LG TE365 Service Manual

Service Manual
Internal Use Only
Service Manual
TE365
Model : TE365
Date: February, 2009 / Issue 1.0

REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
J.P.Kim Jul. 18. 2008 0.1 -
* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the TE365
Series.
Copyright © 2008 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -4- Copyright © 2008 LG Electronics. Inc. All right reserved.
Table Of Contents
1. INTRODUCTION ...............................7 5. Trouble shooting............................66
1.1 Purpose .................................................. 7 5.1 Trouble shooting test setup....................66
1.2 Regulatory Information............................ 7 5.2 Power on Trouble...................................67
1.3 ABBREVIATION ..................................... 9 5.3 Charging trouble ....................................70
5.4 LCD display trouble................................72
2. PERFORMANCE .............................11 5.5 Camera Trouble .....................................74
2.1 H/W Features.........................................11 5.6 Receiver & Speaker trouble ...................76
2.2 Technical specification...........................12 5.7 Microphone trouble ................................78
5.8 Ear-MIc Jack Detection trouble..............79
3. TECHNICAL BRIEF ........................19 5.9 Vibrator trouble ......................................80
3.1 TE365 series Component 5.10 Keypad back light trouble.....................82
Block diagram... .....................................19 5.11 SIM & USD trouble...............................84
3.2 Baseband Processor (BBP) 5.12 Touch trouble .......................................88
Introduction ............................................20
5.13 Qwerty Key trouble ..............................90
3.3 Power management IC ..........................28
5.14 Trouble Shooting of Receiver Part.......92
3.4 Power ON/OFF ......................................32
5.15 Trouble Shooting of Transmitter Part...96
3.5 SIM interface..........................................33
3.6 Micro SD external memory Interface .....34
3.7 Memory ..................................................35 6. Download & S/W upgrade...............103
3.8 LCD Display ...........................................36
6.1 S/W download setup ............................103
3.9 Keypad Switching & Scanning ...............39
6.2 Download program user guide.............104
3.10 Touch KEY...........................................41
6.3 Multi-Download Program Setting .........105
3.11 Keypad back-light illumination .............43
3.12 LCD back light illumination...................44 7. CIRCUIT DIAGRAM ......................107
3.13 ISP(Image Signal Processor)...............45
3.14 JTAG & ETM interface connector ........46 8. BGM PIN MAP...............................117
3.15 Audiot ...................................................47
3.16 Charging circuit ....................................49 9. PCB LAYOUT ................................121
3.17 BLUETOOTH .......................................50
10. RF Calibration ............................127
3.18 FM Radio .............................................52
3.19 18pin Multi Media Interface 10.1 Test Equipment Setup .......................127
connector .............................................53 10.2 Calibration Step .................................127
3.20 General Description .............................55
11. Stand-alone Test ........................133
3.21 Receiver part........................................57
3.22 Transmitter part....................................58 11.1 Test Program Setting .........................133
3.23 RF synthesizer .....................................59 11.2 Tx Test ...............................................135
3.24 DCXO...................................................60 11.3 Rx Test...............................................136
3.25 Front End Module control.....................60
12. ENGINEERING MODE ................137
3.26 Power Amplifier Module .......................61
4. PCB layout......................................62 13. EXPLODED VIEW &

REPLACEMENT PART LIST ......139
4.1 Main PCB component placement ..........62
13.1 Exploded View ...................................139
13.2 Replacement Parts ............................141
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the TE365 Series.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the TE365 Series or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the TE365 Series must be performed only at the LGE or its authorized
agents. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.
1. INTRODUCTION
E. Notice of Radiated Emissions

The TE365 Series complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

An TE365 Series may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
1. INTRODUCTION
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
LGE Internal Use Only - 10 - Copyright © 2008 LG Electronics. Inc. All right reserved.
2. GENERAL PERFORMANCE
2.1 H/W Feature

Item Feature Comment
Standard Battery Li-Polymer, 800mAh
AVG TCVR Current 250mA typ @PL5
Standby Current 1.85 mA typ @PP9
Talk time 5.6 hours (GSM TX Level 10)
Standby time Over 430 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓
TX output power EGSM : 32.5dBm (@PL 5)

DCS/PCS: 29.5/29.5dBm (@PL 0)
GPRS compatibility Class 12
SIM card type 3V Small
Display Main 240x320 262K TFT 2.4”
Status Indicator Dial keys are implemented by touchpad.

Navi, Send, Call End, Back, Volume Up, Volume Down,
Camera, Touch hot Key and CLEAR
Number key, Alphabet, OK, space bar,
Function key are implemented by Qwertykey
ANT Built in antenna
EAR Phone Jack - 18pin multi port Headset jack (Call/Music)
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
Copyright © 2008 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
2.2 Technical specification
Item Description Specification

GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
1 Frequency Band
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
RMS < 5 degrees
2 Phase Error
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
2 26 dBm 3dB 10 10 dBm 4dB
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
Output RF Spectrum 6,000 -71

5
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19

6
(due to switching transient) 600 -21
1,200 -21
1,800 -24

DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
BER (Class II) < 2.439% @-102dBm
8 Bit Error Ratio
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.

14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
System frequency
18 2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 2 mA(@PP9)
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
21 Talk Time
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
2. Full charge, no receive/send and keep GSM in idle mode.
22 Standby Time
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : < 450 mA
24 Charge Current
Slow Charge: < 200 mA
Antenna Bar Number Power
7 >-92 dBm ~
7→5 -97dBm ~ -93dBm
5→4 -100dBm ~ -98dBm
25 Antenna Display
4→2 -103dBm ~ -101dBm
2→1 -105dBm ~ -104dBm
1→0 < -106 dBm
Off No Service
Battery Bar Number Voltage( 0.05V)

3 3.74V ~ 4.2V
26 Battery Indicator 2 3.64V~3.73V
1 3.45V ~ 3.63V
0 3.35V ~ 3.44V
3.45V ↓ 0.05V (Call)
27 Low Voltage Warning
3.45V ↓ 0.05V (Standby)
28 Forced shut down Voltage 3.35 0.05 V
Li-ion Battery or Li-Polymer Battery
Standard Voltage = 3.7 V
29 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 5.6V, 0.4A
* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

1 RMS EVM 9%
2 Peak EVM 30%
3 95th Percentile EVM 15%
4 Origin Offset Suppression ≥ 30dB
GSM900/EGSM
5 27dBm 3dB 13 17dBm 3dB
5 Power Level 12 19dBm 3dB
DCS1800, PCS1900
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
6 Output RF Spectrum DCS1800, PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 TE365 series Component Block diagram
Figure 1. TE365 series Functional Block Diagram
3. TECHNICAL BRIEF
3.2 Baseband Processor (BBP) Introduction
S-GOLDradio
Baseband GS R
IS/ IR-Memory
Cipher
AD
FIR DC
DigR Offset
TEAKLit Æ Comp AD LPF
FIR
DAC
Speech
X and Equalize
U
M
DAC Decodin Sigma-Delta
GMSK
MASH
8PSK
Modulato
DigR -
Speech
AD and
+ AD
Encodin L
Ramp
3-wire Gen
Ctrl
GS RF
USB FS DCXO
Timer Contro DA
SRAM
FCDP SCCU EBU
Keypad DMAC ICU GEA-1/2/3 CGU PA/FE

LDO
Contro
GPIO CAPCOM AUX
ADC
GPT IC Power
USI
ARMÆ926 LED S PL RF GP VI
Hands- PWMís (BL LD LD LD LD
RTC JTAG
free SD1 I/ RF SI AUX
IrDA MOVE Multimedia IC Amp (1.5V) LD LD LD LD
MMC/SD Camera Display Powe SD2 ANA RF1 USB RTC
USIM I USARTs Charger
I I I Contro (1.8V) LD LD LD LD
Figure 2. Top level block diagram of the S-GOLDRadio™ (PMB8888)
3.2.1 General Description

S-GOLDRadio™ is a GSM/EDGE single chip mixed signal Single Chip Radio IC containing all analog
and digital functionality of a cellular radio. Additionally S-GOLDRadio™ Provides multimedia
extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution,
integrating the digital and mixed signal portions of the base band in 0.13um, 1.5V technology.
The chip will fully support the FR/HR/EFR/NB-AMR speech codec.
S-GOLDRadio™ support multi-slot operation modes CSD/GPRS/EGPRS (up to class 12) without
additional external hardware.
3. TECHNICAL BRIEF
3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S
includes an MMU, and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
3. TECHNICAL BRIEF
- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)
3.2.3 External Devices connected to memory interface

Table 1. Memory interface
Device Name Maker Remark

NAND FLASH K5D1G12ACD-D075 Samsung Synchronous / A synchronous
SDRAM K5D1G12ACD-D075 Samsung Synchronous 133MHz
LCD IM200DBN7A LGIT 8bit access 2times transmission
3.2.4 RF Interface
S-GOLDRadio uses this interface to control RF IC and Peripherals. 13 signals are provided switch
on/off RF ICs Periodically each TDMA frame.
Table 2. RF Interface Spec.
Resource Interconnection Description

TX2 TXHB Output High band(DCS/PCS) Tx
TX1 TXLB Output Low band(850/900) Tx
RX1, RX1X GSM850_RXP, GSM850_RXN Input of GSM850 LNA
RX2, RX2X GSM900_RXP, GSM900_RXN Input of GSM900 LNA
RX3, RX3X DCS1800_RXP, DCS1800_RXN Input of DCS1800 LNA
RX4, RX4X PCS1900_RXP, PCS1900_RXN Input of PCS1900 LNA
PABS PA_BAND Select PAM operation band.
FE1, FE2 VC1, VC2 Control FEM operation band & mode
PAEN PA_EN PAM Enable
VRAMP TX_RAMP Tx Ramp signal
T_OUT6 PA_MODE Select PAM operation mode (GSM/EDGE)
3. TECHNICAL BRIEF
3.2.5 USART Interface
TE365 have two UART Drivers as follow :

- USART0 : SW upgrade / Calibration
- USIF : BT Interface.
Table 3. USIF Interface Spec.
Resource Name Remark

UART0
UART0_TXD UART_TX Transmit Data
UART0_RXD UART_RX Receive Data
USIF
USIF_TXD UART_BT_TX Transmit Data
USIF_RXD UART_BT_RX Receive Data
T_OUT3 UART_BT_RTS Flow Control Signal
T_OUT4 UART_BT_CTS Flow Control Signal
3.2.6 ADC channel

BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4. S-GOLDRadio ADC channel usage
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery supply voltage measure
M9 N.C
M10 JACK_TYPE JACK type measure (Not used)
3. TECHNICAL BRIEF
3.2.7 GPIO map

Over a hundred allowable resources, TE365 is using as follows except dedicated to SIM and Memory.
TE365 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
Table 5 S-GOLDradio GPIO pin Map
Port Function Net Name Description

#Keypad
KP_IN1 KEY_I2C_SCL Key coder IC control
KP_IN2 KEY_I2C_SDA Key coder IC control
KP_IN3 DIF_RESET LCD reset
KP_IN4 BT_RESET BT reset
KP_IN5 IF_MODE3 LCD interface mode (Hitachi LCD => High)
KP_IN6 VIB_PWR_EN Motor LDO enable
KP_OUT0 CAM_PWR_EN Camera LDO enable
KP_OUT1 LIN_INVERT Motor control
KP_OUT2 TOUCH_SCL Touch IC control
KP_OUT3 TOUCH_SDA Touch IC control
#USART0
USART0_RXD UART_RX UART, RS232 data
USART0_TXD UART_TX UART, RS232 data
USART0_RTS_N MMC_DET Micro SD card Detect
USART0_CTS_N HOOK_DETECT Earmic hook key Detect
DSPOUT0 JACK_DET Earmic Detect
#USB
USB_DPLUS USB_DP USB +
USB_DMINUS USB_DM USB -
#CIF:Camera Interface
CIF_D0 CAM_D(0) Camera DATA(0)
3. TECHNICAL BRIEF

CIF_PCLK CAM_PCLK Camera pixel clock
CIF_HSYNC CAM_HS Camera H sync
CIF_VSYNC CAM_VS Camera V sync
CLKOUT2 CAM_MCLK Camera main clock
CIF_PD_GPIO CAM_PWDN Camera sensor power down
CIF_RESET_GPIO CAM_RST Camera reset
#Display_Interface
DIF_D0 DIF_D(0) LCD DATA(0)
DIF_CS1 DIF_CS LCD chip select
DIF_CS2 BT_INT BT interrupt
DIF_CD DIF_CD LCD command/data switch
DIF_WR DIF_WR LCD write
DIF_RD DIF_RD LCD read
DIF_HD EOC Indicating End of charging
DIF_VD DIF_VSYNC LCD V sync
DIF_RESET1_GPIO KEY_INT Key coder IC interrupt
#I2C
I2C_SCL I2C_SCL For Sub-PMIC/Audio DAC/Camera
I2C_SDA I2C_SDA For Sub-PMIC/Audio DAC/Camera
#Chip Card (USIM1)
CC_IO SIM_DATA SIM card I/O
CC_CLK SIM_CLK SIM card CLOCK
CC_RST SIM_RST SIM card RESET
#MMCI: Multimedia Card IF
MMCI_CMD MMC_CMD uSD Card command/response
MMCI_DAT0 MMC_D0 uSD Card Data (0)
MMCI_CLK MMC_CLK uSD Card Clock
3. TECHNICAL BRIEF
#USIF: Universal Serial IF

USIF_TXD_MTSR UART_BT_TX BT UART data output
USIF_RXD_MRST UART_BT_RX BT UART data input
USIF_SCLK BT_VCXO_EN BT vcxo (26MHz) enable
#I2S1: DAI-PCM
I2S1_CLK0 I2S1_CLK BT synchronous data clock
I2S1_RX I2S1_RX BT synchronous data input
I2S1_TX I2S1_TX BT synchronous data output
I2S1_WA0 I2S1_WA0 BT synchronous data sync
#MMCI: SD-Extension
#Voiceband: Analog Interface
EP_N BB_SND_L For Speaker
EP_P BB_SND_R For Speaker
HS_N RCV_N For Receiver
EP_CM NA
HS_P RCV_P For Receiver
MIC1_N MIC_N For Mic
MIC1_P MIC_P For Mic
MIC2_N HS_MIC_N For Headset Mic
MIC2_P HS_MIC_P For Headset Mic
VMIC MICBIAS Power for MIC
#Measurement
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery voltage measure
M9 NA
M10 JACK_TYPE JACK type measure (Not used)
#JTAG
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
3. TECHNICAL BRIEF
#FCDP:Flash Controller DMA Port

FCDP_RBN FCDP
#GSM TDMA Timer: GSM Control
T_OUT3 UART_BT_RTS BT UART request to send
T_OUT4 UART_BT_CTS BT UART clear to send
T_OUT5 TOUCH_INT Touch IC interrupt
T_OUT6 PA_MODE PAM
T_OUT7 RPWRON Remote Power On
T_OUT8 LIN_PWM_FRQ Motor control
#Other Functional Pins:
Clocks and control
CLKOUT0 CHG_EN Charging enable
F32K To 32KHz crystal
OSC32K To 32KHz crystal
RESET_N nRESET
#Extra I/Os & Interrupt Inputs
DSPIN0 CLK32K BT 32kHz sleep clock
DSPIN1 SLIDE_OPEN Slide open/close detect
#Baseband I/0
FSYS3 NA
FSYS2 26MHZ_BT BT Main clock
#Reference Oscillator / PLL
REFR NA
XOX 26MHz 26MHz Main clock
XO 26MHz 26MHz Main clock
#LED's
BL1_PWM / VSENSE1 DBB_BL_PWM Not used
BL2_PWM LIN_PWM_MAG Motor control
BL3_PWM SUB_KEY_BL Sub Key LED control
VSS_FLASH GND
FLASH_SINK QWERTY_KEY_BL Qwerty Key LED control
#Control Logic
LPBCL_ECHO GND
ON_OFF / SCAN_RESET PWRON
RESET2_N / VSENSE2 M_RESET Memory reset
PO_RESET_N / SCAN_OUT2 PO_RESET
3. TECHNICAL BRIEF
3.3 Power management IC
3.3.1 General Description

S-GOLDradio has a highly integrated Power and Battery Management block for mobile handsets.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
3. TECHNICAL BRIEF
Figure 3. Top level block diagram of the PMU Block of PMB8888
3. TECHNICAL BRIEF
Table 6. LDOs Output Table of PMU Block of PMB8888
LDO Net name Output Voltage Output Current Usage

SD1 VSD1_1V5 1.5V 400mA Core & for LDO
SD2 1V8_VSD2 1.8V 300mA Memory
VAUX 2V9_VAUX 2.9V 150mA BT Power
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_VSIM 2.9V 22mA SIM card
VMME 2V9_VMMC 2.9V 150mA SD Card
VAUDIO 2V5_VAUDIO 2.5V 220mA Headset
VUSB 3V1_VUSB 3.1V 40mA USB Switch
VRF1 2V85_VRF1 2.85V 150mA
VRF2 1V5_VRF2 1.5V 80mA
VRF3 2V85_VRF3 2.85V 150mA
VPLL 1V5_VPLL 1.5V 20mA S-GOLDRadio PLL
VRTC 2V0_VRTC 2.0V 4mA RTC
VVIB 2V8_VVIB 2.8V 140mA Touch
1V5_VRF2 2V85_VRF3 2V85_VRF3 2V5_VAUDIO 2V8_VVIB 3V1_VUSB 1V5_VRF2 VBAT

0.01u
0.01u
220n
120p
C110 220n
0.1u
C100
C106 C107
C109 1u
C111 1u
C101 2.2u
2.2u 1u
C108
C103
1u
C104
C105
C102
KDR331V
2V85_VRF3 R100 0
2
VCHG_OVP
2V85_VRF3 3 R101 0
2V85_VRF3 2V9_VAUX 2V62_VIO 2V85_VRF1 1
VBUS_OVP
2V85_VRF1
47nH
D100
47nH
47nH
1V5_VSD1 1V8_VSD2 2V9_VMMC 1V5_VPLL 2V85_VRF3 VBAT 2V9_VSIM

L100
L101
VBAT 2V0_VRTC 2V0_VRTC

L102
0.01u
39p
220n
C112
C120 0.01u
C121 0.01u
2.2u
2.2u
1u
1u
1u
1u
100p
C113 C114 C127

0.1u C117
0.1u 0.1u 1u
C119
C123
C125
C118
C122
C115
C124
C116
C126
0.1u
C128
C130
C129
0.1u
0.1u
W19
M11
M10
C10
D11
D12
A19
D18
V19
E12
E11
E18
L11
L12
L10
W4
W5
W6
W1
M9
M2
M4
H2
K1
K4
A7
B7
C6
C7
A8
B8
D6
A3
B4
B3
A2
B1
B2
C3
N2
N3
R2
U2
U3
U6
A4
C5
D5
C4
D7
A5
C8
A1
P4
V7
E1
E2
E3
P2
V2
V4
V5
V6
L9
L8
F3
T3
T6
L1
T2
J8
VDD_MAIN_1
VDD_MAIN_2
VDD_MAIN_3
VDD_MAIN_4
VSS_MAIN_1
VSS_MAIN_2
VSS_MAIN_3
VSS_MAIN_4
VSS_MAIN_5
VDDP_EBU_1
VSS_MS
VSS_EP
AGND_MS1
AGND_MS2
VDDTX
VDDVCO
VDDTRX
VDDDIG
VDDMS
VDDXO
VDDPLL
VDDRX
VAUDIO
VBAT_AUDIO
VSS_AUDIO
VLED
VAUX
VVIB
VBAT_LDO1
VSS_LDO1
VMMC
VUSB
VBAT_BSW_USB_MMC
VIO
VSIM
VBAT_LDO2
VSS_LDO2
VPLL
VRF2
VDD_RF2PLL
VRF1
VRF3
VBAT_RF13
VSS_LDO3
VSSRF1
VSSRF2
VSSRF3
VSSRF4
VSSRF5
VSSRF6
VSSRF7
VSSRF8
VSSRF9
VSSRF10
VSSRF11
VSSRF12
VSSRF13
VSSRF14
CH_SOURCE
CH_GATE
SENSE_IN1
SENSE_IN2
VDD_REF
VDDCHARGE
CHARGE_UC_SCAN_IN1
VDD_FUSE_FS
NC1
NC2
NC3
VSS_RTC
VDD_RTC
Figure 4. LDOs Circuit Diagram of TE365 series
3. TECHNICAL BRIEF
3.3.2 Charging
TE365 charge the battery using an external charging IC of Intersil ISL9221 for Li-Polymer battery in
4.2 Volts level.
4.2V~3.74V 3.74V~3.64V 3.64V~3.45V 3.45V~3.35V
Figure 5. Battery Block Indication
1 Charging method : CC-CV

2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 400 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.15 V
9 Low battery alarm
a. Idle : 3.45 V ~ 3.35 V
b. Dedicated : 3.45 V ~ 3.35 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.35 V
12. Charging temperature adc range
a. ~ -5 : low charging voltage operation (3.6 V ~ 3.9 V)
b. -5 ~ 50 : standard charging (up to 4.2 V)
c. 50 ~ : low charging voltage operation (3.6V ~ 3.9V)
3. TECHNICAL BRIEF
3.4 Power ON/OFF

TE365 series Power State : Defined 3cases as follow
] Power-ON : Power key detect (S-GOLDradio PWRON port)
] Power-ON-charging : Charger or USB detect.
Remote Power On END
2V0_VRTC END_KEY_IN
RPWRON_EN KEY_COL7
330K
R219
R222
R220
END_KEY
2K
10K
R221
PWRON
100K
R224
KEY_ROW6
R223 3.3M
1 2 3
RPWRON C226
2K 10u
R225
100K
6 5 4 EMX18
Q201
END_KEY_IN
Figure 6. Remote power on and End-key power on circuit.
Input ON is a power-on input for S-GOLDradio with 2 active high levels (see Figure 6). It might be
triggered by a push button. To detect if the push-button is pressed during system operation the logical
level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF
register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-
mentioned bit won’t be set.
To support Remote power on function for factory mass production, applied an BJT as following figure.
As monitoring the RPWRON and Key matrix KEY_COL7 & KEY_ROW6, TE365 series system
recognize whether remote power on or End-key pushed
3. TECHNICAL BRIEF
3.5 SIM interface

TE365 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 7). SIM_DATA,
SIM_CLK, SIM_RST ports are used to communicate with BBP(S-GOLDRadio).
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_DATA : SIM card bidirectional data
SIM CONNECTOR
2V9_VSIM 2V9_VSIM
R522
R523
DNI
J500
15K
4 1
C5 C1
5 2
C6 C2 SIM_RST
6 3
SIM_DATA C7 C3 SIM_CLK
10 7
GND4 GND1
9 8
GND3 GND2
C546 C543 C547 C548
DNI 220n 22p 1000p
Figure 7. SIM Circuit
3. TECHNICAL BRIEF
3.6 Micro SD external memory Interface

In TE365 series a Micro SD slot for external Memory is connected to PMB8888.
MICRO SD Connector
2V62_VIO 2V9_VMMC
100K
100K
100K
100K
100K
100K
2V9_VMMC
S500 AXA463062P
R500
R508
R501
R502
R503
R504
MMC_D1 DAT1_2
DUMMY1
MMC_D0 DAT0
VSS
MMC_CLK CLK
VDD
MMC_CMD CMD
MMC_D3 CD_DAT3
DUMMY2
MMC_D2 DAT2
MMC_DET DETECT_A
DETECT_B
DUMMY3
C534 GND
C526 C527 C528 C529 C530 C531 C532 C533
27p 27p 27p 27p 27p 27p 27p 27p
1u
Figure 8. Micro SD Card Circuit
Micro SD memory pad assign.
SD mode
Pin No. Name Type Description
DAT1_2 MMC_D1 I/O Data bit [1]
DUMMY1 NC
DAT0 MMC_D0 I/O Data bit [0]
VSS GND GND Ground
CLK MMC_CLK I Clock
VDD 2V9_VMMC Power Power
CMD MMC_CMD I/O Command response
CD_DAT3 MMC_D3 I/O Data bit [1]
DUMMY2 NC
DAT2 MMC_D2 I/O Data bit [2]
DETECT_A MMC_DET
DETECT_B GND GND Ground
DUMMY3 GND GND Ground
3. TECHNICAL BRIEF
3.7 Memory
1Gbit NAND Flash & 512Mbit SDRAM employed on TE365 series with 8 bit bus for NAND and 16bit
bus for SDRAM thru ADD(0) ~ ADD(24). The 1Gbit NAND Flash memory with SDRAM stacked device
family offers multiple high-performance solutions.
A10
B10
N10
P10
A2
A9
B1
N1
B2
B7
B9
P1
P2
P9
E8
F3
F6
DATA(0:15) ADD(0:12)
DNU1
DNU2
DNU3
DNU4
DNU5
DNU6
DNU7
DNU8
DNU9
DNU10
DNU11
NC1
NC2
NC3
NC4
NC5
NC6
DATA(0) B3 C7 TP100 ADD(0)
DQ0 A0
DATA(1) C4 C8 ADD(1)
DQ1 A1
DQ2 A2
DATA(3) D4 B8 ADD(3)
DQ3 A3
DATA(4) D3 M9 ADD(4)
DQ4 A4
DATA(5) E4 L9 ADD(5)
DQ5 A5
DATA(6) E3 K9 ADD(6)
DQ6 A6
DATA(7) F4 J9 ADD(7)
DQ7 A7
DATA(8) J4 H7 ADD(8) 1V8_VSD2
DQ8 A8
DATA(9) K3 H8 ADD(9)
DQ9 A9
DATA(10) K4 D9 ADD(10)
DQ10 A10
DATA(11) L3 H9 ADD(11)
DQ11 A11
DATA(12) L4 G7 ADD(12) 1V8_VSD2
DQ12 A12
DATA(13) M3
DQ13
DATA(14) M4
DQ14
DATA(15) N3
DQ15
B4
VDD1
G9
VDD2
E9 H2
SDRAM_CS _CS VDD3
R105 22 M2
SDCLKI VDD4
R106 22 H4
SDCLKO CLK
TP102 G8 D2
CKE CKE VDDQ1
TP104 F8 F2
_WR
D7
_WED U100 VDDQ2
K2
ADD(13) BA0 VDDQ3
D8
ADD(14)
E7
BA1 K5D1G12ACD-D075
_RAS _RAS
F7 C2
_CAS _CAS VSS1
G3 F9
_BC0 LDQM VSS2 C131 C132 C133 C134 C135
H3 G2
_BC1 UDQM VSS3 0.1u 0.1u 0.1u 0.1u 0.1u
N4
DATA(0:7) VSS4
DATA(0) J5 E2
IO0 VSSQ1
DATA(1) L5 J2 1V8_VSD2
IO1 VSSQ2
DATA(2) J6 L2
IO2 VSSQ3
DATA(3) L6
IO3
1V8_VSD2 DATA(4) J7
IO4
DATA(5) L7
IO5
DATA(6) J8 B6
IO6 VCC1
DATA(7) L8 N7
IO7 VCC2
N6
VCCQ
C6
FLASH1_CS _CE
D5
R109
R110
ADD(16) ALE C136 C137 C138

3.3K
3.3K
C5
ADD(17) CLE 0.1u 0.1u 0.1u
TP105 E5 B5
_RD _RE VSS5
E6 N5
FCDP R__B VSS6
D6 N8
R111 _WR _WE VSS7
F5
M_RESET _WP
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
1
NC7
NC8
NC9
G4
G5
G6
H5
H6
J3
K5
K6
K7
K8
M5
M6
M7
M8
N2
N9
Figure 9. Memory Circuit
3. TECHNICAL BRIEF
3.8 LCD Display

LCD module include:
- Main LCD: 240x320 262K TFT 2.4”
- Backlight : 5 piece of white LED
LCD Connector Interface Spec:
Table 7. LCD Connector Interface Spec.
Pin No. Pin Name I/O Description
1 GND Ground
2 PWM O PWM signal output for backlight control
3 DTX3 I Interface Mode
6 VSYNC-O O Vsync Interface out
7 RD O Read
8 WR I/O Write
9 RS I/O Address/Data select
10 CS I/O Chip Select
11 D15 I/O Data[15] for LCD

3. TECHNICAL BRIEF
Pin No. Pin Name I/O Description
27 LCD-ID I Menufacture ID
28 VCC1 I Logic
29 VCC1 I Analog
30 RESET I/O LCD reset
31 MLED5 O LED Cathode
36 MLED I LED Anode
37 GND - Ground
3. TECHNICAL BRIEF
2V62_VIO
R100 C100
100K 0.1u
CN100
1
2
LCD_BL_PWM 3
IF_MODE3 4
R101 0
5
R102 0
IFMODE(1) 6
DIF_VSYNC IFMODE(0) 7
DIF_RD 8
DIF_WR 9
DIF_CD 10
DIF_CS 11
12
13
14
15
16
17
18
19
DIF_D(7) 20
DIF_D(6) 21
DIF_D(5) 22
DIF_D(4) 23
DIF_D(3) 24
DIF_D(2) 25
DIF_D(1) 26
DIF_D(0) 27
LCD_ID 28
29
30
DIF_RESET 31
MLED5 32
MLED4 33
MLED3 34
MLED2 35
MLED1 36
MLED 37
VA101
EVLC14S02050
Figure 10. 37pin LCD connector circuit
3. TECHNICAL BRIEF
3.9 Keypad Switching & Scanning

The keypad is controlled by a Key coder IC (PP2106M2). It can be used for scanning keypads up to 8
rows and 8 columns (max 64 keys). PMB8888 control PP2106M2 by KEY_I2C_SCL, KEY_I2C_SDA
and KEY_INT.
2V62_VIO
QWERTY KEY
KEY_I2C_SDA
C400 2V62_VIO
0.1uF
2V62_VIO
0
R400
120K
(1%)
R402
4.7K
C401 0.1uF
R401
29
28
27
26
25
24
23
22
PGND
GND2
RESETB
XI
XO
CLK_SEL
VDD
P10
27p
27p
27p
C402
C403
C404
1 21 R403 470
TEST P40 KEY_ROW0
2 20 R404 470
SEL_28P P41 KEY_ROW1
R405 470 3 19 R406 470
KEY_COL7 P57 P42 KEY_ROW2
R407 470 4 U400 18 R408 470
R409 470 5 PP2106M2 17 R410 470
R411 0 6 16 R412 470
KEY_INT P17 P45 KEY_ROW5
R413 0 7 15 R414 470
KEY_I2C_SCL P15 P46 KEY_ROW6
GND1
P54
P53
P52
P51
P50
P47
2V62_VIO
R415
C413
C414
C415
C416
C417
C418
C419
8
9
10
11
12
13
14
4.7K
27p
27p
27p
27p
27p
27p
27p
C420 27p
C421 27p
C422 27p
C423 27p
C424 27p
470
470
470
470
470
R416
R417
R418
R419
R420
KEY_COL4
KEY_COL3
KEY_COL2
KEY_COL1
KEY_COL0
Figure 11-1. Keypad Configuration Circuit
3. TECHNICAL BRIEF
SOFT1 SOFT2 SEND OK

100 101 102 103
KEY_ROW4
HOT CLR RIGHT

104 105 106
KEY_ROW5
LEFT UP DOWN
107 108 109
KEY_ROW6
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
VBAT
END
KB100
R112 150
END_KEY
VA100
EVL14S02200
Soft1 W E T U I O Soft2
KB400 KB401 KB402 KB403 KB404 KB405 KB406 KB407
KEY_ROW0
C425 Q A R Y H J P CLR
27p KB408 KB409 KB410 KB411 KB412 KB413 KB414 KB415
KEY_ROW1
Fn S D G Space K L MSG
KEY_ROW2
C426 Sym Z F V B N M ENTER

KEY_ROW3
Shift X C
KB432 KB433 KB434
KEY_ROW4
KEY_COL0
C427
27p
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
Figure 11-2. Keypad Configuration Circuit
3. TECHNICAL BRIEF
3.10 Touch KEY

The Touch keypad is controlled by CY8C20434. PMB8888 control CY8C20434 by TOUCH_SCL,
TOUCH_SDA and TOUCH_INT.
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.11 Keypad back-light illumination

There are 3 snow white color LEDs on Main PCB and 7 blue color LEDs on Sub PCB for keypad
illumination. Sub Keypad Back-light is controlled by S-GOLDradio PWM port which has a duty control
function. And Main Keypad Back-light is controlled by S-GOLDradio FLASH_SINK port. The whole
configuration of the S-GOLDradio Flash LED circuit is shown in below Figure12.
QWERTY_KEY BACKLIGHT
VBAT
R310
LEWWS44-E LD300 47
R311
QWERTY_KEY_BL
LEWWS44-E LD301 47
R312
LEWWS44-E LD302 47
ICVN0505X150FR
VA301
MULTI_KEY BACKLIGHT
VBAT
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
C101 C102
1u 1u
R103
R104
R105
R106
R107
R108
R109
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LD100
LD101
LD102
LD103
LD104
LD105
LD106
R110 Q100
SUB_KEY_BL
2SC5585
1K
R111
10K
Figure 12. Qwerty + Multi_Keypad Backlight Circuit
3. TECHNICAL BRIEF
3.12 LCD back light illumination

MAX8630W is a charge pump designed to support PWM control mode. And MAX8630W supports 5
white LEDs. The MAX8630W is capable of driving up to 5 LEDs at a total of 100mA(MAX8630W
100mA).
The current sinks may be operated individually or in parallel for driving higher current LEDs. To
maximize power efficiency, the charge pump operates in 1X, 1.5X, or 2X mode, where the mode of
operation is automatically selected by comparing the forward voltage of each LED with the input
voltage.
LCD BACKLIGHT
C103 1u
VBAT
6
2
C1P
C1N
3 7
IN OUT MLED
C104
1 14
1u GND LED1 MLED1
13
U100 LED2 MLED2
12
MAX8630W LED3 11
MLED3
LED4 MLED4
R114 DNI 9 10
DBB_BL_PWM CPWM LED5 MLED5
9p
9p
9p
9p
9p
9p
R115 0 8 15
LCD_BL_PWM PWM P_GND
C2N
C2P
C113
R116
100K
C114 1u
C107
C108
C109
C110
C111
C112
5
0.1u
C115 1u
Figure 13. Charge-Pump Circuit
3. TECHNICAL BRIEF
3.13 ISP(Image Signal Processor)

TE365 Series support Camera resolution up to 2M pixel. Camera Sensor I/F is integrated in the S-
GOLDradio(PMB8888).
CAMERA POWER
DIF_RESET2_GPIO
CIF_RESET_GPIO
CIF_PD_GPIO
CIF_HSYNC
CIF_VSYNC
VBAT 1V8_VCAM 2V8_VCAMIO

CIF_PCLK
CLKOUT2
DIF_CS1
DIF_CS2
DIF_WR
DIF_CD
DIF_RD
DIF_HD
DIF_VD
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
CIF_D0
CIF_D1
CIF_D2
CIF_D3
CIF_D4
CIF_D5
CIF_D6
CIF_D7
E17
G15
G17
C19
G16
C18
H15
F16
K11
K8
C17
J9
H10
F15
H16
F17
V14
U13
T12
T13
R11
R12
V13
T11
W12
V12
V11
U11
W11
W10
U500 RT9011-MGPQW
DNI
1 8
VIN VOUT1
2 7
CAM_PWR_EN EN1 VOUT2
PGND
3 6
R119
EN2 NC2
100K
4 5
NC1 GND
C550
9
EUSY0319001
1u C551 C552
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
DIF_CS
BT_INT
DIF_CD
DIF_WR
DIF_RD
EOC
DIF_VSYNC
DSR
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
CAM_HS
CAM_VS
CAM_MCLK
CAM_PWDN
CAM_RST
KEY_INT
CAM_PCLK
R525
2.2u 2.2u
CAMERA CONNECTOR
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
1V8_VCAM 2V8_VCAMIO
R505 10
CAM_D(7)
R506 10
CAM_D(6)
R507 10
CAM_D(5)
FB500 R509 10
CAM_D(4)
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
CN500
G2 G1
24 1
C500
C501
C502
C503
C504
C505
C506
C507
23 2
R510 10 22 3
I2C_SCL
R511 10 21 4
I2C_SDA
R512 10 20 5
CAM_VS
R513 10 19 6 R514 10
CAM_HS CAM_D(3)
10 R515 18 7 R516 10
CAM_MCLK CAM_D(2)
17 8 R517 10
CAM_D(1)
16 9 R518 10
CAM_D(0)
15 10
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
14 11
13 12
C518
C519
C520
C521
C522
C523
C524
C525
C535
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
G4 G3
1u
ENBY0020401
AXK7L24227G R519 10
CAM_PCLK
R520 10
CAM_RST
R521 10
CAM_PWDN
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
C536
C537
C538
C539
C540
C541
Figure 14. ISP & Camera Circuit
3. TECHNICAL BRIEF
3.14 JTAG & ETM interface connector

In case of TE365 series mass production, the JTAG interface connector will not be mount on board.
That is only for developing and software debugging purpose.
ON BOARD ARM9 JTAG & ETM INTERFACE
1V8_VSD2
CN100
G1 G2
1 30
2 29
3 28
4 27
TRST_N
5 26
TDI
6 25
TMS
7 24
TCK
8 23
RTCK
9 22
TDO
10 21
_EXTRST
11 20
12 19
13 18
14 17
15 16
G3 G4
Figure 15. JTAG & ETM Interface Circuit
3. TECHNICAL BRIEF
3.15 Audio
TE365 series Audio signal flow diagram as following diagram.
Figure 16. Audio Signal Flow Diagram
3. TECHNICAL BRIEF
3.15.1 Audio amplifier

We use MAX9877 Audio AMP, which have speaker & headphone amplifiers. An audio signal path can
be selected by I2C command.
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
0
R300
C301 C302
1u 1u
C304 1u
A3
B1
C5
VSS
VDD
PVDD
A4
C1N
C305 1u A5 A1 R313 0 HSO_R

C1P HPR
A2 R314 0 HSO_L
HPL
C308 1u D1
BB_SND_R INA2
C309 1u D2
BB_SND_L INA1
U303
C311 1u C1 MAX9877AEWP_TG45
FM_SND_R INB2
C312 1u C2 D5
FM_SND_L INB1 OUT+ SPK_P
B2 B5
BIAS OUT- SPK_N
B3
i2C_SDA SDA
C3
I2C_SCL SCL
D4
RXIN+
PGND
B4
GND
RXIN-
C315
1u
D3
C4
Figure 17. Audio AMP Circuit Diagram
3.15.2 Microphone circuit
MIC MICBIAS
100nH
L302
C321
39p
L304 MIC300
C320 1
MIC_N P
C319 100nH 2
22n G1
39p 3
G2
4
O
L303
C318 SPU0409HE5H-PB
MIC_P
22n 100nH
C317
39p
EVLC14S02050
VA300 C322
10u
Figure 18. Microphone Circuit Diagram
3. TECHNICAL BRIEF
3.16 Charging circuit

ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other
from a desktop cradle.
The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.
Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used
safely.
An over voltage protection functions are integrated in ISL9221 for USB & Charge
CHARGING IC OVP
VBAT VCHG_OVP VBUS_OVP
2V0_VRTC 2V62_VIO VBUS_USB VCHG
U201 ISL9221
13
PGND
1
R226
R209
100K
VDC
DNI
12
VDC_BYP
2
VUSB
11
BAT
3
_PPR
10
USB_BYP
4
EOC _CHG
9
IVDC
5
CHG_EN _EN
8
GND
6
IMIN
7
(1005,10V,K,X5R)
IUSB
(1608,25V,K,X5R)
(1608,25V,K,X5R)
(1005,10V,K,X5R)
(1005,10V,K,X5R)
R215
100K
R213
R216
R214
C209 C210 C211 C212 C213

10K
33K
16K
1u 1u 1u 1u 1u
(1%) (1%) (1%)
Figure 19. Charging Circuit Diagram
3. TECHNICAL BRIEF
3.17 BLUETOOTH
General Features
The BlueCore 5-FM BGA is a single chip radio and baseband IC for Bluetooth 2.4 GHz systems
including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with stereo
audio output stage and an RDS demodulator.
With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to
v2.0+EDR of the specification for data and voice communications.
BLUETOOTH_CSR 2V62_VIO
ANT600 FB600
R600 GND1
FEED GND2
0 VBALUN_BT
L600 AMAN802015LG14
C600 C601 C602
NA
DNI 0.1u 1u
R601 1
C603 C604 C605

22n DNI 15p
H10 R603 1
G10 R602 1
C606 C607 C608

15p 0.1u 2.2u
B10
C10
G2
G9
G3
G8
A2
C2
A7
H1
A6
K1
B2
C1
B4
D2
C3
D3
B6
H2
E2
E3
F2
F3
J6
J3
C609 C610
VDD_PIO
VDD_FM
VDD_RADIO_1
VDD_RADIO_2
VDD_USB
VDD_PADS
VDD_CORE_1
VDD_CORE_2
VDD_LO
VDD_AUDIO
VDD_ANA
VSS_PIO
VSS_FM1_1
VSS_FM1_2
VSS_FM2
VSS_DIG
VSS_RADIO_1
VSS_RADIO_2
VSS_RADIO_3
VSS_ANA_1
VSS_ANA_2
VSS_ANA_3
VSS_ANA_4
VSS_ANA_5
VSS_ANA_6
VSS_PADS
VSS_CORE
VSS_LO
15p 15p
C611 47n
AU_REF I2C_DATA
A3 C8
FM_SND_R SPKR_R I2C_CLK
A4 C7
FM_SND_L SPKR_L
A5
C612 220n R604 560 USB_DN
K6
FILT_EXT USB_DP
C613 1000p B3 J7
CLK32K CLK_32K UART_CTS UART_BT_RTS
C9 H6
C614 0.01u K3 LO_REF UART_RTS UART_BT_CTS
H5 TP600
XTAL_OUT UART_RX UART_BT_TX
C615 1000p J2 K7 TP601
26MHZ_BT XTAL_IN UART_TX UART_BT_RX
K2 J8
L601 33nH L602 470nH
C616 820p
FM_ANT
B1
FM_P BLUECORE5-FM PCM2_CLK
D9
C618 15p C619 15p FM_N M600 PCM2_SYNC
C617 820p A1 D10
PCM2_IN
E10
AUX_DAC PCM2_OUT
B5 D8
4
FL600 RX_N
D1 TP602
G1
LFB212G45BA1A220 RX_P PCM_CLK I2S1_CLK

E1 H9 TP603
VREGENABLE_H
VREGENABLE_L
UB B1 RF_P PCM_SYNC I2S1_WA0

3 5 F1 J10 TP604
NC_DC G2 RF_N PCM_IN I2S1_TX
VREGOUT_H
2 6 G1 K8 TP605
VREGIN_H
NC B2 PCM_OUT I2S1_RX
VREGIN_L
SPI_MOSI
SPI_MISO
TEST_EN
VBALUN_BT 1 H7
SPI_CLK
7
SPI__CS
G3
PIO_11
PIO_10
AIO_1
AIO_0
PIO_9
PIO_8
PIO_7
PIO_6
PIO_5
PIO_4
PIO_3
PIO_2
PIO_1
PIO_0
_RST
2V9_VAUX
8
L603 18nH
C6
A8
B7
C5
F10
F9
E8
E9
B9
B8
A9
A10
J4
K4
F8
J9
H8
K10
K9
C4
H3
H4
J1
J5
K5
C621
FB601
1.5p 2V62_VIO
TP606
C620
DNI
R605
R606 470K 2.2 C623 C624
R607 47K 2.2u 0.1u
C625 C626
DNI 2.2u
BT_VCXO_EN
BT_RESET
BT_INT
Figure 20. Bluetooth / FM Radio Circuit Diagram
3. TECHNICAL BRIEF
Bluetooth Radio
- Common TX/RX teminal simplifies external matching, eliminates external antenna switch
- No external trimming is required In production
- Bluetooth v2.0 + EDR Specification compliant
Bluetooth Transmitter
- +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB
- Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
Bluetooth Receiver
- Integrated channel filters
- Digital demodulator for improved sensitivity and co-channel rejection
- Real time digitized RSSI available on HCI interface
- Fast AGC for enhanced dynamic range
- Channel classification for AFH
Synthesiser
- Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter
- Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock
Audio
- Single-ended stereo analogue output
- 16-bit 48 kHz digital audio bit stream output
Baseband and Software

- Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types
- Logic for forward error correction, header error control, access code correlation. CRC, demodulation,
encryption bit stream generation, whitening and transmit pulse shaping. Supports all Bluetooth
v 2.0 + EDR features incl. ESCO and AFH
- Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air
Physical Interfaces
- Synchronous serial interface up to 4Mbits/s for system debugging
- UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode
- USB v1.1 interface
- I2C slave for FM
- Two audio PCM interfaces (input and output)
- Analogue stereo (output only)
3. TECHNICAL BRIEF
AUDIO Stereo
BlueCor -5 F Driver Analogu
F
RF
Radi
UAR
RA
2 .4
I/O PI Main
RO PMB 8888
Bluetoot R 2 .4 GH
Antenn IN / OU
Radi
MM
I2S(PCM
Processo
VBT_2V
Figure 21. Bluetooth / FM Radio Block Diagram
3.18 FM Radio
• Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel
3. TECHNICAL BRIEF
3.19 18pin Multi Media Interface connector

Table 11. Multi media interface pin assign
KM380 series MMI

Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Not used
4 HS_OUT_L Headset left sound
5 HS_OUT_R Headset Right sound
6 USB_DP USB_DP
7 UDB_DM USB_DM
8 JACK_DET Headset detect (active low)
9 VBAT Battery voltage
10 VBAT Battery voltage
11 RPWRON_EN Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR Not used
15 VBUS_USB USB VBUS
16 UART_Tx UART Tx
17 UART_Rx UART Rx
18 GND Power GND
3. TECHNICAL BRIEF
2V62_VIO
NCS2200SQ2T2G
18PIN IO CONNECTOR
C200 R200
0.1u
1M
U200 5
4 VIN-
1 VCC
HOOK_DETECT OUT GND 3 VIN+
2 2V5_VAUDIO
C201
R201
100p
330K VBUS_USB 2V62_VIO 2V5_VAUDIO VCHG VBAT
R202
1.5K
C202 0.1u
HS_MIC_N
39p
10u
ICVFP10181E301FR
FM_ANT
FL200
GND2
OUT
R203
C203
C204
2.2K
VBUS_USB
GND1
100nH
L200
C205
IN
HS_MIC_P 24p
C206 0.1u
100K
CN200
10K
DNI
DNI
R227
C207 C208
DNI
21
27p 27p
R207
R204
R205
R206
19
1
FB200 1800 2
R208 DNI 2 : Headset MIC
FB201 1800 3
JACK_TYPE 3 : Jack type
FB202 1800 4 4 : CTS/HSO_L
FB203 1800 5 5 : RTS/HSO_R
R228 1 6 6 : USB+/Remote_INT/TXD
USB_DP
R229 1 7 7 : USB-/Remote_ADC/RXD
USB_DM
FB206 1800 8 8 : JACK_D
JACK_DET
9
9,10 : BATT
10
RPWRON_EN 11 11 : R/ON
RPWRON_EN
12
12,13 : CHG
13
DSR R210 47 14 14 : DSR
DSR
R230 0 15 15 : VUSB
TX 16 16 : D/ TX
UART_TX
RX R211 47 17 17 : D/ RX
UART_RX
R212 47 18
20
22
HSO_L
(1005,10V,K,X5R)
39p
1u
C214
C215
HSO_R
(1608,25V,K,X5R)
1u
C217 C218
C216
27p 27p
Figure 22. 18 Pin Multi port Circuit Diagram
3. TECHNICAL BRIEF
3.20 General Description

The RF transceiver is integrated in S-GOLDradio(PMB8888),which suppors quad-band operation for
voice and data transfer applications. The whole transceiver function is integrated in main IC, PMB8888
provides 4 LNA inputs for RF receiving and two outputs for PAM input for High/Low band. A direct
conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA
functionality.
Figure 23. PMB 8888 Function Block Diagram
3. TECHNICAL BRIEF
R102
LCD_ID
VBAT
0
R103
DNI
H3
R104
390K
BAT_ID M0
J3
RF_TEMP M1
G4
M2
H4
M7
G3
M8
J4
M9
F4
R107
100K
R108
4.7K
JACK_TYPE M10
W3
TXHB TX2
V3
TXLB TX1
W2
GSM850_RXP RX1
V1
GSM850_RXN RX1X
U1
GSM900_RXP RX2
T1
GSM900_RXN RX2X
R3
PABIAS
R4
PA_BAND PABS
R1
DCS1800_RXP RX3
T5
VDET
U5
PAMODE
P1
DCS1800_RXN RX3X
N4
VC1 FE1
P5
VC2 FE2
M3
PA_EN PAEN
N1
PCS1900_RXP RX4
P3
TX_RAMP VRAMP
M1
PCS1900_RXN RX4X
A18
UART_BT_RTS T_OUT3
J10
UART_BT_CTS T_OUT4
H11
TOUCH_INT T_OUT5
E13
PA_MODE T_OUT6
B19
RPWRON T_OUT7
K9
LIN_PWM_FRQ T_OUT8
G19
CHG_EN CLKOUT0
X100
NX3225SA U4
REFR
4 W7
GND2 HOT2 3 XOX
1 HOT1 W8
GND1 2 XO
26MHz
V10
SIM_DATA CC_IO
U9
SIM_CLK CC_CLK
V9
SIM_RST CC_RST
Figure 24. S-GOLD Radio Circuit Diagram
3. TECHNICAL BRIEF
3.21 Receiver part
Figure 25. Receiver Block Diagram of S-GOLDradio
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 25). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
3. TECHNICAL BRIEF
3.22 Transmitter part

The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure26). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information.
The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The
divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining
amplitude and phase information. The output of the amplitude modulator is connected to a single
ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM
supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power
control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK
mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the
baseband ramping DAC.
In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping
functionality is assured by an on-chip ramping generator, whereas output power is controlled by the
PGA’s as described above.
3. TECHNICAL BRIEF
Figure 26. Transmitter Architecture Block Diagram
3.23 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup.
The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz)
and operates at double or four times transmit or receive frequency. To cover the wide frequency range
the VCO is automatically aligned by a binary automatic band selection (BABS) before each
synthesizer startup.
3. TECHNICAL BRIEF
3.24 DCXO
The transceiver contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the crystal itself. The
overall pulling range of the DCXO consists of eight subranges. The subrange closest to the ‘0ppm’ at
the middle AFC-value is selected during the calibration process in the mobile’s production and is used
for the rest of the lifetime. The frequency tuning is performed along the selected subrange by
programming the frequency control word (XO_TUNE) via the three wire bus (“3Wbus”).
3.25 Front End Module control

Implemented in the Transceiver are two outputs for direct control of front end modules with two logic
input pins to select RX- and TX-mode as well as low- and high band operation.
RF
VC1
C622
33p
VC2
C627
33p
16
10
12
14
15
18
19
20
9
CN600
VC1
VC2
GND1
GND2
GND3
GND4
GND5
NC1
NC2
MM8430-2610RB3
C632
4
5 GND3 GND4 6
PAD600 PAD601
GND2
R608 C631 22p

2
OUT
1
ANT U601
IN
GSM1800_1900TX
17
GND1
0 6p
GSM850_900TX
LMSP43NA-782
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM850RX1
GSM850RX2
GSM900RX1
GSM900RX2
PAD602
3
C633 L605 L604

0.5p 22nH NA
1
2
3
4
5
6
7
8
11
13
C634
0.5p
C641
C643 C644 C645 DNI
C646 C647 C648 C649 C650
VC1 VC2 2.5p 2.5p 3.9p 3.9p 3.3p 3.3p 5.6p 5.6p
PIN 14 PIN 13
GSM850_EGSM TX H L
L608 L609
L607 L610
DCS_PCS TX L H
22nH 18nH 5.1nH 5.6nH
GSM850 RX L L GSM900
GSM850 DCS1800 PCS1900
EGSM900 RX L L
DCS1800 RX L L
PCS1900 RX L L
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
DCS1800_RXP
DCS1800_RXN
PCS1900_RXP
PCS1900_RXN
Figure 27. FEM Circuit Diagram
3. TECHNICAL BRIEF
3.26 Power Amplifier Module

VBAT
C629 C628 C630

1u 10u 27p
TQM7M5005 U600
15 7 R609 1
PGND GSM850_900_IN TXLB
3NA-782
8 6 R610 1
GND3 TX_EN PA_EN
11
GND2
14 5 R611 10K
GND1 VRAMP TX_RAMP
9 4
BY_CAP2 VBATT
L606
13 3 R612 1
BY_CAP1 BS PA_BAND
1.2nH C635
C634 10 2 R613 1
0.5p 0.5p GSM850_900_OUT MODE_SELECT PA_MODE
12 1 R614 1
DCS_PCS_OUT DCS_PCS_IN TXHB
C636 C637 C638

R615 C639 C640 DNI DNI 47p
0.01u 0.01u
1nH
C641 C642
DNI 1p
650
.6p
Figure 28. Power Amplifier Circuit Diagram
Table 10 PAM pin description
Pin Mame Description

1 MODE GMSK/EDGE Power control mode. L=GMSK, H=EDGE
2 DCS/PCS_IN RF input(DCS/PCS) DC Blocked
3 BS Band Select
4 REVD1 Reserved
5 VBATT DC Supply
6 VRAMP Analog PA Bias Control(All Bands, EDGE Mode)
Analog Output Power Control(All Bands, GMSK Mode)
7 GSM_IN RF input(EGSM) DC Blocked
9 GSM_OUT RF Output(EGSM) DC Blocked
10,11 GND Ground
12 REVD2 Reserved
13,14,15 GND Ground
16 DCS/PCS_OUT RF Output(DCS/PCS) DC Blocked
Pad GND PAD GRID Ground pad grid is device underside.
4. PCB layout
4. PCB layout
4.1 Main PCB component placement
Main PCB Top Main PCB Top placement
4. PCB layout
Main PCB bottom Main PCB bottom placement
4. PCB layout
Back
u p battery
Vib
rator PA
D Bluetoothntenna
A
Speake
r
MMI PA
D
Connector
a
Hll Efe
f ct S/W Vib
rator
Bluetooth
& FMdio
raChip
Camera
Connector
Battery Connector
Ke
y Encoder
SIM Connector Memory
Pow
er Ind
uctor
BBP
Micro SD
Main F
PCB Conn. Socket
PA
M FE
M
MobileSw
itch
MIC
4. PCB layout
KEY PCB Top
Main FPCB Conn.

LCD Conn.
Touch FPCB Conn.
KEY PCB Bottom
5. Trouble shooting
5. Trouble shooting
5.1 Trouble shooting test setup
Equipment setup
Power on all of test equipment
-Connect PIF-UNION JIG or dummy battery to the DUT for power up.
-Connect mobile switch cable between Communication test set and DUT when you need to make an
phone call.
-Follow trouble shooting procedure
5. Trouble shooting
5.2 Power on Trouble

Check Points
-Battery Voltage( Need to over 3.35V)
-Power-On Key detection (PWRON signal)
VBAT
END
KB100
R112 150
END_KEY
VA100
EVL14S02200
Remote Power On
2V0_VRTC
RPWRON_EN
330K
R219
R220
2K
R221
PWRON
R223 3.3M
1 2 3 TP1
RPWRON C226
2K 10u
R225
100K
6 5 4 EMX18
Q201
END_KEY_IN
END
END_KEY_IN
KEY_COL7
R222
END_KEY
10K
100K
R224
KEY_ROW6
5. Trouble shooting
START
Connect power
supply to the DUT
Vbat = over 3.35V
Yes
Check No
ìPWRONî si gnal of Check the
TP1 2.0V BACKUP Battery
Yes
Check R112 when No Check solder R112

push the power key or
Replace Dome Switch
(PWR key) PWR key
Yes
TP1
Check No Check solder Q201

ìPWRONî signal of Q201
TP1 0V
Yes
Check the all LDOís No

output Check solder whole LDO
Is it correct? parts or replace it
TP2
Is the 26MHz X100
No
clock from TP2 Check solder
X100 of U102 ? Replace X-TAL
Replace main PCB
5. Trouble shooting
5. Trouble shooting
5.3 Charging trouble

Check Points
-Connection of TA (check TA voltage 5.6V)
-Charging Current Path component voltage drop
-Battery voltage
1 Charging method : CC-CV

2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 420 mA
5 CV voltage : 4.2 V
6 Cutoff current : 100 mA
7 Full charge indication current (icon stop current) : 100 mA
8 Recharge voltage : 4.15 V
4.2V~3.75V 3.75V~3.64V 3.64V~3.45V 3.45V~3.35V
VCHG VBAT
CHARGING IC OVP
TP1
ICVFP10181E301FR
FL200
GND2
OUT
VBAT VCHG_OVP VBUS_OVP

GND1
IN
U201 ISL9221
CN200
1
PGND
13
TP2
R226
R209
100K
VDC
DNI
12
21 2
VDC_BYP
19 VUSB
11
BAT
1 3
_PPR
10
FB200 1800 2 4
USB_BYP
FB201 1800 3 EOC _CHG
9
IVDC
FB202 1800 4 CHG_EN
5
_EN
8
FB203 1800 5 6
GND
R228 1 6 IMIN
7
(1005,10V,K,X5R)
IUSB
(1608,25V,K,X5R)
(1608,25V,K,X5R)
(1005,10V,K,X5R)
(1005,10V,K,X5R)
R229 1 7
FB206 1800 8
R215
100K
R213
R216
R214
C209 C210 C211 C212 C213

10K
33K
16K
9
1u 1u 1u 1u 1u
10 (1%) (1%) (1%)
11
12
13
47 14
R230 0 15
16
47 17
47 18
20
22
(1005,10V,K,X5R)
39p
1u
C214
C215
5. Trouble shooting
START
Yes
18pin IO(CN200) No Resolder the

Is soldered ? CN200
TP1
Yes
Source pin The TA can be

No broken
(TP1) of FL200
= 5.6V ? Change other TA TP2
then retest
Yes
Output pin No Check solder

(TP2) U201 or replace it
of C212=4.2V?
Yes
No charging until
Battery voltage battery
is over 3.35V? Voltage goes up to
3.35V
Yes
Charge is operating properly
5. Trouble shooting
5.4 LCD display trouble

Check Points
-LCD assembly status ( LCD FPCB, Connector on FPCB)
-EMI filter soldering
-Connector combination
MAIN To FPCB Connector
VBAT 2V62_VIO 2V8_VVIB
FL400 ICVE10054E250R201FR
1 9
INOUT_A1 INOUT_B1 IF_MODE3
2 8
END_KEY INOUT_A2 INOUT_B2 LCD_ID
3 7
INOUT_A3 INOUT_B3 DIF_RESET
4 6
SUB_KEY_BL INOUT_A4 INOUT_B4 DIF_VSYNC
CN400
KEY_ROW4
G1
G2
1 40
KEY_ROW5
2 39
5
10
KEY_ROW6
3 38
KEY_COL4
4 37
KEY_COL5
5 36
KEY_COL6
6 35 FL401 ICVE10054E250R201FR
KEY_COL7
7 34 1 9
INOUT_A1 INOUT_B1 DIF_RD
8 33
C405
C406
C407
C408
C409
C410
C411
C412
2 8
INOUT_A2 INOUT_B2 DIF_WR
9 32 3 7
INOUT_A3 INOUT_B3 DIF_CD
10 31 4 6
INOUT_A4 INOUT_B4 DIF_CS
27p
27p
27p
27p
27p
27p
27p
27p
11 30
G1
G2
12 29
13 28
5
10
14 27
15 26
16 25
17 24 FL402 ICVE10054E250R201FR
FL403 ICVE10184E150R101FR 18 23 1 9
INOUT_A1 INOUT_B1 DIF_D(0)
1 9 19 22 2 8
TOUCH_SCL INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 DIF_D(1)
2 8 20 21 3 7
TOUCH_SDA INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 DIF_D(2)
3 7 4 6
TOUCH_INT INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 DIF_D(3)
4 6
DBB_BL_PWM INOUT_A4 INOUT_B4
G1
G2
G1
G2
5
10
5
10
Socket 1
9
RCV_P INOUT_A1 INOUT_B1 DIF_D(4)
2 8
RCV_N INOUT_A2 INOUT_B2 DIF_D(5)
3 7
4 6
G1
G2
5
10
Check the connection LCD FPCB connector
Check signal flow via EMI filter
The LCD backlight enable signal

(SUB PCB)
5. Trouble shooting
START
Check LCD connector

combination then LCD test
with New LCD
No
Is LCD FPCB Replace LCD FPCB
normal?
Yes
Signal is normal on No Check solder and

2.62V Signal repair
FL400, FL401, Damaged filter
FL402,FL403,FL404
Yes
Assemble
FL400,401,402,403,404
5. Trouble shooting
5.5 Camera Trouble

Check Points
-Connectors combination
-FPCB status
CAMERA POWER
U500 RT9011-MGPQW
1 8
VIN VOUT1
2 7
CAM_PWR_EN EN1 VOUT2
PGND
3 6
EN2 NC2
100K
4 5
NC1 GND
C550
9
EUSY0319001
1u C551 C552
R525
2.2u 2.2u
CAMERA CONNECTOR
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
1V8_VCAM 2V8_VCAMIO
R505 10
CAM_D(7)
R506 10
CAM_D(6)
R507 10
CAM_D(5)
FB500 R509 10
CAM_D(4)
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
CN500
G2 G1
24 1
C500
C501
C502
C503
C504
C505
C506
C507
23 2
R510 10 22 3
I2C_SCL
R511 10 21 4
I2C_SDA
R512 10 20 5
CAM_VS
R513 10 19 6 R514 10
CAM_HS CAM_D(3)
10 R515 18 7 R516 10
CAM_MCLK CAM_D(2)
17 8 R517 10
CAM_D(1)
16 9 R518 10
CAM_D(0)
15 10
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
14 11
13 12
C518
C519
C520
C521
C522
C523
C524
C525
C535
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
G4 G3
1u
ENBY0020401
AXK7L24227G R519 10
CAM_PCLK
R520 10
CAM_RST
R521 10
CAM_PWDN
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
C536
C537
C538
C539
C540
C541
Check the connector combination
5. Trouble shooting
START
Check camera connector,

24pin main connector
Combination then Camera test
With equipped camera module
Yes
Replace New No
Replace
Camera module Main
Working properly? PCB
Yes
Replace Camera module
Yes
Assemble
5. Trouble shooting
5.6 Receiver & Speaker trouble

Check Points
-Speaker pin contact
-Audio amp soldering
-SUB PMIC soldering
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
0
R300
C301 C302
1u 1u
C304 1u
A3
B1
C5
VSS
VDD
PVDD
A4
C1N
C305 1u A5 A1 R313 0 HSO_R

C1P HPR
TP1C308 1u D1
HPL
A2 R314 0 HSO_L
BB_SND_R INA2
C309 1u D2
BB_SND_L INA1
U303
FM_SND_R TP2C311
C312
1u
1u
C1
C2
INB2 MAX9877AEWP_TG45
D5
FM_SND_L INB1 OUT+ SPK_P
B2 B5
BIAS OUT- SPK_N
B3
i2C_SDA SDA
C3
I2C_SCL SCL
D4
RXIN+
PGND
B4
GND
RXIN-
C315
1u
D3
C4
SPK
MAIN RECEIVER
L500 TP3 CN501
SPK_P
100nH 1
R100 0 TP5 +
RCV_P OUT100
C542
2 R102 0
100p OUT101
L501 TP4 RCV_N
SPK_N
100nH
TP6 -
EVLC18S02015
EVLC18S02015
C544 C545 C101 C102

VA500
VA501
47p 47p 47p 47p
5. Trouble shooting
START
Check Speaker tension and

Contacts are clear.
TP4
Input Signal ( TP1, Yes TP3
Replace Main Board
TP2) is Low(0V)?
No
Check the soldering status

Of U303 of main -board
TP4
Output Signal( TP3, Yes Replace U303 of TP3

TP4) is Low(0V)? main -board
No
Receiver Signal( TP5,

TP6) High(1.6V)? Replace Receiver
Replace Main PCB

TP5 TP6
Assemble
5. Trouble shooting
5.7 Microphone trouble

Check Points
-Microphone hole
-MICBIAS & Signal come from
-Audio signal level of the Microphone
-Soldering of components
MIC MICBIAS
TP3
100nH
C321 L302
39p
TP1 C320
L304
1
MIC300
MIC_N P
C319 100nH 2
22n G1
39p 3
G2
4
O
TP2 C318
L303
SPU0409HE5H-PB
MIC_P
22n 100nH
C317
39p
EVLC14S02050
VA300 C322
10u
STA
RT
Ch
eck micropho
ne sound
ho
le
eYs
TP1
No TP2
Mic bias ON Ch
eck mic
. Bias
.5V)
(2 we
hn line
call?(TP3,L302) TP3
Ye
s
No Replace
Check e th
sign
al microph
one
level at (TP1,2 )each (MIC300)
side of MIC300.
eYs
Replace Main PCB
5. Trouble shooting
5.8 Ear-MIc Jack Detection trouble
START
Check the Ear-Jack detection.
Check the soldering No Resoldering or

status of CN200 Replace CN200
Yes
Is the status of No Resolder FB202,

FB202, FB203( TP1,2)
FB203
low?
Yes
The main board has a

problem
Replace Main PCB
Assemble
TP1
TP2 CN200
5. Trouble shooting
5.9 Vibrator trouble

Check Points
-Connectors combination
MOTOR CIRCUIT
VBAT 3V0_VMOT
C300
1u U300 R1114D301D-TR-F
TP4
1 3
VDD VOUT
1u
4 2
NC GND1
6 5
VIB_PWR_EN CE GND2
C303
R301
100K
3V0_VMOT
3V0_VMOT
C307 2200p
R302 100K
C313
1u
R303 0 1
U301 TC7SZ86FU
5
TP3R304 1
U302 TPA6205A1DRBR
6
LIN_INVERT
LIN_PWM_FRQ
R305 0 2
3
IN_B
IN_A
VCC
4
VIB_PWR_EN
R306 0
_SHUTDOWN VDD L300
100nH
TP1VIB-
2 8 OUT300
GND OUT_Y BYPASS VO-
130K
3 5 OUT301
IN+ VO+
1
U304 TC7SZ86FU
5
4
IN- GND
7
9
L301
100nH
TP2VIB+
IN_B VCC PGND
R307 0 2
LIN_PWM_MAG IN_A R308
3 4
GND OUT_Y C314 R309 100K
130K 0.01u
C316 2200p
TP4
TP3
TP1 TP2
5. Trouble shooting
START
Check Vibrator Connector

Combination
Check the signal of

No Check the soldering
OUT300,OUT301
(TP1,2) of U302,L300,L301
176Hz 2Vp-p PWM?
Yes
Check the signal of No

C303 (TP4) Check the soldering
Voltage is 3.0V? of U300
Yes
Check the signal of

R304 (TP3) Resoldering of
Voltage is 2.6V? Replace U102
Yes
Replace Vibrator
Assemble
5. Trouble shooting
5.10 Keypad back light trouble

Check Points
-Signal path is connected well
-TR is working properly
QWERTY_KEY BACKLIGHT
VBAT
R310
LEWWS44-E LD300 47
R311 TP1
QWERTY_KEY_BL
LEWWS44-E LD301 47
R312
LEWWS44-E LD302 47
ICVN0505X150FR
VA301
MULTI_KEY BACKLIGHT
VBAT
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
C101 C102
1u 1u
R103
R104
R105
R106
R107
R108
R109
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LD100
LD101
LD102
LD103
LD104
LD105
LD106
R110
TP2 Q100
SUB_KEY_BL
2SC5585
1K
R111
10K
TP1
TP2
5. Trouble shooting
START
Check All of LEDs solder
No
Check VBAT Check BATTERY
Yes
check GPIO No
signal(SUB_KEY_BL Replace TR(Q100)
,TP2) Voltage of
Q100 > 0.7v
check GPIO No
signal(QWERTY_KE Resolder or
Y_BL, TP1) Voltage Replace VA301 or U102
of VA301 < 1.0v
Yes
KEY_LED is operating
5. Trouble shooting
5.11 SIM & USD trouble

SIM Check Points
-Power is working
-Socket soldering
-Proper SIM is used
SIM CONNECTOR
2V9_VSIM 2V9_VSIM
TP2
2V9_VSIM
R522
R523
DNI
15K
4
J500
1
TP2
C5 C1
TP3 5
6
C6 C2
2
3
TP1 SIM_RST
10 7
GND4 GND1
9 8
GND3 GND2
C546 C543 C547 C548
DNI 220n 22p 1000p
TP1 TP3
SIM_CLK SIM_DATA
5. Trouble shooting
START
Check All of SIM card voltage

KS360 Series support
1.8V & 2.9V SIM only
6 pins are No
soldered well? Resolder pin
Yes
Check Proper Yes

Replace Main
SIM Card Board
Assemble
5. Trouble shooting
uSD Check Points

-Power is working
-Socket soldering
-Card detect is working
2V62_VIO 2V9_VMMC
100K
100K
100K
100K
100K
100K
2V9_VMMC
S500 AXA463062P
R500
R508
R501
R502
R503
R504
TP1
MMC_D1 DAT1_2
MMC_D0
TP2 DUMMY1
DAT0
VSS
MMC_CLK CLK
MMC_CMD TP2 VDD

CMD
MMC_D3 CD_DAT3
TP4 DUMMY2
MMC_D2 DAT2
MMC_DET DETECT_A
DETECT_B
DUMMY3
C534 GND
C526 C527 C528 C529 C530 C531 C532 C533
27p 27p 27p 27p 27p 27p 27p 27p
1u
Card insert Card eject
5. Trouble shooting
START
Check Micro SD card voltage

(2V9_VMMC)
Resolder it
No (check data line
TF socket pins
are well soldered uSD D0~D3
(TP1~4)is 2.9V
Yes
Yes
Check proper Replace Main Board
uSD?
Assemble
5. Trouble shooting
5.12 Touch trouble

Touch Check Points
-Power is working
-Connector soldering
-Touch IC soldering
(* After press the touch hot key, Touch key will works )

1 9
INOUT_A1 INOUT_B1 IF_MODE3
2 8
END_KEY INOUT_A2 INOUT_B2 LCD_ID
3 7
INOUT_A3 INOUT_B3 DIF_RESET
4 6
SUB_KEY_BL INOUT_A4 INOUT_B4 DIF_VSYNC
CN400
KEY_ROW4
G1
G2
1 40
KEY_ROW5
2 39
5
10
KEY_ROW6
3 38
KEY_COL4
4 37
KEY_COL5
5 36
KEY_COL6
6 35 FL401 ICVE10054E250R201FR
KEY_COL7
7 34 1 9
8 33
C405
C406
C407
C408
C409
C410
C411
C412
2 8
9 32 3 7
10 31 4 6
27p
27p
27p
27p
27p
27p
27p
27p
11 30
G1
G2
12 29
13 28
5
10
14 27
15 26
16 25
17 24 FL402 ICVE10054E250R201FR
FL403 ICVE10184E150R101FR 18 23 1 9
1 9 19 22 2 8
2 8 20 21 3 7
3 7 4 6
4 6
G1
G2
G1
G2
5
10
5
10
Socket 1
9
RCV_P INOUT_A1 INOUT_B1 DIF_D(4)
2 8
3 7
4 6
G1
G2
5
10
TP8
TP5
TP6
TP7
5. Trouble shooting
START
TP5
TP8
TP6
Check Touch Connector
Combination TP7
Check the voltage No Resolder FL403 or

of TP1~4. Voltage is
2.8V? Replace Main Board
Yes
Check the voltage No

Replace Main or
of TP5~8. Voltage is
SUB FPCB
2.8V?
Yes
Touch IC is well
Rosolder Touch IC
soldered?
Yes
Chan ge the Touch window

Yes
Assemble
TP4
TP1~ 3
5. Trouble shooting
5.13 Qwerty Key trouble

Key Check Points
-Dome switch contacts
-Key coder IC soldering
2V62_VIO
QWERTY KEY
KEY_I2C_SDA
TP4
C400 2V62_VIO
0.1uF
2V62_VIO
TP3
0
R400
120K
(1%) R402
4.7K
C401 0.1uF
R401
29
28
27
26
25
24
23
22
PGND
GND2
RESETB
XI
XO
CLK_SEL
VDD
P10
27p
27p
27p
C402
C403
C404
1 21 R403 470
TEST P40 KEY_ROW0
2 20 R404 470
SEL_28P P41 KEY_ROW1
R405 470 3 19 R406 470
R407 470 4 U400 18 R408 470
R409 470 5 PP2106M2 17 R410 470
R411 0 6 16 R412 470
KEY_INT
KEY_I2C_SCL
TP1 R413 0 7
P17
P15
P45
P46
15 R414 470
KEY_ROW5
KEY_ROW6
TP2
GND1
P54
P53
P52
P51
P50
P47
2V62_VIO
R415
C413
C414
C415
C416
C417
C418
C419
8
9
10
11
12
13
14
4.7K
27p
27p
27p
27p
27p
27p
27p
C420 27p
C421 27p
C422 27p
C423 27p
C424 27p
470
470
470
470
470
R416
R417
R418
R419
R420
KEY_COL4
KEY_COL3
KEY_COL2
KEY_COL1
KEY_COL0
5. Trouble shooting
START
Check the Dome switch

contacts are clear
Check the voltage No Resolder or Replace

of TP1~4. U400
Volta ge is 2.6V?
Yes
Check soldering No Resolder the

of components of component
U400
Assemble
TP2
TP1
TP3 TP4
Dome
h
w
istc
Fig 6 Waveform of DCXO
5. Trouble shooting
5.14 Trouble Shooting of Receiver Part
START
Setup Test Equipment

Cell Power : ñ74dBm
EGSM CH30
DCS CH699
VCTCXO
Check point
VCTCXO MobileSW&FEM
PLL
Check point
PLL Control
Check point
Mobile SW & FEM
Re-Download S/W & CAL
Main PCB Bottom
5. Trouble shooting
5.14.1 Checking DCXO Circuit
Is the waveform No
X100 Replace X100
of 1pin Similar to Fig.6?
Yes
DCXO Circuit is OK.

See next page to check
PLL Circuit.
1pin : 26MHz
DCXO
G19
CHG_EN CLKOUT0
X100
NX3225SA U4
REFR
4 W7
GND2 HOT2 3 XOX
1 HOT1 W8
GND1 2 XO
26MHz
V10
SIM_DATA CC_IO
U9
SIM_CLK CC_CLK
SIM_RST
V9
CC_RST 1pin
1pin
DCXO Cicuit DCXO Waveform
5. Trouble shooting
5.14.2 Checking Mobile SW & FEM
TP1
VC1
RF C622
33p
TP2 VC2
C627
33p
16
10
12
14
15
18
19
20
9
CN600
VC1
VC2
GND1
GND2
GND3
GND4
GND5
NC1
NC2
MM8430-2600RB3
C632
TP10
4
5 GND3 GND4 6
PAD600 PAD601
GND2
R608 C631 22p

2
OUT
1
ANT U601
IN
GSM1800_1900TX
17
GND1
0 5p
TP9
GSM850_900TX
LMSP43NA-782
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM850RX1
GSM850RX2
GSM900RX1
GSM900RX2
PAD602
3
C633 L605 L604

0.75p 12nH NA
1
2
3
4
5
6
7
8
11
13
C634
0.5p
TP5,6,7,8
Mobile SW & FEM Circuit
TP10
TP9
CN600
TP2_C625 (ANT_SW2)
U600
TP1_C621 (ANT_SW1)
TP5~8
Mobile SW & FEM Check Points
RX Mode EGSM DCS PCS

ANT_SW1 Off Off Off
ANT_SW2 Off Off Off
FEM RX Control Logic
5. Trouble shooting
Check TP10 of CN600

with RF Cable and TP9 of C631
TP10 Signal No
Replace Mobile SW
same as TP9? (SW401)
Yes
Check TP1, TP2 of U600 ?
Yes
Control Signal is No Check PMB8888

OK ?
Yes
TP5~8 Signal is No
Replace FEM (U600)
OK ?
Yes
Mobile SW & FEM is OK.

Check Antenna.
EGSM RX
ANT SW1
ANT SW2
Mobile SW FEM Control Signals
5. Trouble shooting
5.15 Trouble Shooting of Transmitter Part
Setup Test Equipment

Cell Power : ñ74dBm
EGSM CH30
DCS CH699
Check point
DCXO
Check point
Transceiver
Check point
DCXO
PA Control
Signal FEM & MS
Transceiver
PowerAmp
Check
FEM & Mobile
SW
Re-Download S/W & RF

CAL
Main PCB Bottom
5.15.1 Checking DCXO Circuit

See RX Part “1. Checking DCXO Circuit”
5. Trouble shooting
5.15.2 Checking Transceiver Output Signals
TQM7M5005 U600 TXLB

15 7 R609 1
8 6 R610 1
GND3 TX_EN PA_EN
11
GND2
14 5 R611 10K
GND1 VRAMP TX_RAMP
9 4
BY_CAP2 VBATT
13 3 R612 1
BY_CAP1 BS PA_BAND
10 2 R613 1
GSM850_900_OUT MODE_SELECT PA_MODE
12 1 R614 1
C636 C637 C638

DNI DNI 47p
TXHB
Transceiver Output Circuit
TXLBTXHB
MODE Transceiver Output

GSMK Fixed
8PSK Ramp Burst Control
Transceiver Output Operation
5. Trouble shooting
Check Output Signal

(TP1, TP2)
N0 Replace
Signals are PMB8888(U102)
Normal ?
Yes
Transceiver is OK.
PAM Control Circuit.
TXLB (MODE: GMSK) : TP1 TXLB (MODE: 8PSK) : TP1
Transceiver Output (GMSK) Transceiver Output (8PSK)
5. Trouble shooting
5.15.3 Checking PAM Control Signals
TQM7M5005 U600
15 7 R609 1
PA_EN
8 6 R610 1
GND3 TX_EN PA_EN
11
GND2
TX_RAMP
14 5 R611 10K
GND1 VRAMP TX_RAMP
9 4
BY_CAP2 VBATT
13 3 R612 1
BY_CAP1 BS PA_BAND
PA_MODE
10 2 R613 1
GSM850_900_OUT MODE_SELECT PA_MODE
12 1 R614 1
C636 C637 C638

DNI DNI 47p
PAM Control Signals
PA_MODE
TX RAMP
PA_EN
Transceiver Output
MODE MODE PA_LEVEL TXON_PA

GMSK LOW Ramp Burst Control HIGH
8PSK HIGH Control Amp bias HIGH
PAM Mode Operation
5. Trouble shooting
Check Control Signals

(TP1, TP2, TP3)
No Check
Signals are
PMB8888(U102)
Normal ?
Yes
PAM Control Signal is

OK.
FEM & Mobile SW Circuit.
GSMK Control Signal 8PSK Control Signal
TP2(PA EN)
TP1(TX RAMP)
TP1(TX RAMP)
TP2(PA EN)
TP3(PA MODE)
TP3(PA MODE)
TP3(PA MODE) : R616

TP1(TX RAMP)
TP1(TX_RAMP) : R612
TP2(PA_EN) : R614
TP2(PA EN)
TP3(PA MODE)
5. Trouble shooting
5.15.4 Checking FEM & Mobile SW
TP1
VC1
RF C622
33p
TP2 VC2
C627
33p
16
10
12
14
15
18
19
20
9
CN600
VC1
VC2
GND1
GND2
GND3
GND4
GND5
NC1
NC2
MM8430-2600RB3
C632
TP10
4
5 GND3 GND4 6
PAD600 PAD601
GND2
R608 C631 22p

2
OUT
1
ANT U601
IN
GSM1800_1900TX
17
GND1
0 5p
TP9
GSM850_900TX
LMSP43NA-782
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM850RX1
GSM850RX2
GSM900RX1
GSM900RX2
PAD602
3
C633 L605 L604

0.75p 12nH NA 1
2
3
4
5
6
7
8
11
13
C634
0.5p
TP5,6,7,8
Mobile SW & FEM Circuit
TP10
CN600 TP9
TP2_C625 (ANT_SW2)
U600
TP1_C621 (ANT_SW1)
TP5~8
Mobile SW & FEM Checking Points
TX Mode EGSM DCS PCS

ANT_SW1 On Off Off
ANT_SW2 Off On On
FEM TX Control Logic
5. Trouble shooting
Check TP6 of CN600

with RF Cable and TP9 of C631
TP10 Signal No
Replace Mobile SW (CN600)
same as TP10?
Yes
Check TP1, TP2 of U600 ?
Yes
Control Signal is No Check PMB8888(U102)

OK ?
Yes
No
TP9 Signal is
OK ? Replace FEM (U600)
Yes
Mobile SW & FEM is OK.

Check Antenna.
EGSM TX
TP1(ANT SW1)
TP2(ANT SW2)
Mobile SW FEM Control Signals
6. Download & S/W upgrade
6.1 S/W download setup
S/W download & upgrade setup
Preparation
• Target terminal
• PIF-Union
• RS-232 Cable and PIF-UNION to Phone interface Cable
• Power Supply or Battery
• PC supporting RS-232 with Windows 2000 or newer.
If you are going to use battery, the voltage of the battery should be over 3.7V for stable power
supplying during S/W download.
6.2 Download program user guide
6.2.1 After “GSMULTI” folder copy, paste C:\
6.2.2 “MultiGSM.exe” execution file execute
TE365
KS360 TE365
KS360
KS36
6.3 Multi-Download Program Setting(Model-Base)
■ Multi-Download Program Execution → Setting : Configuration
■ Setting Completed
KC550 KC550
TE365
KC550
KC550 TE365
KC550
KC550
■ Stand-by Condition: “Wait phone connecting” confirm → Phone connection
TE365
KS360
KS3 0 TE365
KS360
KS3
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
1V5_VRF2 2V85_VRF3 2V85_VRF3 2V5_VAUDIO 2V8_VVIB 3V1_VUSB 1V5_VRF2 VBAT

OJ102
0.01u
0.01u
220n
120p
C110 220n
0.1u
C100
C109 1u
C111 1u
C106 C107
A C101 2.2u A
2.2u
C108
1u
C103
C104
C105
1u
C102
KDR331V
2V85_VRF3 R100 0
2
VCHG_OVP
2V85_VRF3 3 R101 0
2V85_VRF3 2V9_VAUX 2V62_VIO 2V85_VRF1 1
VBUS_OVP
2V85_VRF1
47nH
D100
47nH
47nH
1V5_VSD1 1V8_VSD2 2V9_VMMC 1V5_VPLL 2V85_VRF3 VBAT 2V9_VSIM
A10
B10
N10
P10
A2
A9
B1
N1
B2
B7
B9
P1
P2
P9
E8
F3
F6
L100
3
L101
VBAT 2V0_VRTC 2V0_VRTC
L102
DATA(0:15)
DNU1
DNU2
DNU3
DNU4
DNU5
DNU6
DNU7
DNU8
DNU9
DNU10
DNU11
NC1
NC2
NC3
NC4
NC5
NC6
ADD(0:12)
0.01u
DATA(0) B3 C7 TP100 ADD(0)
39p
220n
C112
C120 0.01u
C121 0.01u
2.2u
2.2u
DQ0 A0
1u
1u
1u
1u
100p
C113 C114 C127 DQ1 A1
0.1u C117 DATA(2) C3 C9 ADD(2)
B 0.1u 0.1u 1u DQ2 A2 B
C119
C123
C125
C118
C122
C115
C124
C116
C126
DATA(3) D4 B8 ADD(3)
0.1u DQ3 A3
C128
C130
DATA(4) D3 M9 ADD(4)
DQ4 A4
C129 DATA(5) E4 L9 ADD(5)
DQ5 A5
DATA(6) E3 K9 ADD(6)
0.1u DQ6 A6
0.1u
DATA(7) F4 J9 ADD(7)
DQ7 A7
DATA(8) J4 H7 ADD(8) 1V8_VSD2
DQ8 A8
DATA(9) K3 H8 ADD(9)
DQ9 A9
DATA(10) K4 D9 ADD(10)
W19
M11
M10
C10
D11
D12
A19
D18
V19
E12
E11
E18
L11
L12
L10 DQ10 A10
W4
W5
W6
W1
M9
M2
M4
H2
K1
K4
A7
B7
C6
C7
A8
B8
D6
A3
B4
B3
A2
B1
B2
C3
N2
N3
R2
U2
U3
U6
A4
C5
D5
C4
D7
A5
C8
A1
P4
V7
E1
E2
E3
P2
V2
V4
V5
V6
L9
L8
F3
T3
T6
L1
T2
J8
DATA(11) L3 H9 ADD(11)
R102 DQ11 A11
DATA(12) L4 G7 ADD(12) 1V8_VSD2
LCD_ID
VDD_MAIN_1
VDD_MAIN_2
VDD_MAIN_3
VDD_MAIN_4
VSS_MAIN_1
VSS_MAIN_2
VSS_MAIN_3
VSS_MAIN_4
VSS_MAIN_5
VDDP_EBU_1
VSS_MS
VSS_EP
AGND_MS1
AGND_MS2
VDDTX
VDDVCO
VDDTRX
VDDDIG
VDDMS
VDDXO
VDDPLL
VDDRX
VAUDIO
VBAT_AUDIO
VSS_AUDIO
VLED
VAUX
VVIB
VBAT_LDO1
VSS_LDO1
VMMC
VUSB
VBAT_BSW_USB_MMC
VIO
VSIM
VBAT_LDO2
VSS_LDO2
VPLL
VRF2
VDD_RF2PLL
VRF1
VRF3
VBAT_RF13
VSS_LDO3
VSSRF1
VSSRF2
VSSRF3
VSSRF4
VSSRF5
VSSRF6
VSSRF7
VSSRF8
VSSRF9
VSSRF10
VSSRF11
VSSRF12
VSSRF13
VSSRF14
CH_SOURCE
CH_GATE
SENSE_IN1
SENSE_IN2
VDD_REF
VDDCHARGE
CHARGE_UC_SCAN_IN1
VDD_FUSE_FS
NC1
NC2
NC3
VSS_RTC
VDD_RTC
DQ12 A12
VBAT DATA(13) M3
0 DQ13
DATA(14) M4
R103 DQ14
DATA(15) N3
DATA(0:15) DQ15
B4
DNI VDD1
H3 G9
R104
390K
BAT_ID M0 VDD2
J3 R14 TP101 E9 H2
C RF_TEMP M1 EBU_AD0 SDRAM_CS _CS VDD3 C
G4 W18 R105 22 M2
M2 EBU_AD1 SDCLKI VDD4
H4 V18 R106 22 H4
M7 EBU_AD2 SDCLKO CLK
G3 W17 TP102 G8 D2
M8 EBU_AD3 CKE CKE VDDQ1
J4 T15 TP104 F8 F2
F4
M9 EBU_AD4
U14
_WR
D7
_WED U100 VDDQ2
K2
R107
100K
R108
4.7K
JACK_TYPE M10 EBU_AD5 ADD(13) BA0 VDDQ3

Domain Voltage(V) Current(mA) Net Name EBU_AD6
V17
ADD(14)
D8
BA1 K5D1G12ACD-D075
W3 T14 E7
TXHB TX2 EBU_AD7 _RAS _RAS
V3 R13 F7 C2
TXLB TX1 VAUX 2.9 150 2V9_VAUX EBU_AD8 _CAS _CAS VSS1
W2 W16 G3 F9
GSM850_RXP RX1 EBU_AD9 _BC0 LDQM VSS2 C131 C132 C133 C134 C135
V1 V16 H3 G2
GSM850_RXN
U1
RX1X VIO 2.62 100 2V62_VIO EBU_AD10
U12
_BC1 UDQM VSS3
N4
0.1u 0.1u 0.1u 0.1u 0.1u
GSM900_RXP RX2 EBU_AD11 DATA(0:7) VSS4
T1 W15
GSM900_RXN
R3
RX2X VSIM 2.9/1.8 22 2V9_VSIM EBU_AD12
W14 DATA(0) J5 E2
PABIAS EBU_AD13 IO0 VSSQ1
R4 V15 DATA(1) L5 J2 1V8_VSD2
PA_BAND
R1
PABS VMME 2.9/1.8 150 2V9_VMMC EBU_AD14
W13 DATA(2) J6
IO1 VSSQ2
L2
DCS1800_RXP RX3 EBU_AD15 IO2 VSSQ3
T5 N18 DATA(3) L6
D
U5
VDET VUSB 3.1 40 3V1_VUSB EBU_WR_N
P19
_WR
1V8_VSD2 DATA(4) J7
IO3 D
PAMODE EBU_RD_N _RD IO4
P1 N19 DATA(5) L7
DCS1800_RXN RX3X VLED 2.9 10 EBU_BC0_N _BC0
DATA(6)
IO5
N4 P15 J8 B6
VC1 FE1 EBU_BC1_N _BC1 IO6 VCC1
P5 DATA(7) L8 N7
VC2
M3
FE2 VAUDIOa 2.5 220 2V5_VAUDIO IO7 VCC2
PA_EN PAEN
N1 N6
PCS1900_RXP
P3
RX4 VRF1 2.85 150 2V85_VRF1 C6
VCCQ
TX_RAMP VRAMP ADD(0:17) FLASH1_CS _CE
M1
PCS1900_RXN RX4X VRF2 1.5 80 1V5_VRF2 H19 D5
R109
R110
EBU_A0 C136 C137 C138
3.3K
3.3K
ADD(16) ALE
J17 C5
A18
VRF3 2.85 150 2V85_VRF3 EBU_A1
K16
ADD(17)
TP105 E5
CLE
B5
0.1u 0.1u 0.1u
UART_BT_RTS T_OUT3 EBU_A2 _RD _RE VSS5
J10 G18 E6 N5
UART_BT_CTS T_OUT4 VPLL 1.5 20 1V5_VPLL EBU_A3 FCDP R__B VSS6
H11 L16 D6 N8
TOUCH_INT T_OUT5 EBU_A4 R111 _WR _WE VSS7
E13 J19 F5
PA_MODE
B19
T_OUT6 VRTC 2.0 4 2V0_VRTC EBU_A5
J16
M_RESET _WP
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
RPWRON T_OUT7 EBU_A6 1
NC7
NC8
NC9
K9 K17
E LIN_PWM_FRQ T_OUT8 VVIB 2.8 140 2V8_VVIB EBU_A7
K18
E
U102 EBU_A8
G4
G5
G6
H5
H6
J3
K5
K6
K7
K8
M5
M6
M7
M8
N2
N9
G19 L17
CHG_EN CLKOUT0 SD1 1.5 400 1V5_VSD1 EBU_A9
K15
X100 EBU_A10
NX3225SA
4
GND2 HOT2 3
U4
W7
REFR
XOX
PMB8888 SD2 1.8 300 1V8_VSD2 EBU_A11
EBU_A12
L18
M16
W8 J18
1 HOT1 GND1 2 XO SU1 5.6 ... 25 0 ... 120 EBU_A13
M18
26MHz EBU_A14
V10 N15
SIM_DATA CC_IO EBU_A15
U9 L15
SIM_CLK CC_CLK EBU_A16
SIM_RST
V9
CC_RST EBU_A17
L19
M15
EXT_RESET
EBU_A18
U10 M19
MMC_CMD MMCI_CMD EBU_A19
R8 H18
MMC_D0 MMCI_DAT0 EBU_A20 2V62_VIO 2V0_VRTC
R10 R16
MMC_CLK MMCI_CLK EBU_A21
T9 N17
MMC_D1 MMCI_DAT1 EBU_A22
R9 T19
F MMC_D2 MMCI_DAT2 EBU_A23 F
T10 U17
MMC_D3 MMCI_DAT3 EBU_A24
R112
100K
T8
TDO TDO
2V62_VIO T7 R17 1V8_VSD2 U101 TC7SH08FS
TDI TDI EBU_CS0_N FLASH1_CS 5
U8 R19 1 VCC
TMS TMS EBU_CS1_N SDRAM_CS _EXTRST
V8 T17 4
TCK TCK EBU_CS2_N nRESET
W9 P18 3
TRST_N TRST_N EBU_CS3_N PO_RESET GND
R6 R18
R113
R114
RTCK RTCK EBU_ADV_N
3.3K
1K
K19 2
R115 10K EBU_RAS_N _RAS
N5 N16
TRIG_IN EBU_CAS_N _CAS
L5 U18
MON1 EBU_WAIT_N nWAIT
R116 0 M5
MON2
VBAT
1V5_VSD1
26MHZ_BT
TP106
TP107
R7
U7
FSYS3
FSYS2
EBU_SDCLKO
EBU_SDCLKI
U19
U15
SDCLKO
SDCLKI
ON BOARD ARM9 JTAG & ETM INTERFACE
P17
C EBU_BFCLKO C
A14 U16
VBAT_SD1 EBU_BFCLKI
A15 T18
10uH VSD1 EBU_CKE CKE 1V8_VSD2
A13
L103 SD1_FB
C11
SD2_SD1_SUBST
A12 F18 CN100
KDS160E
C140 10u
VSS_SD1 FCDP_RBN FCDP G1 G2

D101
C139 1V8_VSD2 VBAT A16

SD1_FBL
1 30
22u A11 E19 2 29
L104 VBAT_SD2 F32K
A10 D19 3 28
10uH VSD2 OSC32K
B9 F19 X101 4 27
SD2_FB RESET_N nRESET TRST_N
B10 5 26
SD2_FBL TDI
A9 2 1 6 25
KDS160E
VSS_SD2 TMS
C143 10u
D102
C141 B5 C142 32.768KHz 7 24

IREF1 C145 TCK
C12 B6 DNI 8 23
22u SU_GATE A_GND 18p RTCK
B14 A6 C144 9 22
PO_RESET_N_SCAN_OUT2
SU_GND VREF1 18p TDO
B11 10 21
D SU_FB _EXTRST D
ON_OFF_SCAN_RESET
B13 11 20
RESET2_N_VSENSE2
BL1_PWM_VSENSE1
SU_ISENSE
B12 L3 12 19
DIF_RESET2_GPIO
VBAT_SU VREF2
CIF_RESET_GPIO
USIF_RXD_MRST
USIF_TXD_MTSR
C13 L4 13 18
USART0_RTS_N
USART0_CTS_N
VSS_SU IREF2
LPBCK_ECHO
14 17
USART0_RXD
CIF_PD_GPIO
USB_DMINUS
USART0_TXD
MONO_OUTN
MONO_OUTP
VBAT_MONO
FLASH_SINK
USB_DPLUS
VSS_FLASH
CIF_HSYNC
VSS_MONO
CIF_VSYNC
USIF_SCLK
MONO_INN
15 16
MONO_INP
I2S1_CLK0
CIF_PCLK
BL2_PWM
BL3_PWM
I2S1_WA0
CLKOUT2
DSPOUT0
KP_OUT0
KP_OUT1
KP_OUT2
KP_OUT3
I2C_SDA
DIF_CS1
DIF_CS2
I2C_SCL
I2S1_RX
I2S1_TX
DIF_WR
C147
MIC1_N
MIC2_N
DIF_CD
DIF_RD
DIF_HD
MIC1_P
MIC2_P
DSPIN0
DSPIN1
DIF_VD
KP_IN1
KP_IN2
KP_IN3
KP_IN4
KP_IN5
KP_IN6
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
CIF_D0
CIF_D1
CIF_D2
CIF_D3
CIF_D4
CIF_D5
CIF_D6
CIF_D7
EP_CM
C146 R117
R118 G3 G4
HS_N
EP_N
HS_P
EP_P
VMIC
220n 1u 100K
22K
E17
G15
G17
C19
G16
C18
H15
F16
K11
K8
C17
J9
H10
F15
H16
F17
V14
U13
T12
T13
R11
R12
V13
T11
W12
V12
V11
U11
W11
W10
A17
B16
B17
D17
B15
K12
C14
C15
D14
D13
K2
G2
F2
J2
K3
F1
G1
J1
H1
L2
E4
D1
D2
D3
C2
C1
J12
E14
D15
J11
F5
G5
C16
E16
H9
P16
M17
B18
H17
J15
K10
J5
K5
H5
D10
E10
E8
E7
E6
D8
D9
E9
C9
C150
39p
PO_RESET
DNI
M_RESET
C151
39p
PWRON
E E
R119
C152
C148 C149
39p
DNI DNI
UART
C153
39p
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
DIF_CS
BT_INT
DIF_CD
DIF_WR
DIF_RD
EOC
DIF_VSYNC
DSR
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
CAM_HS
CAM_VS
CAM_MCLK
CAM_PWDN
CAM_RST
KEY_I2C_SCL
KEY_I2C_SDA
DIF_RESET
BT_RESET
IF_MODE3
VIB_PWR_EN
CAM_PWR_EN
LIN_INVERT
TOUCH_SCL
TOUCH_SDA
BB_SND_L
BB_SND_R
RCV_N
I2S1_CLK
I2S1_RX
I2S1_TX
I2S1_WA0
UART_BT_TX
UART_BT_RX
BT_VCXO_EN
USB_DP
USB_DM
UART_RX
UART_TX
MMC_DET
HOOK_DETECT
JACK_DET
CLK32K
SLIDE_OPEN
DBB_BL_PWM
LIN_PWM_MAG
SUB_KEY_BL
QWERTY_KEY_BL
KEY_INT
CAM_PCLK
UART
3G 2.5G
1
GND GND
2
RX RX UART_RX
3 2V62_VIO
RCV_P
MIC_N
MIC_P
HS_MIC_N
HS_MIC_P
MICBIAS
TX TX UART_TX
4 VCHG
VCHAR NC1
5 R120 2.2K
ON_SW ON_SW RPWRON_EN
6 R121 2.2K
VBAT VBAT VBAT
7 VBUS_USB
PWR NC2
8
URXD NC3 USB_DM
9
F UTXD NC4 USB_DP
10
I2C_SCL
I2C_SDA
DSR DSR
11
RTS
12
CTS
1 2 3 4 5 6 7 8 9
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
2V62_VIO
NCS2200SQ2T2G
18PIN IO CONNECTOR
C200 R200
0.1u
1M A
U200 5
A CHARGING IC OVP 1 VCC
4 VIN-
HOOK_DETECT OUT VIN+
GND 3
2 2V5_VAUDIO
C201
R201
100p
VBAT VCHG_OVP VBUS_OVP 330K VBUS_USB 2V62_VIO 2V5_VAUDIO VCHG VBAT

R202
1.5K
C202 0.1u
HS_MIC_N
U201 ISL9221
39p
10u
ICVFP10181E301FR
FM_ANT
FL200
GND2
OUT
13 R203
PGND
C203
1
C204
2.2K
R226
R209
100K
VDC
DNI
12 VBUS_USB
GND1
VDC_BYP
100nH
L200
2 C205
IN
VUSB
11
BAT HS_MIC_P 24p
3 C206 0.1u
_PPR
100K
10 CN200
10K
DNI
DNI
USB_BYP
4
R227
EOC _CHG C207 C208
DNI
9 21
IVDC 27p 27p
R207
R204
R205
R206
5 19
CHG_EN _EN
8 1
GND
6 FB200 1800 2
IMIN R208 DNI 2 : Headset MIC
B
7 FB201 1800 3
(1005,10V,K,X5R)
IUSB JACK_TYPE 3 : Jack type
(1608,25V,K,X5R)
(1608,25V,K,X5R)
(1005,10V,K,X5R)
(1005,10V,K,X5R)
FB202 1800 4 4 : CTS/HSO_L
FB203 1800 5 5 : RTS/HSO_R
R228 1 6
R215
100K
R213
R216
R214
C209 C210 C211 C212 C213 6 : USB+/Remote_INT/TXD
USB_DP
10K
33K
16K
R229 1 7 7 : USB-/Remote_ADC/RXD
1u 1u 1u 1u 1u USB_DM
(1%) (1%) FB206 1800 8 8 : JACK_D
(1%) JACK_DET
9
9,10 : BATT
10
RPWRON_EN 11 11 : R/ON
RPWRON_EN
12
12,13 : CHG
13
DSR R210 47 14 14 : DSR
DSR
R230 0 15 15 : VUSB
TX 16 16 : D/ TX
UART_TX
RX R211 47 17 17 : D/ RX
UART_RX
R212 47 18
20
22
HSO_L
(1005,10V,K,X5R)
39p
1u
C214
C215
HSO_R C
(1608,25V,K,X5R)
1u
C217 C218
C216
27p 27p
Battery Connector HALL EFFECT S/W

Remote Power On END 2V62_VIO
VBAT
2V0_VRTC
D R217 100K D
RPWRON_EN CN201 SLIDE_OPEN
END_KEY_IN C219
1 0.1u
2
330K
R219
R218 C220
4 2 U202
OUT
VDD
R220
KEY_COL7 BAT_ID 0.1u

2K
3
1K
C221 C222 C223 C224 C225
R221 R222
VSS
NC
PWRON END_KEY 10u 1u 39p 39p 27p
R223 3.3M 10K
3
1 2 3 EM-0781-T5
RPWRON C226
100K
R224
2K 10u KEY_ROW6
R225
100K
6 5 4 EMX18
Q201
END_KEY_IN
1 2 3 4 5
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A A
B B
MOTOR CIRCUIT AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
VBAT 3V0_VMOT
0
C C
R300
C300
1u U300 R1114D301D-TR-F
1 3
VDD VOUT
C301 C302
1u
4 2
NC GND1 1u 1u
6 5
VIB_PWR_EN CE GND2
C303
C304 1u
R301
100K
A3
B1
C5
VSS
VDD
PVDD
A4
C1N
C305 1u A5 A1 R313 0 HSO_R

C1P HPR
3V0_VMOT
3V0_VMOT A2 R314 0 HSO_L
D C307 2200p HPL D
C308 1u D1
BB_SND_R INA2
C309 1u D2
R302 100K BB_SND_L INA1
U303
C311 1u C1 MAX9877AEWP_TG45
C313 FM_SND_R INB2
C312 1u C2 D5
1u FM_SND_L INB1 OUT+ SPK_P
U301 TC7SZ86FU R304 U302 TPA6205A1DRBR
R303 0 1 5 1 6 B2 B5
LIN_INVERT IN_B VCC VIB_PWR_EN _SHUTDOWN VDD L300 BIAS OUT- SPK_N
R305 0 2
LIN_PWM_FRQ IN_A R306 0 100nH VIB-
3 4 2 8 OUT300 B3
GND OUT_Y BYPASS VO- i2C_SDA SDA
C3
130K I2C_SCL SCL
3 5 OUT301
IN+ VO+
D4
L301 VIB+ RXIN+
PGND
U304 TC7SZ86FU 4 7 B4
GND
IN- GND 100nH RXIN-
1 5 9
IN_B VCC PGND C315
R307 0 2
LIN_PWM_MAG IN_A R308 1u
D3
C4
3 4
E GND OUT_Y C314 R309 100K E
130K 0.01u
C316 2200p
F F
MIC
C C
MICBIAS
100nH
L302
C321
QWERTY_KEY BACKLIGHT 39p

L304 MIC300
C320 1
MIC_N P
C319 100nH 2
22n G1
39p 3
G2
4
O
L303
C318 SPU0409HE5H-PB
D MIC_P D
22n 100nH
VBAT C317
39p
EVLC14S02050
VA300 C322
R310 10u
LEWWS44-E LD300 47
R311
QWERTY_KEY_BL
LEWWS44-E LD301 47
R312
LEWWS44-E LD302 47
ICVN0505X150FR
VA301
E E
1 2 3 4 5 6 7 8 9
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
2V62_VIO
QWERTY KEY
KEY_I2C_SDA
C400 2V62_VIO
A 0.1uF
2V62_VIO
0
R400
120K
(1%)
R402
4.7K
C401 0.1uF
R401
29
28
27
26
25
24
23
22
PGND
GND2
RESETB
XI
XO
CLK_SEL
VDD
P10
27p
27p
27p
C402
C403
C404
1 21 R403 470 FL400 ICVE10054E250R201FR
TEST P40 KEY_ROW0
2 20 R404 470 1 9
SEL_28P P41 KEY_ROW1 INOUT_A1 INOUT_B1 IF_MODE3
R405 470 3 19 R406 470 2 8
KEY_COL7 P57 P42 KEY_ROW2 END_KEY INOUT_A2 INOUT_B2 LCD_ID
R407 470 4 U400 18 R408 470 3 7
KEY_COL6 P56 P43 KEY_ROW3 INOUT_A3 INOUT_B3 DIF_RESET
R409 470 5 PP2106M2 17 R410 470 4 6
KEY_COL5 P55 P44 KEY_ROW4 SUB_KEY_BL INOUT_A4 INOUT_B4 DIF_VSYNC
R411 0 6 16 R412 470 CN400
KEY_INT P17 P45 KEY_ROW5 KEY_ROW4
G1
G2
R413 0 7 15 R414 470 1 40
KEY_I2C_SCL P15 P46 KEY_ROW6 KEY_ROW5
2 39
5
10
KEY_ROW6
GND1
3 38
KEY_COL4
P54
P53
P52
P51
P50
P47
4 37
2V62_VIO
R415 KEY_COL5
C413
C414
C415
C416
C417
C418
C419
5 36
KEY_COL6
8
9
10
11
12
13
14
B 6 35 FL401 ICVE10054E250R201FR
4.7K KEY_COL7
27p
27p
27p
27p
27p
27p
27p
7 34 1 9
C405
C406
C407
C408
C409
C410
C411
C412
8 33 2 8
C420 27p 9 32 3 7
C421 27p 10 31 4 6
27p
27p
27p
27p
27p
27p
27p
27p
C422 27p 11 30
G1
G2
C423 27p 12 29
13 28
5
10
C424 27p
14 27
470
470
470
470
470
15 26
16 25
17 24 FL402 ICVE10054E250R201FR
FL403 ICVE10184E150R101FR 18 23 1 9
R416
R417
R418
R419
R420

1 9 19 22 2 8
2 8 20 21 3 7
3 7 4 6
KEY_COL4
KEY_COL3
KEY_COL2
KEY_COL1
KEY_COL0
4 6
G1
G2
G1
G2
5
10
5
10
Soft1 W E T U I O Soft2 Socket 1
9
C KB400 KB401 KB402 KB403 KB404 KB405 KB406 KB407 RCV_P INOUT_A1 INOUT_B1 DIF_D(4)
2 8
3 7
4 6
KEY_ROW0
G1
G2
Q A R Y H J P CLR
5
10
C425
KEY_ROW1
Fn S D G Space K L MSG
KEY_ROW2
C426 Sym Z F V B N M ENTER

D D
KEY_ROW3
Shift X C
KB432 KB433 KB434
KEY_ROW4
KEY_COL0
C427
27p
KEY_COL1
KEY_COL2
E
KEY_COL3
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
1 2 3 4 5 6 7
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
CAMERA CONNECTOR
MICRO SD Connector (ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
1V8_VCAM 2V8_VCAMIO
A A
2V62_VIO 2V9_VMMC R505 10

CAM_D(7)
R506 10
CAM_D(6)
R507 10
CAM_D(5)
FB500 R509 10
CAM_D(4)
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
100K
100K
100K
100K
100K
100K
CN500
2V9_VMMC
G2 G1
24 1
C500
C501
C502
C503
C504
C505
C506
C507
S500 AXA463062P 23 2
R500
R508
R501
R502
R503
R504
R510 10 22 3
I2C_SCL
R511 10 21 4
MMC_D1 DAT1_2 I2C_SDA
R512 10 20 5
DUMMY1 CAM_VS
R513 10 19 6 R514 10
MMC_D0 DAT0 CAM_HS CAM_D(3)
10 R515 18 7 R516 10
VSS CAM_MCLK CAM_D(2)
17 8 R517 10
MMC_CLK CLK CAM_D(1)
16 9 R518 10
VDD CAM_D(0)
15 10
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
MMC_CMD CMD
14 11
MMC_D3 CD_DAT3
13 12
DUMMY2
C518
C519
C520
C521
C522
C523
C524
C525
MMC_D2 DAT2 C535
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
G4 G3
MMC_DET DETECT_A 1u
B B
DETECT_B ENBY0020401
AXK7L24227G R519 10
DUMMY3 CAM_PCLK
R520 10
CAM_RST
C534 GND R521 10
C526 C527 C528 C529 C530 C531 C532 C533 CAM_PWDN
27p 27p 27p 27p 27p 27p 27p 27p
1u
7.5p
7.5p
7.5p
7.5p
7.5p
7.5p
C536
C537
C538
C539
C540
C541
C C
SIM CONNECTOR SPK CAMERA POWER
2V9_VSIM 2V9_VSIM

L500
CN501
SPK_P
100nH 1
R522
R523
C542
DNI
J500 2
15K 100p
4 1
C5 C1 L501
5 2
C6 C2 SIM_RST SPK_N
6 3 100nH U500 RT9011-MGPQW
EVLC18S02015
EVLC18S02015
10 7 C544 C545 1 8
GND4 GND1 VIN VOUT1
VA500
VA501
9 8 47p 47p 2 7
GND3 GND2 CAM_PWR_EN EN1 VOUT2
PGND
C543 C547 C548 3 6
C546 EN2 NC2
100K
4 5
DNI 220n 22p 1000p NC1 GND
C550
9
EUSY0319001
1u C551 C552
D D
R525
2.2u 2.2u
BACKUP BATTERY
SIDE KEY
2V 0.5mAh
2V0_VRTC
VOL-UP
KEY_COL0
CAM VOL-DOWN 4
KEY_COL0 KEY_COL1
3 3
KEY_ROW6 KEY_ROW5
2 2
R524
4.7K
1 1
CN502 CN503
E
VA502
VA503
VA504
VA505
VA506
BAT500
C549
1u
1 2 3 4 5
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
2V62_VIO
BLUETOOTH_CSR
ANT600 FB600
R600 GND1
FEED GND2
0 VBALUN_BT
A AA
L600 AMAN802015LG14
C600 C601 C602
NA
DNI 0.1u 1u
R601 1
C603 C604 C605
22n DNI 15p
H10 R603 1
G10 R602 1
C606 C607 C608
15p 0.1u 2.2u
B10
C10
G2
G9
G3
G8
A2
C2
A7
H1
A6
K1
B2
C1
B4
D2
C3
D3
B6
H2
E2
E3
F2
F3
J6
J3
C609 C610
VDD_PIO
VDD_FM
VDD_RADIO_1
VDD_RADIO_2
VDD_USB
VDD_PADS
VDD_CORE_1
VDD_CORE_2
VDD_LO
VDD_AUDIO
VDD_ANA
VSS_PIO
VSS_FM1_1
VSS_FM1_2
VSS_FM2
VSS_DIG
VSS_RADIO_1
VSS_RADIO_2
VSS_RADIO_3
VSS_ANA_1
VSS_ANA_2
VSS_ANA_3
VSS_ANA_4
VSS_ANA_5
VSS_ANA_6
VSS_PADS
VSS_CORE
VSS_LO
15p 15p
C611 47n
AU_REF I2C_DATA
A3 C8
FM_SND_R SPKR_R I2C_CLK
A4 C7
FM_SND_L SPKR_L
A5
C612 220n R604 560 USB_DN
K6
FILT_EXT USB_DP
C613 1000p B3 J7
CLK32K CLK_32K UART_CTS UART_BT_RTS
C9 H6
C614 0.01u K3 LO_REF UART_RTS UART_BT_CTS
B H5 TP600
XTAL_OUT UART_RX UART_BT_TX
C615 1000p J2 K7 TP601
GT365 VS KS360 change note 26MHZ_BT XTAL_IN UART_TX UART_BT_RX
K2 J8
L601 33nH L602 470nH
C616 820p
GT365 KS360 FM_ANT
B1
FM_P BLUECORE5-FM PCM2_CLK
D9
C618 15p C619 15p FM_N M600 PCM2_SYNC
C617 820p A1 D10
R199 DNI 1 ohm PCM2_IN
E10
AUX_DAC PCM2_OUT
B5 D8
4
R198 1 ohm DNI FL600 RX_N
D1 TP602
G1
LFB212G45BA1A220 RX_P PCM_CLK I2S1_CLK
E1 H9 TP603
VREGENABLE_H
VREGENABLE_L
C633 0.5 pF 0.75 pF UB B1 RF_P PCM_SYNC I2S1_WA0
3 5 F1 J10 TP604
NC_DC G2 RF_N PCM_IN I2S1_TX
VREGOUT_H
2 6 G1 K8 TP605
VREGIN_H
L605 22 nH 12 nH NC B2 PCM_OUT I2S1_RX
VREGIN_L
SPI_MOSI
SPI_MISO
TEST_EN
VBALUN_BT 1 H7
SPI_CLK
7
SPI__CS
G3
PIO_11
PIO_10
AIO_1
AIO_0
PIO_9
PIO_8
PIO_7
PIO_6
PIO_5
PIO_4
PIO_3
PIO_2
PIO_1
PIO_0
_RST
C631 6 pF 5 pF 2V9_VAUX
8
L603 18nH
R615 1 nH 1 ohm RF
C6
A8
B7
C5
F10
F9
E8
E9
B9
B8
A9
A10
J4
K4
F8
J9
H8
K10
K9
C4
H3
H4
J1
J5
K5
C621
FB601
1.5p 2V62_VIO
TP606
C620
VC1 DNI
R605
C622 R606 470K 2.2 C623 C624
C 33p R607 47K 2.2u 0.1u C
C625 C626
DNI 2.2u
VC2
BT_VCXO_EN
BT_RESET
BT_INT
C627
33p VBAT
C629 C628 C630

16
10
12
14
15
18
19
20
10u
9
1u 27p
CN600
VC1
VC2
GND1
GND2
GND3
GND4
GND5
NC1
NC2
MM8430-2610RB3
C632
4
5 GND3 GND4 6
PAD600 PAD601
GND2
R608 C631 22p TQM7M5005 U600

2
OUT
1
ANT U601
IN
GSM1800_1900TX
17 15 7 R609 1
GND1
0 6p
GSM850_900TX

LMSP43NA-782
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM850RX1
GSM850RX2
GSM900RX1
GSM900RX2
PAD602 8 6 R610 1
3
C633 L605 GND3 TX_EN PA_EN

L604 11
0.5p 22nH GND2
NA 14 5 R611 10K
GND1 VRAMP TX_RAMP
D D
9 4
BY_CAP2 VBATT
1
2
3
4
5
6
7
8
11
13
L606
13 3 R612 1
BY_CAP1 BS PA_BAND
1.2nH C635
C634 10 2 R613 1
0.5p 0.5p GSM850_900_OUT MODE_SELECT PA_MODE
12 1 R614 1
C636 C637 C638

R615 C639 C640 DNI DNI 47p
0.01u 0.01u
1nH
C641 C642
C643 C644 C645 DNI 1p
C646 C647 C648 C649 C650
VC1 VC2 2.5p 2.5p 3.9p 3.9p 3.3p 3.3p 5.6p 5.6p
PIN 14 PIN 13
GSM850_EGSM TX H L
L608 L609
L607 L610
DCS_PCS TX L H
22nH 18nH 5.1nH 5.6nH
GSM850 RX L L GSM900
GSM850 DCS1800 PCS1900
E EGSM900 RX L L
DCS1800 RX L L
PCS1900 RX L L
R616 100K
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
DCS1800_RXP
DCS1800_RXN
PCS1900_RXP
PCS1900_RXN
RF_TEMP
R617 10K
1 2 3 4 5 6 7
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
A A
B
MAIN To FPCB Connector FPCB To SLIDE Connector
VBAT 2V62_VIO 2V8_VVIB 2V8_VVIB 2V62_VIO VBAT
CN100 CN101
1 40 1 40
2 39 2 39
END_KEY END_KEY
3 38 3 38
IF_MODE3 IF_MODE3
4 37 4 37
LCD_ID LCD_ID
5 36 5 36
SUB_KEY_BL DIF_RESET DIF_RESET SUB_KEY_BL
6 35 6 35
KEY_ROW4 DIF_VSYNC DIF_VSYNC KEY_ROW4
7 34 7 34
KEY_ROW5 DIF_RD DIF_RD KEY_ROW5
8 33 8 33
KEY_ROW6 DIF_WR DIF_WR KEY_ROW6
9 32 9 32
KEY_COL4 DIF_CD DIF_CD KEY_COL4
10 31 10 31
KEY_COL5 DIF_CS DIF_CS KEY_COL5
11 30 11 30
KEY_COL6 KEY_COL6
12 29 12 29
KEY_COL7 DIF_D(0) DIF_D(0) KEY_COL7
13 28 13 28
TOUCH_SCL DIF_D(1) DIF_D(1) TOUCH_SCL
14 27 14 27
TOUCH_SDA DIF_D(2) DIF_D(2) TOUCH_SDA
15 26 15 26
C TOUCH_INT DIF_D(3) DIF_D(3) TOUCH_INT C
16 25 16 25
DBB_BL_PWM DIF_D(4) DIF_D(4) DBB_BL_PWM
17 24 17 24 TP100TP101TP102TP103
DIF_D(5) DIF_D(5)
18 23 18 23
RCV_P DIF_D(6) DIF_D(6) RCV_P
19 22 19 22
RCV_N DIF_D(7) DIF_D(7) RCV_N
20 21 20 21
Header Header
D D
1 2 3 4 5 6 7
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
LCD FILTER, ZIP CONNECTOR MULTI_KEY & END_KEY MULTI_KEY BACKLIGHT

A 2V62_VIO A
IFMODE(0) IFMODE(1) IFMODE(3) MODE
L X L Sharp
L H H Hitachi SOFT1 SOFT2 SEND OK

100 101 102 103
R100 VBAT
C100
100K 0.1u KEY_ROW4
CN100
1
2 HOT CLR RIGHT
LCD_BL_PWM 3 104 105 106
IF_MODE3 4
R101 0
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
100ohm
5
R102 0
IFMODE(1) 6 C101 C102
DIF_VSYNC IFMODE(0) 7 KEY_ROW5 1u 1u
DIF_RD 8
DIF_WR 9 LEFT UP DOWN
R103
R104
R105
R106
R107
R108
R109
DIF_CD 10 107 108 109
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
LEBB-S14E
DIF_CS 11
LD100
LD101
LD102
LD103
LD104
LD105
LD106
12
13
14 KEY_ROW6
15
B
16
17 R110 Q100
18 KEY_COL4 SUB_KEY_BL
2SC5585
19 1K
R111
DIF_D(7) 20 KEY_COL5
10K
DIF_D(6) 21
DIF_D(4) 23
DIF_D(2) 25
DIF_D(1) 26
VBAT
DIF_D(0) 27
END
LCD_ID 28
29 KB100
30
R112 150
DIF_RESET 31 END_KEY
MLED5 32
MLED4 33
VA100
MLED3 34
EVL14S02200
MLED2 35
MLED1 36
MLED 37
R113
C LCD_ID C
VA101
DNI
EVLC14S02050
IF_MODE3
LCD BACKLIGHT TOUCH

C103 1u
2V8_VVIB
FPCB To SLIDE Connector VBAT
2
CN101
C1P
C1N
3 7 G1 G2
2V62_VIO IN OUT MLED
TP100 1 10
2V8_VVIB VBAT C104 TOUCH_RST
1 14 2 9
1u GND LED1 MLED1 TOUCH_INT
D 13 3 8 D
U100 LED2 MLED2 RCV_P TOUCH_SDA
12 4 7
CN102 MAX8630W LED3 11
MLED3 RCV_N
5 6
TOUCH_SCL
LED4 MLED4
1 40 R114 DNI 9 10
DBB_BL_PWM CPWM LED5 MLED5 C105 C106
2 39 G3 G4
END_KEY 27p 27p
9p
9p
9p
9p
9p
9p
3 38 R115 0 8 15
IF_MODE3 LCD_BL_PWM PWM P_GND
C2N
C2P
4 37
LCD_ID C113
5 36
R116
100K
DIF_RESET SUB_KEY_BL C114 1u
C107
C108
C109
C110
C111
C112
5
6 35
DIF_VSYNC KEY_ROW4 0.1u
7 34
DIF_RD KEY_ROW5
8 33
DIF_WR KEY_ROW6 C115 1u
9 32
DIF_CD KEY_COL4
10 31
DIF_CS KEY_COL5
11 30
KEY_COL6
12 29
DIF_D(0) KEY_COL7
13 28
DIF_D(1) TOUCH_SCL
14 27
DIF_D(2) TOUCH_SDA
15 26
DIF_D(3) TOUCH_INT
16 25
DIF_D(4) DBB_BL_PWM
17 24
DIF_D(5)
18 23
DIF_D(6) RCV_P
19 22
DIF_D(7) RCV_N
20 21
E
Socket
1 2 3 4 5 6 7
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
A A
FROM SLIDE PCB

MAIN RECEIVER
2V8_VVIB
CN100
G1 G2 R100 0
+
RCV_P OUT100
1 10
TOUCH_RST R102 0
2 9 OUT101
TOUCH_INT RCV_N
3 8
RCV_P
RCV_N
4 7
TOUCH_SDA
TOUCH_SCL
-
5 6
C101 C102
47p 47p
G3 G4
Header
B
C C
TO TOUCH FPCB
2V8_VVIB
D CN102 D
G1 G2
1 10
2 9
TOUCH_INT TOUCH_RST
3 8
TOUCH_SDA
4 7
TOUCH_SCL
5 6
G3 G4
Socket
1 2 3 4 5 6 7
8. BGM Pin Map
8. BGM Pin Map
BGA IC pin check (U102, PMB8888)
: Not in use
8. BGM Pin Map
BGA IC pin check (U100, K5D1G12ACD-D075)
: Not in use
8. BGM Pin Map
BGA IC pin check (U303, MAX9877)
: Not in use
8. BGM Pin Map
BGA IC pin check (M600, BC5FM)
: Not in use
9. PCB LAYOUT
Hall Effect SW
U202 Dome SW
No Wallpaper No Keypad &
Change Press
Vibrator Amp
U302
No Vibrator
Key Encoder
U400
No Qwerty Key
Main FPCB
Connector CN400
No Display
No Vibrator
No Multi-key
No Speaker &
Receiver
Micro Phone
MIC300
No Record
TE365
9. PCB LAYOUT
Backup Battery Bluetooth

BAT500 Antenna ANT600
No Service No BT Connect
Speaker CN501 Vibrator

No Speaker No Vibrator
(Sound)
Camera Module
MMI Connector
U500
CN200
No Camera
No Ear Mic
No Speaker Bluetooth & FM
Radio Chip M600
Battery Connector
BT Module
CN201
No Service
No Power
Camera
Connector
CN500
No Camera
Memory
U100
SIM Connector No Booting
J500
No Service
Power Inductor
L103,104
No Booting
No Power
BB Chipset
Micro SD Socket U102 No Power
S500 On No Display
No Micro SD No Service
PAM U600
Mobile SW CN600
GSM TX Power
GSM TX Power
No Service
NO Service
FEM U601
GSM RX
Sensitivitry & TX
Power
TE365
9. PCB LAYOUT
LED
LD100~106
No Multi_Key
Backlight
TE365
9. PCB LAYOUT
LCD Filter, ZIP

Connector
Main FPCB CN100
Connector NO Display
CN100
No Display LCD Back Light
No Power U100
No Display
Touch FPCB
Connector
CN100
No Touch
Sense
TE365
9. PCB LAYOUT
LCD Connector
CN100, 101
No Power
No Booting
No Display
TE365
TE365
9. PCB LAYOUT
Touch
Connector
CN102
No Touch Sense
Touch
Connector
CN100
No Touch Sense
TE365 TE365
10. RF Calibration
10. RF Calibration
10.1 Test Equipment Setup
4.00 V 0.000 A
10.2 Calibration Step
10.2.1 Turn on the Phone
10.2.2 Execute “HK_27.exe”
10. RF Calibration
10.2.3 Click “SETTING” Menu
TE365
10.2.4 Setup “Ezlooks” menu such as the following figure
10. RF Calibration
10.2.5 Setup “Line System” menu such as the following figure
TE365
Adjust the number of times
10.2.6 Setup Logic operation such as the following figure
Operation Mode
1. By- Pass: not control by GPIB
2. Normal : control by GPIB
Setup UART Port

PWR : Power Supply
CELL :Call- Test Equipment
10. RF Calibration
10.2.7 Select “MODEL”
10.2.8 Click “START” for RF calibration
TE365
10.2.9 RF Calibration finishes.
10. RF Calibration
10.2.10 Calibration data will be saved to the following folder
TE365
10. RF Calibration
Notices:
1. The state of Phone is “test mode” during the CALIBRATION.
2. Calibration program automatically changes either “normal mode” or “ptest mode”.
3. RF Calibration steps as follow:
TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS
RX Channel compensation: EGSM->DCS->PCS
4. Phone Operation Mode
Normal Mode ptest Mode
11. Stand-alone Test
11.1 Test Program Setting

1 Set COM Port.
2 Check PC Baud rate.
3 Confirm EEPROM & Delta file prefix name.
4 Click “Update Info” for communicating Phone and Test-Program.
Not Connected
Connected
5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the
“Reset” bar.
6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.
Change "ptest mood"
11.2 Tx Test
1 Click “Non signaling mode” bar and then confirm “OK” text in the command line.
2 Put the number of TX Channel in the ARFCN.

3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.
4 Finally, Click “Write All” bar and try the efficiency test of Phone.
11.3 Rx Test
1 Put the number of RX Channel in the ARFCN.
2 Select “Rx” in the RF mode menu.
3 Finally, Click “Write All” bar and try the efficiency test of Phone.
4 The Phone must be changed “normal mode” after finishing Test.

5 Change the Phone to “normal mode” and then Click the “Reset” bar.
Change "normal mode"
12. ENGINEERING MODE
12. ENGINEERING MODE
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided
by a handset. The key sequence for switching the engineering mode on is “1809#*360# “Select. Pressing
END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and
press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.
[1] BB TEST [4] Call Timer [7] Network selection
[1-1] Battery Info [7-1] Automatic

[5] Factory Reset
[1-1-1] BattInfo [7-2] GSM850
[1-2] Bluetooth Test [6] MF TEST [7-3] EGSM
[1-2-1] Enter Test Mode
[7-4] DCS
[1-2-2] OnOff Test [6-1] All Auto Test
[7-5] PCS
[1-2-3] Headset Test [6-2] Backlight
[1-2-4] BT Test1 [6-2-1] BacklightOn
[1-2-5] BT Test2 [6-2-2] BacklightOff
[1-2-6] Xhtml Compose Print [6-3] Audio

[1-2-7] Xhtml Print Test [6-3-1] Audio Test
[6-4] Vibrator
[2] Model Version
[6-4-1] VibratorOn
[2-1] Version [6-4-2] VibratorOff
[6-5] LCD
[3] Eng Mode
[6-5-1] Auto LCD
[3-1] Cell environ [6-6] Key pad
[3-2] PS Layer Info [6-7] Mic Speaker
[3-2-1] Mobility
[6-8] Camera
[3-2-2] RadioRes
[6-8-1] Camera Main Preview
[3-2-1] Gprs
[6-8-2] FlashOn
[3-3] Layer1 Info [6-8-3] FlashOff
[3-4] Reset Information [6-8-4] CameraFlashBunning
[3-5] Memory Configurarion [6-9] FM Radio
[3-6] MemGenConf [6-9-1] FM Radio Test
[3-7] MemAllUse [6-10] Touchpad Test

[3-8] MemDetUse
[3-9] MemDump
[3-10] Change Frequency Band
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
6 29
1 30 33
4 26 32
2
7 34
24 25
28 31
8
27 21
9 19
35
3
22
5 14
54
23
15 20
13
11
16 18
12
17
10 49 50 52
39 38 48
40
41 37
53
51
42
46
36 43
47
44 45
ASS'Y EXPLODED VIEW
G
B D
K
J
I
H
J
G
H
F
E
D
C
B
A C E F A
13.2 Replacement Parts Note: This Chapter is used for reference, Part order
<Mechanic component> is ordered by SBOM standard on GCSC
Location
Level Description Part Number Spec Color Remark
No.
1 GSM(FOLDER) TGFF0100802 White Green
2 APEY PHONE APEY0623302 White Green
3 ABGF00 BUTTON ASSY,MAIN ABGF0005301 QWERTY ENGLISH WN White Green 35
Color
3 ACGM00 COVER ASSY,REAR ACGM0114301 J
Unfixed
4 MCCC00 CAP,EARPHONE JACK MCCC0056101 MOLD, Urethane Rubber S190A, , , , , White 47
4 MCCG00 CAP,MULTIMEDIA CARD MCCG0013301 MOLD, Urethane Rubber S190A, , , , , White 48
4 MCJN00 COVER,REAR MCJN0086401 MOLD, PC LUPOY SC-1004A, , , , , White 38
4 MDAK00 DECO,REAR MDAK0015501 COMPLEX, (empty), , , , , White 50
4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White
4 MLEA00 LOCKER,BATTERY MLEA0046101 MOLD, PC LUPOY SC-1004A, , , , , Black 42
4 MPBJ00 PAD,MOTOR MPBJ0054901 COMPLEX, (empty), , , , , Black 40
4 MPBN00 PAD,SPEAKER MPBN0056601 COMPLEX, (empty), , , , , Black 46
4 MPBT00 PAD,CAMERA MPBT0059301 COMPLEX, (empty), , , , , Black 39
Without
4 MPBZ00 PAD MPBZ0206803 COMPLEX, (empty), , , , , 43
Color
Without
4 MPBZ00 PAD MPBZ0206804 COMPLEX, (empty), , , , ,
Color
4 MSDB00 SPRING,COIL MSDB0001701 G7000 Pearl White 4
Without
4 MTAA00 TAPE,DECO MTAA0161601 COMPLEX, (empty), , , , , 49
Color
Without
4 MTAB00 TAPE,PROTECTION MTAB0239701 COMPLEX, (empty), , , , , 53
Color
Without
4 MTAK00 TAPE,CAMERA MTAK0012201 COMPLEX, (empty), , , , , 51
Color
Without
4 MWAE00 WINDOW,CAMERA MWAE0036401 CUTTING, PMMA MR 200, , , , , 52
Color
Color
3 ACGQ00 COVER ASSY,SLIDE ACGQ0027601
Unfixed
4 ABGG00 BUTTON ASSY,SUB ABGG0004401 White Green E, 27
Color
4 ACGK00 COVER ASSY,FRONT ACGK0114301 G
Unfixed
Location
No.
5 MBJL00 BUTTON,SIDE MBJL0060801 COMPLEX, (empty), , , , , Green 20
5 MBJL01 BUTTON,SIDE MBJL0060701 COMPLEX, (empty), , , , , Green 19
5 MCJK00 COVER,FRONT MCJK0089501 MOLD, PC LUPOY SC-1004A, , , , , Green 19
5 MFBD00 FILTER,MIKE MFBD0031301 COMPLEX, (empty), , , , , Black
5 MTAB01 TAPE,PROTECTION MTAB0239101 COMPLEX, (empty), , , , , Green 21, 22
COVER ASSY, Color

4 ACGR00 ACGR0016601 F
SLIDE(LOWER) Unfixed
5 MCJV00 COVER,SLIDE(LOWER) MCJV0016401 COMPLEX, (empty), , , , , Green 10
5 MGDA00 GUIDE,LEFT MGDA0013901 MOLD, POM LUCEL N109-LD, , , , , Green 12
5 MGDB00 GUIDE,RIGHT MGDB0008701 MOLD, POM LUCEL N109-LD, , , , , Green 11
5 MMAA00 MAGNET,SWITCH MMAA0000901 G7000 12x2x0.7t Metal Silver 16
5 MPBM00 PAD MPBZ0211501 PRESS, NS, , , , , Black 17
Without
Color
Without
Color
5 MSGY00 STOPPER MSGY0024601 MOLD, Urethane Rubber S190A, , , , , Green 13
COVER ASSY, Color

4 ACGS00 ACGS0020601 B
SLIDE(UPPER) Unfixed
Without
5 ABGG00 BUTTON ASSY,SUB ABGG0004901 FUNCTION 5
Color
5 MCJW00 COVER,SLIDE(UPPER) MCJW0019901 MOLD, PC LUPOY SC-1004A, , , , , White 1
5 MFBB00 FILTER,RECEIVER MFBB0026701 COMPLEX, (empty), , , , , Black 4
5 MPBG00 PAD,LCD MPBG0079501 COMPLEX, (empty), , , , , Black 9
Without
Color
Without
5 MTAD00 TAPE,WINDOW MTAD0088901 COMPLEX, (empty), , , , , 2
Color
Without
5 MTAG00 TAPE,BUTTON MTAG0008101 COMPLEX, (empty), , , , , 3
Color
Without
5 MTAJ00 TAPE,FLEXIBLE PCB MTAJ0007801 COMPLEX, (empty), , , , , 8
Color
Without
5 MTAZ00 TAPE MTAZ0217901 PRESS, NS, , , , , 7
Color
4 ARDY00 RAIL ASSY,SLIDE ARDY0006101 White Green D, 31
4 GMEY00 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black 32
4 GMZZ00 SCREW MACHINE GMZZ0021901 3.0 mm,1.5 mm,SWCH18A ,N ,+ ,- , Black
Location
No.
4 MCCH01 CAP,SCREW MCCH0130601 MOLD, PC LUPOY SC-1004A, , , , , Green 34
4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White
4 MPBF00 PAD,FLEXIBLE PCB MPBF0032501 COMPLEX, (empty), , , , , Black
4 MTAB00 TAPE,PROTECTION MTAB0239601 COMPLEX, (empty), , , , , Green 29
Without
Color
4 MTAZ00 TAPE MTAZ0214201 COMPLEX, (empty), , , , , Green
Without
4 MWAC00 WINDOW,LCD MWAC0101401 CUTTING, PMMA MR 200, 1.2, , , , A, 25
Color
3 GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black 37
Without
3 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array
Color
Without
5 ACKA00 CAN ASSY,SHIELD ACKA0009101
Color
6 MCBA00 CAN,SHIELD MCBA0033101 PRESS, STS, , , , , Silver
6 MGAD00 GASKET,SHIELD FORM MGAD0171801 COMPLEX, (empty), , , , , Silver
Without
6 MIDZ00 INSULATOR MIDZ0178701 COMPLEX, (empty), , , , ,
Color
Without
5 ACMY00 CAMERA ASSY ACMY0006403
Color
Without
6 ABFZ BRACKET ASSY ABFZ0014401
Color
7 MBFP00 BRACKET,CAMERA MBFP0009201 MOLD, PC LUPOY SC-1004A, , , , , Gray
Without
7 MTAK00 TAPE,CAMERA MTAK0012601 COMPLEX, (empty), , , , ,
Color
Without
7 MTAZ00 TAPE MTAZ0214701 COMPLEX, (empty), , , , ,
Color
5 ADCA00 DOME ASSY,METAL ADCA0082101 MAIN White
Without
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array
Color
<Main component> Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Location
No.
3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,-

4 SNGF00 ANTENNA,GSM,FIXED SNGF0036402 45
2.0 ,50 ,3.0
PIN ,8 ohm,91 dB,16 mm,3.4T spring contact ,; , , , , , ,

4 SPEAKER SUSY0024802 41
,[empty]
4 SAEY00 PCB ASSY,KEYPAD SAEY0060403 26
PCB ASSY,
5 SAEB00 SAEB0023502
KEYPAD,INSERT
6 ADCA00 DOME ASSY,METAL ADCA0082001 White
5 SAEE00 PCB ASSY,KEYPAD,SMT SAEE0027603
PCB ASSY,KEYPAD,SMT
6 SAEC00 SAEC0026103
BOTTOM
7 C100 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C103 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C104 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
7 C105 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
37 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

7 CN100 CONNECTOR,FFC/FPC ENQY0014301
,STRAIGHT ,BOTH ,SMD ,[empty] ,[empty] ,
CONNECTOR,BOARD TO 10 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT

7 CN101 ENBY0045301
BOARD ,FEMALE ,SMD ,[empty] , ,
CONNECTOR,BOARD TO
7 CN102 ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
BOARD
7 Q100 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
7 R100 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
PCB ASSY,MAIN,PAD
7 R101 SAFP0000501
SHORT
Location
No.
PCB ASSY,MAIN,PAD
7 R102 SAFP0000501
SHORT
7 R112 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP
PCB ASSY,MAIN,PAD
7 R114 SAFO0000501 0OHM_1005_DNI
OPEN
PCB ASSY,MAIN,PAD
7 R115 SAFP0000501
SHORT
7 U100 IC EUSY0263108 TDFN ,14 PIN,R/TP , ,; ,IC,Charge Pump
7 VA100 VARISTOR SEVY0000701 14 V, ,SMD ,120pF, 1005
PCB ASSY,KEYPAD,SMT
6 SAED00 SAED0025703
TOP
7 LD100 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
7 R103 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 SPJY00 PCB,SUB SPJY0054701 FR-4 ,0.5 mm,MULTI-4 , ,; , , , , , , , , ,
3 SAFY00 PCB ASSY,MAIN SAFY0247503 I, 36
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0087301
Location
No.
6 SVCY00 CAMERA SVCY0018101 CMOS ,MEGA ,2M FF Toshiba(1/4'),8.5x8.5x4.6,FPCB
5 SJMY00 VIBRATOR,MOTOR SJMY0008504 2.0 V,0.1 A,10*3.6 ,12mm linear motor ,; ,3V , , , , , , ,
5 SPKY00 PCB,SIDEKEY SPKY0058801 POLYI ,0.2 mm,MULTI-2 , ,; , , , , , , , , ,
5 SPKY01 PCB,SIDEKEY SPKY0058901 POLYI ,0.2 mm,MULTI-2 , ,; , , , , , , , , ,
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0163703
PCB ASSY,MAIN,SMT
5 SAFC00 SAFC0104201
BOTTOM
3.0 ,-2.0 dBd,, ,internal, bluetooth chip ,; ,SINGLE ,-2.0

6 ANT600 ANTENNA,GSM,FIXED SNGF0036701
,50 ,3.0
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi

6 BAT500 BATTERY,CELL,LITHIUM SBCL0001701
4.8, Pb-Free
6 C100 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C102 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C108 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
Location
No.
6 C128 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP , , ,[empty]

6 C139 CAP,CERAMIC,CHIP ECCH0000393
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]

22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP , , ,[empty]


Location
No.

6 C209 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP


Location
No.
7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No

X7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]













Location
No.












Location
No.






6 C603 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
Location
No.
6 C616 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C617 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C621 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C631 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C633 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C634 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C635 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C643 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 C644 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 CN200 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
Location
No.
6 CN201 CONNECTOR,ETC ENZY0020401 3 PIN,2.5 mm,BOTTOM , ,
CONNECTOR,BOARD TO
BOARD
6 CN600 CONN,RF SWITCH ENWY0001801 STRAIGHT ,SMD ,2 dB,3000PCS/REEL
6 D100 DIODE,SWITCHING EDSY0017301 VSM ,15 V,100 mA,R/TP ,PB-FREE
6 D101 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
6 D102 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
6 FB200 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB500 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FL200 FILTER,EMI/POWER SFEY0007101 SMD ,1CH,1608Feedthru ESD/EMI filter for power Pb-free
2450 MHz,2.0*1.25*1.0 ,SMD ,2400M~2500M, IL 3.8,

6 FL600 FILTER,DIELECTRIC SFDY0002601 8pin, U-B, 34.2_j95, BT (CSR BC41B143A) ,; ,BPF ,2450
,100 ,SMD ,R/TP
6 J500 CONN,SOCKET ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8
6 L100 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 L103 INDUCTOR,SMD,POWER ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
6 L104 INDUCTOR,SMD,POWER ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
6 L200 INDUCTOR,CHIP ELCH0009114 100 nH,J ,1005 ,R/TP ,coil
6 L602 INDUCTOR,CHIP ELCH0003823 470 nH,K ,1608 ,R/TP ,chip coil,PBFREE
6 L603 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free
Location
No.
6 L606 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE
6 L607 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE
6 L608 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free
6 L609 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
6 L610 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 M600 MODULE,ETC SMZY0015801 84 Ball 0.5pitch, BGA , Bluetooth+FM (6.0*6.0*1.0)
6 Q200 TR,BJT,NPN EQBN0007601 SOT-23 ,0.15 W,R/TP ,EMT3
6 Q201 TR,BJT,NPN EQBN0013701 EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS
PCB ASSY,MAIN,PAD
6 R100 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R101 SAFP0000501
SHORT
6 R109 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
PCB ASSY,MAIN,PAD
6 R116 SAFP0000501
SHORT
6 R202 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
Location
No.
6 R213 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
6 R221 RES,CHIP ERHY0000298 3.3M ohm,1/16W,J,1005,R/TP
PCB ASSY,MAIN,PAD
6 R230 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R300 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R313 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R314 SAFP0000501
SHORT
Location
No.
PCB ASSY,MAIN,PAD
6 R523 SAFO0000501 0OHM_1005_DNI
OPEN
PCB ASSY,MAIN,PAD
6 R600 SAFP0000501
SHORT
6 R605 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
PCB ASSY,MAIN,PAD
6 R608 SAFP0000501
SHORT
Location
No.
NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,

6 R617 THERMISTOR SETY0006301
PBFREE
6 S500 CONN,SOCKET ENSY0021001 8 PIN,ANGLE ,Reverse , mm,
FBGA ,107 PIN,ETC ,FULLY 1.8V 1G(LB/128Mx8)

6 U100 IC EUSY0338202
NAND+512M(8Mx4x16) SDRAM ,; ,IC,MCP
SON5-P-0.35(fSV) ,5 PIN,R/TP ,2-INPUT AND GATE, Pb

6 U101 IC EUSY0227901
Free
BGA ,293 PIN,R/TP ,EDGE RF BB PM Onechip BB ,;

6 U102 IC EUSY0347801
,IC,Digital Baseband Processor
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

6 U200 IC EUSY0250501
EUSY0077701
DFN ,12 PIN,R/TP ,Dual Charger IC (Bypass) ,;

6 U201 IC EUSY0351601
,IC,Charger
CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,;

6 U303 IC EUSY0360201
,IC,Audio Sub System
dBm, %, A, dBc, dB,5x5 ,SMD ,IFX Linear Edge ,; , , , , , ,

6 U600 PAM SMPY0017901
, ,R/TP ,R/TP ,
6 U601 FILTER,SEPERATOR SFAY0012001 , , dB, dB, dB, dB,4532 ,IFX EDGE Quad Pin
6 VA500 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA501 VARISTOR SEVY0003801 18 V, ,SMD ,
26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm

6 X100 X-TAL EXXY0018404 at -30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , ,
,SMD ,R/TP
32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

6 X101 X-TAL EXXY0018701
,
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0102601
6 C307 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
Location
No.
6 C316 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty]

6 C400 CAP,CHIP,MAKER ECZH0004402
,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty]

6 C401 CAP,CHIP,MAKER ECZH0004402
,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
Location
No.
6 C551 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C552 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
CONNECTOR,BOARD TO
BOARD
6 FL400 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF),

6 FL403 FILTER,EMI/POWER SFEY0010501
Pb-free
WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75

6 LD300 DIODE,LED,CHIP EDLH0013701
,30mA , , ,120mW ,[empty] ,[empty] ,2P


UNIT ,42 dB,3.76*2.95*1.1 ,MEMS mic ,; , , ,OMNI

6 MIC300 MICROPHONE SUMY0010608
,[empty] , ,[empty]
PCB ASSY,MAIN,PAD
6 R102 SAFP0000501
SHORT
6 R104 RES,CHIP ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP
PCB ASSY,MAIN,PAD
6 R303 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R304 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R305 SAFP0000501
SHORT
Location
No.
6 R306 RES,CHIP ERHY0000283 130K ohm,1/16W,J,1005,R/TP
PCB ASSY,MAIN,PAD
6 R307 SAFP0000501
SHORT
6 R308 RES,CHIP ERHY0000283 130K ohm,1/16W,J,1005,R/TP
PCB ASSY,MAIN,PAD
6 R401 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R411 SAFP0000501
SHORT
PCB ASSY,MAIN,PAD
6 R413 SAFP0000501
SHORT
FR-4 ,0.8 mm,STAGGERED-8 ,ETNA MAIN PCB ,; , , , , ,

6 SPFY PCB,MAIN SPFY0178401
,,,,
Location
No.
QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size wide input voltage

6 U202 IC EUSY0313401
Hall Switch
6 U300 IC EUSY0232816 SON1612-6 ,6 PIN,R/TP ,3.0V ,150mA,LDO
6 U301 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
6 U302 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP
6 U304 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free
QFN ,28 ,R/TP ,Keycoder ic, 28pin, 64keys ,; ,IC,Analog

6 U400 IC EUSY0300004
Multiplexer
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual

6 U500 IC EUSY0319001
LDO
6 VA301 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA502 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
Note
Note

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LG TE365 Service Manual

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Service Manual

Internal Use Only

Date: February, 2009 / Issue 1.0

J.P.Kim Jul. 18. 2008 0.1 -

4. PCB layout......................................62 13. EXPLODED VIEW &

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

APC Automatic Power Control

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

2.1 H/W Feature

Standard Battery Li-Polymer, 800mAh

AVG TCVR Current 250mA typ @PL5

Standby Current 1.85 mA typ @PP9

Talk time 5.6 hours (GSM TX Level 10)

Standby time Over 430 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓

TX output power EGSM : 32.5dBm (@PL 5)

GPRS compatibility Class 12

SIM card type 3V Small

Display Main 240x320 262K TFT 2.4”

Status Indicator Dial keys are implemented by touchpad.

ANT Built in antenna