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Applications:
Package: TO-220F-6L Switching power supplies for electronic devices such as:
• White goods
• Consumer electronics
• Office automation
• Industrial equipment
• Communication equipment
Not to scale
Typical Application
U1 U2
R8
GND
D1 R2
STR-W6200D C2
D
FM/ELP
S/OCP
D/ST
GND
VCC
FB
1 3 4 5 6 7
Damper Snubber
Selection Guide
POUT*
MOSFET RDS(on)
fOSC (W)
Part Number VDSS(min) (max)
(kHz) 85 to
(V) (Ω) 230 VAC
265 VAC
STR-W6251D 3.95 45 30
STR-W6252D 67 650 2.8 60 40
STR-W6253D 1.9 90 60
*The listed output power is based on the thermal ratings, and the
peak output power can be 120% to 140% of the value stated here.
At low output voltage and short duty cycle, the output power may
be less than the value stated here.
STR-W6200D-DS 2
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
STR-W6200D-DS 3
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
Protection Operation
STR-W6200D-DS 4
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
STR-W6200D-DS 5
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
10
80
0.1 ms
60
1 ms
1
40
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
10 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 30
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
PD1 = 25 W
25
80
20
60 With infinite
heatsink
EAS
15
40
10
Without
20 heatsink
5
PD1 = 1.3 W
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
STR-W6200D-DS 6
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
10
80 0.1 ms
60
1 ms
1
40
Drain current limited
by on-resistance
20
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
10 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 30
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
PD1 = 26 W
25
80
20
60 With infinite
heatsink
EAS
15
40
10
Without
20 heatsink
5
PD1 = 1.3 W
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
STR-W6200D-DS 7
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
0.1 ms
10
80
60 1 ms
1
40 Drain current limited
by on-resistance
20
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
10 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 30
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
PD1 = 27.5 W
25
80
20
60 With infinite
heatsink
EAS
15
40
10
Without
20 heatsink
5
PD1 = 1.3 W
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
STR-W6200D-DS 8
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
TSD
RQ
Dmax 75%
S
PWM OSC DRV
SQ
R
S2 Q
Frequency OLP
FM /ELP Modulation CK Drain Peak Current
S1 Compensation
tDLY =
tFM ×16 R OCP
7.8 V
160 μA
Feedback
FB Control LEB S/OCP
Slope
Compensation GND
STR-W6200D-DS 9
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
U1 U2
R8
GND
D1 R2
STR-W6200D C2
D
FM/ELP
S/OCP
D/ST
GND
VCC
FB
1 3 4 5 6 7
Damper Snubber
The following design feature should be observed: In applications having a power supply specified such that VDS
has large transient surge voltages, a clamp snubber circuit of a capacitor-resistor-diode (CRD) combination
should be added on the primary winding, P, or a damper snubber circuit of a capacitor (C) or a resistor-capacitor
(CR) combination should be added between the D/ST pins and the S/OCP pin.
STR-W6200D-DS 10
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
Package Diagram
TO-220F-6L package
Leadform: 2003
10.0 ±0.2
4.2 ±0.2
Gate Burr 2.8 ±0.2
0.5
4.0 ±2
7.9 ±0.2
16.9 ±0.3
Ø3.2 ±0.2
2.6 ±0.1
(At base of pin)
2.8
5.0 ±0.5
6X0.74 ±0.15
10.4 ±0.5
+0.2 (2
6X0.65 –0.1 End of bend R1
)
(5.4)
View A View B
1 2 4 6
View A View B
Bottom View
Unit: mm
Dashed line at Gate Burr indicates
protrusion of 0.3 mm (max)
STR
W62xx
Part Number
YMDDR
Lot Number
Y is the last digit of the year (0 to 9)
M is the month (1 to 9, O, N, or D)
DD is a period of day (01 to 31)
R is the Sanken Registration Number
STR-W6200D-DS 11
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
Because reliability can be affected adversely by improper • Please select suitable screws for the product shape. Do not
storage environments and handling methods, please observe use a flat-head machine screw because of the stress to the
the following cautions. products. Self-tapping screws are not recommended. When
Cautions for Storage using self-tapping screws, the screw may enter the hole
• Ensure that storage conditions comply with the standard diagonally, not vertically, depending on the conditions of hole
temperature (5°C to 35°C) and the standard relative before threading or the work situation. That may stress the
humidity (around 40% to 75%); avoid storage locations products and may cause failures.
that experience extreme changes in temperature or • Recommended screw torque: 0.588 to 0.785 N●m (6 to 8
humidity. kgf●cm).
• Avoid locations where dust or harmful gases are present • For tightening screws, if a tightening tool (such as a driver)
and avoid direct sunlight. hits the products, the package may crack, and internal
• Reinspect for rust on leads and solderability of the stress fractures may occur, which shorten the lifetime of
products that have been stored for a long time. the electrical elements and can cause catastrophic failure.
Cautions for Testing and Handling Tightening with an air driver makes a substantial impact.
When tests are carried out during inspection testing and In addition, a screw torque higher than the set torque can
other standard test periods, protect the products from be applied and the package may be damaged. Therefore, an
power surges from the testing device, shorts between electric driver is recommended.
the product pins, and wrong connections. Ensure all test When the package is tightened at two or more places, first
parameters are within the ratings specified by Sanken for pre-tighten with a lower torque at all places, then tighten
the products. with the specified torque. When using a power driver, torque
Remarks About Using Silicone Grease with a Heatsink control is mandatory.
• When silicone grease is used in mounting the products on Soldering
a heatsink, it shall be applied evenly and thinly. If more • When soldering the products, please be sure to minimize
silicone grease than required is applied, it may produce the working time, within the following limits:
excess stress. 260±5°C 10±1 s (Flow, 2 times)
• Volatile-type silicone greases may crack after long periods 380±10°C 3.5±0.5 s (Soldering iron, 1 time)
of time, resulting in reduced heat radiation effect. Silicone • Soldering should be at a distance of at least 1.5 mm from
greases with low consistency (hard grease) may cause the body of the products.
cracks in the mold resin when screwing the products to a Electrostatic Discharge
heatsink. • When handling the products, the operator must be
Our recommended silicone greases for heat radiation grounded. Grounded wrist straps worn should have at
purposes, which will not cause any adverse effect on the least 1 MΩ of resistance from the operator to ground to
product life, are indicated below: prevent shock hazard, and it should be placed near the
operator.
Type Suppliers • Workbenches where the products are handled should be
G746 Shin-Etsu Chemical Co., Ltd. grounded and be provided with conductive table and floor
YG6260 Momentive Performance Materials Inc. mats.
SC102 Dow Corning Toray Co., Ltd. • When using measuring equipment such as a curve tracer,
the equipment should be grounded.
Cautions for Mounting to a Heatsink • When soldering the products, the head of soldering irons
• When the flatness around the screw hole is insufficient, such or the solder bath must be grounded in order to prevent
as when mounting the products to a heatsink that has an leak voltages generated by them from being applied to the
extruded (burred) screw hole, the products can be damaged, products.
even with a lower than recommended screw torque. For • The products should always be stored and transported in
mounting the products, the mounting surface flatness should Sanken shipping containers or conductive containers, or
be 0.05 mm or less. be wrapped in aluminum foil.
STR-W6200D-DS 12
SANKEN ELECTRIC CO., LTD. November 12, 2012
STR-W6251D,
STR-W6252D, and PWM Off-Line Switching Regulator ICs
STR-W6253D
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-
ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-
ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-
ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-
tion network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
STR-W6200D-DS 13
SANKEN ELECTRIC CO., LTD. November 12, 2012