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8/4/2018 2.2.

2 Cleaning, Aqueous Batch Process

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GENERAL SERVICES GUIDES PRODUCTS

2.2.2 Cleaning, Aqueous Batch Process More Guides


More Information
Base Board Repair and Rework
Outline
BGA Component Rework and Modification
Surface contaminants can significantly Flash version 9,0 or Circuitry and Plated Hole Repair
effect soldering, bonding, coating and the greater is required Coating and Marking Rework
electrical characteristics of circuit boards Engineering Changes and Jumper Wires
and assemblies. This procedure outlines a You have no flash plugin Gold Edge Contact Repair and Replating
batch cleaning process for the removal of installed SMT and BGA Pad Repair
the small volumes of fluxes and other SMT/Through Hole Component Rework
contaminants that may contact circuit Click here to download latest version
boards during routine circuit board repair
and rework operations. This batch cleaning
procedure is not necessarily appropriate
for the removal of contaminants that
accumulate during full assembly
operations.

Caution
Aqueous batch cleaning may not always be suitable for removing rosin based fluxes
or other contaminants that are not readily soluble in water.

Caution
Aqueous cleaning will expose all areas of a circuit board assembly to penetrating
water spray. Circuit boards must be assessed for possible damage to coatings and
devices that may be sensitive to deionized water.

Minimum Skill Level - Intermediate


Recommended for technicians with skills in basic soldering and component rework,
but may be inexperienced in general repair/rework procedures.

Conformance Level - High


This procedure most closely duplicates the physical characteristics of the original,
and most probably complies with all the functional, environmental and serviceability
factors.

Acceptability References
IPC-A-610 7.0 Cleanliness

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies

Tools and Materials


Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.

Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.

Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.

Oven
General purpose oven for drying, baking and curing epoxies.

Wipes
Nonabrasive, low-linting wipes for
cleanup.

Daily System Setup

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8/4/2018 2.2.2 Cleaning, Aqueous Batch Process
1. Check and record the meg ohm reading of the water exiting the deionizing filter
tanks. Reading should always exceed 1 megohm. Immediately change filter
tanks if the reading drops below 1 megohm.

2. With the unit empty, run the batch cleaning system through 3 cycles at the
start of each day. Check the following:
- Water Pressure: 20 PSI +/- 5 PSI
- Water Reservoir Temperature: 120 degrees F to 140 degrees F

Operation

1. Remove any loose items from circuit boards and place circuit boards in suitable
cleaning rack. Circuit boards should be placed within the rack at a minimum 45
degree angle to ensure proper rinse run off.

2. Place the rack within the batch cleaning system and run through the cleaning
cycle. Cycle temperature and cycle times follow:
- Wash Cycle Temperature: 120 degrees F to 140 degrees F
- Wash Cycle Time: 75 to 85 seconds
- Rinse Cycle Temperature: 120 degrees F to 140 degrees F
- Rinse Cycle Time: 10 to 30 seconds

3. Remove the rack and visually examine the circuit boards for cleanliness.

4. Dry the circuit boards in an oven, if desired.

Evaluation

1. Visually check board assemblies for any evidence of residual flux or


contamination. Clean again if needed.

2. Check circuit board assemblies for any loose items. Reattach items removed
prior to cleaning if needed.

Procedure for reference only.

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Haverhill, MA 01835 USA
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