CLA Series: Silicon Limiter Diode Bondable Chips: Applications

DATA SHEET
CLA Series: Silicon Limiter Diode Bondable Chips

Applications
 LNA receiver protection
 Commercial and defense radar
Features
 Established Skyworks limiter diode process
 High-power, mid-range, and cleanup designs
 Low insertion loss: 0.1 dB @ 2.6 GHz
 Peak power handling to +74 dBm
 Ultra-low spike leakage power
 Tight control of I layer base width
 Mesa and planar chip designs
Description
Skyworks GreenTM products are compliant with The Skyworks CLA series of silicon limiter diodes provides
all applicable legislation and are halogen-free. passive receiver protection over a wide range of frequencies from
For additional information, refer to Skyworks 100 MHz to over 30 GHz. These devices use the well-established
Definition of GreenTM, document number Skyworks silicon technology resulting in high resistivity and tightly
SQ04–0074. controlled base width PIN limiter diodes. Limiter circuits using
these devices perform with strong limiting action and low loss.
The CLA series consists of eleven individual chip designs of
different intrinsic region base widths and capacitances designed
to accommodate multi-stage limiter applications. The mesa-
constructed, thin base width, low capacitance CLA4601-000,
CLA4602-000, CLA4604-000, CLA4605-000, and CLA4611-000
are designed for low-level and cleanup applications. The
CLA4603-000, CLA4606-000 through CLA4608-000, and
CLA4610-000 are planar designs designated for high-power and
mid-range applications.
The CLA4609-000 thick base width mesa diode is designed for
coarse limiter-stage applications.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200100U • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 4, 2015 1
DATA SHEET • CLA SERIES DIODES
Electrical and Mechanical Specifications Table 3 and Figures 1 through 4. Table 4 identifies the die part
The absolute maximum ratings of the CLA diode series are numbers with their corresponding top contact diameters and die
specified in Table 1. Electrical specifications are provided in outline drawings.
Table 2. Typical performance characteristics are provided in
Table 1. CLA Series Absolute Maximum Ratings (Note 1)

Parameter Symbol Minimum Typical Maximum Units
Power dissipation PDIS Maximum TJ  Case Temp W
Thermal Re sis tan ce junctiontocase
Reverse voltage VR Minimum rated breakdown voltage V

Forward current IF 200 mA
Junction temperature TJ –65 +175 C
Storage temperature TSTG –65 +200 C
Electrostatic discharge:
Charged Device Model (CDM), Class 4 1000 V
Human Body Model (HBM), Class 1C 1000 V
Machine Model (MM), Class A 150 V
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
2 June 4, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100U
Table 2. CLA Series Electrical Specifications (Notes 1 and 2)

Thermal Resistance (θ) (Note 3)
Minority
Junction Junction Series Carrier 1 μs Pulse
Capacitance (CJ) Capacitance (CJ) Resistance Lifetime (TL) 0.01% Duty
Breakdown I Region @0V @6V (RS) @ 10 mA @ 10 mA Average Cycle PDISS
Voltage (V) (μm) (pF) (pF) (Ω) (ns) (C/W) (C/W) (W)
Part Number Min to Max Nominal Typical Maximum Maximum Typical Maximum Typical Typical
CLA4601-000 15 to 30 1 0.12 0.10 2.5 5 185 0.89 0.49
CLA4602-000 15 to 30 1 0.20 0.15 2.0 5 177 0.42 0.51
CLA4603-000 20 to 45 1.5 0.20 0.15 2.0 5 135 0.39 0.66
CLA4604-000 30 to 60 2.0 0.12 0.10 2.5 7 139 0.40 0.65
CLA4605-000 30 to 60 2.0 0.20 0.15 2.0 7 139 0.51 0.65
CLA4606-000 45 to 75 2.5 0.20 0.15 2.0 10 139 0.43 0.65
CLA4607-000 120 to 180 7.0 0.20 0.15 @ 38 V 2.0 50 191 0.26 0.47
CLA4608-000 120 to 180 7.0 0.60 0.50 @ 38 V 1.2 100 106 0.14 0.85
CLA4609-000 250 (Min.) 20 0.26 0.14 1.5 1175 84 0.44 1.07
CLA4610-000 80 to 120 4.5 0.13 0.12 2.2 20 145 0.46 0.62
CLA4611-000 120 to 180 12 0.23 0.20 @ 38 V 1.2 300 103 0.37 0.87
Note 1: Performance is guaranteed only under the conditions listed in this table and is not guaranteed over the full operating or storage temperature ranges. Operation at
elevated temperatures may reduce reliability of the device.
Note 2: TOP = +25 C, CJ measured at 1 MHz, RS measured at 500 MHz, CW thermal resistance for infinite heat sink, unless otherwise noted.
Note 3: Thermal resistance is calculated from the measured power dissipation and junction temperature @ f = 2.6 GHz, TJ max = 175 °C and TCASE = 85 °C. Die were
connected in single stage limiter configuration with a 22 nH inductor providing the DC ground return. The diode cathode was attached to the RF ground of a 10 mil thick
Rogers 4003 microstrip test board using 2 mil thick conductive epoxy. The anode contact was connected to the test board input and output RF lines using 0.8 mil Au
bond wire for each connection. The test board included 22 mil coplanar, gold-plated, RF lines and two 50  SMA connectors.
Table 3. Typical Performance @ 25 °C @ 2.6 GHz, Z0 = 50 Ω (Note 1)

CW Input Power Maximum Output @
for 1 dB Maximum CW Pulsed Input Maximum
Insertion Loss Insertion Loss Input Power Power Pulsed Input Recovery Time Spike Leakage
Part Number @ –10 dBm (dB) (dBm) (dBm) (dBm) (Note 2) (dBm) (Note 2) (ns) (Note 3) (ergs) (Note 4)
CLA4601-000 0.1 12 36 65 21 5 Note 5
CLA4602-000 0.1 12 36 65 24 5 Note 5
CLA4603-000 0.1 10 38 67 22 5 Note 5
CLA4604-000 0.1 12 40 70 24 5 Note 5
CLA4605-000 0.1 11 40 70 27 5 0.08
CLA4606-000 0.1 11 41 71 27 5 0.03
CLA4607-000 0.1 26 43 73 39 5 0.21
CLA4608-000 0.2 23 43 73 44 5 0.15
CLA4609-000 0.3 37 44 74 50 5 25.77
CLA4610-000 0.1 22 40 57 32 5 Note 5
CLA4611-000 0.3 25 40 60 42 450 0.6
Note 1: Diode chip is mounted on a 0.5 oz Cu PC board using 1 to 2 mils of conductive epoxy. Bond wire connections are made with 0.8 mil Au wire. Limiter configured with shunt connected
diode and 22 nH ground return and 100 pF DC blocking capacitors.
Note 2: Pulsed power measurements taken at 1 μs pulse width, pulse frequency = 10 kHz, and 0.1% duty cycle.
Note 3: Recovery time represents the transition time from the high-loss state to the low-loss state following the removal of a high-power input. It is defined as the time from the end of the
high-power pulse to the time when insertion loss has returned to within 3 dB of the quiescent (low-power) state.
Note 4: Spike Leakage (ergs) = ts x Ps x 107 where ts is the spike width at the half-power point (in seconds) and PS is the maximum spike amplitude in watts.
Note 5: Not detectable under current test conditions described in Note 2.
Table 4. CLA Series Parts – Die Packages

Part Number Typical Top Contact Diameter (mils/mm) Die Drawing
CLA4601-000 1.05/0.027 150–806
CLA4602-000 1.15/0.029 150–806
CLA4603-000 2.00/0.051 149–815
CLA4604-000 1.65/0.042 150–806
CLA4605-000 2.00/0.051 150–813
CLA4606-000 2.25/0.057 149–815
CLA4607-000 3.50/0.089 149–815
CLA4608-000 6.50/0.165 149–815
CLA4609-000 4.00/0.102 150–813
CLA4610-000 2.75/0.070 149–815
CLA4611-000 4.1/0.104 150-801
Typical Performance Characteristics

(Tested at 25 °C, 2.6 GHz, Z0 = 50 Ω)
20 40
35
Output Power (dBm)
Output Power (dBm)

15 30
25
10 CLA4601
20
CLA4602
CLA4603 15 CLA4607
CLA4604 CLA4608
5 10 CLA4609
CLA4605
CLA4610
Y1828
5
Y0383
CLA4606 CLA4611
0 0
0 5 10 15 20 25 30 35 40 45 0 5 10 15 20 25 30 35 40 45
Input Power (dBm) Input Power (dBm)

Figure 1. CLA4601 to CLA4606 CW Output vs Input Power Figure 2. CLA4607 to CLA4611 CW Output vs Input Power
0 0
–5 –5
Insertion Loss (dB)
Insertion Loss (dB)
–10 –10
CLA4601
CLA4602 CLA4607
–15 –15 CLA4608
CLA4603
CLA4604 CLA4609
–20 CLA4605 –20 CLA4610
Y0385
Y1829
CLA4606 CLA4611
–25 –25
0 5 10 15 20 25 30 35 40 45 –10 –5 0 +5 +10 +15 +20 +25 +30 +35 +40 +45
Power In (dBm) Power In (dBm)

Figure 3. CLA4601 to CLA4606 Insertion Loss vs CW Input Power Figure 4. CLA4607 to CLA4611 Insertion Loss vs CW Input Power
Technical Description in chip form and represent the ultimate in limiter performance not
The CLA4603-000, CLA4606-000 through CLA4608-000, and approached by other manufacturers.
CLA4610-000 limiter diodes are constructed in a passivated The highest power CLA4609 diodes use a mesa construction.
flat-chip configuration and are available in a basic chip form. Additional bonding and handling methods are contained in these
Limiter diodes with lower capacitance values to 0.08 pF and Skyworks Application Notes:
constructed with a passivated mesa configuration are available in
the CLA4601-000, CLA4602-000, CLA4604-000, CLA4605-000  Waffle Pack Chip Carrier Handling/Opening Procedure
and CLA4611-000 series. The mesa devices offer low (document #200146)
capacitance and, therefore, broader bandwidth, lower loss, and  Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods
faster response at reduced power. These diodes are also available and Packaging (document #200532).
Package Outline Drawings

Package outline die drawings for the CLA diode series are shown
in Figures 5, 6, and 7.
Schematic
1
Anode 2
Top Contact, Gold
0.002 (0.051 mm)
Dia. Min. 0.014 ± 0.001
(0.356 ± 0.025 mm)
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.004 (0.10 mm)

0.006 (0.15 mm) Nom.
1
2
Cathode Metallized Back
Contact, Gold S1565
Figure 5. 149-815 Package
Schematic
Anode 1
Metallized
Gold Dot
0.010 (0.254 mm) Min. 2

0.014 (0.356 mm) Max. Sq.
150-801:
0.002 (0.051 mm) Min.
150-806:
0.0011 (0.028 mm) Nom.
1
0.004 (0.100 mm) Min.
0.006 (0.152 mm) Max.
Silicon
2
Cathode Metallized Back
Contact: Gold S1567
Figure 6. 150 Series Package
Schematic
1
Metallized Gold Dot 2

0.002 (0.01 mm) Min. Dia.
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.014 ± 0.001
(0.356 ± 0.025 mm)
Silicon
Metallized Back
Contact Gold
1
0.005
(0.13 mm) Nom.
Dimensions are in inches (millimeters shown in parentheses) S1566
Figure 7. 150-813 Package
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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DATA SHEET

CLA Series: Silicon Limiter Diode Bondable Chips

Table 1. CLA Series Absolute Maximum Ratings (Note 1)

Reverse voltage VR Minimum rated breakdown voltage V

Table 2. CLA Series Electrical Specifications (Notes 1 and 2)

Table 3. Typical Performance @ 25 °C @ 2.6 GHz, Z0 = 50 Ω (Note 1)

Table 4. CLA Series Parts – Die Packages

Typical Performance Characteristics

Output Power (dBm)

Input Power (dBm) Input Power (dBm)

Power In (dBm) Power In (dBm)

Package Outline Drawings

0.004 (0.10 mm)

Figure 5. 149-815 Package

0.010 (0.254 mm) Min. 2

Figure 6. 150 Series Package

Metallized Gold Dot 2

Dimensions are in inches (millimeters shown in parentheses) S1566

Figure 7. 150-813 Package

Copyright © 2002-2009, 2012-2015 Skyworks Solutions, Inc. All Rights Reserved.

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