APQP – Advanced Product Quality Planning

Suppliers should provide APQP status reports for new products with regard to meeting program
objectives including quality, cost, performance and timing. TRW will provide the format, frequency and
the required content of these reports. TRW prefers their suppliers to use the forms included in this
document.
Status report for new products, regarding cost, performance, timing.

1) Kick-off phase – supplier has awarded new business. Company and supplier defines key
milestones, time lines, follow ups and tech design.
2) Span of time in which supplier completes design.
3) Supplier’s direction to manufcatuerer of the equipment, tools with approval to ship product.
Also assure that manufcatuered items meet specs and requirements.
4) This is pre-PPAP or pre-validation phase. Ends with PPAP production run.
5) Validation and launch stage. Supplier submits PPAP packages for disposition.

PPAP – Production part approval process

standardized process in the automotive and aerospace industries that helps manufacturers and
suppliers communicate and approve production designs and processes before, during, and after
manufacture.

Design records, flow diagrams. Checking aids, control plan, master sample, material and performance
test results, change documents, customer documents.

ISHIKAWA Chart:

Causes of the event. Causes grouped together into categories and then classify these sources. To find
the root cause.

5 Ms manufacturing

Machine, method, material, man, measurement.

8 Ps production

Product, price, place, process, people, performance, pace

GSQM – Global supplier quality manual

SDE – Supplier Development engineering

8D Report:

Resolve problems. Focused on product and process improvement.

Plan for solving the problem

Establish a team of people with product/process knowledge

Describe and specify the problem

Determine the interim containment plan

Determine and verify the root causes and escape points

Verify permanent corrections for problems that will resolve the problem

Define and implement corrective actions

Prevent recurrence / system problems

Congratulate and recognize the efforts.

Surface Mounted tech:

Method of producting electronics circuits in which components are mounted directly on the surface of
printer circuit board.

By employing SMT, the production process speeds up, but the risk of defects also increase due to the
components miniaturization and denser packing of boards. Higher component density. Better
mechanical performance.

Through hole tech is not used anymore.

Selective soldering:

Selectively soldering compinents to PCB and molded modules that can be damaged by heat of reflow
owen in SMT assmblly.

usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by
parts that have been previously soldered in a surface-mount reflow process, and the selective-solder
process must be sufficiently precise to avoid damaging them.

Assembly processes used in SS are:

Seleective aperture tooling over wave solder:

Mask off areas previously soldered exposing aperture that needs to soldered. Then passed to wave to
complete the process.

Wave soldering:

Wave soldering is a large-scale soldering process by which electronic components are soldered to a
printed circuit board (PCB) to form an electronic assembly. The name is derived from the use of waves of
molten solder to attach metal components to the PCB. The process uses a tank to hold a quantity of
molten solder; the components are inserted into or placed on the PCB and the loaded PCB is passed
across a pumped wave or waterfall of solder. The solder wets the exposed metallic areas of the board
(those not protected with solder mask, a protective coating that prevents the solder from bridging
between connections), creating a reliable mechanical and electrical connection. The process is much
faster and can create a higher quality product than manual soldering of components.

Wave solder machine

There are 3 separate processes involved within a wave solder machine.

1. The first stage in the process is for the machine to apply a layer of flux to the underneath
of the entire board in order to help clean the components and PCB in the areas requiring
solder. Any impurities, such as the forming of oxide layers, can affect the soldering
process which can then lead to poor quality solder joints.
2. Once the flux has been applied, the PCB is gradually heated up which both activates the
flux prior to soldering and also helps prevent the board from suffering thermal shock.
3. Finally the PCB is passed over a molten ‘wave’ of solder. As the PCB moves over the
wave, via a mechanical conveyor driven system, a connection is made between the
electronic component leads, the PCB pads/holes and the solder itself which forms an
electrical connection.

Miniature wave selective solder fountain

There are also 3 separate processes involved within a miniature wave selective solder machine
however:

1. Flux is only applied to the components that need to be soldered not the entire board. The
flux is accurately applied using a nozzle which can vary in size to increase or reduce the
area to be soldered. This is particularly useful when attempting to solder densely
populated PCB’s.
2. Once the flux has been applied, the PCB is gradually heated up in the same way as the
wave solder machine, activating the flux prior to soldering and once again helping to
prevent the board suffering thermal shock.
3. Finally, instead of passing over a ‘wave’ of molten solder, smaller, more accurate nozzles
, are used to deposit the solder and form the connection.

http://blog.jjsmanufacturing.com/electronic-pcb-assembly-soldering-selective-or-wave-
soldering

ECU – Electrical Control Unit

An embedded system that controls one or more electrical systems or subsystems in a vehicle.

Speed control or autocrusie: controls the speed. Servomechanisim that takes over the throlttler of car to
maintain a steady speed as set by driver.

TCU: uses sensors from the vehicle as well as data provided by the engine control unit (ECU) to calculate
how and when to change gears in the vehicle for optimum performance, fuel economy and shift quality.

On some applications, the TCU and the ECU are combined into a single unit as a powertrain control
module

power-train control module, abbreviated PCM, is an automotive component, a control unit, used on
motor vehicles. It is generally a combined control unit, consisting of the engine control unit (ECU) and
the transmission control unit (TCU).
There are many hundreds of error codes that can occur, which indicates that some subsection of the car
is experiencing a problem. When one of these errors occurs, usually it will turn on the "check engine"
light on the dashboard. The PCM is one of potentially several on-board computers, or essentially the
"brain" of the engine control system.

Steering, speed control, transmsission control, braking, steering.

Microcontrolleer,

Memory SRAM, EEPROM, Flash

Input voltage, Analog/Digital inputs

Outputs:

Relay. H-bridge, injector, logic outputs

Communication links housing

Diecasting:

Metal casting process where molten metal is forced under high pressure into a mold cavity. The mold
cavity is created using two tool steel dies which have been machined into shape and work simarly to an
injection mold during the process.

Injection moulding:

Manfucaturing process for making parts by injecting material into a mould. Material for the part is fed
into a heated barrel, mixed, and forced into a mould cavity, where it cools and hardens to the
configuration of the cavity. Injection moulding is widely used for manufacturing a variety of parts, from
the smallest components to entire body panels of cars. Advances in 3D printing technology, using
photopolymers which do not melt during the injection moulding of some lower temperature
thermoplastics, can be used for some simple injection moulds.

A printed circuit board (PCB) mechanically supports and electrically connects electronic
components using conductive tracks, pads and other features etched from copper sheets
laminated onto a non-conductive substrate. Components (e.g. capacitors, resistors or active
devices) are generally soldered on the PCB. Advanced PCBs may contain components embedded
in the substrate.

PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer
(outer and inner layers). Conductors on different layers are connected with vias. Multi-layer
PCBs allow for much higher component density.

SMEA – Success mode effect analysis

Process step, success mode, effect of success, cause of effect (effect score), cause of effect (frequency ),
control of cause (detection), success priority number = (effect x frequency x detection)

Quality tools – 5 Whys. Root Cause Analysis.

Types of capacitors:

Ceramic capacitors – non-polarized fixed capacitor made out of ceramic.

Eleoctrolytics - a metallic anode covered with an oxidized layer used as dielectric. The second electrode
is a non-solid (wet) or solid electrolyte. Electrolytic capacitors are polarized. Niobium, Tantalum,
Alluminium.

Supercapacitors - electric double-layer capacitors (EDLC), pseudocapacitors and hybrid capacitors. They
don't have a conventional solid dielectric. The capacitance value of an electrochemical capacitor is
determined by two storage principles, both of which contribute to the total capacitance of the capacitor.
Polarized.

Film capacitos - non-polarized capacitors with an insulating plastic film as the dielectric

X and Y capacitors

Lightning strikes and other sources cause high voltage surges in mains power. Safety capacitors
protect humans and devices from high voltage surges by shunting the surge energy to ground.[30]

In particular, safety regulations mandate a particular arrangement of Class X and Class Y mains
filtering capacitors. [31]

In principle, any dielectric could be used to build Class X and Class Y capacitors; perhaps by
including an internal fuse to improve safety.[32][33][34][35] In practice, capacitors that meet Class X
and Class Y specifications are typically ceramic RFI/EMI suppression capacitors or plastic film
RFI/EMI suppression capacitors.

Inductors don’t have a polarity. Also same for resistors.

Quality tools – 5 Whys. Root Cause Analysis.

Scatter diagram.

Cause-and-effect diagram.

Gantt chart.

PERT charts

ZF Group:

ZF group – 2nd largest manufacturer

Drive performance and results by focus on Best quality, low cost, global reach and inoovative.

Do things right first time, every time and improve.

Specialising in engineering, it is primarily known for its design, research and development, and
manufacturing activities in the automotive industry. It is a worldwide supplier of driveline and chassis
technology for cars and commercial vehicles, along with specialist plant equipment such as construction
equipment. It is also involved in rail, marine, defence and aviation industries, as well as general
industrial applications.

Started in 1915 as gear factory.

Acquired many businessed. Acquired TRW recently. American auto parts manuf. Now is the active and
passive safety technology division.

In 2015 they acquired industrial gears and wind turbine gearbox segment from Bosch.

Auto amd manual transiiion to automobiles.

Business units are divided into 7 divisions.

Car powertrain tech.

Car Chassis

Comeercial vehicle tech

Inductrial tech

Active and passive tech

e-mobility

ZF aftermarket

global leader in driveline and chassis technology as well as active and passive safety technology.

In 2016, ZF achieved sales of €35.2 billion. ZF annually invests about six percent of its sales in research &
development – ensuring continued success through the design and engineering of innovative
technologies. ZF is one of the largest automotive suppliers worldwide.

For 2025: Digitalization and autonomous driving are prompting radical change in the automotive
industry. ZF is one of the key global suppliers with economic strength and technological expertise to be
at the helm of this change. The Group’s broad product portfolio facilitates the deployment of new
solutions in a variety of mobility-related sectors.

Quality KPIs:

Complaints

Supervisions of inpsections

Quality Audits

Non-conformotities raised during audits

Good practiciies

Conformations to certifications and standards.

TS 16949:
ISO technical specification aimed at the development of a quality management system that provides for
continual improvement, emphasizing defect prevention and the reduction of variation and waste in the
automotive industry supply chain

Intro

Gerneral requirements, control of docs and records

Responsbility of management

Management of resources

Product realizations

Measurement, analysis and improvement

ISO 14001:

Standard to provie tools to manage environmental responsibilities. Provide assurance that

environmental impact is measured, monitored and improved.

FMEAs:

Failure Modes and Effects Analysis (FMEA) is a systematic, proactive method for evaluating a process to
identify where and how it might fail and to assess the relative impact of different failures, in order to
identify the parts of the process that are most in need of change.

Functions, potential failure mode, causes of failure, current process controls, recommended actions,
responsibilities. Action results.

CMM:

Coordinate-measuring machine

is a device for measuring the physical geometrical characteristics of an object. This machine may be
manually controlled by an operator or it may be computer controlled. Measurements are defined by a
probe attached to the third moving axis of this machine. Probes may be mechanical, optical, laser, or
white light, among others. A machine which takes readings in six degrees of freedom and displays these
readings in mathematical form is known as a CMM.

Geometric dimensioning and tolerancing:

system for defining and communicating engineering tolerances. It uses a symbolic language on
engineering drawings and computer-generated three-dimensional solid models that explicitly describes
nominal geometry and its allowable variation. It tells the manufacturing staff and machines what degree
of accuracy and precision is needed on each controlled feature of the part. GD&T is used to define the
nominal (theoretically perfect) geometry of parts and assemblies, to define the allowable variation in
form and possible size of individual features, and to define the allowable variation between features.

 Dimensioning specifications define the nominal, as-modeled or as-intended geometry. One

example is a basic dimension.
 Tolerancing specifications define the allowable variation for the form and possibly the size of
individual features,
Process flow diagram:
The PFD displays the relationship between major equipment of a plant facility and does not show minor
details such as piping details and designations. Another commonly used term for a PFD is a flowsheet.

ESPI – Enhcnaed Supplier PPAP initiavite

Audit:

Documentation

Supplier management

Measurement and testing

Manufacturing process

Traceability

Maintenance

Safe launch plan execution