CR5000 Pcb-Design-Master-Training PDF

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Contents
Preface Welcome to the World of PCB Design
Chapter 1 Using PCB Design Tools

1. Overview of the Lesson ................................................................................................1-1
Chapter 2 PCB Design

1. PCB Design ..................................................................................................................2-1
2. Libraries ........................................................................................................................2-3
z Component Library.........................................................................................................................2-3
z Technology Library .........................................................................................................................2-4
z Design Rule Library........................................................................................................................2-6
z Manufacturing Rule Library ............................................................................................................2-7
3. Resource Files ..............................................................................................................2-8

z PCB Library List File (library.rsc)....................................................................................................2-8
z Managing the PCB Library List File (library.rsc) ...........................................................................2-10
z Editing the PCB Library List File (library.rsc) ................................................................................2-12
z Other Resource Files ...................................................................................................................2-15
Chapter 3 Starting Board Designer

1. Starting the Board Designer..........................................................................................3-1
z Starting Board Designer .................................................................................................................3-2
2. Starting the Board Generation Tool ...............................................................................3-4

z Board Generation Tool ...................................................................................................................3-5
* Resource files ..............................................................................................................................3-7
z Executing the Board Generation Tool.............................................................................................3-9
* Component assignment (Component mapping) ........................................................................3-13
3. Starting the Design Rule Editor ...................................................................................3-15

z Design Rule Editor .......................................................................................................................3-16
* Resource files ............................................................................................................................3-17
z Defining Design Rules Specific to the PC Board ..........................................................................3-18
* Adding Groups and Group Groups, and Adding and Deleting Members....................................3-24
* Application Rule .........................................................................................................................3-29
4. Starting PC Board Shape Edit Tool .............................................................................3-32
z PC Board Shape Edit Tool ........................................................................................................... 3-33
* Resource files for each edit tool ................................................................................................ 3-34
* Loading and outputting parameter.rsc ....................................................................................... 3-35
z Designing PC Board Shape and Layout Area.............................................................................. 3-36
z Designing Height Limit Area ........................................................................................................ 3-39
5. Starting Floor Planner .................................................................................................3-40

z Floor Planner ............................................................................................................................... 3-40
z Stacking Components.................................................................................................................. 3-42
z Displaying Reference Designators .............................................................................................. 3-44
z Selecting Components................................................................................................................. 3-45
z Creating Groups .......................................................................................................................... 3-47
z Editing Group Areas .................................................................................................................... 3-49
z Checking Placement.................................................................................................................... 3-55
* Optional placement grid and clearance area............................................................................. 3-57
z Moving a Component While Pushing Aside Other Components.................................................. 3-60
z Saving Placement Results........................................................................................................... 3-61
* Estimated wire length ................................................................................................................ 3-62
6. Starting Placement/Wiring Tool ...................................................................................3-63

* Land status normalization ......................................................................................................... 3-65
z Placement/Wiring Tool ................................................................................................................. 3-66
z Displaying Nets............................................................................................................................ 3-67
* Net construction ........................................................................................................................ 3-68
* Area Net Display for the Input Wire command .......................................................................... 3-71
z Setting a Grid............................................................................................................................... 3-72
z Moving Components.................................................................................................................... 3-74
z Aligning Components................................................................................................................... 3-78
z Changing Components ................................................................................................................ 3-79
z Generating Components.............................................................................................................. 3-84
z Changing Pin Pitch ...................................................................................................................... 3-85
z Locking Components ................................................................................................................... 3-86
z Executing Component DRC......................................................................................................... 3-87
* Executing Online Check for Component DRC........................................................................... 3-90
z Viewing Wiring Probability Distribution ........................................................................................ 3-91
z Performing Wiring........................................................................................................................ 3-93
z High-level Wiring (L-type Wiring) ................................................................................................. 3-98
z High-level Wiring (Via) ................................................................................................................. 3-99
z High-level Wiring (Auto Avoid) ................................................................................................... 3-101
z High-level Wiring (Neck Down).................................................................................................. 3-101
z High-level Wiring (Spread)......................................................................................................... 3-102
z High-level Wiring (Semi-auto-routing)........................................................................................ 3-103
z High-level Wiring (Change Path) ............................................................................................... 3-104
z High-level Wiring (Tangent Arc, Teardrop) ................................................................................. 3-105
z High-level Wiring (Change Pattern Width or Padstack) ............................................................. 3-106
z High-level Wiring (Shield Wiring) ............................................................................................... 3-108
z Auto-routing (Pair Routing).........................................................................................................3-110
z Auto-routing (Control Wire Length)............................................................................................. 3-111
z Wiring without Net ......................................................................................................................3-113
z Editing Net..................................................................................................................................3-114
z Copying a Wiring Pattern ...........................................................................................................3-115
z Moving by Block .........................................................................................................................3-116
z Locking a Wiring Pattern ............................................................................................................3-117
z Editing an Area...........................................................................................................................3-118
z Reshaping Wiring.......................................................................................................................3-122
z Executing Post-wiring Process...................................................................................................3-123
z Editing a Pad..............................................................................................................................3-126
z Editing a Padstack .....................................................................................................................3-127
z Changing Reference Designator ................................................................................................3-129
* Ref-Des and Original Ref-Des .................................................................................................3-131
z Changing the Stock Code ..........................................................................................................3-132
z Changing the Attributes of Components/Pins.............................................................................3-133
* Resource Files Referenced in Component/Pin Browser ..........................................................3-134
z Generating the Test Point...........................................................................................................3-135
z Lowlight Display .........................................................................................................................3-138
z Executing Area DRC ..................................................................................................................3-139
z Approving Error Information .......................................................................................................3-143
z Executing General DRC .............................................................................................................3-145
7. Starting Artwork Tool .................................................................................................3-146

z Artwork Tool................................................................................................................................3-146
z Starting Artwork Tool...................................................................................................................3-147
z Inputting a Component...............................................................................................................3-148
z Erasing a Component ................................................................................................................3-150
z Moving a Component .................................................................................................................3-150
z Copying a Component ...............................................................................................................3-151
z Changing Component Attributes ................................................................................................3-152
z Inputting Component Symbols ...................................................................................................3-153
z Creating a Hole Drawing ............................................................................................................3-155
z Executing the Symbol Mark Cut .................................................................................................3-159
z Inputting Photo Data.. ................................................................................................................3-161
z Inputting PCB/PNL Layer Data...................................................................................................3-162
* About Document Layers...........................................................................................................3-163
z Viewing a Figure.........................................................................................................................3-164
z Executing Area MRC................. .................................................................................................3-167
* Layers That Can Be Checked in Area MRC Checking.............................................................3-168
* About the Settings Dialog Box .................................................................................................3-176
8. Functions Available for All Tools................................................................................3-177

z Referring to Objects ...................................................................................................................3-178
z Measuring Between Objects ......................................................................................................3-192
z Setting the Display Status of Layer ............................................................................................3-194
z Setting a Visible Layer Group.....................................................................................................3-196
z Setting the Order of Layer Names.............................. ....................................................... ........3-198
z Editing Layer Comment................................. ................................................................... .........3-199
* Displaying a layer comment as a layer name................. .............................................. ...........3-199
z Setting Display Parameters................................ ................................................................... ....3-200
z Setting Search Condition.......................... ....................................................................... ..........3-204
z Using Search Filter .......................................................................................... ..........................3-207
z Displaying Scale or Cursor Coordinates .................................................................................... 3-208
z Using Security Copy Function ................................................................................................... 3-208
z Using Subcanvas....................................................................................................................... 3-209
z Moving Origin... ................................................................................ .........................................3-209
z Setting Highlight........ ............................................................................ ....................................3-210
z Changing Design Rules ............................................................................................................. 3-212
9. Using the Assist Menu ..............................................................................................3-213

z Using Repeat............................................................................................................................. 3-213
z Using Next ................................................................................................................................. 3-214
z Using Another ............................................................................................................................ 3-214
z Using Snap Point....................................................................................................................... 3-215
z Using Next Snap Point............................................................................................................... 3-215
z Using Input Coordinates ............................................................................................................ 3-216
z Inputting X/Y Coordinates.......................................................................................................... 3-216
z Using Relative Point .................................................................................................................. 3-217
z Using Division Point................................................................................................................... 3-217
Chapter 4 Designing Multi-layer Board

1. Inner Layer Design........................................................................................................4-1
z Designing a Power Plane Layer .................................................................................................... 4-2
z Designing a Mixed Layer ............................................................................................................... 4-4
2. Using Interstitial Via ......................................................................................................4-7

z Changing Design Rules (Setting Via Specifications) ..................................................................... 4-8
z Generating Interstitial Via .............................................................................................................. 4-9
z Displaying Via From-to ................................................................................................................ 4-11
Chapter 5 Outputting the PC Board Information

1. Outputting the Component List .....................................................................................5-1
z Using Board List Processor ........................................................................................................... 5-1
2. Printing..........................................................................................................................5-4
z Printing (Hardcopy Image)............................................................................................................. 5-4
z Printing (Data Image)................................................................................................................... 5-16
* Drawing by Command Input (Batch) ......................................................................................... 5-34
Preface Welcome to the World of
PCB Design
The Master Training <PCB Design> is designed to enable you to perform a variety of
settings and operations required for the advanced operator based on basic knowledge
and operation learned in the CR-5000 Beginner's Training <PCB Design> Course.
The aim is to attain a level where you

can help operators.
Beginner’s Training You will learn the flow of board design.
Beginner’s Training
<PCB Design>
Simple operations for PCB design
The aim is to attain the knowledge

Master Training necessary to be an operator.
Library Board Design
Master Training Master Training

<Component Library> <PCB Design>
Registration and management of libraries Detailed operation for PCB design
Master Training Master Training

<PCB Design Library> <CAM>
Registration and management of PCB Operation for manufacturing panel
design libraries design through CAM output
Master Training
<Engineering
Change/Operation>
Operation and knowledge related to
engineering design change/operation
Users engaged only in library design and management should study up through
Library but we also recommend reading Board Design. Users only engaged in board
design are expected to mainly study Board Design but are recommended to previously
read and try out Library.
Preface Preface - 1
1. Overview of the Lesson
In the Master Training <PCB Design> course, you will learn the knowledge and
functions necessary for PCB design based on the operations you have learned in the
CR-5000 Beginner's Training <PCB Design> Course.
The files you should refer to or generate are shown below.

CDB System Designer Technology library Design rule library
PRT PKG FTP NDF RUF
Net Rule
ruleA ruleB
RUL PCB
Design rule PC board

database database
For the lesson, the following files are provided:
• explc.ndf and explc.ruf Used to generate a PC board and place components.

• exwir.pcb and exwir.rul Used for wiring, printing, and other functions.
• exchk.pcb and exchk.rul Used for checking manufacturing data.
• exart.pcb and exart.rul Used to practice Artwork commands.
Understanding the flow of PCB design • Design process flow

This chapter explains the operation flow of • Preparation
designing a PC board with CR-5000 and the • Resource files
preparation and knowledge required for it.
Reference This is explained in Chapter 2, [PCB Design].
Chapter 1 Using PCB Design Tools 1-1

Using Board Designer

This chapter explains how to design a PC board.
1. Starting Board Designer

The basics of each tool and how to start Board Designer are introduced.
2. Starting Board Generation Tool System Designer Board Designer

A PC board database based on NDF and RUF
extracted from System Designer is generated. NDF RUF PCB RUL
PC board Design
Net Rule database rule
database
3. Starting Design Rule Editor VCC

Based on the general design rules read from GND
the design rule library, design rules particular

to the PC board are added and edited. GND
4. Starting PC Board Shape Edit Tool

The PC board shape, layout area,
height-limited area, inhibited figures, and
other information necessary for PC board
design are first input.
5. Starting Floor Planner
Before starting detailed design, the placement
of components are checked to see whether the
PC board size and selected components are
appropriate.
6. Starting Placement/Wiring Tool

The exact component positions are determined
and the wiring patterns are designed.
7. Starting Artwork Tool R1

IC1
Manufacturing data such as resist data and
metal mask data are designed and checked.
IC2
8. Functions Available for All Tools

This section outlines common functions and • Query command
commands that are available for all Board • Ruler command
Designer Tools. • Layer Settings dialog, etc.
9. Using Assist Menu • Snap point • Coordinates

This section outlines Assist Menu that • Next • Relative point
complements each command. • Another • Division point
• Repeat
Reference This is explained in Chapter 3, [Starting Board Designer].
1-2 Chapter 1 Using PCB Design Tools

Designing Multilayer PC Boards

This chapter explains how to configure individual settings based on the actual PC
board design and how to use various commands.
1. Inside Layer Design

This section explains using the inside layer as
the power plane layer or to provide
multi-powers.
2. Using Interstitial Via

This section explains steps to generate vias
with various layer combinations (such as those
of Layer 1 to 2, or Layer 2 to 5).
Reference This is explained in Chapter 4, [Designing Multi-layer Board].
Outputting PC Board Information

This chapter explains how to output various forms of information from the PC board
data you designed.
1. Outputting the Components List

This section explains steps to output Placement Placement
Reference side coordinates Angle
===============================
information on the components placed on IC1 A_SIDE 60.960,45.720 0.000

-------------------------------------------------------
IC2 A_SIDE 83.820,30.480 0.000
the PC board as a list. -------------------------------------------------------
IC3 A_SIDE 83.820,50.800 0.000
-------------------------------------------------------
IC4 A_SIDE 83.820,71.120 0.
-----------------------------------------------------
2. Printing
This section explains steps to output PC
board data to the printer or the plotter.
Reference This is explained in Chapter 5, [Outputting the PC Board Information].
Chapter 1 Using PCB Design Tools 1-3

1. PCB Design
The flow of PCB design using CR-5000 is shown below.
Register component library (CDB)
Reference Refer to “Master Training <Component Library>.”
Register technology library
Register design rule library

Library registration
Reference Refer to “Master Training <PCB Design Library>.”
Generate PC board database PC board design

(Edit design rules particular to PC board)
Input PC board outline
Check component placement
Place components
Wiring
Input manufacturing data
Check
Introduced by this textbook.
Paneling
CAM output
Reference Refer to “Master Training <CAM>.”
Chapter 2 PCB Design 2-1

1. PCB Design
Before designing a PC board, prepare the following libraries and information:
Component Library
Register shapes, attributes, names, and other information about components to be
used.
Reference For details on the component library, refer to “Master Training <Component Library>”.
Technology Library
Register PC board layer structure, layer attributes, and other information.
Reference For details on the technology library, refer to “Master Training <PCB Design Library>”.
Design rule library

Define a variety of rules.
Reference For details on the design rule library, refer to “Master Training <PCB Design Library>”.
Information from schematic (net list and design rule list)

Connection information, electrical rules, and other information of the PC board to
be designed are extracted from System Designer.
Net list (NDF)
"SIGN12" : : "SN74LS08" : "AND2" : "IC9" : "1" : : "1.cmp13" : "A" :
"SIGN2" : : "SN74LS08" : "AND2" : "IC9" : "2" : : "1.cmp13" : "B" :
"SIGN8" : : "SN74LS08" : "AND2" : "IC9" : "3" : : "1.cmp13" : "Y" :
"GND" :GROUND : "SN74LS08" : : "IC9" : "7" : : : :
"SIGN22" : : "SN74LS08" : "AND2" : "IC9" : "11" : : "1.cmp16" : "Y" :
"SIGN9" : : "SN74LS08" : "AND2" : "IC9" : "12" : : "1.cmp16" : "A" :
"SIGN12" : : "SN74LS08" : "AND2" : "IC9" : "13" : : "1.cmp16" : "B" :
Design rule list (RUF)

(design expcb1.cir
(header)
(rule
(net "AA[0]"
(pinList
(funcTerm "1.cmp25" "A0")
(funcTerm "1.cmp89" "4Y")))
(net "WAIT"
(pinList
(part "SN74LS08")
(stockId "Z121A1121")))
(comp "IC14"
2-2 Chapter 2 PCB Design

2. Libraries
You need the following libraries to generate a PC board with CR-5000.
• Component library (PRT, PKG and FTP)
• Technology library (TCH)
• Design rule library (RUL)
For CAM output, you also need the following library.
• Manufacturing rule library (MRDB)
This section outlines these libraries.
z Component Library
The component library has registered information on components used at PC board
design. Component attribute information is stored in the part library (PRT), package
information is stored in the package library (PKG), and component shape information
is stored in the footprint library (FTP). These three files are generically called CDB.
You need to register all component information required for various PC board designs
in the CDB. When you generate a PC board, only component information required for
the PC board is copied from the CDB containing all component information to the PC
board database (PCB) and design rule database (RUL).
FTP PKG PRT
Package type
1:1A 1 A
:DIP
2:1B 1 B
Component
3:1Y 1 Y
shapes to be used
4:2A 2 A
:DIP14-A
:
:DIP14-B
:
New PC board generation
Only necessary
components are copied
from the CDB libraries to
generate a PC board.
PCB RUL
Reference For details on the component library, refer to “Master Training <Component Library>.”

2. Libraries
z Technology Library
When designing a PC board, you will input various objects (such as conductive
patterns, symbol marks and resist) to “layers.”
The technology library (TCH) defines all layers necessary in designing a PC board.
Conductive Layer 1
Conductive Layer 2
Layers are defined for each

Side A regist layer
object type for easy output to
film at manufacturing time.
Side B regist layer
Side A symbol
mark layer
Side B symbol
mark layer
In CR-5000, layers for components that register component data (“footprint layers”)
are defined in the CDB footprint library and layers necessary at PC board design
(“PCB layers”) are defined in the technology library.
Layer Mapping Therefore, to use components on the PC board, you must correlate individually defined
footprint layers and PCB layers, and the technology library will correlate those
footprint layers and PCB layers.
2-layered board
Footprint layer
Conductive Layer 1
Component side Conductive Layer 2

conductive layer
Inside layer
conductive layer
Solder side
conductive layer
4-layered board
Conductive Layer 1
Conductive Layer 2
Conductive Layer 3
Conductive Layer 4
Correspondence between footprint layers and PCB layers is called “layer mapping.”
According to the layer mapping, the same footprint can support correspondence
between 2-layered or 4-layered boards and all PCB layers, as seen in the diagram
above.

2. Libraries
The layers required to design a PC board (PCB layers) vary depending on the number
of layers and/or board specifications. In the technology library, register all layer
definitions that are considered necessary in one file.
4-layered board (1)

Single sided board
TCH
6-layered board
4-layered board (2)
When you generate a PC board, from the technology library containing multiple
technologies, only copy technology suitable for the board specifications to the PC board
database (PCB).
Example To generate a 4-layered PC board
TCH
[4-layered board (1)]
Reference For details on the technology library, refer to “Master Training <PCB Design Library>.”

2. Libraries
z Design Rule Library

General conditions (rules) for PC board design are registered in the design rule library
(RUL).
Example
- Various clearance values
- Pattern width
- Via used during wiring
- Grid
When generating a new PC board, specify the design rules that best match the board
specifications. In this manner, general design rules are copied and a design rule
database (RUL) is generated.
Technology library Design rule library

Specifi- Specifi- Specifi-
TCH cations A cations B cations C General design rules
RUL RUL RUL
New PC board generation
PCB RUL Design rules specific to a

PC board
PC board Design rule
database database
The detailed specifications for each PC board (Example: pattern width for each net
name) are defined in the design rule database using other tools.
Reference Defining design rules specific to each PC board is explained in [3. Starting the Design Rule Editor] on page 3-15.
Reference For details on the design rule library, refer to “Master Training <PCB Design Library>.”
The design rule library consists of several files, each containing different
design rules depending on the number of PC board layers or set values.

2. Libraries
z Manufacturing Rule Library

The manufacturing rule library (MRDB) has registered information on panel design
specifications used at panel database creation, photo machine information for CAM
output, and drill machine information.
MRDB
Panel design specification Photo machine information

NC format Aperture table
Clearance at panel design Character code D10
Panel outline to sub-PC board Block order D11
Sub-PC board to sub-PC board : :
Sub-PC board to resist
:
Drill machine information
*Panel design specifications are
only referred to at panel NC format Tool table
generation. Character code T10
Block order T11
: :
Reference For panel design, refer to “Master Training <CAM>.”
When you generate a panel database, only necessary information from the
manufacturing rule library is copied to the panel database (PNL) and manufacturing
rule database (MRL).
CDB
MRDB TCH RUL PRT PKG FTP
New manufacturing panel data generation
PNL MRL
Panel database Manufacturing

rule database
Although a manufacturing rule library is not referenced at PC board generation, it

is needed when directly outputting photo or drill data from the completed PC
board.
MRDB
[Photo data]

3. Resource Files
CR-5000 tools refer to the “resource files” defining the operating environment. If you
have created resource files in the specified format and stored them in the specified
directories, they are automatically loaded at tool activation, and the tool operating
environment and defaults are set.
This section introduces the main resource files.
z PCB Library List File (library.rsc)

The libraries required for PC board design with CR-5000 have been introduced in the
previous sections.
Although you can create them in an arbitrary directory under an arbitrary name
(extension is fixed), you should define “what file in which directory is referred to as a
library.”
The “PCB library list file (library.rsc)” defines the paths for files referenced as
libraries.
Example
Absolute paths for files referred to as libraries by library-type are specified in

library.rsc.
For example, when the above library.rsc is employed, the files enclosed with are
referred to as libraries in the configuration below.

3. Resource Files
Store library.rsc in one of the following directories.
Priority 1 %HOME%\cr5000\ue\library.rsc (Local resource file)

Priority 2 %CR5_PROJECT_ROOT%\zue\info\library.rsc (Project resource file)
Priority 3 %ZUEROOT%\info\library.rsc (Master resource file)
Their roles and usages are explained on the following pages.
！ Caution The environment variables shown above (e.g. %ZUEROOT%) are shown as they appear in Windows. In UNIX,
they are represented in the form $ZUEROOT. This document uses the Windows format.
The format for library.rsc is as follows:
Part{
"C:\\home\\master\\cdb\\cdb2.prt" Part library filename
}
Package{
"C:\\home\\master\\cdb\\cdb2.pkg" Package library filename
}
Footprint{
"C:\\home\\master\\cdb\\cdb2.ftp" Footprint library filename
}
Searcher{
"C:\\home\\master\\cdb\\searcher" Search data generation directory
} path name
Technology{
"C:\\home\\master\\tch\\lay.tch" Technology library filename
}
DesignRule{
"C:\\home\\master\\rule.rul" Design rule library directory name
}
ManufactureRule{
"C:\\home\\master\\mrdb\\pro.mrdb" Manufacturing rule library filename
}
PanelTemplate{
"C:\\home\\master\\pnl\\template" Panel template generation directory path
} name
* Hatched libraries are explained from page 2-3.
The above format example is library.rsc in the Windows version. For details on the
UNIX format for the UNIX version, refer to $ZUEROOT/info/library.rsc in the UNIX version.
！ Caution You can set only one library filename to one type of library. If you enter multiple filenames, names other than the
first filename are ignored.

3. Resource Files
z Managing the PCB Library List File (library.rsc)

As explained earlier, library.rsc can have the following three paths.
If multiple library.rsc files exist, the highest priority file is referred to and the others
are not.
Priority 1 %ZUEROOT%\info\library.rsc (Local resource file)

Priority 2 %CR5_PROJECT_ROOT%\zue\info\library.rsc (Project resource file)
Priority 3 %HOME%\cr5000\ue\library.rsc (Master resource file)
%ZUEROOT%\info\library.rsc (Local resource file: user environment)

Specifying %ZUEROOT%=the log-in user's home directory, you can set local
resource files for each log-in user.
This is a resource file only for the user.
%CR5_PROJECT_ROOT%\zue\info\library.rsc (Project resource file: project

environment)
%CR5_PROJECT_ROOT%= mounting directory or an arbitrary directory the user
selects.
This is a resource file that can be shared by different machine users.
%HOME%\cr5000\ue\library.rsc (Master resource file: program environment)

%HOME%=program installation directory.
This is a resource file common to all users of the same program server. If the
program is installed in each machine, different machine users cannot share this
file.
！ Caution The above environment variables (such as $ZUEROOT) are used on the UNIX-version. In the Windows-version,
use an environment variable such as %ZUEROOT%. In this textbook, UNIX formats (Example: $ZUEROOT) are
used.
Example
2 - 10 Chapter 2 PCB Design

3. Resource Files
！ Caution The %CR5_PROJECT_ROOT% environment variable is not automatically set at installation. You have to set this
for each client to use.
Chapter 2 PCB Design 2 - 11

3. Resource Files
z Editing the PCB Library List File (library.rsc)

Although you can edit library.rsc with the UNIX vi editor or Windows Wordpad, the
“PCB Design Library List File Editor” can also be used for editing. This section
introduces instructions for editing library.rsc using this tool.
The PCB Design Library List File Editor can be used for all types of library.rsc: master
resource files (program environment), project resource files (project environment), and
local resource files (user environment).
Lesson Edit the prepared library.rsc for the user's environment according to your environment.
z Resource file to be edited

%HOME%\cr5000\ue\library.rsc (Local resource file: user environment)
↓
(\home\lesson2)
z Library to be referred to (already prepared.)
• Part library \home\lesson2\cdb\cdb2.prt
• Package library \home\lesson2\cdb\ceb2.pkg
• Footprint library \home\lesson2\cdb\cdb2.ftp
• Technology library \home\lesson2\tch\lay.tch
• Design rule library \home\lesson2\rule.rul
Start PCB Design Library List File Editor.
1. From the Start menu, click Programs Æ CR-5000 Board Designer 10.0 Æ Utilities Æ
PCB Design Library List File Editor to start the editor.
UNIX 1. Click Utilities Æ PCB library list file Editor in CR-5000 Root Menu to start the editor.
Click

3. Resource Files
2. PCB Design Library List File Editor is

started.
3. Click File Æ Open Æ User on the

menu bar.
Click
library.rsc=library.rsc
＝%HOME%\cr5000\ue\library.rsc for
the user environment is opened.

3. Resource Files
4. Change the part library path. Reverse the part library path by clicking it.
Click
Click
Click Change....
A dialog box to change the name is

started.
Click
Specify a library filename from the file

selector.
Select \home\lesson2\cdb\cdb2.prt and

click OK.
Click
\home\lesson2\cdb\cdb2.prt is already
prepared.
5. Similarly, change the other libraries as explained on page 2-12.

6. After changing them, save data and then end the tool.
Click
Click

3. Resource Files
z Other Resource Files

The tools related to PCB design also refer to the following resource files in addition to
library.rsc.
z Board Designer tool resource file
%ZUEROOT%\info\board.rsc (Master resource file)

%CR5_PROJECT_ROOT%\zue\info\board.rsc (Project resource file)
%HOME%\cr5000\ue\board.rsc (Local resource file)
They define operation parameters (default) particular to each tool.
z Resource file for layout DB parameter initialization
%ZUEROOT%\info\parameter.rsc
This is a resource file referred to at PC board generation. This file defines units stored on
the PC board database (PCB) and defaults for each table.
z CAD File Manager System Resource File
%ZLOCALROOT%\zsys\info\eng\zfilemgr.rsc (Master resource file)
z CAD File Manager Customization Resource File
%ZLOCALROOT%\zsys\info\eng\zfmcustm.rsc (Master resource file)

%CR5_PROJECT_ROOT%\zsys\info\zfmcustm.rsc (Project resource file)
%HOME%\cr5000\sys\zfmcustm.rsc (Local resource file)
These resource files are referenced when the CAD File Manager starts, and define tools and
commands which are started from the CAD File Manager.
z CAD File Manager Parameter Initialization Resource File
%HOME%\cr5000\sys\.bfminit
This is a resource file containing the initial settings for CAD File Manager. It is automatically
updated when CAD File Manager is terminated.
Reference The file priority and handling of the environment variable is the same as that for library.rsc.
For management, refer to “Managing the PCB Library List File” on page 2-10.
Reference CR-5000 refers to many resource files other than those related to PCB design. CR-5000 refers to many resource
files other than those related to PCB design. For a list of the resource files not referred to here, refer to [Resource
Files] in the Online Help.

The flow of PCB design using CR-5000 is shown below.
Generate PC board database Board Generation Tool
Edit design rule particular to PC board Design Rule Editor
Input PC board shape, etc. PC board Shape Edit Tool
Check component placement Floor Planner
Component placement/wiring Placement/Wiring Tool
Artwork design Artwork Tool
Board Designer is equipped with the PC board design tools listed above.
z Board Generation Tool System Designer Board Designer
Generates PC board data based on the net list
and a design rule list extracted from the
NDF RUF PCB RUL
schematic (System Designer).
z Design Rule Editor

Defines design rules particular to the PC board VCC
GND
based on the design rule database for each PC
board generated with Board Generation Tool.
GND
z PC Board Shape Edit Tool

Necessary data, such as PC board shapes,
inhibited figures, mounting holes, etc. are
entered before starting the design.
z Floor Planner
Examines component placement.
z Placement/Wiring Tool
Places components and performs wiring
accurately.
z Artwork Tool
Inputs and edits manufacturing data (such as IC1 R1
resist data and metal mask data), except

conductor data, necessary for manufacturing,
and also performs manufacturing checks. IC2
Chapter 3 Starting Board Designer 3-1

z Starting Board Designer

Start Board Designer.
Lesson
1. From the Start menu, click Programs Æ CR-5000 Board Designer 10.0 Æ
CAD File Manager.
UNIX
1. Click (Layout Design System) in the CR-5000 root menu.
The CAD File Manager, which is the Board Designer/System Designer root menu, is
started.
Board Generation Tool

PC Board Shape Edit Tool
Floor Planner (optional)
Floor Planner (for SD, optional)
Placement/Wiring Tool
Artwork Tool
Package Synthesizer (optional)
Design Rule Editor
Technology Update Tool
Forward Annotation Tool
Backward Annotation Tool
Board Analysis (optional)
BD/Lightning Interface Tool (optional)
Apsim Interface Tool (optional)
ICX Data Conversion (optional)
BD-ANF I/F (optional)
Calculate Pattern Area Tool (optional)
SMM I/F Tool (optional)
Photo Tool
Drill Tool
CAM Check Tool
Plot Tool
3-2 Chapter 3 Starting Board Designer

2. Move the work directory to “\home\lesson2\pcb.”
Double-click the pcb directory.
Double-Click

2. Starting the Board Generation Tool
Lesson 1. Click the explc/[Board] file set from CAD File Manager.
Click
2. Click (Board Generation).
Click

z Board Generation Tool

Board Generation Tool is the first tool executed in the flow of PC board design.
Input PC board shape, etc. PC board Shape Edit Tool
Generate a PC board by referring to schematic information and extracting

information necessary for the PC board from each library.
CDB System Designer Technology library Design rule library
PRT PKG FTP NDF RUF
Net Rule
ruleA ruleB
RUL PCB
Design rule PC board

database database

There are two types of information loaded from the schematic:
z Net list information (NDF)

In the net list (NDF), information for one function pin is written on one line.
“SIGN1” : : “SN74LS00” : “AND” : “IC1” : “1”

Net name Net attribute Part name Function name Reference Pin number
: UNFIXED : “1.cmp2” : “A” : ;
Lock attribute Symbol ID Function pin name Package attribute
Example
z Design rule information (RUF) (not editable)

Contains the rules for nets and components necessary at PC board design.

* Resource files
The Board Generation Tool refers to the following resource files.

%ZUEROOT%\info\library.rsc
%CR5_PROJECT_ROOT%\zue\info\library.rsc
%HOME%\cr5000\ue\library.rsc
Part {
“C:\\home\\lesson2\\cdb\\cdb2.prt” Defines the name of files or
} directories where the libraries to
Package {
“C:\\home\\lesson2\\cdb\\cdb2.pkg”
be used are registered.
} Board Generation Tool refers to
Footprint {
C:\\home\\lesson2\\cdb\\cdb2.ftp” • Part library file name
} • Package library file name
Technology { • Footprint library file name
“C:\\home\\lesson2\\tch\\lay.tch”
• Technology library file name
}
• Directory name storing the design rule
DesignRule {
library
“C:\\home\\lesson2\\rule.rul”
}
%ZUEROOT%\info\board.rsc
%CR5_PROJECT_ROOT%\zue\info\board.rsc
%HOME%\cr5000\ue\board.rsc
These resource files are referred

to by Board Designer tools.
The following items are referred
to at PC board generation.
• Net and design rule list output On/Off

• Target schematic sheet number
FromTo
• Component assignment On/Off
• Parameter resource path name
• Temporary part assignment On/Off
• Correspondence table
• Display footprint independent from
package On/Off
• ALIVH switch On/Off
• MSF check button On/Off
These define the default values

for items displayed when Set Æ
Set up Tool is selected from the
Board generation Tool menu bar.

This is the file where you define command parameters and table initial values
for Board Designer and Board Producer. Information set in this file is saved
onto the PC board database.

z Executing Board Generation Tool

Specify the number of layers and the design rules for the PC board to be generated
before executing Board Generation Tool.
Because this tool loads various information, the menu bar has many settings.
Menu bar
Set Æ When checked, nets and design rules are extracted from the
Set up Tool schematic at PC board generation. (Output is enabled only in an
environment where System Designer operates.)
To extract nets and design rules, specify the desired schematic

sheet.
When component mapping is completed, you can change
component assignment.
To read a file other than the master parameter resource file

(%ZUEROOT%\info\parameter.rsc), specify this item.
When checked, a temporary part name can be assigned for a

component not contained in the Part Library.
Menu bar
Set Æ Library
Confirm the reference library name. The library names
in the following resource files are displayed:
1. %HOME%\cr5000\ue\library.rsc
2. %CR5_PROJECT_ROOT%\zue\info\library.rsc
3. %ZUEROOT%\info\library.rsc
You can also temporarily change the library name with

this menu.
Reference For library.rsc, refer to “3. Resource Files” on page 2-8.
Menu bar
Set Æ Net List Type Four nets are to be loaded:
• CR-5000 schematic (NDF/RUF extracted from schematic)
• CR-5000 net list (existing NDF/RUF)
• PWS/CCF net list
• PWS/ECF net list
Reference For details on CCF and ECF, refer to the online documentation.
Menu bar
Confirm Æ If the message area displays the message “An
Confirm Error error has occurred” or “Warning has been issued,”
confirm the contents.
Note Error and warning messages are deleted once

they have been referred to. If you click
Save Messages from the Display Messages dialog
box, you can redisplay the contents by selecting
Confirm Æ Confirm Error Æ Error log or
Warning log.

Menu bar After executing the tool, you can confirm process
Confirm Æ results.
Confirm Process
Menu bar
Check whether related files exist at tool
Confirm Æ
Confirm Data
execution.
The operation flow for PC board generation is shown below.
1. Load the net list

Load the net list and check whether the parts in the list have been
registered in the CDB.
2. Load the design rule library

Load the number of PC board layers and general rules.
3. Load the design rule list

Add design rules particular to the PC board defined on the schematic.
4. Generate component mapping

Based on the reference and part names in the net list, correlate
references and CDB library names (component assignment).
5. Set a power plane net name

If a power plane exists as the wiring layer attribute, set the signal name
that has been set on Board Generation Tool initial screen to the design
rule database.
RUL creation 6. Check design rules/settings
Check for setting errors in the design rule database (RUL) generated by
Steps 1 - 5 above.
PCB creation 7. Generate PC board database

Based on the design rule database (RUL) generated by Steps 1 - 5 above,
generate the PC board database (PCB) which is a file to input objects. Then,
copy only the components used for the PC board from the CDB to the PCB.
8. Generate parameter DB
Load attributes such as layer colors from the resource files.
3 - 10 Chapter 3 Starting Board Designer

Execute Board Generation Tool.
Lesson 1. Check Map Components.

Click Set Æ Set up Tool... from
the menu bar.
Click
Check Map Components.
Click
Click Click OK .
2. Specify the number of layers and design rule name.
Set 6 as the number of layers.
Specify layer6 as design rule

name.
Click
Click Execute .
3. Specify a net name for the power plane layer.

Assign net names for the power
planes as follows:
For Layer 3: GND

For Layer 4: VCC
Click OK .
Click
Chapter 3 Starting Board Designer 3 - 11

4. When component mapping generation is complete, Component Mapping Editor is

started.
(This is because Map Components is checked at tool setting.)
Items that can be set or referenced are as follows:
Component ID (reference)
Part name
Stock code (*)
Package name
Footprint specification name (*) *: Changeable if the CDB contains multiple definitions.
Footprint name (*) (Double-clicking within the frame displays the list
dialog box.)
Side B footprint name (*)
Placement side
Placement angle
You can also set jumpers and decoupling capacitors.

Reference For jumpers and decoupling capacitors, refer to “Master Training <Engineering Change/Operation>.”
5. Exit Component Mapping Editor.

Click File Æ Exit from the
menu bar.
Click
When the editor is ended, processing automatically proceeds to the next operation.

* Component assignment (Component mapping)
Use the tool for component assignment to set the components used for the PC board.
You can specify three types of components:
• Components: Assign components defined in the net list.
• Decoupling capacitors: Define decoupling capacitors to be generated automatically
during PC board design.
• Jumpers: Define jumpers to be generated during PC board design.
The net list contains “Part name” and “Reference designator” for the components used
on the PC board.
The CDB library is configured as follows:
As shown above, when the part name associated with the reference designator is
determined, the package and footprint names are naturally determined.
However, remember that one part may contain multiple stock codes or one package
may have multiple footprint specification names or multiple footprint names. So,
these names are not always decisive. For some boards, you may have to specify
names other than the defaults.
For component assignment, the default names are determined by the reference
designators and part names in the net list. Change them as needed.
This tool also allows you to set information other than CDB, such as the placement
side and angle.

6. If a warning is issued when the PC board database is completed, a message

appears.
Click OK.
Click
This time, a component area is

not input on the soldering side of
the sample component.
Therefore, a warning message

appears indicating that a
component area on the side
opposite to the placement side is
automatically generated for
insertion-mounted components at
PC board database generation.
Click
Click Close.
！ Caution In the lesson, the component area automatically generated is used as it is.
(If you do not want to use the automatically generated shape, delete the PC board and design rule databases,
re-edit the footprint library and re-execute Board Generation Tool.)
7. Exit Board Generation Tool.
Select File Æ Exit from the

Click menu bar.
Two files [explc.pcb/explc.rul] are

generated.

3. Starting the Design Rule Editor
Lesson Start Design Rule Editor to edit design rules specific to a PC board.
Select the “explc/[Board]” file

set, and then click (PC
Board Design Rule Edit).
Click
Click
Design Rule Editor is

started.

z Design Rule Editor
Edit design rules particular to a PC board Design Rule Editor
Input the PC board shape, etc. PC board Shape Edit Tool
The data in the design rule library specified at execution of Board Generation Tool
are copied to the design rule database. Design Rule Editor allows you to modify these
contents or set design rules particular to a certain net.
[layer6]
Design rule library
PC Board A PC Board B
PCB RUL PCB RUL
[layer6] [layer6]
General
design
rule
GND VCC GND +5V

Board-
VCC VCC specific
GND GND
design
rule
You may execute this tool any time after generating the design rule database.

* Resource files
Design Rule Editor refers to the following resource files:
%ZUEROOT%\info\library.rsc
%CR5_PROJECT_ROOT%\zue\info\library.rsc
%HOME%\cr5000\ue\info\library.rsc
Part {
“C:\\home\\lesson2\\cdb\\cdb2.prt”
} Defines the names of files or directories
Package { where the libraries used are registered.
“C:\\home\\lesson2\\cdb\\cdb2.pkg” Design Rule Editor refers to the following
} libraries.
Footprint {
“C:\\home\\lesson2\\cdb\\cdb2.ftp”
}
Technology { • Part library file name
“C:\\home\\lesson2\\tch\\lay.tch” • Package library file name
} • Footprint library file name
DesignRule { • Technology library file name
“C:\\home\\lesson2\\rule.rul”
• Directory name storing the design rule library
}
:
You can also check these files from Design Rule Editor.
Click Set Æ Library from the menu

bar.
Click
The confirmation dialog opens.

z Defining Design Rules Specific to the PC Board

Design Rule Editor has the same menu structure as Design Rule Library Edit Tool,
but there are some menu items that are available only in Design Rule Editor.
Design Rule Library Edit Tool
Design Rule Editor
We will discuss difference between Design Rule Editor and Design Rule Library Edit
Tool on the following pages.
Reference For the same items, refer to “Master Training <PCB Design Library>.”
Reference The individual rules will not be described here. For details on the rules that can be defined for each object, refer
to the online help.

Via/Area Spec
[Qualified Padstack]
You can specify signal names and preferred padstacks for particular From-To pairs of inner layer vias.
Example Net Name From To Padstack

GND
2 5 VIA0.7-1.3
GND VIA0.8-1.4
VCC VIA0.8-1.4
Padstack Padstack
(VIA0.8-1.4) (VIA0.7-1.3)

Net Objects
You can set rules for each of the
following objects:
Default Settings
- Net Object
- Net group group
- Net group
- Net class
- Net
- Pin Object
- Pinpair group group
- Pinpair group
- Pinpair
You can set the following attributes for each object.

Note Using "Default Settings", you can set the default values of properties in the Net
Objects dialog.
Net
Show or hide each category of

configurable settings.
Filtering with power or ground

properties or with regular
expressions is available.
List objects that belong to each

category in a tree-like format.
Pin Wiring Order

You can set the wiring order only
if the pin wiring order property
(net) is set to ON.

Net Group
Set properties for net groups.
Set properties for nets in the net

group.
Reference For details on how to add or delete net groups and their nets, refer to “Adding Groups and Group Groups, and
Adding and Deleting Members” on page 3-24.
Net Group Group
Set properties for net group

groups.
Set properties for net groups in

the net group group.
Reference For details on how to add or delete net group groups and their nets, refer to “Adding Groups and Group Groups,
and Adding and Deleting Members” on page 3-24.
For net group groups, a design rule stack can be defined. This sets the clearance
between nets from net groups in the same group.

Net Class
Set the properties for net classes.
You can also set net properties.
Reference For details on the operations for adding or deleting net classes, or adding or deleting nets that belong to them,
refer to page 3 -24, “Adding Groups and Group Groups, and Adding and Deleting Members.”
The rules that can be defined for net classes are the same as for nets.
Pinpair
Set properties for nets to which

the related pinpairs belong.
Set properties for pinpairs.
Define pinpairs.
Reference For details on how to add or delete pinpairs and their nets, refer to “Adding Groups and Group Groups, and
Adding and Deleting Members” on page 3-24.

Pinpair Group
Set properties for pinpair groups.
Set properties for pinpairs in the

pinpair group.
Reference For details on how to add or delete pinpair groups and their nets, refer to “Adding Groups and Group Groups,
and Adding and Deleting Members” on page 3-24.
Pinpair Group Group
Set properties for pinpair group

groups.
Set properties for pinpair groups in

the pinpair group group.
Reference For details on how to add or delete pinpair group groups and their nets, refer to “Adding Groups and Group
Groups, and Adding and Deleting Members “ on page 3-24.

*Adding Groups and Group Groups, and Adding and Deleting Members
To add groups and group groups, and add and delete members, do the following:
To add groups and group groups Select the desired object, and then
click Append from the assist
menu.
Click
In the dialog box displayed, enter
the group name or group group
Click
name and click OK.
To add or delete members (1)

Select the desired group or group
group, and then click Edit member
from the assist menu.
Click
In the dialog box displayed, add or

delete members.
To add or delete members (2)
Select the desired member, and

then click Send to from the assist
menu and select the name of the
defined group or group group.
Click
To add or delete pinpairs
Click
Select the desired net.
Click Add/Del Pinpair and add or

delete pinpairs in the dialog box
displayed.
Click

Comp. Objects
Set properties for components.

Note You can only customize the above dialogs and control edit permissions in Design
Rule Editor.
From the menu bar, click Utilities Æ Customize....
Click
Specify whether each item can be

displayed and edited.
Click
With your customizations, the

dialog boxes are changed and the
specified items are grayed out.
Your customizations are stored in %HOME%\cr5000\ue\ruleedit.rsc.

Lesson In this lesson, you will add signal rules to board-specific design rules.
1. Click Register Qualified padstack on the Via/Area Spec tab.
Click
2. Click the list icon for padstack names. In the list dialog box displayed, select
“VIA0.7-1.3” and click OK.
Click
Click
Click
3. Select the net names VCC and GND and click Add>>.
Click
Hold Click
Release
4. Click OK to close the dialog box.
Click

5. Click Net Objects to display the dialog box for editing net objects. Select Net and
check Power/Ground net for filtering.
Click
6. Select the GND Design Rule Stack cell and click the action button. In the Design Rule
Stack dialog box, select all0.3 and click OK.
Click
Click
Click
7. Similarly, define the following settings:

Net Name Design Rule Stack Wiring Width Stack
GND,VCC all0.3 line0.5_0.2
8. Set the max total length and min total length for SIGN2 as follows.
Net Name Max Total Length Min Total Length

SIGN2 30 20

9. From the menu bar, click File Æ Exit and save the settings.
Click
Click
10. Select the Wiring Clearance tab and change the settings as follows:
Clearance Priority : ON
Shield Gap Priority : Shield Gap
Click
Click
*Application Rule
This section explains the "application rule" set in Design Rule Library Editor and
Design Rule Editor.
The application rule is not board specifications, such as wire length and grid
settings, registered in the design rule library (RUL), but settings to control
clearance values to be used when you execute the Area DRC command or generate
shield patterns using Board Designer.
Via Clearance for Core Layer

This allows you to specify different clearance values to be used for through and
internal vias in the core layer.
① ② ① ②
When Via Clearance Through Via in Internal Via in

Core for Core Layer is used Core Layer Core Layer
layer
When Via Clearance for
Internal Via Internal Via
Core Layer is not used
Reference For details on clearance settings, refer to “Appendix 1 List of Design Rule Unit Settings” in “Master Training
<PCB Design Library>”.
Note The Via Clearance for Core Layer option

can be selected only if Core Layer is
checked on the Board Spec tab.

Clearance Priority
There are several places where you can specify the clearance value, and here you
can control the priority for referencing clearance values.
When unchecked:
The largest clearance value is used.
When checked:
Clearance values are used in the following order:
High
Net group group
Net group
(Priority)
Net
Board
Low
Shield Gap Priority

This setting controls the distance (clearance) between the shielded net and the
related shield pattern when shield patterns are generated.
The Largest:
The largest of clearance and shield gap values is used.
Shield Gap:
The shield gap value is used.
Clearance:
The clearance value used by the net is used.
Example When clearance is 0.3mm and shield gap is 0.15mm:
The Largest Shield Gap Clearance

0.3mm 0.3mm
0.15mm

11. From the menu bar, click File Æ Exit Tool to exit the tool.
Click
Click
Click
There are two types of design rules: some design rules are stored only in the design
rule database (RUL), and others are stored both in the design rule database (RUL)
and the PC board database (PCB).
The following four items are stored in both of these databases:
• Wiring Spec - Net Name of Power Plane
• Via/Area Spec - Default Padstack
• Via/Area Spec - Qualified Padstack
• Via/Area Spec - Available Padstack
If any of these four items has been changed after the PC board database is created,
a message is displayed and the changes are automatically applied to the PC board
database before the tool is exited.

Lesson 1. Select the explc/[Board] file set from CAD File Manager, and then start PC Board
Shape Edit Tool by clicking (PC Board Shape Edit).
Click
Click
In this lesson, you will learn operations up to component placement using the PC
board “explc/[Board].” During the lesson, learn the functions of each command
reading the descriptions given here.(An explanation of the functions of each command
is provided. Confirm each command’s functions while proceeding with the lesson.)

z PC Board Shape Edit Tool

PC Board Shape Edit Tool allows you to input objects not directly related to the
schematic before beginning placement of components.
Input the PC board shape, etc. PC Board Shape Edit Tool
The following objects may be input:
- PC board shape
- Layout area
- Keep-out areas (placement, wiring, via)
- Height limit area
- Mounting hole
- Resist for mounting hole
- Various dimension lines
Note When using PC Board Shape Edit Tool to input objects, input them to the associated
layers.
For that purpose, be sure to confirm that the input layer is the active layer before
inputting objects.
Reference PC Board Shape Edit Tool operations are almost the same as those for Artwork Tool.
This section explains the commands particular to PC Board Shape Edit Tool. For details on operations, refer to
“Artwork Command Reference”.

* Resource files for each edit tool
PC Board Shape Edit Tool, Floor Planner, Placement/Wiring Tool, Artwork Tool and
Panel Design Tool refer to the following resource files:
%ZUEROOT%\info\board.rsc
%CR5_PROJECT_ROOT%\zue\info\board.rsc
%HOME%\cr5000\ue\board.rsc (Top priority)
They set the environment for Board Designer and Board Producer.
PC Board Shape Edit Tool refers to
the following items:
This file defines command parameters and initial values for tables in Board
Designer and Board Producer. The set information is stored in the PC board
database.

* Loading and outputting parameter.rsc
Data set in parameter.rsc is referred to at PC board generation and stored in the PC

board database.
If command parameters in parameter.rsc are changed after PC board database

generation, the modifications are not reflected to the existing PC board database.
To reflect them, follow the directions below
Loading a 1. Open the PC board database with Placement/Wiring Tool or other tools, and then
parameter click Environment Æ Parameter Resource Æ Load on the menu bar.
resource file
2. Select a resource filename
and click OK.
Click
This reflects data in parameter.rsc to the PC board database.
Conversely, you can also reflect command parameters modified on the PC board
database to parameter.rsc.
Outputting a 1. Open the PC board database with Placement/Wiring Tool or other tools, and then
parameter click Environment Æ Parameter Resource Æ Output on the menu bar.
resource
2. Select a resource filename
and click OK.
Click
This outputs command parameters on the PC board database to the specified

resource file.

z Designing PC Board Shape and Layout Area

Designs PC board shape, layout areas, and keep-out areas. Be sure to input one PC
board shape area and one layout area to a pre-determined layer, as they are areas
that the system uses for recognition.
- PC board shape : Recognition area for Board Producer

- Layout area : Recognition area for Board Designer
When input of one of the objects above is fixed, the area containing the object is
immediately set as the whole display area.
Use the following commands to input and edit the data above:
(Input Area) • • •Input the area data.
(Generate Offset Figure) • • •Input the area data using offsets.
(Edit Shape) • • •Edit the area data.
(Fillet/Chamfer) • • •Generate arcs at construction points or

chamfer corners.
(Move) • • •Move the area data.
(Erase) • • •Erase the area data.
Reference For the Edit, Move and Erase commands, refer to “Artwork Command Reference.”
Now you will learn how to use the Input Area and Generate Offset Figure commands.
Input Area 1. Activate the layer appropriate for the object.
2. Click (Input Area) on the tool bar.

3. Make the nessesary settings in the panel menu.
Specify input shape
Polygon Rectangle Arc Circle
P4 P3 P2
P5
P1 P1
P2
When you input arcs and circles, you can select the
input modes.
Arc input modes Circle input modes
Subcommand (for polygon input)
Straight line Arc input mode

Specifies 3 points Specifies the ends and
Auto-tangent on the arc radius
Specifies the Specifies the diameter
Arc center and radius and end point
4. Input an area.

Generate Offset 1. Activate the layer appropriate for the object.

Figure
2. Click (Generate Offset Figure) on the tool bar.

3. Make the necessary settings in the panel menu.
Figure Type
• Line • Height Limit Area
• Area • RulesByArea
The panel menu varies depending on the figure type selected.

Line Height Limit Area RulesByArea
Target
Whole • • Generate in the whole figure.
Section • • Generate in the specific section.
Gap : Specify the offset gap.
Generate Count : Specify the number of figures generated.
4. Generate the offset figure.
P1: Click on the

base figure for the
offset.
P2: Click on the

empty area to
indicate the direction
for the offset.
Reference For details on parameters for the Generate Offset Figure command, refer to “Artwork Command Reference.”
Note When you select PC Board Shape or Layout Area for the active layer, the Outline
Width and Paint Width options are grayed out and thus cannot be set, because these
are in the section recognized by the system. (When PC Board Shape or Layout Area is
selected as the active layer, this becomes area for system recognition. Thus, the
Outline Width and Paint Width options are grayed out and cannot be set.)

Lesson 1. Set the active layer to PC Board Shape, and input the PC board shape based on the
coordinates shown below.
2. Change the active layer to Layout Area, and click (Generate Offset Figure) on
the tool bar to input the layout area with 2 mm offset inside the PC board shape.
Make the following settings in the panel

menu:
Figure Type : Area

Target : Whole
Gap : 2 mm
Generate Count :1
Click on the PC board shape and

then click on the empty area inside
to generate the layout area.
PC board
shape
Layout area

z Designing Height Limit Area

If you have input a height limit area on the PC board, you can limit the placement of
components by checking the component height.
When you input overlapping objects, the shorter one has priority.
Reference The component height can be set as a part attribute or package attribute, as well as being registered in the
footprint. For details, refer to “Master Training <Component Library>.”
Now you will learn how to input height limit area.
1. From the menu bar, click Input Æ Height Limit Area.

2. Do the necessary setting in the panel menu.
Set the height limit.
Select the input layer

(HeightLimit-A/HeightLimit-B).
3. Input the area in the same way as for the Input Area command.
Lesson 1. Input a 3-mm height limit area on the HeightLimit-A layer.
PC board shape
Layout area
Height limit area
Note If you have any objects with a pre-determined input position such as mounting holes
and dimension lines, you can input them before beginning design.

Lesson 1. Move to Floor Planner by clicking Module Æ Floor Planner on the menu bar.
Note Floor Planner is an option. If you are not using it, place components as shown on
page 3-63 and follow the operations explained from page 3-63.
Click
You can move to Floor

Planner with the PC board
open.
z Floor Planner
Floor Planner is a tool to check floor planning before precisely placing components.
Input the PC board shape, etc. PC Board Shape Edit Tool
It is the designers' responsibility to consider whether all necessary components can be

placed in the predetermined area and to follow the rules (for example, an IC and a
capacitor should be placed close to each other). Floor Planner helps them in doing
this.
Reference For the resource files that Floor Planner refers to, refer to “Resource file for each edit tool” on page 3-34.

Floor Planner provides the following functions:
Stack Components
This function displays all components on the canvas ignoring the online DRC, and allows you to check
whether placement/wiring is possible.
Group Area
This function gathers components placed close to each other into groups, and allows you to check their
placement positions as a group.
GroupA GroupB
GroupC
Trial Placement
This function uses the connection relationships among the components that have been placed, and
places the components automatically so that the wire length becomes shorter.
Save Placement Results

You can save/load three placement result patterns. These can be compared and the best one selected.
Placement Result 1 Placement Result 2 Placement Result 3

z Stacking Components
The Stack Components command arranges and places components. You can place the
components anywhere on the canvas, ignoring the DRC.
The arranged components hold their last arranged coordinates even after they have
been moved with the Move command, and so they can be returned to the last
arranged position using (the Out-board Standby instruction) in Move
Component.
You can arrange components in two ways:
• Auto Stack
Arranges the components matching the rules without specifying the area.
• Manual Stack
Arranges by specifying the components and area.
Now you will learn how to execute these two operations.
Auto Stack 1. Click (Stack Components) from the tool bar.

2. Specify the pitch and type (from 4 types) of components to be arranged in the panel
menu.
Arranges all components including placed ones outside
the PC board.
Arranges only non-placed components outside the PC

board, leaving placed components as they are.
Arranges only the components not contained in a group

outside of the PC board, on the right.
Specifies a group name in the dialog box and arranges

the components contained in that group in the group
area. You can specify multiple group names.
Specify the direction for component arrangement.
Specify the stack pitch for components.
When you specify components, they are

placed immediately.
Note The Stack Components function arranges components so that the component areas do
not overlap each other.

Manual 1. Click (Stack Components) on the tool bar.

arrangement 2. Specify the alignment direction in the panel menu.
[Horizontal] [Vertical]
3. Select a component to be arranged. (If they are on the canvas, click them one by
one. If not, use the Component Selector.)
4. Specify a position where data is ended.
5. When the cursor changes to , specify an arrangement area with two points.
Note You can arrange components anywhere on the canvas because you specify the area.
Lesson From the tool bar, click (Stack Components) to automatically arrange unplaced
components outside of the PC board shape.
Click Unplaced.
Click
Unplaced components are arranged

outside of the PC board shape.

z Displaying Reference Designators

Displays reference designators. Because the displayed reference designators are not
symbol mark data, they cannot be output to photo data. They are only displayed to
facilitate operation. (It is possible to draw them.)
IC4 IC5
Display at the center of components

IC1 IC2 IC3
Display/Not 1. Select View Æ Ref-Des from the menu bar.

Display Reference
Designators ON OFF
Display Only the 1. Select Environment Æ Option from the menu bar.
Reference
Designators of Select the Component tab.
Specified
Components Target
All Comp. : For all components
Specified Comp. : For only components
specified for display
View Side
Both : Components on both sides
A Side : Components on A side
B Side : Components on B side
Display Attributes Following Active Layer :
Also displays marks for attributes. Follow the current active layer
O: Outside-board standby component

F: Group net display component
L: Position lock
S: Placement side lock
A: Angle lock Attribute
R: Reference lock mark
J: Jumper component
B: Decoupling capacitor component
Reference For details on setting these options, refer to “Setting Display Parameters” on page 3-200.
Lesson 1. Select View Æ Ref-Des from the menu bar to display reference designators for all
components.

z Selecting Components
In [CR-5000/Beginner's Training <PCB Design>], you had selected components to be
moved by clicking them on the screen or specifying the area. You can also select
components by their attributes without clicking.
Insert mounted
type components
Utilities Æ 1. Click Utilities Æ Select Manager on the menu bar.

Select Manager Components contained in the group defined by Group Manager.
Reference added to component
Side where the component is placed
Select jumper, non-electrical, or electrical component
Select one of 4 mount types according to the

package-type defined in package library
Package-type defined in package library
Number of set pins
Part name defined in part library
Package name defined in package library
Footprint name defined in footprint library
Checkboxes for conditions Upper height limit set in component area of

footprint library
Reference For details on the function types, refer to “Generating Components” on page 3-84.
2. Select the condition set check box for the item to be set, and then set the condition.
• You can specify multiple conditions.

When you specify multiple conditions, components
that satisfy all conditions specified will be
selected.
• You can use regular expressions (* and ?) for

group, reference, part, package, and footprint
names.
• The number of pins in the right frame must be

greater than that in the left frame.
3. Clicking Apply selects the

components that meet the
specified conditions.
！ Caution You cannot specify multiple package-types for one item. (For example, you cannot specify both “SOP” and
“QFP” at once).

Create If you save the conditions you have set using Select Manager, you can reuse the same
Component conditions as many times as you want.
Selection
Conditions 1. Click Utilities Æ Select Manager on the menu bar.
2. Set conditions.
Click
Click
3. Click File Æ Save on Select Manager.
Click
4. The Enter Name dialog box appears. Enter a name for the condition (Component
Selection Condition Name).
Click
5. Click OK to exit Select Manager.
Use Component 1. Click (Move Component) on the tool bar.

Selection
Conditions 2. Click Utilities Æ Component Condition Selector on the menu bar.
3. Select the name assigned in the above step and click OK.
Click
Click
Note If you want to keep the set condition, specify it in the resource file (parameter.rsc).

z Creating Groups
By grouping components and circuit blocks that you want to be placed close to each
other, you can place them as a group.
GroupA GroupB GroupC
Register a 1. Click Attributes Æ Group Manager on the menu bar.

Component
Select the component group to
Group Using which the selected components
Group Manager are going to belong.
Select the group to which the components

to be grouped currently belong.
Move Component button
Component list
Deselect the components

selected in the component list.
You can enter the component selection

from the keyboard. Regular expressions
are available (Example: IC*, C*).
Note If you have defined a group using System Designer, the component group can be
generated automatically.
2. Click Group Æ New... on the Group Manager menu bar.

Enter a name of your choice in the Enter Name dialog box and click OK.
Click Click
3. Set the From: and To: options for components to be moved between groups.

4. Select the components to be added to the target group from the list of components in
the source group. You may also select components using Select Comp..
Hold
Release
5. After specifying the components, click to move the components to GroupB.
Click
6. After completing group registration, click OK to exit Group Manager.
Register a Alternatively, you can select components from the canvas and group them together.
Component
Group after 1. Click (Move Components) on the tool bar.
Selecting
2. Select the components to be grouped.
Components
Release
Hold
3. Click Attributes Æ Grouping... from the menu bar, and then select the desired group
from the Select Group dialog box.
Click
Click
Click
Lesson Register components to a group as follows:

GroupA: IC1/IC2/IC3/IC4/IC5 (already registered.)
GroupB: IC6/IC7/IC8/IC9/IC10/IC11
GroupC: IC12/IC13/IC14/IC15/IC16/IC17/IC18/IC19/IC20

z Editing Group Areas

This section explains the commands to generate, edit, move, and erase a group area.
Group Area
GroupB(18%:50%）
Inter-group net
GroupA(15%:50%）
GroupC(32%:50%）
Decide on the group area by referring to
the inter-group net.
Create a Group Create a group area on the PC board.

Area 1. Click (Add Group Area) on the tool bar.
2. Specify the group name for the area to be created in the panel menu.
Specify a group name for the area to be generated.
Actions for Groups

Delete Group
Divide Group
You can enter different areas on Sides A and B.
Specify an angle at area input.
3. Specify the area.

P2
Data end GroupA(50%:50%)
P1
P3
P2
Data end GroupB(50%:50%)
P1
Note When a group area is re-input, the existing group will be replaced.
Group Area You can automatically generate a group shape for a component group without a
Automatic defined group shape.
Creation
1. Click (Generate Group Area) on the tool bar, and click Generate Automatically
in the panel menu.
Click

Note Group area descriptions
Numeric values in parentheses indicate current and index values for the component occupancy ratio.
Example GroupA (30% : 50%) Æ Group name (Current value : Index value)
For this group, the components occupy 30% of the total group area.
You can change index values for the component occupancy ratio.
From the menu bar, select Utilities Æ Placement Design Info..
Select the desired group area.
Change the component occupancy index ratio.
Delete Group Delete the group area from the PC board.

Area
1. Click (Add Group Area) on the tool bar.
2. Specify the name of the group to be deleted in the panel menu.
Click
3. Click (Delete Group) in Command.
Edit Group Area Edit the group area shape on the PC board.

2. Specify the name of the group to be edited in the panel menu.
Click
3. Click two points on the group area outline and input a new shape.
P1
P3
P2
GroupA(50%:50%) GroupA(50%:50%)
Data End GroupA(50%:50%)

Divide Group If a group area has been input for both Sides A and B, you can divide it into
Area respective group areas.

2. Specify the name of the group to be edited in the panel menu.
Click
3. Click (Divide Group) in Action for Groups.
The entire area remains

unchanged, but the Side A
and B areas overlap.
Note The above operation divided the group area input commonly for Sides A and B to
respective areas at the same point. You may also input respective areas by selecting
Side A or B from the panel menu when inputting the group area.
Move Group Area Move a group area already created, without changing its shape.
1. Click (Move Group Area) on the tool bar.
2. Panel menu
Actions for Groups
Delete Group
Divide Group
Specify angle for rotation when executing rotation

from the Assist menu.
Specify distance for relative move.
When checked, grouped components placed in the

area are moved together with the group area.
3. Select and move the group area(s).
Selecting one group area

GroupB(30%:50%)
GroupA(50%:50%)
GroupA(50%:50%) P1
GroupB(30%:50%)
P2
Selecting multiple group areas

GroupB(30%:50%)
GroupA(50%:50%) Data End
Shift + P2
P1
GroupB(30%:50%)
GroupA(50%:50%)
GroupB(30%:50%)
P3 GroupA(50%:50%)

Edit Group Area Change the shape of a generated group area.

Shape
1. Click (Edit Group Area) on the tool bar.
Segment Stretch
To fix the segment angles on both sides of the
specified side or construction point, select Lock.
To be able to change the segment angles to any
angle you want, select Free.
2. Specify a group area.

According to the point you specify, Move Construction Point or Move Segment is automatically
selected.
Move Construction Point

Specify a construction point in the group area and click the destination.
P1
Move Segment
Specify one side of the group area and click the destination.
P1
！ Caution To add construction points to the group area, use the Create Group Area command.
Display Related When a group area is created, you can display the following:
to Group Area
Group shape
Guide
Inter-group net
Fixed componet
1. Click View Æ Comp. Group from the menu bar to switch between displaying and
hiding group areas.
OFF ON

2. Select Environment Æ Option from the menu bar, and set the Shape and
View Side options on the Component tab.
Shape
Group Shape
GroupA(70%:50%)
Group Shape and Guide

View Side GroupA(70%:50%)
Both : Components on both sides

A Side : Components on A side The group guide area is an area indicating the
B Side : Components on B side value of (component total area) ÷ (component
occupancy index ratio). This group guide area is
Following Active Layer :Follows the
helpful in inputting or editing a group area.
current active layer
3. You can display inter-group nets by selecting the Group Net edit-mode indicator.
Click
By clicking the list icon, you can also refer to or define the inter-group nets in detail.
Click
You can view color and display settings and net

count or width values for the group net.
4. Click (Move Components) on the tool bar and select the group net components
to be displayed. Click Attributes Æ Group Net Display Component Æ Set from the
menu bar.
If you have defined Group Net Display Component
for a key component such as a connector component,
you can display the inter-group net between the
component and the group.
Group Net Display Component

Lesson 1. Input group areas, and then move and edit them so that they have the following
shapes:
2. Click (Move Components) on the tool bar. Place CN1 and IC1 in the coordinates
shown below and define the group net display component for CN1.
CN1 0-degree angle

(53.34, 10.16)
IC1 180-degree angle
(73.66, 48.26)
3. Check Group Net on Edit-mode indicator to display the group nets between the group
net display components and the related component groups.
Click

z Checking Placement
Now we will try a trial placement.
Trial placement means that a search is made of the combinations of placed
components and non-placed or outside-board standby components for the one that
has the strongest connection relationship. Non-placed components are then
automatically placed near a placed component. This function allows you to place the
components that have strong connection relationships near each other, reducing the
estimated wire length.
Trial placement
Placed component
！ Caution Before trying trial placement, you must define some key components.
You can also perform trial placement according to group areas.
Trial placement for

GroupA
Only the components in

the specified group are
placed in the group area.
Three commands are available for trial placement:
Trial Placement (Serial) Trial placement for each component.
Trial Placement (Repeat) Trial placement for the specified number of components.
Trial Placement (All) Trial placement for all components in-batch.

1. Click Utilities Æ Trial Placement on the menu bar.
2. The Trial Placement dialog box appears.

Trial Placement commands Same as Outside-board Standby and
Unplaced Components for the Move
Specify whether to place Component command.
components using a grid
Specify target component
(All Components, Non-grouped,
Reference grid for grid placement Grouped)
Switch whether to use Bus Mode Specify the group names when the
(In Bus Mode, components that target components are grouped.
have bus relationships with
each other are grouped and Specify the area to place
placed once. You need to specify components.
the minimum number of (Group area, layout area)
connections between two
components for the Bus mode.) Specify the number of repetitions for
Trial Placement.
In this mode, the components
shown below are also Specify the placement side
processed: (No Change, Areas Equal, Side
y Components not connected to A, Side B)
nets
y Components connected only Specify whether to refer to existing
to power/ground If placement is impossible, wiring patterns.
y Components without change the angle by 90 When referred to, wiring is
connections to placed degrees and retry. regarded as wiring inhibited data
components processing.
Note Target components, component group names, and target areas

Target Component group Target areas
components names Layout areas Group areas
Components in all groups are
All components are placed in the
All components - placed in their related group
layout area.
areas.
Components in the specified
Grouped Components in the specified group
Selected group are placed in their
components are placed in the layout area.
related group areas.
Components that do not belong to
- any group are placed in the layout
Non-grouped area.
components Components that do not belong to
Selected any group are placed in the
specified group area.
3. After setting the necessary items, click a Trial Placement command ( )

to start placement.
Click
Note You can suspend the process with the Break key (Ctrl + Break for Windows-version).

* Optional placement grid and clearance area
At trial placement, components are placed so that a DRC error does not occur and the
estimated wire length is minimized.
Components are placed with

minimum clearance between them
without causing DRC errors.
Depending on how the net is filled and the number of connections, components may
be placed too close to each other. In such a case, you can use another grid or increase
the clearance between components for trial placement.
Optional placement grid

Define a grid for each component selection condition effective only for trial placement.
Grid on the screen: 2.54 Placement grid: 7.62
Click Utilities Æ Optional Placement Grid on the menu bar.
Specify Pitch X, Y and Origin X, Y

You can also specify a size not
defined as grid.
Specify grid name

You can select a name from the
list by double-clicking.
Add a component select condition name

You can do this from Append Row in the
assist menu.

Clearance area
Only for trial placement, you can outwardly expand the component area for each
component selection condition.
Component area
Expanded clearance area
Click Utilities Æ Expanded Clearance Area on the menu bar.
Default Expanded Clearance Area

Expanded clearance area for components
other than those specified with an optional
expanded clearance area.
Optional Expanded Clearance Area

Set expanded clearance areas individually for
additional component select conditions.
Offset X
Offset Y
Add a component select condition name

You can do this from Append Row in the
Assist Menu.
！ Caution Before using Optional Placement Grid or Clearance Area, you must preset the component selection conditions
(using Select Manager).
Reference For Select Manager, refer to “Selecting Components” on page 3-45.
！ Caution When doing trial placement using Optional Placement Grid or Clearance Area, you
must consider the following two points:
1. Set the “Base Grid” and “Optional Placement Grid” with a sufficiently large pitch. For trial placement, the
system searches for a placement area based on the set grid. So, if the grid is too small, it will take a long time
to search for a placement area, causing the process to be delayed.
2. Use the placement grid to adjust the component interval and set the clearance areas only when necessary.
Placement is inhibited in all clearance areas set. If many clearance areas are specified, the area available for
placement is reduced and searching will take longer.
On the other hand, if the placement grid is used for adjusting component intervals, the search areas are
skipped by grid. In this way, unnecessary searches are not carried out and the processing time can be
reduced. In addition, unused areas are available for placing components for which other grids have been set.

Lesson 1. For an insert-mounted type component, set the Optional Placement Grid Pitches X
and Y both to 5.08.
Select Manager
Set the component select condition name with a mount-type of Insert Mount
(“Insert” is already provided in this data, so you do not have to add it).
Optional Placement Grid

Set component selection condition “insert” to grid 5.08.
2. Click Utilities Æ Trial Placement on the menu bar, and then set as follows:
Target Component: Grouped Component
Target Area: Group Area
3. For each group, click (Trial Placement (All)).
If some components cannot be placed, make them

standby outside the PC board, change parameters such
as Bus Mode, and then re-execute the trial placement.
！ Caution When trial placement is performed for GroupB with a

certain group area shape, the message, “A net that may
exceed maximum wire length is included” is displayed.
This message will appear when the component placement
position exceeds the maximum wire length specified when
the design rules were set for IC9 in GroupB. You will
correct this position in the following lesson.

z Moving a Component While Pushing Aside Other Components

You can move a component while pushing aside other placed components.
1. Click (Move Component) on the tool bar.
2. Check Spread in the panel menu.
Click
3. Place components so that they overlap.

If component areas overlap each other,
move the placed component.
Lesson Move IC9 to a position where a maximum wire length error does not occur.
The maximum wiring length limit is set to net of IC9 pin 2, SIGN2.
Note For a net with the maximum or minimum total length specified, a diamond appears
when moving a component or inputting wire so that the design rule will not be
violated.
Reference For details, refer to the online help.

z Saving Placement Results

You can save up to three placement results.
1. Click Utilities Æ Save Placement Results ... on the menu bar.
2. Click Placement Results 1 and OK in the Save Placement Results dialog box.
Click
Click
Placement Result 1
3. Change component placement. Click Utilities Æ Save Placement Results ... on the
menu bar again and save the result in Placement Results 2.
Click
Click
Placement Result 2
4. Change component placement again. Click Utilities Æ Save Placement Results ... on
the menu bar again and save the result in Placement Results 3.
Click
Click
Placement Result 3
5. Click Utilities Æ Load Placement Results ... on the menu bar. Click Placement
Results 1 and OK in the Load Placement Results dialog box.
Click
Click
Placement Result 1
6. Click Placement Results 3 and OK in the Load Placement Results dialog box.
Click
Click
Placement Result 3

* Estimated wire length
You can calculate and display the estimated wire length based on the unconnected
net length (Manhattan length). Based on this information, you can evaluate the
placement of components.
Click View Æ Show Estimated Wire Length on the

menu bar to switch display/hide of estimated wire
length.
Click
Current estimated wire length Difference from the previous length
If the estimated wire length has been changed by executing commands such as Move
Component and Swap Gates, the difference is displayed in parentheses ( ).
！ Caution Floor Planner does not calculate power or ground net lengths, but Placement/Wiring Tool does.

Lesson 1. Click Module Æ Placement/Wiring on the menu bar to move to Placement/Wiring
Tool.
You can switch tools while the PC

board remains open.
Click
When the module is switched from

Floor Planner to Placement/Wiring
Tool, land status is internally
changed (normalized).
Information on changed land status is
displayed here.
Click Yes to close the dialog

Click box.
Placement/Wiring Tool is started while the changed land status is marked.

2. View the information to see how the land status has been changed.
On the menu bar, click Check Æ

Error List.
Click
Land status before and after

the change
Padstack signal name
Padstack with changed land status Layer with changed land status
3. Click a padstack name to zoom in the marked position.
Click
The selected padstack will be zoomed in.
4. After checking information on changed land status, remove the marks.
Click the ID cell in the Error list

dialogue, select a column of IDs, and
Click click Remove From List by Selecting
ID.
Click
！ Caution Marks remain unless you remove them. Be sure to remove unnecessary marks each time.

5. Because Placement/Wiring Tool does not require the group area or inter-group net, set
the display mode to OFF.
Click View Æ Group Display Mode on

Click the menu bar.
Uncheck the Group Net check box on

the edit-mode indicator.
Click
* Land status normalization
When the module is switched from Floor Planner to Placement/Wiring Tool, the land
status of padstack is internally changed. This process is called “land status
normalization.”
If the inside layers contain a negative power plane layer or mixed layer, the padstack
(via) with the same signal name as the negative surface is connected on thermal land.
For those with a different signal name, “Unconnected” status is entered for the
clearance land.
Padstack signal : GND
VCC VDD
Mixed layer VCC VDD

Power plane
layer GND
Padstack signal : VCC Padstack signal : VDD
However, Floor Planner regards all vias as clearance land on the inside layers
regardless of signal name of the via and negative surface.
Because a position that should be thermal land must be changed to thermal land
before Placement/Wiring Tool operation, the land is automatically normalized at
module switching.
Reference For details on land status normalization, refer to Online help.

z Placement/Wiring Tool
When you have determined rough placement using Floor Planner, proceed to precise
placement and wiring steps.
Input PC board shape, etc. PC Board Shape Edit Tool
This section explains the commands provided for placement and wiring.
Reference Although the following commands are not covered in Master Training, Beginner’s Training explains them in
detail. Refer to “CR-5000 Beginner's Training <PCB Design>“ and Online help.
z Swap Components z Swap Gate z Swap Pin z Memory Routing

z Template Routing z Move Wire z Delete Wire
Reference For resource files that Placement/Wiring Tool refers to, refer to “Resource files for each edit tool” on page 3-34.

z Displaying Nets
Unconnected Net Check the Net check box on the edit-mode indicator.
Display ON
Click
Set Net Display Open the Set Net Display Color dialog box from the edit-mode indicator.
Color Dialog Box
Click
Set Color Display... Net Name Filter

When changing the display With the net name, limit the nets displayed
color or mode from the in the net color list (example: SIGN*).
default, specify whether to
use that color for all data
or for specified objects only
Selectable objects Additional Information Filter
Unconnected According to the net rule given to the
Net/Pin/Via/Line/Area net, control the nets displayed in the
color list.
Switch the display (Unconnected Net)

and the Construct Net function for
particular nets ON/OFF.
Color Parameters
Set net display color and display mode.
Color:
Displays the net in a specified color.
Hatching:
Displays the net in the hatching mode.
Tone:
Displays the net with tone patterns.
Layer Color:
Selectable from the layer color names. You can
also read and output the layer color file.

* Net construction
You can specify whether to calculate net information in real-time at wiring input or
component moving.
When a net has many connections, such as a power or ground net, you can improve
the response to commands by turning off the Construct Net function.
<<Operation>>
1. Open the Set Net Display Color dialog box from the edit-mode indicator.
Click
2. Set the Construct Net function to ON or OFF in the Set Net Display Color dialog box.
Click
Even when the Construct Net function is set to OFF,

you can recalculate connection status by clicking
Reconstruct Net in the assist menu when entering
wiring or moving components.
Click
When the Check Wiring command is executed, a network reconstruction confirmation

dialog box is displayed.
If Yes is selected in the dialog box, net is recalculated

and the wiring ratio and other data are displayed,
even for a net with the Construct Net function off.
！ Caution If No is selected in the confirmation dialog box, a net with the Construct Net function off is not calculated.
In other words, the wiring ratio and other data are not updated.
Reference For details on the Check Wiring command, refer to “CR-5000 Beginner's Training <PCB Design>.”

Example Sample operation of Set Net Display Color dialog box.
Display only the nets connected from “GroupA”.
Select the View column and click

OFF in the assist menu.
Click
From Additional Information Filter,

click “CGroup[GroupA]”.
Click
Select the View column and click ON

in the assist menu.
Click
Lesson In the Set Net Display Color dialog box, set the display colors for particular nets as
follows.
GND : Green
VCC : Yellow
SIGN2 : Magenta
(Setting Max/Min Wire Length)

Note The following net display functions are also provided.
Setting for Selected Net
You can change the net color, switch the unconnected net view, and switch net
construction ON/OFF by selecting Setting for Selected Net from the assist menu of
each command and specifying nets on the canvas without using the Set Net Display
Color dialog box.
Click
Display Net Density function
You can also display net density outside the PC board shape.
Select View and check the Display Net Density

check box from the menu bar.
Click

* Area Net Display for the Input Wire command
By specifying Disp. Nets in the assist menu during execution of the Input Wire
command, you can display only the unconnected nets which contain pins in the
specified area.
This command allows you to input patterns, inhibiting display of unconnected nets
not related to the nets being operated.
1. Click (Input Wire) on the tool bar.
2. Click Disp. Nets in the assist menu.
Click
3. Specify the area for pins generated from the unconnected net to be displayed.
P1
P2
fc
Note Hold the Shift key down and select areas to display multiple unconnected nets in the
selected areas.
4. Click Command End in the assist menu or press the Return key on the keyboard.
Click
You can also select one of the three modes below from the assist menu, in addition
to displaying nets in the specified area:
• Display All Display all nets.
• Display Area Display the nets in the specified area (default).
• Undisplay area Do not display the nets in the specified area.
！ Caution If you have used Display Area Net to limit the nets to be displayed, only nets in the specified area are displayed
unless you change the area with Display Area Net or change Display/Non-display using the Set Net Display
Color dialog box.

z Setting aTheGrid
Board Designer provides four types of grids:
You can set four types of grids in Board Designer.
1. Artwork grid Grid referred to when editing manufacturing information (referred to in

PC Board Shape Edit Tool and Artwork Tool)
2. Placement grid Grid referred to, for example, when moving components.(Referred to in
Placement/Wiring Tool and Floor Planner)
3. Wiring grid Grid referred to when inputting lines or surfaces as patterns. (Referred to
in Placement/Wiring Tool and Floor Planner)
4. Via grid Grid referred to when inputting vias. (Referred to in Placement/Wiring
Tool and Floor Planner)
Click Environment Æ Grid Settings on the menu bar.
Pitch X, Y Origin X, Y Highlight display/interval

Input grid spacing X- and Y-coordinates Grids are highlighted at
for the grid origin the specified intervals by
checking the Highlight
check button and setting
the highlight interval.
Skip display/interval
Grids are displayed at
the specified intervals by
checking the Skip check
button and setting the
skip interval.
Point Grid
Grid types can also be selected from
Displays the set grids with points.
the predefined list by selecting the
grid type cell and clicking Grid List
Line Grid
Displays the set grids with broken
lines.
Click
！ Caution Line grid does not support via grid and, therefore, the via grid is always point grid.

Change Grid You can temporarily change the wiring grid on the canvas without specifying
numerical values in the Set Grid dialog box. Based on the objects on the PC board,
specify the number of grid pitches to be generated between objects.
1. Click Environment Æ Change Grid on the menu bar.
2. Click an object (P1). See Caution below.

P1
A flag is marked.
！ Caution An object specifies any point on the wiring line or the center of a pin, via, or area.
3. Click a point (P2) where no objects exist “divisions - 1” times.
P2 1
4. Click another object (P3).
P3
5. Click Environment Æ Change Grid from the menu bar, and then click Mode Æ Set To
Original in the assist menu.
Click The temporary grid you have set will

be undone.
Note In addition to the operation explained above, the temporary grid can be undone using
the Change Grid command if P1 and P2 are the same point.
Via Grid Draw-in is Off by default. Set Draw-in or View On if necessary.
Click Environment Æ Via Grid Æ Draw-in from

Click
the menu bar.
Click
Click Environment Æ Via Grid Æ View on the

menu bar.

z Moving Components
Move components already placed.
Edit Æ
Move Component
Start Component Rotate Component

Selector or enter the Rotate the component by a relative
reference designator angle
directly to select Rotate around the component
components.
origin
Action for Components Rotate around the component
center
Relative Move
Move components by Change Angle
the specified values. Rotate the component by an
absolute angle.
Decoupling Capacitor Rotate around the component
Set the placement side origin
of the selected
Rotate around the component
decoupling capacitor
and move it center
Comp. in Placement Group

Spread When a component is selected,
Push aside components components in a placement group
when component areas is selected at the same time.
overlap.
Do not Select from Child
Consider Jumper When Comp. in Placement Group
Generate wiring is used, other components are not
pattern where a selected from child components.
jumper existed after
deleting or moving a
jumper.
Navigate
Fix Wire Bond Pad Guide placement so that the
The Wire Bond Pad does not follow the component estimated wire length is minimized.
movement.
Reroute when moving components

Connect the construction point near the component pin to the
move destination pin with any angle.
Cut the existing wiring pattern around the component and
reroutes.
Cut the existing wiring patterns in a segment according to the
amount of component movement and reroutes.
！ Caution The maze rerouting function is available only when the optional software Embedded Router is purchased.
Command
Outside-board Standby
Put the component standby
at the last arranged position.
Component Standby
Put the component in an
Optimize Component Angle
unplaced state.
Rotate the component so
that the estimated wire
Change Placement Side: Side A/B length is reduced.
(Available only in Floor
Switch the placement sides. Delete Component
Delete the component. Planner.)

Move Single 1. Click (Move Component) on the tool bar.

Component
2. Click the component.
P1
Temporary view of the component

follows the cursor movement.
3. Click the destination.

P2
Move Multiple 1. Click (Move Component) on the tool bar.

Components
2. Select components by drawing an area or clicking multiple components one by one
while holding down the Shift key, and click Data End on the assist menu.
Shift + P2
Data End
Shift + P1
The selected components will be highlighted.

3. Specify a reference point for moving components and perform the move.
P4
P3
Rotate 1. Click (Move Component) on the tool bar and select components.
Component during
Moving or Change
Placement Side
P1
2. Click Rotate and Side B in the assist menu and click the destination.
P2
Note During move the components can be rotated and the placement side can be changed
also by using the Rotate button on the panel menu.

Relative Turn of 1. Click (Move Component) on the tool bar, select components, click Data End,
Component during and click the base point.
Moving
P1
Data End
2. Click Relative Turn in the assist menu.
Relative Turn
3. Click the destination.
P2
The result is that the components are turned on the Y-axis

specified and the placement side changes. A-side components
are moved to B-side. B-side components are moved to A-side.
Rotate 1. Click (Move Component) on the tool bar and select components.
Component at
Placement
Position or
Change
Placement Side The selected components will be
highlighted.
2. Click the Rotate button on the panel menu, and click the Place Side B button.
Click
Click

Move Component 1. Click (Move Component) on the tool bar, and check the Reroute check box and
with Reroute ON
select Simple mode on the panel menu.
(Simple
connection)
Click
2. Select the connected component and drag it.
Connect them at any angle.
Note The simple mode is useful in the parallel movement and rotation of components.
Non-parallel moving.
A DRC error may occur

depending on the angle.
！ Caution This function is available only in Placement/Wiring Tool.
Move Component 1. Click (Move Component) on the tool bar, and check the Reroute check box and
with Reroute ON select the Channel mode on the panel menu.
(Channel
connection)
Click
2. Select the connected component and drag it.
Cuts the existing wiring

pattern around the component
and reroutes.
Note The channel routing mode is valid in the parallel movement and the spread
movement.
！ Caution Rotating and changing the component side is impossible.
！ Caution All patterns are not always rerouted.
！ Caution This function is available only in Placement/Wiring Tool.

z Aligning Components
Align disorderly placed components.
Edit Æ
Align Component
You can also re-place components onto a grid.

Place selected components onto a grid.
Specify the alignment direction and base position.
Align selected components with the specified interval.
Align the components at the specified angle.
Rotate the component that is being dragged by the

specified angle.
Place the components in the same way as on the schematic.

(For detail, see “Master Training <Engineering Change/Operation>”)
Note The components are aligned using the combination of align direction and align base
as follows. Top Center Bottom
Horizontal
Lef t Center Right

Vertical
1. Click (Align Components) on the tool bar.
2. Set the panel menu as follows:
Align Direction : Horizontal

Align Base : Top
Even Spacing : ON
Space (Pin-Pin) : 2.54
3. Select multiple components to be aligned, click Data End in the assist menu, and drag
the components to the destination.
Data End

z Changing Components
While designing the PC board, you can change components to those from another
package.
Edit Æ
Change Component
You can only change components that use the same pin assignment names in parts.
Footprint Part
DIP14 Function
AND INV
SOP14
Pin assignment
AND*4 INV*6
Package
DIP14 SOP14
Part
74LS04-DIP 74LS08-DIP
74LS04-SOP 74LS08-SOP
！ Caution If a component has been registered without pin assignment, all components with the same pin count are to be
changed.
The Change Component command has the following four modes.
Change Part
Change Part (In Table)
Change Footprint
Reset Footprint Shape

1. Click (Change Component) on the tool bar.
2. Click the components to be changed.
P1
Note When you select a component, other components having the same part name will
also be highlighted.
SN74LS08 SN74LS08
To simultaneously execute the change instruction to
P1 components that are highlighted, click them sequentially. To
IC1 IC2 change all components that are highlighted, select Select All
3. From the parts list to be changed, specify the part names.
The selected part name is displayed.
Select this checkbox to specify a component registered in the

Click
CDB but not on the PC board.
When you click the destination part name, the footprint

name used will be displayed.(You can also change it from the
List icon.)
Keep the original footprint after changing the parts.
When selected, component symbols generated for

components remain after the change.
4. Click Apply on the panel menu.
Changes are applied to the specified

Click components.
Note
When executing with CDB Components checked, information on the
components copied from CDB to the PC board is listed.

Change Part You can change all components having the specified name in one operation, instead of
(In Table) changing them individually.
2. Change the Change Mode to Change Part (In Table) in the panel menu and click
Change Part Dialog.
Click
Click
Keep the original footprint after changing the parts.
When selected, component symbols generated for components

remain after the change.
3. Filter the part names that you want to change to change them in one operation.
Click the part name list icon.
Click
Select the part name to change from the

Click part list and click OK.
Click
Double-Click Double-click the part name cell.
Click
Select a part name to change and click OK.
Click
The part names are changed.
Click
Click Close.

Change Footprint You may also change the component shape only, leaving the part name as-is.
The component shape is determined from the package information in the CDB library
as you can see from the figure below. You can change the footprint, ignoring the
package information, just for practice.
Part Information
Part Name: SN74LS08
Package Name: LS08-DIP
Footprint information
Footprint Name: DIP14
Package Information
Package Name: LS08-DIP
Footprint Name: DIP14
2. Switch the Change Mode to Change Footprint in the panel menu and select
components to change.
P1
Check Independent of Package to select footprints in

different packages but with the same pin count and pin
Click number.
Uncheck this check box to select only footprints in the
same package.
You can change the

footprint Spec. Name
and select the target
footprint.
！ Caution If Independent of Package is checked, note that the package

type and mounting type information will be retained even
though you can freely change the shape.
Check this check box to target components in the same part.

Uncheck it to target components with different part names
but the same footprint name.
3. Select footprint names to be changed from the list and click Data End in the assist
menu.
Click
The part name is not changed and only the
footprint name is changed for each placement
side.

Reset Footprint You can reset the component shape that is edited (land cut, silk editing, etc.).
Shape
2. Switch the Change mode to Reset Footprint Figure in the panel menu, and select
components to change.
P1 The selected components will be highlighted.
Click If any of these check boxes are checked, the original status
(edited status) remains unchanged after reset.
Padstack
Maintains all padstacks in the component
Pad
Maintains all pads in the component
General Figure (Edited)
Maintains edited figures in the component
Check this check box to target components in the same

part.
Uncheck it to target components with different part
names but with the same footprint name.
The edited status is reset.
The Change Component command can be executed against selected components,

either using the panel menu or the assist menu.
Click
Click
Panel menu Assist Menu

z Generating Components
Utilities Æ All components on the PC board were in the net list, and then were generated on the
PC board database at PC board generation.
Add Component
You can also generate individual components, which are not in the net list, on the PC
board, if necessary.
The following components may be generated:

Electrical components
Ordinary components with terminals
Jumper components
Components that are defined as
jumpers in the part library
Non-electrical components
Components that are not related to ZUKEN
the net (having no terminal), such as
logos and drawing frame components
1. Click Edit Æ Add Component on the menu bar.
2. Specify the components to be generated in the panel menu.
Comp. type Electrical/Jumper/Non-electrical
Filter Filtering is available against the name and pin

count.
List Generatable part names are listed.

Click
CDB Components
Check this check box to specify a component registered in the
CDB but not existent on the PC board. (The component is
automatically copied from the CDB to the PC board.)
Ref-Des
Specifies the header and starting number of the reference of
the component to be generated.
Placement Side Placement side for the component to be

generated
Angle Placement angle for the component to be generated
3. The component follows the cursor movement. Click the placement position.
If the specified reference designator

already exists, the initial letter
IC1 remains and only the number
increments.

z Changing Pin Pitch

Edit Æ Change the pin pitch. This is effective on components with the same part name and
stock code but different pitches, such as jumper components and axial components.
Change Pitch
7mm 5mm 3mm
1. Click Edit Æ Change Pitch on the menu bar.
2. Click the component pin to be changed.
P1
3. If the component allows pitch change, it is highlighted and dragging starts.
4. When you click while the pitch is changed, the pitch changes to that displayed by
dragging.
P2
Note Pitch-changeable components
Components that allow pitch change are 2-pin components with multiple footprint names defined in the
same package. When you execute the Change Pitch command, the footprint will actually be changed to
another.
Before Change After Change
Part : JUMPER Part : JUMPER

Package : JUMPER Package : JUMPER
Footprint : JUMPER10.0 Footprint : JUMPER20.0

z Locking Components
Attributes Æ You can place four types of locks on a component.
Lock Component Location Lock Inhibit changing the placement location, angle, and
or placement side.
Unlock Component Place Side Lock Inhibit changing the placement side.
Angle Lock Inhibit changing the angle.
Ref-Des Lock Inhibit changing the reference designator.
Lock Component 1. Click (Move Component) on the tool bar.
2. Click Select Only in the assist menu and select components.
Click
The component is not dragged, but only is
P1 highlighted.
3. Click Attributes Æ Unlock Component Æ Location on the menu bar.

(Click one of the following: Location / Place Side / Angle / Ref-Des.)
A mark indicating the location lock

Click
(L) appears.
Unlock 1. Click (Move Component) on the tool bar and select locked components.
Component
P1
(L)
2. Click Attributes Æ Unlock Component Æ Location on the menu bar.
Click
Note When you lock a component, you must use the Move Component command to select
the component. By clicking Select Only in the assist menu of the Move Component
command, you can just select the component at the current position.
Click

z Executing Component DRC

Check Æ You can check clearance between component areas, between a component and a
placement keepout area, and also check that the component does not violate the
Component DRC
placement side limit and placement angle limit.
Clearance check Clearance check

between component between component
areas. area and inhibit area.
Execute Check.
Panel menu
Clear Error Marks.
View the details of the error.
Component DRC
Setup dialog box
Che.:
Setting for checking or clearing error
marks.
Log:
Setting to either retain or clear the check
log.
Disp.:
Setting for displaying error marks.
Reference For details on the check items for Component DRC, refer to [Setting items of component DRC and check
contents] in the online help.

1. Click Check Æ Component DRC on the menu bar to open the DRC Settings
dialog.
Check Check and Disp. check

boxes for items to check.
2. Click Check All Area on the panel menu.
Batch check is performed for

components on the entire PC board.
Click
Error marks may appear

depending on the checked
items.
Refer to 1. Click Error List in the DRC Settings dialog box to display the Error list dialogue.
Component DRC
Error Information
Click
Error list dialogue is started.
Click
Click
Click the Error Type cell.
The selected error information

is zoomed in, and the error
mark is highlighted.

Clearing 1. Select the Clear Error Marks mode in the panel menu, and click on the PC board.
Component DRC
Error Marks Click
Click
All error marks are cleared.
Note
Instead of clearing error marks, you may temporarily turn off error display only.
On the menu bar, click Check Æ

Click
View Comp. DRC Errors
！ Caution Because error marks are stored internally when the display of error marks is disabled, repeating the check
without displaying error marks results in storing a great amount of error mark information.
Thus, if possible, keep the View Comp. DRC Errors ON, and execute Clear Error Marks on error marks that
are unnecessary.

*Executing Online Check for Component DRC
Executing the component DRC check online allows you to check the component
movement real-time when deciding the placements.
Click Check Æ Online DRC on the menu bar.
You can switch ON/OFF and check the current

status from the viewer on the upper right of the
Click
editor.
Click Check Æ DRC/MRC Settings on the menu bar.
Select Check check boxes for items to

check online.
If an error occurred while moving components,

an error mark appears and the movement will
not proceed.

z Viewing Wiring Probability Distribution

You can display a color matrix showing the probability of unconnected net being
wired on the PC board.
By keeping the wiring probabilities on the PC board nearly flat, you can place
components in a manner so that wiring is facilitated. Therefore, keep the Wiring
Probability Distribution displayed at floor planning and placement.
Click Utilities Æ Wire Probability Distribution on the menu bar.
Grid
Specify the number of vertical and
horizontal points for displaying a
color matrix.
Color scale
Indicates the probabilities shown by
these colors.
Component shape
Wiring probability distribution

Displays the distribution with a
color matrix.
You can change the settings of the information displayed.
Setting the Wiring Probability Distribution View

Click View Æ Parameters on the menu bar.
Specify Wiring Detour Factor

Wiring detour factor to be taken into account when calculating the
probabilities.
The wiring detour is assumed to be the wiring width and clearance
multiplied by the Wiring Detour factor.
Scale
Set the division count for distribution.
The greater the scale value, the more minute the distribution.
Display probability distribution for individual conductive layers.
Click View Æ Visible Layer on the menu bar.
Setting for visible layers is performed.
Specify the timing to refresh display.
Click View Æ View Mode Æ Constant Update or

Optional Update on the menu bar.

We have now introduced you to all the commands related to component placement.
Next, we will show you commands for wiring.
Open “exwir/[Board]” provided for wiring and try the operations following the
instructions.
Lesson Click File Æ Open on the menu bar.
Click
Click Click Yes in the confirmation dialog box.
Click
Select exwir.pcb and click OK.

Click
Note When you want to open another file, you can specify the filename after selecting File
Æ Open on the menu bar without ending the tool each time.

z Performing Wiring
Now we proceed to input wire. Various functions are provided.
Pair Layer
When you double-click to generate a via and switch the active
Edit Æ Input Wire layer, the layer set as paired layer is activated.
FromTo Specifies from which layer to which layer the generated

via runs through.
Shape
For details on each mode, see page 3-94 and onward.
Pen Selects either round or square.

Angle Specifies angle lock for wiring pattern
Width Specify the wire width. Checking the Fix Width check
box allows setting a wire width different from the
default.
Display Chart Specify whether to display the wiring length graph

or not (See page 3-97.)
Change Padstack
Allows entering a via into a padstack different from the
default. (See page 3-107)
Parameters
Detailed parameters for tangent Detailed parameters for Detailed parameters

arc generation (See page 3-105.) semi-autorouting (See page 3-103.) for build-up via
generation
Detailed parameters for fillet
generation (See page 3-105.)
Detailed parameters for L

wiring (See page 3-98.)
Specify whether to check

clearance to resist and the same
net via at online DRC.
Detailed parameters for Spread

(See page 3-102.)
Sets pattern drawing into/from

points other than pin reference
points (See page 3-95.)
Sets angle lock for extraction

from wire bond pad
Specifies highlight for a selected

net pin, via, and wire.
Sets auto-draw-in mode. (See

page 3-95.)
Specifies automatic divide input. Displays a

(See page 3-96.) warning when
a loop is to be
Sets input angle when the Switches to rubber Detailed parameters cut
wiring input angle is specified. band display for jumper automatic automatically
(Rectangular/Linear) generation in wiring.
Reference See pages indicated for details on parameters with pages noted.

Input Wire 1. Click (Input Wire) on the tool bar.
2. Specify an unconnected line.

When you move the cursor, the unconnected line nearest the cursor is
highlighted.
P1
3. Sequentially specify points on the wiring route.

Before specifying the wiring route, the shape it will have after
specification is temporarily displayed. You can confirm the shape.
In addition, a rubber band from the cursor to the end point is shown in
P2 a rectangle.
4. Generate a via as needed.

You can generate a via by again clicking the same coordinates
specified immediately before.
You may also generate a via by changing the active layer to another
P3 layer.
Reference For the generation of vias, see “High-level Wiring (Via)” on page 3-99.
5. Specify wiring route (immediately before the end point).

The rubber band from the cursor to the end point turns in a straight
line positioned with an angle of 45 or 90 degrees.
This is useful for snapping to an off-grid pin.

P4
6. Specify the end point.

When you move the cursor to the end pin, the pin is highlighted if
connection to its center is allowable.
Clicking the end point automatically completes wiring.
P5
Note During the wire input, clicking Data End while entering a pattern sets the wiring made until then.
Data End

Draw from a point If a component pin is created with a line or area, you can specify any position (even a
other than the position other than center point) to draw the pattern to.
center
1. Click (Input Wire) on the tool bar, and click Parameters on the panel menu.
Click
Uncheck the Into CenterPoint check box.
2. Click any point in the pin and start inputting wiring.
Note Default setting for this check box is unchecked (no retraction to the center).
！ Caution When the pin is a via, pattern is retracted to the center regardless of the setting.
Auto-draw-in If auto retraction is enabled for a retraction object when wiring is suspended, the line
Mode pattern is automatically generated to retract the end point to the object.
1. Click (Input Wire) on the tool bar, and click Parameter on the panel menu.
Select the Auto-draw-in Mode check box.

Click
2. Now we will input wiring. Extend wire toward the retraction object and execute
Data End when the flag mark appears.
Data End

Auto-divide Mode When the line pattern input with Wire Input passes over the same net pad or
padstack, the line is connected to the pad or padstack in-batch.
1. Click (Input Wire) on the tool bar, and click Parameter on the panel menu.
Click Check the Auto-divide Mode check box.
2. Wire so that the wiring goes over the same net pad or padstack.
P1
You can confirm that

construction points on the pins
(padstacks) are generated and
P2 connected.
If the Auto-divide Mode is OFF, the construction

points will not be generated and it will result in
unconnected lines.
Wiring to a When wiring to a 2-pin component that has been defined to have no logical polarity in
Non-polarized the part library, you can change the connection destination and draw the wire to
Component either of these two pins only if neither of them has been wired.
1. Click (Input Wire) on the tool bar to start inputting wiring.
The swappable component pins are indicated by balloon marks.
2. First, the line is drawn to the opposite pin where an unconnected line does not exist.
The pins are exchanged automatically,

and the unconnected line display
changes.

Considering the You can perform wiring checking maximum/minimum wire lengths by displaying the
wire length pattern’s current wire length.
1. Click (Input Wire) on the tool bar, click Display Chart on the panel menu, and
begin wire input.
Click
The chart display color indicates whether or

not the wire length is in an allowable range.
Green: In allowable range
Purple: The allowable range may be exceeded if
wiring continues in this way.
Red: The allowable range has been exceeded.
If checked, the wire length chart will be started every

time the wire input command is executed.
Regardless of the Wire Length Chart display, a diamond is displayed for

nets with specified maximum/minimum wire lengths as for Move
Component.
Wiring a If you input wire where no unconnected nets or patterns have been specified, a
temporary net temporary net (pattern without signal name) is generated.
1. Click (Input Wire) on the tool bar, and input wire to an area where nothing
exists.
-?- appears on the cursor.
A pattern without connections is generated.
2. Start inputting the wire that is to be connected to a temporary net, and connect it to
the wiring of the temporary net.
P2
P1 The connected net is added.

z High-level Wiring (L-type Wiring)

There are two types of L-type wiring. In Mode1, the corner (P2) is determined after
the end point (P3) is specified. In Mode2, the wiring between the second point (P2)
and the third point (P3) consists of two segments, and these two segments are
Edit Æ determined when P3 is entered.
Input Wire P2
P3
P1
P1 P2
P3 P3 P3
P3
Mode1 Mode2

2. Click Parameter on the panel menu.
Select the mode.
Check this check box to perform L-wiring to the first point of the
first segment.
Check this check box to process the corner point with the
specified length and 45 degree angle.
3. Select L-wire from the assist menu.
Click
4. Input wire.
[Mode 1]
[Mode 2]
Note When there are multiple possible shapes for L-wiring, you can switch them by
clicking Another on the assist menu.
！ Caution Once you set L-wiring to ON, it remains on until you click L-wire again on the assist menu.

z High-level Wiring (Via)

There are 2 ways to enter a via: inputting a single via and generating it on the wire.
Edit Æ 1. Click (Input Wire) on the tool bar, and select Via in Shape on the panel menu.
Input Wire
Input a single via
Click
2. To input a via by specifying a net, click Select Net in the assist menu and specify the
conductive figure to be assigned on the canvas.
Click
Click
3. Input a via.
The via shape and FromTo follows the cursor movement.

When you specify a net, the net name also follows it.
P1 P2
Input a via.
P3 P4
Any lines and vias nearby will be automatically snapped.
This is useful when multiple vias need to be input for reinforcement.
Generating a via 1. Click (Input Wire) on the tool bar, and select Std in Shape on the panel menu.
on the wire
Click
2. Begin inputting wire.
P2
P1

3. Double-click to generate a via.
Double-Click
Note The FromTo of the via generated by double-clicking and the resulting active layer
follow the setting of the panel menu (FromTo, Pair Layer).
FromTo :1-6
Changed active layer: :6
4. Vias can also be generated by changing the active layer.
Click
Change the active layer using the view area or the active
layer selection list.
Click
Note The FromTo of the via generated by a change of the active layer follows the setting of
the panel menu, and the resulting active layer will be the active layer that was
changed.
Reference For the generation of interstitial vias, see “Using Interstitial Via” on page 4-7.

z High-level Wiring (Auto

(Neck Avoid)
Down)
Wiring is carried out avoiding any obstacles.
Edit Æ 1. Click (Input Wire) on the tool bar, and select Auto Avoid in Shape on the panel
Input Wire menu.
Click
2. Input wire over an obstacle.

P2
The obstacle will automatically be

P1 avoided in the temporary view.
！ Caution This is available only when Online DRC is enabled.
z High-level Wiring (Neck Down)

If the line width is too big to wire between pins, you can perform wiring by
temporarily reducing the wiring width.
Edit Æ For the two types of pattern width, you must define the net and default values in
Input Wire advance using Design Rule Editor.
Default wiring width stack
Wiring width stack per net
Wiring width during neck down
Normal wire width
1. Click (Input Wire) on the tool bar, and click Neck Down in Shape on the panel
menu.
Click

2. Input wire.
P1
P2
P3 The temporary view is automatically

necked down.
Lesson In the lesson data, the SIGN23 pattern is defined with maximum pattern width of 0.5
mm and minimum pattern width of 0.2 mm. Change the grid temporarily to G-0.635
so that the pattern can pass through the SMD pins after the neck-down process.
P2
P3
P1
P4
z High-level Wiring (Spread)

Wire while pushing aside other patterns.
1. Click (Input Wire) on the tool bar, and click Spread in Shape on the panel menu.
Edit Æ
Input Wire
Click
2. Click Parameters from the panel menu and specify the target object for spread.
Specify whether antenna pattern is a target of spread or

not.
Specify whether vias are

targets or not Antenna OFF
Specify whether areas are

targets or not
Antenna ON

3. Input wire.
Pattern
P5
P4
P2 P1 P3
Area
P4
P1
P3
P2
！ Caution If the retraction destination for the line pattern is surrounded by areas, you cannot retract the line nor confirm it.
z High-level Wiring (Semi-auto-routing)

A search for a route between two points is automatically started.
1. Click (Input Wire) on the tool bar, and click SemiAuto in Shape on the panel
Edit Æ
Input Wire menu.
Click
2. Click Parameter in the panel menu and select the search mode.
Search for a route in the rubber band status.
Search for the route between the specified two points.
Automatically generate jumpers as needed.
Automatically generate vias as needed.
Push aside obstructive patterns.
3. Specify an unconnected net to start inputting wire, and then specify the net end point.
P2
P1

z High-level Wiring (Change Path)

You can cut existing wiring and change a path by creating a loop when inputting
wire.
Edit Æ 1. Click (Input Wire) on the tool bar.

Input Wire 2. Input wire so that a loop is created.
P2 P3
P1 P4
The looped wires are cut and the path

is change.
Note A loop pattern can also be created without cutting a wire.
Click
Click Loop on the panel menu.
P2 P3
P1 P4
A loop pattern is created without

changing the path.
Note You can set a warning to be displayed when wiring that needs to be cut exists.
Check the Warn of Loop Cut check box in the

Click Parameters dialog.
P1
P2
P3 Click
P4
A warning will be displayed for the following actions:

！ Caution - Cutting a portion of a loop
- Cutting a portion that is not the “entire pattern between the start and the end of the input pattern”.

z High-level Wiring (Tangent Arc, Teardrop)

You can input a pattern while generating tangent arcs or teardrops. Tangent arcs and
fillets may be used in combination with other input shapes (Example: L-type wiring
and tangent arc).
Edit Æ Tangent arc Teardrops
Input Wire
The detailed parameters of both are set in the Parameters dialog box.
Tangent arc radius
Specify a value greater than

the half of the wiring width.
Teardrop shape Teardrop length ratio

Tangent Arc
Arc Radius Teardrop length

Radius × Length ratio = Teardrop length
Specify a value greater than 1.
1. Click (Input Wire) on the tool bar, and check the Tangent Arc and Teardrop
check boxes on the panel menu.
Click Click
2. Input wire.
You can input the shape while confirming it.

z High-level Wiring (Change Pattern Width or Padstack)

Default wiring width and padstacks to be used as vias are predefined using Design
Rule Editor, but you can change them while performing wiring.
Edit Æ
Input Wire
Change Pattern The wiring width can be changed to any value when you input wire or even in the
Width middle of wiring.
The wiring width is changed on the panel menu.

While the wiring width can be set
to any value, if wiring width limits
exist, it cannot be changed to
values that are not registered.
When checked, the specified wiring width is used for

any nets.
2. Specify an unconnected net and begin inputting wire.
P1
P2
3. Change the value in Width on the panel menu.
Changing the wiring width automatically checks the Fix Width check
box.
4. Continue wire input.
P3 The changed wiring width applies to subsequent segments.
！ Caution Because the changed wiring width will be applied to subsequent wiring, if you want to restore the default setting,
you need deselect the Fix Width check box.

Change You can change vias to have non-default settings in via input or when you enter them
Padstack during wiring.
2. Specify an unconnected net and begin inputting wire.
P1
3. Click Change Padstack on the panel menu, and select a padstack name.
Click
Click
Click
4. Input a via.
A via is inserted using a non-default padstack.
！ Caution The specified padstack name is valid until you select Data End.
Note In the Change Padstack List dialog box, padstacks that are defined in via
specification for design rules (Qualified Padstack/Available Padstack) are listed.

z High-level Wiring (Shield Wiring)

You can input a pattern while generating shield patterns all around.
A shield pattern with a specified signal is generated only on nets with a shield
pattern specified.
Edit Æ
Input Wire
Prepare for Before shield wiring, you need to preset the attribute indicating “Shield wiring is to
Shield Wiring be performed” and “Shield pattern net name” to the net.
These settings are design rules.
Edit Design Rule - Net object - Net
Specify whether to Shield net name to Gap between the The wiring width
perform shield be generated at target net and the stack to be applied
wiring. shield wiring shield pattern to the shield
(optional) pattern (optional)
Shielding Mode Set shield parameters, such as specification of whether to generate a shield during
Environment Æ wiring or the shield shape to be generated.
Shielding Mode
Generate shield patterns at wiring input
Generate shield patterns pushing aside obstructive objects
Delete the shield pattern if it is in the floating island status
Use arcs as shield pattern corners
Shield nets with shield generation specification
Set shield pattern shapes around the pin and via
Generate shield patterns longer than the specified length
Put Wire 1. Click (Input Wire) on the tool bar.

Generating Shield
2. Click Environment Æ Shielding Mode on the menu bar, and check the Execute check
box.
Click

3. Specify nets targeted for shield generation and input wiring.
The shield pattern shape is also displayed in real-time as a rubber

band.
Clicking Data End retracts the shield pattern to an object with the
same signal.
Connected to the area in the inside layer.
Generate shield 1. Click (Post-wiring Process) on the tool bar, click the Generate mode on the
later panel menu, and check the Shielding check box.
Click
Click
2. Click a net for which you want to generate a shield.
Click
A shield pattern is generated.
Reference For the post-wiring command, see “Executing Post-wiring Process” on page 3-123.
Reference For the gap value between the shield pattern and the target net that is referenced during the generation of
shield, see “*Application Rule” on page 3-29.
Note
Nets targeted for shield generation and shield patterns are internally correlated.
This shield pattern is correlated with

BA[2].
Therefore, if the pattern targeted for shield generation is edited, the corresponding
shield pattern is updated as well.
Likewise, if the pattern targeted for shield generation is deleted, the corresponding
shield pattern is deleted as well.

6. Starting the Placement/Wiring Tool
z Auto-routing (Pair Routing)

Edit Æ HSL Æ Pair routing makes it possible to wire unconnected nets consisting of a pair of lines on
a single active layer, or nets set as differential pairs.
Pair Routing
Prepare for pair Pair routing requires that “Perform pair routing” attribute has been enabled for the
routing net. These settings are defined in design rules.
Edit Design Rule - Net Objects - Net Group
Group the nets to include in Parallel Wiring: ON (Pair routing enabled)

the pair wiring.
Reference
For information on creating net groups, see “Adding Group and Group Groups, and Adding and Deleting
Members” on page 3-24.
Implement pair 1. Click Edit Æ HSL Æ Pair Routing on the menu bar, and click Reference to Rule on
routing the panel menu.
Click
Highlights unconnected nets for which parallel wiring is enabled.

2. Draw an area over the target unconnected nets.
P1
P2 Specifying nets causes them to

connect automatically.
！ Caution A wiring route is being searched for on the currently active layer. Set the grid to OFF for wiring.
Note You can specify any unconnected net and implement pair routing using the Pair
Routing command, even if the Parallel Wiring attribute is not enabled in the net
group setting of the design rule.
Click
P1
P2

z Auto-routing (Control Wire Length)

Edit Æ HSL Æ You can set the existing wires that violate the minimum wire length and equal length
Length Control wiring specifications to automatically correct.
Prepare for Length control requires that each attribute that is going to be referred to has been
length control enabled for the net. The settings are defined in design rules.
Edit Design Rule - Net objects
<Equal Length Wiring>

Net Group
Group the nets Equal Length Wiring: ON
Pinpair within a net
Create a pinpair Same Length: ON
Pinpair group
Group the pinpairs Equal Length Wiring: ON
<Min Total Length>

Net
Min Total Length

Pinpair
Create a pinpair Min Length

Control the wire 1. Click Edit Æ HSL Æ Length Control on the menu bar.
length
2. Select a mode and a detour shape in the panel menu.
Mode
Selects the wire length control mode to apply.
Wire length in package

Wire length control is done considering wire length in package
also.
Prior Segment
Create a detour route passing through the designated line.
Shape
Accordion Trombone
3. Specify the target pattern.

Accordion
P1
Trombone
P1
Note By specifying Report in the panel menu, you can display the Equal Length Wiring
and Minimum Wire Length information, current wiring pattern length, and check
whether there are any violations.
Click
Displays the maximum/minimum wire length and any

violation.
Displays the matching setting and any violation.

z Wiring Net
zEditing without Net
Environment Æ You can wire from an unconnected pin that has no unconnected nets.
Net-less Design Mode
1. Click Environment Æ Net-less Design Mode on the menu bar.
Click
3. Click an unconnected pin, and begin wire input.
-?- appears on the cursor.
P1
Since the connection destination has not been selected, rubber band
is not displayed.
P4
P3
P2
Connect it to a pin of the destination net.
Note You can also connect an unconnected pin to an existing net on the PC board.
！ Caution When you have connected unconnected pins, they are only temporarily assigned a net. If the wiring pattern is
deleted, the pins return to unconnected.
To assign an internal net to the pin, you must execute the Edit Net command.
Reference For the Net Edit command, refer to the next page.
Note If Net-less Design Mode is enabled, a warning dialog will appear.
Enabling Net-less Design Mode may cause unintentional net connection or wiring, and a warning
dialog box will be displayed when one of the following actions takes place.
- Switching the module to Placement/Wiring Tool

- Opening a file in Placement/Wiring Tool

zEditing Net
Utilities Æ You can edit a net in the following manner:
Edit Net
• Delete Net - Delete the selected nets from the PC board.
• Delete Subnet - Disconnect the net from the specified object.
• No Net Æ Net - Connect an object without a connection to any net on the PC board.
• Generate New Net - Generate a net that does not exist on the PC board.
1. Click Utilities Æ Edit Net on the menu bar.
2. Select an edit mode in the panel menu.
3. Specify objects according to the edit mode.

Delete a Net
P1
Click
Specify an unconnected net or pin. A series of nets are deleted.
Delete a Sub-net
Click
P1
Specify a pin or an existing wire. A net is removed from the object that is
connected with the specified object.
No Net Æ Net
P1
P2
Click a pin connected Click an unconnected pin A net is added and an unconnected net
to a net (P1) (P2) is generated.(Click P1 and P2 in any
order.)
Generate a New Net

$BN000001
Connect two unconnected pins. Specify the area. The signal name is
automatically assigned.
！ Caution The net name that is automatically assigned cannot be changed. If you want to change the net name, execute
Forward Annotation.
！ Caution Nets on the power plane layer cannot be deleted.

z Copying a Wiring Pattern

The Copy command allows you to do the following operations:
• Sequential pattern copy containing vias
Edit Æ Copy
• Interstitial copy of lines, areas, vias, and text
1. Click (Copy) on the tool bar.

Drag Specify the destination by dragging the object.
Relative Specify the destination by specifying the relative distance.
Pick two points on the canvas to

specify the distance.
Sets a numeric value to specify the
relative distance.
Specifies the number of copies.
Base Point Select the base point for copying.
Continuous Check this to copy continuously.
Rotate Specify rotation angle for the Rotate command that is

activated from the assist menu. Lock Via Angle can be
selected.
To Another Layer Specify the source and destination layers when

the copying is done to another layer.
(Non-conductive layers can also be selected.)
Select Via Enable copying of vias. (Selecting only vias is also possible.)
Fix Width Maintain the line width when copying the object. (When unchecked, the
default line width is applied.)
Fix Net Maintain the original data's net when copying the object.
Lock Hierarchy Connector Keep hierarchy connectors generated at divided design on the divided area.
2. Click the copy source pattern and then click the copy destination.
P5 P6 P7
Selecting the Continuous check box
P1 P2 P3P4 enables copying the same shape
continually.
Note Edit Æ Move command can be executed from the menu bar in the same manner
as the Copy command.

z Moving by Block
Edit Æ You can move the components and wiring patterns in a specified area in one
Move Block operation.
If you must move components after inputting the wiring pattern, you can use this
convenient function to move them while keeping the current connections.
1. Click Edit Æ Move Block on the menu bar.

Select how to specify an area.
Input Area
Area Of Group
Check this to move visible layer data only.
Check this to move vias also.
Rotate Specify rotation angle for the Rotate command that

is activated from the assist menu. Lock Via Angle
can be selected.
Set the reverse layer of each nonconductive layer.
Carry out Relative Reverse for all components and objects on

the board.
Cut Mode
Select the objects to cut when creating an area, and select the stretch line mode when moving
the lines.
Line and/or Area checked
Line and Area
Stretch Line Stretch Line Stretch Line
unchecked checked, No Jog checked, No Jog
unchecked unchecked checked
2. After specifying an input area, click Data End from the assist menu.
(Omit this operation if the group name has been specified.)
P1
Data End.
P2 The selected object is highlighted.
3. When the cursor turns into a cross cursor, specify the reference point to move, and
click the move destination.
P3 (Base Point for

P4
Moving)
The selected object is
displayed in the
temporary view.

z Locking a Wiring Pattern

Attributes Æ Wire A wiring pattern can be locked. The locked patterns are exempted from the Erase,
Lock Spread, and Move commands.
Lock a pattern 1. Click Attributes Æ Lock Wire on the menu bar.
2. Select Lock on the panel menu.
Click
3. Specify the wiring pattern to lock by specifying a point or an area.
The selected wires will be highlighted.
Red marks are displayed at the

Click construction points in locked
patterns.
(An area pattern displays this mark
at the center of the smallest square
enclosing the area.)
Note By clicking Apply All Area in the panel menu, you can select the entire PC board
according to the single/all-layer specification on the indicator.
Unlock a pattern 1. Click Attributes Æ Lock Wire on the menu bar.

Red marks are displayed at the construction points in locked patterns.
2. Select Unlock from the assist menu.
3. Specify the wiring pattern to unlock by specifying a point or an area, and click Apply
from the panel menu.
Click
Note When any locked wiring pattern is referenced, an indication “Fix” is displayed.
！ Caution With this command, padstack land status cannot be locked. For information on locking the land status, see
“Editing a Padstack” on page 3-127.

z Editing an Area
Input or edit an area.
Edit Æ If you end operation after confirming the shape when online DRC is activated, this
function searches for an obstacle that which does not maintain clearance from an
Input Area area. It then automatically cuts the area shape so that clearance can be maintained
(Conductive) from the obstacle (DRC error avoiding function).
Shape
Polygon Reptangle Circle
Specify outline width, painting width, and painting angle of the

area.
Subcommands
Straight line Auto-tangent Arc

Arc mode
Pick 3 Points on arc Center and two edges
Two-point diameter and

Center and radius
two end points
Specify lock angle of the area outline.

Commands
Parameters (Refer to the next page.)
Meshplane Parameters
Shape Parameters
Input an area with primitive shape by specifying parameters.
Change land status and input an area even if the padstack

contained in the area will generate a DCR error.
Commands
After starting the Edit Area command, specify the following necessary subcommands to edit the area.
Edit/Input Window Move Window Copy Window Delete Window Move
You can
specify the
target only
when moving.
Default (Input/Edit) Merge Area
Input Net Areas

Divide Area
Refer to non-conductive
layer lines and input an
area in batch.
Cut Out Figure
Convert Line To Area Mesh Clear Meshing Edit Meshing

Convert the shape of lines
already input into an area.
A button that appears pressed is a subcommand that will be executed in command execution.
Reference For details on the commands to set mesh parameter, shape parameter and creating mesh plane, refer to Online
help.

Specify whether to generate an area inside Specify whether to generate an Divide mode
when an obstacle is looping. island area. When selected, an Offset Overlap
When selected, an area is generated inside. islannd area is not generated.
Specify whether to perform DRC error

avoiding for a resist. If checked, the resists are Pitch Divide and overlap
also handled during DRC error avoiding width
Circular figure processing If the area contains lines on the

same net, these lines will be cut.
Circle Rectangle Octagon
Display error marks for places
where the input cannot be made to
the specified coordinates because of
the line width. (Clearing error
Rectangular line processing marks is also possible.)
Circle Rectangle Octagon Automatically set the division
count and input the area.
Division count Not specified
specified
Specify whether to regard the conductive data

without in-component net as an inhibited figure.
Specify the line input layer that

Specify whether to regard data without
will be a slit referenced in the Plur.
in-component net on the same layer as an
Net Insert command.
inhibited figure.
Not specified Specify incremental
Set non-conductive figures as the
pitch
target of cut-out. (Can be set to
always be the target during input).
Cut-out shapes are

reshaped if multiple
objects in a line are
present.
Specify whether to connect Merge Distance
No specification Thermal processing
a pin shape on the same
net with the positive area
as thermal lines in area
input and cut-out. You can
also specify the target.
Input Area 1. Click (Input Area) on the toolbar, and click on the pin that has the same net with
(Standard) the area you want to input.
P1
！ Caution An object with a net must be clicked before input.
2. Select the points on the outline sequentially, and click Data End in the assist menu.
P2 P3
Data End
P5 P4
For an object in the same net, an overlapping area is generated. For an object in a different
net, the generated area is set aside by the defined clearance (DRC error avoiding function).

Input Area 1. Click (Input Area) on the toolbar, and click Parameters in the panel menu.
(Thermal Process)
Check Thermal Process and Thermal Line Output, then
specify the width, the angle, and the count of thermal
lines.
2. Select an object (a pin or pattern) with the same net as the area.
P1
3. Select the points of the area outline sequentially.
P2 P3
Data End
P5
P4
P7 P6
The same net pins are connected

with area and line.
！ Caution Thermal process is applied only to pins. Wiring vias are not processed.
Edit Surface 1. Click (Input Area) on the tool bar.
2. Specify two points on the outline of the area to be edited.
P1
P2
A flag mark appears on the outline you specified.
3. Specify points on the new outline sequentially.

P4 P5
Data End
P3

Change Area 1. Click (Input Area) on the tool bar.

Attribute
2. Specify two points on the area outline.
P1
P2
3. Change the outline width, pitch, and angle in the panel menu, and click Data End.
Data End
Add Cutout 1. Click (Input Area) on the tool bar.

2. In the standard area input, specify the outline.
P1 P2
P4
P3
P6 P5
3. After specifying an outline, click the Add Cutout subcommand.

When you click the subcommand, the area indicating the
outline is confirmed and operation continues. Now, the
Click subcommand is ready to execute.
4. Specify the area outline again.

P1 P2
P4 P3 Data End
Note When executing a subcommand for an area already input, first click the subcommand
and then specify the target area or the window of the area.
Note If you specify the area outline while holding down the Shift key without specifying an
object on the same net, you can input an area that has no net.

z Reshaping Wiring
Edit Æ Reshape You can increase the area for wiring by deleting unnecessary corners and vias, or by
packing patterns.
Delete corner
You cannot delete a corner of a net having a power plane on the inside layer.
Packing
！ Caution The patterns are packed based on the clearance values and may not be on the grid.
Delete vias
1. Click Edit Æ Reshape on the menu bar.

Turn ON/OFF execution mode
Object in Selecting Area
Area Processes only segments in the specified area.
Series Processes a series of lines in the specified

area.
Push-aside Direction (Upper R./Lower L.)
2. Select the object to be processed.
Wiring is reshaped according to

the execution mode.

z Executing Post-wiring Process

You can perform the following processes on a pattern already wired:
Generate, delete, or change teardrop

Edit Æ Perform processing for via pins, SMD pins, or vias being
Post-wiring Process wired.
Generate, delete, or change 45-degree corners

Perform 45-degree processing for 90-degree corners.
Generate, delete, or change tangent arc

Generate tangent arcs at wiring pattern corners.
Change wiring width

Increase or decrease the pattern width in-batch.
Generate, delete, or change shield pattern

Generate or delete a shield pattern for a net for which
Shield Wiring has been set to ON in design rule.
Generate line/area reinforcing pattern

Generate a reinforcing pattern for an endpoint or T-junction
in a wiring pattern.
Generate vias at equal intervals

Generate vias at equal intervals on different conductive
layer areas of the same net.
Generate or reset cut land

Cut the padstack so that the foil spacing is held at the
position where a clearance error has occurred. In addition,
cut the resist figure along with it.
Merge vias
Merge duplicate vias that are on the same coordinate.
Remove antenna vias

Remove unnecessary interstice from interstitial vias that
generate antenna.
Note Merge vias and Remove antenna vias cannot be executed if the post-wiring process
will result in violation of [Design Rule] – [Via Spec. (Interstitial Via - Combination
Limit)].

Click (Post-wiring Process) on the tool bar.
Process mode (Generate, Delete, Change)
Target
Check the process to be executed. (The Wiring Width check
box can be checked only if the process mode is Generate.)
Padstack
Select how to process padstacks.
Parameters (See below.)
Reinforce Area Parameters (See the next page.)
Equal-Space Via Parameters (See the next page.)
Parameters Teardrop parameter Specify Tangent Arc Radius. (If

Tangent genaration with the specified
Line Arc radius is not possible, a tangent
arc with a smaller radius will be
generated.)
R × Length ratio = L Specify the cut length of

45-degree corner. (If the cut is
Connection target not possible, the cut length will
be half of the specified length.)
Throughhole Pin
Wiring Width
Change the wiring width.
SMD Pin Balance Process all the
specified wiring.
Increase Execute only when
increasing the
Via, Pad width.
Decrease Execute only when
decreasing the
width.
Max Pattern Width
Minimum Width Ratio Pattern Width
Generate teardrop if <wiring width>
× <width ratio> ≤ <teardrop width> . Min Pattern Width
Follows the design rules

Delete Corners
Delete corners in pads and generate
teardrop. Padstack (Cut Land) parameter
Noun to Cut (Through-hole Pin/SMD Pin/Via)
Area Spread Area Properties Specify the attributes of the area that
Spread area when generating a will be created after cutting.
teardrop. Merge Torelance
Specify the allowable range to be considered as the same
coordinate when merging vias. (If the space between vias
is equal to or less than this value, the vias will be
merged.)

Reinforce Area Target Area Properties

Throughhole Pin Specify the attributes of
Parameter
the area to be generated.
SMD Pin
Specify the attributes of
the generated area to be
Via, Pad the same as Wiring
Width.
T Junction Close Via Process

Process vias that are
closer than the specified
Close Via space. Of f set
Corner Type
Corner Process
Via Space
Arc 45 degrees
Radius Spread areas in a

Corner Length different net when
generating an area.
Equi-Space Via Generate Via

Parameters Specify the padstack to be generated as equal-space vias.
Via Space Specify the space between

the centers of generated
vias.
Power Plane
Specify the layer if one of the areas where vias are generated is
a power plane.
(Set “no value” to specify two areas.)
Origin Specify the origin from which vias are generated.
1. Click (Post-wiring Process) on the tool bar, and check the process to be
executed in the panel menu.
2. Specify the object to be processed.
Performed 45-degree processing

and generated fillet and
shielding pattern.
！ Caution About Land Cutting

z If the padstack cut does not allow maintaining of the minimum pad width defined as design rule, that padstack
cutting is not carried out.
z If the padstack reference point appears outside, an error occurs and cutting is not carried out.
z If the padstack containing the cut pad also contains resist data, the resist figure will also be cut.
z The resist figure is cut based on the values set in “Solder Resist Clearance” defined as design rule.
z Resist will not be cut unless the conductive layer is cut.

z Editing a Pad
Edit Æ Edit Pad You can perform the following editing to pads on the PC board and pads in the
padstack.
Take in Area
The area on the visible layer that
overlaps with the pad is snapped
(taken in) as a pad.
Change Pad
Changes the pad, excludes pads,
changes their diameter, etc.
Take in Area 1. Click Edit Æ Edit Pad on the menu bar.
Click
Click
2. Select a target pad and click Select Area in the panel menu. When the area to take in
is highlighted, click Apply.
Click
P1
Click
Change Pad 1. Click Edit Æ Edit Pad on the menu bar.
Click
Click
！ Caution You can execute Exclude Pad only for non-conductive layer pads.
！ Caution You can execute Change Pad Diam only for round pads.
2. After selecting a target pad, in the panel menu, specify a new padstack name for the
Original Pad, and click Apply.
Click
P1

z Editing a Padstack
You can edit the padstack on the PC board as follows:
Change Padstack
Edit Æ Replaces the padstack.
Edit Padstack
Rotate
Rotates the padstack. Change padstack
Change land status

Changes to any land status. (The pad is also
changed when the land status changes.)
Change thermal attributes Change land status

Change thermal attributes. (See below for thermal
attributes.)
Change From-to
Changes the padstack interstice.
Change From-to
Change Hole Diameter
Changes the hole diameter in the padstack.
Check Land Status

Checks the land status that are changed when
normalizing land status, .
Change hole diameter
Click (Edit Padstack) on the tool bar.
Select a target padstack name. (Keyboard input possible.)
Change Padstack Specify a new padstack name.

Refers to design rules.
Keeps the original setting for hole type only.
Rotate Specify the rotation angle.
Land Status
Select a process to change land status of the active layer
(Landless/Connect/Unconnect/Thermal/Clearance) and to normalize
(single/all).
Thermal Attributes:
When normalizing the land status, keep the land status for each
attribute as follows:
Prior Clearance: Changes to Clearance if the changed thermal is
on the same net.
Auto: Changes to Thermal/Clearance automatically considering
the connection to the same/different net.
All Layers Fixed: The current land status is maintained regardless
of the connection status.
FromTo: Specify FromTo after the change.
Change Hole Diam: Change the diameter (for round holes only).
Check Land Status

The land status that will be changed when normalizing land status can
Reset Hole be checked.
Reset the hole
of the padstack
whose diameter Select Padstack in Comp.:
was changed. Check it to select padstacks in components or component pins.

Change Pad 1. Click (Edit Padstack) on the tool bar.

2. Specify the padstack to be changed.
P1
Highlighted and a flag mark appears.
3. Specify a new padstack name on the panel menu and click Apply.
Click
Padstack is changed.
Change land 1. Click (Edit Padstack) on the tool bar.

status 2. Change to the active layer whose land status will be changed, and specify a
Change thermal padstack.
attributes
P1
Highlighted and a flag mark appears.
3. From the panel menu, change the land status to Clearance and click Apply; then
change the thermal attribute to Prior Clearance and click Apply.
Click
Click
Use the Query command to

review.
！ Caution The Edit Padstack command ignores Online DRC and makes changes on execution. When you execute the Edit
Padstack command, be sure to execute the Area DRC command in the end.
！ Caution Locked padstacks cannot be selected. If you want to change their land status, unlock them first. For details on
unlocking, refer to “Locking a Wiring Pattern” on Page 3 –117.

z Changing Reference Designator

You can change the reference designator given to components. There are seven
Attributes Æ
change modes available.
Change Ref-Des
Change 1 by 1 Change reference designator of individual components.
IC11 IC9 IC7 IC11 IC9 IC7
IC6 IC10 IC8 U1 IC10 IC8
Number Offset Provide offset reference numbers and re-assign them in one operation.
Change Header Text Re-assign only alphabetical parts of Reference designator in one operation.
IC11 IC9 IC7 U11 U9 U7
IC6 IC10 IC8 U6 U10 U8
Change Digit Count of No. Unify the number of digits for reference numbers and re-assign them in one
operation.
Batch Change Use the specified alphabetical letters and numbers and re-assign them in one
operation.
IC11 IC9 IC7 U106 U104 U102
IC6 IC10 IC8 U101 U105 U103
Change Sequence Re-assign numbers based on placement position separated by divide lines.
Change Location Separate with divide lines and re-assign using location addresses.
IC11 IC9 IC7 1B1 2B1 3B1
IC6 IC10 IC8 1A1 2A1 3A1

Change Header 1. Click Attributes Æ Change Ref-Des on the menu bar.

Text
2. From the panel menu, change to the Change Header Text mode, and click the
reference designator header text that you want to change.
Click
Change the symbols already input as well at the same time.
Display the change information in the Query Window.
Click
Components with the specified reference designator

header text are selected.
3. From the panel menu, specify the new reference designator header text, and click
Apply.
Click
The header text is changed to the specified

text, and the change information is displayed.
Change in Batch 1. Click Attributes Æ Change Ref-Des on the menu bar, and change to
Change in Batch mode in the panel menu.
Click

2. Specify the area of the components to be changed, and specify Data End in the assist
menu.
Data End
3. From the panel menu, specify the new reference designator header text and starting
number, and then click Apply.
Click
The specified header text is used,

and the numbers are re-assigned in
ascending order from the specified
starting number.
Also, the changed information is
displayed if View Change No. is on.
* Ref-Des and Original Ref-Des
A component has two internal reference designators. Even if the reference

designator has been changed, the reference designator assigned at PC board
generation is maintained until back annotation is executed in order to maintain
consistency with the schematic.
Reference Original reference

designator in designator
Board Designer

z Changing the Stock Code

Attributes Æ If you specify multiple stock codes for a component in advance in the part library, you
Change Stock Code can reselect a stock code from among them on the PC board.
Part Editor
You can register multiple

stock codes.
When the component is loaded on the PC

board, the default stock code is selected.
1. Click Attributes Æ Change Stock Code on the menu bar.
2. Specify a component.
3. From the panel menu, click on a new stock code and click Apply.
Click
Click
Make sure that the stock code has been

changed.

z Changing the Attributes of Components/Pins

The attributes for components/pins are initially set by System Designer or CDB. You
Attributes Æ
can temporarily change these attributes on the PC board.
Comp/Pin Browser
System Designer CDB

EMC Part:No
Placement Layer:A
value:0.1u elec_type:capa
Board Designer
EMC Part:No
Placement Layer:A
elec_type:capa
value:0.1u
1. Click Attributes Æ Comp/Pin Browser from the menu bar.
Circuit Information Change attributes for each component set in the schematic.
Component Attribute
Pin Attribute
Part Change attributes that have been set for parts on CDB.
Component Attribute
Pin Attribute

2. Select the component to be changed, enter the new attributes, and click OK.
Click
Click
Click
3. Click (Query Data) on the toolbar, and select the component whose attributes
have been changed.
Click
You can check that the set attribute is applied.
* Resource Files Referenced in Component/Pin Browser
Component/Pin Browser refers to the following resource files:
%ZUEROOT%\info\cpbrowser.rsc
%CR5_PROJECT_ROOT%\zue\info\cpbrowser.rsc
%HOME%\cr5000\ue\cpbrowser.rsc
####################################################################
##
## Component/Pin Browser Property Table
## [usage]
## “propName” type “propLabel” list listType editable
##
####################################################################
####################################################################
## COMP PROPERTY ITEMS
####################################################################
Comp*Property 6 {
“compComment” text “Comment” - - -
“decoupleBalance” float “Decoupling Balance” - - -
“decoupleDist” float “Decoupling Distance” - - -
“emcPart” text “EMC Part” (“YES” “NO”) fix -
“enetNonSeries” text “E-Net Non Series” (“YES” “NO”) fix -
“ICX_PART_MODEL” text “ICX_PART_MODEL” - - -
“placementGroup” text “Placement Group Name” - - -
“placementKind” text “Placement Kind” (“PASS” “SERIES”) - -
“powerDiss” float “Power Consumption(W)” - - -
Note The format is the same as cdb.rsc; by referencing files different from cdb.rsc, it is
possible to control between “reference only on the PC board” and “updatable on the
PC board.”

z Generating the Test Point

Edit Æ Testpoints Allocate the test point attribute to specified nets/components, and generate/delete
padstacks for test point.
Test point attribute allocation
Generate a new padstack for test

point
1. Click Edit Æ Testpoints on the menu bar.
Action
Select a processing mode such as test point allocation or
deletion.
Allocation mode
Select an object to which the test point attribute is allocated.
Select a side where a test point is generated.

A Side – Generate on A Side (only test points that can be generated
on Side A).
B Side – Generate on B Side (only test points that can be generated
on Side B).
Both (prior A Side) Attempt to generate on A Side first; if it is
impossible, generate on B Side.
Both (prior B Side) Attempt to generate on B Side first; if it is
impossible, generate on A Side.
Select – Specify how to select a target for test point generation.
Report Mode
Set the sorting method and name for the test point list and
Zoom in on generated test points.
Output a report Re-allocate reference designator to generated test points on the

(list of test points.) entire PC board.
Action
Auto Alloc./Auto Clear
Based on Allocation Mode and Parameters settings, generates/deletes all test points that can be
generated/deleted.
Mark TPs/Unmark TPs
Attach/detach only the test point attributes to/from existing objects (vias/pins).
Alloc.byHand
Allocate newly-generated pads/padstacks as test points.
Lock TPs/Unlock TPs
Lock/unlock test points already generated.
Inh. Comp./UnInh.Comp.
For the specified components, set/reset the attribute that inhibits generation of test points.
Set Probe/Delete Probe
For test points already generated, set/delete the probe provided in parameters.
Auto Extract
For test points already generated, set the probe defined in the resource file (tpprobe.rsc) in one
operation.

Parameter Padstacks to Generate TPs

TP Inhibition Layers...
Set the test point Set a padstack to be used as
inhibitation layers. a test point at test point
generation.
Set clearance between test
points and between a test Usable Existing Padstacks..
point and an inhibited area. Conv. Vias...
Replace with padstack for
Ref-Des Format
test point when allocating
Net name + 01 to an existing via.
Generate a reference
SMD Params...
designator in the format
When generating to SMD
"Header text + net name -
pins, set detailed
number of TPs”
coordinates for generation.
Serial No.
Min Pad Diameter and Min
Generate a reference
SolderResist
designator in the format
Set minimum land
“Header text + serial number
diameter that enables TP
in the TP generation order.
generation.
Probe Name
Select a probe to be set as Push aside the existing wiring
test point. (You can select at test point generation.
from among probe names Highlight the net requiring a
defined in tpprobe.rsc.) test point.
Assembly State Select component mounting status virtually at test point generation.
Assembled all comps Generate TPs assuming that placed components have been mounted.
Mounted SMD comps Generate TPs assuming that only placed SMD components have been mounted.
Bare board state Generate TPs assuming that no component has been placed.
Adding Test Point Add only test point attributes to existing pins/vias.
Attributes
1. Click Edit Æ Testpoints on the menu bar, and specify settings in the panel menu.
Action: Mark TPs
2. Click Patameters in the panel menu to specify settings for pins/vias to which
attributes can be allocated.
Set Min Pad Diameter and

Min SolderResist, and click
Apply the Min Sizes.
Click
A list of padstack that can be generated is

displayed.
！ Caution If you have not set “Usable Existing Padstacks”, test points cannot be generated. At generation, make sure you
have set “Usable Existing Padstacks” in advance.

3. On the PC board, click on the object to which you want to add test point attributes.
P1
P2
4. Click View Æ Testpoints on the menu bar.
Click
A mark is displayed to
indicate a test point.
Auto Generation Select a component to generate all possible test points.

of Test Points for 1. Click Edit Æ Testpoints on the menu bar, and specify settings in the panel menu.
Components
Action: Auto Alloc.
Select: Comp+peri
2. Click Parameters in the panel menu to specify settings for padstacks to generate TPs.
3. On the PC board, click on the component to which you want to add test point
attributes.
Click Test point attributes are

added to component pins.
Click
By fan-out, padstacks to
generate TPs are generated.
Note By checking Fan-out TPad of Allocation Mode, fan-out from SMD pins is enabled for
newly generated TPs.
！ Caution Because padstacks to generate TPs are not included in the training data, you need to prepare your data in order
to actually perform this function.

Listing Test Points 1. Click Edit Æ Testpoints on the menu bar, and click Do Report in the panel menu.
Click
The net names, the number of

generated test points, and
reference names are listed in the
Query window.
zLowlight Display
View Æ Lowlight Select a net or a component on the canvas and display the unselected figures in a
lowlight color (a color like gray which does not stand out).
1. Click View Æ Lowlight from the menu bar and set the dialogs.
Target
Specify the target figure. (Other figures are displayed in a
lowlight color.)
If it is selected when a component is selected, nets connected to

the component are selected at the same time.
If it is selected when a net is selected, nets in the same net group

are selected at the same time.
If it is selected when a net is selected, the shielding line and

shielding area are selected at the same time.
Normal color figures are displayed on top of lowlight color

figures.
Of the normal color figures, figures in invisible layers are also

displayed.
2. Click the component to be highlighted. The other objects will be displayed in a lowlight
color.
Click
Click the component Only the selected component and the
at the lower left. net connected to it will be highlighted.

z Executing Area DRC

Checks whether various rules are followed on the PC board designed with
Placement/Wiring Tool in detail.
Check Æ
Area DRC
Same Net Check Resist-Conductor Unconnected Thermal Check

Check
Antenna Via Check Missing Fillet Check Open Area Check
Panel menu
Perform checking.
Clear error marks.
Review details of errors.
DRC Setup dialog

box
Check:
Specify settings for checking or deleting
error marks.
Log:
Specify whether check log is maintained
or not.
Disp:
Specify whether error marks are
displayed or not.
Specify options for each check item.
Reference For details on the check items for Area DRC, refer to [Performing DRC by specifying an area] in the online help.

Executing Area
1. Click (Area DRC) from the toolbar, and click DRC Settings.
DRC
Select the Check and Disp cells for the items you
want to check.
2. Click Check All Area in the panel menu.
Checking is performed for components on the entire

PC board in one operation.
Click
Error marks are displayed depending on the

items you selected for the check.
Error mark
DRC [1:0.135 ]
Layer Error
Once an error mark is generated, it
remains until error mark clear is performed
or data is modified.

Reviewing Area 1. From the panel menu, click View Error Marks, and click an error mark on the PC
DRC Error board.
Information
Click
Click
Details about the error are displayed in the

Query window.
Note You can also view information for all errors on the PC board by clicking
Check All Area in the panel menu.

Clearing Area 1. From the panel menu, click Clear Error Marks, and click Check All Area to clear all
DRC Error Marks error marks.
Click
Click
Click
All error marks are cleared.
This may also be done by specifying area.
！ Caution Only error marks that are checked in the Check cells of the Settings dialog box are cleared.
If the Disp cells of the Settings dialog box are unchecked, or if Check Æ DRC/MRC Draw Error Mark is
unchecked, you might overlook error marks that exist internally. Too many error marks can cause a huge file
size. Display error marks and clear unnecessary ones.

z Approving Error Information

For the detected error information, you can specify actions (such as Need modification
or False error) or set approval attributes. By doing this, some errors will not be
displayed during subsequent check, and only newly detected errors can be viewed.
No correction needed (same

net error that cause no
Manufacturing problem)
Unprocessed False error
When checked again When checked again
The error is detected again to A false error is

prompt decision on whether not detected again
correction is necessary
Approving Error 1. From Error list dialogue, select Action, and enter comments if necessary.
Information
Types of actions
Unprocessed: An action has not been specified yet
Modified: Errors that are already modified. Specify this if you want to keep error
information after the error has been modified.
Approved: Errors that can be avoided during manufacturing process, and thus
require no modification of data.
False error: Errors that are marked as errors by the system but cause no problem in
the actual design.
Query: Errors for which an action cannot be determined.
Modification required: Significant errors that need modification.

Note You can also view approval information when you query about error marks.
Click
Controlling how to 1. From the Error list dialogue, click Display option... and turn off the error information
display error items that you do not wish to display after the approval.
information
Click
Click
Click
The corresponding items are not

displayed in the error list, and error
marks disappear from the PC
board.
！ Caution Turning off the display will not delete the error information itself.

z Executing General DRC

Check Æ You can check the clearance between figures on a non-conductive layer and between
DRC figures on conductive and non-conductive layers. The following layer combinations
can be checked.
NonConductive
Layers z Non-conductive layer – all conductive layers
z Non-conductive layer – single conductive layer
z Non-conductive layer – non-conductive layer
1. Click Check Æ DRC NonConductive Layers on the menu bar.
Resource File
Specify a file name to save settings to and load settings
from.
Select a mode.
Specify layers to be checked.
Figure
Specify which clearance between objects is referred
to at the time of setting "Rule unit" and "Rule
stack".
Clearance
Specify clearance to be referred to.
Starts Error List Dialogue.
2. Specify an area, or click Check All Area from the panel menu to perform checking.
Error marks are displayed.
You can view error information in Error list dialogue as you can in Area DRC.
！ Caution When error information is displayed in General DRC, approval settings for error information cannot be
specified.

7. Starting Artwork Tool
z Artwork Tool
You can use Artwork Tool to input and edit manufacturing data (such as resist data
and metal mask data) necessary in manufacturing except conductor data, and also
carry out various manufacturing checks.
Edit design rule peculiar to PC Design Rule Editor
Input PC board shape, etc. PC Board Shape Edit Tool
Artwork Tool enables you to input figures other than conductive patterns into the PC
board database designed by Board Designer.
Dimension lines
50 55
Alignment marks
ZUKEN Logo
Artwork Tool also provides various checking functions including the check for missing
resists or metal masks.
Errors
Note The Artwork Tool commands to input/edit figures are not explained in this textbook.
For details regarding the commands to input/edit artwork figures, refer to “Artwork
Command Reference”.

z Starting Artwork Tool

Using Artwork Tool, open [exchk/[Board]] (this is the data for artwork data input and
manufacturing check).
Lesson 1. Close the PC board file [exwir[Board]], used in the lesson for Placement/Wiring Tool,
and select the “exchk/[Board]” file set and click (Artwork).
Click Click

z Inputting a Component
Artwork Tool allows you to input logos, alignment marks and other non-electrical
Edit Æ components (printed components that have no pins, etc.).
Component Æ
Input
Printed components
ZUKEN
Type (Part/Footprint)
Select a type of component you want to input.
Specify a name for the component you input.
Ref-Des
Specify the header text and the number for reference designator.
Specify the placement side of the component you input.
Specify the placement angle of the component you input.
Specify the scale value of the component you input.
Lesson 1. To input non-electrical parts, click Utilities Æ Copy Component from CDB on the menu
bar.
Enter “PLOGO1” in the Filter text area, and

press the Enter key of the keyboard.
Click
From Name List, select “PLOGO1” and

Click click OK.
After reviewing the action information,

close the Query window.

Note Copying components from CDB
Non-electrical components such as printed components, etc. have no pins and do not
exist in the schematic. Therefore, you must copy them into the PC board database in
advance before you input.
CDB Library
PLOGO1
PRT PKG FTP
Input
PLOGO1
PC Board Database
Reference For details on copying components from CDB, refer to “Master Training <Engineering Change/Operation>“.
2. Click Edit Æ Component Æ Input from the menu bar.
Select “Part” for Type and select

“PLOGO1” from the list icon for Name.
In the upper section of the PC board, input

a component beside the mounting hole.
Input other components beside the

mounting holes at four corners of the PC
board.
You must change the angle for each component.

zErasing a Component
You can erase the existing non-electrical components from the PC board (there is no
Edit Æ specific command mode).
Component Æ
Specify Single Object
Delete
P1
Specify Area
zMoving a Component
Edit Æ You can move the existing non-electrical parts on the PC board. The Drag mode and
the Relative mode are available.
Component Æ
Move Drag mode
P1 P2
Relative mode
Relative Distance
P1 Specify
relative Apply
distance
Destination
Two Points
P3
Specify two Destination

Apply
points
P2
P1
Indicate distance by specifying
two points

zCopying a Component
You can copy the existing non-electrical components on the PC board. The Drag mode
Edit Æ and the Relative mode are available.
Component Æ Copying process is similar to that of the Move command, except that you need to
Copy specify the target reference designator.
Drag Mode
P2
P1
CAM2
CAM1
Relative Mode
Relative Distance
P1 Specify
Apply CAM1
CAM1
relative
distance
CAM2
Two Points
P3
Specify two CAM2

P1 Apply
points
P2
CAM1 CAM1 CAM1
Indicate distance by specifying

two points
Multiple copy (Relative Distance)
Specify relative
CAM3
distance
Apply
Specify number of
copies CAM2
P1
CAM1
CAM1
You can also use two points mode to
make multiple copies.

zChanging Component Attributes

Edit Æ You can change the attributes (such as reference designator and part name) of existing
Component Æ non-electrical components on the PC board.
Change Attribute
The following attributes can be changed:
• Ref-Des
• Part names
• A Side footprint name
• B Side footprint name
• Placement Side
• Absolute Angle
！ Caution You cannot change reference designator if you select multiple components by specifying an area.
Lesson 1. Let's change the reference designator of the component you entered. Click Edit Æ
Component Æ Change Attribute from the menu bar, and click the component.
P1
In the Change Component Attribute dialog box,

change the Ref-Des to “CAM1” and click OK.
Click
2. Review the reference designator of the component you have changed. Click
(Query Data) from the toolbar, and click that component.
P1
You can see that the Ref-Des

has been changed to “CAM1”.

z Inputting Component Symbols

Input component symbols.
Part Name User Defined
Input Æ C1005
Component Symbol 0.1uF
Reference Designator C1
The following types of component symbols are available for input.
• Part Name
• Reference Designator
• User Defined (text)
Symbol (User Defined/Part Name/Reference Designator)

Select the type of component symbol.
Method (Drag/2 Points/Above Component/Below Component/

Left Component/Right Component/
Center Component/Base Point)
Select a Reference Designator for inputting component

symbols.
Input text for a user defined symbol.
Set attributes for the input text.
Select Text Table... Input

Select text attributes from the table.
Char. Angle: Specify theExecute

angle of the text.
Cutoutpoint ofCharacter
Ref. Point: Specify the reference the text.
Font: Select a font.
Framed
Mirror in the X-axis direction. text
Rot. Angle
Specify the angle of rotation performed during dragging.
Style
Reverse Frame
Painting Width Specify painting width of the reverse (cutout

character) area.
Frame Offset For reverse/framed characters, specify a value
for offset between characters and the outline.
Gap (2 Points Parameters)

When two points are specified, set the distance from the first
reference point.
Scale (2 Points Parameters)

When two points are specified, set scaling in accord with the
second point.

Lesson 1. Let's input a component symbol. Click (Add Component Symbol) on the tool bar.
Specify as follows in the panel menu:
Symbol : Ref-Des
Method : Below Comp.
Select Comp. : R1
Char.Width : 1.27
Height : 1.27
Spacing : 0.1
Line Spacing : 0.0
Pen Width : 0.1
2. Select a component and enter its component symbol.
Change the setting of Active Layer to Symbol-A.
P1
Based on the settings made above, a component

symbol is input below the component.
Note
Layers on Which Component Symbols Can Be Input
You can input component symbols on the layers that are defined as follows in the
Technology Editor.
[Layer Type: Symbol Mark]
Layers with [Layer Type: Others]

and related to conductive layers.

z Creating a Hole Drawing

Utilities Æ This function enables you to generate text or pads at holes on the panel or the PC
board.
Hole Drawing
You can also output lists of items such as hole diameters or generated text or pad
names.
The layer to which text, pad, or the list is input changes to active at the hole drawing
execution.
Creates a list
Generates text
Lesson 1. Let's create a hole drawing.

Click Utilities Æ Hole Drawing on the menu bar.
The symbol generation for hole

drawing dialog box is displayed.
Parameters for characters to be generated Parameters for list output

Reference Point
Character height Specify the coordinates for upper-left
corner of the list to be generated.
Table Size
Pen Char. Char.
Width Spacing Width Specify the size of the list to be
generated.
Char. Angle Set Columns
Specify the angle of text to be generated. Specify the items that will be output to
the list to be generated.
Refer. Point
Specify the reference point of text to be
generated.
Font
Specify the font of text to be generated.
Offset
Specify the offset value of the text to be
generated at a hole.

2. Set conditions of the holes where the hole drawing is generated.

In the table, click Append Row from the
assist menu.
Click
From the Hole Type list box,

Click select Round Hole and click OK.
Click
In the Hole Dia cell, enter “0.6” using the

keyboard.
In the from-to cell, select Through from the

pull-down menu.
Click
In the Plating cell, select Plated from the

pull-down menu.
Click
In the Hole Type cell, select Undefined from

the pull-down menu.
Click
In the Drill Type cell, select Normal from the

pull-down menu.
Click
In the Gen. Text cell, enter “0.6” using the

keyboard.

3. Repeat Step 2 to specify the following conditions.
Hole Shape Hole Dia from-to Plating Hole Type Drill Type Gen. Text Symbol Type
Round 0.7 Through Plated Undefined Normal 0.7 String
Round 2.0 Through Unplated Undefined Normal 2.0 String
4. Specify parameters for the list.
Click Check Create List and specify settings as

follows:
Reference Point X: -5.0 Y: 100.0
Table Size Width: 50.0 Height: 25.0
Click
Click Set Columns.
Set Columns in List as follows:
HoleShape/Hole Dia./Gen. Text/Total
Click
Click Close.
5. Generate holes figures.
Change the Active Layer to Hole-Mark.
Click Start Gen.
Click
The Query Window opens, and the

Generate Symbol List is displayed.

6. Let's check the generated text and the list.
Reading all hole conditions

By clicking Read of whole data in the setup dialog box, all the hole information for the
PC board or panel is loaded at once and those holes can be used for hole drawing
generation. If you check Output holes on board only, hole information which does not
exist on the board is not output to the list.
To treat data at the same point (data at the same coordinates with the same shape or
a hole of the same size) as a single hole when outputting to a list or outputting
symbols, select Skip Same Point.
Click Click
Using a pad for a generated character

Note You can generate text using a pad instead of a generated string.
Specify the conditions of generated holes

as follows:
Gen. Text : Pad name to be

generated
Symbol Type : Pad
！ Caution The pads used for hole drawing must have been copied to PCB in advance.

z Executing the Symbol Mark Cut

Utilities Æ Cuts the data of symbol marks that have been created on a line or an area and that
Cut Symbol Mark overlap resist, holes, or component symbol data.
Specify the clearance value to be referred to.

Rule Pitch:
The setting of Design Rules - Artwork tab - Clearance
(Symbol Mark-Hole/Resist) is used.
Local Pitch:
The setting specified here locally is used.
Padstack mode
Specify the target of cutting and its pitch if the padstack
does not contain resist data.
Text Shape (Rectangle/True Shape)

Select the text recognition shape when the target of cutting
is text.
Correct Area in Pad

Specify the attributes of area data to be created after cutting
when tha target of cutting is a pad.
Copy the original data

Copy the original data to a different layer.
Lesson 1. Let's cut symbol marks. Click Utilities Æ Cut Symbol Mark on the menu bar.
On the panel menu, click Local Pitch and specify

Click “0.4” in Pitch.
2. Check In-component in the edit mode indicator
Checked: Also cuts in-component symbol marks.

Unchecked: Does not cut in-component symbol marks.
Click

3. Execute the Symbol Mark Cut
Click Check All on the panel menu.
Click
4. Check that cutting has actually been performed.
Symbol marks for pins and component

symbols have been cut.
Symbol marks for resist in vias have been

cut.
Note The Cut Symbol Mark command is useful in editing errors detected by Area MRC
(Symbol Mark Check).

z Inputting Photo Data

Input Æ On the PCB layers, you can input photo data generated in various formats.
Photo Data
Files
Specify the photo data you want to
input (the file extension is .phd).
Manufacturing Rule Library

Specify the library containing the
Photo Machine that defines the format
of the target photo data.
Machine Name
Specify the Photo Machine that defines
the format of the target photo data.
If checked, adds to a document layer.
Scale: Specify a scale value.
Reference For details on document layers, refer to “About Document Layers” on Page 3-163.
1. Click Input Æ Photo Data on the menu bar.
Specify photo data, machine name, and other

items in the setup dialog box, and click Execute.
Click
2. Input data.
P1
Use the cursor or specify coordinates.
Note Data is input onto the active layer.

z Inputting PCB/PNL Layer Data

Input Æ You can input data of other PC board layers or panel layers created by Board
Designer.
CR-5000 PCB,
PNL’s Layer
Files Destination
Specify the target PC Specify the layer to
board data or panel which data is input.
data you want to
input.
If checked, import
between document
Source
layers is enabled.
Specify the layer
(If unchecked,
from which data is
import between data
input.
layers is performed.)
Select Objects Action for Different Pad Version No.

Specify the target objects you want to Specify the action to be taken if the same pad
input. exists in the source and the destination.
Copy In-component Data as well Terminate as Error
Copy In-childboard Data as well Prioritize Src. Data
Copy Non-padstack Data Prioritize Dst. Data
Copy In-padstack Data
Reference For details on document layers, refer to “About Document Layers” on the next page.
1. Click Input Æ CR-5000 PCB, PNL’s Layer on the menu bar.
2. Input data.
Use the cursor or specify coordinates

to input data.

* About Document Layers
For each layer processed by Board Designer, there is a layer called “document layer”
that has one to one correspondence to the data layer.
PC board PC board shape layer

shape layer (Document layer)
Conductive Conductive Layer 1
Layer 1 (Document layer)
Symbol-A
Symbol-A
(Document layer)
A document layer contains data (such as dimension lines and comments) that is not
necessary in CAM output but is necessary in printer/plotter output.
70.0 50.0
80.0
50.0
120.0
120.0
[Plotter output]
Click Utilities Æ Documentation Toolbox on the menu bar to display icons that you
can use to execute input commands for document layers.
Input lines Generate offset figures
Input area Generate outline
Input text Input dimension Generate

lines magnified figures
Reference For detains on each command, refer to “Artwork Command Reference”.
Note To delete or edit figures, use the general commands.

z Viewing a Figure
In the Query Data command, you can specify Change Search Layer to display object
attributes of an active or visible layer in the Query window, or to measure the foil
spacing between two objects.
Attributes Æ
Query Data Depending on how you specify objects (Single Select or Frame Select), different
information is displayed. Single Select and Frame Select are explained separately
below.
Single Select When specifying a single object, attributes of the specified object and the shortest
distance from the previously displayed object are displayed.
Search Data
ON: Display the object attributes.
OFF: Display the coordinates of the specified point.
Detail
ON: Displays the construction point information for the
figure also.
OFF: Displays only the attributes of the figure.
Segment Unit
ON: Displays segments of the specified line.
OFF: Displays the whole specified line.
Ruler
ON: Displays the shortest distance from the previously
specified object.
OFF: Does not display the shortest distance.
Ruler Settings
Pitch: Specify the graduation pitch of the displayed ruler.
Spacing: When the ruler is displayed, generates an error message if the distance is equal to or less
than the specified spacing value.
Padstack Layer: Specify the layer to be searched.
Text Shape: Specify either rectangle or actual shape.
Example Single Select (1)

P2
Search Data: ON
P1
Detail: OFF
Segment Unit: OFF
Ruler: ON
Single Select (2)
Search Data: ON P1
Detail: OFF
Segment Unit: ON
Ruler: OFF

Frame Select When you specify a frame, the following information in the specified frame can be
referenced:
• Get Total Pen Width
• Pad List
• Padstack List
• Get Total Data Count
Select information to be displayed.
！ Caution When you specify area, Search Data should be checked.
Frame Select - Get Total Pen Width

Example
Frame Select - Pad List
Frame Select - Padstack List
Frame Select - Get Total Data Count
TEXT

Note Displaying Components and Objects in Components
Depending on whether you display components or objects in components, you need

to change the In-component mode in the edit-mode indicator.
ON: Each object in components is searched

OFF: Each component is searched.
Example Display Components
Search Data: ON
Detail: ON
Segment Unit: OFF
Ruler: ON
In-component: OFF
P1
Display in-Component Objects
Search Data: ON
Detail: OFF
Segment Unit: OFF
Ruler: ON
In-component: ON
P1
Note In-component mode is available in the Artwork Tool commands.

zExecuting Area MRC

Checks in detail that the various rules are observed on manufacturing data designed
Check Æ Area MRC with Artwork Tool.
C10
Missing resist check Resist - Resist check Symbol Marks - Clearance

check for each data
IC1
Missing symbol Annular ring check Hole clearance check

mark check
Panel Menu Perform check.
Clear error marks.
Review details of errors.
Settings Dialog
Check:
Settings for checking or clearing error
marks.
Log:
Settings of whether check log is
maintained or not.
Disp:
Settings of whether or not to display
error marks.
Specify options for each check item.
Reference For details on the check items for Area MRC, refer to [Performing MRC by specifying an area] in the online help.

* Layers That Can Be Checked in Area MRC Checking
For Resist Check, Symbol Mark Check, and Metal Mask Check, only data on layers
with proper layer attributes are checked.
Layers for symbol mark data
Layers for resist data
Layers for metal mask data
！ Caution Data on user-defined layers are not checked in the Area MRC check.
Note However, data on user-defined layers are checked for the “Square Line Angle” check.
In addition, Visible for each target layer must be checked when Area MRC is
performed.
Example If [Resist-A] is checked and [Resist-B] is unchecked:
When “Missing Resist” check is performed ...
Only errors for Resist-A layer are detected because

Visible for Resist-B layer is unchecked.

Executing Area 1. Click Check Æ Area MRC on the menu bar, and click MRC Settings....
MRC
Check on the Check and Disp cells

for the items you want to check.
2. Click Check All Area on the panel menu.
The check is performed for components on the

entire PC board in one operation.
Click
Error marks are displayed

depending on the items you
selected for the check.
Reviewing Area 1. From the panel menu, select View Error Marks, and click an error mark on the PC
MRC Error board.
Information
Click
Click
The Error list dialogue is displayed, and

you can review the details of the error.

Clearing Area 1. In the panel menu, select Clear Error Marks and click Check All Area.
MRC Error Marks
Click
Click
Click
All the error marks are cleared.
Lesson 1. Click Check Æ Area MRC on the menu bar, and click MRC Settings....
Specify checked items as follows:
Missing Resist : ON
Symbol Check : ON
Text-Copper : ON
Missing Metal Mask : ON
(other items : OFF)

2. In the panel menu, click Check and then click Check All Area.
Click
Click
Click
Error marks are displayed.
3. Confirm the error positions.

Click Error List in the Settings dialog
box.
Click
Click on a cell for the error type

Click “Missing Resist”.
The error position is zoomed in.

4. To correct the error positions, click (Input Pad) on the toolbar, and select a pad
from the panel menu.
Click Click the list icon.
Type of error: Missing Resist

How to Correct: On error
positions, input pads for resist.
Click
From the PadSelect dialog box,
select “C2.4” and click OK.
Click
5. Input pads on the resist layer.
Change the active layer to Resist-A.
P1 P2
Input a pad on each error position.
Next, change the active layer to

Resist-B, and input pads on the same
positions.

6. Zoom in error positions and correct all errors.
Click
Click on a cell of the type
“Text-Copper” in the error list.
The error position is zoomed in.
7. Click (Move) on the toolbar, and move the text that caused an error.
Type of error: Text-Copper

How to correct: Move the text that
caused an error to a position where
there is no overlapping with the
copper.
P1
Click the text.
Click on the destination and drag to

P2 that position.

8. Continue to correct error positions.
Click on a cell of the type “Missing

Click Metal Mask” in the error list.
Type of error: Missing Metal Mask

How to Correct: On error positions,
input pads for metal mask.
Click (Input Pad) on the toolbar, and

select the “R1.2-0.65” pad.
Change the active layer to

MetalMask-A.
Input a pad on the error position.
Input a pad on the second error

position also.

9. Continue to correct error positions.

Click on a cell of the type “Symbol Check
(Not exist Symbol)” in the error list.
Click
Type of error: Symbol Check (Not exist

Symbol)
How to correct: Generate component
symbols (reference designator) for
components that caused errors.
Change the active layer to

Symbol-A.
Click (Add Component Symbol) on

the toolbar, and click on an error
component.
P1
The component symbol follows the cursor

position.
Click on any appropriate position and

P2 input a component symbol.
10. Click Check Æ Area MRC on the menu bar, and perform the check again.
Make sure that no error exists, and exit

the command.

* About the Settings Dialog Box
The following are additional functions of the common Settings dialog box used in
Component DRC, Area DRC, and Area MRC.
Load/Save the Settings
You can save settings for the check (such as “Che.” on/off and “Disp” on/off) into a
file, and later load these settings onto another PC board.
Specify the file name into which

settings are saved.
Specify the file name to be loaded.
Reviewing the Check Log
You can review the log of information, such as the user who performed the check
and time.
Checked time, User, Number of errors
Cond. Layer No.
！ Caution Whether or not to maintain log can be set in the Settings dialog box.

Board Designer has PC Board Shape Edit Tool, Floor Planner, Placement/Wiring Tool,
and Artwork Tool; Board Producer has Panel Tool. Some functions can be used in all
of these tools.
The following pages introduce the functions marked with in the following list of
functions used in the tools.
Undo/Redo [CR-5000 Beginner's Training <PCB Design>]

Query Data Command (only for Floor Planner and Placement/Wiring Tool)
Ruler command
Layer Settings dialog
Edit Visible Layer Groups dialog
Change Order of Layer Name dialog
Edit Layer Comment dialog
Setting Display Environment
Setting Search Condition
Scale display
Display cursor coordinates [CR-5000 Beginner's Training <PCB Design>]
Coordinates [CR-5000 Beginner's Training <PCB Design>]
Base grid (page 3-72)
Commit File Function
Subcanvas
Move Origin
Highlight
Edit Design Rule
Copy or Update Component from CDB [Master Training <Engineering
change/operation>]
Reference The Query commands described in this textbook can be used only for Floor Planner and Placement/Wiring Tool.
For the Query commands provided for the other tools, refer to “Artwork Command Reference.”
Reference For the functions with , refer to the documentation that explains each function.
Reference For Panel Tool, refer to “Master Training <CAM>.”

Referring to Objects
You can query various information on specified objects, such as component
attributes and coordinates, total wiring length of the net, and the layers with
figures. You can also use this command to check the design state of a board,
Attributes such as connection ratio, placement status, and engineering changes.
Query
The Query Data command has the following two modes.
Object Info – A mode that queries the information of figure data by specifying a single
object or an area.
PCB Data – A mode that queries the design state of a board.
Object Info PCB Data
Object Info
Select a type of figure data to query from the Target items, and click the figure data.
Target figure data and displayed information vary depending on each item.
Target: Component
When you specify component(s) by clicking a single object (Specify Single Object) or enclosing an area
(Specify Area), the configuration of components, such as Part Name, Pin Count, Footprint name, and
User Property, is displayed.
(1) Use the Component Selector dialog in which the Reference designator is listed to select a component.
The component selected from the list is highlighted and its information is displayed.
(2) Check the Auto-zoom check box and select a component with the Component Selector dialog.
The specified component is zoomed in and its information is displayed. The specified component is
(1) zoomed in and its information is displayed. Select Fix Zoom Ratio to keep the zoom ratio fixed and
(2) adjust the display position. (This can also be used with pins and nets.)
(3) (3) Check the item(s) of Output Information (Part , Package , FootPrint, and/or
Comp. in Placement Group check boxes) and select a component. The component information as well
as the information of each library (Part, Package, FootPrint) that makes up that component are
displayed. In the case of a component in a placement group, the components that are either directly
or indirectly connected by a placement group name for component or pin properties will be selected.
For example, when you want to check the library information of the part used in IC1, you can check
it on board without referring to the master component library (CDB).
The content of the component library displayed here is that of the component library in PCB, not
the master component library (CDB) that was referred to when a new board was generated. This
makes it possible to use the displayed information to compare the contents of the master
component library with that of the component library in PCB.
Reference For the component selector, refer to “Beginner's Training <PCB Design>.”
Reference For the relationship between the master component library (CDB) and the component library in PCB, refer
to “Master Training <Engineering Change/Operation>.”

There are two ways to select components, Specify Single Object and Specify Area. Different information is
displayed for each specification
[When selecting with Single Select]
Ref-Des Part Name Gate ID Place Side Limit
Coordinates Pin Assign. Name Pin Count Permitted Angle
Placement Angle Package Name Comp. Group Name Component Height Information
Place Side Footprint Spec. Assignment Phase Comp. Drc Grop
Component Symbol Footprint Name Part Assignment Lock Comp. in Placement Group
Stock Code (Technology) Attribute User Property
Example
[When selecting with Frame Select]

Part Name Coordinates
Stock code Angle
Ref-Des Footprint Name
Original Ref-Des Package Name
Component Symbol Type (by package)
Pin Pin Assignment Name
Placement Side
Example
[When checking the Part check box in Output Information]

Part Name Solder Method Reason (when Admitted Part is “No”)
Pin Count Logical Polarity Create User
Version Use for Circuit Design Create Time
Type Use for Board Design Update User
Package Name Parts List Update Time
Pin Assignment Name Component level Attribute
Stock code Admitted Part
Example

[When checking the Package check box in Output Information]
Package Name Mount Type Create User

Type Footprint Spec. Create Time
Version Footprint Name Update User
Type Body Insertion Pitch Update Time
(When no value, it is not output.) (When no value, it is not output.) Attribute
Type Lead Line Insertion Height
(When no value, it is not output.) (When no value, it is not output.)
Example
[When checking the FootPrint check box in Output Information]

Footprint Name Mounter Name
Pin Count Mounting Point1
Version Mounting Point2
Use for Panel Design Create User
Mounting Symmetry Create Time
Private Footprint Update User
Technology Name Update Time
Attribute
Example
[If Comp. in Placement Group in Output Information is selected]

As well as component information for the single component specified, you can check the following information.
[Decoupling Capacitor] [ESD Part] [Osc] [Comp. In Placement Group (No Type)]
Ref-Des Ref-Des Group Name Group Name
Parent Pin Number Parent Pin Number Ref-Des Ref-Des
Parent GND Pin Parent GND Pin Pin Number Pin Number
Component type Component type Component type Component type
Placement State Placement State Placement State Placement State
Part Name Part Name Part Name Part Name
Placement Priority Ref-Des
Example of selecting a parent component common to a decoupling
capacitor, an ESD part and an osc.
Example

Target: Pin
When you click a component pin, the following pin information is displayed.
* Pin information can be specified only for a single object.
(1) … If Send To Design Rule Editor is selected, you can send pin names of specified data to Net
Objects dialog in Design Rule Editor. (This is also applied to when you select either Net,
Subnet, or Figure/Area.)
Coordinates Gate Pin Name (Gate ID)
Padstack Name Net Name
Ref-Des Attribute
(Original Ref-Des) Part Pin Name
(1) Part Name Part Pin Number
Pin Number (Pin Name) Part Pin Property
(Input/Output Attribute)
Example
From the Query Data command, you can send the selection state to the Design Rule Editor, and you
can also send the selection state in the Design Rule Editor to the Query Data command.
For details, refer to the online help for the Placement/Wiring Tool and the Design Rule Editor.
Target: Net
When you click a wiring pattern (line/area), an unconnected net, or a pin, the information about the net,
such as a net name, wiring status, and a net rule, is displayed.
* Net information can be specified only for a single object.
Net Name
Pattern Width of Individual Conductive Layers
(1) Wiring Status (Number of Pin Pairs, Unconnected Count, Total Wiring Length, and Via Count)
Wiring Rule (the net rules, such as Max/Min Total Length and Max Via Count)
User Property (the user property assigned to the net is displayed)
Example

Note To specify a net, aside from clicking on the canvas, you can select the net name from the list in
the Set Net Display Color dialog.
1. Select Attributes Set Net Display Color or click the Net icon on the edit-mode indicator.
2. Select a net name to query on the Set Net Display Color dialog.
3. Click Send on the assist menu (right-click).

The specified net name will be sent to the canvas and the net information is displayed.
If you have checked the Auto-zoom check box, the net will be zoomed in. This helps you search using
a net name.
Send to
Click the canvas
Click
Target: Subnet
When you click a wiring pattern (line/area) or a pin, the following net information of figures (subnets)
that connect to the specified figure on the same net is displayed.
* Subnet information can be specified only for a single object.
Net Name
Wiring Status (Number of Subnets in Same Net, Total Wiring Length, Via Count)
Wiring Rule (the net rules, such as Max/Min Total Length and Max Via Count)
Connected Component Pin
Example

Target: Figure/Area
The name of a figure, a layer name, a net name, and figure information are displayed. You can switch the
target figures by selecting the layer type in the Select mode. You can also measure the shortest distance
between the specified figures.
* Figure/Area information can be specified only for a single object.
(1) Set the layer type for which to search.

Searchable layers and figure data vary depending on the layer type you select.
Cond. Layer Conductive layer figure, padstack
(1)
Noncond. Layer Height limit area, component area, placement/wiring/via
(2)
(2)
(3) keep-out, text, component symbol, dimension line, resist,
silk, metal mask, user defined layer
(4) System Layer Padstack, component group, PC board outline, layout area
All Layers All figures are searched.
(2),(4) Shortest or 2 Points have the following meanings, respectively:

Shortest When you click two figures or areas on the same layer in succession, the shortest
distance between them is displayed. If one of them is a padstack, you can click
Ruler to set the search target layer
2 Points Displays the coordinates of any 2 points clicked and the distance between them. If a
pattern or figure exists at the clicked points, it is automatically retracted into the
center or construction point.
(3) When Details is checked, the Query window displays the construction point information of the
figure, the pad attributes of the padstack, etc.
[When you select lines]
Shortest Distance (when figures are specified in succession)

Net Name
Clearance
Layer Name
Line Type
Pen type
Line Length
Construction Point Information (when Details is checked)
Example
[When you select areas]

Net Name
Clearance
Layer Name
Outline Width
Painting Width
Painting Angle
Area

Example
[When you select padstacks]

Shortest Distance (when figures Hole Shape (Hole Diameter)
are specified in succession) Plating Attribute
Net Name Hole Kind
Clearance Drill Type
Padstack Name Ref-Des (when a padstack in the component is specified)
From – To (layers) Pin Number (when a padstack in the component is specified)
Coordinates Attribute (Via)
Absolute Angle (Land Status) when Details is checked
Via Type (Pad Information) when Details is checked.
Thermal Attribute
Example

[When you select areas (Height Limit Area, RulesByArea)]

Layer Name
Figure Height (Height Limit Area)
Layer (RulesByArea)
Design Rule Stack (RulesByArea)
Wiring Width Stack (RulesByArea)
Default Padstack (RulesByArea)
Area (RulesByArea)
Example
Target: Segment
When you click a wiring pattern or an area outline, the coordinates of the start and end points and the
width between them are displayed for each line segment.
* Segment information can be specified only for a single object.
(1) If you check the Details mode, the construction points and angles of the segments are displayed.
(2) If you check the Same Width check box, the total length of the series of segments that preserve the
(1)
(2) same width with the segment clicked is displayed.
Layer Name
Length
Construction Point Information (when Details is selected)
Example

Target: Block Area/Panel

The information of the block areas of a board that have been divided by divide design and/or the
information of panel data (Placement/Wiring Tool Utilities View Panel Data) is displayed.
* Block Area/Panel can be specified only for a single object.
File Path Name

Board ID (Panel display only)
Input Mode (Panel display only)
Coordinates
Absolute Angle
Example
Example
Target: Component Group

When you click a component group area created by Floor Planner, the placement side and the Reference
designator information of the components that belong to the group are displayed.
* Component Group information can be specified only for a single object.
Component Group Name

Placement Side
Reference designator that belongs to the component group
Construct points in the component group area
Example
Reference For a component group, refer to “Creating Groups” on page 3-47.

PCB Data
You check the design information of a PC board, such as connection ratio, placement
status, and design changes.
You can check the following PC board information.
PCB Data: Placement Status

The placement status, such as the total count of components placed on A and B sides, and the component
information, such as the total count of component pins, are displayed.
The following information is displayed for both A and B sides.
Placed Component (pin) Count

Outside Board Component (pin) Count
Unplaced Component (pin) Count
Total Component (pin) Count
PCB Data: Wiring Status

The wiring status, such as normal signal, number of nets divided into power and ground, connection
ratio, and unconnected count, etc. is displayed.
Number of Nets for Net (normal signal), Power, and Ground

Number of Pin Pairs for Net (normal signal), Power, and Ground
Unconnected Count for Net (normal signal), Power, and Ground
Connection Ratio for Net (normal signal), Power, and Ground
Total Wiring Length
Via Count
Note When you check the wiring status, the dialog “Recalculate unconnected nets?” is displayed in order to
calculate the unconnected count and the connection ratio. If you click Yes, all nets are recalculated. Click
Yes to confirm the correct wiring status.
Click
You can set the net construction in the Set Net Display Color dialog, but if you want to carry out net
reconstruction to all nets, you can execute a wiring status command. If you carry out net construction for
each net, you should set it in the Set Net Display Color dialog.
Reference For net construction, refer to “* Net construction” on page 3-68.

PCB Data: PCB Design Changes

This is displayed when the design changes related to nets have been made on a PC board.
PCB Data: Technology Info

The information of the technology used on a PC board is displayed.
You can check the details on a board without referring to the technology library.
PCB Data: Unplaced Component

The information of the unplaced components that are not placed on the canvas is displayed.
Ref-Des
Part Name
Footprint
Stock code
Pin Count
Placement Side
Reference For an unplaced component, refer to “Beginner's Training <PCB Design>.”

PCB Data: Decoupling Capacitor

The decoupling capacitor information that has been set by the Generate all command for decoupling
capacitors is displayed.
Ref-Des
Part Name
Footprint Name
Placement Side
Parent Component
Placement Priority
Reference For a decoupling capacitor, refer to “Master Training <Engineering Change/Operation>.”
PCB Data: Shield Wiring

A pattern to which a shield attribute has been specified in the design rule is temporarily displayed on the
canvas, and the conditions are displayed on the Query window.
Shield Target Net Name

Shield Net Name
PCB Data: Temporary Net

A temporary net and unconnected pins are temporarily displayed on the canvas, and their information is
displayed in the Query window.
In-component Data (the number of temporary net figures as in components)

Total Number of Unconnected Pins, their Ref-Des and Pin Number.
Net Name (when connected in the Net-less Design mode)
Rest (Total number of figures that have temporary nets other than in-component figures)

PCB Data: Added Component

The information of components that have been newly generated on the board, not of the components that
have been added due to the engineering change (Forward Annotation) from a schematic (System
Designer), is displayed.
Ref-Des
Part Name
Package Name
Footprint Name
Component Type
Placement Side
Reference For forward annotation, refer to “Master Training <Engineering Change/Operation>.”
PCB Data: Edited Component

The components with shapes that have been edited on board by land cut, by the padstack change of
component pins, or by silk cut, are displayed.
Ref-Des
Footprint Name
Placement Side
Type (whether in-component figures or component pins have been edited)
Layer Name (if the type is Padstack, displays “<Padstack>”)
Layer Type
PCB Data: Not Approved Part

The parts that have been set as not approved parts and the number of parts that refer to those parts are
displayed.
Part Name
Number of Referred Unadmission Parts
(the number of parts that refer to the not approved parts)
Reference For an approved part, refer to “Master Training <Component Library>.”
PCB Data: Temporary Components

Displays information on packages, footprints and similar objects created using simple component
registration, and components whose relationships (parts, packages or footprints) in the master library
have changed during Temporary Component Assignment.
Packages Footprints Components whose relationships have changed

PCB Data: Jumper

The information of jumpers is displayed.
Unplaced -- Unplaced jumpers

Outside Board -- Jumpers outside the board
Unconnected -- Jumpers with incomplete connection
Valid -- Valid jumpers that have a pattern beneath themselves
Needless -- Needless jumpers that do not have a pattern beneath themselves
Rest -- Jumpers other than the one with 2 pins
Reference For a jumper, refer to “Master Training <Engineering Change/Operation>.”
PCB Data: Component Library Info in PCB

You can select the component library information in the PC board database from the list to display it.
The objects you can query are Part, Package, Footprint, Padstack, and Pad.
Click
[When the type is Padstack]
Padstack Name Build up Via Attribute Create User Update Time

Penetration Attribute Use for Panel Design Create Time Attribute
Plating Attribute Version Update User
[When the type is Pad]
Pad Name Use for Panel Design Create Time Attribute

Flash Mode Version Update User
Pad Shape Create User Update Time
Reference For a part, package, and footprint, refer to “Target: Component” on page 3-178.

z Measuring Between Objects

You can measure the distance between objects with the Ruler command.
Specify whether to snap the
Utilities Æ Ruler specified point to the edge or Specify the point of a figure
center of a figure. from which measuring is done.
Measure the pitch between two (4)
specified points. (1) Edge – Distance from the
edge of a figure
Measure the minimum Center – Distance from the
distance between figures. (2) center of a figure
Measure the minimum
distance between Segments. (3) When the target object is
padstack, target layer for
measuring is selected.
When Snap To is “Edge,”

specify either “Rectangle” or
“True Shape” for the edge of
text or component symbol. (5)
Measures the distance with

the specified angle
(Horizontal/Vertical/None). (6)
Specify the ruler pitch which is

displayed on the editor
Specify the ruler height which

is displayed on the editor
Display each distance X

direction and Y direction
When the Ruler command is
finished, the ruler is removed.
[OFF] [ON]
(1) Distance between Two Points
P1
P1
P2
(2) Minimum Distance (Figures)
P1
P1
P2
P2

(3) Minimum Distance (Segments)
P1 P1
P2
P2
(4) Snap To
Edge
Center
(5) Text
Rectangle True Shape
(6) Lock Angle

Horizontal Vertical

z Setting the Display Status of Layer

View Æ In the Layer Settings dialog box, you can facilitate operation on the canvas by
Layer Settings defining the layers to display on the canvas and the colors, painting, and other
attributes of each layer.
Click View Æ Layer Settings on the menu bar.
Limit the layers to be displayed by the text in

Layer Name.
Example:
S* => Symbol-A
Symbol-B
Limit layers to be listed by layer type.
(1)
Target Canvas:
Specify a canvas to set layer attributes.
zMain Canvas
zSub-canvas 1
zSub-canvas 2
zSub-canvas 3
Setting Table: (1）

Set layers to display, their priority, and the color
attribute.
(2) When checked, layer comment information for

layer names is displayed.
Display Columns: (2)
Set each column in the table to display/hide.
(１) Setting Table
Visible Specify the layers to be displayed on the canvas.

In Board Designer, you input objects into several layers according to
their purposes. This setting defines whether to display these layers.
Display
Display
Color Select the color to be displayed on the canvas from the color box
icon. The color box icon starts up by clicking inside the frame.
Display Mode Specify the display status of figures on the canvas.

Simple Width Hatching Solid
In addition to the four modes above, tone patterns such as Cross1 are also
available.

Hatching Pitch Enter the painting angle and pitch with the keyboard
Hatching Angle when Display Mode is Hatching.
(2) Display Columns

By selecting this in the dialog, you can add the columns for the items below to the
items displayed in the setting table. You can also hide columns which are already
displayed with this setting.
Layer Type : Layer Type Column (conductive layer, symbol mark, etc.)
related to the layer name.
Object Settings: Columns of Object Settings for both the Data Layer and
the Document Layer
Display Document Layer: Following columns related to the document layer: Visible,
Color, Display Mode, Hatch Patch, Hatch Angle
Priority: Specify the layer display order on the canvas with a number from 0
to 1000.
Priority 1
Priority 5
The smallest number has the highest priority.
Reference For the document layer, refer to “About Document Layers” on page 3-163.
Reference For a layer comment, refer to “Editing Layer comment” on page 3-199.
Reference For a subcanvas, refer to “Using Subcanvas” on page 3-209.
Note If you check View Æ Reference Act Layer on the menu bar, the active layers specified
to be hidden in the Layer Settings dialog box are displayed.

z Setting a Visible Layer Group

View Æ You can form a group of frequently used visible layers and switch to them by
specifying a “visible layer group name” in one operation.
Edit Visible Layer
Groups Displaying unnecessary visible layers causes too many objects to be overlapped,
which reduces operating efficiency. However, if you switch the setting for each layer
one by one, it requires many operation steps, which also results in reducing operating
efficiency. We recommend creating visible layer groups.
1. Click View Æ Edit Visible Layer Groups on the menu bar.
Click
Click New.
2. In the New Visible Layer Group dialog box, specify a visible layer group name and
check the layers to be displayed.
Specify a visible layer group name.
Check layers that you want to make visible.
The ON/OFF status of the layer currently

displayed on the main canvas is used to set
values.
When switched to this visible layer group, the

specified active layer is displayed.

3. The created visible layer group name is listed in the Edit Visible Layer Groups dialog
box. You can change or delete the setting or change the list order as needed.
Change the setting of a visible layer group.
Delete a visible layer group.
Change the order to list visible layer groups.
4. You can select the defined visible layer group(s) from the pull-down menu in the
edit-mode indicator at lower right on the canvas or by launching the Visible Layer
Group dialog box.
Click
Click
Note After setting visible layer groups, you can save them in a parameter resource.
The saved parameter resource can also be used for other PC board files.
Reference For saving and loading a parameter resource, refer to “Loading and Outputting parameter.rsc” on page 3-35.

z Setting the Order of Layer Names

Attributes Æ You change the display order of layer names on a PC board.
Change Order of The order of layer names changed here will be reflected on the dialog boxes that
Layer Name display layer names, such as the Layer Settings dialog box and the selection list of
active layers.
Click Attributes Æ Change Order of Layer Name on the menu bar.
Sort the list of the displayed layer names in

ascending/descending order.
Display the nonconductive layers related to

conductive layers with Technology by grouping
them for each conductive layer.
List layer names by dividing for each layer type.
Move a selected layer name upward/downward.

* You can select multiple layer names at one
time.
Load a csv format file that describes the display

order of layer names.
* If a layer name that does not exist on the
board to be imported is described in the csv file,
the layer name will be ignored.
Output the display order of layer names into a

csv format file.
！ Caution Change Order of Layer Name cannot be applied to active layers in Placement/Wiring Tool, which lists only their
conductive layer numbers.
Reference For the Layer Settings dialog box, refer to “Setting the Display Status of Layer” on page 3-194.
Reference For an active layer, refer to “Beginner's Training <PCB Design>”.
Note The display order of layer names can also be set with Technology Editor.
If you generate PC board data using technology in which the display order of layer
names has been changed at the technology registration, the board data will be
created reflecting the changed contents.
In addition, for board data of newly generated board, you can update the display
order of layer names that has been changed with the technology by using PC Board
Technology/Component Update Tool.
Reference For how to set the display order of layer names with Technology Editor, refer to “Master Training <PCB Design
Library>.”
Reference For PC Board Technology/Component Update Tool, refer to “Master Training <Engineering
Change/Operation>.”

zEditing Layer Comment

Attributes Æ You can set and edit your comments for layer names of a board.
Edit Layer
Comment Click Attributes Æ Edit Layer Comment on the menu bar.
Limit layers to be listed by the layer name text.

Example: S* Æ Symbol-A
Symbol-B
When checked, the Layer Type column is

displayed.
You can set and edit the comment for layer names.
The layer comments set or edited can be referred as comment information of board
layer names in the Layer Settings dialog box and the active layer.
* The example in the left figure

shows the display status of the
active layers in Artwork Tool.
！ Caution The layer comments set or edited in the Edit Layer Comment dialog box cannot be displayed in the active layer
of Placement/Wiring Tool, where only conductive layer numbers are displayed.
* Displaying a layer comment as a layer name
Environment Æ You can display the layer comments edited in the Edit Layer Comment dialog box as
Option... layer names in the tools that display layer names, such as the Layer Settings
dialog box, the active layer, the Change Order of Layer Name dialog box, the Edit
Visible Layer Groups dialog box, etc.
Click Environment Æ Option... on the menu bar.
Select Show Comment as Layer Name for

Layer Name.
Only layer names are displayed.
Reference For the Option dialog box, refer to “Setting Display Environment” on the next page.

z Setting Display Parameters

Environment Æ You set parameters, such as color, font, and position, for various displays (Ref-Des, Pin
Option... Number, Component Origin, Block Area, Dimension, etc.) that support the design.
1. Click Environment Æ Option... on the menu bar.
2. Select View from the pull-down menu.
The Option dialog box has parameters for the following two
environments
View -- Parameters to set the display environment.

Search Objects -- Parameters to set the environment for searching
objects.
Reference For searching objects, refer to “Setting Search Condition” on page 3-204.
General .. Specify the parameters related to the display attributes in general.
Display Color/Group, Ref-Des (Side A/B), Mark

Set the display colors for component groups, Reference Designator, and DRC error marks.
(*1)
(*2)
Display Font/Ref-Des
Specify the font that is used when Ref-Des Display
is ON. (*This is also used in displaying pin numbers.)
Display Font/Group ID
Specify the font for group areas and group names
that are displayed when you design groups.
Display Font/Screen Info

Specify the font for cursor coordinates, estimated wire length,
scale, etc.
Display Font/Data Attr.

Specify the font for the component area and the height information of a
height limit area that is displayed when data attribute value is ON.
Precision
The number of decimal places for real numbers displayed
on the canvas or the Query window.
Reference For the display option of Via from-to, refer to “Displaying Via From-to” on page 4-11.
Reference For the display option of Block Area, refer to “Master Training <Engineering Change/Operation>.”
Reference For the display option of Layer Name, refer to “Displaying a layer comment as a layer name” on page 3-199.

(*1) Display Color

Select one of the basic 24 colors provided by the system or 128 custom colors.
Reference For custom color, refer to “Online Documentation”.
！ Caution Custom colors are available only for Windows. For UNIX, the display color is 24 colors.
(*2) Display Font

Select one of five fonts.
Component .. Specifies the display parameters related to components.
Ref-Des -- Specify the display parameters for Reference designator that are displayed when you selected
View Æ Ref-Des on the menu bar and set it to ON
Ref-Des/Target
All Comp. : Displays the Reference designator of all components.
Specified Comp. : Displays the Reference designator only of the specified components.
When you specify components to be displayed, launch a command with which
you can select components (ex. Move Component) and click Attributes Æ
Set Display Comp. Attr. on the menu bar.
Ref-Des/View Side
Both : Displays the Reference designator of components placed on both sides.
A Side : Displays the Reference designator of only the components placed on A side.
B Side : Displays the Reference designator of only the components placed on B side.
Following Comp. Search Layer :
Displays the Reference designator of components placed on the current active
layer. Example) When the active layer is A side or the top layer, the
Reference designator is displayed only for the components placed on A side.
Ref-Des/Display Attributes
Displays the Reference designator of a component and the following attributes of the component
behind Reference designator:
(O).. Off-Board Component (S).. Placement Side Lock Specified Component
(J).. Jumper Component (A).. Angle Lock Specified Component
(B).. Decoupling Capacitor Component (R).. Reference Designator Lock Component
(L).. Position Lock Specified Component (F).. Group Net Component

Component Origin .. Specifies the display parameters for component origins that are displayed when you
selected View Æ Component Origin on the menu bar and set it to ON.
Component Origin/Target
All Comp. : Displays the component origins of all components.
Specified Comp. : Displays the component origins only of the specified components.
you can select components and click Attributes Æ Set Display Comp. Attr.
on the menu bar.
Component Origin/View Side

Both : Displays the component origins of components placed on both sides.
A Side : Displays the component origins of only the components placed on A side.
B Side : Displays the component origins of only the components placed on B side.
Displays the component origins that are placed on the current active layer.
Example) When the active layer is A side or the top layer, the component
origin is displayed only for the components placed on A side.
Pin No. .. Specifies the display parameters for Pin No. that are displayed when you selected View Æ Pin No.
on the menu bar and set it to ON.
Pin No./Target
All Comp. : Displays the pin numbers of all components.
Specified Comp. : Displays the pin numbers only of the specified components.
you can select components (ex. Move Component) and click Attributes Æ
Set Display Comp. Attr. on the menu bar.
Pin No./View Layer

All Layers : Displays pin numbers of all pins regardless of visible or active layers.
Visible Layer : Displays pin numbers of the components that have pin figures on the layer
selected as a visible layer.
Active Layer : Displays pin numbers of the components that have pin figures on the specified
active layer.
* When the pin figures are padstack, the conductive layers between FromTo are also the target
layers to be displayed.
Comp. Group .. Specifies the shape parameters for component group areas that are displayed when you
selected View Æ Component Group on the menu bar and set it to ON.
Component Group/Shape
Group Shape Group Shape and Guide
Component Group/View Side

Both : Displays the common component group area for both A and B sides.
A Side : Displays the component group area for A side.
B Side : Displays the component group area for B side.
Displays the component group area that is placed on the current active layer.
Example) When the active layer is A side or the top layer, the component group
area for A side is displayed.
Reference
For the design using a component group area, refer to “Creating Groups” on page 3-47.

Component Dragging ... Sets what is displayed when components are dragged using command such as the
Move Component command or the Align Components command.
Component Dragging/Comp. Shapes

Complete Simple 1 Simple 2
Displays the Displays Displays the conductive layer shape of the component
shape of footprints and placement side layer and the related nonconductive layer
components as the outline of shape (* Whether a nonconductive layer is displayed or not
they are. terminals. depends on ON/OFF of the visible layer.) and hole shapes.
Component Dragging/ Power/GND Net

Hide : Does not display Power/GND nets
Decoupling Capacitor/ESD Only :Only displays Power/GND nets connected to decoupling capacitors
or ESDs
Display All : Displays Power/GND nets for all components
Component Dragging/ Power/GND Mark

If this is selected, "P" and "G" are displayed for Power and GND pins
Component Dragging/ Power/GND Net

If this is selected, "T" marks are displayed for nets with topology rules
Dimension .. Specifies the display parameters related to dimensions.
Each item has the following meanings.

Arrow Length
Text Frame
Adds a frame to text.

Bullet
Arrow Angle
Diameter of the bullet
Dimension Line Offset
Clipping
Cuts the part of a dimension
that overlaps the text Witness Line Offset
Frame Offset
Reference For more information on a dimension, refer to “Artwork Command Reference”.

z Setting Search Condition

You can control how to search objects including specifying area selection, searching
the same point, etc. for the commands that work with objects, such as move, delete,
query, etc.
Environment Æ 1. Click Environment Æ Option... on the menu bar.

Option...
2. Select Search Objects from the pull-down menu.
The Option dialog box has parameters for the following two
environments.
View .. Parameters to set the display environment.

Search Objects .. Parameters to set the environment for
searching objects.
Reference For View, refer to “Setting Display Parameters” on page 3-215.
Select Sets parameters for the Frame Select mode.

Frame Select has two methods to specify: Rectangle and Polygon.
Rectangle Polygon
Hold Click
P1 P2
P1
P3
P4
P6
Release
P2 P5
・ Press and hold the mouse button at the place ・ Click Frame Select in the assist menu.
without objects and drag the mouse.
・ Specify the polygon area by clicking.
・ After you enclosed the object with a rectangle,
release the mouse button. When you release ・ After you enclosed the object, click Data End
the button, the selection of the object is in the assist menu to complete the selection
completed. of the object.
Click free space to: Specify the operation when a place without objects is clicked during execution of a
command to specify objects.
Cancel selected objects

No command is executed because there is no object. Operation continues and the mode is changed
to Specify Single Object.
Indicate start point of frame

The point clicked becomes the start point for the polygon area selection mode.

Frame contains no object: Specify the operation to perform if there is no object when a frame is completed with
the polygon area selection mode.
Complete
Completes with no object selected and the polygon area selection mode ends.
Continue
Does not complete the frame and the polygon area selection mode continues. You can return to the
point you clicked immediately before completing and continue to recreate the frame with the Data
Cancel command.
Snap Point Search Conditions .. Controls the object for search target when a snap point
is used.
No Object Selected .. Sets whether the specified coordinates should be handled as an input point or an error
when there was no candidate for snap point.
Prohibit Construct Point Input (ON) Cancels the specified point as an error.
Prohibit Construct Point Input (OFF) Issues a warning and accepts the specified point.
Construct Point of Arc: Specify whether the snap point search of the figures with an arc searches for the
start/end point of an arc or the center point of an arc.
Start/End Point
When you click near the start/end point of an arc, that point is picked as a snap point. You can
also specify the arc center point as a snap point by clicking near the arc center point.
Click
Center
When you click a point on an arc, the arc center point is picked as a snap point.
Click
Target Layer: Sets the target layer for snap point search.
Visible Layer
The figures on the layer selected as a visible layer are the target for snap point search.
Designated Layer
The figures on the layer specified in Select Layer are the target for snap point search.
Search Target: Specify figures for the search target in Select Object.
Select Object
Specify the figure for the snap point search target from All Nouns, Pad, Line, Area, Constraints
Area, Hole, and Padstack.
！ Caution * The setting of Select Layer and Select Object is valid only for the artwork type commands.

Specify Trap Trap refers to an area where an object is recognized by clicking or by

enclosing. Specify Trap is for specifying the recognized area.
！ Caution * Specify Trap is valid only for the artwork type commands
Individual Pick .. Specify the area recognized when a figure is clicked in the Individual Pick mode.
In the Individual Pick mode, the cursor becomes a rectangle (a search trap), and the figure
that overlaps with this rectangle is recognized. The search trap can be resized using “<” or
“>” keys on the keyboard.
Individual Pick/Line
Point Recognized when a construction point is clicked.
Series Recognized when a line is clicked.
Individual Pick/Area
Point Recognized when a construction point on an area outline is clicked.
Series Recognized when an area outline is clicked.
Whole Recognized when an area is clicked.
Individual Pick/Constrains Area

Point Recognized when a construction point on a constrains area outline is clicked.
Series Recognized when a constrains area outline is clicked.
* Constrains area refers to a component area, a height limit area, etc.
Area Pick .. Specify the area recognized when a figure is enclosed in the Area Select mode.
Area Pick/All Nouns

Point Recognizes figures whose construction points are in the specified area.
Series Recognizes figures if a part of them is in the specified area.
Whole Recognizes figures whose entire shapes are in the specified area.

z Using Search Filter

You can specify the target of each command execution for each noun using a search
filter.
You can set the search filter in every panel menu that works with figures (Delete,
Move, Query, etc.).
Example 1. Click Edit Æ Delete on the menu bar.
Set the panel menu as follows:
Area: Whole
Line: Whole
2. Click the Search Filter tab on the panel menu.
Check Single, Frame, and Condition only for

the Line item and uncheck all for the other
figure items.
Click Click Frame Search Condition.
Add conditions for the target line to refine the

search. Check Line Width, enter “0.2” – “0.2”,
and click OK.
3. Enclose a whole PC board in the Frame Select mode.
Line Width 0.2
Area Area
Line Width 0.4 Line Width 0.4
Only the lines of line width 0.2 are deleted.

z Displaying Scale or Cursor Coordinates

View Æ Scale You can display the following items on the canvas:
View Æ
Cursor Coordinates
Cursor Coordinates
Display coordinates for the
current cursor position.
Scale Display
Displays the origin mark and
coordinate scale.
Click View Æ Scale on the menu bar.
Click View Æ Cursor Coordinates on the menu bar.
Note Initially, these are all set to ON.

！ Caution The scale and cursor coordinates are not actual objects. They are only displayed to assist you in this operation.
z Using Security Copy Function

Floor Planner and Placement/Wiring Tool save the current status in the working file
Environment Æ
at every Data End (automatic commitment function).
Auto Security Copy
If the tool has terminated abnormally, you can recover the status at last Data End
execution by this function.
Click Environment Æ Auto Security Copy and set it to ON (default) on the menu bar.
However, response is diminished when the file is overwritten at every Data End.
File Æ Therefore, the operator can specify the time to save the current status, without
Security Copy saving at every Data End.
You can save the current status by clicking File Æ Security Copy on the menu bar.
If the Auto security copy function is not activated, you should save the current status
at the appropriate time.
！ Caution PC Board Shape Edit Tool and Artwork Tool do not have the security copy function.
The current status is always saved in the working file at every Data End.

z Using Subcanvas
View Æ Board Designer can provide three subcanvases besides the canvas.
Subcanvas The subcanvases allow you to mirror the entire PC board, to apply layer settings
different from that on the canvas, or to design on the subcanvas.
z Moving Origin
Environment Æ For PC board data or panel design data, you can move the origin as needed.
Move Origin
1. Click Environment Æ Move Origin on the menu bar, and enter the destination of the
origin directly on the canvas or enter the distance to move and click Apply on the panel
menu.
Click
The destination of the origin is temporarily displayed.
2. When you confirm the destination, click Move Origin.
Click Click
The origin is moved

to the destination.
！ Caution Once the origin is moved, this operation cannot be undone with the Undo function.

z Setting Highlight
You can display specified objects in specified colors.
Utilities Æ
The display color that you set here takes priority over the display colors specified in
Highlight the Layer Settings or Set Net Display Color dialog box.
！ Caution Highlight is not supported in Placement/Wiring Tool and Floor Planner.
！ Caution Objects are highlighted only while you are editing a file. Switching modules or reopening the file clears the
highlight setting.
！ Caution Editing a highlighted figure clears the highlight setting of the figure.
Highlighting is convenient:
z To change the display color of a particular object regardless of the colors that
have been specified for each layer.
z To highlight an object that meets certain conditions.
1. Click Utilities Æ Highlight on the menu bar.
Click
2. Click Entry/Delete on the panel menu to launch the Highlight dialog box.
(1) (2) (3) (4)
(1) Table Name ... Set the table name of a highlight color group.
You can register up to 5 table names.
(2) Display Color ... Set the highlight display color for the table name.
Double-click the cell and select a color from the color box icon.
(3) Hatching Pitch ... Set the hatching pitch for highlight display when the object
display mode is “hatching with width”.
(4) Hatching Angle ... Set the hatching angle for highlight display when the object
display mode is “hatching with width”.

3. Define the display color of the figure that you want to highlight in the setting table.
4. Select the table name that defines the highlight color that you want to use from Table,
and select a figure.
Click
Select Single Object
Click
Select By Frame
5. Click the highlighted figure to clear highlight.
Click
Clear
Note Reselecting the highlighted figure clears highlight.

If you want to clear all of the highlighted figures, Click Data Cancel on the assist
menu or click an empty place on the canvas.

z Changing Design Rules

Previously, you might have defined the design rules for each PC board before starting
Module Æ
its design. You can change the design rules while designing without closing the file.
Edit Design Rules
1. Click Module Æ Edit Design Rules on the menu bar.
Click
2. Board Design Rule Editor is started.
Change design rules.
3. Click File Æ Exit on the menu bar to end Design Rule Editor.
Note The changes you make here are reflected to the PC board database in real-time when
Board Design Rule Editor is ended.
Let's save the file here.
Lesson 1. Click File Æ Save on the menu bar.
Click
The Save command writes the current status in the database file without closing the
file. Therefore, you can continue the operation.

9. Using the Assist Menu
By displaying the assist menu during the command execution, you can use some
convenient functions such as Snap point and Next Snap Point (collectively called
Adjective) together with the command being executed. Adjectives displayed on the
assist menu vary according to the type of command and the processing status.
The common adjectives used in commands will be introduced in the following
sections.
Repeat
Next
Another
Snap Point
Next Snap Point
Coordinates
X/Y-Coordinates
Relative Point
Division Point
Using Repeat
Repeat is an adjective used to input multiple objects at a time that are the same as
the one previously input.
Clicking Repeat displays a dialog box, from which you can specify the count and
pitch.
OK Execute + Close dialog box

Apply Execute + Continue dialog box
Cancel Cancel dialog box
An operation example is given below.
Repeat
Input five pads, each offset by X = 2 and Y = 2.

Using Next
When an unexpected object has been recognized by a command such as (Query),
you can use an adjective called Next to cancel the currently recognized object and
search for the next adjacent object.
Next
Search
Search
Next
Delete a pad.
If you have accidentally searched for a line with P1, specify Next to search for the pad.
When the next candidate was not found after repeating Next, the guide message “Returned to the first
selection.” appears and the first candidate object is selected.
Using Another
Another is an adjective used to display the next candidate in the temporary display
when multiple results are obtained by a command such as (Input Arc) command
in “Arc Tangent ” mode.

Another
Generate an offset line in the direction opposite to the one specified.
Target Whole
Gap 0.5
Gen. Cnt. 2
When you specify P1 and P2, offset lines are temporarily displayed downward in the traveling direction and
Another causes them to be generated upward.

Using Snap Point

Snap Point is an adjective used to search for a construction point of an object already
input and to input an object to the same construction point.
Snap Point = Construction point

Snap Point
Input a line to the same construction points as the PC board shape.
！ Caution Snap Point can be executed only once. Specify Snap Point each time it is required.
If you check Snap Point in the edit-mode indicator, Snap Point will always be activated.
！ Caution You can search for objects even when they are not on the active layer.
Reference For detailed setting when using snap points, refer to “Setting Search Condition” on page 3-204.
Using Next Snap Point

Next Snap Point is an adjective used to search for the next candidate when an
unexpected snap point has been searched for from multiple objects by Snap Point.
Snap Point Next Snap Point
An operation example is given below

Next Snap Point
Input a line to the same construction point as the layout area.
Next Snap
Snap Point P1 Next Snap Point
Point
Snap Point P2 Snap Point P3
Snap Point P4 Snap Point P5
Snap Point P6
Command End
If a construction point on a PC board shape with P1 is searched accidentally, Next Snap Point allows you to
search for a construction point in the layout area.

Using Input Coordinates

Input Coordinates is an adjective used to specify an object position by inputting the
absolute coordinates or the relative coordinates based on the previous coordinates,
instead of moving the cursor and clicking. Clicking Coordinates displays the Input
Coordinates dialog box, from which you can select the Value-Type (Absolute or
Relative) and set the coordinates.
Coordinates

Input Coordinates
Coordinates Absolute Apply

X=1
Y=1
Relative Apply Relative

X=5 X=0
Y=0 Y=4
OK Command End
Inputting X/Y Coordinates

For typical coordinate input, the coordinates (x, y) specified on the canvas are used.
In this case, the X- and Y-coordinates can be specified individually.
They are not specified by numeric input, but from the canvas. The cursor is fixed at a
specified X-axis position and determines the Y-coordinate on the X-axis.
X-/Y-coordinate input

Using Relative Point

Relative Point is an adjective used to input an object by specifying the relative
coordinates based on the first point.
Clicking Relative Point displays the Relative Point dialog box, from which you can set
the reference coordinates used to input relative coordinates.
Base point OK
Relative Point
P1
Relative Point
From the tool bar

Relative Point P1
P2
Relative
X=5 OK
P1 X=+5 Y=+4 Y=4
(1, 1)
P2 Command End
Using Division Point

Division Point is an adjective used to divide the distance between the two specified
points by the specified division count. Input the resulted division point that has the
specified number as the coordinates.
Clicking Division Point displays the Division Point dialog box, from which you can set
the point and division count.
Division Point
Point = Point selected from division

points (points beginning at P1)

Division Point
Input a line between two lines using Division Point.
From the tool bar Division Point Point=1 P1,P2 OK
Division point=3
(Polyline) Division Point Point=1 P3,P4 OK

Division point=3
Division Point Point=1 P5,P6 OK

Division point=3
Command End

1. Inner Layer Design
As layers on the PC board increase, you will be required to design the inside layers.
The attributes to be added to layers vary according to the purposes of the inside layers.
Positive layer
Input patterns in the same

way as outside layers.
Power plane layer

Give a signal to the entire
layer and generate
thermal/clearance lands.
Mixed layer
Divide a layer into multiple

islands and give a signal to
each island.
Positive and negative layers

are used in combination.
Power plane and mixed layers require special specifications. We will describe the
procedures to design the layers from the next page.
Chapter 4 Designing Multi-layer Board 4-1

z Designing a Power Plane Layer

A layer with one net on its power plane is referred to as a power plane layer.
A power plane layer usually assigns power and ground signals.
Figures generated in a power plane layer are thermal or clearance lands only.
Register CDB Library Register padstack
Register in Technology Library Define power plane layer
Register in Design Rule Library
Generate PC Board Database Specify signal name
Input PC Board Shape, etc.
Place Components
Automatically generate
thermal/clearance lands
Wiring
Output
4-2 Chapter 4 Designing Multi-layer Board

1. Register When registering a padstack, specify thermal/clearance land pad name for the
padstack conductive layer.
2. Define full Use Edit Technology to set “Power plane” as the Layer-Type for the conductive layer.
surface
3. Specify When executing Board Generation Tool, specify a signal name for the power plane
signal name layer.
4. Generate When you open a file with Placement/Wiring Tool, objects with the same signals as the
thermal/ Power Plane are automatically converted to thermal land, and the others are
clearance converted to clearance land.
lands Floor Planner Placement/Wiring Tool
(Normalize
land status)
！ Caution Normalizing land status is supported only in Placement/Wiring Tool.

z Designing a Mixed Layer

You may assign multiple signals to one layer (dividing into islands) and input negative
figures such as clearance or thermal and positive figures such as patterns and areas to
the same layer.
Designed image Manufacturing image
You may input positive figures and negative figures to a mixed layer
(thermal/clearance).
Register CDB Library Register padstack
Register in Technology Library Define mixed layer
Register in Design Rule Library
Generate PC Board Database
Place Components
Wiring Input area
Output Output mixed layer

1. Register When registering a padstack, specify thermal/clearance land pad name for the
padstack conductive layer.
2. Define In Technology Setup Tool, set “Mixed” as the conductive layer-type.

mixed layer
3. Input area Switch to Placement/Wiring Tool and input the area to be divided into islands.

2. Click pins with the same signal as the area.
3. Make the mixed layer active.
4. Input an area.
Thermal lands are generated in all

the padstacks with the same net.

4. Output For a mixed layer, the input positive and negative figures overlap with each other.
Therefore, when outputting the photo data, output positive and negative figures as
different data, and merge them on the film.
Lesson Open “exwir/[Board]” data for this lesson. Because layer 4 is a mixed layer, input an area
to Layer 4 for dividing into islands.

2. Click the VDD pin.
Net display colors are set as

follows:
Click VCC [+5V] Blue
VDD Violet
3. Set the active layer to Layer 4.
4. Input the area.
When you input an area, pins and vias

with the same net are converted to
thermal land, and pins and vias with the
different net to clearance land.
5. Input VCC [+5V] to the area in the same way.

When you input wire as Layer 1 to Layer 2 or Layer 2 to Layer 4 for multiple-layered
board design, interstitial vias will be generated.
We will describe the generation of interstitial vias.
The operation flow for designing multiple-layered boards is shown below.

<Operation Flow>
Register CDB Library
Register in Technology Library
Register in Design Rule Library Change Design Rule

zDrill rule setting
Generate PC Board Database * Refer to Note on page 4-10.

Edit design rules particular to PC board
Place Components
Wiring Generate interstitial vias
CAM Output

z Changing Design Rules (Setting Via Specifications)

Define the specifications for vias generated during wiring by using the
Via/Area Spec tab in Design Rule Library.
1. Start Edit Design Rule from PCB Design Common Tool.
Click the Via/Area Spec tab and

define the interstitial via in the
Via Spec. section.
2. Define the Enable Interstitial Via and Layer Combi. Limit. options.
Click
Check Enable Interstitial Via and
Click
Layer Combi. Limit..
Enable Interstitial Via
Check this option if you are using interstitial
vias on PC boards. Otherwise, interstitial
vias cannot be used on PC boards.
Click Click Register Layer Combination of Via.
3. Define combinations of interstitial vias that can be used on PC boards.
Set FromLayer and ToLayer, and click

Click
Add>>.
Click
Click
After you have defined necessary

Click
combinations, click OK.
4. Review the combinations of interstitial vias you have defined.

z Generating Interstitial Via

Placement/Wiring Tool generates interstitial vias at wire input.
Interstitial vias are generated in two ways:
1. Double-clicking
2. Switching the active layer
1. Double-clicking
Double-clicking the snap point
will generate an interstitial via.
The first interstitial via generated

is the via of the combination of
Double-Click layers displayed in FromTo in the
panel menu.
2. Switching the active layer

Change the active layer during wiring.
Interstitial via from 2 to 5
Click
Click
Interstitial via from 1 to 5
Note If it is difficult to change the active layer on the canvas because there are
too many conductive layers, you can also change the active layer from the
Cond. Layer dialog box.
Click View Æ Cond. Layer on the menu bar.
Click
Click Interstitial via from 1 to 12

Set layer combinations when generating interstitial

Note via by double-clicking
When you generate a via by

double-clicking, the generated via is
for the combination displayed in
FromTo in the panel menu.
When you click the snap point again,
the combination will change.
When you specify a combination

limit, the combinations change in
the order of list in the Set
Combination Specification dialog
box as shown in the figure on the
right.
！ Caution You cannot generate vias on the layer whose layer-type is power plane layer in the From-to specification.
Set Pair Layer and FromTo

Note
The From-to settings of a new via conforms to the From-to specification on the
Input Wire panel menu when generating it both by double-clicking and by
switching the active layer. The Pair Layer specification shows the layer that the
active layer is changed to when the snap point is double-clicked.
Pair Layer: When a via is generated by double-clicking,

the active layer is switched to the layer
specified in Pair Layer.
The Pair Layer specification itself changes by
switching the active layer.
FromTo: This is a specification for vias to be generated.

When Fix is unchecked, the FromTo
specification changes in line with Pair Layer.
When Fix is checked, the FromTo setting can
be specified from a combination other than
that of Pair Layer.
• If you draw a pattern from Layer 2 and double-click with the settings Pair Layer = 2 - 5
and FromTo = 1 – 6
Via for Layer
Layer 2 Layer 2 1 to 6
Double-Click
Layer 5
The active layer changes from Layer 2 to Layer 5 and a via from Layer 1 to Layer 6 is generated.
• If you change the active layer from Layer 1 to Layer 2 with FromTo = 1-6
Via for Layer
Layer 1 1 to 6
Layer 1
Click
Layer 2
The active layer is switched from Layer 1 to Layer 2 and via for Layer 1 to 6 is generated.
4 - 10 Chapter 4 Designing Multi-layer Board

z Displaying Via From-to

By displaying interstitial via combinations using the Via from-to mark on the canvas,
you can use other commands while you are viewing the combinations.
1. Click View Æ Via from-to on the menu bar to set it ON.
Click
From-to mark is
displayed
Via from-to mark
Click Environment Æ Option on the menu

bar to display the Option dialog box. By
setting the Via from-to option, you can select
from one of the following two marks to be
displayed
zDirection
zLayer
[Direction]
This mark indicates whether the via extends
from an active layer toward the front or
towards the rear side.
Penetrates the
Penetrates the front front side Penetrates the
[Layer] and rear sides rear side
This mark shows a layer by a scale and
From-to layer by a vertical bar.
Layer 1 to 5 Layer 2 to 4
Chapter 4 Designing Multi-layer Board 4 - 11

1. Outputting the Component List
List the information related to the components placed on the PC board.
Using Board List Processor

Board List Processor enables you to output information on components from the PC
board database (PCB) or the panel database (PNL) to an ASCII file in the format
specified in the blp file.
PCB RUL PNL MRL
PC board database Panel database
Board List Processor
BLP
Output format file
ASCII output
<Sample Output>
Chapter 5 Outputting the PC Board Information 5-1

You can output the following information using Board List Processor:
PC Board related data

Component group information
Component information (reference designators, placement sides, placement coordinates, etc.)
Stock code information
Footprint information
Package information
Mounting form information (insertion height and pitch information)
Part information
Pin Assignment information
Mounter information (mounter names, mounting base point coordinates)
Pin information
Padstack information
Hole information
Items that can be output.
Add or delete the information list

to be output.
Items that will be output.
Set details for each output

item. Values you can set vary
depending on the item for
output. Set output string for
"String", sort setting method
for "Ref-Des", and output side
information for
"Placed/unplaced".
Specify the target file Specify the starting column position, the maximum number of characters,
for ASCII output data. and the alignment setting to make the output list easier to read.
1. From CAD File Manager, select PC board data or panel data, and click Tool Action
Board List Processor on the menu bar.
Click
Click
5-2 Chapter 5 Outputting the PC Board Information

2. Click Append list... to specify the information to be listed.
Click
Append the items to be output to
Click Output list from Data.
Specify Output column position and

Click
Output File.
Click Output.
Click
Note You can review the output results by clicking Option View Output on the menu
bar. This way you do not have to open the output file.
3. Save the output list and its format you have specified into a parameter file by clicking
File Parameter File Save from the menu bar.
The saved parameter file can be read by

Click clicking Parameter File Open.
Note Board List Processor also allows you to merge the output with csv files and set headers
and footers.
Reference For details on how to set parameters for each item and define the output format, refer to the online help.

2. Printing
z Printing (Hardcopy Image)
Board Designer and Board Producer allow you to output PC board data and
manufacturing data to a printer or plotter during or after the completion of the design
process.
You may also display the print preview on the screen.
Data flow for
printer/plotter
output Board Designer Board Producer
Pre-processing
Read Write Read Write
PCB PNL
Intermediate data
Post-processing
Printer/plotter
output
The data flow for printing is shown in the figure above. Internally, the intermediate
plotting data for CR-5000 is output from the PC board and then converted to the
associated printer/plotter format before output.

2. Printing
Output objects
z Conductive pattern line z Component group *1 *2

z Conductive pattern surface z Pin number *1 *2
z Conductive pattern via z Via from-to *1 *2
z Conductive pattern pin z Wire bond *1 *2
z Hole z Lead symbol *1 *2
z Component area z Error mark for DRC/MRC/component DRC *1
z Keep-out area z Data attribute value *1 *2
z Height-limited area z Test point rectangle area *1
z Layout area z Pattern component temporary display *1
z PC board outline z Wire bond attach point *1
z Silk figure z Board ID *1 *3
z Symbol text z Divided area *1 *3
z Reference *1
z Ruler *1
z Component origin *1 *1 Only when they are displayed on the
z Unconnected net *1 *2 canvas.
z Group net *1 *2 *2 Only when board data is printed.
*3 Only when panel data is printed.
From the menu bar, click File Æ Print.
Board Designer Board Producer
When printing, the following options can be set:
(1. Output layers)

(2. Draw mode)
3. Output target
4. Property
5. Coordinate conversion (Clipping, Mirror, Rotate, Scale, Offset)
6. Reference designator/Board name print parameters
7. Component group area print parameters
8. DRC error print parameters
9. Display data attribute value print parameters
！ Caution The settings for the output layers and the draw mode are configured on the Layer Settings dialog box,
not on the Print dialog box.

2. Printing
Now you will learn how to set each option on the Print dialog box.
The first two print options, the output layer and the draw mode, described in the
previous pages are defined on the Layer Settings dialog box for board data (panel
data).
Output layer 1. Output layer

Click View Æ Layer Settings on the menu bar to specify the output layers.
The layers with Visible setting ON in

the Layer Settings dialog box will be
output.
Draw mode 2. Draw mode

Click View Æ Layer Settings on the menu bar to specify the draw mode.
The setting in Disp. Mode determines

the draw mode.
Simple
Solid
Reference For details on the Layer Settings dialog box, refer to “Setting the Display Status of Layer” on page 3-194.

2. Printing
Output target 3. Output target

Specify the plotter label name for the output target. You can output directly to the
connected plotter or printer, or output to the specified file in the format for various
plotters and printers. When you select the device to output a file, a field to specify the
file name is displayed.
[Outputting to a plotter or printer]

Select the desired printer or plotter name
from the pull-down menu.
[Outputting to the screen]

Select X-Window or DISPLAY from the
pull-down menu.
[Outputting to a file <1>]

(1) Select the output format from the
(1) pull-down menu.
(2) Specify the output file name.
(2)
Note The following output formats are available:

z CR5000
z CR3000
z LIPS
z HP-GL
[Outputting to a file <2>]

When you select the device that allows you to output to a file, you can output to both
device and file.
(1) Select the output device from the

(1) pull-down menu.
Click
(2) Check Output to file, and the
Output File Name field is displayed.
Specify the desired file name.
(2)
Note Setting the output device as default target
When you set the selected printer or plotter as a default target, the device is
automatically displayed in the Plotter Label field the next time you open the dialog
box.
Check Set As Default.
Click

2. Printing
Property 4. Property
Define paper and color settings.
Click Property next to Plotter Label to

(1) display the Print Property dialog box.
(2) (3)
(1) PropertySet name
The property set consists of parameters on the Paper tab, such as paper size,
orientation, and margins, as well as parameters on the Color tab, such as enabling or
disabling the pallet set.
The property set you have defined can be saved or deleted.
(2) Paper
Set the appropriate paper parameters for printing on the Paper tab.
The following settings can be

configured:
zSize
zOrientation
zMargins
zSize
Select the output paper size from the pull-down menu.

You can set the Width and Height fields only when Specify Size is selected.
Width
Height
zOrientation
Select the paper orientation. When Automatic is selected, the optimum orientation is
determined based on the data.

2. Printing
zMargins
Specify the paper margins. The margin settings are used when automatic scale and
automatic offset settings are selected.
Top
Left Right
Bottom
(3) Color
Set color related settings for printing. Select the Color tab and set appropriate
parameters.
The following color settings can

be set:
zEnabling/disabling the pallet set

zSetting the pallet set
zEnabling/disabling the pallet set
Specify whether the pallet set information is used when print operation is performed.
In some tools, enabling/disabling the pallet set is not supported.
Always enabled
Can be configured

2. Printing
zSetting the pallet set

Associate the CR-5000 color numbers with plotter's pen and pallet numbers. You can
set the pen and pallet numbers for each color for the output data.
Select the name of the pallet set

that defines the pen and pallet
numbers.
Set the pen and pallet numbers

for each CR-5000 color.
Add... : Saves the displayed pallet set with different file name.
Delete : Deletes the displayed pallet set.
OK : Updates the displayed pallet set and exits the dialog box.
Cancel : Exits the dialog box without updating the displayed pallet set.
！ Caution The Default pallet set cannot be modified.
Coordinate 5. Coordinate conversion

conversion
The following coordinate conversion can
be performed on the output data.
zClipping
zMirror
zRotate
zScale
zOffset
zClipping
Specify the drawing area.
On : Draws data in the area displayed on the canvas.
Off : Draws all data in the displayed area.
zMirror
Specify the settings for mirroring process.
Off X Direction Y Direction
5 - 10 Chapter 5 Outputting the PC Board Information

2. Printing
zRotate
Specify the setting for rotating process.
No rotation 90 180 270
zScale
Specify the setting for scaling process.
Automatic: On The optimum scaling will be calculated based on paper size and margins.
Automatic: Off Scaling values must be set.
zOffset
Specify the setting for offset process based on the origin of the drawing area.
Automatic: On Offset values will be calculated based on paper size and margins so that the central
point of the data becomes the center of the drawing area.
Automatic: Off Offset values must be set.
X offset
Y offset
Reference For details on [Read Parameters] and [Save Parameters], refer to the online help.
6. Board name/Reference designator print parameters
Board names and reference designators are output only when View Æ Ref-Des is
Board name/
Reference selected on the menu bar.
designator print
parameters
Board Designer Board Producer
Chara. Height
Chara. Chara.
Spacing Width
Pen Width
Input reference point (nine types)
9 types
Nowidth
Width
Hatching
Painting
Chapter 5 Outputting the PC Board Information 5 - 11

2. Printing
Note For panel data, you can output board names (displayed when the subboard display
option is set to Simple) only when they are displayed on the canvas.
Component group 7. Component group print parameters

print parameters
Component group areas are output only when View Æ Comp. Group is selected on
the menu bar.
Board Designer
Reference For details about the setting, refer to the previous page.
DRC error print 8. DRC error print parameters

parameters
DRC errors are output only when DRC errors are displayed on the canvas.
Board Designer
Reference For details about the setting, refer to the previous page.

2. Printing
Data attribute 9. Display data attribute value print parameters

value print
parameters
Data attribute values are output only when they are displayed on the canvas.
Board Designer
Reference For details about the setting, refer to page 5-11.
Lesson 1. Make simulative drawing for the PC board data on the screen as shown below. Use
the following board data:
<PCB> file name /home/lesson2/pcb/exwir.pcb
Set the layer display mode as follows:
Display mode of the wiring layers

Layer 1 : Simple
Layer 2 to 5 : Width
Layer 6 : Solid
2. From the menu bar, click File Æ Print.
Set the following options:

Click
Plotter Label
X-Window
Coordinate Conversion
Scale : Automatic
Offset : Automatic
Click Property.

2. Printing
3. Set the following properties:
Paper
Size : A4
(4) Orientation : Landscape
Click OK.
Click
Enter “property1” and click OK.
Click
Click Ref-Des.
Click
Ref-Des
Plot Mode : Nowidth
Click OK.
Click

2. Printing
4. Output the data.
Click Click OK.
The Execute dialog box is displayed.

As the dialog message indicates, pressing
the Break (Ctrl + Break for Windows) key
cancels the operation.
The data is output in the plot window.
5. Exit the plot window.

From the plot window menu bar,
click File Æ Quit.
Click

2. Printing
Printing (Data Image)

In the previous section “Printing (Hardcopy Image),” you have opened PC data on the
Editor window and printed the data. For data image drawing, you can print the PC
data without opening it.
The data flow for printer/plotter output is as follows:
Data flow for Board Designer Board Producer
printer/plotter
output
Pre-processing
Read Write Read Write
PCB PNL
Intermediate data
Post-processing
Printer/plotter
output
In the same way as in the previous section “Printing (Hardcopy Image),” the data flow
is divided into two parts: pre-processing and post-processing. The pre-processing part
provides the following functions:
PC board drawing Output Plotter Specify Drawing Attribute for Drawing of Each
program functions Output Destination Positive/Negative figure
Output Format Specify Drawing Attribute for Each Specified Component
Output Paper Size Reference Designator
Paper Orientation Specify Drawing Attribute for Pin Attribute Figure
Rotate Draw Reference Designator
Scale Specify Drawing Attribute for Each Specified Net Attribute
Offset Specify Drawing Attribute for Drawing of Specified Net Name
Clipping Drawing Unconnected Net
Select Drawing Target Layer Drawing of Specified Figure
Specify Pen/Palette Numbers Specify Drawing Attribute for Each Specified Hole
Drawing Shape Draw Test Points
Output Mirror by Layer

2. Printing
From CAD File Manager, select the PC board data (panel data) you want to plot, and click
(Plot tool) on the tool box.
Click
Each item in Plot Tool is described below.
Specify target PC board file 1. Specify PC board file name or panel file name to be output (required item)
name/panel file name
Specify the PCB (PNL) file name to be plotted.
Specify a parameter file

2. Specify a parameter file (optional item)
In Plot Tool, the content of items that have been once specified can be saved in
parameter files, which can be loaded later if necessary.
To load an existing parameter file, select a parameter file in the file selector.

2. Printing
Specify Output
Destination
3. Specify Output Target
Specify the plotter label name for the output target. You can output directly to the
connected plotter or printer, or output to the specified file in the format for
various plotters and printers. When you select the device for file output, a field to
specify the file name is displayed.
Outputting to a plotter or printer

Select the desired printer or plotter name
from the pull-down menu.
Outputting to the screen

Select X-Window or DISPLAY from the
pull-down menu.
Outputting to a file <1>

(1) Select the output format from the
pull-down menu.
(1) (2) Specify the output file name.
(2)
(2)
Note The following output formats are available.
CR5000
CR3000
LIPS
HP-GL
Outputting to a file <2>

When you select the device that allows you to output to a file, you can output to
both the device and the file.
(1) Select the output device from the

(1) pull-down menu.
(2) Check Output to file, and the

(2) destination specification field is displayed.
Specify the desired file name.

2. Printing
Paper Parameters
4. Specify paper size/orientation
Specify parameters for the paper used in printing.
The following settings are
available for output paper.
Size
Orientation
Size
Select output paper size from the pull-down menu.
You can set the Width and Height fields only when Specify Size is selected.
Landscape
Portrait
Orientation
Select the paper orientation. When Automatic is selected, the optimum
orientation is determined based on the data.
Specify Coordinate 5. Specify Coordinate Options

Options
The following coordinate
conversion can be performed on
the output data.
Rotate
Scale
Offset
Clipping
Option Unit
Rotate
Specify the setting for rotating process.
No rotation 90 degrees 180 degrees 270 degrees

2. Printing
Scale
Specify the setting for scaling process.
Automatic: On Automatic: Off
The optimum scaling will be calculated Scaling values must be set.
based on paper size and margins.
Offset
Specify the setting for offset process based on the origin of the drawing area.
Automatic: On Automatic: Off
Offset values will be calculated based on Offset values must be set.
paper size and margins so that the central
point of the data becomes the center of the
drawing area.
Specify Clipping
Draw only the specified area of the PC board data.
Specify Clipping On: Draws only the specified area.
Specify Clipping Off: Draws the entire PC board.
Option Unit
Specify unit for the coordinate option settings.
mm/inch/mil/micron

2. Printing
Specify drawing
6. Specify drawing page
page
Set the combination of drawing target layers and output format for each page.
(1) Append a page

(2) Copy a page
(3) Delete an existing page
(4) Rename an existing page
(5) Set output layer and format for each

page
(1) Append Page

Append a new page.
A “page” is a unit for drawing. Plot Tool outputs drawing data for each page.
Note You can preset multiple pages and have them output in one operation.
Click Append Page to open the

New Page dialog.
<<How to specify in the dialog box>>

1. Enter the page name to be added from the keyboard, and click Append Page.
2. Click Close when addition is finished.
(2) Copy Page

Copy an existing page.
Select the page name to be

copied, and click Copy Page to
display the Plot Tool - Copy
Click
Page dialog box.

1. Enter a new page name in the New Page Name field from the keyboard, and
click Copy Page.
2. Click Close when copying is finished.

2. Printing
(3) Delete Page

Delete an existing page.
Select the page name to be

deleted, and click Delete Page.
Click
Click OK in the confirmation dialog

box.
Click
(4) Rename Page

Change the name of an existing page.
Select a page name, and click

Rename Page to display the Plot
Tool - Rename Page dialog box.
Click

1. Enter a new name in the New Page Name field from the keyboard, and click
Rename Page.
2. Click Close when renaming is finished.

2. Printing
(5) Page-Settings
Specify output layers and output format for each page.
Click Page-Settings to open the

Page Settings dialog.
Click
(b)
(a)
(c)
(a) Displays page names that have been registered with Append Page.
Click each individual page name to specify parameters when plotting the
page. You can also use to change the page order
(plotting order).
(b) Switch tabs to specify each setting item.
You can specify the following eight items.
Drawing Layer Net

Positive/Negative Figure Object
Component/Ref-Des Hole
Net Attribute ICT
(c) Each item has its own settings, which will be explained in the following
section.
Drawing Layer
Drawing Layer
Layer Name: Specify PC board layer name
Output: Specify output target layers. Select layer(s) you want to output.
Pen/Palette: Specify pen number and palette number.
Drawing Mode: Select a drawing shape from the following six types.
Widthless
Width
Tone Paint the inside using the specified
Hatching 1 pallete number.
Hatching 2
Paint Draw outline using the specified
pen number, and paint the inside
using the specified pallete number.

2. Printing
Pitch : Specify a hatching pitch when drawing mode is Hatching 1 or 2.

Angle 1 : Specify a hatching angle when drawing mode is Hatching 1 or 2.
Angle 2 : Specify a hatching angle when drawing mode is Hatching 2.
Angle 2
Angle 1
Mirror : Mirroring is performed for each output layer.
Mirroring Off Mirror in X Direction Mirror in Y Direction
X-direction mirroring except Y-direction mirroring except

characters characters
X-direction mirroring for Y-direction mirroring for characters

characters only only
[Draw specified data only]

When checked, only the data enabled in Component/Ref-Des, Net Attribute,
Net, Figure Object, and Hole on the drawing layers will be drawn.
[Display Draw Data Only]
When checked, only the drawing layers will be displayed in the list.
[Display Document Layer]
When checked, document layers will be also displayed in the list.
Document layers are displayed with

[doc].

2. Printing
Positive/Negative
Positive/Negative
[Draw Figure]
Select whether to draw positive figures or negative figures (thermal/clearance
lands in padstacks, and mesh figures in mesh planes) in the drawing layers.
• Draw both positive and negative figures
• Draw positive figures only
• Draw negative figures only
[Negative Area]
Draw negative areas using Nega-Area creating function of Photo Tool.
Specify the following settings for nega-area drawing:
• Base area layer
• Base area pen width
• Base area outside offset
• Mirror
• Draw Mode etc.
Component/Ref-Des Component/Ref-Des
Specify special drawing attributes for figures that belong to the reference
designators specified in Drawing Layers.
You can specify the following attributes for reference designators.
• Drawing Mode
• Pen/Palette numbers
[Draw Attribute on Pin]
When checked, special drawing attributes can be specified for figures that
belong to pins.
[Ref-Des, Pin Number/Pin Name]
If you want to draw reference designators, pin numbers or pin names for
display on the canvas, specify the placement side for these components from
among A Side, B Side, or Both Sides. You can set the drawing attributes
during drawing with the [Parameters] button.
[Specified Drawing Target Comp.]
If this is checked, you can set the component to use for drawing with the
[Target Comp. Settings] button.
When checked, only rows specified as plotting targets are displayed in the list.
[Specified filter for Ref-Des]
Filter reference designators to display only reference designators that match
with the conditions.
[Destination]
The destination set for each component is displayed.
Note
The [Ref-Des] does not depend on Drawing Layers. You can draw them without
specifying Drawing Layers.

2. Printing
Net Attribute
Net Attribute
Specify special drawing attributes for each signal attribute of nets (Normal net,
Power net, Ground net, or Temporary net) in drawing layers.
You can specify the following attributes for net attributes.
• Drawing Mode
Net
Net
Specify special drawing attributes for nets specified in drawing layers.
You can specify the following attributes for net names.
• Drawing Mode
[Draw Unconnect Net]
When checked, unconnected nets are plotted in the mirror mode using the
specified pen number.
[Specified filter for Net name]
Filter net names and display only nets that match with the conditions.
[Import Net display colors]
Assign pen/pallet numbers used for drawing nets based on the net display
colors of System Designer or Board Designer
When imported, colors are converted to pen/pallet numbers that corresponds to
plotter labels.
If you want to specify pen/pallet numbers corresponding to display colors, click
PalletSet-Settings and open the PalletSet dialog to specify them.
Click
Click
Note [Draw Unconnected Net] does not depend on Drawing Layers. You can draw them
without specifying Drawing Layers.

2. Printing
Figure Object
Figure Object
Specify special drawing attributes for figure objects specified in drawing layers.
You can specify the following attributes for figure objects:
• Drawing Mode
You can specify the following figure objects:
•Text •Mesh Plane •Padstack •Component figure

•Constraints Area •Component Symbol •Padstack (Instance) •Round hole
•Line •Pad •Dimension •Square hole
•Area •Pad (Instance) •Leader •Slot hole
•Wirebond
[Draw Bond Wire]

When checked, you select options such as the pen number to be used,
mirroring mode, and destination, and draw bond wires.

Hole Hole
[Specified Setting Target]
Specify special drawing attributes for hole figures specified in drawing layers.
You can specify the following attributes for hole figures:
• Drawing Mode
You can specify the following. The edit menus will change accordingly, when you
switch between radio buttons.
Specified Plating
Specify draw attributes for holes with

each plating attribute (Plating and No
Plating).
Specified From-To
In the Layer menu, specify a draw

attribute by selecting the layer
combination among Through Hole,
From-To Hole, and Cover Hole.
Specified Dia./Kind
Specify draw attributes for

combinations of hole diameter/kind.


2. Printing
ICT
Ict
Draw test point (TP) information on the PC board (TP path, TP names, and TP
position marks).
You can specify the following attributes for drawing TPs.

[Process Mode]
Select a process mode of TP drawing from the following three options:
OFF: TP drawing is not performed
A Side: Draw TPs generated on A Side.
B Side: Draw TPs generated on B Side.
[Path Pen Number]
Specify a pen number used to track the position of TPs.
0: Drawing of TP path is not performed.
Numbers greater than 0: Draw TP paths using this specified pen
number.
(This does not apply to TPs generated on prior reference nets.)
Reference For details on test point generation command and prior reference nets, refer to online help.
[TP Name Pen Number]

Specify a pen number used to draw TP names.
Numbers greater than 0: Draw TP names using the specified pen
number.
[Character Width]
Specify character width for drawing TP names.
0.0: Calculate automatically based on the PC board shape and the layout area.
0.0 < W < 2000 mm: Draw TP names using the specified character width.
[Spacing]
Specify character spacing for drawing TP names.
0.0 < S < 2000 mm: Draw TP names using the specified character spacing.
[TP Offset]
Specify the offset value for TP names when the same TP names exist.
If there are more than one identical PC boards in panel data, the same TP
names exist. To avoid this, the offset number specified here will be
appended to TP names to distinguish TPs with the same name on each PC
board.
[TP Name Interval]
Specify interval to draw TP names.
0: Drawing of TP name is not performed.
(This does not apply to TPs generated by Prior Reference Nets.)
Numbers greater than 0: Drawing is performed using the specified interval.
Draw those TP names whose generation order is divisible by the specified
value.
Note that TPs generated on Prior Reference Nets and the first/last generated
TPs are drawn regardless of the interval value.

2. Printing
[TP Mark Pen Number]

Specify a pen number used to draw the position marks for TPs.
0: Use the pen number used for drawing TP paths.
Numbers greater than 0: Draw TP position marks using the specified pen number.
The TP position marks vary depending on whether the TPs are generated in
the Prior Reference Nets mode of the test point command or in a normal
method as follows:
TP position mark for Prior Normal TP position mark

Reference Nets
[Fill Background]
Specify a pallet number used to paint the background of TP names.
-1: The background of TP names is blanked out (erased).
0: The background of TP names is not painted.
Numbers greater than 0: Paint the background of TP names using the
specified pallet number. (Overlay)
-1: Blank out (erase) 0: No background Greater than 0: Overlay
[Height]
Specify character height to draw TP names.
0.0 < H ≤ 2000 mm: Draw TP names using the specified height.
[TP Mark Width]

Specify the width of TP position marks.
-1.0 Drawing of TP position marks is not performed.
0.0 Draw TP position marks using half the character width for TP names.
0.0<[W]<2000mm Draw TP position marks using the specified character width.
[Draw Position]
Specify a drawing position of TPs from the following nine options:
Lower Left Lower Center Lower Right
Center of Left Center Center of Right
Upper Left Upper Center Upper Right (default)
[Mirror]
Specify a mirroring mode when ICT is plotted.
[Include prior nets in TP name interval]

Specify whether to include prior nets when determining the TP name
interval.
[Plotting cross path line]

Specify whether to keep cross path lines crossed when plotting them.

2. Printing
！ Caution ICT drawing does not depend on Drawing Layers. You can draw them without specifying Drawing Layers.
！ Caution You can draw ICTs only if you have input test points (TPs) in Board Designer.
Reference For details on test point generation command and Prior Reference Nets, refer to online help.
Note Priorities for Draw Attributes

In Component/Ref-Des (including pin attributes), Net Attribute, Net, Figure
Object, and Hole, if more than one drawing attributes have been specified for a
figure, the following is the priority of attributes.
Hole diameter/kind > Penetration attributes > Plating attributes > Figure object > Net >
Net attributes > Pins
Higher priority Lower priority
Lesson Use the following conditions to output the drawing data to the screen “DISPLAY”, and
review the output image.
<PCB> file name : \home\lesson2\pcb\exwir.pcb

Plotter intermediate data output destination : \home\lesson2\pcb
Output format : CR-5000
Paper size : JIS A3
Paper orientation : landscape
Scaling : Auto
Offset : Autp
Page name : plot
[The settings of the page named “plot”]
Output Layer Drawing Mode Pen Number

PC board Shape NoWidth 6
Conductive Layer 1 Width 1
Symbol-A Tone 2
Resist-A Width 5
Metalmask-A Width 3
Draw Unconnected Net ON 7

2. Printing
1. Select the file set [exwir/[Board]], and click (Plot Tool) in the tool box of the CAD
File Manager.
Click Append Page.

Click
Enter a new page name “plot” and

Click
click Append Page.
Click Page-Settings.
Click
Set attributes for the target drawing

layers as follows:
Output Layer Pen Drawing Mode
No.
PC board Shape 6 NoWidth
Cond. Layer 1 1 Width
Symbol-A 2 Tone
Resist-A 5 Width
Click the Net tab, and specify as

follows:
Draw Unconnected Net : ON

Pen Number :7
Click Close to close the

Page-Settings dialog.
Click

2. Printing
2. Specify plotter label, paper, and coordinate options.

Plotter Label : DISPLAY
Paper size : JIS A3
Paper Orientation : Landscape
Click
Click Coordinate Option-Settings.
Scale : Automatic ON
Offset : Automatic ON
Click
Click Close.
3. Perform drawing.
In the Page List, select plot.
Click
Click Click Plot Execute.
The confirmation dialog box appears.

Click OK.
Click
The Status dialog is displayed, and

the Plot Window appears.
After reviewing the Plot Window,

close the dialog.
The confirmation dialog box appears.

Click Click OK.

2. Printing
4. Save the set parameters with the file name “plot.plp.”

Click File Save Parameter File on the menu bar.
Enter the file name “plot” as shown in

the left.
Click OK.
Click
5. Close Plot Tool.

Click File Exit on the menu bar.
Click
Click

2. Printing
* Drawing by Command Input (Batch)
You can draw PC boards from the command line without using Plot Tool.
<XX>zplot.exe [parameters] ↓
UNIX <XX>zplot.sh [parameters] ↓
The following two methods can be used for command input:

1. Specify edit parameters as optional parameters.
2. Specify edit parameters in the parameter file.
[1. Specifying draw parameters as optional parameters]

In the command line, you can perform drawing by using individual optional
parameters that correspond to the items specified in Plot Tool.
Syntax
<XX> zplot.exe PCB/Panel data name [parameters] ↓
Example If you want to output the PC board data “ex.pcb” as follows:
Output Layer Drawing Mode Pen No. Scale : Automatic

Cond Layer 1 Width 1 Offset : Automatic
Symbol-A Tone 2 Paper size : A3
Plotter label : DISPLAY
<XX>zplot.exe ex -p:scale auto -p:offset auto -p:paper A3/L

PCB data name Scaling Offset Paper size
-p:layer WIR1:without:width:1,WIR1-S:without:tone:2 -o sample ↓
Output layer (Drawing mode & Pen No.) Output file name
When executing the above command, intermediate data will be generated with the file name specified in
the “-o” option and the file extension “.pld” into the folder where the command was issued.
Next, use the post-processing program “post1.bat” to output the already generated “sample.pld” to
“DISPLAY”.
<XX> post1.bat sample.pld ↓
Note As described above, zplot.exe/sh cannot be output directly to a printer/plotter. This

command performs only “Pre-processing”, described in the figure on page 5-16.
Post-processing for output to a printer/plotter is performed by the post-processing
program (post*.bat/sh), which handles the already generated intermediate data.

2. Printing
[2. Specifying draw parameters in the parameter file]

In addition to the previous method in which you specified optional parameters
in the command line, you can also prepare a parameter file (a specifically
formatted text file) in advance, and use it to perform drawing.
Example If you want to use the parameter file “plot.plp” (which you've created in a previous lesson) to draw PC
board data “exwir.pcb” to a plotter label named “DISPLAY”:
<XX>zplot.exe -p plot ↓
Parameter file name
When you specify a parameter file, you do not need to specify the target PC board data on the command
line because it is already included in the parameter file.
Next, use the post-processing program “post1.bat” to output the already generated “sample.pld” to
“DISPLAY”.
<XX>post1.bat plot.pld ↓
As described above, you can use the parameter file generated from Plot Tool, and also
create a new parameter file from the command line using the “-p:mkparam” option.
Example If you want to create a parameter file “prm.clp” to be used for drawing the PC board data “exchk.pcb”:
<XX> zplot.exe -p:mkparam prm exchk ↓

Create a parameter file PCB data name
Note You can specify both parameter file and optional parameters at the same time; in this
case, optional parameters take priority.
！ Caution On UNIX, the post-processing program is named “post1.sh”. Also, you must add “-r” when you specify
intermediate data.
<XX> post1.sh -r plot.pld
！ Caution When you install CR-5000, the post-processing program “post1.bat/sh”, which generates output to DISPLAY, is
provided by default. You need to create new post processing programs in order to output to printers/plotters.
The newly created post-processing programs will be named “post1.exe/sh”, “post2.exe/sh” ... and so on.
Reference For details on how to create the post-processing program (post.bat/sh), refer to the online documentation.
Reference For details on the batch program “zplot.exe/sh”, refer to the online help [Batch Programs].

Zuken Inc.
Master Training <PCB Design >
Serial ID C2A1001E

CR5000 Pcb-Design-Master-Training PDF

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The ZUKEN logo and CI mark are registered trademarks of Zuken, Inc.

◆This manual was prepared as an educational text.

◆The contents of this manual are subject to change without notice.

◆Copying the contents of this manual without permission from Zuken

© 2007 ZUKEN Incorporated.

Preface Welcome to the World of PCB Design

Chapter 1 Using PCB Design Tools

Chapter 2 PCB Design

3. Resource Files ..............................................................................................................2-8

Chapter 3 Starting Board Designer

2. Starting the Board Generation Tool ...............................................................................3-4

3. Starting the Design Rule Editor ...................................................................................3-15

5. Starting Floor Planner .................................................................................................3-40

6. Starting Placement/Wiring Tool ...................................................................................3-63

7. Starting Artwork Tool .................................................................................................3-146

8. Functions Available for All Tools................................................................................3-177

9. Using the Assist Menu ..............................................................................................3-213

Chapter 4 Designing Multi-layer Board

2. Using Interstitial Via ......................................................................................................4-7

Chapter 5 Outputting the PC Board Information

The aim is to attain a level where you

Simple operations for PCB design

The aim is to attain the knowledge

Library Board Design

Master Training Master Training

Master Training Master Training

The files you should refer to or generate are shown below.

PRT PKG FTP NDF RUF

Design rule PC board

For the lesson, the following files are provided:

• explc.ndf and explc.ruf Used to generate a PC board and place components.

Understanding the flow of PCB design • Design process flow

Reference This is explained in Chapter 2, [PCB Design].

Chapter 1 Using PCB Design Tools 1-1

Using Board Designer

1. Starting Board Designer

2. Starting Board Generation Tool System Designer Board Designer

3. Starting Design Rule Editor VCC

the design rule library, design rules particular

4. Starting PC Board Shape Edit Tool

6. Starting Placement/Wiring Tool

7. Starting Artwork Tool R1

8. Functions Available for All Tools

9. Using Assist Menu • Snap point • Coordinates

Reference This is explained in Chapter 3, [Starting Board Designer].

1-2 Chapter 1 Using PCB Design Tools

Designing Multilayer PC Boards

1. Inside Layer Design

2. Using Interstitial Via

Reference This is explained in Chapter 4, [Designing Multi-layer Board].

Outputting PC Board Information

1. Outputting the Components List

information on the components placed on IC1 A_SIDE 60.960,45.720 0.000

Reference This is explained in Chapter 5, [Outputting the PC Board Information].

Chapter 1 Using PCB Design Tools 1-3

Register component library (CDB)

Reference Refer to “Master Training <Component Library>.”

Register technology library

Register design rule library

Generate PC board database PC board design

Input PC board outline

Check component placement

Input manufacturing data