TED e

Information
SURPASS hiT 7550 2.05
Technical Description (TED)
A42022-L5936-C51-1-7618
Technical Description (TED) Information
f Important Notice on Product Safety

Elevated voltages are inevitably present at specific points in this electrical equipment. Some of the
circuit parts may also have elevated operating temperatures. Systems with forced ventilation have
rotating items.
Non-observance of these conditions and the safety instructions can result in personal injury or in prop-
erty damage.
The system complies with the standard EN 60950 / IEC 60950. All equipment connected has to comply
with the applicable safety standards.
Mount the systems in areas with restricted access only. Only trained and qualified personnel may
install, operate, and maintain the systems.
The same text in German:

Wichtiger Hinweis zur Produktsicherheit
In elektrischen Anlagen stehen zwangsläufig bestimmte Schaltungsteile der Geräte unter Spannung.
Einige Teile können auch eine hohe Betriebstemperatur aufweisen. Anlagen mit Zwangsbelüftung
haben drehende Teile.
Eine Nichtbeachtung dieser Situation und der Warnungshinweise kann zu Körperverletzungen und
Sachschäden führen.
Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Angeschlossene Geräte
müssen die zutreffenden Sicherheitsbestimmungen erfüllen.
Die Anlagen dürfen nur in Betriebsstätten mit beschränktem Zutritt aufgebaut werden. Die Anlagen
dürfen nur durch geschultes und qualifiziertes Personal installiert, betrieben und gewartet werden.
Trademarks:
All designations used in this document can be trademarks, the use of which by third parties for their
own purposes could violate the rights of their owners.
Copyright (C) Siemens AG 2003
Issued by the Information and Communication Networks Group

Hofmannstraße 51
D-81359 München
Technical modifications possible.

Technical specifications and features are binding only insofar as
they are specifically and expressly agreed upon in a written contract.
2 A42022-L5936-C51-1-7618
Information Technical Description (TED)
This document consists of a total of 178 pages. All pages are issue 1.
Contents
1 Notes on the SURPASS hiT 7550 2.05 Documentation . . . . . . . . . . . . . . . 11
1.1 Preliminary Remarks concerning this Release . . . . . . . . . . . . . . . . . . . . . . 11
1.2 Customer Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 Complementary Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.4 Symbols Used in the Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.1 Symbol for Warnings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.2 Symbols for Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.3 Symbols for Menu Displays and Text Inputs. . . . . . . . . . . . . . . . . . . . . . . . 13
1.4.4 Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.5 Notes on Licensed Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.6 Form for your Ideas, Proposals and Corrections . . . . . . . . . . . . . . . . . . . . 14
2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.2.1 Network Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.2.2 Compatibility with Existing Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.3 SURPASS hiT 7550 2.05 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3.1 Transmission Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3.2 Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.3 Optical Safety Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.3.3.1 Automatic Power Shutdown Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.3.3.2 Automatic Power Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3.3.3 Additional APSD/APR Safety Mechanisms. . . . . . . . . . . . . . . . . . . . . . . . . 26
2.3.4 Optical Performance Monitoring & Control . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.3.4.1 Optimal EDFA Gain Setting and Fast Gain Control . . . . . . . . . . . . . . . . . . 27
2.3.4.2 EDFA Output Power Control (Slow Gain Control) . . . . . . . . . . . . . . . . . . . 27
2.3.4.3 Power Equalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.3.4.4 EAM4 Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.3.4.5 Client Signal Ageing, Drop Control, Add Channel . . . . . . . . . . . . . . . . . . . 28
2.3.4.6 Constant Pump Current Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.3.4.7 Tilt Analyzer and Adjustable Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.3.4.8 ASE Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.3.4.9 Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.3.4.10 Channel Up- and Downgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3.4.11 Optical Layer Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3.4.12 Optical Layer Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3.4.13 Optical Performance Analyzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.3.5 Optical Network Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2.3.5.1 The Telecommunication Network Management System . . . . . . . . . . . . . . 38
2.3.5.2 Integrated Domain management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.3.6 Element Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.3.7 Connection to Network Management Systems. . . . . . . . . . . . . . . . . . . . . . 42
2.3.7.1 Information Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
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2.3.7.2 Communication Stacks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

2.3.7.3 Communication Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.3.8 EOW Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.3.9 User Data Channels (sV.11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.3.10 Telemetry Interface (TIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.3.11 Overview of System Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.1 Frequency/Wavelength Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.1.1 “C” and “L” Wavelength Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.1.1.1 40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6) . . . . . . 54
3.1.1.2 40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8) . . . . . . 55
3.1.1.3 40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6) . . . . . . . 55
3.1.1.4 40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8) . . . . . . . . 57
3.1.2 Interleaver Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
3.2 Functional Overview of the NE Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.2.1 OTT(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.2.1.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.2.1.2 Four Stage Design from 1 to 160 Channels. . . . . . . . . . . . . . . . . . . . . . . . . 62
3.2.1.3 Multiplexer Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.2.1.4 Multiplexer Equipping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.2.2 OLRU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.2.2.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.2.2.2 Scalability of DWDM Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.2.2.3 Amplifier Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.2.2.4 Multi-Stage Amplifier Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.2.2.5 Amplifier Pump Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
3.2.2.6 Raman Amplification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3.2.3 OADM(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.2.3.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.2.3.2 Remotely Configurable 20% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.2.3.3 Back-to-Back 100% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
3.2.3.4 Connectivity Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.2.3.5 OADM Cascadability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.2.4 CCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.2.5 OADM Ring Closure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
3.2.6 Networking with OADMU/OTTU. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
3.3 Functional Overview of the Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
3.3.1 Modules used for NEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
3.3.2 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
3.3.3 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
3.3.4 SAB Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
3.3.5 SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
3.3.6 OSCT Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
3.3.7 SMU2 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
3.3.8 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
3.3.9 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
3.3.10 OLI PUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
4 A42022-L5936-C51-1-7618
3.3.11 RPUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

3.3.12 OMD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
3.3.13 OM/OD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
3.3.14 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
3.3.15 EAM4C or EAM4L Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
3.3.16 OCA / OCAS / OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
3.3.17 UDCM Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
3.4 Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
3.5 Control and Monitoring via the Element Manager. . . . . . . . . . . . . . . . . . . 108
3.5.1 Access Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
3.5.2 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
3.6 Control and Monitoring via Network Management System . . . . . . . . . . . . 110
4 Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
4.1 Racks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
4.1.1 Mechanical Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
4.1.2 Rack and Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
4.1.3 Connector Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
4.2 Subracks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
4.2.1 Subrack Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
4.2.2 DCM Trays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
4.3 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.4 System Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.4.1 OTT Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
4.4.2 OLR Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
4.4.3 OADM Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
4.4.4 CCU Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
4.5 Display and Operating Elements on Equipment . . . . . . . . . . . . . . . . . . . . 126
4.5.1 NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
4.5.2 SAB Boards and Subrack Address Setting. . . . . . . . . . . . . . . . . . . . . . . . 126
4.5.3 Module Front Panel Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
5 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
5.1 Fault Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
5.2 NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
5.3 Management PC Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
6 Commissioning, Operation and Maintenance . . . . . . . . . . . . . . . . . . . . . . 135

6.1 Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
6.2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
6.2.1 Operating and Display Elements of the Modules . . . . . . . . . . . . . . . . . . . 135
6.2.2 Operation with an Operating Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
6.3 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
7 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

7.1 Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
7.2 Rack/Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
7.2.1 Rack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
7.2.2 Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
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7.3 Technical Characteristics of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

7.3.1 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
7.3.2 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
7.3.3 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
7.3.4 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
7.3.5 OSCTUT and OSCTUI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
7.3.6 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
7.3.7 PUMPA, PUMPB, and PUMPC Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 147
7.3.8 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL) . . . . . . . . . 148
7.3.9 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
7.3.10 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
7.3.11 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
7.3.12 EAM4 Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
7.3.13 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
7.3.14 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
7.3.15 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
7.4 Rack/Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
7.5 Electrical Power Consumption of Modules. . . . . . . . . . . . . . . . . . . . . . . . . 156
7.6 Electrical Power Consumption of Racks . . . . . . . . . . . . . . . . . . . . . . . . . . 157
7.7 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
7.8 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
7.9 System Requirements for the Element Manager . . . . . . . . . . . . . . . . . . . . 160
8 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
10 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
6 A42022-L5936-C51-1-7618
Illustrations
Fig. 2.1 Basic Structure of the ’SUPRASS hiT 7550 2.05’ Optical Network
System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Fig. 2.2 The Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig. 2.3 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link
with No Fibre Break . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Fig. 2.4 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link with a Single Fibre
Break between OLR and OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Fig. 2.5 Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points . 35
Fig. 2.6 Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points 36
Fig. 2.7 Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points . 37
Fig. 2.8 Element Manager Main Window (Example: OTTU Network Element, Sub-
rack 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Fig. 2.9 TNMS CT Graphical User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Fig. 2.10 Communication Interfaces and Controller Architecture
of SURPASS hiT 7550 2.05. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Fig. 2.11 Synopsis of Applications, Communication Stacks and Interfaces . . . . . 45
Fig. 2.12 Information Model of the Physical Interfaces . . . . . . . . . . . . . . . . . . . . . 46
Fig. 3.1 SURPASS hiT 7550 2.05 Wavelength Plan. . . . . . . . . . . . . . . . . . . . . . 53
Fig. 3.2 ’SURPASS hiT 7550 2.05’ Wavelength Bands and Sub-Bands . . . . . . 59
Fig. 3.3 OTTU, Optical Path Structure for C Band
(Upgradable to C+L Band). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Fig. 3.4 Block Diagram of C Band ’SURPASS hiT 7550 2.05’
Multiplexer Architecture Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Fig. 3.5 OLRU, Optical Path Structure for C Band . . . . . . . . . . . . . . . . . . . . . . . 65
Fig. 3.6 Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration 66
Fig. 3.7 Two Fibre SURPASS hiT 7550 2.05 Standalone
L Band Amplifier Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Fig. 3.8 Stage EDFA Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Fig. 3.9 Two Fibre ’SURPASS hiT 7550 2.05’ C+L Band, Raman Amplifier Config-
uration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Fig. 3.10 OADMU with CAD2x Modules, Optical Path for C Band Standalone . . 72
Fig. 3.11 Remotely Configurable CAD2 Optical Switch Modules . . . . . . . . . . . . . 73
Fig. 3.12 Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz) .
75
Fig. 3.13 Symmetrical and Asymmetrical OADM Architectures . . . . . . . . . . . . . . 76
Fig. 3.14 CCU: Principal System Environment of OCA and OC(A)S Modules . . . 77
Fig. 3.15 OADM Ring with two Back to Back Terminals (2xOTTU) . . . . . . . . . . . 78
Fig. 3.16 Network Configurations with Combinations of Network Elements . . . . . 79
Fig. 3.17 MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Fig. 3.18 SAB and SABM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Fig. 3.19 OSCTU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Fig. 3.20 SMU2 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Fig. 3.21 OPA Module, Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Fig. 3.22 System Environment of OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 92
A42022-L5936-C51-1-7618 7
Fig. 3.23 OLI Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Fig. 3.24 OLI PUMP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Fig. 3.25 OMDFIC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Fig. 3.26 OMDFIL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Fig. 3.27 OMDFC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Fig. 3.28 OMDFL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Fig. 3.29 OMD2IC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Fig. 3.30 OMD2IL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Fig. 3.31 OM20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Fig. 3.32 OD20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Fig. 3.33 ODA20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Fig. 3.34 CAD2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Fig. 3.35 EAM4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Fig. 3.36 OCA and OCAS Modules, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . 104
Fig. 3.37 OCS Module, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Fig. 3.38 Timer Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Fig. 4.1 Power Distribution within the Rack (Single Row Subrack) . . . . . . . . . . 112
Fig. 4.2 Power Distribution within the Rack (Double Row Subrack) . . . . . . . . . 113
Fig. 4.3 Power Distribution within the Subrack . . . . . . . . . . . . . . . . . . . . . . . . . 114
Fig. 4.4 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access . . . 115
Fig. 4.5 COPA Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Fig. 4.6 ANSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 116
Fig. 4.7 ANSI Double-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . 117
Fig. 4.8 ETSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 118
Fig. 4.9 ETSI Double-Row Subrack (Front Access). . . . . . . . . . . . . . . . . . . . . . 119
Fig. 4.10 DCM Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Fig. 4.11 OTTU, C+L Bands, 160 Channels (Equipping Example) . . . . . . . . . . . 122
Fig. 4.12 OLRU, C+L Bands (Equipping Example) . . . . . . . . . . . . . . . . . . . . . . . 123
Fig. 4.13 OADMU, C+L Bands, 160 Channels, with Maximum Configurable
Add/Drop Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Fig. 4.14 CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM).
125
Fig. 4.15 NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Fig. 4.16 Subrack Address Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Fig. 5.1 Current Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Fig. 5.2 History Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Fig. 5.3 NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
8 A42022-L5936-C51-1-7618
Tables
Tab. 2.1 OSC Byte Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Tab. 2.2 Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Tab. 3.1 40 Blue Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 54
Tab. 3.2 40 Red Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 55
Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band. . . . . . . . . . . . . . . . . . . . . 55
Tab. 3.4 40 Red Wavelengths in the "L" (Long) Band . . . . . . . . . . . . . . . . . . . . . 57
Tab. 3.5 List of SURPASS hiT 7550 2.05 Multiplexer Modules . . . . . . . . . . . . . . 64
Tab. 3.6 Output Power for OLI Module with/without Pumps . . . . . . . . . . . . . . . . 69
Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System . . . . . . . . . . . . . . . . . 80
Tab. 7.1 Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Tab. 7.2 ETSI Rack Dimensions According to ETS 300 . . . . . . . . . . . . . . . . . . 139
Tab. 7.3 ANSI Rack Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Tab. 7.4 Subrack Dimensions and Weight (Single Row Subrack) . . . . . . . . . . . 140
Tab. 7.5 Subrack Dimensions and Weight (Double Row Subrack) . . . . . . . . . . 140
Tab. 7.6 Mechanical Specifications for DCM Shelf . . . . . . . . . . . . . . . . . . . . . . 140
Tab. 7.7 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Tab. 7.8 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Tab. 7.9 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Tab. 7.10 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Tab. 7.11 OSCT Module Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Tab. 7.12 OLI Module Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
Tab. 7.13 Specifications for OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Tab. 7.14 PUMPA, PUMPB, and PUMPC Modules. . . . . . . . . . . . . . . . . . . . . . . 147
Tab. 7.15 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL). . . . . . 148
Tab. 7.16 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Tab. 7.17 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Tab. 7.18 CAD2 Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Tab. 7.19 EAM4 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Tab. 7.20 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Tab. 7.21 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Tab. 7.22 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
Tab. 7.23 Electrical Power Consumption of Modules . . . . . . . . . . . . . . . . . . . . . 156
Tab. 7.24 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Tab. 7.25 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 160
Tab. 7.26 EM System Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
A42022-L5936-C51-1-7618 9
10 A42022-L5936-C51-1-7618
1 Notes on the SURPASS hiT 7550 2.05 Docu-

mentation
The documentation of the Network Element SURPASS hiT 7550 2.05 comprises cus-
tomer documentation (see 1.2) and complementary documentation (see 1.3). The doc-
umentation is available in binders as well as on CD-ROM.
For system requirements to install the CD-ROMs on your computer (under Windows
or UNIX) see the file README.TXT in the root directory of the CD ROMs.
1.1 Preliminary Remarks concerning this Release

You should not use the L-Band in the current release!
!
Please also NOTE carefully:
Although sometimes mentioned in this documentation, the following features are not
supported/tested with the current release:
• Web based control of the network element SURPASS hiT 7550 2.05
• TL1 control of the network elements SURPASS hiT 7550 2.05
• OADM with 80 % or 50 % static/configurable add/drop capacity
• TCP/IP and Dynamic routing (OSPF)
1.2 Customer Documentation

The customer documentation is split into manuals and Online Help:
• Technical Description (TED)
The Technical Description TED provides an overview of the application, perfor-
mance features, interfaces and functions of the equipment. It also contains the most
important technical data.
• Installation and Test Manual (ITMN)

The Installation and Test Manual ITMN contains instructions on how to install and
test the SURPASS hiT 7550 2.05 components. This includes mounting the subracks
in the equipment racks, connecting and testing power cables, electrical cabling and
plug-in card installation.
The optical cabling and rack arrangement are described in a complementary docu-
ment (see Cabling Plan, Chapter 1.3).
The ITMN also deals with commissioning the operating terminal and the software
and describes standard turn-up procedures.
• Operator Guidelines (OGL)

The Operator Guidelines OGL provide information on how to operate, monitor and
maintain the SURPASS hiT 7550 2.05 via use of the Q3-based Element Manager
software. The Element Manager (EM) is an easy-to-use Graphical User Interface
(GUI) with extensive Online Help built in.
☞ For detailed information on the Element Manager (EM) Graphical User In-
terface (GUI) the Operator Guidelines OGL comprise an Appendix "Printed
Help" containing the complete Online Help texts converted into printed
documentation.
A42022-L5936-C51-1-7618 11
• Online Help
The Online Help (Java based) provides information about the Element Manager win-
dows used for the SURPASS hiT 7550 2.05. Complex procedures are explained as
step-by-step instructions, especially alarm signaling, evaluation of the alarm mes-
sages, and performance management.
There are several ways for obtaining help:
=> Press F1 for getting help information related to the currently active window.
=> Select Help > Contents from the main menu to open the main help window. Via
this window you can display the help’s table of contents and you can search for spe-
cial topics using the “Find” or the “Index” tab.
1.3 Complementary Documentation

In addition to the customer documentation given above further complementary docu-
mentation set will be available partially on customer’s demand:
• Release Note
This document identifies the specific version of the SURPASS hiT 7550 2.05 product
and provides information on HW, SW, LCT/NCT components and the limitations of
the release as well as important notes concerning the customer documentation.
• Cabling Plan
This document deals with the electrical and optical cabling of the subracks and
racks, it illustrates the rack equipment of the several variants and contains block di-
agrams and cabling lists.
It may be obtained from the sales departments.
Ordering number: S42022-L5020-A100-*-7633.
• DCN Rules for OSI/IP (on customer’s demand)

This document describes the IP configuration for the SURPASS hiT 7550 2.05.
It may be obtained from the sales departments.
The IP feature is currently not released.
i
• User Manual TNMS CT:
The TNMS CT user manual describes the application, the installation, and the use
of the TNMS Craft Terminal (CT), which offers integrated management for DWDM
and SDH network elements together with central monitoring and configuration of an
entire (small) network. The TNMS CT also contains the Element Manager software
of the SURPASS hiT 7550 2.05, operated via a graphical user interface (GUI). The
connection to the managed network element is established either via Ethernet or via
RS-232 communication channels (Q3 or QF).
The TNMS CT user manual is supplied with the TNMS CT application itself.
Ordering number for the CD-ROM: A42022-L5959-A10-*-76K5
Ordering number for the manual (UMN): A42022-L5959-A53-*-7619.
• Field Test Protocols

Field Test Protocols specify the required values for system measurements and pro-
vide space to enter the actual measured value to confirm successful installation.
The current Field Test Protocols can be obtained from the sales departments.
12 A42022-L5936-C51-1-7618
1.4 Symbols Used in the Documentation
1.4.1 Symbol for Warnings

This symbol identifies notes which, if ignored, can result in personal injury or in perma-
! nent damage to the equipment.
1.4.2 Symbols for Notes

This symbol identified notes providing information which extends beyond the immediate
i context.
⇒ Denotes a point in the text which contains specific handling notes.
☞ Cross reference to other chapters in this manual or cross reference to other

manuals.
Help Note on the online help system of the relevant application software concerned.
1.4.3 Symbols for Menu Displays and Text Inputs

Menu options from pop-up menus or inputs to be made by the user (texts, commands)
are displayed consecutively in their hierarchical sequence in pointed brackets:
<Menu> <Menu Item> <Submenu Item> <...> <GUI Window...> etc.
In the Online Help menu options to be made by the user are displayed consecutively in
their hierarchical sequence by arrows:
Menu → Menu Item → Submenu Item → ... → GUI Window... → etc.
1.4.4 Terms
The modules of the network element are also referred to as cards, plug-in units or slide-
in units; in the English screen text, the designation “Card” is used in addition to the des-
ignation “Module”. In this manual, the designation “Module” is used for the most part.
There are also different namings as shelves and racks, subracks and subshelves, etc.
1.5 Notes on Licensed Software

This documentation refers to software products which were taken over from other com-
panies as licenses.
Should problems arise, you should contact Siemens AG as the licensee and not the rel-
evant licenser.
In this documentation, the following designations of licensed products are mentioned:
• UNIX (registered trademark of UNIX System Laboratories Inc.)
• MS-Windows (identification of the Microsoft Corporation)
A42022-L5936-C51-1-7618 13
1.6 Form for your Ideas, Proposals and Corrections

We aim to provide clear, user-friendly documentation. To achieve this objective, your
practical experience is very important. We appreciate your suggestions.
To offer you, the user, a cost-effective opportunity to identify weak points or requests for
documentation, we have compiled a form for you on the next page. You can use it as a
master or as a printout in electronic documentation.
Please enter your ideas, proposals and corrections on the copy (enclose further
pages, if required).
The following points are of particular importance to us:

• Where are we offering too much or too little detail?
• Where should more explanatory graphics be used?
• Where is the description difficult to understand?
• How can the basic structure of the description or the manual be improved?
Please forward your feedback as a letter, fax or E-Mail to our address given overleaf.
If you want a reply or need to discuss anything with us, please complete the “Sender”
field in full.
Many thanks for your feedback!
14 A42022-L5936-C51-1-7618
To Sender
SIEMENS AKTIENGESELLSCHAFT Name:

Information and Communication Networks Group
ICN CP STS PD 22 .......................................................................................
Hofmannstrasse 51
D-81359 Munich, Germany Address:
Fax +49 89 722 57315 .......................................................................................

E-Mail: Georg.Hohmann@siemens.com
.......................................................................................
Department: Tel./Fax:
E-Mail:
................................ .....................................................
Date: Signed:
................................. .....................................................
I use this manual as My functions include

(...) Service documentation (...) System commissioning/Startup
(...) Commissioning/System startup documentation (...) Operation
(...) A general introduction (...) Maintenance
(...) A reference work (...) Sales
(...) A text book (...) Teaching activities
(...) _______________________________ (...) _______________________________
Page Comments to the Documents TED, ITMN, OGL, or to the Online Help1)
1) Please mark the unit concerned.
A42022-L5936-C51-1-7618 15
16 A42022-L5936-C51-1-7618
2 System Overview
This chapter consists of the following sections:
• Introduction
• Applications
• SURPASS hiT 7550 2.05 Features
2.1 Introduction
Siemens SURPASS hiT 7550 2.05 is the new generation of ultra-high performance
DWDM systems extending transport capacity into the Terabit/s region. It's high equip-
ment density, modularity and flexibility make it one of the most compact and powerful
DWDM systems for today's and tomorrow's capacity requirements. High equipment
density ensures that a minimum of valuable rack space is consumed. Modularity results
in simple, low-cost, incremental component additions/exchanges being all that is neces-
sary for the user to upgrade his network to higher and higher capacities. Flexibility is built
into the SURPASS hiT 7550 system via many features. For instance, SURPASS hiT
7550 is able to accommodate a wide variety of ITU-compliant wavelength plans. Flexi-
bility ensures successful, cost-efficient deployment in today’s typical multi-vendor envi-
ronment, as well as in future all-optical transport networks that employ protection
switching architectures and restoration capability within the photonic layer.
Advances in technologies such as narrow-band optics (50 GHz channel spacing),
L Band broadband amplifiers, Raman amplification, and Enhanced Forward Error Cor-
rection (EFEC) techniques, together with improvements in their economic feasibility pro-
vide the foundation for Ultra-High Capacity (UHC) DWDM systems. Implementing them
represents the logical evolution of the SURPASS hiT 7550 platform.
SURPASS hiT 7550 2.05 offers a scalable capacity of up to 160 channels at 10 Gbit/s
on a single fibre pair. Each fibre carries a maximum of 160 wavelengths, 80 in the C
Band and another 80 in the L Band, that means 1.6 Tbit/s capacity per fibre and
3.2 Tbit/s capacity per fibre pair. Further capacity enhancements can be provided by a
system upgrade to higher bit rates.
Operation in either the C Band or in the L Band is also available. A smooth upgrade path
exists from an 80 channel system, requiring only C Band components, to a 160 channel
system, requiring the addition of the L Band wavelength spectrum. Standalone L band
systems are particularly interesting for Dispersion Shifted Fibre (DSF) applications due
to the higher chromatic dispersion in the L band.
Fully integrated DWDM interworking with Siemens 10 Gbit/s SDH line systems is offered
to reduce the number of costly network components. Alternatively, in combination with
the SURPASS hiT 7540 (OCU), highly sophisticated transponder and consolidating mul-
tiplexer solutions are provided to accommodate many different vendor and service
types, i. e. 2.5 Gbit/s/10 Gbit/s services, Internet Protocol (IP) services and Asynchro-
nous Transfer Mode (ATM) services. The SURPASS hiT 7540 (OCU) can deliver up to
32 bi-directional 10 Gbit/s or 64 bi-directional 2.5 Gbit/s channels per 7-foot rack (and
double that amount assuming back-to-back racks in one rack) for efficient integration
onto the ’SURPASS hiT 7550 2.05’ DWDM backbone network. Thus SURPASS hiT
7550 2.05 delivers substantial savings in floor space, operational costs (power con-
sumption) and equipment procurement costs.
The powerful combination of SURPASS hiT 7550 2.05 and the SURPASS hiT 7540
(OCU) provide the required optical networking building blocks for all applications.
A42022-L5936-C51-1-7618 17
2.2 Applications
2.2.1 Network Applications

The following four NE types are used in the SURPASS hiT 7550 2.05 transport platform:
– ’SURPASS hiT 7550’ Optical Transport Terminal (OTT) for 160 channel DWDM ca-
pability
– ’SURPASS hiT 7550’ Optical inLine Repeater (OLR), providing powerful inline am-
plification of 160 channels - up to 160 wavelengths per fibre in a unidirectional, two-
fibre configuration (3.2 Tbit/s total bandwidth)
– ’SURPASS hiT 7550’ Optical Add/Drop Multiplexer (OADM) which permits the ex-
traction and insertion of channels at intermediate line amplifier sites
– ’SURPASS hiT 7550’ Channel Connection Unit (CCU) to built static or dynamic pass
through or add/drop channel connections and thus to connect several OTTs and
OADMs together.
Depending on the wavelength band(s) used for transmission, there are three possible
configurations for each NE type:
– C band
– C+L band
– L band standalone
Possible NE configurations are shown in Fig. 4.11 through Fig. 4.14. For further details,
refer also to Chapter "3.2 Functional Overview of the NE Types".
Fig. 2.1 shows the basic structure of the SURPASS hiT 7550 2.05 optical network sys-
tem.
100% OADM
OTT ORL OADM OTT CCU OTT OTT
up to 20% configurable up to 100% add/drop or

add/drop express channels
Terminal equipment
OCR10G or SIEMENS SDH
Fig. 2.1 Basic Structure of the ’SUPRASS hiT 7550 2.05’ Optical Network
System
2.2.2 Compatibility with Existing Systems

The ’SURPASS hiT 7550 2.05’ transport platform presents wide channel passbands for
compatibility with multiple vendors’ 10 Gbit/s terminal equipment. In addition, it is com-
patible with the following Siemens solutions:
– Siemens 2.5 Gbit/s line systems (SL16, SLR16, WTTR)
– Siemens 10 Gbit/s SDH line systems (SL64)
18 A42022-L5936-C51-1-7618
– SURPASS hiT 7540 (OCU) with the following modules:

- 10 Gbit/s TDM multiplexing transponder (TEX) combining 4 x 2.5 Gbit/s signals
into one 10 Gbit/s signal
- OCR 10 Gbit/s transponder
– SURPASS hiT 7540 c1.5 (former OCU c1.5): 2.5 Gbit/s transponder
A42022-L5936-C51-1-7618 19
2.3 SURPASS hiT 7550 2.05 Features

This section consists of the following subsections:
• Transmission Functions
• Optical Supervisory Channel
• Optical Safety Mechanisms
• Optical Performance Monitoring & Control
• Optical Network Management
• Element Manager
• Connection to Network Management Systems
• EOW Interface
• User Data Channels (sV.11)
• Telemetry Interface (TIF)
• Overview of System Benefits
The following explanations to short terms would be useful for the understanding of some
feature descriptions:
ASE
stands for (undesired) Amplified Spontaneous Emissions, they are generated in laser
light sources and laser pump modules.
OSAR
is the abbreviation of the Optical Signal-to-accumulated-ASE Ratio. It can be seen as
the optical signal power at the output of a particular NE (OTT Tx or OLRU or OTTU Rx)
related to the "optical noise power" which has been accumulated up to this output.
OSAR is an absolute value and is measured e. g. by means of the OPA module.
OSAAR
is the abbreviation of the Optical Signal-to-added-ASE Ratio. This calculated, relative
value describes the degradation of OSAR along the optical link (between OTTU Tx and
OTTU Rx).
Preemphasis alignment is applied to equalize the OSAAR ratio of all express channels.
2.3.1 Transmission Functions

The SURPASS hiT 7550 system provides powerful and comprehensive control capabil-
ities for all optical elements, ensuring optimized configuration at system start-up as well
as superior stability and transmission quality when the network reaches its full running
state with live traffic. Some control decisions depend only on local conditions (within the
same NE), while others are based on extensive information exchanged among NEs. In-
formation needed to control the optical path is communicated between NEs via the Op-
tical Supervisory Channel (described below). Control capabilities include:
– Control of NEs during initial system start-up; pump lasers off-state for safety, upload
and download of module information, initial equalization of transmit channel signal
power, stabilization of line and module parameters (e. g., EDFA gain and output
power), and correction of transmit input powers to achieve optimum OSNR and pow-
er distribution (pre-emphasis).
– After the network becomes fully operational, the system performs ongoing monitor
duties for any required adjustments of the EDFAs (pump lasers, wavelength stability,
output power, VOA and power tilt control, and automatic power shutdown).
20 A42022-L5936-C51-1-7618
2.3.2 Optical Supervisory Channel

The Siemens SURPASS hiT 7550 2.05 offers a 2 Mbit/s optical service channel to pro-
vide communications between all SURPASS hiT 7550 NEs. This optical supervisory
channel supports all network management communication for the configuration, fault
management, performance monitoring, and software maintenance required to set up
and maintain a DWDM system. The OSC provides both a 576 kbit/s DCCOo (OTS DCC
Optical Transmission Section Data Communication Channel) and a 576 kbit/s DCCMo
(OMS DCC Optical Multiplex Section Data Communication Channel). The DCCOo is
terminated in every NE type, whereas the DCCMo only by the OTT and the OADM,
much like the DCCm and DCCr in the SDH overhead.
The OSC is a bi-directional channel whereby the same wavelength of 1625 nm is used
for both transmission directions, each on a separate fibre as shown in Fig. 2.2. The
OSC wavelength lies just outside the C Band of wavelengths, and is terminated at each
SURPASS hiT 7550 NE. Therefore, even in the rare occurrence of an amplifier failure,
the OSC and hence all management communications remain intact.
Customer’s
OSS Local
Craft Terminal
(LCT)
Network
Ethernet (Q3)
Craft Terminal
(NCT)
OSS (Q) Local (F)

interface interface
MCU OSC (1625 nm) MCU OSC (1625 nm) MCU OSC (1625 nm) MCU
with DCCOo with DCCOo with DCCOo
and DCCMo and DCCMo and DCCMo
OSCTUT OSCTUI OSCTUI OSCTUT
OSC (1625 nm) OSC (1625 nm) OSC (1625 nm)
with DCCOo with DCCOo with DCCOo
OTTU and DCCMo OLRU and DCCMo OADMU and DCCMo OTTU
Note: DCCOo is terminated at every NE. DCCMo is also terminated at

every NE except OLRU. DCCMo is passed through each OLRU.
Fig. 2.2 The Optical Supervisory Channel
The OSC channel is terminated on the Optical Supervisory Channel Termination Card
Unidirectional (OSCTU). A major function of the OSCTU module is the digital processing
of the bytes of the OSC (see also Tab. 2.1). The OSC is optically inserted into and ex-
tracted from the main DWDM traffic signal by a filter module on the Optical Line Interface
(OLI) module, and then is sent optically to the OSCTU module where it is electrically ter-
minated for digital processing.
There are two variants of the OSCTU module, one for the terminal sites OTT called the
OSCTUT, and one for the intermediate nodes OLR and OADM called the OSCTUI,
which require two OSC terminations, one each for the line side 1 and the line side 2. The
OSCTU has other important functions other than just OSC byte processing (see also
Chapter 3.3.6).
A42022-L5936-C51-1-7618 21
OSC bytes Contents

0 to 31
0 – G.704 basic frame

– CRC- 4 multiframe
– Sa4 bit used for timing marker
– CRC- 4 checksum used for EXC, SD
– A bit: optical link RDI bit
– Sa7 bit used for APSD signaling
– Sa8 bit used for direction Id
1 to 9 DCCOo: data communication channel of the optical transport section layer, 576 kbit/s
10 to 18 DCCMo: data communication channel of the optical multiplex section layer, 576 kbit/s
19 E0: engineering order-wire channel, 64 kbit/s

In OTT: EOW channel (E0 or F0) is permanently connected to the EOW conference. If E0
is connected to the EOW conference, F0 can be used as data channel.
In OLR, OADM: EOW channels (E0 or F0) of both OSC (A and B) are permanently con-
nected to the EOW conference. If E0 of OSCA and OSCB are connected to the EOW con-
ference, F0 of OSCA and OSCB can be applied as user data channel (passed through or
connected to sV.11 interfaces).
20/21/22 Configurable 64 kbit/s OSC user data channel connection to one out of two sV.11
interfaces
F0: engineering order-wire channel and sV.11 channels;
NU1, NU2: user data channel
23 OTS trace identifier
24 to 26 OSC channel status information
27 to 30 Optical link control
31 CRC check for link control information
Tab. 2.1 OSC Byte Mapping
22 A42022-L5936-C51-1-7618
2.3.3 Optical Safety Mechanisms

With the high powers being emitted by today's optical amplifiers and pump light sources
Siemens recognizes that safety to all users of DWDM equipment from harmful light
emission is an important issue.
The SURPASS hiT 7550 2.05 Erbium Doped Fibre Amplifiers (EDFA) produce power
outputs of up to +23 dBm, which means they fit into Laser Class 3B (< +27 dBm or
500 mW) according to relevant ETSI standards. The Raman pump output power also
has a maximum of +27 dBm which means it is also placed into Laser Class 3B. For this
Laser Class there must be controlled access to rooms containing this equipment, and a
mechanism to reduce the output power to Class 1 levels (< +10 dBm or 10 mW) at all
open optical connectors.
Due to the implementation of reliable Automatic Power Shutdown (APSD) and Automat-
ic Power Reduction (APR) algorithms, Siemens ensures that during normal equipment
operation Laser Class 1 is achieved. This applies for normal running traffic, link set-up,
fibre break or amplifier/laser defects. During fibre breaks, the shutdown of all high power
outputs must be achieved within 3 s. With subrack covers equipped, as is standard
equipment practice, Laser Class 1 is satisfied, as no light is expected to be emitted from
within the subrack. It also is not possible for the customer to disable the Automatic Pow-
er Shutdown functionality for obvious safety reasons.
2.3.3.1 Automatic Power Shutdown Procedure

There are several situations in which the amplifier pump lasers and the Raman pump
lasers are shut down, the main being due to fibre breaks in the line between any two
SURPASS hiT 7550 2.05 NEs, be they OTTU, OLRU, or OADMU.
Each SURPASS hiT 7550 2.05 optical amplifier is equipped with the Automatic Power
Shutdown (APSD) and automatic restart capability. If the input power of an amplifier
drops under a predefined power threshold, the pump lasers in one amplifier section are
switched off. They are restarted again if the input power reaches a certain minimum
power threshold for a certain time.
Fig. 2.3 shows a C Band ’SURPASS hiT 7550 2.05’ DWDM link with Siemens 10 Gbit/s
transponders providing the individual channel traffic signals. In this scenario the line fi-
bers are intact and a special bit in the OSC, the APSD bit is set to 0, or “o.k.”, in each
direction of each link.
Normal Operation
OCR10G OTT OLR OADM OTT OCR10G
APSD bit = 0
APSD bit = 0
Fig. 2.3 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link
with No Fibre Break
If at any site with an OTT/OLR/OADM, there is a fibre break on the fibre carrying the
incoming signal, then this line input will detect a loss of signal (LOS) of both the DWDM
traffic signal AND the Optical Supervisory Channel (OSC). In this case the fibre break
A42022-L5936-C51-1-7618 23
triggers the shutdown of the pump lasers of the inline amplifier (or preamplifier) in the
same direction AND of the inline amplifier (or booster amplifier) in the counter direction.
Hence the traffic signal in this counter direction is shut down and at the same time, the
APSD bit in the OSC in this direction is set to “1” to indicate an “active APSD” which is
then received by the next neighbouring NE, as can be seen in Fig. 2.4 below as an ex-
ample.
A loss of the OSC may mean one of the following: actual loss of OSC signal power, loss
of the OSC clock or the APSD bit in the OSC overhead is active. The APSD bit is used
to indicate to the neighboring NE in the counter direction that an APSD has occurred in
this NE. The use of the APSD bit is also shown in Fig. 2.4. The OSC is never switched
off as it is only Laser Class 1 which has no special safety requirements.
Single Fiber Break

OCR10G OTT OLR 2 OADM OTT OCR10G
APSD bit = 1 APSD bit = 0
APSD bit = 0
X APSD bit = 0
4 ALS 1 APSD 3 APSD 5 ALS
Fig. 2.4 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link with a Single Fibre Break between OLR and
OADM
To complete the full shutdown process of this optical section, the other connected NE in
the faulty section detects a loss of signal of the DWDM traffic and an active APSD bit
which in turn triggers an APSD of it's inline amplifier in this signal direction, and in the
counter direction. Hence it is no longer possible that high power laser light is active any-
where in this section.
As the APSD shutdown of one amplifier in a link leads to the successive loss of input
signal (LOS) detection of all other amplifiers in the forward signal direction, the end ter-
minal equipment at each end will eventually detect a LOS for it's individual channel sig-
nal and perform an Automatic Laser Shutdown (ALS) in the reverse direction. Hence the
shutdown of all individual channel transmitters is complete.
Note, that due to the individual implementation of APSD and ALS mechanisms in SUR-
PASS hiT 7550, the Line Terminal Equipment is not required to have it's own ALS mech-
anism to ensure safe optical levels in the SURPASS hiT 7550 domain. However, at the
SURPASS hiT 7550 tributary interfaces, where optical channel power levels are Class
1 only, individual channel ALS is still the responsibility of the end terminals.
Once the fibre break is repaired, and the OSC is detected again (with APSD bit set to 0
as can be seen in Fig. 2.4), all of the amplifier pumps are able to be switched on. The
synchronized Automatic Laser Restart (approx. 9 s laser on) at the 10 Gbit/s terminal
equipment provides an input signal to the first booster amplifier in the OTT which is now
ready for service, enabling all amplifiers in succession to begin carrying traffic again.
The fact that both the loss of the main traffic signal and the OSC signal is used to trigger
i the automatic power shutdown of the signal in the opposite direction ensures that in the
case of a faulty OSC connection, there is no shutdown of a live and running main traffic
signal.
24 A42022-L5936-C51-1-7618
2.3.3.2 Automatic Power Reduction

Demux surveillance takes place in OTT and OADM network elements. It includes the
supervision of all internal connections between the OLI preamplifier output and OD(A)
resp. EAM4 module inputs. In case of fault, the automatic power reduction (APR) will act
in order to keep the system running with limited power.
APR in the OTT

The APR becomes active if at least one subband connection between OLITP and OD(A)
modules fails. If an OD(A) module receives no signal from the OLITP module, the OLITP
module reduces the power to class 1M (APR).
If a signal is detected again at each OD(A) module, the OLITP module releases this
power reduction.
APR in the OADM

The EAM4 module supervises all subbands, including the subbands which are dropped
via OD(A) modules.
Every “active” OD(A) module sends an APR-telegram to its related EAM4 module in
case a subband loss is raised or cleared. The EAM4 module collects the information
from the OD(A) modules and decides (based on the currently configured channel status)
if APR has to be set or cleared.
On EAM4 modules, signals from monitor diodes for all four subbands are used to com-
pare the power level of the relevant input with the channel status of the corresponding
channel group, as they are periodically reported by the OSCT module. If the measured
power level for at least one channel group does not indicate light, where light is expected
according to the channel status (i.e. at least one of the 20 channels of one group has
the channel state OK), then an APR command is sent from the EAM4 module to force
power reduction at the corresponding OLI preamplifier module. APR is released, if the
measured input power corresponds to the expected channels again.
A42022-L5936-C51-1-7618 25
2.3.3.3 Additional APSD/APR Safety Mechanisms

It is not only breaks in the line fibre which result in the automatic power shutdown of the
OLI pumps. Additional safety mechanisms are implemented in SURPASS hiT 7550 2.05
to ensure that there is no way a user can become exposed to high power light energy.
These extra APSD mechanisms are detailed in the list below.
OLI interstage APSD Each of the three amplifier stages sensing a LOS at it's input
will go into APSD state and shutdown it's pump lasers indepen-
dently. This results in the shutdown of the optical signal in the
forward signal direction.
OLI interstage device If the input power level at the input of the 3rd EDFA stage of an
surveillance OLI module, where the DCM interstage device resides, de-
creased below a certain threshold, then the output power of the
2nd stage EDFA is reduced.
Raman Pump The Raman pump will be switched off if no OSC is received
surveillance (i. e. in case of LOS, LOF, EXC, APSD bit = 1 or OSC LOS).
The Raman pump is switched on again, if it receives the 2 MHz
spectral line from OSC and if the APSD signal from the OLI
module is cleared.
L Band amplifier OTTU: In the L band a missing signal at line preamplifier
surveillance OLITPUL triggers APSD at the booster amplifier OLITBUL.
OADMU: Like for OTTU but APSD is triggered for the OLITBUL
at the same NE side / other direction.
OLRU: In the L band a missing signal at port 1 of the line am-
plifier OLIIUL triggers APSD at the line amplifier OLIIUL. at the
same side / other direction.
The output cable of the L-band optical line amplifier is also op-
tically monitored via a duplex cable. If connection is lost the
corresponding L-band amplifier is shut down.
OLI Pump Similarly the connection between the OLI Pump modules and
surveillance the OLI modules is monitored electrically by an electrical cable
within the optical cable, and the Pump A, B or C module is shut
down if the connection is open.
Demultiplexer See Chapter 2.3.3.2.
surveillance
OLI module Equipment An equipment failure of the OLI module results in an APSD of
Defect the pump lasers on this module. In this case, no automatic re-
start of the amplifiers is allowed and therefore not performed.
After fault rectification a new link startup via software must be
performed.
26 A42022-L5936-C51-1-7618
2.3.4 Optical Performance Monitoring & Control

SURPASS hiT 7550 2.05 guarantees an exceptional level of signal performance, an
End of Life (EOL) Bit Error Rate (BER) of 10-13 (“default”) or better for all optical chan-
nels per optical link. To achieve this level of quality a certain Optical Signal to Noise Ra-
tio (OSNR) must be met, which depends on whether Forward Error Correction
(FEC/EFEC) techniques are required or not. SURPASS hiT 7550 2.05 implements nu-
merous optical configuration, control and maintenance tools to facilitate the bring up of
an optical link, and the continued smooth operation of the link during it's life-cycle. How
exactly SURPASS hiT 7550 2.05 does this is described in the following sections:
• Optimal EDFA Gain Setting and Fast Gain Control
• EDFA Output Power Control (Slow Gain Control)
• Power Equalization
• EAM4 Adjustment
• Client Signal Ageing, Drop Control, Add Channel
• Constant Pump Current Control
• Tilt Analyzer and Adjustable Filter
• ASE Correction
• Link Control Actions
• Channel Up- and Downgrade
• Optical Layer Provisioning
• Optical Layer Supervision
• Optical Performance Analyzer
2.3.4.1 Optimal EDFA Gain Setting and Fast Gain Control

Each amplifier (OLI) is designed to have an optimum gain flatness over the entire wave-
length spectrum for a particular value of total amplifier gain. Note that the gain of an am-
plifier (in dB) is just the difference between the total output power and the total input
power of the amplifier. In order to keep the EDFAs operating at a particular optimum gain
point, but meanwhile still being able to allow a wide range of span losses (up to 32 dB
without Raman amplification, and up to 40 dB with Raman amplification), a Variable Op-
tical Attenuator (VOA) between the first and second EDFA stage is used. By adjusting
this VOA, the overall optimum gain of the three EDFA stages can be set during link pro-
visioning. Adjusting the VOA also effects the tilt setting (see Chapter 2.3.4.7).
A fast digital control loop is implemented to keep this gain value constant during any type
of overall system transient behavior. This ensures that even abrupt changes in input sig-
nal power, such as caused by channel losses or return of one of the signal lasers, will
not cause optical surges in individual channels, on the contrary, the output power of
each channel remains constant.
2.3.4.2 EDFA Output Power Control (Slow Gain Control)

Based on the number of channels equipped in the DWDM system and the required
EDFA output power per channel, the total output power of an EDFA can be determined.
This total EDFA output power is kept constant via a slow output power control loop,
to compensate for degradations or fluctuations in the fibre attenuation and for ageing of
laser sources (e. g. on the OCU equipment). Hence, the physical changes in fibre prop-
erties over the years will have no influence on ongoing system performance.
If a change of the total EDFA input power is due to the addition or loss of channels, then
the value change of for the number of equipped channels causes a re-calculation of the
A42022-L5936-C51-1-7618 27
expected total output power of the EDFA. The slow output power control loop will then
start regulating the EDFA output power based on this new, calculated value.
2.3.4.3 Power Equalization

The output power of the single channel signal transmitters is expected to vary from
channel to channel by several dB, depending on manufacturer and individual variations.
Signal power equalization (PEQ) is used to achieve nearly equal power values for all
channels at the beginning of the link (at the booster input of the OTT-Tx) for a defined
power distribution at link startup. This is initialized by an element manager command
(power equalization) for the OTT-Tx.
The OSCT module requests
– the mean per channel output power from the OLITB module
– the mean insertion loss (depends on the use of interleavers in the optical path) of all
8 subbands together with the OM module of one band
– all channel input powers from the OM modules of the respective band (C or L).
Then the OSCT calculates the optimum VOA values for all present channels to get a
spectrum as flat as possible. The maximum allowed channel power deviation (gain tol-
erance) is configurable by the operator.
2.3.4.4 EAM4 Adjustment

Power levels of subbands which are connected through the EAM4 modules are adjusted
via VOAs for equal power distribution. Subbands which are terminated on OD(A) mod-
ules are not connected through the EAM4 (their EMA4 VOAs are set to minimum atten-
uation).
This link control in the OADMU is done separately for C and L band and for each direc-
tion and is started at the element manager either as
– EAM4 automatic adjustment (measured by OPA and handed over to OSCT) or as
– EAM4 manual adjustment (each four power measurements have to be done).
EAM4 adjustment can be started in linkstate running: the EAM4 module selects one
subband as reference and adjusts the EAM4 VOAs of the other subbands with respect
to the value of the reference.
The adjustment can be performed for still empty subbands, but it has to be repeated ev-
ery time a subband is populated with the first channel.
Every time an EAM4 adjustment was performed, a tilt correction cycle for this band and
direction must be started at OTT-Tx.
2.3.4.5 Client Signal Ageing, Drop Control, Add Channel

To counteract the effect of ageing client transmitters so as to have no impact on the total
DWDM link performance, SURPASS hiT 7550 2.05 continuously monitors and adjusts
the input power of each individual channel at the SURPASS hiT 7550 2.05 multiplexers.
The allowable customer input signal range is a reference value adjustable between
+2 dBm and -8 dBm (defined by the Siemens planning tool) with a tolerance window of
+/-4 dB (EOL). SURPASS hiT 7550 2.05 adjusts this value per channel by means of
Variable Optical Attenuators (VOAs) to get the optimum channel input power. Fluctua-
tions in client signal input power are regulated via decreasing or increasing the VOA set-
ting.
28 A42022-L5936-C51-1-7618
If the client signal does not meet the input range requirement this channel is excluded
from transmission and an alarm is raised at the network management system. Likewise,
if the VOA cannot be adjusted correctly to meet the optimum input channel power cal-
culated by the system.
Client signal ageing is not only controlled at the OTTU terminal sites, but also at the
OADMU add/drop interfaces. The VOAs at the Add Channel and Drop Channel inter-
faces (CAD2) also perform signal ageing/drop control to reach a particular input power
(see above) and output power (-8.8 dBm +/- 2.0 dB) window. Appropriate alarms are ac-
tivated when the client signal powers do not meet the specified ranges.
Aging and drop control is performed every two minutes in the condition “linkstate run-
ning”. During all channel affecting link control actions (i.e. preemphasis, add channel ad-
just) the aging and drop control is stopped.
2.3.4.6 Constant Pump Current Control

The output power of all laser pump sources is controlled by adjusting the respective bias
current of each laser. All on board OLI pumps, and external OLI pumps
(i. e. PUMPA/B/C), as well as Raman pumps have a constant pump current control cir-
cuit to maintain the correct pump output power. Alarms are raised if these pump currents
reach certain dangerous thresholds, ensuring the safety of the system, and the early de-
tection of faulty hardware.
The OLI pump currents are adjusted by the slow Output Power Control loop in order to
slightly change the actual amplifier gain values due to slight fluctuations in span losses.
The Raman pump currents however are always set to a fixed optimum value, hence a
constant output power of the Raman pumps is maintained.
2.3.4.7 Tilt Analyzer and Adjustable Filter

The OLI module includes an adjustable tilt filter (in the standard and extended module
versions) which is used to compensate for tilts in channel powers caused by the Stimu-
lated Raman Scattering (SRS) non-linear fibre effect, fibre spectral attenuation, DCF
SRS tilt or DCF spectral attenuation. The tilt effect in the optical signal can be viewed
with an optical spectrum analyzer as a decreasing power tilt from channels of higher fre-
quency (lower wavelength) to those of lower frequency (higher wavelength). The tilt filter
controls the optical tilt locally (Gain Tilt Control, GTC), based on measurements of the
channel powers and channel distribution at the output of the OLI.
For all OLI module types a GTC pretilt may be entered, defined by the Siemens planning
tool.
In the extended type OLI module, output parameter readings are done by a Gain Tilt
Monitor (GTM) on the module itself. The GTM continuously monitors the current optical
spectrum at the output of the extended type OLI modules. Changes in channel numbers
or mean channel powers detected by the GTM require adjustments of the tilt filter. An-
other way in which SURPASS hiT 7550 2.05 guarantees a flat output spectrum at the
end of each optical link.
In basic type OLI modules tilt settings are performed via the VOA element, because
there is no tilt filter control and no gain tilt monitor.
A42022-L5936-C51-1-7618 29
2.3.4.8 ASE Correction

The correction of the Amplified Spontaneous Emission (ASE) is the enhancement of the
required linear total output power. It is done by any OLI module in the optical path. How-
ever, a reduction of the ASE correction is required, if the ASE accumulation in the optical
path is interrupted (e.g. due to automatic power shutdown in the optical line preamplifier
of the OADM).
The reduction of the ASE correction is processed for each EDFA band separately (band
specific updates).
The accumulated ASE power is calculated by the Siemens tool and must be configured
for each OLI module in the link. The correction value or the default value is transmitted
downstream via OSC.
2.3.4.9 Link Control Actions

The Link Control of SURPASS hiT 7550 2.05 is a high sophisticated state machine.
From each particular state the system may be switched in order to perform special tasks
within the link. For example when the link is in state "running" all amplifiers are working
and the link is carrying traffic. The user only via a link control action can initiate link state
changes. The possible link control action depends on the current link state. Some state
changes are temporarily (transition link state) and other states are statically (final link
state).
This chapter describes all link control actions that can be initiated via the Network Man-
agement System (NMS). It also describes the link state transitions, which belong to the
several actions. For detailed description of how - and when to use the several link control
actions refer the chapter "standard commissioning procedures" of the ITMN.
Action Initial link state Transition link state Final link state
Forced prestart Running or prestart -- Prestart

Description
SW and HW is initiated and checked by self-tests. All lasers (excepted the OSC
lasers) are switched off.
CAUTION: This action will shut down any running link!
Power equalization Prestart Power equalization Prestart

Description
Input signal from all client lasers are equalized in terms of power. Each particular
channel power is adjusted by VOA on the multiplex side in order to achieve opti-
mum input power on the first amplifier input of the link.
Tab. 2.2 Link Control Actions
30 A42022-L5936-C51-1-7618
Link startup Prestart Startup Running

Description
It sequentially sets up all SURPASS hiT 7550 2.05 NEs in transmit direction. All
pump lasers are switched on and the EDFA target output power is set.
20% OADM:
While the link state "startup" the basic sub bands C3C4 are adjusted in terms of
power to reach optimum input power on the booster of the OADM. Attenuation of
all other sub bands is calculated relatively to these basic bands and adjusted ac-
cordingly. This procedure is only performed during the very first link startup. It is
required to run always a further "EAM4 Adjust" in order to re-adjust the sub bands
between each other with high accuracy.
NOTE: Once the sub bands on the OADM are being adjusted this particular proce-
dure for the 20% OADM is skipped automatically.
Preemphasis Running Preemphasis Running

(manual / automatic)
Description
The individual channel power is adjusted in order to achieve an optimum and bal-
anced spectrum.
The process involves measuring power and OSAR at the begin and at the end of
the optical link (Tx and Rx side) with an Optical Spectrum Analyzer (OSA) or the
optional integrated Optical Performance Analyzer (OPA) of the SURPASS hiT
7550 2.05 system.
INFO: SURPASS hiT 7550 2.05 performs preemphasis adjustments only on "ex-
press" channels.
Manual preemphasis adjust:

Supported by manual measurements with OSA, OSAR and power measurement
have to be performed for each channel at the begin and at the end of the link. The
results have manually to be entered into the system via TMN/LCT.
Automatic preemphasis adjust:

The automatic adjust requires OPA modules at both sides of the link. Measure-
ments and the following adjustments are automatically performed by the system it-
self.
Depending on the measurement values the system automatically decides between

different adjustment algorithms:
Tab. 2.2 Link Control Actions (Cont.)
A42022-L5936-C51-1-7618 31
Preemphasis OSAAR Balance is performed if only the 100 GHz grid is populated with channels
(continued) and the measured OSAR values of all express channels are 26 dB or less. In this
case each particular channel is being adjusted in order to suffer the same amount
of OSAR within the link.
However the Tx Power Balance is performed if only the 100 GHz grid is populated
with channels and the measured OSAR values of all express channels are greater
than 26 dB. In this case the transmit spectrum is being adjusted to equal power
within all channels.
As soon as at least one channel is present within the 50 GHz grid only the
Power Interpolation is performed. All power values of the express channels within
the 50 GHz grid are adjusted by interpolating the channel power between their next
adjacent 100 GHz express neighbours.
Add channel adjust Running Add channel adjust Running

(manual / auto)
Description
Channels which are added/dropped at an OTT or at an intermediate 20% OADM

are locally treated with the add channel adjust procedure at that NE where the
channel is being added. The adjustment procedure is based on the measured pow-
er spectrum at the transmitting amplifier.
Manual add channel adjust:

All channel powers of the transmit spectrum have to be measured with an external
OSA and the results have to be entered into the system via NMS/LCT.
Automatic add channel adjust:

All channel powers of the transmit spectrum are queried via the integrated Gain Tilt
Monitor (GTM) of the amplifier module and all add channels are automatically be-
ing adjusted. This procedure requires an extended type OLI module at the transmit
side since only the extended type OLI module is equipped with GTM.
Tilt adjust Running Preemphasis Running

Description
Gain and tilt values of each amplifier module will be measured and corrected to
achieve a correct and flat power spectrum at the input of the next following amplifier
within the link.
At the extended type OLI module the GTM provides power tilt data from the output
of the amplifier and sets the Gain Tilt Control (GTC) respectively the inline VOA be-
tween the first two EDFA stages.
32 A42022-L5936-C51-1-7618
Tilt adjust (continued) At the standard and the basic type OLI modules, the module itself calculates the tilt
settings from the RAMAN coefficient, from the fiber tilt parameters, and from the
current gain. It accordingly sets GTC (only standard type OLI module) and inline
VOA.
NOTE: There is no continuous tilt adjust within the amplifier modules. Tilt adjust
must always be initiated by user.
2.3.4.10 Channel Up- and Downgrade

In the linkstate running single channels can be added to or removed from transmission.
The channels can be added at OTT-Tx or OADM. In OTT-Tx, the attribute ’channel us-
age’ must be different from 'unused' as precondition for channel upgrade.
Channels which are routed directly from OTT-Tx to OTT-Rx must be configured with
channel usage express at OTT-Tx. These channels are controlled from OTT-Tx via pre-
emphasis.
Channels which can be added and / or dropped at an OADM are signalled as addDrop
channels to OTT-Tx. These channels are controlled at their local add NE via add chan-
nel adjustment.
2.3.4.11 Optical Layer Provisioning

A high degree of flexibility in the provisioning of optical parameters enables SURPASS
hiT 7550 2.05 to deliver the promised optical system performance and control in all cus-
tomer network applications.
The following parameters are user provisionable via the network management system:
– Required EDFA channel output power, depending on network dimensions, maxi-
mum number of channels, fibre type, use of FEC/EFEC, and use of Raman amplifi-
ers
– Optical OMS path and optical channel OCh inventory information
– Enabling and disabling of all pump lasers
– Configuration of client Tx input channel powers via VOA adjustment
– Configuration of Raman coefficient
– Fibre attenuation spectral tilt and ASE power
– Configurable alarm thresholds for signal degraded SD (at OLIP and OLII inputs),
input power too high PHF or too low PLF alarms (in receive direction for OM20 and
CAD2 add-port, in transmit direction for ODA20 and CAD2 drop-port),
OSC signal degrade
– Optical link management via commands such as: power equalization, optical link
startup, preemphasis.
2.3.4.12 Optical Layer Supervision

SURPASS hiT 7550 2.05 also offers the possibility of requesting all the important optical
system parameters from the Network Management System at any time. With the inclu-
sion of the Optical Performance Analyzer (OPA, see Chapter 2.3.4.13), full optical per-
formance monitoring and recording of the DWDM signal parameters is offered.
A42022-L5936-C51-1-7618 33
Without the OPA the following optical parameters are supervised:

– Input power of each individual client channel
– Current insertion loss of each channel input VOA
– Output power of each individual client channel
– Total input and output powers of each preamplifier, booster amplifier or inline ampli-
fier
– Pump currents for all OLI pump sources (on board and external) and Raman pumps
– OSC laser current for the OSC channel
– Current number of actually equipped channels in each OLR/OTT/OADM, in each di-
rection
– Current state of each amplifier's pump lasers, i. e. enabled/disabled
– Optical OMS path and optical channel Och inventory information
– Current value of tilt filter in each amplifier
– Current actual signal tilt in each amplifier
2.3.4.13 Optical Performance Analyzer

See Chapter 3.3.8 also.
The Optical Performance Analyzer (OPA) module is an integrated Optical Spectrum An-
alyzer (OSA) card which can be slotted into the SURPASS hiT 7550 2.05 subrack like
any other module. The OPA offers full optical performance monitoring features, and is
comparable to SDH/SONET performance monitoring in terms of record handling. It en-
ables the carrier to monitor the optical link to the highest level of detail and accuracy, to
help in system maintenance and fault analysis.
As well as the performance monitoring capability, the OPA may be used for optimizing
the transmission of optical signals. It is used to automate the preemphasis procedure;
for this OPA modules are required at both, the link start and the link end. OPA is also
applied to control the addition of channels at terminal and OADM sites.
When live traffic is running, the OPA samples several optical inputs and collects perfor-
mance measurement data. The number of optical input scans depends on the NE type:
• At a SURPASS hiT 7550 2.05 terminal site (OTTU), the preamplifier output and the
booster amplifier output are measured (a total of 4 interfaces when both C and L
band amplifiers are considered).
34 A42022-L5936-C51-1-7618
OLITBUL
OTTU
OLITBC
LINE
MonL2
MonC2
OPA MonC1
MonL1
OLITPC
LINE
OLITPUL
Fig. 2.5 Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points
A42022-L5936-C51-1-7618 35
• At an Optical Add/Drop Multiplexer site (OADMU), the preamplifier outputs and the
booster amplifier outputs are measured (a total of 8 interfaces when both C and L
band amplifiers, in both directions are considered). See Fig. 2.6.
OADMU OLITBUL OLITPUL
LINE LINE
OLITBC OLITPC
MonL1 MonL3
MonC1 MonC3
Side 2 MonC4 OPA MonC2 Side 1
MonL4 MonL2
OLITPC OLITBC
LINE LINE
OLITPUL OLITBUL
Fig. 2.6 Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points
36 A42022-L5936-C51-1-7618
• Four inputs are monitored in the OPA module at an Optical Line Repeater site
(OLRU): the C band and the L band in both transmission directions (corresponds to
a maximum of 320 channels) are monitored at the output of the optical inline ampli-
fiers.
OPA module and Raman amplifier use the same slot. Therefore only one of these
may be equipped.
OLRU
OLIIUL
OLIIC LINE
LINE
MonC1 MonL2
Side 1 OPA Side 2
MonL1 MonC2
OLIIC
LINE LINE
OLIIUL
Fig. 2.7 Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points
OPA is used to get optical performance information on a per channel basis.

Every 15 minutes (beginning on the hour) and every 24 hours, the following optical per-
formance data is measured and recorded:
– Minimum, average and maximum carrier power (dBm)
– Minimum, average and maximum carrier OSNR
– Minimum, average and maximum measured carrier frequency (GHz)
– Measurement sample size: The number of samples used to compute each mini-
mum, average and maximum value
– Loss of Light (LOL) count: The number of times a LOL is detected for this carrier
It is possible to request the following accumulated records:
– The current and previous 15 minute performance management records
– The current 24 hour summary as well as summaries for each of the 7 most recent
days
– The most recent eight hours, where the values are specified in 15 minute interval
records, i. e. 32 x 15 minute records
– Actual snapshots of measurement data, described above.
A42022-L5936-C51-1-7618 37
2.3.5 Optical Network Management

The Siemens Optical Telecommunication Network Management System which serves
it's complete Optical Telecommunication Product Portfolio, today and well into the fu-
ture, is called TNMS (Telecommunication Network Management System). Being a truly
recent development, the TNMS is able to offer state-of-the-art computer architecture
and graphical user interface innovations.
2.3.5.1 The Telecommunication Network Management System

The Telecommunication Network Management System (TNMS) composed of TNMS
Core and TNMS CDM (Cross Domain Manager) is the Siemens Management Solution
designed for the needs of metropolitan and regional transport networks as well as for
long distances within national or international networks. TNMS Core/CDM supports
PDH, SDH and DWDM NEs in core and backbone application scenarios as service lay-
er, network layer, and element layer management with the TMN (Telecommunications
Management Network) Model. This system can be scaled within a wide range to give
customized network management solutions. Special end-to-end connection manage-
ment procedures with automatic and manual routing over the entire network allow quick
service provisioning and monitoring in a user-friendly way.
TNMS Core can be combined optionally with TNMS CDM to manage extremely large
Siemens networks. TNMS CDM is related to the Network Layer and Service Layer,
whereas TNMS Core additionally supports the Element Layer.
Each TNMS Core can support several network servers with a maximum of about 1400
SMA 1 equivalents and more. (SMA 1 equivalent means the performance of an SDH
STM-1 add/drop multiplexer.) A TNMS CDM can support up to 20 TNMS Core Servers.
This hierarchical architecture leads to a flexible and scalable management system.
The TNMS Core/CDM supports the management of a large variety of Siemens DWDM,
PDH and SDH equipment such as:
– TransXpress Infinity MTS 1.1E and MTS-R2.03
– SURPASS hiT 7550 2.05
– SURPASS hiT 7540 (OCU) with TEX, and OCR
– Siemens PDH Access equipment (e. g. FMX / CMX V2, SRA L)
– Siemens SDH equipment; cross-connects (SXA/SXD), synchronous multiplexers
(SMA, SMA 1K, SMA 16), synchronous line equipment (SLT/D 16, SLR 16, SL64)
– Siemens Radio NEs
The TNMS-Core/CDM system is designed to run on IBM compatible PCs on
Windows 2000 Operating Systems (Microsoft Corporation).
38 A42022-L5936-C51-1-7618
2.3.5.2 Integrated Domain management

Siemens is an active member of the Telemanagement Forum (TMF), which consists of
a growing number of Telecommunication industry leaders who have defined a standard
multi-vendor NML/EML management interface, which is CORBA based. The work of the
TMF is currently being integrated into ITU standardization activities in the area of optical
telecommunication network management.
The TNMS-Multi-Vendor Management Platform (TNMS-MVM) extends the capability of
TNMS-Core/CDM to allow true Multi-Vendor interworking for Optical Telecommunica-
tion Networks, by providing a standardized CORBA Interface. This enables the operator
to manage optical telecommunication network products from several suppliers, from the
same network management platform.
A42022-L5936-C51-1-7618 39
2.3.6 Element Manager

As is standard for all Siemens Optical Networking Products, SURPASS hiT 7550 2.05
comes with an Element Manager (EM). The EM as an application program is part of the
software packet for the TNMS Craft Terminal, designed to run on IBM compatible PCs
on Windows 2000 Operating Systems (Microsoft Corporation) which can either be used
for local commissioning or maintenance operations just for one NE, or can be used for
remote commissioning or maintenance operations of a relatively small DWDM network
(approx. 50 NEs). A sample window of the SURPASS hiT 7550 2.05 Optical Terminal
OTTU is shown in Fig. 2.8.
Title bar
Menu bar
Tool bar
Module View
Message Area
Status bar
Fig. 2.8 Element Manager Main Window (Example: OTTU Network Element, Subrack 1)
40 A42022-L5936-C51-1-7618
TNMS Craft Terminal

Using the EM application program for SURPASS hiT 7550 2.05 requires the TNMS Craft
Terminal (TNMS CT). It is a transparent software platform for SDH and WDM network
elements and provides access to network elements via
– a network interface: Q interface via 10BaseT Ethernet, supports the OSI protocol
(in a later release also the TCP/IP protocol) or via
– a serial line interface: Q-F interface (RS232), supporting the TCP/IP protocol
(see Fig. 2.10 also).
TNMS CT offers two operation modes:
– the Network Craft Terminal (NCT) mode: can be used for remote login, displays a
network view of all NEs, SDH and DWDM, and their current alarm status as shown
in Fig. 2.9. Double-clicking on an NE item will open the EM application for the par-
ticular NE (i. e. a window as shown in Fig. 2.8), and thus permits the network ele-
ment to be operated and alarm lists to be displayed.
– the Local Craft Terminal (LCT) mode: serial line or Ethernet connection to NE(s). Up
to three NE windows may be displayed at a time. To show alarms of an NE, an ele-
ment manager session with this NE has to be started, selecting the option for serial
connection from the menu.
With Ethernet connection the LCT or NCT may display up to 150 NE icons.
The NCT mode offers several additional functions to the LCT mode (e. g. fault manage-
ment).
NCT and LCT modes need separate licenses and installations.
Menu bar
Tool bar
Network View
Working Area
Minimized
Windows
Status bar
Fig. 2.9 TNMS CT Graphical User Interface
A42022-L5936-C51-1-7618 41
2.3.7 Connection to Network Management Systems

SURPASS hiT 7550 2.05 provides control via Q3 interface. It supports the Q3 informa-
tion model, which describes the behavior between interface partners like OSS and an
NE. The Q3 information model uses specific management application protocols, namely
CMISE/CMIP (OSI protocols), which allow communication between the Network Man-
agement System (NMS) and an NE, via the implemented communication stacks. This is
explained more detailed in the following subsections:
• Information Models
• Communication Stacks
• Communication Interfaces
See also Chapter 3.6.
2.3.7.1 Information Models

The information model is the behavior description of a system. It shows the existing en-
tities, how they interact and how to control them. Information models are described in
formal languages. Between interface partners (like OSS and NE) they can be regarded
as communication treaty. The information models use specific management application
protocols which have to be bidirectionally transported via communication stacks from a
OSS to the NE and back. There exist several application protocols:
Q3-CMIP
The Q3 information model is based on ITU recommendations X.721 and M.3100. The
corresponding service and application protocol is CMISE/CMIP (ITU X.710/X.711). It al-
lows connection of the NE to an OSI Q3-CMISE compliant Telecommunication Manage-
ment System (OSS). The OSS may be provided by the customer.
Also the Network Control Terminal (NCT) can manage the NE via Q3-CMIP. The NCT
is a Windows PC running an application program which can be used for commissioning
and maintenance operations.The NCT PC can act as a simple Element Manager for
small clusters of NE units.
The Q3-CMIP implementation of the NE operates on top of an OSI upper-layer stack
(Marben stack) providing e. g. association/presentation and session services. Alterna-
tive lower transport layers are possible.
TL1
TL1 application is not supported in the current release.
i
Web Terminal
The Web terminal is not supported in the current release.
i
42 A42022-L5936-C51-1-7618
2.3.7.2 Communication Stacks

IP stack and dynamic routing in IP (OSPF) are not supported in the current release.
i
OSI Stack (Marben OSIAM Stack)

The Marben OSIAM stack provides the OSI/ISO upper layers (session, presentation,
ACSE) and access to/from the application (CMIP agent). The upper OSI layers can ei-
ther use transport class 4 (TP4) services based on CLNP with ES-IS and IS-IS as the
routing protocols or transport class 0 (TP0) services based on the TCP/IP stack (with IP
to NSAP address mapping).
For routing purposes of CLNP packets the ES-IS (for end system and router detection)
and IS-IS (for dynamic route detection and update) are used. Routing takes place over
the Ethernet and DCC interfaces, if so configured.
TCP/IP Stack
The TCP/IP stack for the NE is delivered with a real time operating system of the NE and
can be used directly by telnet and http or indirectly by the OSI stack by means of
RFC1006. For routing purposes either static route configuration or dynamic routing are
possible. End system (host) detection is accomplished by the ARP protocol for Ethernet.
For dynamic routing, route detection and the update of the OSPF (continuous evaluation
of route parameters) is used. Routing takes place over the Ethernet and DCC interfaces,
if so configured.
Stack Management (MCF)

The communication stacks of the NE are called message communication function
(MCF) in ITU terminology. Certain configuration and performance parameters of the
communication stacks are modeled in Q3 and can thus be managed.
For the OSI part these are parameters concerning the layers 2 (DCC, MAC), 3 (NSAP,
ES-IS, IS-IS) and 4 (TP4), for the TCP/IP part they are concerning IP (address, routing
tables), TCP (connection table) and OSPF (basic parameter set). The Q3 information
model of the TCP/IP stack parameters is aligned to the corresponding SNMP specifica-
tions as far as possible.
A42022-L5936-C51-1-7618 43
2.3.7.3 Communication Interfaces
OSS NCT/LCT
Q3 Q3 Ethernet
on Q-F Rack Alarms

COPA RS 232
on NEAP
AUI/10baseT 10baseT
High Level System Controller
DCC
PCB_2 PCB_1
CAN-bus
SPI SPI
power
LCC
LCC LCC LCC EEPROM LCC LCC

supervisor/ passive
card SMU card DCC cards SMU card
extension subrack main subrack

EOW, sV.11
dry loop contacts
Fig. 2.10 Communication Interfaces and Controller Architecture

of SURPASS hiT 7550 2.05
SURPASS hiT 7550 2.05 uses a two-level control hierarchy (see Fig. 2.10):
– A high level system controller, which serves as gateway for the system, implements
the MCF function, the Q3 stacks and the Q3 agent. It performs the complete pro-
cessing of the Q3 object model and supports the central system functions.
– A low-level card controller (LCC) on each active card which performs the necessary
on-card functions. In extension subracks, a shelf management unit (SMU) – as a
simple LCC – provides limited supervision for the subrack. Passive cards
(e. g. OMDxx, SAB(M), MIBS, UDCM modules) do not have an LCC, they are
equipped with an EEPROM with inventory data stored on it.
TMN Control Synopsis

Fig. 2.11 shows a condensed view of the supported stack profiles. In the following sub-
sections an overview of the communication stack profiles supported at the communica-
tion interfaces is given.
In Fig. 2.11 a complete overview of the stack profiles is given. In Fig. 2.12 an overview
is given, which information models (interface dialects) are supported at which physical
interface. The complete stack profiles for the interfaces are shown in the following sub-
sections describing the physical interfaces.
44 A42022-L5936-C51-1-7618
Other Web/ TL1

IP Java CMIP agent (DSET)
applic. agent agent application
debug
SMTP ACSE
Presentation
Session
Transport TP0 Transport TP4
http telnet RFC1006 access

UDP TCP TCP TCP
TCP/IP socket interface

IP CLNP
Static and/or OSPF ES-IS IS-IS
routing routing
PPP DCC Ethernet Ethernet LAPD

NI Network Interface (NI) NI access access
with PPP framing
LAPD
streams
driver
IP mode dual mode dual mode

asynchronous PPP (streams multiplex)
RS-232 ETHERNET DCC (HDLC)
driver driver driver
Fig. 2.11 Synopsis of Applications, Communication Stacks and Interfaces
A42022-L5936-C51-1-7618 45
TNMS or
NCT
B3 (10BaseT, Ethernet)
Q3, CMIP (CLNP, OSI)
Q3, CMIP (TCP/IP)
TL1 (TCP/IP)
NE NE
DCC (OSC)
SURPASS hiT SURPASS hiT
7550 2.05 7550 2.05
F (RS-232 / V.24)
Q3, CMIP (TCP/IP over PPP)
TL1 (TCP/IP)
Q3, CMIP (CLNP, OSI)
Q3, CMIP (TCP/IP)
TL1 (TCP/IP)
LCT
Fig. 2.12 Information Model of the Physical Interfaces
That because of compatibility to existing OSI networks a switch in DCC exists to decide
i whether only OSI, OSI and TCP/IP or only TCP/IP packages are transported. Depend-
ing on that switch the according packages can be transported and routed in the DCC.
Ethernet (B3) Interface

See Fig. 2.10 and Fig. 2.12.
The Ethernet interface provides for management purposes control of the NE by multiple
Q3 managers (e. g. an OSS and an NCT) and the above mentioned application proto-
cols. The Ethernet interface is provided via 10BaseT. The 10BaseT interface provides
a point-to-point connection usually to a hub/switch, which in turn realizes the logical
broadcast network topology.
OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP packets can be distinguished by
the use of different frame types with a dual mode driver.
Extension Ethernet Interface

An additional Ethernet interface is provided (10BaseT or 100BaseT; the HW supports
both). It is located at the Network Element Alarm Panel (NEAP).
For the current release the extension ethernet interface is not activated.
i
RS-232/V.24 (F) Interface
The F-interface provides for management control of the NE from a PC-based Local Craft
Terminal (LCT) using a simple point to point (PPP) RS-232/V.24 interface. PPP serves
as the data link (layer 2) protocol and is directly being used by the TCP/IP stack. Besides
46 A42022-L5936-C51-1-7618
the IP based applications (TL1, Web Terminal) Q3-CMIP management is possible via
RFC1006. Control of remote NEs however is not possible, as data packets from this in-
terface are not routed.
DCC Interfaces
The data communication channels (DCC) are HDLC type serial channels embedded in
the fiber optical signal(s) used for TMN purposes and separate from the payload. The
supervisory channel SC provides a number of independent serial interfaces for the
transmission of DCC bytes. Four DCC channels are supported by the NE: 2 DCCRo and
2 DCCMo.
The data link protocol (layer 2) is LAPD (in unacknowledged mode) for OSI layer 3 pro-
tocols (CLNP, ES-IS and IS-IS). IP packets are framed according to PPP. No other fea-
tures of PPP are used. With a dual mode driver the packets can be distinguished and
handed over to the corresponding stack. The mode of operation (inactive, OSI only, IP
only, OSI and IP combined) can be specified by management and should be in accor-
dance with the mode of the NE at the remote end of the DCC line.
Routing
In a communication network an NE does not only has to care for the information ad-
dressed to himself but also has to forward information. For this so called Routing two
protocols are supported depending on the transport protocol that is supported in the
used stack profile. For OSI-stack the ES-IS, IS-IS protocol is used. For TCP/IP stack the
OSPF protocol is used, see Fig. 2.11.
It is not possible to route packages between these 2 protocols, i. e. not gateway func-
tionality is provided. E. g. it is not possible to receive IP packages on Ethernet and route
them as OSI packages to 7 layer OSI DCC.
However it is possible to route OSI packages via ES-IS, IS-IS from Ethernet to DCC and
vice versa as well as it is possible to route IP packages via OSPF from Ethernet to DCC
and vice versa. Of course it is possible to “terminate” routing by providing packages to
upper-layers of Network Element itself (OSI or IP packages).
The current release supports OSI stack routing.
i
2.3.8 EOW Interface

The engineering orderwire (EOW) interface can be used to make a telephone connec-
tion or conference from one NE to other NEs via handset.
The realized interfaces on the OSCTU module are:
– two external 4-wire-interfaces or
– one external 4-wire-interface and one 4-wire-interface for the handset with selective
call
The first external 4-wire-interface resp. the 4-wire-interface for the handset can only be
used alternatively and not at the same time (4-wire interface #1 is permanently used for
the handset).
4- wire interconnection is possible via a distance of up to 10 m to other NEs. So it is pos-
sible to use only one handset in a location with more than one NE and to have telephone
connections between these systems.
A42022-L5936-C51-1-7618 47
The EOW channel is mapped to the frame of the optical supervisory channel via the E0-
or F0-byte (selected via SW). Coding/decoding the EOW channel is configurable for A-
law (ETSI) or µ-law (ANSI).
The complete EOW-IF is enabled or disabled by configuration. Disabled means all
i E0/F0 bytes are passed through, no access is possible. Normally OLR and OADM pass
through the E0/F0 bytes and OTT terminates them.
When the handset is "off hook" or the speech control detects an incoming speech signal
on the 4-wire-interface, the E0/F0 bytes are connected to the EOW interface inside the
OSCTU module.
A 400 Hz ring tone generator and a dual tone multi frequency (DTMF) dialling receiver
are permanently connected to the EOW conference.
The DTMF receiver is always reading both direction lines and the handset interface for
a DTMF-signal. The DTMF generator is part of the handset.
A whistler is applied to indicate the conference status.
Support is provided for
– collective call
– group call
– selective call via a configurable 3-digit (each digit = 0 to 9) telephone number; only
selective calls activate an audible tone generator.
In protection DWDM links, a ring manager in one of the OTTs is used to prevent EOW
loops. It will only become active for a protection event.
See also technical data in the Chapter "7.7 External Interfaces".
2.3.9 User Data Channels (sV.11)

These channels are used for bidirectional sV.11 (s= similar) connections between NEs
up to a distance of about 1000 meters.
There are two sV.11 interfaces with a data rate of 64 kbit/s on each OSCTU module (per
network element). Each interface can be configured to access one of the optical service
channel (OSC) bytes F0 or NU1 or NU2. In the OTT these bytes are terminated, in the
OLR and OADM they are terminated or passed through (from OSC B to OSC A, mean-
ing from side 1 to side 2).
In OTT a user data channel of OSC A can be connected to sV.11 #1 or sV.11#2. In OLR
and OADM a user data channel of OSC A and/or OSC B can be connected to sV.11 #1
or sV.11#2 or can be passed through.
Codirectional Tx timing (data out, clock out) and contra directional Rx timing (data in,
clock out) is applied, both derived from Tx of the optical service channel clock A.
48 A42022-L5936-C51-1-7618
2.3.10 Telemetry Interface (TIF)

TIF input monitors and output relay contacts are intended to be used for traditional user-
defined “housekeeping” purposes.
For example, the inputs (sensors) are usually configured to activate upon the occur-
rence of particular events at the site (fire alarm, over-temperature alarm, door-open
alarm, etc.). A TIF input supervises the (negative) input voltage against ground. Activa-
tion of an input is reported by the NE as an alarm.
Similarly, the outputs (actors) are normally employed to provide remote control of vari-
ous devices at the site. A TIF output is realized with a relay contact switching between
TIF output and TIF common. Such an (intentional) issued open/close command to an
output is not considered an alarm.
An inactive TIF output is open (high impedance state), an active output is shorted to TIF
common (low impedance state).
TIF circuits must be powered by circuits that meet SELV (Safety Extra Low Voltage) lim-
its according to Standards UL 1950, VDE 0100-410, and DIN EN 60950.
☞ For further information, see the Operator Guidelines (OGL) and the Online Help.
A42022-L5936-C51-1-7618 49
2.3.11 Overview of System Benefits

The SURPASS hiT 7550 2.05 system provides the following benefits:
Maximum Fibre Utilization Transport capacities of up to 1.6 Tbit/s (160 x 10 Gbit/s)

per fibre, upgradeable in a further release to higher bit
rates, make SURPASS hiT 7550 2.05 a leader in ultra high
capacity systems.
Extended Reach Ultra-high performance optical amplifiers, optional Raman

amplification and Forward Error Correction (FEC) as well
as Enhanced Forward Error Correction (EFEC) for highest
available span performance values. Future releases mov-
ing into Ultra Long Haul (ULH) dimensions of thousands of
kilometers of pure optical transmission.
Modularity From 1 (2 for light EDFA) to 80 channels for C band (and

in a later release: additionally from 2 to 80 channels for
L band), in 20 channel increments, minimizes initial invest-
ment costs.
Lower Network Costs High system performance reduces the number of costly
electrical regenerator sites and optical amplifier sites.
Scalability Everything in SURPASS hiT 7550 is scalable, from the op-

tical amplifier performance (via external pump modules),
scalable multiplexer/demultiplexer concept, to the re-
quired number of terminal or add/drop channels.
Compactness High equipment density results in the most compact

DWDM solution including all interfaces. Up to 640 Gbit/s in
a single 7-foot bay (assuming each 16 transponders
10 Gbit/s in 2+2 subracks of back-to-back racks) using
space-efficient wavelength transponders.
Simplified Network Design Reduced amount of equipment and module variants re-
quired reduces support and maintenance costs.
Sophisticated Optical SURPASS hiT 7550 2.05 employs numerous techniques

Control to ensure the quality of the end signal; dynamic gain and
output power control to adjust for gain and power fluctua-
tions, spectral gain control to adjust for gain tilt variations
(particularly Raman Gain Tilt variations), end-to-end pre-
emphasis for fine tuning of channel OSNR and power vari-
ations, integrated ASE filter, gain flattening filter and tilt-
able filter, to name but just a few.
Fibre Type Flexibility Suitable for operation with all major fibre types, i. e. SSMF,
NZDSF and DSF. Integrated dispersion compensation tai-
lored for each fibre's requirements.
On special request: Standalone L Band application de-
signed specifically for DSF networks.
50 A42022-L5936-C51-1-7618
OADM Flexibility Sophisticated SURPASS hiT 7550 2.05 OADM solutions

with remote add/drop configurability up to 100%. Solutions
are tailored according to customers current and foresee-
able traffic requirements at a particular site and are scal-
able from 1 to 32 add/drop channels (in the 20% OADM)
or from 1 to 160 add/drop channels (in the 100% OADM
for C+L band).
Service Flexibility Almost all services are supported by SURPASS hiT 7550
2.05 and the SURPASS hiT 7540 (OCU) due to the inher-
ent transparency of the DWDM system and the transpar-
ency built-in to the transponders. Therefore a carrier is
flexible to meet all customer requirements, be it SDH/SO-
NET or IP/ATM based services.
Integrated Solutions Fully integrated DWDM solutions in conjunction with:

− Siemens 2.5 Gbit/s SDH line systems (SL16, SLR16,
WTTR)
− Siemens 10 Gbit/s SDH line systems (SL64),
− 10 Gbit/s TDM 'thin' multiplexing transponder (TEX)
cards, which combine 4 x 2.5 Gbit/s signals into one
10 Gbit/s signal, thereby increasing fibre optimization.
The TEX module is housed and managed within the
subrack of SURPASS hiT 7540 (OCU)
- Sycamore OEM Cross Connect SN16000
Multi-vendor Solutions Via the SURPASS hiT 7540 (OCU) 10 Gbit/s transponder,
your legacy 10 Gbit/s terminal equipment can be inter-
faced to SURPASS hiT 7550 2.05. The 10 Gbit/s tran-
sponder transmitting lasers are wavelength tunable for
reduced spare log.
Optical Performance Built-in enhanced optical monitoring capability.

Analyzer
Survivability Against fibre or equipment outages is possible with the

OSN Optical Channel Protection Unit (OCP) which pro-
vides 1+1 optical protection switching per channel.
Network Management As with all Siemens optical networking products,

SURPASS hiT 7550 2.05 is managed via the Transport
Network Management System (TNMS), using the latest in
architecture technology for the most advanced network
management solution. For maintenance and small to me-
dium network purposes each product may also be man-
aged via Element Manager (EM).
Evolution The SURPASS hiT 7550 2.05 platform is already 'future

proof' for next generation ultra-high capacity networks,
and is set to expand with Ultra Long Haul (ULH) capability.
A42022-L5936-C51-1-7618 51
52 A42022-L5936-C51-1-7618
3 Functionality
This chapter describes the SURPASS hiT 7550 2.05 functionality. The chapter consists
of the following sections:
• Frequency/Wavelength Bands
• Functional Overview of the NE Types
• Functional Overview of the Modules
• Synchronization
• Control and Monitoring via the Element Manager
• Control and Monitoring via Network Management System
3.1 Frequency/Wavelength Bands

Remember: although described below the current release makes no use of the L band!
i
3.1.1 “C” and “L” Wavelength Bands

The SURPASS hiT 7550 2.05 system uses a maximum of 160 wavelengths, divided into
groups (see Fig. 3.1 and Fig. 3.2). Half of the wavelengths (i. e., 80 of them) are in the
"C" (Conventional) band. The other 80 are in the "L" (Long) band.
196.1 THz 191.7 THz 190.9 THz 186.5 THz

1528.77 nm 1563.86 nm 1570.41 nm 1607.46 nm
C12 C C34 L12 L L34

C56 C78 L56 L78
C band L band
C1 C2 C3 C4 L1 L2 L3 L4
C5 C6 C7 C8 L5 L6 L7 L8
Fig. 3.1 SURPASS hiT 7550 2.05 Wavelength Plan

As shown in Tab. 3.1 and Tab. 3.2, the "C" band consists of:
– 40 "Blue" (shorter) wavelengths, spaced at 50 GHz
– an unused gap of approximately 4 nm
– 40 "Red" (longer) wavelengths, also spaced at 50 GHz.
Similarly (see Tab. 3.3 and Tab. 3.4), the "L" band consists of:
– 40 "Blue" (shorter) wavelengths, spaced at 50 GHz
– an unused gap of approximately 4 nm
– 40 "Red" (longer) wavelengths, also spaced at 50 GHz.
Note:
The last column in Tab. 3.1 to Tab. 3.4 shows the wavelength upgrade order. This is
the order to be considered if new channels are to be added to the C band (or L band) in
A42022-L5936-C51-1-7618 53
case no 100% OADMs are used. Else the upgrade sequence also depends on the traffic
matrix including add/drop channels.
3.1.1.1 40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6)
Frequency Wavelength Sub-band Channel Number Add/Drop Channel Upgrade

(THz) (nm) Order in C band
196.10 1528.77 C1 1 40
196.05 1529.16 C5 2 80
196.00 1529.55 C1 3 39
195.95 1529.94 C5 4 79
195.90 1530.33 C1 5 38
195.85 1530.72 C5 6 78
195.80 1531.11 C1 7 CAD2C1C1 37
195.75 1531.50 C5 8 CAD2C5C5 77
195.70 1531.89 C1 9 36
195.65 1532.29 C5 10 76
195.60 1532.68 C1 11 35
195.55 1533.07 C5 12 75
195.50 1533.46 C1 13 CAD2C1C1 34
195.45 1533.85 C5 14 CAD2C5C5 74
195.40 1534.25 C1 15 33
195.35 1534.64 C5 16 73
195.30 1535.03 C1 17 32
195.25 1535.43 C5 18 72
195.20 1535.82 C1 19 CAD2C1C2 31
195.15 1536.21 C5 20 CAD2C5C6 71
195.10 1536.61 C2 21 CAD2BC2C2 30
195.05 1537.00 C6 22 CAD2BC6C6 70
195.00 1537.39 C2 23 CAD2BC2C2 29
194.95 1537.79 C6 24 CAD2BC6C6 69
194.90 1538.18 C2 25 CAD2C1C2 28
194.85 1538.58 C6 26 CAD2C5C6 68
194.80 1538.97 C2 27 27
194.75 1539.37 C6 28 67
194.70 1539.76 C2 29 23
194.65 1540.16 C6 30 66
194.60 1540.55 C2 31 CAD2C2C2 25
194.55 1540.95 C6 32 CAD2C6C6 65
194.50 1541.35 C2 33 22
194.45 1541.74 C6 34 62
194.40 1542.14 C2 35 24
194.35 1542.54 C6 36 64
194.30 1542.93 C2 37 CAD2C2C2 26
194.25 1543.33 C6 38 CAD2C6C6 63
194.20 1543.73 C2 39 21
194.15 1544.12 C6 40 61
194.10 1544.52 sub-band limit
194.05 1544.92 not used
194.00 1545.32 not used
193.95 1545.72 not used
193.90 1546.12 not used
193.85 1546.51 not used
193.80 1546.91 not used
193.75 1547.31 not used
Tab. 3.1 40 Blue Wavelengths in the "C" (Conventional) Band
54 A42022-L5936-C51-1-7618
3.1.1.2 40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8)

(THz) (nm) Order in C band
193.65 1548.11 C7 41 41
193.60 1548.51 C3 42 1
193.55 1548.91 C7 43 CAD2C7C7 44
193.50 1549.31 C3 44 CAD2C3C3 4
193.45 1549.71 C7 45 45
193.40 1550.11 C3 46 5
193.35 1550.51 C7 47 43
193.30 1550.91 C3 48 3
193.25 1551.32 C7 49 CAD2C7C7 46
193.20 1551.72 C3 50 CAD2C3C3 6
193.15 1552.12 C7 51 47
193.10 1552.52 C3 52 7
193.05 1552.92 C7 53 48
193.00 1553.33 C3 54 8
192.95 1553.73 C7 55 CAD2C7C8 49
192.90 1554.13 C3 56 CAD2C3C4 9
192.85 1554.53 C7 57 CAD2BC7C7 50
192.80 1554.94 C3 58 CAD2BC3C3 10
192.75 1555.34 C7 59 CAD2BC7C7 51
192.70 1555.74 C3 60 CAD2BC3C3 11
192.65 1556.15 C8 61 CAD2C7C8 52
192.60 1556.55 C4 62 CAD2C3C4 12
192.55 1556.96 C8 63 53
192.50 1557.36 C4 64 13
192.45 1557.76 C8 65 54
192.40 1558.17 C4 66 14
192.35 1558.57 C8 67 CAD2C8C8 55
192.30 1558.98 C4 68 CAD2C4C4 15
192.25 1559.39 C8 69 56
192.20 1559.79 C4 70 16
192.15 1560.20 C8 71 57
192.10 1560.60 C4 72 17
192.05 1561.01 C8 73 CAD2C8C8 58
192.00 1561.42 C4 74 CAD2C4C4 18
191.95 1561.82 C8 75 59
191.90 1562.23 C4 76 19
191.85 1562.64 C8 77 42
191.80 1563.04 C4 78 2
191.75 1563.45 C8 79 60
191.70 1563.86 C4 80 20
Tab. 3.2 40 Red Wavelengths in the "C" (Conventional) Band
3.1.1.3 40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6)

(THz) (nm) Order in L band
190.90 1570.41 L1 81 20
190.85 1570.82 L5 82 60
190.80 1571.24 L1 83 2
190.75 1571.65 L5 84 42
Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band
A42022-L5936-C51-1-7618 55

190.70 1572.06 L1 85 19
190.65 1572.47 L5 86 59
190.60 1572.88 L1 87 CAD2L1L1 18
190.55 1573.30 L5 88 CAD2L5L5 58
190.50 1573.71 L1 89 17
190.45 1574.12 L5 90 57
190.40 1574.54 L1 91 16
190.35 1574.95 L5 92 56
190.30 1575.36 L1 93 CAD2L1L1 15
190.25 1575.78 L5 94 CAD2L5L5 55
190.20 1576.19 L1 95 14
190.15 1576.61 L5 96 54
190.10 1577.02 L1 97 13
190.05 1577.44 L5 98 53
190.00 1577.85 L1 99 CAD2L1L2 12
189.95 1578.27 L5 100 CAD2L5L6 52
189.90 1578.68 L2 101 CAD2BL2L2 11
189.85 1579.10 L6 102 CAD2BL6L6 51
189.80 1579.51 L2 103 CAD2BL2L2 10
189.75 1579.93 L6 104 CAD2BL6L6 50
189.70 1580.35 L2 105 CAD2L1L2 9
189.65 1580.76 L6 106 CAD2L5L6 49
189.60 1581.18 L2 107 8
189.55 1581.60 L6 108 48
189.50 1582.01 L2 109 7
189.45 1582.43 L6 110 47
189.40 1582.85 L2 111 CAD2L2L2 6
189.35 1583.27 L6 112 CAD2L6L6 46
189.30 1583.69 L2 113 3
189.25 1584.10 L6 114 43
189.20 1584.52 L2 115 5
189.15 1584.94 L6 116 45
189.10 1585.36 L2 117 CAD2L2L2 4
189.05 1585.78 L6 118 CAD2L6L6 44
189.00 1586.20 L2 119 1
188.95 1586.62 L6 120 41
188.85 1587.46 not used
188.80 1587.88 not used
188.75 1588.30 not used
188.70 1588.72 not used
188.65 1589.14 not used
188.60 1589.56 not used
188.55 1589.99 not used
Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band (Cont.)
56 A42022-L5936-C51-1-7618
3.1.1.4 40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8)

188.45 1590.83 L7 121 61
188.40 1591.25 L3 122 21
188.35 1591.67 L7 123 CAD2L7L7 63
188.30 1592.10 L3 124 CAD2L3L3 26
188.25 1592.52 L7 125 64
188.20 1592.94 L3 126 24
188.15 1593.37 L7 127 62
188.10 1593.79 L3 128 22
188.05 1594.21 L7 129 CAD2L7L7 65
188.00 1594.64 L3 130 CAD2L3L3 25
187.95 1595.06 L7 131 66
187.90 1595.49 L3 132 23
187.85 1595.91 L7 133 67
187.80 1596.34 L3 134 27
187.75 1596.76 L7 135 CAD2L7L8 68
187.70 1597.19 L3 136 CAD2L3L4 28
187.65 1597.61 L7 137 CAD2BL7L7 69
187.60 1598.04 L3 138 CAD2BL3L3 29
187.55 1598.46 L7 139 CAD2BL7L7 70
187.50 1598.89 L3 140 CAD2BL3L3 30
187.45 1599.32 L8 141 CAD2L7L8 71
187.40 1599.74 L4 142 CAD2L3L4 31
187.35 1600.17 L8 143 72
187.30 1600.60 L4 144 32
187.25 1601.02 L8 145 73
187.20 1601.45 L4 146 33
187.15 1601.88 L8 147 CAD2L8L8 74
187.10 1602.31 L4 148 CAD2L4L4 34
187.05 1602.74 L8 149 75
187.00 1603.16 L4 150 35
186.95 1603.59 L8 151 76
186.90 1604.02 L4 152 36
186.85 1604.45 L8 153 CAD2L8L8 77
186.80 1604.88 L4 154 CAD2L4L4 37
186.75 1605.31 L8 155 78
186.70 1605.74 L4 156 38
186.65 1606.17 L8 157 79
186.60 1606.60 L4 158 39
186.55 1607.03 L8 159 80
186.50 1607.46 L4 160 40
Tab. 3.4 40 Red Wavelengths in the "L" (Long) Band
3.1.2 Interleaver Devices

Each wavelength band (Blue C band, Red C band, Blue L band and Red L band) con-
sists of 40 channels spaced at 50 GHz. In the demux direction, an interleaver separates
a 40-channel band into two 20-channel bands, each with 100 GHz spacing
(see Fig. 3.2). In other words, the interleaver separates all the "even numbered" chan-
nels and places them on one fiber and all the "odd numbered" channels and places them
on another fiber. Now, the wavelengths are far enough apart (100 GHz) to use thin-film
filter devices to completely demultiplex these 20-channel sub-bands into the individual
A42022-L5936-C51-1-7618 57
wavelengths. This is achieved by the various "OD20" plug-in cards (OD20C1C2,

OD20C3C4, OD20L1L2, etc.)
Everything operates in reverse for the mux direction. Individual wavelengths spaced at
100 GHz are input to the proper OM20 plug-in cards, each of which mux together up to
20 wavelengths, and places them all on one fiber. Two such fibers (each carrying 20
wavelengths at 100 GHz spacing) are routed to an interleaver. The interleaver "weaves
together" these wavelengths, placing all 40 wavelengths (with 50 GHz spacing) onto one
fiber.
The interleavers make use of Mach-Zehnder interferometer technology. In this design,
an unequal fiber path length between two 3 dB couplers creates the interference. By
carefully controlling the path length difference, the channel spacing can be set to the de-
sired value. Because of the all-fiber design, this technology has very low loss, low dis-
persion, and small polarization-dependent effects.
58 A42022-L5936-C51-1-7618
"C" (Conventional) Band "L" (Long) Band

1528.77 nm to 1563.86 nm 1570.41 nm to 1607.46 nm
196.10 THz to 191.70 THz 190.90 THz to 186.50 THz
The 80 C band wavelengths The 80 L band wavelengths

are in two groups of 40: are in two groups of 40:
the "Blue" C band and the "Blue" L band and
the "Red" C band, both the "Red" L band, both
spaced at 50 GHz. spaced at 50 GHz.
40 Blue C band wavelengths 40 Red C band wavelengths 40 Blue L band wavelengths 40 Red L band wavelengths
spaced at 50 GHz spaced at 50 GHz spaced at 50 GHz spaced at 50 GHz
1 52 8.77 n m
gap gap gap

1 54 4.13 n m
1 54 8.11 nm
1 57 0.41 n m
1 58 6.62 n m
1 59 0.83 n m
15 63 .8 6 n m
16 07 .4 6 n m
C 1, C 2, C 5, and C 6
C 3, C 4, C 7, and C 8
L1, L2, L5, and L6
L3, L4, L7, and L8

su b -b a n d s
su b -b a n d s
su b -b a n d s
su b -b a n d s
50/100 GHz 50/100 GHz 50/100 GHz 50/100 GHz
Interleaver Interleaver Interleaver Interleaver
C1 / C2
C5 / C6
C3 / C4
C7 / C8
L1 / L2
L5 / L6
L3 / L4
L7 / L8
The 40 Blue C band The 40 Red C band The 40 Blue L band The 40 Red L band
wavelengths consist wavelengths consist wavelengths consist wavelengths consist
of 4 sub-bands, each of 4 sub-bands, each of 4 sub-bands, each of 4 sub-bands, each
at 100 GHz spacing. at 100 GHz spacing. at 100 GHz spacing. at 100 GHz spacing.
C1 C2 C3 C4 L1 L2 L3 L4
C5 C6 C7 C8 L5 L6 L7 L8
The transition from 100-GHz spaced sub-bands to 50-GHz spaced sub-bands (and vice-versa) is
accomplished via Interleaver devices.
Fig. 3.2 ’SURPASS hiT 7550 2.05’ Wavelength Bands and Sub-Bands
A42022-L5936-C51-1-7618 59
3.2 Functional Overview of the NE Types

There are four SURPASS hiT 7550 2.05 NE types:
– SURPASS hiT 7550 2.05 Optical Transport Terminal Unidirectional (OTTU) for
160 channel DWDM capability; all channels are multiplexed or demultiplexed and
preemphasis is terminated at OTTU
– SURPASS hiT 7550 2.05 Optical inLine Repeater Unidirectional (OLRU), provid-
ing powerful inline amplification of 160 channels - up to 160 per wavelength per fibre
in a unidirectional, two-fibre configuration (3.2 Tbit/s total bandwidth)
– SURPASS hiT 7550 2.05 Optical Add/Drop Multiplexer Unidirectional (OADMU)
which permits the extraction and insertion of channels at intermediate line amplifier
sites.
– SURPASS hiT 7550 2.05 Channel Connection Unit (CCU), an NE with amplifi-
er/switch modules OCA/OCAS (C band only), and pure switch modules OCS for in-
terconnection (express channel or add/drop of traffic)
“Unidirectional” in the NE type description, e. g. OLRU, refers to the fact that two fibres
i are used for the optical transmission between SURPASS hiT 7550 2.05 NEs. One fibre
carries the signals of one direction, and the other fibre carries the signals for the counter
direction, hence allowing the transmission of several (up to 160) bi-directional channels
over two fibres. This nomenclature is used to distinguish the system from other DWDM
systems which transmit both signal directions on one optical fibre.
3.2.1 OTT(U)
The choice and structure of the optical multiplexing technology for the ’SURPASS hiT
7550 2.05’ Optical Transport Terminal Unidirectional (OTTU) takes several factors into
consideration, such as the channel granularity requirements, the reliability of the tech-
nology, modularity and subsequent upgradability, and the ability of supporting the use
of subband dispersion compensation schemes.
SURPASS hiT 7550 2.05 supports 160 wavelengths of the 50 GHz ITU-T G.692 wave-
length grid.
3.2.1.1 Optical Path

As an example Fig. 3.3 shows the optical path through the OTTU (C band, upgradable
to C+L band).
The OTTU uses OM / OD20 modules, subband filters and interleavers.
For standalone C band OTTU simply replace OLITBC by OLITBNC, OLITPC by OLIT-
PNC modules. For standalone L band OTTU replace all C band modules by respective
L band types and omit upgrade section.
The preamplifier OLITP may be supported by Pump A/B/C modules or alternatively by
RPUMP modules.
If an Optical Performance Analyzer module OPA (not shown in Fig. 3.3) is applied (only
one of these, OPA or RPUMP module may be equipped), up to four monitoring inputs
are used: in transmit direction (after the booster), 80 channels in C band (and 80 chan-
nels in L band) are connected to a 3 dB coupler input into the OPA. In receive direction
also 80 channels in C Band (and 80 channels in L band) after the preamplifier are con-
nected to a 3 dB coupler input into the OPA. One OPA monitors 320 channels, to get
optical performance information on a per channel basis.
An OSCTUT module terminates and processes the OSC.
60 A42022-L5936-C51-1-7618
Configurable channel input power ranges enable the interconnection of OTTUs from de-
mux (ODA) to mux via OCA or OCAS modules in between (see also 3.2.3.3).
OM20x/OD20x
Mux/Demux
Interleaver
OMD2IC
C band red/blue filter
OMDFIC
Optical line amplifier modules OLITPC + OLITBC,
and opt. service channel module OSCTUT

dispersion compensation modules UDCM
with several pump modules,
Fig. 3.3 OTTU, Optical Path Structure for C Band

(Upgradable to C+L Band)
A42022-L5936-C51-1-7618 61
3.2.1.2 Four Stage Design from 1 to 160 Channels

The multiplexing architecture supported by SURPASS hiT 7550 2.05 is based on band
separation filters, frequency interleavers, and dielectric multiplexer/demultiplexer filters.
The four stages of demultiplexing a 160 channel DWDM signal into 160 individual client
signals are described as follows and represented graphically in Fig. 3.4.
1. A C/L Band separation filter is used to split the co-directional C and L Band wave-
lengths into two separate C and L wavelength bands. Each of these bands consists
of 80 channels with 50 GHz spacing.
2. Red/Blue band separation filters are used to split the C Band in half (for simplification
only the C Band is looked at). For example, the 80 Channel C Band wavelengths are
split into the C-Red Band and C-Blue Band, each with 40 wavelengths.
3. A 50 GHz period device called an interleaver is required per Red/Blue C Band. The
interleaver has two sub-band outputs, and every second wavelength is filtered to the
first sub-band output, the remaining wavelengths to the second sub-band output.
This has the effect of doubling the wavelength frequency, so all wavelengths are now
spaced at 100 GHz. Each sub-band consists of 20 wavelengths with 100 GHz spac-
ing, and the pair of sub-bands is frequency shifted by 50 GHz. Note that in the
C Band this results in 4 sub-bands of 20 channels, two blue and two red bands.
4. Finally, a 100 GHz dielectric filter separates the 20 channel sub-band into the indi-
vidual 20 channels. This stable technology was chosen to provide the lowest cost
per channel.
62 A42022-L5936-C51-1-7618
Stage 1 Stage 2 Stage 3 Stage 4

C band / L band Blue / Red Interleavers 100 GHz
Filter Filter Dielectric
Mux/Demux
20 Blue C-band channels
Mux/Demux
spaced at 100 GHz Ch
interleaver
1 - 20
40 Blue C band channels
spaced at 50 GHz
20 Blue C-band channels
C-band red / blue filter
Mux/Demux
21 - 40
80 channels C-band
spaced at 50 GHz
20 Red C-band channels
Mux/Demux
interleaver
41 - 60
spaced at 50 GHz
Mux/Demux
C+L bands C 61 - 80
at 50 GHz L
80 channels L-band
spaced at 50 GHz
Same 4-stage structure for L-band mux/demux.

L-band channels are numbered 81 - 160.
Fig. 3.4 Block Diagram of C Band ’SURPASS hiT 7550 2.05’

Multiplexer Architecture Scheme
The same concept applies in the reverse direction when multiplexing one channel into
a 160 channel DWDM signal. If only either the C Band or the L Band have been imple-
mented, there is a maximum capacity of 80 channels, and the C/L Band filter stage can
be bypassed. It is also possible to eliminate the need for the third multiplexing stage, the
interleaver devices, if only 100 GHz spacing is required, a substantial cost saving.
3.2.1.3 Multiplexer Modularity

The multiplexing architecture described above and the hardware components which im-
plement this architecture lend itself to modularity benefits, which allow the customer to
optimize his equipping requirements. In summary:
– The decision for a maximum number of 40 or 80 channels per C or L Band. For 40
channels only, the optical interleaver devices are not necessary, reducing equipment
costs and enabling longer optical transmission distances.
– The decision for a maximum number of 80 or 160 channels for combined C & L Band
applications. For 80 channels only (40 + 40, C & L combined applications), the opti-
A42022-L5936-C51-1-7618 63
cal interleaver devices are not necessary, reducing equipment costs and enabling
longer optical transmission distances.
– For every 20 channels, a new 20 channel multiplexer/demultiplexer pair is required.
– The access points between the red/blue filters and the interleaver devices allow a
sophisticated dispersion compensation concept, including sub-band filters and
slope varying filters, to improve system performance.
3.2.1.4 Multiplexer Equipping

The following modules are required to implement the multiplexer architecture described
in the previous sub-sections. The first stage of demultiplexing (last stage of multiplex-
ing), the C/L Band separation filters, are found on the optical amplifier modules (OLI)
and are hence not represented in Tab. 3.5 below.
Module Name Stage 2 Stage 3 Stage 4
C/L Band Filters Red/Blue Band Interleav- 20 channel Sub-Band

ers Dielectric Filters
OMDFIC 1 x C-Blue/Red, red reflect- 2 x C-Red interleavers -
ing type, &
1 x C-Blue/Red, blue reflect-
ing type
OMDFIL 1 x L-Blue/Red, red reflecting 2 x L-Blue interleavers -

type, &
1 x L-Blue/Red, blue reflect-
ing type
OMDFC 1 x C-Blue/Red, red reflect- - -

ing type, &
1 x C-Blue/Red, blue reflect-
ing type
OMDFL 1 x L-Blue/Red, red reflecting - -

type, &
1 x L-Blue/Red, blue reflect-
ing type
OMD2IC - 2 x C-Blue interleavers -
OMD2IL - 2 x L-Red interleavers -
OM20 - - 20 channel Multiplexer
OD20 - - 20 channel Demultiplexer
ODA20 - - 20 channel Demultiplexer

with VOAs at each output
Tab. 3.5 List of SURPASS hiT 7550 2.05 Multiplexer Modules
64 A42022-L5936-C51-1-7618
3.2.2 OLRU
The Siemens Optical inLine Repeater Unidirectional (OLRU) allows extended reach
DWDM solutions on 10 Gbit/s transmission systems, removing the need for costly mul-
tiple signal electrical regenerator sites. The optical amplification is provided via Erbium
Doped Fibre Amplifier (EDFA) technology. SURPASS hiT 7550 2.05 utilizes broadband
EDFAs in the C (Conventional) and L (Long) Band of wavelengths, whereby 160 chan-
nels are simultaneously, optically amplified, pushing optical transmission distances up
to 1000 km and allowing higher bit rates of individual wavelengths.
OLRU boosts the channel power, adjusts the power tilt and compensates for dispersion.

As an example Fig. 3.5 shows the C band version (upgradable to C+L band) of the
OLRU. Each of the two directions has an optical line amplifier (OLI module) for the
C Band. The OLI modules may have pump A/B/C modules. Raman pump modules may
be used in front of the OLI inputs to extend transmission distances.
If an Optical Performance Analyzer module OPA (not shown in Fig. 3.5) is applied, up
to four monitoring inputs are used in the OPA module: the C Band (and the L Band) in
both transmission directions (corresponds to a total of 320 channels) are monitored at
the output of the optical line amplifier. OPA is used to get optical performance informa-
tion on a per channel basis.
OPA module and Raman amplifier module RPUMP use the same slot. Therefore only
i one of these may be equipped.
Optical line amplifier modules OLITIC,

with several pump modules,
dispersion compensation modules UDCM
and opt. service channel module OSCTUI
Fig. 3.5 OLRU, Optical Path Structure for C Band
A42022-L5936-C51-1-7618 65
An OSCTUI module terminates and processes the OSC on line side 1 and line side 2 of
the OLRU.
The C Band standalone OLRU originates from this figure by replacing OLIIC modules
by OLIINC modules and omitting the L Band upgrade section. The L Band standalone
OLRU originates from this figure by replacing all C Band modules by the respective
L Band modules and omitting the upgrade section.
3.2.2.2 Scalability of DWDM Capacity

SURPASS hiT 7550 2.05 transmits from 1 up to 160 wavelengths over a single physical
fibre, using a 50 GHz frequency spacing between the individual 'colored' carriers. Both
the C Band (1528 to 1564 nm) and the L Band (1570 to 1607nm) wavelengths are used
in both transmission directions, combining their capacity of 80 channels per band.
Hence the total capacity is up to 160 bi-directional channels over 1 fibre pair, or 2 x
1.6 TBit/s. The C and L Band wavelengths are optically amplified by separate C and L
Band EDFAs.
OTT PUMPS OLR PUMPS PUMP OADM fixed

PUMPS PUMP OTT
A B C A B C A add/drop A B C A
OLITBC OLIIC OLITPC OLITBC OLITPC

DEMUX C
DEMUX C
MUX C
MUX C
DCM DCM DCM DCM DCM
DCM DCM DCM DCM DCM

DEMUX L
DEMUX L
MUX L
MUX L
OLITBUL OLIIUL OLITPUL CAD2 OLITBUL OLITPUL
A B C A B C A Configurable A B C A
PUMPS PUMPS PUMP add/drop PUMPS PUMP
one direction
other direction
PUMP PUMPS PUMPS fixed
PUMP PUMPS
A A B C A B C add/drop A A B C
OLITPC OLIIC OLITBC OLITPC OLITBC

DEMUX C
DEMUX C
MUX C
MUX C
DCM DCM DCM DCM DCM
DCM DCM DCM DCM DCM

DEMUX L
DEMUX L
MUX L
MUX L
OLITPUL OLIIUL OLITBUL CAD2 OLITPUL OLITBUL
A A B C A B C A A B C
Configurable
PUMP PUMPS PUMPS add/drop PUMP PUMPS
Fig. 3.6 Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration
Operation in either the C or in the L Band only is also possible, in which case only the
EDFAs required for the particular Band of operation are necessary. A smooth upgrade
from an 80 Channel C Band only DWDM system to a 160 Channel C+L Band system is
enabled via the addition of the Upgrade L Band EDFA modules to the existing C Band
EDFA modules, as can be seen in Fig. 3.6. This upgrade strategy allows a minimum
initial investment in infrastructure, by allowing the carrier to begin with an 80 Channel C
Band only DWDM system, with the assurance of a non-traffic interrupting upgrade to
160 Channels with the addition of the L Band amplifier modules.
66 A42022-L5936-C51-1-7618
A Standalone L Band DWDM system, as shown in Fig. 3.7, is scalable up to 80 Chan-

nels and is recommended for networks with a Dispersion Shifted Fibre (ITU-T Recom-
mendation. G.653) base already implemented.
OTT OLR OADM fixed

OTT
PUMPS PUMPS PUMP PUMPS PUMP
OLITBL OLIIL OLITPL OLITBL OLITPL
DEMUX L
DEMUX L
MUX L
MUX L
DCM DCM DCM DCM DCM
one direction
other direction
PUMP PUMPS PUMPS PUMP PUMPS
A A B C A B C A A B C
OLITPL OLIIL OLITBL OLITPL OLITBL

DEMUX L
DEMUX L
MUX L
MUX L
CAD2
DCM DCM DCM DCM DCM
Configurable
add/drop
Fig. 3.7 Two Fibre SURPASS hiT 7550 2.05 Standalone

L Band Amplifier Configuration
3.2.2.3 Amplifier Variants

All EDFAs are located on the Optical Line Interface (OLI) module. Whereby several vari-
ants of the OLI module exist to satisfy the different requirements for booster amplifica-
tion, inline amplification and preamplification, the basic OLI module design for all
variants uses two different EDFAs (see Chapter 3.3.9).
The main differentiators of the OLI card variants are:
– Whether they amplify the optical C Band (C), the optical L Band only (L), or the op-
tical L Band as an upgrade in combination with a C Band system (UL)
– Whether they are optimized for operation as either a Terminal Booster (TB), Terminal
Preamplifier (TP) or Inline amplifier (I). Such optimization factors include the power
ranges of the optical interfaces and the Automatic Power Shutdown (APSD) thresh-
old levels and behavior.
– Depending on the given span lengths and tilt correction requirements there are three
different OLI categories: basic, standard, and extended (see Chapter 3.3.9 also).
For illustration, an OLIIC module is the inline amplifier module for the C Band which is
normally equipped in an OLR NE, and an OLITBUL is the booster amplifier module for
the L Band which is found in the OTTU of a C+L Band system. Fig. 3.6 and Fig. 3.7
show the usage of the different OLI modules.
3.2.2.4 Multi-Stage Amplifier Design

The EDFA optical module itself is a three-stage optical amplifier. The mid-stage access
points between each EDFA section, as illustrated in Fig. 3.8, allow the addition of inline
optical components to enhance the performance of the amplification process as well as
the overall network performance. As the attenuation incurred by these mid-stage optical
components is already calculated in the optical link budget, the SURPASS hiT 7550
2.05 is ready to handle today's and tomorrow's optical networking requirements.
A42022-L5936-C51-1-7618 67
The first EDFA stage is optimized for amplification of a low power signal and therefore
for low noise amplification. A flat spectral gain is ensured via a gain flattening filter which
is integrated in this first EDFA stage.
Between the first and the second EDFA stages, the first mid-stage access point, devices
for spectral control of the system are included, such as a Variable Optical Attenuator
(VOA) for setting the optimum EDFA gain operating point and a Pre-Tilt compensation
filter to reduce Raman Tilt.
The second EDFA stage provides moderate optical amplification so that the output sig-
nal level is appropriate for interconnection to a dispersion compensating module (DCM)
situated in the second mid-stage access point.
The third and final EDFA stage is optimized to maximize the amplification of the signal
to be sent out on the line.
Interstage External External External

Gain Tilt Control Device PUMPA card PUMPB card PUMPC card
(GTC)
variable optical dynamic tilt
attenuator adjustment DCF
1)
1) 1) 1)
Stage 1 Stage 2 Stage 3
Gain Tilt Monitor (GTM)

OLI 2)
1) ... not applicable for basic type OLI modules

Input 2) ... only applicable for extended type OLI modules Output
Connector
Fig. 3.8 Stage EDFA Design
3.2.2.5 Amplifier Pump Modularity

To account for the wide variety of optical conditions in backbone networks, such as var-
ied span lengths, fibre types, fibre attenuations, chromatic dispersion coefficients, and
non-linear effects, SURPASS hiT 7550 2.05 offers a modular amplifier pump implemen-
tation. By varying the number of pump modules equipped, the total output power of the
OLI modules can be adjusted to suit the exact network requirements. Each amplifier
pumps' current and output power is precisely regulated via hardware and software con-
trol loops implemented on the OLI module, which determine the total output power of the
optical amplifier.
Several pump modules are equipped on the OLI module itself, whereas extra pump
modules (external pumps are not applicable on basic type OLI modules), providing
much higher total amplifier output powers, may be added via additional plug-in PUMP
modules.
68 A42022-L5936-C51-1-7618
The following maximum total output power is available at the OLI module:
Configuration: Max. total output power

OLI module of the OLI module (approx.)
without pump modules + 17 dBm

PumpA added + 20 dBm
PumpA+PumpB added + 22 dBm
PumpA+PumpB+PumpC + 23 dBm
added
Tab. 3.6 Output Power for OLI Module with/without Pumps
The maximum total output power of the OLI module alone is +17 dBm. With the addition
of the plug-in unit PumpA, this can be increased to +20 dBm. By adding two extra units
PumpB and PumpC, a maximum total amplifier output power of +23 dBm can be
reached. This means, that with 80 channels maximum per EDFA (remember the C Band
and L Band EDFAs are separate), we can achieve a maximum channel output power of
approximately +4 dBm per channel. If only 40 channels maximum are equipped per
EDFA (i. e. for only 100 GHz channel spacing), then the maximum channel output power
can be increased to +7 dBm, which means even longer optical DWDM links are possi-
ble.
The pump modules are suitable for both C Band or L Band optical amplifiers, as well as
for booster amplifiers, preamplifiers or inline amplifiers.
3.2.2.6 Raman Amplification

In order to extend the distances between inline amplifier sites and the total optical trans-
mission reach, SURPASS hiT 7550 2.05 employs one of the sophisticated technologies
available for optical amplification, namely Raman amplification. Optical amplifier spac-
ings of up to 40 dB are possible with Raman amplification.
The basis of Raman amplification is the energy scattering effect called Stimulated Ra-
man Scattering (SRS), a non-linear effect inherent to the fibre itself. SRS involves a
transfer of power from a signal at a higher frequency (lower wavelength) to one at a low-
er frequency (higher wavelength), due to inelastic collisions in the fibre medium. It can
be used for optical amplification, in which the higher frequency light serves as a pump
source, amplifying the lower frequency wave carrying the actual traffic signal to be am-
plified. Although this is a very broadband process, the approximate required separation
between the signal wavelength and the Raman pump wavelength for optimal Raman
amplification can be calculated, hence the required pump wavelengths can be deter-
mined.
The Raman amplification process occurs at the end of an optical span in SURPASS hiT
7550 2.05. When the signal is at it's weakest, it is given renewed energy via the pump
light being inserted at the end of the hop in the reverse direction. Hence only in the last
few kilometers of a span does the real Raman amplification take place. This is known
as contra-directional Raman pumping, as the Raman pump light is travelling in the op-
posite direction to the actual traffic signal.
SURPASS hiT 7550 2.05 employs three different Raman pump modules. There is one
module for the C Band (RPUMPC), one for the L Band in case of a C+L Band system
A42022-L5936-C51-1-7618 69
(RPUMPUL) and one for a Standalone L Band system (RPUMPL). Just as it is possible
to upgrade a C Band only system with the L Band amplifiers, it is also possible to up-
grade a C Band only with Raman system with the L Band amplifiers and L Band Raman
pumps. This is a non-service interrupting upgrade. However, upgrading a C or L Band
system to include Raman pumps is traffic interrupting, and therefore when required, Ra-
man pumps must be inserted at the receiving line interface from the beginning. The ex-
act placement of the Raman pumps is shown in the C+L Band system in Fig. 3.9.
An additional Raman pump module can be inserted at the input of each inline preampli-
fier (and – in case of OTTU network elements – terminal preamplifier) to realize a Ra-
man amplification.
OTT PUMPS OLR PUMPS PUMP OADM fixed PUMPS PUMP OTT
RPUMPC RPUMPC RPUMPC

OLITBC OLIIC OLITPC OLITBC OLITPC
DEMUX C
DEMUX C
MUX C
MUX C
DCM DCM DCM DCM DCM
DCM DCM DCM DCM DCM

DEMUX L
DEMUX L
RPUMPUL RPUMPUL RPUMPUL
MUX L
MUX L
OLITBUL OLIIUL OLITPUL CAD2 OLITBUL OLITPUL
A B C A B C A Configurable A B C A
PUMPS PUMPS PUMP PUMPS PUMP
one direction add/drop
other direction
PUMP PUMPS PUMPS
fixed PUMP PUMPS
A A B C A B C add/drop A A B C
RPUMPC RPUMPC RPUMPC

OLITPC OLIIC OLITBC OLITPC OLITBC
DEMUX C
MUX C
DEMUX C
MUX C
DCM DCM DCM DCM DCM
DCM DCM DCM DCM DCM

DEMUX L
DEMUX L
RPUMPUL RPUMPUL RPUMPUL

MUX L
MUX L
OLITPUL OLIIUL OLITBUL CAD2 OLITPUL OLITBUL
A A B C A B C Configurable A A B C
PUMP PUMPS PUMPS PUMP PUMPS
add/drop
Fig. 3.9 Two Fibre ’SURPASS hiT 7550 2.05’ C+L Band, Raman Amplifier Configuration
Raman amplification has several significant implications for DWDM systems. It allows
the spacing between optical amplifiers to be increased, or alternatively allows the same
amplifier spacing to be achieved with lower per channel EDFA output powers. Reducing
the per channel EDFA output powers allows an increase in the total number of optical
spans.
Raman amplifiers are preferable applied to bridge single extra long spans.
Note: Raman pump modules are not applicable with basic type OLI modules.
70 A42022-L5936-C51-1-7618
3.2.3 OADM(U)
Siemens has developed a unique solution for its Optical Add/Drop Multiplexer Unidirec-
tional (OADMU), for the addition and termination of optical signals at intermediate opti-
cal amplifier sites, by providing several implementation options. Therefore carriers have
the flexibility to choose the option which best suits their network requirements.
The options are scalable to allow the adding/dropping of one to n number of channels,
where “n” depends on the option chosen and can be as much as 100% of the total line
capacity. For an 80 channel C system this translates to 80 channels which can be opti-
cally and cost-effectively terminated at intermediate sites. All channels which are not
added/dropped at an OADM site are passed through unaffected.
OADM may statically or dynamically add/drop channels, can through connect or termi-
nate subbands, and compensates dispersion.
In case that preemphasis termination is needed for performance reasons, it is recom-
mended to use a back-to-back OTT configuration with single channel through connec-
tion.
There are two different types of OADM network elements in the current release:
• Remotely Configurable 20% OADM (see Chapter 3.2.3.2): realized with CAD2 mod-
ules, 20% of the channels can be added/dropped and they are configurable, the oth-
ers are express channels (details are defined during system planning)
• Back-to-Back 100% OADM (see Chapter 3.2.3.3): all channels can be added or
dropped via two OTTs with a channel connection unit CCU in between
Additional OADM configurations with static add/drop channels or a mixture of dynami-
i cally configurable and static add/drop channels would be deliverable on customer’s re-
quest only.

Fig. 3.10 gives one example of an OADM configuration. It shows the optical path of the
configurable OADM with CAD switchable add/drop modules, a configuration for C band
standalone operation at 50 GHz channel spacing. Side 1 is equipped with a raman pump
module in front of the line preamplifier module OLITPNC, side 2 is equipped with pump
A, B, and C modules for the booster amplifier modules OLITBNC.
The Optical Multiplexer/Demultiplexer modules OMDFIC and OMD2IC contain the band
filters for separation of the blue and red sub-bands (within the C band) and the interleav-
ers to get a 100 GHz grid (required for the subsequent channel add/drop) from the given
50 GHz channel spacing.
Modules EAM4 are used for power equalizing of the four subbands.
An OSCTUI module terminates and processes the OSC on each side of the OADM.
With the OPA module the C band is monitored on line sides (two line sides for interme-
diate NEs like OLR and OADM) in both transmission directions, to get optical perfor-
mance information on a per channel basis for the incoming and outgoing channels (4
measuring ports).
Figures on a greater variety of OADM configurations are given in the Installation and
i Test Manual ITMN.
A42022-L5936-C51-1-7618 71
Fig. 3.10 OADMU with CAD2x Modules, Optical Path for C Band Standalone
72 A42022-L5936-C51-1-7618
3.2.3.2 Remotely Configurable 20% OADM

(See Fig. 3.10 also).
It is possible in each of the 20 channel sub-bands to drop up to 20% of the maximum
traffic capacity, i. e. up to 4 channels via two serially cascaded optical switch modules
named CAD2. Each of these 4 channels may be remotely configured as an “add/drop”
channel or to a “through state” via the network management system. The CAD2 module
is responsible for the extraction of two wavelengths and insertion of the same two wave-
lengths being transmitted in one direction, as seen in Fig. 3.11. Therefore two CAD2
modules are required for bidirectional channel operation, and it is assumed that all chan-
nels are bidirectional. Two wavelengths must be chosen during the network planning
and design stage from a total of 8 wavelengths (actually four pre-assigned wavelength
pairs) per sub-band, which means a total of 32 CAD2 modules in total (four CAD2 vari-
ants per sub-band x 8 sub-bands). It is also possible that only one wavelength of the two
is actually equipped, and the second wavelength can be equipped later. For a detailed
description of these modules, refer to Chapter "3.3 Functional Overview of the Mod-
ules".
CAD2
λ1 λ 2 λ1 λ2
from
EAM4 λ1 - λ20 λ1 - λ20
module
CAD2
Fig. 3.11 Remotely Configurable CAD2 Optical Switch Modules
Configuration changes such as the remote re-configuration of individual channels from

“through state” to “add/drop” or vice versa, are non-traffic interrupting. This means a net-
work operator can already prepare for a change in traffic topology by passing through a
wavelength originally, and later configuring the same wavelength to be added/dropped
at this OADM site.
An upgrade port on the CAD2 module also allows a plug and play upgrade from 2 to 4
channel add/drop per sub-band, with the addition of a second CAD2 module in series
with the first. E. g. un upgrading CAD2 module could be plugged into a neighbouring
slot. As traffic requirements grow, it is possible to add remotely configurable add/drop
channels to a currently unequipped sub-band without disturbing the traffic in the other
sub-bands.
In terms of total configurable add/drop capacity, it is possible to drop 16 wavelengths
from the C Band (i. e. 16 from 80) and 16 wavelengths from the L Band, which makes a
total of 32 wavelengths from 160. Only two single row subracks are required to house
A42022-L5936-C51-1-7618 73
the CAD2 modules required for 16 bi-directional add/drop channels in either the C or the
L wavelength band.
Power adjustment in the relevant subband is done automatically with the VOAs in the
EAM4 module.
Sub-band channels, where CAD2 modules are equipped, but whose wavelengths do not
correspond to those of the particular CAD2 modules, i. e. the “add/drop” channel wave-
lengths, are referred to as “express” channels. Sub-bands where no add/drop require-
ments currently exist, and where no CAD2 modules are equipped, are directly
connected from east to west and vice versa.
Remark: for 20% OADM operation of RPUMP and PUMPA,B,C modules is not possible
in both directions, only RPUMP+PUMPA modules in one direction and RPUMP + PUM-
PA,B,C modules in the opposite direction.
3.2.3.3 Back-to-Back 100% OADM

(see Fig. 3.12)
Back-to-back 100% OADM is applied for add/drop nodes with high required flexibility
and add/drop capacity. It is also called optical network node ONN and offers 100% ac-
cess to all used channels with absolutely free selection between path-through and
add/drop, where full remote control is possible and no manual work has to be done lo-
cally.
This type of OADM consists of three network elements:
It is realized as two back-to-back terminals (2 network elements OTT) with full demulti-
plexing and multiplexing and a channel connection unit (network element CCU, see
Chapter 3.2.4 also) with single channel EDFAs in between.
The OTTs contain the OLI amplifier modules and the demultiplexer/multiplexer units, the
network element CCU with single channel amplifier modules OCA without switches or
OCAS with remotely configurable switches. In the back-to-back 100% OADM demulti-
plexer modules from the ODA (with VOAs) type are required.
The add/drop function is remotely configurable on these channel amplifier/switch mod-
ules OCAS/OCS of the CCU.
Use of single channel amplifier in CCU is provided for 50 GHz systems.
Instead of these OCA(S) modules in the CCU, also OCR transponders in a network el-
ement SURPASS hiT 7540 could be connected to the OM20/OD20 modules of the
OTTs.
Due to the 8 subracks limit for CCU, a maximum of 7 x 9 + 8 = 71 OCAS modules can
be equipped in one CCU network element, each module connecting 2 channels per di-
rection. Thus a maximum of 71 x 2 = 142 bidirectional channels can remotely be config-
ured in one CCU. For a larger number of remotely configurable channels an additional
network element CCU is required.
As an example, Fig. 3.12 shows a back-to-back 100% configurable OADM for C band
standalone operation with 50 GHz channel spacing. Combinations of demultiplexer/mul-
tiplexer modules ODA20/OM20 and filter/interleaver modules are needed in the OTTs.
Equipping with demultiplexer/multiplexer modules is mandatory for all used subbands.
74 A42022-L5936-C51-1-7618
As shown for subbands C3C4, the remaining subbands are also fed via OCA(S) modules.
Note 1)
Note 1):
Fig. 3.12 Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz)
A42022-L5936-C51-1-7618 75
Between demultiplexer and multiplexer modules of both OTTs, channels may be treated
as required:
– connected via CCU, using amplifier/switching modules OCAS (for configurable
add/drop channels, as shown in Fig. 3.12) or OCA (amplifier modules)
or
– used as fixed add/drop channels (via interfaces of the modules ODA20/OM20 in the
OTTs).
Regardless of their designation as add/drop or express, all channels have to be multi-
plexed/demultiplexed.
Every OTT terminates the respective link of the SURPASS hiT 7550 2.05 and thus pre-
emphasis is terminated in this type of OADM.
Single channel amplifiers (OCA/OCAS modules) cope with polarization dependent loss
(PDL) and enable intermediate preemphasis in a ultra-long-haul path.
3.2.3.4 Connectivity Options

Although the optical Add/Drop hardware modules, whether fixed or remotely config-
urable are symmetrical in nature, there is no requirement for symmetrical add/drop traf-
fic connectivity. Asymmetrical architectures are also supported. For example, the
following OADM topologies are supported (see Fig. 3.13).
Symmetric OADM Add/Drop # of added/dropped

=
# of added/dropped
wavelengths wavelengths
number of wavelengths = X through channels number of wavelengths = X

OLRU
OADMU
Asymmetric OADM Add/Drop # of added/dropped

=
# of added/dropped
wavelengths wavelengths
number of wavelengths = X through channels number of wavelengths is

<X or >X
OLRU
OADMU
Fig. 3.13 Symmetrical and Asymmetrical OADM Architectures
3.2.3.5 OADM Cascadability

The limit to the number of OADMs which can be cascaded in a SURPASS hiT 7550 2.05
DWDM network depends on the following factors: the applied FEC code, the wavelength
spacing, the required total EOL capacity and the number of the same wavelength CAD2
modules in series (details are defined during system planning).
76 A42022-L5936-C51-1-7618
3.2.4 CCU
The channel connection unit (CCU) network element is applied to amplify single chan-
nels and/or to switch them between 2 locations (add/drop or pass through with 2x 1:2
switches). It houses the amplifier modules OCAC, the amplifier/switch modules OCASC
and the switch modules OCS, controlled by one MCU module in the main subrack and
by an SMU module in any additional CCU subrack. Each CCU subrack also contains an
SAB module with bus termination resistors. CCU can support OCAC, OCAL, OCASC,
OCASL and OCS modules in any mix.
L-Band amplifiers OCAL and OCASL are not available in the current release.
i The switch module OSC is not tested for this release.
The OSCTUT module in the CCU main subrack provides shelf management (like the
SMU module) and TIF functions. It also supports (reduced) alarming (e. g. module prob-
lem and TIF alarms). TIF interfaces are specified like those of the remaining NE (OTT,
OLR, OADM). The CCU also uses the same connector panel COPA.
With CCU network elements, several OTTs and OADMs can be connected together. Ei-
ther static connections can be built with OCA (optical channel amplifier) or dynamic
add/drop connections can remotely be built with OCAS (optical channel amplifier with
integrated switch) or OCS (optical channel switch). With CCU this tasks can be used in
back-to-back 100% OADM also (see Fig. 3.14).
Optical Optical
line line
interface interface
Dispersion Attenuator/
compensation Dispersion
compensation
DeMux Mux
OCA
in out
drop
OC(A)S add
in out
50/
50 CCU
C
drop add
Fig. 3.14 CCU: Principal System Environment of OCA and OC(A)S Modules
OTTU and OADMU can be combined optionally with CCU network elements for trans-
parent through connection of optical channels. In the CCU single channel amplifiers
OCA or OCAS are required for this.
A42022-L5936-C51-1-7618 77
A maximum of eight subracks with up to 71 OC(A) (S) modules may be controlled by

one MCU module. This results in 142 possible bidirectional channels.
Single row subracks are used for better cooling of the uncooled pump lasers of OCA(S).
3.2.5 OADM Ring Closure

(see Fig. 3.15)
OADM rings are attractive for medium distance Core and regional applications.
In OADM ring configurations (without 3R regeneration at a terminal) you must avoid it to
connect lasers in a loop. There has to be at least one discontinuity/interruption in the
optical path for every wavelength.
The ring closure without 3 R regeneration of express channels at a point is achieved as
follows: The signals must be demultiplexed and re multiplexed at one point in the ring
with two OTTs: The interconnection of express channels is done via OCA modules
(equipped in a CCU network element) . The two OTTs are set back to back against each
other. The interconnection between the two OTTs may also be established via OCAS
amplifier/switch modules for remotely configurable OADM function. No optical-electri-
cal-optical (oeo) conversion is needed for this.
The terminal preamplifier OLITP gets 3 PUMP modules to achieve high channel powers
at the output of the demultiplexer.
The OTT at the Tx side is configured via the element manager for a lower input power
threshold. In case of ring closure the OTT accepts input powers at the OM20 module
down to -10 dBm. In this way signals can be directly interconnected between demux out-
put of one OTT and mux input of the second OTT.
Only one band and one direction shown
OTTU OTTU
OLITP OLITB
12 3 12 3
OMDF OMDF
PUMP A PUMP A
UDCM ODA20 ODA20 OM20 OM20 attenuator /
UDCM
PUMP B PUMP B
PUMP C PUMP C
patch cord connections

(in the current release:
connections only via
OCA or OCAS modules)
20 % add/drop 20 % add/drop
OADMU OADMU
Fig. 3.15 OADM Ring with two Back to Back Terminals (2xOTTU)
The maximum ring circumference depends on the channel count due to the optical per-
formance penalty at the two back to back OTTs.
In case of larger ring diameter, a ring can be built with two times two back to back OTTs
placed at different locations. In this case the ring consists of 2 links and in each link 2
78 A42022-L5936-C51-1-7618
express channels have to be present for link startup and preemphasis. No end to end
express traffic is going around the complete ring and the performance will increase, due
to distributed preemphasis.
3.2.6 Networking with OADMU/OTTU

(see Fig. 3.16)
Due to the flexible network element architecture of OADMU/OTTU and CCU it is possi-
ble to generate meshed network architectures without the need of optical-electrical-op-
tical (oeo) conversion.
20 % add/drop 20 % add/drop
line1 OADMU line1 line1 OADMU line1
local fix/ CCU local fix/

CCU
flexible OTTU flexible
(OCAS) (OCAS)
line3 add/drop
add/drop
20 % add/drop
OTTU
OADMU
line2 line2
line2
Note: only unidirectional traffic configuration shown!
Fig. 3.16 Network Configurations with Combinations of Network Elements

By combining the network elements, a static network node of grade n can be built with-
out restrictions. As the OCAS module integrates only 2:1 switches, a service can be dy-
namically switched only between 2 ports, e.g. line1/local add/drop or line1/line2 or
line1/line3.
SURPASS hiT 7550 2.05 planning SW and control SW supports a quasi-static mesh op-
tical network consisting of defined links, which are limited by OTTUs for optical link con-
trol. The optical wavelength path can continue at the OTTU, so the OTTU does not
terminate the optical channel.
A42022-L5936-C51-1-7618 79
3.3 Functional Overview of the Modules
3.3.1 Modules used for NEs

The next table lists features and functions of the various SURPASS hiT 7550 modules.
Module NE Type Features/Remarks

Name
MCU All NE Types The Main Control Unit is the central control element of the SURPASS hiT
7550 system which provides interfaces to the Local/Network Craft Terminal
and a Q3 interface to the customers network management system. The
MCU is responsible for fault, configuration, performance, and security man-
agement. The MCU requires 1 slot.
MIBS All NE Types The Management Information Base (Small) module stores all persistent
management data handled by the MCU. The MIBS requires 1 slot in com-
bination with the SAB.
SAB All NE Types The Subrack Address Board only consists of bus termination resistors. The
SAB requires 1 slot in combination with the MIBS.
SABM All NE Types The SABM includes a CAN bus repeater. It is only used in OADM NEs. At
an OADM, the SABM replaces the SAB in the Subrack that contains the
MCU. The SABM requires 1 slot in combination with the MIBS.
OSCTUT OTTU Optical Supervisory Channel Termination module Terminal, is required in

each OTTU to terminate and process the OSC. The OSCTUT modules re-
quire 2 slots.
OSCTUI OLRU Optical Supervisory Channel Termination module Inline, is required in each
& OLRU and OADMU to terminate and process the OSC on each side of the
OADMU NE. The OSCTUI modules require 2 slots.
SMU2 All NE Types The Supervisory Management Unit is equipped in all subracks without an
OSCTU and performs a subset of OSCTU functions such as card present
management. The SMU2 modules require 1 slot.
OPA OTTU Optical Performance Analyzer is used to provide detailed optical perfor-
& OADMU mance information on a per channel basis, i. e. channel power, OSNR and
& OLRU wavelength can be measured and recorded. The OPA module requires 3
slots.
Preamplifier: OTTU Rx Optical Line Interface Terminal Preamplifier.

OLITPC & “TP” type OLIs are equipped in the terminal sites (OTTU and OADMU).
OLITPL OADMU They contain a preamplifier for one band in one direction.
OLITPUL Type C/L refers to the wavelength band used, where:
OLITPNC - OLITPL is used in standalone L band systems,
(standard or - OLIPTNC is used in standalone C band systems,
extended ver- - OLITPUL (together with OLITPC) is used in C+L band systems and
sion) - OLISTPNC is used for short span standalone C band systems (with basic
version of amplifier).
Preamplifier: OTTU Rx
The output power of the OLITPC/L/UL and OLISTPNC is normally +19
OLISTPNC
dBm (+19.5 dBm for OLITPNC), but can be increased via the OLI pump
(basic ver-
modules described below. All OLI modules require 3 slots.
sion)
Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System
80 A42022-L5936-C51-1-7618
Booster am- OTTU Tx Optical Line Interface Terminal Booster.

plifier: & “TB” type OLIs are equipped in the terminal sites (OTTU and OADMU).
OLITBC OADMU They contain a booster amplifier for one band in one direction.
OLITBL Type C/L refers to the wavelength band used, where:
OLITBUL - OLITBL is used in standalone L band systems,
OLITBNC - OLITBNC is used in standalone C band systems,
(standard or - OLITBUL (together with OLITBC) is used in C+L band systems and
extended ver- - OLISTBNC is used for short span standalone C band systems (with basic
sion) version of amplifier).
The output power of the OLITBC/L/UL is normally +17 dBm (+18 dBm for
Booster am- OTTU Tx
OLITBNC and OLISTBNC), but can be increased via the OLI pump mod-
plifier: &
ules described below. All OLI modules require 3 slots.
OLISTBNC OADMU Tx
(basic ver-
sion)
Inline amplifi- OLRU Optical Line Interface Inline.

er: & “I” type OLIs are equipped in the inline amplifier sites (OLRU). They contain
OLIIC OADMU an inline amplifier for one band in one direction.
OLIIL Type C/L refers to the wavelength band used, where:
OLIIUL - OLIIL is used in standalone L band systems,
OLIINC - OLIINC is used in standalone C band systems,
(standard or - OLIIUL (together with OLIIC) is used in C+L band system and
extended ver- - OLISINC is used for short span standalone C band systems (with basic
sion) version of amplifier).
The output power of the OLIIC/L/UL is normally +17 dBm (+18 dBm for
Inline amplifi- OLRU
OLIINC and OLISINC), but can be increased via the OLI pump modules de-
er: &
scribed below. All OLI modules require 3 slots.
OLISINC OADMU Tx
(basic ver-
sion)
PUMPA All NE Types The PUMPA module is an OLI pump module which is used to increase the
optical output power of an OLI amplifier to +20dBm. The PumpA requires
1 slot.
PUMPA All NE Types The PUMPA/PUMPB/PUMPC consists of 3 OLI pump modules which are
PUMPB used to increase the optical output power of an OLI amplifier:
PUMPC to +20 dBm for PUMPA, to +22 dBm for PUMPA+PUMPB, to +23 dBm for
PUMPA+PUMPB+PUMPC.
The PUMPA/PUMPB/PUMPC modules require 3 slots.
R-PUMPC All NE Types Raman pump for C/L/UL band.

R_PUMPL Optional Raman pump modules can be installed to provide Raman ampli-
R-PUMPUL fication. C/L refers to the wavelength band used, where RPUMPL is used
in standalone L band systems and RPUMPUL is used in C+L band sys-
tems. All Raman pump modules require 2 slots.
OM20/ OD20 OTTU The Optical Multiplexer/Demultiplexer units perform the optical multiplex-
& ing/ demultiplexing of 20 channels according to the C and L subband based
OADMU scheme. The optical power levels of all inputs and outputs are monitored.
The OM20 also contains a VOA at each individual channel input. All
OM/OD20 modules require 4 slots.
Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System (Cont.)
A42022-L5936-C51-1-7618 81
ODA20 OTTU The Optical Demultiplexer (with VOA) units perform the optical demultiplex-
& ing of 20 channels according to the C and L sub-band based scheme. The
OADMU optical power levels of all inputs and outputs are monitored. The ODA20
also contains a VOA at each individual channel output. All ODA20 modules
require 4 slots.
OMDFIC / OTTU The OMDFIX modules contain the band filters for the separation of the blue
OMDFIL & and red subbands within the C and L band. They also include the C-red and
OADMU L-blue band frequency interleavers to achieve a 100 GHz frequency sepa-
ration among the carriers from the incoming 50 GHz signal, and vice-versa.
The OMDFIX modules require 2 slots.
OMDFC/ OTTU The OMDFX modules contain only the band filters for the separation of the
OMDFL & blue and red subbands within the C and L band. Hence, only 100GHz spac-
OADMU ing of wavelengths is supported. The OMFX modules require 2 slots.
OMD2IC/ OTTU The OMD2IX modules contain additional frequency interleavers in the C-
OMD2IL & blue and L-red bands to achieve a 100 GHz frequency separation among
OADMU the carriers from the incoming 50 GHz signal, and vice-versa. Together
with the OMDFIC & OMDFIL the entire C & L band is supported for 50 GHz
wavelength spacing. The OMD2IX modules require 2 slots.
CAD2xxxx(B) OADMU The CAD2 module is used to drop/insert wavelengths from/into the aggre-
gate signals in one direction. It is possible to remotely configure the 2 wave-
lengths as either add/drop or through channels. Up to two modules can be
used per OADMU subband in each direction. The CAD2xxxx(B) modules
require 2 slots.
EAM4C OADMU The power equalizing module contains 4 VOAs, one for each of the 4 sub-
EAM4L bands. The EAM4x modules require 2 slots.
OCAC/ CCU The OCxx Optical Channel Amplifier Module is used to configure single ex-
OCASC/ press or add/drop channels in a channel connection unit CCU.
OCS OCAC: four amplifiers (C band) enable four express channels.
OCASC: four amplifiers (C band) with each an optical switch at their inputs
and outputs allow either express or add/drop channel configuration.
OCS: like OCASC but without amplifiers and for both bands (C, L)
UDCMC/Lxxx All NE Types Unidirectional Dispersion Compensation Modules with slope compensating
DCFs for the C or L band for SSMF.
UDCMCxxxA All NE Types Unidirectional Dispersion Compensation Modules with normal compensat-
ing DCFs for the C band.
UDCMC/L All NE Types Unidirectional Dispersion Compensation Modules with slope compensating
xxxN DCFs for the C or L band for NZDSF(+) fibre and TWRS slope compensa-
tion.
UDCMC All NE Types Unidirectional Dispersion Compensation Modules with slope compensating
xxxP DCFs for the C band for NZDSF(-) or DSF fibre.
UDCMC All NE Types Unidirectional Dispersion Compensation Modules with slope compensating
xxxH DCFs for the C or L band for NZDSF(+) fibre and LEAF slope compensa-
tion.
Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System (Cont.)
82 A42022-L5936-C51-1-7618
3.3.2 MCU Module

The Main Control Unit (MCU) provides the central monitoring and control functions for
the system (SEMF function). It also performs the Management Communication Function
(MCF), i. e. handling the information for the F, Q and ECC communication interfaces.
Internal control is performed via the PCB (Peripheral Control Bus) which consists of two
asynchronous serial busses connecting the MCU to all modules which have their own
Local Card Controller (LCC). A second bus system called the CAN Bus (a common se-
rial bus communication protocol) is an asynchronous serial bus used for very fast inter-
card communications for time-critical operations such as optical link control.
Using these interfaces, the MCU performs the following functions:
– Fault Management
Monitors all system alarms and extends their states to the network management
system and the rack alarm bus. It also extends the information to the Local/Network
Craft Terminal.
– Performance Management
On request, it sends all optical performance management information to the network
management system and the Local/Network Craft Terminal.
– Configuration Management
Configures the system to either default settings or to settings passed to it from the
network management system or the Local/Network Craft Terminal.
– Security Management
Controls the individual access via the network management system or the Lo-
cal/Network Craft Terminal to particular NE functions via a hierarchical security man-
agement user ID and password concept.
– Equipment Management
Monitors the actual and required subrack equipping.
– Communication Management
Implements the Management Communication Function (MCF) so that communica-
tion to all NEs from the Network Management system is possible.
– Software Management
Responsible for all software downloads, uploads, and software integrity.
– Real Time Management
Controls the real time clock
– Providing Bw7R or NEALI shelf and rack alarm outputs
– NE alarms LEDs control (major/minor, for communication and equipment alarms)
The MCU requires the space of one slot in the SURPASS hiT 7550 2.05 subrack, and
is also responsible for detecting the presence of the MIBS and SAB in the same subrack.
Fig. 3.17 shows the MCU block diagram.
A42022-L5936-C51-1-7618 83
P3V3
P1V8FP
NUBAT1 Onboard P2V5FP
NUBAT2 Power P2V0PC
MPC8260
Supply P2V5PQ
NUBAT3 P12V0
MII
Ethernet1
STD Communication
NUBAT1,2,3,4 P5V0 (FCC1)
NUBAT4 Supervision
MII
Ethernet2
ULED
(FCC3)
UART
Terminal1
MPC755 PLD (SCC2) (Modem)
Backside Cache
UART
(SMC1) Terminal2
1 MByte
200 MHz HW Config HDLC
Serial 1
(SCC3)
ICE connectors HDLC
for debug purpose MICTOR (SCC4) Serial 2
1 Bank
PowerPC 60x Bus
SDRAM 66 MHz
64
128 MByte
Latch_Mux /Data_Mux
SPI
SPI
RTC 35ppm 8
17
Port
32 kByte NVRAM
Pins
TDMA1
TDM1
Core Communication Structure

(MCC1)
internal signals
and MIBS
Flash EPROM TDMB1
2 Banks 64 (MCC1) TDM2
32 MByte each bank
TDMC2
(MCC2) TDM3
NUBAT 4
Supervision FPGA 16 TDMD2
Adaption
(MCC2) TDM4
FPRE_L IDMA1/2
MII
(FCC2) MII
MIBS Card
up to 32 MByte 16
reserved
Pin
Port
EDI Comm
COP Debug
CLK driver /JTAG
66 MHz to 8260,755,SDRAM ..
8
32 MHz to FPGAs
RESET
2
32 MHz
20ppm
Fig. 3.17 MCU Block Diagram
3.3.3 MIBS Module

The Management Information Base Small (MIBS) module accommodates up to
32 Mbyte of FEPROM required for the persistent storage of all configurable parameters
handled by the MCU.
The MIBS itself contains all data visible and changeable via a Q3 interface. A subset of
the MIBS, the NE-VCDB (Variable Configurable Database) contains the total variable
configuration parameters of an NE. Only the NE-VCDB is persistently stored on the
MIBS module, as a backup version of the master stored on the MCU in external SRAM.
Hence, if an MCU happens to fail, a replacement can be made without losing the entire
contents of the MIBS. The contents of the MIBS also survive a power failure or 'cold-
start' of the NE.
84 A42022-L5936-C51-1-7618
One MIBS module is required per NE, and is fitted into the extreme bottom right slot of
the subrack equipped with the MCU. These are implemented as replaceable units to
ease their repair in case of malfunction. Replacement of the MIBS does not cause any
interruption to the traffic being carried over this particular NE.
The MCU is responsible for the module detection of the passive MIBS module. The
MIBS does not contain an EEPROM for Card Inventory Management information.
3.3.4 SAB Module

The Subrack Address (SAB) Module is named so because it previously held the subrack
address information for each subrack so that it could be uniquely identified for inter-sub-
rack data communications between the many subracks of an NE. This function has
moved to the NE Alarm Panel (NEAP), however the SAB is still required as it contains
several bus termination resistors required for inter-subrack data communications.
One SAB module is required per single row subrack, and one per double row subrack,
and is fitted into the extreme bottom right slot of each row of each subrack. The SAB
modules are implemented as replaceable units to ease their repair in case of malfunc-
tion.
The OSCTU or SMU2 modules, via the Serial Peripheral Interface (SPI) Bus, are re-
sponsible for the module detection of the passive SAB module. The SAB does not con-
tain an EEPROM for Card Inventory Management information.
Fig. 3.18 shows the SAB/SABM block diagram.
PCB1
PCB
THROUGH-
CONNECTION
PCB2 OR
TERMINATION
MPUPROUT
CONTROL
CAN1 CAN
TERMINATION
and
REPETITION *)
CAN2
* SABM only
PWR_BUS
ULED PWR
Fig. 3.18 SAB and SABM Block Diagram
A42022-L5936-C51-1-7618 85
3.3.5 SABM Module

The SABM (see Fig. 3.18) includes an additional CAN bus repeater/amplifier. It is only
used in the main subrack (the subrack that contains the MCU) of the OADM NEs. Here,
the SABM replaces the SAB. The SABM requires one slot in combination with the MIBS.
3.3.6 OSCT Module

The Optical Supervisory Channel Termination (OSCT) module is an active module (i. e.
it has it's own local module controller) and is mainly responsible for the optical and elec-
trical termination of the 2 Mbit/s Optical Supervisory Channel (OSC) which is transmitted
on a separate wavelength to the main payload traffic.
Other than OSC byte processing the OSCTU is responsible for providing the electrical
interfaces for the V.11 user channels, the EOW 4-wire interfaces, TIF alarm contacts,
T3in clock input, SPI bus connection to passive modules, LED control, FAN control and
supervision, inventory management and clock synchronization. The electrical interfaces
are found either on the connector panel (COPA), the NE alarm panel (NEAP), or on the
OSCTU module itself (i. e. for module LEDs), all accessible via the front of the NE.
Fig. 3.19 shows the OSCT block diagram.
86 A42022-L5936-C51-1-7618
NUBAT4
NUBAT3
NUBAT2
NUBAT1
PUBAT
LAMPTEST
SLOTADR#1-5
SUBRADR#1-3
CAN
PCB
SLOOP2
SLOOP1
ALCOM OMD-AS#1-4
PWFNC FAN-LAMP#1-2
FAN-AS#1-2
FAN-PR#1-2
ULED CA-PR
PWR-BUS
PSU
LCC
SPI-DI
SPI
SPI-DO
SPI-CO
SPI-ADR#1-5
TX-I-out_
D
_A
SDI
A
_B
AUX
+3,4/+1,8
MPUFAIL
TEC_B
TEC_A
+12
-12
+5
-5
SMA _BUS
Status
Fail
Poti
TX-
FE
CPS
APSD_B APSD_B
24
RX
TIFCOM_o
Tosc
1625
_B
B_RX
F
4 4
TIF
16
Poti
Iout
TIF-IN
TIFCOM_i
DCC1DO
A
DCCO
DCC1DI
1625
TX
B_TX DCC12CO
DCC2DI
B
DCC2DO
DCC3DO
PLL
SURPASS hiT 7550

_B
A
DCCM
DCC3DI
DCC34CO
T2
OSCC2
DCC4DI
B
DCC4DO
T3IN
T3
Z
MIN
T15
T0
SYNC
PLL
_A
V11-1DO
OUT
V11-1
V11-1CO
RX
V11-1CO
IN
V11-1DI
Tosc
1625
_A
A_RX
F
V11-2DO
OUT
V11-2
V11-2CO
Poti
Iout
V11-2CO
IN
V11-2DI
HS
1625
TX
A_TX
SICOFI
OW1
EOW
APSD_A APSD_A OW2

D
OW_LP
OSCTU DTMF
W
Fig. 3.19 OSCTU Block Diagram
A42022-L5936-C51-1-7618 87
A comprehensive list of OSCTU functions including those just stated is given in the fol-
lowing:
– Provides a T3in clock input interface for incoming 2048 kHz for OSC synchronization
and real-time clock synchronization. Note that no 1.5 Mbit/s or 2 Mbit/s clocks are
implemented because no complete SSM is required for OSC synchronization
– Provides all cross connections from terminated OSC bytes to the electrical interfac-
es, or cross connections for bytes which are to be passed through the NE untermi-
nated
– User configurable clock priorities via software for T3in & the T2 internal clock
– Implements a timing marker byte to prevent OSC timing loops
– User configurable EOW 4-wire electrical interface properties via software for ETSI
or ANSI customer requirements
– User-configurable EOW channel encoding/decoding law of the 4-wire interfaces via
software to A-law (ETSI) or µ-law (ANSI)
– The EOW supports 3-digit selective calling, group or collective calling
– EOW Ring Manager function: enables selection of one OTT as a ring manager to
allow ring EOW configurations for protection purposes
– User-configurable Telemetry Interfaces (TIF) providing 4 outputs (actors) and 16 in-
puts (sensors) per OSCTU module
– Supervision of FAN units, i. e. activation of FAN alarms
– Controlling the LED display on the Network Element Alarm Panel (NEAP) for the
FAN and EOW functions
– Controlling the LED display on the OSCTU module itself, red (alarm) and green (ac-
tive) LEDs
– Detection and reporting of all OSC alarms, such as LOS/LOF, SD, RDI, & EXC
– Module present monitoring of the FANs, UDCMs and SAB modules. The module
present monitoring of all other modules is performed by the SMU2 or the MCU,
whichever is present in each subrack
– Providing an SPI (Synchronous Peripheral Interface) for communication to passive
modules in the same subrack (i. e. OMDFx, OMDFIx, OMD2Ix) and UDCMs
– Storage and retrieval of module inventory data management on EEPROMs in OSC-
TU and in other passive modules in the same subrack, and to UDCMs
– Power feeding to other passive modules in the same subrack, and to UDCMs.
3.3.7 SMU2 Module

The Subrack Management Unit (SMU2) is an active module (i. e. it has it's own local
module controller) and is equipped in all subracks except for the main subrack contain-
ing the OSCTU, and performs a subset of the OSCTU functions. These include FAN
control and supervision, module present monitoring of modules within the subrack,
SMU2 LED control, user-configurable TIF providing 4 outputs and 16 inputs, and NE
alarms LED control (minor/major equipment alarms).
The SMU2 implements an SPI Bus connection to the passive modules in the same sub-
rack which feeds a power supply to these passive modules and enables the retrieval of
inventory data stored on EEPROMs in these modules.
Fig. 3.20 shows the SMU2 block diagram.
88 A42022-L5936-C51-1-7618
NUBAT4
NUBAT3
NUBAT2
NUBAT1
PUBAT
LAMPTEST
SLOTADR#1-5
SUBRADR#1-3
CAN
PCB
SLOOP2
SLOOP1
ALCOM OMD-AS#1-4
PWFNC FAN-LAMP#1-2
FAN-AS#1-2
FAN-PR#1-2
ULED CA-PR
PWR-BUS
PSU
LCC
SPI-DI
SPI
SPI-DO
SPI-CO
SPI-ADR#1-5
SDI
AUX
+3,4/+1,8
TEC_B
TEC_A
+12
-12
+5
-5
SMA _BUS
Status
Fail
FE
CPS
24
TIFCOM_o
4 4
TIF
16
TIF-IN
TIFCOM_i
OSCC2
SMU2
Fig. 3.20 SMU2 Block Diagram
A42022-L5936-C51-1-7618 89
3.3.8 OPA Module

(see Fig. 3.21)
The Optical Performance Analyzer module (OPA) is used for optimizing the transmis-
sion of optical signals and for monitoring the performance of the optical signals in a
DWDM environment.
Main functions of the OPA module:
• Measures the optical signal power, wavelength and OSAR of carriers
• Manages the measurement of the correct optical input signal for the respective op-
tical link state and network element type
• Participates in preemphasis setting and power optimization
• Allows to display a scan spectrum, i. e. for each of up to eight scan ports (at OLI
module outputs) and for a selectable frequency range, the laser power values are
presented in regular steps over the frequency at the element manager screen (OPA
module serves as spectrum analyzer)
• Monitores internal power and OSA failures and reports them
• Runs automatic performance measurements of supervised optical carriers
• Generates channel and carrier alarms for all supervised optical carriers
• Calibrates (in a special factory mode) optical power loss through optical switches
and couplers and stores calibrated data on the module EEPROM
The OPA module consists of a module mounted Optical Spectrum Analyzer (OSA) with
additional logic added to control and support the OSA within the SURPASS hiT 7550
2.05 system.
C/L splitter
4 channel
MonC1 2:1 version
Optical
4/8 switch
2:1 OSA
optical Optical (Optical Spectrum
inputs 2:1 switch Analyzer)
Optical
switch SIPAC
MonL4 connector
RS232
115.200 bps
red
TTL optical
LED switch
control
green Slot address
bus
SDI port Lamp test

LCC
“Debug” (Local module controller) PCB bus
CAN bus
ULED
18.432 MHz clock, Power supply

OPA for RS232 rates (OSA) 12 V
Fig. 3.21 OPA Module, Block Diagram
OPA is available either as four or eight channel version: so it has up to eight external
optical inputs, MonC1 to MonC4 for the C band and MonL1 to MonL4 for the L band.
90 A42022-L5936-C51-1-7618
Pairs of inputs e.g. MonC1 and MonL1 are coupled via a C&L band filter into one optical
switch input (pair 1 to input 1 and so on). In case of the 4 channel version only the inputs
MonC1, MonC2, MonL1 and MonL2 are valid.
A 4:1 switch at the optical inputs is implemented as cascaded three times 2:1 switches
and four C/L splitters.
The OPA behavior is controlled by message transfer via PCB bus and CAN bus. The
messages on the PCB bus generally control configuration and management, whereas
the messages over the CAN bus control the operation, especially during optical link star-
tup. The OPA also sends asynchronous notification messages containing performance
data and alarms to the master controller of the PCB bus (MCU module).
Behaviour of the OPA module at several optical link states:
• During Pre-start state (the startup), the OPA does not monitor optical links.
• When preemphasis is adjusted, the OPA performs continuous high resolution mea-
surements of OSAR and power values for the link. When the data is requested, the
OPA hands over the measured optical parameters (power and OSAR) to the OSCT
module via CAN bus. During preemphasis setting phase, no alarming and no per-
formance monitoring takes place for the inputs.
• In the running state (and enabled supervision for carriers on an input), which is the
normal operational state of optical links, OPA actively monitors the power levels and
signal-to-noise ratios of the supervised carriers. It also reports alarms if any of the
measured values is outside specified thresholds, and sends performance reports to
the MCU module every 15 minutes.
3.3.9 OLI Modules

The Optical Line Interface (OLI) modules are active modules (i. e. they have their own
local module controller) whose primary function is the optical amplification and control
of the main DWDM traffic signal.
Fig. 3.22 shows the system environment of OLI modules.
A42022-L5936-C51-1-7618 91
ext.
Pump(s)
OLIx(U)L
OLI-L Band
EDFA
Standalone L-Band Standalone L-Band
or booster only Subsystem or preamp. only
ext.
Pump(s)
OLIxC
From line or MUX C/L-Split OLI-C Band C/L-Comb. To line or DEMUX
EDFA
OSC-Split Subsystem OSC-Comb.
Raman Raman
Pump Pump
OSCT Card
Fig. 3.22 System Environment of OLI Modules
An unidirectional C- or L-band EDFA amplifier is the central element of every OLI mod-
ule. OLI module variants can provide additionally C- and L-band splitters to combine a
C-band OLI module with an upgrade L-band amplifier.
In every configuration the OSC channels are tapped off by the main module and are con-
nected to the associated OSCT/SMU2 module.
There are three general types of OLI modules:
• a cost optimized basic type (in standalone C Band systems only) for short spans up
to 90 km and transmission lengths of up to 800 km (for regional and long-haul appli-
cations);
no external pumps and no Raman pump can be used with a basic type OLI, i. e. the
output power is restricted to about +18 dBm
• a standard type for medium span lengths
• an extended type for longer spans
A mix of basic, standard, and extended type OLI modules is possible on transmission
links.
Different OLI module types are available (see Tab. 3.7) according to the application in
the network element:
• for C or L or L+C band
• either as preamplifier (at the receive side of the optical path) or booster (at the trans-
mit side of the optical path) or inline (in regenerators along the route) amplifier type
• as basic or standard or extended type
Fig. 3.23 shows the OLI module basic block diagram.
92 A42022-L5936-C51-1-7618
PD
GTM
PUMPC
PUMPA
PUMPB
P-LD
P-LD
P-LD
EDFA 6
P-LD
EDFA 5
PD
DCM
PD
GTC
P-LD PD
EDFA 4
PD P-LD
EDFA3
DSP
VOA
P-LD PD
EDFA2
LCC
EDFA1
P-LD
OLI
EDFA
PD
Fig. 3.23 OLI Block Diagram

The EDFA gain block provides the basic optical function. It is a scalable broadband op-
tical amplifier.
A42022-L5936-C51-1-7618 93
Each standard or extended type OLI module has the identical high-performance 3-stage
EDFA for C band or L band with gain control and output power control for any of the 3
stages. A basic type OLI module has a cost-effective 3-stage C-band EDFA with gain
control and output power control.
The EDFA control is provided by the control of pump power and the current of the differ-
ent amplifier sections. The signal and pump powers of the different stages can be mon-
itored by internal photodiodes.
The OLI module is equipped with six on-board pump lasers (only two in the basic type
OLI) which enables a maximum total optical output power of approximately +17 dBm to
+ 19 dBm. For higher output powers, external OLI PUMP modules (Pump A, B, and C)
are required (not applicable for the basic type OLI), getting a maximum output power of
+ 24.5 dBm.
A variable optical attenuator (VOA) allows the operation of the EDFA at different gains
respectively gain tilts with optimum noise figure.
With the extended type OLI module, a gain tilt monitor (GTM) measures the actual gain
tilt at the output of the OLI. A gain tilt control (GTC) compensates the spectral tilt induced
by the EDFA itself, by the Raman pumps, or by Raman crosstalk. For this no continuous
pretilt control applies, the tilt data (generated by the Transplan tool) are to be entered
manually into the element manager.
In the standard type OLI module, the GTC is used again to set predefined (fixed) tilt
values, but there is no GTM circuitry.
The basic type OLI has no GTM and no GTC; there a pretilt correction is done via VOA.
The basic OLI type is used in the C band only as inline, terminal booster amplifier, and
terminal preamplifier. It will preferably be found in shorter spans. The standard and ex-
tended type OLI are applied in the C and/or L band as inline, terminal booster amplifier,
and terminal preamplifier. All this three OLI types are applied in the OTT, OLR, and
OADM network elements.
The extended type OLI module with its GTM facility allows to display an OLI scan spec-
trum; i. e. for a selectable frequency range, the laser power values (gain tilt) behind the
third OLI amplifier stage may be presented in regular steps over the frequency at the el-
ement manger screen (spectrum analyzer functionality).
Each OLI module also contains an on-board EEPROM to store module inventory data
which can be requested by the network management system.
3.3.10 OLI PUMP Modules

The OLI PUMP modules are used to increase the output power of the preamplifier,
booster amplifier and inline amplifiers on the various OLI modules. This modularity is
necessary to support the large span loss range available with SURPASS hiT 7550 2.05,
the different fibre types, and the large range of channel numbers supported. The OLI
PUMP modules are active modules, which means they are equipped with their own local
module controller (LCC).
Fig. 3.24 shows the OLI PUMP module’s block diagram.
94 A42022-L5936-C51-1-7618
Temp. Reg. Power Temp. Reg. PSU

and Supervision and
Supervision Supervision
Polarisation PUMP_OUT
Pump Combiner l1,2,3
Laser 1
l1,2,3
Pump
Laser 2
l1,2,3
PUMP A
PUMP B
PUMP C
LCC
Fig. 3.24 OLI PUMP Block Diagram
There are three OLI PUMP modules which each require one slot, namely PUMPA,
PUMPB and PUMPC. Three configurations are supported, the PUMPA module alone, a
combination of PUMPA and PUMPB as well as a combination of PUMPA, PUMPB and
PUMPC. For typical OLI output power values see Tab. 3.6.
In order to provide this, each PUMP module is equipped with two laser diodes where the
pump signal wavelengths for PUMPA, PUMPB and PUMPC are 1480 nm, 1495 nm and
1465 nm respectively. The signals from the two laser diodes on each PUMP module are
combined together into one pump laser signal via a polarization beam combiner. Then
one signal is sent to the OLI via an optical/electrical cable. On the OLI module itself,
which can receive inputs from up to three PUMP modules, the signals are combined via
a WDM multiplexer.
The electrical connection is important as it is used to determine whether the high optical
power connection from the PUMP module to the OLI is closed. If not, the PUMP module
power is automatically shut down.
The PUMP modules contain Peltier controlling elements and temperature sensors,
which trigger an appropriate alarm if the temperature exceeds the programmed thresh-
olds.
Each OLI PUMP module also contains an on-board EEPROM to store module inventory
data which can be requested by the network management system.
For C and L wavelength bands, the same PUMP modules are used.
A42022-L5936-C51-1-7618 95
3.3.11 RPUMP Modules

The Raman PUMP (RPUMP) modules are utilized to increase the number of spans, or
to increase the length of the spans, or to improve the performance of a particular net-
work.
The Raman PUMP modules are active modules, which means they contain a local mod-
ule controller. They require two slots in the SURPASS hiT 7550 2.05 subrack.
The RPUMPC for the C Band contains 4 or 5 laser diodes with various wavelengths be-
tween 1409 nm and 1466 nm. Each of these laser diode signals is combined together
before one signal is sent to the OLI via an optical/electrical cable.
Likewise, the L Band RPUMP required for C+L Band systems, RPUMPUL, contains 3
or 4 laser diodes with the following wavelengths; 1482 nm, 1497 nm and 1513 nm. The
output of the RPUMPUL is sent to the RPUMPC module via an optical twin cable. This
is then combined with the pump laser signals generated on the RPUMPC module. For
a Standalone L Band system the RPUMPL module utilizes two extra laser diodes with
wavelengths 1452 nm and 1466 nm.
This connection is important as it is used to determine whether the high optical power
connection from the RPUMPUL module to the RPUMPC module, or the RPUMPC/L
module to the OLI is closed. If not, the Raman Pump module power is automatically shut
down.
Each Raman PUMP module also contains an on-board EEPROM to store module inven-
tory data which can be requested by the network management system.
3.3.12 OMD Modules

The Optical Multiplexer/Demultiplexer (OMD) modules consist of the OMDFIC, OMD-
FIL, OMDFC, OMDFL, OMD2IC and OMD2IL. All these modules have no separate, lo-
cal module controller. They are managed via the OSCTU or SMU2 modules via the SPI
Bus, which means Card present information and Card Inventory Management informa-
tion (stored on an EEPROM on each module) can be requested at all times.
The OMD modules contain the subband filter and interleaver optical components nec-
essary for the 160 channel multiplexing/demultiplexing structure.
The C and L filters are used to separate the wavelengths into C-red/C-blue and L-red/L-
blue subbands using standard optical reflecting filter technology.
The C and L subband interleavers are used to convert a set of wavelengths with 50 GHz
spacing to two sets of wavelengths with 100 GHz spacing and vice versa, so that final
individual channel demultiplexing/multiplexing can be performed with a 100 GHz wave-
length grid. The interleavers make use of Mach-Zehnder interferometer technology. In
this design, an unequal fiber path length between two 3 dB couplers creates the inter-
ference. By carefully controlling the path length difference, the channel spacing can be
set to the desired value. Because of the all-fiber design, this technology has very low
loss, low dispersion, and small polarization-dependent effects.
The temperature and power alarms for the OMD are supervised by the OSCTU or SMU2
equipped in the same subrack.
Fig. 3.25 to Fig. 3.30 show the block diagrams of the particular modules. The abbrevi-
ations used in the figures have the following meaning:
96 A42022-L5936-C51-1-7618
1C/1L 1st C band terminal/L band terminal on board (MUX)

2C/2L 2nd C band terminal/L band terminal on board (DEMUX)
1C3478 1st C band terminal on board for groups C3, C4, C7, C8
2C1256f 2nd C band terminal (filter side) on board for groups C1, C2, C5, C6
1C1256i 1st C band terminal (interleaver side) on board for groups C1, C2, C5, C6
2C1256i 2nd C band terminal (interleaver side) on board for groups C1, C2, C5, C6
C12 terminal for C band groups C1 and C2
1C1256
C band filter
red reflecting
MUX
red/blue
1C
1C34
interleaver
1C3478f
C band
1C3478i
1C78
blue reflecting
2C1256
C band filter
red/blue
2C
2C34
interleaver
2C3478f C band
2C3478i
DEMUX 2C78
OMDFIC
Fig. 3.25 OMDFIC Block Diagram
A42022-L5936-C51-1-7618 97
MUX 1L3478
L band filter
red reflecting
red/blue
1L
1L12
interleaver
1L1256f
L band
1L1256i
1L56
blue reflecting
2L3478
L band filter
red/blue
2L
2L12
interleaver
2L1256f
L band
2L1256i
DEMUX 2L56
OMDFIL
Fig. 3.26 OMDFIL Block Diagram
MUX 1C3478
C band filter
red reflecting
red/blue
1C
1C1256
2C3478
C band filter
red reflecting
red/blue
2C
DEMUX 2C1256
OMDFC
Fig. 3.27 OMDFC Block Diagram
98 A42022-L5936-C51-1-7618
MUX 1L3478
L band filter
red reflecting
red/blue
1L
1L1256
2L3478
L band filter
red reflecting
red/blue
2L
DEMUX 2L1256
OMDFL
Fig. 3.28 OMDFL Block Diagram
MUX interleaver 1C12

C band
1C1256
1C56
2C12
interleaver
C band
2C1256
DEMUX 2C56
OMD2IC
Fig. 3.29 OMD2IC Block Diagram
MUX 1L34
interleaver
L band
1L3478
1L78
2L34
interleaver
L band
2L3478
DEMUX 2L78
OMD2IL
Fig. 3.30 OMD2IL Block Diagram
A42022-L5936-C51-1-7618 99
3.3.13 OM/OD Modules

The Optical Multiplexer/Optical Demultiplexer (OM20/OD20) modules are active mod-
ules (i. e. they have their own local module controller) and are equipped in the OTTU
and OADMU NEs to perform fixed 20 channel optical multiplexing and demultiplexing.
The ODA20 is a variant of the OD20 with optical outputs adjustable in power.
There are 8 OM20 modules (4 per C and L Band), 8 OD20 modules and 8 ODA20 mod-
ules, which vary only in the wavelengths supported by the 100 GHz dielectric filters im-
plemented in each module. Each OM20 module has 2 dielectric filters, which multiplex
10 channels separately and then two groups of 10 channels together to form one 20
channel DWDM signal.
Each OM20 channel input has a VOA implemented to control the power of this client in-
put channel. The stepper motor controlled VOA wiper settings may be software con-
trolled via the network management system.
Each ODA20 channel output has a VOA implemented to control the power of this client
output channel. The stepper motor controlled VOA wiper settings may be software con-
trolled via the network management system.
A sophisticated calibration procedure for the VOA elements is implemented in SUR-
PASS hiT 7550 2.05 to ensure the accuracy of network setup.
For optical power monitoring, monitor diodes are placed at each OM20 channel input,
at the OD(A)20 input and at each OD(A)20 channel output so that channel powers can
be monitored at the DWDM boundary inputs and outputs of the SURPASS hiT 7550
2.05 DWDM system via the network management system, as well as the total DWDM
input power before the final demultiplexing stage.
The input channel “ageing/drop control” is implemented in the OM20 and ODA20 mod-
ules. For each input channel of an OM20 the actual power after the VOA is compared
with the required value, and if a given tolerance level is exceeded for more than a pre-
defined integration time (2 min.) then the attenuation is adjusted back to the requested
value. If it cannot be reached, because the VOA has to regulate beyond its lowest or
highest possible attenuation, then the Power Low Failure (PLF) or the Power High Fail-
ure (PHF) communication alarm for that channel will be raised. The VOA at each output
of the ODA20 is monitored similarly.
The OD(A)20 also plays a role in Optical Laser Safety. The input power of the OD(A)20
is measured and if it is < -15 dBm it activates an APSD which shuts down the preceding
OLI preamplifier pump lasers.
Each OM20 and OD(A)20 module also contains an on-board EEPROM to store module
inventory data which can be requested by the network management system.
Fig. 3.31 to Fig. 3.33 show the block diagrams of the module groups OM20, OD20 and
ODA20.
100 A42022-L5936-C51-1-7618
1 5:95 1
MxIn 1
2 2
MxIn 2
3 3
MxIn 3 VOA
4 4
MxIn 4
MxIn 5
5 MD in 5
Mux
6 6
MxIn 6
7 7
MxIn 7
MxIn 8 8 8
9 9
MxIn 9
10 10
MxIn 10
11 5:95 1
MxIn 11
12 2
MxIn 12
13 3
MxIn 13 VOA
14 4
MxIn 14
15 MD in 5
MxIn 15
Mux
16 6 MxOut
MxIn 16
17 7
MxIn 17
MxIn 18 18 8
19 9
MxIn 19
20 10
MxIn 20
Fig. 3.31 OM20 Block Diagram
5:95 1
1
P1 P2
DxOut 1
2 2
DxOut 2
3 3
P3 DxOut 3
5:95 4 4
DxOut 4
Demux
DxIn P1 P2 5 5
DxOut 5
6 6
P3 MD out DxOut 6
7 7
DxOut 7
8 8
DxOut 8
9 9
MD 10 DxOut 9
10
APSD DxOut 10
5:95
1 11
P1 P2 DxOut 11
2 12
DxOut 12
3 P3
13
DxOut 13
4 14
DxOut 14
Demux
5 15
DxOut 15
6 16
MD out DxOut 16
7 17
DxOut 17
8 18
9 DxOut 18
19
10 DxOut 19
20
DxOut 20
Fig. 3.32 OD20 Block Diagram
A42022-L5936-C51-1-7618 101
1 5:95 1
DxOut 1
2 2
DxOut 2
3 3
5:95 VOA DxOut 3
4 4
DxOut 4
Demux
DxIn P1 P2 MD in
5 5
DxOut 5
6 6
P3 DxOut 6
7 7
DxOut 7
8 8
DxOut 8
9 9
MD 10 DxOut 9
10
APSD DxOut 10
1 5:95 11
DxOut 11
2 12
DxOut 12
3 13
VOA DxOut 13
4 14
DxOut 14
Demux
5 MD in 15
DxOut 15
6 16
DxOut 16
7 17
DxOut 17
8 18
9 DxOut 18
19
10 DxOut 19
20
DxOut 20
Fig. 3.33 ODA20 Block Diagram
3.3.14 CAD2 Modules

The Channel Add/Drop (CAD2) module is an active module (i. e. it has it's own local
module controller) and is equipped in OADMU NEs to perform remotely configurable
channel add/drop functions.
The CAD2 module consists of a set of add/drop WDM filters to either add/drop a wave-
length into/from an optical 16nm band with 20 optical wavelengths and 100 GHz. Two
wavelengths can be added and dropped per CAD2 module in one direction. Each Add
channel input has a VOA implemented to control the power of this Add channel. The re-
quired input power of the Add channel is calculated with the help of the OPA, or interpo-
lated from the other channel power values if no OPA is equipped. Each Drop channel
output has a VOA implemented to control the output power so that it is within the allow-
able range of the client's receiver. The stepper motor controlled VOA wiper settings may
be software controlled via the network management system.
Add channel and drop channel “ageing control” is implemented in the CAD2 modules.
For each input and output channel the actual power after the VOA is compared with the
required value, and if certain tolerance level is exceeded for more than a predefined in-
tegration time (2 min.) then the attenuation is adjusted back to the requested value. If it
cannot be reached, because the VOA has to regulate beyond its lowest or highest pos-
sible attenuation, then the Power Low Failure (PLF) or the Power High Failure (PHF)
communication alarm for that channel will be raised.
102 A42022-L5936-C51-1-7618
The wavelengths used for channel selection take into account the following optical prop-
erties, the nearest neighbour of an add/drop channel is always a through channel to fa-
cilitate add channel power adjustment, and there is a spacing of 2 channels between
every 2 add/drop channels (i. e. 300 GHz) to minimize the impact of imperfect through
channel filter shapes. There is one group of CAD2s and one additional group of CAD2B.
Each CAD2 module also contains an on-board EEPROM to store module inventory data
which can be requested by the network management system.
Fig. 3.34 shows the CAD2 block diagram.
Drop f1 Drop f2 Add f1 Add f2
VOA VOA
filter VOA
In 2x2
VOA
2x2 Out
through channel f2
notch-
filter fixed
attenuator
1x2 1x2
synchronized express channels
upgrade port for
next A/D-card
UpOut UpIn
Fig. 3.34 CAD2 Block Diagram
3.3.15 EAM4C or EAM4L Modules

The EAM4x basically is a smaller subset of the CAD2 module and is therefore also an
active module with it's own local module controller. It is equipped only in OADMU NEs
and is required to equalize the sum channel powers of the four interleaved 20 channel
sub-bands of the C or L band.
The EAM4x consists only of four Variable Optical Attenuators (VOAs), one for each sub-
band. Hence two EAM4x modules are required per band (C or L), for each direction,
making a total of 4 EAM4x modules for a C+L OADMU. In the EAM4 module the input
power of each of the four channel groups is measured and checked against the expect-
ed value. If there is no correspondency, an automatic power reduction command is sent
to the relevant OLI preamplifier module.
Each EAM4x module also contains an on-board EEPROM to store module inventory
data which can be requested by the network management system.
Fig. 3.35 shows the EAM4 block diagram.
A42022-L5936-C51-1-7618 103
VOA Out In VOA Out

In
1 x1x2 x3x4 2 x3x4
x1x2
f1,3,..39 (20 ch.) f51,53,..89
In VOA Out In VOA Out
x5x6 3 x5x6 x7x8 4 x7x8
f 2,4,..40 f50,52,..88
Fig. 3.35 EAM4 Block Diagram
3.3.16 OCA / OCAS / OCS Modules

(See Fig. 3.36 and Fig. 3.37)
Optical Channel Amplifier modules allow to configure either express channel connec-
tions or single add/drop channels in channel connection unit (CCU) network elements.
They can be applied together with OADMs and back-to-back OTTs.
There are the following basic variants:
• Modules with four single (C band) channel amplifiers only (OCAC)
• Modules with four single (C band) channel amplifiers and additional optical switches
(OCASC)
• Modules with optical switches only (OCS, for C and L band)
Switch in Express position
OCAS
Fwd1 IN Fwd1 OUT

OCA
Fwd1 Drop Fwd1 Add
Fwd1 IN Fwd1 OUT
Back1 IN Back1 OUT
Back1 IN Back1 OUT Back1 Drop Back1 Add
Fwd2 IN Fwd2 OUT

Fwd2 IN Fwd2 OUT
Fwd2 Drop Fwd2 Add
Back2 IN Back2 OUT Back2 IN Back2 OUT
Back2 Drop Back2 Add
Switch in Add-Drop position
Fig. 3.36 OCA and OCAS Modules, Optical Path
104 A42022-L5936-C51-1-7618
Switch in Express position
OCS
Fwd1 IN Fwd1 OUT
Fwd1 Drop Fwd1 Add
Back1 IN Back1 OUT
Fwd2 IN
Fwd2 OUT
Fwd2 Drop Fwd2 Add
Back2 IN Back2 OUT
Switch in Add-Drop position
Fig. 3.37 OCS Module, Optical Path
OCAx modules (x= C stands for C band and, for later releases, x= L for L band) are
channelized amplifiers without switching function. The basic optical function is provided
by an EDFA module consisting of 4 internal gain blocks. Amplifiers for 2 channels in di-
rection 1 -> 2 are denominated Fwd1 and Fwd2, amplifiers for 2 channels in direction
2 -> 1 are denominated Back1 and Back2.
The EDFAs are controlled individually by the pump current control for the 4 different sin-
gle channel amplifiers. The optical input and output power of each single channel ampli-
fier are monitored and automatic output power control is done. An automatic over-
temperature shutdown is provided for each pump laser. The output power of each am-
plifier is individually controllable via the element manager and may be calibrated to the
according connector.
OCASx modules contain channelized amplifiers (like the OCA modules) with switching
function. The modules provide amplifiers for 2 channels per direction: for channels in di-
rection 1 -> 2 they are denominated Fwd1 and Fwd2, for channels in direction 2 -> 1
they are denominated Back1 and Back2.
There is also one dual 2 x 1 optical switch (a drop switch at the input and an add switch
at the output) for configurable add/drop traffic in each channel. Both optical switches
within the dual switch operate simultaneously, i. e. switches for the add/drop functional-
ity always operate synchronously.
Power monitoring of the amplifier is only reporting power information in case of the
switch being configured for express channel. Otherwise the amplifier is shut down.
For the current release no L band OCA/OCAS module is available.
A42022-L5936-C51-1-7618 105
For OCS modules, only switches and no EDFAs are present. An OCS module has only
4x 2x 1:2 switches and offers cheap dynamic add/drop. For each channel there is a drop
switch at the input and an add switch at the output. Channels in direction 1 -> 2 are de-
nominated Fwd1 and Fwd2, channels in direction 2 -> 1 are denominated Back1 and
Back2.
The same HW/optics can be used in C- and L-band.

OCA, OCAS, and OCS modules are equipped in the CCU subrack.
3.3.17 UDCM Modules

Unidirectional Dispersion Compensation Modules (UDCMs) are an important part of the
SURPASS hiT 7550 2.05 system, without these it would be impossible to transmit a
DWDM signal many hundreds of kilometers. UDCMs are primarily used to counteract
the chromatic dispersion which a signal undergoes as it travels through a section of op-
tical fibre. This chromatic dispersion has the effect of 'spreading' the signal spectrum so
much that the inter-symbol interference no longer allows an accurate determination of a
single 'one' bit or a single 'zero' bit. The UDCMs contain Dispersion Compensating Fibre
(DCF), which are just spools of fibre which contain the opposite dispersion characteris-
tics of the fibre used for signal transmission, hence “compressing” the signal for better
optical performance.
Naturally, the type of DCF depends on which wavelength band and type of fibre is being
used for transmission, which is why several types of UDCMs are required for accurate
DCM management. UDCMs for SSMF C band & L band, NZDSF(+) C band & L band,
NZDSF(-) and DSF are defined.
The strategy for choosing UDCMs, or DCM strategy, is highly system dependent and is
influenced by the optical performance limiting effect. For lower channel DWDM systems,
with larger channel spacings, i. e. a system with 100 GHz channel spacing, this limiting
effect was SPM (Self Phase Modulation), which lead to a DCM strategy where all of the
dispersion along the link was compensated with DCMs (full inline compensation) leaving
a high residual dispersion at the end of the link for SPM optimization.
For extensive channel systems with smaller channel spacings such as SURPASS hiT
7550 2.05, the 160 channel system with 50 GHz spacing, SPM is no longer the limiting
effect, rather Cross Phase Modulation (XPM) and Raman crosstalk, therefore the calcu-
lation of the residual dispersion is different.
UDCMs are passive modules placed in all NE types (excepted CCU), i. e. OTTU, OLRU
and OADMU. They are normally located in the optical path between the 2nd and 3rd
stages of each optical amplifier, as here the insertion loss of the UDCM can be compen-
sated for by the amplifier design. However, it is also possible to perform subband dis-
persion compensation, for example, using different UDCMs for the C-red and C-blue
bands in each NE type.
The UDCMs are physically stored in their own UDCM trays at the bottom of the rack,
and are visible via the network management system. As passive modules they are man-
aged via the OSCTU or SMU2 modules via the SPI Bus, which means module present
information and module Inventory Management information (stored on an EEPROM on
each UDCM) can be requested at all times. Up to a maximum of 4 UDCMs fit into one
UDCM tray, each in their own slot.
106 A42022-L5936-C51-1-7618
3.4 Synchronization
In all NEs, the OSCT module provides the master system clock (T0), which is used to
synchronize the real-time clock on the MCU module for greater accuracy. The accuracy
of the clock is 4.6 ppm. The OSCT sends clock data to the MCU every 15 minutes.
All clocks in a SURPASS hiT 7550 system are synchronized via the Supervisory Chan-
nel. The MCU's clock is equipped with a battery back-up in case of power failure or tem-
porary MCU module removal.
Additionally, an external clock can be used to get a maximum of accuracy. The clock
signal (T3) is fed in via the EOW1/T3in pin connector on the Connector Panel (COPA)
of the subrack.
If this external signal fails, a T3LOS alarm is propagated.
OTT OLR/OADM counter direction OTT

(Master)
same direction
If the T3 signal fails, the internal clock (T2) will be used instead.
A priority list is used to control the switchover.
T3 Input
Fig. 3.38 Timer Configuration
A42022-L5936-C51-1-7618 107
3.5 Control and Monitoring via the Element Manager

The Element Manager (EM) enables the user to perform a wide variety of OAM&P (Op-
eration, Administration, Maintenance, and Provisioning) tasks. These include:
– Equipment Management
– Fault Management
– Configuration Management
– Performance Management
– Security Management
• Access Check
• User Interface
The system requirements for the element manager are described in chapter
i 7.9.
3.5.1 Access Check

Whenever you start the TNMS CT application, a login dialog appears requiring:
– User name: You are assigned a user name by your administrator
– Password: Use your personal password. When you log on for the first time, you do
not need a password.
The access to TNMS CT is regulated by five user classes. Users can be assigned to the
user classes. The set of functionality available to a given user class is fixed an cannot
be changed.
The following five user classes for TNMS CT are defined having different privileges:
• 0: Supervision
• 1: Maintenance
• 2: Operation
• 3: Configuration
• 4: Administrator
Furthermore the element manager uses the following security levels to control the ac-
cess rights for the different LCT functions:
• Normal user administration: user classes 0 to 10.
Via the user administration the customer can configure the different access levels.
Some functions are restricted in this security level and can only be accessed via an
additional login.
• Service staff: this highest security class can only be reached via a key combination
and an additional password. This class is used by Siemens personnel only.
108 A42022-L5936-C51-1-7618
3.5.2 User Interface

Detailed information on the user interface can be found in the Operator Guidelines OGL
i and in the Online Help.
If you’re familiar with Microsoft® Windows, you can use the Element Manager EM. Com-
mon tasks such as moving, re-sizing, minimizing, and closing windows, manipulating
pull-down menus and dialog boxes, as well as the use of the primary and secondary
mouse buttons all work exactly as in Microsoft® Windows.
EM Screen
The EM screen structure consists of the following basic levels:
Network Element When you establish a session with a particular SURPASS hiT
(Main) Window 7550 NE, you will be presented with its Network Element Win-
dow, which functions as the root screen from which all other
EM windows for that NE are accessible. Several listings (e.g.
alarm listings) are obtainable directly from this window; they re-
flect the NE as a whole.
Module View From the Network Element Window, you must navigate to the
Module View to subsequently configure various parameters or
to request detailed information on the NE and modules. The
Module View represents the subracks and all modules in their
assigned slots.
OR
Traffic View From the Network Element Window, you may also navigate to
the traffic view, which gives an overview of the network ele-
ment's general optical path structure and of the involved mod-
ules. Additionally, the traffic view displays information
concerning the modules.
NE, Subrack, and A large amount of information is obtainable by navigating to the

Module Details various EM detail screens. Information pertaining to the NE as
a whole or individual modules can be requested. This includes
comprehensive Configuration, Security, Alarm, Software, and
Database details, as well as Traffic Performance measure-
ments (both in numeric and graphical form).
A42022-L5936-C51-1-7618 109
3.6 Control and Monitoring via Network Management System

(See also Chapter 2.3.7)
SURPASS hiT features advanced network management capabilities. Each network ele-
ment in a SURPASS hiT network contains one Main Control Unit (MCU) module. MCUs
are the major control element in the system. At the local level, each MCU communicates
with the other modules in its network element and supports the gathering and reporting
of traditional local telemetry (major and minor audible/visual alarms, – 60 Vdc power fail,
Alarm Cut-off, Lamp Test, etc.). It also provides an interface for connecting the
TNMS CT element manager (Local Craft Terminal, LCT). At the system-wide level, the
MCU provides a full Q3 interface to connect the SURPASS hiT system to the customer’s
Q3-CMISE compliant TMN system. Access can be through the TNMS CT element man-
ager (Network Control Terminal, NCT) or direct from the customer’s OSS.
The MCU serves as the gateway between the SURPASS hiT system and the Network
Management System. The MCU provides a full Q3-CMISE interface for connection of
the SURPASS hiT system to the customer’s Operational Support System (OSS) and the
QF interface for connection of PC-based local element managers (Local Craft Termi-
nals). MCU software implements all activities related to:
Equipment Management Performance Management

Software Management Real Time Management
Fault Management Security Management
Configuration Management Message Control Function
110 A42022-L5936-C51-1-7618
4 Hardware
This chapter describes the SURPASS hiT 7550 2.05 hardware. It consists of the follow-
ing sections:
• Racks
• Subracks
• Modules
• System Equipment
• Display and Operating Elements on Equipment
4.1 Racks
The SURPASS hiT 7550 2.05 is a highly modular system in which easy to install mod-
ules are housed in single-row or double-row equipment subracks that mount in common
ANSI racks or ETSI racks optimized for optical and electrical cabling.
Beside the power distribution panel (PDP) on top of the rack, up to three single row sub-
racks or one single row subrack and one double row subrack can be mounted in one
rack. The PDP contains at least six fuses/power breakers (15/16 A and 20 A, see Chap-
ter 4.1.2) for working and the same for spare power supply.
4.1.1 Mechanical Layout

Examples of the mechanical equipment layout for OTT, OLR, OADM, and CCU are
shown in Fig. 4.11 through Fig. 4.14. For further details concerning the rack dimen-
sions, refer to Chapter "7.2 Rack/Subrack Mechanical Data".
4.1.2 Rack and Subrack Power Supply

The rack is operated by a AC/DC station converter and a battery 48/60V, positive
grounded. Voltage range is between -40.5 Vdc to -75 Vdc (nominal voltage -48/-60 Vdc).
At the rack power distribution panel PDP, each power line input is distributed over two
circuit breakers (20 A fuse for an OADM double row subrack equipped with OLI mod-
ules, 15/16 A fuse for all other subracks) to the input connectors and terminal blocks of
the subrack.
All power lines have an input noise filter before the distribution on the backplane in the
subrack. The noise filters are for an extra low level of re-injected noise on the DC power
distribution in accordance with the relevant standards ETS 300 132-2 [ETS-60], EN
55022 [ETS-154] and ETS 300386-1.
Rack, subrack and modules are grounded by multiple mechanical and electrical connec-
tions to the planar shelf (protection earth).
Fig. 4.1 shows the power supply within the rack with single row subracks. Fig. 4.2
shows the power supply within the rack with double row subracks. Fig. 4.3 represents
the power supply within the subrack.
A42022-L5936-C51-1-7618 111
Station Power Supply

AC/DC and Batteries
positive grounded
INPUT A INPUT B
Rack Top Distribution Panel
Circuit Breakers / Fuses
UBAT1 UBAT2 UBAT3 UBAT4

Connector
LF Filter
Subrack
Distribution
PUBAT2/4
NUBAT2
NUBAT4
FAN1
PUBAT1/3
NUBAT1
NUBAT3
FAN2
slots
slots
slots
slots
slot 1 ... 10 slot 11 ... 19
Subrack Backplane
Rack
Planar shelf / Protection Earth
Fig. 4.1 Power Distribution within the Rack (Single Row Subrack)
112 A42022-L5936-C51-1-7618
Station Power Supply

AC/DC and Batteries
positive grounded
INPUT A INPUT B
Rack Top Distribution Panel
Circuit Breakers / Fuses

Connector
LF Filter
Subrack
Distribution
FAN1
PUBAT1/3
PUBAT2/4
NUBAT1
NUBAT3
NUBAT2
NUBAT4
upper row upper row

slots
slots
slots
slots
slot 1 ... 10 slot 11 ... 19
FAN2
PUBAT1/3
NUBAT1
NUBAT3
PUBAT2/4
NUBAT2
NUBAT4
lower row lower row

slots
slots
slots
slots
slot 1 ... 10 slot 11 ... 19
Subrack Backplane
Rack
Planar shelf / Protection Earth
Fig. 4.2 Power Distribution within the Rack (Double Row Subrack)
A42022-L5936-C51-1-7618 113

Subrack
NEAP
+S
LF-Filter Shelf Alarm
NUBAT1
NUBAT3 Fan unit 1 +S -S
PUBAT
NUBAT4
NUBAT2 Fan unit 2
PUBAT
Card in slot 19 MCU

+12V
UBAT +3,3V
UC +5V
SU MCU
SU
ULED +4,7V
Fault LED
SU
NUBAT4
NUBAT2
PUBAT
SLOOP 1 SLOOP 2
Card in slot 11 ... 18 1)

UC n
UBAT
UC 2
UC UC 1
*)
ULED +4,7V LCC
SU
Fault LED
Power Bus +5V
SU 1) CAD2,
ULED-BUS
SLOOP 1 SLOOP 2 EAM4,

NUBAT1
NUBAT3
PUBAT
OM/OD,
OPA,
OSCT,
Card in slot 1 ... 10 1) PUMP,
UC n RPUMP,
UBAT OLI,
UC 2
UC 1
OCA/OCAS//OCS,
UC
PQM
*)
ULED +4,7V LCC
Power
Bus
+5V SU
SAB(M) Fault LED

SU
SLOOP 1 SLOOP 2
*) also slot 19
SU = Supervision +S/-S = Signaling voltage UBAT = Battery voltage (supply voltage)

UC = Operating voltage LT = Lamp test
Fig. 4.3 Power Distribution within the Subrack
114 A42022-L5936-C51-1-7618
4.1.3 Connector Panel

All connections like the power supply, signaling data and so on from the subrack to the
rack, to other subracks or to further equipment are terminated on the connector panel
COPA (see Fig. 4.4). The panel is placed on the subrack lower front side.
... The connectors 10BT_0, 10BT_M2, and 10BT/100BT are currently not in use!
Fig. 4.4 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access
There is a variety of connectors on the COPA. Most of them are used only on the sub-
rack that contains the OSCT module in each NE.
COPA Power Connectors

ANSI subracks with front access COPA and all ETSI subracks have four 3W3 type pow-
er connectors labeled as UBAT1, UBAT2, UBAT3 and UBAT4.
-48/-60 Vdc
Fig. 4.5 COPA Power Connectors
A42022-L5936-C51-1-7618 115
4.2 Subracks
• Subrack Mounting
• DCM Trays
4.2.1 Subrack Mounting

The SURPASS hiT 7550 2.05 uses single-row and double-row equipment subracks.
Both subrack types used in ANSI and ETSI markets are shown in Fig. 4.6 to Fig. 4.9.
For further details concerning the rack dimensions, refer to Chapter "7.2 Rack/Subrack
Mechanical Data".
Fig. 4.6 ANSI Single-Row Subrack (Front Access)
116 A42022-L5936-C51-1-7618
Fig. 4.7 ANSI Double-Row Subrack (Front Access)
A42022-L5936-C51-1-7618 117
Fig. 4.8 ETSI Single-Row Subrack (Front Access)
118 A42022-L5936-C51-1-7618
Fig. 4.9 ETSI Double-Row Subrack (Front Access)
A42022-L5936-C51-1-7618 119
4.2.2 DCM Trays

In order to fit the UDCMs within the rack, DCM shelves are installed in the bottom or the
top of the rack. In a 2 HU shelf four UDCMs can be mounted.
Fig. 4.10 shows the DCM tray.
Fig. 4.10 DCM Tray
120 A42022-L5936-C51-1-7618
4.3 Modules
Modules are described in detail in the following sections:
• "3.3 Functional Overview of the Modules" describes the module functionality.
• "4.4 System Equipment" describes the arrangement of modules in the rack/subrack.
4.4 System Equipment

For the example configurations as shown in Fig. 4.11 through Fig. 4.14, the maximum
number of OLI pump cards (PUMPA, PUMPB, PUMPC) was assumed for the equipping.
For some configurations Raman pumps and the OPA card were included to demon-
strate the possible equipping options. Actual configurations may of course require fewer
OLI pump cards, Raman pump cards and OPA cards.
☞ For description of the NE functionality, refer to Chapter "3.2 Functional Over-

view of the NE Types".
For description of the module functionality, refer to Chapter "3.3 Functional
Overview of the Modules".

• OTT Equipment
• OLR Equipment
• OADM Equipment
• CCU Equipment
Chapters 4.4.1 to 4.4.3 each represent only one example for NE equipping.
For equipping details see Installation and Test Manual ITMN.
i
The listed power consumption values in Fig. 4.11, Fig. 4.12, and Fig. 4.13 are
total maximum power values.
In a completely equipped subrack/rack you will get the total maximum power as 90 per-
cent from the maximum value (because not all modules consume the maximum power
at the same time).
A42022-L5936-C51-1-7618 121
4.4.1 OTT Equipment
Rack power
panel
Double-row
Double-row subrack for
subrack for L-band
C-band mux/demux
mux/demux
Electrical connec-
tor panel (on each
subrack)
Single-row sub-
Single-row sub-
rack for C-band rack for L-band
amplifiers and amplifiers
network element
controller
Tray for passive

dispersion com-
pensators
Shown:ETSI2200mmx600mmx300mmracks
Total Power Consumption: 1564 W
Rack 1: 828 W Rack 2: 736 W
Fig. 4.11 OTTU, C+L Bands, 160 Channels (Equipping Example)
122 A42022-L5936-C51-1-7618
4.4.2 OLR Equipment
Single-row subrack
(address "2")
for L-band amplifiers
Single-row subrack
(address "1")
for C-band amplifiers
and network element
controller
Tray for passive

dispersion com-
pensators
Shown: ETSI 2200mm x 600mm x 300mm rack

Fig. 4.12 OLRU, C+L Bands (Equipping Example)
A42022-L5936-C51-1-7618 123
124
Fig. 4.13
OMDFIL OLITPUL CAD2L1L1
EAM4L PUMPA CAD2L2L2
OMD2IL CAD2L3L3
L
PUMPA
CAD2L4L4
4.4.3
OLITPUL EAM4L CAD2L1L1

OLITBUL OMDFIL CAD2L2L2
PUMPC
Rack 1: 1103 W
6
Technical Description (TED)
5
4
PUMPA PUMPB CAD2L3L3
PUMPB PUMPA
PUMPC CAD2L4L4
OLITBUL OMD2IL
SMU SMU SMU
SAB SAB SAB
CAD2L5L5 CAD2C5C5
CAD2L6L6 CAD2C6C6
OADM Equipment
CAD2L7L7 CAD2C7C7
CAD2L8L8 CAD2C8C8
CAD2L5L5 CAD2C5C5
CAD2L6L6 CAD2C6C6
3
7
CAD2L7L7 CAD2C7C7
Rack 2: 300 W
CAD2L8L8 CAD2C8C8
SMU SMU
SAB SAB

OMDFIC OLITPC CAD2C1C1
PUMPA CAD2C2C2
c
OPA OMD2IC CAD2C3C3

PUMPA
EAM4C CAD2C4C4
OLITPC EAM4C CAD2C1C1
OLITBC OMDFIC CAD2C2C2
PUMPC
2
1
0
PUMPA PUMPB CAD2C3C3
PUMPB PUMPA
Rack 3: 1139 W
PUMPC CAD2C4C4
OADMU, C+L Bands, 160 Channels, with Maximum Configurable Add/Drop Capacity
OSCTUI OLITBC OMD2IC
MCU SMU SMU
MIB SAB SAB SAB
A42022-L5936-C51-1-7618
Information
4.4.4 CCU Equipment

Network element OTT #1
Network element OTT #2
subrack 3
subrack 3
OM20C5C6
OM20C3C4 OM20C7C8
OD20C5C6
OD20C7C8
OM20C5C6
OM20C7C8
OD20C5C6
OD20C7C8
OMD2IC
OMD2IC
S
S
M
M
U S
A U S
A
1 5 9 13 18 B
1 5 9 13 18 B
subrack 2
OD20C1C2
OD20C3C4
OM20C1C2
subrack 2
OM20C1C2
OM20C3C4
OD20C1C2
OD20C3C4
OMDFIC
OMDFIC
S
M S
U S M
A U S
1 5 9 13 18 B A
1 5 9 13 18 B
cable compartment
cable compartment
4x UDCM
4x UDCM
PUMP C *
PDP
PUMP C *
PDP
subrack 1
subrack 1
PUMP C
PUMP B
PUMP A
PUMP A
PUMP B
PUMP C
OLI TPC
OLI TBC
OSCTUT
PUMP B
PUMP A
PUMP A
PUMP B
RPumpC
OPA *
OSCTUT
OLI TPC
OLI TBC
RPumpC
I
OPA *
MB I
C S MB
5
US C S
5 U S
A
2 5 6 7 10 13 14 15 16 18 B A
2 5 6 7 10 13 14 15 16 18 B
cable compartment
cable compartment
Network element CCU
PDP
subrack 2
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
S
M
U S
A
2 4 6 8 10 12 14 16 18 B
cable compartment
PDP PDP
subrack 4
subrack 1
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
S S
M M
U S U S
A A
2 4 6 8 10 B 2 4 6 8 10 12 14 16 18 B
cable compartment cable compartment
PDP PDP
M
subrack 0
subrack 3
OSCTUT
I
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
OCAS
S M B
M C S
U S U S
A A
2 4 6 8 10 12 14 16 18 B 2 4 6 8 10 12 14 16 18 B
cable compartment cable compartment
Fig. 4.14 CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM)
Fig. 4.14 shows the CCU network element in a typical application, combined with two
back-to-back OTT network elements.
A42022-L5936-C51-1-7618 125
The subrack of the CCU network element may be equipped with the following modules:
• MCU/SMU
• SAB
• OCA/OCAS/OCS
4.5 Display and Operating Elements on Equipment

• NE Alarm Panel
• SAB Boards and Subrack Address Setting
• Module Front Panel Features
4.5.1 NE Alarm Panel

Alarms of the subrack are indicated on the NE Alarm Panel (NEAP, see Fig. 4.15). The
NEAP contains a small board and is installed above the fan unit slots of the subrack. It
contains the indication LEDs as Power On (4x green), major equipment alarm (red), mi-
nor equipment alarm (yellow), major communication alarm (red), minor communication
alarm (yellow) and ACO (Alarm Cut-Off) (blue). In addition for control, one button (black)
for lamp test (to switch on all LEDs via cards) and one (blue) for ACO (to acknowledge
indicated alarms) are fitted.
The LEDs on it are visible and connectors are contactable even if the subrack front cover
is mounted.
All rack alarms are derived from the supervision unit MCU of the subrack. The signals
effect visible and audible alarms on top of the rack. All subrack alarms are connected by
cable to the power distribution and alarm panel PDP or other equipment on the top of
the rack.
At the NEAP front side, there also is a rotary switch for setting the subrack addresses
(see Fig. 4.16).
On the right half of the NEAP there are located three connectors:
– Ethernet interface 10/100BT
– Serial interface F-IF
– Handset connector
Fig. 4.15 NE Alarm Panel
4.5.2 SAB Boards and Subrack Address Setting

The following applies for the Subrack Address Board (SAB) and the subrack address
setting:
– Every subrack (single-row subrack and double-row subrack) is equipped with one
SAB. The SAB provides necessary information for the PCB/CAN bus.
– At OADM NEs, the SABM board is needed because of the potentially large number
of subracks required. At an OADM, the SABM replaces the SAB in the subrack that
contains the MCU. This subrack should always be placed in the middle of the sub-
rack chain.
– All subracks in an OTT or OLR are always equipped with an SAB.
126 A42022-L5936-C51-1-7618
– Subrack addresses are set via a small rotary switch that is placed at the NEAP (see
Fig. 4.16). This switch has 8 positions (switch is marked by the numbers 0 to 7).
– In a double-row subrack, the address of the lower row is always an even number.
The address of the upper row is equal to the lower row address increased by 1. So,
it always is an odd number.
☞ For details on how to perform the subrack addressing, refer to the ITMN.
Fig. 4.16 Subrack Address Setting
4.5.3 Module Front Panel Features

Each module includes the following features:
– Large top and bottom insertion/extraction aids that allow the module to be easily in-
stalled and removed from the SURPASS hiT 7550 subrack. A latching mechanism
ensures a positive lock.
– Green OK LED and red Fault LED.
– Debug port (for use by authorized personnel only). This port is used at active mod-
ules only.
– The front panel on OM/OD, OLI, PUMP, RPUMP, OCA, and OCAS modules also
shows the warning symbols for laser radiation (for examples, refer to the Chapter
"Protective Measures" of the Installation and Test Manual ITMN).
A42022-L5936-C51-1-7618 127
128 A42022-L5936-C51-1-7618
5 Software
• Fault Management
• NE Software Management
• Management PC Software
5.1 Fault Management

Current Alarm List
Fig. 5.1 shows an example of a Current Alarm List. This window displays all alarms that
are currently active in the NE. Alarms that have cleared are automatically purged from
this list. The Current Alarm List features the following:
Checkboxes to select which alarm severities are listed. You may

choose to list any or all of the following: Critical alarms,
Major alarms, Minor alarms or Warnings. You may also
choose to list Acknowledged alarms, Unacknowledged
alarms, or both. To acknowledge an alarm, right-click on it
and choose “Acknowledge” or use the Fault pull-down
menu to acknowledge all listed alarms at once.
Counters that display the current number of each type of alarm (Crit-
ical, Major, Minor, and Warning). These are read-only
fields.
Alarm List This is the actual listing of details for each Current Alarm.
For each alarm, the following is listed (from left to right):
Severity Icon This is a colored circle that allows you to quickly identify
the severity of listed alarms. Red = Critical, Orange = Ma-
jor, Yellow = Minor and Blue = Warning. A blue box sur-
rounding any colored circle indicates that the alarm is
unacknowledged
Object The name of the SURPASS hiT 7550 2.05 component re-
porting the alarm. This can be the name of a module, or a
system entity such as “Monitoring Point” or “External
Alarm”.
Location The location of the Object reporting the alarm, i.e. the
module name, slot number, and/or port number.
Alarm The actual alarm event. Since there is limited space on the
Alarm List, abbreviations are used for the alarm events.
Severity The severity level associated with the event (Critical, Ma-
jor, Minor, or Warning).
State “Acknowledged” or “Unacknowledged”. To acknowledge
an alarm, select it and right-click the mouse. Or use the
Fault pull-down menu to Acknowledge all alarms at once.
Also, note that by clicking the mouse on any of the column headings, it is possible to
change the order in which the alarms are listed. For example, click on the “Severity”
header to toggle between listing the alarms in most-to-least severe order and vice versa.
A42022-L5936-C51-1-7618 129
Checkboxes Counters
Select which alarms you want to display. These show the total number of each type
Select any or all of the following: of alarm appearing in the Current Alarm List.
These are read-only fields.
Critical
Major
Minor
Warning
Acknowledged
Unacknowledged
Severity Icons
Red = Critical
Orange = Major
Yellow = Minor
Blue = Warning Alarm
A blue box around the icon List
indicates that the alarm area
is unacknowledged.
Click on any of the column Details Listed for Each Alarm

headings to change the order
in which alarms are listed. Name of the component reporting the alarm. This can
Object be the name of a module or an entity such as a
transmit or receive interface.
Location of the Object reporting the alarm; module
Location
name, slot number, port number.
The actual alarm event. They are highly abbreviated in
this window.
Alarm For detailed explanation of all alarms, refer to the OnlineHelp.
Severity Critical, Major, Minor, or Warning.

Acknowledged or Unacknowledged. To acknowledge an
State alarm, right-click on it, or use the Fault pull-down menu
to acknowledge all alarms at once.
Fig. 5.1 Current Alarm List (Example)
130 A42022-L5936-C51-1-7618
History Alarm List

Fig. 5.2 shows an example of a History Alarm List. This window displays a history log
of all alarms that have been reported by this NE since the EM session was established.
The History Alarm List is basically the same as the Current Alarm List described above
with the following exceptions:
– Cleared Alarms are listed in the History List, but not in the Current List.
– Date and time stamps are listed for each alarm in the History List.
You may specify the maximum number of entries in this list via the Option Settings dia-
log box.
Checkboxes
Select which alarms you want to display. Choices Click this button to
are the same as for the "Current Alarm" listings.
clear the contents
of the History TCA List.
Details Listed for Each Alarm

Click on any column heading to The details listed for each alarm are the same as those for the "Current Alarm"
change the order in which alarms listings (see previous Figure) with the following differences:
are listed.
Alarms that have cleared are listed.
Time and date the alarm was reported are listed.
You may specify the maximum number of Alarms listed in this window via the Option Settings dialog box.
Fig. 5.2 History Alarm List (Example)
A42022-L5936-C51-1-7618 131
5.2 NE Software Management

The MCU holds two complete versions of the APS (Application Program System) soft-
ware for all modules in its NE, the “Active” APS and the “Inactive” APS. If a new APS
version needs to be downloaded to the MCU, it is first stored as the “Inactive” version,
then swapped to become the “Active”. This way, the original APS is recoverable if the
new APS proves unstable. The APS contains one software image of each module. Soft-
ware version numbers for all modules are obtainable from the Active APS.
Fig. 5.3 NE Software Management
The “Software Management” window provides a means to check the compatibility of the
Active APS (Application Program System) with installed modules and to download a
new APS if desired.
132 A42022-L5936-C51-1-7618
5.3 Management PC Software

’SURPASS hiT 7550’ local craft terminal: the network management software for Win-
dows 2000 platforms is supplied on one compact disk.
’SURPASS hiT 7550’ network craft terminal: the network management software for Win-
dows 2000 platforms is supplied on a separate compact disk. Each CD includes the fol-
lowing components:
– SURPASS hiT 7550 2.x Element Manager software
– Siemens ’TNMS CT’ Local Craft Terminal (LCT) / Network Craft Terminal (NCT) soft-
ware
– TMN-DCP OSI Stacks.
A42022-L5936-C51-1-7618 133
134 A42022-L5936-C51-1-7618
6 Commissioning, Operation and Maintenance

• Commissioning
• Operation
• Maintenance
6.1 Commissioning
The SURPASS hiT 7550 2.05 has to be configured on initial commissioning. For this
purpose, a Local Craft Terminal (LCT) has to be connected to the LCT interface at the
COPA front side. The craft terminal offers a graphical, menu-driven Element Manager
(EM) user interface.
Detailed information for commissioning of equipment and the operating terminals can
i be found in the Installation and Test Manual ITMN.
6.2 Operation
Operation of SURPASS hiT 7550 2.05 equipment is explained in detail in the Operator
i Guidelines OGL and in the Online Help.
6.2.1 Operating and Display Elements of the Modules

LED Displays of the Modules
For assistance in maintenance work, there are a red fault LED and a green service sta-
tus LED on the front of every module. For some modules the red LED has some special
meanings (see Online Help).
Operating Elements of the Modules

No hardware settings have to be made on the printed circuit boards of the modules. The
modules are configured by software commands of the EM user interface (or from a net-
work management system) when commissioning or in case of later changes.
Module configuration by software is explained in the Operator Guidelines OGL.
i
6.2.2 Operation with an Operating Terminal

For local or remote control and monitoring of the SURPASS hiT 7550 2.05 by means of
the EM user interface, the ’TNMS CT’ LCT/NCT software also must be installed and
connected on the PC. The EM application communicates with the MCU module of the
SURPASS hiT 7550 2.05 equipment using the gateways provided by the TNMS CT soft-
ware.
For local control/monitoring a PC only with ’TNMS CT’ LCT software installed must per-
i manently be allocated to the local NE.
A42022-L5936-C51-1-7618 135
6.3 Maintenance
Maintenance of SURPASS hiT 7550 2.05 equipment is described in the Operator
i Guidelines OGL and in the Online Help.
The alarm and maintenance concept of the system provides sufficient alarm information
to localize and clear the fault at module level. The equipment has been designed in such
a way that no regular settings are required.
Maintenance measures (e. g. fault localizing) can be carried out locally or under remote
control using the EM user interface and the ’TNMS CT’ LCT/NCT software.
136 A42022-L5936-C51-1-7618
7 Technical Data
This chapter describes the most important SURPASS hiT 7550 2.05 technical parame-
ters. The chapter consists of the following sections:
• Physical Layer Parameters
• Rack/Subrack Mechanical Data
• Technical Characteristics of Modules
• Rack/Subrack Power Supply
• Electrical Power Consumption of Modules
• Electrical Power Consumption of Racks
• External Interfaces
• System Environmental Specifications
• System Requirements for the Element Manager
A42022-L5936-C51-1-7618 137
7.1 Physical Layer Parameters

General information
Maximum number of channels 160
Bit rate/line coding of optical tributary signals 10 Gbit/s NRZ
Maximum bit error ratio user configurable 10-12 to 10-16 ; typ. 10-13
Supported fibre types SSMF, DSF, NZDSF according to G.652, G.653

and G.655
DMC (Dispersion Managed Cable)
Wavelength Grid compliant to ITU-T G.692
Interface at point MPI-SM
Maximum mean channel output power 11.0 dBm (depending on channel count)
Minimum mean channel output power -5.0 dBm (depending on channel count)
Maximum mean total output power of each wave- depends on the type of optical line amplifier used; refer
length band (C or L) to the technical characteristics of the OLI modules in
Tab. 7.13
Central frequency compliant to ITU-T G.692
Channel spacing 50 GHz for 80 channels per C or L band

100 GHz for 40 channels per C or L band
Maximum central frequency deviation 2.5 GHz for 50 GHz channel spacing
10 GHz for 100 GHz channel spacing
Minimum channel extinction ratio 10 dB
Optical path (single span) from point MPI-SM to MPI-RM
Maximum attenuation 40 dB using Raman pumps
Minimum attenuation 15 dB
Minimum optical return loss for 1 span: –17 dB w/o Raman, –20 dB with Raman
for 10 spans: –25 dB w/o Raman, –26 dB with Raman
for 30 spans: –29.7 dB w/o Raman, –30.7 dB with Ra-
man
Maximum discrete reflectance for 1 span: –20 dB w/o Raman, –23 dB with Raman
for 10 spans: –27 dB w/o Raman, –29 dB with Raman
for 30 spans: –31.7 dB w/o Raman, –33.7 dB with Ra-
man
Maximum differential group delay 40 ps for 1 dB OSAR penalty
Interface at point MPI-RM
Maximum mean channel input power -15 dBm (depending on channel count)
Minimum mean channel input power -26 dBm (depending on channel count)
Maximum mean total input power +2.0 dBm
Maximum channel power difference 12 dB
Maximum optical path penalty for n spans 1.8 dB + √n 0.5 dB
Maximum receiver reflectance –27 dB
Tab. 7.1 Physical Layer Parameters
138 A42022-L5936-C51-1-7618
Meaning of the above mentioned reference points:

MPI-SM: a multichannel reference point on the optical fibre just after the output optical
connector of the NE transport interface
MPI-RM: a multichannel reference point on the optical fibre just after the input optical
connector of the NE transport interface
7.2 Rack/Subrack Mechanical Data
7.2.1 Rack Mechanical Data

Infinity MTS uses standard ANSI racks or ETSI racks (see Tab. 7.2 and Tab. 7.3) opti-
mized for electrical and optical cabling.
Parameter Dimension
Height 2200 mm
Height (usable) 2050 mm

Width 600 mm
Usable width between rack uprights 500 mm
Depth 300 mm
Depth (usable) 280 mm
Weight of the unequipped ETSI subrack about 59 kg
Tab. 7.2 ETSI Rack Dimensions According to ETS 300
Parameter Dimension (mm) Dimension (ft/HU)
Height 2134 7 ft
2286 7 1/2 ft1)
2438 8 ft1)
Height (usable) 1867 42 HU2) (7 ft rack)

2045 46 HU (7 1/2 ft rack)
2178 49 HU (8 ft rack)
Width 660 2 ft, 2 inch
Usable width between rack uprights 546 21.5 inch
Depth 305 12 inch
1) In some customer applications 7 1/2 ft and 8 ft high racks are used

2) 1 HU = 1 3/4 inch = 44.45 mm
Tab. 7.3 ANSI Rack Dimensions
A42022-L5936-C51-1-7618 139
7.2.2 Subrack Mechanical Data
Parameter ETSI ANSI
Overall height (including cable compartment) 578 mm 578 mm
Overall width with flanges 533 mm 583 mm
Overall width without flanges 500 mm 500 mm
Mounting center distance 515 mm 566.7 mm
Mounting depth (front) 125 mm 125 mm
Rack spacing 600 mm 578 mm
Weight of the unequipped single-row subrack 19 kg
Tab. 7.4 Subrack Dimensions and Weight (Single Row Subrack)
Parameter ETSI ANSI
Overall height (including cable compartment) 968 mm 968 mm

Overall width with flanges 533 mm 583 mm
Overall width without flanges 500 mm 500 mm
Mounting center distance 515 mm 566.7 mm
Mounting depth (front) 125 mm 125 mm
Rack spacing 975 mm 978 mm
Weight of the unequipped double-row subrack about 26 kg
Tab. 7.5 Subrack Dimensions and Weight (Double Row Subrack)
Parameter ETSI ANSI
Height (rack spacing) 100 mm 88.9 mm
Height 88 mm 88 mm
Width (overall) 533 mm 583 mm
Width between mounting holes 515 mm 567 mm
Depth (max.) 280 mm 280 mm
Weight of the empty DCM shelf about 5 kg
Tab. 7.6 Mechanical Specifications for DCM Shelf
140 A42022-L5936-C51-1-7618
7.3 Technical Characteristics of Modules

The following modules are described in this section:
• MCU Module
• MIBS Module
• SAB/SABM Module
• SMU Module
• OSCTUT and OSCTUI Modules
• OLI Modules
• PUMPA, PUMPB, and PUMPC Modules
• Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)
• OMDFxx and OMD2xx Modules
• OM20xx and OD20xx Modules
• CAD2 Modules
• EAM4 Module
• OPA Module
• OCA, OCAS, and OCS Modules
• UDCM Modules
7.3.1 MCU Module
Used at: One MCU in main shelf of each SURPASS hiT 7550 2.05 NE
Module dimensions 25 mm wide x 265 mm high x 235 mm deep

(0.98 inch wide x 10.43 inch high x 9.25 inch deep)
Slots used 1
Weight 2.0 kg
Power consumption (see Chapter 7.5)
Front panel fibre connectors None
Front panel LEDs OK (green) and FAULT (red)
OSS interfaces Q3 over TCP/IP (RFC1006) / 7-layer OSI Stack / Q-F Stack
Office alarm outputs Major audible/visual and Minor audible/visual Form C relays. Pow-
er Fail Form B relay. All relays are 100 mA maximum.
In addition, each shelf features an Alarm Cut-off (ACO) button,
Lamp Test button, and Fan Unit Failure LEDs.
Tab. 7.7 MCU Module
7.3.2 MIBS Module
Used at: One MIB in main shelf of each SURPASS hiT 7550 2.05 NE
Module dimensions 7.5 mm wide x 50 mm high x 235 mm deep

Slots used 1 (in combination with one SAB or SAB-M module)
Weight 0.05 kg
Tab. 7.8 MIBS Module
A42022-L5936-C51-1-7618 141
FEPROM storage capacity 32 MByte
Tab. 7.8 MIBS Module (Cont.)
7.3.3 SAB/SABM Module
Used at: One SAB in each subrack
Module dimensions 7.5 mm wide x 90 mm high x 235 mm deep

Slots used 1 (may be combined with one MIB module)
Weight SAB: 0.03 kg, SAB-M: 0.06 kg
Power consumption SAB/SABM (see Chapter 7.5)
SABM: this module hosts an additional CAN bus amplifier/repeater and replaces the SAB module in the
main controller (MCU) subrack in OADM NEs.
Tab. 7.9 SAB/SABM Module
7.3.4 SMU Module
Used at: One in each subrack row of all SURPASS hiT 7550 2.05 NEs ex-
cept for main subracks containing the OSCTU

Slots used 1
Weight 0.8 kg
Tab. 7.10 SMU Module
7.3.5 OSCTUT and OSCTUI Modules
OSCT Module Types
OSCTUT OSCT, Unidirectional, for use at Terminal NEs (OTT)
OSCTUI OSCT, Unidirectional, for use at In-line NEs (OLR, OADM)
Specifications
Used at: all SURPASS hiT 7550 2.05 NEs (exact type as appropriate)
Module Dimensions 50 mm wide x 265 mm high x 235 mm deep

Slots used 2
Weight 1.7 kg
Tab. 7.11 OSCT Module Types
142 A42022-L5936-C51-1-7618
Front panel fibre connectors 2 LC/PC for OSCTUT modules

4 LC/PC for OSCTUI modules
Front panel LED’s OK (green) and Fault (red)
External interfaces 2 V.11 for customer 64 kbit/s channels

2 4-wire Voice Engineering Orderwire (EOW)
16 housekeeping inputs and 4 outputs
EOW implementation 2x4-wire interfaces (#1 and #2, 64 kbit/s PCM with A or µ law) with
access via connector panel,
4-wire interface #1 can also be used for the DTMF handset;
4-wire interface #2 is used for an EOW connection to another NE
at the same site.
Laser Class Class 1
OSC Capacity 2 Mbit/s
OSCT Module Optical Characteristics
OSC Wavelength 1625 8 nm
Tx Output Power Range 0.0 dBm .. -3.0 dBm (typical: -1.0 dBm)
Rx Input Power Range -15 dBm .. -50 dBm
EOL Span Loss Range 15.0 dB .. 40.0 dB at 1550 nm (47 dB at 1625 nm)
Line Coding CMI
Tab. 7.11 OSCT Module Types (Cont.)
7.3.6 OLI Modules
OLI Module Classification
According to the Special Tasks
Basic type amplifier A cost-effective amplifier type with reduced tilt setting facilities.
OLIS TP/ I /TB Used in short links (lengths of 500 to 800 km) with only a low num-
ber of spans or in longer links combined together with extended or
standard type OLIs.
Standard type amplifier A high performance amplifier with gain tilt control facility.
OLI TP/ I /TB
Extended type amplifier A high performance amplifier with extended gain tilt monitoring
OLI TP/ I /TB with GTM (GTM) and controlling facilities. Used for bridging a larger number
of spans in a link.
According to the Application
OLI (S)TP Terminal Preamplifier. Used at terminal sites for amplifying the in-
coming line signal before it is fed into the demultiplexing stage.
OLI (S)I Inline Amplifier. Used at in-line sites for optical regeneration of the
signal.
OLI (S)TB Terminal Booster. Used at terminal sites for amplifying the outgo-
ing line signal.
According to the Used Wavelength Band
Tab. 7.12 OLI Module Classification
A42022-L5936-C51-1-7618 143
OLITPC C band. This amplifier module operates in the

OLIIC C band and can be upgraded with an OLI-UL module for additional
OLITBC support of the L band. Available in versions with and w/o GTM.
OLITPUL Upgrade L band. This amplifier module operates in the L band.

OLIIUL This upgrade module is used for combined C+L-band applications.
OLITBUL Available in versions with and w/o GTM.
OLITPL L band. This amplifier module operates in the L band. It is specifi-

OLIIL cally designed for standalone L-band applications where C band
OLITBL operation is not required. Available in versions with and w/o GTM.
OLITPNC C band. This amplifier module operates in the C band. It is specif-

OLITBNC ically designed for standalone C-band applications where L-band
OLIINC operation is not required. It offers higher span performance due to
the removal of the C/L band splitters, which results in lower inser-
tion loss. Available in versions with and w/o GTM.
OLISTPNC C band, using basic type OLI module. This amplifier module oper-
OLISTBNC ates in the C band and cannot be upgraded to C+L band operation.
OLISINC It consists of performance optimized amplifiers.
Tab. 7.12 OLI Module Classification (Cont.)
Specifications for All Types of OLI Modules
Used at: All NEs (exact type as applicable).

Basic type OLI currently only available in OTTU and OLRU.
Overall dimensions 75 mm wide x 265 mm high x 235 mm deep

Slots used 3
Weight 4.0 kg (3.8 kg for basic type OLI)
Electrical power consumption (see Chapter 7.5)
Front panel fibre connectors 3 pigtails with E2000/HRL for connection of pump modules
2 duplex LC/PC for L-C-Band amplifier interconnection
2 LC/PC for optical signal monitoring
2 LC/PC for line-in and line-out fibre connections
1 LC/PC for the OSC
at OLII (inline amplifier) stations one additional LC/PC
connector for the OSC is provided
Front panel LED’s OK (green) and FAULT (red)
Maximum output power 24 dBm per C/L band (depends on OLI type)
Laser class Class 1 with APSD
Automatic power shut-down (APSD) –28.0 +/ – 2.0 dB

level
Maximum return loss at LC connec- 30 dB for booster input

tors 35 dB for line input and output
Pump leakage <0 dBm (<1.0 mW)
Multichannel gain variation/difference 1.0 dB (C band)

1.0 dB (L band)
1.6 dB (C band only) with basic type OLI module
Tab. 7.13 Specifications for OLI Modules
144 A42022-L5936-C51-1-7618
Multichannel gain tilt 0.7 dB/dB (C band) (this tilt is compensated with internal tilt filters)
1.0 dB/dB (L band) (this tilt is compensated with internal tilt filters)
0.7 dB/dB (C band only) with basic type OLI module

(this is compensated by EDFA pretilt + GTC pretilt)
Specifications for Specific Types of OLI Modules
OLITBC / OLIIC
Maximum total mean output power 17.5 dBm in standard configuration

20.5 dBm with optional PUMPA module
22.3 dBm with optional PUMPA and PUMPB module
23.5 dBm with optional PUMPA, PUMPB and
PUMPC module
Per channel mean output power range -5.0 dBm <= Pout <= +11.0 dBm
(depending on channel count)
Required per channel mean output power range -2.0 dBm <= Pout <= +7.0 dBm
(40 channels)
Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLITBC
-26.0 dBm <= Popt <= -15.0 dBm for OLIIC

OLITPC / OLITPL / OLITPUL / OLITPNC

22.0 dBm with optional PUMPA module at OTTU Rx
or 21.3 dBm with optional PUMPA module at
OADMU
(40 channels)
Per channel mean input power range -26.0 dBm <= Popt <= -15.0 dBm
OLITBL / OLIIL / OLITBNC / OLIINC

PUMPC module
(40 channels)
Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLITBL/
OLITBNC (depending on channel count)
-26.0 dBm <= Popt <= -15.0 dBm for OLIIL/OLIINC

Tab. 7.13 Specifications for OLI Modules (Cont.)
A42022-L5936-C51-1-7618 145
OLITBUL / OLIIUL

PUMPC module
Per channel mean output power range -5.0 dBm <= Pout <= +11.0 dBm at C-band line out-
put (depending on channel count)
(40 channels)
OLISTBNC / OLISINC
Maximum total mean output power 18.0 dBm
Per channel mean output power range -5.0 dBm <= Pout <= +5.0 dBm (at OLI line output,
depending on channel count)
(40 channels)
Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLISTBNC
-26.0 dBm <= Popt <= -15.0 dBm for OLISINC

OLISTPNC
Maximum total mean output power 18.5 dBm
Per channel mean output power range -5.0 dBm <= Pout <= +5.5 dBm (at OLI line output,
depending on channel count)
(40 channels)
Tab. 7.13 Specifications for OLI Modules (Cont.)
146 A42022-L5936-C51-1-7618
7.3.7 PUMPA, PUMPB, and PUMPC Modules
Specifications
Used at: optional at any SURPASS hiT 7550 2.05 NE

Slots used 1
Weight 1.15 kg
Optical connector type E2000 angled. Connector is located inside the module
(behind front panel)
On-board laser diodes PUMPA: two 1480 nm laser diodes

PUMPB: two 1495 nm laser diodes
PUMPC: two 1465 nm laser diodes
Maximum optical output power 450 mWatt (26.5 dBm)

Tab. 7.14 PUMPA, PUMPB, and PUMPC Modules
For use of pump modules with different OLI module variants and the corresponding total
i output power of the OLI modules refer to Chapter 7.3.6.
A42022-L5936-C51-1-7618 147
7.3.8 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)
Specifications
Used at: optional at any SURPASS hiT 7550 2.05 NE

Slots used 2
Weight 2 kg
Front panel fibre connectors RPumpC: 2 LC/PC and 1 Duplex LC/PC

RPumpL: 2 LC/PC
RPumpUL: 1 Duplex LC/PC
Maximum optical output power < 27 dBm (< 500 mW)
Raman Pump Module Types

RPUMPC "Raman Pump, C band". Raman pump for C-band wavelengths.
RPUMPUL "Raman Pump, Upgrade L band". Raman pump that can be used
only in combination with the RPUMPC module for a system that
uses both the C band and L band.
RPUMPL "Raman Pump, L band". Raman pump to be used with systems

that will be L band only.
Tab. 7.15 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)
148 A42022-L5936-C51-1-7618
7.3.9 OMDFxx and OMD2xx Modules
Used at: OTTU (100% OADM) and OADMU NEs

Slots used 2
Weight OMDFI C/L: 1.8 kg

OMD2I C/L: 1.8 kg
OMDF C/L: 1.5 kg

Front panel fibre connectors OMDFIC: 12 LC/PC
OMDFIL: 12 LC/PC
OMDFC: 6 LC/PC
OMDFL: 6 LC/PC
OMD2IC: 6 LC/PC
OMD2IL: 6 LC/PC
Front panel LED’s none

Maximum return loss with LC connec- 35 dB
tors
Bandwidth (1 dB) 16 GHz
Even-odd channel isolation 25 dB
Active temperature controlled over -5˚C .. +65˚C (not for OMDFC/L)
Tab. 7.16 OMDFxx and OMD2xx Modules
A42022-L5936-C51-1-7618 149
7.3.10 OM20xx and OD20xx Modules
Used at: OTTU (100% OADM) and OADMU NEs
Module dimensions 100 mm wide x 265 mm high x 235mm deep

Slots used 4
Weight OD20xx 3.1 kg
Weight OM/ODA20xx 4.1 kg
Front panel fibre connectors 24 LC PC
Front panel LED’s none
Input power range for OM20xx adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)
Output power range for OD/ODA20xx - 14 dBm to - 2.0 dBm per channel
Maximum return loss at LC connector 35 dB

Adjacent channel isolation 22 dB
Non-adjacent channel isolation 40 dB
Temperature stability range -5˚C .. +65˚C via passive compensation
Tab. 7.17 OM20xx and OD20xx Modules
7.3.11 CAD2 Modules
Used at: OADMU NEs

Slots used 2
Weight 1.5 kg
Front panel fibre connectors 8 LC/PC
Add-channel input power range 0 dBm +/ - 4.5 dB
Drop-channel output power range - 12.0 dBm to - 6.0 dBm
Adjacent channel isolation 22 dB
Non-adjacent channel isolation 36 dB
Switching time < 15 ms
Maximum return loss at LC connector 41.0 dB
Temperature stability The given parameters are valid for the whole operating tempera-
ture range of 0˚C ... 65 ˚C
Tab. 7.18 CAD2 Modules
150 A42022-L5936-C51-1-7618
7.3.12 EAM4 Module
Used at: OADMU NEs

Slots used 2
Weight 1.0 kg
Temperature stability range 0 ˚C to 65 ˚C
Tab. 7.19 EAM4 Module
7.3.13 OPA Module
Used at: optional at OTTU (100% OADM), OADMU and OLRU NEs

Slots used 3
Weight 3 kg
Temperature stability range - 5˚C to +70 ˚C
OSNR measurement range 8 dB to 28 dB
Resolution bandwidth 0.1 nm
Measurement grid 100 GHz
Tab. 7.20 OPA Module
A42022-L5936-C51-1-7618 151
7.3.14 OCA, OCAS, and OCS Modules
Used at: CCU NEs together with OTTU (100% OADM) and OADMU
Module types OCAC, OCAL: module with four single channel amplifiers for C/L
band
OCASC, OCASL: module with four single channel amplifiers and
with optical switches for C/L band
OCS: module with optical switches only (for C and L band)
L band modules are not available in the current release.

Slots used 2
Weight OCA, OCAS: 3.0 kg

OCS: 1.7 kg
Front panel fibre connectors LC/APC connectors
Front panel LED’s OK (green) and FAULT/LOS alarm (red)

Amplifiers (EDFAs) OCAC/OCAL/OCASC/OCASL: four single channel amplifiers
Add-channel input power range adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)
Drop-channel output power range - 12.0 dBm to - 6.0 dBm
Switching time < 15 ms
Mean input power range –15.0 to –3.0 dBm (OCA, OCAS)
Mean output power range OCA: +3 to +8 dBm, typical +7.5 dBm

OCAS: -3 to + 2 dBm
Optical switches OCS/OCASC/OCASL: two 2:1 switches per channel (four chan-
nels) for add/drop or express traffic
Temperature stability OCS: - 5˚C to +70 ˚C

OCA, OCAS: 0˚C to +50˚C
Tab. 7.21 OCA, OCAS, and OCS Modules
152 A42022-L5936-C51-1-7618
7.3.15 UDCM Modules
Specifications
Shelf size (UDCM tray) 583 mm wide x 88.2 mm high x 300.3 mm deep
(23 inches wide x 3.5 inches high x 11.8 inches deep)
UDCM dimensions (up to 4 fit into a 268 mm wide x 40.8 mm high x 294 mm deep
UDCM Tray) 10.5 inches wide x 1.6 inches high x 11.6 inches deep
Weight UDCM, depending on type:

10 km to 80 km: 3.15 kg + n x 0.12 kg (“n” for each 10 km = 1 ... 8);
90 km to 120 km: 3.7 kg + n x 0.12 kg (“n” for each 10 km = 9 ... 12)
UDCM tray: 5.0 kg
Maximum return loss without LC con- 27 dB

nector (Rayleigh backscatter)
UDCMC (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation

for SSMF
Type Average Dispersion at 1550 nm

UDCMC-10 -170 ps/nm
UDCMC-20 -340 ps/nm
UDCMC-30 -510 ps/nm
UDCMC-40 -680 ps/nm
UDCMC-50 -850 ps/nm
UDCMC-60 -1020 ps/nm
Relative dispersion slope RDS = 0.0035 / nm
UDCMCA (C band) Unidirectional Dispersion Compensation Modules

for SSMF
UDCMC-10A -170 ps/nm
Tab. 7.22 UDCM Modules
A42022-L5936-C51-1-7618 153
UDCML (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation

for SSMF
UDCML-10 -187 ps/nm
UDCML-20 -374 ps/nm

UDCML-30 -561ps/nm
UDCML-40 -748 ps/nm
UDCML-50 -935 ps/nm
UDCML-60 -1122 ps/nm

UDCMCP (C band) Unidirectional Dispersion Compensation Modules for NZDSF and DSF with Pos-
itive Slope Compensation
UDCMC-48P 48 ps/nm
UDCMC-80P 80 ps/nm
UDCMC-128P 128 ps/nm
UDCMCN (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for
NZDSF+ (Truewave RS)
UDCMC-170N -170 ps/nm
Tab. 7.22 UDCM Modules (Cont.)
154 A42022-L5936-C51-1-7618
UDCMLN (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for
NZDSF+ (Truewave RS) and DSF
UDCML-170N -170 ps/nm


UDCMCH (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for
NZDSF+ (LEAF & Freelight)
UDCMC170H -170 ps/nm
UDCMLH (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for
NZDSF+ (LEAF & Freelight) and DSF
UDCML170H -170 ps/nm
Tab. 7.22 UDCM Modules (Cont.)
A42022-L5936-C51-1-7618 155
7.4 Rack/Subrack Power Supply

Nominal supply voltage –48/–60 Vdc
positive grounded
Supply voltage range –40.5 Vdc to –75 Vdc
Each two circuit breakers/fuses (at PDP) for:

– OADM double-row subrack equipped with OLI modules 20 A
– all other subracks 15/16 A
7.5 Electrical Power Consumption of Modules
Module Electrical power consumption
typical maximum
CAD2 3.6 W 5.3 W
EAM4 3.6 W 5.3 W

Fan Box 25 W 50 W
MCUB 15 W 25 W
MIBS 1W 1W
OD20 3.6 W 5.3 W
OM20 3.6 W 5.3 W
OLI Modules 65 W 120 W

(40 W for basic type OLI) (75 W for basic type OLI)
OMDFI C/L 10.6 W 24 W
OMDI C/L 10.6 W 24 W
OMDF C/L 0.2 W 0.2 W
OPA 25 W 31 W
OSCTUI/OSCTUT 10 W 18 W
PUMPA 25 W 45 W
PUMPB 25 W 45 W
PUMPC 25 W 45 W
RPUMPC 85 W 110 W
RPUMPL 85 W 110 W
RPUMPUL 55 W 70 W
OCA, OCAS 21 W 26 W (C band)

35 W (L band)
OCS 16 W 18 W
SAB 0.5 W 0.5 W
SABM 1W 1W
SMU2 7W 12 W
UDCM 0.2 W 0.2 W
Tab. 7.23 Electrical Power Consumption of Modules
156 A42022-L5936-C51-1-7618
7.6 Electrical Power Consumption of Racks

For details on the electrical power consumption of fully-populated racks, refer to
Fig. 4.11 to Fig. 4.13.
A42022-L5936-C51-1-7618 157
7.7 External Interfaces

Optical Line Interface
Connector LC/PC
Mean channel output power - 5 dBm .. +11 dBm
Mean channel input power - 26 dBm .. - 15 dBm
OSC output power range - 2.0 dBm .. - 5.0 dBm
OSC input power range - 15 dBm .. - 50.0 dBm
Optical Tributary Interface

Connector LC/PC
Input power adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)
Wavelength stabilization for 10 Gbit/s 2.5 GHz for 50 GHz channel spacing
10 GHz for 100 GHz channel spacing
Required extinction ratio 10 dB

Required receiver dynamic range - 14 dBm .. – 2dBm
T3 Clock Interface
Connector D-SUB 9
Compliant to G.703 (10.98)
Frequency 2048 kHz 4.6 ppm
Impedance 75 Ohms coaxial pair

120 Ohms symmetrical pair
Peak voltage 0.75 to 1.5 Vop at 75 Ohms

1.0 to 1.9 Vop at 120 Ohms
User Data Channels (sV.11)
Data channel similar to ITU-T V.11
Number of available bi-directional 2

channels
Connector 2 D-SUB 9 pin connectors
Bit rate 64 kbit/s
Input impedance 150 Ohms +/– 10% balanced
Max.imum load resístance 150 Ohms balanced
Output voltage (line a to b) 2 to 5 V (at Ri = 150 Ohms)
Input voltage (line a to b) 0.3 to 6 V
Used overhead bytes F0, NU1, NU2
Engineering Orderwire
Realization 4-wire interface and handset
Transmission range 300 to 3400 Hz
Dialing:
– method DTMF
– transmit level – 14 to – 9 dBm0
– receive level – 30 to 0 dBm0
Tab. 7.24 External Interfaces
158 A42022-L5936-C51-1-7618
Modulation method PCM, A / µ-law
Bit rate 64 kbit/s
Input/output impedance
– handset 600 / 150 Ohms balanced
– 4-wire interface 600 / 600 Ohms balanced
Input level – 4/ – 10/ 0 dBr (settable via SW)
Output level – 4/ + 7/ – 12 dBr (settable via SW)
Connector Western plug (handset) and D-SUB 9 pin (4-wire interface)

Used overhead bytes E0, F0
Telemetry Interface (TIF)
Telemetry inputs (sensors)
Number of inputs available per sub- 16

rack
Input voltage range – 75 V to 0 Vdc (SELV) / central office battery supply (TNV-2)
Voltage range for active state – 3 V .. 0 V

Voltage range for inactive state – 75 V .. – 10 V
Input current (input connected to 1 to 3 mA

ground)
Telemetry outputs (actors)
Number of outputs available per sub- 4

rack
Output voltage range 0 V to +/– 75 Vdc (SELV) / central office battery supply (TNV-2)
Maximum current (active) 200 mA
Maximum impedance active state 16 Ohms
Maximum impedance inactive state 100 kOhms
Connector D-SUB 25
NEAP
User Interface 2 Major alarm LED’s (Communication and Equipment)

2 Minor alarm LED’s (Communication and Equipment)
1 Acknowledge LED
1 Acknowledge button
1 Lamp test button
4 Power on LED’s
1 EOW conference LED
Connector Handset connector
LCT Interface
Connector 1 10 BaseT connector (Q interface)

1 RS-232 9 pin D-SUB connector (F interface)
Tab. 7.24 External Interfaces (Cont.)
A42022-L5936-C51-1-7618 159
7.8 System Environmental Specifications

Operating range:
– according to ETSI standard 300 019
class 3.1E –5˚ to +45˚ C (temperature of air flowing into the subracks)
– according to Bellcore GR 63 +5 to +40˚ C; short term: +5 to +50˚ C
– exceptions for the OCA/OCAS mod- –5 to +48˚ C at an air flow of >1m/s

ules in the CCU network element (–5 to +55˚ C for a maximum of 96 contiguous hours during a max-
imum of 15 days a year and at an air flow of >1m/s)
Storage range:
– according to ETSI standard 300 019
class 1.2 –25˚ to +55˚ C
– according to Bellcore GR 63 –40˚ to +70˚ C during a maximum of 72 hours
Humidity 5% to 90%
Altitude -100 m to 4000 m
Environmental standards ETS 300 019 and Bellcore GR63

EMC standards EN 300 386-2 - V1.1.3 (1997-12)
Safety standard EN 60950 (according to most actual and valid issue)

FCC Part 15, Subpart J, Class A
ESD per GR-1089
Tab. 7.25 System Environmental Specifications
7.9 System Requirements for the Element Manager

The computer onto which this software is installed must have the following attributes. As
always, PCs operating at faster speeds are recommended for better performance.
CPU Pentium IV 1.8 GHz
Memory 1 GB
Hard Disk Drive 30 GB
Monitor Color monitor 21” recommended
LAN Ethernet card, 2x 3COM (3C982-TXM)
Operating System Windows® 2000
Tab. 7.26 EM System Requirements
160 A42022-L5936-C51-1-7618
8 Product Overview
An overview of the main components used for SURPASS hiT 7550 2.05 is provided
in the ITMN.
A42022-L5936-C51-1-7618 161
162 A42022-L5936-C51-1-7618
9 Abbreviations
10BaseT Q3/Ethernet Interface
AC/DC Converter
ACO Alarm Cut-Off
ACSE Application Control Service Element
ALS Automatic Laser Shutdown
ANSI American National Standard
APR Automatic Power Reduction
APR Automatic power reduction
APS Application Program System
APSD Automatic Power Shutdown
ASCII American Standard Code for Information In-
terchange
ASE Amplified Spontaneous Emission
ATM Asynchronous Transfer Mode
AUX Auxiliary Channel
BSD Berkely Software/Standard Distribution
Bw7R Narrow-Rack Style 7R
CAD2 Channel Add/Drop module 2 wavelengths
CAN Controller Area Network
CCU Channel Connection Unit
CDM Cross Domain Manager
CLK Clock
CLNP Connectionless Network Layer Protocol
(G.784)
CMI Code Mark Inversion
CMIP Common Management Information Proto-
col
CMISE Common Management Information Service
Element
CMX Cross Multiplexer
COPA Connector Panel (rear or front access)
CORBA Common Object Request Brocker Architec-
ture
CPS Card-Present-Sense
CPU Central Processing Unit
DCC Data Communication Channel
DCC-M Data Multiplex Channel-Multiplex Section
DCCMo Data Communication Channel Multiplex
(OMS DCC)
DCCOo Data Communication Channel Optical (OTS
DCC)
A42022-L5936-C51-1-7618 163
DCC-R Data Multiplex Channel-Regenerator Sec-

tion
DCF Dispersion Compensating Fibre
DCM Dispersion Compensation Module
DCN Data Communication Network
DEMUX Demultiplexer
DSF Dispersion Shifted Fibre
DSP Digital Signal Processor
D-SUB Sub-Miniature Connector
DTMF Dual Tone Multi Frequency
DWDM Dense Wavelength Division Multiplex
EAM4 Equalizing Module
ECC Embedded Communication Channel
EDFA Erbium Doped Fiber Amplifier
EDI Electronic Data Interface
EEPROM Electrical Erasable Programmable Read-
Only Memory
EFEC Enhanced Forward Error Correction
EM Element Manager
EMC Electromagnetic Compatibility
EML Element Management Layer
EN Enable European Standard
EOW Engineering Order Wire
ESD Electrostatic Discharge
ES-IS Enhanced Signaling and Interworking Sub-
system
ETS European Telecommunication Standard
ETSI European Telecommunication Standards
Institute
EXC Excessive Bit Error Ratio
Ext External Alarm
F Standardized Interface for Connection of
the Operating Terminal
FAN Fiber Access Network
FCC Federal Communications Commission
(USA)
FE Functional Unit
FEC Forward Error Correction
FEPROM Flash Erasable Programmable Read-Only
Memory
FMX Flexible Multiplexer
FPGA Field Programmable Gate Array
GTC Gain Tilt Control
164 A42022-L5936-C51-1-7618
GTM Gain Tilt Monitor

GUI Graphical User Interface
HDLC High-Level Data Link Control/Procedure
HRL High Return Loss (Connector Type)
HU Height Unit
HW Hardware
I Inline amplifier
IP Internet Protocol
IS-IS Integrated system for fulfilling the infrastruc-
ture requirements of fiber optics systems
ISO International Standards Organization
ITMN Installation and Test Manual
ITU International Telecommunication Union
ITU-T Telecommunication Standardization Sector
of ITU
LAPD Link Access Point Discriminator
LCC Local Card Controller
LCT Local Craft Terminal
LDAP Lightweight Directory Access Protocol
LEAF Large Effective Area Fiber
LED Light Emitting Diode
LF Loop Filter
LOF Loss Of Frame (G.783)
LOL Loss Of Light
LOS Loss Of Signal
MAC Media Access Control
MCF Message Communication Function
MCU Main Control Unit
MD Monitor Diode
MIBS Management Information Base (Small)
MPI-RM Multi-Point-Interface-Receiver Module
MPI-SM Multi-Point-Interface-Synchronous Multi-
plexer
MTS Multiwavelength Transport System
MUX Multiplexer
MVM Multi-Vendor Management
NCT Network Craft Terminal
NE Network Element
NEALI Network Element Alarm Interface
NEAP Network Element Alarm Panel
NI Network Interface
NML Network Management Layer
A42022-L5936-C51-1-7618 165
NRZ Non Return to Zero

NSAP Network Service Access Point
NUBAT Battery Voltage (negative)
NZDSF Non Zero Dispersion Shifted Fibre
Och Optical channel
OCP Optical Channel Protection
OCR Optical Channel Repeater
OCR10G Optical Channel Repeater 10 Gbit/s
OCU Optical Channel Unit
OD Optical Demultiplexer
OD20 Optical Demultiplexer 20 channels
OGL Operator Guidelines
OLI Optical Line Interface
OM20 Optical Multiplexer 20 channels
OMD Optical Multiplexer/Demultiplexer
OMS Optical Multiplex Section
OSC Optical Supervisory Channel
OSCT Optical Supervisory Channel Termination
Card
OSI Open System Interconnection (G.784)
OSIAM Open System Interconnection Access Man-
ager
OSIAM OSI Protocol Stack API Message
OSN Optical Service Node
OSNR Optical Signal/Noise Ratio
OSPF Open Shortest Path First
OSS Operational Support System (e. g. TNMS)
OTS Optical Transmission Section
PCB Peripheral Control Bus
PD Photo Diode
PDH Plesiochronous Digital Hierarchy (G.783)
PDP Power Distribution Panel
PHF Power High Failure
P-LD Photo-Laser Diode
PLF Power Low Failure
PLL Phase Locked Loop
Pout Output Power ,,,,,
PPP Point-to-Point Protocol
pSOS provably Secure Operating System
PSU Power Supply Unit
PUBAT Battery Voltage (positive)
PWR Power
166 A42022-L5936-C51-1-7618
Q Interface to a Telecommunication Manage-

ment Network
Q3 Q-Interface acc. to Info-Model
RAM Random-Access Memory
RDI Remote Defect Indicator
RDS Relative Dispersion Slope
RFC Request For Commands
RPUMP Raman PUMP
RS Regenerator Section
Rx Receive Data
RX Receiver
SAB Subrack Address Board
SABM Subrack Address Board Modificated
SC Supervisory Channel
SD Signal Degrade (G.782)
SDH Synchronous Digital Hierarchy
SDRAM Synchronous Dynamic Random Access
Memory
SEMF Synchronous Equipment Management
Function
SIPAC Siemens Packaging System
SL16 Synchronous Fiber-Optic System for STM-
16 Signals
SL64 Synchronous Fiber-Optic System for STM-
64 Signals
SLR Synchronous Line Regenerator
SLR16 Synchronous Line Regenerator STM-16
SLT Synchronous Line Terminal
SMA Synchronous Multiplexer Access
SMTP Simple Mail Transfer Protocol
SMU Supervisory Management Unit
SNMP Simple Network Management Protocol
CMIP
SONET Synchronous Optical Network (uses Ameri-
can Standard)
SPI Serial Peripheral Interface
SPM Self Phase Modulation
SRA Synchronous Radio Access
SRAM Static RAM
SRS Stimulated Raman Scattering
SSM Synchronization Status Message
SSMF Standard Single Mode Fibre
STM-1 Synchronous Transport Module Level 1
A42022-L5936-C51-1-7618 167
SURPASS hiT 7540Optical Channel Unit (OCU)

SURPASS hiT 7550 2.05Long Haul /
SURPASS hiT 7550Long Haul /
SURPASS hiTSiemens Next Generation Network Solution
for Optics
SURPASS Brandname for the Siemens Next Genera-
tion carrier networking solutions
SW Software
SXA Siemens SDH Synchronous Cross Connect
- VC-12
SXD Siemens SDH Synchronous Cross Connect
- VC-4
t.b.d. to be defined
T0 System Clock
T2 Internal Clock Reference Signal
T3 Input for External Clock Reference Signal
TB Terminal Booster
TCP/IP Transmission Control Protocol/Internet Pro-
tocol
TDM Terminal Digital Multiplexer
TED Technical Description
TempP Temperature Problem
TEX Ten Gigabit Multiplexer
TIF Telemetry Interface
TMF Telemanagement Forum
TMN Telecommunications Management Network
TMN-DCP Telecommunications Management Net-

work-Data Communication Protocol
TMNS Transport Network Management System
TMNS-MVM TMNS-Multi-Vendor Management
TNMS CT TNMS Craft Terminal
TP Terminal Preamplifier
TP Termination Point
TP0 Transport class 0
Tx Transmit Data
TX Transmitter
UBAT Battery Voltage
UDCM Unidirectional Dispersion Compensation
Module
UDP User Datagram Protocol
UHC Ultra-High Capacity
UL Underwrites Laboratory
168 A42022-L5936-C51-1-7618
ULED Feeding Bus for Card LEDs

ULH Ultra Long Haul
UNIX Trademark of UNIX System Laboratories In-
corporated
VCDB Variable Configurable Data Block
VOA Variable Optical Attenuator
WDM Wavelength Division Multiplexing
WTTR Regenerative Transponder
XPM Cross Phase Modulation
A42022-L5936-C51-1-7618 169
170 A42022-L5936-C51-1-7618
10 Index
Symbols allowable customer input signal range 28
"C" (Conventional) band 53 amplification process 67
"even numbered" channels 57 ANSI 88, 116
"L" (Long) band 53 ANSI racks 111, 139
(APSD) threshold levels and behavior 67 ANSI subracks 115
“Active” APS 132 APS (Application Program System) software 132
“Inactive” APS 132 APSD bit 24
“Inactive” version 132 ARP protocol for Ethernet 43
“Unidirectional” 60 Asymmetrical architectures 76
’TNMS CT’ LCT/NCT software 136 asynchronous serial busses 83
’TNMS CT’ Local Craft Terminal (LCT) 133 Asynchronous Transfer Mode (ATM) services 17
attributes 160
automatic and manual routing 38
Numerics
Automatic Laser Restart 24
100 GHz spacing 58 Automatic Laser Shutdown (ALS) 24
100BaseT 46 Automatic Power Reduction (APR) 23
10BaseT 46 Automatic Power Shutdown (APSD) 23, 67
16 bi-directional add/drop channels 74
16 wavelengths from the C Band 73
B
16 wavelengths from the L Band 73
160 channel DWDM signal 62, 63 backbone networks 68
2 Mbit/s Optical Supervisory Channel (OSC) 86 basic OLI module design 67
20 optical wavelengths 102 battery 48/60V 111
3 dB coupler 60 bi-directional channel operation 73
3 dB couplers 58, 96 Bit Error Rate (BER) of 10-13 27
3W3 115 Blue C band 57
4 sub-bands 62 booster amplification 67
48/60V 111 booster amplifier output 34, 36
50 GHz spacing 58 broadband EDFAs 65
Bw7R 83
A
C
abbreviations used in the figures 96
AC/DC station converter 111 C (Conventional) 65
access to/from the application 43 C and L Band amplifiers 34, 36
according to PPP 47 C and L Band EDFAs 66
accuracy of the clock 107 C Band 53
ACO (Alarm Cut-Off) (blue) 126 C Band and L Band EDFAs 69
ACSE 43 C/L Band separation filter 62
active modules 100 CAD2 73, 102
Add Channel 29 CAD2 block diagram 103
Add channel and drop channel “ageing control” 102 CAN Bus 83
add/drop 73 CAN bus repeater/amplifier 86
add/drop WDM filters 102 card detection 85
addition and termination of optical signals 71 Card Inventory Management information 85
additional Ethernet interface 46 Card present information 96
Additional safety mechanisms 26 carrier OSNR 37
adjustable tilt filter 29 carrier power 37
ageing control 100 cascaded 76
alarm and maintenance concept 136 CD 133
alarm information 136 central monitoring 83
alarm panel PDP 126 change in traffic topology 73
Alarms 129 Channel Add/Drop (CAD2) module 102
Alarms of the subrack 126 channel distribution 29
A42022-L5936-C51-1-7618 171
channel powers 29 double-row 111, 116

channel spacing 58 Drop Channel 29
chromatic dispersion 106 DSF 106
chromatic dispersion coefficients 68 DWDM link performance 28
Class 1 levels 23 DWDM signal parameters 33
Cleared Alarms 131 DWDM solutions on 10 Gbit/s transmission
Client signal ageing 29 systems 65
client signals 62 DWDM system 27
client’s receiver 102 dynamic routing 43
CLNP 43
clock signal (T3) 107 E
clock synchronization 86 EAM4x 103
CMIP agent 43 ECC communication interfaces 83
CMISE/CMIP (ITU X.710/X.711) 42 EDFA 27
commissioning 135 EEPROMs 88
commissioning and maintenance operations 42 effect of ageing client transmitters 28
communication interfaces 44 electrical and optical cabling 139
communication network 47 electrical interfaces 86
communication stack profiles supported 44 electrical power consumption 157
communication stacks 43 element layer management 38
Compact Disk 133 Element Manager (EM) 40, 108
compatibility to existing OSI networks 46 Element Manager (EM) user interface 135
compensate for tilts 29 Element Manager software 133
complementary documentation 11 EM 109
configuration and performance parameters 43 EM application program 41
Configuration Management 108 EM Screen Tree 109
connector panel COPA 115 EM session 131
constant pump current control 29 EM user interface 135, 136
control element 110 End of Life (EOL) 27
control functions 83 end system 43
COPA 86, 107 end terminal equipment 24
COPA front side 135 energy scattering effect 69
CORBA based 39 EOL capacity 76
CORBA Interface 39 EOW 88
craft terminal 135 EOW 4-wire interfaces 86
Cross Phase Modulation (XPM) 106 Equipment Management 108
Current Alarm List 129 Erbium Doped Fibre Amplifier (EDFA) technology 65
currently unequipped sub-band 73 ES-IS 43
customer documentation 11 Ethernet and DCC interfaces 43
Ethernet interface 46
D ETS 300386-1 111
Data Communication Channel 21 EN 55022 111
data link (layer 2) protocol 46 ETS 300 132-2 111
Date and time stamps 131 ETSI 88, 116
DC power distribution 111 ETSI rack 139
DCC interfaces 43 express 73
DCF spectral attenuation 29 external clock 107
DCF SRS tilt 29 external OLI pumps 29
DCM management 106 extra APSD mechanisms 26
DCM shelves 120 extra pump modules 68
Debug port 127 extreme bottom right slot 85
demultiplexing 64
dielectric multiplexer/demultiplexer filters 62 F
Dispersion Compensating Fibre (DCF) 106 FAN alarms 88
Dispersion Shifted Fibre 67
172 A42022-L5936-C51-1-7618
FAN control and supervision 86 IP (address, routing tables) 43

FAN units 88 IP based applications (TL1, Web Terminal) 47
Fault LED 127 IP packages on Ethernet 47
Fault Management 108 IP packets 47
fibre attenuations 68 IP to NSAP address mapping 43
fibre break 23 IS-IS 43
fibre spectral attenuation 29 ITU terminology 43
fibre types 68 ITU-T G.692 wavelength grid 60
F-interface 46 ITU-T Recommendation. G.653 67
first booster amplifier 24
first EDFA stage 68 L
first sub-band output 62 L (Long) Band 65
flat output spectrum 29 L Band 53
Forward Error Correction (FEC) 27 L Band (1570 to 1607nm) 66
frequency interleavers 62 lamp test 126
front panel on OM/OD, OLI, PUMP and RPUMP LAPD (in unacknowledged mode) 47
modules 127 large span loss range 94
fully-populated racks 157 Laser Class 3B 23
functionality 53 latching mechanism 127
layers 2 (DCC, MAC) 43
G LCT 133, 135
Gain Tilt Monitor (GTM) 29 LCT interface 135
gateway functionality 47 LCT Network Management software 133
LED control 86
H LEDs 86
higher frequency (lower wavelength) 69 list of OSCTU functions 88
History Alarm List 131 live traffic 34
history log 131 local card controller 86
http 43 Local Card Controller (LCC) 83
hub/switch 46 local commissioning 40
local or remote control and monitoring 135
logical broadcast network topology 46
I
loss of input signal (LOS) 24
indication LEDs 126 Loss of Light (LOL) count 37
individual wavelengths 57 loss of the OSC 24
inelastic collisions 69 low dispersion 58
information addressed 47 low loss 58
information model 42 low noise 68
information models (interface dialects) 44 low power 68
infrastructure 66 lower frequency (higher wavelength) 69
initial commissioning 135 lowest cost per channel 62
inline amplification 67
input noise filter 111
M
insertion/extraction aids 127
integration time (15 min.) 100 Mach-Zehnder 58
inter-card communications 83 Main Control Unit (MCU) 83
interference 58 main DWDM traffic signal 91
interferometer technology 58 main subrack 86
interleaver 57, 62 main traffic signal 24
interleavers 58 Maintenance measures 136
intermediate optical amplifier sites 71 maintenance operations 40
Internet Protocol (IP) services 17 major communication alarm (red) 126
inter-subrack data communications 85 major equipment alarm (red) 126
inter-symbol interference 106 Management Communication Function (MCF) 83
inventory management 86 Marben 43
A42022-L5936-C51-1-7618 173
master system clock (T0) 107 OK LED 127

MCU 132 OLI 91
MCU module 135 OLI card 92
MCU’s clock 107 OLI interstage APSD 26
measured carrier frequency (GHz) 37 OLI interstage device surveillance 26
mechanical equipment layout 111 OLI module 92
menu-driven 135 OLI module basic block diagram 92
message communication function (MCF) 43 OLI modules 91, 111
MIBS 83 OLI preamplifier pump lasers 100
mid-stage access points 67 OLI pump cards (PUMPA, PUMPB, PUMPC) 121
minor communication alarm (yellow) 126 OLI pump currents 29
minor equipment alarm (yellow) 126 OLI PUMP modules 94
mode of operation (inactive, OSI only, IP only, OSI OLIIC module 67
and IP combined) 47 OLITBUL 67
module 127 OLR 126
Modules 121 OLR NE 67
monitor diodes 100 OM20 58
multiple Q3 managers 46 OM20/OD20 100
multiplexing architecture 63, 64 OMD 96
OMD2IC 96
N OMD2IL 96
NCT 133 OMDFC 96
NCT Network Management software 133 OMDFIC 96
NCT PC 42 OMDFIL 96
NE Alarm Panel 126 OMDFL 96
NE Alarm Panel (NEAP) 85 on board OLI pumps 29
NE alarms LED control (minor/major equipment on-board EEPROM 94, 100
alarms) 88 OPA 37, 65
NEALI 83 OPA card 121
NEAP 86, 126 Optical Add/Drop Multiplexer (OADM) 18, 71
NEAP front side 126 Optical Add/Drop Multiplexer site (OADMU) 36
Network Control Terminal (NCT) 42 Optical Add/Drop Multiplexer Unidirectional
Network Craft Terminal (NCT) 133 (OADMU) 60
Network Element Alarm Panel (NEAP) 46 optical amplifier modules (OLI) 64
network layer 38 Optical inLine Repeater (OLR) 18, 65
network management capabilities 110 Optical inLine Repeater Unidirectional (OLRU) 60
Network Management System (NMS) 42 Optical Laser Safety 100
network planning 73 Optical Line Interface (OLI) module 21
new APS 132 Optical Line Interface (OLI) modules 91
noise filters 111 optical link budget 67
nominal voltage 111 optical link control 83
non-linear effects 68 Optical Multiplexer/Demultiplexer (OMD) modules 96
non-linear fibre effect 29 Optical Multiplexer/Optical Demultiplexer
non-traffic interrupting 73 (OM20/OD20) modules 100
non-traffic interrupting upgrade 66 optical parameters 33
NZDSF(-) 106 optical path 60
optical path through the OADM 71
Optical Performance Analyzer 33
O
Optical Performance Analyzer (OPA) 34
OADM double row subrack 111 optical power monitoring 100
OADMU add/drop interfaces 29 Optical Signal to Noise Ratio (OSNR) 27
OADMU NEs 102 optical spectrum analyzer 29
OAM&P 108 Optical Spectrum Analyzer (OSA) 34
OD20 58 Optical Supervisory Channel 20
ODA20 100 optical supervisory channel 21
174 A42022-L5936-C51-1-7618
Optical Supervisory Channel Termination (OSCT) power distribution 126

module 86 power line input 111
Optical Supervisory Channel Termination Card Unidi- power lines 111
rectional (OSCTU) 21 Power Low Failure (PLF) 100, 102
optical system performance and control 33 Power On (4x green) 126
Optical Terminal OTT 40 power outputs 23
optical transmission 60 power supply 111, 115
optical transmission distances 65 PPP 46
Optical Transport Terminal (OTT) 18, 60 preamplification 67
optical/electrical cable 95 preamplifier output 34, 36
optimum gain flatness 27 Presentation 43
optimum gain point 27 Pre-Tilt compensation filter 68
Option Settings dialog box 131 protection earth 111
OSC 86 pull-down menus 109
OSC byte 86 PUMP 95
OSC clock 24 pump modules 68
OSC signal power 24 PUMPA 95
OSCT 86 PumpB 69
OSCT block diagram 86 PumpC 69
OSCT module 107, 115
OSCTU 85, 86, 96 Q
OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP Q3 information model 42
packets 46 Q3 information model of the TCP/IP stack
OSI layer 3 protocols (CLNP, ES-IS and IS-IS) 47 parameters 43
OSI or IP packages 47 Q3-CMIP 42
OSI packages to 7 layer OSI DCC 47 Q3-CMIP management 47
OSI packages via ES-IS 47 Q3-CMISE interface 110
OSI part 43
OSI Q3-CMISE 42
R
OSI stack by means of RFC1006 43
OSI/ISO upper layers 43 Rack 111
OSIAM stack 43 rack alarms 126
OSPF 43 rack dimensions 116
OSPF (basic parameter set) 43 rack power distribution panel PDP 111
OSPF from Ethernet to DCC 47 rack with double row subracks 111
OSPF protocol 47 rack with single row subracks 111
OSS 42 Raman amplification 27, 69
OTT 60, 126 Raman crosstalk 106
OTT of a C+L Band system 67 Raman PUMP (RPUMP) modules 96
overall network performance 67 Raman pump currents 29
Raman pump output power 23
Raman pump wavelength 69
P
Raman pumps 29, 121
path length difference 58 Raman Tilt 68
PCB (Peripheral Control Bus) 83 real time operating system 43
PCB/CAN bus 126 real-time clock 107
PC-based Local Craft Terminal (LCT) 46 Red C band 57
PDP 111, 126 Red/Blue band separation filters 62
Peltier controlling elements 95 Red/Blue C Band 62
Performance Management 108 relevant standards 111
physical interface 44 remote commissioning or maintenance operations 40
planar shelf 111 remote control 136
plug-in cards 58 remote end of the DCC line 47
polarization-dependent effects 58 remote NEs 47
possible equipping options 121 remotely configurable add/drop channels 73
power connectors 115
A42022-L5936-C51-1-7618 175
remotely configured as an “add/drop” 73 stable technology 62

replaceable units 85 stack profiles 44
required EDFA output power 27 Standalone L Band DWDM system 67
required total EOL capacity 76 Standalone L Band system (RPUMPL) 70
requirements for the element manager 108 standard multi-vendor NML/EML management
respective bias current of each laser 29 interface 39
reverse direction 63 standards 111
RFC1006 47 static route configuration 43
rotary switch 126 Stimulated Raman Scattering (SRS) 29, 69
route packages 47 sub-bands 57
router detection 43 subrack 111, 127
Routing 43, 47 Subrack Address (SAB) Module 85
routing protocols 43 Subrack Address Board (SAB) 126
Routing two protocols 47 subrack address information 85
RPUMP 96 subrack address setting 126
RS-232/V.24 interface 46 subrack addresses 126
subrack alarms 126
S subrack front cover 126
SAB 83, 85, 126 Subrack Management Unit (SMU2) 88
SABM 86, 126 subrack types 116
SDH/SONET performance monitoring 34 subracks 111
second EDFA stage 68 supervision unit MCU 126
Security Management 108 Supervisory Channel 107
SELVSafety Extra Low Voltage 159 support several network servers 38
SEMF function 83 supported stack profiles 44
separation filters 62 SURPASS hiT 7550 2.05 17
Serial Peripheral Interface (SPI) Bus 85 SURPASS hiT 7550 functionality 53
service and application protocol 42 SURPASS hiT 7550 modules 80
service layer 38 SURPASS hiT 7550 NE types 60
service provisioning and monitoring 38 SURPASS hiT 7550 technical parameters 137
Session 43 symmetrical add/drop 76
shelf and rack alarm outputs 83 system environment of OLI modules 91
Shutdown functionality 23
Siemens ’TNMS CT’ 133 T
Siemens 10 Gbit/s SDH line systems 17 T3in clock input 86
Siemens Management Solution 38 T3LOS alarm 107
signal performance 27 TCP (connection table) 43
signaling data 115 TCP/IP part 43
simple point to point RS-232/V.24 interface 46 TCP/IP stack 47
single-row 111, 116 TCP/IP stack for the NE 43
site OTT/OLR/OADM 23 Telecommunication Management System (OSS) 42
SMU2 85, 88, 96 Telemanagement Forum (TMF) 39
SMU2 block diagram 88 telnet 43
SNMP specifications 43 temperature sensors 95
software 160 Terminal Booster (TB) 67
software commands 135 Terminal Preamplifier (TP) 67
software image 132 thin-film filter devices 57
span losses 27 third and final EDFA stage 68
spectral control 68 three different Raman pump modules 69
SPI (Synchronous Peripheral Interface) 88 three-stage optical amplifier 67
SPI bus connection 86 TIF alarm contacts 86
SPM (Self Phase Modulation) 106 tilt effect 29
SPM optimization 106 tilt filter 29
SRS 69 tiltl 29
SSMF 106 time-critical operations 83
176 A42022-L5936-C51-1-7618
TMN-DCP OSI Stacks 133 Windows PC 42

TNMS (Transport Network Management System) 38
TNMS-CDM (Cross Domain Manager) 38
TNMS-Core 38
TNMS-Core/CDM support 38
TNMS-Multi-Vendor Management Platform 39
total amplifier gain 27
total capacity 66
total DWDM link performance 28
total EDFA output power 27
total input power 27
total number of optical spans 70
total output power 27
transmission directions 66
transport class 0 (TP0) services 43
transport class 4 (TP4) services 43
transport protocol 47
transported and routed in the DCC 46
two protocols 47
two sub-band outputs 62
U
UBAT1 115
UBAT2 115
UBAT3 115
UBAT4 115
UDCM tray 106
UDCMs 88, 106
UDCMs within the rack 120
Unidirectional Dispersion Compensation Modules
(UDCMs) 106
upgrade from an 80 Channel C Band 66
Upgrade L Band EDFA 66
upgrade path 17
upgrade strategy 66
upper OSI layers 43
upper-layers of Network Element 47
used stack profile 47
User name 108
V
V.11 86
V.24 interface 46
Variable Optical Attenuator (VOA) 27, 68
variants of the OLI module 67
varied span lengths 68
visible and audible alarms 126
VOA 100, 102
Voltage range 111
W
wavelengths 53
WDM multiplexer 95
Windows NT platforms 133
A42022-L5936-C51-1-7618 177
178 A42022-L5936-C51-1-7618

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Information

SURPASS hiT 7550 2.05

Technical Description (TED)

f Important Notice on Product Safety

The same text in German:

Copyright (C) Siemens AG 2003

Issued by the Information and Communication Networks Group

Technical modifications possible.

2.3.7.2 Communication Stacks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.3.11 RPUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

6 Commissioning, Operation and Maintenance . . . . . . . . . . . . . . . . . . . . . . 135

7 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

7.3 Technical Characteristics of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

8 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

Fig. 3.23 OLI Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1 Notes on the SURPASS hiT 7550 2.05 Docu-

1.1 Preliminary Remarks concerning this Release

1.2 Customer Documentation

• Installation and Test Manual (ITMN)

• Operator Guidelines (OGL)

1.3 Complementary Documentation

• DCN Rules for OSI/IP (on customer’s demand)

• Field Test Protocols

1.4 Symbols Used in the Documentation

1.4.1 Symbol for Warnings

1.4.2 Symbols for Notes

⇒ Denotes a point in the text which contains specific handling notes.

☞ Cross reference to other chapters in this manual or cross reference to other

1.4.3 Symbols for Menu Displays and Text Inputs

1.5 Notes on Licensed Software

1.6 Form for your Ideas, Proposals and Corrections

The following points are of particular importance to us:

SIEMENS AKTIENGESELLSCHAFT Name:

Fax +49 89 722 57315 .......................................................................................

I use this manual as My functions include

1) Please mark the unit concerned.

2.2.1 Network Applications

OTT ORL OADM OTT CCU OTT OTT

up to 20% configurable up to 100% add/drop or

2.2.2 Compatibility with Existing Systems

– SURPASS hiT 7540 (OCU) with the following modules:

2.3 SURPASS hiT 7550 2.05 Features

2.3.1 Transmission Functions

2.3.2 Optical Supervisory Channel

OSS (Q) Local (F)

Note: DCCOo is terminated at every NE. DCCMo is also terminated at

Fig. 2.2 The Optical Supervisory Channel

OSC bytes Contents

0 – G.704 basic frame

19 E0: engineering order-wire channel, 64 kbit/s

23 OTS trace identifier

24 to 26 OSC channel status information

27 to 30 Optical link control

31 CRC check for link control information

Tab. 2.1 OSC Byte Mapping

2.3.3 Optical Safety Mechanisms

2.3.3.1 Automatic Power Shutdown Procedure

Single Fiber Break

2.3.3.2 Automatic Power Reduction