Comparing the merits of

integrated power modules

versus discrete regulators

Rich Rosen
Field Applications Engineer
Texas Instruments
Modern integration technologies have brought
about improvements to the modular “DC/DC power
module” voltage regulator.
Time to market, cost, size constraints, reliability, and design capabilities are among
the motivating factors in choosing modular power versus a traditional controller plus
external components design. Each approach has its advantages and disadvantages.
And often times, it is not possible to predict which choice will better satisfy the list of
design criteria until the design process has been completed for each approach.

What is a modular voltage regulator? manufacturing/assembly costs. Other potential

The basic building blocks of a simple, non-isolated
DC-DC switching voltage regulator can be seen in
the schematics shown in Figure 1. PWM control,
current switching, inductance, and capacitance for
storing energy are all required. The power module
integrates the current switches and inductor while
these are separate entities in a discrete design.
Since the values of the energy-storing capacitors
tend to be well over 1 μf, they are integrated less
often into a monolithic package.
How to choose between discrete
and modular power
Typically, the tradeoff is between cost of ownership,
design effort, and performance.
The cost of ownership is the bill of materials (BOM)
cost in addition to power designer labor fees
plus test, potential redesign labor fees, and finally
costs can include those associated with quality
issues with an improperly designed supply.
Clearly, the design effort behind using a fully
integrated power module is less than that of a
discrete supply. But within the discrete regulator
designs available, there exists a range of integration.
For example, some regulators have built-in FET
switches that remove the task of choosing the FETs
and gate drive considerations. Controller ICs are the
most flexible of choices but require a more expert
level of design capability. Should one decide to
tackle a non-modular approach, they should further
investigate how “discretely” they wish to dive into
the design. Fortunately, there are excellent tools
available such as TI’s WEBENCH® online design
tool, that allow novice power supply designers to
easily assemble discrete supply designs.

VIN VIN
ISWITCH 1
ISWITCH 1
ILOAD I LOAD

VSW VOUT VOUT

ISWITCH 2
ISWITCH 2

Discrete controller Integrated module

Figure 1. DC-DC buck regulator integration levels.

Comparing the merits of integrated power modules versus discrete regulators 2 September 2016
Integrated modules streamline design and layout
challenges but do not completely eliminate the
process. At a minimum, the designer must evaluate
the power specifi cation of the design; this includes
assessing requirements of input and output
voltage, current, allowed temperature rise, noise
issues, safety and emissions, and possibly other
considerations. Even the simplest modular solution is
not exempt from careful planning.
To demonstrate the relative ease of design between
the two approaches, TI’s WEBENCH design tool
will be used to design circuits around the LM3152
3.3V SIMPLE SWITCHER® controller and LMZ14203
SIMPLE SWITCHER power module. The easy-to-
use WEBENCH tool offers too large a complement
of design tools to highlight at this time, but it can be
thoroughly examined online at
TI.com/webench. The desired output will focus on

Circuit performance is multifaceted and application the schematic, BOM costs, component land area

dependent. Where output noise might be most of the PCB, output noise analysis, efficiencies, and

critical in an RF circuit supply, temperature rise and thermal simulation.

size of the circuit can be the driving specifications in

Schematics and bill of materials
a hearing aid.
Figure 2 shows the discrete design using
Design example the LM3152 3.3 V controller. This design was

It would be impossible to examine the pros and cons accomplished using the WEBENCH tool and took

of each approach with all possible values of voltage about 30 minutes, including a few part changes

and current, but the following design analysis will to optimize for cost savings and some design

expose the benefits and drawbacks of a modular simulation to verify proper operation. Design without

design versus a design with a discrete controller the aid of a CAD program might take anywhere

IC for a common set of parameters. The design from a couple of hours to an entire day for circuit

specifications will be the same between the calculations and component searches.

two approaches:

• VIN = 24 V
• VOUT = 3.3 V
• Output current = 3.0 A maximum
• Ambient temperature = 55˚C

24V
Part Attribute Price
Cbst 470 nF/16 V $ 0.02
3

CIN + 1 M1
1 µf U1 L1
Cbyp 100 nF/50 V $ 0.01
Cbst
2

3 11
EN HG 3.3V CIN 1 μF/50 V $ 0.05
2 12 39 µH
VIN BST 470 µf
Cbyp
6
SW
10 COUT 47 μF/16 V $ 0.41
SS
3

1 M2
100n 4 LG
13
CSS 15 nF/50 V $ 0.01
FB
DAP
15
CVCC 2.2 μF/10 V $ 0.02
2

7
CSS 8
NC 5 COUT +
NC SGND 9 L1 10 μH/4 A $ 0.54
15 nf 1
SGND 14 47 µf
VCC SGND M1 80 V/30 mΩ $ 0.39
CVCC
M2 80 V/30 mΩ $ 0.39
2.2 µf
U1 LM3152MH-3.3 $ 2.30
0V 0V
Total BOM $ 4.14

Figure 2. Discrete design—LM3152 3.3V controller and bill of materials.

Comparing the merits of integrated power modules versus discrete regulators 3 September 2016
 U1
Part Attribute Price
1 7
24V VIN VOUT 3.3V
Rent
Cf 22 nF/50 V $ 0.01
3 6
68.1k EN FB Rfbt Cf
22 nF
CIN 10 μF/50 V $ 0.43
3.32k
5 4
CIN +
SS GND COUT 47 μF/6.3 V $ 0.18
10 µF
2
RON EP
8 CSS 10 nF/50 V $ 0.02
Ron Rfbb

Renb
49.9k
CSS
1.07k COUT +
Renb 11.8 KΩ $ 0.01
47 µF
11.8k 10 nf Rent 68.1 KΩ $ 0.01
0V
Rfbb 1.07 KΩ $ 0.01
0V
Rfbt 3.32 KΩ $ 0.01
Ron 49.9 KΩ $ 0.01
U1 LMZ14203 $ 9.50
Total BOM $ 10.19

Figure 3. Modular design—LMZ14203 integrated power module and bill of materials.

Figure 3 shows the schematic of the modular
design using the LMZ14203 integrated power
module. With fewer design choices to make, and
limited opportunities for error, the design process
is almost instantaneous with the WEBENCH
design tool. The data sheet provides instruction on
choosing the capacitors and resistors. The task of
searching through catalogs for the FETs and the
inductor is eliminated.
Comparing the BOM cost between the two designs,
there is clearly a cost benefi t to the discrete design.
Note that the power module price is based on a
500-piece list price, whereas the controller price is
based on a 1000-quantity list price. All costs shown
are generated by the WEBENCH tool and are
published catalog prices, typically at 1000-unit or
cut-tape quantities.
Simplicity of PCB layout
Figure 4 shows evaluation boards that represent
the current design examples. The “art” of laying out
a switching regulator lies in reducing the length and
size of the high-current, high-frequency nodes, as
well as properly managing the paths of the return
currents. Any PCB CAD operator can put together
a “working” supply. Ensuring the supply is robust
and operating with minimal noise emissions requires
careful planning and knowledge of the circuit
operation. It should be intuitively obvious that the
modular design is far less prone to layout mistakes.

Integrated power module Discrete controller

Figure 4. Evaluation boards for modular and discrete solutions.

Comparing the merits of integrated power modules versus discrete regulators 4 September 2016
 WEBENCH® footprint Eval board comparison
Design type 50% packing factor
(single-side layout) (single-side layout)
Discrete 526 mm2 / 0.815 in2 1.22 in2 1.4 in2

Modular 374 mm2 / 0.58 in2 0.87 in2 0.902 in2

Figure 5. Component land area comparison table.

Another advantage of the PCB layout for some Efficiency and thermal simulation
modular designs is the ability to route an unbroken
The WEBENCH thermal simulator outputs represent
top copper plane underneath the die. Maximum
operating conditions of 24 VIN, 3.3 VOUT, 3 A output
heat conduction between the die and the top
current, 55°C ambient temperature, no fan, and
copper plane is always an important goal to keep
1.5 oz copper on both sides. Thermal graphs show
the junction temperatures as cool as possible. In
a generic layout and do not represent the maximum
the case of TI’s LMZ family of power modules, a
packing density possible.
large-geometry exposed pad of ground potential is
It is clear from the efficiency plots and the thermal
spatially separated from the other signal pins. The
images in Figures 6 and 7 that the discrete design
LMZ14203 evaluation board in Figure 4 illustrates
is more effi cient and will operate with less heat
the ease of providing unbroken top copper to the
dissipation compared to the modular design. Of
exposed pad underneath the module.
course, this is just one operating point.
Component land area
An advantage of the discrete design is the ability
Component PCB “footprint” is given in units of mm2 to optimize the FET selection for the specifi ed
by the WEBENCH tool. It includes a 1 mm per-side operating voltage and output current. Also, it is
margin to allow for clearance. The table in Figure 5 important to remember that these temperatures
summarizes the total component footprint and adds are at 55°C raised ambient. With a maximum Tj of
an additional 50% packing factor to include traces 125°C, there remains an additional 38°C of safety
and open spaces. All dimensions are for buffer for the modular design.
single-side layout.

Figure 6. WEBENCH simulation output for a discrete design.

Comparing the merits of integrated power modules versus discrete regulators 5 September 2016
Figure 7. WEBENCH simulation output for a modular design.

Output noise and emissions
Since there are many ways to quantify noise
generated from switching supplies, this discussion
will be limited to comparing the output voltage noise
between the two designs. In addition, it would be
an erroneous assumption to say that one approach
is always noisier than the other. Factors such as
inductor size, input voltage, switching frequency, and
capacitor Equivalent Series Resistance (ESR) play
dominant roles in the resultant output voltage ripple.
There is, however, a distinct advantage in modular
designs since the circuit traces connecting the
regulator components are minimized far more than is
possible in a discrete design.
The LMZ family of integrated modules utilizes a
threedimensional stack of silicon and shielded
inductor to minimize trace length and inductance.
Scope plots of the output voltages are shown
in Figure 8.

Note: AC-coupled output noise. BW = 150 MHz. Very low inductance probe across output capacitors.
Figure 8. Output ripple noise measurement taken from evaluation boards.

Comparing the merits of integrated power modules versus discrete regulators 6 September 2016
For both of these outputs, it is possible to realize Summary
even lower voltage ripple by lowering the total
The pros and cons of discrete versus modular
capacitor ESR. This can be achieved by obtaining
voltage regulator design for the previous design
a more expensive capacitor or adding more
example are summarized in the following table. This
capacitance in parallel. The difference to notice is the
“scorecard” will generally hold true for many DC-DC
amount of very-high-frequency noise “spikes” that
regulator applications. Exceptions to this example
appear in the discrete design. All of the additional
will occur often, especially since design specifi
parasitic inductance and capacitance of the trace
cations often deviate from common voltage and
elements create high-frequency spikes that occur in
current ranges.
the output and also as conducted and radiated noise
that can fail noise emissions tests.

Reliability considerations
Circuit failures of a working power supply design
can be grouped into three categories—initial
assembly errors, lack of protection against misuse
(overloaded outputs, excessive input voltages,
etc.), and shortened lifetime component failures.
Both discrete and modular designs are subject to
all three categories, but it is often the case where
the modular design incorporates a more extensively
thought-out set of protection mechanisms since
the entire circuit is “planned” by a designer and the
module manufacturer will subject the circuit to a
much more rigorous set of testing than the typical
end user will expose to their supply.

Modular designs have a significant advantage when

it comes to comparing the likelihood of assembly
errors such as incorrect components, unstuffed
components, and bad solder joints. The modules are
always tested before they are sold for assembly into
a printed circuit board.

Comparing the merits of integrated power modules versus discrete regulators 7 September 2016
 Modular Discrete
Consideration Comments
approach approach
Initial cost much less for discrete design
Cost of design x
Time to market might offset differences significantly
Costs

Assembly errors greatly reduced in modular design

Reliability of design x
Modular design subject to higher levels of testing

Cost of ownership Depends upon factors such as quantities, quality of assembly line, and purchasing consistency

Design simplicity x Always easier, especially if CAD tool unavailable

Ease of design

Simplicity of PCB layout x Always easier, diffi cult to make mistakes

Design effort Schematic, parts sourcing, and PCB layout are all easier

Design size x Usually smaller with modular design

Thermal advantages x Ability to optimize components allows flexibility in design

For this design, modular was quieter, but there is control over ripple
Performance

Output noise, ripple x x

noise with choice of component value

Output voltage, RF x Modular designs are inherently quieter due to small node length/size

RF emissions / As above, TI’s SIMPLE SWITCHER power modules are

x
compliance predesigned to pass EN55022 and equivalent compliance testing

Circuit performance More performance metrics available, but not listed above; extremely application dependent

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8/10/2016 Deciding Between DC­DC Modules or Discretes When Facing a Space Jam

print | close

Deciding Between DC­DC Modules or Discretes When Facing a
Space Jam
Paul Pickering
Thu, 2016­08­11 08:00

Download this article in .PDF format
This file type includes high­resolution graphics and schematics when applicable.

Two trends in electronics show no signs of abating: The shift to portable and mobile products across multiple
applications; and packing more and more features into each successive generation of equipment.

For the end user, it all sounds great. For the power­system designer, though, it translates into making the most
efficient use of the available power, since portable devices are typically space­constrained with no room to add
extra batteries.

The drive to get the most out of ever­smaller designs has led to the dominance of power systems based on
switching, rather than linear, technology. Switched­mode power supplies (SMPSs) can attain efficiencies greater
than 90%. That extends battery life in portable systems and frees up space otherwise needed for heat­dissipation
components. Even in line­powered equipment, switching technology rules, because greater efficiency translates
into lower operating costs. Consequently, switching designs are increasingly dominating all but the lowest­cost
applications.

This increased efficiency has a downside, though, in the form of more complex design. Although not taught at
Hogwarts, many engineers consider SMPS design in the same category as other Dark Arts such as Poisonous
Potions and Unforgivable Curses.

Switching power supplies generate noise that interferes with sensitive analog and RF circuits. Their design also
requires a diverse skill set, including knowledge of analog and digital circuits, magnetics, and control systems. The
complexity can be overwhelming, especially for small development teams lacking an SMPS design specialist.

Sponsored

Powerful solutions come in small packages

A flexible, easy­to­design MicroSiP power module for portable test and measurement

Is a power module always the optimal solution for your space constrained SSD?

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8/10/2016 Deciding Between DC­DC Modules or Discretes When Facing a Space Jam

Rise of the DC­DC Power Module

Here's an ugly truth: Much as we power engineers might like to think otherwise, many system designers regard
power more as a “necessary evil” than a point of product differentiation. Given the complexity of SMPS design and
shrinking development cycles—another trend—it’s not surprising that engineers are looking for ready­made
solutions that provide efficient power without the attendant headaches.

With dc­dc modules, multiple SMPS components are integrated into a single package to simplify the design process.
Thanks to improvements in semiconductor and packaging technology, such modules have become increasingly
popular. Their higher levels of integration simplify the overall design and consume smaller printed­circuit­board
(PCB) area than a custom design.

Using a module reduces the time needed for design and verification. A market report by research firm Darnell
Group found that a module­based design requires 45% fewer man­hours to complete than a discrete dc­dc regulator
design. The reasons include robust designs, careful component selection, and EMI testing to ensure compliance
with industry standards such as the EN55022 Class B Emissions test.

In fast­moving markets like consumer electronics, such a savings in development time can easily make the
difference between being early to market with a new product and missing the market window altogether. In other
applications, the development team can spend that time adding or refining new features.

DC­DC Module Overview

TI offers dc­dc power modules for input voltages up to 60 V and power levels up to 50 W. Modules are primarily
step­down (buck) converters, although boost, buck/boost, and negative output modules are available.

In general, these dc­dc modules don’t provide galvanic isolation between input and output. However, for low­power
isolated dc­dc conversion, there are standard brick modules up to 30 W, and the DCP and DCR families of
miniature unregulated and regulated dc­dc converters come in 1­ and 2­W versions.

Adding a dc­dc power module isn't an “all­or­nothing” approach. Depending on the application and power level, a
range of integration options is available. In fact, many of the options overlap (Fig. 1). Several package types are
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8/10/2016 Deciding Between DC­DC Modules or Discretes When Facing a Space Jam

used for dc­dc modules in this power range.

MicroSiL and MicroSiP Power Modules

For low­power applications where smallest size is a priority, the MicroSiL and MicroSiP power modules integrate
the required passives and the integrated circuit (IC) into a single device. In both technologies, the IC is embedded
into an FR4 laminate substrate and the inductor is mounted on top of the substrate material.

A MicroSiL device integrates the power inductor and the regulator IC; the required capacitors are external. The
module outline and pinout are similar to a QFN­type package. For example, the TPS82085 power module can
deliver 3 A from an 8­pin package that measures 3 mm × 2.8 mm. External input and output capacitors, feedback
resistors, and an optional power­good resistor complete the design. MicroSiL devices are available with inputs up
to 17 V.

The fully integrated MicroSiP power modules integrate both IC and passive components into a single device with a
ball­grid­array (BGA) format. The regulator is embedded inside the PCB, and the passive components are mounted
on top. This is the simplest solution with the highest integration level. The smallest modules can achieve a footprint
of less than 7mm2  (Fig. 2).

The TPS8268x power module, for example, is a 1.6­A synchronous step­down dc­dc power supply in a single
package. The five devices in this family offer output voltages from 0.9 V (TPS8268090) to 1.8 V (TPS8268180)

Another option for space­constrained applications is a Simple Switcher buck regulator integrated into a Micro­SiL
module. The LMZ21700 Nano Module, for example, can drive up to 650 mA load at up to 95% efficiency with an
input voltage range of 3 to 17 V and output voltage range from 0.9 to 6 V. Input and output capacitors and two
feedback resistors complete the basic design.

Wide­Input­Voltage Modules

POL applications with wide input voltages up to 60 V can take advantage of Simple Switcher­based modules, which
come in a variety of leaded and leadless packages. The 3­A LMZ23603, for example, can accept an input voltage
between 6 and 36 V and deliver an adjustable output voltage as low as 0.8 V. The package for the LMZ23603
measures 10.16 mm × 9.85 mm; a complete solution requires three external capacitors and two external resistors.

High­Current DC­DC Open­Frame Modules

For higher­current applications where small size is important, designers can stay with a ready­made design by using
a traditional open­frame module, such as one of TI's PTH family. The PTH08T240 (Fig. 3) is a non­isolated buck
regulator that operates at up to 93% efficiency. It can supply up to 10 A; other PTH family members are able to
supply up to 30 A.

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The PTH pinouts conform to the specifications of the Point Of Load Alliance (POLA) consortium. POLA members,
including Texas Instruments, offer pin­compatible, non­isolated, point­of­load plug­in power modules.

DC­DC Module Design Tradeoffs

There's no doubt that designers have a lot of choices when it comes to power modules—TI’s SiP family includes over
200 devices. But is a dc­dc module always the best solution for every design?

Integration doesn’t come for free—there are always tradeoffs to be considered. For example, a power module
integrates various discrete components, so it must include a method of interconnecting them. A PCB is the
preferred choice in the TPS82xxx MicroSiP family; the packages stack the inductor on top of the controller. Clearly,
both of these design choices increase the height of a MicroSiP module compared to a discrete design.

Designing for minimum footprint requires reducing the inductor’s size. The inductance of a coil is proportional to
coil area, all other factors being equal. Reducing the coil area while keeping the same inductance increases the
amount of wire used. This in turn increases the dc resistance, which lowers efficiency slightly, especially at higher
loads.

Figure 4 compares the efficiencies of three different solutions based on the TPS62085 3­A synchronous step­down
converter: the TPS82085 MicroSiP version; a discrete design using a small­size inductor; and a discrete design
using an inductor of the same value, but in a larger size.

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Comparing the relative sizes of these three solutions shows that the MicroSiP saves 22% in board area, but
increases height by 33% compared to the equivalent discrete design. Compared to the discrete design with the
larger inductor, though, the board­area savings are 43%.

Efficiency is another story. The results show that with identically sized inductors, the MicroSiP and the discrete
design have identical efficiencies across their range. However, the discrete design with the large inductor has an
advantage at higher currents, as much as 5% at full load.

Cost is a paramount issue for many designs. The cost of an integrated dc­dc module will be higher than that of the
discrete regulator because it includes the inductor and perhaps other components. To get an accurate comparison,
though, other costs must be included, such as increased assembly costs, the costs associated with a larger BOM, and
non­recurring items like component selection and qualification, increased design time, potential layout issues, and
PCB respins.

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The table summarizes the tradeoffs in cost and performance between a discrete power supply IC and a dc­dc
module, without considering non­recurring costs. For this comparison, the inductor cost is estimated at $0.30, the
capacitors at $0.05 each, and the resistors at $0.005 each.

Conclusion

For harried designers working within short design cycles, dc­dc modules offer several advantages in space­
constrained designs, including a shorter design cycle and a smaller footprint. These advantages need to be weighed
against potential performance differences and higher costs before deciding on the optimum approach for any given
application.

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Powerful solutions come in small packages

A flexible, easy­to­design MicroSiP power module for portable test and measurement

Is a power module always the optimal solution for your space constrained SSD?

Source URL: http://electronicdesign.com/power/deciding­between­dc­dc­modules­or­discretes­when­facing­
space­jam

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