 2155-658X.

[6] Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Tien Nguyen and
Vijit Wuttijumnong (2011) A Review Of Heat Pipe Application Including New Opportunities.
Global Digital Central ISSN: 2155-658X.

[7] Amir Faghri (2014) Heat Pipes: Review, Opportunities And Challenges. Global Digital
Central ISSN: 2155-658X.

[8] Kyung Mo Kim, In Cheol Bang (2014) Heat transfer characteristics and operation
limit of pressurized hybrid heat pipe for small modular reactors. Applied Thermal Engineering
112 (2017) 560–571

[9] Vipul M. Patel, Gaurav, Hemantkumar B. Mehta (2016) Influence of working fluids on
startup mechanism and thermal performance of a closed loop pulsating heat pipe. Applied
Thermal Engineering 110 (2017) 1568–1577

[10] M. Nishikawara , H. Nagano (2016) Optimization of wick shape in a loop heat pipe for
high heat transfer. International Journal of Heat and Mass Transfer 104 (2017) 1083–1089
[11] Jiang Cheng, Gang Wang, Yong Zhang, Pihui Pi, Shouping Xu (2016) Enhancement of
capillary and thermal performance of grooved copper heat pipe by gradient wettability
surface. International Journal of Heat and Mass Transfer 107 (2017) 586–591

[12] Yaxuan Xiong, Li Bo, Meng Qiang, Yuting Wub, Xingxing Zhang, Peng Xu,
Chongfang Mab (2016) A characteristic study on the start-up performance of molten-salt heat
pipes: Experimental investigation. Experimental Thermal and Fluid Science 82 (2017) 433–
438

[13] Randeep Singha, Masataka Mochizukia, Thang Nguyena, Aliakbar Akbarzadehb

(2011) Applications Of Heat Pipes In Energy Conservation And Renewable Energy Based
Systems. Global Digital Central ISSN: 2155-658X

[14] ww.wikipedia.com (2016). Heat Pipe. https://en.wikipedia.org/wiki/Heat_pipe.

(accessed on 20/12/16).