NUD3124, SZNUD3124

Automotive Inductive Load

Driver
This micro−integrated part provides a single component solution to
switch inductive loads such as relays, solenoids, and small DC motors
without the need of a free−wheeling diode. It accepts logic level
inputs, thus allowing it to be driven by a large variety of devices www.onsemi.com
including logic gates, inverters, and microcontrollers.
MARKING DIAGRAMS
Features 3 SOT−23
• Provides Robust Interface between D.C. Relay Coils and Sensitive CASE 318 JW6 MG
1 G
Logic 2 STYLE 21
• Capable of Driving Relay Coils Rated up to 150 mA at 12 Volts
JW6 = Specific Device Code
• Replaces 3 or 4 Discrete Components for Lower Cost M = Date Code
• Internal Zener Eliminates Need for Free−Wheeling Diode G = Pb−Free Package
• Meets Load Dump and other Automotive Specs (Note: Microdot may be in either location)

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and SC−74
JW6 MG
PPAP Capable 6 CASE 318F
G
STYLE 7
• These are Pb−Free Devices 1

JW6 = Specific Device Code

Typical Applications
M = Date Code
• Automotive and Industrial Environment G = Pb−Free Package
• Drives Window, Latch, Door, and Antenna Relays (Note: Microdot may be in either location)

ORDERING INFORMATION
Benefits
• Reduced PCB Space Device Package Shipping†

• Standardized Driver for Wide Range of Relays NUD3124LT1G SOT−23 3000 / Tape &
(Pb−Free) Reel
• Simplifies Circuit Design and PCB Layout
SZNUD3124LT1G SOT−23 3000 / Tape &
• Compliance with Automotive Specifications (Pb−Free) Reel

NUD3124DMT1G SC−74 3000 / Tape &

(Pb−Free) Reel
SZNUD3124DMT1G SC−74 3000 / Tape &
(Pb−Free) Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
INTERNAL CIRCUIT DIAGRAMS
Drain (3) Drain (6) Drain (3)

Gate (1) 10 k Gate (2) 10 k 10 k Gate (5)

100 K 100 K 100 K

Source (2) Source (1) Source (4)

CASE 318 CASE 318F

© Semiconductor Components Industries, LLC, 2002 1 Publication Order Number:

October, 2016 − Rev. 13 NUD3124/D
 NUD3124, SZNUD3124

MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)

Symbol Rating Value Unit
VDSS Drain−to−Source Voltage – Continuous 28 V
(TJ = 125°C)
VGSS Gate−to−Source Voltage – Continuous 12 V
(TJ = 125°C)
ID Drain Current – Continuous 150 mA
(TJ = 125°C)
EZ Single Pulse Drain−to−Source Avalanche Energy 250 mJ
(For Relay’s Coils/Inductive Loads of 80 W or Higher)
(TJ Initial = 85°C)
PPK Peak Power Dissipation, Drain−to−Source (Notes 1 and 2) 20 W
(TJ Initial = 85°C)
ELD1 Load Dump Suppressed Pulse, Drain−to−Source (Notes 3 and 4) 80 V
(Suppressed Waveform: Vs = 45 V, RSOURCE = 0.5 W, T = 200 ms)
(For Relay’s Coils/Inductive Loads of 80 W or Higher)
(TJ Initial = 85°C)
ELD2 Inductive Switching Transient 1, Drain−to−Source 100 V
(Waveform: RSOURCE = 10 W, T = 2.0 ms)
(For Relay’s Coils/Inductive Loads of 80 W or Higher)
(TJ Initial = 85°C)
ELD3 Inductive Switching Transient 2, Drain−to−Source 300 V
(Waveform: RSOURCE = 4.0 W, T = 50 ms)
(For Relay’s Coils/Inductive Loads of 80 W or Higher)
(TJ Initial = 85°C)
Rev−Bat Reverse Battery, 10 Minutes (Drain−to−Source) −14 V
(For Relay’s Coils/Inductive Loads of 80 W or more)
Dual−Volt Dual Voltage Jump Start, 10 Minutes (Drain−to−Source) 28 V
ESD Human Body Model (HBM) 2,000 V
According to EIA/JESD22/A114 Specification
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current square pulse 1.0 ms duration.
2. For different square pulse durations, see Figure 2.
3. Nonrepetitive load dump suppressed pulse per Figure 3.
4. For relay’s coils/inductive loads higher than 80 W, see Figure 4.

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 NUD3124, SZNUD3124

THERMAL CHARACTERISTICS
Symbol Rating Value Unit
TA Operating Ambient Temperature −40 to 125 °C
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range −65 to 150 °C
PD Total Power Dissipation (Note 5) SOT−23 225 mW
Derating above 25°C 1.8 mW/°C
PD Total Power Dissipation (Note 5) SC−74 380 mW
Derating above 25°C 3.0 mW/°C
RqJA Thermal Resistance Junction–to–Ambient (Note 5) SOT−23 556 °C/W
SC−74 329
5. Mounted onto minimum pad board.

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 NUD3124, SZNUD3124

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain to Source Sustaining Voltage VBRDSS 28 34 38 V
(ID = 10 mA)
Drain to Source Leakage Current IDSS mA
(VDS = 12 V, VGS = 0 V) − − 0.5
(VDS = 12 V, VGS = 0 V, TJ = 125°C) − − 1.0
(VDS = 28 V, VGS = 0 V) − − 50
− − 80
(VDS = 28 V, VGS = 0 V, TJ = 125°C)
Gate Body Leakage Current IGSS mA
(VGS = 3.0 V, VDS = 0 V) − − 60
(VGS = 3.0 V, VDS = 0 V, TJ = 125°C) − − 80
(VGS = 5.0 V, VDS = 0 V) − − 90
− − 110
(VGS = 5.0 V, VDS = 0 V, TJ = 125°C)
ON CHARACTERISTICS
Gate Threshold Voltage VGS(th) V
(VGS = VDS, ID = 1.0 mA) 1.3 1.8 2.0
(VGS = VDS, ID = 1.0 mA, TJ = 125°C) 1.3 − 2.0

Drain to Source On−Resistance RDS(on) W

(ID = 150 mA, VGS = 3.0 V) − − 1.4
(ID = 150 mA, VGS = 3.0 V, TJ = 125°C) − − 1.7
(ID = 150 mA, VGS = 5.0 V) − − 0.8
− − 1.1
(ID = 150 mA, VGS = 5.0 V, TJ = 125°C)
Output Continuous Current IDS(on) mA
(VDS = 0.25 V, VGS = 3.0 V) 150 200 −
(VDS = 0.25 V, VGS = 3.0 V, TJ = 125°C) 140 − −

Forward Transconductance gFS − 500 − mmho

(VDS = 12 V, ID = 150 mA)
DYNAMIC CHARACTERISTICS
Input Capacitance Ciss − 32 − pf
(VDS = 12 V, VGS = 0 V, f = 10 kHz)
Output Capacitance Coss − 21 − pf
(VDS = 12 V, VGS = 0 V, f = 10 kHz)
Transfer Capacitance Crss − 8.0 − pf
(VDS = 12 V, VGS = 0 V, f = 10 kHz)
SWITCHING CHARACTERISTICS
Propagation Delay Times: ns
High to Low Propagation Delay; Figure 1, (VDS = 12 V, VGS = 3.0 V) tPHL − 890 −
Low to High Propagation Delay; Figure 1, (VDS = 12 V, VGS = 3.0 V) tPLH − 912 −

tPHL − 324 −
High to Low Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V)
tPLH − 1280 −
Low to High Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V)
Transition Times: ns
Fall Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) tf − 2086 −
Rise Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) tr − 708 −

tf − 556 −
Fall Time; Figure 1, (VDS = 12 V, VGS = 5.0 V)
tr − 725 −
Rise Time; Figure 1, (VDS = 12 V, VGS = 5.0 V)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.

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 NUD3124, SZNUD3124

TYPICAL PERFORMANCE CURVES

(TJ = 25°C unless otherwise noted)

VIH
Vin 50%

0V

tPHL tPLH

VOH
90%
Vout 50%
10%
VOL

tf tr

Figure 1. Switching Waveforms

25
Ppk, PEAK SURGE POWER (W)

20

15

10

0
1 10 100
PW, PULSE WIDTH (ms)
Figure 2. Maximum Non−repetitive Surge
Power versus Pulse Width

Load Dump Pulse Not Suppressed: TR

VR = 13.5 V Nominal ±10%
VS = 60 V Nominal ±10% 90%
T = 300 ms Nominal ±10%
TR = 1 − 10 ms ±10%
10% of Peak; VS
Load Dump Pulse Suppressed:
Reference = VR, IR
NOTE: Max. Voltage DUT is exposed to is
NOTE: approximately 45 V.
10%
VS = 30 V ±20% T
T = 150 ms ±20% VR, IR

Figure 3. Load Dump Waveform Definition

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 NUD3124, SZNUD3124

140 14

12

IDSS, DRAIN LEAKAGE (mA)

120
VS, LOAD DUMP (VOLTS)

10
VDS = 28 V
100
8

80 6

4
60
2

40 0
80 110 140 170 200 230 260 290 320 350 −50 −25 0 25 50 75 100 125
RELAY’S COIL (W) TJ, JUNCTION TEMPERATURE (°C)
Figure 4. Load Dump Capability versus Figure 5. Drain−to−Source Leakage versus
Relay’s Coil dc Resistance Junction Temperature

80 34.8
BVDSS BREAKDOWN VOLTAGE (V)
70 34.6
IGSS GATE LEAKAGE (mA)

34.4
60
VGS = 5 V 34.2 ID = 10 mA
50
34.0
40
33.8
VGS = 3 V
30 33.6

20 33.4
−50 −25 0 25 50 75 100 125 −50 −25 0 25 50 75 100 125
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Gate−to−Source Leakage versus Figure 7. Breakdown Voltage versus Junction
Junction Temperature Temperature

1 1
VGS = 5 V
VDS = 0.8 V
0.1
0.01
ID DRAIN CURRENT (A)

ID DRAIN CURRENT (A)

VGS = 3 V VGS = 2.5 V VGS = 2 V 125 °C

0.01

1E−04
0.001
85 °C
1E−06 1E−04

1E−05 25 °C
VGS = 1 V
1E−08
1E−06 −40 °C

1E−10 1E−07
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)

Figure 8. Output Characteristics Figure 9. Transfer Function

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 NUD3124, SZNUD3124

1800 0.20
RDS(ON), DRAIN−TO−SOURCE RESISTANCE (mW)

RDS(ON), DRAIN−TO−SOURCE RESISTANCE (W)

ID = 250 mA
ID = 0.25 A 0.18
1600 VGS = 3.0 V
0.16
1400 0.14
0.12
1200 125 °C 85 °C 25 °C −40 °C
ID = 0.15 A 0.10
1000 VGS = 3.0 V
0.08

800 0.06
ID = 0.15 A 0.04
600 VGS = 5.0 V 0.02
400 0.00
−50 −25 0 25 50 75 100 125 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
TJ, JUNCTION TEMPERATURE (°C) VGS, GATE−TO−SOURCE VOLTAGE (V)

Figure 10. On Resistance Variation versus Figure 11. On Resistance Variation versus
Junction Temperature Gate−to−Source Voltage

36.0
VZ ZENER CLAMP VOLTAGE (V)

35.5

35.0

34.5 −40 °C
25 °C
34.0
85 °C
33.5
125 °C
33.0

32.5

32.0
0.1 1.0 10 100 1000
IZ, ZENER CURRENT (mA)
Figure 12. Zener Clamp Voltage versus Zener
Current

1.0
D = 0.5
RESISTANCE (NORMALIZED)

0.2
r(t), TRANSIENT THERMAL

0.1
0.1
0.05
Pd(pk)
0.02

0.01

0.01 PW t1
t2 PERIOD
SINGLE PULSE DUTY CYCLE = t1/t2

0.001
0.01 0.1 1.0 10 100 1000 10,000 100,000 1,000,000
t1, PULSE WIDTH (ms)

Figure 13. Transient Thermal Response for NUD3124LT1G

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 NUD3124, SZNUD3124

APPLICATIONS INFORMATION

12 V Battery
− +

NO
NC
Relay, Vibrator,
or
Inductive Load
Drain (3)

Gate (1) 10 k
Micro
Processor
Signal
100 K
for
Relay

NUD3124 Source (2)

Figure 14. Applications Diagram

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 NUD3124, SZNUD3124

PACKAGE DIMENSIONS

SOT−23 (TO−236)
CASE 318−08
ISSUE AR

D NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
3 THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
E HE T PROTRUSIONS, OR GATE BURRS.
1 2
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
L A 0.89 1.00 1.11 0.035 0.039 0.044
3X b A1 0.01 0.06 0.10 0.000 0.002 0.004
L1 b 0.37 0.44 0.50 0.015 0.017 0.020
e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008
TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.080
L 0.30 0.43 0.55 0.012 0.017 0.022
L1 0.35 0.54 0.69 0.014 0.021 0.027
A HE 2.10 2.40 2.64 0.083 0.094 0.104
T 0_ −−− 10 _ 0_ −−− 10 _
A1 SIDE VIEW SEE VIEW C c STYLE 21:
PIN 1. GATE
END VIEW 2. SOURCE
3. DRAIN

RECOMMENDED
SOLDERING FOOTPRINT*

3X
2.90 0.90

3X 0.80 0.95
PITCH
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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 NUD3124, SZNUD3124

PACKAGE DIMENSIONS

SC−74
CASE 318F−05
ISSUE N
D NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
6 5 4 THICKNESS OF BASE MATERIAL.
HE E 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
1 2 3
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.90 1.00 1.10 0.035 0.039 0.043
b A1 0.01 0.06 0.10 0.001 0.002 0.004
e b 0.25 0.37 0.50 0.010 0.015 0.020
c 0.10 0.18 0.26 0.004 0.007 0.010
D 2.90 3.00 3.10 0.114 0.118 0.122
E 1.30 1.50 1.70 0.051 0.059 0.067
q e 0.85 0.95 1.05 0.034 0.037 0.041
C L 0.20 0.40 0.60 0.008 0.016 0.024
0.05 (0.002) A
HE 2.50 2.75 3.00 0.099 0.108 0.118
q 0° − 10° 0° − 10°
L
A1 STYLE 7:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1

SOLDERING FOOTPRINT*
2.4
0.094

0.95
1.9 0.037
0.074
0.95
0.7 0.037
0.028

1.0 ǒinches
mm Ǔ
SCALE 10:1
0.039
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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