Data Sheet
SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
General Description
The AP3616 is an sixteen-channel constant current
sink with current match used for LED driver. It uses an
external resistor to set the current for sixteen LED
strings with an accuracy of ±1.5%. The full scale LED
current can be adjusted from 20mA to 75mA for each
channel. The LED lightness can be adjusted by PWM
dimming function.
The device can keep working normally without any
damage when LEDs are short or open. It features under
voltage lockout protection and over temperature pro-
tection.
The AP3616 has three interface terminals (FB, SYN
and FBX pins). The FB and SYN pins allow the device
to work with a DC/DC converter to drive LED arrays
for good performance. And the FBX pin enables the
device to be connected in parallel.
The AP3616 is available in SOIC-28 and HSOP-28
packages.
SOIC-28
Figure 1. Package Types of AP3616
Jul. 2012 Rev. 1. 2
1
AP3616
Features
· Input Voltage Range: 4.2V to 27V
· Maximum Output Current: Typical 1.2A (75mA
per Channel)
· Current Match Accuracy (Typical): ±1.5%
· PWM / Linear Dimming Control
· Open LED Self-check and Protection
· Flexible Short LED Protection
· Under Voltage Lockout Protection
· Over Temperature Protection
· FBX and SYN Pins Enable Parallel Application
· Over Voltage Protection
Applications
· LCD Display Modules
· LCD Monitor
· LCD TV
HSOP-28
BCD Semiconductor Manufacturing Limited
 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Pin Configuration

M Package M28 Package

(SOIC-28) (HSOP-28)

CH1 1 28 CH9 CH1 1 28 CH16

CH2 2 27 CH10 CH2 2 27 OVP
CH3 3 26 CH11 CH3 3 26 SCP
CH4 4 25 SYN
CH4 4 25 CH12 CH5 5 24 SYNF
CH5 5 24 CH13 CH6 6 23 DIM
CH6 6 23 CH14 CH7 7 22 ISET
CH7 7 22 CH15
CH8 8 21 CH16
FLAG 9 20 OVP
CH8 8 21 GND
FB 10 19 SCP CH9 9 20 VIN
FBX 11 18 SYN CH10 10 19 EN
EN CH11 11 18 FBX
12 17 SYNF
CH12 12 17 FB
VIN 13 16 DIM CH13 13 16 FLAG
GND 14 15 ISET CH14 14 15 CH15

Figure 2. Pin Configuration of AP3616 (Top View)

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Pin Description

Pin Number
Pin Name Function
SOIC-28 HSOP-28

1 to 8 1 to 8 CH1 to CH8 White LED cathode connection pins. If not used, leave them uncon-
28 to 21 9 to 15 & 28 CH9 to CH16 nected

Error flag pin. When LED load goes to error (short or open ), the flag
9 16 FLAG
open drain output will close

Feedback pin. This pin is an interface terminal, which samples the

10 17 FB voltage of each channel, and outputs the lowest voltage of the string
to DC/DC converter

This pin is an interface terminal. Connect it to FB pin can achieve

11 18 FBX
parallel application. If not used, leave it unconnected

12 19 EN Enable pin. Logic high enables the IC and logic low disables the IC

13 20 VIN Input voltage pin

14 21 GND Ground pin

LED current setting pin. An external resistor is connected to this pin.

15 22 ISET Current on each channel can be expressed by ICHAN-
NEL=1.194*1560/RISET

Dimming control pin. Adding a PWM signal or DC signal to this pin

16 23 DIM
to control LED dimming. Connect it to high voltage level if not used

Synchronous PWM frequency setting pin. A nF level of capacitor

17 24 SYNF should be connected to this pin to set PWM frequency at about 80Hz
to 25kHz

PWM dimming synchronous pin, this pin outputs DC transformed

18 25 SYN PWM signal to synchronize parallel AP3616 and power converter, if
not used, leave it unconnected
LED short trigger voltage setting pin. This pin is used to set the LED
19 26 SCP
short circuit protection voltage level

This pin is used to trigger OVP condition. OVP triggering voltage

20 27 OVP should be lower than the OVP voltage of its cascade chip, such as ,
AP3039A in Figure 19

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Functional Block Diagram

CH1_IREF
x3120
PGND 20(27)
AMP

OVP

COMP
OVP_EN
x1 VREF 1.194V
CH1 1 1
(

2µA SCP
VDD=5V
8 8 VDS1
AGND
_ VDD

COMP
x7 x1
28 9 VDD AGND + 19(26)
CH16 SCP
COMP

Short SCP Open

+
21 15 SCP Detection Detection

COMP
_
0.26V
& VREF 18(25)
28 SYN
COMP

Open
(

200mV Detection
16(23)
VDS1=VDD DIM
COMP

PWM
Latch
Block
13µA
9(16)
FLAG
Open LED
+ 2.2V
Short LED
COMP

_
10(17) SET 17(24)
FB Q_BAR
RS
RESET SYNF
+
COMP

VCH 16 to 1 _ 0.5V
11(18)
LOW
SEL

FBX VREF
13µA
VDD
UVLO
Regulator

12(19) x1 x4 x4

EN EN Bandgap
AMP

VIN 13(20) CH_IREF 1 to 16

14(21) 15(22)
GND
AGND
ISET
PGND

A(B)
A for SOIC-28
B fro HSOP-28

Figure 3. Functional Block Diagram of AP3616

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

4
 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Ordering Information

AP3616 -

Circuit Type G1: Green

Package
Blank: Tube
M: SOIC-28
M28:HSOP-28

Package Temperature Range Part Number Marking ID Packing Type

SOIC-28 AP3616M-G1 AP3616M-G1 Tube
-40 to 85oC
HSOP-28 AP3616M28-G1 AP3616M28-G1 Tube

BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.

Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit
Input Voltage VIN 30 V
FLAG Pin Voltage VFLAG 30 V
EN Pin Voltage VEN 30 V
Voltage on Each Channel VCHX -0.3 to 60 V
Voltage on Other Seperate Pins -0.3 to 6 V
Thermal Resistance (Junction to SOIC-28 72 oC/W
Ambient, No Heat Sink) θJA
HSOP-28 59 o
C/W
Operating Junction Temperature TJ 150 oC

Lead Temperature (Soldering, 10sec) TSTG -65 to 150 o

C
ESD (Human Body Model) 2000 V
ESD (Machine Model) 200 V

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Input Voltage VCC 4.2 27 V

Recommended PWM Dimming Frequency fPWM 0.08 25 kHz
VCHX=0.5V 20 40
Full Scale Setting Current per Channel ICHX mA
VCHX=0.8V 20 60
VCHX=1.2V 20 75

Operating Temperature Range TA -40 85 oC

Electrical Characteristics
VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera-
ture range (TA=-40oC to 85oC).
Parameter Symbol Conditions Min Typ Max Unit
VCC SECTION
Quiescent Current IQ ISET, SYN and FB 2 4 mA
Pin Floating
Shutdown Supply Current ISTBY VEN=0V, ISET,SYN 0.1 1 µA
and FB Pin Floating
Under Voltage Lockout Threshold VUVLO VIN Falling Edge 3.65 3.9 4.15 V
Under Voltage Lockout Hysteresis VUVLO_HYS 300 mV
CHANNEL SECTION
Maximum Output Current per Channel ICHX_MAX VCHX=0.8V, RISET=0 75 mA
Current Sink Saturation Voltage per
VCHX_SAT ICHX=60mA 0.6 V
Channel

Current Matching Accuracy between Any I =60mA,

ICH_MATCHING CHX 3 %
Two Channels VCH=0.8V

Output Current Load Regulation VCHX=0.5V to 2.8V 4 %

Output Current Line Regulation (Note 2) VCHX=4.2V to 2.8V 2 %/V

Note 2: Guaranteed by design (GBD).

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Electrical Characteristics (Continued)
VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera-
ture range (TA=-40oC to 85oC).
Parameter Symbol Conditions Min Typ Max Unit

DIMMING SECTION
PWM High Level Threshold Voltage VIH_PWM 2.5 V
PWM Low Level Threshold Voltage VIL_PWM 0.3 V
Linear Dimming Level VL_DIM 0.5 2.2 V
LED SHORT PROTECTION SECTION

SCP Current ISCP 10.5 12.5 14.5 µA

CURRENT SINK SECTION

ISET Reference Voltage VISET RISET=30k, CH1 to 1.170 1.194 1.218 V

CH16 Floating

ICHX/ISET Current Multiplication Ratio k RISET=30k, VCHX=1V 1615

ENABLE SECTION

EN Pin High Level Threshold VIH_EN 2.0 V

EN Pin Low Level Threshold VIL_EN 0.8 V

OVP SECTION

Threshold Voltage VTHRESHOLD 1.130 1.194 1.250 V

FLAG SECTION

Saturation Voltage VSAT ISINK=2mA 0.3 V

SYN SECTION

PWM Frequency fPWM 0.08 25 kHz

SYNF High Level Output Voltage VOUT_H 2.4 V

SYNF Low Level Output Voltage VOUT_L 0.4 V

FB SECTION

Feedback Output Current IFB VFB Drop to 97% 13 17 µA

TOTAL DEVICE

Thermal Shutdown Temperature TOTSD CHX Pin Left Foating 160 o

C
Thermal Shutdown Hysteresis THYS 20 o
C

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.

200 0.56

180
0.54
160
Maximum Channel Current (mA)

0.52
140

Feedback Voltage (V)

120 0.50

100
0.48
80
0.46
60

40 0.44

20 0.42

0
0.40
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 4 6 8 10 12 14 16 18 20
Channel Voltage (V)
Feedback Current (µA)

Figure 4. Maximum Channel Current vs. Channel Voltage Figure 5. Feedback Voltage vs. Feedback Current

70 65
60
60 55
50
Current per Channel (mA)

50
Current per Channel (mA)

45
40
40 35
30
30 25
20
20 15
10 f=100Hz
10
5 f=20kHz
0
0
-5
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 10 20 30 40 50 60 70 80 90 100
Linear Dimming Voltage (V) Duty Cycle (%)

Figure 6. Channel Current vs. Linear Dimming Voltage Figure 7. Current per Channel vs. Duty Cycle
(PWM Dimming)

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.

65 1.4

64

63 1.3

ISET Reference Voltage (V)

62
Channel Current (mA)

1.2
61

60 1.1

59

58 1.0

57
0.9
56

55
0.8
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
o
Temperature ( C) o
Temperature ( C)

Figure 8. Channel Current vs. Temperature Figure 9. ISET Reference Voltage vs. Temperature

0.8 2.2

2.1
0.7
2.0
0.6 1.9
Quiescent Current (mA)

1.8
Saturation Voltage (V)

0.5
1.7
0.4 1.6

1.5
0.3
1.4
0.2 1.3

1.2
0.1
1.1
0.0 1.0
-50 -25 0 25 50 75 100 125 150 3 6 9 12 15 18 21 24 27
o
Temperature ( C) Input Voltage (V)

Figure 10. Saturation Voltage vs. Temperature Figure 11. Quiescent Current vs. Input Voltage

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.

63.6
63.4
63.2
63.0
62.8 VDIM
Current per Channel (mA)

62.6
62.4
5V/div
62.2
62.0 VSYN
61.8 5V/div
61.6
61.4
61.2 VGATE
61.0
TA=-40 C
o 10V/div
60.8
o
60.6 TA=125 C
60.4 o ICH
TA=25 C
60.2 50mA/div
60.0
0 2 4 6 8 10 12 14 16
Channel Time 4ms/div

Figure 12. Current per Channel vs. Channel Figure 13. PWM Dimming (f=100Hz, Duty Cycle=50%)

VSYNF
VDIM 1V/div
5V/div

VSYN VSYN
5V/div 5V/div

VGATE VGATE
10V/div 10V/div

ICH ICH
50mA/div 100mA/div

Time 20µs/div Time 800µs/div

Figure 14. PWM Dimming (f=20kHz, Duty Cycle=50%) Figure 15. Linear Dimming (VDIM=1.4V)

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

10
 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Performance Characteristics (Continued)
VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified.

VOVP VSCP
1V/div 1V/div

ICH I CH
50mA/div 100mA/div

VFB
1V/div VCH
5V/div
VFLAG
VFLAG
5V/div
5V/div

Time 400µs/div Time 4µs/div

Figure 16. LED Open Protection Figure 17. LED Short Protection

VGATE
5V/div

ICH
50mA/div

Time 2s/div

Figure 18. OTP and Recovery

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

11

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH
Function Description
1. LED Current Setting
The maximum LED current per channel can be
adjusted up to 75mA via ISET pin. When ≥ 75mA
current is needed in application, two or more channels
can be paralleled to provide larger drive current. Con-
nect a resistor RISET between ISET pin and GND to
set the reference current ISET. The LED current is
determined by the following equation.
k ⋅ V ISET 156 0 × 1.194
I LED ( mA ) = =
R ISET ( kΩ ) R ISET ( kΩ )
2. Dimming Control
The AP3616 provides two dimming methods: external
PWM signal or DC voltage input. Applying a PWM
signal to DIM pin to adjust the LED current, that
means, the LED current of all enabled channels can be
adjusted at the same time and the LED brightness can
be adjusted from 1%*ICHX_MAX to 100%*ICHX_MAX.
During the high level period of PWM signal, the LED
is turned on and 100% of the current flows through
LED, while during the low level period of the PWM
signal, the LED is turned off and almost no current
flows through the LED, thus changing the average
current through LED and finally adjusting LED
brightness. The external PWM signal frequency
applied to PWM pin is allowed to be 80Hz or higher.
3.Over Voltage Protection
Jul. 2012 Rev. 1. 2
12
Data Sheet
AP3616
The AP3616 integrates an OVP circuit. The OVP pin
is connected to the center tap of voltage-divider (ROV3
and ROV4) that placed between high voltage output
and GND (Figure 19). If the voltage on OVP pin
exceeds 1.194V, which may results from open loop or
excessive output voltage, the AP3616 will start LED
open protection.
(R OV3 + R OV4 ) ×1.194V
VOVP =
R OV4
4. LED Short-circuit Protection
The AP3616 integrates an LED short-circuit
protection circuit. During normal operation, any short-
circuited LED will cause the corresponding LED pin
voltage to rise. If any LED pin voltage exceeds 8
times of the voltage at SCP pin, the corresponding
LED current sink will be latched off, while the
remaining string(s) keep normal operation. Toggle the
VIN and/or EN to reset the latch. An internal current
source was connected to this pin, a resistor connected
here is used to set the shorting LED trigger voltage.
5. LED Open-circuit Protection
The AP3616 integrates an LED Open-Circuit Protec-
tion circuit. When any LED string is open, VOUT will
boost up until the voltage at OVP pin reaches an
approximate 1.194V threshold. The IC will automati-
cally ignore the open string(s) whose CHX pin voltage
is less than 100mV.
BCD Semiconductor Manufacturing Limited
 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Typical Application

R2 C1
(Optional) (Optional)

R3
+24V L (Optional) VOUT LED Arrays
D

CIN2 CIN3 47µH/4A MBRD360 COUT1 COUT2 ROV1 ROV3

CIN1
RUVLO_1

200k 150k
22µF/50V 60V/3A 10 µF/100V 10 µF/100V
20k

Css OVP1 OVP2

FQD13N06L
1 14 22nF/16V 60V/11A ROV2 ROV4
UVLO SS 4.3k
CC 4.3k
OVP1 2 13 RC
OV COMP
12x16
+24V (VCC) R1 12 3.9k 10nF/16V
3 FB
EN
AP3039A

EN 51Ω 4 11
VIN SHDN
5
VCC 10
GND
RUVLO_2 2.7k

R10
6 9 (Optional)
OUT
0.47µF/25V

CS
R10 PWM

CH1

CH16
CH2
RT
(Optional)

7 8 PWM / Linear
CV

SYN
C4

GND RT Dimming
RCS2 R5 62k µ 51Ω
100k RCS1 DIM
U1 300mΩ 300mΩ FB AP3616 1µF
FBX (Optional)
VCC=24V

SYNF

FLAG
VIN

ISET

OVP
GND

SCP

EN
RG C2
0.1 µ F/50V R7 C3 R8
2Ω R4 130k 6.8nF 51Ω
R6 R9
100k
30k 1k
OVP2

EN +5V

Single Chip Application (12S16P)

R2 C1
(Optional) (Optional)
(Optional)
+24V L VOUT LED Arrays
R3 D
CIN2 CIN3 47µH/4A MBRD360 COUT2
ROV1 ROV3
CIN1
RUVLO_1

200k 150k
22µF/50V 60V/3A COUT1 10µF/100V
20k

µ OVP1 OVP2
Css FQD13N06L 10 F/100V
1 14 22nF/16V 60V/11A ROV2 ROV4
UVLO SS 4.3k
CC 4.3k
OVP1 RC
2 13
OV COMP 12x32
+24V (VCC) R1 12 3.9k 10nF/16V
3 FB
EN
AP3039A

EN 51Ω 4 11
VIN SHDN
5
VCC 10
GND
RUVLO_2 2.7k

R11_1
6 9 (Optional)
OUT
0.47µF/25V

CS
CH16

CH1

CH16
CH1

CH2

CH2

RT
(Optional)

7 8 R10 PWM
CV

SYN SYN
C4

GND RT DIM PWM / Linear

RCS1 RCS2 R5 62k DIM
100k 51Ω Dimming
FB AP3616 FBX FB AP3616
U1 300mΩ 300m Ω
VCC=24V U3 FBX 1 µF
U2
(Optional)
ISET

ISET

VCC=24V
SYNF

SYNF
FLAG

FLAG

VIN
OVP
GND

GND

OVP
SCP

SCP

VIN
EN

EN

RG C2
0.1µF/50V C3_1 C2
R6 R7 C3 R8
2Ω R4
R7_1 0.1µF/50V 6.8nF 51Ω R9
R6_1 130k
6.8nF 30k 130k 1k
100k
30k R9_1 OVP2
1k
R8_1
+5V +5V
51Ω
OVP2

EN

Multi Chips Application (12S32P)

Figure 19. Typical Applications of AP3616

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

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 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Mechanical Dimensions

SOIC-28 Unit: mm(inch)

17.700(0.697)
18.100(0.713) 0.204(0.008)
0.330(0.013)

0°
8°
10.210(0.402)
10.610(0.418)

7.400(0.291)
7.700(0.303)

1.270(0.050) 0.400(0.016)
BSC 1.270(0.050)

0.330(0.013) 0.100(0.004)
0.510(0.020) 0.300(0.012)

2.290(0.090) 2.350(0.093)
2.500(0.098) 2.650(0.104)

Note: Eject hole, oriented hole and mold mark is optional.

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

14
 Data Sheet

SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616

Mechanical Dimensions (Continued)

HSOP-28 Unit: mm(inch)

17.890(0.704)
0.204(0.008)
18.190(0.716) 0.360(0.014)

0.400(0.016)
10.000(0.394) 1.270(0.050)
10.650(0.419)

7.400(0.291)
7.600(0.300)

0o ～8 o

5.050(0.199) 0.800(0.031) TYP

5.250(0.207)

0.230(0.009) 0.100(0.004)
0.470(0.019) 0.300(0.012)

2.180(0.086) 2.280(0.090)
2.330(0.092) 2.630(0.104)

Note: Eject hole, oriented hole and mold mark is optional.

Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

15
 BCD Semiconductor Manufacturing Limited

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E, 5F, Noble 7951 Tel: +886-2-2656
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan 2808 Tel :94544,
CA +1-510-324-2988
U.S.A
Fax: +86-755-88267951
Tel: +86-755-8826 7865 Fax: +886-2-2656 28062808
Tel: +886-2-2656 Fax:: +1-510-324-2988
Tel +1-510-324-2788
Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 Fax: +1-510-324-2788