CD40106BMS

December 1992
CMOS Hex Schmitt Triggers

Features Pinout
• High Voltage Type (20V Rating) CD40106BMS
TOP VIEW
• Schmitt Trigger Action with No External Components
• Hysteresis Voltage (Typ.) A 1 14 VDD
- 0.9V at VDD = 5V G=A 2 13 F
- 2.3V at VDD = 10V
B 3 12 L = F
- 3.5V at VDD = 15V
H=B 4 11 E
• Noise Immunity Greater than 50%
C 5 10 K = E
• No Limit on Input Rise and Fall Times I=C 6 9 D
• Low VDD to VSS Current During Slow Input Ramp VSS 7 8 J=D

• 100% Tested for Quiescent Current at 20V

• 5V, 10V and 15V Parametric Ratings
• Maximum Input Current of 1µA at 18V Over Full Pack- Functional Diagram
age Temperature Range; 100nA at 18V and +25oC
• Standardized Symmetrical Output Characteristics A
1 2
G=A
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of 3 4
B H=B
‘B’ Series CMOS Devices”

5 6
Applications C I=C

• Wave and Pulse Shapers

9 8
D J=D
• High Noise Environment Systems
• Monostable Multivibrators 11 10
E K=E
• Astable Multivibrators
13 12
F L=F
Description
CD40106BMS consists of six Schmitt trigger circuits. Each
circuit functions as an inverter with Schmitt trigger action on
the input. The trigger switches at different points for positive
and negative going signals. The difference between the
Logic Diagram
positive going voltage (VP) and the negative going voltage
(VN) is defined as hysteresis voltage (VH) (see Figure 17). * *
A G
The CD40106BMS is supplied in these 14 lead outline 1 (3, 5, 9, 11, 13) 2 (4, 6, 8, 10, 12)
packages:
VDD
Braze Seal DIP H4Q
Frit Seal DIP H1B
* ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION
Ceramic Flatpack H3W
NETWORK

VSS

FIGURE 1. 1 OF 6 SCHMITT TRIGGERS

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. File Number 3354
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
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 Specifications CD40106BMS

Absolute Maximum Ratings Reliability Information

DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC
At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for
10s Maximum
Thermal Resistance . . . . . . . . . . . . . . . . θja θjc
Ceramic DIP and FRIT Package . . . . . 80oC/W 20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70oC/W 20oC/W
Maximum Package Power Dissipation (PD) at +125oC
For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW
For TA = +100oC to +125oC (Package Type D, F, K). . . . . . Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC

TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS

LIMITS
GROUP A
PARAMETER SYMBOL CONDITIONS (NOTE 1) SUBGROUPS TEMPERATURE MIN MAX UNITS
Supply Current IDD VDD = 20V, VIN = VDD or GND 1 +25oC - 2 µA
2 +125oC - 200 µA
VDD = 18V, VIN = VDD or GND 3 -55oC - 2 µA
Input Leakage Current IIL VIN = VDD or GND VDD = 20 1 +25oC -100 - nA
2 +125oC -1000 - nA
VDD = 18V 3 -55oC -100 - nA
Input Leakage Current IIH VIN = VDD or GND VDD = 20 1 +25oC - 100 nA
2 +125oC - 1000 nA
VDD = 18V 3 -55oC - 100 nA
Output Voltage VOL15 VDD = 15V, No Load 1, 2, 3 +25oC, +125oC, -55oC - 50 mV
Output Voltage VOH15 VDD = 15V, No Load (Note 2) 1, 2, 3 +25oC, +125oC, -55oC 14.95 - V
Output Current (Sink) IOL5 VDD = 5V, VOUT = 0.4V 1 +25oC 0.53 - mA
Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1 +25oC 1.4 - mA
Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1 +25oC 3.5 - mA
Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1 +25oC - -0.53 mA
Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1 +25oC - -1.8 mA
Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1 +25oC - -1.4 mA
Output Current (Source) IOH15 VDD = 15V, VOUT = 13.5V 1 +25oC - -3.5 mA
N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1 +25oC -2.8 -0.7 V
P Threshold Voltage VPTH VSS = 0V, IDD = 10µA 1 +25oC 0.7 2.8 V
Functional F VDD = 2.8V, VIN = VDD or GND 7 +25oC VOH > VOL < V
VDD/2 VDD/2
VDD = 20V, VIN = VDD or GND 7 +25oC
VDD = 18V, VIN = VDD or GND 8A +125oC
VDD = 3V, VIN = VDD or GND 8B -55oC
Positive Trigger VP5 VDD = 5V 1, 2, 3 +25oC, +125oC, -55oC 2.2 3.6 V
Threshold Voltage
VP10 VDD = 10V 1, 2, 3 +25oC, +125oC, -55oC 4.6 7.1 V
(See Figure 17)
VP15 VDD = 15V 1, 2, 3 +25oC, +125oC, -55oC 6.8 10.8 V
Negative Trigger VN5 VDD = 5V 1, 2, 3 +25oC, +125oC, -55oC 0.9 2.8 V
Threshold Voltage
VN10 VDD = 10V 1, 2, 3 +25oC, +125oC, -55oC 2.5 5.2 V
(See Figure 17)
VN15 VDD = 15V 1, 2, 3 +25oC, +125oC, -55oC 4 7.4 V
Hysteresis Voltage VH5 VDD = 5V 1, 2, 3 +25oC, +125oC, -55oC 0.3 1.6 V
(See Figure 17)
VH10 VDD = 10V 1, 2, 3 +25oC, +125oC, -55oC 1.2 3.4 V
VH15 VDD = 15V 1, 2, 3 +25oC, +125oC, -55oC 1.6 5.0 V
NOTES: 1. All voltages referenced to device GND, 100% testing being 3. For accuracy, voltage is measured differentially to VDD. Limit
implemented. is 0.050V max.
2. Go/No Go test with limits applied to inputs.

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 Specifications CD40106BMS

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS

LIMITS
GROUP A
PARAMETER SYMBOL CONDITIONS (NOTE 1, 2) SUBGROUPS TEMPERATURE MIN MAX UNITS
Propagation Delay TPHL VDD = 5V, VIN = VDD or GND 9 +25oC - 280 ns
TPLH
10, 11 +125oC, -55oC - 378 ns
Transition Time TTHL VDD = 5V, VIN = VDD or GND 9 +25oC - 200 ns
TTLH
10, 11 +125oC, -55oC - 270 ns
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns
2. -55oC and +125oC limits guaranteed, 100% testing being implemented.

TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS

LIMITS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS
Supply Current IDD VDD = 5V, VIN = VDD or GND 1, 2 -55oC, +25oC - 1 µA
+125oC - 30 µA
VDD = 10V, VIN = VDD or GND 1, 2 -55oC, +25oC - 2 µA
+125oC - 60 µA
VDD = 15V, VIN = VDD or GND 1, 2 -55oC, +25oC - 2 µA
+125oC - 120 µA
Output Voltage VOL VDD = 5V, No Load 1, 2 +25oC, +125oC, - 50 mV
-55oC
Output Voltage VOL VDD = 10V, No Load 1, 2 +25oC, +125oC, - 50 mV
-55oC
Output Voltage VOH VDD = 5V, No Load 1, 2 +25oC, +125oC, 4.95 - V
-55oC
Output Voltage VOH VDD = 10V, No Load 1, 2 +25oC, +125oC, 9.95 - V
-55oC
Output Current (Sink) IOL5 VDD = 5V, VOUT = 0.4V 1, 2 +125oC 0.36 - mA
-55oC 0.64 - mA
Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1, 2 +125oC 0.9 - mA
-55oC 1.6 - mA
Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1, 2 +125oC 2.4 - mA
-55oC 4.2 - mA
Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1, 2 +125oC - -0.36 mA
-55oC - -0.64 mA
Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1, 2 +125oC - -1.15 mA
-55oC - -2.0 mA
Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1, 2 +125oC - -0.9 mA
-55oC - -1.6 mA
Output Current (Source) IOH15 VDD =15V, VOUT = 13.5V 1, 2 +125oC - -2.4 mA
-55oC - -4.2 mA
Propagation Delay TPHL VDD = 10V 1, 2, 3 +25oC - 140 ns
TPLH
VDD = 15V 1, 2, 3 +25oC - 120 ns
Transition Time TTHL VDD = 10V 1, 2, 3 +25oC - 100 ns
TTLH
VDD = 15V 1, 2, 3 +25oC - 80 ns

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 Specifications CD40106BMS

TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)

LIMITS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS
Input Capacitance CIN Any Input 1, 2 +25oC - 7.5 pF
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on
initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K., Input TR, TF < 20ns

TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS

LIMITS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS
Supply Current IDD VDD = 20V, VIN = VDD or GND 1, 4 +25oC - 7.5 µA
N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1, 4 +25oC -2.8 -0.2 V
N Threshold Voltage ∆VTN VDD = 10V, ISS = -10µA 1, 4 +25oC - ±1 V
Delta
P Threshold Voltage VTP VSS = 0V, IDD = 10µA 1, 4 +25oC 0.2 2.8 V
P Threshold Voltage ∆VTP VSS = 0V, IDD = 10µA 1, 4 +25oC - ±1 V
Delta
Functional F VDD = 18V, VIN = VDD or GND 1 +25oC VOH > VOL < V
VDD/2 VDD/2
VDD = 3V, VIN = VDD or GND
Propagation Delay Time TPHL VDD = 5V 1, 2, 3, 4 +25oC - 1.35 x ns
TPLH +25oC
Limit
NOTES: 1. All voltages referenced to device GND. 3. See Table 2 for +25oC limit.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns. 4. Read and Record

TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25oC

PARAMETER SYMBOL DELTA LIMIT

Supply Current - MSI-1 IDD ± 0.2µA
Output Current (Sink) IOL5 ± 20% x Pre-Test Reading
Output Current (Source) IOH5A ± 20% x Pre-Test Reading

TABLE 6. APPLICABLE SUBGROUPS

MIL-STD-883
CONFORMANCE GROUP METHOD GROUP A SUBGROUPS READ AND RECORD
Initial Test (Pre Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas
Interim Test 3 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas
Final Test 100% 5004 2, 3, 8A, 8B, 10, 11
Group A Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11

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 Specifications CD40106BMS

TABLE 6. APPLICABLE SUBGROUPS

MIL-STD-883
CONFORMANCE GROUP METHOD GROUP A SUBGROUPS READ AND RECORD
Group B Subgroup B-5 Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6 Sample 5005 1, 7, 9
Group D Sample 5005 1, 2, 3, 8A, 8B, 9 Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.

TABLE 7. TOTAL DOSE IRRADIATION

TEST READ AND RECORD

MIL-STD-883
CONFORMANCE GROUPS METHOD PRE-IRRAD POST-IRRAD PRE-IRRAD POST-IRRAD
Group E Subgroup 2 5005 1, 7, 9 Table 4 1, 9 Table 4

TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS

OSCILLATOR
FUNCTION OPEN GROUND VDD 9V ± -0.5V 50kHz 25kHz
Static Burn-In 1 2, 4, 6, 8, 10, 12 1, 3, 5, 7, 9, 11, 13 14
Note 1
Static Burn-In 2 2, 4, 6, 8, 10, 12 7 1, 3, 5, 9, 11,
Note 1 13, 14
Dynamic Burn- - 7 14 2, 4, 6, 8, 10, 12 1, 3, 5, 9, 11, 13
In Note 1
Irradiation 2, 4, 6, 8, 10, 12 7 1, 3, 5, 9, 11,
Note 2 13, 14
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V

Typical Performance Characteristics

AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC

OUTPUT LOW (SINK) CURRENT (IOL) (mA)

OUTPUT LOW (SINK) CURRENT (IOL) (mA)

30 GATE-TO-SOURCE VOLTAGE (VGS) = 15V 15.0

GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25 12.5

20 10.0

10V
15 7.5
10V

10 5.0

5 2.5
5V 5V

0 5 10 15 0 5 10 15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) DRAIN-TO-SOURCE VOLTAGE (VDS) (V)

FIGURE 2. TYPICAL OUTPUT LOW (SINK) CURRENT FIGURE 3. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS CHARACTERISTICS

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 Specifications CD40106BMS

Typical Performance Characteristics (Continued)

DRAIN-TO-SOURCE VOLTAGE (VDS) (V) DRAIN-TO-SOURCE VOLTAGE (VDS) (V)

-15 -10 -5 0 -15 -10 -5 0
0 0
AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC

OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)

OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)

GATE-TO-SOURCE VOLTAGE (VGS) = -5V -5 GATE-TO-SOURCE VOLTAGE (VGS) = -5V

-10 -5

-15

-10V -10V
-20 -10

-25

-15V -15V
-30 -15

FIGURE 4. TYPICAL OUTPUT HIGH (SOURCE) CURRENT FIGURE 5. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS CHARACTERISTICS
AMBIENT TEMPERATURE (TA) = +25oC
SUPPLY VOLTAGE (VDD) = 15V SUPPLY VOLTAGE (VDD) = 15V
15.0 1.5 15
CURRENT VDD
OUTPUT VOLTAGE (VO) (V)

OUTPUT VOLTAGE (VO) (V)

PEAK VDD
DRAIN CURRENT (ID) (mA)

12.5

10V 1 2
VIN VO 10V 1 2
10.0 1.0 10 VIN VO

CURRENT ALL
7.5 VO ID OTHER ALL
PEAK
ID INPUTS TO -55oC OTHER
5V VDD OR VSS 5V +125oC INPUTS TO
5.0 0.5 5 VDD OR VSS

2.5

0 0 0
0 2.5 5.0 7.5 10.0 12.5 15.0 0 5 10 15
INPUT VOLTAGE (VI) (V) INPUT VOLTAGE (VI) (V)
FIGURE 6. TYPICAL CURRENT AND VOLTAGE TRANSFER FIGURE 7. TYPICAL VOLTAGE TRANSFER CHARACTERIS-
CHARACTERISTICS TICS AS A FUNCTION OF TEMPERATURE

200
AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC
PROPAGATION TIME (tPHL, tPLH) (ns)

TRANSITION TIME (tTHL, tTLH) (ns)

150 SUPPLY VOLTAGE (VDD) = 5V

200

SUPPLY VOLTAGE (VDD) = 5V

150
100
10V
100
5V 10V
50
15V
50

0 0
0 20 40 60 80 100 0 20 40 60 80 100
LOAD CAPACITANCE (CL) (pF) LOAD CAPACITANCE (CL) (pF)
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNC- FIGURE 9. TYPICAL TRANSITION TIME AS A FUNCTION OF
TION OF LOAD CAPACITANCE LOAD CAPACITANCE

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 CD40106BMS

Typical Performance Characteristics (Continued)

105 8
POWER DISSIPATION PER TRIGGER (PD) (µW)

TRIGGER THRESHOLD VOLTAGE (VP, VN) (V)

6 AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC
4
INPUT ON TERMINALS 1, 5, 8, 12 OR 2, 6, 9, 13;
2
OTHER INPUTS TIED TO VDD
104 8 SUPPLY VOLTAGE (VDD) = 15V 15
6
4
2 5V
VP
103 8 10V 10
6
4
2 VN

102 8 5
6
4 CL = 50pF
CL = 15pF
2

10 0
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
10-1 1 10 102 103 104 0 5 10 15 20
INPUT FREQUENCY (f) (kHz) SUPPLY VOLTAGE (VDD) (V)

FIGURE 10. TYPICAL POWER DISSIPATION PER TRIGGER AS FIGURE 11. TYPICAL TRIGGER THRESHOLD VOLTAGE AS A
A FUNCTION OF INPUT FREQUENCY FUNCTION OF SUPPLY VOLTAGE

104 8
6
AMBIENT TEMPERATURE (TA) = +25oC
X 100 PERCENT

4
POWER DISSIPATION (PD) (µW) 2
103 8 SUPPLY VOLTAGE (VDD) = 15pF
6 FREQUENCY (f) = 100kHz
25 4
(

2
102 8
15V, 10kHz
20 6
4
VDD
VH

2
15 10 8 15V, 1kHz
(

6
HYSTERESIS

4 10V, 1kHz
10 2
18
6 5V, 1kHz
5 4 AMBIENT TEMPERATURE (TA) = +25oC
2 LOAD CAPACITANCE (CL) = 15pF
0 10-1
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
0 5 10 15 20 0.1 1 10 102 103 104
SUPPLY VOLTAGE (VDD) (V) RISE AND FALL TIME (tr, tf) (ns)

FIGURE 12. TYPICAL PERCENT HYSTERESIS AS A FUNCTION FIGURE 13. TYPICAL POWER DISSIPATION AS A FUNCTION
OF SUPPLY VOLTAGE OF RISE AND FALL TIMES

Applications

VDD

R
1/3 CD4007UB 1 2 tM

VDD VDD
VDD C
VDD VSS 1/6 CD40106BMS VSS
VSS
VSS VDD
VSS tM = RC n
1/6 CD40106BMS VDD-VP

50kΩ ≤ R ≤ 1MΩ
FREQUENCY RANGE OF WAVE SHAPE 100pF ≤ C ≤ 1µF
IS FROM DC TO 1MHz
FOR THE RANGE OF R AND C
GIVEN 5µs < tM < 1s

FIGURE 14. WAVE SHAPER FIGURE 15. MONOSTABLE MULTIVIBRATOR

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 CD40106BMS

Applications (Continued)

tA

VDD
1/6 CD40106BMS
VSS

VP VDD-VN
tA = RC n
VN VDD-VP
R
50kΩ ≤ R ≤ 1MΩ
C 100pF ≤ C ≤ 1µF

VSS FOR THE RANGE OF R AND C

GIVEN 2µs < tA < 0.4s

FIGURE 16. ASTABLE MULTIVIBRATOR

VP VN

VDD

VIN VH

VO VH VH = VP - VN
VSS VIN VO

VDD VIN

VO VN VP

VSS
(a) DEFINITION OF VP, VN, VH (b) TRANSFER CHARACTERISTIC OF 1 OF 6 GATES

FIGURE 17. HYSTERESIS DEFINITION, CHARACTERISTICS, AND TEST SETUP

OUTPUT INPUT
CHARACTERISTIC CHARACTERISTIC
VDD

LOGIC “1” LOGIC “1” VOH

OUTPUT INPUT VOL
REGION REGION
VP
VOH
VN
LOGIC “0”
LOGIC “0” DRIVER LOAD
OUTPUT
INPUT
REGION
REGION
VOL
VSS

FIGURE 18. INPUT AND OUTPUT CHARACTERISTICS

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 CD40106BMS

Chip Dimensions and Pad Layout

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).

METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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