Lecture 1: Introduction

Dr. Ying-Khai Teh

EE 330
Fundamentals of Engineering Electronics
Fall 2018
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 2

Class administration
• Course #: EE 330
• Course name:
Fundamentals of Engineering Electronics
• Two lectures per week:
Tuesday, Thursday
5:30PM-6:45PM@PS-130
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 3

Class administration
• Instructor: Dr. Ying-Khai Teh
• Email: ykteh@sdsu.edu
• Office: E202E, Phone: 619-594-2436
• Office hours:
Tuesday, 10 – 10.50am @ NE-175 (EE397:Discussion, 1
unit credit, optional class registration,1:Many meeting)
Thursday 12:15pm - 1:30pm @ E-202E (1:1 meeting)

Email me for other time arrangement

9/4/2018 EE 330 Fundamentals of Engineering Electronics 4

Brief story about myself

• Born in Malaysia, grew up in a small town
nicknamed “Rain town” in Malaysia.
• Joined electronics club in high school.
• Got my Bachelor and Master in Malaysia
• Got Fulbright offer to do PhD in US! Plan
did not work out eventually.
• Work in Malaysia for 2 year as lecturer.
• Spend 6 years and got my PhD in Hong
Kong. Thesis on energy harvesting chip.
• Joined SDSU as faculty in Fall 2016.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 5

Email
• When emailing me, please format the subject
line as follows:

“EE330 : <first name> - <last name> - <subject>”

This will make sure my email filter will not ditch

your email into junk folder!
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 6

Textbooks
• Sedra and Smith, "Microelectronic Circuits",
7th edition, Oxford University Press, 2015.

• EE430, COMPE572 also recommends the

same textbook. So it is cost effective to
invest on this book.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 7

Homework
• Homework from textbook will be assigned on
regular basis.
• Homework is due at the beginning of class on
the date specified on Blackboard.
➢ No late submission will be accepted.

• Homework and projects are essential to the

learning process! More important than grades
alone. Cheating will NOT be tolerated.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 8

Computer Simulation Projects

• Two group (Maximum 5 students per group)
computer simulation project (LTSPICE)
assignments in total.
• There are no scheduled lab times. Perform your
lab work at your own computer whenever you
wish.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 9

Exams
• Two mid-term exams. (Oct 11, Thursday and Nov
13, Tuesday)
• Comprehensive final exam (Dec 18, Tuesday
1530-1730). No make up exams.
• All exams are closed book, but you are allowed
to bring one sheet (double-sided) of notes
(letter size) prepared by your own, plus
calculator without file storage ability. Backpacks
and bags should be put in front of classroom.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 10

Course snapshots
• 1. Introduction to analog/digital electronics
• 2. Fundamentals of semiconductor physics on PN
junctions, MOSFETs and BJTs
• 3. Diode-based rectifier and filter circuits
• 4. MOSFET biasing and amplifier circuits
• 5. BJT biasing and amplifier circuits
• 6. Operational amplifier circuits
• 7. The use of CAD (computer aided design) tools
to simulate the circuit behavior of rectifier and
transistor amplifiers.
9/4/2018 EE 330 Fundamentals of Engineering Electronics 11

Flashing news! POP quiz!

Let us have the

first quiz NOW! ☺
9/4/2018 EE 330 Fundamentals of Engineering Electronics 12

Flashing news! POP quiz!

Where is Malaysia?
9/4/2018 EE 330 Fundamentals of Engineering Electronics 13

Flashing news! First HW!

Don’t worry, it is just a survey
form. Please complete the form
online.
https://goo.gl/forms
/1bWZJjcdUVblyg
DK2
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 14

Class grades
• Homework
➢ 15% of grade

• Simulation project assignments (Group work up to 5)

➢ 25% of grade
• Two midterm exams Oct 11 (Thursday), Nov 13 (Tuesday)
➢ 30% of grade
• Final exam Dec 18 (Tuesday), 3.30pm-5.30pm.
➢ 30% of grade (No make up exams until Spring 2019)
• Extra credit (Projects and class participation bonus).
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 15

Class grades
• Grading system (A or B, whichever is higher)
A B Letter

90.00 % Class average + 25% A

Class average + 22% A-

Class average + 19% B+

80.00 % Class average + 16% B

Class average + 12% B-

Class average + 7% C+

60.00 % Class average - 3% C

Class average - 6% C-

Class average - 12% D+

Class average - 18% D

0.00 % 0.00% F
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 16

You are expected to

• Attend class and participate in HW, projects

• Spend time outside of class learning the
material
• Read the class material
• Attempt the homework on your own
• Complete all of the lab projects on your own
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 17

Prerequisites
• At least a C in EE210-CIRCUIT ANALYSIS I.
• You will need to apply circuit theories learnt to
analyze diode and transistor circuits.
• Last day to add/drop is 9/10/2018 (Monday). If
your prerequisite courses were not taken at
SDSU, you should obtain a proof of course
equivalency from the Office of Advising and
Evaluations at SDSU, showing that the courses
you have taken are equivalent to EE210.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 18

Learning objectives

• Introduction of Electronics
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 19

Introduction of Electronics
• Application of Electronics systems

VLSI systems
9/4/2018 EE 330 Fundamentals of Engineering Electronics 20

Miniaturization and integration (Digital

Data), less so for Power-Analog
• 1997 mobile phone
• Single-mode / Single-band
Analog Radio
• No touch screen.
Monochrome LCD.
• MHz microcontroller clock
speed
• MegaBytes memory and
storage.
9/4/2018 EE 330 Fundamentals of Engineering Electronics 21

Apple iPhone 7 (Tri-mode / Quad-Band

radio, sensors, WiFi, NFC)
9/4/2018 EE 330 Fundamentals of Engineering Electronics 22
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 23

Introduction of VLSI
• Different levels of abstraction

Memory ALU

Control I/O

System design System block Circuit design

design

We focus on diode and transistor-level

circuit design in this course
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 24

Introduction of Electronics
• Discrete electronic components
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 25

Introduction of Electronics
• This class focuses on Diode & Transistors level
design for rectifiers, and amplifiers
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 26

Introduction of VLSI
• First integrated circuit (IC) - Texas Instruments
1958 by Jack Kilby.

• 1 transistor and 4 other devices on 1 chip.

• RC feedback transistor oscillator.
• Winner of the 2000 Nobel Prize
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 27

Introduction of VLSI
• First commercial planar IC – Fairchild 1959

• 1-bit memory device on a chip

• 4 transistors and 5 resistors – small scale integration
technology
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 28

Introduction of VLSI
• 𝜇𝐴709 operational amplifier – Fairchild 1965
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 29

Introduction of VLSI
• First 1,024 bit memory chip – Intel 1970

Mostly made of nMOS transistors

 9/4/2018 EE 330 Fundamentals of Engineering Electronics 30

Introduction of VLSI
• First microprocessor – Intel 1971

The Intel 4004 – 2,300 Transistors

 9/4/2018 EE 330 Fundamentals of Engineering Electronics 31

Introduction of VLSI
• Qualcomm Snapdragon 835 Mobile SoC 2.45GHz,
8 cores. Samsung 10-nm process.

> 3.0 billion

transistors
9/4/2018 EE 330 Fundamentals of Engineering Electronics 32

10nm CMOS technology Mixed-signal

System-on-chip by Qualcomm.
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 33

Global semiconductor industry revenue from

2009 to 2017, by vendor (in billion U.S. dollars)

Source: Statista
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 34

Global semiconductor industry revenue from

2009 to 2017, by vendor (in billion U.S. dollars)

Source: Statista
9/4/2018 EE 330 Fundamentals of Engineering Electronics 35

Hidden force – Semiconductor Foundries

(Fabless vs Integrated device manufacturer)
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 36

Introduction of VLSI
• Scales of integrated circuits
Large-scale
Small-scale integration Medium-scale integration integration
(SSI) ~10 components (MSI) ~100 components (LSI) ~10,000
components

Very large-scale integration (VLSI) has more

than tens of thousands of transistors on a single chip
9/4/2018 EE 330 Fundamentals of Engineering Electronics 37

Moore’s Law
• Self-fulfilling prophecy

• Transistor # doubles every …

9/4/2018 EE 330 Fundamentals of Engineering Electronics 38

Moore’s Law
• Self-fulfilling prophecy

• Transistor # doubles every …

• 1 year (Moore)
9/4/2018 EE 330 Fundamentals of Engineering Electronics 39

Moore’s Law
• Self-fulfilling prophecy

• Transistor # doubles every …

• 1 year (Moore)

• 2 year (Moore, again)

9/4/2018 EE 330 Fundamentals of Engineering Electronics 40

Moore’s Law
• Self-fulfilling prophecy

• Transistor # doubles every …

• 1 year (Moore)

• 2 year (Moore, again)

• 4 year (as of 2018)

 9/4/2018 EE 330 Fundamentals of Engineering Electronics 41

Introduction of VLSI
• IC wafers and packaging. Production yield vs
engineering sample.

After metal deposition, each wafer contains a number of the same

ICs, which will be cut into distinct pieces and put in the package
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 42

Introduction of VLSI
• Semiconductor manufacturing (food analogy: pizza)
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 43

Introduction of VLSI
• Semiconductor manufacturing (food analogy: pizza)
 9/4/2018 EE 330 Fundamentals of Engineering Electronics 44

Introduction of VLSI
• Illustration of IC layout (Future course: Digital:
COMPE572, Analog: EE530)

Cross-sectional diagram of
3-D illustration of an IC n- and p-MOSFETs
9/4/2018 EE 330 Fundamentals of Engineering Electronics 45

COMPE470,

COMPE475

COMPE270

EE330, EE430 (ideal model)

COMPE572, EE530 (realistic design)

 9/4/2018 EE 330 Fundamentals of Engineering Electronics 46

Summary

• Introduction of VLSI