A Summary Report for On-the-Job Training

Undertaken at STMicroelectronics, Inc.

Mher Karizze Anne Narciso
Industrial Engineering Department, College of Engineering and Agro-Industrial Technology,
University of the Philippines Los Baños
mrnarciso2@up.edu.ph

I. COMPANY PROFILE manufacturing building as an expansion was completed to

STMicroelectronics was formed in 1987 by the merger of
two long-established semiconductor companies, SGS
Microelettronica of Italy and Thomson Semiconducteurs of
France, and has been publicly traded since 1994. The
company serves customers across the spectrum of electronics
applications with innovative semiconductor solutions, such as
energy reduction consumption at the point of use in domestic
and industrial applications, all aspects of security and data
protection, and a growing presence in the emerging advanced
healthcare market.
Being one of the world’s largest semiconductor companies
and offering one of the industry’s broadest product
assortments, STMicroelectronics has net revenue of
US$ 10.35 billion in 2010. Particularly, it has strengths in
Multimedia, Power, Connectivity and Sensing technologies
and its sales, including wireless business conducted via ST-
Ericsson, the 50/50 Joint Venture with Ericsson, are well
balanced among the industry’s major sectors: Telecom (31%),
Automotive (15%), Consumer (11%), Computer (14%),
Industrial (8%) and Distribution (21%). It focuses on its world
leadership on many different fields, including semiconductors
for industrial applications, inkjet print heads, MEMS (Micro-
Electro-Mechanical Systems) for portable and consumer
devices, MPEG decoders and smartcard chips, automotive
integrated circuits, computer peripherals and wireless products.
The company has approximately 53,000 employees, 15
main manufacturing sites, advanced research and development
centers in 10 countries, and sales offices all around the world.
Corporate headquarters, as well as the headquarters for
Europe, the Middle East and Africa (EMEA) are located in
Geneva. The Company’s Americas Headquarters are in
Coppell (Texas); those for Greater China and South Asia are
based in Shanghai; and Japanese and Korean operations are
headquartered in Tokyo.
Their site for packaging and test manufacturing in the
Philippines is located at the Science Park in Calamba, Laguna,
which employs 1,505 employees, with high level of education.
It started its operations in January 1999, which built as a state
of the art technology in 1998 for Assembly and Testing of
Wafers & Integrated Circuits to cater various applications
such as connectivity, displays, digital video, power
management unit, RF transceivers, identification, automotive,
near‐ field communication. In November 2001, the second
handle further growth in the IC market in the future.
ST has preserved an unwavering commitment to research
and development since its conception. Almost quarter of its
employees work in R&D and product design. In 2010, the
Company spent almost 23% of its revenue in R&D. ST owns
around 20,000 patents and pending patent applications such as
chip fabrication technologies, including advanced CMOS
(Complementary Metal Oxide Semiconductor), mixed-signal,
analog and power processes, and is a partner in the
International Semiconductor Development Alliance (ISDA)
for the development of next-generation CMOS technologies.
Over the past 15 years, the Company’s sites have received
more than 100 awards for excellence in all areas of Corporate
Responsibility, from quality to corporate governance, social
issues and environmental protection.
II. SYSTEM DOCUMENTATION
A. Product Line/Portfolio
STMicroelectronics’ corporate vision is based on two pillars:
to be the clear world leader in power applications and
multimedia convergence. Power applications are those that
manage flows of electricity in industrial automation systems,
in automobiles, in lighting, or in a large variety of household
appliances. On the other hand, multimedia convergence
controls the way audio, video and telecommunications data is
disseminated in the age of the internet, where consumers
increasingly expect a fully connected wireless world, with
information and entertainment available at any time, in any
place, on any device. Thus, its rich portfolio of products and
technologies is designed to support this vision. ST serves its
customers in these areas with five main blocks of products,
namely:
 Power devices - power transistors, EMI filtering and
signal conditioning, diodes, protection devices, thyristors
and AC switches. ST offers two families of smart power
technologies: VIPower is a family of proprietary ST
technologies in which a discrete power structure is
integrated with analog and digital control and diagnostic
circuitry, resulting in a device that combines the
robustness of discrete technology with integrated control
and diagnostic circuitry. The second is ST’s BCD
(Bipolar-CMOS-DMOS) technology combines bipolar,
CMOS and DMOS processes, allowing additional system
functions, such as voltage regulators, communication
 interfaces, as well as multiple-load drivers, to be
integrated along with logic circuitry in a single device.
 MEMS and advanced analog ICs - MEMS (Micro-
Electro-Mechanical Systems) devices include silicon
motion sensors such as accelerometers, gyroscopes and
compasses, and pressure sensors and silicon microphones.
ST’s advanced analog portfolio includes high-
performance power management ICs, lighting ICs, motor
control ICs, sensors (touch, proximity, temperature),
photovoltaic power conversion ICs, low-power RF
transceivers, power-line communication, battery
monitoring, clocks and timing circuits and mixed-signal
ICs.
 ASICs / ASSPs - ST’s ASIC (Application-Specific
Integrated Circuits) and ASSP (Application-Specific
Standard Product) devices range from very complex chips
based on the most advanced CMOS technology to
BiCMOS technologies used, for example, for optical
cable applications and radio frequency applications. ST’s
ASIC and ASSP portfolio includes many types of
application-specific products optimized for applications
in the key growth segments of Digital Consumer,
Computer Peripherals, Automotive and Industrial. ST is
also a key supplier to the Wireless Terminals industry via
ST-Ericsson, a 50/50 joint venture focusing on
semiconductors and platforms for mobile applications.
 Platforms for digital consumer applications and for
wireless via ST-Ericsson. Platforms are complete
solutions that build upon ASSP chips by adding reference Figure 1. Photo of employees wearing personal protective equipment.
designs, board support packages, application software,
and manufacturing tools and specifications. Platforms are Scalpak and Micromodule are located in the second floor.
transforming the Company from an ASSP supplier into a Scalpak has its own FOL (Front of Line) and EOL (End of
supplier of overall solutions that allow customers to Line). The reason for this is that some customers want their
minimize development costs and time to market while supplies to be produced separately and isolated from other
retaining the ability to differentiate their products. products of other customers. Semiconductors are highly
Examples include ST’s advanced set-top box and TV sensitive; hence these products need extreme care. The
platforms delivering high-definition content and rich operators are connected to a grounding wire, and the
services to end users, as well as the wireless platform equipment and other things inside the clean room or
offered via. production area. Even the papers they use are made with ESD
or Electrostatic Sensitive Devices, which avoid energy to be
B. Production Area accidentally conducted by the products.
The production layouts are shown in Appendix 1.
STMicroelectronics occupies more than 89 thousand
square meters of land area. The ground floor production area C. Manufacturing/Fabrication of Semiconductor Device
consists of the following parts: FOL (Front of line), TNF (Test
and Finish), and EOL (End of line). FOL is where An IC (integrated circuit), a small but sophisticated device
preassembly, die band, gold line wire band, and copper line implementing several electronic functions, is comprised of
wire band processes occur. EOL processes comprise of two major parts. The first part is a tiny and very fragile silicon
sowing, cutting, molding and laser marking. TNF, apparently, chip (die). The second part is a package which protects the
is where testing and finishing the semiconductors and other internal silicon chip and provides users with a practical way of
products take place. handling the component.
Smocks, which resemble the form of a laboratory gown, An IC manufacturing phase is comprised of two steps,
should be worn in TNF and EOL. Bunny suit and boots, generally known as “Front-End” and “Back-End”. The first
which fully cover the body of the employees, should be worn step is the wafer fabrication, which is the extremely
in FOL, Scalpak and Micromodule. Goggles should be worn sophisticated and intricate process of manufacturing the
as well, unless the employees are aleady wearing graded silicon chip. The latter is the assembly which is the highly
glasses. These PPE’s are illustrated in the following figure. precise and automated process of packaging the die. Those
two phases include two test steps: wafer probing and final test, a. Process parametric test - performed on some test samples
as shown in Figure 1 below. and checks the wafer fabrication process itself.
b. Full wafer probing test - verifies the functionality of the
finished product and is performed on all the dies.

Figure 1. Manufacturing flow chart of an IC

1. Wafer Fabrication (Front-End) Figure 2. Description of the wafer probing operation.

Identical ICs are called die. They are made on each wafer
in a multi-step process. Every step adds a new layer, which
forms the elements of the individual electronic circuits, to the
wafer or modifies the existing one.
The following table summarizes the main steps for the
fabrication of a die. Some of which are repeated several times
at different stages of the process. However, the order given
here doesn't reflect the real order of fabrication process.
Figure 2 describes the wafer probing operation. The bad
die are automatically marked with a black dot so they can be
separated from the good die after the wafer is cut. Failure
analysis engineers closely examine the record the failures on
the non-working die. This is done to determine where the
problem occurred so that it may be corrected. The percentage
of good die on an individual wafer is called its yield.

Table 1. Summary of the major steps in die fabrication. 3. Assembly (Back-End)

PhotoMasking This step shapes the different components. Resin is put The first step of assembly is die cutting. This is where the
down on the wafer which is then exposed to light
through a specific mask. The lighten part of the resin silicon chips are separated. Afterwards, the die are placed on a
softens and is rinsed off with solvents. lead frame. The “leads” are the chip legs, which will be
Etching This operation removes a thin film material. There are soldered or placed in a socket on a printed circuit board.
two different methods: wet (using a liquid or soluble Thousands (or millions) of electronic components are o found
compound) or dry (using a gaseous compound like
oxygen or chlorine). on a tiny surface, all of them interconnected and capable of
Diffusion This step is used to introduce dopants inside the implementing a subset of a complex electronic function. The
material or to grow a thin oxide layer onto the wafer. device is entirely functional at this point, but it would be
Wafers are inserted into a high temperature furnace impossible to use it without some sort of supporting system.
(up to 1200 ° C) and doping gazes penetrate the silicon
or react with it to grow a silicon oxide layer.
Any scratch would alter its behavior (or impact its reliability)
Ionic It allows the introduction of a dopant at a given depth and any shock would cause failure.
Implantation into the material using a high energy electron beam. Thus, for protection, the die must be placed into a
Metal It allows the realization of electrical connections ceramic or plastic package. A number of operations have to be
Deposition between the different cells of the IC and the outside. done as shown in Figure 3.
Two different methods are used to deposit the metal:
evaporation or sputtering.
Passivation Wafers are sealed with a passivation layer to prevent
the device from contamination or moisture attack. This
layer is usually made of silicon nitride or a silicon
oxide composite.
Back-lap It’s the last step of wafer fabrication. Wafer thickness
is reduced (for microcontroller chips, thickness is
reduced from 650 to 380 microns), and sometimes a
thin gold layer is deposited on the back of the wafer.

All these processes are part of the manufacturing phase of

the silicon chip itself, which are grouped on a silicon wafer
before being separated from each other at the beginning of the
assembly phase.

2. Wafer Probing.

As shown previously in Figure 1, this process occurs
between wafer fabrication and assembly. This is where the
functionality of the device performing thousands of electrical
tests is verified, by means of special microprobes. There are
two different tests in the wafer probing:
Figure 3. Description of The Assembly Process.
It is a requirement that wires thinner than a human hair
(for microcontrollers, the typical value is 33 microns) must
connect chips to the exterior and enable electronic signals to
be fed through the chip. The process of connecting these thin III. APPLICATION OF IE TOOLS AND TECHNIQUES AND
wires from the chip’s bond pads to the package lead is called POTENTIAL PROBLEMS / IMPROVEMENTS
wire bonding as shown in Figure 4.
Preventive Maintenance

The preventive maintenance of each machine follows a

specific standard operation procedure. There were three kinds
of machines assigned during the internship period: ICOS,
ISMECA and Hanseo Oven. ICOS and ISMECA are located
in Test and Finish, which are meant for the tape and reel
operations.
Table 2 provides the standard time and operations for
ICOS T120/640. The total standard time is 12 and 16 hours
for ICOS T120 and T640, respectively. T640 has longer hours
in contrast to T120 since it is a bigger machine with double
capacity.
Table 2. Standard time and maintenance operations for ICOS T120/640.
T120 T640
ICOS T120/640 Maintenance operations Time Time
(mins) (mins)
ICOS, handler, MVS6000 Backup 15 20
HDD backup 30 40
AV, patch update and Anti-malware update 60 100
Figure 4. Wire Bonding Operation. MUBA data collection / Analysis 15 20
Machine power down 5 5
Then, the chip is mounted in a ceramic or plastic package, Machine front and back cover removal 15 15
which not only protects the chip from external shocks, but Vacuum cleaning 15 15
also makes the whole device easier to handle. They come in a Pickup cleaning / Servicing 15 15
variety of shapes and sizes, which depend on the die itself and LM guide cleaning and lubrication at X1-X5, Y, Z1/Z2
the application in which it will be used. and Z4 20 30
YZ1/YZ2 and YZ4 filter replacement 20 30
Taper maintenance (Taper track, seal shoe and cutter
checking) 30 40
Belt replacement / Tension Checking 60 80
Y4 / Mechanical condition checking 30 30
Machine power-up 15 15
Checking of reference point 30 30
Reference mechanical alignment / teaching 30 30
Vision checking in preparation for wizzard 50 50
Full handler calibration 40 60
Check of individual pick-up and vacuum reading 10 20
PBFT Testing 10 15
Ionizer cleaning and ESD checking 20 20
Initial buy-off / checking of pick-up and tray 40 60
Figure 5. Different Kinds of Plastic Packages. Vision teaching (with process group) bottom 15 20
Checking of pick-up at X3 and drop at taper 30 40
Afterwards, the products are then marked with a Fine tuning / adjustments of delay, offset 60 80
“traceability code,” purposed to identify the function of the MUBA checking and data gathering 10 20
device and its fabrication date. Last of all, the IC is then tested 1st reel checking at VMI 10 20
by automated test equipment, wherein only the ICs that passed Online checking with Setup checklist 10 20
the tests will be packed and shipped to their final destination. LS certification release to production 10 20
Total time (minutes) 720 960
Total time (hours) 12 16
 Table 3 provides the standard time and operations for Lastly, Table 4 provides the standard time and operations
ISMECA NX16. The standard time for its preventive for ISMECA NX16. It is shown that its preventive
maintenance is 12 hours. maintenance should last for 8 hours.
Table 3. Standard time and maintenance operations for ISMECA NX16. Table 4. Standard time and maintenance operations for ISMECA NX16.
NX16 Maintenance Time Hanseo Bake Oven PM Operations Time
(mins) (mins)
Pre-assesment / initial inspection/ ACS and CMMS WO entry 25 Supervisor approval / Lead tech initial report findings approval 5
Back-up copying (NTI and VISION) 25 CMMS transaction 5
1.0 Bowl Feeder Initial assessment on machine 10
Inspection of critical parts 10 Cleaning of machine components
Cleaning of vibrating bowl assembly and all sensor involved 20 Door and chamber cleaning 10
2.0 Linear Track Cleaning of oven walls 10
Inspection of critical parts (arrestor blade, deadspot and all Dirt and stains removal 20
sensor involved) 10
Checking of electrical parts
Cleaning of linear track assembly 20
Check functionality of electrical switches 5
3.0 Turret
Check functionality of temp recorder 5
Inspection of critical parts (16x PUH, Hoses, Spring, Grounding) 10
Check functionality of over temp controller 5
Cleaning of 16x pickup heads, spring, linear bearing and rod for Check condition of heaters 5
safety enclosure, cylinder head / retainer head) 30
Check condition of thermocouples 5
Lubrication of 16x ball cage bearing for pickup heads, ball cage Check the condition of motor blower 10
bearing of upper plate, linear bearing for safety enclosure 30
Check the functionality of N2 Supply 5
Installation of 16x PUH, Compression spring including screw Chec the functionality of SSR and magnetic contactors 10
also replacement of broken ESD, grounding wire and hoses 40
Check the functionality of buzzer and signal lights 5
Height alignment w/r to calibration jig 10
Check the control cabinet condition 5
4.0 Two-position Table
Other PM Activities
Inspection of crititcal parts (motor, tooling, gear, hose) 10
Check ESD connection 5
Dismantled and cleaning of two-position table nest 25
Check and repair exhaust duct 5
5.0 Recentering/Rotary nest
Inspection of critical parts (wearout nest tool, spring, base parts, Check/Replace missing standard screws 15
motor and belt) 5 Check/Repair of door gaskets 15
Dismantled and cleaning of recentering module, nest tooling, Check/Repair cylinder lock 15
compression spring) 20 Install external profiler to perform 5-point temp profile 300
Assemble/Installation of recentering module and checking of
functionality 20 Complete PM documents and CMMS WO 5
6.0 Purge Bin Total time (minutes) 480
Inspection of critical parts 10 Total time (hours) 8
Cleaning of purge bin module 10
7.0 Taper The time study data done are all appended in this
Inspection of critical parts (FST track, flag cover, roller guide, document (Appendices 2-6). The preventive maintenance
cutting blade, guiding roller, sprocket wheel, taper rollers schedule is taken into account in the demand forecast and
bearing, taping belt, motor/encoder and sensor, carrier tape production capacity. It is important to follow the standard
cleaner, unweeler) 20
procedures within the standard time, since the machine
Dismantled Cleaning of FST track, guiding rollers carrier tape
cleaner, vacuum hose line, seal shoe, replacement of filter, undergoing preventive maintenance is being pulled out from
silencer, cover tape detection. 30 the production. Otherwise, it will incur production losses
Lubrication of sealing cam, taper rolling and LM guide 30 because of the delay of the release or buy-off of the machine
8.0 Auto-reject to the production.
Check functionality and align nozzle rest and pick u position and Table 5 provides the summary for the preventive
height clearance 20 maintenance time study. It can be observed that the preventive
Check/Clean parts on vacuum system for leaks/clogs 20 maintenance operations for ICOS T120 and T640 exceeds the
9.0 Others expected PM time. As observed, this is caused by idle times,
numerous travel from PM room to the location of the machine,
Initial offline buy-off 10k and machine fine tuning at bowl feed, massive data to back up compared to the usual, occupied
linear track/feeder, 2P table, bottom inspection, taper, auto-reject 240 machine which delaying its availability, etc.
Installation of all machine covers, fill up of pm card, cmms
completion, checklist completion, 5S 30
Total time (minutes) 720
Total time (hours) 12
Table 5. Summary of preventive maintenance time study.
Machine Description Machine ID No. PM Cycle/ Frequency Location Scheduled Date/Time Estimated PM Time Actual PM Time Percent Difference
ICOS T 120 PIR136 12W FINISH AREA T HURS (JUNE 29, 2017) 16 21.8828 36.77%
HANSEO BAKE OVEN PBK008 13W FINISH AREA FRI (JUNE 30, 2017) 8 6.9286 -13.39%
ICOS T 120 PIR130 24W FINISH AREA MON (JULY 3, 2017) 16 19.6022 22.51%
ICOS T 640 PIR641 12W FINISH AREA WED (JULY 5, 2017) 12 20.6531 72.11%
ISMECA NX16 PIH004 24W FINISH AREA T HURS (JULY 6, 2017) 12 11.8692 -1.09%

The wirebonding process is the bottleneck, since it has
the longest cycle that limits the whole assembly line. Thus it
dictates the production rate of the company. From the time
study appended in Appendices 7 and 8, the average production
rate is 2,131 units per hour. As shown in the above summary,
the company has lost 3.60 to 8.65 hours, causing a loss of
around 7,672 to 18,433 units.
The proposed layout is shown in Figure 7 below. Unlike
the original layout, the display of viands is available prior
entry of queue. It means that the employee has already
decided what choice of food he wants upon entry. As
proposed, there are stainless steel barriers between to
concessionaires. Employee will need to pay first before he can
go to other concessionaires.

Queuing Analysis

Aside from the preventive maintenance, the queuing

analysis of canteen was assigned. This is done because the
Human Resource Manager was requesting the IE Department
to eliminate inefficiencies in the break time of employees. The
security system only secures the access of the employees, thus
there is no existing system to monitor the entry and exit time
of the employees from the production area. Due to this, some
employees are overstaying at the lounge or canteen. The
production cannot proceed without the production operators.
Therefore, one way of solving this is to reduce the queuing
time to at most 1 minute, which was required by the HR upon
requesting queuing analysis from the IE Department. The
objectives for this study are given as follows:
 To determine if 4 food servers and 2 cahiers per
concessionaires are enough to prevent long queue Figure 7. Proposed layout of STMicroelectronics’ canteen.
(originally, there were only 2 food servers and 1 cashier
per concessionaire). The total direct labor headcount is 1,985 employees.
 To determine the queue time given above resources There are 3 shifts and 4 break batches. The arrival rate is
 To determine the number of employees in queue given computed as follows:
above number of servers & cashiers and analyze if the
given space is enough to accommodate employees in
queue
 To determine how long will one employee spend in the
canteen system On the other hand, the total indirect labor headcount is 476.
The original layout is shown in Figure 6 below. The problem Since their shift is regular, they only have one break batch,
with this layout is the queue is not organized since employees which is 12:00 pm to 1:00 pm. The arrival rate is computed as
can freely transfer to another concessionaire if they do not follows:
prefer the set of viands in the previous concessionaire.
The total time the direct labor employees stay in the
system for 1.61 minutes. On the contrary, they will stay for
0.97 minutes. The indirect labor employees stay in the system
for approximately 3.43 minutes. In the proposed system with
improved queuing, they will only stay for only 1.02 minutes.

Figure 6. Original layout of STMicroelectronics’ canteen.

 IV. STUDENT’S REFLECTION since the internship can lead to a more permanent position, as
I was given the opportunity to be absorbed when I have
As a student pursuing a multi-disciplinarian degree of finished my degree.
Industrial Engineering, it was a satisfying experience to apply
what I have learned in Methods Engineering (IE 132) and
V. REFERENCES
Stochastic Processes (IE 143). The internship has honed my
technical knowledge and soft skills, which I believe, are
(1) “Introduction to Semiconductor Technology” (2000). Retrieved from
useful in my professional development. http://www.st.com/resource/en/application_note/cd00003986.pdf
During the first weeks of the internship, it was rather hard
to adjust my body clock and adapt to the workplace
environment. It was very cold in the production area and it
was difficult to move since I was fully covered by PPE’s. But
it was easy to get along with my workmates, especially with
my co-trainees, as I have joined their carpool. Having good
relationships with the people you work with smoothen the
workload and avoids extra stress. I have realized how
important it is to be people-oriented at work. During time
study, I have worked with maintenance and production
operators, whose attitude and reactions vary. Some of them
improved their quality of work since someone is observing.
Some of them were worried because it was common
knowledge that it is the IE’s job to solve for the man-machine
ratio and the workforce might be reduced and they might lose
their jobs. Some employees are not aware so they were just
comfortable with their idle times. Some are grumpy since we
were interrupting their work. Nonetheless, dealing with such
people stretched my patience and I was grateful to have
improved myself when it comes to being overly sensitive and
emotional.
I was fortunate enough to work where my
recommendations and opinions on the project matter. This
instantly made me feel comfortable working with the team.
The supervisor was so open in revising the forms, in using
unfamiliar excel add-ins, etc. He listens when problems
regarding their methods were raised. I remember raising up a
problem with regards to the time study of wirebonding. In the
usual time study protocol, they measure the time of
wirebonding per unit in every panel in the strip. There are 300
units in every panel, and a strip has 5 panels. In the
computations, they just multiply the measured wirebonding
time to the number of units per strip. However, I have
observed that during its inward motion, the machine slows
down when approaching the middle part of the panel in
contrast to its fast speed in those near the edges. Thus the
measured times were not accurate since the samples only
consist of the average of the first ten units in the edges among
the 300 units. Correcting the time study practice impressed my
supervisor. Correcting errors worth of even just seconds in the
time study can cause thousands of savings, according to him.
It was an astounding experience as well to be the only
intern who has presented queuing analysis to the HR manager.
I have appreciated UP more as it really did given superior and
quality education. Overall, my work experience at
STMicroelectronics was positive. I was very contented with
the massive amount of things that I have learned and
experienced in the company, more than what I expect in a
time span of just 240 hours. It can be very beneficial as well
 VI. APPENDICES
A. Appendix 1 – Production Layout
B1F1

B1F2
B2F1
B. Appendix 2 – Time Study for the Preventive Maintenance for ICOS T120 PIR136
STMICROELECTONICS

Analyst: Mher Karizze Anne R. Narciso Machine No: ICOS CI T120

Technicians: Frederic Bongolan & Renato Domalanta Machine ID: PIR136
Area of Study: B2F1 - Finish Machine Operation: Tape and Reel (Finish)
Obs. Date/Time 23-Jun-17 0830H-1730H* Frequency of PM: 12 weeks

A Shift, Technician: Frederic Bongolan Observed Time

General Duration per Duration per Duration
Machine No. # Activities Detailed Tasks Time Start Time Finish task Activity (mins)
1 Travel from PM Room to machine 8:30:00 AM 8:31:35 AM 0:01:35
2 Perform PM preassessment of machine 8:31:35 AM 8:36:39 AM 0:05:04
3 Travel to supervisor 8:36:39 AM 8:36:59 AM 0:00:20
4 Endorsement from supervisor 8:36:59 AM 8:38:13 AM 0:01:14
5 Travel back to machine 8:38:13 AM 8:38:34 AM 0:00:21
6 Review history of machine 8:38:34 AM 8:42:08 AM 0:03:34
7 Travel from machine to PM room 8:42:08 AM 8:43:45 AM 0:01:37
8 Prepare PM tools/materials 8:43:45 AM 8:45:13 AM 0:01:28
9 Travel from PM room to machine 8:45:13 AM 8:46:51 AM 0:01:38
10 Record keeping 8:46:51 AM 8:48:10 AM 0:01:19
11 Pre- Travel from machine to supervisor 8:48:10 AM 8:48:30 AM 0:00:20
12 maintenance Request for supervisor's signature 8:48:30 AM 8:48:39 AM 0:00:09 0:49:10 49.17
13 Activities Travel from supervisor to other technician 8:48:39 AM 8:49:03 AM 0:00:24
14 Consult other technician to check initial condition 8:49:03 AM 8:49:30 AM 0:00:27
15 Travel from other technician to machine 8:49:30 AM 8:49:35 AM 0:00:05
Back up ICOS, handler, MVS6000 for safety of file, delete
0:12:56
16 old back up, CMMS Log-in 8:49:35 AM 9:02:31 AM
17 Physical inspection of critical parts, callibration 9:02:31 AM 9:13:02 AM 0:10:31
18 Travel to telephone 9:13:02 AM 9:13:47 AM 0:00:45
19 Phonecall 9:13:47 AM 9:15:32 AM 0:01:45
20 Travel to PM Room 9:15:32 AM 9:17:31 AM 0:01:59
21 Get tools from PM Room 9:17:31 AM 9:17:44 AM 0:00:13
22 Travel to machine 9:17:44 AM 9:19:10 AM 0:01:26
23 Borrow callibration sensor from other machine 9:19:10 AM 9:19:45 AM 0:00:35
Callibration 0:03:06 3.10
24 Install sensor to the machine 9:19:45 AM 9:22:16 AM 0:02:31
25 Replacement of parts (YZ1 & YZ2 Filter) 9:22:16 AM 10:00:00 AM 0:37:44
Replacement Break Time (10:00 AM - 11:00 AM)
27 Replacement of parts (YZ1 & YZ2 Filter) 11:00:00 AM 12:45:00 PM 1:45:00 2:22:44 142.73
28 LM guide cleaning and lubrication at X1-X5, Y and Z1 & Z2 12:45:00 PM 1:08:01 PM 0:23:01 0:23:01 23.02
29 Cleaning 1:08:01 PM 1:11:35 PM 0:03:34 0:03:34 3.57
30 5S 1:11:35 PM 1:17:33 PM 0:05:58
31 Post- Writing in PM Checklist 1:17:33 PM 1:20:53 PM 0:03:20
32 maintenance Travel to PM Room 1:20:53 PM 1:33:38 PM 0:12:45 0:34:02 34.03
33 Activities Return tools to locker 1:33:38 PM 1:34:02 PM 0:00:24
34 Making a report 1:34:02 PM 1:45:37 PM 0:11:35
B Shift, Technician: Renato Domalanta
35 Pre- Check e-mail 2:00:00 PM 2:07:50 PM 0:07:50
36 maintenance Talk to other technicians 2:07:50 PM 2:08:46 PM 0:00:56 0:09:27 9.45
37 Activities Get tools from locker 2:08:46 PM 2:09:27 PM 0:00:41
38 Travel to machine 2:09:27 PM 2:11:09 PM 0:01:42
39 IDLE 2:11:09 PM 2:11:29 PM 0:00:20
40 Copying of defective sensor 2:11:29 PM 2:15:49 PM 0:04:20
41 Travel to PM Room 2:15:49 PM 2:17:30 PM 0:01:41
42 Collaborate with specialist for sensor replacement 2:17:30 PM 2:19:57 PM 0:02:27
43 Testing for continuity of defective cable 2:19:57 PM 2:21:39 PM 0:01:42
ICOS CI-T120 Sensor Comparison of defective vs. replacement sensor, cutting
0:02:18 0:46:57 46.95
44 Replacement of cables 2:21:39 PM 2:23:57 PM
45 Test for continuity of replacement cable 2:23:57 PM 2:25:42 PM 0:01:45
46 Fixing and soldering the replacement cable 2:25:42 PM 2:37:13 PM 0:11:31
47 Collaboration with other PM Technicians 2:37:13 PM 2:37:51 PM 0:00:38
48 IDLE 2:37:51 PM 2:38:15 PM 0:00:24
49 Travel from PM Room to machine 2:38:15 PM 2:40:14 PM 0:01:59
50 Actual replacement of machine cable 2:40:14 PM 2:56:24 PM 0:16:10
51 Visual inspection and lubrication 2:56:24 PM 3:31:31 PM 0:35:07 0:35:07 35.12
52 Prepare for installation of software for cloning 3:31:31 PM 3:35:28 PM 0:03:57
53 Travel from machine to PM room 3:35:28 PM 3:37:37 PM 0:02:09
54 Back up file to PC 3:37:37 PM 4:00:54 PM 0:23:17
55 Travel to T&F MFG Room, consultation 4:00:54 PM 4:03:01 PM 0:02:07
56 Travel back to PM Room, troubleshooting 4:03:01 PM 4:11:50 PM 0:08:49
57 Travel to supervisor 4:11:50 PM 4:12:55 PM 0:01:05
58 Phonecall 4:12:55 PM 4:14:58 PM 0:02:03
59 Cloning of Travel to machine 4:14:58 PM 4:15:27 PM 0:00:29
60 Machine Hard IDLE 4:15:27 PM 4:15:35 PM 0:00:08 1:36:42 96.70
Drive Prepare for installation of software for cloning,
61 pneumatic fitting 4:15:35 PM 4:33:48 PM 0:18:13
62 Travel to PC 4:33:48 PM 4:35:17 PM 0:01:29
63 Ask other operators regarding reformatting 4:35:17 PM 4:36:01 PM 0:00:44
64 Reformat Flash Drive 4:36:01 PM 4:37:53 PM 0:01:52
65 Travel back to ICOS Machine 4:37:53 PM 4:39:24 PM 0:01:31
66 Copy Servicepack Application 4:39:24 PM 4:46:17 PM 0:06:53
67 Installation of software for cloning 4:46:17 PM 5:08:13 PM 0:21:56
Break Time (5:00 PM - 6:00 PM)
68 Taper maintenance (taper track, seal shoe and cutter checking) 6:10:00 PM 6:40:00 PM 0:30:00 0:30:00 30.00
69 Belt replacement/tension checking 6:40:00 PM 8:20:00 PM 1:40:00 1:40:00 100.00
70 QRM/Mechanical Condition Checking 8:20:00 PM 8:50:00 PM 0:30:00 0:30:00 30.00
71 Machine power-up 8:50:00 PM 9:10:00 PM 0:20:00 0:20:00 20.00
72 Checking of Reference Point 9:10:00 PM 9:50:00 PM 0:40:00 0:40:00 40.00
73 Reference Mechanical alignment/teaching 9:50:00 PM 10:30:00 PM 0:40:00 0:40:00 40.00
74 Vision checking in preparation for wizzard 10:30:00 PM 11:30:00 PM 1:00:00 1:00:00 60.00
75 Full handler callibration 11:30:00 PM 12:50:00 AM 1:20:00 1:20:00 80.00
76 Checking of individual pickup and vacuum readings 12:50:00 AM 1:20:00 AM 0:30:00 0:30:00 30.00
77 PBFT Testing 1:20:00 AM 1:40:00 AM 0:20:00 0:20:00 20.00
78 Initial buy-off/checking of pick-up tray 1:40:00 AM 2:40:00 AM 1:00:00 1:00:00 60.00
79 Vision teaching (with process group) bottom/Mark/VA/OC/TCI/TSI 2:40:00 AM 3:40:00 AM 1:00:00 1:00:00 60.00
80 Checking of pick-up at X3 and drop at taper 3:40:00 AM 4:00:00 AM 0:20:00 0:20:00 20.00
81 Fine tuning/adjustments of af delay, offset 4:00:00 AM 4:40:00 AM 0:40:00 0:40:00 40.00
82 MUBA checking and data gathering 4:40:00 AM 6:40:00 AM 2:00:00 2:00:00 120.00
83 1st reel checking at VMI 6:40:00 AM 7:00:00 AM 0:20:00 0:20:00 20.00
84 Online checking with setup checklist 7:00:00 AM 7:20:00 AM 0:20:00 0:20:00 20.00
85 LS certification release to production 7:20:00 AM 8:40:00 AM 1:20:00 1:20:00 80.00
Total Working Time 21:53:50
Less IDLE Time 21:52:58
Total Working Time (HOURS) 21.8828
Total Working Time (MINUTES) 1313.83
Total Machine per day 1.096752901
C. Appendix 3 – Time Study for the Preventive Maintenance for HANSEO OVEN

STMICROELECTONICS

Analyst: Mher Karizze Anne R. Narciso Machine No.: HANSEO BAKE OVEN
Technicians: Frederic Bongolan & Eric Jason Zapanta Machine ID: PBK008
Area of Study: B2F1 - Finish Machine Operation: Curing/Baking
Obs. Date/Time 30-Jun-17 0830H-1730H* Frequency of PM: 13 weeks

A Shift, Technician: Frederic Bongoloan Observed Time

Duration Remarks
General Duration per per Duration
Machine No. # Activities Detailed Tasks Time Start Time Finish Task Activity (mins)
1 Supervisor approval/Lead tech initial report finding approval 11:20:09 AM 11:20:45 AM 0:00:36
2 Travel to machine (Baking Room) 11:20:45 AM 11:21:26 AM 0:00:41
Pre-
3 Travel to PM Room 11:21:26 AM 11:22:27 AM 0:01:01
maintenance 0:09:00 9.00
4 CMMS transaction/Log-in 11:22:27 AM 11:27:22 AM 0:04:55
Activities
5 Travel to Baking Room 11:27:22 AM 11:28:09 AM 0:00:47
6 Writing in PM checklist 11:28:09 AM 11:29:09 AM 0:01:00
7 Perform PM initial assessment/Checking and inspection 11:29:09 AM 11:37:50 AM 0:08:41 0:08:41 8.68
8 Cleaning of
Checking and Cleaning of motor and external parts for wear and air
Machine 0:04:05 4.08
leaks (door gaskets, oven walls, oven chamber), dirt and stains
Components
9 removal 11:37:50 AM 11:41:55 AM 0:04:05
Cleaning and inspection of internal/electrical parts (electrical
Checking of switches, temp recorder, over temp controller, heaters,
electrical thermocouples, motor blower, N2 supply, SSR & magnetic 0:17:50 17.83
parts contractors, buzzer & signal light, control cabinet condition),
10 assembly of covers 11:41:55 AM 11:59:45 AM 0:17:50
HANSEO OVEN
PBK008 11 Checking in PM Checklist 11:59:45 AM 12:00:22 PM 0:00:37 0:00:37 0.62
12 Prepare external temperature profiler 12:00:22 PM 12:06:14 PM 0:05:52
13 Perform 5 Get adaptor/extension from PM Room 12:06:14 PM 12:07:57 PM 0:01:43
0:08:38 8.63
point Installation/preparation to perform 5 point temperature profiling
14 temperature verification 12:07:57 PM 12:09:00 PM 0:01:03
15 profiling Ramp up time and monitoring 12:09:00 PM 1:48:00 PM 1:39:00
16 verification Travel to PM Room 1:48:00 PM 1:48:40 PM 0:00:40
17 (30 mins Idle (Waiting for PC to be unoccupied) 1:48:40 PM 1:51:54 PM 0:03:14
18 RAMP UP, 6 Report making 1:51:54 PM 1:59:32 PM 0:07:38
19 hours Meeting with PM Manager 1:59:32 PM 2:41:08 PM 0:41:36 7:00:00 420.00
PROFILING, B Shift, Technician: Eric Jason Zapanta
20 30 mins Idle/Other activities 2:41:08 PM 3:04:26 PM 0:23:18
RAMP Continuous monitoring of temperature profiler and other PM
DOWN) 3:34:34
21 activities 3:04:26 PM 6:39:00 PM
22 Ramp down 6:39:00 PM 7:09:00 PM 0:30:00
23 5S, Complete PM documents, CMMS WO 7:09:00 PM 7:24:00 PM 0:15:00 0:15:00 15.00
Total Working Time 8:03:51
Less IDLE Time 6:55:43
Total Working Time (HOURS) 6.9286
Total Working Time (MINUTES) 415.72
Total Machine per day 3.4639

*Note: Time study inclusive of non-value adding activities such as travel & idle time
D. Appendix 4 – Time Study for the Preventive Maintenance for ICOS T120 PIR130

STMICROELECTONICS

Analyst: Mher Karizze Anne R. Narciso Machine No.: ICOS CI T120

Technicians: Renato Domalanta & Eric Jason Zapanta Machine ID: PIR130
Area of Study: B2F1 - Finish Machine Operation: Tape and Reel (Finish)
Obs. Date/Time 3-Jul-17 0830H-1730H* Frequency of PM: 24 weeks

General Duration per Duration per Duratiom

# Activities Detailed Tasks Time Start Time Finish task Activity (mins) Remarks
Machine No. A Shift, Technician: Renato Domalanta

Pre- Supervisor approval/ Lead tech initial report finding approval, 1:30:00
1:43:11 103.18
1 maintenance CMMS transaction, Perform PM preassessment of machine 8:00:00 AM 9:30:00 AM
2 Activities ICOS, handler, MVS6000 Backup 9:30:00 AM 9:43:11 AM 0:13:11
3 Machine front and back cover removal 9:43:11 AM 9:50:36 AM 0:07:25 0:07:25 7.42
4 Vacuum Cleaning 9:50:36 AM 10:10:31 AM 0:19:55 0:19:55 19.92
Break Time (10:00 AM - 11:00 AM)
5 HDD Backup 11:12:38 AM 12:13:19 PM 1:00:41
6 Travel to PM Room 11:21:40 AM 11:22:59 AM 0:01:19
HDD Backup 0:11:20
7 IDLE 11:22:59 AM 11:34:19 AM
and Filter
8 replacement Travel to machine 11:34:19 AM 11:35:49 AM 0:01:30 1:00:41 60.68
9 (Simultaneous) Vacuum Cleaning 11:35:49 AM 11:37:08 AM 0:01:19
10 Pickup cleaning, servicing 11:37:08 AM 11:45:24 AM 0:08:16
11 YZ1 & YZ2 Filter replacement 11:45:24 AM 12:13:19 PM 0:27:55
12 LM guide cleaning and lubrication at X1-X5, Y and Z1 & Z2 12:13:19 PM 12:58:25 PM 0:45:06 0:45:06 45.10
13 Taper maintenance (taper track, seal shoe and cutter checking) 12:58:25 PM 1:07:59 PM 0:09:34 0:09:34 9.57
14 End of shift 5S 1:07:59 PM 1:20:00 PM 0:12:01
15 activities Make report, etc. 1:20:00 PM 2:00:00 PM 0:40:00 0:52:01 52.02
B Shift, Technician: Eric Jason Zapanta
16 Taper maintenance (taper track, seal shoe and cutter checking) 2:29:21 PM 2:57:39 PM 0:28:18 0:28:18 28.30
17 Get tools from PM Room 2:57:39 PM 3:05:51 PM 0:08:12 0:08:12 8.20
18 Fitting replacement Y1 3:05:51 PM 3:33:44 PM 0:27:53 0:27:53 27.88
19 QRM/Mechanical Condition Checking 3:33:44 PM 4:24:09 PM 0:50:25 0:50:25 50.42
20 Belt tension checking 4:24:09 PM 4:35:00 PM 0:10:51 0:10:51 10.85
21 Cleaning/removal of excess lubrication, installation of cover 4:35:00 PM 4:41:55 PM 0:06:55 0:06:55 6.92
22 Machine power-up 4:41:55 PM 4:50:31 PM 0:08:36 0:08:36 8.60
23 Initialization 4:50:31 PM 4:55:31 PM 0:05:00 0:05:00 5.00
Break Time (5:00 PM - 6:00 PM)
72 Checking of Reference Point 5:55:00 PM 6:35:00 PM 0:40:00 0:40:00 40.00
73 Reference Mechanical alignment/teaching 6:35:00 PM 7:15:00 PM 0:40:00 0:40:00 40.00
74 Vision checking in preparation for wizzard 7:15:00 PM 8:15:00 PM 1:00:00 1:00:00 60.00
75 Full handler callibration 8:15:00 PM 9:35:00 PM 1:20:00 1:20:00 80.00
76 Checking of individual pickup and vacuum readings 9:35:00 PM 10:05:00 PM 0:30:00 0:30:00 30.00
77 PBFT Testing 10:05:00 PM 10:25:00 PM 0:20:00 0:20:00 20.00
78 Initial buy-off/checking of pick-up tray 10:25:00 PM 11:25:00 PM 1:00:00 1:00:00 60.00
79 Vision teaching (with process group) bottom/Mark/VA/OC/TCI/TSI 11:25:00 PM 12:25:00 AM 1:00:00 1:00:00 60.00
80 Checking of pick-up at X3 and drop at taper 12:25:00 AM 12:45:00 AM 0:20:00 0:20:00 20.00
81 Fine tuning/adjustments of af delay, offset 12:45:00 AM 1:25:00 AM 0:40:00 0:40:00 40.00
82 MUBA checking and data gathering 1:25:00 AM 3:25:00 AM 2:00:00 2:00:00 120.00
83 1st reel checking at VMI 3:25:00 AM 3:45:00 AM 0:20:00 0:20:00 20.00
84 Online checking with setup checklist 3:45:00 AM 4:05:00 AM 0:20:00 0:20:00 20.00
85 LS certification release to production 4:05:00 AM 5:25:00 AM 1:20:00 1:20:00 80.00
Total Working Time 19:45:42
Less IDLE Time 19:36:08
Total Working Time (HOURS) 19.6022
Total Working Time (MINUTES) 1176.13
Total Machine per day 1.2244

*Note: Time study inclusive of non-value adding activities such as travel & idle time, data captured is only from 8:00 AM - 5:30 PM thus incomplete since the process exceeded regular shift
E. Appendix 5 – Time Study for the Preventive Maintenance for ICOS T640 PIR641.

STMICROELECTONICS

Analyst: Mher Karizze Anne R. Narciso Machine No.: ICOS CI T640

Technicians: Renato Domalanta & Eric Jason Zapanta Machine ID: PIR641
Area of Study: B2F1 - Finish Machine Operation: Tape and Reel (Finish)
Obs. Date/Time 5-Jul-17 0830H-1730H* Frequency of PM: 12 weeks

General Duration per Duration per Duration

# Activities Detailed Tasks Time Start Time Finish task Activity (mins) Remarks
Machine No. A Shift, Technician: Renato Domalanta

0:26:25
1 Pre- Supervisor approval/ Lead tech initial report finding approval 8:00:00 AM 8:26:25 AM
0:32:50 32.83
2 maintenance Pre-PM assessment - Check TPM alarm history 8:26:25 AM 8:32:50 AM 0:06:25
Activities CMMS transaction 8:32:50 AM 8:34:36 AM 0:01:46
3 Replace Z1, Z2, Z4 & idle Station vacuum filters 8:34:36 AM 8:55:24 AM 0:20:48 0:20:48 20.80
4 Temp. Get pyrometer to callibrate temperature 8:55:24 AM 8:59:40 AM 0:04:16
0:30:36 30.60
callibration Check taper temperature 8:59:40 AM 9:26:00 AM 0:26:20
5 Machine power down 9:26:00 AM 9:27:05 AM 0:01:05 0:01:05 1.08
6 Hard disk backup 9:27:05 AM 10:37:05 AM 1:10:00 1:10:00 70.00
Break Time (10:00 AM - 11:00 AM)
7 Phonecall 10:37:05 AM 10:48:09 AM 0:11:04 0:11:04 11.07
8 Continue replacing Z1, Z2, Z4 & idle Station vacuum filters 10:48:09 AM 11:05:13 AM 0:17:04 0:17:04 17.07
9 Vacuum Cleaning 11:05:13 AM 11:35:49 AM 0:30:36 0:30:36 30.60
10 LM guide cleaning and lubrication at X1-X5, Y and Z1, Z2 & Z4 11:35:49 AM 11:50:00 AM 0:14:11 0:14:11 14.18
11 Cleaning, scanning for virus 11:50:00 AM 1:08:22 PM 1:18:22 1:18:22 78.37
12 Ionizer cleaning and ESD checking, Mahine power up 1:08:22 PM 1:47:44 PM 0:39:22 0:39:22 39.37
14 End of shift 5S 1:47:44 PM 1:49:29 PM 0:01:45
16.75
15 activities Make report, etc. 1:49:29 PM 2:04:29 PM 0:15:00 0:16:45
B Shift, Technician: Eric Jason Zapanta
16 Idle, other activities, i.e. checking of email 2:04:29 PM 2:20:56 PM 0:16:27 0:16:27
17 Travel to machine 2:20:56 PM 2:22:38 PM 0:01:42 0:01:42 1.70
18 Continue scanning, AV, patch update and Anti-malware update 2:22:38 PM 3:24:21 PM 1:01:43 1:01:43 61.72
19 Continue ionizer cleaning and ESD checking 3:24:21 PM 3:42:29 PM 0:18:08 0:18:08 18.13
20 Left taper maintenance 3:42:29 PM 4:02:56 PM 0:20:27 0:20:27 20.45
21 Right taper maintenance 4:02:56 PM 4:18:16 PM 0:15:20 0:15:20 15.33
22 Other activities, taper maintenance 4:18:16 PM 4:27:37 PM 0:09:21 0:09:21 9.35
23 Continue scanning 4:27:37 PM 4:37:43 PM 0:10:06 0:10:06 10.10
24 ESD/ionizer checking 4:37:43 PM 4:48:28 PM 0:10:45 0:10:45 10.75
25 Writing in Checklist, other activities 4:48:28 PM 4:51:00 PM 0:02:32 0:02:32 2.53
26 Withdraw parts from CSR (Central Storage Room) 4:51:00 PM 5:11:35 PM 0:20:35 0:20:35 20.58
27 ESD/ionizer checking 5:11:35 PM 5:25:38 PM 0:14:03 0:14:03 14.05
Break Time (5:00 PM - 6:00 AM)
28 Checking of Reference Point 6:25:00 PM 7:05:00 PM 0:40:00 0:40:00 40.00
29 Reference Mechanical alignment/teaching 7:05:00 PM 7:45:00 PM 0:40:00 0:40:00 40.00
30 Vision checking in preparation for wizzard 7:45:00 PM 8:45:00 PM 1:00:00 1:00:00 60.00
31 Full handler callibration 8:45:00 PM 10:05:00 PM 1:20:00 1:20:00 80.00
32 Checking of individual pickup and vacuum readings 10:05:00 PM 10:35:00 PM 0:30:00 0:30:00 30.00
33 PBFT Testing 10:35:00 PM 10:55:00 PM 0:20:00 0:20:00 20.00
34 Initial buy-off/checking of pick-up tray 10:55:00 PM 11:55:00 PM 1:00:00 1:00:00 60.00
35 Vision teaching (with process group) bottom/Mark/VA/OC/TCI/TSI 11:55:00 PM 12:55:00 AM 1:00:00 1:00:00 60.00
36 Checking of pick-up at X3 and drop at taper 12:55:00 AM 1:15:00 AM 0:20:00 0:20:00 20.00
37 Fine tuning/adjustments of af delay, offset 1:15:00 AM 1:55:00 AM 0:40:00 0:40:00 40.00
38 MUBA checking and data gathering 1:55:00 AM 3:55:00 AM 2:00:00 2:00:00 120.00
39 1st reel checking at VMI 3:55:00 AM 4:15:00 AM 0:20:00 0:20:00 20.00
40 Online checking with setup checklist 4:15:00 AM 4:35:00 AM 0:20:00 0:20:00 20.00
41 LS certification release to production 4:35:00 AM 5:55:00 AM 1:20:00 1:20:00 80.00
Total Working Time 20:55:38
Less IDLE Time 20:39:11
Total Working Time (HOURS) 20.6531
Total Working Time (MINUTES) 1239.18
Total Machine per day 1.1621
F. Appendix 6 – Time Study for the Preventive Maintenance for ISMECA NX16 PIH004.

STMICROELECTONICS

Analyst: Mher Karizze Anne R. Narciso Machine No.: ISMECA NX16

Technicians: Renato Domalanta & Refe Aguilar Machine ID: PIH004
Area of Study: B2F1 - Finish Machine Operation: Tape and Reel (Finish)
Obs. Date/Time 6-Jul-17 0830H-1730H* Frequency of PM: 24 weeks

General Duration per Duration per Duration

# Activities Detailed Tasks Time Start Time Finish task Activity (mins) Remarks
Machine No. A Shift, Technician: Renato Domalanta

1 Supervisor approval/ Lead tech initial report finding approval 7:30:00 AM 7:38:27 AM 0:08:27
2 Pre- CMMS transaction/WO entry 7:38:27 AM 7:43:00 AM 0:04:33
maintenance Pre-PM assessment - Check for missing screws, functionality of all 0:56:10 56.17
3 Activities sensors, valves, motors & cylinder functionality, etc. 7:43:00 AM 7:54:09 AM 0:11:09
Machine handler log-in, delete old file, Back up copying (NTI and
4 VISION) 7:54:09 AM 8:26:10 AM 0:32:01 Forgot password
5 Cleaning/replacement of turret vacuum hoses 8:26:10 AM 8:43:54 AM 0:17:44
Break Time (10:00 AM - 11:00 AM)
6 Turret Continue cleaning/replacing turret vacuum hoses 10:52:45 11:31:58 0:39:13 2:35:10 155.17
7 Withdraw materials from CSR (Central Storage Room) 11:31:58 AM 11:52:24 AM 0:20:26
8 Turret maintenance, Lubricate ball cage of pick-up heads 11:52:24 AM 1:10:11 PM 1:17:47
9 Taper Clean/check taping cells and replace vacuum filter 1:10:11 PM 1:18:20 PM 0:08:09 0:08:09 8.15
10 Clean recentering/rotary module and tooling rest 1:18:20 PM 1:31:52 PM 0:13:32
Recentering/
Check/replace recentering/rotary tooling, motor/coder, belt, and 0:28:39 28.65
Rotary Nest 0:15:07
pulley/bearing 1:31:52 PM 1:46:59 PM
11 5S 1:46:59 PM 1:49:39 PM 0:02:40
End of shift
12 Travel to PM Room 1:49:39 PM 1:51:11 PM 0:01:32 0:13:01 13.02
activities
14 Report-making 1:51:11 PM 2:00:00 PM 0:08:49
B Shift, Technician: Refe Aguilar
15 Check email, endorsement from previous shift, other activities 2:00:00 PM 2:32:00 PM 0:32:00 0:32:00 32.00
16 Clean/Check purge bin module, position and parts 2:32:00 PM 2:37:01 PM 0:05:01
17 Purge Bin Other activities (Search for backup files with Sir Young) 2:37:01 PM 2:51:59 PM 0:14:58 0:29:00 29.00
18 Check/replace detection sensors valves, hose/wiring and harness 2:51:59 PM 3:01:00 PM 0:09:01
19 Inspection of critical parts 3:01:00 PM 3:11:00 PM 0:10:00
Bowl Feeder 0:30:00 30.00
20 Cleaning of vibrating bowl assembly and all sensors involved 3:11:00 PM 3:31:00 PM 0:20:00
Inspection of critical parts (Arrestor blade, deadspot and all
0:05:00
21 Linear Track sensors involved 3:31:00 PM 3:36:00 PM 0:20:00 20.00
22 Cleaning of linear track assembly 3:36:00 PM 3:51:00 PM 0:15:00
23 Two-position Inspection of critical parts (motor, tooling, gear, hose) 3:51:00 PM 4:01:00 PM 0:10:00
0:35:00 35.00
24 table Dismantled and cleaning of two position table nest 4:01:00 PM 4:26:00 PM 0:25:00
Check functionality and align nozzle rest and pick up position and
Auto-reject 0:20:00
25 height clearance 4:26:00 PM 4:46:00 PM 0:35:00 35.00
option
26 Check/clean parts on vacuum system for leaks/clogs 4:46:00 PM 5:01:00 PM 0:15:00
Break Time (5:00 PM - 6:00 PM)
Initial offline buyoff 10k and machine fine tuning at bowl feed,
4:00:00 4:00:00 240.00
27 linear/track feeder 2P table, bottom inspection, taper, auto-reject 6:00:00 PM 10:00:00 PM
28 Post- Installation of all machine covers
29 maintenance Filling up of PM card/checklist
30 Activities CMMS Completion 10:00:00 PM 10:30:00 PM 0:30:00 0:30:00 30.00
31 Checklist completion
32 5S
Total Working Time 11:52:09
Less IDLE Time 11:52:09
Total Working Time (HOURS) 11.8692
Total Working Time (MINUTES) 712.15
Total Machine per day 2.0220
G. Appendix 7 – Time Study for the wirebonding process of FWB731 machine.

STMICROELECTONICS TIME STANDARDS COMPUTATIONAL WORKSHEET

DEVICE TYPE: CGZW*2456CKB LOT NUMBER: 78720K702 RATING: 85% NORMAL

PRODUCT TYPE: UFDFPN 2X3X0.6 8L 0.5mm PITCH LOT SIZE: 29757 ALLOWANCE FACTOR: 11%
PACKAGE: UFDFPN 2X3X0.6 8L 0.5mm PITCH - AU Unit/Strip 1500 9% PERSONAL FATIGUE
DIE SIZE: X 12 2% STANDING
MACHINE TYPE: EAGLE60AP Y 25 2% TEDIOUSNESS
MACHINE ID: FWB731 MAPS 5
OPTR NAME: Strip/lot 20
Magazine/lot 2
Number of wires 8 (NORMAL WIRES) OBS DATE/TIME: 17-Jul-17 1045H-1115H
Wire type GOLD

AREA OF STUDY: Front of Line

Item Activities PIC FREQ UNIT AVE NT ST TOTAL ST (secs)

Lot Preparation
1 Loading of magazine Operator 1 lot 8.24 7.00 7.87 7.87
2 Check actual material used vs runcard Operator 1 lot 59.45 50.53 56.78 56.78
3 Check your LF or substrate BE code and ST LOT ID Operator 1 lot 30.17 25.64 28.81 28.81
4 Factory works transaction track in Operator 1 lot 29.18 24.80 27.87 27.87
WIRE BOND
5 Index of strip from magazine to wire bond area Machine 20 strip 29.77 29.77 29.77 590.62
6 Wirebonding of units Machine 29757 units 1.59 1.59 1.59 47245.19
7 Index every panel Machine 79 per panel 20.08 20.08 20.08 1593.23
8 Index out to magazine Machine 1 strip 6.58 6.58 6.58 6.58
9 Index in of succeeding strip Machine 19 strip 6.58 6.58 6.58 123.95
Post Operation
10 Unloading of magazine Operator 1 lot 25.14 21.37 24.01 24.01
11 Lot track out Operator 1 lot 33.15 28.18 31.66 31.66
TOTAL TIME (secs) 49,736.57
TOTAL TIME (min) 828.94
TOTAL TIME (hrs) 13.82
GROSS UPH 2,153.85
DLC 42.62
NOTES:

H. Appendix 8 – Time Study for the wirebonding process of FWB687 machine.

STMICROELECTONICS TIME STANDARDS COMPUTATIONAL WORKSHEET

DEVICE TYPE: CGZW*2456CKB LOT NUMBER: 78720K702 RATING: 85% NORMAL

PRODUCT TYPE: UFDFPN 2X3X0.6 8L 0.5mm PITCH LOT SIZE: 29757 ALLOWANCE FACTOR: 11%
PACKAGE: UFDFPN 2X3X0.6 8L 0.5mm PITCH - AU Unit/Strip 1500 9% PERSONAL FATIGUE
DIE SIZE: X 12 2% STANDING
MACHINE TYPE: EAGLE60AP Y 25 2% TEDIOUSNESS
MACHINE ID: FWB687 MAPS 5
OPTR NAME: Strip/lot 20
Magazine/lot 2
Number of wires 8 (NORMAL WIRES) OBS DATE/TIME: 17-Jul-17 1045H-1115H
Wire type GOLD

AREA OF STUDY: Front of Line

Item Activities PIC FREQ UNIT AVE NT ST TOTAL ST (secs)

Lot Preparation
1 Loading of magazine Operator 1 lot 8.24 7.00 7.87 7.87
2 Check actual material used vs runcard Operator 1 lot 59.45 50.53 56.78 56.78
3 Check your LF or substrate BE code and ST LOT ID Operator 1 lot 30.17 25.64 28.81 28.81
4 Factory works transaction track in Operator 1 lot 29.18 24.80 27.87 27.87
WIRE BOND
5 Index of strip from magazine to wire bond area Machine 20 strip 29.77 29.77 29.77 590.62
6 Wirebonding of units Machine 29757 units 1.68 1.68 1.68 50081.03
7 Index every panel Machine 79 per panel 20.08 20.08 20.08 1593.23
8 Index out to magazine Machine 1 strip 6.58 6.58 6.58 6.58
9 Index in of succeeding strip Machine 19 strip 6.58 6.58 6.58 123.95
Post Operation
10 Unloading of magazine Operator 1 lot 25.14 21.37 24.01 24.01
11 Lot track out Operator 1 lot 33.15 28.18 31.66 31.66
TOTAL TIME (secs) 52,572.41
TOTAL TIME (min) 876.21
TOTAL TIME (hrs) 14.60
GROSS UPH 2,037.67
DLC 40.32
NOTES:
I. Appendix 8 – Time Study for the plasma machine process prior wirebond.
EOL PLASMA - PRIOR MOLDING
Gross
Unload Strips per
Load magazine Pump Cleaning TOTAL Cycles per Units per units per Net Operating
Category Pkg UOM Ventilation magazine to day UPH Utilization Efficiency UPH
to machine generation Time TIME (mins) day strip day units/day Time/Day
machine (Maximum)
(Maximum)
U/WFDFPN 2x3 Au/Cu mins 0.57 1.95 6.00 1.27 0.68 10.47 137.53 5,501 1,500 8,251,500 343,813 80% 97% 266,799 24.00 11,116
MEMS 3x3 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 1,400 8,411,200 350,467 80% 97% 6,527,091 24.00 271,962
MEMS 2x2 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 2,856 17,158,848 714,952 80% 97% 13,315,266 24.00 554,802
MEMS
MEMS 2.5x3 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 1,610 9,672,880 403,037 80% 97% 7,506,154 24.00 312,756
MEMS 2.3x2.3 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 2,250 13,518,000 563,250 80% 97% 10,489,968 24.00 437,082
XFBGA 4.2X7X0.47 87 0.5P 0.22B mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 312 1,874,496 78,104 80% 97% 1,454,608 24.00 60,608
LFBGA 4.5X4.5X1.4 64L F8X8 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 520 3,124,160 130,173 80% 97% 2,424,348 24.00 101,014
LFBGA-10-10-M-1.0-273 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 120 720,960 30,040 80% 97% 559,464 24.00 23,311
VFBGA 8X6X1 88 F11X8 P0.65 B0.3 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 240 1,441,920 60,080 80% 97% 1,118,929 24.00 46,622
VFBGA 6x6x1.0 100 F10 P.5 b.3 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 320 1,922,560 80,107 80% 97% 1,491,906 24.00 62,162
UFBGA 5X7X0.60 117 0.5P 0.25B mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 396 2,379,168 99,132 80% 97% 1,846,234 24.00 76,926
BGA VFBGA138 8X8X1.0 PITCH0.5 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 168 1,009,344 42,056 80% 97% 783,250 24.00 32,635
TFBGA 8X8X1.2 95 4R 11X11 0.65 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 168 1,009,344 42,056 80% 97% 783,250 24.00 32,635
UFBGA143 5X9X0.65 0.5P 0.22BALL mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 220 1,321,760 55,073 80% 97% 1,025,685 24.00 42,736
UFBGA79 5X5X0.65 0.5P 0.22 BALL mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 396 2,379,168 99,132 80% 97% 1,846,234 24.00 76,926
TFBGA-7-7-0.8-88 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 224 1,345,792 56,075 80% 97% 1,044,334 24.00 43,513
LFBGA-4-4-0.9-49 mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 672 4,037,376 168,224 80% 97% 3,133,003 24.00 130,541
XFBGA 5X5X0.47 80 0.5P 0.20B mins 0.71 1.95 5.00 1.27 0.66 9.59 150.21 6,008 396 2,379,168 99,132 80% 97% 1,846,234 24.00 76,926

FOL PLASMA - PRIOR WIREBOND

Unload Strips per Gross
Load magazine TOTAL Cycles per Units per Net Operating
Category Pkg UOM Machine Processing/Cleaning Time magazine to day units per UPH Utilization Efficiency UPH
to machine TIME (mins) day strip units/day Time/Day
machine (Maximum) day
U/WFDFPN 2x3 Au/Cu mins 0.57 23.51 0.68 24.76 58.15 2,325 1,500 3,487,500 145,313 80% 97% 2,706,300 24.00 112,762
MEMS 3x3 mins 0.71 8.37 0.66 9.74 147.92 5,916 1,400 8,282,400 345,100 80% 97% 6,427,142 24.00 267,797
MEMS 2x2 mins 0.71 8.37 0.66 9.74 147.92 5,916 2,856 16,896,096 704,004 80% 97% 13,111,370 24.00 546,307
MEMS
MEMS 2.5x3 mins 0.71 8.37 0.66 9.74 147.92 5,916 1,610 9,524,760 396,865 80% 97% 7,391,213 24.00 307,967
MEMS 2.3x2.3 mins 0.71 8.37 0.66 9.74 147.92 5,916 2,250 13,311,000 554,625 80% 97% 10,329,336 24.00 430,389
QFN mR mins 0.86 16.00 0.67 17.54 82.10 3,284 1,505 4,942,420 205,934 80% 97% 3,835,317 24.00 159,804