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Transistors

2SC3940, 2SC3940A
Silicon NPN epitaxial planar type
Unit: mm
5.0±0.2 4.0±0.2
For low-frequency output amplification and driver amplification
Complementary to 2SA1534, 2SA1534A

8.0±0.2
■ Features 0.7±0.1

0.7±0.2
• Low collector-emitter saturation voltage VCE(sat)
• Allowing supply with the radial taping

13.5±0.5
■ Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Collector-base voltage 2SC3940 VCBO 30 V 0.45+0.2 0.45+0.15
–0.1
–0.1

(Emitter open) 2SC3940A 60 (1.27) (1.27)

2.3±0.2
Collector-emitter voltage 2SC3940 VCEO 25 V 1: Emitter
1 2 3
(Base open) 2SC3940A 50 2: Collector
2.54±0.15 3: Base
Emitter-base voltage (Collector open) VEBO 5 V TO-92NL-A1 Package
Collector current IC 1 A
Peak collector current ICP 1.5 A
Collector power dissipation PC 1 W
Junction temperature Tj 150 °C
Storage temperature Tstg −55 to +150 °C

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage 2SC3940 VCBO IC = 10 µA, IE = 0 30 V
(Emitter open) 2SC3940A 60
Collector-emitter voltage 2SC3940 VCEO IC = 2 mA, IB = 0 25 V
(Base open) 2SC3940A 50
Emitter-base voltage (Collector open) VEBO IE = 10 µA, IC = 0 5 V
Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 µA
Forward current transfer ratio *1 hFE1 *2 VCE = 10 V, IC = 500 mA 85 340 
hFE2 VCE = 5 V, IC = 1 A 50 
Collector-emitter saturation voltage*1 VCE(sat) IC = 500 mA, IB = 50 mA 0.2 0.4 V
Base-emitter saturation voltage*1 VBE(sat) IC = 500 mA, IB = 50 mA 0.85 1.20 V
Transition frequency fT VCB = 10 V, IE = −50 mA, f = 200 MHz 200 MHz
Collector output capacitance Cob VCB = 10 V, IE = 0, f = 1 MHz 11 20 pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank Q R S
hFE1 85 to 170 120 to 240 170 to 340

Publication date: March 2003 SJC00150BED 1


2SC3940, 2SC3940A

PC  Ta IC  VCE IC  I B
1.2 1.5 1.2
Ta = 25°C
VCE = 10 V
Ta = 25°C
Collector power dissipation PC (W)

1.0 1.25 1.0


IB = 10 mA
9 mA

Collector current IC (A)

Collector current IC (A)


8 mA
0.8 1.0 0.8
7 mA
6 mA
0.6 0.75 5 mA 0.6
4 mA

0.4 0.5 3 mA 0.4


2 mA

0.2 0.25 0.2


1 mA

0 0 0
0 40 80 120 160 0 2 4 6 8 10 0 2 4 6 8 10 12
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Base current IB (mA)

VCE(sat)  IC VBE(sat)  IC hFE  IC


10 100 600
IC / IB = 10 IC / IB = 10
Collector-emitter saturation voltage VCE(sat) (V)

VCE = 10 V
Base-emitter saturation voltage VBE(sat) (V)

500

Forward current transfer ratio hFE


1 10
Ta = 75°C
400
25°C
25°C Ta = −25°C
−25°C 1
0.1 300
75°C
Ta = 75°C
200
25°C
0.01 0.1
−25°C
100

0.001 0.01 0
0.01 0.1 1 10 0.01 0.1 1 10 0.01 0.1 1 10
Collector current IC (A) Collector current IC (A) Collector current IC (A)

fT  I E Cob  VCB VCER  RBE


200 V = 10 V 50 120
C (pF)

CB
IE = 0 IC = 10 mA
Ta = 25°C
f = 1 MHz Ta = 25°C
(V)
(Common base, input open circuited) ob

Ta = 25°C
100
Transition frequency fT (MHz)

160 40
(Resistor between B and E) VCER

80
120 30
Collector-emitter voltage
Collector output capacitance

60
2SC3940A
80 20
40

2SC3940
40 10
20

0 0 0
−1 −10 −100 1 10 100 0.1 1 10 100
Emitter current IE (mA) Collector-base voltage VCB (V) Base-emitter resistance RBE (kΩ)

2 SJC00150BED
2SC3940, 2SC3940A

ICEO  Ta Safe operation area


104 10
VCE = 10 V Single pulse
Ta = 25°C

ICP
103 1

Collector current IC (A)


IC t = 10 ms
ICEO (Ta = 25°C)

t=1s
ICEO (Ta)

102 0.1

2SC3940A
10 0.01

2SC3940
1 0.001
0 40 80 120 160 0.1 1 10 100
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V)

SJC00150BED 3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
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products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL

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