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TMS320C50

Architecture
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ENGINEERING
OVERVIEW OF DSP
PROCESSORS
BY

Dr. M.Pallikonda Rajasekaran,


Professor/ECE
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ENGINEERING
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ENGINEERING
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ENGINEERING
Short history of DSPs
• 1960
• DSP hardware using discrete components
• 1970
• Monolithic components for DSP subsystems
• 1979
• Intel 2920 DSP
• (40 pin DIP)(EPROM,A/D,D/A,RAM)(1200bps modem)
• 1982
• Texas Instruments TMS32010

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ENGINEERING
Inside a DSP?

Computer
Engine Input / Output

Serial ports
Timers
Host ports
I/O
External ports connects
Program Data Link ports
Memory Memory to
outside
world
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ENGINEERING
INSIDE A DSP ENGINE?

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ENGINEERING
Why DSP?
- Flexible to change Signal Processing
Operations through a change in Software,
whereas hardwired machines are difficult to
Reconfigure.
- High Speed Parallel Processing enables it
to Real World Processing.
- Multi-Function Instruction like MAC etc,.
- Multiple data paths
- Flexible addressing modes

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ENGINEERING
MEMORY ARCHITECTURE
Stored Program
Control
Program
and ALU
Data Input
Output

Von Neumann Architecture


Program
Control
Stored
Input Stored
Program
Output Data
ALU

Harvard Architecture
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ENGINEERING
• Conventional microprocessors
use:
• Von Neumann architecture
-simple
• -program and data all in a single
memory -effective
• -Address and data buses are
shared between instruction and BUT
data fetches.

performance problems:
Memory
Addre -fetch for next instruction collides
CPU/ALU ss with data fetch/store
Data -Buses may be idle during
instruction decode

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ENGINEERING
• Most DSP chips use Harvard architecture
• -separate memory space(s) for program and data
• -separate data and program buses

P Address
CPU/ALU Program

Instr.
Memory
D1 D1 Data
Address
D2 Address D2 Data

Data
Data
Memory
Memory
#1
#2

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ENGINEERING
Comparison between DSP &
GP processor
• GP µP optimized for: DSPs optimized for:
• -Multi task operations -special digital processing
• -handling huge OS -real time processing
• -handling various -small code size
programs
-single program
• -Multiple I/O management
-limited number of I/O
• -transporting large size of
-low power
data

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ENGINEERING
DSP LEADING MANUFACTURERS

TEXAS INSTRUMENTS (TI)


ANALOG DEVICES (ADSP)
MOTOROLA

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ENGINEERING
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ENGINEERING
TMS320C320 DSP Family

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ENGINEERING
DSP TEXAS
INSTRUMENTS FAMILY

TMS320C6000
C62X,C64X,C67X DSPs
TMS320C5000
TMS320C2000 C54X,C55X DSPs
C24X,C28X DSPs High
OMAP Performance
Power C55X+ARM
Control Efficient
Optimized
www.ti.com
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ENGINEERING
TMS320C2000 PLATFORM ROADMAP

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ENGINEERING
TMS320C2000 DSP Platform
TMS320C2000 family offers various DSP
processors for motor control. Based on the specific
requirements, the user can choose the particular
device for the speed control of Induction Motor/Brush
less motor/ Switch Reluctance motor. In this platform
varieties of DSP Processors are available in 3
categories.
• TMS320F240
• TMS320F2407
• TMS320F2812.

Targeted for Industrial Automation, Automatic Control


Application, UPS, Motor Control, etc.
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ENGINEERING
TMS320F240 TMS320F2407A TMS320F2812

16 Bit Fixed point 16 Bit Fixed point 32 Bit Fixed point

20 MIPS 40 MIPS 150 MIPS

544 x 16 Bit RAM 2.5k x 16 Bit RAM 18k x 16 Bit RAM

3 Timers 4 Timers 7 Timers

SPI & SCI Serial SPI, SCI & CAN SPI, SCI & CAN
ports Serial ports Serial ports

12 PWM Channels 16 PWM Channels 16 PWM Channels

16 Channel ADC @ 16 Channel ADC 16 Channel ADC @


6 microsec @ 0.5 micro sec 200 ns conversion
conversion time conversion time time
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ENGINEERING
TMS320C5000 PLATFORM ROADMAP

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ENGINEERING
TMS320C6000 PLATFORM ROADMAP

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ENGINEERING
TMS320C6000 DSP Platform

This has got 3 series of DSP Processor family.


 TMS320C62XX  32 Bit Fixed Point DSP
 TMS320C64XX  32 Bit Fixed Point DSP
 TMS320C67XX  32 Bit Floating Point DSP

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ENGINEERING
Development Tools
CODE COMPOSER STUDIO
It includes

Assembler
Linker
Simulator
C/C++ compiler
Debugger
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ENGINEERING
ANALOG DEVICES
FAMILY

Blackfin processors
Tiger SHARC processors
SHARC DSPs
ADSP-21xx
Mixed signal DSPs

www.analog.com/dsp
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ENGINEERING
NOMENCLATURE OF DSP
PROCESSORS
• TMS 320 C 25 GB L
TMX-Expt. Device C-CMOS
TMP-Prototype Device E-CMOS EPROM
TMS-Qualified Device

PACKAGE TYPE TEMPERATURE


GB-Ceramic L -0° -70°
N-Plastic DIP H -0° -50°
FN-Plastic Leaded S - -55° -100°
FD-Ceramic Leadless M - -55° - 125°
A - -40° -85°

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ENGINEERING
TMS320C5x Family Features
• Fabrication using CMOS integrated-circuit
technology
• Architectural design is based on the ’C25
• Advanced Harvard architecture
• A CPU with application-specific hardware
logic
• On-chip peripherals
• On-chip memory
• Highly specialized instruction set
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ENGINEERING
TMS320C50 PROCESSOR

TMS320C50PQ57

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ENGINEERING
D/P RAM D. RAM D. RAM
D/P RAM P. ROM TMS320C50
B0 B1 B2
A(15-0) 512 X 16 512 X 16 9K X 16 2K X 16
32 X 16

I/O Ports
D(15-0) CPU 64K X 16
16-bit T-Reg 1,2 16-bit T-Reg0 Software
16 X 16 Multiplier Waitstates
16-bit Barrel
32-bit P-register
Shifter (L or R)
ShiftL(0, 1, 4, -6) Timer
32-bit ALU
32-bit Accumulator and Buffer Serial Port
ShiftL( 0 – 7 ) Sync
8 Auxiliary Registers
8 Level H/W Stack PLU
3 Status Registers BitSet, Clear
Block repeat/Circular Buffer Test, Toggle
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11 Shadow Registers
ENGINEERING
Central Arithmetic Logic Unit (CALU )
16-bit ∗ 16-bit hardware multiplier with a 32-bit
product capability
32-bit arithmetic logic unit (ALU)
PLU-Executes IIy only logical operation –without
affecting Accumulator
32-bit accumulator (ACC)
32-bit accumulator buffer (ACCB)
0- to 16-bit left and right data barrel-shifters

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ENGINEERING
TMS320C50 Multiplier/Accumulator
Program Bus
Data Bus
16
32 16 16 16
MUX T Register (16) MUX
32 16
16
Multiplier (16 X 16)
Right/Left 32 32
Shifter P Register (32)
(0-16) 32
Left Shifter (0,1,4,-6)

MUX 32
32
32
Arithmetic Logic Unit (ALU)
32
Accumulator Register (32) Accumulator Buffer (32)
16 32
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Left Shifter (0 – 7) ENGINEERING
C50 MEMORY MAPPING
Program Data
0000 0000

INTERNAL
EEPROM
RAM (32KW)
(48KW)
7FFF
8000
BFFF
C000
EXTERNAL
EXTERNAL RAM
RAM (16KW) (32KW)
FFFF
FFFF
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ENGINEERING
TMS320C50 DATA MEMORY

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ENGINEERING
TMS320C50 DATA MEMORY
•Total memory = 0000h – FFFFh (64KW)
•Total no. pages = 200h
•Every page contains 80h locations
•Page 0 = 0h * 80h = 0000 to 007F
•Page 1 = 1h * 80h = 0080 to 00FF
• . . . . . . .
• . . . . . . .
• . . . . . . .

•Page 100 = 100h * 80h = 8000 to 807F
•Page 1FF = 1FFh * 80h = FF80 to FFFF
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ENGINEERING
Addressing Modes
Direct addressing-ADD 9h
Indirect addressing
Immediate addressing-Rpt # 99
Dedicated-register addressing
Memory-mapped register addressing
Circular addressing
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ENGINEERING
Dedicated-register addressing
• BLDD BMAR,DAT 100
BLDD-Block Move from Data memory to
Data memory
• BMAR-Block move Address Register
• BMAR-200h-Predefined
• Data in Address 200h is copied to data
memory location 100h
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ENGINEERING
Memory-mapped register addressing

• LMMR, CBCR #800h

• Data in CBCR is loaded to the location


800H
• CBCR-Circular buffer control Register

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ENGINEERING
Circular addressing

• CBSR-1
• CBSR-2
• CBER-1
• CBER-2
• CBCR

• Used for convolution, correlation & FIR Filter

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ENGINEERING
ASSEMBLEY LANGUAGE PROGRAMS
Linear convloution
.text input :
.mmregs h(n) - program memory
START: c100 - 1
LDP #0002H c101 - 3
LAR 3,#8200H ;y(n) starting c102 - 1
LAR 4,#0007 ;N1+N2-1 c103 - 3
LAR 1,#8100H ; x(n) data array with N1-1 trailing zeros c104 - 0
LOP: MAR *,1 c105 - 0
LACC *+ c106 - 0
SACL 050H ;starting of the scope of multiplication c107 - 0
LAR 2 ,#0153H ; end of the array, to be multiplied with x(n) - data memory
h(n) {150+N1-1} 8100 - 0
MAR *,2 8101 - 1
ZAP 8102 - 2
RPT #0003 ;N1-1 times so that N1 times 8103 - 1
MACD 0C100H,*- output:
APAC ;to accmulate the final product sample y(n) - data memory
MAR *,3 8200 - 1
SACL *+ 8201 - 5
MAR *,4 8202 - 8
BANZ LOP ,*- 8203 - 8
H: B H 8204 - 7
8205 - 3
8206 - 0
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ENGINEERING
Basic software tools for dsp design
•Basic text editor :This can be a very simple application such as
windows notepad.It is used for entering DSP
programs

•Assembler/ Compiler :Used to convert the user editor based files into a
machine readable format

•Conversion :Converts assembled and linked DSP code into a


Utilities DSP chip executable format (.hex, .bin, .asc etc)

•Down loader :It is used to transfer the DSP executable format


into the DSP development board

•Debugger :Enables software to be tested for the particular


DSP device; the debug environment may be in
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formCORE
of aINsimulator
NETWORK or emulator 39
ENGINEERING
Software
Source
Efficiency Effort
C Compiler 80 – 100% Low
C++ Optimizer

ASM Hand 100% High


Optimize

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ENGINEERING
Software Tools

Assembler
optimizer
Link.cmd

Text Assembler Linker Debugger


editor
.asm .obj .out
.c
.c - c source file
.asm - assembly source file
Compiler
.obj - object file
optimizer
.out - executable file
.cmd - linker command file

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ENGINEERING
DSP choosing considerations
• Arithmetic formats
• Data width
• Speed
• Memory organization
• Ease of development
• Multiprocessor support
• Power consumption management
• Cost
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ENGINEERING
• Fixed point Floating point

• -difficult programming -more flexible


• -low cost -easier to program
• -limited dynamic -more expensive
• -range & precision -higher power
consumption

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ENGINEERING
Data widths are
-32 bit
-16 bit
-24 bit
-20 bit

Cost considerations
-chip size
-pin number
-external memory

Memory organization
-On and Off-chip memory size

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ENGINEERING
Development tools:
-software tools
assemblers
linkers
simulators
debuggers
compilers

-hardware tools
development boards
emulators

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ENGINEERING
Cost:

• Least expensive DSPs have


-fewer features
-less on chip Memory
-lower performance

• Chipset price depends on:


-Packaging
-Quantity

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ENGINEERING
MAC using GPP
R0 11
12
3 11 R2
X 24 ∑ 44
R1 1 9
2 Clr A ;Clear Accumulator A
Clr B ; Clear Accumulator B
3 Loop Mov *R0, Y0 ; Move data from memory location 1 to register Y0

Mov *R1,X0 ; Move data from memory location 2 to register X0


Mpy X0,Y0,A ;X0*Y0 ->A

Add A,B ;A + B -> B

Inc R0 ;R0 + 1 -> R0

Inc R1 ;R1 + 1 -> R1

Dec N ;Dec N (initially equals to 3)

Tst N ;Test for the value

Jnz Loop ;Different than zero loop again

Mov B,*R2 ;Move result to memory

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ENGINEERING
MAC using DSP
• Harvard Architecture allows multiple
memory reads
11
12
3 11 R2
X 24 ∑ 44

1 9
2
3 Clr A ;Clear Accumulator A
Rep N ; Rep N times the next instruction
MAC *(R0)+, *(R1)+, A ; Fetch the two memory locations pointed by R0 and R1, multiply
them together and add the result to A, the final result is stored back
in A
Mov A, *R2 ; Move result to memory

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ENGINEERING
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ENGINEERING
•.mmregs
•.text
•Start:
LACC #2345H
LAR AR1,#8000H
LAR AR2,#0fffH
Loop:
MAR *,AR1
SACL *+,AR2
BANZ Loop,*-
HERE:B HERE
.end

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ENGINEERING
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ENGINEERING
TI – 5000 SERIES

TMS320C50
1. MICRO 50 ST
2. MICRO 50 LC
3. MICRO 50 EB
TMS320VC5416
1. MICRO 5416
2. MICRO 5416 AT
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ENGINEERING
TMS 320C50 STARTER KIT

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ENGINEERING
TMS 320C50 TRAINER KIT

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ENGINEERING
C50 TRAINER KIT
MONITOR TIMER & SERIAL
TIMER
EEPROM SERIAL PORT
PORT
LOGIC CONNECTOR
Analog
BUS EXPANDER

EXTERNAL
Output
DATA
MEMORY
C50
PROCESSOR
EXTERNAL Analog
PROGRAM Input
MEMORY
HIGH HIGH RESET
SPEED SPEED LOGIC
ADC DAC
BATTERY
BACKUP
(MICRO 50LC)

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ENGINEERING
TMS320C50 KIT WITH FUNCTION GENERATOR

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ENGINEERING
TMS 320C50 PROFESSIONAL TRAINER KIT

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ENGINEERING
TMS 320VC5416 TRAINER KIT

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ENGINEERING
TMS320VC5416 ADVANCED TRAINER KIT

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ENGINEERING
TI – 6000 SERIES

TMS320C33
1. MICRO 33

TMS320C6713
1. MICRO 6713 AT

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ENGINEERING
TMS 320C33 TRAINER KIT

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ENGINEERING
TMS320C6713 TRAINER KIT

MICRO-6713

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ENGINEERING
TI – 2000 SERIES

TMS320F240
1. MICRO 240

TMS320F2407
1. MICRO 2407
2. MICRO 2407 EB
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ENGINEERING
TMS 320F240 TRAINER KIT

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ENGINEERING
TMS 320F2407 TRAINER KIT

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ENGINEERING
IPM UNIT

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ENGINEERING
TMS 320F240 BASED MOTOR CONTROL

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ENGINEERING
ANALOG DEVICES SERIES

ADSP 2181
1. EZ KIT 81
2. MICRO 81 AD
3. MICRO 81 AT
ADSP 2189
1. MICRO 89 ST
2. MICRO 89 AT
ADSP 2191
1. MICRO 91
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ENGINEERING
ADSP 2181 ADVANCED TRAINER KIT

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ENGINEERING
ADSP 2181 TRAINER KIT

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ENGINEERING
ADSP 2181 TRAINER KIT

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THANK YOU

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ENGINEERING

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