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TS5A22366

www.ti.com SCDS262B – JANUARY 2009 – REVISED MAY 2013

0.7-Ω DUAL SPDT ANALOG SWITCH


WITH NEGATIVE RAIL CAPABILITY AND 1.8-V COMPATIBLE INPUT LOGIC
Check for Samples: TS5A22366

1FEATURES
• Negative Signaling Capability: Maximum • ESD Performance Tested Per JESD 22
Swing From –2.75 V to 2.75 V (V+ = 2.75 V) – 2500-V Human-Body Model
• Low ON-State Resistance (0.7 Ω Typ) (A114-B, Class II)
• Excellent ON-State Resistance Matching – 1000-V Charged-Device Model (C101)
• 1.8-V Compatible Control Input Threshold – 200-V Machine Model (A115-A)
Independent of V+
• Control Inputs Are 5.5-V Tolerant APPLICATIONS
• 2.25-V to 5.5-V Power Supply (V+) • Cell Phones
• Low Charge Injection • PDAs
• Specified Break-Before-Make Switching • Portable Instrumentation
• Latch-Up Performance Exceeds 100 mA Per • Audio Routing
JESD 78, Class II • Portable Media Players
YFC PACKAGE TERMINAL ASSIGNMENTS
YFC PACKAGE D NC1 V+ NC2
C COM1 GND COM2
D D B NO1 GND NO2
C C A IN1 N.C. (1) IN2
B B 1 2 3
A A

3 2 1 1 2 3
Laser Marking View Bump View (1) N.C. –No internal connection

DESCRIPTION
The TS5A22366 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V
to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the
switch without distortion.
The break-before-make feature prevents signal distortion during the transferring of a signal from one path to
another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total
harmonic distortion (THD) performance are ideal for audio applications.
The TS5A22366 is available is a ultra small 1.6 mm × 1.2 mm wafer-chip-scale package (WCSP) (0.4 mm pitch).

ORDERING INFORMATION
For package and ordering information, see the Package Option Addendum at the end of this document.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2009–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5A22366

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Table 1. SUMMARY OF CHARACTERISTICS


V+ = 3.3 V, TA = 25°C
2:1 Multiplexer/Demultiplexer
Configuration
(2 × SPDT)
Number of channels 2
ON-state resistance (ron) 0.8 Ω
ON-state resistance match (Δron) 0.08 Ω
ON-state resistance flatness (rON(flat)) 0.3 Ω
Turn-on/turn-off time (tON/tOFF) 199 ns/182 ns
Break-before-make time (tBBM) 7.1 ns
Charge injection (QC) 120 pC
Bandwidth (BW) 32 MHz
OFF isolation (OISO) –70 dB at 100 kHz
Crosstalk (XTALK) –70 dB at 100 kHz
Total harmonic distortion (THD) 0.01%
Package option 12-pin WCSP (YFC)

Table 2. FUNCTION TABLE


NC TO COM, NO TO COM,
IN
COM TO NC COM TO NO
L ON OFF
H OFF ON

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TS5A22366

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APPLICATION BLOCK DIAGRAM


OUT+ NC1
Audio
Source 1 OUT–
COM1

NO1 IN1
Input Select

TS5A22366 8 Ω Speaker

NC2 IN2

COM2
OUT+
Audio
Source 2 OUT– NO2

Figure 1. TS5A22366 Application Block Diagram

Negative Signaling Capacity


The TS5A22366 dual SPDT switch features negative signal capability that allows signals below ground to pass
through without distortion. These analog switches operate from a single +2.3-V to +5.5-V supply. The
input/output signal swing of the device is dependant of the supply voltage V+: the devices pass signals as high as
V+ and as low as V+ – 5.5 V, including signals below ground with minimal distortion.
Table 3 shows the input/output signal swing the user can get with different supply voltages.

Table 3. Input/Output Signal Swing


MINIMUM MAXIMUM
SUPPLY VOLTAGE, V+
(VNC, VNO, VCOM) = V+ – 5.5 (VNC, VNO, VCOM) = V+
5.5 V 0V 5.5 V
4.2 V –1.3 V 4.2 V
3.3 V –2.2 V 3.3 V
3V –2.5 V 3V
2.5 V –3 V 2.5 V

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ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) (2)

over operating free-air temperature range (unless otherwise noted)


MIN MAX UNIT
(3)
V+ Supply voltage range –0.5 6 V
VNC
VNO Analog voltage range (3) (4) (5)
V+ – 6 V+ + 0.5 V
VCOM
IK Analog port diode current (6) V+ < VNC, VNO, VCOM < 0 –50 50 V
INC ON-state switch current –150 150
INO VNC, VNO, VCOM = 0 to V+ mA
ICOM ON-state peak switch current (7) –300 300
VI Digital input voltage range –0.5 6.5 V
IIK Digital input clamp current (3) (4)
VIO < VI < 0 –50 mA
IGND
Continuous current through V+or GND –100 100 mA
I+
Tstg Storage temperature range –65 150 °C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Requires clamp diodes on analog port to V+.
(7) Pulse at 1-ms duration <10% duty cycle

THERMAL IMPEDANCE RATINGS


UNIT
θJA Package thermal impedance (1) YFC package 106.2 °C/W

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

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ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (1)


V+ = 2.25 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM,
V+ – 5.5 V+ Ω
range VNO, VNC
VNC or VNO = V+, 1.5 V, 25°C 1 1.8
ON-state Switch ON,
ron V+ – 5.5 V 2.25 V Ω
resistance See Figure 15 Full 2
ICOM = –100 mA,
ON-state 25°C 0.05 1
resistance match VNC or VNO = 1.5 V, Switch ON,
Δron 2.25 V Ω
between ICOM = –100 mA, See Figure 15 Full 1
channels
ON-state VNC or VNO = V+, 1.5 V, 25°C 0.53 1.5
Switch ON,
resistance ron(flat) V+ – 5.5 V 2.25 V Ω
See Figure 16 Full 1.6
flatness ICOM = –100 mA,
VNC = 2.25, V+ – 5.5 V 25°C –50 50
VCOM = V+ – 5.5 V,
2.25,
NC, NO VNO = Open,
INC(OFF), Switch OFF,
OFF leakage or 2.7 V nA
INO(OFF) See Figure 16 Full –375 375
current VNO = 2.25, V+ – 5.5 V
VCOM = V+ – 5.5 V,
2.25,
VNC = Open,
COM 25°C –50 50
VNC and VNO = Open,
ON leakage ICOM(ON) See Figure 17 2.7 V nA
VCOM = V+,V+ – 5.5 V, Full –375 375
current
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 1.05 5.5 V
Input logic low VIL Full 0.65 V
Input leakage 25°C –700 700
IIH, IIL VIN = 1.8 V or GND 2.7 V nA
current Full –700 700

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY(1) (continued)


V+ = 2.25 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 2.5 V 193 297
VCOM = V+, CL = 35 pF,
Turn-on time tON 2.25 V to 2.7 ns
RL = 300 Ω, See Figure 19 Full 350
V
25°C 2.5 V 266
VCOM = V+, CL = 35 pF,
Turn-off time tOFF 2.25 V to 2.7 ns
RL = 300 Ω, See Figure 19 Full 320
V
Break-before- VNC = VNO = V+/2 CL = 35 pF,
tBBM 25°C 2.5 V 1 15.6 ns
make time RL = 300 Ω, See Figure 20
VGEN = 0, CL = 1 nF,
Charge injection QC 25°C 2.5 V 91 pC
RGEN = 0, See Figure 24
VNC or VNO = V+ or
NC, NO CNC(OFF),
GND, See Figure 18 25°C 2.5 V 51 pF
OFF capacitance CNO(OFF)
Switch OFF,
VNC or VNO = V+ or
NC, NO CNC(ON),
GND, See Figure 18 25°C 2.5 V 181 pF
ON capacitance CNO(ON)
Switch OFF,
COM VCOM = V+ or GND,
CCOM(ON) See Figure 18 25°C 2.5 V 181 pF
ON capacitance Switch ON,
Digital input
CI VI = V+ or GND See Figure 18 25°C 2.5 V 3 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 2.5 V 32 MHz
See Figure 20
f = 100 kHz, –70
RL = 50 Ω, Switch
OFF isolation OISO OFF, f = 1 MHz, 25°C 2.5 V –50 dB
See Figure 22
f = 5 MHz, –35
f = 100 kHz, –70
RL = 50 Ω, Switch ON,
Crosstalk XTALK f = 1 MHz, 25°C 2.5 V –50 dB
See Figure 23
f = 5 MHz, –35
f = 20 Hz to 20
Total harmonic RL = 600 Ω,
THD kHz, 25°C 2.5 V 0.02 %
distortion CL = 50 pF,
See Figure 25
Supply
Positive
I+ VI = 1.8 V or GND, Full 2.7 V 6 12 μA
supply current

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ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY (1)


V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM,
V+ – 5.5 V+ Ω
range VNO, VNC
VNC or VNO ≤ V+, 1.5 25°C 0.8 1.3
ON-state V, Switch ON,
ron 3V Ω
resistance V+ – 5.5 V, See Figure 15 Full 1.53
ICOM = –100 mA,
ON-state 25°C 0.08 0.17
resistance match VNC or VNO = 1.5 V, Switch ON,
Δron 3V Ω
between ICOM = –100 mA, See Figure 15 Full 0.3
channels
VNC or VNO ≤ V+, 1.5 25°C 0.3 0.65
ON-state
V, Switch ON,
resistance ron(flat) 3V Ω
V+ – 5.5 V, See Figure 16 Full 0.75
flatness
ICOM = –100 mA,
VNC = 3, V+ – 5.5 V 25°C –50 50
VCOM = V+ – 5.5 V, 3,
NC, NO VNO = Open,
INC(OFF), Switch OFF,
OFF leakage or 3.6 V nA
INO(OFF) See Figure 16 Full –375 375
current VNO = 3 , V+ – 5.5 V
VCOM = V+ – 5.5 V, 3,
VNC = Open,
COM 25°C –50 50
VNC and VNO = Open, Switch ON,
ON leakage ICOM(ON) 3.6 V nA
VCOM = V+,V+ – 5.5 V, See Figure 17 Full –375 375
current
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 1.05 5.5 V
Input logic low VIL Full 0.65 V
Input leakage 25°C –920 920
IIH, IIL VIN = 1.8 V or GND 3.6 V nA
current Full –920 920

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY(1) (continued)


V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
VCOM = V+, CL = 35 pF, 25°C 3.3 V 199 313
Turn-on time tON ns
RL = 300 Ω, See Figure 19 Full 3 V to 3.6 V 370
VCOM = V+, CL = 35 pF, 25°C 3.3 V 182 289.9
Turn-off time tOFF ns
RL = 300 Ω, See Figure 19 Full 3 V to 3.6 V 350
Break-before- VNC = VNO = V+/2 CL = 35 pF,
tBBM 25°C 3.3 V 1 7.1 ns
make time RL = 300 Ω, See Figure 20
VGEN = 0, CL = 1 nF,
Charge injection QC 25°C 3.3 V 120 pC
RGEN = 0, See Figure 24
VNC or VNO = V+ or
NC, NO CNC(OFF),
V+ – 5.5 V, See Figure 18 25°C 3.3 V 50 pF
OFF capacitance CNO(OFF)
Switch OFF,
VNC or VNO = V+ or
NC, NO CNC(ON),
GND, See Figure 18 25°C 3.3 V 180 pF
ON capacitance CNO(ON)
Switch OFF,
COM VCOM = V+ or GND,
CCOM(ON) See Figure 18 25°C 3.3 V 180 pF
ON capacitance Switch ON,
Digital input
CI VI = V+ or GND See Figure 18 25°C 3.3 V 3 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 3.3 V 32 MHz
See Figure 20
f = 100 kHz, –70
RL = 50 Ω, Switch
OFF isolation OISO OFF, f = 1 MHz, 25°C 3.3 V –50 dB
See Figure 22
f = 5 MHz, –35
f = 100 kHz, –70
RL = 50 Ω, Switch
Crosstalk XTALK ON, f = 1 MHz, 25°C 3.3 V –50 dB
See Figure 23
f = 5 MHz, –35
f = 20 Hz to 20
Total harmonic RL = 600 Ω,
THD kHz, 25°C 3.3 V 0.01 %
distortion CL = 50 pF,
See Figure 25
Supply
Positive
I+ VI = 1.8 V or GND Full 3.6 V 6 13 μA
supply current

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ELECTRICAL CHARACTERISTICS FOR 5-V SUPPLY (1)


V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, V+ –
V+ Ω
range VNO, VNC 5.5
VNC or VNO = V+, 25°C 0.7 1
ON-state Switch ON,
ron 1.5V, V+ -5.5V 4.5 V Ω
resistance See Figure 15 Full 1.36
ICOM = –100 mA,
ON-state 25°C 0.1 0.2
VNC or VNO = 1.5 V, Switch ON,
resistance match Δron 4.5 V Ω
ICOM = –100 mA, See Figure 15 Full 0.3
between channels
ON-state VNC or VNO = V+, 25°C 0.135 0.37
Switch ON,
resistance ron(flat) 1.5V, V+ -5.5V 4.5 V Ω
See Figure 16 Full 0.51
flatness ICOM = –100 mA,
VNC = 4.5, V+ – 5.5 V 25°C –50 50
VCOM = V+ – 5.5 V,
4.5,
NC, NO VNO = Open,
INC(OFF), Switch OFF,
OFF leakage or 5.5 V nA
INO(OFF) See Figure 16 Full –375 375
current VNO = 4.5, V+ – 5.5 V
VCOM = V+ – 5.5 V,
4.5,
VNC = Open,
COM 25°C –50 50
VNC and VNO = Open, Switch ON,
ON leakage ICOM(ON) 5.5 V nA
VCOM = V+,V+ – 5.5 V, See Figure 17 Full –375 375
current
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 1.05 5.5 V
Input logic low VIL Full 0.65 V
Input leakage 25°C –1.5 1.5
IIH, IIL VIN = 1.8 V or 0 5.5 V μA
current Full –1.5 1.5

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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ELECTRICAL CHARACTERISTICS FOR 5-V SUPPLY(1) (continued)


V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 5V 230 374
VCOM = V+, CL = 35 pF,
Turn-on time tON 4.5 V to 5.5 ns
RL = 300 Ω, See Figure 19 Full 470
V
25°C 5V 206 325
VCOM = V+, CL = 35 pF,
Turn-off time tOFF 4.5 V to 5.5 ns
RL = 300 Ω, See Figure 19 Full 380
V
Break-before- VNC = VNO = V+/2 CL = 35 pF,
tBBM 25°C 3.3 V 1 3 ns
make time RL = 300 Ω, See Figure 20
VGEN = 0, CL = 1 nF,
Charge injection QC 25°C 5V 168 pC
RGEN = 0, See Figure 24
VNC or VNO = V+ or
NC, NO CNC(OFF),
V+ – 5.5 V, See Figure 18 25°C 5V 48 pF
OFF capacitance CNO(OFF)
Switch OFF,
VNC or VNO = V+ or
NC, NO CNC(ON),
V+ – 5.5 V, See Figure 18 25°C 5V 176 pF
ON capacitance CNO(ON)
Switch ON,
COM VCOM = V+ or GND,
CCOM(ON) See Figure 18 25°C 5V 176 pF
ON capacitance Switch ON,
Digital input
CI VI = V+ or GND See Figure 18 25°C 5V 3 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 5V 32 MHz
See Figure 20
f = 100 kHz –70
RL = 50 Ω, Switch
OFF isolation OISO OFF, f = 1 MHz 25°C 5V –50 dB
See Figure 22
f = 5 MHz –35
f = 100 kHz –70
RL = 50 Ω, Switch ON,
Crosstalk XTALK f = 1 MHz 25°C 5V –50 dB
See Figure 23
f = 5 MHz –35
Total harmonic RL = 600 Ω, f = 20 Hz to 20 kHz,
THD 25°C 5V 0.01 %
distortion CL = 50 pF, See Figure 25
Supply
Positive
I+ VI = 1.8 V or GND Full 5.5 V 7 14 μA
supply current

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TYPICAL PERFORMANCE
1.8 1.6
1.6 1.4
TA = 85°C
1.4
1.2
1.2
V+ = 2.25 V 1.0 TA = 25°C
rON (Ω)

rON (Ω)
1.0
V+ = 3 V 0.8
0.8
0.6
0.6 TA = –40°C
0.4 V+ = 4.5 V 0.4

0.2 0.2
0.0 0.0
–4 –3 –2 –1 0 1 2 3 4 5 –3 –2 –1 0 1 2 3
Input Voltage, VIN (V) Input Voltage, VIN (V)
Figure 2. ron vs VIN Figure 3. ron vs VIN (V+ = 2.5 V)

1.2 0.8

0.7
1.0 TA = 85°C
TA = 85°C 0.6
0.8 TA = 25°C
0.5
rON (Ω)

rON (Ω)

0.6 0.4
TA = –40°C
TA = –40°C
0.4 0.3
TA = 25°C
0.2
0.2
0.1
0.0 0.0
–3 –2 –1 0 1 2 3 4 –1 0 1 2 3 4 5
Input Voltage, VIN (V) Input Voltage, VIN (V)
Figure 4. ron vs VIN (V+ = 3.3 V) Figure 5. ron vs VIN (V+ = 5 V)

4.0 200
3.5
150
Charge Injection (pC)

3.0
NO (ON)
2.5 100
Leakage (nA)

2.0 50
1.5
COM (ON) 0
1.0
0.5 –50

0.0
–100
1
3

3
2

2
6

6
5

5
0

0
9

8
7

–0.5
2.
0.

2.

3.
1.

1.

4.
0.

3.

4.
1.

4.
0.

3.

5.
0.

3.
2.

–40 25 85 Bias Voltage (V)


Temperature (°C)
Figure 6. Leakage Current vs Temperature Figure 7. Charge Injection (QC) vs VCOM(V+ = 5 V)

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TYPICAL PERFORMANCE (continued)


470 1
0
455
–1
440 –2
425 tON –3

Magnitude (dB)
tON/tOFF (ns)

410 –4
–5
395
–6
380 –7
365 –8
350 –9
tOFF –10
335
–11
320 –12
2.5 3 5
–13
VCC (V) 0.01 0.1 1 10 100 1000
Frequency (MHz)
Figure 8. tON and tOFF vs Supply Voltage Figure 9. Bandwidth (V+ = 2.5 V)

–1

–11 –9

–21 –19
Magnitude (dB)
Magnitude (dB)

–29
–31
–39
–41
–49
–51
–59
–61
–69
–71
–79
–81 0.01 0.1 1 10 100 1000
0.01 0.1 1 10 100 1000
Frequency (MHz) Frequency (MHz)
Figure 10. OFF Isolation vs Frequency Figure 11. Crosstalk (V+ = 3.3 V)

0.019 8
7
0.017
6
0.015 V+ = 2.5 V
5
0.013
THD (%)

4
I+ (µA)

3
0.011
2
0.009
1
V+ = 3.3 V
0.007 0

0.005 –1
V+ = 5 V
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.003 V+ (V)
10 100 1000 10000 100000
Frequency (Hz)
Figure 12. Total Harmonic Distortion vs Frequency Figure 13. Power-Supply Current vs V+

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TYPICAL PERFORMANCE (continued)


6
V+ = 5.5 V
5
V+ = 4.5 V
4
V+ = 3.6 V

VOUT (V)
3 V+ = 3 V
V+ = 2.7 V
2 V+ = 2.25 V

–1
0.0 0.2 0.4 0.6 0.81.0 1.2 1.4 1.6 1.8 2.0
VIN (V)
Figure 14. Control Input Thresholds

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PARAMETER MEASUREMENT INFORMATION

Ω
IN
+

Figure 15. ON-state Resistance (rON)

+ OFF-State Leakage Current


Channel OFF
+ VI = VIH or VIL

IN
+

Figure 16. OFF-State Leakage Current


(ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF))

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PARAMETER MEASUREMENT INFORMATION (continued)

ON-State Leakage Current


+ Channel ON
VI = VIH or VIL

IN
+

Figure 17. ON-State Leakage Current


(ICOM(ON), INC(ON))

VNO NO
Capacitance
Meter VBIAS = V+ or GND and
VI = VIH or VIL
COM COM Capacitance is measured at NO,
VBIAS COM, and IN inputs during ON
and OFF conditions.

Figure 18. Capacitance


(CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON))
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.

Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 15


Product Folder Links: TS5A22366
TS5A22366

SCDS262B – JANUARY 2009 – REVISED MAY 2013 www.ti.com

PARAMETER MEASUREMENT INFORMATION (continued)

TEST RL CL VCOM

tON 300 Ω 35 pF V+

tOFF 300 Ω 35 pF V+

IN

Logic
Intput
(VI)

tON tOFF

Switch 90% 90%


Output
(VNO)

Figure 19. Turn-On (tON) and Turn-Off Time (tOFF)


A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.

VNC or VNO

NC or NO

NC or NO

VOH

VNC or VNO = V+/2


RL = 300 Ω
CL = 35 pF

Figure 20. Break-Before-Make Time (tBBM)

16 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated

Product Folder Links: TS5A22366


TS5A22366

www.ti.com SCDS262B – JANUARY 2009 – REVISED MAY 2013

PARAMETER MEASUREMENT INFORMATION (continued)

Channel ON: NO to COM


50 Ω VI = VIH or VIL

Network Analyzer Setup

Source Power = 0 dBM


IN
(632-mV P-P at 50-Ω load)
Ω + DC Bias = 350 mV

Figure 21. Bandwidth (BW)

Channel OFF: NO to COM


50 Ω VI = VIH or VIL

Ω
Network Analyzer Setup

Source Power = 0 dBM


IN
(632-mV P-P at 50-Ω load)
Ω + DC Bias = 350 mV

Figure 22. OFF Isolation (OISO)

Channel ON: NC to COM


50 Ω VNC NC Channel OFF: NO to COM
VI = VIH or VIL

VNO NO

Ω Network Analyzer Setup

Source Power = 0 dBM


Ω IN
(632-mV P-P at 50-Ω load)
+ DC Bias = 350 mV

Figure 23. Crosstalk (XTALK)


A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: TS5A22366
TS5A22366

SCDS262B – JANUARY 2009 – REVISED MAY 2013 www.ti.com

PARAMETER MEASUREMENT INFORMATION (continued)

IN

Figure 24. Charge Injection (QC)


A. CL includes probe and jig capacitance.

Channel ON: COM to NO VI = VIH or VIL RL = 600 Ω


VSOURCE = V+ P-P fSOURCE = 20 Hz to 20 kHz CL = 50 pF

V+/2

Audio Analyzer NO
600 Ω COM

IN
+

600 Ω

–V+/2

Figure 25. Total Harmonic Distortion (THD)

18 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated

Product Folder Links: TS5A22366


TS5A22366

www.ti.com SCDS262B – JANUARY 2009 – REVISED MAY 2013

REVISION HISTORY

Changes from Revision A (August 2009) to Revision B Page

• Removed QFN reference from product description. ............................................................................................................. 1


• Changed Analog signal range MIN value from V+ – 0.5 to V+ – 5.5 ..................................................................................... 7

Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 19


Product Folder Links: TS5A22366
PACKAGE OPTION ADDENDUM

www.ti.com 1-Dec-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TS5A22366YFCR ACTIVE DSBGA YFC 12 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 (3A2 ~ 3AN)
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 1-Dec-2015

Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jul-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal


Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS5A22366YFCR DSBGA YFC 12 3000 178.0 9.2 1.29 1.69 0.73 4.0 8.0 Q1

Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jul-2015

*All dimensions are nominal


Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS5A22366YFCR DSBGA YFC 12 3000 220.0 220.0 35.0

Pack Materials-Page 2
D: Max = 1.59 mm, Min = 1.53 mm

E: Max = 1.19 mm, Min = 1.13 mm


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