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Vatell’s Heat Flux Microsensors are made using patented thin film processes.
Thin Film construction gives the sensors many unique advantages.
HFM ADVANTAGES
The industry’s fastest response time
Minimal effects on measured variables
Measures both heat flux and temperature
at the face of the sensor
Measures heat flux in all 3 modes
Low electrical noise
Guaranteed quality – warranted for 1 year
HFM Specifications
HFM-6 D/H HFM-7 E/L HFM-7 E/H HFM-8 E/L HFM-8 E/H
(high temp) (low temp) (high temp) (low temp) (high temp)
Temperature sensor sensitivity 0.25-0.35 0.25-0.35 0.25-0.35 13-15 (ºC/mV) 13-15 (ºC/mV)
(ºC/Ω) (ºC/Ω) (ºC/Ω)
Max. temperature is for uncoated sensors; sensor coating max. temperature is 650°C. Max.
temperature for the back end of the sensor is 650ºC and 200ºC for high and low temperature units
respectively. Sensitivity numbers are based on coated sensors with a radiant source.
When purchased with an AMP, your sensor arrives with user-friendly software for signal
conversion and temperature correction. The calibration coefficients for each sensor and amplifier
are automatically included in the software.
Principle of Operation:
This sensor measures two thermal variables at its front surface simultaneously – the rate of
thermal energy flow per unit area (heat flux) and temperature. The polarity of the heat flux signal
indicates the direction of heat flow; its magnitude is proportional to heat flux. Surface temperature
is indicated by a thin film resistance temperature sensor (RTS) or thermocouple.
Construction:
The heat flux and temperature sensors of the HFM are thin films deposited by proprietary
techniques on a ceramic substrate. The heat flux sensor is a differential thermopile, deposited as
a precisely registered composite pattern of three materials.
The diagram below shows a small part of the pattern. When heat flows into or out of the substrate
surface, a small temperature difference develops across the thermal resistance elements of the
thermopile, and each thermocouple pair produces a voltage proportional to the heat flux. The total
voltage across the thermopile is the sum of these voltages, and indicates the direction and
magnitude of the heat flux.
Lower
Lead Thermocouple
Connection
Upper
Thermal
Thermocouple
Resistance
Layer
The temperature sensor of the HFM-7 is a platinum resistor which surrounds the heat flux sensor.
Its resistance value change with the substrate surface temperature. Temperature is usually
determined by passing a small constant current through the resistor and measuring the resulting
voltage. The HFM-8 uses a thermocouple. Substrate surface temperature may be used to correct
the output signal of the heat flux sensor for variations in the thermal resistance element as a
function of temperature. It may also be used to detect changes in the calibration of the heat flux
element and measure the heat transfer coefficient in some applications. The total thickness of the
thin films which make up the HFM is less than 2 microns. As a result, the response time of the
HFM is very rapid, typically less than 20 microseconds.
In order to reap the full advantage of the thin film sensors’ small temperature drop, the HFM
substrate is designed to have the highest possible heat transfer coefficient to the surrounding
material. Sensor housings are copper for low temperature and nickel for high temperature. Both
types of housings use capture nuts to clamp them to the mounting surface, producing a low
resistance thermal path. This allows good heat sinking which is important to the operation of any
heat flux sensor.
HFM may be mounted in a surface or on the end of a probe. Electrical connections are made to a
single Lemo connector at the end of the wire exiting the rear of the sensor. Cold junction
compensation is not required, since the temperature sensors are individually calibrated.