Beruflich Dokumente
Kultur Dokumente
Lab.
Outline
-2- Lab.
Outline
Part 1 Part 2.
Part 2 Part 3
Part 3.
-3- Lab.
Basic Principles of a Solar Cell
Solar Cell: device using a photovoltaic effect of p-n junction
Light E Electric E
absorption
ⓔ
AR coationg
generation
front elecrode
ⓔ electron , ⓗ hole
Dissipation
ⓗ
-4- 4 Lab.
Classification of Solar Cells
Based on Technology Evolution
Thin Wafer
Crystalline Si Wafer
Si thin film
Perovskite
CIGS, CdTe thin film Organic http://www.mpip-
mainz.mpg.de/3492720/Perovs
kite_Solar_Cells
-5- Lab.
Why Thin Film Solar Cells?
http://cigs-pv.net www.coins-global.com
www.solartodaymag.com
http://trendinsight.biz
-6- Lab.
Annual Photovoltaic Installation
Source: Global Market Outlook for Solar Power / 2017-2021
Supported by: Intersolar Europe, Global Solar Council (GSC)
PV installation in 2017
60 China, 52.83
Intallation Capacity (GW)
50
40
30
10 전망치(단위: GW)
0
CHINA US INDIA JAPAN
-7- Lab.
Best Research-Cell Efficiencies
July, 2018
-8- Lab.
Best Research-Cell Efficiencies
July, 2018
-9- Lab.
PV Production by Technology
Percentage of Global Annual Production
Fraunhofer Institute for Solar Energy Systems 2017, ISE with support of PSE AG
-10- Lab.
Market Share of Thin-Film Technologies
Percentage of Total Global PV Production
Fraunhofer Institute for Solar Energy Systems 2017, ISE with support of PSE AG
-11- Lab.
Why Cu2ZnSn(S,Se)4 (CZTSSe)?
Issues in Inorganic Compound Thin Film Solar Cells
Expensive & Toxic
Low-cost and eco-friendly process with high efficiency
CdTe (h = 22.1%)
Cu(In,Ga)(S,Se)2 (h =22.6%) Cu2ZnSn(S,Se)4 (h =12.6%)
Source : Wadia, Alivisatos, Kammen, Envron. Sci. Technol. 43, 2072 (2009)
-13- Lab.
Cost for CIGS/CZTS PV System
$0.67
per WDC
(Source : On the Path to SunShot – The Role of Advancements in Solar Photovoltaic Efficiency, Reliability, and
Costs )
Materials Cost of CZTS Materials Cost of CIGS
Environ. Sci. Technol.
43, 2072 (2009)
-14- Lab.
Recent Publications on CZTSSe
480 437
430 Results from Web of Science 409 415411
Keywords: CZTS, CZTSe, Cu2ZnSnS4,..
2018. 2
380
Number of papers
330
Increases rapidly
280 244
230
180 156
130 92
80
37 43 55
30 3 0 3 0 5 4 7 10
-20
2002
2013
2001
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2014
2015
2016
2017
2018
Year
-15- Lab.
Progress in Cell Efficiency of CZTSSe TFSCs
Results from Web of Science
Keywords: CZTS, CZTSe, Cu2ZnSnS4,..
2018. 2.
14
Conversion Efficiency (%)
0
2001 2004 2007 2010 2013 2016 2019
Year
-16- Lab.
Recent Publications based on Methods
140 2009
Results from Web of Science
(487) 2010
Keywords: CZTS, CZTSe, Cu2ZnSnS4,..
120 2018. 2. 2011
(476) 2012
100 2013
2014 (249)
80 2015
2016
60 (211) 2017
(169) 2018
40
(128)
20
(42)
0
Sputtering Electrodeposition Nanoparticle based Sol-gel
Evaporation Spray method PLD
-17- Lab.
Major Results from World-Leading Groups
Institute Materials Process Annealing condition ɳ (%) Eg (eV)
-18- Lab.
Major Results from World-Leading Groups
-19- Lab.
Research Activities in Korea
Institute Materials Process Annealing condition ɳ (%) Eg (eV)
DGIST
SeS2/Se Graphite box 13.7
J. Mater. Chem. A CZTSSe Sputtering 1.097
300°C 1000sec. / 510°C 1100sec. 12.3
2016, 4, 10151
KIST
CZTSSe Electrodeposition Se powder H2S gas 550°C 15min. 9.9 1.14
(SNU*)
Yeungnam
CZTSe Sputtering Se vapor 500°C 10min. 5.8 1.06
University
Yonsei Hybrid ink-derived
CZTS H2S atmosphere, 550°C, 30min 8.17 1.46
University spin-coating
-20- Lab.
Why Cu2ZnSn(S,Se)4 (CZTSSe)?
Still too low cell efficiency compare to CIGS!!
Cu(In,Ga)(S,Se)2 Cu2ZnSn(S,Se)4
(ɳ = 22.6%) (ɳ = 12.6%)
-21- Lab.
Evolution of Cell Efficiencies in CIGS & CZTS
Key technical issues to improve efficiencies ZSW
Double graded band,
24 Post Deposition Treatment(KF) 22.6% World Best
CIGS Bandgap engineering 22.6% (2016)
CZTS
20
High transmittance TCO
AR coating
ZWS (2015) CZTS AIM
21.7 % Efficiency: 18%
NREL(2008)
Thin CdS thickness 19.9% (2018)
Efficiency (%)
NREL (1999)
16 18.8%
Sputter based
Ga composition control
NREL (1993) Hydrazine based Following CIGS
Slurry method DGIST (2016) Bandgap engineering
16.9% 13.7%
Band gap control, PDT treatment (Na, K)
12 IBM (2013)
High transmittance TCO
Boeing (1988) Morphology improvement 12.6%
12.5% IBM (2012) Band grading
Sulfo-selenization 11.1%
IBM (2011) Wide band buffer
condition control
8 Boeing (1981)
IBM (2010) 10%
9.4%
9.7% Progressing CZTS
U. Of Maine (1976) Absorber optimization NNCT (2008) Enhancing the Voc
6.8%
4 ~6-7 % Control recombination
Control absorption loss
Elimination of defect
NNCT (1996) (Bulk recombination)
0 0.7% Harvesting extra photon
-23- Lab.
Preparation of Absorber Layers
Precursor Preparation Annealing process
Precursor Structure
Pre-Treatment
Stacked layer Co-deposition Nano particle
Elimination of C contained binder
Homogeneous mixing of metal layers
Annealing Condition
Mo Mo Mo
Furnace & RTP Process
Sub. Sub. Sub. S powder & Se pellet : 500 ~ 580 oC
Physical Chemical
Electrodeposition
Sputtering Bath-based
Evaporation Sol-Gel
PLD Mo
Ink-Based
CVD Sub.
-24- Lab.
CZTSSe TFSCs on Various Substrates
-25- Lab.
Solar Cell Fabrication Process
Evaporation
RF sputter
CBD
RTA
Sputtering
Grid
Cu
Sn CZTS absorber Absorber (p-type) Absorber (p-type) Absorber (p-type)
Zn
Back contact Back contact Back contact Back contact Back contact
Substrate (SLG) Substrate (SLG) Substrate (SLG) Substrate (SLG) Substrate (SLG)
Difficult to control the uniformity of Zn and Sn unit layers by adjusting process parameters (power, pressure)
-27- Lab.
Preparation of Stacked Precursor Thin Films
Reasonably possible to control the uniformity by adjusting process parameters
(power, pressure, temperature)
Cu (DC) 50 W 5mTorr Sn (DC) 40 W 5 mTorr
CZTS
Mo
SLG
Zn (RF) 40Zn
W 5(RF sputtering)
mTorr Metal stacked precursor
Cu
Sn
Zn
Mo
SLG
-28- Lab.
Preparation of Crystalline Absorber Layers
Sputtering Sulfo-selenization using RTP
Halogen lamps
RTA Chamber Precursors
Ar
Cu
Sn
Zn
Mo
SLG
Mo
Substrate
-29- Lab.
Preparation of Crystalline Absorber Layers
Sulfo-Selenization Process
Cu
CZTS
Sn
Zn
Mo Mo
SLG SLG
-30- Lab.
Process Fine Tuning for CdS Buffer Layers
100
Quantum efficiency (%)
80
CNU solar cells show vey low EQE at
60
short wavelength
Jsc
40 Buffer (CdS) optimization
• CIGS(ZSW) 21.7%
20 • CZTSSe(IBM) 12.6% TCO optimization
• CZTSSe(CNU) 10.4%
0
200 400 600 800 1000 1200
Wavelength (nm)
CdS 26nm
CdS 35nm
CZTSSe
CZTSSe
-32- Lab.
Photo Images of Samples
after
Precursor after CdS Final Cells
Sulfo-Selenization
CZTSe
CZTSSe
Cell size: 0.31 cm2
Reasonably Uniform Surface Morphology
-33- Lab.
Fabrication of a CZTS TFSC
Cross-sectional TEM image
-34- Lab.
Cell efficiency of a CZTS TFSC
Current density (mA/cm ) 10
0.012 CZTS with poor performance
2
Current (A)
FF : 34.3% 0.008
h : 0.783%
6 2
Rs : 141 cm
2
Rsh : 400 cm 0.004
4
h = 0.78 % 0.000
2
Shunt current
-0.004
0
0.0 0.1 0.2 0.3 0.4 -1.0 -0.5 0.0 0.5 1.0
Voltage (V) Voltage (V)
-6
-1.0 -0.5 0.0 0.5 1.0
Voltage (V)
-35- Lab.
Processing Parameters to Be Controlled
Precursor Preparation
Buffer thickness
Cd-free buffer
i-ZnO thickness
Target material Cu AZO thickness
Thickness Sn Electrical properties of TCO layers
Stacking order Zn Band gaps of n-type layers
Barrier layer Mo (Back contact) Deposition Temp. of n-type layers
Glass
Al
Temperature Sulfo-Selenization
Ramp Rate Cell
Fabrication AZO
Duration Time
Soft annealing i-ZnO
Post annealing ZdS, Zn(O,S)
treatment
Partial Pressure Cu2ZnSn(S,Se)4 Cu2ZnSn(S,Se)4
(S, Se)
MoSSe2 Mo (Back contact) Mo (Back contact)
interfacial layer Glass Glass
Alkali control
-36- Lab.
Improving Cell Efficiency: Optimization of Annealing Process
Se/(S+Se)
Ratio
Annealing
Temp.
Annealing
Time
-37- Lab.
Optimization of Composition of Absorber Layers
-2
4.0x10
=0.57
Current (A)
6 -2
2.0x10
Cu poor
Cu rich
4
0.0
2
-1.0 -0.5 0.0 0.5 1.0
Voltage (V)
0
=1.59 ZnS
6
4
Zn secondary phase
2 Zn rich
-38- Lab.
Fine Tuning on CdS Buffer Layers
-2
5.0x10 -1
CdS60
-2 -2
4.0x10 CdS80
Log(Current(A))
-3
-2
3.0x10
Current
-4
-2
2.0x10 -5
-2 -6
1.0x10 CdS60
-7 CdS80
0.0
-8
-1.0 -0.5 0.0 0.5 1.0 -1.0 -0.5 0.0 0.5 1.0
Voltage Voltage(V)
0.1 3.0
100
18.5 min.
Gsh (S/cm )
0.01
2
Rs ( cm)
0.1
20.5 min.
2.0
A
1
60
1E-3 0.01
1.5
40
1E-3
1E-4 1.0 0
CdS60 CdS80 CdS60 CdS80 20
Samples Samples
-39- Lab.
Improving Cell Efficiency: Window-Control
Reduction of series resistance by controlling i-ZnO layer
12
FF : 29.2 %
AZO 8 n : 0.81 %
2
Rs : 268 cm
2
6 Rsh : 1000 cm
i-ZnO (100 nm)
CdS (40 nm) 4
2
CZTS
0
50 nm 0.0 0.1 0.2 0.3 0.4 0.5
Voltage (V)
20
5
CZTS
50 nm 0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Voltage (V)
-40- Lab.
Improving Cell Efficiency: Interface Control
FF : 39.5 %
5 h : 0.5 %
2
Rs : 182 cm
4 2
Rsh : 3787 cm
3
2
1
100 nm
0
0.0 0.1 0.2 0.3 0.4
Voltage (V)
20
CZTS
5
MoS2 100 nm
Mo 0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Voltage (V)
-41- Lab.
Improving Cell Efficiency: Sulfo-Selenization
Possible to control bandgaps of CZTSSe absorbers
Property change by S/Se ratio Result of optimized device
2.0 40
2
S/(S+Se)
(S+Se)/M S/(S+Se) 35
CZTSSe Voc : 481 mV
Intensity (arb.unit)
Composition ratio
338
287
2
373
5 Mo
CZTS
CZTS
1
242
174
196
0.0 0
200 300 400 500 1 0.76 0.72 0.68 0.53 0.47 0.39 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6
-1
S/(S+Se) Voltage (V)
Raman Shift (cm )
40 100
Current density(mA/cm )
100
Quantum efficiency (%)
S/(S+Se)
2
QE (%)
25 0.53 60 0.47 1.14 60
0.47 0.39 1.10
20 0.39 0 0.92
0 40 40
15
10
20 20
5
Eg : 1.15 eV
0 0 0
0.0 0.2 0.4 0.6 400 600 800 1000 1200 1400 400 600 800 1000 1200
Voltage(V) Wavelength (nm) Wavelength (nm)
-42- Lab.
Improving Cell Efficiency: Soft Annealing Process
10 min. 10 min.
Ar+S+Se
Metal alloy
520℃
Mo
Without
Soft annealing
10 min.
100 35
10
W/O Soft annealing 30
80
τ = 302 ps
25
PL intensity
2
With Soft annealing
60 10 Jsc improvement
τ = 413 ps 20
Diffusion length 15
40
control
10
1 10
20
5
0 0
400 600 800 1000 1200 0 3 6 9 12 15 18 0 100 200 300 400 500
Wavelength (nm) Time(ns) Voltage (mV)
-43- Lab.
Improving Cell Efficiency: High Pressure Process
Efficiency (%)
8
1100
7
1000
6 900
800
5
350 400 450 500 550 600 650 700 750 800 450 500 550 600 650 700 750
Initial pressure (torr) Initial chaber pressure (Torr)
-44- Lab.
Anti-Reflection Coating Layer
Thickness of MgF2 Applying MgF2 Layer
MgF2
i-ZnO/AZO
CdS • Formation of MgF2 using
CZTSSe E-beam evaporation
(MgF2 100 nm)
Mo Back contact
Substrate (SLG)
12 0.50
0.46
I𝐧𝐜𝐢𝐝𝐞𝐧𝐭 𝐥𝐢𝐠𝐡𝐭 𝐰𝐚𝐯𝐞 𝐥𝐞𝐧𝐠𝐭𝐡 = 4n(MgF2:1.37)×d
8 0.45
A(W/O) A(MgF2) B(W/O) B(MgF2) A(W/O) A(MgF2) B(W/O) B(MgF2)
at 550 nm, d = 100 nm Samples Samples
at 500 nm, d = 91 nm
• about 1% increasement of cell efficiency
-45- Lab.
Evolution of Cell Efficiency in our Lab.
14 Certified by KITECH
Sputtering (Sulfide targets)
Sputtering (Metal targets) CZTSSe (12.06%)
12 Electrodeposition
Certified by KIER
Efficiency (%)
Flexible Substrate
10 CZTSSe (11.8%)
Certified by KIER
8 CZTSSe (10.4%)
6 Certified by KIER
CZTSSe (8.00%)
GET-Future
4 Start Certified by KITECH
CZTSSe (5.5%)
2 CZTS
(0.6%) KIER
CZTS Korea Institute of
0 (1.2%) Energy Research
KITECH
Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1 Korea Institute of
2012 2013 2014 2015 2016 2017 2018 Industrial Technology
-46- Lab.
Key issues in improving Cell Efficiency
Our recent CZTS-based results
CZTSSe
12 CdS
Uniformity
(12.8=06%)
Temperature
Certified Value
Efficiency (%)
Annealing By KITECH
10 pressure Ni/Al grid
Heating
temperature AR coating
8 TCO
optimization
S+Se
6 Metal
target
Se Soft annealing
pellet
H2S gas
4 Se
MoSe2
control
amount Se pellet
Sulfide Composition
target Soft annealing
2 ratio
Heating
Annealing pressure
temperature
0
M6 M9 M12 M3 M6 M9 M12 M3 M6 M9 M12 M3 M6
2014 2015 2016 2017
-47- Lab.
Fabrication of a CZTSSe Submodule
Cross-sectional schematic of a submodule
Ag
AZO P3
i-ZnO
CdS
CZTS P2
Ag
MO P1
SLG
P3 P2 P1
-49- Lab.
Fabrication of a CZTSSe Submodule
Voc & Isc could be controlled by changing module structure
135 45
2
Area : 33.30 [cm ] Area : 16.3 [cm2]
120
Cell : 3ea 3 cells 40
Cell : 6ea
6 cells
105 35
Current [mA]
Current [mA]
90 30
75 25
60 20 Voc : 3.37[V]
Voc : 1.21[V]
Isc : 113.09[mA] Isc : 32.97[mA]
45 15
Jsc : 3.43[mA] Jsc : 2.02[mA]
30 FF : 30 [%] FF : 37 [%]
10
Eff : 1.23 [%] Eff : 2.55 [%]
15 Rs : 7 [ohm] 5 Rs : 57[ohm]
Rsh : 15 [ohm] Rsh : 183 [ohm]
0 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Voltage [V] Voltage [V]
45
Area : 22.65 [cm2]
40 8 cells
Cell : 8ea
35 Voc Isc Jsc FF η
# of cell
(V) (mA) (mA/cm2 ) (%) (%)
Current [mA]
30
25
3 1.21 113.09 3.43 30 1.23
20 Voc : 3.74[V]
Isc : 40.31[mA]
15 Jsc : 1.78[mA] 6 3.37 32.97 2.02 37 2.55
FF : 42 [%]
10
Eff : 2.76 [%]
Rs : 41[ohm]
8 3.74 40.31 1.78 42 2.76
5
Rsh : 253 [ohm]
0 Size of a submodule is ~25 cm2
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Voltage [V]
-50- Lab.
Operation of a CZTSSe Submodule
-52- Lab.
Characteristics of Our Best Cell
J-V Curve & QE TEM & EDS Line scanning
Ni/Al Top, MgF2 AR
40
Current density (mA/cm )
2
35
30
25
20 Efficiency : 12.06 %
FF : 59.78 %
15 2
Jsc : 38.67 mA/cm
10 Voc : 521.77 mV
5
0
0 100 200 300 400 500
Voltage (mV) STEM-HAADF Image and EDS mapping
100
Quantum efficiency (%)
80
60 1.0 Secondary
MG756
0.8 phase
2
[hln(1-EQE)]
40 0.6
0.4
ZnSe
20 0.2
1.12 eV SnO
0.0
0.9 1.0 1.1 1.2
Energy (eV)
1.3 1.4 1.5 MoSe2
0
400 600 800 1000 1200
Wavelength (nm)
-53- Lab.
Technical Issues to Improve Cell Efficiency
Comparison of IV Characteristics
Minimizing bulk recombination
J-V Curve Cation disorders
40
Current density (mA/cm )
2
Grain boundaries
30
Minimizing interfacial recombination
Absorber/Buffer
20
Absorber/Mo interface
10 • CZTSSe (IBM)
• CZTSSe (CNU)
0
0 200 400 Minimizing photon loss
Voltage (mV) Wide band-gap TCO
Optimization of grid structure
CZTSSe CZTSSe JNU/ Cd-free Zn(O,S) buffer layer
(전남대) (IBM) IBM (%)
Thin buffer
Voc (mV) 521.7 513.4 101.6
Anti-reflection coating
Jsc (mA/cm2) 38.6 35.2 109.7
Fill Factor 59.7 69.8 85.5 Optimization of Rs & Rsh
ɳ (%) 12.0 12.6 95.2 Improving junction quality
Voc deficit (mV) 598 617 96.9 Carbon layer (Mo/CZTS)
※ Vocdef = Eg/q – Voc
Diffusion barrier (Mo/CZTS)
※ IBM Adv. Energy Mater. 4 (2014) 1301465 Defect control
-54- Lab.
Various approaches to improve Voc
Origins of Voc: GBs, Interfaces, Defects
Results in Low MCCLT, electrostatic potential fluctuations, and tail states
Can be Minimized by Passivation, Doping, Post Annealing Treatment
Absorber/Buffer Interface
Alkaline (Na, K): surface passivation
Double emitter: increasing carrier density
Passivation with a dielectric layer
Absorber Layer
Buffer (CdS)
Alkaline (Na, K): increasing grain size
Post air annealing: GB passivation
Cu2ZnSn(S,Se)4
Doping: minimizing cation disorder (CuZn-, ZnCu+)
Mo (Back contact)
Glass Absorber/Back-Contact Interface
Passivation with a dielectric layer
Optimizing sulfo-selenization process:
(reducing secondary phases)
-55- Lab.
Summary
-56- Lab.
Thank you
-57- Lab.