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IF(AV) 1A
VRRM 40 V
Tj 150°C
VF (max) 0.45 V
Value
Symbol Parameter Unit
1N5817 1N5818 1N5819
VRRM Repetitive peak reverse voltage 20 30 40 V
IF(RMS) RMS forward current 10 A
IF(AV) Average forward current TL = 125°C 1 A
δ = 0.5
IFSM Surge non repetitive forward tp = 10 ms 25 A
current Sinusoidal
PARM Repetitive peak avalanche tp = 1µs Tj = 25°C 1200 1200 900 W
power
Tstg Storage temperature range - 65 to + 150 °C
Tj Maximum operating junction temperature * 150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
dPtot 1
* : < thermal runaway condition for a diode on its own heatsink
dTj Rth( j − a )
THERMAL RESISTANCES
Fig. 1: Average forward power dissipation versus Fig. 2: Average forward power dissipation versus
average forward current (1N5817/1N5818). average forward current (1N5819).
PF(av)(W) PF(av)(W)
0.6 0.7
δ = 0.1 δ = 0.2 δ = 0.5
δ = 0.2 δ = 0.5
δ = 0.1 0.6
0.5 δ = 0.05
δ = 0.05
0.5
0.4 δ=1 δ=1
0.4
0.3
0.3
0.2
T 0.2 T
0.1 0.1
IF(av) (A) δ=tp/T tp IF(av) (A) δ=tp/T tp
0.0 0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Fig. 2-1: Average forward current versus ambient Fig. 2-2: Average forward current versus ambient
temperature (δ=0.5) (1N5817/1N5818). temperature (δ=0.5) (1N5819).
IF(av)(A) IF(av)(A)
1.2 1.2
Rth(j-a)=Rth(j-l)=45°C/W Rth(j-a)=Rth(j-l)=45°C/W
1.0 1.0
0.6 0.6
0.4 0.4
T T
0.2 0.2
δ=tp/T tp Tamb(°C) δ=tp/T tp Tamb(°C)
0.0 0.0
0 25 50 75 100 125 150 0 25 50 75 100 125 150
2/5
1N581x
Fig. 3: Normalized avalanche power derating Fig. 4: Normalized avalanche power derating
versus pulse duration. versus junction temperature.
PARM(tp) PARM(tp)
PARM(1µs) PARM(25°C)
1 1.2
1
0.1 0.8
0.6
0.01 0.4
0.2
tp(µs) Tj(°C)
0.001 0
0.01 0.1 1 10 100 1000 0 25 50 75 100 125 150
Fig. 5-1: Non repetitive surge peak forward Fig. 5-2: Non repetitive surge peak forward
current versus overload duration current versus overload duration
(maximum values) (1N5817/1N5818). (maximum values) (1N5819).
IM(A) IM(A)
10 8
9 7
8
6
7
6 Ta=25°C 5 Ta=25°C
5 Ta=75°C
4 Ta=75°C
4 3
3 Ta=100°C
Ta=100°C 2
2 IM IM
1 t 1 t
δ=0.5 t(s) δ=0.5 t(s)
0 0
1E-3 1E-2 1E-1 1E+0 1E-3 1E-2 1E-1 1E+0
Fig. 6: Relative variation of thermal impedance Fig. 7: Junction capacitance versus reverse
junction to ambient versus pulse duration (epoxy voltage applied (typical values).
printed circuit board, e(Cu)=35mm, recommended
pad layout).
Zth(j-a)/Rth(j-a) C(pF)
1.0 500
F=1MHz
Tj=25°C
0.8 200
1N5817
0.4 50 1N5819
δ = 0.2 T
0.2 δ = 0.1
20
tp(s) δ=tp/T tp
VR(V)
Single pulse
0.0 10
1E-1 1E+0 1E+1 1E+2 1E+3 1 2 5 10 20 40
3/5
1N581x
Fig. 8-1: Reverse leakage current versus reverse Fig. 8-2: Reverse leakage current versus reverse
voltage applied (typical values) (1N5817/1N5818). voltage applied (typical values) (1N5819).
IR(mA) IR(mA)
1E+1 1E+1
Tj=125°C 1N5818
Tj=125°C
1N5817
1E+0 1E+0
Tj=100°C Tj=100°C
1E-1 1E-1
1E-2 1E-2
Tj=25°C
Tj=25°C
VR(V) VR(V)
1E-3 1E-3
0 5 10 15 20 25 30 0 5 10 15 20 30 35 40
Fig. 9-1: Forward voltage drop versus forward Fig. 9-2: Forward voltage drop versus forward
current (typical values) (1N5817/1N5818). current (typical values) (1N5819).
IFM(A) IFM(A)
10.00 10.00
1.00 1.00
Tj=100°C Tj=100°C
Tj=125°C Tj=125°C
Tj=25°C Tj=25°C
0.10 0.10
VFM(V) VFM(V)
0.01 0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
IFSM(A)
30
F=50Hz Tj initial=25°C
25
20
15
10
5
Number of cycles
0
1 10 100 1000
4/5
1N581x
PACKAGE MECHANICAL DATA
DO41 plastic
DIMENSIONS
C A C / B
O
REF. Millimeters Inches
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