1678-Manual PDF

Proprietary – Use pursuant to Company instruction
Title page
1678 Metro Core Connect (MCC) | Release 4.6

Product Information and Planning Guide
PIPG
3AG 24683 AAAA R4.6
ISSUE 1
JULY 2009
Alcatel-Lucent – Internal
Legal notice
Legal notice
Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective
owners.
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright © 2009 Alcatel-Lucent. All rights reserved.

Contains proprietary/trade secret information which is the property of Alcatel-Lucent and must not be made available to, or copied or used by anyone outside
Alcatel-Lucent without its written authorization.
ot to be used or disclosed except in accordance with applicable agreements.
Alcatel-Lucent – Internal
Contents
About this document

Purpose ........................................................................................................................................................................................ xxix
xxix
Intended audience .................................................................................................................................................................... xxix

xxix
Conventions used ..................................................................................................................................................................... xxix

xxix
Related information .................................................................................................................................................................. xxx

xxx
Technical support ..................................................................................................................................................................... xxxi

xxxi
How to comment ...................................................................................................................................................................... xxxi

xxxi
1 Introduction
1678 MCC network solutions ............................................................................................................................................... 1-1
General Description .................................................................................................................................................................. 1-5

1-5
1678 MCC Main Shelf Equipment View .......................................................................................................................... 1-8
Insertion of the Equipment into the etwork ................................................................................................................ 1-11
Applications .............................................................................................................................................................................. 1-12

1-12
Configuration ............................................................................................................................................................................ 1-16

1-16
etwork Topologies ............................................................................................................................................................... 1-18

1-18
2 Features
Overview ....................................................................................................................................................................................... 2-1

2-1
Physical interfaces
Overview ....................................................................................................................................................................................... 2-3

2-3
Synchronous/electrical interfaces ........................................................................................................................................ 2-4

2-4
Data interfaces ............................................................................................................................................................................ 2-6

2-6
Timing interfaces ....................................................................................................................................................................... 2-7

2-7
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3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal iii
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Contents
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Operations interfaces ................................................................................................................................................................ 2-8

2-8
Power interfaces ......................................................................................................................................................................... 2-9

2-9
Transmission features
Overview .................................................................................................................................................................................... 2-10

2-10
Cross-connection features .................................................................................................................................................... 2-11

2-11
Ethernet features ...................................................................................................................................................................... 2-12

2-12
Forward error correction ....................................................................................................................................................... 2-13

2-13
Ring protection ......................................................................................................................................................................... 2-14

2-14
Line protection ......................................................................................................................................................................... 2-15

2-15
Path protection .......................................................................................................................................................................... 2-16

2-16
Restoration - Support of the GMPLS Protocol ............................................................................................................. 2-17
Equipment features
Overview .................................................................................................................................................................................... 2-19

2-19
Equipment protection ............................................................................................................................................................. 2-20

2-20
Optical interface modules ..................................................................................................................................................... 2-21

2-21
Equipment reports ................................................................................................................................................................... 2-22

2-22
Synchronization and timing
Overview .................................................................................................................................................................................... 2-23

2-23
Timing features ........................................................................................................................................................................ 2-24

2-24
Timing protection .................................................................................................................................................................... 2-25

2-25
Timing interface features ...................................................................................................................................................... 2-26

2-26
3 Topologies and configurations
Overview ....................................................................................................................................................................................... 3-1

3-1
Rack Configurations
Configuration Possibilities ..................................................................................................................................................... 3-3

3-3
Rack Configuration for SO ET markets .......................................................................................................................... 3-6
LA Switches (LSX) ............................................................................................................................................................... 3-7

3-7
Dispersion Compensation Unit (DCU) .............................................................................................................................. 3-8
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Contents
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Housekeeping Monitoring Unit (HMU) ......................................................................................................................... 3-10
Physical configuration of the main shelf
Overview .................................................................................................................................................................................... 3-11

3-11
1678 MCC Main Shelf (SR78) ........................................................................................................................................... 3-12
Equipment Front View .......................................................................................................................................................... 3-16

3-16
Configuration Rules ............................................................................................................................................................... 3-19

3-19
Part List ....................................................................................................................................................................................... 3-30

3-30
Units Front View ..................................................................................................................................................................... 3-39

3-39
Physical configuration of the LO extension shelf
Overview .................................................................................................................................................................................... 3-64

3-64
Lower Order Extension Shelf ............................................................................................................................................. 3-65
Equipment Front View .......................................................................................................................................................... 3-67

3-67
Configuration Rules ............................................................................................................................................................... 3-69

3-69
Connection to the Main Shelf ............................................................................................................................................. 3-74
Part List ....................................................................................................................................................................................... 3-77

3-77
Units Front View ..................................................................................................................................................................... 3-81

3-81
Physical configuration of the OED shelves
Overview .................................................................................................................................................................................... 3-86

3-86
1670SM Shelf - Layout ......................................................................................................................................................... 3-88

3-88
1670SM Shelf - Basic Equipment ..................................................................................................................................... 3-90
1670SM Shelf - Basic Function of the Boards ............................................................................................................. 3-91
1670SM Shelf - I/O Interfaces ........................................................................................................................................... 3-92
1670SM Shelf - System Configurations ......................................................................................................................... 3-93
1670SM Shelf - Connection to the Main Shelf ............................................................................................................ 3-99
1670SM Shelf - Part List ................................................................................................................................................... 3-102
1670SM Shelf - Units Front View .................................................................................................................................. 3-106
1662SMC Shelf - Shelf Layout ....................................................................................................................................... 3-123
1662SMC Shelf - Basic Equipment ............................................................................................................................... 3-124
1662SMC Shelf - Basic Function of the Boards ....................................................................................................... 3-125

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Contents
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1662SMC Shelf - System Configurations .................................................................................................................... 3-126
1662SMC Shelf - Part List ................................................................................................................................................ 3-130
1662SMC Shelf - Units Front View ............................................................................................................................... 3-133
4 Product description
Overview ....................................................................................................................................................................................... 4-1

4-1
General Description
Board types .................................................................................................................................................................................. 4-5

4-5
Centralized Common Boards ................................................................................................................................................ 4-6

4-6
Equipment Units ......................................................................................................................................................................... 4-7

4-7
Traffic Ports boards ................................................................................................................................................................... 4-8

4-8
Lower Order Extension Shelf ............................................................................................................................................. 4-12
Subsystems and involved Boards
General operating functions ................................................................................................................................................ 4-13

4-13
Connections Subsystem
High Order SDH/SO ET/OT Cross Connect Subsystem .................................................................................... 4-17
20/40G Lower Order Subsystem ....................................................................................................................................... 4-18
160G Lower Order Partsystem ........................................................................................................................................... 4-21
Transmission Management .................................................................................................................................................. 4-22

4-22
Connection Management ...................................................................................................................................................... 4-24

4-24
Signal Management Subsystem
Introduction ............................................................................................................................................................................... 4-27

4-27
SDH functional Model .......................................................................................................................................................... 4-28

4-28
ITU-T/ETSI SDH Functional Block ................................................................................................................................ 4-29
Matrix Board ............................................................................................................................................................................. 4-35

4-35
Controller Subsystem
Overview .................................................................................................................................................................................... 4-37

4-37
FLC and SLC Functions ....................................................................................................................................................... 4-39

4-39
External Communication and Routing ............................................................................................................................ 4-44
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Synchronization Subsystem
Synchronous equipment timing .......................................................................................................................................... 4-51
Protection Subsystem
Protection types ........................................................................................................................................................................ 4-54

4-54
EPS Protection Main Shelf .................................................................................................................................................. 4-56

4-56
EPS Protection 1670SM Shelf ............................................................................................................................................ 4-58
EPS Protection 1662SMC Shelf ........................................................................................................................................ 4-62
etwork Protections ............................................................................................................................................................... 4-64

4-64
Performance Monitoring Subsystem
Overview .................................................................................................................................................................................... 4-93

4-93
Monitoring Functions ............................................................................................................................................................ 4-95

4-95
External Interfaces Subsystem
List of external interfaces ..................................................................................................................................................... 4-96

4-96
Power Supply Subsystem
General power information .................................................................................................................................................. 4-98

4-98
1678 MCC Main Shelf .......................................................................................................................................................... 4-99

4-99
OEDs ......................................................................................................................................................................................... 4-104

4-104
Equipment Alarms and Tests Subsystem
General alarm information ................................................................................................................................................ 4-107

4-107
Battery Failure ....................................................................................................................................................................... 4-108

4-108
RUM, RUTM ......................................................................................................................................................................... 4-109

4-109
RUP ............................................................................................................................................................................................ 4-110

4-110
Fuse Failure ............................................................................................................................................................................. 4-111

4-111
Test Management .................................................................................................................................................................. 4-112

4-112
Station Alarms
Description .............................................................................................................................................................................. 4-113

4-113
Features ..................................................................................................................................................................................... 4-114

4-114
Architectural Overview ....................................................................................................................................................... 4-115

4-115
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Contents
...................................................................................................................................................................................................................................
Control of the ( G)TRU .................................................................................................................................................... 4-116

4-116
GTRU Alarm Supervision .............................................................................................................................................. 4-117
Hardware Aspects ................................................................................................................................................................. 4-118

4-118
Supported Customer individual Housekeeping contacts ........................................................................................ 4-121
Housekeeping Monitoring Unit (HMU) ....................................................................................................................... 4-122
Remote Inventory Subsystem
Remote inventory functions .............................................................................................................................................. 4-123
OED Integration
General ...................................................................................................................................................................................... 4-125

4-125
System Requirements .......................................................................................................................................................... 4-126

4-126
Mechanical OED Integration Requirements ............................................................................................................... 4-127
SW OED Integration Requirements ............................................................................................................................... 4-128
Kinds of OEDs ....................................................................................................................................................................... 4-129

4-129
OED Synchronization ......................................................................................................................................................... 4-132

4-132
1678 MCC etwork Requirements
Consistent Time and Clock ............................................................................................................................................... 4-133

4-133
Data Application and Layer 2 Switching
Importance of Ethernet services ...................................................................................................................................... 4-134
4/8/16xGigabit Ethernet Boards ...................................................................................................................................... 4-135
4x10 Gigabit Ethernet Boards .......................................................................................................................................... 4-136
ISA-ES64 Data Board ......................................................................................................................................................... 4-137

4-137
Units Descriptions Main Shelf
Introduction ............................................................................................................................................................................. 4-138

4-138
First Level Controller and Control & General Interface (FLCCO GI) ........................................................... 4-143
First Level Controller and Service Interface (FLCSERV) ..................................................................................... 4-149
Power Supply and Filter Board (PSF) ........................................................................................................................... 4-153
Bus Termination Board (BUSTERM) ........................................................................................................................... 4-156
Matrix 640 Gbit/s Board .................................................................................................................................................... 4-158

4-158
...................................................................................................................................................................................................................................
viii Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
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Matrix 320/160 Gbit/s Enhanced Board (MX320 / MX160) ................................................................................ 4-170
Lower Order Adaptation and Matrix 40G and 20G (LAX40 and LAX20) ..................................................... 4-171
STM-64 traffic Port Boards with not pluggable MSA Modules .......................................................................... 4-175
STM-64 traffic Port Boards with pluggable XFP MSA Modules ....................................................................... 4-181
STM-16 traffic Port Board (P16S16) ............................................................................................................................ 4-184
STM-16 Traffic Port Board (P4S16, P8S16) .............................................................................................................. 4-189
16xSTM-1/4 Traffic Port Board (P16S1-4) ................................................................................................................. 4-190
16xSTM-1 Traffic Port Board (P16S1S) ...................................................................................................................... 4-191
4/8/16xGigabit Ethernet Port Board .............................................................................................................................. 4-192
2x/4x10 Gigabit Ethernet Port Board ............................................................................................................................ 4-198
ES64 Server Card .................................................................................................................................................................. 4-203

4-203
FA Unit (FA ) .................................................................................................................................................................... 4-213

4-213
Units Descriptions Lower order extension shelf
Introduction ............................................................................................................................................................................. 4-216

4-216
Lower Order Adaptation Board 20G (LA20) ............................................................................................................. 4-217
Lower Order Matrix 160 Gbit/s Board ......................................................................................................................... 4-220
Alarm Board (ALM) ............................................................................................................................................................ 4-222

4-222
Power Supply and Filter Board (PSF) ........................................................................................................................... 4-225
Bus Termination Board (BUSTERM) ........................................................................................................................... 4-226
Units Descriptions OED shelf 1670SM
Introduction ............................................................................................................................................................................. 4-227

4-227
4xSTM-1Electrical I/O Interface .................................................................................................................................... 4-228
16xSTM-1Electrical I/O Interface .................................................................................................................................. 4-232
4xSTM-1Optical I/O Interface ......................................................................................................................................... 4-234
16xSTM-1 Optical I/O Interface ..................................................................................................................................... 4-238
I/O Port Board STM-4 ........................................................................................................................................................ 4-240

4-240
I/O Port Board 4xSTM-4 ................................................................................................................................................... 4-242
4x140 Mbit/s Port Board (P4E4 ) ................................................................................................................................. 4-245
High Speed Port Protection Using HPROT and HPROT16 Boards .................................................................. 4-249
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3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal ix
Contents
...................................................................................................................................................................................................................................
Optical Link Enhanced (HCLI KE) ............................................................................................................................. 4-252
Bus Termination (BTERM) ............................................................................................................................................... 4-255

4-255
Control and General Interface Board (CO GIHC) .................................................................................................. 4-256
Matrix Board (HCMATRIX) ............................................................................................................................................ 4-259
FA s Unit ................................................................................................................................................................................ 4-263

4-263
Units Descriptions OED shelf 1662SMC
Introduction ............................................................................................................................................................................. 4-266

4-266
63x2 Mbit/s Access Board ................................................................................................................................................. 4-267

4-267
Low Speed Protection ......................................................................................................................................................... 4-269

4-269
63x2 Mbit/s Port Board (P63E1) ..................................................................................................................................... 4-270
63x2 Mbit/s / G703 / ISD -PRA Port Board (P63E1 ) ........................................................................................ 4-274
CO GI Board ........................................................................................................................................................................ 4-280

4-280
SY TH16 Board .................................................................................................................................................................. 4-284

4-284
FA Unit for FA Shelf .................................................................................................................................................... 4-293
5 Operations, administration, maintenance, and provisioning (OAM&P)
Overview ....................................................................................................................................................................................... 5-1

5-1
Operations
Overview ....................................................................................................................................................................................... 5-2

5-2
Visible alarm indicators ........................................................................................................................................................... 5-3

5-3
Craft Terminal ............................................................................................................................................................................. 5-8

5-8
TL1 Interface ............................................................................................................................................................................ 5-10

5-10
6 Quality and reliability
Alcatel-Lucent’s commitment to quality and reliability .............................................................................................. 6-1
Ensuring quality ......................................................................................................................................................................... 6-2

6-2
Conformity statements ............................................................................................................................................................. 6-3

6-3
Electromagnetic Compatibility ............................................................................................................................................. 6-4

6-4
Electrostatic Dischargers (ESD) ........................................................................................................................................... 6-6

6-6
Labels affixed to the Equipment ........................................................................................................................................... 6-7

6-7
...................................................................................................................................................................................................................................
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7 Technical specifications
Overview ....................................................................................................................................................................................... 7-1

7-1
General Characteristics
Standards and interfaces .......................................................................................................................................................... 7-3

7-3
Electrical Interface Characteristics
Electrical Transmission Interfaces ....................................................................................................................................... 7-8

7-8
Electrical Safety ....................................................................................................................................................................... 7-10

7-10
Optical Interface Characteristics
STM- Optical Characteristics .......................................................................................................................................... 7-11

7-11
Optical Safety ........................................................................................................................................................................... 7-29

7-29
Power Supply Characteristics
Electrical specifications ........................................................................................................................................................ 7-34

7-34
Alarm Characteristics
Units Alarms .............................................................................................................................................................................. 7-35

7-35
Equipment Alarms and Trouble-shooting ....................................................................................................................... 7-36
Auto Port Monitoring ............................................................................................................................................................. 7-37

7-37
Mechanical Characteristics
1678 MCC Rack ...................................................................................................................................................................... 7-38

7-38
OED Rack .................................................................................................................................................................................. 7-39

7-39
1678 MCC Main Shelf .......................................................................................................................................................... 7-40

7-40
1678 MCC Main Shelf (SO ET) ...................................................................................................................................... 7-41
1670SM Shelf ........................................................................................................................................................................... 7-42

7-42
1662SMC Shelf ........................................................................................................................................................................ 7-43

7-43
Environmental Conditions
General aspects ......................................................................................................................................................................... 7-44

7-44
Waste from Electrical and Electronic Equipment (WEEE) ..................................................................................... 7-45
Acoustical noise ....................................................................................................................................................................... 7-46

7-46
Climatic for Operating Conditions .................................................................................................................................... 7-47
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3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xi
Contents
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Storage ......................................................................................................................................................................................... 7-50

7-50
Transportation ........................................................................................................................................................................... 7-53

7-53
EMI/EMC Condition .............................................................................................................................................................. 7-55

7-55
Dismantling & recycling
WEEE general Information ................................................................................................................................................. 7-56

7-56
How to disassemble equipment .......................................................................................................................................... 7-57
Tools necessary for disassembly ........................................................................................................................................ 7-58
Procedure 7-1: Shelf Disassembly .................................................................................................................................... 7-59
Procedure 7-2: Unit Disassembly ...................................................................................................................................... 7-66
Hazardous Materials and Components ............................................................................................................................ 7-77
ECO Declaration ...................................................................................................................................................................... 7-79

7-79
Glossary
Index
...................................................................................................................................................................................................................................
xii Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of tables
3-1 Main Rack Configurations with DCU ............................................................................................................... 3-8
3-2 OED Rack Configurations with DCU ................................................................................................................ 3-8
3-3 1678 MCC Equipment: slot configuration ..................................................................................................... 3-19
3-4 Pluggable Optical and Electrical Modules ..................................................................................................... 3-21
3-5 1678 MCC Equipment: slot configuration explanation notes ................................................................. 3-22
3-6 Main parts list ........................................................................................................................................................... 3-30

3-30
3-7 Accessories list ......................................................................................................................................................... 3-34

3-34
3-8 Parts list: explanatory notes ................................................................................................................................. 3-36
3-9 1678 MCC LO Shelf Equipment: slot configuration ................................................................................. 3-69
3-10 Pluggable Optical Modules ................................................................................................................................. 3-69
3-11 1678 MCC LO Shelf Equipment: slot configuration explanation notes ............................................. 3-69
3-12 Main parts list ........................................................................................................................................................... 3-77

3-77
3-13 Accessories list ......................................................................................................................................................... 3-78

3-78
3-14 Parts list: explanatory notes ................................................................................................................................. 3-79
3-15 Basic Equipment of the 1670SM Shelf ........................................................................................................... 3-90
3-16 1670SM: General Configuration Rules for the I/O Boards ..................................................................... 3-94
3-17 1670SM: Slot relation Port/Access Boards ................................................................................................... 3-95
3-18 1670SM: Position of the Port Boards in the Shelf ...................................................................................... 3-95
3-19 1670SM: Interface specific Configuration Rules ........................................................................................ 3-96
3-20 1670SM: Allowed mix of I/O Boards .............................................................................................................. 3-98
3-21 Main part list .......................................................................................................................................................... 3-102

3-102
3-22 Accessories list ...................................................................................................................................................... 3-104

3-104
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3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xiii
List of tables
...................................................................................................................................................................................................................................
3-23 Parts list: explanatory notes .............................................................................................................................. 3-104
3-24 1662SMC: Basic Equipment ............................................................................................................................ 3-124
3-25 1662SMC: Relation Access / Port Boards ................................................................................................... 3-126
3-26 1662SMC: Configuration Rules ...................................................................................................................... 3-127
3-27 Main part list .......................................................................................................................................................... 3-130

3-130
3-28 Accessories list ...................................................................................................................................................... 3-131

3-131
3-29 Parts list: explanatory notes .............................................................................................................................. 3-131
4-1 Subsystems and involved boards ....................................................................................................................... 4-15
4-2 Point-to-point connections ................................................................................................................................... 4-25
4-3 Maximum number of DCC channels ............................................................................................................... 4-38
4-4 EPS Protection Scheme parameters ................................................................................................................. 4-57
4-5 S CP configuration ............................................................................................................................................... 4-70
4-6 External Interfaces .................................................................................................................................................. 4-96

4-96
4-7 Rack Lamp Colors ................................................................................................................................................ 4-120
4-8 Units involved in 1678 MCC Main Shelf .................................................................................................... 4-138
4-9 Electrical Modules involved in 1678 MCC Main Shelf ......................................................................... 4-139
4-10 Optical Modules involved in 1678 MCC Main Shelf ............................................................................. 4-139
4-11 Power characteristics ........................................................................................................................................... 4-162
4-12 ES64 Performance Parameters ........................................................................................................................ 4-212
4-13 Units involved in 1678MCC LO Extension Shelf .................................................................................... 4-216
4-14 Modules involved in 1678MCC LO Extension Shelf ............................................................................. 4-216
4-15 Units involved in 1670SM ................................................................................................................................ 4-227
4-16 Pluggable Modules involved in 1670SM ..................................................................................................... 4-227
4-17 Interfaces on the Boards CO GIHC A and B ............................................................................................ 4-256
4-18 Units involved in 1662SMC ............................................................................................................................. 4-266
4-19 CO GI A and CO GI B interfaces ............................................................................................................... 4-280
4-20 Rack lamps signals ............................................................................................................................................... 4-281
6-1 Label references ......................................................................................................................................................... 6-7

6-7
7-1 Parameters specified for STM-1 optical interface ...................................................................................... 7-12
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xiv Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of tables
...................................................................................................................................................................................................................................
7-2 Parameters specified for STM-4 optical interface ...................................................................................... 7-13
7-3 Parameters specified for STM-16 optical interfaces .................................................................................. 7-14
7-4 Parameters specified for STM-16 colored optical interfaces .................................................................. 7-15
7-6 Parameters specified for STM-64 optical interface - P1L1-2D2 long-haul application ............... 7-18
7-8 Parameters specified for STM-64 colored optical interfaces .................................................................. 7-22
7-9 Parameters specified for 1000B-SX Optical Interface .............................................................................. 7-23
7-10 Parameters specified for 1000B-LX Optical Interface .............................................................................. 7-24
7-11 Parameters specified for 1000B–ZX Optical Interface ............................................................................. 7-25
7-12 Parameters specified for 10GE-SR ................................................................................................................... 7-26
7-13 Parameters specified for 10GE-LR,-ER,-ZR ................................................................................................ 7-27
7-14 Hazard level classification of different optical interfaces ........................................................................ 7-29
7-15 Incorporated laser sources characteristics ...................................................................................................... 7-30
7-16 Relation between Alarm severity terminology ............................................................................................. 7-36
7-17 Climate parameters for environmental class 3.1 .......................................................................................... 7-48
7-18 Climate parameters for environmental class 1.2 .......................................................................................... 7-51
7-19 Climatic conditions for environmental classes 2.1/2.2 .............................................................................. 7-53
7-20 List of hazardous materials and components present in the equipment .............................................. 7-77
7-21 Power Consumption ............................................................................................................................................... 7-80
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xv
List of figures
1-1 1678 MCC scenario .................................................................................................................................................. 1-2
1-2 Management Interfaces of 1678 MCC ............................................................................................................... 1-4
1-3 1678 MCC SDH/SO ET Multiplexing Schemes ......................................................................................... 1-6
1-4 1678 MCC Main Shelf - Front View .................................................................................................................. 1-8
1-5 1678 MCC Main Shelf - Side View .................................................................................................................... 1-9
1-6 1678 MCC Main Shelf - Board View .............................................................................................................. 1-10
1-7 Terminal multiplexer .............................................................................................................................................. 1-16

1-16
1-8 Add/Drop Multiplexer ........................................................................................................................................... 1-16
1-9 ”HUB” STM–1 ........................................................................................................................................................ 1-16
1-10 Point–to–point links ............................................................................................................................................... 1-18
1-11 Linear Drop–insert .................................................................................................................................................. 1-18
1-12 Ring structure ........................................................................................................................................................... 1-19

1-19
1-13 Meshed Topology .................................................................................................................................................... 1-20
3-1 Schematic 1678 MCC Main Rack Configurations with Main and OED Shelves .............................. 3-4
3-2 Schematic 1678 MCC Rack Configurations with LO Extension Shelf ................................................. 3-4
3-3 Schematic OED Rack Configurations ................................................................................................................ 3-5
3-4 Schematic SO ET Rack Configurations .......................................................................................................... 3-6
3-5 General LA Cabling for multirack configurations ..................................................................................... 3-7
3-6 Dispersion Compensation Unit (DCU) .............................................................................................................. 3-9
3-7 Housekeeping Monitoring Unit (HMU) ......................................................................................................... 3-10
3-8 1678 MCC Main Shelf Layout ........................................................................................................................... 3-12
3-9 1678 MCC Equipment front view (slot position) ........................................................................................ 3-17
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xvii
List of figures
...................................................................................................................................................................................................................................
3-10 Main Shelf: Supported I/O boards - Part 1 .................................................................................................... 3-25
3-11 Main Shelf: Supported I/O boards - Part 2 .................................................................................................... 3-26
3-12 Basic configuration of 1678 MCC Main Shelf ............................................................................................ 3-28
3-13 Allowed Equipment Configuration (Example) ............................................................................................ 3-29
3-14 4xGE, 4xSTM-16 optical port board - front view ....................................................................................... 3-40
3-15 8xGE, 8xSTM-16 optical port board - front view ....................................................................................... 3-41
3-16 LAC40, 16xGE,16xSTM-16,16xSTM-4/1, 16xSTM-1E port board - front view .......................... 3-42
3-17 1xSTM-64 (S64M) optical port board - front view .................................................................................... 3-43
3-18 2xSTM-64 (P2S64M) optical port board - front view ............................................................................... 3-44
3-19 4xSTM-64 (P4S64M) optical port board - front view ............................................................................... 3-45
3-20 1xSTM-64 (L-642M) optical port board - front view ................................................................................ 3-46
3-21 1xSTM-64 (V-642M) optical port board - front view ............................................................................... 3-47
3-22 1xSTM-64 (U-642M) optical port board - front view ............................................................................... 3-48
3-23 Connector assignment of L-642M, V-642M and U-642M boards -Part 1 ......................................... 3-49
3-24 Connector assignment of L-642M, V-642M and U-642M boards -Part 2 ......................................... 3-50
3-25 2xSTM-64 XFP/XFP-E - Front View .............................................................................................................. 3-51
3-26 4xSTM-64 XFP/XFP-E - Front View .............................................................................................................. 3-52
3-27 2x10GE LA - Front View ................................................................................................................................. 3-53
3-28 4x10GE LA - Front View ................................................................................................................................. 3-54
3-29 ES64SC - Front View ............................................................................................................................................ 3-55
3-30 First Level Controller and Service Interfaces board - front view .......................................................... 3-56
3-31 First Level Controller and Control&General Interfaces board - front view ...................................... 3-57
3-32 Matrix board - front view ..................................................................................................................................... 3-58
3-33 Lower Order Matrix board - front view .......................................................................................................... 3-59
3-34 Power Supply and Filter board - front view .................................................................................................. 3-60
3-35 FA unit - front view ............................................................................................................................................ 3-60
3-36 Optical SFP Module ............................................................................................................................................... 3-61
3-37 Electrical SFP Module ........................................................................................................................................... 3-61
3-38 Optical XFP Module .............................................................................................................................................. 3-62
...................................................................................................................................................................................................................................
xviii Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of figures
...................................................................................................................................................................................................................................
3-39 Optical colored DWDM APD XFP Module (only supported in R4.3.2 and higher Rel.) ............ 3-62
3-40 Optical XFP-E Module ......................................................................................................................................... 3-63
3-41 Lower Order Extension Shelf Layout .............................................................................................................. 3-65
3-42 Lower Order Extension Shelf Equipment front view (slot position) ................................................... 3-68
3-43 Lower Order Extension Shelf: Supported Adaptation Board .................................................................. 3-70
3-44 Basic configuration of LO Extension Shelf ................................................................................................... 3-72
3-45 Configuration of the 160G LO extension Shelf ........................................................................................... 3-73
3-46 Connection of 160G LO Extension Shelf with the Main Shelf .............................................................. 3-74
3-47 VC-4 mapping on LA20 Boards ........................................................................................................................ 3-76
3-48 Lower Order Adaptation 20G board - front view ........................................................................................ 3-81
3-49 Alarm board - front view ...................................................................................................................................... 3-82
3-50 LO Centerstage Matrix Board - front view .................................................................................................... 3-83
3-51 Power Supply and Filter board - front view .................................................................................................. 3-84
3-52 FA unit - front view ............................................................................................................................................ 3-84
3-53 Electrical SFP Module with cable assembled ............................................................................................... 3-85
3-54 1670SM Shelf Front View ................................................................................................................................... 3-88
3-55 1670SM: Relation Port/Access Boards ........................................................................................................... 3-93
3-56 1670SM: Flexible Shelf equipped with 16xSTM-1e EPS protected and other I/O Boards ......... 3-97
3-57 Assignment of I/O Boards to the Link Boards ............................................................................................. 3-99
3-58 Example for a Connection Main Shelf /1670SM (4 links, 1+1 MSP full protected) ................... 3-101
3-59 4x140/STM-1 Switchable E/O Port Board or 4xSTM-4 Port Board - Front View ...................... 3-107
3-60 4xSTM-1 E/16xSTM-1 E/O Port Board - Front View ............................................................................ 3-108
3-61 16xSTM-1 COMPACT optical Port Board - front view ........................................................................ 3-109
3-62 2x140Mbit/s/STM-1/STM-4 Access Board Optical - Front View ...................................................... 3-110
3-63 4xSTM-1 Electrical 75 Ohm Access Board - Front View ...................................................................... 3-111
3-64 16xSTM-1 Electrical 75 Ohm Access Board - Front View ................................................................... 3-112
3-65 12xSTM-1 COMPACT optical Access Board - Front View ................................................................. 3-113
3-66 High-Speed Protection Board - Front View ................................................................................................ 3-114
3-67 Bus Termination Board - Front View ............................................................................................................ 3-115
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xix
List of figures
...................................................................................................................................................................................................................................
3-68 HiCap Matrix Board - Front View .................................................................................................................. 3-116
3-69 Optical Link Enhanced Board - Front view ................................................................................................ 3-117
3-70 Optical Link LC CO ECTOR Board - Front view .............................................................................. 3-118
3-71 Control and Generic Interface Board - Front View .................................................................................. 3-119
3-72 FA s Subrack Cover - Front View ................................................................................................................ 3-120
3-73 Shelf ID Connector for 1670SM ..................................................................................................................... 3-120
3-74 Electrical pluggable module ............................................................................................................................. 3-121
3-75 STM-4 Optical Modules .................................................................................................................................... 3-121
3-76 Optical SFP module ............................................................................................................................................. 3-122
3-77 1662SMC Shelf Front View ............................................................................................................................. 3-123
3-78 1662SMC: I/O Boards. Relation Access/Port Boards ............................................................................. 3-126
3-79 1662SMC Equipment: Unprotected Configuration with 2Mbit/s ....................................................... 3-127
3-80 1662SMC Equipment: Protected Configuration with 2Mbit/s ............................................................. 3-128
3-81 Connection Main Shelf/1662SMC (1+1MSP protected) ....................................................................... 3-129
3-82 63 x 2 Mbit/s Port Board - Front View ......................................................................................................... 3-134
3-83 Control and General Interface - Front View ............................................................................................... 3-135
3-84 SY TH16 Board - Front View ........................................................................................................................ 3-136
3-85 63 x 2 Mbit/s Access Board - Front View .................................................................................................... 3-137
3-86 Low Speed Protection Board - Front View ................................................................................................. 3-138
3-87 FA s Subrack Cover - Front View ................................................................................................................ 3-139
3-88 STM-16 optical SFP module ............................................................................................................................ 3-139
3-89 Shelf ID Connector for 1662SMC .................................................................................................................. 3-140
4-1 1678 MCC Block Diagram .................................................................................................................................. 4-14
4-2 Low Order Matrix Overview .............................................................................................................................. 4-18
4-3 Physical Matrix View with MX640 and LAX40 ......................................................................................... 4-19
4-4 Logical Matrix View .............................................................................................................................................. 4-20
4-5 1678 MCC Main Shelf with 160G Lower Order Shelf ............................................................................. 4-21
4-6 Types of connections managed .......................................................................................................................... 4-26
4-7 SDH payload subsystem functional model: physical position of functional blocks ....................... 4-28
...................................................................................................................................................................................................................................
xx Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of figures
...................................................................................................................................................................................................................................
4-8 Port board implementation and corresponding ITU-T G.783 functional model .............................. 4-29
4-9 Matrix board implementation: payload processing .................................................................................... 4-35
4-10 Physical LA Topology of Main shelf only configuration ..................................................................... 4-39
4-11 Physical LA Topology of Main shelf with single 1670SM OED configuration .......................... 4-41
4-12 Physical LA Topology of Main shelf with single 1662SMC OED configuration ....................... 4-41
4-13 Physical LA Topology of Main shelf with single LO extension shelf ............................................. 4-42
4-14 Physical LA Topology of Multi Rack Setup .............................................................................................. 4-43
4-15 Example of a routing domain ............................................................................................................................. 4-45
4-16 OSI protocol stack (layer 1 - 3) .......................................................................................................................... 4-46
4-17 Multiple Rings on 1678 MCC as Transit E ................................................................................................ 4-49
4-18 Multiple Rings on 1678 MCC as Gateway E ............................................................................................ 4-50
4-19 SETS function .......................................................................................................................................................... 4-51

4-51
4-20 MSP Linear 1+1 single and dual ended protection ..................................................................................... 4-66
4-21 MSP Linear 1: Dual-Ended protection ........................................................................................................ 4-68
4-22 Typical ring network with S CP ...................................................................................................................... 4-71
4-23 Failure examples in S CP ring .......................................................................................................................... 4-72
4-24 Drop and Continue D/C A I S A and D/C A I S B .................................................................................. 4-74
4-25 Drop and Continue .................................................................................................................................................. 4-75
4-26 Drop and Continue - 1st and 2nd failure ........................................................................................................... 4-76
4-27 2F MS SPRI G Connection ............................................................................................................................... 4-77
4-28 Effect of a BRIDGE "B side" operation ......................................................................................................... 4-79
4-29 Effect of a BRIDGE "A side" operation ......................................................................................................... 4-79
4-30 Effect of SWITCH "B side" operation ............................................................................................................ 4-80
4-31 Effect of SWITCH "A side" operation ............................................................................................................ 4-80
4-32 Line break recovering operations ...................................................................................................................... 4-81
4-33 2F MS-SPRI G example of operation ........................................................................................................... 4-83
4-34 Squelching on isolated ode connection ....................................................................................................... 4-84
4-35 MS SPRI G Drop and Continue, Insert Continues (protected) ............................................................ 4-86
4-36 Collapsed dual node interconnection ............................................................................................................... 4-88
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxi
List of figures
...................................................................................................................................................................................................................................
4-37 Collapsed dual node interconnection - 1st and 2nd failure ......................................................................... 4-89
4-38 Collapsed single node ring interconnection .................................................................................................. 4-90
4-39 Collapsed single node ring interconnection -1st failure ............................................................................. 4-91
4-40 Collapsed single node ring interconnection -2nd failure ............................................................................ 4-92
4-41 Step-up Converter - Location of Jumper ...................................................................................................... 4-100
4-42 1678 MCC Power Supply with 3-wire FPE ................................................................................................ 4-101
4-43 1678 MCC Power Supply with 2-wire FPE ................................................................................................ 4-102
4-44 Power distribution ................................................................................................................................................ 4-103
4-45 OED Shelf Power Supply with 3-wire FPE ................................................................................................ 4-105
4-46 OED Shelf Power Supply with 2-wire FPE ................................................................................................ 4-106
4-47 Station Alarm System Architecture - Physical View ............................................................................... 4-115
4-48 Rack Lamp Interfaces including GP Contacts of 1678 MCC Shelf ................................................... 4-118
4-49 Rack Lamp Interfaces including GP Contacts of LO Extension Shelf .............................................. 4-119
4-50 Rack Lamp Interfaces including GP Contacts of 1670SM Shelf ........................................................ 4-119
4-51 Rack Lamp Interfaces including GP Contacts of 1662SMC Shelf ..................................................... 4-120
4-52 Schematic Drawing of HMU Architecture .................................................................................................. 4-122
4-53 Remote Inventory Subsystem .......................................................................................................................... 4-124
4-54 Schematic drawing of OED Integration ....................................................................................................... 4-127
4-55 Layout of the 1670SM Shelf ............................................................................................................................ 4-130
4-56 1662SMC Shelf Front View ............................................................................................................................. 4-131
4-57 OED Synchronization for ETSI application ............................................................................................... 4-132
4-58 Block Diagram and external Interfaces of FLCCO GI enhanced ..................................................... 4-143
4-59 Block Diagram and external Interfaces of FLCSERV(A) enhanced ................................................. 4-149
4-60 PSF Functional Block Diagram ....................................................................................................................... 4-155
4-61 BUSTERM Functional Block Diagram ........................................................................................................ 4-157
4-62 Matrix Board Functional Block Diagram .................................................................................................... 4-159
4-63 Payload Subsystem Logical Block Diagram .............................................................................................. 4-160
4-64 Payload Subsystem Physical Block Diagram ............................................................................................. 4-161
4-65 Power Subsystem Block Diagram .................................................................................................................. 4-162
...................................................................................................................................................................................................................................
xxii Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of figures
...................................................................................................................................................................................................................................
4-66 CRU, On- and Off- Board Connections in SDH Applications ............................................................. 4-164
4-67 CRU, On- and Off- Board Connections in SO ET Applications ....................................................... 4-166
4-68 PQ2/SCM Control Interfaces ........................................................................................................................... 4-168
4-69 LAX40 Functional Overview ........................................................................................................................... 4-172
4-70 LAX40 (LAX20) Board Block Diagram ..................................................................................................... 4-174
4-71 Equipping Options of STM-64 Boards ......................................................................................................... 4-176
4-72 STM-64 Board Functional Block Diagram ................................................................................................. 4-178
4-73 STM-64 Board Payload Subsystem Block Diagram ............................................................................... 4-179
4-74 STM-64 Board Power Supply Block Diagram .......................................................................................... 4-179
4-75 STM-64 Board Timing and Clock Block Diagram .................................................................................. 4-180
4-76 Functional Blocks of the 4xSTM-64 Port Board ...................................................................................... 4-182
4-77 Functional Blocks of the 2xSTM-64 Port Board ...................................................................................... 4-183
4-78 STM-64 XFP Board Timing and Clock Block Diagram ........................................................................ 4-183
4-79 STM-16 board Functional Block Diagram .................................................................................................. 4-185
4-80 STM-16 Board Payload Subsystem Block Diagram ............................................................................... 4-186
4-81 STM-16 Board Power Supply Block Diagram .......................................................................................... 4-187
4-82 STM-16 Board Timing and Clock Block Diagram .................................................................................. 4-187
4-83 GE Board Block Diagram ................................................................................................................................. 4-195
4-84 Ethernet Virtual Private Line Service ............................................................................................................ 4-199
4-85 10GE LA Board Block Diagram ................................................................................................................. 4-201
4-87 Functionality ........................................................................................................................................................... 4-204

4-204
4-88 Management and Control .................................................................................................................................. 4-205
4-89 ES64SC Block Diagram ..................................................................................................................................... 4-206
4-90 Data Path .................................................................................................................................................................. 4-207

4-207
4-92 ISA–ES64 Management Domains – S MP And Q3 management .................................................... 4-211
4-93 FA Functional Block Diagram ..................................................................................................................... 4-215
4-94 LA20 Functional Overview .............................................................................................................................. 4-218
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxiii
List of figures
...................................................................................................................................................................................................................................
4-95 LA20 Board Block Diagram ............................................................................................................................ 4-219
4-96 LO Centerstage Matrix Board Functional Block Diagram .................................................................... 4-221
4-97 ALM Board Functional Block Diagram ....................................................................................................... 4-224
4-98 Block Diagram 4xSTM-1 Electrical I/O Interface ................................................................................... 4-229
4-99 Block Diagram Access Board 4xSTM-1 Electrical (A4ES1) ............................................................... 4-231
4-100 Relation between Port Boards/Access Boards ........................................................................................... 4-232
4-101 Block Diagram 16xSTM-1 Electrical I/O Interface ................................................................................. 4-233
4-102 Block Diagram 4xSTM-1 Optical I/O Interface ........................................................................................ 4-235
4-103 Block Diagram Access Board 2xSTM-1 Optical (A2S1) ...................................................................... 4-236
4-104 Block Diagram STM-1 Optical Module ....................................................................................................... 4-237
4-105 Relation between Port Boards/Access Boards ........................................................................................... 4-238
4-106 Block Diagram Optical STM-4 I/O Port Board ......................................................................................... 4-241
4-107 Block Diagram Access Board 2xSTM-4 Optical (A2S4) ...................................................................... 4-243
4-108 Block Diagram STM-4 Optical Module ....................................................................................................... 4-244
4-109 P4E4 Port Board Block Diagram ................................................................................................................ 4-246
4-110 A2S1 Access Board Block Diagram .............................................................................................................. 4-247
4-111 ICMI Module Block Diagram .......................................................................................................................... 4-248
4-112 Block Diagram HPROT Board ........................................................................................................................ 4-249
4-113 BTERM Board Block Diagram ....................................................................................................................... 4-255
4-114 CO GIHC Board Block Diagram ................................................................................................................. 4-257
4-115 HCMATRIX Board Block Diagram .............................................................................................................. 4-262
4-116 FA s Unit Block Diagram ................................................................................................................................ 4-265
4-117 63x2 Access Board - Block Diagram ............................................................................................................ 4-268
4-118 LSPROT Board - Block Diagram ................................................................................................................... 4-269
4-119 63x2 Mbit/s Board - Block Diagram ............................................................................................................. 4-273
4-120 63x2 Mbit/s G.703/ISD -PRA, Block Diagram ...................................................................................... 4-278
4-121 Functional Diagram of the T ISD -PRA Block .................................................................................... 4-279
4-122 CO GI - Block Diagram ................................................................................................................................... 4-283
4-123 SY TH16 - Block Diagram ............................................................................................................................. 4-292
...................................................................................................................................................................................................................................
xxiv Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of figures
...................................................................................................................................................................................................................................
4-124 FA s Shelf 19" General Block Diagram ..................................................................................................... 4-295
4-125 FA s Unit for FA Shelf 19" Block Diagram .......................................................................................... 4-296
5-1 Example of network management architecture via Craft Terminal ......................................................... 5-9
5-2 Example of network management architecture via TL1 interface ........................................................ 5-10
6-1 Subrack label (1) ........................................................................................................................................................ 6-8

6-8
6-2 Subrack label (2) ........................................................................................................................................................ 6-9

6-9
6-3 Subrack label (3) ..................................................................................................................................................... 6-10
6-4 Labels on units with standard cover plate ...................................................................................................... 6-11
6-5 Modules label ........................................................................................................................................................... 6-12

6-12
6-6 Internal label for Printed Board Assembly ..................................................................................................... 6-12
6-7 Back panels internal label .................................................................................................................................... 6-13
6-8 Label specifying item not on catalogue (P/ and serial number) ......................................................... 6-14
6-9 Label specifying item on catalogue (P/ and serial number) ................................................................. 6-14
6-10 Item identification labels - item on catalog ................................................................................................... 6-14
6-11 Label identifying the equipment (example) .................................................................................................. 6-15
6-12 CE Label ..................................................................................................................................................................... 6-15

6-15
6-13 WEEE Label ............................................................................................................................................................. 6-15

6-15
7-1 Long Haul Application (L-64.2) ........................................................................................................................ 7-20
7-2 Very Long Haul Application (V-64.2) ............................................................................................................. 7-20
7-3 Ultra Long Haul Application (U-64.2) ............................................................................................................ 7-21
7-4 Climatogram for Class 3.1 ................................................................................................................................... 7-48
7-5 Climatogram for Class 1.2 ................................................................................................................................... 7-51
7-6 Shelf Front and Rear View .................................................................................................................................. 7-59
7-7 Handle Removal and Disassembly ................................................................................................................... 7-60
7-8 Rear Cover Removal .............................................................................................................................................. 7-61
7-9 Back Panel Removal .............................................................................................................................................. 7-62
7-10 Upper and Lower Guides Plane Removal ...................................................................................................... 7-63
7-11 Side Wall Removal ................................................................................................................................................. 7-64

7-64
7-12 Optical Fiber Duct, Guides and Contact Spring Removal ....................................................................... 7-65
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxv
List of figures
...................................................................................................................................................................................................................................
7-13 Side Coverplate Removal ..................................................................................................................................... 7-66
7-14 Levers Removal ....................................................................................................................................................... 7-67

7-67
7-15 Optical Connectors Support Removal ............................................................................................................. 7-68
7-16 Side Coverplate and Contact Spring Removal ............................................................................................. 7-69
7-17 Internal Connectors Removal ............................................................................................................................. 7-70
7-18 Dissipator Removal ................................................................................................................................................ 7-71
7-19 Modules Removal from Dissipator ................................................................................................................... 7-72
7-20 Daughter Board Removal ..................................................................................................................................... 7-73
7-21 Gold Connector Removal ..................................................................................................................................... 7-74
7-22 Internal Cables Removal ...................................................................................................................................... 7-75
7-23 Connector metal Support Removal ................................................................................................................... 7-76
...................................................................................................................................................................................................................................
xxvi Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
List of procedures
7-1 Shelf Disassembly .................................................................................................................................................. 7-59
7-2 Unit Disassembly .................................................................................................................................................... 7-66

7-66
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxvii
About this document
About this document
Purpose
This Product Information and Planning Guide (PIPG) provides the following information
about 1678 Metro Core Connect (MCC):
• Features
• Applications
• Topologies and configurations
• Product description
• Operations, administration, maintenance, and provisioning (OAM&P)
• Quality and reliability
• Technical specifications
Intended audience
The Product Information and Planning Guide (PIPG) is primarily intended for network
planners and engineers. In addition, others who need specific information about the
features, applications, operation, and engineering of 1678 MCC find useful information in
this manual.
Conventions used
These conventions are used in this document:
Numbering
The chapters of this document are numbered consecutively. The page numbering restarts
at “1” in each chapter. To facilitate identifying pages in different chapters, the page
numbers are prefixed with the chapter number. For example, page 2-3 is the third page in
chapter 2.
Cross-references
Cross-reference conventions are identical with the conventions used for page numbering
The first number in a reference to a particular page refers to the corresponding chapter.
Keyword blocks
This document contains so-called keyword blocks to facilitate the location of specific text
passages. The keyword blocks are placed to the left of the main text and indicate the
contents of a paragraph or group of paragraphs.
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxix
About this document
...................................................................................................................................................................................................................................
Typographical conventions
Special typographical conventions apply to elements of the graphical user interface
(GUI), file names and system path information, keyboard entries, alarm messages, and so
on:
• Text appearing on a graphical user interface (GUI), such as menu options, window
titles or push buttons:
– Provision…, Delete, Apply, Close, OK (push-button)
– Provision Timing/Sync (window title)
– Administration → Security → User Provisioning… (path for invoking a
window)
• File names and system path information:
– setup.exe
– C:\Program Files\Alcatel-Lucent
• Keyboard entries:
– F1, Esc X, Alt-F, Ctrl-D, Ctrl-Alt-Del (simple keyboard entries)
A hyphen between two keys means that you have to press both keys. Otherwise,
you have to press a single key, or a number of keys in sequence.
– copy abc xyz (command)
A complete command that you enter.
• Alarms and error messages:
– Loss of Signal
– HP-UNEQ, MS-AIS, LOS, LOF
Abbreviations
Abbreviations used in this document can be found in the “Glossary” unless it can be
assumed that the reader is familiar with the abbreviation.
Related information
The manuals related to 1678 MCC are shown in the following table:
Document title Document code
1678 MCC Safety Guide 3AG 24686 AAAA Release 4.6
1678 MCC Product Information and Planning Guide 3AG 24683 AAAA Release 4.6
Presents a detailed overview of the system, describes its applications, gives
planning requirements, engineering rules, ordering information, and technical
specifications.
1678 MCC User Provisioning Guide 3AG 24684 AAAA Release 4.6
Provides step-by-step information for use in daily system operations. The manual
demonstrates how to perform system provisioning, operations, and administrative
tasks by use of the1320 Craft Terminal 20.8.x, or ES64SC Zero Installation Craft
Terminal (ZIC), respectively.
...................................................................................................................................................................................................................................
xxx Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
About this document
...................................................................................................................................................................................................................................
Document title Document code
1678 MCC Maintenance and Trouble-Clearing Guide 3AG 24685 AAAA Release 4.6
Gives detailed information on each possible alarm message. Furthermore, it
provides procedures for routine maintenance, troubleshooting, diagnostics, and
component replacement.
1678 MCC Installation and System Turn-Up Guide 3AG 24689 AAAA Release 4.6
A step-by-step guide to system installation and set up. It also includes information
needed for pre-installation site planning and post-installation acceptance testing.
1678 MCC GMRE Command Line Interface Guide 3AG 24687 AAAA Release 4.6
Provides the general CLI rules and the general CLI syntax and describes the CLI
commands in alphabetical order.
1678 MCC GMPLS/GMRE Guide 3AG 24688 AAAA Release 4.6

Provides a general introduction to the GMPLS/ASO control plane concept,
describes the GMRE architecture, components, and main features, and provides a
description of the GMRE protection and restoration features.
Documentation CD-ROM 1678 MCC (all manuals on a CD-ROM) 3AG 24399 BGAA Release 4.6
1678 MCC Software Release Description This document is delivered with the E software.
These documents and drawings can be ordered at or downloaded from the Alcatel-Lucent
Online Customer Support Site (OLCS) (https://support.lucent.com) or through your Local
Customer Support.
Technical support
For technical support, contact your local Alcatel-Lucent customer support team. See the
Alcatel-Lucent Support web site (http://www.alcatel-lucent.com/support/) for contact
information.
How to comment
To comment on this document, go to the Online Comment Form (http://infodoc.
alcatel-lucent.com/comments/) or e-mail your comments to the Comments Hotline
(comments@alcatel-lucent.com) .
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal xxxi
1 Introduction
1
1678 MCC network solutions

Introduction to the Equipment
The 1678 Metro Core Connect (MCC) is a new generation Optical Multiband Platform
for Broadband (SDH/Sonet), Wideband (SDH/Sonet), OT and L2 (Ethernet)
functionalities, each portion flexibly configurable in size. Starting with a switching
capacity of 640 Gbit/s in one single shelf, the architecture allows scaling to bigger
capacities in each direction thanks to its modular design and advanced technology.
The system has been designed to address all the variety of applications from metro to
backbone networks supporting ring-based functionalities as well as advanced mesh
topologies based on GMPLS/ASO dynamic control plane (refer to Figure 1-1,
“1678 MCC scenario” (p. 1-2)).
Telecom Operators and Service Providers look for prompt solutions to face the challenges
of today's telecommunication market. ew revenue opportunities from broadband
services can be supported by limited budgets for new network infrastructures. By
leveraging an SDH/SO ET infrastructure capable to evolve, carriers can reach the
objective of enabling broadband services while keeping network and operation costs to a
minimum level.
An ideal transport solution for metro-core and core networks has to satisfy the following
requirements:
• Simplify and optimize the network: less network elements capable of better
aggregating and consolidating huge multi-protocol traffic streams towards the core.
• Minimize costs: compact equipment with high switching capacity and high density
interfaces to lower CAPEX and OPEX with respect to more complex multi-node
architectures.
• Enable broadband services: support Gigabit Ethernet and data layer management
features to enable Packet-based services cost-effectively.
• Future proof: easy to support Optical Transport etwork (OT ) architectures, lambda
switching and GMPLS control plane.
The 1678 Metro Core Connect (MCC) of the Intelligent Optical Multi-Service odes
(OMS ) family was designed to meet all those challenges.
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal 1-1
Introduction 1678 MCC network solutions
...................................................................................................................................................................................................................................
The 1678 MCC is an Intelligent Optical Multi-Band ode with an outstanding broadband
density of 640 Gbit/s or 4096 x 4096 STM-1 equivalents in a single shelf, with a
wideband (VC12/VT1.5) matrix up to 40 Gbit/s, Gigabit Ethernet, ASO /GMPLS and
OT extension features.
The system is highly scalable both in broadband and wideband direction: the architecture
is ready for possible future evolution up to 160 Gbit/s for the wideband switching and up
to 5 Tbit/s for the broadband one.
Figure 1-1 1678 MCC scenario
The 1678 MCC equipment allows for a seamless evolution of the existing SDH/SO ET
infrastructure towards OT and packet base services, offering a single-shelf solution with
unsurpassed compactness and capacity, providing telecom operators with both near-term
and long-term benefits:
• Compact and Capable
640 Gbit/s worth traffic capacity in one single shelf. Minimum footprint with up to
3.8 Tbit/s switching in one 600x600 rack. High density interfaces, such as 16 x
STM-16 or 4 x STM-64 in one slot.
• Wideband Grooming Point
Fully flexible, non-blocking 256 x 256 STM-1 equivalents, 20G or 40G LO single
board matrix (VC/11/12/3), 1+1 EPS protected. Each copy of the LO matrix is
plugged into one 40G slot of the main shelf.
From R4.1 on a 160 Gbit/s (1024 x 1024 STM-1 equivalents) LO matrix is
introduced. This LO matrix is located in an own shelf named LO Extension Shelf.
...................................................................................................................................................................................................................................
1-2 Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
...................................................................................................................................................................................................................................
• Multiservice Broadband enabler

Standardized Gigabit Ethernet transport and aggregation for packet-based services.
• Family I/O edge devices
Full range of wideband interfaces (E1, E3, E/FE/GE, STM1-el., STM1-opt.,
STM-4/16/64) are supported in Optical Edge Devices (OEDs), as 1662SMC and
1670SM. Multi-shelf configurations are managed as single network element.
• Grow as you want
ext generation plug-in optical interfaces. Scalable wideband LO fully non blocking
extension.
• Cost-effective
Reduced CAPEX and OPEX thanks to network and office simplification.
Pay-as-you-grow service capacity increments up to 4096 STM-1 equivalents,
including Lower Order aggregation. Support of both SDH and SO ET transport
technologies.
• Future-proof
Hardware platform ready for VC-4/ODU-k switching and GMPLS/ASO control
plane management to support OT and meshed architectures.
Management Interfaces
With the extensive introduction of SDH and WDM in the transport network, centralized
and integrated network management is mandatory for etwork Operators to realize the
potential cost saving and required Quality of service.
Figure 1-2, “Management Interfaces of 1678 MCC” (p. 1-4) shows the 1678 MCC
Management Interfaces. A CMISE Interface, based on Q3 orRFC 1006, for
communication with the Craft Terminal (CT) and other etwork Managers, like
1353SH(Element Management System) or 1354RM/1354 P (Domain Management) is
existing.
Furthermore the 1678 MCC can be managed over a TL1 interface.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 1-2 Management Interfaces of 1678 MCC
TL1 CT
TL1 CMISE–IF
TL1 Adapter
CMISE–IF
1678MCC
...................................................................................................................................................................................................................................
Introduction General Description
...................................................................................................................................................................................................................................
General Description
All kind of broadband (STM–1/4/16/64, 1GE, 10GE), wideband (E1, E3, STM1) and
Optical G.709 (OTM1, OTM2, colored) interfaces are integrated with a family concept to
support traditional TDM, data aware, long haul SA and transparent services.
The 1678 MCC can operate in any mesh, ring, restoration or hub and spoke topology,
because of its superior blocking free cross–connect architecture and its fast–speed control
plane. It can be used as a Multi–Terminal, Multi–Ring closure node, Restoration–Cross-
connect or as a Gateway between different layers.
With GMRE (GMPLS Routing Engine) – the control plane machine on top of the
1678 MCC – traffic paths are set up through a switched network automatically and
restored in case of failure.
The HO switching functionalities are implemented in a 640 Gbit/s Matrix board that can
be extended in future. The matrix supports any mixture of AU–4 and AU–3 cross
connections. In future the available signal rates are extended to ODU1 and ODU2 (ITU–T
G.709).
Moreover a LO matrix is available with a capacity of 40 Gbit/s for cross connecting at
VC–3/VC–12 level. In future it will also support VC11. This function allows the perfect
control of VC–4 and VC–3 pipes filling in the SDH frame, maximizing flexibility.
When the LO matrix is used in conjunction with an I/O shelf containing the LO
interfaces, the 1678 MCC becomes a next generation wideband cross–connect. The
architecture is prepared to scale the LO capacity beyond 40G in service operation.
From R4.1 on a LO matrix with a capacity up to 160 Gbit/s is available.
The same LO matrix board implements the AU3–TU3 conversion function: this enables
the usage of 1678 MCC in a mixed SDH/SO ET traffic environment.
Figure 1-3, “1678 MCC SDH/SO ET Multiplexing Schemes” (p. 1-6) shows the
SDH/SO ET multiplexing schemes of the 1678 MCC.
The plug–in boards can be of the following types:
• STM–64 port (1x/2x/4x):
Intraoffice, Short, Long, Very Long and Ultra Long Haul interfaces
• STM–16 port (4x/8x/16x):
Short and Long Haul interfaces
• STM–4 port (16x):
Short and Long Haul interfaces; electrical interfaces
• Gigabit Ethernet (4x/8x/16x):
SX and LX interfaces
• 10 Gigabit Ethernet
10G-SR, 10G-LR and 10G-ER interfaces
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Additional plug–in boards are supported in OED shelves 1670SM and 1662SMX:
• STM–1e port (4x/16x)
• 140Mbit/s port
• 2Mbit/s port
For future applications the following OTH interfaces will be supported:
• OTM-0.1
• OTM-0.2
• 2.5 Gbit/s U I (STM-16/CBR 2.5 Gbit/s)
• 9.95 Gbit/s U I (STM-64/CBR 9.95 Gbit/s)
These interfaces are not shown in Figure 1-3, “1678 MCC SDH/SO ET Multiplexing
Schemes” (p. 1-6)).
Figure 1-3 1678 MCC SDH/SONET Multiplexing Schemes

x1
STM–256 AUG256 AU3–768c VC4–256c C4–256c
STS–768c SPE
x4
x1
STM–64 AUG64 AU3–192c VC4–64c C4–64
OC192 STS–192c SPE 10GE
x4
x1
STM–16 AUG16 AU3–48c VC4–16c C4–16c
OC48 STS–48c SPE
x4
x1
STM–4 AUG4 AU3–12c VC4–4c C4–4c
OC12 STS–12c SPE
x4
x1 x1 x1
x1
STM–1 AUG1 AU3–3c VC–4 C4
x3
OC3 STS–3c SPE x1 GE
EC3 x3 TUG–3 TU–3 VC–3 140Mbit/s
x1 C3
STM–0 AU3 VC–3
x7 (DS3) GE
STS1–SPE x7
x1
OC1 (optical)
EC1 (electrical) TUG–2 TU–2 VC–2 C2
VT–Group x3 VT6 DS2
TU–12 VC–12 C12

VT2 2Mbit/s
1678MCC matrix connectivity supported for this signal rate x4
supported (monitoring or payload mapping or interface type) TU–11 VC–11 C11

VT1.5 DS1
planned
GE Gigabit Ethernet
OTH capability not shown. SPE Synchronous Payload Envelope
1GE with configurable virtual concatenation and LCAS. STS Synchronous Transport Signal
10GE with configurable virtual concatenation, LCAS, EPL and EVPL. VT Virtual Tributary
Some additional units are devoted to central functions:

• Equipment Controller units
• HO SDH/SO ET/OT Matrix + Clock Reference units
– MX640, MX320 and MX160 for ETSI applications
– MX640GA and MX320GA for A SI applications
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• LO Matrix
• Power supply filter boards
• FA cooling units
• Service and Control&General interfaces boards
According to the network topology, single ended and dual ended MSP (Multiplex Section
Protection) 1+1 and 1: can be implemented between any STM–n interfaces.
S CP (Sub etwork Connection Protection) inherent (S CP/I) as well as non–intrusive
(S CP/ ) is also provided at all VC–4, VC–3 and VC–12 levels (future: VC11 as well).
The SDH ports belonging to a protection group (MSP or S CP) can be flexibly selected
by craft terminal or management system, regardless of their position in the shelf.
MS–SPRing protection is supported in a 2F or 4F schema, at STM–16 or STM–64 level.
The 1678 MCC supports non–intrusive Path Overhead Monitoring (POM) of the Higher
Order and Lower Order VCs. For LO VCs only Monitoring before matrix is supported.
Supervisory Unequipped Trail (SUT) functions on 100% is only supported for Higher
Order VCs. Tandem Connection Monitoring and Termination capabilities can be
supported in future.
All STM–1, STM–4 and STM–16 optical interfaces are realized with SFP plug–in
technology, giving small size, cheapness and huge flexibility. XFP modules can be used
for STM–64 and 10GE interfaces.
For Very Long Haul (VLH) and Ultra Long Haul (ULH) at STM–64 boards the optical
amplifiers and pre–amplifiers are integrated on the relevant boards.
The synchronization function, located on the SDH/SO ET matrix board, synchronizes
the 1678 MCC and provides generation and distribution of a reference clock. The clock
can be locked to an external 2 MHz, 2 Mbit/s or 1.5 Mbit/s source, to any STM– traffic
port or to the internal oscillator. The SSM (Synchronization Status Message) quality and
priority algorithms are also supported (not for 1.5 Mbit/s).
The Equipment Controller and Service Controller boards provide configuration, alarm
status and performance monitoring data. A software download facility (Local and
Remote) is available in order to update the complete software of the control subsystem.
The system can be managed either by a CMISE Craft Terminal running on a Personal
Computer attached to the F–interface, by the etwork Management System through the
Q–interface or by a TL1 command line interface.
A DC/DC converter, located on each board, guarantees power supply throughout the
system. The distribution of the DC/DC converters guarantees inherently power supply
hardware protection.
...................................................................................................................................................................................................................................
Introduction 1678 MCC Main Shelf Equipment View
...................................................................................................................................................................................................................................
1678 MCC Main Shelf Equipment View

In the following figures are shown the 1678 MCC Main Shelf Equipment photos:
• Figure 1-4, “1678 MCC Main Shelf - Front View” (p. 1-8) shows a view of equipment
with cover;
• Figure 1-5, “1678 MCC Main Shelf - Side View” (p. 1-9) shows a lateral view of
equipment with cover;
• Figure 1-6, “1678 MCC Main Shelf - Board View” (p. 1-10) shows a view of the
1678 MCC main shelf with relevant units (common and traffic ports board).
Figure 1-4 1678 MCC Main Shelf - Front View
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 1-5 1678 MCC Main Shelf - Side View
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 1-6 1678 MCC Main Shelf - Board View
...................................................................................................................................................................................................................................
Introduction Insertion of the Equipment into the Network
...................................................................................................................................................................................................................................
Insertion of the Equipment into the Network

The 1678 MCC equipment belongs to the Alcatel-Lucent OMS family product,
compliant with the Synchronous Digital Hierarchy (SDH) defined by the ITU-T Recs.
and compliant with SO ET defined by the A SI Recs.
The 1678 MCC can be used for transmission over any type of fiber.
The equipment 1678 MCC can be utilized in interurban, regional and metropolitan
networks configured for standard plesiochronous or synchronous systems.
The product can be suitably employed on linear, ring and hub networks and on protected
or unprotected line links.
The equipment applications depends on the different types of networks available.
The main applications are described in the following paragraph.
...................................................................................................................................................................................................................................
Introduction Applications
...................................................................................................................................................................................................................................
Applications
The 1678 MCC is designed with enough flexibility to find application in many segments
of a carrier's network. Because the system can be minimally configured with a matrix,
common control and interface boards, yet also be fully populated with a mix of interface
types, the same system can be used either near the network edge or even in core
applications.
A number of the most important network applications are listed below:
• Metro-Core Cross-Connect (VC-4/3/12/11)
• Core Cross-Connect (VC-4nc/VC-4; AU-3nc/AU-3)
• Optical Gateway Cross-Connect (SDH/SO ET/OTH)
• Gateway in Trans- ational networks
• Gateway in Submarine Landing station
• Gateway for Carrier - Carrier stations
• Hub and Spoke node in Core Data networks
• Service Connect for Mobile Core etworks
• ASO / GMPLS node for Core ISP networks
Optimized Site Architectures
All kind of network topologies like hub and spoke, ring or mesh networks are supported
by 1678 MCC, converging the different layers of transmission.
Most carriers' networks contain points of presence or central offices in physical locations
dictated by traffic demand or collocation with other carriers. Typically, these offices form
interconnection points between:
• ring or hub based access and metro structures that collect and aggregate traffic coming
from the network edge, often carrying as well LO as HO traffic parts;
• ring or mesh based transport structures, interconnecting different metro areas directly
or via a metro core / core network (mostly HO structured).
Historically, sites therefore required a number of network elements (LO/HO OMS s,
LO/HO DXCs) in order to satisfy the different applications. Today only one 1678 MCC is
necessary to perform this task, such ensuring a very cost-effective node solution.
In addition to this office modernization effect, there are other possibilities to reduce the
required node functionality and size (and with that the node cost) by choosing appropriate
layered network topologies. This should be done in such a way that transit traffic is
avoided in client layers and switched or cross-connected in server layers instead.
One example for such an network concept is the change from hierarchical IP/MPLS over
DWDM networks to a flat (fully meshed on the MPLS layer) architecture, with an
intermediate SDH layer which provides an 1:1 mapping of MPLS LSPs into SDH VCs.
These than can be groomed and cross-connected throughout their way in the network at
lower cost as it would be if they had to be handled in real IP/MPLS nodes at each
location.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The 1678 MCC with its data functionalities is best suited and prepared for these
applications.
Aggregation
Whether there is a need for traffic aggregation or cross-connecting - the 1678 MCC
provides the optimized solution. Usually in the metro area many customers create low
bit-rate access traffic using various services to reach their partners and service providers
somewhere else.
The 1678 MCC fits in ideally as an advanced wideband multi-service cross-connect
which bridges the required distances and concentrates the required capacities in one
single network element by using SDH/SO ET and OTH technology. Comprising the
wide range of interfaces from 2 Mbit/s to 10 Gbit/s by using extension shelves, even the
OTH boundary transition in core networks is effectively possible.Thus, thanks to its
flexible architecture and SW build-up it is possible not only to converge SDH and
SO ET but also OTH on a common platform taking the benefits of aggregation over all
layers.
Data Interfaces
The growth of data applications adds the requirement for associated interfaces like 1
Gigabit Ethernet (1GE) or 10GE.
The 1678 MCC supports optical 1/10 Gbit/s Ethernet data interfaces that enable easy to
handle and cost effective connectivity towards data aware networks with Routers and
Servers.
Following applications are supported:
• Point to Point EoS (Ethernet over SDH/Sonet)
• Point to Multi-Point EoS (with L2 extension)
• LSR (Label Switch Router) in core data networks
GASON / GMPLS Support
The overall forecasted growth of data applications adds requirements for dynamics and
interoperability, not only for the service but also for the management of the transport
entity. Automatic Switched Optical etworks (ASO ) as the concept and Generalized
Multi Protocol Label Switching (GMPLS) as the protocol are today's buzzwords in this
aspect.
The traditional trend of centralized management of transmission networks is enhanced
with the introduction of a dynamic, decentralized control plane paying tribute to the new
demand. By introducing such a concept to the optical transmission, a new era arises.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
This era will lead to:

• Restorable mesh networks.
Those are either already implemented or under implementation. Automation is used
here to achieve a kind of 'automatic redialing' performed by the network in case of
failures. Based on this technology a much finer service differentiation can be provided
compared to today's protected networks.
• Interoperability on control level.
Actually each vendor has a different manager for his equipment and in a multi vendor
domain there is always an issue to provide end-to-end connectivity and supervision.
By using standard protocols between devices of different vendors, a end-to-end
provisioning can be achieved by actually performing only one provisioning action at
the source of a connection.
• ew services with close protocol interaction (ASO ) between Data and Transmission
equipment. Here the service node (e.g. a router) can derive according to bandwidth
and QoS requirements whether additional transport capacity is needed or if sufficient
capacity is readily available.
• Automatic switching from user side may be introduced concurrently to above steps
depending on prosperous business models. Ethernet over SDH may push for a control
plane interoperability between data and transmission to actually control and maintain
the overall network. Bandwidth on Demand (BonD) can become a service once
interoperability between nodes and technologies are resolved.
Alcatel-Lucent is also tackling one of the key issues operators see when dealing with
GMPLS, that is its operational manageability. Yet, this seems to be one of the key factors
that have so far prevented widespread adoption of the technology.
Here comes Alcatel-Lucent distinctive story: thanks to huge and unparalleled experience
accumulated in transport network management, including the intricacies of large
backbone real time restoration systems, Alcatel-Lucent is in a position to design,
implement and deploy a managed GMPLS solution that allows tracking in real time the
circuit and bandwidth allocation within the network keeping continuous control of
network resource usage.
Also, to ease deployment and customization with the new technology, Alcatel-Lucent
solution allows partitioning of each E between different control planes, allowing a
smooth transition from the current technology paradigm to the next.
"Lambda" aware Networking
The 1678 MCC has built in networking capabilities according to the new Optical
Transport Hierarchy (OTH) which allows effective and cost efficient networking on a
coarser granularity than traditional SDH/SO ET +networks. Even if OTH signals are
digital signals and as such independent from the physical medium they currently are
transported or processed, often it is referred to as "Lambda" networking, as DWDM
technology is part of the OTH concept and as the transport entities are in the order of
magnitude of a complete wavelength (today 2.5 & 10 Gbit/s, in future also 40 Gbit/s).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Three major network applications can be fulfilled by the 1678 MCC on the OTH layers:
• a gateway functionality between SDH and OTH networks with the appropriate
mapping functionalities (e.g. STM-16 in ODU1, or STM-64 in ODU2);
• a pure ODU cross-connect functionality between OTH interfaces;
• a "modem" functionality which allows both, complete STM- signals and already
ODU structured OTH signals, to be transported over non-OTH-aware SDH networks
(using virtual concatenated SDH VCs as transport entity).
Optical Edge Device (OED) Integration
Optical Edge Devices (OEDs) will be used in 1678 Metro Core Connect to provide
additional I/O ports, which are not supported in the 1678 MCC main shelf at all, or where
implementation in the OED allows a better usage of the HO matrix capacity in the
1678 MCC main shelf.
The OED integration feature covers the complete integration of OEDs, consisting of the
mechanical OED integration and the SW OED integration.
...................................................................................................................................................................................................................................
Introduction Configuration
...................................................................................................................................................................................................................................
Configuration
Terminal multiplexer, refer to Figure 1-7, “Terminal multiplexer” (p. 1-16)
The multiplexer is provided with an STM–1 / STM–4 / STM–16 / STM–64 station
interface (possibly stand–by too) to be connected to a Digital Electronic Cross–Connect
or to a higher hierarchical line system.
Figure 1-7 Terminal multiplexer
SDH PORT
SDH
PDH PORTS NE
SDH PORT
(SPARE)
Add/Drop Multiplexer, refer to Figure 1-8, “Add/Drop Multiplexer” (p. 1-16)

The multiplexer can be programmed to drop (insert) signals from (into) the STM–1 /
STM–4 / STM–16 / STM–64 stream. Part of the signal pass–through between the line
sides, defined A and B in Figure 1-8, “Add/Drop Multiplexer” (p. 1-16).
Figure 1-8 Add/Drop Multiplexer
SDH PORT SDH PORT

Side A NE Side B
SDH PORT SDH PORT
(SPARE) (SPARE)
SDH, PDH PORTS
”HUB” STM–, refer to Figure 1-9, “”HUB” STM–1” (p. 1-16)

The multiplexer permits to drop/insert STM– tributaries into a multiple stream and then
branch them off in HUB structures.
Figure 1-9 ”HUB” STM–1
SDH PORT SDH PORT

NE
SDH PORT SDH PORT
(SPARE) (SPARE)
SDH PORT
Mixed Configuration
...................................................................................................................................................................................................................................
Introduction Configuration
...................................................................................................................................................................................................................................
The E can handle in the same node all the previously listed configurations, thus
performing a mixed configuration.
...................................................................................................................................................................................................................................
Introduction Network Topologies
...................................................................................................................................................................................................................................
Network Topologies
For each of the above network applications different network topologies may be used.
The most important network topologies are:
• Point to Point
• Linear
• Ring and multiring topology
• Meshed topology
Point–to–point links, refer to Figure 1-10, “Point–to–point links” (p. 1-18).
In this case the E can be connected to another E through the line.
Figure 1-10 Point–to–point links
SDH PORT SDH PORT

SDH SDH
PDH PORTS NE NE PDH PORTS
SDH PORT SDH PORT

SPARE SPARE
Linear Drop–insert, refer to Figure 1-11, “Linear Drop–insert” (p. 1-18).

The E can be programmed to drop (insert) PDH and SDH ports from (into) the STM–1,
STM–4, STM–16, STM–64 stream or terminate PDH ports.
Figure 1-11 Linear Drop–insert
SDH PORT SDH PORT SDH PORT
NE NE NE NE
SPARE SPARE SPARE
PDH PORTS PDH PORTS
SDH AND PDH SDH AND PDH

PORTS PORTS
Ring structure, refer to Figure 1-12, “Ring structure” (p. 1-19).

The drop–insert function permits to realize ring structures. The VC can be automatically
rerouted if the optical splice breaks down or one of the equipment nodes fails.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 1-12 Ring structure

SDH AND PDH
PORTS
NE
STM 64 STM 64
RING 1

NE NE
PORTS SDH AND PDH PORTS
PORTS
STM 64 STM 64
NE
STM 1 STM 1
PDH
PORTS
NE NE
PORTS PORTS
RING 2
STM 1 STM 1
NE
SDH AND PDH

PORTS
Meshed Topology, refer to Figure 1-13, “Meshed Topology” (p. 1-20).

The Meshed topology may be used in case of collection of traffic in peripheral nodes or
customer premises sites. The 1+1 line protection may be used to protect against line
failure and, in some cases, node failure could be protected using dual hub topology too.
For this type of network topologies the mini digital cross connect system is very useful
and S CP/I is used.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 1-13 Meshed Topology

PDH PORT
NE
SDH AND PDH

STM N STM N PORTS PDH PORT
PDH PORT
STM 1 STM 1
NE NE NE
RING 1 NE
STM N STM N
PDH PORT
NE
STM N
SDH AND PDH

PORTS
NE
STM N STM N
PDH PORT
STM N
NE STM N
NE RING 2
NE PDH PORT
SDH AND PDH

PORTS
NE STM N
STM N
PDH PORT
...................................................................................................................................................................................................................................
2 Features
2
Overview
Purpose
This chapter briefly describes the features of 1678 Metro Core Connect (MCC).
For more information on the physical design features and the applicable standards, please
refer to Chapter 7, “Technical specifications”.
Contents
Physical interfaces 2-3

Synchronous/electrical interfaces 2-4
Data interfaces 2-6
Timing interfaces 2-7
Operations interfaces 2-8
Power interfaces 2-9
Transmission features 2-10
Cross-connection features 2-11
Ethernet features 2-12
Forward error correction 2-13
Ring protection 2-14
Line protection 2-15
Path protection 2-16
Restoration - Support of the GMPLS Protocol 2-17
Equipment features 2-19
Equipment protection 2-20
Optical interface modules 2-21
Equipment reports 2-22
Synchronization and timing 2-23
...................................................................................................................................................................................................................................
Features Overview
...................................................................................................................................................................................................................................
Timing features 2-24

Timing protection 2-25
Timing interface features 2-26
...................................................................................................................................................................................................................................
Features Physical interfaces
Overview
...................................................................................................................................................................................................................................
Physical interfaces
Overview
Purpose
This section provides information about all kinds of physical external interfaces of
1678 MCC. For detailed technical data and optical parameters of the interfaces please
refer to Chapter 7, “Technical specifications”.
1678 MCC supports a variety of configurations as described in the previous chapter, due
to its flexible architecture. The choice of synchronous and data interfaces described below
provides outstanding transmission flexibility and integration capabilities.
Contents
Synchronous/electrical interfaces 2-4

Data interfaces 2-6
Timing interfaces 2-7
Operations interfaces 2-8
Power interfaces 2-9
...................................................................................................................................................................................................................................
Synchronous/electrical interfaces
...................................................................................................................................................................................................................................
SONET/SDH transmission interface overview
1678 MCC supports the whole range of interfaces from 10 Gbit/s down to 2 Mbit/s. All
optical interface units support SO ET and SDH formatted signals.
The following synchronous/electrical interfaces are available in the present release for the
1678 MCC main shelf:
• 10-Gbit/s long reach / long haul optical TRX SFP interface module, colored DWDM,
APD, CH60 to CH17
• 10-Gbit/s long reach / long haul optical SFP interface module (40 km), 1550 nm
• 10-Gbit/s intermediate reach / short haul optical SFP interface module (15 km), 1550
nm
• 10-Gbit/s short reach / short haul optical SFP interface module , 1310 nm
• 2.5-Gbit/s long reach / long haul optical TRX SFP interface module, DWDM, CH620
to CH170
• 2.5-Gbit/s optical transceiver module, 1610 nm, APD
• 2.5-Gbit/s optical transceiver module, 1610 nm
• 2.5-Gbit/s long reach / long haul optical SFP interface module (40 km), 1550 nm
• 2.5-Gbit/s long reach / long haul optical SFP interface module (40 km), 1310 nm
• 2.5-Gbit/s intermediate reach / short haul optical SFP interface module (15 km), 1310
nm
• 2.5-Gbit/s intra-office optical SFP interface module (2 km), 1310 nm
• 622-Mbit/s long reach / long haul optical SFP interface module (40 km), 1550 nm
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• 622-Mbit/s intermediate reach / short haul optical SFP interface module (15 km),
1310 nm
1310 nm
• 155-Mbit/s intra-office interface for electrical STM-1 signals
The following synchronous interfaces are available in the present release for the lower
order extension shelf:
• 2.5-Gbit/s intra-office optical SFP interface module (2 km), 1310 nm
The following synchronous/electrical interfaces are available in the present release for the
OED shelf 1670SM:
1310 nm
1310 nm
• 140-Mbit/s intra-office interface for electrical 140/155-Mbit/s signals
The following interfaces are available in the present release for the OED shelf 1662SMC:
• 2-Mbit/s intra-office interface.
...................................................................................................................................................................................................................................
Data interfaces
...................................................................................................................................................................................................................................
Data interfaces
Gigabit Ethernet interface
1678 MCC supports optical 1-Gbit/s (1000BASE) Ethernet interfaces.
Three optical 1-Gbit/s Ethernet interface types are supported on the Gigabit Ethernet
boards:
• SX, the short reach interface,
• LX, the long reach interface and
• ZX long reach interface (1550nm long haul, single mode fiber, with a target distance
of 70km)
The Gigabit Ethernet boards P4GE/P8GE/P16GE support up to 4/8/16 SFP's with these
interfaces.
The 10 Gigabit Ethernet boards P2XGE/P4XGE support 2/4 XFP modules with three
optical 10-Gbit/s Ethernet interface types:
• 10GbE 10km 1310nm
• 10GbE 40km 1550nm
• 10GbE 80km 1550nm
...................................................................................................................................................................................................................................
Timing interfaces
...................................................................................................................................................................................................................................
Timing interfaces
Synchronization interfaces
1678 MCC provides two physical timing inputs and two timing outputs. Timing signals
can be a 2.048 MHz clock or a 2.048 Mbit/s frame (E1) in an ETSI environment, or a
1.544 MHz clock or 1.544 Mbit/s frame (DS1) in a SO ET architecture.
...................................................................................................................................................................................................................................
Operations interfaces
...................................................................................................................................................................................................................................
1678 MCC is equipped with the following operations interfaces:
• Station alarm interface which drives four rack lamps (one power lamp and three
station alarm lamps which can be configured by the customer)
• Bicolor or multicolor LED on each controlled circuit pack indicating the operational
state of the pack
• Alarm board in the lower order extension shelf providing
– Rack alarm interface
– Housekeeping inputs and outputs
– Alarm lamps interface
– Power supervision
• Two interfaces LA _A and LA _B provide a redundant high speed communication
channel able to support the Ethernet protocol IEEE 802.3. They are both used for
connection to an external Operation System (OS) station.
• Housekeeping input and output contacts for operator defined usage:
– Each 1678 MCC main shelf/low order extension shelf has 3 general purpose input
contacts (GPI) and 4 general purpose output contacts (GPO)
– Each 1670SM OED shelf has 4 general purpose input contacts (GPI) and 2
general purpose output contacts (GPO)
– Each 1662SMC OED shelf has 4 general purpose input contacts (GPI) and 2
general purpose output contacts (GPO)
• F interface: RS–232 electrical interface on the FLCCO GI front panel for connection
of the craft terminal for maintenance and control activities.
...................................................................................................................................................................................................................................
Power interfaces
...................................................................................................................................................................................................................................
Power interfaces
Power supply
Two redundant power supply inputs are available per shelf; the supply voltage is -48 V
DC to -60 V DC nominal. The system powering meets the ETSI requirements ETS
300132-2. Operation range is -40 V DC to -72 V DC.
For detailed information about the power consumption please refer to “Electrical
specifications” (p. 7-34) and to “Power consumption” (p. 7-80).
...................................................................................................................................................................................................................................
Features Transmission features
Overview
...................................................................................................................................................................................................................................
Transmission features
Overview
Purpose
This section gives an overview of the transmission related features of the 1678 Metro
Core Connect (MCC). For more detailed information on the implementation of the switch
function in the E please refer to Chapter 4, “Product description”.
Contents
Cross-connection features 2-11

Ethernet features 2-12
Forward error correction 2-13
Ring protection 2-14
Line protection 2-15
Path protection 2-16
Restoration - Support of the GMPLS Protocol 2-17
...................................................................................................................................................................................................................................
Cross-connection features
...................................................................................................................................................................................................................................
Cross-connection features
Cross-connection rates
1678 MCC supports unidirectional and bidirectional cross-connections for VT1.5/VC-12,
VC-3 (lower-order), STS-1/VC-3 (higher-order), STS-3c/VC-4, STS-12c/VC-4-4c,
STS-48c/VC-4-16c and STS-192c/VC-4-64c payloads.
Cross-connection capacity
The following switching units are available with the present release of 1678 MCC:
• the MX160 with a cross-connection capacity of 160 Gbit/s in total (3072 × 3072
STS-1 / 1024 × 1024 VC-4)
STS-1 / 2048 × 2048 VC-4)
STS-1 / 4096 × 4096 VC-4)
• the LX160 in the lower order extension shelf with a cross-connection capacity with
STS–1 granularity of up to 1024 STM–1 signals (3072 signals at AU3 level), non
blocking
• the HCMATRIX in the 1670SM shelf
• the SY TH16 in the 1662SMC shelf with a cross-connection capacity of up to 96
× 96 STM-1 equivalents at High Order level and up to 64 × 64 STM-1 equivalents at
Low Order level between all traffic ports
...................................................................................................................................................................................................................................
Ethernet features
...................................................................................................................................................................................................................................
Ethernet features
The Gigabit Ethernet interface provides an enhanced feature set for flexible Ethernet over
SO ET/SDH transport.
Related features of 1678 MCC are:
• Virtual concatenation (VCAT)
• Link Capacity Adjustment Scheme (LCAS)
• Virtual LA
• Ethernet Private Line (EPL) for 10GE
• Ethernet Virtual Private Line (EVPL) for 10GE
• Bidirectional Link Pass Through (LPT)
• Static Link Aggregation Group (S–LAG)
• Unidirectional broadcast
• Unidirectional Link Pass Through (LPT)
...................................................................................................................................................................................................................................
Forward error correction
...................................................................................................................................................................................................................................
Forward error correction

Forward error correction (FEC) makes it possible to improve the optical signal-to-noise
ratio (OS R), and thus to lower the bit error ratio, of an optical line signal by adding
redundant information. This redundant information can then be used to correct bit errors
that unavoidably occur when an optical line signal is transmitted over longer distances
over an optical fiber.
Units supporting forward error correction

Forward error correction is available on the following transmission units:
• 4xGigabit Ethernet Port Board P4GEFC
...................................................................................................................................................................................................................................
Ring protection
...................................................................................................................................................................................................................................
Ring protection
MS-SPRing
1678 MCC supports the SDH ring protection feature Multiplex Section Shared Protection
Ring (MS-SPRing).
The following MS-SPRing protection schemes can be configured:
• 2-fiber MS-SPRing at STM–16 interfaces
• 2-fiber MS-SPRing at STM–64 interfaces
• 2-fiber MS-SPRing at GE interfaces
1678 MCC can support up to 28 2-fiber MS-SPRing schemes at the same time,
irrespective of whether they are at STM–16 and/or at STM–64 interfaces.
...................................................................................................................................................................................................................................
Line protection
...................................................................................................................................................................................................................................
Line protection
1678 MCC supports the SDH linear protection feature Multiplex Section Protection
(MSP). Single ended and dual ended MSP 1+1 and 1: can be implemented between any
STM–n interfaces.
Linear APS / MSP principle

The principle of a linear APS is based on the duplication of the signals to be transmitted
and the selection of the best signal available at the receiving port. The two (identical)
signals are routed over two different lines, one of which is defined as the working line,
and the other as protection line. The system only switches to the standby line if the main
line is faulty.
...................................................................................................................................................................................................................................
Path protection
...................................................................................................................................................................................................................................
Path protection
1678 MCC supports the SDH path protection feature Subnetwork Connection Protection
(S CP). S CP inherent (S CP/I) as well as non–intrusive (S CP/ ) is provided at all
VC–4, VC–3 and VC–12 levels (future: VC11 as well).
SNCP principle
The principle of S CP is based on the duplication of the signals to be transmitted and the
selection of the best signal available at the path termination. The two (identical) signals
are routed over two different path segments (uni-directional paths), one of which is
defined as the main path and the other as standby path. The system only switches to the
standby path if the main path is faulty.
SNCP
1678 MCC supports two types of S CP:
• Inherently monitored subnetwork connection protection (S CP/I)
S CP/I protection generally protects against failures in the server layer. This means
AU-4 or STS-1 defects are detected and the switch is triggered by the Server Signal
Fail (SSF) signal.
• on-intrusively monitored subnetwork connection protection (S CP/ )
S CP/ protection, generally, protects against failures in the server layer and against
failures and degradation in the client layer. This means the non-intrusive monitor
function detects Signal Fail (SF) and Signal Degrade (SD) events on the incoming
signal and triggers the switch accordingly.
...................................................................................................................................................................................................................................
Restoration - Support of the GMPLS Protocol
...................................................................................................................................................................................................................................

GMRE
1678 MCC supports the Generalized Multi Protocol Label Switching (GMPLS) control
plane by introducing the GMPLS routing Engine (GMRE). This is a software package
that coordinates the various actions which are necessary to provide the dynamic
establishment and release of connections and restoration in the event of failures in a
distributed fashion.
The GMPLS protocol supports the
• exchange of topology and resource information between Es
• communication of route decisions to the involved Es
• setup of the corresponding paths.
GMRE features
The features supported by the GMPLS routing Engine GMRE comprise:
• SPC Management: 5 priority levels, support of multiple different
protection/restoration schemes, VC–4 trails VC–4–TTPs connection end points in
support of connections carrying GbE or LO traffic
• Switched Connections management
• Retrieval of SPC and Switched Connections, filtering supported
• Interworking of MS-SPRing and SPCs on domain boundary for SPCs (MS-SPRing on
'drop ports')
• Modification of existing SPCs: priority, protection type
• Path diversity for dual homing
• Support of unidirectional Label Switched Paths (LSPs) without reverse handling
• Support of S CP rings (single node interconnection)
• Compound link support
• E– I routing
• Signaling issues including
– Route requests issued at source nodes and domain ingress nodes
– Signaling issues concerning the interworking between E– I and I– I
interfaces
• ominal transit routes with the purpose to have a defined route through the network
for transit connections as well as resource portioning for local domain and inter
domain connections
• Restoration schemes based on the point of failure reporting (within or exterior to the
domain)
– Intra domain restoration
– End to end restoration
• Performance monitoring on Label Switched Paths
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Regional Manager to ASO migration

• Management of S CP selector
• Protection and Restoration Combined (PRC) for Multicast
• Supports a network size of 260 nodes
• EVPL Support: Support of logical interfaces based on the VCG identifier on
– 10GE cards
– ES64 cards.
• GMRE soft rerouting on section signal degrade
GMRE provides soft reroute restoration in case of section signal degraded (SD).
Therefore the SD is handled on GMRE controlled ports ( I and split ports, not on
drop, U I or E- I ports) and is mapped to port degradation failure to trigger
restoration with a separation whether the port is really failed (signal fail) or degraded
(signal degraded).
Restoration on SD is made in a soft-reroute manner by which the source node
establishes an S CP first before the degraded leg is removed.
• GMRE resource coloring
This feature allows to restrict the usage of network resources for a given scope. For
this purpose a color attribute is introduced for TE links. The following modes are
defined for the usage of a link:
– Include colors: the link can be used if any of the colors is set
– Exclude colors: the link cannot be used if any of the colors is set.
For further information on restoration and the GMRE implementation please refer to the
1678 MCC GMPLS/GMRE Guide.
...................................................................................................................................................................................................................................
Features Equipment features
Overview
...................................................................................................................................................................................................................................
Equipment features
Overview
Purpose
This section provides information about 1678 MCC equipment features concerning
hardware protection, optical interface modules, and inventory and failure reports.
Contents
Equipment protection 2-20

Optical interface modules 2-21
Equipment reports 2-22
...................................................................................................................................................................................................................................
Equipment protection
...................................................................................................................................................................................................................................
Equipment protection
1+1 redundancy
To enhance the reliability of 1678 MCC, for the following boards equipment protection is
supported:
• In the 1678 MCC main shelf non-revertive 1+1 equipment protection for:
– the higher order matrix boards (MX160, MX320, MX640)
– the lower order matrix boards (LAX20, LAX40)
– the FLCCO GI and FLCSERV boards (only for First Level Controller and
GMRE functions)
• In the 1670SM OED shelf:
– non-revertive 1+1 equipment protection for the high capacity matrix board
(HCMATRIX)
– revertive +1 equipment protection for high speed ports on 4 x STM–1 electrical
boards and on 16 x STM–1 electrical boards
• In the 1662SMC OED shelf:
– non-revertive 1+1 equipment protection for the compact ADM 16 board
(SY TH16)
– revertive +1 equipment protection for low speed ports on 63 x 2 Mbit/s boards
(A63E1)
Besides automatic switching, manual and forced switching is supported to minimize
operations interruption e.g. in maintenance scenarios (exchange of units).
Power supply
Two Power Supply and Filter boards (PSF) in 1+1 configuration are provided.
...................................................................................................................................................................................................................................
Optical interface modules
...................................................................................................................................................................................................................................
Optical interface modules

1678 MCC supports optical port units consisting of a parent board which can be equipped
with field-replaceable optical interface modules.
An optical interface module is a replaceable unit with a receiver and transmitter function
providing the optical port. 1678 MCC optical interface modules are “hot pluggable”
(field-replaceable), i.e. the interface modules can be inserted or removed while the parent
board is in operation, without affecting the service of other interface modules on the same
parent board.
Advantages of the optical interface modules

The 1678 MCC optical interface modules provide excellent pay-as-you-grow
opportunities for smaller or start-up applications, as only the up-to-date required number
of ports must be purchased . An additional advantage of this flexible interface lies in ease
and cost reduction when it comes to maintenance and repair activities.
The number of modules inserted into the parent board can be varied flexibly between zero
and the maximum number of sockets; the possibly unused sockets can be left empty.
Types of optical interface modules

All optical interface modules used in the 1678 MCC systems are listed in the part lists for
the respective shelves: Table 3-6, “Main parts list” (p. 3-30), Table 3-12, “Main parts list”
(p. 3-77), Table 3-21, “Main part list” (p. 3-102), and Table 3-27, “Main part list”
(p. 3-130).
...................................................................................................................................................................................................................................
Equipment reports
...................................................................................................................................................................................................................................
Equipment reports
Equipment inventory
1678 MCC automatically maintains an inventory of the following information of each
installed board:
• ALCATEL company
• Unit type
• Unit part number
• Software part number
• CLEI Code
• Manufacturing plant
• Serial umber
• Date
You can obtain this information by an inventory request command.
Equipment failure reports

Failure reports are generated for equipment faults and can be forwarded via the Craft
Terminal (CT) or management system interfaces.
...................................................................................................................................................................................................................................
Features Synchronization and timing
Overview
...................................................................................................................................................................................................................................
Synchronization and timing
Overview
Purpose
This section provides information about synchronization features, timing protection and
timing interfaces of 1678 MCC.
Contents
Timing features 2-24

Timing protection 2-25
Timing interface features 2-26
...................................................................................................................................................................................................................................
Timing features
...................................................................................................................................................................................................................................
Timing features
Synchronization modes
Several synchronization configurations can be used for the 1678 MCC:
• Locked mode, internal SDH Equipment Clock (SEC) locked to either:
– One of two external synchronization inputs (each of them accepts 2,048 kHz, 2
Mbit/s, or 1.5 Mbit/s) or
– One of up to three STM- input signals.
In locked mode, if all configured references fail, the internal clock will switch to the
holdover mode.
• Free-running.
The timing reference for the external timing output can be provisioned independently
from the timing reference for the system clock.
Synchronization provisioning
It is possible to provision manual timing reference switching, to set priorities for timing
sources, etc. using the Craft Terminal (CT) or a management system.
...................................................................................................................................................................................................................................
Timing protection
...................................................................................................................................................................................................................................
Timing protection
Timing unit protection
In 1678 MCC the timing functionality is physically located on the higher order matrix
board. Thus, 1+1 non-revertive protection of the timing functionality is provided (see
“Equipment protection” (p. 2-20)).
Timing reference selection

Automatic timing reference switching is supported by 1678 MCC on signal failure of the
active timing reference. The timing reference selection is according to ITU-T Rec.
G.781/G.783. If all provisioned timing references fail or become unacceptable, the system
will automatically switch over to the holdover mode.
...................................................................................................................................................................................................................................
Timing interface features
...................................................................................................................................................................................................................................
Timing interface features

External timing outputs
1678 MCC provides external timing output signals derived from the system clock or from
the incoming line signals. These output ports support 2,048 kHz or 2 Mbit/s signals as per
ITU-T Rec. G.812 and G.703.
An external timing output will automatically be squelched as soon as its associated
Quality Level (QL) drops below a provisionable threshold. Squelching is implemented by
turning the timing output signal off.
Synchronization Status Message (SSM)

A Synchronization Status Message (SSM) can be used to indicate the signal quality level
throughout a network. This will guarantee that all network elements will always be
synchronized to the highest quality clock available.
On the 1678 MCC system, the SSM algorithm is implemented according to ETS 300
417-6 and GR-253-CORE. SSM is supported on all incoming and outgoing optical and
electrical interfaces.
The user can assign a certain SSM value (overriding the received SSM, if any) to any
synchronization reference signal that can be made available to the SSM selection
algorithm.
It is possible to force each individual outgoing SSM value (overriding the SSM computed
by the algorithm) to the value D U/DUS (Do ot Use for Synchronization).
Additionally 1678 MCC supports insertion of an SSM value into an outgoing 2-Mbit/s
framed signal (external timing output) and evaluation of the SSM of an incoming
2-Mbit/s framed signal (external timing input). This feature complies with Bellcore
TR- WT-000499 and with the ITU-T Rec. G.704 respectively.
...................................................................................................................................................................................................................................
3 3opologies and
T
configurations
Overview
Purpose
This chapter describes the different shelf types for 1678 Metro Core Connect (MCC),
their physical configuration and the circuit packs.
Contents
Rack Configurations 3-3

Configuration Possibilities 3-3
Rack Configuration for SO ET markets 3-6
LA Switches (LSX) 3-7
Dispersion Compensation Unit (DCU) 3-8
Housekeeping Monitoring Unit (HMU) 3-10
Physical configuration of the main shelf 3-11
1678 MCC Main Shelf (SR78) 3-12
Equipment Front View 3-16
Configuration Rules 3-19
Part List 3-30
Units Front View 3-39
Physical configuration of the LO extension shelf 3-64
Lower Order Extension Shelf 3-65
Connection to the Main Shelf 3-74
Part List 3-77
Physical configuration of the OED shelves 3-86
1670SM Shelf - Layout 3-88
...................................................................................................................................................................................................................................
Topologies and configurations Overview
...................................................................................................................................................................................................................................
1670SM Shelf - Basic Equipment 3-90

1670SM Shelf - Basic Function of the Boards 3-91
1670SM Shelf - I/O Interfaces 3-92
1670SM Shelf - System Configurations 3-93
1670SM Shelf - Connection to the Main Shelf 3-99
1670SM Shelf - Part List 3-102
1670SM Shelf - Units Front View 3-106
1662SMC Shelf - Shelf Layout 3-123
1662SMC Shelf - Basic Equipment 3-124
1662SMC Shelf - Basic Function of the Boards 3-125
1662SMC Shelf - System Configurations 3-126
1662SMC Shelf - Part List 3-130
1662SMC Shelf - Units Front View 3-133
...................................................................................................................................................................................................................................
Topologies and configurations Rack Configurations
Configuration Possibilities
...................................................................................................................................................................................................................................
Rack Configurations
The 1678 MCC cross connect consists of one or more racks. The minimum configuration
is one main rack equipped with the main shelf. This configuration can be extended with
additional shelves an racks.
There are four kinds of shelves:
• Main shelf
• Lower Order extension shelf
• 1670SM OED
• 1662SMC OED
These shelves can be mounted in two different racks. The main shelf and the LO
extension shelf can only be mounted in a main rack. The OED shelves can be mounted
inside the main rack in combination with the main shelf or in a separate rack, named OED
rack.
The several rack configurations are shown from Figure 3-1, “Schematic 1678 MCC Main
Rack Configurations with Main and OED Shelves” (p. 3-4) to Figure 3-3, “Schematic
OED Rack Configurations” (p. 3-5)
Figure 3-1, “Schematic 1678 MCC Main Rack Configurations with Main and OED
Shelves” (p. 3-4) shows the combination possibilities of main shelf and OED shelves
inside the main rack.
Figure 3-2, “Schematic 1678 MCC Rack Configurations with LO Extension Shelf”
(p. 3-4) shows the combination possibilities with the LO extension shelf.
Figure 3-3, “Schematic OED Rack Configurations” (p. 3-5) shows the configuration
possibilities of the OED shelves inside the OED rack.
For more details about the shelves installation in the racks refer to the "Installation
Handbook".
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-1 Schematic 1678 MCC Main Rack Configurations with Main and OED
Shelves
NGTRU NGTRU NGTRU NGTRU NGTRU NGTRU

HMU HMU HMU HMU HMU HMU
Cable Space Cable Space DCU DCU
1662SMC Main
Main Shelf Main Main
Shelf Shelf Shelf
1670SM FAN
Cable Space
FAN Cable Space
Main Main
Shelf Main Shelf 1662SMC
Main Shelf 1670SM
Shelf FAN
DCU DCU DCU FAN
Top access Bottom access
Figure 3-2 Schematic 1678 MCC Rack Configurations with LO Extension Shelf
Configuration inside the main rack Rack for system extension *
NGTRU NGTRU
HMU HMU
Main LO
Shelf Shelf
Storage Box
LO
Shelf
LAN
* The extension rack can be mounted at right, left or back side of an existing main rack.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-3 Schematic OED Rack Configurations
TRU TRU TRU TRU TRU TRU

HMU HMU HMU HMU HMU HMU/DCU
DCU
1662SMC 1662SMC 1662SMC
1670SM 1670SM
FAN FAN FAN
FAN 1670SM FAN
1662SMC FAN
1662SMC 1662SMC
1670SM FAN 1662SMC 1670SM
FAN LAN FAN FAN
DCU FAN FAN
LAN LAN LAN
Top access Top/Bottom

Bottom access
access
...................................................................................................................................................................................................................................
Rack Configuration for SONET markets
...................................................................................................................................................................................................................................
Rack Configuration for SONET markets

The following special features exits:
• One main shelf or,
• Main shelf plus LO extension shelf (customer specific racks are used)
• Lower FA unit with dust filter,
• Special shelf with support for dust filter,
• Modified GTRU to provide A SI complaint battery inputs,
• o HMU is used.
This is possible in case of single shelf per rack only. In this case a dedicated alarm
cable is needed to interface GTRU with main shelf.
Figure 3-4, “Schematic SO ET Rack Configurations” (p. 3-6)shows a schematic SO ET
rack configurations.
Figure 3-4 Schematic SONET Rack Configurations
NGTRU NGTRU
Main Main
Shelf Shelf
LO
Shelf
Top/Bottom access
...................................................................................................................................................................................................................................
LAN Switches (LSX)
...................................................................................................................................................................................................................................
LAN Switches (LSX)

For multirack configurations consisting of a 1678 MCC main rack and several OED racks
a pair of Ethernet LA switches are needed to interconnect the internal control plane.
The two LA switches will be mounted at the bottom of one OED rack (refer to Figure
3-5, “General LA Cabling for multirack configurations” (p. 3-7)). For more details refer
to the "Installation Handbook".
Figure 3-5 General LAN Cabling for multirack configurations
OED Rack Main Rack OED Rack

LAN A
LAN B
TRU NGTRU TRU
1678 MMC
1662SMC 1670 SM
1670 SM
1670 SM
LO Shelf
LAN A
LAN B
Q3B to LAN A Q3B to LAN B
...................................................................................................................................................................................................................................
Dispersion Compensation Unit (DCU)
...................................................................................................................................................................................................................................

This chapter describes the mechanical integration of up to four Dispersion Compensation
Units (DCUs) into both rack types (Main-/OED-Rack). In consequence of using V/U-64.2
boards the insertion of one or two Dispersions Compensation Modules (DCMs) is
required. Up to two DCMs can be housed per DCU shelf (refer to Figure 3-6, “Dispersion
Compensation Unit (DCU)” (p. 3-9)). The DCM is a pure passive component without any
control functions. The Dispersion Compensation Module is designed for SMF operating
in extended C-band. It is capable of compensating the dispersion of standard single mode
fiber (SMF) over a wide wavelength range, from 1529nm to 1569nm. For more details
please refer to chapter “V-64.2 Application (Very Long Haul)” (p. 7-20) and “U-64.2
Application (Ultra Long Haul)” (p. 7-21).
The following tables show the several configuration possibilities in the Main and in the
OED rack.For more details about the concrete rack configurations with DCUs refer to the
"Installation Handbook".
Table 3-1 Main Rack Configurations with DCU

HMU 1678 MCC 1670SM 1662SMC # of DCU
Main Rack 1 1 1 0 11
1 1 0 1 2
1 2 0 0 4
Notes:
1. Only by bottom access. o DCU is possible by top access .
Table 3-2 OED Rack Configurations with DCU

HMU 1670SM 1662SMC LANs # of DCU
OED Rack 1 1 1 0 2
1 0 2 2 4
11 2 0 0 11
Notes:
1. Only one HMU or one DCU is possible.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-6 Dispersion Compensation Unit (DCU)
...................................................................................................................................................................................................................................
Housekeeping Monitoring Unit (HMU)
...................................................................................................................................................................................................................................

The HMU (refer to Figure 3-7, “Housekeeping Monitoring Unit (HMU)” (p. 3-10)) is
meant to be a collector and distributor for system internal and housekeeping signals. The
HMU can be used in all racks being equipped with a 1678 MCC, a 1670SM or a
1662SMC shelf.
All supported combinations of HMUs with other equipment inside main rack and OED
rack are shown in Figure 3-1, “Schematic 1678 MCC Main Rack Configurations with
Main and OED Shelves” (p. 3-4)and Figure 3-3, “Schematic OED Rack Configurations”
(p. 3-5)
Regarding the 1678 MCC, main purpose of the HMU is to make the converter alarms of
the up to six step-up converters located inside the GTRU available to the system(s).
Also the "Push Button" to reset system alarm lamps and the customer access via a D-SUB
connector to the GPI and GPO interfaces will be supported.
Regarding the 1670SM, only the "Push Button" will be used.
For the 1662SMC, beside the "Push Button" also the FA alarms of the 1662SMC will be
supported.
Figure 3-7 Housekeeping Monitoring Unit (HMU)
Reset push button
...................................................................................................................................................................................................................................
Topologies and configurations Physical configuration of the main shelf
Overview
...................................................................................................................................................................................................................................
Physical configuration of the main shelf
Overview
Purpose
This section illustrates the physical structure, layout and composition, coding and
partition of the main shelf equipment.
The Equipment shelf front view is illustrated in Figure 3-8, “1678 MCC Main Shelf
Layout” (p. 3-12) and Figure 3-9, “1678 MCC Equipment front view (slot position)”
(p. 3-17).
The Main part codes and partition are listed in Table 3-6, “Main parts list” (p. 3-30).
The Accessory codes and partition are listed in Table 3-7, “Accessories list” (p. 3-34).
The Explanatory notes of part list are reported in Table 3-8, “Parts list: explanatory notes”
(p. 3-36).
For the units front view refer to “Units Front View” (p. 3-39).
These paragraphs illustrate the interconnection points that can be accessed on the units
front panel and the alarm/status LEDs together with the relevant legend and meaning.
ote: The Personal Computer (Craft Terminal) utilized for Initial Turn-on and
Maintenance operations is not listed as an item of the equipment, but it can be supplied by
Alcatel-Lucent.
Refer to the 1678 MCC User Provisioning Guide for PC hardware configuration.
Table 3-6, “Main parts list” (p. 3-30) contains the units of current equipment release.
Units belonging to previous equipment releases/versions (e.g. for configuration updating)
are not listed here but still supported, if compatible with the current one (for eventual
units belonging to previous equipment releases/versions refer to the relevant Technical
Handbook).
Contents
1678 MCC Main Shelf (SR78) 3-12

Part List 3-30
...................................................................................................................................................................................................................................
1678 MCC Main Shelf (SR78)
...................................................................................................................................................................................................................................

The mechanical design of the 1678 MCC is based on a 21" ETSI compatible shelf,
consistent with the 1678 MCC Rack equipment practice. This rack can house one
1678 MCC shelf, or one 1678 MCC shelf plus an additional OED shelf.
The mechanical dimensions of the shelf (named SR78) is the following:
• 533 mm (Wide)
• 674 mm (High) or 684 mm (with dust filter)
• 294 mm (Deep)
The deep with cover is max. 300 mm.
The mechanical design provides EMI/EMC performances, in compliance with ETSI
standard 300 386-1 "Telecommunication Center".
The 1678 MCC main shelf is a single row shelf (refer to Figure 3-8, “1678 MCC Main
Shelf Layout” (p. 3-12) ):
Figure 3-8 1678 MCC Main Shelf Layout
FAN Unit Subrack n

PSF
PSF
MATRIX* (Copy A)
MATRIX* (Copy B)
FLCCONGI
Subrack n+1
FLCSERV
Traffic Ports Traffic Ports
FAN Unit Subrack n+2
21 96 TE
Matrix*: MX160
MX320
MX640
The 1678 MCC main shelf (SR78) has a symmetrical layout. There are no dedicated slots
for expansions towards other shelves.
The 1678 MCC has got 16 port slots, each supporting up to 40 Gbit/s (256 STM-1
equivalent) throughput. So the maximum throughput supportable by 1678 MCC is 640
Gbit/s (4096 STM-1 equivalent).
The 16 port slots are provided by a 2.5 Gbit/s backpanel.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Three types of slots are distinguished:

• Port slot (16 slots, each 4.5TE wide), containing any type of the following Traffic
Port boards:
16 x STM-1/4 optical board (P16S1-4)

16 x STM-1 board (P16S1S)
16 x STM-16 optical board (P16S16)
1 x STM-64 optical board (S64M)
2 x STM-64 optical board (P2S64M)
4 x STM-64 optical board (P4S64M)
2 x STM-64 optical board (P2S64X)
4 x STM-64 optical board (P4S64X)
16 x GE Port board (P16GE)
2 x 10 Gigabit Ethernet Port (P2XGE)
4 x 10 Gigabit Ethernet Port (P4XGE)
Lower Order Matrix board 40G (LAX40)
Lower Order Matrix board 20G (LAX20)
Lower Order Matrix Link 40G (LAC40)
ISA-ES64 Server Board (ES64SC)
The maximum quantity of each interface per shelf is:

– 256 x STM-1 optical interfaces
– 256 x GE optical interfaces
– 32 x 10GE optical interfaces with 2 x 10GE per board.
The maximum number of 4 x 10GE boards depends on the configuration. Please
contact your Technical Assistance Center.
• Higher Order Matrix slot (2 slots, each 8TE wide), containing the following boards
(1+1):
640 Gbit/s Matrix board (MX640)

640 Gbit/s Matrix board ASI (MX640GA)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

320 Gbit/s Matrix board ASI (MX320GA)
• Control and Common parts slot (2 slots, each 4TE wide), containing the following
boards:
First Level Controller and Service Interfaces (FLCSERV)

First Level Controller and Service Interfaces ASI (FLCSERVA)
First Level Controller and Control&General Interfaces (FLCCO GI)
Power Supply Filter (1+1) (PSF)
Bus Termination (two boards) (BUSTERM)
ote: FLC, PSF and BUSTERM are located in the same slot. This slot is divided into
three subslots (refer to Figure 3-9, “1678 MCC Equipment front view (slot position)”
(p. 3-17)). The BUSTERM board is not visible on the shelf front panel. It is
positioned behind the FLC board.
The FA Subsystem consists of two subracks and contains the following boards:
FA s unit (FA )
The FLCSERVICE supports the following functionalities:

• Flash Memory device
• First Level Controller spare
• connectors for Auxiliary AUX/EOW Channels (not supported by the software)
• External Synchronization Interface
• Q3 and F interfaces
• phone jack and phone expansion
• DCC
The FLCCO GI supports the following functionalities:
• Flash Memory device
• First Level Controller main
• External connectors for Housekeeping, Remote Alarms, Rack Alarms
• Q3 and F interfaces
• DCC
The Matrix boards supports the following functionalities:
• Cross-connection
• Synchronization (CRU)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Shelf Controller
• 1+1 EPS protection scheme, when two Matrix boards are present
The Power Supply Filter board (PSF) supports the following functionality:
• distribution of Power Supply after filtering process
The Bus Termination board (BUSTERM) supports the following functionality:
• electrical termination to the buses routed on the backplane
These two boards are not visible on shelf front-panel. They are two small board included
in the shelf and one BUSTERM is placed behind the FLCSERV board and the other
BUSTERM is placed behind the FLCCO GI board.
The FA unit (FA ) supports the following functionality:
• cooling of the equipment
Due to the high level of integration reached with this equipment, the two FA units
located at the top and at the bottom of the shelf have always to be equipped.
The two FA units are physically integrated in the 1678 MCC shelf, without the need of
external connection cables.
ote: The slots which are not equipped have to be closed by a dummy plate for EMC
reasons.
...................................................................................................................................................................................................................................
Equipment Front View
...................................................................................................................................................................................................................................

The 1678 MCC equipment has a symmetrical layout (refer to Figure 3-9, “1678 MCC
Equipment front view (slot position)” (p. 3-17)).
The following types of slots are distinguished:
slot 1 First Level Controller "spare" + Service Interfaces board

(FLCSERV, FLCSERVA)
slots 2 to 9 and slots 12 to Traffic Port boards, ES64 data board, Lower Order
19 Adaptation/Matrix and Lower Order Matrix Link 40G
slot 10 and 11 High Order Matrix (A and B) boards
(MX640, MX640GA, MX320, MX320GA, MX160)
slot 20 First Level Controller "main" + Control&General Interfaces board
(FLCCO GI)
slot 21 and 22 Bus Termination boards
(BUSTERM)
slot 24 and 25 Power Supply and Filter boards
(PSF)
ote: Slot 21 and slot 22 are positioned behind slot 1 and slot 20 respectively, so the
BUSTERM boards are not visible on the shelf front panel.
The two FA s have no slot number, because they are modelled as separate subracks
(subrack n and n+2).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-9 1678 MCC Equipment front view (slot position)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Configuration Rules
Capacity Count in HO Matrix
From R3.2 (SKY20-01G) onwards the following handling on I/O boards with pluggable
modules is implemented: The HO matrix capacity is counted on configured port level (not
on board level), while cards without direct interfaces (e.g. LAX20/40) are not counted.
But all LO shelf LAC40 ports are taken in account!
Restrictions
There are the following two restrictions in term of matrix size and power consumption:
ote: Please note, that the number of configurable modules (e.g. on 16xSTM-16
boards) depends on your matrix size! The matrix size defines the max. number of
modules. There are restrictions in case of smaller matrix size:
• MX320 = 2048 STM-1 equ.
• MX160 = 1024 STM-1 equ.
ote: Refer to the 1678 MCC User Provisioning Guide for the detailed procedure.
ote: Depending on the configuration the maximum number of boards in the I/O slots
might be limited because of the power consumption of 140 W per board. The
maximum shelf load must not be violated.
Allowed or basic Equipment Configuration

Table 3-3, “1678 MCC Equipment: slot configuration” (p. 3-19) presents for each slot, the
allowed equipment types and the basic equipment type (the acronyms of the units are
shown).
Table 3-3, “1678 MCC Equipment: slot configuration” (p. 3-19)describes the
configuration for allowed and basic boards in the 1678 MCC main shelf. Table 3-4,
“Pluggable Optical and Electrical Modules” (p. 3-21)describes the configuration of the
Pluggable Modules in the STM-64, STM-16, STM-1/4 and the GE boards front panels
allowed for 1678 MCC main shelf.
Table 3-3 1678 MCC Equipment: slot configuration

1678 MCC shelf
Slots Basic Configuration Allowed Equipment note
1 FLCSERV/FLCSERVA -- 1
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Table 3-3 1678 MCC Equipment: slot configuration (continued)

1678 MCC shelf
Slots Basic Configuration Allowed Equipment note
2 to 9 no basic configuration SDH High Speed ports: 2
and P4S64M
12 to 19 P2S64M
P4S64X
P2S64X
S64M
P16S16
P8S16
P4S16
P16S1S4
P16S1S
P16GE
P8GE
P4GE
P2XGE
P4XGE
Layer 2 Switch 20G board: 14
ES64SC
LO Matrix boards: 3
LAX40
LAX20
LO Matrix Link 40G boards: 13
LAC40
10 MX640, MX640GA, -- 4
MX320, MX320GA,
MX160 (main)
11 MX640, MX640GA, -- 4
MX320, MX320GA,
MX160 (spare)
20 FLCCO GI -- 5
21, 22 BUSTERM -- 6
24, 25 PSF -- 7
subrack n, n+2 FA -- 8
For the explanatory notes refer to Table 3-5, “1678 MCC Equipment: slot configuration
explanation notes” (p. 3-22).
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-10, “Main Shelf: Supported I/O boards - Part 1” (p. 3-25) and Figure 3-11,
“Main Shelf: Supported I/O boards - Part 2” (p. 3-26) show the supported basic boards
and allowed I/O and LO matrix boards and the STM- optical/electrical modules
managed in the 1678 MCC main shelf.
Table 3-4 Pluggable Optical and Electrical Modules

Slot Allowed Equipment note
P16S1S board
J1 to J16 STM-1 electrical module: SES1 9
J1 to J16 STM- optical modules: SS11 9
SL11
SL12
P16S1S4 board
J1 to J16 STM-1 electrical module: SES1 9
J1 to J16 STM- optical modules: SS11 9
SL11
SL12
SS41
SL41
SL42
P4S16, P8S16, P16S16
J1 to J4 STM- optical modules: SI161 10
J1 to J8 SS161
J1 to J16 SL161
SL162
STM- colored modules: CWP (1470 - 1610 nm)
CWA (1470 - 1610 nm)
DWA (CH 620 - CH 170)
LAC40 boards
J1 to J16 STM- optical modules: SI161 10
SEI161
P4GE, P8GE, P16GE boards
J1 to J4...16 Optical modules: SGESX 10
SGELX
SGEZX
P2S64X, P4S64X boards
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Table 3-4 Pluggable Optical and Electrical Modules (continued)

Slot Allowed Equipment note
J1 to J2 STM- optical modules: XS642E 11
J1 to J4 XS642B
XI641
XP1L12D2
STM- colored modules: DWDM APD (CH60 – CH17)
P2XGE, P4XGE boards
J1 to J16 STM- optical modules: XGES 12
XS642B
XI641
For the explanatory notes refer to Table 3-5, “1678 MCC Equipment: slot configuration
explanation notes” (p. 3-22).
Table 3-5 1678 MCC Equipment: slot configuration explanation notes
Note Explanation
1 It is 4TE.
It is dedicated to First Level Controller "spare" function and Service interfaces.
Equipment Controller 1+1 EPS protection scheme is supported. When this board is "active" manages the F interface.
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................

(continued)
Note Explanation
2 All these boards are 4.5TE.

For S64M: This port board can combine with different non exchangeable MSA modules.The following board types result
from this:
• 1 x S-64.2 Port (S-64.2M)
• 1 x L-64.2 Port (L-64.2M)
• 1 x I-64.1 Port (I-64.1M)
• 1 x V-64.2 Port (V-64.2M)
• 1 x U-64.2 Port (U-64.2M)
For P2S64M: This port board can combine with different non exchangeable MSA modules. The following board types
result from this:
• 2 x S64.2 Port (P2S64M)
• 2 x I64.1 Port (P2I64M)
For P4S64M: This port board can combine with different non exchangeable MSA modules. The following board types
result from this:
• 4 x S64.2 Port (P4S64)
• 4 x I64.1 Port (P4I64)
For P2S64X/P4S64X: This port boards can combine with different pluggable XFP/XFP-E modules. The following
XFP/XFP-E modules are supported:
• OPTO TRX XFP S-64.2B Ext.
• OPTO TRX S-64.2B XFP
• OPTO TRX I-64.1 XFP -5/70C
• OPTO TRX XFP P1L1-2D2 (80 km)
• OPTO TRX XFP L–64.2 DWDM APD (80 km) (only in R4.3.2 and higher Releases)
For P16S16: up to sixteen Short, Long Haul and colored STM-16 standard ITU-T optical interfaces are provided.
For P8S16: up to eight Short, Long Haul and colored STM-16 standard ITU-T optical in terfaces are provided.
For P4S16: up to four Short, Long Haul and colored STM-16 standard ITU-T optical inter faces are provided.
For P16S1S4: up to sixteen electrical STM-1 and/or optical STM-1 and/or STM-4 standard ITU-T interfaces are provided.
For P16S1S: up to sixteen optical STM-1 and/or electrical STM-1 standard ITU-T inter faces are provided.
For P4/8/16GE: up to four/eight/sixteen Gb Ethernet SFP modules are provided.
For P2XGE/P4XGE: up to four of the following modules are provided per board:
• OPTO TRX 10G BASE-S
• OPTO TRX S-64.2B XFP
• OPTO TRX I-64.1 XFP -5/70C
3 It is 4.5TE. Both boards provide to 1+1 EPS protection scheme (mandatory).

LAX A and LAX B have to be located as pair in the following slot numbers:
slot#2 and #3 or slot#4 and#5 and so on until slot#18 and #19.
4 It is 8TE. Both boards provide to 1+1 EPS protection scheme (mandatory).
5 It is 4TE.
It is dedicated to First Level Controller "main" function and Control&General interfaces.
First Level Controller 1+1 EPS protection scheme is supported. When this board is "active" manages the F interface.
6 These two small boards are located behind FLCSERV and FLCCO GI boards.
They are not visible on the front view.
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................

(continued)
Note Explanation
7 They are both mandatory.
8 They are both mandatory, one under and one above the shelf.
9 Up to sixteen optical/electrical SFP modules can be plugged in the P16S1S4 and P16S1S port board. A mix of different
modules is allowed. In case of P16S1 S4 a mix of STM-1e/o and STM-4 is only allowed in groups of four.
10 Each optical SFP module can be plugged in anyone of the up to sixteen front panel slots of the relevant port boards.
11 Each optical XFP/XFP-E module can be plugged in anyone of the up to four front panel slots of the relevant port boards.
A mix of different modules is allowed.
12 Each optical XFP module can be plugged in anyone of the up to four front panel slots of the relevant port boards. A mix of
different modules is allowed.
13 This board is used to connect the 1678 MCC main shelf with the LO extension shelf.
Max. 5 (4+1) LAC40 boards are necessary to connect a fully equipped 160G LO extension shelf. The board can be
equipped with up to sixteen SI161 or SEI161 SFP modules.
14 This board is used to support Layer 2 switch functionality.
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-10 Main Shelf: Supported I/O boards - Part 1
I/O Interfaces Port boards Connectors

1 slot
1 4xSTM–64
4xSTM–64 MSA PORT 2
S64.2b SC/PC
3
I–64.1 (FC/PC)
no mix possible, . P4S64
4
modules not pluggable
P4I64
1 slot
2xSTM–64 MSA PORT 2xSTM–64

1
S–64.2b
I–64.1 SC/PC
no mix possible, 2 P2S64M (FC/PC)
modules not pluggable .
P2I64M
1 slot
1 4xSTM–64
XFP(–E)
4xSTM–64 XFP PORT
2
S64.2b
XFP(–E)
I–64.1 3 LC
XFP(–E)
P1L1–2D2
DWDM APD 4
XFP(–E) P4S64X
any mix of XFP/XFP–E modules
possible; modules are pluggable
1 slot
2xSTM–64
2xSTM–64 XFP PORT
1
S–64.2b XFP(–E)
I–64.1 LC
P1L1–2D2 2
DWDM APD XFP(–E)
P2S64X
any mix of XFP/XFP–E modules
possible; modules are pluggable
1 slot
1xSTM–64
1xSTM–64
S–64.2b SC/PC
1 (FC/PC)
L–64.2b S–64.2M
I–64.1 L–64.2M
I–64.1M
1 slot
1xSTM–64
1xSTM–64 external part
V–64.2 1
DCU
see note below
U–64.2
V–64.2M
U–64.2M
1 slot
(4/8)16xSTM–16
1
I–16.1 SFP
S–16.1 2
SFP
L–16.1 . . (4/8)16xSTM–16
L–16.2 LC
CWP . . (P4S16)
(4/8)16 (P8S16)
CWA SFP
P16S16
DWA
any mix of SFP modules allowed
1 slot
1
LAC40 SFP
I–16.1 2
SFP
. . LC
16xSTM–16
. .
16
SFP
LAC40
* only on customer request
ote: For the connector assignment refer to Figure 3-23, “Connector assignment of
L-642M, V-642M and U-642M boards -Part 1” (p. 3-49) and to Figure 3-24,
“Connector assignment of L-642M, V-642M and U-642M boards -Part 2” (p. 3-50).
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-11 Main Shelf: Supported I/O boards - Part 2
I/O Interfaces Port boards Connectors
1 slot
16xSTM–1/4 1
SFP
S–4.1, L–4.1, L–4.2 2
SFP
S–1.1, L–1.1, L–1.2, SES1
. . LC
16xSTM–1/4
a mix of SFP modules allowed,
. .
16
but only in groups of four
SFP P16S1S4
1 slot
1
SFP
16xSTM–1 2
SFP
S–1.1, L–1.1, L–1.2, SES1 . .
. 16xSTM–1 LC
.
16
SFP P16S1S
1 slot
1
(4/8)16xGE SFP
2
SGELX SFP
SGESX
. .
(4/8)16xGE LC
SGEZX . . (P4GE)
(4/8)16 (P8GE)
SFP P16GE
1 slot
1
2x10GE XFP PORT XFP
10G BASE–S 2 XFP
S–64.2b (10G BASE–E) 2x10GE LC
I–64.1 (10G BASE–L)
P2XGE
1 slot
1
XFP
4x10GE XFP PORT
10G BASE–S 2 XFP
S–64.2b (10G BASE–E)
3
4x10GE LC
XFP
I–64.1 (10G BASE–L)
4
XFP
P4XGE
Examples of Equipment Configuration

The figures on next pages show some examples of allowed equipment configuration.
Figure 3-12, “Basic configuration of 1678 MCC Main Shelf” (p. 3-28) shows the typical
basic configuration of 1678 MCC main shelf (without Traffic Port boards):
slot 1 FLCSERV / FLCSERVA board

slot 2 to 9 reserved to traffic port boards, ES64 and LO matrix
slot 10 and slot 11 two MX(160/320/320GA/640/640GA) boards
slot 12 to 19 reserved to traffic port boards, ES64 and LO matrix
slot 20 FLCCO GI board (CT interface)
slot 21 and slot 22 two BUSTERM boards (small board)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
slot 24 and slot 25 two PSF boards

two FA units (subrack n, n+2)
dummy plates for all other slots unequipped
Figure 3-13, “Allowed Equipment Configuration (Example)” (p. 3-29) shows an example
of the following configuration:
basic configuration
slot 2 to 5 four 16 x STM-16 boards
slot 7 and slot 8 two 1 x STM-64 boards (short haul)
slot 9 one 4 x STM-64 board (short haul)
slot 12 and slot 13 two 16 x STM-1/4 boards
slot 14 one 4 x STM-64 board (short haul)
slot 15 and slot 16 two 2 x STM-64 boards (short haul)
slot 18 one 4 x STM-64 board (intraoffice)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-12 Basic configuration of 1678 MCC Main Shelf
FAN (subrack n)
24 25
2 3 4 5 6 7 8 9 12 13 14 15 16 17 18 19
PSF
PSF
10 11
Matrix Copy B
Matrix Copy A
1 20
FLCSERVICE
FLCCONGI
21 22
BUSTERM
BUSTERM
FAN (subrack n+2)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-13 Allowed Equipment Configuration (Example)
FAN (subrack n)
24 25
PSF 2 3 4 5 6 7 8 9 12 13 14 15 16 17 18 19
PSF
10 11
1 20
Matrix Copy B
Matrix Copy A
P16S1 4
P16S1 4
P16S16
P16S16
P 16S 16
P16S16
S642M
S642M
FLCSERVICE
P4S64
P4S64
P2S64
P2S64
P4I64
FLCCONGI
dummy plate
dummy plate
dummy plate
21 22
BUSTERM
BUSTERM
FAN (subrack n+2)
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................
Part List
The Part List is subdivided in three tables, specifically:
• in Table 3-6, “Main parts list” (p. 3-30) is shown the Main part list
• in Table 3-7, “Accessories list” (p. 3-34) is shown the Accessory list
• in Table 3-8, “Parts list: explanatory notes” (p. 3-36) is shown the Explanatory notes
of previous lists
Furthermore, for any item the position and the maximum quantity that can be allocated
inside the equipment are indicated too.
Such tables report the following information:
• Description: name of items
• Acronym: it is used to identified units and modules on the Craft Terminal applications
• A V Part/ umber
• Max Q.ty: maximum quantity of items in the 1678 MCC equipment
• Slot: position of the units inside the 1678 MCC equipment (refer to Figure 3-9,
“1678 MCC Equipment front view (slot position)” (p. 3-17))
• otes: listed as a set of explanatory notes in the separate Table 3-8, “Parts list:
explanatory notes” (p. 3-36).
Table 3-6 Main parts list
Max.
DESCRIPTION ACRONYM ANV P/N SLOT NOTE
Q.ty
MECHA ICAL STRUCTURE
3AL 81673 AA--
MCC RACK WITH GTRU -- 1 -- 1
3AL 81673 AB--
3AL 81224 AA-- 2
1678 MCC SHELF SR78 1 --
3AL 81224 AB-- 29
HOUSEKEEPI G MO ITORI G U IT HMU 3AG 24234 AA-- 1 -- 28
POWER SUPPLY
POWER SUPPLY A D FILTERS PSF 3AL 81502 AA-- 2 24, 25 3
COMMO PARTS (CO TROLLER)
FLCCO GI E H. FLCCO GI 3AG 24102 AA--
20
FLCCO GI E H. (max DCC–M) FLCCO GI 3AG 24102 AB--
FLCSERVICE E H. FLCSERV 3AG 24103 AA-- 1 4
FLCSERVICE E H. (max DCC–M) FLCSERV 3AG 24103 AB-- 1
FLCSERVICE E H. A SI FLCSERVA 3AG 24332 AB--
SWITCHI G MATRIX
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................
Table 3-6 Main parts list (continued)

Max.
Q.ty
MATRIX 640 GBIT/S MX640 3AL 81429 AA--
MATRIX 640 GBIT/S A SI MX640GA 3AG24334 AA--
MATRIX 320 GBIT/S MX320 3AG 24173 AA-- 10, 11 5
MATRIX 320 GBIT/S A SI MX320GA 3AG 24336 AA--
MATRIX 160 GBIT/S MX160 3AG 24174 AA-- 2
LOWER ORDER
LAX40 3AG 24104 AA--
ADAPTATIO /MATRIX 40G 2 to 9
6
LOWER ORDER 3AG 24186 AA-- and
LAX20
ADAPTATIO /MATRIX 20G 3AG 24186 AB-- 12 to 19
Lower Order Matrix Link 40G LAC40 3AG 24327 AA-- 5 35
SPARE PARTS
3AL 81209 AA--
TERMI ATIO BUS BUSTERM 2 7
3AL 81209 AB-- --
SFP EXTRACTOR -- 3AL 81728 AA-- 1 8
TRAFFIC PORTS
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
16xSTM-1 PORT /SFP (OC-3) P16S1S 3AG 24183 AA-- 9
16xSTM-1/4 PORT /SFP (OC-3/OC-12) P16S1S4 3AL 89540 AA-- 10
16xSTM-16 PORT /SFP (OC-48) P16S16 3AL 81295 AA--
8xSTM-16 PORT /SFP (OC-48) P8S16 3AG 24175 AA-- 11
4xSTM-16 PORT /SFP (OC-48) P4S16 3AG 24176 AA--
3AL 81292 AA--
4xSTM-64 I-64.1 PORT FC/PC (OC-192) P4I64
3AL 81292 AB--
3AL 81692 AE--
4xSTM-64 S-64.2 PORT FC/PC (OC-192) P4S64
3AL 81692 AF--
3AG 24161 AA--
4xSTM-64 XFP PORT (OC-192) P4S64X
3AG 24161 AB--
3AG 24177 AA--
2xSTM-64 I-64.1 PORT FC/PC (OC-192) P2I64M
3AG 24177 AB--
3AL 81692 AC--
2xSTM-64 S-64.2 PORT FC/PC (OC-192) P2S64M
3AL 81692 AD--
3AL 24214 AA--
2xSTM-64 XFP PORT (OC-192) P2S64X 2 to 9
3AL 24214 BA-- 16
and
1xSTM-64 V-64.2 PORT FC/MU 3AL 89997 AA--
V-642M 12 to 19
(OC-192) 3AL 89997 AB--
--
3AL 89996 AA--
1xSTM-64 U-64.2 PORT FC/PC 3AL 89996 AB--
U-642M
(OC-192) 3AL 89996 AC--
3AL 89996 AD--
3AG 24179 AA--
1xSTM-64 I-64.1 PORT FC/PC (OC-192) I-641M
3AG 24179 AB--
3AL 81692 AA--
1xSTM-64 S-64.2 PORT FC/PC (OC-192) S-642M
3AL 81692 AB--
3AL 89995 AA--
1xSTM-64 L-64.2 PORT FC/PC (OC-192) L-642M
3AL 89995 AB--
16xGE/FC PORT P16GEFC 3AL 81904 AA--
8xGE/FC PORT P8GEFC 3AG 24181 AB--
4xGE/FC PORT P4GEFC 3AG 24182 AB--
2x10GE XFP PORT P2XGE 3AG 24476 AA--
4x10GE XFP PORT P4XGE 3AG 24339 AA-- -- 42
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
DATA APPLICATIO
2 to 9
ISA-ES PACKET AGGREGATOR 20G
ES64SC 3AG 24371 AA-- 2 and 40
(SERVER CARD)
12 to 19
STM- ELECTRICAL/OPTICAL MODULES
12,
OPTO TRX SFP STM-1EL PLUG-I SES1 1AB 21017 0001
27
OPTO TRX SFP S-1.1 PLUG-I 1AB 19467 0001
SS-1.1
OPTO TRX SFP S-1.1 DDM PLUG-I 1AB 19467 0004
OPTO TRX SFP L-1.1 PLUG-I 1AB 19467 0002
SL-1.1
OPTO TRX SFP L-1.1 DDM PLUG-I 1AB 19467 0005
SL-1.2
SS-4.1
SL-4.1
SL-4.2
256 --
OPTO TRX SFP S-16.1 PLUG-I SI-16.1 1AB 19637 0013
12
SS-16.1
SL-16.1
SL-16.2
Opto Transc. Module 1470nm CWP 1AB 19634 0001
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
Opto Tr. Module 1470nm APD CWA 1AB 19635 0001
Opto Tr. Module 1530nm APD CWA 1AB 19635 0004 12
256
1AB 23141 0001 to
Opto TRX SFP DWDM CH620...CH170 DWA 37
1AB 23141 0046
OPTO TRX 1.25 GBE SFP-LX 1AB 18728 0001
SGELX
OPTO TRX 1.25 GBE SFP-LX DDM 1AB 18728 0031
--
OPTO TRX 1.25 GBE SFP-SX 1AB 18728 0002 12
SGESX
OPTO TRX 1.25 GBE SFP-SX DDM 1AB 18728 0033
OPTO TRX 1.25 GBE SFP–ZX DDM SGEZX 1AB 18728 0042
OPTO TRX XFP 10GBASE-S XGES 1AB 21454 0002 24 36
3AG 24273 AA--
OPTO TRX I-64.1 XFP XI641
1AB 21454 0001
3AG 24274 AA--
OPTO TRX S-64.2B XFP XS642B
1AB 21728 0001
OPTO TRX XFP S-64.2B EXT XS642E 3AL 81887 AA-- 64 26
3AG 24488 AA--
OPTO TRX XFP P1L1-2D2 XP1L12D2
1AB 21728 0002
1AB 35663 0001 to
Opto TRX XFP L–64.2 DWDM APD DWDM APD
1AB 35663 0044
Table 3-7 Accessories list

Max.
Q.ty
SOFTWARE 13
EQUIPME T ACCESSORIES
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................
Table 3-7 Accessories list (continued)

Max.
Q.ty
3AL 81205 AA-- 14
1678 MCC FA U IT FA 3AL 81205 AB-- 2 34
3AL 81205 AC-- 14
1678 MCC DUST FILTER U IT -- 3AG 24350 AA-- 1 31
1678 MCC DUST FILTER -- 3AG 24354 AA-- 1 32
--
1678 MCC DUST FILTER CARRIER -- 3AG 24608 AA-- 1 41
1678 MCC OEM–WIRE MESH DUST
-- 3AG 24609 AA-- 1 41
FILTER
1678 MCC I STALLATIO KIT -- 3AL 89584 AA-- 1 15
1678 MCC I STALLATIO KIT -- 3AG 24367 AA-- 1 30
DUMMY PLATE W=22.5 mm -- 3A 52174 AA-- 16 16
PI PROTECTIO BOARD PI PROT 3AG 24663 AA-- 16 43
2 MB/S AUX CHA EL 75 Ω KIT -- 3AL 38432 AA-- 1 --
2 MB/S AUX CHA EL 120 Ω KIT -- 3AL 38433 AA-- 1 --
SDH SY C ADAPTER 75 Ω U BAL
-- 3AL 89586 AA-- 1 -- --
KIT
SDH SY C ADAPTER 120 Ω BAL KIT -- 3AL 89587 AA-- 1 --
CRAFT TERMI AL CABLE KIT -- 3AL 89585 AA-- 1 17
GTRU GTRU 3AL 81656 AA-- 1 33
GTRU DUMMY COVER -- 3A 51536 AA-- 4 18
DC/DC CO VERTER STEP-UP 2000 W STPUP 3AL 89590 AA-- 6 19
GTRU BYPASS GBYP 3AL 38414 AA-- 6 21
FA U IT PROTECTIO -- 3AL94613 AA-- 1 14
SFP DUMMY PLUG KIT -- 3AL89857 AA-- 16 20
--
I STALLATIO KIT GTRU -- 3AL 38423 AA-- 1 --
ESD KIT -- 3AL 37973 AA-- 1 22
EARTHQUAKE KIT -- 3AL 91637 AA-- 1 23
ACCESSORY KIT 1678 MCC -- 3AG 24268 AA-- 1 --
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
XFPE DUMMY PLUG -- 3AL 24271 AA-- 24
LOW LOSS SMF C + BA D DCM 10
-- 1AB 21083 0003
km - MU
-- 1AB 21083 0008
km - MU
25
-- 1AB 21083 0009
km - MU --
-- 1AB 21083 0012
km - MU
KIT DCU TRAY 1678 MCC RACK -- 3AL 91853 AA-- --
3AL 74705 AA--
LA SWITCH LS-DC LS-DC 2 38
3AL 74705 AB--
I STALLATIO KIT LA SWITCH -- 3AG 24223 AA-- 2 39
Table 3-8 Parts list: explanatory notes

Note Explanation
This item contains the GTRU equipment (without converters and dummy covers) and the complete set of parts of the
1
rack to host 1678 MCC equipment.
2 It is the equipment shelf.
These items are mandatory and they are provisioned in 1+1 configuration: the boards perform the filtering and the
3
distribution of the power supply for the 1678 MCC equipment.
The two boards are used in an 1+1 protected FLC configuration (master and slave): one is the FLC active and the other is
the FLC in stand-by to perform the equipment controller functionalities. Both boards must be of the same type: 33Mhz or
4
66Mhz. FLCs (33Mhz) have part numbers ending with AA, while FLCs (max DCC–M) (66Mhz) have part numbers
ending with AB. For replacing FLC boards see the replacement procedure in the 1678 MCC Maintenance Handbook.
Two MX boards are used in an 1+1 protected EPS configuration: the boards perform connection and cross-connection
5
functionalities and moreover synchronization functionalities.
The both LAX boards have to be located as pair in the following slot numbers: slot#2 and #3 or slot#4 and#5 and so on
6
until slot#18 and #19.
7 This is a spare part item; the 1678 MCC shelf (SR78) already included it.
This is a spare part item; the 1678 MCC shelf (SR78) already included it. It is necessary for STM- Optical Module
8
extraction.
It provides to process up to sixteen STM-1 electrical and optical SFP modules: Any mix of different SFP modules is
9
possible.
It provides to process up to sixteen STM-1e/o and/or STM-4 SFP modules: a mix of different SFP modules is possible, but
10
only in groups of four.
11 It provides to process up to sixteen STM-16 SFP modules: Any mix of different SFP modules is possible.
12 Up to 16 of these modules are hosted in PORT board.
13 Details concerning the software P/ are given in the 1678 MCC User Provisioning Guide.
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................
Table 3-8 Parts list: explanatory notes (continued)

Note Explanation
14 These items are mandatory. Maintenance intervals are described in the 1678 MCC User Provisioning Guide.
It contains the cables and all the accessories (connectors, caps, screws, etc.) concerning Power Supply and Auxiliary
15
systems (except Sync. and 2 Mbit/s Aux. systems).
It is essential to insert the relevant dummy plates on the space left by all Traffic Port boards OT supplied, in order to
16
obtain the EMI/EMC performances.
It contains the cable to connect the Craft Terminal to the "Active" Equipment Controller (FLCCO GI or FLCSERV
17
boards). Its length is 3 m.
It is essential to insert the relevant dummy covers on the space left by all DC/DC Step-up Converters (or GTRU Bypass)
18
OT supplied in the GTRU equipment, in order to obtain the EMI/EMC performances.
19 These items are hosted in the GTRU equipment in 1+1 configuration to supply the 1678 MCC equipment.
20 It contains the SFP dummy plugs to insert into the free cavities of P16S16 and P16S1-4 boards.
When this item is used in alternative to the DC/DC Step-up Converter, only 8 Traffic Ports are provisional in the
21
1678 MCC equipment (four into slots 2 to 9 and four into slots 12 to 19).
22 Part of MCC rack

23 If earthquake proof is required.
24 One per unplugged XFP-E module necessary.

Dispersion Compensation Module for STM-64 (U-64.2 and V-64.2); refer also to Figure 3-23, “Connector assignment of
25 L-642M, V-642M and U-642M boards -Part 1” (p. 3-49) and to Figure 3-24, “Connector assignment of L-642M, V-642M
and U-642M boards -Part 2” (p. 3-50). Two DCMs can be mounted in one Dispersion Compensation Unit (DCU).
26 Up to 4 of these modules are hosted in PORT board. Any mix of different XFP modules is pos sible.
27 Electrical SFP modules have to be inserted in the leftmost and rightmost board of the shelf (slot 2 or slot 19)!
28 Only necessary in case of supported feature: Station Alarms
29 Shelf supports FA s with dust filter.
30 Installation Kit 1678 MCC for A SI market.

31 Dust filter support used in former product releases.
32 The Kit includes three dust filters used in former product releases.
33 This is a spare part item; the 1678 MCC rack already included it.
34 Version for A SI market.

Link board for the connection of the LO extension shelf. In case of a full equipped 160G LO extension shelf 5 (4+1)
35
LAC40 are necessary.
36 umber of modules depends on number of used boards.
Up to 16 of these modules are hosted in PORT board.

37
1AB 23141 0001 is CH620, 1AB 23141 0002 is CH610 and so on up to 1AB 23141 0046 is CH170.
38 LA switches are necessary for multirack configurations.
39 One Kit per LA switch.
Always 1:1 protected. Two working boards and two protecting boards. The maximum quantity listed in the table refers to
40
the number of working boards.
Dust filter is only needed, if the ambient condition is twice worse than required by the following international standard:
41
E 300–019–1–3 class 3.2: dust (suspension) 400 g/m3, dust (sedimentation) 15mg/(m2 per hour)
42 The maximum number of 4 x 10GE boards depends on the configuration. Please contact your Technical Assistance Center.
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Note Explanation
eeded for dirty environment (≥ class 3.2) to protect the backplane connector in an empty slot from dust. After insertion
43 of the Pin Protection Board an RUTM alarm (Replaceable Unit Type Mismatch) is raised. Refer to the section Alarms
Configuration of the CT Operator’s Handbook to set the ASAP to o Alarms.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Units Front View

This paragraph shows the access points (LEDs, switches etc.) present on each units
together with legend and meaning.
Figure 3-14, “4xGE, 4xSTM-16 optical port board - front view” (p. 3-40) through Figure
3-35, “FA unit - front view” (p. 3-60) illustrate units front view available in the
1678MCC Equipment.
Figure 3-36, “Optical SFP Module” (p. 3-61) to Figure 3-40, “Optical XFP-E Module”
(p. 3-63) show the pluggable modules available in the 1678MCC Equipment.
ote: The unit dimensions in all figures are not the real ones.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-14 4xGE, 4xSTM-16 optical port board - front view
ACRONYM SLOTS
P4S16 2 to 9 and 12 to 19
P4GE 2 to 9 and 12 to 19
(2)
(3)
(4)
(5)
LEGENDA:
(1) Bicolor LED:

Red – local unit alarm
Green – in service unit
(2) to (5) STM–16 optical channel
(from ch. #1 to ch. #4)
(1)
ote: The cavities must be equipped with up to four STM-16 or GE optical SFP
module plug-ins (refer to Figure 3-36, “Optical SFP Module” (p. 3-61)); in the free
cavities the relevant SFP dummy plugs must be inserted.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-15 8xGE, 8xSTM-16 optical port board - front view
ACRONYM SLOTS
P8S16 2 to 9 and 12 to 19
(2)
(3)
(8)
(9)
LEGENDA:
(1) Bicolor LED:

(1)
ote: The cavities must be equipped with up to eight STM-16 or GE optical SFP
module plug-ins (refer to Figure 3-36, “Optical SFP Module” (p. 3-61)); in the free
cavities the relevant SFP dummy plugs must be inserted.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-16 LAC40, 16xGE,16xSTM-16,16xSTM-4/1, 16xSTM-1E port board - front

view
ACRONYM SLOTS
P16S16 2 to 9 and 12 to 19
P16S1S4 2 to 9 and 12 to 19
(2)
P16S1S 2 to 9 and 12 to 19
(3)
LAC40 2 to 9 and 12 to 19
(16)
LEGENDA:
(17)
(1) Bicolor LED:
(1)
ote: The cavities must be equipped with up to sixteen STM-1e, STM-1, STM-4,
STM-16 or GE SFP module plug-ins (refer to Figure 3-36, “Optical SFP Module”
(p. 3-61)); in the free cavities the relevant SFP dummy plugs must be inserted.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-17 1xSTM-64 (S64M) optical port board - front view
SC/PC
ACRONYM SLOTS
I–64.1M 2 to 9 and 12 to 19
S–64.2M 2 to 9 and 12 to 19
(1)
It is also available with following connector: FC/PC
OUTPUT
INPUT
LEGENDA:
(1) Channel #1
(2) Bicolor LED
(2)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-18 2xSTM-64 (P2S64M) optical port board - front view
SC/PC
ACRONYM SLOTS
P2I64M 2 to 9 and 12 to 19
P2S64M 2 to 9 and 12 to 19
(1)
(2)
OUTPUT
INPUT
LEGENDA:
(1) Channel #1
(2) Channel #2
(3) Bicolor LED:

(3)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-19 4xSTM-64 (P4S64M) optical port board - front view
SC/PC
ACRONYM SLOTS
P4I64 2 to 9 and 12 to 19
P4S64 2 to 9 and 12 to 19
(1)
(2)
OUTPUT
INPUT
(3)
LEGENDA:
(1) Channel #1 (4)

(2) Channel #2
(3) Channel #3
(4) Channel #4
(5) Bicolor LED
(5)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-20 1xSTM-64 (L-642M) optical port board - front view
ACRONYM SLOTS
L–642M 2 to 9 and 12 to 19
(1)
(2)
LEGENDA:
(1) Output Booster, Input L64

(2) Input Booster, Output L64
(3) Bicolor LED:

(3)
L-642M, V-642M and U-642M boards -Part 1” (p. 3-49).
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-21 1xSTM-64 (V-642M) optical port board - front view
ACRONYM SLOTS
V–642M 2 to 9 and 12 to 19
(1)
LEGENDA: (2)
(1) Input Preamplifier, Output Preamplifier

(2) Input Laser Module, Output Laser Module
(3) Bicolor LED:

(3)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-22 1xSTM-64 (U-642M) optical port board - front view
ACRONYM SLOTS
U–642M 2 to 9 and 12 to 19
(1)
(2)
LEGENDA:
(1) Output Booster, Input Preamplifier (3)

(2) Input Booster, Output Preamplifier
(3) Input Laser Module, Output Laser Module
(4) Bicolor LED
(4)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-23 Connector assignment of L-642M, V-642M and U-642M boards -Part 1
Connector
on Board variant: IN L–64 OUT Booster 80 KM
ABxx AAxx
SC FC
IN Booster OUT L-64
SC FC
Attenuator
L–64 10dB
Connector
on Board variant: IN Preamp OUT Preamp 120 KM
AAxx
FC
MU in
DCM
Connectors out 80 km
IN ILM OUT ILM
LC V–64
Connector
on Board variant: OUT Booster 160 KM
IN Preamp
ABxx AAxx
SC FC
IN Booster OUT Preamp MU in
DCM
SC FC
MU out DCM
IN ILM OUT ILM Connectors in 40 km
LC LC
U–64
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-24 Connector assignment of L-642M, V-642M and U-642M boards -Part 2
Connector
on Board variant: IN Preamp OUT Preamp 120 KM
ABxx
FC
MU in
DCM
IN ILM OUT ILM

MU out DCM
LC V–64 Connectors in 10 km
Connector
on Board variant: OUT Booster 160 KM
IN Preamp
ADxx ACxx
SC FC
IN Booster OUT Preamp MU in
DCM
SC FC
MU out DCM
IN ILM OUT ILM Connectors in 50 km
LC LC
U–64
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-25 2xSTM-64 XFP/XFP-E - Front View
ote: For XFP module refer to Figure 3-38, “Optical XFP Module” (p. 3-62) and for
XFP-E module refer to Figure 3-40, “Optical XFP-E Module” (p. 3-63).
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-26 4xSTM-64 XFP/XFP-E - Front View
ote: For XFP modules refer to Figure 3-38, “Optical XFP Module” (p. 3-62) and for
XFP-E modules refer to Figure 3-40, “Optical XFP-E Module” (p. 3-63).
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-27 2x10GE LAN - Front View
ACRONYM SLOTS
P2XGE 2 to 9 and 12 to 19
XFP1 (4)
XFP2
(5)
(2)
(3)
LEGENDA:
(1) Bicolor LED:

(2) to (3) Slots for XFP modules
(4) LED for XFP module (2)
(1)
ote: For XFP modules refer to Figure 3-38, “Optical XFP Module” (p. 3-62).
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-28 4x10GE LAN - Front View
ACRONYM SLOTS
P4XGE 2 to 9 and 12 to 19
XFP1 (6)
XFP2
(7)
XFP3 (8)
XFP4
(9)
(2)
(3)
(4)
LEGENDA:
(1) Bicolor LED:

Red – local unit alarm (5)
(2) to (5) Slots for XFP modules
(1)
ote: For XFP modules refer to Figure 3-38, “Optical XFP Module” (p. 3-62).
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-29 ES64SC - Front View
ACRONYM SLOTS
ES64SC 2 to 9 and 12 to 19
LEGENDA:
(3)
(1) Reset command key
(2) Debug Interface
(2)
(3) LAN Interface
(4) Multicolor LED:
(1)
Red l ocal unit alarm
Green i n service unit (4)
Yellow i n stand by unit
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-30 First Level Controller and Service Interfaces board - front view
ACRONYM SLOT
(12)
FLCSERV 1
(11)
FLCSERVA
(18)
First Level Controler SPARE (19)
(9)
(20)
(21)
LEGENDA: (13)

(2) Personal Computer Connector (F interface)
IN
(3) Synchronization Interface
(4) Red LED – Urgent alarm (Critical or Major) * 2 1 (22)
(5) Red LED – Not Urgent alarm (Minor) *
OUT
(6) Yellow LED – Alarm storing (Attended) * (1)
(7) Yellow LED – Abnormal condition * (10)
(8) Yellow LED – Indicative alarm (Warning) *
(9) Line Seizure Key
(10) Alarm storing push–botton (Attended) (3)
(11) Green LED – When on it means active unit
(12) Multicolor LED
Yellow – in stand–by unit
(13) Auxiliary Channels (not supported) (16)
(14) EC and OAM Debug (internal use only)

(2)
(15) LAN Interface for ext. LAN switch
(multi rack configuration)
(16) LAN Interface for internal LAN cabling to OED/LO shelf (14)
(single rack configuration) (17)
(4)
(17) Future CT Interface (not used) (5)
(6)
(18) Yellow LED (7)
(19) Green LED EOW Line Status (not supported)
(8)
(20) Telephone Jack
(21) 4 Wire Telephone Extension
(22) 2 Mbit/s Auxiliary Channels
* The LEDs are never lit
adhesive silk–screen printingfront–plate
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-31 First Level Controller and Control&General Interfaces board - front
view
ACRONYM SLOT
FLCCONGI 20 (12)
(11)
First Level Controller MAIN
(9)
(13)
LEGENDA:

(2) Personal Computer Connector (F interface) (1)
(3) Synchronization Interface (10)
(4) Red LED – Urgent alarm (Critical or Major) *
(5) Red LED – Not Urgent alarm (Minor) *
(6) Yellow LED – Alarm storing (Attended) * (3)
(7) Yellow LED – Abnormal condition *
(8) Yellow LED – Indicative alarm (Warning) *
(9) Rack Lamps
(10) Alarm storing push–botton (Attended) (15)
(11) Green LED – When on it means active unit
(16)
(12) Multicolor LED
Yellow – in stand–by unit
(14)
(13) Housekeeping and Remote Alarms (17)
(14) EC and OAM Debug (internal use only) (4)
(5)
(15) LAN Interface for ext. LAN switch
(multi rack configuration) (6)
(7)
(16) LAN Interface for internal LAN cabling to OED/LO shelf (8)
(single rack configuration)
(17) Future CT Interface (not used)
* The LEDs are never lit
adhesive silk–screen printing front–plate
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-32 Matrix board - front view
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-33 Lower Order Matrix board - front view
ACRONYM SLOTS
LAX40 2 to 9 and 12 to 19
LAX20 2 to 9 and 12 to 19
slot 2 and 3; 4 and 5 ...18 and 19
(1)
LEGENDA: (2)

(3)
(2) Debug Interface
(3) LAN Interface n ot used
(4) Multicolor LED:
Green i n service unit (4)
Yellow i n stand by unit (spare EPS schema)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-34 Power Supply and Filter board - front view
ACRONYM SLOTS
PSF 24, 25
LEGENDA: (3)
(1) Bicolor LED:

Green i n service unit
(2) Equipment and boards Lamp Test key (2) (1)
(3) Input Power Supply
Figure 3-35 FAN unit - front view
ACRONYM SUBRACKs
FAN n, n+2
(2) (3)
(1)
LEGENDA:
(1) Bicolor LED:
(2) WARNING label: moving mechanical parts
(3) WARNING label: windage (air suction)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-36 Optical SFP Module
MODULE EQUIPPED
ACRONYM on CARDS
SI161 LAC40
SI161
SS161
SL161 P4S16
SL162 P8S16 TRX STM–16 SFP module
CWP P16S16 TRX STM–1/4 SFP module
CWA Gigabit Ethernet optical module
DWA
SS41
SL41
SL42 Output
P16S1S4
SS11
SL11
SL12
SGELX P4GE
SGESX P8GE
SGEZX P16GE
Input
Optical cables
Figure 3-37 Electrical SFP Module
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-38 Optical XFP Module
Figure 3-39 Optical colored DWDM APD XFP Module (only supported in R4.3.2 and
higher Rel.)
...................................................................................................................................................................................................................................
Topologies and configurations Units Front View
...................................................................................................................................................................................................................................
Figure 3-40 Optical XFP-E Module
...................................................................................................................................................................................................................................
Topologies and configurations Physical configuration of the LO extension shelf
Overview
...................................................................................................................................................................................................................................
Physical configuration of the LO extension shelf
Overview
Purpose
partition of the lower order extension shelf equipment.
The Equipment shelf front view is illustrated in Figure 3-41, “Lower Order Extension
Shelf Layout” (p. 3-65) and Figure 3-42, “Lower Order Extension Shelf Equipment front
view (slot position)” (p. 3-68).
The Main part codes and partition are listed in Table 3-12, “Main parts list” (p. 3-77).
The Accessory codes and partition are listed in Table 3-13, “Accessories list” (p. 3-78).
The Explanatory notes of part list are reported in Table 3-14, “Parts list: explanatory
notes” (p. 3-79).
For the units front view refer to “Units Front View” (p. 3-81).
Alcatel-Lucent.
Table 3-12, “Main parts list” (p. 3-77) contains the units of current equipment release.
Handbook).
Contents

Connection to the Main Shelf 3-74
Part List 3-77
...................................................................................................................................................................................................................................
Lower Order Extension Shelf
...................................................................................................................................................................................................................................

The lower order extension shelf is from mechanical point of view the same as the
1678 MCC main shelf (refer to “1678 MCC Main Shelf (SR78)” (p. 3-12)).
The lower order extension shelf is a single row shelf (refer to Figure 3-41, “Lower Order
Extension Shelf Layout” (p. 3-65)). It has got 16 slots for the Lower order Adaptation
20G boards.
Figure 3-41 Lower Order Extension Shelf Layout
FAN Unit Subrack n

PSF
PSF
LO CS MATRIX* (Copy A)
LO CS MATRIX* (Copy B)
Dummy Plate
Subrack n+1
ALM
LO ES Slots LO ES Slots
FAN Unit Subrack n+2

Matrix*: LX160
Three types of slots are distinguished:

• LO ES Slot (16 slots, each 4.5TE wide), containing the Lower Order Adaptation 20G
boards (LA20).
• Centerstage Matrix slot (2 slots, each 8TE wide), containing the LO Centerstage
Matrix 160GBIT/S boards (LX160; 1+1):
• Control and Common parts slot (2 slots, each 4TE wide), containing the following
boards:
Alarm Board (ALM)

Power Supply Filter (1+1) (PSF)
Bus Termination (two boards) (BUSTERM)
ote: ALM, PSF and BUSTERM are located in the same slot. This slot is divided
into three subslots (refer to Figure 3-9, “1678 MCC Equipment front view (slot
position)” (p. 3-17)). The BUSTERM board is not visible on the shelf front panel. It is
positioned behind the dummy plate (slot 1) and the ALM board (slot 20).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The ALM board provides housekeeping, remote alarm and rack lamp interfaces. The
ALM board functionality is a subset of the FLCCO GI board.
• The FA Subsystem consists of two subracks and contains the following boards:
FA s unit (FA )
The Matrix board (LX160) supports the following functionalities:

• Cross-connection
• Synchronization
• 1+1 EPS protection scheme, when two Matrix boards are present (default)
The Power Supply Filter board (PSF) supports the following functionality:
• distribution of Power Supply after filtering process
The Bus Termination board (BUSTERM) supports the following functionality:
• electrical termination to the buses routed on the backplane
These two boards are not visible on shelf front-panel. They are two small boards included
in the shelf and are placed behind the dummy plate (slot 1) and the ALM board (slot 20).
The FA unit (FA ) supports the following functionality:
• cooling of the equipment
Due to the high level of integration reached with this equipment, the two FA units
located at the top and at the bottom of the shelf have always to be equipped.
The two FA units are physically integrated in the lower order extension shelf, without
the need of external connection cables.
ote: The slots which are not equipped have to be closed by a dummy plate for EMC
reasons.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

The lower order extension shelf equipment has a symmetrical layout (refer to Figure 3-42,
“Lower Order Extension Shelf Equipment front view (slot position)” (p. 3-68)).
The following types of slots are distinguished:
slot 1 empty (closed with dummy plate)

slots 2 to 9 and 12 to 19 Lower Order Adaptation 20G boards
slot 2 and 19 are reserved for LA20 protection boards
slot 10 and 11 LO Centerstage Matrix 160GBIT/S boards
(LX160)
slot 20 Alarm board
(ALM)
slot 21 and 22 Bus Termination boards
(BUSTERM)
slot 24 and 25 Power Supply and Filter boards
(PSF)
ote: Slot 21 and slot 22 are positioned behind slot 1 and slot 20 respectively, so the
BUSTERM boards are not visible on the shelf front panel.
The two FA s have no slot number, because they are modelled as separate subracks
(subrack n and n+2).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-42 Lower Order Extension Shelf Equipment front view (slot position)
FAN (Subrack n)
24 25
1 20
2 3 4 5 6 7 8 9 12 13 14 15 16 17 18 19
10 11
21 22
FAN (Subrack n+2)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Configuration Rules
Allowed or basic Equipment Configuration
Table 3-9, “1678 MCC LO Shelf Equipment: slot configuration” (p. 3-69)presents for
each slot, the allowed equipment types and the basic equipment type (the acronyms of the
units are shown).
ote: Up to now a switching matrix capacity of max. 160G is supported.
That means, max. eight LA20 working boards can be equipped.
Table 3-9 1678 MCC LO Shelf Equipment: slot configuration

1678 MCC shelf
Slots Basic Configuration Allowed Equipment Note
1 Empty (dummy plate) -- 1
3 to 5 Spare (dummy plate) -- 9
6 to 9
and LA20 -- 2
12 to 15
2, 19 Protection LA20 -- 3
16 to 18 Spare (dummy plate) -- 9
10 LX160 (main) --
4
11 LX160 (spare) --
20 ALM -- 5
21, 22 BUSTERM -- 6
24, 25 PSF -- 7
subrack n, n+2 FA -- 8
For the explanatory notes refer to Table 3-11, “1678 MCC LO Shelf Equipment: slot
configuration explanation notes” (p. 3-69)
Table 3-10 Pluggable Optical Modules

LA20 boards Note
J1 to J8 STM- optical modules: SI161 or SEI161 10
Table 3-11 1678 MCC LO Shelf Equipment: slot configuration explanation notes
Note Explanation
1 It is 4TE.
All these boards are 4.5TE.
2 Up to eight LA20 boards can be equipped. Working LA20 boards are always inserted in the inner slots of their half
(starting from slot 9 and 12).
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Table 3-11 1678 MCC LO Shelf Equipment: slot configuration explanation

notes (continued)
Note Explanation
3 These slots are mandatory for protection LA20 boards.
4 It is 8TE. Both boards provide to 1+1 EPS protection scheme (mandatory).
It is 4TE.
5
This slot is dedicated to ALM board. The ALM board is always unprotected.
BUSTERM#1 is located behind the dummy plate of slot1 and BUSTERM#2 behind the ALM board.
6
They are not visible on the front view.
7 They are both mandatory.
8 They are both mandatory, one under and one above the shelf.
9 It is 4.5TE. These slots are reserved for future applications (LO matrix > 160G)
10 Up to eight optical or electrical SFP modules (I-16.1) can be plugged in the LA20 board.
Lower Order Extension Shelf: Supported Lower Order Adaptation Board
Figure 3-43 Lower Order Extension Shelf: Supported Adaptation Board
Interfaces Board Connectors
1 slot
Lower Order Adaptation 20G 1

SFP
I 16.1 2
SFP
. .
LA20 LC
. .
8
SFP
Examples of Equipment Configuration

The figures on next pages show some examples of allowed equipment configuration.
Figure 3-44, “Basic configuration of LO Extension Shelf” (p. 3-72) shows the typical
basic configuration of LO extension shelf (without LO adaptation 20G boards):
slot 1 empty
slot 2 to 9 reserved to LO adaptation 20G boards
slot 10 and slot 11 two LX160 boards
slot 12 to 19 reserved to LO adaptation 20G boards
slot 20 ALM board
slot 21 and slot 22 two BUSTERM boards (small board)
slot 24 and slot 25 two PSF boards
two FA units (subrack n, n+2)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-45, “Configuration of the 160G LO extension Shelf” (p. 3-73) shows the
configuration of the 160G LO extension shelf:
basic configuration
slot 6 to 9 four LA20 boards
slot 2 LA20 protection board
slot 12 to 15 four LA20 boards
slot 19 LA20 protection board
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-44 Basic configuration of LO Extension Shelf
FAN (subrack n)
24 25
2 3 4 5 6 7 8 9 12 13 14 15 16 17 18 19
PSF
PSF
10 11
160G LO Matrix Copy B

160G LO Matrix Copy A
1 20
ALM
21 22
BUSTERM
BUSTERM
FAN (subrack n+2)
...................................................................................................................................................................................................................................
Configuration Rules
...................................................................................................................................................................................................................................
Figure 3-45 Configuration of the 160G LO extension Shelf
FAN (subrack n)
24 25
PSF 2 3 4 5 6 7 8 9 12 13 14 15 16 17 18 19
PSF
10 11
160G LO Matrix Copy B

1 160G LO Matrix Copy A 20
LA20 protection
LA20 protection
LA20
LA20
LA20
LA20
LA20
LA20
LA20
LA20
dummy plate
dummy plate
dummy plate
dummy plate
dummy plate
dummy plate
dummy plate
A LM
21 22
BUSTERM
BUSTERM
FAN (subrack n+2)
...................................................................................................................................................................................................................................
Connection to the Main Shelf
...................................................................................................................................................................................................................................

To connect the LO extension shelf with the 1678 MCC main shelf STM-16 interfaces are
used in the main shelf. The board which supports this functionality is the Link Board
LAC40. This is a special 16xSTM-16 board used only for connection to LO extension
shelf.
The configuration of the Main shelf is flexible (refer to Figure 3-46, “Connection of 160G
LO Extension Shelf with the Main Shelf” (p. 3-74)):
The position of the boards in the main shelf is flexible and allows an upgrade which is
independent from the starting configuration.
A LAC40 board can be linked to a symmetric pair of LA20 boards only. The lower ports
of the LAC40 (9..16) are linked with the ports of the left half and the upper ports (1..8)
are linked with the ports of the right half.
For the connection to a 160G LO extension shelf the 1678 MCC main shelf contains:
• Four LAC40 working boards
• One LAC40 protection board
For optical cabling the LAC40 boards have to be equipped with I16.1 SFP modules.
Alternatively, electrical SFPs with cable assembled can be used.
The LO extension have to be connected to the main shelf as shown in Figure 3-46,
“Connection of 160G LO Extension Shelf with the Main Shelf” (p. 3-74)
Figure 3-46 Connection of 160G LO Extension Shelf with the Main Shelf
Higher Order Shelf Lower Order Shelf

FAN FAN
S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S
P P l P P l
l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l
S o o o o o o o o o o o o o o o o o o S o S o o o o o o o o o o o o o o o o o o S o
F t t t t t t t t t t t t t t t t t t F t F t t t t t t t t t t t t t t t t t t F t
# # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # #
2 3 4 5 6 7 8 9 10 11 12 1314 15 16 1718 19 24 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 25
F L M M L L
L L L L D S S S S S S
L I I I I I A I I X X I I I A L L L L L X X L L L L
A A A I F U P P P P P P L A
C 6 6 / / / C A A A A A 1 1 A A A A
C / / / / / / / C C C / L M A A A A A A A L
S O O O O O 4 OO 4 4 OOO 4 2 2 2 2 2 6 2 2 2 2
4 4 4 O C M R R R 6 R R R 2 M
0 0 0 0 0 0 0 0 0 0
E 0 0 0 0 0 0 C Y E E E 0 0 E E E 0
R O
V P N P P
C C C C
I R G S R R S
C O
O O I BO O O O B l
l
E T P P o T T P P T T o
Y Y t E Y Y E t
A B # R A B
R #
21 M M 22
FAN FAN
8 8 8 8
16
16
16
16
16
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The configuration of the LO extension shelf is fixed (refer to Figure 3-46, “Connection of
160G LO Extension Shelf with the Main Shelf” (p. 3-74)):
• A LA20 has to host either 8 protection or 8 working ports per board (no mixture is
allowed).
For this reason 8 working boards and 2 protecting boards are used.
• Working LA20 boards are configured in the inner slots of their half (starting from slot
9 and 12).
• The protection boards are configured always in the outer slots of their half (slot 2 and
19).
The connection main shelf/LO extension shelf is done via the following 'connection
items':
• Optical cables:
– On the Main Shelf side, the cables are plugged at the front of LAC40 boards.
– On the LO extension shelf side, the cables are plugged at the front of the LA20
boards.
or alternatively:
• Electrical SFPs with cable assembled:
– On the Main Shelf side, the SFP module at one side of the electrical cable is
plugged at the front of a LAC40 board.
– On the LO extension shelf side, the SFP module at the other side of the electrical
cable is plugged at the front of an LA20 board.
A mixture of optical and electrical cables is possible. The connection is always 1: MSP
protected.
ote: The same modules (I16.1) have to be used in LA20 and in LAC40 boards.
The location scheme of the VC-4s on LA20 boards and the connection scheme
LA20/LAC 40 is shown in the following Figure 3-47, “VC-4 mapping on LA20 Boards”
(p. 3-76) Refer also to Figure 3-46, “Connection of 160G LO Extension Shelf with the
Main Shelf” (p. 3-74)for understanding this scenario. The LAC40 boards are configured
as shown in Figure 3-46, “Connection of 160G LO Extension Shelf with the Main Shelf”
(p. 3-74)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-47 VC-4 mapping on LA20 Boards
Higher Order Shelf Lower Order Extension Shelf

LAC40 Board LA20 Board
Port Slot Slot Port ModVc4
Protecting 18 7
9 16 7 2 18 Protecting
18 15 6 18 751 875
9 16 15 7 18 501 625
18 16 8 18 251 375
9 16 16 9 18 1 125
Matrix
18 17 12 18 126 250
9 16 17 13 18 376 500
18 18 14 18 626 750
9 16 18 15 18 876 1000
19 18 Protecting
The position of the LAC40 boards is flexible. The position of the LA20 boards is fixed.
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................
Part List
• Table 3-12, “Main parts list” (p. 3-77) shows the Main part list
• Table 3-13, “Accessories list” (p. 3-78) shows the Accessory list
• Table 3-14, “Parts list: explanatory notes” (p. 3-79) shows the Explanatory notes of
previous lists
• A V Part/ umber
• Max Q.ty: maximum quantity of items in the 1678 MCC equipment
• Slot: position of the units inside the 1678 MCC equipment (refer to Figure 3-42,
“Lower Order Extension Shelf Equipment front view (slot position)” (p. 3-68))
Table 3-12 Main parts list
Max.
Q.ty
3AL 81673 AA--
MCC RACK WITH GTRU -- 1
3AL 81673 AB--
3AL 81224 AA-- 1 --
1678 MCC SHELF SR78 2
3AL 81224 AB--
HOUSEKEEPI G MO ITORI G U IT HMU 3AG 24234 AA-- 4
POWER SUPPLY
POWER SUPPLY A D FILTERS PSF 3AL 81502 AA-- 2 24, 25 5
COMMO PARTS
ALARM ALM 3AG 24262 AA-- 1 20 6
SWITCHI G MATRIX
LO CE TERSTAGE MATRIX 160
LX160 3AG24328 AA-- 2 10, 11 7
GBIT/S
2 to 9
LOWER ORDER ADAPTATIO 20G LA20 3AG 24150 AA-- 10 and 8
12 to 19
SPARE PARTS
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
3AL 81209 AA--
TERMI ATIO BUS BUSTERM 2 -- 9
3AL 81209 AB--
STM- OPTICAL MODULES
OPTO TRX SFP I-16.1 PLUG-I SI-161 1AB 19637 0013 80 -- 10
ELECTRICAL SFP WITH CABLE ASSEMBLED
Electrical SFP STM–16 PLUG–I SEI161 3AG 24638 AA-- 80 -- 26

Max.
Q.ty
SOFTWARE 11
3AL 81205 AA--
1678 MCC FA U IT FA 3AL 81205 AB-- 2 -- 12
3AL 81205 AC--
1678 MCC DUST FILTER U IT -- 3AG 24350 AA-- 1 -- 14
1678 MCC DUST FILTER -- 3AG 24354 AA-- 1 -- 15
1678 MCC DUST FILTER CARRIER -- 3AG 24608 AA-- 1 -- 25
1678 MCC OEM–WIRE MESH DUST
-- 3AG 24609 AA-- 1 -- 25
FILTER
1678 MCC I STALLATIO KIT -- 3AL 89584 AA-- 1 -- 16
1678 MCC I STALLATIO KIT -- 3AG 24367 AA-- 1 -- 17
DUMMY PLATE W=22.5 mm -- 3A 52174 AA-- 6 -- 18
PI PROTECTIO BOARD PI PROT 3AG 24663 AA-- 6 -- 27
2 MB/S AUX CHA EL 75 Ω KIT -- 3AL 38432 AA-- 1 -- --
2 MB/S AUX CHA EL 120 Ω KIT -- 3AL 38433 AA-- 1 -- --
SDH SY C ADAPTER 75 Ω U BAL
-- 3AL 89586 AA-- 1 -- --
KIT
SDH SY C ADAPTER 120 Ω BAL KIT -- 3AL 89587 AA-- 1 -- --
GTRU GTRU 3AL 81656 AA-- 1 -- 19
GTRU DUMMY COVER -- 3A 51536 AA-- 4 -- 20
DC/DC CO VERTER STEP-UP 2000 W STPUP 3AL 89590 AA-- 6 -- 21
GTRU BYPASS GBYP 3AL 38414 AA-- 6 -- 22
FA U IT PROTECTIO -- 3AL94613 AA-- 1 -- 12
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Max.
Q.ty
I STALLATIO KIT GTRU -- 3AL 38423 AA-- 1 -- --
ESD KIT -- 3AL 37973 AA-- 1 -- 23
EARTHQUAKE KIT -- 3AL 91637 AA-- 1 -- 24
ACCESSORY KIT 1678 MCC -- 3AL 24268 AA-- 1 -- --
KIT DCU TRAY 1678 MCC RACK -- 3AL 91853 AA-- -- --

Note Explanation
This item contains the GTRU equipment (without converters and dummy covers) and the complete set of parts of the
1
rack to host 1678 MCC equipment.
2 It is the equipment shelf.
3 Shelf supports FA s with dust filter.

4 Only necessary in case of supported feature: Station Alarms
These items are mandatory and they are provisioned in 1+1 configuration: the boards perform the filtering and the
5
distribution of the power supply for the 1678 MCC equipment.
6 The ALM board provides housekeeping, remote alarm and rack lamp interfaces.
Two LX boards are used in an 1+1 protected EPS configuration: the boards perform connection and cross-connection
7
functionalities.
8 Up to eight SFP modules can be equipped (I-16.1) per board.
9 This is a spare part item; the 1678 MCC shelf (SR78) already included it.
10 Up to 8 of these modules are hosted in LA20 board.
11 Details concerning the software P/ are given in the 1678 MCC User Provisioning Guide.
12 These items are mandatory. Maintenance intervals are described in the 1678 MCC User Provisioning Guide.
13 Version for A SI market.
14 Dust filter support used in former product releases.
15 The Kit includes three dust filter used in former product releases.
It contains the cables and all the accessories (connectors, caps, screws, etc.) concerning Power Supply and Auxiliary
16
systems (except Sync. and 2 Mbit/s Aux. systems).
17 Installation Kit 1678 MCC for A SI market.
It is essential to insert the relevant dummy plates on the space left by all LA20 boards OT supplied, in order to obtain the
18 EMI/EMC performances. The number of six dummy plates is necessary in case of 160G LO matrix (refer to Figure 3-45,
“Configuration of the 160G LO extension Shelf” (p. 3-73) ).
19 This is a spare part item; the 1678 MCC rack already included it.
It is essential to insert the relevant dummy covers on the space left by all DC/DC Step-up Converters (or GTRU Bypass)
20
OT supplied in the GTRU equipment, in order to obtain the EMI/EMC performances.
21 These items are hosted in the GTRU equipment in 1+1 configuration to supply the 1678 MCC equipment.
When this item is used in alternative to the DC/DC Step-up Converter, only 8 Traffic Ports are provisional in the
22
1678 MCC equipment (four into slots 2 to 9 and four into slots 12 to 19).
...................................................................................................................................................................................................................................
Part List
...................................................................................................................................................................................................................................

Note Explanation
23 Part of MCC rack.

24 If earthquake proof is required.
Dust filter is only needed, if the ambient condition is twice worse than required by the following international standard:
25
E 300–019–1–3 class 3.2: dust (suspension) 400 g/m3, dust (sedimentation) 15mg/(m2 per hour)
Electrical SFP with cable assembled; only used for link connection to the LO extension shelf. These SFP modules can be
26
used as alternative to SI-161 modules.
eeded for dirty environment (≥ class 3.2) to protect the backplane connector in an empty slot from dust. After insertion
27 of the Pin Protection Board an RUTM alarm (Replaceable Unit Type Mismatch) is raised. Refer to the section Alarms
Configuration of the CT Operator’s Handbook to set the ASAP to o Alarms.
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Units Front View

Figure 3-48, “Lower Order Adaptation 20G board - front view” (p. 3-81) through Figure
3-52, “FA unit - front view” (p. 3-84) illustrate units front view available in the lower
order extension shelf.
Figure 3-48 Lower Order Adaptation 20G board - front view
ACRONYM SLOTS
LA20 2, 6 to 9, 12 to 15, 19
(2)
(3)
(8)
LEGENDA:
(9)
(1) Bicolor LED:
(2)to (9) STM–16 optical channel
(1)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-49 Alarm board - front view
ACRONYM SLOT
ALM 20 (1)
(2)
(3)
(9)
LEGENDA:
(1) Multicolor LED

Yellow i n stand by unit
(2) Rack Lamps (10)
(3) Housekeeping and Remote Alarms (4)
(4) Red LED U rgent alarm (Critical or Major) (5)
(6)
(5) Red LED N ot Urgent alarm (Minor)
(7)
(6) Yellow LED Alarm storing (Attended) (8)
(7) Yellow LED Abnormal condition
(8) Yellow LED Indicative alarm (Warning)
(9) Alarm storing push botton (Attended)
(10) Future CT Interface (not used)
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-50 LO Centerstage Matrix Board - front view
...................................................................................................................................................................................................................................
Units Front View
...................................................................................................................................................................................................................................
Figure 3-51 Power Supply and Filter board - front view
ACRONYM SLOTS
PSF 24, 25
LEGENDA: (3)
(1) Bicolor LED:

(2) Equipment and boards Lamp Test key (2) (1)
(3) Input Power Supply
Figure 3-52 FAN unit - front view
ACRONYM SUBRACKs
FAN n, n+2
(2) (3)
(1)
LEGENDA:
(1) Bicolor LED:
...................................................................................................................................................................................................................................
Topologies and configurations Units Front View
...................................................................................................................................................................................................................................
Figure 3-53 Electrical SFP Module with cable assembled
...................................................................................................................................................................................................................................
Topologies and configurations Physical configuration of the OED shelves
Overview
...................................................................................................................................................................................................................................
Physical configuration of the OED shelves
Overview
Purpose
partition of the OED shelves equipment. OED shelves are the 1670SM shelf and the
1662SMC shelf.
The Equipment shelf front view is illustrated in Figure 3-54, “1670SM Shelf Front View”
(p. 3-88) for 1670SM and in Figure 3-77, “1662SMC Shelf Front View” (p. 3-123) for
1662SMC.
The Main part codes and partition are listed in Table 3-21, “Main part list” (p. 3-102) for
1670SM and in Table 3-27, “Main part list” (p. 3-130) for 1662SMC.
The Accessory codes and partition are listed in Table 3-22, “Accessories list” (p. 3-104)
for 1670SM and in Table 3-28, “Accessories list” (p. 3-131) for 1662SMC.
The Explanatory notes of the part lists are reported in Table 3-23, “Parts list: explanatory
notes” (p. 3-104) for 1670SM and Table 3-29, “Parts list: explanatory notes” (p. 3-131)
for 1662SMC.
For the units front view refer to “1670SM Shelf - Units Front View” (p. 3-106) and to
“1662SMC Shelf - Units Front View” (p. 3-133).
Alcatel-Lucent.
Table 3-21, “Main part list” (p. 3-102) contains the units of current equipment release.
Handbook).
Contents
1670SM Shelf - Layout 3-88

1670SM Shelf - Basic Equipment 3-90
1670SM Shelf - Basic Function of the Boards 3-91
1670SM Shelf - I/O Interfaces 3-92
...................................................................................................................................................................................................................................
Overview
...................................................................................................................................................................................................................................
1670SM Shelf - System Configurations 3-93

1670SM Shelf - Connection to the Main Shelf 3-99
1670SM Shelf - Part List 3-102
1670SM Shelf - Units Front View 3-106
1662SMC Shelf - Shelf Layout 3-123
1662SMC Shelf - Basic Equipment 3-124
1662SMC Shelf - Basic Function of the Boards 3-125
1662SMC Shelf - System Configurations 3-126
1662SMC Shelf - Part List 3-130
1662SMC Shelf - Units Front View 3-133
...................................................................................................................................................................................................................................
1670SM Shelf - Layout
...................................................................................................................................................................................................................................

The 1670SM shelf is divided in three areas (refer to Figure 3-54, “1670SM Shelf Front
View” (p. 3-88)):
• The Access area in the upper portion of the shelf mainly devoted to the physical
interfaces
• The Traffic Ports area in the middle devoted to the traffic and control boards
• The Link area in the lower portion of the shelf devoted to the boards for the inter-shelf
communication
A separate FA subrack is mounted at the bottom of each 1670SM.
Figure 3-54 1670SM Shelf Front View
1 2 3 4 5 6 7 8 9 10 1112 13 1415 16171819 20 21
Access cards
CONGIHC copyB
CONGIHC copyA
empty Access Area

empty
empty
22 23 2425 26 27 28 2930 31 323334 35 36 3738 3940 41
Port Cards
HCMATRIX copyB
I/O slots assigned
I/O slots assigned
I/O slots assigned
I/O slots assigned

HCMATRIX copyA
to VSR LINK 1
to VSR LINK 2
to VSR LINK 3
to VSR LINK 4
Port Area
empty
empty
42 43 44 45 46 47 48 49 50
HCLINKE 1A
HCLINKE 1B
HCLINKE 2A
HCLINKE 2B
HCLINKE 3A
HCLINKE 3B
HCLINKE 4A
HCLINKE 4B
Link Area
BTERM
Separate Fan Shelf
The Access area (21 slots) can contain the following boards:
• 2 slots for general service connectors such as Power, QB3 Int., Housekeeping, remote
alarm, rack lamp (CO GIHC/A and CO GIHC/B);
• 16 slots for traffic access modules;
• 3 slots empty (not used).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The Traffic Ports area (20 slots) can host the following boards:
• 2 slots for the matrices (master and slave) (HCMATRIX)
• 16 slots for the traffic ports
• 2 slots empty (not used)
The Link area (9 slots) can host the following boards:
• 1 slot for the internal bus termination (BTERM)
• 8 slots for the link boards (HCLI KE) used for inter-shelf connection to the main
shelf.
ote: The number of link boards depends on the number of equipped slots.
The 1670SM shelf has a capacity of 256 STM-1 equivalents.
The maximum quantity of each interface per shelf is:
• 64 x 140 Mbit/s interfaces
• 256 x STM-1 electrical interfaces
• 256 x STM-1 optical interfaces
• 64 x STM-4 optical interfaces
...................................................................................................................................................................................................................................
1670SM Shelf - Basic Equipment
...................................................................................................................................................................................................................................
1670SM Shelf - Basic Equipment
Table 3-15 Basic Equipment of the 1670SM Shelf

Slot Board Mnemonic Comment
Access Area
1 Control and General Interface Board copy A CO GIHC Mandatory. "3-wire" variant
2 to 3 Empty
4 to 19 Access boards or empty
20 Empty
21 Control and General Interface Board copy B CO GIHC Mandatory. "3-wire" variant
Port Area
22 Matrix Hi-Cap copy A HCMATRIX Mandatory
23 Empty
24 to 39 I/O port boards
40 Empty
41 Matrix Hi-Cap copy B HCMATRIX Mandatory
Link Area
42 Optical Link Enhanced board 1 copy A HCLI KE HCLI KE boards are used only
43 Optical Link Enhanced board 1 copy B HCLI KE for connection to the Main Shelf.
Only the required HCLI KE
44 Optical Link Enhanced board 2 copy A HCLI KE
boards are equipped
45 Optical Link Enhanced board 2 copy B HCLI KE
If the connection Main Shelf /
47 Optical Link Enhanced board 3 copy A HCLI KE 1670SM is not protected,
48 Optical Link Enhanced board 3 copy B HCLI KE HCLI KE boards copy B are not
equipped
49 Optical Link Enhanced board 4 copy A HCLI KE
50 Optical Link Enhanced board 4 copy B HCLI KE
46 Bus Termination Board BTERM Mandatory
Cooling: A separate FA shelf must be mounted at the bottom of each 1670SM shelf
...................................................................................................................................................................................................................................
1670SM Shelf - Basic Function of the Boards
...................................................................................................................................................................................................................................
1670SM Shelf - Basic Function of the Boards

COGIHC (Control and General Interface)
• Provides power supply interfaces and power supply distribution
(only the '3-wire FPE' variant 3AL 79135 AB** is used)
• Provides the external LA interface
A Shelf Identifier is plugged on the CO GIHC B (Q2 interface)
Access Board
• Line Interface:
Access boards are used together with the STM-1 and 4xSTM-4 interfaces
Matrix Hi-Cap
• The synchronization function CRU is used for frame synchronization and for clock
distribution within the shelf.
• The Shelf Controller (SC) controls the ASICs of the shelf
• The SC provides the redundant interface to the control system
Port Board
• Transport, adaptation and termination functions
• Matrix Hi-Cap selection
Link board - HCLIKE
• The Link boards are the interfaces between 1670SM and 1678 MCC Main shelf. The
HCLI KE boards are implemented in a 1+1 protected configuration. Each shelf can
be equipped with max. 4+4 HCLI KE boards.
Bus Termination Board
• Electrical Termination of the buses routed on the backpanel.
• Power supply of the ISPB bus (management bus)
...................................................................................................................................................................................................................................
1670SM Shelf - I/O Interfaces
...................................................................................................................................................................................................................................
1670SM Shelf - I/O Interfaces

The 1670SM integration offers the following interfaces:
• 140 Mbit/s
• STM-1e
• STM-1o
• STM-4
Mixed I/O configuration on shelf level is supported. For more details about supported
STM- interfaces and configurations in R3 refer to chapter “1670SM Shelf - System
Configurations” (p. 3-93).
...................................................................................................................................................................................................................................
1670SM Shelf - System Configurations
...................................................................................................................................................................................................................................

Supported I/O Boards, Relation Access/Port Boards
Figure 3-55 1670SM: Relation Port/Access Boards

I/O Interfaces Access Boards Port Boards Connectors
1 slot
1
4xSTM 4 proprietary
2
proprietary
S 4.1
L 4.1 2xSTM 4 SC/PC, FC/PC
3 4xSTM 4
L 4.2 proprietary
any mix of I/O modules allowed 4 proprietary P4S4
A2S4
1 slot
1 slot
1 SFP
. . .
. . .
. . .
16xSTM 1o
4 SFP
S 1.1 1 slot
LC
L 1.1 5
SFP 16xSTM 1o
L 1.2 .
. .
. . 12xSTM 1o
.
any mix of SFP I/O modules allowed
16 SFP P160S1
SFP I/O modules are pluggable A12OS1
1 slot 1 slot
16xSTM 1e 16xSTM 1e
16xSTM 1e 1.0/2.3 75 Ohm
A16S1 P16S1
1 slot 1 slot
4xSTM 1e 4xSTM 1e
4xSTM 1e * 1.0/2.3 75 Ohm
A4ES1 P4ES1
1 slot
1
4x140/155Mbit/s ICMI
ICMI I/O modules are pluggable 2
ICMI
2x140/155Mbit/s
1 slot 1.0/2.3 75 Ohm
4x140/155Mbit/s
3 ICMI
4 P4E4
ICMI
A2S1
* only on customer request
Configuration Rules for the I/O Boards

General I/O Configuration Rules
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 3-16 1670SM: General Configuration Rules for the I/O Boards
I/O Boards • The supported I/O boards are shown in Figure 3-55, “1670SM: Relation Port/Access
Boards” (p. 3-93)
Take into account that some boards require an access board
• Each I/O slot has a capacity of 16 STM-1 eq.
• The slot position of the access boards have to be in line with the slot position of the
corresponding port boards
The connection port/access boards is done on the backpanel. (Ref.Table 3-17,
“1670SM: Slot relation Port/Access Boards” (p. 3-95))
• It is possible to equip a board only with the required I/O modules. I/O modules slots
which are not equipped must not be closed by a dummy plate.
Mixing of I/O • The boards can be plugged in almost any mix in any slot (flexible configuration)
boards within a from left to right . The boards which are allowed to be mixed within a shelf are
Shelf shown in Table 3-20, “1670SM: Allowed mix of I/O Boards” (p. 3-98)
• A shelf may be equipped with combinations of all unprotected electrical boards and
all protected/unprotected optical boards.
• A flexible shelf configuration with EPS for 16xSTM-1e is also supported (Ref.
chapter “Flexible Configuration with EPS for 16xSTM-1e” (p. 3-97))
I/O Protection • The optical I/O signal can be 1+1 MSP protected or unprotected
• A protection connection must be established in the same shelf (no protection is
possible across different shelves)
HCLIKE Boards • The HCLI KE boards are used only for the connection to the Main Shelf
• Each HCLI KE board has a capacity of 64 STM-1equiv.
• HCLI KE boards copy A and copy B must be neighbor boards
• If the connections Main Shelf OEDs are not protected, the HCLI KE boards copy B
are not equipped.
• There is a fixed relationship between I/O boards and HCLI KE boards:
I/O boards HCLI KE board
slot 24,25,26,27 slot 42 and 43
slot 28,29,30,31 slot 44 and 45
slot 32,33,34,35 slot 47 and 48
slot 36,37,38,39 slot 49 and 50
• Only the HCLI KE boards which are necessary are equipped.

Dummy Plates • The I/O slots and HCLI KE slots which are not equipped must be closed by a
dummy plate for EMC reasons.
Slot Relation Port/Access Boards
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 3-17 1670SM: Slot relation Port/Access Boards

I/O Board Width Slot relation Port/Access boards
4x140Mbit 1 slot Port boards 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
Unprotected
STM- Access boards 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
4/16xSTM-1e 1 slot Port boards 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

unprotected Access boards 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
4/16xSTM-1e 1 slot Port boards 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
Protected EPS +1 Access boards 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
( =1+15)
Protecting port board at the left side of the working boards
Protecting access board (HPROT/HPROT16): depends on position of
protecting port board
16xSTM-1o 1 slot Port boards 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
Protected/
Unprotected Access boards 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
4xSTM-4 1 slot Port boards 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

Protected/ Access boards 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
Unprotected
Slot Position of the Port Boards
Table 3-18 1670SM: Position of the Port Boards in the Shelf

I/O Board Protection Width Slot positions
4x140Mbit unprotected 1 slot any
4xSTM-1e unprotected 1 slot any
4xSTM-1e EPS +1 ( =1...15) 1 slot protecting board: at the left side of
working boards
working boards 25....39
unprotected 24...39 working boards
16xSTM-1e unprotected 1 slot any
16xSTM-1e EPS +1 ( =1...15) 1 slot protecting board: at the left side of
working boards
working boards 25....39
unprotected 24...39 working boards
16xSTM-1o unprotected or 1+1 MSP 1 slot any
protected
4xSTM-4 unprotected or 1+1 MSP 1 slot any
protected
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Interface Specific Configuration Rules

Table 3-19 1670SM: Interface specific Configuration Rules
4xSTM-4
Board equipment: • The port board and the access board are equipped with one or two I/O modules
• If only two ports are required, the access board can be omitted
• Within a board, a mix of different STM-4 I/O modules (S-4.1, L-4.1, L-4.2) is
allowed
• Within a board, a mix with other I/O modules is not allowed
Replacement of IF modules:
• The I/O modules are hot pluggable

Protection: • The I/O signal can be 1+1 MSP protected or unprotected
16xSTM-1o
Board equipment: • It is possible to equip 1 to 16 SFP modules
• If no more than 4 ports are required, the access board can be omitted
• The SFP modules are hot pluggable
• It is possible to equip only the required ports. The ports which are not equipped
need not to be covered by a dummy plate.
Protection: • The I/O signal can be 1+1 MSP protected or unprotected
Limitation • Timing reference can be derived only from interfaces of group 1: SFP 1 to 6 on
A12OS1 and 3,4 on P16OS1
4/16xSTM-1e
Shelf equipment Unprotected: Access boards: slots 4 to 19 Port boards: slot: 24 to 39
Protected: Working Access boards: slots 5 to 19 Port boards: slots 25 to 39
Protected: Protecting HPROT/HPROT16: depends Port board: left side of
on position of protecting port working boards
board
Protection Protection is performed at board level
4x140Mbit/s
Board equipment • The port board and the access board can be equipped with one or two ICMI I/O
modules
• If only two ports are required, the access board can be omitted
• Within a board, a mix with other IF modules (e.g. STM-1e) is not allowed
• The ports slots which are not equipped need not to be covered by a dummy plate.
Protection Protection not supported
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Flexible Configuration with EPS for 16xSTM-1e

As a general rule a 1670SM shelf may be equipped with combinations of all unprotected
electrical I/O boards and all protected/unprotected optical I/O boards. This is called the
'flexible configuration'.
It is also possible to equip a 'flexible' shelf with EPS protected 16xSTM-1e pairs.
Configuration Rules
• The 16xSTM-1e boards with EPS are installed from the left to the right without any
gap (no empty slot allowed).
• The most left board is the protection board, the related access slot is equipped with the
HPROT16 board.
• Other I/O boards are installed starting from the most right slot to allow extension of
the EPS group.
• The following boards may be equipped in a flexible shelf:
– 16xSTM-1e with or without EPS
– 4x140Mbit/s without EPS
– all kinds of STM- optical boards protected or unprotected
• Commissioning and reconfiguration is possible via remote access.
Figure 3-56, “1670SM: Flexible Shelf equipped with 16xSTM-1e EPS protected and
other I/O Boards” (p. 3-97)shows an example of a mixed electrical/optical shelf
supporting EPS for the electrical ports.
Figure 3-56 1670SM: Flexible Shelf equipped with 16xSTM-1e EPS protected and
other I/O Boards
1 2 3 4 5 6 7 8 9 101112 1314 15161718 19 20 21

Access 16 x STM–1e
Access 2 x 140Mb/s
Access 2 x 140Mb/s
Access 2 x STM–4
Access 2 x STM–4
Access 2 x STM–4
Access 2 x STM–4
empty
empty
empty
not equipped
not equipped
not equipped
not equipped
not equipped
CONGIHC B
CONGIHCA
HPRROT16
PW W W W
22 23 2425 26 27 28 2930 31 323334 35 36 3738 3940 41

Port 4 x 140Mbit/s
Port 4 x 140Mbit/s
Port 16xSTM–1e
Port 16xSTM–1e
Port 16xSTM–1e
Port 16xSTM–1e
Port 16xSTM–1e
HCMATRIX B
empty
empty
HCMATRIX A
Port 4 x STM–4
Port 4 x STM–4
Port 4 x STM–4
Port 4 x STM–4
not equipped
not equipped
not equipped
not equipped
not equipped
PWW WW
42 43 44 45 46 47 48 49 50
HCLINKE 1A
HCLINKE 1B
HCLINKE 2A
HCLINKE 2B
HCLINKE 3A
HCLINKE 3B
HCLINKE 4A
HCLINKE 4B
BTERM
W Working
P Protecting
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Allowed Mix of I/O Boards

Table 3-20 1670SM: Allowed mix of I/O Boards
I/O Board Type 4x 4x 4x 16x 16x 16x 4x
140Mb STM-1e STM-1e STM-1e STM-1e STM-1o STM-4
unprot. unprot. EPS N+1 unprot. EPSN+1
1
4x140Mbit unprot. x x - x x x
1
4xSTM-1e unprot. x x - x x x
4xSTM-1e EPS +1 - - x - - - -
1
16xSTM-1e unprot. x x - x x x
1 1 1 1 1
16xSTM-1e EPS +1 - x
( =1..15)
1
16xSTM-1o x x - x x x
1
4xSTM-4 x x - x x x
Notes:
1. According to Figure 3-56, “1670SM: Flexible Shelf equipped with 16xSTM-1e EPS protected and other I/O
Boards” (p. 3-97).
...................................................................................................................................................................................................................................
1670SM Shelf - Connection to the Main Shelf
...................................................................................................................................................................................................................................

To connect the 1670SM with the 1678 MCC main shelf no HW modification in the
1670SM is needed. The STM-64 interface of the 1670SM is compatible with the STM-64
interface on the 1678 MCC, both standard SDH-interfaces, and are used as link interfaces.
In the 1678 MCC the 4xSTM-64 I-64.1 boards are used as link board to the 1670SM.
Each port can be physically connected to one HCLI KE board in the 1670SM shelf with
an optical fibre.
In 1678 MCC Release 3 the links between 1670SM and 1678 MCC main shelf are
statically assigned. The 4 leftmost I/O-slots in the 1670SM with a capacity of 4xSTM-16
are connected in the HO matrix of the 1670SM to the leftmost HCLI KE board copy A
(refer to Figure 3-57, “Assignment of I/O Boards to the Link Boards” (p. 3-99)). The next
4 I/O slots to the next link board copy A and so on. For link protections the HCLI KE
boards copy B are used and the HO matrix connections are broadcasted to both
corresponding link boards.
Figure 3-57 Assignment of I/O Boards to the Link Boards
1 2 3 4 5 6 7 8 9 10 1112 13 14 1516 1718 19 20 21
Access cards
CONGIHC copyB
CONGIHC copyA
Access Area
empty
empty
empty
22 2324 25 26 27 28 2930 31 32 3334 35 36 3738 3940 41
Port Cards
HCMATRIX copyB
I/O slots assigned
I/O slots assigned
I/O slots assigned

I/O slots assigned
HCMATRIX copyA
to VSR LINK 1
to VSR LINK 2
to VSR LINK 3
to VSR LINK 4
Port Area
empty
empty
42 43 44 45 46 47 48 49 50
HCLINKE 1A
HCLINKE 1B
HCLINKE 2A
HCLINKE 2B
HCLINKE 3A
HCLINKE 3B
HCLINKE 4A
HCLINKE 4B
Link Area
BTERM
In the link area of the 1670SM the link boards copy A and B are ordered alternately, i.e.
A-B-A-B.Also the fibre connection from the HCLI KE board in the OED to one port of
a 4xSTM-64 board in the main shelf is assigned statically. The HCLI KE boards copy A
in the 1670SM are connected to the ports of the leftmost 4xSTM64 I/O board in the main
shelf. If the links are protected the HCLI KE boards copy B in the OED are connected to
the second 4xSTM-64 I/O board in the main shelf.
All links are MSP protected but can optionally also be configured as unprotected.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The connection Main Shelf/1670SM is done via the following 'connection items':
• Optical cables
• On the Main Shelf side, the cables are plugged at the front of dedicated I/O boards
4xSTM-64 (I-64.1)
• On the 1670SM side, the cables are plugged at the front of HCLIKE boards.
• The connection may be unprotected or 1+1 MSP protected
Figure 3-58, “Example for a Connection Main Shelf /1670SM (4 links, 1+1 MSP full
protected)” (p. 3-101)shows an example for a Main Shelf/1670SM connection 1+1 MSP
protected.
Number of connected 1670SM Shelves
The number of 1670SM OEDs which can be connected to one 1678 MCC main shelf is
limited by the I/O ports used as link ports in the 1678 MCC main shelf.
The 1678 MCC main shelf offers 16 x 4 = 64 STM-64 ports which can be used as
STM-64 link ports to an 1670SM OED. Since each 1670SM OED shelf provides 8
protected STM–64 ports, up to 8 1670SM OED shelves can be connected to the
1678 MCC main shelf with links protected.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-58 Example for a Connection Main Shelf /1670SM (4 links, 1+1 MSP full
protected)
OED: 1670SM
1 2 3 4 5 6 7 8 9 10 1112 1314 15 16 17 18 19 20 21
CONGIHC B
CONGIHCA
Main Shelf
FAN
4 x STM64 I–64.1 copy B
22 23 2425 26 27 28 29 30 31 32 33 34 35 36 37 38 3940 41
4 x STM64 I–64.1 copy A
PSF
PSF
MX160/320/640 Copy B
MX160/320/640 Copy A
24 25
LAX20/40 Copy B (optional)

LAX20/40 Copy A (optional)
I/O slots assigned
I/O slots assigned
I/O slots assigned

I/O slots assigned
FLCCONGI
to VSR LINKs 1
to VSR LINKs 2
to VSR LINKs 3
to VSR LINKs 4
HCMATRIX copyB
FLCSERV
HCMATRIX copyA
empty
empty
1 1
2 2
3 3
42 43 44 45 46 47 48 49 50
4 4
HCLINKE 1A
HCLINKE 1B
HCLINKE 2A
HCLINKE 2B
HCLINKE 3A
HCLINKE 3B
HCLINKE 4A
HCLINKE 4B
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
BTERM
FAN
Capacity: 1xSTM–64 per Link
...................................................................................................................................................................................................................................
1670SM Shelf - Part List
...................................................................................................................................................................................................................................

• Table 3-21, “Main part list” (p. 3-102) shows the Main part list
the previous lists.
• A V Part/ umber
• Max Q.ty: maximum quantity of items in the 1670SM equipment
• Slot: position of the board inside the 1670SM equipment (refer to Figure 3-54,
“1670SM Shelf Front View” (p. 3-88))
Table 3-21 Main part list
ANV P/N Max.
NAME ACRONYM SLOT NOTE
Factory P/N Q.ty
1670SM MAI SHELF SR70M 3AL 79245 AA-- 1 -- 1
ASEL FA S SUBRACK -- 3A 52347 AA-- 4 -- 2
OPTI EX RACK WITH TRU -- 3A 44815 AA-- 1 -- 3
SHELF IDE TIFICATIO IDSHELF 3AL 79242 AA-- 1 -- 4
COMMO PARTS
CO TROL & GE ERAL I/F HC CO GIHC 3AL 79135 AA-- 2 1, 21 5
ASEL CO TROL & GE ERAL I/F HC
CO GIHC 3AL 79135 AB-- 2 1, 21 5
3WIRE
42 to 45,
1670SM OPTICAL LI K E H FC/PC HCLI KE 3AL 81509 AA-- 8 6
47 to 50
42 to 45,
1670SM OPTICAL LI K E H SC/PC HCLI KE 3AL 81509 AB-- 8 6
47 to 50
1670SM OPTICAL LI K LC 42 to 45,
HCLI KE 3AL 89524 AA-- 8 6, 27
CO ECTOR 47 to 50
SWITCHI G MATRIX
MATRIX HI-CAP HCMATRIX 3AL 78938 AA-- 2 22, 41 7
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 3-21 Main part list (continued)

ANV P/N Max.
Factory P/N Q.ty
SPARE PARTS
TERMI ATIO BUS BTERM 3AL 79076 AA-- 1 46 8
EXTRACTORS KIT -- 3AL 79497 AA-- 1 -- --
TRAFFIC PORTS: STM–1 (SDH)
16 x STM-1 OPTIC. / EL. PORT P16S1 3AL 79152 AA-- 16 24 to 39 9
16 x STM-1 OPTICAL COMPACT PORT P16OS1 3AL 80948 AA-- 16 24 to 39 10
11,
4 x 140/STM-1 SWITCH. O/E PORT/1 P4E4 3AL 79263 AA-- 16 24 to 39
12
4 x STM-1 ELECTRICAL PORT P4ES1 3AL 78823 AA-- 16 24 to 39 25
TRAFFIC PORTS: STM–4 (SDH)
4 x STM-4 PORT P4S4 3AL 79176 AA-- 16 24 to 39 13
ACCESS BOARDS (CO ECTIO MODULES)
2 x140/STM-1 OPT./EL. ADAPTER A2S1 3AL 78818 AA-- 16 4 to 19 14
2 x STM-4 ACCESS A2S4 3AL 79177 AA-- 16 4 to 19 15
4 x STM-1 EL A4ES1 3AL 78835 AA-- 16 4 to 19 26
16 x STM-1 ELECTRICAL ACCESS A16ES1 3AL 80492 AA-- 16 4 to 19 16
HIGH SPEED PROTECTIO HPROT 3AL 78849 AA-- 3 4 to 19 17
16 x HIGH SPEED PROTECTIO HPROT16 3AL 81269 AA-- 3 4 to 19 17
12 x STM-1 OPTICAL ACCESS
A12OS1 3AL 80949 AA-- 16 4 to 19 18
COMPACT
STM- ELECTRICAL/OPTICAL MODULES
140/155MB ELECTRICAL I TERF. ICMI 3AL 37558 AB-- -- 19
OPTO TRX SFP S-1.1 PLUG-I SS-1.1 1AB 19467 0001
256
OPTO TRX SFP L-1.1 PLUG-I SL-1.1 1AB 19467 0002 -- 20
OPTO TRX SFP L-1.2 PLUG-I SL-1.2 1AB 19467 0003
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

ANV P/N Max.
Factory P/N Q.ty
S-4.1 OPTICAL I TERF. FC/PC 3AL 79340 AA--
S-4.1 OPTICAL I TERF. SC/PC IS-4.1 3AL 79451 AA--
S-4.1 OPTICAL I TERF. LC 3AL 91793 AA--
L-4.1 OPTICAL I TERF. FC/PC 3AL 79452 AA--
L-4.1 OPTICAL I TERF. SC/PC IL-4.1 3AL 79452 AB-- 64 -- 21
L-4.1 OPTICAL I TERF. LC 3AL 91794 AA--
L-4.2 OPTICAL I TERF. FC/PC 3AL 79453 AA--
L-4.2 OPTICAL I TERF. SC/PC IL-4.2 3AL 79453 AB--
L-4.2 OPTICAL I TERF. LC 3AL 91795 AA--

ANV P/N Max.
Factory P/N Q.ty
FA U IT
FA 3AL 79114 AA--
FOR FA S SHELF 21" 8 --
ASEL FA LEVEL 3WIRE FA 3AL 79114 AB-- 22
PROTECTIO
-- 3A 50121 AA-- 4 --
FOR FA S SHELF 21"
DUMMY PLATE W20 (h 290) -- 3A 49397 AA-- 35 -- 23
DUMMY PLATE W40 (h 140) -- 3A 49587 AA-- 8 -- 24
I STALLATIO KIT 1670SM for
-- 3AL 79486 AA-- 1 -- --
OPTI EX RACK
I STALLATIO KIT 1670SM for
-- 3AL 81819 AA-- 1 -- --
1678 MCC RACK

Note Explanation
1 It is the equipment shelf. It includes the back panel and a W10 dummy plate.
2 Placed under the 1670SM Shelf, it is mandatory and does not include its accessories (two FA Units and one Protection).
3 OED rack for 1670SM and 1662SMC.
4 One Shelf ID per 1670SM shelf mandatory.

Delivers two voltage levels to all the boards.
5 Provides external connectors for housekeepings, rack lamps, Q interface, LA interface.
A mixed configuration of two types of CO GIHC (3-wire and 2-wire) in the same 1670SM equipment is not allowed.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

Note Explanation
eeded for connection to the 1678 main shelf. A mix of the different link boards within one shelf is allowed. OTE: 3AL
6
81509 AA--and 3AL 81509 AB-- are phased out.
Two HCMATRIX boards are used in an 1+1 protected EPS configuration; the board performs connection and
7
cross-connection functionalities and moreover synchronization functionalities.
This is a spare part item.

8
The 1670SM Shelf already includes it.
9 This board needs an access board (A16ES1) for 16xSTM-1 electrical connections.
This board manages up to sixteen STM-1 optical streams (numbered from Ch.1 to Ch.4).
10 It needs up to four SFP optical modules to be fully equipped and the others twelve SFP optical modules have to be inserted
on the relevant A12OS1 access board (numbered from Ch.5 to Ch.16).
The port needs four (electrical or optical) modules to be fully connected. Two modules have to be inserted on the board
front panel and two on the corresponding access board 2xSTM-1 front panel (A2S1). otice that different kind of access
11
module (electrical and optical, also of different characteristic and connectors) can be inserted in the port board or in the
access board.
12 Each port of this board can be configurated as 140 Mbit/s or STM-1.

The port needs four optical modules to be fully connected. Two modules have to be inserted on the board front panel and
13 two on the corresponding access board 2xSTM-4 front panel (A2S4). otice that different kind of access module (also of
different characteristic and connectors) can be inserted in the port board or in the access board.
This board needs up to 2 (electrical or optical) 140Mbit/s or STM-1 modules in the front panel, numbered from top to
14
bottom; this board is used for the 4x140/STM-1 O/E port (P4E4 ).
This board needs up to 2 optical STM-4 modules in the front panel, numbered from top to bottom; this board is used for
15
the 4xSTM-4 port (P4S4 ).
HS access board to be used for the 16xSTM-1 optical/electrical port (P16S1 ). Allows the bidirectional connection of up
16
to 16 channels.
This board is used in an EPS protection scheme as access board for High Speed STM-1 electrical spare port (HPROT for
17
P4ES1 and HPROT16 for P16S1).
This board is used in conjunction to the relevant 16xSTM-1 compact port (P16OS1).
18
It needs up to twelve SFP optical modules to be fully equipped (numbered from Ch.5 to Ch.16).
Up to 2 of these modules are inserted on the boards P4E4 and A2S1 to realize electrical connections for a maximum of 2
19
STM-1 channels (one for module).
Up to 4 of these SFP modules are inserted on P16OS1 board and up to 12 of these modules are inserted on A12OS1 access
20
board. They realize optical STM-1 connections.
Up to 2 of these modules are inserted on the boards P4S4 and A2S4 to realize optical connections for a maximum of 4
21
STM-4 channels (one for module). Optical modules supplied with different connectors (SC/PC or FC/PC).
22 Accessories of FA s Subracks.
It is essential to insert the relevant dummy plates on the spaces left by all boards (port or access board) not supplied in
23
order to obtain the EMI/EMC performances.
24 Dummy plate for unequipped HCLI KE board.
25 This board needs an access board (A4ES1) for 4xSTM-1 electrical connections.
HS access board to be used for the 4xSTM-1 electrical port (P4S1 ). Allows the bidirectional connection of up to 4
26
channels.
This link board uses an I–64.1 XFP module, that is, a different connector compared to the other link boards. A standard LC
27 cable can be used for the connection to the 1678MCC main shelf. The XFP module belongs to the link board. The removal
of the module is mechanically prohibited. Do not try to remove the module!
...................................................................................................................................................................................................................................
1670SM Shelf - Units Front View
...................................................................................................................................................................................................................................

Figure 3-59, “4x140/STM-1 Switchable E/O Port Board or 4xSTM-4 Port Board - Front
View” (p. 3-107) through Figure 3-72, “FA s Subrack Cover - Front View” (p. 3-120)
illustrate units front view available in the 1670SM Equipment.
Figure 3-74, “Electrical pluggable module” (p. 3-121) through Figure 3-76, “Optical SFP
module” (p. 3-122) show the pluggable modules available in the 1670SM Equipment.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-59 4x140/STM-1 Switchable E/O Port Board or 4xSTM-4 Port Board - Front
View
ACRONYM SLOTS
P4E4N 24 to 39
P4S4N
(1)
(2)
(1) Channel #1 (refer to the note)

(3) Bicolor LED
Red: The system control
detected a board error,
local board alarm (INT)
Green: The board is in service (3)
ote: The P4E4 board can be equipped with electrical modules, refer to Figure
3-74, “Electrical pluggable module” (p. 3-121), the P4S4 board can be equipped
with optical modules, refer to Figure 3-75, “STM-4 Optical Modules” (p. 3-121).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-60 4xSTM-1 E/16xSTM-1 E/O Port Board - Front View
ACRONYM SLOTS
P4ES1 24 to 39
P16S1N 24 to 39
(1) Bicolor LED

local board alarm (INT) (1)
Green: The board is in service
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-61 16xSTM-1 COMPACT optical Port Board - front view
ACRONYM SLOTS
P16OS1 24 to 39
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(1) Bicolor LED (9)
(2) to (5) STM–1 optical channel (refer to the note)
(from channel #1 to channel #4)
(6) to (9) Laser restart key
(1)
ote: The twelve remaining STM-1 channels are on the A12OS1 access board, refer
to Figure 3-65, “12xSTM-1 COMPACT optical Access Board - Front View”
(p. 3-113). The cavities must be equipped with STM-1 optical SFP module plug-ins
(refer to Figure 3-76, “Optical SFP module” (p. 3-122)).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-62 2x140Mbit/s/STM-1/STM-4 Access Board Optical - Front View
ACRONYM SLOTS
A2S1 4 to 19
A2S4 4 to 19
(1)
(2)

(3) Bicolor LED
ote: The A2S1 board can be equipped with electrical modules, refer to Figure 3-74,
“Electrical pluggable module” (p. 3-121), the A2S4 board can be equipped with
optical modules, refer to Figure 3-75, “STM-4 Optical Modules” (p. 3-121).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-63 4xSTM-1 Electrical 75 Ohm Access Board - Front View
ACRONYM SLOTS
A4ES1 4 to 19
INPUT
(1)
OUTPUT
INPUT
(2)
OUTPUT
INPUT
(3)
OUTPUT
INPUT
(4)
OUTPUT
(1) to (4) STM-1 electrical Channel

(5) Bicolor LED:
(5)
Red: The system control detected a board error,
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-64 16xSTM-1 Electrical 75 Ohm Access Board - Front View
ACRONYM SLOTS
A16ES1 4 to 19
INPUT OUTPUT
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(1) to (16) STM-1 electrical Channel

(17) Bicolor LED:
Red: The system control detected a board error, (17)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-65 12xSTM-1 COMPACT optical Access Board - Front View
ACRONYM SLOTS
A12OS1 4 to 19
(1)
(14)
(2)
(15)
(3)
(16)
(4)
(17)
(5)
(18)
(6)
(19)
(7)
(20)
(8)
(1) to (12) STM-1 optical channel (refer to the note) (21)

(from channel #5 to channel #16) (9)
(14) to (25) Laser restart key (22)
(10)
(13) Bicolor LED (23)
(11)
local board alarm (INT) (24)
(25)
(13)
ote: The first four STM-1 channels are on the P16OS1 port board, refer to Figure
3-61, “16xSTM-1 COMPACT optical Port Board - front view” (p. 3-109). The
cavities must be equipped with STM-1 optical SFP module plug-ins (refer to Figure
3-76, “Optical SFP module” (p. 3-122)).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-66 High-Speed Protection Board - Front View
ACRONYM SLOTS
HPROT 4 to 19
HPROT16 4 to 19
(1) Bicolor LED

(1)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-67 Bus Termination Board - Front View
ACRONYM SLOT
BTERM 46
(1)
(1) Bicolor LED

...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-68 HiCap Matrix Board - Front View
ACRONYM SLOTS
HCMATRIX 22 and 41
(1)
(3)
(2)
(1) For factory and maintenance only.

(2) Reset command key.
(3) Multicolor LED
Green: The board is in service (main)
Yellow: The board is in stand by (spare)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-69 Optical Link Enhanced Board - Front view
ACRONYM SLOTS
FC/PC
42 to 45
HCLINKE 47 to 50
(1)
HCLINKE main: slot 42, 44, 47, 49

HCLINKE spare: slot 43, 45, 48, 50
(2)
The board is also available
with an SC/PC connector:
SC/PC (3)
INPUT
INPUT
OUTPUT
OUTPUT
(1) Bicolor LED

(2) Laser Restart Key
(3) Optical IN/OUT 10 GBit/s signal
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-70 Optical Link LC CONNECTOR Board - Front view
ACRONYM SLOTS
LC
42 to 45
HCLINKE 47 to 50
(1)
HCLINKE main: slot 42, 44, 47, 49

HCLINKE spare: slot 43, 45, 48, 50
(2)
(3)
INPUT
OUTPUT
(1) Bicolor LED

(2) Laser Restart Key
(3) Optical IN/OUT 10 GBit/s signal
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-71 Control and Generic Interface Board - Front View
ACRONYM SLOTS
CONGIHC 1, 21
(1)
CONGIHC/A Slot 1
CONGIHC/B Slot 21
(8)
(1) Power ( 48/60 V)

(2)
(2) Housekeeping and remote alarm (only used in slot 1)
(3) Rack lamp (only used in slot 1)
(9)
(4) Shelf Identifier block (not used in slot 1)
(3)
(5) not used (external LAN, 10Base2)
(6) not used (external LAN, 10Base2)
(7) External LAN (Slot 1), 10BaseT
IP or Q interface (single LAN configuration) (4)
Customer s LAN (Slot 21), 10BaseT (optionally)
only Q interface (separated LAN configuration (10)
(8) Auxiliary housekeeping (8 + 8), connector for FAN alarm cable
(9) not Used (5) (11)
(10) Internal LAN - 10baseT (link #1) Main LAN
(6) (12)
(11) not used
(12) not used (7) (13)
(13) Internal LAN - 10baseT (link #2) Redundant LAN
(14) Bicolor LED
(14)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-72 FANs Subrack Cover - Front View
(1) (2) (3) (4) (5) (6)
(7)
Fans Unit #1
Fans Unit #2 (8)
LEGENDA:
(1) (2) (3) (4) (5) (6)
(1) Red LED ( NURG) n ot used or not present

(2) Red LED U rgent alarm (URG)
(3) Yellow LED Alarm storing (ATTD)
(4) Alarm storing push botton (Attended)
(5) Red LED n ot used or not present
(6) Red LED f ans Urgent alarm (URG V)
Figure 3-73 Shelf ID Connector for 1670SM
Connector SUB-D Rotary Switch

15-pin, male for ID
Shelf ID Connector
is connected on
CONGIHC Board B
(Slot 21)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-74 Electrical pluggable module
Figure 3-75 STM-4 Optical Modules
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-76 Optical SFP module
...................................................................................................................................................................................................................................
1662SMC Shelf - Shelf Layout
...................................................................................................................................................................................................................................
1662SMC Shelf - Shelf Layout

The 1662SMC is a single row construction. The mechanical integration is such that the
1662SMC is housed in 600x300 mm racks. Back to back and stand alone application of
OED-Racks will be supported. EMC shielding is done on shelf level. The 1662SMC
shelves are indoor equipment and it is recommended to be installed in a air conditioned
location.
It must be noted that max 504x2 Mbit/s ports can be equipped in one shelf (unprotected
configuration). In the configuration with EPS max 378x2 Mbit/s ports can be equipped.
The layout of the 1662SMC shelf is shown in Figure 3-77, “1662SMC Shelf Front View”
(p. 3-123)
Figure 3-77 1662SMC Shelf Front View

1662SMC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
SYNTH16 copyA
SYNTH16 copyB
A
B
Access
Access
Access
Access
Access
Access
Access
Access
CONGI
CONGI
Port
Port
Port
Port
Port
Port
Port
Port
* * * Slot 21 and 22 for

BUSTERM board
(behind SYNTH16)
...................................................................................................................................................................................................................................
1662SMC Shelf - Basic Equipment
...................................................................................................................................................................................................................................
1662SMC Shelf - Basic Equipment
Table 3-24 1662SMC: Basic Equipment

Slot Board Mnemonic Comment
1 Control & General I/F Board CO GI Mandatory
2 to 5 Access boards 63x2Mbit/s A63x2E1A/B
6 Compact STM-16 copy A SY TH16 Mandatory
7 to 14 Port boards 63x2Mbit/s P63E1/ / -M4
15 Compact STM-16 copy B SY TH16 Mandatory
16 to 19 Access boards 63x2Mbit/s A63x2E1A/B
20 Control & General I/F Board CO GI Mandatory
21, 22 Termination Bus 1662 T_BUS Mandatory
Cooling A separate FA subrack is mounted at the bottom of each 1662SMC
...................................................................................................................................................................................................................................
1662SMC Shelf - Basic Function of the Boards
...................................................................................................................................................................................................................................
1662SMC Shelf - Basic Function of the Boards

COGI (Control and General Interface)
• Provides power supply interfaces and power supply distribution
• Provides the external LA interface
A Shelf Identifier is plugged on the CO GI in slot 20 (Q2 interface)
SYTH16
SY TH16 board includes:
• SDH matrix
The matrix implements the Cross-Connect functions. The full non blocking matrix
allows cross-connections of up to 96x96 STM-1 equivalents at High Order level and
up to 64x64 STM-1 equivalents at Low Order level between all traffic ports.
• Clock reference
• The left SY CH16 board provides Equipment control functions (EQUICO62).
BUSTERM (Termination Bus)
• Provides voltage logical reference to all Control and Auxiliary buses
The board is mandatory and is located behind the SY TH16 board (not visible in
front view)
Access board
• Line Interface:
Access boards are used together with the 2 Mbit/s interfaces
• Protection board (LPROT)
Port board
• Transport, adaptation and termination functions
• Matrix selection
I/O Interfaces
The 1662SMC integration of this Release supports only 2 Mbit/s interfaces.
...................................................................................................................................................................................................................................
1662SMC Shelf - System Configurations
...................................................................................................................................................................................................................................

Supported I/O Boards, relation Access/Port Boards
Figure 3-78 1662SMC: I/O Boards. Relation Access/Port Boards

Interface Access Boards Port Boards Connectors
1 slot 1 slot
1
63x2Mbit/s
....
....
63 x 2Mbit/s 63x2Mbit/s
Access standard HM 75Ohm or 120Ohm

Port standard 63 Standard Standard
1 slot 1 slot
1
63x2Mbit/s 63x2Mbit/s
....
63 x 2Mbit/s
....
HM 120Ohm
Access K20
Port standard 63 K20 Standard
1 slot 1 slot
1
63 x 2Mbit/s 63x2Mbit/s
....
....
63x2Mbit/s
Access standard HM 75Ohm or 120Ohm
Port with retiming 63
with retiming
Standard function
function
1 slot 1 slot
1
63 x 2Mbit/s 63x2Mbit/s 63x2Mbit/s
....
....
Access K20 HM 120Ohm

Port with retiming with retiming
63 K20
function function
2 slot
1 x STM 16 SYNTH16
S 16.1
FC/PC
SC/PC
Used only for the connection to the Main Shelf
Relation Access Board/Port Board
Table 3-25 1662SMC: Relation Access / Port Boards

Slot Access Board 2 3 4 5 16 17 18 19
Slot Port Board 7 8 9 10 11 12 13 14
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Configuration Rules
Table 3-26 1662SMC: Configuration Rules

Capacity • Capacity of the Shelf: 16 STM-1eq.
(Actually needed capacity in the 1678 MCC application R3: 8
STM-1equiv.)
• Max. number of 1662SMC which can be attached to the Main Shelf: 32
This number is limited by the max. capacity of the LO matrix:
256STM-1 eq.
I/O Boards • Only 2Mbit/s boards are supported
• Each slot has a capacity of 2 STM-1eq.
• The 2Mbit/s I/O interfaces consists of port and access boards.
• The 2 Mbit/s port and access boards are available in different versions as
shown in Figure 3-78, “1662SMC: I/O Boards. Relation Access/Port
Boards” (p. 3-126)
I/O Protection • EPS 1:n (n=1...3). One or two protection groups are possible
• The protection access board LPROT may be located in slots 2 to 5, resp.
18 to 21. The protection I/O port board have to be inserted in a slot at
the most left of the protected port boards group. (for relation of access
and port board ref. Table 3-25, “1662SMC: Relation Access / Port
Boards” (p. 3-126))
Dummy Plates • The slots which are not equipped must be closed by a dummy plate for
EMC reasons
Connection to • The connection to the Main Shelf is done via the SY TH16 (S-16.1)
the Main Shelf boards: the connection cables are plugged at the front of the SY TH16
• Capacity of the SY TH16 board: 16 STM-1eq.
Front view of the Shelf equipped with 2Mbit/s I/O Boards
Figure 3-79 1662SMC Equipment: Unprotected Configuration with 2Mbit/s
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
SYNTH16 copyA
SYNTH16 copyB
CONGI copyA
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
CONGI copyB
A
B
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
WW W W WW W W W W W W W W WW
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-80 1662SMC Equipment: Protected Configuration with 2Mbit/s
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
prot. Port 63 x 2Mb/s
prot. Port 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
Access 63 x 2Mb/s
SYNTH16 copyA
SYNTH16 copyB
CONGI copyA
CONGI copyB
A
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
Port 63 x 2Mb/s
B
LPROT
LPROT
W: Working
P: Protection P W WW P W W W P WW W P W WW
Connection to the Main shelf

In deviation to the 1670SM where the link capacity is STM-64, the capacity for each link
for the 1662SMC is STM-16. As link board in the 1662SMC the STM-16 I/O board
(SY TH16) is used which is connected with fibres to one port of the 16xSTM-16 I/O
board in the main shelf of the 1678 MCC.
The link can be configured in a flexible way, i.e. the STM-16 ports can be chosen in an
arbitrary way.
The links are MSP protected. Two (SY TH16) boards using a STM-16 interface in the
1662SMC are connected with two fibres to two different STM-16 ports on possibly
different 16xSTM-16 boards in the 1678 MCC (refer to Figure 3-81, “Connection Main
Shelf/1662SMC (1+1MSP protected)” (p. 3-129)).
The synchronization between OED and main-shelf is done via the STM-16 links. o
additional cabling is required. The clock source can be either selected from an I/O port at
the OED and the synchronization is transmitted over the link to the main-shelf which
selects the link as clock source, or vice versa. The STM-16 links allow a complete SSM
handling for synchronization.
The connection main shelf/1662SMC is done via the following 'connection items':
• Optical cables.
• On the Main Shelf side, the cables are plugged at the front of dedicated I/O boards
16xSTM-16 (S-16.1)
• On the 1662SMC side, the cables are plugged at the front of the SY TH 16 boards
(S-16.1).
• The connection may be unprotected or 1+1 MSP protected.
Figure 3-81, “Connection Main Shelf/1662SMC (1+1MSP protected)” (p. 3-129)shows
an example for a Main Shelf/1662SMC connection 1+1 MSP protected.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-81 Connection Main Shelf/1662SMC (1+1MSP protected)

Main Shelf
FAN
16xSTM–16 S–16.1 copyA

16xSTM–16 S–16.1 copyB
PWI
PWI
24 25
MX160/320/640 Copy B
MX160/320/640 Copy A
1662SMC
SYNTH16 copyBB(S–16.1)
FLCCONGI
SYNTH16 copyAA(S–16.1)
FLCSERV
CONGI copyA
.. ..
CONGI copyB
LAX40 copyB
LAX40 copyA
.. ..
Access
Access
Access
Access
Access
Access
Access
Access
Port
Port
Port
Port
Port
Port
Port
Port
1 2 3 4 5 8 9 10 11 12 13 14 1516 17 18 19 20
FAN
1 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 20
Capacity: 1xSTM–16 per Link
Number of connected 1662SMC Shelves

The number of OEDs which can be connected to one 1678 MCC main shelf is limited by
the I/O ports used as link ports in the 1678 MCC main shelf. For 1662SMC OEDs, an
additional limit is given by the LO matrix capacity offered by the 1678 MCC main shelf
(max. 160G).
For the 1662SMC integration the 1678 MCC main shelf offers 16x16 = 256 STM-16
ports which can be used as STM-16 link ports. Theoretically, 128 1662SMC OEDs could
be connected with a protected link. But due to performance reasons only up to 32
1662SMC OEDs can actually be connected to the main shelf with a protected link.
...................................................................................................................................................................................................................................
1662SMC Shelf - Part List
...................................................................................................................................................................................................................................

• Table 3-27, “Main part list” (p. 3-130) shows the Main part list
previous lists.
• A V Part/ umber
• Max Q.ty: maximum quantity of items in the 1662SMC equipment
• Slot: position of the board inside the 1662SMC equipment (refer to Figure 3-77,
“1662SMC Shelf Front View” (p. 3-123))
Table 3-27 Main part list
ANV P/N Max.
Factory P/N Q.ty
1662SMC SHELF SR62C 3AL 98009 AB-- 1 -- 1
FA S SHELF 19" -- 3AL 79773 AA-- 1 -- 2
OPTI EX RACK WITH TRU -- 3A 44815 AA-- 1 -- 3
TERMI ATIO BUS/2 T_BUS 3AL 79088 AC-- 2 21, 22 4
SHELF IDE TIFICATIO IDSHELF 3AL 79242 AA-- 1 -- 5
CO TROL A D GE ERAL I/F CO GI 3AL 78830 AD-- 2 1, 20 6

3AL 98038 AC--
COMPACT ADM 16 SY TH16 2 6, 15 7
3AL 98038 AD--
EXTRACTORS KIT -- 3AL 79497 AA-- 1 -- 8
63x2 MBIT/S PORT P63E1 3AL 79092 AA-- 9

8 7 to 14
63x2 MBIT/S G703/ISD -PRA-FS PORT P63E1 3AL 79092 AC-- 10
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

ANV P/N Max.
Factory P/N Q.ty
63x2 MBIT/S PROT. 75 OHM HM A63E1A 3AL 98029 AA--
11
63x2 MBIT/S PROT. 120 OHM HM A63E1B 3AL 98035 AA-- 2 to 5,
8
16 to 19 11,
63x2 MBIT/S PROT. 120 OHM HM K20 A63E1B 3AL 98051 AA--
12
2 to 5,
LOW SPEED PROTECTIO LPROT 3AL 98026 AA-- 2 13
16 to 19
STM- OPTICAL MODULES
OPTO TRX SFP S-16.1 PLUG-I SS-161 1AB 19637 0001 2 -- 14

ANV P/N Max.
Factory P/N Q.ty
FA U IT
FA 3AL 79772 AA-- 4 -- 15
FOR FA S SHELF 19"
METALLIC FA GRID -- 3AL 81812 AA-- 1 -- 16
I STALLATIO KIT FA SHELF
-- 3AL 80807 AA-- 1 -- --
1662SMC for OPTI EX RACK
I STALLATIO KIT FA SHELF
-- 3AG 24277 AA-- 1 -- --
1662SMC for 1678 MCC RACK
I STALLATIO KIT 1662SMC for
-- 3AL 79463 AA-- 1 -- --
OPTI EX RACK
I STALLATIO KIT 1662SMC for
-- 3AL 91636 AA-- 1 -- --
1678 MCC RACK
1662SMC 19/21" ADAPTER -- 3AL 98097 AA-- 1 -- 17
1662SMC FIBER I STALLATIO KIT
-- 3AL 98198 AA-- 1 -- --
21"
2MB/S CABLI G TOOLS -- 3AL 98162 AA-- 1 -- --

Note Explanation
1 It is the equipment shelf. It includes the back panel.

Placed under the 1662SMC Shelf, it is mandatory and does not include its accessories (two FA Units and one
2
Protection).
3 OED rack for 1670SM and 1662SMC.
4 Mandatory board, it is used to provide voltage logical reference to all control and auxiliary busses.
5 One Shelf ID per 1662SMC shelf mandatory.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

Note Explanation
Delivers two voltage levels to all the boards. Only the CO GI in slot1 provides external connectors for housekeeping,
6
rack lamps, Q interface, LA interface. Both CO GI boards (slot1 and 20) deliver remote alarms.
eeded for connection to the 1678 main shelf. The board provides: 1xSTM-16 line interface, equipment controller, shelf
7
controller, matrix and synchronization function (1+1 protected EPS configuration).
8 Tool used to extract the connectors.
9 To be used with access board A63E1. Each access board A63E1 are needed to fully connect the port channels.
10 The board supports the T functionality, performance monitoring and retiming on 2 Mbit/s ISD --PRA.
Protected LS access board. Allow bidirectional connection of up to 63x2 Mbit/s channels. To be used in EPS protection
11
configurations.
12 LS access board complaint with ITU K20 norms.
13 To be used in EPS protection schemes as access board for the LS electrical port (63x2 Mbit/s).
14 Optical SFP module used on the SY TH16 board.

15 Two FA units for each 1662SMC shelf are necessary in the FA shelf.
16 Metallic FA grid.
17 Mechanical adapter utilized to insert the subrack in an 21" rack.
...................................................................................................................................................................................................................................
1662SMC Shelf - Units Front View
...................................................................................................................................................................................................................................

Figure 3-82, “63 x 2 Mbit/s Port Board - Front View” (p. 3-134) through Figure 3-87,
“FA s Subrack Cover - Front View” (p. 3-139) illustrate units front view available in the
1662SMC Equipment.
Figure 3-88, “STM-16 optical SFP module” (p. 3-139) shows the pluggable module
available in the 1662SMC Equipment.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-82 63 x 2 Mbit/s Port Board - Front View
ACRONYM SLOTS
P63E1 7 to 14
P63E1N M4 7 to 14
3AL XXXXX AA
(1) Multicolor LED (1)

xxxxxx
Red led l ocal unit alarm

Green led i n service unit
Orange led unit in Stand by (EPS schema)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-83 Control and General Interface - Front View
ACRONYM SLOTS
CONGI 1, 20
(1)
(2)
(3)
(4)
(1) Power
(5)
(2) Housekeeping and remote alarm
(3) Rack lamps (not used on CONGI in slot 20)
(4) QMD (Q2) (Fan alarm on CONGI in Slot 1)
(Shelf ID on CONGI in Slot 20) (6)
(5) I/O BNC for Q3 10 base 2 (not used on CONGI in slot 20)
3AL XXXXX AA
(6) RJ45 for Q3 10 base T (not used on CONGI in slot 20)

(7)
xxxxxx
(7) Bicolor LED:

...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-84 SYNTH16 Board - Front View
ACRONYM SLOTS
SYNTH16 6, 15
(5)
(1) PC Connector (F interface)

(2) Reset Command Key
(3) Alarm Storing Pushbutton (Attended)
(4) Lamp Test Pushbutton
(5) Channel #1 (N.B.)
(6) Red LED U rgent Alarm (Critical or Major) (1)
(7) Red LED N ot Urgent alarm (Minor)
(8) Yellow LED Alarm storing (Attended)
(9) Yellow LED Abnormal condition (6)
(10) Yellow LED Indicative Alarm (Warning) U
(11) Green LED w hen on, unit is active NU (7)
when off, unit is standby R AT (8)
(12) Bicolor LED: (2)
Red led l ocal unit alarm AB (9)
Green led i n service unit (3) IN (10)
(11)
(4) (12)
ote: The SY TH16 board can be equipped with the SS-161 Module (refer to Figure
3-88, “STM-16 optical SFP module” (p. 3-139)). The left SY TH16 board is
equipped with an EQUICO62.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-85 63 x 2 Mbit/s Access Board - Front View
ACRONYM SLOTS
A63E1A (75 OHM) 2 to 5, 16 to 19
A63E1B (120 Ohm) 2 to 5, 16 to 19
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(1) Channel # 1 7 (8)

(2) Channel # 8 1 4
(3) Channel # 15 21
(4) Channel # 22 2 8 (9)
(5) Channel # 29 3 5
(6) Channel # 36 4 2
(7) Channel # 43 4 9
3AL XXXXX AA
xxxxxx
(8) Channel # 50 5 6
(9) Channel # 57 6 3
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-86 Low Speed Protection Board - Front View
ACRONYM SLOTS
LPROT 2 to 5, 16 to 19
(1) Bicolor LED:

3AL XXXXX AA
(1)
xxxxxx

...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 3-87 FANs Subrack Cover - Front View
(1)
(2) (4) (5) (6) (3)
(1) Multicolor LED

Orange led t emperature major than 55 C
Green led
(2) Battery A connector

(3) Battery B connector
(4) not used
(5) Alarm connector
(6) not used
Figure 3-88 STM-16 optical SFP module
...................................................................................................................................................................................................................................
Topologies and configurations 1662SMC Shelf - Units Front View
...................................................................................................................................................................................................................................
Figure 3-89 Shelf ID Connector for 1662SMC
Connector SUB-D Rotary Switch

15-pin, male for ID
Shelf ID Connector
is connected on
CONGI Board B
(Slot 20)
...................................................................................................................................................................................................................................
4 Product description
4
Overview
Purpose
This chapter provides a description of 1678 Metro Core Connect (MCC), the involved
subsystems and boards, and a description of the units used in the different shelf types.
Contents
General Description 4-5

Board types 4-5
Centralized Common Boards 4-6
Equipment Units 4-7
Traffic Ports boards 4-8
Subsystems and involved Boards 4-13
General operating functions 4-13
Connections Subsystem 4-17
High Order SDH/SO ET/OT Cross Connect Subsystem 4-17
20/40G Lower Order Subsystem 4-18
160G Lower Order Partsystem 4-21
Transmission Management 4-22
Connection Management 4-24
Signal Management Subsystem 4-27
Introduction 4-27
SDH functional Model 4-28
ITU-T/ETSI SDH Functional Block 4-29
Matrix Board 4-35
Controller Subsystem 4-37
Overview 4-37
...................................................................................................................................................................................................................................
Product description Overview
...................................................................................................................................................................................................................................
FLC and SLC Functions 4-39

External Communication and Routing 4-44
Synchronization Subsystem 4-51
Synchronous equipment timing 4-51
Protection Subsystem 4-54
Protection types 4-54
EPS Protection Main Shelf 4-56
EPS Protection 1670SM Shelf 4-58
EPS Protection 1662SMC Shelf 4-62
etwork Protections 4-64
Performance Monitoring Subsystem 4-93
Overview 4-93
Monitoring Functions 4-95
External Interfaces Subsystem 4-96
List of external interfaces 4-96
Power Supply Subsystem 4-98
General power information 4-98
1678 MCC Main Shelf 4-99
OEDs 4-104
Equipment Alarms and Tests Subsystem 4-107
General alarm information 4-107
Battery Failure 4-108
RUM, RUTM 4-109
RUP 4-110
Fuse Failure 4-111
Test Management 4-112
Station Alarms 4-113
Description 4-113
Features 4-114
Architectural Overview 4-115
Control of the ( G)TRU 4-116
GTRU Alarm Supervision 4-117
Hardware Aspects 4-118
Supported Customer individual Housekeeping contacts 4-121
Housekeeping Monitoring Unit (HMU) 4-122
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Remote Inventory Subsystem 4-123

Remote inventory functions 4-123
OED Integration 4-125
General 4-125
System Requirements 4-126
Mechanical OED Integration Requirements 4-127
SW OED Integration Requirements 4-128
Kinds of OEDs 4-129
OED Synchronization 4-132
1678 MCC etwork Requirements 4-133
Consistent Time and Clock 4-133
Data Application and Layer 2 Switching 4-134
Importance of Ethernet services 4-134
4/8/16xGigabit Ethernet Boards 4-135
4x10 Gigabit Ethernet Boards 4-136
ISA-ES64 Data Board 4-137
Units Descriptions Main Shelf 4-138
Introduction 4-138
First Level Controller and Control & General Interface (FLCCO GI) 4-143
First Level Controller and Service Interface (FLCSERV) 4-149
Power Supply and Filter Board (PSF) 4-153
Bus Termination Board (BUSTERM) 4-156
Matrix 640 Gbit/s Board 4-158
Matrix 320/160 Gbit/s Enhanced Board (MX320 / MX160) 4-170
Lower Order Adaptation and Matrix 40G and 20G (LAX40 and LAX20) 4-171
STM-64 traffic Port Boards with not pluggable MSA Modules 4-175
STM-64 traffic Port Boards with pluggable XFP MSA Modules 4-181
STM-16 traffic Port Board (P16S16) 4-184
STM-16 Traffic Port Board (P4S16, P8S16) 4-189
16xSTM-1/4 Traffic Port Board (P16S1-4) 4-190
16xSTM-1 Traffic Port Board (P16S1S) 4-191
4/8/16xGigabit Ethernet Port Board 4-192
2x/4x10 Gigabit Ethernet Port Board 4-198
ES64 Server Card 4-203
FA Unit (FA ) 4-213
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Units Descriptions Lower order extension shelf 4-216

Introduction 4-216
Lower Order Adaptation Board 20G (LA20) 4-217
Lower Order Matrix 160 Gbit/s Board 4-220
Alarm Board (ALM) 4-222
Power Supply and Filter Board (PSF) 4-225
Bus Termination Board (BUSTERM) 4-226
Units Descriptions OED shelf 1670SM 4-227
Introduction 4-227
4xSTM-1Electrical I/O Interface 4-228
16xSTM-1Electrical I/O Interface 4-232
4xSTM-1Optical I/O Interface 4-234
16xSTM-1 Optical I/O Interface 4-238
I/O Port Board STM-4 4-240
I/O Port Board 4xSTM-4 4-242
4x140 Mbit/s Port Board (P4E4 ) 4-245
High Speed Port Protection Using HPROT and HPROT16 Boards 4-249
Optical Link Enhanced (HCLI KE) 4-252
Bus Termination (BTERM) 4-255
Control and General Interface Board (CO GIHC) 4-256
Matrix Board (HCMATRIX) 4-259
FA s Unit 4-263
Units Descriptions OED shelf 1662SMC 4-266
Introduction 4-266
63x2 Mbit/s Access Board 4-267
Low Speed Protection 4-269
63x2 Mbit/s Port Board (P63E1) 4-270
63x2 Mbit/s / G703 / ISD -PRA Port Board (P63E1 ) 4-274
CO GI Board 4-280
SY TH16 Board 4-284
FA Unit for FA Shelf 4-293
...................................................................................................................................................................................................................................
Product description General Description
Board types
...................................................................................................................................................................................................................................
General Description
Board types
The boards equipped in 1678 MCC are divided in the following types:
1. Centralized Common boards
2. Equipment units
3. Traffic Ports SDH boards
...................................................................................................................................................................................................................................
Centralized Common Boards
...................................................................................................................................................................................................................................

The following boards are available; they are mandatory in the 1678 MCC main shelf
equipment about control and connections:
• First Level Controller and Service interfaces board (FLCSERV)
The board provides the following functionalities:
– First Level Controller function (spare)
• F interface for Local Craft Terminal (CT)
• Communication with the Operation System (OS) through different interfaces
(DCC, QB3 etc.)
• 2 MHz Input/Output
• First Level Controller and Control & General interfaces board (FLCCOGI)
– First Level Controller function (main)
• F interface for Local Craft Terminal (CT)
• Communication with the Operation System (OS) through different interfaces
(DCC, QB3 etc.)
• QB3 Interface
• Housekeeping and Remote Alarm interface
• Auxiliary Housekeeping interface
• High Capacity Matrix board
Three types of HO matrix boards exist:
– MX640 with 4096 STM-1 equiv. (SDH, SO ET)
– MX320 with 2048 STM-1 equiv. (SDH, SO ET)
– MX160 with 1024 STM-1 equiv. (SDH)
– HO Matrix that performs HPC
– Protection functions
– HPOM / HSUT functions
– Synchronization functions
– Shelf Controller function
Two boards in master/slave configuration are provided (redundant SLC).
ote: The two First Level Controllers (FLCSERV and FLCCO GI) are provided in
main/spare configuration (redundant EC); the board in the “Active” state manages the
F interface.
...................................................................................................................................................................................................................................
Equipment Units
...................................................................................................................................................................................................................................
Equipment Units
The following units are available; they are mandatory in the 1678 MCC equipment about
powering, cooling and bus terminating:
• Power Supply and Filter board (PSF)
The board provides the following functionality:
– distribution of Power Supply (65 V) after filtering process
Two PSF boards in 1+1 configuration are provided (they are both mandatory).
• Bus Termination board (BUSTERM)
The board provides the following functionality:
– electrical termination to the buses routed in the backplane
Two BUSTERM boards are provided (they are both mandatory).
• FAs unit (FA)
The unit provides the following functionality:
– cooling the equipment
Two FA units are provided (they are both mandatory).
...................................................................................................................................................................................................................................
Traffic Ports boards
...................................................................................................................................................................................................................................

The following boards are available in the 1678 MCC main shelf:
• 16xSTM-1/4 optical board (P16S1S4)
The board provides to process up to sixteen STM-1/4's (SFP plug-in).
Any combination of optical interface (Short or Long haul) is possible on the same
port. That must be done by groups of four continuous STM-n ports.
The 16 x STM-1/4 board is a single blade board providing 16 slots. Each slot can host
a STM-1/4 SFP (small form factor plug-in) optical module, so that each board can
provide up to 16 optical interfaces.
This board is 4.5 TE wide.
The 1678 MCC can host up to sixteen 16 x STM-1/4 boards in one shelf. So the
maximum number of STM-1/4 interfaces per shelf is 256.
Each STM-1 SFP module is available with S-1.1, L-1.1 or L-1.2 interface and each
STM-4 SFP module is available with S-4.1, L-4.1 or L-4.2 interface. So each 16 x
STM-1/4 board can host any mix of the above mentioned interfaces.
All STM-1/4 modules can be protected in S CP or 1+1 / 1: MSP.
• 16xSTM-1 board (P16S1S)
The board provides to process up to sixteen STM-1's (SFP plug-in).
A combination of optical interfaces (Short or Long haul) and electrical interfaces is
possible on the same port.
The 16 x STM-1 board is a single blade board providing 16 slots. Each slot can host a
STM-1 SFP (small form factor plug-in) optical or electrical module, so that each
board can provide up to 16 optical/electrical interfaces.
The 1678 MCC can host up to sixteen 16 x STM-1 boards in one shelf. So the
maximum number of STM-1 interfaces per shelf is 256.
Limitation (In case of electrical interfaces): Due to mechanical restrictions, up to 32
STM-1 electrical ports can be supported within1678 MCC with front cover. The
boards have to be located as follow:
– one board on right side of the shelf
– one board on left side of the shelf.
Each STM-1 SFP module is available with SES1, S-1.1, L-1.1 or L-1.2 interface.
• 4/8/16xSTM-16 optical board (P4S16, P8S16, P16S16)
The board provides to process up to four/eight/sixteen STM-16's (SFP plug-in).
Any combination of optical interface (Short or Long haul) is possible on the same
port.
The 4/8/16 x STM-16 board is a single blade board providing 16 slots. Each slot can
host a STM-16 SFP (small form factor plug-in) optical module, so that each board can
provide up to 4/8/16 optical interfaces.
The 1678 MCC can host up to sixteen 4/8/16 x STM-16 boards in one shelf. So the
Each STM-16 SFP module is available with S-16.1, L-16.1 or L-16.2 interface, so
each 4/8/16xSTM-16 board can host any mix of four/eight/sixteen STM-16 interfaces.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
They may be used in the following configurations:

– x unprotected STM-16 lines
– x 1+1/1: STM-16 terminal
– x S C-P rings
– x 2-fiber MS-SPRing
– or any combinations of the above unprotected and protected configurations
• 1xSTM-64 board
The board provides one STM-64 optical interface.
The 1 x STM-64 optical board (S64M) is a single slot board providing one STM-64
optical interface (on front panel).
The STM-64 interface is available with FC or SC connectors.
Several interface types are available:
– S-64.2
– I-64.1 (VSR2000-2R1)
– L-64.2
– V-64.2
– U-64.2
• 2xSTM-64 board
The board provides two STM-64 optical interface.
The 2xSTM-64 optical board (P2S64M) is a single slot board providing two STM-64
optical interface (on front panel).
This board is 4.5 TE wide. The STM-64 interface is available with FC or SC
connectors.
– S-64.2
– I-64.1 (VSR2000-2R1)
– 2xSTM-64 interfaces per board for XFP/E modules
• 4xSTM-64 board
The board provides four STM-64 optical interface.
The 4xSTM-64 optical board (P4S64M) is a single slot board providing four STM-64
optical interfaces (on front panel).
This board is 4.5 TE wide. The four STM-64 interfaces are available with FC or SC
connectors.
The 1678 MCC can host up to sixteen 4 x STM-64 boards in one shelf. So the
– I-64.1 (VSR2000-2R1)
– 4xSTM-64 interfaces per board for XFP/E modules
The I-64.1 board can be used for the intra-shelf connections of 1670SM OEDs. The
links can be 1+1 MSP protected.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
All STM-64 boards can be used in the following configurations:

– x unprotected STM-64 lines
– x 1+1/1: STM-64 terminal
– x S C-P rings
– or any combinations of the above unprotected and protected configurations
• 4/8/16xGE board
The board provides to process up to four/eight/sixteen GE optical interfaces (SFP
plug-in).
Flexible mix of short range (1000SX) and long range (1000LX) optics is possible.
The 4/8/16 x GE board is a single blade board providing up to 16 slots. Each slot can
host a GE SFP (small form factor plug-in) optical module, so that each board can
provide up to 4/8/16 optical interfaces.
The 1678 MCC can host up to sixteen 4/8/16 x GE boards in one shelf. So the
maximum number of GE interfaces per shelf is 256.
Each GE SFP module is available with 1000SX or 1000LX interface, so each
4/8/16xSTM-16 board can host any mix of four/eight/sixteen GE interfaces.
They may be used in the following configurations:
– x S C-P rings
• 2/4x10 GE board
The board provides to process up to two/four GE optical interfaces (XFP plug-in).
Flexible mix of 10GE-SR, 10GE-LR and 10GE-ER is possible.
The 2/4x10GE board is a single blade board providing up to 2/4 slots. Each slot can
host a XFP optical module, so that each board can provide up to 2/4 optical interfaces.
• Lower Order Matrix board
Two types of LO matrix boards exist:
– LAX40 with 256 STM-1 equiv.
– LAX20 with 128 STM-1 equiv.
– LO Matrix
– Adaptation function
– Switching entities: VC-3, VC-12, VC-11 (for future VC-2)
– Protection capabilities: S CP/I, S CP/
Two boards in master/slave configuration are provided.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Lower Order Matrix Link 40G (LAC40)

This board is used to connect the 1678 MCC main shelf with the LO extension shelf.
The LAC40 board is a single blade board providing 16 slots. Each slot can host a
STM-16 SFP (small form factor plug-in) optical module, so that each board can
provide up to 16 optical interfaces (in general I-16.1).
Max. 5 (4+1) LAC40 boards are necessary to connect a fully equipped 160G LO
extension shelf.
• ES64 board
This board has a ethernet switching function (L2 switching)
The ES64 board can be used in the following configuration:
– always 1+1 EPS
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

The lower order partsystem provides lower order functionality with a capacity of 160
Gbit (1 K LO matrix).

The following boards are available; they are mandatory in the LO extension shelf
equipment about control and connections:
• Alarm board (ALM)
The board provides housekeeping, remote alarm and rack lamp interfaces.
• LO Centerstage Matrix board
LX160 with 1024 STM-1 equiv.
– Adaptation function
– LO three stage matrix (1 : MSP protected, =1...7)
– Protection capabilities: S CP/I, S CP/
– Redundant clock generator
Two boards in master/slave configuration are provided.
Equipment Units
The shelf includes also the equipment units PSF, BUSTERM and FA s as described in
chapter “Equipment Units” (p. 4-7).
Port Boards
The port board area of the shelf can be equipped with up to 16 port boards.
• LO Adaptation 20G board (LA20)
– The board is a single blade board providing 8 slots. Each slot can host a STM-16
SFP (small form factor plug-in) optical module, so that each board can provide up
to 8 optical interfaces (in general I-16.1).
– This board is 4.5 TE wide.
– For the 160G LO matrix a maximum of 10 (8+2) LA20 boards per shelf are
supported.
...................................................................................................................................................................................................................................
Product description Subsystems and involved Boards
General operating functions
...................................................................................................................................................................................................................................
Subsystems and involved Boards

Figure 4-1, “1678 MCC Block Diagram” (p. 4-14) illustrates in block diagram form some
boards employed in the 1678 MCC equipment and the general operating functions.
For more details on the boards managed refer to “Units Descriptions Main Shelf”
(p. 4-138).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-1 1678 MCC Block Diagram
Main shelf FLCSERV

optical 2MHz/2Mb T4/T5
interface I/O board synch G.703 T3/T6
O
DCC
STM-N Logical/
First Level
Physical
Controller Q3
Transport OBPS
and
Adaption
Function VccA / V ccB
BattA / BattB Control
FLCCONGI
OBPS 2MHz/2Mb T4/T5

16 synch G.703 T3/T6
1 DCC
BattA / BattB VccA / V ccB
First Level
Controller Q3
HO MATRIX OBPS
T0 VC-4/-nc VccA / V ccB

BattA / BattB Control
Matrix
SEC T4/T5 Power Supply Filter A

T1 VccA Power A
T3/T6
DC/DC
OBPS SLC BattA

2 Control
1
BattA / BattB VccA / V ccB Control
VccB Power Supply Filter B
Power B
LO MATRIX DC/DC
BattB
VC-3/VC-12/ Control
VC11 Matrix
OBPS
2
1
BattA / BattB VccA / V ccB
The functions carried out by the unit can be split into the following subsystems:
• Connections subsystem (refer to “Connections Subsystem” (p. 4-17))

• Signal management (refer to “Signal Management Subsystem” (p. 4-27))
subsystem
• Controller subsystem (refer to “Controller Subsystem” (p. 4-37))
• Synchronization subsystem (refer to “Synchronization Subsystem” (p. 4-51))
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Protection subsystem (refer to “Protection Subsystem” (p. 4-54))

• Performance Monitoring (refer to “Performance Monitoring Subsystem” (p. 4-93)
subsystem )
• External Interfaces (refer to “External Interfaces Subsystem” (p. 4-96))
subsystem
• Power Supply subsystem (refer to “Power Supply Subsystem” (p. 4-98))
• Equipment Alarms and (refer to “Equipment Alarms and Tests Subsystem”
Test subsystem (p. 4-107))
• Remote Inventory (refer to “Remote Inventory Subsystem” (p. 4-123))
subsystem
In the following sections a detailed description of each subsystem is given.

Each logical function does not correspond necessarily to a physical board but can be
distributed over more than one board. On the other side, one board can house more than
one function.
For each subsystem the list of the involved boards and a brief abstract of the function
detailed on the following paragraphs is reported in Table 4-1, “Subsystems and involved
boards” (p. 4-15).
Table 4-1 Subsystems and involved boards

Subsystem Board involved Short description
Connections MATRIX and ports The paragraph explains how the signal is
managed between the port and the MATRIX.
Signal all ports The paragraph explains how the SDH signals
management are elaborated on the ports.
The description is in compliancy with the
G.783 ITU-T Rec.
Controller FLCSERV and The control system is centralized.
FLCCO GI, HO The FLCSERV and the FLCCO GI perform
MATRIX the First Level Controller (FLC) function and
the HO MATRIX performs the Second Level
Controller (SLC) function.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 4-1 Subsystems and involved boards (continued)

Subsystem Board involved Short description
Pro- et- all ports The following network protections are
tection work explained: linear MSP, S CP/I and S CP/
protec- (among VC-4 only), Drop & Continue +
tions insertion S CP, Collapsed single-node ring
interconnection, Collapsed dual-node ring
interconnection, 2F MS-SPRing. The HO
MATRIX board manages all the protections.
Equip- FLCSERV and The SLC on the HO MATRIX board controls
ment FLCCO GI, HO the EPS protections.
protec- MATRIX
tions
Synchronization HO MATRIX The MATRIX performs the synchronization
function therefore distributing the clock and
synchronism to all the equipment units.
Auxiliary and all ports, FLCSERV, The paragraph explains how the OH bytes
External FLCCO GI (DCC) are framed and managed.
ote that EOW and AUX channels are not
supported.
Also the External Interfaces (Housekeeping,
Craft Terminal, Remote Alarms and Rack
Alarms) are described.
Power Supply all boards, PSF The powering is distributed over the all
equipment boards. The PSF boards provides
the 65 V and the service 3.3 V to power each
board.
Equipment all boards and modules The paragraph explains the Alarms and the
Alarms and Test Test (Loop) managed.
Remote all boards and modules The paragraph explains the Remote Inventory
Inventory architecture.
...................................................................................................................................................................................................................................
Product description Connections Subsystem
High Order SDH/SONET/OTN Cross Connect Subsystem
...................................................................................................................................................................................................................................
Connections Subsystem
High Order SDH/SONET/OTN Cross Connect Subsystem

The 1678 MCC cross-connect is built upon a non-blocking matrix (the HO
640/320/160Gb/s matrix) that can interconnect AU-4s (or AU-3s) between any
SDH/SO ET port accessing the system.
The same board can switch ODU-x entities, implementing the G.709 optical layer.
Several types of connections can be established, such as:
• unidirectional point-to-point (protected or unprotected)
• bi-directional point-to-point (protected or unprotected)
• unidirectional point-to-multipoint
• S CP Drop & Continue
The HO matrix capacity is max. 4096x4096 STM-1 equivalent ports at the Higher Order
VC level.
The HO matrix can support, in accordance with the ITU-T G.783 Rec., the following
functions:
• MSP (Multiplex Section Protection) according to G.841, which provides protection
for the STM- signal against line failures within a multiplex section, by using the
protocol defined for the MSP bytes: K1 and K2;
• HPC (Higher Order Path Connection), which performs the AU-4 (AU-3)
cross-connections, assigning an incoming VC-4's to an outgoing VC-4's. The
characteristic of the connection depends on:
– Type of connection (unprotected, 1+1 protected by means of S CP/I, S CP/
protection):
– Input and Output connection points.
The SDH/SO ET matrix is responsible for all the network protection mechanisms: S CP
and linear MSP. The matrix is always protected in 1+1 EPS configuration.
...................................................................................................................................................................................................................................
20/40G Lower Order Subsystem
...................................................................................................................................................................................................................................

Principle
The LO Matrix is a square matrix. Two LO board types are supported:
• LAX40
• LAX20
Equipment
The LO Matrix is implemented in 1+1 LAX matrix boards. The LAX boards are always
all equipped.
The LAX board implements the square low order matrix together with the so called
adaptation function (Higher Order path termination and adaptation function). The LAX
board is always 1+1 protected.
Figure 4-2 Low Order Matrix Overview
Lower order
adaption and
monitoring
Backplane
interface
to higher LO matrix
order function
subsystem
32 x 2.5 Gbit/s Copy

A and B
to/from HO Matrix
16 x 2.5 Gbit/s 16 x 2.5 Gbit/s
Switching entities
• VC-3
• VC-12
• VC-11 (SO ET).
Capacity
• LAX40 has a capacity of 256 STM-1 eq. (40 Gbit/s)
• LAX20 has a capacity of 128 STM-1 eq. (20 Gbit/s)
This results in a maximum capacity of 256 STM-1eq. for the LO matrix, if the LAX40
board is used.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Protection
• 1+1 protected
• S CP/I and S CP/ with:
– Hold off timers (limited to 4 values: disabled, 10,100,1000 ms)
– Wait to restore timers (disabled and 1 minute).
Matrix Management
Figure 4-3, “Physical Matrix View with MX640 and LAX40” (p. 4-19) shows the
physical signal flow between HO matrix and LO matrix. Receive and transmit direction
are depicted as dedicated boards on the left and the right hand side of the HO matrix. In
reality both signal directions are unified on a board and allow the insertion of remote
information into the transmission paths.
Figure 4-3 Physical Matrix View with MX640 and LAX40

RX direction TX direction
STM N, VC4
STM N, VC4
structured
1 1 structured
STM N, VC4
STM N, VC4
unstructured
unstructured
... ...
2Mbit 2Mbit
STM-1e/140Mbit HO I/O 14 * MX640 14 * HO I/O STM-1e/140Mbit

boards 256 STM1 4096 x 4096 256 STM1 boards
STM N, VC4 STM N, VC4
structured OED VC4
square matrix VC4 OED structured
STM N, VC4 STM N, VC4

unstructured unstructured
Gigabit Ethernet Gigabit Ethernet

4096 4096
256 STM1 256 STM1
1
LAX40 ...
256 x 256
square matrix256
OEDs are connected to the main shelf via normal interfaces.

In case the I/O port receives structured SDH/SO ET signals (from OED or directly from
an HO I/O) the signal can be connected to an assembler located on an LAX board (refer
to Figure 4-4, “Logical Matrix View” (p. 4-20)for matrix logical view).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Low order PDH traffic (only via OED) is connected via the HO matrix to the LAX
boards. The connection is established as soon as the OED ports are put into service. The
AU4 path through the HO matrix and the assembler on the LAX board are internal. Each
of the low order signals is connected with the LO matrix to a free assembler or to another
PDH port.
Figure 4-4 Logical Matrix View
RX direction TX direction
STM–N HO
structured Matrix STM–N
structured
STM–N
unstructured
STM–N
unstructured
Gigabit Ethernet Gigabit

Ethernet
STM-1e/140Mbit
I/O I/O STM-1e/140Mbit
board board
2Mbit 2Mbit
LO
Assembler
Assembler
Matrix
...................................................................................................................................................................................................................................
160G Lower Order Partsystem
...................................................................................................................................................................................................................................
160G Lower Order Partsystem

This partsystem has a LO functionality up to the capacity of 160 Gbit. The Lower Order
crossconnect functionality is implemented in an extension shelf.
The Lower Order system of the 1678 MCC contains the following functions:
• Adaptation function (TU-Pointer Processor), 1: protected
• Low Order three stage matrix
– scalable in steps of 20 GBit/s,
– the second stage is 1+1 EPS protected,
– the first and third stages are 1: protected using MSP, is 4 in case of 160G
• Switching entities : VC-3, VC-12
• Protection capabilities : S CP/I, S CP/
• Redundant clock generator (ETSI compliance)
The 1678 MCC Main Shelf with 160G Lower Order extension shelf is shown in Figure
4-5, “1678 MCC Main Shelf with 160G Lower Order Shelf” (p. 4-21)
Figure 4-5 1678 MCC Main Shelf with 160G Lower Order Shelf
STM 16
16 x STM16 link card
Intra system link
(16x 1:4 MSP)
1678MCC LO shelf
LA20 LX160
MX640GE LAC40 Link Daffodil TUPP ES
8x2.5G
MSP #1 LO CS
I/O #1
#1 HPC .. .. Copy A
.. 640G .. . .
. Copy A .
Link Daffodil TUPP ES
8x2.5G
#4 #8
MSP
HPC Link
640G 8x2.5G
Daffodil TUPP ES
#P1
I/O Copy B #P LO CS
#11 Copy B
Link Daffodil
8x2.5G TUPP ES
#P2
...................................................................................................................................................................................................................................
Transmission Management
...................................................................................................................................................................................................................................
The following functionalities are managed:
• J0 and J1 management
• POM on AU-4 and AU-3
• SUT on AU-4
• MSP 1+1 @ STM-16 / STM-64
• MSP 1+1 @ STM-1 / STM-4
• AU-3 switching
• F4 filter configuration at path layer
For more details refer to the 1678 MCC User Provisioning Guide.
Section Trace Management (J0)

The regenerator section trace identifier information is managed, according to ITU-T
G.707 Rec.: when the accepted identifier (AcTI detected in the byte J0) is different from
the expected (ExTI), an alarm "Trace Identifier Mismatch" (TIM) is generated. The
control can be disabled by setting ExTI= ULL.
Path Trace Management (J1)

The trail trace identifier information is managed, according to ITU-T G.707 Rec.: when
the accepted identifier (AcTI detected in the byte J1) is different from the expected
(ExTI), an alarm "Trace Identifier Mismatch" (TIM) is generated. The control can be
disabled by setting ExTI= ULL.
ote that the E calculates the CRC-7 value to be inserted even if this parameter is
passed to the E from the managing system.
Path Overhead Monitoring

Path Overhead ( on-intrusive) Monitoring function is implemented according to ITU-T
G.783 Rec.
The POM function monitors the VC-4 or VC-3 for errors, and recovers the trail
termination status.
It extracts and processes the payload overhead bytes from the VC.
The POM function detects the following alarms: Trace Identifier Mismatch (TIM),
EXCessive error (EXC),U EQuipped (U EQ), Alarm Indication Signal (AIS), Remote
Defect Indication (RDI), DEGraded Signal (DEG), Server Signal Failure (SSF).
The object modeling the POM function is created by CT/OS below the AU-4 or AU-3.
The POM can be used also for obtaining the S CP switch criteria.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Supervisory Unequipped Termination

SUT functions are implemented according to ITU-T G.783 Rec.
The object modeling the SUT function is created by CT/OS below the AU-4.
SUT on AU-3 is not supported.
...................................................................................................................................................................................................................................
Connection Management
...................................................................................................................................................................................................................................
The following functionalities are managed:
• S CP/I on AU -4 and AU-3
• S CP/ on AU -4 and AU -3
Overview
The connection management covers:
• the management of the connections at AU-4 and AU-3 level
• the management of unidirectional 1+1 revertive/not revertive subnetwork connection
protection (for both AU-4 and AU-3)
The 1678 MCC has the capability to manage and configure upon management request
several types of connections, namely:
• point-to-point connection (unidirectional and bidirectional)
– unprotected
– protected
• point-to-multipoint connection (unidirectional)
– unprotected
– protected
For the 1678 MCC equipment the maximum number of cross-connections is obtained
exploiting totally the matrix capability: 4096 AU4 crossconnectable (12288 AU3
crossconnectable).
The connections are established between ports belonging to the shelves and are always
performed by the matrix: no direct connection between two ports is allowed.
The managed system allows the managing system to protect a connection. Such protected
connections can be used in network protection applications.
Unprotected Point-to-Point Connections

The following Table 4-2, “Point-to-point connections” (p. 4-25) shows the possible
unprotected point-to-point connections (unidirectional and bidirectional).
There is not any constraint for the timeslot change for each cross-connection (i.e. the
AU-4#x of a STM-64 port can be cross-connected with the AU-4#y of a STM-16 port).
Such connections are allowed for both AU-4 and AU-3.
Protected Point-to-Point Connections

Protected point-to-point connections (unidirectional and bidirectional) are defined by
Figure 4-6, “Types of connections managed” (p. 4-26). Such connections are allowed for
both AU-4 and AU-3.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Unprotected Point-to-Multipoint Connections

Unprotected unidirectional point-to-multipoint (broadcast) connections are defined by
Figure 4-6, “Types of connections managed” (p. 4-26). Such connections are allowed for
both AU-4 and AU-3.
Protected Point-to-Multipoint Connections

Protected point-to-multipoint connections are defined by Figure 4-6, “Types of
connections managed” (p. 4-26).
Such connections are allowed for both AU-4 and AU-3.
Table 4-2 Point-to-point connections
STM-1 STM-4 STM-16 STM-64
AU3 AU4 AU3 AU4 AU4- AU3 AU4 AU4- AU4- AU3 AU4 AU4- AU4- AU4-
4c 4c 16c 4c 16c 64c
STM-1 AU3 X X X X
AU4 X X X X
STM-4 AU3 X X X X
AU4 X X X X
AU4- X X X
4c
STM-16 AU3 X X X X
AU4 X X X X
AU4- X X X
4c
AU4- X X
16c
STM-64 AU3 X X X X
AU4 X X X X
AU4- X X X
4c
AU4- X X
16c
AU4- X
64c
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-6 Types of connections managed
AU4 slot i
AU4 slot j
protected point to point unidirectional connection

AU4 slot x
AU4 slot i
AU4 slot j
protected point to point bidirectional connection

AU4 slot x
AU4 slot h
AU4 slot i
AU4 slot j
unprotected point to m ultipoint connection
AU4 slot x AU4 slot k
Protected AU4 slot i Protecting AU4 slot h
AU4 slot j
AU4 slot x AU4 slot k protected point to m ultipoint connection
...................................................................................................................................................................................................................................
Product description Signal Management Subsystem
Introduction
...................................................................................................................................................................................................................................
Signal Management Subsystem
Introduction
This section describes the signal management architecture implemented in 1678 MCC
equipment.
The signal management architecture has been designed in order to obtain a flexible
system in which the switching matrix is kept as much as possible payload independent.
This implies that SDH payload specific functions are implemented in the I/O port boards.
...................................................................................................................................................................................................................................
SDH functional Model
...................................................................................................................................................................................................................................
SDH functional Model

SDH Payload matrices, foreseen by ITU-T standards, (i.e. MSP_RX, H PC, MSP_TX
matrices) collapse into one single device, performing fully non blocking 4096x4096 AU-4
switch, with respect to any broadcast type.
Figure 4-7, “SDH payload subsystem functional model: physical position of functional
blocks” (p. 4-28) depicts the payload processing subsystem functional partitioning.
Figure 4-7 SDH payload subsystem functional model: physical position of functional
blocks
...................................................................................................................................................................................................................................
ITU-T/ETSI SDH Functional Block
...................................................................................................................................................................................................................................

SDH Port Board
At port board level, functions related to the payload processing are integrated, causing, in
principle, a violation of ITU-T G.783 functional model. The functional block diagram is
reported in Figure 4-8, “Port board implementation and corresponding ITU-T G.783
functional model” (p. 4-29), with its corresponding atomic function representation.
Figure 4-8 Port board implementation and corresponding ITU-T G.783 functional
model
The received/transmitted line signal is optical STM- with =1, 4, 16, 64, 256 (ITU-T
G.957 Rec. and ITU-T G.691 Rec.). The SDH frame format is compliant with ITU-T
G.707 Rec.
SDH Physical Layer
• Optical Section Layer Trail Termination: OSn_TT
– OSn_TT_Sk
input LOS detection
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
TSF insertion on LOS detection

– OSn_TT_So
signal conditioning for transmission medium
• Optical Section Layer Adaptation to Regenerator Section Layer: OSn/RSn_A
– OSn/RSn_A_Sk
descrambler
OOF count and LOF detection
SSF insertion (on LOF detection)
– OSn/RSn_A_So
scrambler
Regenerator Section Layer
• Regenerator Section Layer Trail Termination: RSn_TT
– RS_TT_Sk
A1, A2: frame alignment detection
J0: regenerator section trace recovery and mismatch detection
B1: BIP-8 Errored Block count: even bit parity is computed and compared with
B1 recovered from the current frame
BMD: Processed for detection of a fiber failure in a single fiber transmission.
BMD byte is set in position S(2,2,1).
D1-D3: RS data communication (DCC-R) extraction
SSF detection
TSF insertion (on SSF or TIM detection)
– RS_TT_So
A1, A2: frame alignment insertion
J0: regenerator section trace insertion
B1: BIP-8 calculation and insertion
BMD: BMD message insertion for detection of a fiber failure in a single fiber
transmission.
D1-D3: RS data communication (DCC-R) insertion
• Regenerator Section Layer Adaptation to Multiplex Section Layer: RSn/MSn_A
– RSn/MSn_A_Sk
TSF detection
SSF insertion (on TSF detection)
– RSn/MSn_A_So
no information is inserted
Multiplex Section Layer
• Multiplex Section Layer Trail Termination: MSn_TT
– MSn_TT_Sk
B2: BIP-24 Errored Block count
M1, M0: MS-REI recovery (M0 significant for STM-64/STM-256 only)
K2[6-8]: MS-RDI detection
K2[6-8]: MS-AIS detection
D4-D12: MS data communication (DCC-M) extraction
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
D13-D156: Extended MS data communication (DCC-Mx) extraction (STM-256

only)
S1: SSM message extraction
TSD insertion on MS -DEG (Signal Degrade) detection
TSF insertion (on MS-AIS detection)
– MSn_TT_So
B2: BIP-24 calculation and insertion
M1, M0: MS-REI insertion (M0 significant for STM-64/STM-256 only)
K2[6-8]: MS-RDI insertion
K2[6-8]: MS-AIS insertion
D4-D12: MS data communication (DCC-M) insertion
D13-D156: Extended MS data communication (DCC-Mx) insertion (STM-256
only)
S1: SSM message insertion
• Multiplex Section Sub-layer protection function:
– Multiplex Section Layer Adaptation to the Multiplex Section Protection Sub-layer:
MSn/MSnP_A
MSn/MSnP_A_Sk
the K1-K2 (extended to K0) information (APS protocol) is

recovered
SSD insertion (on TSD detection)
MSn/MSnP_A_So
generation of K1-K2 information (APS protocol - extended

to K0).
• Multiplex Section Protection Sub-layer Termination: MSnP_TT

– MSnP_TT_Sk
SSF detection
TSF insertion (on SSF detection)
– MSnP_TT_So
no information is inserted
• Multiplex Section Layer Adaptation to the high Order Path Layer: MSn/Sn_A
– MSn/Sn_A_Sk
AU-4 Pointer interpreter
SSF insertion (on LOP and AU-AIS detection)
PJE (Pointer Justification Event) count
– MSn/Sn_A_So
AUG assembly and byte interleaving
AU-4 Pointer generator
AU-AIS generator
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Path Layer
• High Order Path Overhead Monitoring Function (POM): Snm_TT
– Snm_TT_Sk
J1: Path Trace information is recovered.
G1[1-4]: The REI information is recovered.
G1[5-7]: Path Status monitoring detection --> G1[5] is used for HP-RDI
detection; G1[6 -7] is optionally used for HP-RDI coding enhancement.
C2: Signal Label Monitoring --> U EQ and VC -AIS detection.
B3: VC-4 BIP-8 Errored Block Count.
TSF insertion (on SSF or U EQ or TIM or AIS detection).
TSD insertion (on a condition of degraded signal detection).
• High Order Supervisory Unequipped Termination (HSUT) : Sns_TT
– Sns_TT_Sk
J1: Path Trace information is recovered.
G1[1-4]: The REI information is recovered.
G1[5]: Path Status monitoring detection --> G1[5] is used for HP-RDI detection;
G1[6 -7] is optionally used for HP-RDI coding enhancement.
C2: Signal Label Monitoring --> U EQ and VC-AIS detection.
B3: VC-4 BIP -8 Errored Block Count.
– Sns_TT_So
Generation of an unequipped container and frame offset.
C2: "unequipped" insertion.
J1: trail trace identifier is generated.
G1: insertion of RDI and/or REI information.
B3: VC-4 Bip -8 calculation and insertion.
• VC-4 Tandem Connection Trail Termination: SnD_TT
– SnD_TT_Sk
1[1-4]: VC-4 BIP-8 extraction and EDC calculation.
1[8][73]: RDI extraction.
1[5]: REI extraction.
1[7][74]: ODI extraction (Outgoing Defect Indication).
1[6]: OEI extraction (Outgoing Error Indication).
1[7-8]: extraction from the multiframed channel 1[7-8] of:
FAS (Frame Alignment Signal) in frames 1 to 8.

trace identifier in frames 9 to 72.
TC RDI and ODI in frames 73 to 76.
B3: BIP-8 compensation.

– SnD_TT_So
1[8][73]: RDI insertion.
1[5]: REI insertion.
1[7][74]: ODI insertion (Outgoing Defect Indication).
1[6]: OEI insertion (Outgoing Error Indication).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
1[7-8]: insertion in the multiframed channel 1[7 -8] of:

1[1-4]: BIP-8 calculation and insertion.

B3: BIP-8 compensation.
• VC-4 Tandem Connection Adaptation: SnD_A
– SnD_A_Sk
this function will restore the invalid Frame Start condition if that existed at the
ingress of the tandem connection.
AIS insertion.
– SnD_A_So
this function will replace the incoming Frame Start signal by a local generated one
if all-O Es VC is received.
• VC-4 Tandem Connection non-intrusive monitoring: SnDm_TT
– SnDm_TT_Sk
1[1-4]: VC-4 BIP-8 extraction and EDC calculation.
1[8][73]: RDI extraction.
1[5]: REI extraction.
1[7][74]: ODI extraction (Outgoing Defect Indication).
1[6]: OEI extraction (Outgoing Error Indication).
1[7-8]: extraction from the multiframed channel 1[7-8] of:

• Path Sub-layer protection function:

ote: The path sublayer is not only related to protection information management, but
also dedicated to the add/drop of particular POH bytes, without the need to regenerate
the path layer. This is achieved thanks to Daffodil framer, which allows POH insertion
with B3 compensation.
• Path Layer Adaptation to the Path Protection Sub-layer: Sn/SnP_A
– Sn/SnP_A_Sk
the K3 information (APS protocol) is recovered
SSD insertion (on TSD detection)
F2, F3: path user channel insertion
– Sn/SnP_A_So
generation of K3 information (APS protocol)
F2, F3: path user channel extraction
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Path Protection Sub-layer Termination: SnP_TT

– SnP_TT_Sk
SSF detection
TSF insertion (on SSF detection)
– SnP_TT_So
no information is inserted.
...................................................................................................................................................................................................................................
Matrix Board
...................................................................................................................................................................................................................................
Matrix Board
The matrix module provides switching capabilities with STS-1 minimum granularity,
achieving full SO ET/SDH compatibility. Both MSPC (Multiplex Section Protection
Connection) and HPC (Higher Order Path Connection) switching functions are integrated
in one single device.
The maximum switching capacity is equivalent to 12288x12288 at AU-3 level (i.e.
4096x4096 at AU-4 level), fully non blocking with respect to any broadcast type.
Matrix Physical Representation

The payload processing functionalities integrated in the matrix board are limited to AU-4
switching operations only. The corresponding functional model of the matrix board is
depicted in Figure 4-9, “Matrix board implementation: payload processing” (p. 4-35).
The statuses of MSPC and HPC connection functions are individually calculated, as if
they were two physical entities. The switching command is then derived correlating
MSPC status and HPC status.
Figure 4-9 Matrix board implementation: payload processing
MSPC connection function status is determined in order to provide protection for the
STM- signal against channel-associated failures within a multiplex section, by using the
bit-oriented protocol defined for the MSP bytes K1, K2 and optionally K0. Under failure
condition in Rx direction valid data are no longer taken from the working line termination
but from the spare one; the required switch operation for MSP protection does not involve
HPC. Similarly in Tx direction the MSPC status is such to guarantee data forking to both
working and spare lines.
...................................................................................................................................................................................................................................
Matrix Board
...................................................................................................................................................................................................................................
HPC connection function status is generated in order to provide VC-ns connectivity

among input and output ports. The assignment of incoming VC-ns to outgoing VC-ns is
defined as the "connection pattern" which can be described by a uni-directional
connection matrix and characterized by:
• Type of connection (unprotected, 1+1 protected by means of S CP/I, S CP/ ,
S CP/S protection or 1:n S CP by using the bit oriented protocol defined in K3
byte).
• Traffic direction (unidirectional, bi -directional).
• Input and output connection points.
...................................................................................................................................................................................................................................
Product description Controller Subsystem
Overview
...................................................................................................................................................................................................................................
Controller Subsystem
Overview
The controller subsystem implements the Synchronous Equipment Management Function
(SEMF) defined by ITU-T G.783 Rec. It communicates with external management
systems through a standard QB3 CMIP interface.The management information model is
based on the ITU-T G.774 series of recommendations. Communication with the local
Craft Terminal (CT) is also based on the same interface.
The controller subsystem is responsible for applying the configuration requested by the
element manager or CT and to report the status of the equipment as well as alarm and
performance information. It is also responsible to drive automatic protection switching.
The 1678 MCC has centralized control architecture, built upon a two-level model:
• First Level Controller (FLC) mainly for DCC networking, CT/OS interface and
database management;
• Second Level Controller (SLC) mainly for provisioning, alarm detection, performance
monitoring and protection switching.
Two microprocessors are dedicated respectively to the FLC and SLC functions.
The FLC processor is 1+1 protected (one is located on the FLCCO GI board, the other
on the FLCSERV board), like the Second Level Controller processors (located on the two
HO Matrix and Lower Order Matrix boards).They communicate through an internal ISSB
bus (ILA - Internal LA ).
The SLC processor interfaces directly through a backplane parallel bus (ISPB - Intra
Shelf Parallel Bus) all circuits (ASICs) implementing the SDH functions in the shelf, for
data collection (alarms, performance monitoring) and configuration provisioning
purposes.
A 60 GB hard disk located in the FLCCO GI board for the configuration database and
SW loads provides a mass storage board. It is protected by another 60 GB hard disk
located in the FLCSERV board.
A failure on the FLCCO GI or FLCSERV board has no impact on traffic, or on
automatic protection switching functions, which are managed by the SLC processor
inside the HO Matrix board.
Moreover a failure on the FLCCO GI or FLCSERV board has no impact on the node
availability in the etwork Management (supervision), thanks to the FLC duplication.
DCC Channels
The number of DCC channels depends on the installed FLC type. Two types of FLCs
exists:
• FLC with 33 MHz PCI clock frequency
• FLC with 66 MHz PCI clock frequency.
...................................................................................................................................................................................................................................
Overview
...................................................................................................................................................................................................................................
The following number of DCC channels per board and system are possible:
Table 4-3 Maximum number of DCC channels

FLC Type FLC 33 MHz FLC 66 MHz
DCC per Board 16 DCC-M + 16 DCC-R 16 DCC-M + 16 DCC-R
DCC per System 61 DCC-M + 16 DCC-R 95 DCC-M + 16 DCC-R
Selection of the STM-n ports and of the DCCM or DCCR channel is via Local CT or
etwork Manager ( M).
...................................................................................................................................................................................................................................
FLC and SLC Functions
...................................................................................................................................................................................................................................

In the 1678 MCC the control system is based on First Level Controller (FLC) and Second
Level Controller (SLC). Figure 4-10, “Physical LA Topology of Main shelf only
configuration” (p. 4-39) shows the control functionality of the 1678 MCC main shelf.
Figure 4-10 Physical LAN Topology of Main shelf only configuration
OS
GMPLS UNI GMPLS UNI

... ...
Neighbor ISP 1 Customer DCN Neighbor ISP 2
FLCSERV FLCCONGI
internal LAN switch internal LAN switch
DCR EM DCR EM
ISSB
SLC SLC
HO Matrix Copy A HO Matrix Copy B
1678MCC Main shelf
FLC Functions
The FLC functionalities are the following:
• provides the HW resources and SW functions required for the communication
between the E and the managing system (OS/CT);
• performs all the SW functions related to the control and management activities of the
"virtual" machine: info-model processing, event reporting and logging, equipment
database management, SW downloading and management; to support these activities
the FLC function requires a nonvolatile memory;
• system memory for FLC:
– Flash EPROM Boot bank (boot information)
– system RAM bank (application program and data)
– non-volatile mass-storage (database storage, SW program storage, event logging,
provisioning and maintenance data)
The board with the FLC, about the bootstrap function, can be classified as disk based: the
board bootstraps the software from the equipped Mass Storage memory on the board.
The software code resides (at least 2 copies per board) only on the Mass Storage.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The download must be done in two distinct contexts:

• initial: over CT on LA
• upgrade: M via DC
In the 1678 MCC E the First Level Controller functionality is performed on
FLCCO GI (main) and on FLCSERV (spare).
SLC Functions
The SLC functionalities are the following:
• control and management of the "real" machine; to perform this, SLC directly
interfaces the ASICs implementing functions for data collection and configuration
provisioning;
• system memory for SLC:
– Flash EPROM Boot bank (boot information)
– system RAM bank (application program and data)
The duplication of SLC functionalities is based on the following Scheme:
• one SLC is in active state and the other in stand-by state
• FLC provisions both SLCs with the same data and commands
• hardware (ASIC, FPGA) is controlled by the active SLC
FLC bootstraps the software application through a disk based protocol, while the SLC
through a etwork based protocol.
Control of OED Shelves and Lower Order Extension Shelf

The main shelf and the OED shelf/LO extension shelf are managed as a single E. The
control system located in the main shelf acts as the control system of the whole E. In
case of single rack configurations the OED shelf/LO extension shelf are connected over
internal LA switches. In case of multi rack configurations the OED shelf/LO extension
shelf are connected over external LA switches.
Single Rack Configurations
A system configuration consisting of the 1678 MCC Main shelf plus one OED shelf/LO
extension shelf in one rack has no need for an external LA switch.
The following Figures show system configurations consisting of only one rack:
• Main shelf plus 1670SM OED (Figure 4-11, “Physical LA Topology of Main shelf
with single 1670SM OED configuration” (p. 4-41))
• Main shelf plus 1662SMC OED (Figure 4-12, “Physical LA Topology of Main shelf
with single 1662SMC OED configuration” (p. 4-41))
• Main shelf plus LO extension shelf (Figure 4-13, “Physical LA Topology of Main
shelf with single LO extension shelf” (p. 4-42))
One single OED shelf/LO extension shelf can be connected directly to the internal LA
switch. This connection is provided on the FLC boards (labeled Q3 B).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-11 Physical LAN Topology of Main shelf with single 1670SM OED
configuration
OS
GMPLS UNI GMPLS UNI

... ...
FLCSERV FLCCONGI
DCR EM DCR EM
1678MCC Main shelf
CONGI A CONGI B
SC A SC B
OED 1670SM
Figure 4-12 Physical LAN Topology of Main shelf with single 1662SMC OED
configuration
OS
GMPLS UNI GMPLS UNI

... ...
FLCSERV FLCCONGI
DCR EM DCR EM
1678MCC Main shelf
CONGI A
SC A SC B
OED 1662SMC
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-13 Physical LAN Topology of Main shelf with single LO extension shelf
OS
GMPLS UNI GMPLS UNI

... ...
FLCSERV FLCCONGI
DCR EM DCR EM
1678MCC Main shelf
SC A SC B
LX160 A LX160 B
LO Extension Shelf
Multi Rack Configurations

For multirack configurations consisting of a 1678 MCC main rack and several OED racks
a pair of Ethernet LA switches are needed to interconnect the internal control plane.
The OED 1670SM and the LO extension shelf are connected via two LA connections to
both external LA switches (LSX). The 1662SMC used as a LO OED supports only one
LA interconnection. Therefore the 1662SMC is connected non-redundant to LA
switch LSX A or LSX B (all on one).
The following Figure 4-14, “Physical LA Topology of Multi Rack Setup” (p. 4-43)
shows the principle of multi rack system configurations with LO extension shelf, OED
1670SM and OED 1662SMC.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-14 Physical LAN Topology of Multi Rack Setup
OS
GMPLS UNI GMPLS UNI

... ...
FLCSERV FLCCONGI
DCR EM DCR EM
1678MCC Main shelf
extension LAN switch (LSX A) extension LAN switch (LSX B)
SC A SC B CONGI A CONGI B CONGI A
LX160 A LX160 B
EC A EC B
ISSB
SC A SC B
SC A SC B
SYNTH16 SYNTH16
LO Extension Shelf OED 1670SM
OED 1662SMC
...................................................................................................................................................................................................................................
External Communication and Routing
...................................................................................................................................................................................................................................

The purpose of the communication and routing domain is to define configuration
parameters concerning the communication protocols for the local E, the OS and each
other related E in order to provide global communication capabilities inside the
network.
Introduction
Protocol Stack
The set of protocols used in a communications network compose a protocol stack. Thus, a
protocol stack is a prescribed hierarchy of software layers. This layered structure also
allows to use different protocols to accommodate different network architectures. A
protocol stack resides in each client and server.
OSI Stack
An OSI protocol stack (short: OSI stack) is a protocol stack according to the ISO/OSI
standard for worldwide communications that defines a framework for implementing
protocols in seven layers. Control is passed from one layer to the next, starting at the
application layer in one network node, proceeding to the bottom layer, over the channel to
the next node and back up the hierarchy. For routing purposes only the first three layers of
the OSI protocol stack are relevant.
In an OSI network there are the following significant architectural entities (see Figure
4-15, “Example of a routing domain” (p. 4-45)):
• domain
A domain is any part of an OSI network that is under common administrative
authority.
• area
An area is a logical part of a domain formed by a set of adjacent routers and the data
links that connect them. Within any OSI domain, one or more areas can be defined.
All routers in the same area exchange information about all of the hosts that they can
reach.
The maximum number of Es per area depends on the E type. For 1678 MCC the
maximum number per area is 300.
• backbone
The areas are connected by a backbone. All routers on the backbone know how to
reach all areas.
• host
A host is a network node, router or network element ( E).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-15 Example of a routing domain
Routing Domain
L1 Area 1 Area 2
ES
L2
ES
L1
IS
L1
IS
L2 IS
L2 IS
Backbone
L1
IS
L2 IS
L1 L1
IS IS
Area 3
L1
IS
L1
IS
L1
ES
ES End System
IS Intermediate System
L1 Level 1
hosts/ routers/ NEs/ nodes L2 Level 2
OSI Stacks in the 1678 MCC

The 1678 MCC uses OSI stacks for communication and routing. Figure 4-16, “OSI
protocol stack (layer 1 - 3)” (p. 4-46)shows an example of an OSI protocol stack can be
configured. Since the 1678 MCC is used as a router only the first three layers of the OSI
protocol stack are shown.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The "Don't care" in layer 1 and 2 under IP in Figure 4-16, “OSI protocol stack (layer 1 -
3)” (p. 4-46)means that the layer 1 and 2 protocols under IP are not fixed, but any of the
protocols of the corresponding layer shown in the left blocks can be used.
The 1678 MCC provides a ready-to-use default OSI stack to which a standard local
Ethernet is assigned as physical layer. Ethernet is the most widely used local area network
(LA ) access method, defined by the IEEE as the 802.3 standard. In this handbook the
terms "LA " and "Ethernet" are used as synonyms.
Figure 4-16 OSI protocol stack (layer 1 - 3)
OSI Protocol Stack: layer 1 - 3
CLNS, CLNP: ISO 8880-3, 8473 / ITU Q.811

3
ES-IS: ISO 9542 IP
Network
IS-IS: ISO 10589
2 LLC class 1: ISO 8802-2/ ITU X.802.2 LAPD: ITU Q.921
Don t care
Data Link CSMA/CD: ISO 8802-2/ ITU X.802.2
1 Ethernet SDH DCC-R / DCC-M
Physical Don t care
D1- D3, D4 - D12
Multiple OSI Areas

You can create further OSI stacks to support multiple OSI Level 1 sub domains (short:
OSI areas). Multiple OSI area support means that different data communication channels
(DCC) or local area network (LA ) interfaces can be assigned to different OSI areas.
LAPD/DCC and In-Band Signalling
LAPD/DCC connections use in-band signalling, which means meta data and network
control information are transmitted in the SDH overhead bytes. etwork nodes connected
via LAPD/DCC build-up an in-band data communication network (DC ).
LAN and Out-Of-Band Signalling
Out-of-band signalling is the complement to in-band signalling, which means any
signalling where the meta data and network control information are not transmitted in the
SDH overhead bytes. etwork nodes connected via LA build-up an out-of-band DC .
Background
DCC channels and external LA s can be used for the following purposes in 1678 MCC:
• Communication between local and remote Es, and TM managers via Q3 or
QRFC1006
• Communication between CS-Server, and Equipment Provisioning and maintenance
applications via IP
• Communication between GMRE and ASO manager via CORBA
• Communication between GMREs via IP
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Use1678 MCC networks for interconnecting SDH networks from other vendors (DCC
transparency)
• Fast DCC link protection is needed for the dataplane signaling and routing protocols
running between neighboring GMREs
• IP-in-IP tunnels via the external LA s are used by GMRE as backup links for the
dataplane signaling and routing protocols
• IP-in-CL P tunnels are used to reach IP managed Es through OSI network islands
• To connect U I clients/client networks, GMRE configures VLA s on top of the
external LA to achieve traffic separation between DC traffic and client signaling
traffic
• The IS-IS protocol is used for the routing of OSI management traffic
• The OSPF protocol is used for the routing of IP management and signaling traffic
All GMRE related information is described in the 1678 MCC GMPLS/GMRE Guide.
DCC Transparency
The DCC transparency feature allows 1678 MCC networks to be used for interconnecting
SDH networks from other vendors. When DCC transparency is provisioned, the
back–office system of the other vendor is allowed to transfer its management traffic as
usual through DCC channels, even if the links carrying those DCC channels are
transported over the 1678 MCC network.
Any DCC from any STM– port can be routed to any other STM– port up to the
maximum number of possible DCC channels (see Table 4-3, “Maximum number of DCC
channels” (p. 4-38)).
DCC transparency can also be used on STM– ports managed by GMRE. More
precisely, GMRE is using all DCC–M channels not assigned to DCC transparency for its
in–band control plane traffic, while automatically excluding the ones assigned to DCC
transparency.
Limitations
• DCC transparency connection is provided on HDLC level. This implies that any type
of link layer protocol based on HDLC frames can be used.
• DCCs assigned to DCC transparency cannot be used for other purposes (e.g.
DCC/LAPD or DCC protection).
• The mapping of non–standard overhead bytes into DCC is not supported.
• DCC transparency is only supported in the 1678 Main Shelf.
• DCC transparency mapping is only supported for DCC–R to DCC–R and DCC–M to
DCC–M due to different channel capacities.
Multi OSI Area Management

The 1678 MCC provides the feature Multi OSI Area. The 1678 MCC can act as a transit
E and as a Gateway E (G E).
The principle of multi OSI areas
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
There are several OSI areas within a routing domain. Each area can include the following
systems:
• End System (ES)
• Intermediate Systems (IS).
The Intermediate Systems can be configured as Level 1 (L1) and Level 2 (L2)
systems.
Figure 4-15, “Example of a routing domain” (p. 4-45) shows an example for Multi OSI
Area Routing.
Two types of routing protocols exists:
• ES-IS
IS learns about directly connected ESs and vice versa
• IS-IS
L1 ISs learn topology of their own area
L2 ISs learn topology of complete L2 backbone (all areas).
Multiple Rings on 1678 MCC as Transit E
In this example the 1678 MCC is used as transit E (refer also to Figure 4-17, “Multiple
Rings on 1678 MCC as Transit E” (p. 4-49)). That means:
• One area per ring (or group of rings)
• All Es are Level 1 IS (L1)
( E assuming routing functionality inside an area)
• 1678 MCC runs one L1 osi_ll process per area
(osi_ll is equal to OSI stack)
• Q-Interface Adapter (QIA) connects to one osi_ll
• 1678 MCC is Gateway E (G E) for at most one area
• 1678 MCC is transit E for other areas.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-17 Multiple Rings on 1678 MCC as Transit NE
1678MCC
QIA
osi_ll#1 osi_ll#2 osi_ll#3

L1 L1 L1
L1
L1 L1 L1
L1
L1
A1 A2 A3
L1
L1 L1 L1
L1 L2
L1 L1
L2 L2
A1...A3 OSI Area 1...3

L1 Level 1 IS
L2 Level 2 IS
osi_ll OSI stack
QIA Q Interface Adapter
Multiple Rings on 1678 MCC as Gateway E

In this example the 1678 MCC is used as Gateway E (refer also to Figure 4-18,
“Multiple Rings on 1678 MCC as Gateway E” (p. 4-50)). That means:
• One area per ring (or group of rings)
• All Es are Level 1 IS (L1)
( E assuming routing functionality inside an area)
• 1678 MCC runs one L1 osi_ll process per area
(osi_ll is equal to OSI stack)
• Q-Interface Adapter (QIA) connects to one osi_ll
• 1678 MCC is Gateway E (G E) for all areas
• Each osi_ll is connected to multi-area IS-IS router via separate VLA .
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-18 Multiple Rings on 1678 MCC as Gateway NE
L1/L2
1678MCC
VLAN
QIA
osi_ll#1 osi_ll#2 osi_ll#3

L1 L1 L1
L1
L1 L1 L1
L1
L1
A1 A2 A3
L1
L1 L1 L1
L1
L1 L1
A1...A3 OSI Area 1...3

L1 Level 1 IS
L2 Level 2 IS
osi_ll OSI stack
QIA Q Interface Adapter
VLAN Virtual LAN
...................................................................................................................................................................................................................................
Product description Synchronization Subsystem
Synchronous equipment timing
...................................................................................................................................................................................................................................
Synchronization Subsystem

The synchronization subsystem is located on the matrix boards. As the SDH/SO ET
matrix is protected in 1+1 configuration, also the Clock Reference function is protected.
The synchronization subsystem provides the timing reference required by all components
in the network element. The subsystem performs the functionality identified by the ITU-T
recommendation G.781/G.783 as Synchronous Equipment Timing Source (SETS).
The SETS function is implemented in the SDH/SO ET HO Matrix board (MX640,
MX320, MX160) as shown in Figure 4-19, “SETS function” (p. 4-51).
Figure 4-19 SETS function
T4/T5
Selector Squelch Selector
A C
A to
FLCSERV /
Squelch FLCCONGI
B
from ports
T1/T2 3
Selector T0
2 SETG
T3/T6 B
from
FLCSERV /
FLCCONGI HO Matrix Board
OSC
SETS Function
The SETS accepts synchronization inputs from a number of sources:

• T0 is the reference signal for the internal system clock and system framing signal
• STM- traffic ports (T1)
T1 is the clock derived from an STM- signal (from STM- port)
• 2 Mbit/s traffic ports (T2)
T2 is a 2 Mbit/s signal (derived from a 2 Mbit/s framed signal - E1 port)
• 2 MHz (T3)
T3 is a 2 MHz signal (from FLCSERV / FLCCO GI board)
• 2 Mbit/s external input (T6)
• 1.544 Mbit/s external input (T6)
T6 is a 2 Mbit/s or 1.5 Mbit/s signal (from FLCSERV / FLCCO GI board without
data)
• Internal Oscillator.
Automatic selection of one of the above sources for system timing (T0) is performed by
selector B, using quality (Synchronization Status Message (SSM) algorithm) and priority
criteria. The quality criteria can be disabled. Also manual selection is possible.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The E clock reference is used as internal timing source and to time the outgoing STM-
signals.
Automatic selection of one of the above sources (except internal oscillator) performed by
selector A is used for external devices (T4/T5). This output is duplicated (1+1) on both
FLC boards to avoid single point of failure. It can be configured for 2 MHz (T4) or 2
Mbit/s (T5). Such outputs are not available, if 1.544 Mbit/s sources are used.
Up to three references (T1) may be selected among all STM- traffic ports in the system.
Two external inputs (2 MHz or 2 Mbit/s or 1.5 Mbit/s) are available. When configured as
2 Mbit/s, the external clock signals can carry the SSM information.
If the selected reference is 1.544 Mbit/s, then only selector B is available. In this case no
quality selection (SSM) is possible.
The Synchronous Equipment Timing Generation (SETG) function has three modes of
operation: locked, holdover and free running. In holdover mode, the SETG holds the
frequency of the last valid reference with a maximum drift of +/- 0.37-ppm per day. The
accuracy of the local oscillator is 4.6 ppm, according to ITU-T G.813.
In compliance to ITU-T G.781 - chapter 5.13.3 1678 MCC can be used in conjunction
with an external Synchronization Supply Unit (SSU). If the operator selects per operator
command, that an SSU is connected to the E, the external reference clock output
(T4/T5) is used as input for the external SSU. The output signal of the SSU is configured
as the timing source (T3 or T6) with the highest priority for selection of the timing source
for the internal synchronization. In cases where the SSU is not supporting SSM bytes,
according G.781 chapter 5.13.3.1 the operator should assign a quality using the
1678 MCC capability to set the SSM value of the T3/T6 clock input, which shall be sent
out within T0. For more details and for the configuration command, please refer to the
1678 MCC User Provisioning Guide.
Synchronization of Es, within the SDH/SO ET network, is necessary in order to
prevent pointer accumulation.
The timing can be provided by:
• A timing signal external to the E (T1, T2, T3, T6)
• An internal timing generator (OSC)
Master-slave synchronization of SDH/SO ET E uses a hierarchy of clocks in which
each level of the hierarchy is synchronized with reference to a next higher level.
The highest level is the Primary Reference Clock (PRC).
General structure of the SETS (refer to Figure 4-19, “SETS function” (p. 4-51)):
• The SDH Equipment Clock accepts synchronization inputs from a number of sources
(T1, T2, T3, T6)
• Automatic selection of one of these sources is achieved by selector A or B, using
quality (SSM algorithm) and priority criteria; also manual selection is possible; T0
(after a filtering operation by SETG block) is used like internal clock and to time the
outgoing SDH STM- signals;
(in case of T6=1.5 Mbit/s only selector B without quality criteria available)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• STM- /2 Mbit/s signals received at drop shelves (OEDs) can only be used for
internal timing at selector B, but not for the selector A.
• The clock signal T4 (2 MHz) or T5 (2 Mbit/s) is a possible source for an external
device.
T4 and T5 output can also be forced to T0 for testing purposes of the system clock.
ote: In order to prevent phase jumps, always use a Synchronization Supply Unit
(SSU) between output T4/T5 and input of an external equipment.
The SETG function filters the selected timing reference to ensure that the timing
requirements at the T0 reference point are met. Additionally the SETG function filters the
frequency changes caused by selecting a different reference source to achieve clock
switching without any traffic hit. It has three modes of operation:
• Locked mode: output signal controlled by the selected external timing reference;
• Holdover mode: SETG has lost its controlling external timing reference, and is using
stored data, acquired whilst in locked mode, to control its output; the internal
oscillator signal is phase corrected according to the stored data, and used as timing
reference by SETG in the holdover mode;
• Free run mode: it is not a normal operating mode. In this mode the clock has never
acquired lock with an external timing reference, or has not access to the stored data
acquired during previous lock state; the SETG output timing, in free run mode, is
locked to the internal oscillator.
In 1678 MCC both FLCSERV and FLCCO GI boards support one T3/T6 input signal
and one T4/T5 output signal. The T4/T5 output signal is the same for both boards.
ote: If an SSU is used, the SSU must be connected to the T3 input signal of the
FLCSERV board in slot 1 to avoid input signal detection problems.
The maximum number of STM- / 2 Mbit/s signals, incoming from STM- / E1 ports,
that can be used as timing reference (in the protection group) is equal to three. There is
not any restriction about the number of signals coming from each board.
...................................................................................................................................................................................................................................
Product description Protection Subsystem
Protection types
...................................................................................................................................................................................................................................
Protection types
The available types of protection supported in the 1678 MCC equipment are:
Equipment Protection (EPS)
For the description refer to “EPS Protection Main Shelf” (p. 4-56) and to “EPS Protection
1670SM Shelf” (p. 4-58).
Network protections
For the description refer to “ etwork Protections” (p. 4-64).
• MSP (Multiple Section linear trail Protection):
– 1+1 linear single-ended
– 1+1 linear dual-ended
– :1 ( max=14)
• S CP/I and S CP/
It is used on ring, linear and mesh network topology. Switching occurs on the path,
selecting (Rx side) the signal transmitted to both Tx A and Tx B (A and B are two
different directions) sides.
• Drop & Continue (dual node or collapsed).
It is an architecture to connect sub-networks, in order to improve traffic availability
with hardware resource reduction.
• MS-SPRing
The 1678 MCC supports the following MS-SPRing protection schemes:
– 2 Fiber at STM-16 interfaces
– 2 Fiber at STM-64 interfaces
MS-SPRing protection is supported only for sections not containing AU-3.
The main features of the 2 Fiber MS-SPRing are:
– D&C
– Programmable WTR
The 1678 MCC supports programmable WTR (Wait To Restore) time to recover
from the failure status; the allowed values are 1 – 15 min in steps of 1 min.
– Programmable Hold off Time
The Hold off Time for line switching is provisionable in the range of 0 - 10 sec
with the following steps: 0, 30ms, 50ms, 70ms, 100ms, 300ms, 500ms, 700ms, 1s,
3s, 5s, 10s.
ote: The 1678 MCC can support up to 28 2F MS-SPRing schemes at the same time
independent from the fact that they are at STM-16 and/or at STM-64 interfaces.
Centralized restoration
The 1678 MCC can automatically restore a path in a centralized meshed network, under
the 1354 P manager. The path is restored at VC-4/VC-4nc level.
The centralized restoration time is < 500 ms in worst case (fiber cut scenario).
...................................................................................................................................................................................................................................
Protection types
...................................................................................................................................................................................................................................
The First Level Controller function is redundant for maximizing the node availability. The
same node can manage together the meshed and ring network: the resources dedicated to
the restoration are managed by P, while the others are managed by RM.
Distributed restoration
The distributed restoration is one of the major benefits introduced with the GMPLS
control plane.
...................................................................................................................................................................................................................................
EPS Protection Main Shelf
...................................................................................................................................................................................................................................

The EPS protection is supported on the 1678 MCC equipment for the following boards:
• MX160/320/640GE board (redundancy of HO matrix, CRU and SLC)
• LAX20/LAX40 board
• FLCCO GI and FLCSERV boards (only for First Level Controller and GMRE
functions)
HO Matrix EPS
The positions of main and spare matrices are fixed (at start-up and in normal conditions):
• slot 10 : MX160/320/640GE main
• slot 11 : MX160/320/640GE spare
1+1 MATRIX + TIMIG EPS
The 1678 MCC architecture merges on the same board the Matrix and Timing, as well as
the SLC driving this circuitry and the peripheral logic of each service/traffic board
equipped in the shelf.
Every failure condition blocking the availability of one of these centralized functions
initiates the EPS switch algorithm, which affects simultaneously the three parts.
In case of switching due to operator commands (manual command), the Matrix + Timing
+ SLC switching mechanism is traffic hitless if the E is synchronized (in locked state),
if the E is in free-running or in Holdover condition the switching can cause some errors
on traffic.
This protection is not revertive.
External commands to control the switch position are:
• Manual to protection: to switch from protected (Main board) to protecting board
(Spare board).
This command is accepted if no failure is present on protecting board.
• Manual to protected: to switch from protecting board (Spare board) to protected one
(Main board).
This command is accepted if no failure is present on protected board.
• Lockout: the protection is locked, the traffic is managed by protected board
independently of its status, in failure or not in failure.
• Clear: release command which is active.
LO Matrix EPS
The positions of main and spare LAX boards are flexible as follow. LAX A and LAX B
have to be mounted always as pair (1+1 EPS) in the port slots (slot #2 to #9 or slot #12 to
#19).
The HO SLC controls the LAX20/40 like an I/O board that can be EPS protected with
another LAX20/40.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
ote: Any LAX20/40 switch leads to a transmission hit. In case of EPS, traffic will
be interrupted for <50 ms!
FLC EPS
The positions of main and spare First Level Controllers are fixed (at start-up and in
normal conditions):
• slot 20 : First Level Controller main (on FLCCO GI board)
• slot 1 : First Level Controller spare (on FLCSERV board)
The EPS is characterized by the parameters shows in the following Table 4-4, “EPS
Protection Scheme parameters” (p. 4-57).
Table 4-4 EPS Protection Scheme parameters

Parameter Values
Architecture type 1 +1
Switching type uni-directional (single-ended)
Operation type not revertive
WTR time not applicable
Switching time = 5 min
Signal switching condition equipment failure condition
Priority not applicable
...................................................................................................................................................................................................................................
EPS Protection 1670SM Shelf
...................................................................................................................................................................................................................................

EPS protection is applicable to the service boards and to the PDH/SDH traffic boards
with electrical interfaces. In the latter case the EPS is applied to the interface traffic board
only; the access module boards are part of the line and unprotected.
General characteristics of the EPS protection mode are:
• Switching criteria: board-missing, board-fail;
• Switching time: max 50 ms;
• Operation mode:1+1 EPS on matrix is always non-revertive, +1 EPS is always
revertive with fixed WTR = 5 minutes;
• External commands to control the switch position: Manual, Lockout, Clear.
Equipment modularity and implementation peculiarities will be case by case mentioned in
the description of the individual EPS protection.
For the EPS protection it is necessary to distinguish between:
• High Capacity Matrix board protection (refer to “Matrix Board Protection” (p. 4-58));
• High Speed port protection: 4 x STM-1 or 16 x STM-1 (refer to “High Speed (HS)
Port Protection” (p. 4-59)).
EPS protection will be characterized by the following parameters:
Parameters Values
1 + 1 EPS N + 1 EPS
Architecture type 1+1 +1
Switching type uni-directional (single-ended) uni-directional (single-ended)
Operation type not revertive revertive
1
WTR time not applicable supported but fixed to 5 min
Signal switching condition Equipment failure condition Equipment failure condition
Architecture type 1+1 +1
Notes:
1. The WTR cannot be used in case of release of operator commands.
Matrix Board Protection

The positions of main and spare matrices are fixed (at start-up and in normal conditions):
• slot 22 : HCMATRIX main
• slot 41 : HCMATRIX spare
1+1 MATRIX + TIMING EPS
The OMS architecture merges on the same board the Matrix and Timing, as well as the
SLC driving this circuitry and the peripheral logic of each service/traffic board equipped
in the shelf.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Every failure condition blocking the availability of one of these centralized functions
initiates the EPS switch algorithm, which affects simultaneously the three parts.
In case of switching due to operator commands ( manual command), the Matrix + Timing
+ SLC switching mechanism is traffic hitless if the E is synchronized (in locked state),
if the E is in free-running or in Holdover condition the switching can cause some errors
on traffic. This protection is not revertive.
• Manual to protection: to switch from protected (main board) to protecting board
(Spare board). This command is accepted if no failure is present on protecting board;
• Manual to protected: to switch from protecting board (Spare board) to protected one
(main board) This command is accepted if no failure is present on protected board;
independently of its status, in failure or not in failure;
High Speed (HS) Port Protection

In 1670SM equipment are available the following two EPS:
• 4 x STM-1 electrical
• 16 x STM-1 electrical
N+1 4 x STM-1 electrical EPS
The EPS is supported for the 4 x STM-1 electrical board (P4ES1 ) used in conjunction
with the 4 x STM-1 access module (A4ES1).
One or more +1 EPS protection groups can be configured (up to three).
The position of the spare board is flexible but in the corresponding access slot the
HPROT board has to be plugged in. The spare board has to be plugged at the left side of
the main ports; the main/spare ports have to be adjacent.
The scheme is revertive with fixed WTR= 5 min.
In 1670SM up to 15 main boards can be protected in EPS (15+1).
• Manual to protection: to switch from protected (main board) to protecting board
(Spare board); this command is accepted if no failure is present on protecting board;
• Lockout protection : the protection is locked, the no main board can be used
protection;
• Clear: release command, which is active.
N+1 16xSTM-1 electrical EPS
The EPS is supported for the 16STM-1 electrical/optical board (P16S1 ) used in
conjunction with the 16xSTM-1 electrical access module (A16ES1).
One or more +1 EPS protection can be configured (up to three).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The position of the spare board is flexible but in the corresponding access slot the
HPROT16 board has to be plugged in. The spare board has to be plugged at the left side
of the main ports; the main/spare ports have to be adjacent.
The scheme is revertive with fixed WTR= 5 min.
In 1670SM up to 15 main boards can be protected in EPS (15+1).
External commands to control the switch position are the same of +1 4xSTM-1
electrical EPS.
Here below are present more details referred to +1 4xSTM-1 electrical EPS.
As High Speed ports (HS) are intended 155 Mbit/s speed ports.
Up to 16 HS ports can be housed in the basic area.
For the electrical HS ports the corresponding access boards have to be put in the access
area with fixed relations.
More than one protection group +1 revertive can be created, depending on the
equipment configuration.
For each group +1 protected group the revertive mode is supported while the 1+1 EPS
can be only revertive.
The spare board position can be assigned in a flexible way.
The only constraints are the following:
• the access board corresponding to the protecting board must be an HPROT access
board
• the HPROT board has to be plugged at the left side of the access board group
(A4ES1)
• the main/spare ports have to be adjacent
• the protecting ports has to be plugged at the left side of the protected group of ports
(P4ES1 )
• the protecting/protected group of ports have to be of the same type.
ote that no protection is planned for the access board, and note also that the type of
protection can't be changed (i.e. it is not possible to change the protection scheme from
+1 to 1+1).
Manual Switch and force switch commands can be given via software by the user to
activate the spare boards.
Each access board is connected also with the previous one and with the next one; in this
way +1 protection is provided using HPROT board in last position at the left side of the
access boards pertaining to the protected port group.
Each electrical High Speed port (P4ES1 ) can manage up to 4 HS streams.
Input side (from the access module point of view)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The CMI encoded signal coming from the line and connected to the access board is RZ
decoded. The clock CK is extracted from the data. By means of the back panel
connections, RZ data and CK are forwarded to the pertaining main port and to the spare
port.
Moreover RZ data and Clock are sent to the next access board if present to perform +1
protection.
The spare port should not be devoted to a specific main port therefore a distributed switch
matrix (on every access board) is used to allows the signal to gain the spare port.
The command criteria for the distributed switch matrix comes from the matrix board via
serial interface.
Output side (from the access module point of view)
The signal, coming from Main and Spare ports via back panel connections, is coded into
CMI format.
The spare port is not devoted to a specific main port, therefore the signal transmitted from
the spare is distributed to all access boards involved in the protection scheme. The
connections are functionally point-to-multipoint but physically every access board
realizes a point-to-point connection towards the previous and the next access board using
a buffer to decouple and regenerate the signal.
Hardware failures types
The hardware failures causing automatic EPS protection switch can be grouped as:
• failures causing the internal equipment link loss as powering KO, Clock loss, board
missing (referred as LOS/LOF);
• failures causing traffic loss (the internal link is preserved) as for instance unlocked
oscillator, electrical interface defective and so on;
• failures not causing traffic loss nor internal link loss but causing loss of management
as ISBP failure or SPI failure.
Moreover some failures can cause equipment malfunctioning (as remote inventory fault,
laser degrade, loss of DC/DC synchronism).
These hardware faults are signalled to the management system and do not provokes an
automatic switch.
...................................................................................................................................................................................................................................
EPS Protection 1662SMC Shelf
...................................................................................................................................................................................................................................

The EPS protection is supported on the 1662SMC equipment for the following boards:
Equipment Boards Protection Scheme Number of Mode

protection
schemes
SY TH16 1+1 1 ot revertive
Low Speed ports: +1 ( max = 6) 1 Revertive
• 63x2Mbit/s
SYNTH16 Board Protection

The positions of main and spare SY TH16 are fixed:
• slot 6 : COMPACT ADM main
• slot 15 : COMPACT ADM spare
Low Speed (LS) Port Protection

As Low Speed ports (LS) are intended the 2 Mbit/s ports.
For the relation between LS ports and access boards refer to para “Configuration Rules”
(p. 3-127).
The positions of main and spare P63E1 are optional.
The P63E1 port can manage up to 63 x 2 Mbit/s ports. Sixty-three bidirectional links are
used for each connection between P63E1 port and A63E1 access board.
The main P63E1 ports are connected in a fixed way to A63E1 access boards using
point-to-point connections. The spare P63E1 port is connected to LSPROT board also
using point-to-point connections.
Under alarm condition, the signal transmitted and received from the main port is switched
towards the LSPROT board, and then connects to the spare port.
In the following a generic description of the access board is given:
Input side
Under normal operating condition, the signal received from the line is sent to the 63 x 2
Mbit/s Pertaining port board.
Under alarm condition, the signal received from the line is switched towards the LSPROT
board. The switching command SEL is received from the RIBUS I/F block.
A protection block is present to protect the incoming signal against spikes (G.703).
Output side
Under normal operating condition, the signal received from the main port is sent to the
line.
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Under alarm condition, the signal received from the spare port is switched towards the
LSPROT board and then sent to the line.
The SEL command, received from the RIBUS I/F block, select the signal to sent to the
line.
The LSPROT board is used to realize EPS protection for Low Speed ports. It realizes the
connection between the spare port board and LS protection bus if protection request.
The switches to select between main links and protection links are located on the access
boards and managed by the RIBUS block. The switch is activated in case of failure.
Hardware failures types
• failures causing the internal equipment link loss as powering KO, Clock loss, board
oscillator, electrical interface defective and so on;
as ISBP failure or SPI failure.
laser degrade, loss of DC/DC synchronism).
automatic switch.
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Network Protections
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Network Protections
Multiplex Section Protection (MSP)
Special features of the 1670 OED Shelf
STM- Linear Single-Ended 1+1 APS and STM- Linear Dual-Ended 1+1 APS are only
supported for optical interfaces (STM-1 and STM-4 optical)!
MSP 1: is supported for STM-1/4 optical and STM-1 electrical interfaces.
The following restrictions exist for the MSP 1: feature for electrical interfaces in the
1670 OED shelf:
• MSP 1: is only supported for A16ES1/P16S1 boards.
• o EPS allowed in case of MSP 1: protection
That means there is no support of a mixed configuration of MSP 1: and EPS within
a shelf. Also, if MSP is configured, no HPROT board can be provisioned.
• HW limits a mix of port numbers only in the group of ports 1..8 and the group of ports
9..16.
• The electrical interfaces of an OED cannot be in the same MSP group as optical
interfaces.
STM-N Linear Single-Ended 1+1 APS
The whole section is duplicated from the originating node for each direction of
transmission.
Tx side is permanently bridged. In Rx side the best signal is selected. As the scheme is
"unidirectional protection mode", the switch occurs only at the near-end where the failure
is detected and the K1/K2 messages are just devoted to carry info switch status to the
far-end.
This protection protects against Transmission failures (LOS, LOF, MS_AIS) or section
degradation (MS_SD or MS_EXBER) or HW failure which affects the traffic.
Only on-revertive mode is supported.
Protection takes place within 50 ms.
The implementation is compliant with the G.841 - 7.1 clause: MSP protocol compatible
with the 1: MSP operation.
Operator command are according G.841 and the following one are supported:
• Manual to protection: to switch from protected (Main resource) to protecting board
(Spare resource). This command is accepted if no failure is present on protecting
board.
• Manual to protected: to switch from protecting board (Spare resource) to protected
one (Main resource). This command is accepted if no failure is present on protected
board.
• Force to protection: to switch from protected (Main resource) to protecting board
board.
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Network Protections
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• Force to protected: to switch from protecting board (Spare resource) to protected one
(Main resource). This command is accepted if no failure is present on protected board.
• Exercise: not supported.
Refer to Figure 4-20, “MSP Linear 1+1 single and dual ended protection” (p. 4-66).
STM-N Linear Dual-Ended 1+1 APS
The whole section is duplicated from the originating node for each direction of
transmission.
Tx side is permanently bridged. In Rx side the best signal is selected, in bi-directional
operation mode the selector is moved only when the two sides agreed the operation; and
for this reason a side makes requests then waiting for acknowledgements of switch action
from other side by using the APS bytes.
This protection protects against Transmission failures (LOS, LOF, MS_AIS) or section
degradation (MS_SD or MS_EXBER) or HW failure which affects the traffic.
Only on-revertive mode is supported.
The implementation is compliant with the G.841 - 7.1 clause: MSP protocol compatible
board.
• Manual to protected: to switch from protecting board (Spare resource) to protected
one (Main resource). This command is accepted if no failure is present on protected
board.
board.
• Force to protected: to switch from protecting board (Spare resource) to protected one
(Main resource). This command is accepted if no failure is present on protected board.
Refer to Figure 4-20, “MSP Linear 1+1 single and dual ended protection” (p. 4-66).
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Figure 4-20 MSP Linear 1+1 single and dual ended protection
Single ended 1+1
1
MAIN MAIN
2
1
SPARE SPARE
2
a) Normal conditions
APS SWITCH
1
MAIN MAIN
2
MS RDI
1
SPARE SPARE
2
b) Unidirectional failure
Dual ended 1+1
1
MAIN MAIN
2
1
SPARE SPARE
2
APS
1 SWITCH
MAIN MAIN
2
APS
1
SPARE SPARE
SWITCH 2
b) Unidirectional failure
STM-N Linear dual-ended 1:N APS

1: ( =14 max.) linear protection without extra traffic is supported.
One section is used as spare resource to protect one of the main sections when in
failure.
The implementation is compliant with the G.841 - clause 7.1 MSP protocol compatible
Only revertive mode is supported. A WTR time beween 1 and 15 minutes can be
configured in steps of 1 minute. A Hold–off time between 0 and 10 seconds can be
configured.
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When the protection section is not in use, null signal is indicated on both sent K1 and K2
bytes.
The operation switch is bi-directional, which means that both Tx side and Rx side switch
will occur (using K1/K2 messages) in compliant with the G.841 protocol operations.
In this mechanism the priority can be assigned to the main resource so that in case of
double failure the high priority traffic is restored.
This protection protects against transmission failures (LOS, LOF, MS_AIS) or section
degradation (MS_SD or MS_EXBER) or hardware failure, which affects the traffic.
board.
board.
• Clear WTR: supported.
Refer to Figure 4-21, “MSP Linear 1: Dual-Ended protection” (p. 4-68).
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Figure 4-21 MSP Linear 1:N Dual-Ended protection

Dual ended 1:N without extra traffic
1 1
2 2
MAIN MAIN
1 1
2 #1 #1
2
1 1
2 2
MAIN MAIN
1 1
2 #N #N 2
SPARE SPARE
1 1
2 2
MAIN MAIN
1 1
#1 #1
2 2
Link failure
SWITCH SWITCH
1 1
2 2
MAIN MAIN
SWITCH 1 1 SWITCH
#N #N
2 2
SPARE SPARE
b) Failure conditions
SNCP (Sub-Network Connection Protection)

Refer to Figure 4-22, “Typical ring network with S CP” (p. 4-71) and Figure 4-23,
“Failure examples in S CP ring” (p. 4-72).
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Network Protections
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Subnetwork etwork Connection protection is a dedicated protection mechanism that can

be used to protect a path (e.g. that portion where two separate path segments are
available) or the full end-to-end path. It may be applied at any path layer in a layered
network.
Two types of S CP are possible:
• SCP/I (Inherent monitoring) that switches on SSF criteria (AU-AIS and AU-LOP);
• SCP/ ( on-intrusive monitoring) where POH is monitored by the POM enabled
before the matrix. The switches criteria are SSF and one or more of ExBER, TIM,
U EQ, SD; in this case the same selection must be made on each E of the ring.
S CP is employed on ring networks on which several equipments have been installed.
It can be also employed in Linear or Meshed network topology.
Two operating mode can be selected for single VC S CP:
• revertive (the signal is switched back into the working channel, after recovery of the
fault).
In the revertive operation the “Wait time to restore” (WTR) can be configured within
a range of 2 to 15 minutes for higher order cross–connections. For lower order
cross–connections the value is fixed to 5 minutes.
• not revertive
As illustrated in the example shown in Figure 4-22, “Typical ring network with S CP”
(p. 4-71) several equipment (numbered 1 to 5) are ring-connected on a looped path.
Each of the equipment on the node is bidirectionally connected (Side A and Side B). One
of the two directions represent the main path (clockwise). The opposite direction will
utilize a second fiber line for the spare traffic (counter clockwise).
The S CP automatic protection intervenes upon detecting path failure (SSF).
Each transmitting signal node is permanently connected (bridge) in the main traffic
direction (clockwise) and in the protected traffic direction(counter clockwise).
The Tx signal reaches destination through two different paths thus enabling the node
receiving it to select the best one (switch).
The switching decision can be taken at the E level (automatic switch) or at the OS level
(management switch). The forced switch and lockout command is supported.
The automatic switch is initiated upon detection of failure on the receiving end (sink
side). The following table resumes the protection scheme features for S CP/I and
S CP/ .
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Table 4-5 SNCP configuration

Protection Switching Switching Hold Off Wait to
mode
type Type Criteria time Restore time
HO:
SCP/I unidirectional/ AIS (SSF), 0–10.000ms revertive/not HO: 2–15min
(inherent) single ended AU–LOP (SSF) LO: 0, 10, 100 revertive LO: fixed 5min
or 1000ms
AU–AIS (SSF), HO:
SCP/ unidirectional/ AU–LOP (SSF), 0–10.000ms revertive/not HO: 2–15min
(non intrusive) single ended ExBER, TIM, LO: 0, 10, 100 revertive LO: fixed 5min
U EQ, SD or 1000ms
The Hold Off time (HOT) is the time between declaration of Signal Degrade or Signal
Fail, and the initialization of the protection switching algorithm.
The example of Figure 4-22, “Typical ring network with S CP” (p. 4-71) illustrates the
connection between two signals (T1 between nodes 2 and 5 and T2 between nodes 1 and
4) and relevant in/out nodes with associated pass-through.
Figure 4-23, “Failure examples in S CP ring” (p. 4-72) shows two examples of failures
and subsequent S CP switching mechanism.
A failure or degrade on the main path causes to switch over to the spare one.
When the receiving end switches no information is sent to the corresponding Tx side to
activate the switching operation at the remote end (Single ended switching operation).
To manage switching the S CP architecture utilizes the data inherent to the Path and not
to the Line. Switching is in fact activated by defective operations occurring at the VCn
levels (AU-AIS, AU-LOP, ExBER).
When the path is no longer available, an AIS signal is transmitted on the same path to
activate protection. In this manner S CP can protect the paths following cable
break-down or failures along the fiber and nodes. Cable break-down concerns all the
fibers it contains, hence it places traffic in both directions out-of-service, while a failure
concerns only one fiber.
The units are provided with a path switching circuit (bridge + switch). Its enabling
depends on the equipment configuration. With S CP each working path has a dedicated
protection path.
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Figure 4-22 Typical ring network with SNCP
Side B 3 Side A
T1, T2 Pass through
2 Side A Side B 4
BRIDGE
T2
T1
T2 Pass through T1 Pass through
T1 Drop/Ins Prot. T2 Drop/Ins Prot.
SWITCH Side B Side A

COUNTER
CLOCKWISE
1 CLOCKWISE
Side A 5
Side B
T1
T2 T1 Pass through T2 Pass through
T2 Drop/Ins Prot. T1 Drop/Ins Prot.
Side B
Side A
NOTES: On Craft Terminal, the following terminology is used:

Pass Through= Bidirectional Connection
Drop/Ins Prot.= Bidirectonal Protected Connection
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Network Protections
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Figure 4-23 Failure examples in SNCP ring
Case of cable break between nodes 2 and 3

Cable break 3 AU AIS on T1,T2
Switch on spare path

2 4 SSF
T1
T2
MAIN SPARE
1 Switch on spare path
5 SSF
T2
T1
Case of unidirectional failure between nodes 5 and 1
3
2 4
T1
T2
SSF
MAIN SPARE
1
5
T2
T1
SSF

Unidirectional failure
Drop and Continue

Refer to from Figure 4-24, “Drop and Continue D/C A I S A and D/C A I S B” (p. 4-74)
to Figure 4-26, “Drop and Continue - 1st and 2nd failure” (p. 4-76).
The Drop and Continue architecture has been implemented in the network to improve
traffic availability.
Drop and Continue is a way of protecting a path crossing a number of sub-networks, e.g.,
rings.
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Network Protections
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The sub-networks should be connected through at least two nodes (so realizing two
independent connections).
The equipment is configured as "DROP and CO TI UE" on each interconnection node.
The subnetworks' equipment implement the connection between two S CP rings.
The resulting architecture affords protection against multiple failures (evenly distributed
one per subnetwork) tolerated without traffic loss (node failure or single cable cut).
The Drop and Continue feature improves traffic availability as compared with the simple
"end-to-end S CP". More subnetworks are connected the further is availability increased.
The Drop and Continue features simultaneously realizes the following on one node:
• unidirectional pass-through
• protected drop
• insertion in one direction
The configurations achievable are:
• D/C-A I S-A (called " ormal" on Craft Terminal)
• D/C-A I S-B (called "Inverse" on Craft Terminal)
D/C stands for "Drop and Continue", the letter after it (A = line side" A") indicates the
"drop " side (e.g., "A" means "A main side", and consequently the spare side is the "B"
one).
The end letter (I S-B or I S-A) indicates the insert side.
ote: The letters "A" and "B" are not referred to a specific board or ports in a
physical slot of the subrack; "A" and "B" are used in the figures of this paragraph to
identify a Line direction.
The "Unidirectional pass-through" is always in the direction opposite to that of the
"insert" side (e.g., when "I S B" the pass-through is from B side to A side).
For further information refer to Figure 4-24, “Drop and Continue D/C A I S A and D/C A
I S B” (p. 4-74) which shows the D/C-A I S-A configuration (called " ormal" on CT)
and the D/C-A I S-B configuration (called "Inverse" on CT).
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Network Protections
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Figure 4-24 Drop and Continue D/C A INS A and D/C A INS B
The "Drop and Continue" featuring two connected S CP rings (with dual node
connection) is indicated in Figure 4-25, “Drop and Continue” (p. 4-75). It shows the
connection of a path signal between the two nodes 1 and 8.
The relevant path signal is:
• connected in Drop and Continue (D/C A - I S A) in nodes 3, 4, 6 and 10
• connected in pass-through in nodes 2, 5, 7, 9
• connected in drop/ins protection in nodes 1, 8
ote: The following terminology is used on Craft Terminal:
pass-through = Bidirectional connection

drop/ins protection = Bidirectional Protected connection
When in normal condition, the unidirectional way of traffic from 1 to 8 is supposed to be

1 → 2 → 3 → 6 → 7 → 8.
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Network Protections
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After a failure on the 1st ring between nodes 2 and 3 (refer to Figure 4-26, “Drop and
Continue - 1st and 2nd failure” (p. 4-76)), the link direction is: 1 → 5 → 4 → 3 → 6 → 7
→ 8, with a switch on node 3.
After a second failure on the 2nd ring between nodes 6 and 7 (refer to Figure 4-26, “Drop
and Continue - 1st and 2nd failure” (p. 4-76)) the selected direction on the link is: 1 → 5 →
4 → 10 → 9 → 8. The operative switch is on node 8 and the previous pass-through
between nodes 4 and 3 is no more used.
Figure 4-25 Drop and Continue
2 SNCP ring 5
D/CA INSA D/CB INS B
A Port 1 Port 2 B A Port 1 Port 2 B
INS
INS
A 3 4 B
Port 3 Port 3
Port 3 Port 3
6 10
INS
INS B
A
D/CA INSA D/CB INSB

7 SNCP ring 9
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Network Protections
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Figure 4-26 Drop and Continue - 1st and 2nd failure
2 SNCP ring 5
3 4
switched Drop & Continue

1st failure
6 10
SNCP ring
7 9
8
2 SNCP ring 5
3 4
Drop & Continue

2nd failure
6 10
SNCP ring
7 9
8
switched
Multiplex Section shared Protection Rings (MS-SPRING)

The following protection MS-SPRI G is supported:
• 2 fiber MS-SPRI G at STM-16
• 2 fiber MS-SPRI G at STM-64
The supported MS-SPRI G is compliant to the ITU-T Rec. G.841
The MS-SPRI G protection is realized in the MATRIX card.
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Network Protections
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A 2 fiber MS-SPRI G (Multiple Section-Shared Protection Ring) consist of a set of Es

each equipped with a two bidirectional port, one for the clockwise and the other for the
counter-clockwise. The MS-SPRI G is said "two fiber" because each pair of adjacent
Es is linked by two fibers, one for each direction.
The MS SPRI G protection is an alternative with respect to S CP. While MS SPRI G
allows the connection at the same time on the clockwise and on the counterclockwise
direction on the same AU4 that can be inserted and extracted in each span, on the contrary
the S CP connection engages the same AU4 on both sides for the whole link.
ote: In the following the 2F MS-SPRI G at STM-16 will be explained; the same
description can be applied to 2F MS-SPRI G at STM-64 taking into account that 64
AU- 4 are available and that the bandwidth is divided into two halves of equal
capacity called respectively "working" (AU4#1 to AU4#32) and "protection" capacity
(AU4#33 to AU4#64).
2 fiber MS-SPRING at STM-16 level
The bandwidth of a 2F MS-SPRI G is divided into two halves of equal capacity called
respectively "working" (AU4#1 to AU4#8) and "protection" capacity (AU4#9 to
AU4#16). The AU4#1 is protected by AU4#9 up to AU4#8 that is protected by the
AU4#16. The "working " capacity is used to carry the "high priority traffic", while the
"protection" capacity can be used for "low priority" traffic that is lost in case of failure.
Refer to Figure 4-27, “2F MS SPRI G Connection” (p. 4-77).
The MS SPRI G algorithm starts as a consequence of the following section alarms:
• LOS, LOF, MS AIS, EXBER (B2), SIG AL DEGRADE (B2)
Figure 4-27 2F MS SPRING Connection
PORT
B A B A
A 1 2 3 B
6 5 4 A
B
A B A B
WORKING CHANNELS (AU4#1 TO AU4#8)

PORT
PROTECTION CHANNELS (AU4#9 TO AU4#16)
APS in 2-fiber MS-SPRIG

In case of fibre break the APS for 2F MS-SPRI G uses a synchronized sequence of
"bridge" and "switch" operations that modify the internal connections of the two Es
adjacent to the failure and permits the "high priority" traffic to be restored.
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Network Protections
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Only the Es adjacent to the failure are interested to the "switch" and "bridge" functions
while for all other Es the final configuration is a "pass through" of all "protection" (low
priority) AU4s.
Figure 4-28, “Effect of a BRIDGE "B side" operation” (p. 4-79) and Figure 4-29, “Effect
of a BRIDGE "A side" operation” (p. 4-79), Figure 4-30, “Effect of SWITCH "B side"
operation” (p. 4-80) and Figure 4-31, “Effect of SWITCH "A side" operation” (p. 4-80)
highlight how the connections are modified as a consequence of a "bridge " or a "switch"
operation.
The Bridge operation is performed on the Tx side while the Switch is performed on the
Rx side.
• The "Bridge" operation on the B side has the effect of routing the outgoing "high
priority" A traffic to the outgoing "protection" B capacity.
The Bridge function adds a connection on the opposite side and on the relevant AU
protection.
• When a "Switch" operation is working on the B side all the connections having an
AU4 belonging to the A working capacity as a source, are replaced by connections
having the incoming B protection traffic as a source. The signals maintain the same
end point connection.
The Switch function replaces the incoming flow with a protection one, coming form
the opposite side.
In the same way:
• The "Bridge" operation on the A side has the effect of routing the outgoing "high
priority" B traffic to the outgoing "protection" A capacity.
The Bridge function adds a connection on the opposite side and on the relevant AU
protection.
• When a "Switch" operation is working on the A side all the connections having an
AU4 belonging to the B working capacity as a source, are replaced by connections
having the incoming A protection traffic as a source. The signals maintain the same
end point connection.
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Network Protections
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Figure 4-28 Effect of a BRIDGE "B side" operation
A B A B
A B A B
protection
working
BEFORE AFTER
Figure 4-29 Effect of a BRIDGE "A side" operation
A B A B
A B A B
protection
working
BEFORE AFTER
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Network Protections
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Figure 4-30 Effect of SWITCH "B side" operation
A B A B
A B A B
protection
BEFORE working AFTER
Figure 4-31 Effect of SWITCH "A side" operation
A B A B
A B A B
protection
BEFORE working AFTER
Figure 4-32, “Line break recovering operations” (p. 4-81) depicts the final effect of
Bridge and Switch synchronized steps for traffic restoration in a network with one fault.
They are carried out via a protocol that uses the K1 and K2 bytes. The failed span is
replaced by the protection traffic of the span not affected by the failure.
The K1 and K2 are exchanged between the ode that are adjacent to the failure, instead
the other odes put K1 and K2 in passthrough.
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Network Protections
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Figure 4-32 Line break recovering operations

SWITCH BRIDGE
side A side A SWITCH
PROTECTED BRIDGE
SIGNAL side B
side B
B A B A
A 1 2 3 B
6 5 4
B A
(*) (*)
A B A B
WORKING CHANNELS
PROTECTION CHANNELS PROTECTED

SIGNAL
BRIDGE
SWITCH
(*) All protection AU4 are put in Pass through in the 5th and 6th NEs
An example of 2F MS-SPRI G is reported in Figure 4-33, “2F MS-SPRI G example of

operation” (p. 4-83).
In the example a ring of four nodes is protected with 2F MS-SPRI G
AU4-1 carries the traffic of the span : C-B, B-A, A-D, D-C
AU4-2 carries the traffic of the span D-B (pass-through in C)
AU4-9 protects AU4-1.
AU4-10 protects AU4-2.
After a failure in the section C-B, the following actions are performed on:
• node B : Streams access 1 and 2, previously drop-inserted on AU4-1 and AU4-2
"side A", are switched respectively on AU4-9 and AU4- 10 "side B".
In this way, C is reached through nodes A and D.
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Network Protections
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• node C: Stream access 1, previously drop-inserted on AU4.1 "side B", is switched on

AU4-9 "side A".
In this way, B is reached through nodes D and A.

Rx AU4-2 "side A", previously in pass-through on Tx AU4-2 "side B", is
looped on Tx AU4-10 "side A". In this way, B is reached through nodes
D-A (signal transmitted D to B).
Rx AU4-2 "side B" is no more received.
So, Rx AU4-10 "side A" is looped on the Tx AU4-2 "side A".
In this way, the signal transmitted by node B follows the path :
A-D- C and here is looped to reaches node D again.
• nodes A and D do not switch

We can obtain from the example that is possible bandwidth re-used for some traffic
patterns (AU4-9 protects four connection on AU4-1) having the same protection for some
several connections (shared protection).
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Network Protections
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Figure 4-33 2F MS-SPRING example of operation
A
D A . AU4 1 A B : AU4 1
AU4.9 Prot. AU4.1
AU4.10 Prot. AU4.2
D B
C
D C : AU4 1 C B : AU4 1
D B : AU4 2
side B
D B
side A
side A side B
C B
side A side B side A side B

AU4 AU4 AU4 AU4
1 1 1 1
2 2 2 2
9 9 9 9
10 10 10 10
1 1 1 1
2 2 2 2
9 9 9 9
10 10 10 10
1 1 2
SQUELCHIG FUCTIO
The squelching function is activated when a node that carries Drop/Insert streams,
remains isolated because of a double failure.
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In this case to avoid misconnections on the AU4 involved in MS SPRI G protection, an

AIS signal will be inserted on Low Priority streams transmitted from the nodes adjacent
to the isolated one. See Figure 4-34, “Squelching on isolated ode connection” (p. 4-84)
Before ode 2 isolation because of the double failure, the following connections were
active using the AU4#1
• Stream between Port 3 and Port 1
• Stream between Port 2 and Port 4
After a second failure, the odes adjacent to the isolated ode 2 send AIS on the Low
Priority traffic (AU4#9) by means of the Squelching function thus avoiding the
misconnection between Port 3 and Port 4.
If the squelching function were not active, the MS SPRI G algorithm would activate the
Bridge and Switch functions on the nodes adjacent to ode 2 thus misconnecting Port 3
and Port 4 using AU4#9 as protection. In virtue of squelching function the nodes adjacent
to isolated ode 2 send AIS on Low Priority AU4#9 avoiding in this way the
misconnection between Port 3 and Port 4 in this case.
After the failure has been removed, a similar reverse sequence of operations on the Es
adjacent to the recovered span will be activated. The reverse procedure can start after a
step programmable WTR.
Figure 4-34 Squelching on isolated Node connection
PORT 3 PORT 1 PORT 2 PORT 4
AU4 #1 AU4 #1 AU4 #1 AU4 #1

B A B A
BRIDGE SWITCH
side A side B
1 SWITCH
2 3
side A BRIDGE
side B
(SF/SD) (SF/SD) B
A
AIS ON AIS ON
AU4 # 9 AU4# 9
5 4
B
A
AIS ON AIS ON AIS ON
AU4 # 9 AU4 # 9 AU4 # 9
PASS THR OUGH PASS THR OUGH PASS THR OUGH
6
A B A B
WORKING CHANNELS
PROTECTION CHANNELS
MS - SPRIG Interworking
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
When a 2f MS-SPRIG is interconnected with another ring (either S CP/I or

MS-SPRI G), the interconnection of the two is performed by connecting two nodes per
ring with HVC connections, as shown in Figure 4-35, “MS SPRI G Drop and Continue,
Insert Continues (protected)” (p. 4-86).
Each VC4 that has to cross the ring boundary (only HVC level ring interconnections are
considered here) must be output by two nodes, one of which, the Primary Service ode
(PS ) drops it and continues to the Secondary Service ode (SS ). In the opposite
direction, the SS inserts a copy of the VC4 into the ring and the PS selects by means
the Primary ode Service Selector function, between the VC4 coming from the SS and
the VC4 that can be locally inserted by means an STM-1 Tributary. The selection is made
on the Path-AIS basis (AU-AIS).
The protection mechanism works on the hypothesis that the other ring selects one of the
two versions of the incoming VC4 and transmits two identical copies of the VC4 towards
the PS and the SS (this is guaranteed if the other ring is an MS-SPRI G or an S CP
ring).
ote that the PS and the SS need not to be adjacent and need not to be the same for all
of the VC4 that cross the ring boundary: i.e. each crossing VC4 has two associated nodes
that act as PS and SS .
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
Figure 4-35 MS SPRING Drop and Continue, Insert Continues (protected)
2F MS S PRING
side A
side B
side B side A
Secondary
SS Service
Node
Primary
Service
side A side B side A side B
Node
SNCP or MS SPRING
SS = Service Selector
Collapsed Dual Node Ring Interconnection

Refer to Figure 4-36, “Collapsed dual node interconnection” (p. 4-88) and Figure 4-37,
“Collapsed dual node interconnection - 1st and 2nd failure” (p. 4-89).
The "Collapsed dual node ring interconnection" is a way of protecting a path crossing a
number of sub-networks, e.g., rings.
The sub-networks should be connected through at least two nodes (so realizing two
independent connections).
Respect to the configuration shown in Figure 4-25, “Drop and Continue” (p. 4-75) ("Drop
and Continue"), "Collapsed dual node interconnection" allows a hardware reduction,
since an OMS contains several ports and a path signal can be connected in protected
mode, from a generic pot to another one, on the same equipment.
The subnetworks' equipment implement the S CP connection.
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
The resulting architecture affords protection against multiple failures (evenly distributed
one per subnetwork) tolerated without traffic loss (node failure or single cable cut).
The "Collapsed dual node ring interconnection" featuring two connected rings (with dual
connection) is indicated in Figure 4-36, “Collapsed dual node interconnection” (p. 4-88).
S CP protection is enabled throughout the equipment. When in normal condition, the
unidirectional way of traffic from 1 to 8 is supposed to be 1 → 2 → 3 → 6 → 8.
After a failure on the 1st ring between nodes 2 and 3 (refer to Figure 4-37, “Collapsed
dual node interconnection - 1st and 2nd failure” (p. 4-89)), the link direction is: 1 → 5 → 4
→ 3 → 6 → 8.
Pass-through is used between nodes 4 and 3, and switch on node 3.
After a second failure on the 2nd ring between nodes 3 and 6 (refer to Figure 4-37,
“Collapsed dual node interconnection - 1st and 2nd failure” (p. 4-89)) the selected direction
on the link is: 1 → 5 → 4 → 7 → 8.
The operative switch is on node 8 and the previous pass-through between nodes 4 and 3 is
no more used.
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
Figure 4-36 Collapsed dual node interconnection
2 SNCP ring 5
3 4
Port 3 Port 4 Port 3 Port 4
C D C D
6 SNCP ring 7
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
Figure 4-37 Collapsed dual node interconnection - 1st and 2nd failure
2 5
SNCP ring
switched 3 4 Collapsed dual node interconnection

1st failure
SNCP ring
6 7
8
2 5
SNCP ring
Collapsed dual node interconnection

3 4
2nd failure
SNCP ring
6 7
8
switched
Collapsed Single Node Ring Interconnection

Refer to from Figure 4-38, “Collapsed single node ring interconnection” (p. 4-90) to
Figure 4-40, “Collapsed single node ring interconnection -2nd failure” (p. 4-92).
The "Collapsed single node ring interconnection" is a way of protecting a path crossing a
number of sub-networks, e.g., rings.
Respect to the configuration shown in Figure 4-25, “Drop and Continue” (p. 4-75) ("Drop
and Continue"), "Collapsed single node ring interconnection" allows the best hardware
reduction; as a matter of fact four nodes are collapsed in one node.
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
The protection operating mode is similar to that described for the "Collapsed dual node
ring interconnection" (refer to “Collapsed Dual ode Ring Interconnection” (p. 4-86)).
Figure 4-38 Collapsed single node ring interconnection
SNCP ring
2 4
Port 1 Port 2
Port 3 Port 4
5 7
SNCP ring
...................................................................................................................................................................................................................................
Network Protections
...................................................................................................................................................................................................................................
Figure 4-39 Collapsed single node ring interconnection -1st failure
2 SNCP ring 4
Port 1 Port 2
switched
3
Port 3 Port 4
5 SNCP ring 7
...................................................................................................................................................................................................................................
Product description Network Protections
...................................................................................................................................................................................................................................
Figure 4-40 Collapsed single node ring interconnection -2nd failure
SNCP ring
2 4
Port 1 Port 2
Port 3 Port 4
5 7
SNCP ring
switched
...................................................................................................................................................................................................................................
Product description Performance Monitoring Subsystem
Overview
...................................................................................................................................................................................................................................
Performance Monitoring Subsystem
Overview
The Performance Monitoring process consists of three different steps:
• performance monitoring primitives processing: it is performed by atomic functions
(termination functions) and provides the EBC (Errored Block Count) and DS (Defect
Second) defect indications;
• performance monitoring event processing: provides the following performance events:
– ES (Errored Second): one second period in which DS is set or there is at least one
errored block;
– SES (Severely Errored Second) one second period in which DS is set or the EBC
is greater or equal to Y% of the blocks in this second (Y=30 for the path);
– BBE (Background Block Errors) is the count of EBC events in one second not
SES;
• performance monitoring Data collection & History processing: for each event, a count
is performed on a defined period (15 min or 24 h); the results of these counts are
stored in performance registers (current and historical registers).
If at least 10 consecutive seconds are SES, the period is said Unavailable Time (UAT)
period.
In this time the events count is inhibited. During unavailable time, each second is counted
as optional UAS event.
The Performance Monitoring Process is performed for two different purposes:
• Maintenance:
– the monitoring is applied on the path or section layer
– events are counted (in the available period) by 15 min and 24 h counters
– trail is monitored in the two different directions independently (unidirectional
counters)
– it is used a degradation monitoring by threshold crossing
• Quality of Service:
– the monitoring is applied only on the path layer
– events are counted (in the available period) only by 24 h counters
– trail is monitored at the same time in the two different directions (bidirectional
counters)
– it is not used a degradation monitoring by threshold crossing
Types of counters are the following:
• Errored Second (ES)
• Severely Errored Second (SES)
• Background Block Error (BBE)
...................................................................................................................................................................................................................................
Overview
...................................................................................................................................................................................................................................
• Unavailable Second (UAS)

• Elapsed time
• AU Pointer Justification Event (PJE)
The 1678 MCC supports the suspect interval flag.
Ethernet performance monitoring is supported on
• 1GbE cards and on 10GbE cards for EPL
• 10GbE cards for EVPL.
Improvement of the Transmission Control Protocol (TCP) throughput for EVPL on 10GE
cards is achieved by
• Active Queue Management which describes a Random Early Discard (RED)
mechanism on intermediate routers
• Increased buffer handling.
For more details about the list of PM counters supported for each 1678 MCC board refer
to the 1678 MCC User Provisioning Guide.
...................................................................................................................................................................................................................................
Monitoring Functions
...................................................................................................................................................................................................................................
Monitoring Functions
Paths are often responsible of the end-to-end customer service, so they can be requested
to provide monitoring for Quality of Service purposes and, in addition, to cooperate with
specific monitoring to the network Maintenance applications.
The 1678 MCC equipment has the full set of Alcatel-Lucent OMS Performance
Monitoring capabilities, physically performed in the Matrix (HO &LO) and in the ports.
PM data collection can be individually activated on the LO-VC trail termination or on the
HO-VC trail termination of the structured VC4 afterwards groomed at LO-VC level.
PM processing is performed according to the standard G.784 recommendation: BBE, ES,
SES and UAS counters are collected.
E-PM (near-end) monitoring on the incoming signal checks the BIP code violations
using the B3 byte (VC4, VC3) or the bits 1-2 of the V5 byte (VC12); in addition the VCn
termination can provide FE-PM (far-end) monitoring by REI&RDI information of G1
byte (VC4, VC3) or the V5 byte (VC12) processing.
On the same bi-directional VCn-TTP, the unidirectional PM collection for Maintenance
application and bi-directional collection for Quality of Service can simultaneously be
activated.
In addiction the 1678 MCC equipment performs the following monitoring functions:
• HTCT (Higher Order Tandem Connection Termination) which terminates the 1 byte
for locally terminated VC-4's.
• HTCM (Higher Order Tandem Connection Monitoring) which performs the
monitoring of the 1 byte for non-terminated VC-4's.
• HSUT (Higher Order Supervisory Unequipped Termination) which performs the trail
termination and monitoring functions of unequipped VC-4's by terminating and
monitoring the path overhead bytes (J1, G1, C2 and B3).
• HPOM (Higher Order Path Overhead Monitoring) which performs the non-intrusive
monitoring of the path overhead bytes (J1, G1, C2 and B3) for non-terminated VC-4's.
• LPOM (Lower Order Path Overhead Monitoring) that performs the non-intrusive
monitoring of the path overhead bytes before matrix.
...................................................................................................................................................................................................................................
Product description External Interfaces Subsystem
List of external interfaces
...................................................................................................................................................................................................................................
External Interfaces Subsystem

The following Table 4-6, “External Interfaces” (p. 4-96) summarizes the external
interfaces of FLCSERV, FLCCO GI, MX160/320/640 and LAX20/40 boards.
Table 4-6 External Interfaces

Number of Logicalinterfaces Physical connector
interfaces
FLCSERV/A board
2 Q3 8 pin RJ45 (for each Q3 interface)
1 F 8 pin RJ45
1 F USB mini-B
currently not supported!
2 2 MHz - 2 Mbit/s external Sub-D 9 pin female
output synchronization signal
2 2 Mbit/s AUX G.703 25 pin SCSI + 4 coaxial
2 64 Kbit/s AUX G.703 (2 input and 2 output)
2 V.11 - 64 Kbit/s currently not supported!
2 V.24 - 9600 bit/s
1 phone jack RJ11
1 phonic extension tripolar jack female
1 debug RJ45
FLCCOGI board
2 Q3 8 pin RJ45 (for each Q3 interface)
1 F 8 pin RJ45
1 F USB mini-B
8 HouseKeeping Input 2 sub-D 15 pin female
4 HouseKeeping Output
7 Remote Alarms
5 Rack Alarms Sub-D 9 pin male
1 debug RJ45
MX160, MX320 (GA), MX640(GA) LAX20, LAX40, LAC40 board
...................................................................................................................................................................................................................................
Product description External Interfaces Subsystem
...................................................................................................................................................................................................................................
Table 4-6 External Interfaces (continued)

Number of Logicalinterfaces Physical connector
interfaces
1 debug RJ45
For more details about Housekeeping management refer to the 1678 MCC User
Provisioning Guide.
...................................................................................................................................................................................................................................
Product description Power Supply Subsystem
General power information
...................................................................................................................................................................................................................................
Power Supply Subsystem
General power information

The architecture of the power subsystem is distributed.
The input battery power:
• -48 V (-40.5 V to -57 V) or
• -60 V (-50 V to -72 V)
is delivered without level translation to all boards in the shelf.
When two inputs are used (Battery A and Battery B) the highest voltage is selected.
Each board has an on-board DC/DC converter, which generates the required voltage.
Distribution of power supplies inherently provides protection against single converter
failures.
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
1678 MCC Main Shelf

New Generation Top Rack Unit (NGTRU)
The 1678 MCC Rack is generally equipped with the ew Generation Top Rack Unit
( GTRU) where are also located the rack lamps. The GTRU is connected to a separate
so called service power supply "VSERV" needed for the "Rack Lamp Alarm" board and
dedicated shelf alarming boards. The station power supplies are terminated into the
GTRU. The GTRU performs the following functions:
• Delivers up to 6 Step-Up converter in the housed assemblies or up to 6 circuit breaker
(bypass modules)
• Delivers the service battery (VSERV) to the housed assemblies
• Sums up the alarms received from the shelves thus generating optical indications and
transmitting remote alarms towards an external target.
• Connects the assemblies (up to 3) to the supervisory network through connectors
situated into the GTRU
• Provides up to 4 individual alarms per step up converter
There exist two types of modules using in the GTRU:
• The Step-Up converter
DC/DC converter with a constant output voltage of -65 V ± 2 V
• The Bypass Battery module
Circuit Breaker
The GTRU can house up to six step-up converter or bypass modules. Any mix of these
parts is allowed, but always as pair. That means branch A and branch B of the same shelf
has to be fused with two step-up converters or two bypass modules.
The circuit-breaker unit is part of the bypass module and is taken if the output voltage is
equal to the input voltage. In any case if the shelf consumption is more than 20 A (for
UBattmin = -40.5 V) the Step-Up converter will be used instead of a circuit breaker. In this
case the constant output voltage of -65 V limits the max. current (Imax).
Power Distribution
2-wire and 3-wire Functional Protection Earth (FPE) can be installed. Figure 4-42,
“1678 MCC Power Supply with 3-wire FPE” (p. 4-101) shows the 1678 MCC power
distribution with 3-wire FPE and Figure 4-43, “1678 MCC Power Supply with 2-wire
FPE” (p. 4-102) shows the 1678 MCC power distribution with 2-wire FPE.
ote: The delivery state of the step-up converters is 2-wire. A jumper is located on the
rear panel of the step-up converter (refer to Figure 4-41, “Step-up Converter -
Location of Jumper” (p. 4-100)). In case of 3-wire systems the jumper have to be
removed!
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
Figure 4-41 Step-up Converter - Location of Jumper
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
Figure 4-42 1678 MCC Power Supply with 3-wire FPE
2 Batt. ret.
Top access 2 Batt. ret.
a 1 Batt. ret. is not
+a
b shown
+b Bottom access
FPE/
GNDM
NGTRU
a+a +b b
NGTRU
GNDM
Rack
Rack
1 Batt. ret.
Top access
a
+
b
FPE/
GND M
FPE
a+a +b b a
+a
NGTRU
GNDM b
+b
Rack FPE/
3-wire FPE GNDM
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
Figure 4-43 1678 MCC Power Supply with 2-wire FPE
Top access
a bottom access
b
+/FPE/
GNDM
FPE
a +a +b b NGTRU
NGTRU
GNDM
Top access Rack
Rack
a
+a/FPE/GNDM
b
+b/FPE/GNDM
FPE
a +a +b b Rack
NGTRU
GNDM FPE
a
b
+/FPE/
GNDM
2-wire FPE
The distribution of the ew Generation Top Rack Unit ( GTRU) battery voltage (65V)
and the distribution of the Service Battery voltage (3.6V) inside 1678 MCC equipment
are illustrated at high level in Figure 4-44, “Power distribution” (p. 4-103).
The Power Supply Filter (PSF) board get the power from the GTRU and distributes the
power to all boards inside the main shelf.
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
Figure 4-44 Power distribution
...................................................................................................................................................................................................................................
OEDs
...................................................................................................................................................................................................................................
OEDs
Top Rack Unit (TRU)
The OED Rack is generally equipped with the Top Rack Unit (TRU) where are also
located the rack lamps. The TRU is connected to a separate so called service power
supply "VSERV" needed for the "Rack Lamp Alarm" board and dedicated shelf alarming
boards. The TRU performs the following functions:
• Delivers up to 12 circuit breakers (bypass modules)
• Delivers the service battery (VSERV) to the housed assemblies
• Sums up the alarms received from the shelves thus generating optical indications and
transmitting remote alarms towards an external target.
• Connects the assemblies (up to 6) to the supervisory network through connectors
situated into the TRU
The TRU has been designed to distribute the Power supply voltage (A and B). All the
outputs are protected by circuit-breakers (1 to 12) having a max. of 30 A capacity. The
total load amount must not exceed 60 A for each battery. Should circuit-breakers having a
capacity higher than 20 A, they have to be spaced as most as possible inside the box to
reduce over-temperature. If only one station battery is available, it is possible to connect
both Power blocks together thus utilizing a distributor with a max. of 12 outputs .The
whole current capacity must not exceed 60 A.
Power Distribution in the OEDs

Two separated power branches (branch A and branch B) supply the converters. Branch A
and branch B may be connected to two different sources or to a common source.
Two circuit breaker blocks, one for each branch, are located in the power distribution unit
(Top Rack Unit - TRU) of each rack. The circuit breakers are of following types:
- FA unit 1670SM: 4A
- 1670SM shelf: 25 A
- FA unit 1662SMC: 4A
- 1662SMC shelf: 16 A
- LA switch: 4A
Figure 4-45, “OED Shelf Power Supply with 3-wire FPE” (p. 4-105) show the power
distribution with 3-wire FPE.
...................................................................................................................................................................................................................................
OEDs
...................................................................................................................................................................................................................................
Figure 4-45 OED Shelf Power Supply with 3-wire FPE
2 Batt. ret.
2 Batt. ret. 1 Batt. ret. is not
Top access shown
a Bottom access
+a
b TRU FPE
+b
FPE/
GND Rack
M Rack
TRU
a b
+a +b
FPE
1 Batt. ret.
Top access
a
+
b
FPE/
GND
M FPE
Rack
a
TRU +a
a b b
+a +b
FPE +b
FPE/
GNDM
3-wire FPE
Figure 4-46, “OED Shelf Power Supply with 2-wire FPE” (p. 4-106) shows the power
distribution with 2-wire FPE.
...................................................................................................................................................................................................................................
OEDs
...................................................................................................................................................................................................................................
Figure 4-46 OED Shelf Power Supply with 2-wire FPE
Top access
a
b
+/FPE/
GNDM Bottom access
Rack
TRU FPE
TRU
a b Rack
+a +b FPE
Top access
a
+a /FPE/GNDM
b
+b /FPE/GNDM
Rack
TRU
a b
+a +b FPE
FPE
a
b
+/FPE/
GNDM
2-wire FPE
...................................................................................................................................................................................................................................
Product description Equipment Alarms and Tests Subsystem
General alarm information
...................................................................................................................................................................................................................................
Equipment Alarms and Tests Subsystem
General alarm information

This paragraph describes the following functionalities managed in the 1678 MCC
equipment:
• the Equipment Alarms (the alarms are referred to by the corresponding probable cause
which is visualized on OS);
• the Tests (loops)
For more details about the list of all alarms and the list of all loops for each 1678 MCC
refer to the 1678 MCC User Provisioning Guide.
Refer to “Power Supply Subsystem” (p. 4-98) for details about Power Distribution.
...................................................................................................................................................................................................................................
Battery Failure
...................................................................................................................................................................................................................................
Battery Failure
Battery Failure is raised only on PSF board when:
• the corresponding Top Rack Unit (TRU) battery voltage is missing
ote: This happens, for instance, when the cable between TRU battery and PSF board
is unplugged.
...................................................................................................................................................................................................................................
RUM, RUTM
...................................................................................................................................................................................................................................
RUM, RUTM
Each considered 1678 MCC item has got a Remote Inventory.
The management of the Remote Inventory results in providing the following equipment
alarms:
• RUM (Replaceable Unit Missing): the slot is configured for an item with specific
Remote Inventory but no item is plugged in.
• RUTM (Replaceable Unit Type Mismatch): the slot is configured for an item with
specific Remote Inventory but an item with different Remote Inventory is plugged in.
...................................................................................................................................................................................................................................
RUP
...................................................................................................................................................................................................................................
RUP
RUP (Replaceable Unit Problem) alarm is raised on all items (except PSF board) when:
• Battery Voltage (65V) from both PSF boards are missing.
• At least one Service Battery voltage got by internal converter is failed.
ote: This condition takes into account double failure scenarios such as Battery
Voltage (65 V) from one PSF boards missing and the battery fuse on the item,
corresponding to the other PSF board, is broken.
• The FLC board is present and has got a power problem.
ote: this statement applies only to FLCCO GI and FLCSERV boards.
• At least one of the three FA s in a FA unit does not run.
On RUP occurrence, the information about its cause is provided by the alarm qualifier
(i.e. "specific problem" number).
In the RUP definition for the currently designed items of 1678 MCC, the specific problem
indicates the SPIDER pin on which the problem is detected.
When more equipment problems causing the alarm on an item are contemporarily
present, the specific problem shows the first one detected by SLC.
...................................................................................................................................................................................................................................
Fuse Failure
...................................................................................................................................................................................................................................
Fuse Failure
The alarm for reporting a Battery Fuse Broken is the Fuse Failure.
For describing the fuse failure alarm usage, it is worthwhile to differentiate the PSF board
from the other boards of the E, as follow:
• In case of PSF board, the fuse failure alarm is raised when a battery fuse of the board
is broken and the corresponding TRU battery voltage (65V) is correctly received.
It means that fuse failure alarm cannot be raised on a PSF board, for which TRU
battery voltage is missing.The information, about which fuse is broken inside the PSF
board, is provided by the specific problem number. The specific problem indicates the
SPIDER pin on which problem is detected.
• In case of all other boards and FA , the fuse failure alarm is raised when a battery
fuse of the board is broken and the battery voltage of the same branch of the broken
fuse is correctly received.
It means that fuse failure alarm cannot be raised on an item, for which battery voltage
of the same branch of the broken fuse is missing.
The information about the affected battery fuse is on branch of PSF A or on branch of
PSF B is provided by the specific problem number. The specific problem indicates the
SPIDER pin on which problem is detected.
When more equipment problems causing the alarm on an item are contemporarily
present, the specific problem shows the first one detected by SLC.
ote: The Fuse Failure alarm contributes to light the red led on the board frontpanel,
like RUP alarm.
...................................................................................................................................................................................................................................
Test Management
...................................................................................................................................................................................................................................
Test Management
The functions, described in this section, are used to control and monitor the test operation
and returning the system to the normal environment (i.e. the environment before the test
was performed).
The Second Level Controller (SLC) is in charge to perform the following tests on the
Optical STM- ports:
• Line Loopback (external)
• Internal loopback
Each of these Loopbacks is performed driving ASICs on the port boards (Loop and
Continue, i.e. the VC is sent back and also continues its path).
...................................................................................................................................................................................................................................
Product description Station Alarms
Description
...................................................................................................................................................................................................................................
Station Alarms
Description
The Station Alarm feature will provide the following main functions:
• Rack lamps
• Housekeeping inputs/outputs (GPIs/GPOs)
• Rack reset button
The Station Alarms feature describes the concept of how the rack lamps and contacts
either in the GTRU or TRU are driven.
Each GTRU/TRU has 4 independent station alarms and corresponding alarm contacts
which are controlled by one shelf via the R/M-interface of the GTRU.
There are two different TRUs in the 1678 MCC. The main rack which contains the
1678 MCC main shelf (and/or the LO extension shelf) is equipped with the GTRU
( ew Generation Top Rack Unit). The OED racks are equipped with the TRU.
This chapter describes the general station alarm concept used in the 1678 MCC for the
main rack and OED racks. In addition it describes the handling of the GTRU alarms,
using the housekeeping input contacts.
...................................................................................................................................................................................................................................
Features
...................................................................................................................................................................................................................................
Features
The 1678 MCC has the following Station Alarm features:
• Each rack provides one reset push button which is connected to one housekeeping
input contact.
• Each shelf has 4 outputs (Power, Lamp 1-3) to connect directly to the 4 station lamps.
• Each 1678 MCC main shelf/LO extension shelf has 3 General Purpose Input contacts
(GPI) and 4 General Purpose Output contacts (GPO) for operator defined usage.
• Each 1670SM OED shelf has 4 General Purpose Input contacts (GPI) and 2 General
Purpose Output contacts (GPO) for operator defined usage.
• Each 1662SMC OED shelf has 4 General Purpose Input contacts (GPI) and 2 General
Purpose Output contacts (GPO) for operator defined usage.
• It is possible to detect alarms of the equipment mounted in the GTRU, e.g. Step up
converters with their FA s.
Only one shelf in a rack is connected to the TRU/ GTRU to control the rack lamps:
• In the 1678 MCC rack
– the 1678 MCC main shelf or
– the LO extension shelf (if only the LO extension shelf is mounted in a separate
rack).
• In the OED rack is this generally the lower shelf (1670SM or 1662SMC).
The operator has to specify for the R/M and GPI/O interfaces which shelf is responsible
to drive the rack lamps.
...................................................................................................................................................................................................................................
Architectural Overview
...................................................................................................................................................................................................................................
Architectural Overview
In this section, an architectural overview is given. Figure 4-47, “Station Alarm System
Architecture - Physical View” (p. 4-115) is more a physical view showing all the
components or subsystems which are necessary to implement this station alarm feature. It
shows the physical interfaces which are provided by each rack:
• Internal communication
• Control system
• Craft Terminal (CT) or Element Manager which provides a user-friendly graphical
user interface towards the operator.
Figure 4-47 Station Alarm System Architecture - Physical View

Remote Remote Remote Remote
alarming alarming alarming alarming
P L1 L2 L3 P L1 L2 L3 P L1 L2 L3 P L1 L2 L3
.
R/M
. .
R/M R/M R/M
HMU
TRU
. Push
Button HMU
TRU
Push
Button
3 x GPI
HMU
NGTRU
FAN
Push
Button
3 x GPI
4 x GPO
NGTRU
HMU
FAN
Push
Button
1662SMC 1662SMC 4 x GPO
ALM
FLC
LO 1678
FANs FANs
FAN FAN
FAN
1670SM OED shelf

1662SMC
4 x GPI or
2 x GPO FANs GPI CTRL LO shelf
4 x GPI FANs
2 x GPO LAN
LAN FANs
internal LAN
GPO CTRL
Rack #n Rack #3 Rack #2 Rack #1
CT/EML
...................................................................................................................................................................................................................................
Control of the (NG)TRU
...................................................................................................................................................................................................................................
Control of the (NG)TRU

Only the 1678 MCC main shelf/LO extension shelf of the 1678 rack is connected to the
GTRU and can drive the station lamps. In the OED rack the 1670SM or the 1662SMC
shelf can be connected to the TRU. The shelf is selected according the cabling during
equipment provisioning.
Each ( G)TRU is connected with cables either to
• the front panel connectors of the FLCCO GI board in case of 1678 MCC main shelf,
• the front panel connectors of the Alarm board in case of LO extension shelf or
• the front panel connectors of the CO GI boards in case of 1670SM/1662SMC OED
shelf.
Control from the 1678 MCC Main Shelf

On the FLCCO GI/ALM board the "Control and General Interface" (CGI) function is in
charge of the management of rack lamps and housekeeping interfaces for the 1678 MCC
etwork Element. This interface consists of a set of specialized parallel I/O with certain
electrical properties and a DC/DC converter to provide the local voltage (-12 V) for the
housekeeping inputs.
Control from an OED Shelf

The Remote Monitoring (R/M) and housekeeping (HK) interface in OED shelves can also
be accessed via the redundant shelf controllers in the OED shelves (CO GI boards).
...................................................................................................................................................................................................................................
NGTRU Alarm Supervision
...................................................................................................................................................................................................................................
NGTRU Alarm Supervision

The GTRU contains step up converters with FA s which need to be supervised or
bypass modules. Only in case of a failure condition of the step-up converters the
equipment has to be alarmed.
Because this granularity is not needed in the 1678 MCC GTRU supervision, some of
the alarms of each step -up converter are joined in the HMU. Voutput or FA alarm or
Intern alarm of the same step-up converter = Internal alarm.
The GTRU offers the following alarms at the 25-pin connector interface for each of the
6 step-up converters (24 alarm pins + ground pin):
• Vinput (<38Veff)
• Internal alarm
– Voutput
– FA alarm
– Intern alarm
The GTRU Vinput alarms are mapped to fuse failures (FF), the GTRU Internal alarms
are mapped to RUP alarms.
Only the alarms of the first step-up converter of each branch, belonging to the 1678 MCC
main shelf, are wired to the housekeeping input contacts at the 1678 MCC main shelf. For
this a connection cable is necessary. The challenge of this cable is the monitoring of the
two step-up converter alarms for the 1678 MCC main shelf via housekeeping input
contacts (GPIs) by the FLCCO GI.
The first 4 GPI contacts of the main shelf are predefined. There are used to signal "Power
failures" of the 4 Step-up converters which are used in the GTRU. The alarms are
VinputA, VinputB, InternalA and InternalB. These GPI contacts can't be assigned by the
operator for other purposes.
...................................................................................................................................................................................................................................
Hardware Aspects
...................................................................................................................................................................................................................................
Hardware Aspects
The physical interfaces like rack lamp interface (RM) towards GTRU/TRU or
Housekeeping Contacts (GPI/GPO) are provided by:
• 1678 MCC Main shelf (refer to Figure 4-48, “Rack Lamp Interfaces including GP
Contacts of 1678 MCC Shelf” (p. 4-118))
– RM (FLCCO GI)
– GPs (FLCCO GI)
• 1678 MCC LO extension shelf (refer to Figure 4-49, “Rack Lamp Interfaces including
GP Contacts of LO Extension Shelf” (p. 4-119))
– RM (ALM)
– GPs (ALM)
• OED shelf 1670SM (refer to Figure 4-50, “Rack Lamp Interfaces including GP
Contacts of 1670SM Shelf” (p. 4-119))
– RM (CO GIHC_A)
– GP (CO GIHC_A)
• OED shelf 1662SMC (refer to Figure 4-51, “Rack Lamp Interfaces including GP
Contacts of 1662SMC Shelf” (p. 4-120))
– RM (CO GI_A)
– GP (CO GI_A)
ote: The customer interface supporting Housekeeping contacts will be provided by
the Housekeeping Monitoring Unit (HMU).
Figure 4-48 Rack Lamp Interfaces including GP Contacts of 1678 MCC Shelf
Upper FAN RACK LAMPS
PSF PSF
R/M
FLCSERVICE
FLCCONGI
1678MCC
HK & RA
Push Button
HMU NGTRU
Step up
Alarms
Lower FAN
3xGPI
4xGPO
...................................................................................................................................................................................................................................
Hardware Aspects
...................................................................................................................................................................................................................................
Figure 4-49 Rack Lamp Interfaces including GP Contacts of LO Extension Shelf
Upper FAN RACK LAMPS
PSF PSF
R/M
dummy plate
1678MCC
ALM
HK & RA
Push Button
HMU NGTRU
Step up
Alarms
Lower FAN
3xGPI
4xGPO
Figure 4-50 Rack Lamp Interfaces including GP Contacts of 1670SM Shelf

RACK LAMPS
R/M
R/M
CONGIHC_A
CONGIHC_B
1670SM
HK & RA
HK & RA
4xGPI Push Button

HMU
2xGPO
AUX_HK
AUX_HK
FANs
...................................................................................................................................................................................................................................
Hardware Aspects
...................................................................................................................................................................................................................................
Figure 4-51 Rack Lamp Interfaces including GP Contacts of 1662SMC Shelf
RACK LAMPS
R/M
R/M
1662SMC
CONGI_A
CONGI_B
HK & RA
HK & RA
4xGPI Push Button
HMU
2xGPO FAN Alarms
Upper FAN
Lower FAN
Rack Lamp (RM) Interface

The rack lamp unit provides 4 alarm lamps with colors as defined in Table 4-7, “Rack
Lamp Colors” (p. 4-120)The (P)ower lamp indicates "power ok" only for the shelf, that
drives the rack lamps, not for the whole rack. The (P)ower lamp lit during normal
operation.
The three station alarm lamps (L1, L2, L3) can be configured by customer.
ote: If an OED shelf drives the rack lamps, the power lamp is switched off when
both branches are OK. In case of a failed branch the power lamp is lit (inverse
behavior as normally)!
The three station alarm lamps are off in normal operation and on during dedicated alarm
conditions.
Restriction if an OED shelf drives the rack lamps
There are the following restriction:
• In case of a failed branch the alarm lamp L3 (yellow) is switched on, independent of
configured alarm filters on software side.
Table 4-7 Rack Lamp Colors
Lamp position 1 2 3 4
Lamp label P L1 L2 L3
Color green red red yellow
Reset Push Button

The reset push button will be located on the HMU. The reset push button is controlled by
SW and allows to reset all GPO contacts and the rack lamps L1 to L3.
...................................................................................................................................................................................................................................
Supported Customer individual Housekeeping contacts
...................................................................................................................................................................................................................................
Supported Customer individual Housekeeping contacts

Depending on kind of used shelf different quantity of GPIs/GPOs are supported. In case
of pure OED shelves (1670/1662) CO GI 3-wire must be used only. With this boards
each rack provides up to 4 housekeeping inputs and 2 housekeeping output contacts.
In case of 1678 MCC shelf/LO extension shelf up to 3 GPIs and 4 GPOs are supported at
rack level.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

The HMU is part of the 1678 MCC Main and OED racks with following applications:
• 1678 MCC Main Rack:
– Monitoring of up to six Step-Up Converter Alarms
– Client Interface for Housekeeping Contacts (GPIs/GPOs)
– Rack Reset Push Button
• In case of OED Racks:
– Rack Reset Push Button
Figure 4-52 Schematic Drawing of HMU Architecture

HMU
HK MS2
NGTRU MS1
Reset Push Button

COED
MS3 MON
HK Connector for Housekeeping

NGTRU Connector for NGTRU
MS1 Connector for Main Shelf No.1/LO Extension Shelf
MS2 Connector for Main Shelf No. 2
MS3 Connector for Main Shelf No. 3
COED Connector for OED Shelf
MON Connector for FAN of 1662SMC shelf
...................................................................................................................................................................................................................................
Product description Remote Inventory Subsystem
Remote inventory functions
...................................................................................................................................................................................................................................
Remote Inventory Subsystem

The Remote Inventory functions permit the operator to retrieve information about any
board or module present on the equipment.
The available information is: construction date, code number, maker name, Board-type,
etc. (refer to details in the 1678 MCC User Provisioning Guide).
The Remote Inventory function is present in all the boards and modules.
The relevant data are transported by a serial link (named RIBUS in Figure 4-53, “Remote
Inventory Subsystem” (p. 4-124)) that connects all boards or modules of the equipment.
The block "RIBUS-I/F" of figure implements the interface of the serial link with the
remote inventory device (named RI in the figure). Further it manages the slot identifier
(ID) and the board type (CType). The CType information is contained on the RI device.
The RI can be also present on some sub-modules assembled on the board (such as optical
modules, micro-controllers and so on).
This block can also manage the visual indications of the board (LEDs) and some I/O
parallel commands/contacts/alarms that can eventually be transferred by means of the
RIBUS link.
If it is not possible to read the Remote Inventory information, a "Board Fail" alarm is
declared.
...................................................................................................................................................................................................................................
Product description Remote Inventory Subsystem
...................................................................................................................................................................................................................................
Figure 4-53 Remote Inventory Subsystem
RIBUS
RI I/F
SHELF RIBUS
CONTROLLER
Generic Board (or Module)

Board
X Indications
RIBUS Board
EQUIPMENT I/F
CONTROLLER RI
ID
...
Board I/O Intracard
RIBUS Module
RI I/F
Module
RI
...
...................................................................................................................................................................................................................................
Product description OED Integration
General
...................................................................................................................................................................................................................................
OED Integration
General
This chapter covers the introduction of the 1670SM and 1662SMC into the 1678 MCC.
The reasons for doing this are to provide external interfaces which are not offered by the
1678 MCC main shelf, like 2Mbit/s, and mainly to increment the matrix capacity which
can be used for STM-1 and STM-4 interfaces.
...................................................................................................................................................................................................................................
System Requirements
...................................................................................................................................................................................................................................
System Requirements
This chapter presents the detailed requirements for the 1678 OED Integration feature. The
OED integration feature is driven by the motivation
• to provide I/O types which are not supported in the 1678 MCC main shelf
• to reuse existing equipment as additional I/O ports
• to increase the number of possible I/O ports
• to allow a better usage of the HO matrix capacity in the 1678 MCC main shelf by I/O
types which would be limited by the number of I/O slots in the 1678 MCC main shelf.
The OED integration feature defines a complete integration of OEDs consisting of
• the mechanical OED integration and
• the SW OED integration.
...................................................................................................................................................................................................................................
Mechanical OED Integration Requirements
...................................................................................................................................................................................................................................
Mechanical OED Integration Requirements

The following figure describes how the OEDs 1670SM and the 1662SMC are connected
to the 1678 MCC main shelf and which hardware components are involved.
Figure 4-54 Schematic drawing of OED Integration
...................................................................................................................................................................................................................................
SW OED Integration Requirements
...................................................................................................................................................................................................................................
SW OED Integration Requirements

The 1678 MCC main shelf and all integrated OEDs are seen as one network element from
an external point of view. The control of the OEDs has to be done via the 1678 MCC
control system.
The links from the OEDs to the 1678 MCC main shelf are internal links of the network
element and are to be managed internally. The SW supports the complete configuration of
these internal links including the required link protection.
The complete 1678 MCC network element including all integrated OEDs runs with one
selected clock source. The SW supports the complete configuration of the
synchronization mechanism in the OEDs and main shelf.
...................................................................................................................................................................................................................................
Kinds of OEDs
...................................................................................................................................................................................................................................
Kinds of OEDs
The following OEDs are integrated into the 1678 MCC:
• 1670SM
• 1662SMC
The number of OEDs which can be connected to the 1678 MCC main shelf is limited on
one side by the I/O ports used as link ports in the 1678 MCC main shelf and on the other
side by the LO matrix capacity offered by the 1678 MCC main shelf.
1670SM
General
The optical edge device 1670SM provides interfaces:
• which are also supported by the 1678 MCC Main shelf (several HO interfaces)
• which are not supported by the 1678 MCC Main shelf
Equipment
The mechanical integration is such that the 1670SM is housed in 600x300 mm racks.
Back to back and stand alone application of OED-Racks will be supported. The system is
designed for 2 wire and 3 wire application. EMC shielding is done on shelf level. The
1670SM shelves are indoor equipment and it is recommended to be installed in a air
conditioned location. The layout of the 1670SM shelf is shown in Figure 4-55, “Layout of
the 1670SM Shelf” (p. 4-130)
Figure 4-55, “Layout of the 1670SM Shelf” (p. 4-130) shows the basic equipment of a
1670SM shelf. Detailed information about basic equipment are described in “1670SM
Shelf - Layout” (p. 3-88).
I/O Interfaces
The 1670SM integration offers the following interfaces:
• 140 Mbit/s
• STM-1e
• STM-1o
• STM-4.
ote: For the supported I/O interfaces refer to chapter “Supported I/O Boards,
Relation Access/Port Boards” (p. 3-93).
...................................................................................................................................................................................................................................
Kinds of OEDs
...................................................................................................................................................................................................................................
Figure 4-55 Layout of the 1670SM Shelf
1670SM 1 2 3 4 5 6 7 8 9 10 11 1213 14 15 1617 1819 20 21
Access cards
CONGIHC copyB
CONGIHC copyA
Access Area
empty
empty
empty
20
22 2324 25 26 27 2829 30 31 3233 34 35 3637 38 39 40 41
Port Cards
HCMATRIX copyB
I/O slots assigned
I/O slots assigned

I/O slots assigned
I/O slots assigned

HCMATRIX copyA
to USR LINKs 1
to USR LINKs 2
to USR LINKs 4
to USR LINKs 3
Port Area
empty
empty
42 43 44 45 46 47 48 49 50
VSR LINK 1A
VSR LINK 1B
VSR LINK 2A
VSR LINK 2B
VSR LINK 3A
VSR LINK 3B
VSR LINK 4A
VSR LINK 4B
LINK Area
BTERM
1662SMC
General
The 2 Mbit/s interfaces which are not supported by the 1678 MCC Main shelf are
provided by the optical edge device 1662SMC.
Equipment
The mechanical integration is such that the 1662SMC is housed in 600x300 mm racks.
Back to back and stand alone application of OED-Racks will be supported. The system is
designed for 2 wire and 3 wire application. EMC shielding is done on shelf level. The
1662SMC shelves are indoor equipment and it is recommended to be installed in a air
conditioned location. It must be noted that max 504x2 Mbit/s ports can be equipped in
one shelf. The layout of the 1662SMC shelf is shown in Figure 4-56, “1662SMC Shelf
Front View” (p. 4-131)
Figure 4-56, “1662SMC Shelf Front View” (p. 4-131) shows the basic equipment of a
1662SMC shelf. Detailed information about basic equipment are described in “1662SMC
Shelf - Shelf Layout” (p. 3-123).
I/O Interfaces
The 1662SMC integration offers the following interfaces:
• 2 Mbit/s
• STM-16.
...................................................................................................................................................................................................................................
Kinds of OEDs
...................................................................................................................................................................................................................................
ote: For the supported I/O interfaces refer to chapter “Supported I/O Boards,
relation Access/Port Boards” (p. 3-126).
Figure 4-56 1662SMC Shelf Front View
1662SMC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
SYNTH16 copyA
SYNTH16 copyB
A
B
Access
Access
Access
Access
Access
Access
Access
Access
CONGI
CONGI
Port
Port
Port
Port
Port
Port
Port
Port
...................................................................................................................................................................................................................................
OED Synchronization
...................................................................................................................................................................................................................................
OED Synchronization
The System-Synchronization is part of the 1678 MCC Main Shelf (refer to Figure 4-57,
“OED Synchronization for ETSI application” (p. 4-132)). The synchronization with
possible extension shelves (eg. 1670SM or 1662SMC) will be done without special clock
cable through standard SDH interfaces by using SSM signalling. The synchronization
subsystem provides the timing reference and represents the SDH Equipment Clock
(SEC). The subsystem performs the functionality identified by the ITU-T
recommendation G.783 as SDH Equipment Timing Source (SETS).
The OED subsystems are able to handle the Priority and Quality (SSM) synchronization
algorithms termination functionality. Source for the OED synchronization is either a
customer signal or an internal STM-n link provided by the main shelf. The
synchronization information between OED and Main shelf is done via internal standard
STM-n link using SSM signalling.
Figure 4-57 OED Synchronization for ETSI application
1670
T1
1678
T1 1670 1662 T2
T3/T6
The interfaces provided by the OEDs can distribute the system clock with or without
quality indication (SSM in S1 byte) to neighbored network elements and can also be used
for clock derivation (timing sources). Each OED operates like a normal SDH network
element concerning its clock system, but only the selector B for the system clock is used.
The selectors A and C for station clock outputs are not used in OEDs. The station clock
outputs of the OEDs can be configured permanently to T4 (2MHz) with a forced squelch
(AIS). A station clock output (T4 or T5) and 2 station clock inputs (T3 resp. T6) are
supported in the main shelf of the 1678 only. The selector A in the main shelf (providing
station clock output) can be configured with STM- timing sources located in the main
shelf only.
...................................................................................................................................................................................................................................
Product description 1678 MCC Network Requirements
Consistent Time and Clock
...................................................................................................................................................................................................................................
1678 MCC Network Requirements
Consistent Time and Clock

A consistent time between the Es of a network is an important requirement to a network.
The same holds for the distribution of the clock.
Time and Date Partsystem
All hosts within 1678 MCC refer to the FLC U IX system time. This time is
synchronized to an external time source and is distributed to the Shelf Controllers,
Equipment Controllers and User Boards. The Time and Date Partsystem covers all the
functionalities to retrieve the correct time and date from time sources in order to have this
time available for functions like time stamping etc...
Further the Time and Date Partsystem has to ensure that:
• o problems occur due to the switching of summer/winter time or to different
interpretations of the actual time base (e.g. LCT, GMT)
• The operation of a network by the OS is performed without ambiguity of the time
base and time accuracy: the OS performs an interpretation of the network availability
and error status on the base of alarms correlation. This function requires that the alarm
time stamps in all the Es of the network are created on the same time base and with
a limited offset error.
1678 MCC fulfills these requirements in the following way:
• All hosts run under a common time base UTC (Universal Time Coordinated)
(On the CT the local time offset against UTC can be set by the operator for
presentation purposes)
• The control system supports the etwork Time Protocol TP:
The FLC and CT U IX system time is synchronized to an external time source by
application of the TP which is available on the external LA .
• Date and time source is a TP time server connected to the external LA .
TP Server Configuration
The configuration of TP is provided via CT/MIB/VHM/CS-Server. For proper TP
operation, the provisioned TP servers must have a stratum value of 9 or better.
One main and one spare TP server address can be configured via CT/MIB /VHM. Initial
installation shall not require to define an TP server address. During initial installation,
the system time is set to the time of the install server.
ote: IP addresses which are local to the E cannot be configured as external TP
time server addresses.
...................................................................................................................................................................................................................................
Product description Data Application and Layer 2 Switching
Importance of Ethernet services
...................................................................................................................................................................................................................................
Data Application and Layer 2 Switching
Importance of Ethernet services

In typical Metro etworks, Ethernet services are becoming more and more important.
Triple Play and Business Ethernet services are driving the traffic requirements. From the
transport network perspective, this requires Ethernet connectivity and aggregation
capability, sometimes even at several points in the network, in order to increase the
network efficiency and utilization.
In order to support the Core and Metro Core data applications, 1678 MCC supports
different data boards. The functionality of these boards and the services enabled are
described in the following in more detail.
ote: 1GE/10GE interfaces are relying on adjacent nodes to guarantee in–profile
traffic. Out–of–profile frames might be dropped regardless of their QoS class.
...................................................................................................................................................................................................................................
4/8/16xGigabit Ethernet Boards
...................................................................................................................................................................................................................................
4/8/16xGigabit Ethernet Boards

With the GE cards Ethernet Private Line services (point-to-point, EPL Type 1) can be
supported.
Traffic is entering the network from customer sites using separate physical GE interfaces.
The complete GE signal will be mapped into SDH/SO ET via GFP in a dedicated Virtual
Concatenation Group (VCG), either transparently or with rate adaptation. The VCs of one
VCGs can run in the same or different STM- /OC-x links through the network. On the
other end of the network the VCGs will be terminated and the traffic is mapped back on a
dedicated GE interface. It is not possible that several customer GE interfaces share the
same VCG through the network, as EPL Type 1 is a dedicated and not a shared service.
Ethernet frames are mapped in SDH/SO ET containers via a GFP code according to
G.7041 with any possible adaptation ratios:
1: - 1 x GE -> GFP -> VC-4- v (with = 1 to 7) / AU3- v (with = 1 to 21)
A further aggregation of the traffic is possible at the SDH/SO ET layer on a VC-4/AU3
granularity.
The Link Capacity Adjustment Scheme (LCAS) is supported, providing automatic rate
adaptation from VC-4/AU3 to VC-4-7v/AU3-21v depending on the incoming bit rate, and
in case of failure of a single VC (compliant with G.7042). If a VC fails, this failure will
be signaled back to the source node to reduce the Ethernet packet flow. The LCAS
protocol ensures that the failing VC-4/AU3 will not be used anymore and only working
VC-4s/AU3s will be used for the transport of Ethernet frames. Flow control and Ethernet
performance counters are supported for quality of service purposes.
...................................................................................................................................................................................................................................
4x10 Gigabit Ethernet Boards
...................................................................................................................................................................................................................................
4x10 Gigabit Ethernet Boards

The 4x 10GE card is an Ethernet Aggregator and provides physical access of 4x 10GE
interfaces. It can be used in the same way as the GE interface described in the previous
chapter (EPL Type 1).
In order to achieve an optimized interfacing to other Service Providers a 10GE interface
should have a cost advantage over several times GE. In this case a multiplexed access is
required, as several customer services (VLA s) with different end-points will be carried
over one physical 10 GE interface. The 4x 10GE card addresses this requirement and
provides VLA aggregation capabilities using Ethernet Virtual Private Line Service
(EVPL Type 1, logical point-to-point).
In case several client signals are transported over the same 10 GE interface, the different
VLA tags of the aggregation link are evaluated. The Ethernet frames will be mapped per
VLA into separate VCGs, using GFP. So each VLA is connected individually over the
network. For each VLA a dedicated VCG is used. On the destination side the signal is
terminated and can be handed over to the customer via another multiplexed 10 GE
interface or via a dedicated physical interface.
EVPL Type 1 functionality is supported in any kind of topology, e.g. point-to-point, hub
& spoke or mesh.
The 10GE board can be used amongst others for IP Backbone, Metro Ethernet
interconnect and point-to-point Ethernet private line applications. The 10GE board is the
optimized board to provide EVPL Type 1 and EVPL Type 1a.
...................................................................................................................................................................................................................................
ISA-ES64 Data Board
...................................................................................................................................................................................................................................
ISA-ES64 Data Board

The ISA-ES64 board complements the data portfolio of the 1678 MCC. It is an advanced
20Gbit/s L2 switch and enables cost-effective Carrier Class Ethernet for Metro.
1678 MCC provides two different hardware variants of the ISA-ES64 board:
• A pure L2 server board without any physical ports,
• A board with an integrated 10GE physical front access (future releases).
It represents the next step of the ISA family and increases further the support of Metro
Ethernet Services for the Alcatel-Lucent transmission portfolio. The board can be used as
well in IP Core applications within the 1678 MCC to provide L2 Ethernet aggregation
between Core-, Service- and Edge Routers on one side and Optical Switches on the other
side. In addition to the data functionality the ISA-ES64 is optimized for more advanced
L2 switching mechanisms, beyond what is provided by the 1GE and 10GE boards.
...................................................................................................................................................................................................................................
Product description Units Descriptions Main Shelf
Introduction
...................................................................................................................................................................................................................................
Units Descriptions Main Shelf
Introduction
The following Table 4-8, “Units involved in 1678 MCC Main Shelf” (p. 4-138) up to
Table 4-10, “Optical Modules involved in 1678 MCC Main Shelf” (p. 4-139) sums up the
units managed in the 1678 MCC Main Shelf Equipment.
Table 4-8 Units involved in 1678 MCC Main Shelf
Type / Class Description Acronym1 Width Q.ty2
(TE)
Control / Common FLCCO GI E H. FLCCO GI 4 1
FLCSERVICE E H. FLCSERV
FLCSERVICE E H. A SI FLCSERVA
Power Supply and Filter PSF 2
Bus Termination BUSTERM
HO Matrix Matrix 640 Gbit/s MX640 8 2
Matrix 640 Gbit/s A SI MX640GA
Matrix 320 Gbit/s MX320
Matrix 320 Gbit/s A SI MX320GA
Matrix 160 Gbit/s MX160
LO Matrix LO Adaptation/Matrix Board 40G LAX40 4.5 2
LO Adaptation/Matrix Board 20G LAX20
Lower Order Matrix Link 40G LAC40 5
SDH Port 1 x STM-64 S-64.2 Optical port S-642M 4.5 16
STM-64 1 x STM-64 L-64.2 Optical port L-642M
1 x STM-64 V-64.2 Optical port V-642M
1 x STM-64 U-64.2 Optical port U-642M
1 x STM-64 I-64.1 Optical port I-642M
2 x STM-64 S-64.2 Optical port P2S64M
2 x STM-64 I-64.1 Optical port P2I64M
2 x STM-64 S-64.2 Optical XFP port P2S64X
4 x STM-64 I-64.1 Optical port P4I64
4 x STM-64 S-64.2 Optical port P4S64
4 x STM-64 S-64.2 Optical XFP port P4S64X
...................................................................................................................................................................................................................................
Introduction
...................................................................................................................................................................................................................................
Table 4-8 Units involved in 1678 MCC Main Shelf (continued)

Type / Class Description Acronym1 Width Q.ty2
(TE)
SDH Port 16 x STM-16 Optical port P16S16 4.5 16
STM-16 8 x STM-16 Optical port P8S16
4 x STM-16 Optical port P4S16
SDH Port 16 x STM-1/4 Optical port P16S1S4 4.5 16
STM-1/4 16 x STM-1 Optical/Electrical port P16S1S
SDH Port 16 x GE Optical port P16GE 4.5 16
GE 8 x GE Optical port P8GE
4 x GE Optical port P4GE
2 x 10GE Optical port P2XGE
3
4 x 10GE Optical port P4XGE 4.5
SERVER CARD ISA-ES64 Server Board ES64SC 4.5 24
FA System FA FA -- 2
Notes:
1. Acronym = label shown on CT
2. Q.ty = max number allowed in the 1678 MCC Main Shelf equipment
3. Max number of P4XGE boards is limited because of the power consumption of around 150 W per board
without optical modules and around 165W with optical modules. The maximum number of 4 x 10GE boards
depends on the configuration. Please contact your Technical Assistance Center.
4. Max number of ES64SC boards is limited because of the power consumption. Depending on the
configuration up to two pairs of ES64SC boards are possible, that is, two working boards and two protecting
boards. The quantity listed in the table refers to the number of working boards. Please contact your Technical
Assistance Center.
Table 4-9 Electrical Modules involved in 1678 MCC Main Shelf

Type Description Acronym Q.ty
STM-1e TRX SFP STM-1e SES1 16
Table 4-10 Optical Modules involved in 1678 MCC Main Shelf

Type Description Acronym1 Q.ty2
STM-1 S-1.1 SFP - Short Haul (wl = SS-1.1 16
1310 nm)
L-1.1 SFP - Long Haul (wl = SL-1.1
1310 nm)
1550 nm)
...................................................................................................................................................................................................................................
Introduction
...................................................................................................................................................................................................................................
Table 4-10 Optical Modules involved in 1678 MCC Main Shelf (continued)
STM-4 S-4.1 SFP - Short Haul (wl = SS-4.1 16
1310 nm)
1310 nm)
1550 nm)
STM-16 I-16.1 SFP - Intra-office (wl = SI-16.1 16
1310 nm)
S-16.1 SFP - Short Haul (wl = SS-16.1
1310 nm)
1310 nm)
1550 nm)
Opto Transc. Module 1470nm CWP
Opto Tr. Module 1470nm APD CWA
Opto TRX SFP L-16.2 DWDM DWA
CH620 ... CH170
...................................................................................................................................................................................................................................
Introduction
...................................................................................................................................................................................................................................
Table 4-10 Optical Modules involved in 1678 MCC Main Shelf (continued)
STM-64 S-64.2b3 MS642 1, 2, 4
I-64.14 MI641 1, 2, 4
5
L-64.2 ML642 1
5
V-64.2 MV642 1
U-64.25 MU642 1
S-64.2 b6 XS642B 2, 4
S-64.2 b Ext6 XS642E 2, 4
6
L-64.2 XP1L12D2 2, 4
6
I-64.1 XI641 2, 4
Opto TRX XFP L–62.2 DWDM DWDM APD 2, 4
APD CH60 ... CH176
GE OPTO TRX 1.25GBE SFP-SX7 SGESX 4, 8, 16
OPTO TRX 1.25GBE SFP-LX7 SGELX
OPTO TRX 1.25GBE SFP–ZX7 SGEZX
OPTO TRX XFP 10GBASE-S8 XGES 2, 4
8
OPTO TRX XFP 10GBASE-E XS642B 2, 4
8
OPTO TRX XFP 10GBASE-L XI641 2, 4
Notes:
1. Acronym = label shown on CT
2. Q.ty = max number allowed in a single system
3. Hosted in S-642M, P2S64 and P4S64 boards
4. Hosted in I-64.1M, P2I64M and P4I64 board
5. Hosted in L-642M
6. Hosted in P2S64X and P4S64X
7. Hosted in P(4, 8, 16)GE boards
8. Hosted in P2XGE/P4XGE boards
For SFP and XFP modules Digital Diagnostic Monitoring (DDM) is provided. In
compliance with other Alcatel-Lucent products a subset of the monitoring functions
provided by the modules is supported. The system provides the current values of
• Case temperature
• Laser bias current
• Optical input power
• Optical output power
• Supply voltage.
...................................................................................................................................................................................................................................
Introduction
...................................................................................................................................................................................................................................
The values of the above mentioned parameters are retrieved from the modules and are
presented at the CT on operator request. Threshold crossing alarms are not supported.
For modules, that do not support Digital Diagnostic Monitoring (DDM), the operator
request delivers “ o values available” in the measurement field.
...................................................................................................................................................................................................................................
First Level Controller and Control & General Interface
...................................................................................................................................................................................................................................
(FLCCONGI)

(FLCCONGI)
The FLCCO GI board is designed as the hardware platform supporting the First Level
Controller (FLC), the Control and General Interface (CGI) and the Data Communication
Channel (DCC) functions for the 1678 MCC etwork Element ( E).
These functions are performed by one or two on-board microprocessors (DCR and EM),
by a Multi High-Level Data Link Controller (MHDLC) for the DCC processing and by a
Complex Programmable Logic Device (CPLD) which manages the station alarms and
signalling (part of the CGI function).
The FLCCO GI board is composed of the following blocks (refer to Figure 4-58, “Block
Diagram and external Interfaces of FLCCO GI enhanced” (p. 4-143)):
• First Level Controller (FLC) function
• Control and General Interface (CGI) function (comprises also the synchronization
reference interface)
• DCC function.
Figure 4-58 Block Diagram and external Interfaces of FLCCONGI enhanced
Frontpanel interfaces Backpanel interfaces

Qecc 17
RL FLCCONGI
Qecccmx 16
RA
HK
DCC Function PIO
SY_REF
SY_FR
LAN_A
DBG_DCR CGI Function ISSB_1
LCI
F
SYS_ID
USB
FLC Function
LAN_B
LAN switch IPL
IPL_LAN
DBG_EM
SYNC
DCR EM
HDD ISSB_2
SPI_A
SPI_B
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(FLCCONGI)
First Level Controller Function
The first level controller function is in charge of the processing activities concerning the
"Virtual Equipment Control Element" (VECE) function for the 1678 MCC network
element, consisting of:
• Virtual Machine Management Function (VMMF)
• Message Communication Function (MCF).
The basic element of the FLC function in the FLCCO GI/FLCSERV(A) board is the
"DCR Processor Module" daughterboard. On the processor board are several basic
hardware components available, as required by the FLC function:
• Microprocessor (CPU)
• System memory (Flash EPROM, RAM)
• I/O parallel bus (PCI)
• Serial communication channels
• General Purpose Parallel I/O.
GMRE Function
The GMRE function is in charge of providing the hardware support for the GMRE
software.
The basic element of the GMRE function is a Embedded Module (EM) used as a
daughterboard in the FLCCO GI/FLCSERV(A) board.
This board supplies several basic hardware components required by the function:
• Microprocessor (CPU) with L2 cache
• System memory (Boot Flash EPROM, RAM)
• Serial communication channels
• I/O parallel bus bridge interface (PCI).
Additional components related to the GMRE function are present on the motherboard: the
physical interface circuitry supporting the DBG_EM serial communication channels,
which is used for debug, and the interface toward an ATA socket, capable of hosting mass
storage devices as hard disks.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(FLCCONGI)
The main components related to the GMRE function are:

• Parallel Bus Interface (PCI)
The FLCCO GI motherboard supports the PCI bus interface as the I/O parallel bus
used by both the OAM and the FLC processors present on the daughterboards to
access local peripheral devices.
• Ethernet interface
The Ethernet interface of the GMRE daughterboard is used to support the QB_A,
QB_B and IPL interfaces of the FLCCO GI board. The daughterboard interface is a a
IEEE 802.3 Fast Ethernet serial communication channel, suitable for operation at both
10 Mbit/s and 100 Mbit/s.
• Asynchronous Serial interface
The asynchronous serial interface available from the GMRE daughterboard is used to
support the DBG_EM interface of the FLCSERV(A) board.
It provides a RS-232 asynchronous communication channel for connection to a
console, mainly used for support to software debug activity.
Control and General Interface Function

The Control and General Interface (CGI) function is in charge of the management of
remote alarms, rack lamps and housekeeping interfaces for the 1678 MCC network
element. These interface consist of a set of specialized parallel (I/O) with certain
electrical properties, which are standardized for all E equipment. The equipment
synchronization is here considered part of the CGI function.
All the circuitry related to the CGI functions hosted on the FLC motherboard. This
includes the physical interfaces toward the front panel connectors. The DC/DC converter
provides the -12 V local voltage for the housekeeping inputs.
DCC Function
The task of the DCC Partsystem is to access and route the information encoded in the
DCCs.
The DCC partsystem consists of the DCCs servers (which terminate and insert the
D1...D3 and D4...D12 bytes) and of their connection to the I/O boards on one side and to
the external LA on the other side.
The FLCCO GI/FLCSERV(A) is dimensioned to handle the number of DCCR and
DCCM as described in chapter “Controller Subsystem” (p. 4-37) 'Controller Subsystem'
on page “Controller Subsystem” (p. 4-37).
External Interfaces
The FLCCO GI supports the serial and parallel external I/O interfaces shown in Figure
4-58, “Block Diagram and external Interfaces of FLCCO GI enhanced” (p. 4-143).
These interfaces are generally used to support external or system-internal communication
as required by the FLC and CGI functions.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(FLCCONGI)
F Interface
The F interface is defined at the equipment level as a local interface to support the craft
terminal function for maintenance and control activities, normally provided by a PC. The
physical layer (hardware) of this interface is implemented as a point to point
asynchronous serial channel (UART) with an RS-232 electrical interface, complying with
the F-LTS Alcatel-Lucent standardization requirements.
The main characteristics and operating modes of the F interface protocol, as supported by
the FLCSERV card, are:
• Asynchronous full duplex communication protocol with RZ data encoding;
• 8 bits character, 1 stop bit, odd parity;
• TX and RX clocks internally generated
• Supported baud-rate up to 38400 b/s (9600 b/s specified for F-LTS)
• Simplified DCE configuration of the RS-232 control signals set (null modem
connection).
The physical access to this interface is provided through a RJ45 on the board front panel.
DBG_DCR and DBG_EM Interfaces
These interfaces are related to the DCR and EM processors, respectively and are intended
to support the communication interface of high level run time SW debug tools.
Both consist of a RS–232 asynchronous serial channel (UART) suitable for local
connection to an external debug terminal (e.g. PC or Work Station) at a data rate of 38.4
kbit/s maximum.
Signals related to these interfaces are available with RS–232 electrical levels on a single
8–pin RJ–45 connector (i.e. the connector is shared between the two interfaces) mounted
on the motherboard and placed in the board's front panel area.
USB Interface (currently not supported!)
This interface is planed to be connected to a local craft terminal. It consists of a serial
interface compliant with the Universal Serial Bus specification 1.1, able to support both
the 12 Mbit/s (full speed) and the 1.5 Mbit/s (low speed) modes. The physical access to
this interface is provided through a standard USB mini–B receptacle on the board front
panel.
LAN_A and LAN_B Interfaces
These interfaces provide a redundant high speed communication channel able to support
the Ethernet protocol IEEE 802.3. They are both used for connection to an external
Operation System (OS) station and are functionally equivalent. The layer–2 protocol
functions (MAC controller) for these interface are provided by one on–board LA
switch, which is configured to support either 10BaseT or 100BaseTX connections
(automatic selection); the physical layer circuitry (transceivers, line transformers, etc.) is
placed on the motherboard. The physical access to these interfaces is provided through
two (one for each interface) RJ45 on the board front panel.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(FLCCONGI)
SY_REF Interface
The 1678 MCC etwork Element accepts two external timing reference signals; physical
access for these interfaces is placed on the front panel of the FLCSERV and FLCCO GI
boards, to provide the redundancy required for this functionality. Timing signals can be a
2.048 MHz clock or a 2.048 Mb/s frame (E1) in an ETSI environment, or a 1.544 MHz
clock or 1.544 Mb/s frame (DS1) in a SO ET architecture.
A Sub-D 9-pin female connector, as required for SO ET equipments, is used as balanced
physical interface for the input/output reference clocks. In ETSI environments, timing
references have usually unbalanced (coaxial) connections; this makes necessary to have
an external "adapter" to support also this kind of physical interfaces. The presence of this
adapter is sensed by means of a parallel I/O of "Spider". The different line impedances for
both the receiver and the transmitter in the different environments are matched by the
internal circuitry of Line Interface Unit (LIU) itself, which must be configured
accordingly through its SPI interface. The possible configurations are:
• 100 Ω (T1/J1) balanced interface (on the Sub-D 9-pin female connector)
• 120 Ω (E1) balanced interface (on the Sub-D 9-pin female connector)
• 75 Ω (E1) unbalanced interface (a pair of coaxial connectors on the adapter plugged
on the Sub-D connector).
The physical access to this interface is provided through a Sub–D 9 poles female
connector (DB9), accessible on the board front panel. Signal levels on this interface are
compliant with A SI T1.102 (FLCSERVA only) and ITU-T G703 standards.
RL Interface
This interface is intended to drive a number of rack lamps showing a summary of the
equipment shelves status. It provides a standard set of galvanically insulated contacts
which can be closed toward the Rack Lamps ground, or opened, under control of the
active FLC. The physical access to this interface is provided through one Sub–D 9–poles
male connector (DB9) on the board front panel.
HK and RA Interfaces
The Housekeeping (HK) interface provides a number of galvanically insulated general
purpose inputs and outputs, whose meaning can be defined by the customer, while the
Rack Alarms (RA) interface provides a number of galvanically insulated output contacts,
reporting the status of some equipment–related alarms. The outputs are realized with
electronic switches, which can close or open a contact toward the independent
Housekeeping Output grounds; similarly, the inputs can sense the closure of an external
switch toward the Housekeeping Input ground.
The physical access to these interfaces is provided through a Sub–D 25 poles female
connector (DB25), accessible on the board front panel. The on–board "Teroldego" CPLD
device provides a set of parallel outputs dedicated to the management of the signals
belonging the afore mentioned RL, HK and RA interfaces.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(FLCCONGI)
Reset Key
The FLC reset key has a multiple functionality, in that:
• when pressed once resets the DCR processor,
• when pressed twice in a short time resets the EM processor and
• when keep pressed (> 3 s) it resets both processors.
...................................................................................................................................................................................................................................
First Level Controller and Service Interface (FLCSERV)
...................................................................................................................................................................................................................................

There are two types of FLCSERV:
• FLCSERV enhanced (for SDH applications)
• FLCSERVA enhanced ASI (for SO ET applications).
The FLCSERV(A) board is designed as the hardware platform supporting the First Level
Controller (FLC), the Control and General Interface (CGI) and the Data Communication
Channel (DCC) functions for the 1678 MCC etwork Element ( E).
These functions are performed by one or two on-board microprocessors (DCR and EM),
by a Multi High-Level Data Link Controller (MHDLC) for the DCC processing and by a
Complex Programmable Logic Device (CPLD) which manages the station alarms and
signalling (part of the CGI function).
The FLCSERV(A) board is composed of the following blocks (refer to Figure 4-59,
“Block Diagram and external Interfaces of FLCSERV(A) enhanced” (p. 4-149)):
• First Level Controller (FLC) function
• Service and General Interface (SGI) function (comprises also the synchronization
reference interface)
• DCC function.
Figure 4-59 Block Diagram and external Interfaces of FLCSERV(A) enhanced
Frontpanel interfaces Backpanel interfaces
SERV FLCSERVICE AUX 16
PH
Qecc 17
PH_EXT
Qecccmx 16
SY_REF DCC Function
PIO
SY_FR
LAN_A
DBG_DCR
SGI Function ISSB_1
F LCI
USB SYS_ID
FLC Function
IPL
LAN_B LAN switch
IPL_LAN
DBG_EM
SYNC
DCR EM ISSB_2
HDD
SPI_A
SPI_B
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Equipment Controller Function

This function is the same of the FLCCO GI board: refer to “First Level Controller
Function” (p. 4-144).
Service and General Interface Function

The Service and General Interface (SGI) function is in charge of the management of the
phone, phone extension and service channels interfaces for the 1678 MCC network
element. The equipment synchronization is here considered part of the SGI function.
All the circuitry related to the SGI functions hosted on the FLCSERV(A) motherboard.
This includes the physical interfaces toward the front panel connectors.
DCC Function
This function is the same of the FLCCO GI board: refer to “DCC Function” (p. 4-145).
External Interfaces
The FLCSERV(A) supports the serial and parallel external I/O interfaces shown in Figure
4-59, “Block Diagram and external Interfaces of FLCSERV(A) enhanced” (p. 4-149).
These interfaces are generally used to support external or system-internal communication
as required by the FLC and CGI functions.
F Interface
The F interface is defined at the equipment level as a local interface to support the craft
terminal function for maintenance and control activities, normally provided by a PC. The
physical layer (hardware) of this interface is implemented as a point to point
asynchronous serial channel (UART) with an RS-232 electrical interface, complying with
the F-LTS Alcatel-Lucent standardization requirements.
The main characteristics and operating modes of the F interface protocol, as supported by
the FLCSERV card, are:
• Asynchronous full duplex communication protocol with RZ data encoding;
• 8 bits character, 1 stop bit, odd parity;
• TX and RX clocks internally generated
• Supported baud-rate up to 38400 b/s (9600 b/s specified for F-LTS)
• Simplified DCE configuration of the RS-232 control signals set (null modem
connection).
The physical access to this interface is provided through a RJ45 on the board front panel.
DBG_DCR and DBG_EM Interfaces
These interfaces are related to the DCR and EM processors, respectively and are intended
to support the communication interface of high level run time SW debug tools.
Both consist of a RS–232 asynchronous serial channel (UART) suitable for local
connection to an external debug terminal (e.g. PC or Work Station) at a data rate of 38.4
kbit/s maximum.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Signals related to these interfaces are available with RS–232 electrical levels on a single
8–pin RJ–45 connector (i.e. the connector is shared between the two interfaces) mounted
on the motherboard and placed in the board's front panel area.
USB Interface (currently not supported!)
This interface is planed to be connected to a local craft terminal. It consists of a serial
interface compliant with the Universal Serial Bus specification 1.1, able to support both
the 12 Mbit/s (full speed) and the 1.5 Mbit/s (low speed) modes. The physical access to
this interface is provided through a standard USB mini–B receptacle on the board front
panel.
LAN_A and LAN_B Interfaces
These interfaces provide a redundant high speed communication channel able to support
the Ethernet protocol IEEE 802.3. They are both used for connection to an external
Operation System (OS) station and are functionally equivalent. The layer–2 protocol
functions (MAC controller) for these interface are provided by one on–board LA
switch, which is configured to support either 10BaseT or 100BaseTX connections
(automatic selection); the physical layer circuitry (transceivers, line transformers, etc.) is
placed on the motherboard. The physical access to these interfaces is provided through
two (one for each interface) RJ45 on the board front panel.
SY_REF Interface
The 1678 MCC etwork Element accepts two external timing reference signals; physical
access for these interfaces is placed on the front panel of the FLCSERV and FLCCO GI
boards, to provide the redundancy required for this functionality. Timing signals can be a
2.048 MHz clock or a 2.048 Mb/s frame (E1) in an ETSI environment, or a 1.544 MHz
clock or 1.544 Mb/s frame (DS1) in a SO ET architecture.
A Sub-D 9-pin female connector, as required for SO ET equipments, is used as balanced
physical interface for the input/output reference clocks. In ETSI environments, timing
references have usually unbalanced (coaxial) connections; this makes necessary to have
an external "adapter" to support also this kind of physical interfaces. The presence of this
adapter is sensed by means of a parallel I/O of "Spider". The different line impedances for
both the receiver and the transmitter in the different environments are matched by the
internal circuitry of Line Interface Unit (LIU) itself, which must be configured
accordingly through its SPI interface. The possible configurations are:
• 100 Ω (T1/J1) balanced interface (on the Sub-D 9-pin female connector)
• 120 Ω (E1) balanced interface (on the Sub-D 9-pin female connector)
• 75 Ω (E1) unbalanced interface (a pair of coaxial connectors on the adapter plugged
on the Sub-D connector).
The physical access to this interface is provided through a Sub–D 9 poles female
connector (DB9), accessible on the board front panel. Signal levels on this interface are
compliant with A SI T1.102 (FLCSERVA only) and ITU-T G703 standards.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
PH Interface (not supported)

The PH interface allows to connect an external telephone handset, which will receive both
the power supply (about 12 V, internally limited to 18 mA max.) and the analog audio, on
a two-wire interface with an impedance of 600 Ω. The receive (from the unit toward the
external phone) and transmit audio (from the phone toward the equipment) are internally
separated by an on-board hybrid circuit which routes the two audio channels to a
dedicated audio processor for the analog/digital conversion. This latter is controlled by
the AUX manager FPGA "Aton", which selects the AUX channels bytes that will be used
for the EOW. The audio volume, both in the TX and in the RX directions, can be varied in
a range of about 20 dB by means of a digital potentiometer connected as a slave device to
the on-board SPI manager "Spider". Physical access to this interface is provided through a
Bantam jack on the unit front panel.
PH_EXT Interface (not supported)
For applications needing separate access for the transmit and receive audio of the EOW,
the FLCSERV unit supplies the PH_EXT four-wire interface. On this interface no DC
power is available for the external devices, being it galvanically insulated from the
motherboard by means of transformers; both the TX and RX audio connections have a
nominal impedance of 600 Ω and, like for the PH interface, are connected to a dedicated
audio processor for the analog to digital conversion, controlled by the "Aton" FPGA. The
audio volume, both in the TX and in the RX directions, can be varied in a range of about
20 dB by means of a digital potentiometer connected as a slave device to the on-board
SPI manager "Spider". The physical access to this interface is provided through a RJ11
connector on the unit front panel.
SERV Interface (not supported)
The AUX channels data going through the "ATO " FPGA can be made available at the
front panel SERV interface as general digital streams, having various bit rates and
reference standards. On the FLCSERV unit there are two 64 kb/s V.11, two RS-232, two 2
Mb/s and two 64 kb/s G.703 interfaces, managed by the "ATO " FPGA.
The physical access to the SERV interface is provided through a front panel SCSI 26-pin
female connector and two couples of 1.0/2.3 75 coaxial connectors carrying the 2 Mb/s
interfaces.
Reset Key
The FLC reset key has a multiple functionality, in that:
• when pressed once resets the DCR processor,
• when pressed twice in a short time resets the EM processor and
• when keep pressed (> 3 s) it resets both processors.
...................................................................................................................................................................................................................................
Power Supply and Filter Board (PSF)
...................................................................................................................................................................................................................................

In the 1678 MCC equipment two PSF boards are mandatory.
Main Characteristics
The main function of this board is to carry the Battery Voltage from the TRU (Top Rack
Unit) to the backplane thus guaranteeing the main power supply (voltage) to the boards
making up the subrack.
It also supplies the Service Voltage (3.6 V) to all the boards.
The board block diagram is illustrated in Figure 4-60, “PSF Functional Block Diagram”
(p. 4-155) where are shown the following functionalities (two sub-boards are assembled
to obtain a PSF board):
• the sub-board 1 provided with the following circuits:
– EMI Filter: it is necessary to reduce the battery noises; the noises are rejected by
the DC/DC converters present on all the boards.
– OC and OV protections: each battery wire is protected against overcurrents and
short-circuits by means of a fuse, while the protection against overvoltage is
realized by means of varistors.
– Fuse Fault Detectors: it is realized with circuits situated after the fuses detecting
the battery voltage failure.
– Battery Failure Detector: it is realized with a circuit situated before the fuses.
– Input Power Stage: this circuit is used to power supply the DC/DC converter that
generates the service voltage for the whole subrack; it consists of a filter to reduce
the noises, a protection fuse against short-circuits with relevant fault detector and
of an inrush current limiting circuit.
• the sub-board 2 provided with the following circuits:
– 48 V to 3.6 V DC/DC Converter
– Service Voltage Undervoltage Detector
– SPIDER block
– Remote Inventory block
Electrical Interfaces
The main electrical interfaces are:
• Battery Voltage on the front panel: it can be received through the 3-pin power male
connector; the female pole is dedicated to the mechanical ground; the battery can
absorb a max of 30 A.
• Backplane Battery Voltage: it is received through a 8-pin female connector; three
battery branches are available (10 A per branch), each branch is protected with a 30 A
fuse.
• Incoming 3.6 V Service Voltage: it is received (V3V_A_I ) from the other PSF board
present in the 1678 MCC equipment; the typical absorbed current is 25 mA.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Alarms and signaling: the following signaling are available:

– Lamp Test (output), through a switch on the front panel:
switch pressed=G D, switch released=high impedance.
ote, that a pull-up resistor is provided at the input on the FLCCO GI.
– Converter Synchronization (input, ALMSY C): TTL compatible levels.
– Slot ID (input, SLOT_ID_0): TTL compatible levels.
– Alarm indicating 3.6 output voltage failure or voltage lower then 3.6 V (output,
V3V_A_OUT):
Alarm status: it is activated when the output voltage is lower than 3 V.
Alarm Absence status: it is activated when the output voltage is higher than 3 V.
– Board Missing (output): it indicates the circuit presence by means of a G D
contact; one contact indicates the presence/absence of this board to the Matrix and
another contact indicates the presence/absence of this board to the FLC.
– Battery Voltage Failure alarm (output, BATT_FAIL):
Alarm status: it is activated when the Battery voltage is lower than 37 V.
Alarm Absence status: it is activated when the Battery voltage is higher than 37 V.
ote, that a pull-up resistance has to be provided towards a positive voltage (3.3
V).
– Broken Fuse Alarm (output, BROKE _FUSE):
Alarm status: it is activated when at least one of the six fuses situated in series of
wires leading the battery to the backplane is broken.
Alarm Absence status: no fuse is broken.
ote, that a pull-up resistance has to be provided towards a positive voltage (3.3
V).
– SPI Bus: four wires are envisaged for path A and four for path B.
On board a bicolor LED is present to show:
• Green: board in service
• Red: internal fault (board out of service)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-60 PSF Functional Block Diagram
PSF
Sub_unit 1
OC and OV
Protections
EMI Filter
GNDM
Battery Fuses Fault

Failure Detectors
INPUT POWER Detector
STAGE (60W) GNDM
Sub_unit 2
48Vcc
3,6V SPIDER
R.I. Slot ID
UV Detector
...................................................................................................................................................................................................................................
Bus Termination Board (BUSTERM)
...................................................................................................................................................................................................................................

This board gives the electrical termination to buses routed on the backplane and also to
provide the LCI interface.
In the 1678 MCC equipment two BUSTERM boards are mandatory.
They are allocated behind the FLCSERV(A) and FLCCO GI boards (they are inserted
into the backpanel directly; these two boards are not visible on shelf front-panel).
Functional Description
The board takes on board networks to adapt all the signal buses of 1678 MCC backplane,
that are:
• ISPB bus
• ISSB/ISSB2 bus
• JTAG chain.
It also gives adaption to six 2 MHz lines (CK2M_x), two 1 Hz lines (1HzSY C) and the
power sync line (ALMSY C).
Furthermore, a LCI interface is present: this is the serial link between the FLC function
and a serial non-volatile memory (EEPROM) where the equipment local configuration
and the MAC address data are stored.
The bus termination board is powered by V3VA, V3VB lines coming from backpanel;
these are used to create all needed voltages within the board.
Spider and alarm control circuits are supplied by 3.3VS; data information concerning the
board is stored in a remote inventory EEPROM, while another roomier EEPROM
contains the MAC address data and the equipment local configuration.
Figure 4-61, “BUSTERM Functional Block Diagram” (p. 4-157) displays the block
diagram of the board.
ISPB bus is the communication way between uP and the ASICs of equipment, while
ISSB/ISSB2 buses are used to connect the main FLC with the SLC hosted in the matrix
board. All buses, JTAG chain included, need double termination, one at each end: this
goal is reached by inserting in the backpanel two BUSTERM boards.
On the BUSTERM is placed a FPGA called Spider to manage SPI buses. SPI is a low
speed serial communication channel used by SC to transfer data to/from serial devices on
different boards in the shelf.
Spider is connected to two SPI buses, one connected to matrix-A and one to matrix-B: it
reads the identification (ID) slot from backplane, manages remote inventory and collects
power supply alarms.
On the board is mounted an EEPROM with a serial protocol called remote inventory
interfaced to Spider. This memory stores data information regarding the board as code,
version, series and so on.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
LCI interface
It is the serial link between the FLC function and a serial EEPROM, placed on this board,
where the equipment local configuration and the MAC address data are stored.
The buffer before memory acts as MUX, since lines FLC_ACT_A and FLC_ACT_B
enable control lines toward FLCSERV(A) board or control lines toward FLCCO GI
board.
Power Supply Control and Alarms

Dedicated circuits check the presence of voltages on the board. This part generates
internal alarms to FLC (CFAIL and CMISS).
• green: unit in service
• red: internal fault (unit out of service)
Figure 4-61 BUSTERM Functional Block Diagram
BUSTERM
6
ID
E
3+1 SPIDER E
P
SPIA R
O
SPIB M
3+1
TRESHOLD
OSC (4 MHz) VOLTAGE
GENERATOR
(1.5V)
ISPB 25
ISSB 2 TERMINATIONS
ISSB2 2
JTAG 4
2 MHz CLK 6
1 Hz SYNC 2 ADAPTION
ALMSYNC
10
LCI I/F EEPROM
POWER LINES AND ALARMS
V3VA,V3VB CFAIL_BT CMISS CMISS_BT
...................................................................................................................................................................................................................................
Matrix 640 Gbit/s Board
...................................................................................................................................................................................................................................

There are two types of Matrix 640Gbit/s:
• Matrix 640Gbit/s enhanced (MX640)
This board is used for SDH applications.
• Matrix 640Gbit/s advanced (MX640GA)
This board is used for SOET applications.
Functional description
The board MATRIX 640 Gbit/s provides SO ET/SDH switching capabilities,
implementing MSPC (Multiplex Section Protection Connection) and HPC (Higher Order
Path Connection) switching functions.
The 1678 MCC equipment can host up to two Matrix boards; in this case, only one
Matrix board at a time is active, the other one is standing by.
The Matrix board supports the following functionalities:
• Cross-connection with STS-1 granularity of up to 4096 STM-1 signals (12288 signals
at AU3 level), non blocking
• Synchronization (Clock Reference Unit)
• Shelf Controller (SC)
• 1+1 EPS protection scheme (when two MX640 boards are present)
Features
The Matrix board address the following functional requirements:
• Management of 256 bi-directional links @ 2.5/2.7 Gbit/s (for an overall capacity of
640 Gbit/s)
• Forward Error Coding (FEC) protection of the 256 links through the backpanel
• Payload Performance Monitoring (PM)
• Traffic Sub etwork Connection Protection (S CP)
• Clock Reference Unit (CRU) of SDH quality - MX640
• Clock Reference Unit (CRU) of SOET STRATUM 3 quality - MX640GA
A functional block diagram with indication of main internal and external interfaces is
shown in Figure 4-62, “Matrix Board Functional Block Diagram” (p. 4-159).
For further details about how the MSPC and HPC functions are implemented from a
logical point of view to fulfil the ITU-T G.783 functional model.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-62 Matrix Board Functional Block Diagram
Port Payload Links

MX640
High
Control Signals
Order
Matrix
Shelf
Controller
Synchronization
Signals
SDH/SONET
Equipment Power
Clock Supply
Physical Description
The board is made up of a main board and a daughter board, the PQ2/SCM
(PowerQUICC2 / Shelf Controller Module), which hosts the Shelf Controller and the
ISPB bus master.
The front panel of the board provides access to the debug interface of the PQ2/SCM, to
the Shelf Controller, to the PQ2/SCM processor reset button, and is provided with one
multicolor LED. This LED can emit light of three different colors, with the following
meanings:
• Red color: internal failure (board out of service)
• Green color: board in-service
• Orange color: board stand-by
The following paragraphs provide details of different subsystems implementation.
Payload Subsystem Description

Payload Subsystem Logical and Physical High-level Description
The logical flow of traffic signals is shown in Figure 4-63, “Payload Subsystem Logical
Block Diagram” (p. 4-160).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-63 Payload Subsystem Logical Block Diagram
MX640(GA)
MSnP + Sn
The physical flow of traffic signals is shown in Figure 4-64, “Payload Subsystem
Physical Block Diagram” (p. 4-161).
The board hosts four ASICs (GA #0 to GA#3). Each GA is capable to interface 66 2.5
Gbit/s links. Of these 66 links, only 64 are used in the board. Therefore, each of the four
GA, as implemented on the board, is capable to process 1024 STM-1 equivalent signals,
to the required total of 4096 STM-1 equivalent capacity.
Since the GAs (GA #0 to GA #3) work in bit slice mode, each GA process 2 out of 8 bits
of the payload; therefore, no payload interfaces between the GAs are needed.
The GA is able to protect the traffic coming from/going to the Port boards using FEC. In
this case, because of the redundancy the frequency of the signal is 10/9 of the SDH
standard STM-16, that is 2.7 Gbit/s.
Each GA (GA #0 to GA #3) extracts/inserts some overhead information from/into the
backpanel links. This information is then transmitted/received by the GA #5 and GA #6
through two bi-directional 622 Gbit/s links for each GA #0 to GA #3, as shown in Figure
4-64, “Payload Subsystem Physical Block Diagram” (p. 4-161).
The information is then processed by GA #5 regarding path criteria, alarms, PM and
remote criteria and by GA #6 concerning section and path protection.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-64 Payload Subsystem Physical Block Diagram
MX640(GA)
GA #0
PQ2/SCM
GA #4
(PM collection)
2.5 Gb/s links to /from Backpanel
GA #1
GA #5
(Path criteria,
alarms, PM and
remote criteria)
GA #2
GA #6
(Section and
Path protection)
GA #3
Power Subsystem Description

The power subsystem is shown in Figure 4-65, “Power Subsystem Block Diagram”
(p. 4-162).
The main power characteristics (actual currents and efficiencies) are reported in Table
4-11, “Power characteristics” (p. 4-162).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-65 Power Subsystem Block Diagram
1.2 V To GA#0
DC/DC
On
1.2 V To GA#1
DC/DC
On
48 V Battery A
1.2 V To GA#2
Inrush DC/DC
Current
Limiter On
48 V Battery B
1.2 V To GA#3
DC/DC
Delay
On
1.8 V To GA#0,#1,#2,#3 and

FPGAs
DC/DC
On
1.5 V To FPGAs
To FPGAs and
2.5 V other logic
DC/DC
On
3.3 V VREG To FPGAs Hi
To Spider, LEDs
1.8 V Speed macros
and other Service
Service 3.6 V A powered logic
VREG To FPGAs Hi
2.5 V Speed macros
To on board
logic
Service 3.6 V B
VREG To GTL buffers

1.5 V
To OCXO
VTT for GTL

terminations
Note: GAs in Payload subsystem
Table 4-11 Power characteristics

DC/DC voltages, current and power
Voltage [V] Current [A] Power [W]
3.3 5 18
2.5 1.3 3.25
1.8 1.8 3.24
1.5 4 6
1.2 11.6 13.92
Regulators voltages, current and power
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 4-11 Power characteristics (continued)

2.5 1.4 3.5
1.8 0.2 0.36
Power consumption and overall efficiency
38.4 2.8 108
48 2.2 108
72 1.53 111
Timing Subsystem Description

The Matrix board has two main synchronization sources.
One is the Clock Reference Unit (CRU), which provides the main SDH/SO ET timing
reference for the whole equipment. The second is the PQ2/SCM Shelf Controller module,
which provides the clocks for the control interfaces.
In the following, each timing subsystem will be specified.
Clock Reference Unit
For SDH applications (MX640) the CRU is implemented in the GA #7 with the aid of an
external OCXO.
For SO ET applications (MX640GA) the CRU is implemented in the GA #8 with the aid
of an external OCXO.
The GA #8 is specific for the MX640GA (SO ET applications) and has the following
SO ET specific functions:
• Select a reference clock (from the T1 and DS-1 inputs) as configured by SC
• Alarm handling for DS-1 inputs
• Hold off time handling
• SSM extraction on DS-1 inputs.
When the equipment hosts two Matrix boards, one CRU is master and the other is slave.
The slave CRU must closely track the master CRU both in frequency and in phase. To
this goal, the two CRUs must exchange some synchronization signals.
The connections of the CRU on the board are shown in Figure 4-66, “CRU, On- and Off-
Board Connections in SDH Applications” (p. 4-164) for SDH and in Figure 4-67, “CRU,
On- and Off- Board Connections in SO ET Applications” (p. 4-166) for SO ET
applications.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-66 CRU, On- and Off- Board Connections in SDH Applications
BACK PANEL
M ATRIX A M ATRI X B
VCXO
622 MHz
To otheron on boardlogic 622MHz
FL CCONGI
Cl ocks to
2 M b/s
2 M Hz
F(s)
FL CSERV (A )
Cl ocks to
2 M Hz
2 M b/s
OUTSD_P_10S
CK OUT_ES
DTOUT_ES
CK OUT_EC
DTOUT_EC
OUTSD_N_10S
PHOFSIN PHOFSIN
?? PHOFSOUT PHOFSOUT
SY_1HZIN SY1HZ_IN
CK 622
CK38CRU CK_77S
:8 SY_1HZOUT SY_1HZOUT
FA N Uni ts
A nd l ower
To Upper
CKOUT1 CK51CRU
FR2MIN FR2MIN
CK38A,
FR2MOUT FR2MOUT
GA #3 SYNCA
CK_H O_IN CK_HO_IN
CK38,
To otheron on boardlogic SYNC38 CK_HO_BIDIR CK_HO_BIDIR
To Backpanel
Ports
Cl ocks f rom
Si x 2 M Hz
OCXO CK10S CK_2EXT CK_2EXT

10 MHz
Cl ocks f rom Cl ocks f rom
FL CCONGI FL CSERV (A )
2 M Hz
2 M b/s
IRQ6_SY1SEC CKINEC CKINEC

To GA #5 on PQ2/SCM
DIN_EC DIN_EC
VIOL_EC VIOL_EC
2 M Hz
2 M b/s
CKINES CKINES
DIN_ES DIN_ES GA #7
GA #7 VIOL_ES VIOL_ES
The CRU T0 and T4 PLL can lock either on the local OCXO, on any of the 2 MHz clocks
coming from the port boards, on the 2 MHz / 2 Mbit/s or 1.544 Mb/s clocks coming from
the FLCSERV(A) and FLCCO GI or on the second CRU, if present.
Then the clock system:
• Locks a 622 MHz VCXO on the chosen primary reference. This 622 MHz clock is
then distributed on board to all SDH processing logic.
• Derives from the 622 MHz clock a 38 MHz clock and 125 ms synchronism signal to
be distributed on board to all SDH processing logic and through the backpanel to
every payload processing board as the main synchronism reference.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Provides the T4 2 MHz / 2 Mbit/s (or 1.544 Mb/s) reference clocks to the
FLCSERV(A) and FLCCO GI.
• Provides the 1 second synchronization signal to GA #4 on PQ2/SCM.
The GA #3 is included in the 622 MHz loop because the FPGA in which GA #7/GA #8 is
implemented does not provide high-frequency interfaces. Therefore, the GA #3 divides
the clock by 8 before feeding it to GA #7/GA #8.
The GA #3 then requires a complex clock system, also comprising a second PLL at a
frequency of 691 MHz to support FEC.
PQ2/SCM Module
The PQ2/SCM module provides the timing references (clocks and signals) necessary to
the Control subsystem.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-67 CRU, On- and Off- Board Connections in SONET Applications
BACKPANEL
MATRIX A MATRIXB
VCXO
622 MHz
622 MHz
To other on on board logic
FLCCONGI
1.544 Mb/s
1.544 MHz
Clocks to
F(s)
FLCSERVA
1.544 Mb/s
1.544 MHz
Clocks to
IRQ6_SY1SEC
OUTSD_N_10S
OUTSD_P_10S
CKOUT_EC
CKOUT_ES
DTOUT_EC
DTOUT_ES
CK622
PHOFSIN PHOFSIN
CK38CRU CK_77S
?? PHOFSOUT PHOFSOUT
:8
SY_1HZIN SY1HZ_IN
SY_1HZOUT SY_1HZOUT
And lower
Fan Units
To Upper
CKOUT1 CK51CRU
CK38A, CK_HO_IN spare CK_HO_IN

GA #3 SYNCA
CK_HO_BIDIR CK_HO_BIDIR
FLCCOPNGI
CK38, Fr
Clocks from
1.544 Mb/s
1.544 MHz
To other on on board logic

SYNC38 CKINEC
CKINEC
To Backpanel DIN_EC DIN_EC
+2 VIOL_EC VIOL_EC
2x77.76MHz
Div
Clocks from
FLCSERVA
1.544 Mb/s
1.544 MHz
TO3, TO5
CKINES
2x1.544MHz CKINES
DIN_ES DIN_ES
Sel & Div TO2, TO9
VIOL_ES VIOL_ES
I13
I12
Clocks from
T4 PLL
Six 2 MHz
CK_2EXT CK_2EXT
Ports
T0 PLL
I11 FR2MIN
FR2MIN
TO10 FR2MOUT
??? FR2MOUT
SONET/SDH GA #8 GA #8
MASTER/SLV
OCXO
12.8 MHz To FALCO on PQ2/SCM
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Control Subsystem Description

PQ2/SCM Module
The PQ2/SCM module provides the control interfaces and Figure 4-68, “PQ2/SCM
Control Interfaces” (p. 4-168) shows their connections. They are detailed in the following
paragraphs:
• Spider SPI Bus
The Spider block on the board can be controlled both via the local Spider bus driven
by the PQ2/SCM or via the remote Spider bus coming from the second Matrix board.
– Remote Inventory: the Remote Inventory EEPROM can be accessed via SPI
through Spider in transparent mode; the EEPROM is connected to Spider Chip
Select #0.
– SPI Temperature Sensor: the SPI Temperature Sensor EEPROM can be accessed
via SPI through Spider in transparent mode; the Temperature Sensor is connected
to Spider Chip Select #1.
• GA #9 CMISS and ID Bus
The GA #9 is used to serialize the Board Missing (CMISS) and local board
Identification codes (ID) towards the PQ2/SCM, to reduce the pin count of the
PQ2/SCM connectors. The CMISS data is used by the microprocessor to know which
boards are present in the shelf. The ID data is used by the microprocessor to know the
Matrix board board version, the equipment type, the shelf ID, etc.
• FPGA Download Bus & Hardware Configuration Bus
This bus is used to download the local GA #5, GA #6 and GA #7/#8 on the board and
to download/upgrade the remote FPGA on the other boards. This is a serial bus; the
local signal levels are CMOS, while the GTL electrical standard is used to
communicate with the other boards in the shelf.
• ISSB Bus
This bus is multi-master backplane serial bus providing the physical connection
between boards in the same shelf. The bus uses the GTL electrical standard.
• ISPB Bus
This bus is a parallel bus through which the microprocessor on the PQ2/SCM module
can access the internal registers of ASIC or FPGA devices placed on the various
boards in the shelf which provide ISPB access.
• I2C Bus
This is a serial bus used locally on the board to read the temperature sensors and to
control the on / off status of the outputs of the ISPB clock distribution logic.
• IPL Bus
This bus is a 2 wire serial communication channel communication channel used by
the PQ2/SCM of a protected pair of Matrix boards to keep their configuration and
status data aligned each other.
• ACT / OPE Active / Operative Status Management Logic
The two Matrix boards exchange some signals to decide which board is the active
master.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Debug Interface
The PQ2/SCM provides a standard serial interface for debugging purposes. The
interface is accessible from a connector on the front panel (only for Alcatel-Lucent
service persons).
• LA Interface.
Two LA interfaces of the PQ2 are transformed on the main board with transceivers
to Ethernet standard.
In case of LX160 (LO matrix of the LO extension shelf) the software image download
and the controlling from the main shelf (FLCSERVICE and FLCCO GI) will be
done by using this connections. The interfaces support 10 Mbps and 100 Mbps
Ethernet standard (10/100BASE-T).
• Reset Management.
• Interrupt Management.
Figure 4-68 PQ2/SCM Control Interfaces

From / To all
boards
From / To SPIB SPIA
other Matrix SPIDER
T Sensor T Sensor
BUFFER
SPI bus
From / To 2 x LAN
other Matrix I2C bus
IPL bus
To/From other Debug
Matrix and to
GTL BUFFER
FLCCONGI and ISSB bus

FLCSERV(A)
To / From CFG bus
Ports and
FLCSERV(A)
DMUX MUX
PQ2/SCM
GTL BUFFER
To / From
Ports and
ISPB bus
ACT / OPE
CMISS bus
other Matrix
ID bus
From / To
other Matrix
GA #0
GA #7/#8 GA #9
GA #1
GA #5
GA #2
GA #6
GA #3
MX640 (GA)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Self Diagnosis Subsystem Description

Fuse, Battery and Undervoltage Alarms
The board has the capability to monitor the presence of both batteries A and B, the fuse
status and to detect a DC/DC or voltage regulator output undervoltage condition.
These alarms are all collected by Spider block. However, there is also a visual indication
through 16 LEDs on the back of the board, under the shield.
The undervoltage alarms are also collected.
Temperature Sensors
The board hosts three temperature sensors.
One is controlled via SPI bus and is able to give only its temperature. The other two are
controlled via I2C bus and are able to read their own temperature as well as the
temperature of some remote components.
Parallel I/O description

Board LEDs
The board has a one front panel light. The light is generated by a dual LED. The color can
be green, red or a combination of the two (orange).
Spider ASIC Parallel I/Os
The Spider ASIC is used to control several board I/Os (four lines)
PQ2/SCM Parallel I/Os
The other board I/Os are controlled by PQ2/SCM general purpose I/Os.
External Interfaces Description

The external interfaces are splitted in:
• High-Frequency Backpanel Signals
• Low-Frequency Backpanel Signals and Power Supply Lines
• Debug Front Panel Connector Signals
• LA Front Panel Connector Signals
Mechanical Design Description

The Matrix board is 8TE wide, 440 mm x 210 mm.
...................................................................................................................................................................................................................................
Matrix 320/160 Gbit/s Enhanced Board (MX320 / MX160)
...................................................................................................................................................................................................................................
Matrix 320/160 Gbit/s Enhanced Board (MX320 / MX160)

The functional and physical descriptions of the MX320 and MX160 boards are similar to
the MX640 board. Only the switching capacity is different.
The following types exists:
• Matrix 320Gbit/s advanced (MX320GA)
This board is used for SOET applications.
...................................................................................................................................................................................................................................
Lower Order Adaptation and Matrix 40G and 20G (LAX40
...................................................................................................................................................................................................................................
and LAX20)
Lower Order Adaptation and Matrix 40G and 20G (LAX40 and
LAX20)
The LAX board is used in the 1678 MCC Main Shelf partsystem which is introduced in
1678 MCC. The main purpose of this new partsystem is to build a 4/3/1 Crossconnect
designed for the ETSI and A SI Market.
The LAX board implements the lower order matrix together with the so called adaptation
function (higher order path termination and adaptation function), refer to Figure 4-69,
“LAX40 Functional Overview” (p. 4-172).
Lower Order Matrix

The lower order matrix is a square matrix. Switching is performed at VC-3 and VC-12
level in SDH application and VC-11 for SO ET applications.
One LAX40 board has a capacity of 40Gb/s and is always 1+1 protected.
One LAX20 board has a capacity of 20Gb/s and is always 1+1 protected.
Lower Order Adaption Function

The lower order adaption function is located between the interface to HO subsystem and
the matrix function (refer to Figure 4-69, “LAX40 Functional Overview” (p. 4-172)). In
other words these chips terminate the administrative units AU4 of an STM-64 byte serial
stream in receive direction into lower order VC-n and multiplexes lower order VC-n in
transmit direction into the administrative units AU4 of an STM-64 byte serial stream.
The lower order adaption function supports fault detection, alarm generation and
performance monitoring for higher and lower order.
The chip set of this function is furthermore SO ET compliant. For instance the chips are
capable to terminate administrative units AU3 and to process virtual tributaries VT1.5.
The chips additionally support AU3/AU4 conversion. These functionalities are used for
SO ET and SDH/SO ET interworking.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
and LAX20)
Figure 4-69 LAX40 Functional Overview
LAX40
LO Adaptation
and Monitoring
Backplane
Interface
to HO Matrix
Subsystem
Data Connections
The data connections between higher order matrix and the lower order matrix board are
done via differential signal lines over the backplane at 2.5 Gb/s.
Synchronization and Clock Distribution
The LAX board receives two 38 MHz clock signals (Copy_A and Copy_B) and two
38MBit/s data signals (Copy_A and Copy_B). These synchronization signals are led to
VIVALDI ASIC, which performs the synchronization function. The data signal comprises
frame and multiframe information (1Hz/8kHz) to synchronize the board to the 1678 MCC
internal framing. The data signal is read by the 38 MHz clock. The 38 MHz clock is also
used to generate the 622 MHz system clock by means of a VCO.
A frame generator provides the required 1 Hz, 2 kHz and 8 kHz frame and
synchronization signals for the LAX board.
Power Subsystem
There are two independent power interface inputs, each coming from a PSF board.
On the LAX board there are four central DC/DC converters (48 V to 1.2/5 V) and four
point of load (POL) converters (5 V to 1.5/1.8/2.5/3.3 V). An inrush current limitation
circuit and a filter are provided in front of the central DC/DC converters for current
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
and LAX20)
limitation when the board is plugged in. A central DC/DC power converter provides a
galvanically isolated power (5 V) to the POL converters. The POL converters deliver the
various voltages:
• 1.5 V
• 1.8 V
• 2.5 V
• 3.3 V
used by the ASICs and FPGAs on the LAX board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
and LAX20)
Figure 4-70 LAX40 (LAX20) Board Block Diagram
Card present Slot ID

CLK 155 1.2 V, 2.5 V
#4 [#2 (LAX20)]
#1
TUPP
32 x 2.5 GBPS
Matrix VIVALDI 16 x 2.5 GBPS
STM 16 Adaptation Function
Copy A/B
Sync. A+B Clock VCXO

622MHz MOT Int Sync. Ctrl
Clk A+B
CLK 155 1.2 V, 2.5 V

1/4
Divider
ISPB
CF WSE 40
from HO
WSE 20 (LAX20)
SLC A/B
CLK 155 Matrix Function
Sync.
16 x 2.5 GBPS
OH Bus STM 16
MOT Ctrl
Int Sync.
Slot_ID
Sync.MOT Int. CPLD
[5..0]
SYSID
Sync.
Spare PM IF PQ2/SCM
links ISSB_1
ISPB local bus ISSB_2
AM-
PS interface RA LAN
SEL1
to Partner M Debug
LAX40
(LAX20)
HW_CFG
3.3 V A, B +
HW_CFG GOBLIN FEPROM Power
2.5 V
&
1.8 V
Filter
A, B
SPI A RI Ctrl 1.5 V
DC/DC
SPI B & GPIO 1.2 V FPE
Service Temp.
3.3 V
Power
Ctrl Manager
...................................................................................................................................................................................................................................
STM-64 traffic Port Boards with not pluggable MSA
...................................................................................................................................................................................................................................
Modules
STM-64 traffic Port Boards with not pluggable MSA Modules

Introduction
In the 1678 MCC equipment several types of STM-64 interfaces are available with
different implementation on board (one, two or four optical interfaces). The optical MSA
modules are not pluggable, they are fixed on the board.
The following description covers all different items equipped. The same motherboard can
support the following modes using different equipping options:
• 4 x I64.1 optical interfaces (P4I64)

• 2 x I64.1 optical interfaces (P2I64M)
• 1 x I64.1 optical interface (I-64.1M)
• 4 x S64.2 optical interfaces (P4S64)
• 2 x S64.2 optical interfaces (P2S64)
• 1 x S64.2 optical interface (S-642M)
• 1 x L64.2 optical interface (L-642M)
• 1 x V64.2 optical interface (V-642M)
• 1 x U64.2 optical interface (U-642M).
The STM-64 board provides optical interface for one, two or four tributaries at STM-64
rate for Short, VSR (Intra-office), Long, Very Long and Ultra Long connections. It also
contains circuitry for management, configuration, and control of on-board devices
through backplane SPI, ISPB and Hardware & Configuration buses.
Main Features
The main features of STM-64 board are shown in the following.
The STM-64 boards are composed of a single PCB supporting various modes based on
the mounting options. Depending on the optical devices, there are different modes as
mentioned.
The board has always GA #1, GA #2 and GA #3 (and GA #4 when are mounted four
optical interfaces) as common devices in the data path, for all the modes (refer to Figure
4-71, “Equipping Options of STM-64 Boards” (p. 4-176)):
• The P4S64M board
– 4 x S-64.2 (P4S64) has four S-64.2b optical modules and its associated circuitry.
– 4 x I-64.1 (P4I64) has four I-64.1 optical modules and its associated circuitry.
• The P2S64M board
– 2 x S-64.2 (P2S64) has two S-64.2b optical modules and its associated circuitry.
– 2 x I-64.1 (P2I64M) has two I-64.1 optical modules and its associated circuitry.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
• The S64M board

– 1 x S-64.2 (S-642M) has one S-64.2b optical module and its associated circuitry.
– 1 x L-64.2 (L-642M) has one L-64.2 optical module and its associated circuitry.
– 1 x V-64.2 (V-642M) has one V-64.2 optical module and its associated circuitry.
– 1 x U-64.2 (U-642M) has one U-64.2 optical module and its associated circuitry.
– 1 x I-64.1 (I-64.1M) has one I-64.1 optical module and its associated circuitry.
Figure 4-71 Equipping Options of STM-64 Boards
S64.2
I64.1
GA #3
S64.2
I64.1
GA #2 GA #1
S64.2
I64.1
GA #4
S64.2
I64.1
Equipping option of P4S64M
S64.2
I64.1
GA #3
S64.2
I64.1
GA #2 GA #1
Equipping option of P2S64M
S64.2
L64.2
V64.2 GA #3
U64.2
I64.1
GA #2 GA #1
Equipping option of S64M
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
Main components of STM-64 boards are the following (refer to Figure 4-72, “STM-64
Board Functional Block Diagram” (p. 4-178)):
• The STM-64 board provides GA #1 device for interface with the backplane. This is a
CMOS ASIC with 2.5 Gbit/s I/O, 2 x 40 Gbit/s throughput.
• The STM-64 board provides GA #3 (and GA #4) device as an STM-64 Framer. This is
a CMOS ASIC with 2.5 Gbit/s I/O, 2 x10 Gbit/s throughput.
• The STM-64 board provides GA #2 device and associated SRAM for overhead
management. This is a CMOS FPGA.
• The STM-64 board provides GA #5 device for following functions:
– Monitor and generate various status and control signals through its ports.
– Interface on-board temperatures sensors.
– Interface to on-board SEEPROM for Remote Inventory information through board
internal SPI bus.
– Generate signals for board status LED for board status reporting.
– Provide I2C like protocol for the on-board interfacing devices.
– Interface to flash EEPROM for on board FPGA code.
– Provide HW&CFG bus for remote code change inside flash EEPROM.
• The STM-64 board provides DC-DC converters to generate all the required voltages
from input 48 V DC.
• The STM-64 board provides in-rush current limiting circuitry on input 48 V DC.
• The STM-64 board provides VCXOs and associated circuitry for external clock
Generation and PLL function.
• The STM-64 board provides back plane interface using press-fit connectors, for
following:
– Incoming and outgoing DCC channels.
– Timing information and Data flow from both switch matrices.
– SPI links A and B for power up status /configuration.
– ISPB bus.
– Reading the slot identification.
– 48 V DC and 3.3 V service voltage.
• The STM-64 board provides circuitry on board to:
– Distribute clock / timing information coming from the back plane to different
on-board components.
– Indication of programming status of GA #2.
– Provide access to GA #1. GA #2 internal registers through ISPB bus and
associated GTL buffers, and their enabling circuitry.
– Other miscellaneous circuitry.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
Figure 4-72 STM-64 Board Functional Block Diagram
MSA
transponder
GA #2
GA #3
MSA
POWER
from / to line
transponder SUPPLY
backplane
MSA
transponder
GA #4 GA #1
MSA Temperature
transponder sensors
TIMING LOGIC
GA #5
The following paragraphs provide details of different subsystems implementation.

The data flow on the STM-64 boards is shown in Figure 4-73, “STM-64 Board Payload
Subsystem Block Diagram” (p. 4-179).
The MSA transponders connect to GA #3 which further interfaces with the backplane
through GA #1. Only GA #3 is shown in the picture as the second one (GA #4) is
connected in the same way to GA #1.
MSA - GA #3 interface
The MSA transponders interface with the GA #3 (and GA #4) through 622 Mbit/s data
signal lines.
GA #3 - GA #1 interface
The GA #3 (and GA #4) interfaces with GA #1 through 2488 Mbit/s data signal lines. It
provides a bandwidth of 19904 Mbit/s so eight differential pair (for each direction) are
used to connect GA #3 (and GA #4) to GA #1.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
Figure 4-73 STM-64 Board Payload Subsystem Block Diagram
from / to Matrices A and B

16 x 622 Mbit/s
4 x 2.5 Gbit/s
MSA
1 16 x 2.5 Gbit/s
from / to line
backplane
GA #3 GA #1
MSA 16 x 2.5 Gbit/s

2
16 x 622 Mbit/s
4 x 2.5 Gbit/s

The STM-64 board gets a supply voltage of 48 V from the back panel and uses this to
generate the voltages of 3.3 V, 5.0 V, -5.0 V, 1.2 V, 1.5 V, 1.8 V on the board.
There is an in-rush current protection circuitry provided on the board. The power scheme
is summarized in Figure 4-74, “STM-64 Board Power Supply Block Diagram” (p. 4-179).
Figure 4-74 STM-64 Board Power Supply Block Diagram
+48 V
+ BATT DC/DC conv. +1.2 V
From #1
Backplane 48 V
BATT +48 V
DC/DC conv. +3.3 V
In rush #2
current 48 V
limiting
+48 V 5 V
circuitry DC/DC conv.
#3 +5 V
48 V
+48 V
DC/DC conv. 1.5 V
#4
48 V 1.8 V
3.3 VA
From
Backplane VS GA #5
3.3 VB
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules

The timing and clock circuitry is shown in Figure 4-75, “STM-64 Board Timing and
Clock Block Diagram” (p. 4-180).
Figure 4-75 STM-64 Board Timing and Clock Block Diagram
622MHz
VCXO
622MHz 622MHz
Phase
MFSYA, B
from / to line
38MHz
MSA 622MHz 77.76MHz GA #1
CLK
GA #3
155MHz
155MHz
77.76MHz
VCXO GA #2
155MHz
Miscellaneous Subsystems Description

Control subsystem
The GA #5 drives the GA #2 for configuration purposes.
Parallel I/O and self-diagnosis subsystems
The Parallel I/O subsystem manages Alarms, commands, LEDs present in the boards and
mapping to parallel I/O registers of the control interface, indicating meanings and
activation levels.
The Self-diagnosis subsystem monitors the temperature sensor that are placed on the
board.
Main alarms are related to LOS, LASER_OFF, FUSES, BATT.
• green: board in service
• red: internal fault (board out of service).
...................................................................................................................................................................................................................................
STM-64 traffic Port Boards with pluggable XFP MSA
...................................................................................................................................................................................................................................
Modules
STM-64 traffic Port Boards with pluggable XFP MSA Modules

Two SDH I/O boards with pluggable XFP modules are supported:
• 1..4x STM-64 board with XFP/XFP-E type pluggable modules
• 1..2x STM-64 board with XFP/XFP-E type pluggable modules
The types of introduced modules are (according to ITU-T G.691, G959):
• I-64.1 (2 km)
• S-64.2b (40 km)
• L-64.2 (80 km) - XP1L12D2 and DWDM APD
ote: DWDM APD modules are only supported in R4.3.2 and higher Releases.
From a functional point of view this board is compatible to the 4xSTM-64 MSA port
board supported already in Rel. 3.0. Main difference is that the board has in service
pluggable optical modules. A serializer/deserializer (SERDES) device is needed for each
XFP/XFP-E module to adapt the 10 Gbit/s serial XFI interface to the 16bit wide SFI-4.1
interface of DAFFODIL.
4xSTM-64 XFP Port Board

This is a 1 to 4 interface port board supporting the following pluggable optical modules:
• XFP formfactor optical modules:
– OPT TRX S-64.2B XFP
– OPT TRX I-64.2B XFP
– OE - TRX XFP 80 KM STD SIZE (XP1L12D2 - L-64.2)
• XFP formfactor colored optical modules:
– OE - TRX XFP DWDM Ch 60 to Ch 17 (DWDM APD - L-64.2)
• XFP-E formfactor optical modules:
– OPT TRX XFP S-64.2B Ext
The board supports:
• Fully equipped module configuration (4 XFP/XFP-E modules are plugged in)
• Partly equipped module configuration (configuration with 1 to 4 XFP/XFP-E modules
is possible)
• Mixed module type configuration (any mix of different XFP/XFP-E modules is
supported)
• In service changeable configuration.
Figure 4-76, “Functional Blocks of the 4xSTM-64 Port Board” (p. 4-182) shows a block
diagram of the 4xSTM-64 board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
Figure 4-76 Functional Blocks of the 4xSTM-64 Port Board
4xSTM 64 4xSTM 64 16xSTM 16 like 4xSTM 64 XFP

(XFI) (SFI 4.1)
STM 64 SerDes
XFP/ E 16:1
#1
GA #3
STM 64 SerDes
XFP/ E
16:1
#2
GA #1
GA #2
STM 64 SerDes
XFP/ E 16:1
#3
GA #4
STM 64 SerDes
XFP/ E
16:1
#4
2xSTM-64 XFP Port Board

This is a de-populated 4xSTM-64 XFP port board as described in “4xSTM-64 XFP Port
Board” (p. 4-181). It is cut down to 1x Daffodil, 2x SERDES and max. 2x XFP/XFP-E
modules.
The 1 to 2 interface port board supports the following pluggable optical modules:
• XFP formfactor optical modules:
– OPT TRX S-64.2B XFP
– OPT TRX I-64.2B XFP
– OE - TRX XFP 80 KM STD SIZE (XP1L12D2 - L-64.2)
• XFP formfactor colored optical modules:
– OE - TRX XFP DWDM Ch 60 to Ch 17 (DWDM APD - L-64.2)
• XFP-E formfactor optical modules:
– OPT TRX XFP S-64.2B Ext
The board supports:
• Fully equipped module configuration (2 XFP/XFP-E modules are plugged in)
• Partly equipped module configuration (configuration with 1 to 2 XFP/XFP-E modules
is possible)
• Mixed module type configuration (any mix of different XFP/XFP-E modules is
supported)
• In service changeable configuration.
Figure 4-77, “Functional Blocks of the 2xSTM-64 Port Board” (p. 4-183) shows a block
diagram of the 2xSTM-64 board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Modules
Figure 4-77 Functional Blocks of the 2xSTM-64 Port Board
2xSTM 64 2xSTM 64 2xSTM 64 XFP

8xSTM 16 like
(XFI) (SFI 4.1)
STM 64
XFP/ E SerDes
#1 16:1
GA #3
STM 64
XFP/ E SerDes
#2 16:1 GA #1
GA #2
Timing Subsystem
The timing and clock circuitry is shown in Figure 4-78, “STM-64 XFP Board Timing and
Clock Block Diagram” (p. 4-183)
Figure 4-78 STM-64 XFP Board Timing and Clock Block Diagram
622MHz
VCXO
VCXO 622MHz 622MHz
622MHz
Phase
MFSYA, B
from / to line
Phase
GA #1
38MHz
XFP/ E SerDes 622MHz GA #3 77.76MHz
CLK
155MHz 155MHz 155MHz

77.76MHz
VCXO
GA #2
155MHz
...................................................................................................................................................................................................................................
STM-16 traffic Port Board (P16S16)
...................................................................................................................................................................................................................................

In the 1678 MCC equipment several types of STM-16 interfaces are available with the
same implementation on board (up to sixteen STM-16 optical interfaces).The following
description covers all different items (S-16.1, L-16.1 and L-16.2) equipped on the P16S16
board.
The STM-16 interfaces are composed by SFP plug-in modules.
The STM-16 board provides optical interface for sixteen tributaries at STM-16 rate for
Short and Long connections. It also contains circuitry for management, configuration, and
control of on-board devices through backplane SPI, ISPB and Hardware&Configuration
buses.
The STM-16 boards are composed of a single PCB supporting various modes based on
the mounting options. The board has always GA #1, GA #2 and GA #3 as common
devices in the data path (refer to Figure 4-79, “STM-16 board Functional Block Diagram”
(p. 4-185)).
Main components of STM-16 boards are the following (refer to Figure 4-79, “STM-16
board Functional Block Diagram” (p. 4-185)):
• The STM-16 board provides GA #1 device for interface with the backplane. This is a
CMOS ASIC with 2.5 Gbit/s I/O, 2 x 40 Gbit/s throughput.
• The STM-16 board provides GA #3 device as an STM-64 Framer .This is a CMOS
ASIC with 2.5 Gbit/s I/O, 2 x10 Gbit/s throughput.
• The STM-16 board provides GA #2 device and associated SRAM for overhead
management. This is a CMOS FPGA.
• The STM-16 board provides GA #5 device for following functions:
– Monitor and generate various status and control signals through its ports.
– Interface on-board temperatures sensors.
– Interface to on-board SEEPROM for Remote Inventory information through board
internal SPI bus.
– Generate signals for board status LED for board status reporting.
– Provide I2C like protocol for the on-board interfacing devices.
– Interface to flash EEPROM for on board FPGA code.
– Provide HW&CFG bus for remote code change inside flash EEPROM.
• The STM-16 board provides DC-DC converters to generate all the required voltages
from input 48 V DC.
• The STM-16 board provides in-rush current limiting circuitry on input 48 V DC.
• The STM-16 board provides VCXOs and associated circuitry for external clock
Generation and PLL function.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• The STM-16 board provides back plane interface using press-fit connectors, for
following:
– Incoming and outgoing DCC channels.
– Timing information and Data flow from both switch matrices.
– SPI links A and B for power up status /configuration.
– ISPB bus.
– Reading the slot identification.
– 48 V DC and 3.3 V service voltage.
• The STM-16 board provides circuitry on board to:
– Distribute clock / timing information coming from the back plane to different
on-board components.
– Indication of programming status of GA #2.
– Provide access to GA #1. GA #2 internal registers through ISPB bus and
associated GTL buffers, and their enabling circuitry.
– Other miscellaneous circuitry.
Figure 4-79 STM-16 board Functional Block Diagram
SFP
module
GA #2
1
POWER
from / to line
SUPPLY
GA #3
backplane
GA #1
SFP
module Temperature
16 sensors
TIMING LOGIC
GA #5

The data flow on the STM-16 boards is shown in Figure 4-80, “STM-16 Board Payload
Subsystem Block Diagram” (p. 4-186).
The MSA transponders connect to GA #3 which further interfaces with the backplane
through GA #1.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
MSA - GA #3 interface
The MSA transponders interface with the GA #3 (and GA #4) through 2.5 Gbit/s data
signal lines.
GA #3 - GA #1 interface
The GA #3 interfaces with GA #1 through 2488 Mbit/s data signal lines. It provides a
bandwidth of 19904 Mbit/s so eight differential pair (for each direction) are used to
connect GA #3 to GA #1.
Figure 4-80 STM-16 Board Payload Subsystem Block Diagram
from / to Matrices A and B

1 x 2.5 Gbit/s
8 x 2.5 Gbit/s
SFP
1 16 x 2.5 Gbit/s
from / to line
backplane
GA #3 GA #1
SFP 16 x 2.5 Gbit/s

16
1 x 2.5 Gbit/s
8 x 2.5 Gbit/s

The STM-64 board gets a supply voltage of 48V from the back panel and uses this to
generate the voltages of 3.3 V, 1.2 V, 1.5 V, 1.8 V on the board. There is an in-rush current
protection circuitry provided on the board. The power scheme is summarized in Figure
4-81, “STM-16 Board Power Supply Block Diagram” (p. 4-187)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-81 STM-16 Board Power Supply Block Diagram
+48 V
+ BATT DC/DC conv.
+1.2 V
From #1
Backplane 48 V
BATT +48 V
DC/DC conv. +3.3 V
In rush #2
current 48 V
limiting
circuitry REG.
1.8 V
+48 V
DC/DC conv. 1.5 V
#4
48 V
1.2 V
3.3 VA
From GA #5
Backplane VS
3.3 VB

The timing and clock circuitry is shown in Figure 4-82, “STM-16 Board Timing and
Clock Block Diagram” (p. 4-187).
Figure 4-82 STM-16 Board Timing and Clock Block Diagram
622MHz
VCXO
622MHz 622MHz
Phase
MFSYA, B
from / to line
SFP 77.76MHz
622MHz
38MHz
GA #3 GA #1
155MHz CLK
155MHz
77.76MHz
VCXO
GA #2
155MHz
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Miscellaneous Subsystems Description

Control subsystem
The GA #5 drives the GA #2 for configuration purposes.
Parallel I/O and self-diagnosis subsystems
The Parallel I/O subsystem manages Alarms, commands, LEDs present in the boards and
mapping to parallel I/O registers of the control interface, indicating meanings and
activation levels.
The Self-diagnosis subsystem monitors the temperature sensor that are placed on the
board.
Main alarms are related to LOS, LASER_OFF, FUSES, BATT.
• green: board in service
• red: internal fault (board out of service).
...................................................................................................................................................................................................................................
STM-16 Traffic Port Board (P4S16, P8S16)
...................................................................................................................................................................................................................................
STM-16 Traffic Port Board (P4S16, P8S16)

The functional and physical descriptions of the P4S16 and P8S16 boards are similar to the
P16S16 board. Only the number of interfaces is different.
...................................................................................................................................................................................................................................
16xSTM-1/4 Traffic Port Board (P16S1-4)
...................................................................................................................................................................................................................................
16xSTM-1/4 Traffic Port Board (P16S1-4)

In the 1678 MCC equipment several types of STM-1 and STM-4 interfaces are available
with the same implementation on board (up to sixteen STM-1 electrical interfaces, up to
sixteen STM-1 optical interfaces, up to sixteen STM-4 or a mix of STM-1 and STM-4).
For the "mixed configuration" is provided the "quartet rule": the sixteen interfaces are
managed in four blocks (quartet) and the interfaces within the same quartet must be
STM-1e/o or STM-4 (for example: if the first interface provisioned in the same quartet is
STM-1, also the other three interfaces of the quartet have to be STM-1).
Within the quartet a mix of electrical, short haul or long haul modules is possible.
EPS for STM-1 electrical is not supported.
The following description covers all different items equipped on the P16S1-4 board:
• for STM-1e: SES1
• for STM-1o: S-1.1, L-1.1 and L-1.2
• for STM-4: S-4.1, L-4.1 and L-4.2
The STM-1 and STM-4 interfaces are composed by SFP plug-in modules.
Functional and Physical Description

The functional and physical descriptions of the P16S1-4 board are similar to P16S16
board.
For the functional description refer to “Functional Description” (p. 4-184).
For the physical description refer to “Physical Description” (p. 4-184).
...................................................................................................................................................................................................................................
16xSTM-1 Traffic Port Board (P16S1S)
...................................................................................................................................................................................................................................
16xSTM-1 Traffic Port Board (P16S1S)

In the 1678 MCC equipment several types of STM-1 interfaces are available with the
same implementation on board (up to sixteen STM-1 electrical interfaces, up to sixteen
STM-1 optical or a mix of both). Any mix of the supported interfaces is allowed.
EPS for STM-1 electrical is not supported.
The following description covers all different items equipped on the P16S1S board:
• for STM-1e: SES1
• for STM-1o: S-1.1, L-1.1 and L-1.2
The STM-1e and STM-1o interfaces are composed by SFP plug-in modules.
Functional and Physical Description

The functional and physical descriptions of the P16S1S board are similar to P16S16
board.
For the functional description refer to “Functional Description” (p. 4-184).
For the physical description refer to “Physical Description” (p. 4-184).
...................................................................................................................................................................................................................................
4/8/16xGigabit Ethernet Port Board
...................................................................................................................................................................................................................................

The Gigabit Ethernet (GE) board exists in three variants:
• 16xGE
• 8xGE
• 4xGE.
It can provides up to 16 SFP modules, which support the following types of interfaces:
• Opto TRX 1.25GBE SFP-SX
• Opto TRX 1.25GBE SFP-LX
• Opto TRX 1.25GBE SFP-ZX.
The GE ports can be mixed in a flexible way. The optical SFP modules can be equipped
in flexible way:
• flexible mix of short range (1000Base-SX) and long range (1000Base-LX) optics
• flexible equipment of ports from:
– 1 to 4 SFP modules (4xGE)
– 1 to 8 SFP modules (8xGE)
– 1 to 16 SFP modules (16xGE).
ote: 1GE interfaces are relying on adjacent nodes to guarantee in-profile traffic.
Out-of-profile frames might be dropped regardless of their QoS class.
HW Functionality
The main features of the GE board are:
• Ethernet point to point transport only (no L2 switch functions)
– VC4/AU4 in SDH
– VC3/AU3 in SOET
• GE mappings
– frame mapping according to G.7041 (GFP-F) over VC-4-Xv (X=1... 7) - SDH
– frame mapping according to G.7041 (GFP-F) over VC-3-Xv (X=1... 21) - SOET
– client flow control according to 802.3x, 10km client distance
• 15 ms differential delay compensation for virtual concatenated VC-4/VC-3 (HO
VCGs only)
• PM on Ethernet
– Interface counters (per gMauTTP)
– Aggregate counters (per gMauCTP)
– Service flow counters (per gMauCTP)
• Support of Jumbo Frames (MTU = 9796 bytes)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The GE boards have the following capacity:

• 16xGE has max. 112 STM-1 equivalents
• 8xGE has max. 56 STM-1 equivalents
• 4xGE has max. 28 STM-1 equivalents.
Link Capacity Adjustment Scheme (LCAS)

Defined by the G.7042 specification, LCAS is a means for the source and the sink to
synchronize during addition or deletion of members to a Virtual Concatenation Group
(VCG) such that payload de-adaptation at the sink end may be done hitless under
non-defect conditions. LCAS functionality can also restore temporarily unavailable
members hitless. The synchronization mechanism is necessary because of the varying
delays that each member of a VCG may incur.
Under the LCAS scheme, the management layer issues add/remove commands for a
given member separately to the source and sink ends of a VCG. The LCAS state machine
at the source end then signals to the sink end that it is ready to add a particular member to
the VCG.
The LCAS sink end state machine then checks the "to be added" member for trail failures
and signals to the source end that it is ready via an acknowledgement signal. The source
end then signals the start of the payload change and initiates the actual change. This entire
"handshaking" process between the two ends takes place via the H4 byte for higher order
VC.
Again, the LCAS state machine operation is identical for both higher and lower order VC.
ote that for lower-order VC the LCAS handshaking process takes place via the K4 byte.
The importance of LCAS is pretty simple in a system architecture. By dynamically
altering the bandwidth of Sonet/SDH transport pipes, LCAS allows designers to adjust
bandwidth based on Quality of Service (QoS) or other priority considerations.
Refer to schematic block diagram (Figure 4-83, “GE Board Block Diagram” (p. 4-195)) it
is possible to see that the client signal (Gigabit Ethernet) is an optical signal that is
converted from Optical to Electrical using an SFP module.
After the conversion the signal enters into VOLTA ASIC, which map the data signal (GE
or FC) into SDH. Every VOLTA can support up to 10 clients (but we use 8 interfaces) and
is able to map transparently or rate adaptive into a 10 Gbit SDH (STM64). Every VOLTA
needs 8 SDRAM memories to support the Flow Control and the Virtual Concatenation
differential delay compensation up to 15 ms.
The 10 Gbit signal from VOLTA is passed to VIVALDI ASIC which double the signal
and add a FEC to adapt the STM64 to a proprietary backpanel format.
IACO FPGA is another block which mainly manages the microprocessor interface of
VOLTA, receiving the data from ISPB bus and translating the commands to VOLTA.
Other use of IACO is to implement the SDH Performance Monitoring.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The last important block is represented by GOBLI which is an EPLD with many uses:
read and write the remote inventory, read some board alarms and activate some
commands. GOBLI communicates with the external controller via SPI bus (protected A
and B). GOBLI is also used as an hardware configuration manager to load external
devices (FPGA) interfacing with a flash memory.
The power supply of the board are:
• 1.2 V
• 1.5 V
• 1.8 V
• 2.5 V
• 3.3 V.
All of them are obtained using four DC/DC converter which are driven by a Battery (after
an OR between BATT A and BATT B) coming from Backpanel.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-83 GE Board Block Diagram
GE
RAM 8 8 RAM
1 1
Cx 622 MHz
Cx 77 MHz
Matrix A
VOLTA
VIVALDI
Data
Optical SFP Matrix B
Module 16
1 2
Commands
1
Alarms
Micro ISPB
Interface ISPB
Buffer GTLP
Backpanel
to/from IACO
IACO
Power Alarm
Flash LED Control

Memory GOBLIN
SPI Bus
RI
1.2 V
1.5 V BATT A
1.8 V DC/DC BATT B
3.3 V
2.5 V
Board Functionality
The GE board has the following functionalities:
• Board and module management (plug-in, plug-out, Laser on/off)
• Configuration of fixed concatenation for all interfaces (GFP-F-7v)
• Crossconnections of VC4vTTPs, incl. S CP support
• Mapping and demapping of GE signal to/from VC4s, incl. 'far end' signalling (RDI,
REI) within VC4 POH
• LOS alarm for GE interfaces
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• SSF (summary) alarm for the (16) VCAT groups in case of underlying SDH problems
• Configuration of VC4s (TTI, alarm mask, DEG threshold)
• Alarming of VC4s (SSF, U EQ, RDI, DEG, TIM and LOM, LOA, SQM)
• HO PM for VC4vTTPs
• Modification of number of VC4s per interface
• Configuration of 'idle' VC4s (only used for SDH-Termination, not for
mapping/demapping)
• GE PM (Rx, Tx)
• Link Capacity Adjustment Scheme (LCAS), refer to next chapter “LCAS
Management” (p. 4-196) for details
LCAS Management
• Enable / disable LCAS protocol per VC-group (per port)
• Configuration of hold-off (0..10 000 ms) and wait-to-restore (0..900 s) times.
• Configuration of 'idle' VC4s at individual positions, if LCAS is enabled (without
LCAS, all the VC4s with the lower IDs have to be active and only the VC4s with the
upper IDs can be idle).
• Retrieval of status information per VC-group and for each member/channel (VC4) on
management request:
– number of working channels in receive and transmit direction per group.
– status (fail or ok), sequence number and control packet (FIXED, ADD, ORM,
EOS, IDLE, D U) in receive and transmit direction per channel.
• All the management is done via the Q3 interface.
A detailed description of the 4 main chips follows:
ASIC VOLTA
Features are:
• Multiprotocol mapper which optimize transport of GEthernet/Fibre Channel client
Data Signals over SDH using VC
• 8B/10B Performance Monitoring
• Transparent GFP
• Frame based GFP
• Supports Virtual Concatenation VC4-Xv and VC3-Xv
• Provides up to 15 ms of inter tributary de-skew for VC groups using external DDR
Ram
• Supports LCAS functionality as for ITU-T G.7042.
ASIC VIVALDI
Features are:
• Interfaces between Commercial Framer and Backplane
• Proprietary frame building to backpanel with Slice/Deslice function
• FEC and DEFEC for proprietary backpanel frame
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Overhead drop/insert and interface for external device(s)

• EPS protections.
FPGA IACO
Features are:
• Some HPT management accessing Volta Registers
• Automatic Laser Shutdown Manager
• Controller of Volta Mapper
• ISPB2 Interface
• ISPB2/Motorola Bridge
• SDH Performance Monitoring.
FPGA GOBLIN
Features are:
• Hardware Configuration Bus Manager
• Local I2C bus controller via backplane SPI bus
• SPIDER-like SPI functionalities.
GE Services
The GE provides the following services:
• Bidirectional Link Pass Through (LPT)
The GE emulates a bidirectional point-to-point cable between two client devices.
Failures in any direction at any point (GE line or TDM) will cause a service down
notification to both ends.
• Unidirectional broadcast
The GE emulates a unidirectional point-to-multipoint cable between a sender and a
number of receivers. As the sender always requires a valid GE line for broadcasting,
the GE laser is constantly forced on.
• Unidirectional Link Pass Through (LPT)
The GE emulates a unidirectional point-to-point cable between two client devices.
ear end failures (LOS, GFP errors) are propagated in the same direction, but far end
failure (RDI, auto-negotiation remote faults) are not. Therefore, the clients must
notify service interruptions by other means (e.g. bidirectional fault propagation or
protocol hello).
These services can be configured via CT/ M. Refer to the 1678 MCC User Provisioning
Guide for the related configuration procedures.
...................................................................................................................................................................................................................................
2x/4x10 Gigabit Ethernet Port Board
...................................................................................................................................................................................................................................

The 10GE LA card supports point to point Ethernet Private Line (EPL) transport of
10GE LA and Ethernet Virtual Private Line (EVPL) transport of multiple sub-rate
services of 10GE via SDH/SO ET network.
The 10GE EPL service is equivalent to the service provided for the 4/8/16xGE card
except for the extended range of Generic Framing Procedure (GFP)-Virtual
Concatenation Group (VCG). In this case there is a one to one relationship between the
ethernet port and the GFP-VCG.
The GE services described in chapter “GE Services” (p. 4-197) are also supported for
10GE, except the "Unidirectional Link Pass Through" service, that is supported for 1GE
only.
ote: 10GE interfaces are relying on adjacent nodes to guarantee in-profile traffic.
Out-of-profile frames might be dropped regardless of their QoS class.
HW Functionality
The main features of the board are:
• 2x/4x10GE LA ports per board
• XFP optical modules:
– 10GE-SR
– 10GE-LR (equivalent with I-64.1)
– 10GE-ER (equivalent with S-64.2b)
• Board and port management via Q3
• 10GE Services
– Ethernet Private Line (EPL), point to point transport
– Ethernet Virtual Private Line (EVPL) according to G.8011.2 type 1
- Ethernet port is used as a multiplexed access where traffic is separated by VLA
tags, there is one EPL (VCG) per VLA .
- Up to 61 services (VCG) per 10GE Port
- VLA processing at line side allowing to:
• 'pop' received VLA tag on receive side
• 'push' a VLA tag with ethernet type and priority bits on transmit side
- IA complete port (ethernet or VCG) can be used in transparent mode, e.g. for
EPL services or VLA ignored EVPL services.
• 10GE mappings
– frame mapping according to G.7041 (GFP-F)
(VC4 and STS1 mode cannot be mixed on a 10GE port)
- into VC-4-nv (n= 1...64) for SDH or
- into STS-1-nc (n= 1...192) or STS-3c-xv (x=1 to 64) for SO ET
– client flow control according to 802.3x (PAUSE frames) - only for EPL mode
• Support of Jumbo Frames (MTU = 10240 bytes)
• 32 ms differential delay compensation for virtual concatenated VC/STS
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• PM on Ethernet
– Interface counters (per gMauTTP)
– Aggregate counters (per gMauCTP)
– Service flow counters (per gMauCTP)
• SDH/SO ET functions: VC-4/STS-3c/STS-1 TTP incl. PM
• CSF insertion in case of Ethernet link failures and SSF/CSF detection on VCAT sink
side.
Ethernet Virtual Private Line (EVPL)

The EVPL service introduces a new level of hierarchy between the ethernet port and the
VCG using VLA tags to provide multiple services at subrates of the 10GE up to the port
capacity. The sub-rate services are identified by the VLA tag carried within the ethernet
frames. Each EVPL service is mapped to a unique VCG. The demultiplexing from one
10GE port to multiple VCGs is done on ingress side, while multiplexing of multiple
EVPL services into a 10GE port must be provided on egress side.
Figure 4-84, “Ethernet Virtual Private Line Service” (p. 4-199)shows a typical EVPL
service application for the GE. The source client want to have two separate Ethernet
services over the same Ethernet port to different clients. Each Ethernet frame is tagged
with an VLA identifier to which service it belongs. The data traffic enters the SDH
domain at the GE board. For each incoming frame the VLA identifier identifies to
which VCAT group the frame belongs. If the router sends more data than the VCAT group
is able to transport the traffic is dropped as no VLA Flow Control is defined yet. For a
short traffic burst the GE is able to receive data with the full Gigabit Ethernet data rate
because the input is buffered (in the meaning of 'store and forward').
Figure 4-84 Ethernet Virtual Private Line Service
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-84, “Ethernet Virtual Private Line Service” (p. 4-199) shows 4 individual EVPL
services each of them marked in different color or dashed. Some of the EVPL services
enters and leaves the network in a shared manner with other services but each EVPL is
transported over a dedicated VCG.
The receiving GE is responsible to de-map the VCAT group and to multiplex the packets
from different VCAT groups to a single Gigabit interface. VCAT de-mapping includes
compensation of the differentialdelay between the fractions.
In order to decouple VLA identifier assignment for each customer side the VLA swap
functions are provided at the edge of network. This allows individual assignment per
customer side and avoids unique VLA assignment over all customer interfaces.
Required E functions:
• GFP,
• VCAT,
• LCAS,
• L1 aggregation,
• VLA based L2 aggregation on access link
Services:
• Ethernet leased line,
• IP Backbone,
• Storage Area etwork (SA ),
• Metro Ethernet network interconnection,
• Mobile backhaul.
Figure 4-85, “10GE LA Board Block Diagram” (p. 4-201) shows the basic constellation
for the 2x/4x10GE. At max there are two or four 10 Gigabit Ethernet interfaces available.
The board has a maximum back-panel capacity of 128/256 VC4s (768 STS1)s. Each port
is handled by a separate EWTO FPGA.
Optical interfaces are provided as drawers which are inserted in the main board. Four
different sub-modules are available:
• XS642B
• XI641
• XGESR.
Mixed interface variants are allowed on the same board. The expected 10GE card is
named P2XGE/P4XGE.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-85 10GE LAN Board Block Diagram
SPI A/B
FPGA download Goblin4G
HW_CFG
Local SPI
I2C, ALS
Port #1 QDR2RAM RLDRAM
72M 288M MAZINGA4G
LED
FPGA
LED control NEWTON FPGA
LOS ISPB
XFI SERDES XSBI
GAUSS SFI
10GE_LAN XSBI 10GE 10GE VLAN
SFI4.1
E/O e.g Vitesse Core 4.1
1x VCS8479 16x IF PCS MAC MUX GFP F, VCAT, LCAS 16x
IF
XFP 10.3G 644M 622M
OH IF
I2C I2C
V
OH OH I To matrix
V A/B
Port #2 A
L
Port #3 * D
I Clk38MHz
sync38Mb
Port #3 *
DC/DC 48V A/B
* in case of 4x10GE board
The board uses the Generic Framing Procedure (GFP) with null extension header for the
mapping. Optional a payload Frame Check Sequence (FCS) can be chosen.
The back-panel bandwidth can be assigned with a granularity of one VC4 (STS1)
separately to the two/four 10Gigabit interfaces (1...64 VC4 or 1..192 STS1 per port). As
there is sufficient back-panel capacity available each port can be used with full capacity
(64 VC4 or 192 STS1) without any limitation. It is possible to change the number of
virtually concatenated VC4s/STS1s for any interface that is in use. The concept is very
similar to the 4/8/16xGE port whereby the back-panel capacity is group in 64 VC4/192
STS1 blocks.
Power Subsystem
The P2XGE/P4XGE board gets its power supply of 48/60 V from the back panel and
generates the following voltages by DC/DC converters (refer to Figure 4-86, “Power
Subsystem Block Diagram” (p. 4-202)):
• -5.2 V_XFP,
• +5 V_XFP,
• 3.3 V,
• 3.3 V_GTL,
• 2.5 V,
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• 1.8 V and
• 1.2 V.
There is an inrush current limitation circuit to limit the current when the board is plugged
in. A 3.3 V service voltage is used to supply GOBLI and the power manager, which do
the controlling and supervision of the converters. All battery voltages from the back panel
are fused on board, and there is a fuse supervision. After the power converters there are
various LC-filter circuits for ASICs, FPGAs, XFP modules etc.
Power failures are visualized by LED, and a power fail signal to GOBLI is generated.

Back Panel
DC/DC OB 5.2 V_XFP

+BATT_A
DC/DC HB +5 V_XFP
BATT_A
DC/DC POL 3.3 V

Inrush current limitation
3.3 V_GTL
DC/DC POL 2.5 V
+BATT_B 1...4
DC/DC POL 1.8 V

BATT_B
1...2
DC/DC QB 1.2 V
3.6 V_A
3.3 V_Service
Power
Manager
1A Control
GOBLIN
3.6 V_B
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
ES64 Server Card

Introduction
The ES64 card is part of the ISA-ES family of boards. It is a plug-in blade card that is
housed in the 1678MCC chassis.
The ISA-ES series module is a single slot module that can be located at any I/O card's
slot. The ES64SC is a portless data aggregator card capable of switching incoming
packets at a rate of 20 Gbps (20 ingress + 20 egress). It can be housed in any port slots
and has up to 3 blade pairs per chassis (free slot selection).
The ES64SC has the ability to work in 1+1 EPS with warm standby of up to a total of 6
free slot selections, where EPS can be configured for a pair of ES64SCs in adjacent slots.
One pair of ES64SC boards is supported. The maximum number of ES64SC boards is
limited because of the power consumption. Depending on the configuration up to two
pairs of ES64SC boards are possible. Please contact your Technical Assistance Center.
The ES64SC provides Ethernet connectivity for LA -based clients by mapping Ethernet
flows directly onto the SDH network by means of a standard mechanism such as GFP,
LCAS and VCAT. It provides Ethernet Layer 2 switching features interworking with the
various physical interfaces of Ethernet and SDH I/O boards. It also has a dedicated
S MP management interface.
The card currently supports EVPL services in business, mobile backhaul and other
applications. In future also MPLS connectivity is provided where MPLS flows can be
transported via GFP/LAPS over SDH connections. They introduce wire speed classifying,
policing and scheduling capability using a carrier class packet switch engine for Ethernet
and MPLS traffic.
Main features
The ES64SC has the following main features:
• 20 Gbps ingress and 20 Gbps egress capacity
• Portless card, interworking with the 1678 Ethernet and SDH I/O boards
• Supports High Order virtual concatenation SDH (VC4–nV)
• 128 logical ports (VCGs)
• EVPL services
• Extensive traffic management: Classification, Policing, QoS
• Extensive performance monitoring
• VLA manipulations
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
Figure 4-87 Functionality
GE 1678MCC
or
10GE
VCG/STSG
GFP ES64
GE
or
10GE MATRIX
MATRIX
VCG/STSG
SONET GFP
SDH Server
Card
SONET = Logical Port

SDH
Figure 4-87, “Functionality” (p. 4-204) illustrates the ES64SC functionality within the
1678MCC.
The ES64SC implements EVPL services (VLA cross–connections) through its logical
ports. The logical interface is an interface that terminates the VCG.
Each port can be configured separately to carry single or multiple VLA s. The logical
port is linked to the matrix by a VCG GFP connection and via the matrix to a TDM or
1GE/10GE card.
Figure 4-88, “Management and Control” (p. 4-205) illustrates the ES64SC management
and control in the ETSI release.
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
Figure 4-88 Management and Control
1678 MCC Server

Card
GE ES64
or
10GE
MATRIX
MATRIX
SLC
Local DCC
or
Remote
SNMP
ZIC
BM
CLI
(for TEC only)
FLC
CT
NM
The ES64SC supports the following management interfaces:

• S MP interface for an external management system
• ES64 ZIC (Zero Installation Craft Terminal)
All interfaces are available locally or remotely via the DCC and the FLC.
The ES64SC can interwork with remote Ethernet ports through GFP/VCAT. These ports
can be located in the same shelf or can even be located in a different E connected
through the SDH network.
The ES64SC is split into two parts: the data part and the Time Division Multiplexing
(TDM) part.
Data functionality
A block diagram of the ES64SC board is shown in Figure 4-89, “ES64SC Block
Diagram” (p. 4-206) and the data path functional diagram is illustrated in Figure 4-90,
“Data Path” (p. 4-207).
Figure 4-89, “ES64SC Block Diagram” (p. 4-206) shows that the 20G ingress data
packets that come from the matrix interface, pass through the cross–connection and go
into the ES64SC.
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
Figure 4-89 ES64SC Block Diagram
FPGA CAM RAM RAM
Mapper
to/from
BP Backplane Paket Traffic
20G in Interface Processor Manager
20G out
Mapper
Local Data
RAM
Controller
In the ES64SC card, the packets go through the back plane interface. The backplane
interface performs the required adaptation from the incoming bit stream to the mapper.
The data packets then continue to the SO ET/SDH mapper for termination of the GFP
encapsulation and extraction of the Ethernet frames. The packets then go through the
etwork Processor (P). The etwork Processor classifies, monitors, and edits the data,
if required. The CAM serves as lookup tables while the RAM and FPGA are used for
facilitating the P tasks.
From the etwork Processor, the packets go through the Traffic Manager for ingress data
manipulation. The Traffic Manager is responsible for queuing, shaping, scheduling, or
multi–casting the frames. Behind the Traffic Manager, the packets begin their journey
towards egress and are sent back to the etwork Processor for editing. The etwork
Processor then edits the data, if required and the data packets pass on to the mapper for
GFP encapsulation and back into the matrix interface.
The Controller in the ES–64 card performs all control tasks such as user interface and
storing the configuration.
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
Figure 4-90 Data Path
Matrix I/F Matrix adaptor
Mapper Extraction of frames from SONET / SDH
NP Classification, Policing, Editing
Traffic Manager Queuing, Shaping, Scheduling, Multicast
NP Editing
Mapper Insertion of frames to SONET / SDH
Matrix I/F Matrix adaptor
Ports and interfaces

• There are 128 logical ports. Each port can be configured according to the details listed
below:
– Admin status of the port or the Link Aggregation Group (LAG)
– Configurable rate limiting (gross rate)
– Configurable MRU/MTU of up to 9242 bytes including FCS
– Link aggregation (LAG)
– Configurable EtherType
– Configurable CIR overbooking factor per port (100% and up or 0 for no CAC)
• Ports 1–30, 129–158 (total 60) support Jumbo Frames (9242 bytes including FCS),
other ports (31–64 & 159–192) support Baby Jumbo Frames (2026 bytes including
FCS)
Provisioning
• Provisioning Ethernet Transport Service (ETS) – uni–directional VLA
cross–connections
• Up to 4k VLA CC – each consisting of up to 8 flows (1 per P–bit)
• Classification: Port/SVlan/CVlan/P–bits
• Forwarding: Port/SVlan/CVlan
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
• Policing (according to MEF–10)

– Per service
– Committed Information Rate (CIR) and Excess Information Rate (EIR),
Committed Burst Size (CBS) and Excess Burst Size (EBS), or unpoliced services
– Hitless modification
• Frame Processing
– Push, Pop, Swap
– Maintain/change P–bit
• Class of Service (CoS)
– Eight levels of CoS (8 Queues per egress port)
– 2 Strict Priority (SP) Queues
– 6 Weighted Fair Queues (WFQ)
– Flexible mapping of each flow to Queue
• Connection Admission Control (CAC)
– Ensures resources are available
– CAC can be disabled (via setting CIR overbooking factor=0)
Ethernet Performance Monitoring

Ethernet Performance Monitoring (PM) per port:
• Rx & Tx frames/octets
• Rx frames/octets dropped (errored)
The above is given for current and history counters (two periods of 24 h and 96 periods of
15 min interval).
ote: On link aggregation ports, counters are aggregated from all participating ports.
Ethernet PM per queue:
• Rx green and yellow frames
• Discarded green and yellow frames
The above is given for current and history counters (two periods of 24 h and two periods
of 15 min interval).
The user can activate/deactivate and reset the counters.
ote: Further alarms and counters are supported on the relevant I/O boards.
Optional 1+1 equipment protection, see “Equipment Protection ” (p. 4-210).
Link Aggregation (LAG IEEE 802.3ad)

• Each ES64 pair working in 1+1 protected operation supports up to 18 Link
Aggregation groups
• Each group can contain up to 10 ports
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
• LAG ports can reside on different I/O boards

• Configurable LAG distribution function
• LACP or non–LACP supported.
TDM Functionality
The TDM part of the ES64SC is composed of the following functions:
• The backplane driver is compatible with the 160G/320G/640G TDM matrix of the
1678MCC.
• DATA/TDM mapper functions which are detailed below.
GFP
• GFP–F (null extension header, no FCS) – not configurable
• Mappings are according to the 1678 capabilities wherein SDH is VC4–4c, or VC4–nv
• LCAS
• Up to 128 logical ports (VCGs).
Alarms
The following alarms are supported at the GFP level:
• TSF (Transmission Signal Fail)
• LOF (Loss Of Frame)
• EXM (Extension Header Mismatch)
• UPM (User Payload Mismatch)
• CSF (Client Signal Fail)
• DEG
• LOS (Loss of Signal).
Four pre–defined default ASAP and up to 100 ASAP total are supported.
Control functionality
The Local Data Controller (LDC) acts as a single etwork element providing
management agents (via S MP), protocol engines (e.g. LACP for Ethernet) and control
of the data functions down to the HW.
Power Subsystem
The ES64SC board gets its power supply of 48/60 V from the back panel and generates
the following voltages by DC/DC converters (refer to Figure 4-91, “Power Subsystem
Block Diagram” (p. 4-210))
• 1.2 V,
• 1.8 V,
• 2.5 V,
• 3.3 V,
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
• 5 V,
• 1 V and
• 1.5 V.
There is an inrush current limitation circuit to limit the current when the board is plugged
in. All battery voltages from the back panel are fused on board, and there is a fuse
supervision. Behind the power converters there are various LC–filter circuits for ASICs,
FPGAs, XFP modules etc.

Back Panel
DC/DC 60 A 1.2 V
+BATT_A
Inrush Current
BATT_A Limiter DC/DC 25 A
1.8 V
Power Se-
quencing
Logic DC/DC 25 A 2.5 V
DC/DC 15 A 3.3 V
DC/DC 10 A
3.6 V_A 5V
VREG 16 A 1V
3.6 V_B 3.3 V_Service
VREG 5 A
1.5 V
Equipment Protection
The 1+1 ES64 equipment protection or redundancy is an optional feature. Pairs of
ES64SCs can be plugged in adjacent slots and configured for working in equipment
protection (EPS) mode. If configured to work in EPS, the active ES64SC updates the
standby ES64SC upon each user configuration. If a protection event is detected (e.g.
ES64SC plug–out), the TDM cross–connections are switched to the standby board,
restoring traffic within 50ms.
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
Management functionality
The ES64SC supports the following management interfaces:
• S MP interface for an external management system
• ES64 ZIC (Zero Installation Craft). The ZIC has the following features:
– Can be activated as a standalone
– Can be launched from the 1320 Craft Terminal (CT)
– Can be launched from the 1353 etwork Manager ( M)
– When launched as a standalone, security is embedded within the ZIC
– Up to 6 simultaneous sessions
– All management operations that are supported by the S MP are supported by the
ZIC
All interfaces are available locally or remotely via the DCC.
Management Domains
Figure 4-92, “ISA–ES64 Management Domains – S MP And Q3 management”
(p. 4-211) shows the ES64SC management domains. From a management point of view,
the ES64SC has two domains:
• The Ethernet switching domain, where Ethernet frames are handled
• The Multi–Service Function domain, where GFP and SDH functions take place (e.g.
GFP mapping/ demapping, LCAS, alarms and PM).
The Ethernet switching functions are managed in the S MP management domain using
S MP and ZIC. The multi–service functions are managed in the Q3 management domain
using the same Q3 interface which is used for managing the rest of the 1678MCC
functions.
Figure 4-92 ISA–ES64 Management Domains – SNMP And Q3 management
...................................................................................................................................................................................................................................
ES64 Server Card
...................................................................................................................................................................................................................................
ES64 Performance Parameters
Table 4-12 ES64 Performance Parameters

ES64 Performance Parameters Value
Typical latency 1GE––ES64––1GE (1500 190 Sec
byte)
Typical jitter 1GE––ES64––1GE (1500 byte) 10 Sec
Typical latency ES64 only (1500 byte) 100 Sec
Typical jitter ES64 only (1500 byte) 5 Sec
Back plane capacity 20 Gbps
Total L2 switching capacity 20 Gbps
Buffer memory 1 Gbit (50 ms per queue depending on
expected bit rate)
Flash memory 512 Kbyte
S MP versions supported S MPv1, S MPv2c
Total number of ETS (VLA XC) 4096 ETS. Each ETS consists of up to 8 flows.
Total 32 k flows.
Delay compensation (differential delay) 32 ms
Policing parameters CIR/EIR/PIR Minimum: 0, Maximum:
port–rate,
Granularity: 1 Kbit/s;
CBS Minimum: 0; Maximum: 40,000 bytes on
SP queues, 1,000,000 bytes on WFQs;
Granularity: 1 byte;
EBS Minimum: 0; Maximum: 100,000,000
bytes;
Granularity:1, byte Accuracy: 3%
Simultaneous sessions in ZIC 6
Max frame size on Jumbo frame ports 9242
Max frame size on Baby Jumbo frame ports 2026
...................................................................................................................................................................................................................................
FAN Unit (FAN)
...................................................................................................................................................................................................................................
FAN Unit (FAN)

In the 1678 MCC equipment two FA units are mandatory.
The unit can be simply plugged into the backpanel as any other board of the 1678 MCC,
in one of the two slots present for the purpose, at the top and at the bottom of the shelf.
FA speeds are monitored through Spider block, that also collects alarms rising when
FA s revolve below 30% of their maximum speed allowed.
The FA unit is set up with a basic assembled PCB on which FA s are screwed on; on
the same PCB the FA controller is also hosted.
Functional description
The FA controller is the PCB dedicated to providing FA s with power, managing the
speed of each of them and monitoring speeds through Spider block, that also collects
alarms rising when FA s revolve below 30% of their maximum speed allowed.
Each FA is powered by 48VDC voltage, supplied through a 38V-75V input acceptable
range DC/DC converter.
On the power supply of each FA a fuse has been inserted, so that if a rotor had to be
blocked for any reason, the current absorbed from it would rise and then the fuse would
break, protecting the motor from damages.
In reality, this caution is not strictly necessary, since FA s mounted on the unit have
themselves a locked rotor protection: if the rotor is prevented from rotating and power is
applied to the unit, the motor will self-protect. When the locked rotor condition is
removed the FA will automatically restart. The motor can sustain locked rotor
conditions indefinitely throughout the full specification range of voltage and temperature.
Figure 4-93, “FA Functional Block Diagram” (p. 4-215) shows the block diagram of
unit.
As we can see, Spider can individually interrupt the 48V power supply of each FA ,
detects temperatures from three sensors spread across the controller board and can adjust
FA speeds by means of three potentiometers, which provide through potential dividers
variable voltages to FA speed control pins.
The speeds of three brushless DC motors are also monitored. Is available an output signal
that switches at a frequency of 2 cycles per revolution of the FA : when the FA is not
rotating, the output is either a steady High or a steady Low. This signal enters a
monostable that detects the presence of it and refers to Spider. At the same time, it enters
a counter triggered by a 1 Hz sync (SY1Hz) coming either from matrix A or B (and
selected by ACT lines): information about revolutions is so collected every 1 sec and read
by Spider by means of an enable command.
• green: unit in service
• red: internal fault (unit out of service).
The FA unit front panel is shown Figure 3-35, “FA unit - front view” (p. 3-60).
...................................................................................................................................................................................................................................
FAN Unit (FAN)
...................................................................................................................................................................................................................................
Performance
Each FA provide a flow of 167 m3/hr against a pressure of 82 Pa when running at
maximum speed and with 1.2 kg/m3 inlet air density.
In 40°C environment at full speed condition, the grease in the bearings has an L10 life of
100,000 hours. In 75°C environment, the grease in the bearings has an L10 life of 40,000
hours.
Power Supply
The maximum current drawn by one single FA is 0.35 A at full speed condition on 48
VDC supply, corresponding to 16.8 W of power consumption.
With all FA s at full speed condition, the board absorbs 0.9 A when powered through
battery A by a voltage of 65 V, i.e. it has a total power consumption of 58.2 W.
FAN Failure
In case of a FA failure the following instructions are very important.
o effect on transmission yet, but the FA unit does not work properly. There is the
danger of system overheat.
ote: If the FA unit does not work properly, immediately replace the FA unit.
If the operation temperature is more than 35 °C it is necessary to replace the
damaged FA unit in max. 24 hours.
ote: For FA unit replacement refer to the 1678 MCC User Provisioning Guide.
FAN Unit in ETSI Applications

In case of dirty enviroment: FA units have to be equipped with a dust filter, if the
contamination is more than 2 x E 300–019–1–3 class 3.2.
Dust filters are not needed, if the ambient is in accordance to the following international
standards:
• E 300-019-1-3 class 3.1: Dust (suspension) 200 µg/m3, Dust (sedimentation)
1,5mg/(m2h)
• E 300-019-1-3 class 3.2: Dust (suspension) 400 µg/m3 Dust (sedimentation)
15mg/(m2h).
FAN Unit in SONET Applications

The lower FA unit is equipped with a dust filter and the upper FA unit with a safety
plate (finger guard).
...................................................................................................................................................................................................................................
FAN Unit (FAN)
...................................................................................................................................................................................................................................
Figure 4-93 FAN Functional Block Diagram
SPI SPI ID
A B
FAN
EEPROM
ON/OFF 1
ON/OFF 2
ON/OFF 3
SPIDER
speed ADJ 1
speed ADJ 2
DIG
POT SENSOR 1 SENSOR 2 SENSOR 3
speed ADJ 3
speed MON 1 mon 1
speed MON 2
mon 2
speed MON 3
mon 3
counter 1 buffer 1
buffer 2
counter 2
counter 3 buffer 3
act_A SY1Hz_B
act_B SY1Hz_A
...................................................................................................................................................................................................................................
Product description Units Descriptions Lower order extension shelf
Introduction
...................................................................................................................................................................................................................................
Units Descriptions Lower order extension shelf
Introduction
The following Table 4-13, “Units involved in 1678MCC LO Extension Shelf” (p. 4-216)
and Table 4-14, “Modules involved in 1678MCC LO Extension Shelf” (p. 4-216) sums
up the units managed in the 1678MCC LO Extension Shelf Equipment.
Table 4-13 Units involved in 1678MCC LO Extension Shelf

Type / Class Description Acronym Width Q.ty
(TE)
Control / Common Alarm Board ALM 4 1
Power Supply and Filter PSF 2
Bus Termination BUSTERM
LO Matrix LO Centerstage Matrix LX160 8 2
160GBIT/S
Lower Order Adaptation LA20 4.5 10
20G
FA System FA FA -- 2
ote: Q.ty = max number allowed in the 1678MCC LO Extension Shelf equipment
Acronym = label shown on CT
Table 4-14 Modules involved in 1678MCC LO Extension Shelf

STM-16 I-16.1 SFP - Intra-office (wl = 1310 nm) SI161 8
optical module or electrical module SEI161
ote: Q.ty = max number allowed per LA20 board

Acronym = label shown on CT
...................................................................................................................................................................................................................................
Lower Order Adaptation Board 20G (LA20)
...................................................................................................................................................................................................................................

The LA20 board is used in the 1678MCC LO Shelf 160G partsystem which is introduced
in 1678 Metro Core Connect. The main purpose of this new partsystem is to build a 4/3/1
cross connect designed for the ETSI and A SI Market.
The LA20 board implement the first and third stage of low order matrix together with the
so called adaptation function (High Order path termination and adaptation function). One
LA20 board has a capacity of 20Gb/s and is 1:n (1<n<7) protected.
Two LA20 groups are possible.
Lower Order Matrix

The lower order matrix is a three stage matrix which is distributed over 2 types of boards.
• Low Order Adaptation and endstage matrix board (LA20)
• Low Order CS Matrix Boards (LX160, LO functionality)
The effective switching capacity amounts to 20 Gbit/s per LA20 board.
The LA20 supports the following switching entities.
• VC-3, VC-12, in SDH application
• VC-11, STS-1, STS-3c, STS-12c in SO ET application
Protection capabilities: S CP/I and S CP/
Lower Order Adaption Function

The lower order adaption function is located between the interface to HO subsystem and
the matrix function (refer to Figure 4-94, “LA20 Functional Overview” (p. 4-218)). In
other words these chips terminate the administrative units AU4 of an STM-64 byte serial
stream in receive direction into lower order VC-n and multiplexes lower order VC-n in
transmit direction into the administrative units AU4 of an STM-64 byte serial stream.
The lower order adaption function supports fault detection, alarm generation and
performance monitoring for higher and lower order.
The chip set of this function is furthermore SO ET compliant. For instance the chips are
capable to terminate administrative units AU3 and to process virtual tributaries VT1.5.
The chips additionally support AU3/AU4 conversion. These functionalities are used for
SO ET and SDH/SO ET interworking.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-94 LA20 Functional Overview
LA20
LO Adaptation
and Monitoring
Backplane
Interface
to HO Matrix
Subsystem
Data Connections
The data connections between higher order matrix and the lower order matrix board are
done via differential signal lines over the backplane at 2.5 Gb/s .
Synchronization and Clock Distribution
The LA20 board receives two 38 MHz clock signals (Copy_A and Copy_B) and two
38MBit/s data signals (Copy_A and Copy_B). These synchronization signals are led to
VIVALDI ASIC, which performs the synchronization function. The data signal comprises
frame and multiframe information (1Hz/8kHz) to synchronize the board to the 1678MCC
internal framing. The data signal is read by the 38 MHz clock. The 38 MHz clock is also
used to generate the 622 MHz system clock by means of a VCO.
Power Subsystem
There are two independent power interface inputs, each coming from a PSF board.
On the LA20 board there are four central DC/DC converters (48V to 1.2/5V) and four
point of load (POL) converters (5 V to 1.5/1.8/2.5/3.3 V). An inrush current limitation
circuit and a filter are provided in front of the central DC/DC converters for current
limitation when the board is plugged in. A central DC/DC power converter provides a
galvanically isolated power (5 V) to the POL converters. The POL converters deliver the
various voltages:
• 1.5 V
• 1.8 V
• 2.5 V
• 3.3 V
used by the ASICs and FPGAs on the LA20 board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The front panel is shown in Figure 3-48, “Lower Order Adaptation 20G board - front
view” (p. 3-81) .
Figure 4-95 LA20 Board Block Diagram
STM 16
16 4
2.5 Gb/s 1 opt.
32
WSE TUPP SFP
4 2.5 Gb/s
#1
2MHz ref clk bus
IS STM 16
M M
6 DAFFODIL
CLK
Rx Clocks
Center
Stage STM 16
4
2.5 Gb/s 1 opt.
4
WSE TUPP SFP
32 VIVALDI 16 2.5 Gb/s
OS
#8 STM 16
M M M OH
OH link
OH link
HAWK DOVE
OH link
DCC
HW cfg
SPI A
GOBLIN 48v/60v A+B
SPI B
DC/DC 0v A+B
Service OBPS GND (FPE)
voltage
3,3v
M = Motorola Bus
ISPB
...................................................................................................................................................................................................................................
Lower Order Matrix 160 Gbit/s Board
...................................................................................................................................................................................................................................

Overview
The Unit 'LO Centerstage Matrix 160GBIT/S' provides SO ET/SDH switching
capabilities, implementing MSPC (Multiplex Section Protection Connection) and HPC
(Higher Order Path Connection) switching functions.
The unit will be used in the 1678 Metro Core Connect (1678MCC). The 1678MCC
equipment can host up to two 'LO CE TERSTAGE MATRIX 160GBIT/S' Units; in this
case, only one 'LO CE TERSTAGE MATRIX 160GBIT/S' Unit at a time is active, the
other one is standing by.
The Matrix board supports the following functionalities:
• Cross-connection with STS-1 granularity of up to 1024 STM-1 signals (3072 signals
at AU3 level), non blocking
• Synchronization (Clock Reference Unit)
• 1+1 EPS protection scheme (when two LX160 boards are present)
Features
The Matrix board address the following functional requirements:
• Management of 256 bi-directional links @ 2.5/2.7 Gbit/s
• Forward Error Coding (FEC) protection of the 256 links through the backpanel
• Payload Performance Monitoring (PM)
• Traffic Sub etwork Connection Protection (S CP)
• Clock Reference Unit (CRU) of SDH quality
shown in Figure 4-96, “LO Centerstage Matrix Board Functional Block Diagram”
(p. 4-221).
For further details about how the MSPC and HPC functions are implemented from a
logical point of view to fulfil the ITU-T G.783 functional model.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-96 LO Centerstage Matrix Board Functional Block Diagram
Port Payload Links

LO Centerstage Matrix 160G
High
Control Signals
Order
Matrix
Shelf
Controller
Synchronization
Signals
SDH
Equipment Power
Clock Supply
The physical description of the LX160 board is similar to the MX640 board. Only the
switching capacity is different (refer to chapter “Physical Description” (p. 4-159) ).
...................................................................................................................................................................................................................................
Alarm Board (ALM)
...................................................................................................................................................................................................................................
Alarm Board (ALM)

Overview
The Alarm board is used in the 1678MCC LO Shelf 160G partsystem. One Alarm board
per LO shelf is necessary. The ALM board is mandatory because it has to provide the
supervision of the step-up converters for the LO shelf. Also the service voltage have to be
supervised via a backplane signal from PSF boards like on the FLC. The ALM board
functionality is a subset of the FLCCO GI board.
The ALM provides the following functionalities:
• Rack alarm interface
• Housekeeping inputs and outputs
• Alarm lamps interface
• Power supervision.
Rack Alarms Interface

The Rack Alarms (RA) interface provides a number of galvanically insulated output
contacts, reporting the status of some equipment-related alarms. The outputs are realized
with electronic switches which can close or open a contact toward the independent
housekeeping output ground similarly. The physical access to the interface is provided
through a Sub-D 25 poles female connector, accessible on the unit front panel.
Housekeeping Interface
The ALM board provides a set of generic, programmable, parallel I/O contacts, physically
available from the same Sub-D 25-poles female connector used also for the rack alarms
interface.
There are 8 housekeeping inputs and 4 housekeeping outputs available from the ALM
board.
Rack Lamp Interface

The rack lamps interface provides a set of galvanically insulated contacts which allows to
control a number of rack lamps . these contacts are controlled by the SPIDER device
parallel ports according to the main internal alarms status of the equipment contained in a
rack thus showing a summary of the shelves status. The lamps are controlled by closing
or opening the related contacts toward the separate rack lamps ground.
The main electrical characteristics are summarized below:
• ormally open contacts
• Voltage polarity independent ;can accept either AC or DC signals
• Maximum load current 120 mA
• Open contact resistance > 50 MΩ
• Closed contact < 1Ω
• X_RCH : Is not active of the ALM board
...................................................................................................................................................................................................................................
Alarm Board (ALM)
...................................................................................................................................................................................................................................
ote: The rack lamp interface functionality is done under SW control.
Features
The Alarm board address the following functional requirements:
• Battery supervision , Input from the PSF board
• Battery fail displayed ( Batt_A and Batt_B fail ) via X_TA D/X_G D_RA contact
• 3.6V service voltage for SPI devices and glue logic
• Housekeeping I/O (with internal galvanic isolated power supply):
– 8 inputs
– 4 outputs
• Alarm lamps
• Alarm contacts
• House keeping (HK) I/O and alarm contacts (RA) connector on front side
• Rack lamps connector (RL) on front side
• Supervision of all internal voltages
shown in Figure 4-97, “ALM Board Functional Block Diagram” (p. 4-224).
Power Subsystem
The Alarm board gets its power supply of 48/60 V from the back panel and generates the
3.6 V service voltage for SPI devices.
...................................................................................................................................................................................................................................
Alarm Board (ALM)
...................................................................................................................................................................................................................................
Figure 4-97 ALM Board Functional Block Diagram
Fuses
48/60V
Input Power + 48/60V
Inrush Current Limitation & EMC
48/60V
POWER_LAMP
+12V
Rack URG_LAMP
CMISS Lamp NURG_LAMP
M_LAMP
from PSF
Lamptest
Rack RA
Alarm RA_GND
POWER
V3V_A
V3V_B FAIL
Fuse House HK_OUT
Keeping HK _IN
In/Out HK_GND
3
TS RIM
2 STATUS_LED
2
Spider
MRXDA
A 3 SPI bus
SPI bus 3 MRXDB
B
URG_LED
NURG_LED
Board_ID ATTD_LE
ABN_LED
D
IND_LED
Quit push button
BATFAIL_A1..3
BATFAIL_B1..3
V3VAKO
V3VBKO
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

This board is already described in “Power Supply and Filter Board (PSF)” (p. 4-153) .
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

This board is already described in “Bus Termination Board (BUSTERM)” (p. 4-156) .
...................................................................................................................................................................................................................................
Product description Units Descriptions OED shelf 1670SM
Introduction
...................................................................................................................................................................................................................................
Units Descriptions OED shelf 1670SM
Introduction
The following Table 4-15, “Units involved in 1670SM” (p. 4-227) and Table 4-16,
“Pluggable Modules involved in 1670SM” (p. 4-227) sum up the units managed in the
1670SM Shelf Equipment.
Table 4-15 Units involved in 1670SM

(mm)
Control / Control and General Interfaces CO GIHC 40 2
Common Bus Termination BTERM 40 1
Matrix Matrix HiCap HCMA- 52 2
TRIX
LI K Optical Link Enh HCLI KE 40 8
SDH Port 4xSTM-4 P4S4 20 16
STM-4
SDH Port 16xSTM-1 optical P16OS1 20 16
STM-1 16xSTM-1 electrical P16S1
4xSTM-1 electrical P4ES1
SDH Port 4x140 MBit/s P4E4 20 16
SDH Access 2xSTM-4 A2S4 20 16
SDH Access 12xSTM-1 optical A12OS1 20 16
STM-1 16xSTM-1 electrical A16ES1
4xSTM-1 electrical A4ES1
SDH Access 2x140 MBit/s A2S1 20 16
FA Unit FA FA -- 2
Table 4-16 Pluggable Modules involved in 1670SM

140 MBit/s 140/155 electrical interface ICMI 64
STM-1 S-1.1 OPTIC - Short Haul (wl = 1310 nm) IS-1.1 256
L-1.2 OPTIC - Long Haul (wl = 1550 nm) IL-1.2
STM-4 S-4.1 OPTIC- Short Haul (wl = 1310 nm) IS-4.1 64
...................................................................................................................................................................................................................................
4xSTM-1Electrical I/O Interface
...................................................................................................................................................................................................................................

The I/O Port board 4xSTM-1 electrical (P4ES1 ) manages up to four STM-1 data
signals. The physical access points to the four STM-1 signals are available on the related
Access board (A4ES1).
Port Board P4ES1N

The SDH functions required to process the STM-1 signals are implemented by an
Interface ASIC (refer to Figure 4-98, “Block Diagram 4xSTM-1 Electrical I/O Interface”
(p. 4-229)). It interfaces the two HiCap Matrix boards via the backpanel. The Interface
ASIC sends and receives four STM-1 signals (data + clock) at 155 Mbit/s to/from each
SPI. An external LOS is received from each input line interface.
Complying with the ITU-T G.783 Recommendation, the Interface ASIC performs the
TTF function. The TTF block is connected to the two HiCap Matrix boards (main and
spare) by means of a bidirectional link at 622 Mbit/s (STM-4 equivalent capacity) in 1+1
configuration. It performs the sink on Rx side and source on Tx side for the termination
of the STM-1 signals. In addition, the TTF block provides the T1 timing references at 2
MHz, derived from the STM-1 input signals.
The backpanel interface supplies redundant system clocks (SYST CK, a, b) to the internal
circuits of the Interface ASIC.
The PISO blocks provide the board interface to the backpanel at a bit rate of 622 Mbit/s.
The DC/DC Converter converts the 48/60 V power supply to the following voltages:
• +2.5 V (to supply all components on the board)
• +3.3 V (to supply all components on the board).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-98 Block Diagram 4xSTM-1 Electrical I/O Interface
System clock a
Interface ASIC
System clock b
Main and spare

HiCap Matrix
from/to
1st INTERFACE
T1
TTF
Electrical
Input/ STM 1
Output RST MST MSA P
I
SPI LOS (3) S
1 O
DCCR DCCM
RSOH MSOH
(4) P DCC
I
S
O
Electrical
Input/
Output
SPI (3)
2 2nd INTERFACE
(4) T1
Electrical
Input/
Main and spare

Output
HiCap Matrix
(3)
SPI 3 rd INTERFACE (4)
3 T1
to
Electrical
Input/
Output (3)
4 th INTERFACE (4)
SPI T1
4
Config. &
Status Management
622 MHz Bus
OSC M-bus
Driver
Main and spare

HiCap Matrix
from/to
Bus OFF
Remote
Inventory
RIBUS RIBUS
Power I/F
Sync
Unit ID
Failure
3.3 V 48/60 V
CONGIHC
DC/DC
from
2.5 V CONVERTERS
A4ES1 P4ES1N
Access Board A4ES1

The Access board 4xSTM-1 Electrical (A4ES1) is located in the Access area and provides
the connection to the line by a coaxial cable for the electrical STM-1 I/O Port board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-99, “Block Diagram Access Board 4xSTM-1 Electrical (A4ES1)” (p. 4-231)
depicts the block diagram of the Access board A4ES1.
Input Side
On the input side, the CMI coded signal coming from the coaxial cable is equalized,
decoded into RZ code and forwarded to the electrical Port board.
The command criteria SWITCH from the RIBUS I/F block selects the MUX in order to
send the local streams towards the protection Port board.
LOS alarm, if detected, is sent to the Port board. It can also be sent through a MUX
towards the protection Port board if the SWITCH command is active.
Output Side
On the output side, the signal from the Port board is coded into CMI code and then sent
toward the coaxial cable.
When EPS is active, the RIBUS I/F block sends the SWITCH command to the MUX. In
this case, the signals from the protection Port board are selected and sent toward the
encoder RZ/CMI.
Control Section
RI data, such as code, series number and construction data, can be read/written via the
RIBUS I/F. It also sends the following commands:
• FSEL for frequency selection (not used)
• CLOP for loopback facility
• SWITCH for EPS facility.
A red/green LED is provided for board fail alarm indication on the front cover plate.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-99 Block Diagram Access Board 4xSTM-1 Electrical (A4ES1)
CMI CMI LOS

Input PLL NRZ to Port board
NRZ
MUX NRZ to protection
Port board
SWITCH
NRZ from previous
LOS Access board
MUX LOS to protection

Port board
ACCESS 1 Input side
SWITCH
Mask CMI NRZ from Port board

CMI PLL MUX from protection
Output Adapter NRZ NRZ
Port board
SWITCH NRZ to next Access board
FSEL
CLOP
ACCESS 1 Output side
CMI
Input
CMI ACCESS 2
Output
CMI
Input
ACCESS 3
CMI
Output
CMI
Input
ACCESS 4
CMI
SWITCH
Output
CLOP
FSEL
FAIL
RIBUS to/from
Remote RIBUS
Inventory I/F HiCap Matrix board
A4ES1
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

The I/O 16xSTM-1e boards increase the I/O port board density by factor 4 and the I/O
shelf density by factor 2.
Similar to the I/O 4xSTM-1e used up to now, the I/O 16xSTM-1e interface functionality
is implemented in two boards:
• Port board (P16S1 )
• Access board (A16ES1).
Port Board P16S1N
The Port board P16S1 performs signal processing. A block diagram of this board is
shown in Figure 4-101, “Block Diagram 16xSTM-1 Electrical I/O Interface” (p. 4-233).
The port boards are located in the port area. The access boards are located in the
corresponding access area. Port and access boards are connected over the backpanel.
Both boards Access and Port are one slot wide (4TE).
Figure 4-100 Relation between Port Boards/Access Boards
Access Board Port Board
1 16xSTM-1 16xSTM-1 16xSTM-1equiv.

16
16xSTM-1electrical
16 (P16ES1)
(A16S1)
Two configurations are supported:

• EPS +1 (with =1 to 15) protected configuration
The protection is ensured by a protection board HPROT16 located in the access area
and a protection port board 16xSTM-1e located in the port area.
• Unprotected configuration
In this case, the protection boards HPROT16 and the I/O board 16xSTM-1e (P) are
not equipped.
Access Board A16ES1
The access board A16ES1 provides 16xSTM-1e interfaces.
The A16ES1 is located in the access area and provides the connection to the 16xSTM-1
electrical I/O port board.
The description of the functionalities is similar to 4xSTM-1 electrical access board
(A4ES1) described in section “4xSTM-1Electrical I/O Interface” (p. 4-228) .
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-101 Block Diagram 16xSTM-1 Electrical I/O Interface
System clock a
System clock b
Interface #1 HPOM
HSUT
Buffer
TTF
4x
STM 1
.
MAIN AND SPARE

RST MST MSA P
I
S
O
from/to Access board
DCCR DCCM
RSOH MSOH
(1)
MATRIX
4x
STM 1
Interface #2
4x
STM 1
Interface #3
4x
STM 1
Interface #4
622 MHz DCC

OSC (1)
FPGA
Config. &
Status
MATRIX MAIN AND SPARE

Management
Bus
M B US
Driver
Bus OFF from/to

Remote
Inventory
RIBUS RIBUS
Power I/F
Sync
Unit ID
Failure
3.3 V
CONGIHC
DC/DC 48/60 V
from
2.5 V CONVERTERS
P16S1N
...................................................................................................................................................................................................................................
4xSTM-1Optical I/O Interface
...................................................................................................................................................................................................................................

The I/O Port board 4xSTM-1 optical (P4S1 ) manages up to four STM-1 data signals.
The physical access to the four STM-1 signals is performed by optical I/F modules. Two
modules are inserted in the related Access board (A4S1), two in the Port board itself.
Port Board P4S1N

Interface ASIC (refer to Figure 4-102, “Block Diagram 4xSTM-1 Optical I/O Interface”
(p. 4-235)). It interfaces the two HiCap Matrix boards via the backpanel. The Interface
ASIC sends and receives four STM-1 signals (data + clock) at 155 Mbit/s to/from each
SPI. An external LOS is received from each input line interface.
TTF function. The TTF block is connected to the two HiCap Matrix boards (main and
spare) by means of a bidirectional link at 622 Mbit/s (STM-4 equivalent capacity) in 1+1
of the STM-1 signals. In addition, the TTF block provides the T1 timing references at 2
MHz, derived from the STM-1 input signals.
The PISO blocks provide the board interface to the backpanel at a bit rate of 622 Mbit/s.
Each optical transmitter reports its status to the Interface ASIC by means of the two input
signals "Laser Degrade" and "Laser Failure".
The Automatic Laser Shutdown (ALS) algorithm is implemented by the hardware and
provides the laser shutdown command "Laser OFF" to the Interface ASIC.
The DC/DC Converter converts the 48/60 V power supply to the voltages +2.5 V and
+3.3 V to supply all components on the board. It is synchronized with a synchronization
clock at 300 kHz (signal "Power Sync", generated by the Interface ASIC) in order to
prevent EMI problems.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-102 Block Diagram 4xSTM-1 Optical I/O Interface
Interface ASIC System clock a
System clock b
Main and spare

HiCap Matrix
1st INTERFACE
from/to
T1
Optical TTF
Input/
Output STM 1
RST MST MSA P
I
SPI (3) S
1 LOS
O
LASER D.
LASER F. DCCR DCCM
Optical RSOH MSOH
module LASER OFF (4) P DCC
I
S
O
Optical
Input/
Output 2ndINTERFACE
2nd INTERFACE (3)
Optical
2 module (4) T1
Optical
Main and spare

HiCap Matrix
Input/ (3)
Output 3 rd INTERFACE
Optical (4) T1
to
3 module
Optical
Input/ (3)
Output 4 th INTERFACE
Optical (4) T1
4 module
Config. &
Status Management
622 MHz Bus
OSC M-bus
Main and spare

Driver
HiCap Matrix
from/to
Bus OFF
Remote
Inventory
RIBUS RIBUS
Power I/F
Sync
Unit ID
CONGIHC
Failure
3.3 V 48/60 V
from
DC/DC
2.5 V CONVERTERS
A2S1 P4S1N
Access Board A2S1

The Access board 2xSTM-1 Optical (A2S1) is located in the Access area and provides the
connection to the line by a fiber cable for the optical STM-1 I/O Port board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-103, “Block Diagram Access Board 2xSTM-1 Optical (A2S1)” (p. 4-236)
depicts the block diagram of the Access board A2S1.
Figure 4-103 Block Diagram Access Board 2xSTM-1 Optical (A2S1)
CLOP
INPUT LOS
LASER DEG
OPTICAL LASER FAIL

LINE1
MODULE
SHUT DOWN
OUTPUT DATA AND CLOCK
to/from
Port board
CLOP
INPUT LOS
LASER DEG
LINE2 OPTICAL LASER FAIL

MODULE SHUT DOWN
to/from
Port board
CLOP
FAIL
to/from
HiCap Matrix board
REMOTE RIBUS
RIBUS
INVENTORY I/F
A2S1
The Access board A2S1 houses up to two independent optical modules.

Control Section
RIBUS I/F. It also sends the following command:
• CLOP for loopback facility.
A red/green LED is provided for board fail alarm indication on the front cover plate.
STM-1 Optical Module

The STM-1 Optical module represents the physical access for the optical I/O Port board
STM-1. Each module provides the optical RX and TX module with level adapter, Remote
Inventory and Laser Restart button. Different Optical modules are available according to
the connector type and wavelength.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-104 Block Diagram STM-1 Optical Module
EDR
Data in
Optical Rx optical module Level
Input ECKR Adapter Clock in
LOS
EDT Data out

ECT Level
Adapter Clock out
Optical Tx optical module
Output
Laser Failure
Laser Restart Laser Degrade
Shutdown
Remote
to RIBUS I/F
Optical Module Inventory
...................................................................................................................................................................................................................................
16xSTM-1 Optical I/O Interface
...................................................................................................................................................................................................................................

The I/O 16xSTM-1o boards increase the I/O port board density by factor 4 and the I/O
shelf density by factor 2.
Similar to the I/O 4xSTM-1o used up to now, the I/O 16xSTM-1o interface functionality
is implemented in two boards:
• Port board (P16OS1)
• Access board (A12OS1).
Port Board P16OS1
The port board P16OS1 which provides 4 STM-1o interfaces performs signal processing
of all the 16 signals.
The port boards are located in the port area. The access boards are located in the
corresponding access area. Port and access boards are connected over the backpanel.
Both boards (access and port) are one slot wide (4TE).
All optical modules are Small Form Pluggable (SFP) modules. They are different of those
used in the 4xSTM-1o boards. These optical modules can be equipped in a flexible way
(1 to 4 optical modules).
Only the S-1.1 interface is supported. The connectors are LC.
Otherwise the description of the functionalities is similar to 4xSTM-1o port board
(P4S1 ) described in section “4xSTM-1Optical I/O Interface” (p. 4-234) .
The relation between port board (P16OS1) and access board (A12OS1) is shown in
Figure 4-105, “Relation between Port Boards/Access Boards” (p. 4-238).
Figure 4-105 Relation between Port Boards/Access Boards
Access board Port board
1 slot 1 slot
1
. . 16xSTM 1o
. .
. 12xSTM 1o . 16xSTM 1equiv.
16xSTM 1o . 12 .
interfaces (A12SO1)
1
.
. (P16OS1)
4
SFP module S 1.1
Access Board A12OS1

The access board A12OS1 provides 12xSTM-1o interfaces (SFP modules).
The A12OS1 is located in the access area and provides the connection to the 16xSTM-1o
I/O port board.
The description of the functionalities is similar to 4xSTM-1o access board (A2S1)
described in section “4xSTM-1Optical I/O Interface” (p. 4-234). But the A12OS1
supports up to 12 optical modules (compared to two). These optical modules are Small
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Form Pluggables (SFPs) and can be equipped in a flexible way (1 to 12 optical modules).
...................................................................................................................................................................................................................................
I/O Port Board STM-4
...................................................................................................................................................................................................................................

The I/O Port board STM-4 (S4) manages one optical STM-4 data signal. The physical
access is performed by an optical module on the board.
The Port board S4 is available in variants S-4.1 (Short haul, 1300 nm), L-4.1 (Long haul,
1300 nm) and L-4.2 (Long haul, 1500 nm), all with FC/PC or SC/PC connectors. The
variants identified by JE (Joint Engineering) have better optical characteristics, typically
for the dispersion values and sensitivity.
Interface ASIC (refer to Figure 4-106, “Block Diagram Optical STM-4 I/O Port Board”
(p. 4-241)). It interfaces the two HiCap matrix boards via the backpanel.
TTF function. The TTF block is connected to the two HiCap matrix boards (A and B) by
means of a bidirectional link at 622 Mbit/s (STM-4 equivalent capacity) in 1+1
of the STM-4 signal. In addition, the TTF block provides the T1 timing references at 2
MHz, derived from the STM-4 input signal.
The Interface ASIC sends and receives one STM-4 signal (data + clock) at 622 Mbit/s
to/from the SPI. The SPI is able to detect an external LOS from the input line. The optical
transmitter reports its status to the Interface ASIC by means of the two input signals
"Laser Degrade" and "Laser Failure". The ALS algorithm is implemented by the hardware
on the O/E block and provides the Laser shut down command "Laser OFF" to the
Interface ASIC. A push-button is provided for manual laser restart on the board's front
panel.
The DC/DC Converter converts the 48/60 V power supply to the following voltages:
• -5.2 V (to supply the optical module).
The DC/DC converter is synchronized with a synchronization clock at 300 kHz (signal
'Power Sync', generated by the Interface ASIC) in order to prevent EMI problems.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-106 Block Diagram Optical STM-4 I/O Port Board
System clock a
System clock b
Matrix board A and B

from/to
Interface ASIC
TTF
Optical
Input/ K1,K2
Output STM 4
O/E SPI Tx side RST MST K1,K2,TP
MSA
LOS Insertion Rx side
Optical LASER D. Insertion
module LASER F. DCCR DCCM
RSOH MSOH
DCC
Config. & Status

Management
M-bus Bus
622 MHz
Laser Restart Driver
Matrix board A and B

OSC
from/to
Bus OFF
Remote
Inventory RIBUS
RIBUS
I/F
Unit ID
Power Failure
Sync
5.2 V
CONGIHC
3.3 V 48/60 V
from
DC/DC
2.5 V CONVERTERS
S4
...................................................................................................................................................................................................................................
I/O Port Board 4xSTM-4
...................................................................................................................................................................................................................................

ote: The description of the 4xSTM-4 Port board is similar to I/O STM-4 Port board,
refer to “I/O Port Board STM-4” (p. 4-240)
The I/O Port board 4xSTM-4 (P4S4 ) manages four optical STM-4 data signals. The
physical access to the four STM-4 signals is performed by optical IF modules. Two
modules are inserted in the related Access board (A2S4), two in the Port board itself.
The I/O Port board 4xSTM-4 (P4S4 ) is available in variants S-4.1 (Short haul, 1300
nm), L-4.1 (Long haul, 1300 nm) and L-4.2 (Long haul, 1500 nm), all with FC/PC or
SC/PC connectors. The variants identified by JE (Joint Engineering) have better optical
characteristics, typically for the dispersion values and sensitivity.
Port Board P4S4N

The SDH functions required to process the STM-4 signals are implemented by the GAs
mounted on the board. They interfaces the two HiCap matrix boards via the backpanel.
Access Board A2S4

The Access board 2xSTM-4 optical is located in the Access area and provides two
additional connections to the line.
The Access board A2S4 houses up to two independent optical modules. Figure 4-107,
“Block Diagram Access Board 2xSTM-4 Optical (A2S4)” (p. 4-243) depicts the block
diagram of the Access board A2S4.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-107 Block Diagram Access Board 2xSTM-4 Optical (A2S4)
CLOP
A2S4
INPUT LOS
STM-4 LASER DEG

OPTICAL LASER FAIL
LINE1
MODULE
SHUT DOWN
to/from
Port board
CLOP
INPUT LOS
LASER DEG
STM-4
LINE2 LASER FAIL
OPTICAL
MODULE SHUT DOWN
to/from
Port board
CLOP
FAIL
to/from
Matrix board
REMOTE RIBUS
RIBUS
INVENTORY I/F
STM-4 Optical Modules

The STM-4 optical modules represent the optical physical accesses for the 4xSTM-4 Port
board (P4S4 ), refer to Figure 4-108, “Block Diagram STM-4 Optical Module”
(p. 4-244).
The optical module houses in the Access board A2S4 and in the Port board P4S4 .
Up to two optical modules houses in the Access board A2S4 and in the Port board P4S4 .
Each module provides the optical RX and TX module with level adapter, Remote
Inventory and Laser Restart button. Different optical modules are available according to
the connector type and wavelength.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-108 Block Diagram STM-4 Optical Module
OPTICAL EDR
INPUT Level Data in
RX Optical Module
ECKR Adapter
Clock in
LOS
EDT
Data out
ECT Level
OPTICAL Adapter Clock out
OUTPUT TX Optical Module
Laser Failure
Laser Restart
Laser Degrade
Shutdown
Remote to RIBUS IF bus

Inventory
Optical Module
...................................................................................................................................................................................................................................
4x140 Mbit/s Port Board (P4E4N)
...................................................................................................................................................................................................................................

The 4x140 Mbit/s Port board is a bidirectional unit which interfaces up to four
plesiochronous 140 Mbit/s (E4).
The choice among the two possible different interfaces is flexible and mixed
configuration are allowed.
For each P4E4 Port board there are four electrical (75 Ohm) or optical module (Short
and Long Haul); two of the four module are hosted directly on the port board, the other
two are hosted in the relevant access board (A2S1).
The functions required to manage 140 Mbit/s PDH signals are implemented by the
"Mapper/Demapper 140-PDH/155-STM-1" block and GA mounted on the board. The GA
interfaces the two matrix on the HiCap matrix boards via backpanel.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-109 P4E4N Port Board Block Diagram
System clock a
G.A. System clock b
HiCap Matrix
A and B
1st INTERFACE
Int.
Loop
Line
Loop
EN 140/155 HPOM T1
HSUT(*)
O/E (3a)
Input/ O/E LOS LOS TTF (3b) PISO
Output Module (3c) &
MAPPER/DEMAPPER Data SIPO
1 Data 140 PDH/155 STM1 (3d)
SPI RST MST MSA
or
PPI DCCR DCCM (4a)
LASER D. RSOH MSOH (4b)
PISO
& DCC
LASER F. (4c) SIPO
LASER OFF (4d)
O/E
Input/
Output
2
2nd INTERFACE (3b)
O/E EN 140/155 (4b)
Input/ T1
Output
3
SPI 3 rd INTERFACE
Hicap Matrix
( ) (3c)
A and B
O/E (4c)
Input/ EN 140/155 T1
Output
4
SPI
( ) 4 th INTERFACE (3d)
EN 140/155 (4d)
T1
Config. &
Status
FROM CONGI HC HiCap Matrix A and B

622 MHz Management
Bus
OSC M B US
Driver
FROM/TO
Power
Sync.
Remote CMISS
Inventory Bus OFF
RIBUS
EN 140/155 1 4 RIBUS
I/F ID
Line Loop 1 4
1.8 V F +3.3 Vdc
Int. Loop 1 4
5V
DC/DC Unit failure 48/60 V
3.3 V
A2S1 CONVERTERS
ACCESS 2.5 V
CARD
P4E4N
Notes:
The SPI associated to the 3rd and 4th interfacees are physically on the Access board
2x140 Mbit/s Access Board (A2S1)

The 2x140 Mbit/s A2S1 Access board is placed in the Access area of Main Shelf (MS).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The Access board A2S1 can house two independent modules that can be both electrical,
both optical or a mix of the two.
The Access board houses also the RIBUS I/F block function.
Figure 4-110 A2S1 Access Board Block Diagram
CLOP
INPUT LOS
LASER DEG
ELECTRICAL LASER FAIL to/from
LINE1
PORT CARD
SHUT DOWN
MODULE
OUTPUT
DATA AND
ICMI CLOCK
CLOP
INPUT LOS
LASER DEG
ELECTRICAL LASER FAIL
LINE2 to/from
SHUT DOWN PORT CARD
MODULE
OUTPUT
DATA AND
ICMI
CLOCK
CLOP
FAIL
to/from
MATRIX
REMOTE RIBUS
RIBUS
INVENTORY I/F
A2S1 Access Board
140 Mbit/s Electrical Module (ICMI)

The electrical modules are housed in the Access board A2S1 and in the Port board
P4E4 .
Up to two modules can be housed in A2S1 and P4E4 .
The module contains:
• a CMI interface (CMI/ RZ decoder and RZ/CMI encoder)
• a Remote Inventory block.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-111 ICMI Module Block Diagram
LOS
RX side DATA RX
Coax Input CMI/NRZ
DECODER CLOCK RX
TX side DATA TX
Coax Output
NRZ/CMI
CLOCK TX
ENCODER
Remote
to RIBUS I/F block
Inventory
ICMI Module
OMI Interface
IPUT side : the CMI electrical signal coming from the line is RZ decoded (clock +
data). The LOS alarm is revealed.
OUTPUT side : the RZ signal coming from the port (data + clock) is CMI coded to be
sent to the line.
Remote Inventory
The Remote Inventory is implemented on an E2PROM. Inventory data as code, series
number, construction date are stored inside the E2PROM and can be read through the
RIBUS I/F block.
...................................................................................................................................................................................................................................
High Speed Port Protection Using HPROT and HPROT16
...................................................................................................................................................................................................................................
Boards
High Speed Port Protection Using HPROT and HPROT16 Boards

The High speed Protection (HPROT) board is located in the Access area and provides
EPS protection for electrical high speed ports. It realizes the connection between the
Access boards and protection Port board (electrical) if protection is requested.
There are available two protection access boards:
• HPROT
It is used in conjunction to A4ES1 access board + P4ES1 port board. It is needed for
EPS protection on 4xSTM-1 electrical board.
• HPROT16
It is used in conjunction to A16ES1 access board + P16S1 port board. It is needed
for EPS protection on 16xSTM-1 board.
These modules have to be placed in correspondence of spare port board. The general
functionality of HPROT and HPROT16 is the same. Figure 4-112, “Block Diagram
HPROT Board” (p. 4-249) shows the HPROT board. The HPROT16 is similar, it has got
16 blocks instead of 4.
The next chapters describe only the HPROT board.
The HPROT board connects up to four electrical high speed data streams from/to the
neighbored last Access board related to the protected Port board group.
Figure 4-112 Block Diagram HPROT Board
NRZ NRZ
from/to the last CK CK from/to
Access board related to the NRZ NRZ protection Port board
protected Port board group CK CK
LOS LOS
NRZ NRZ
from/to the last CK CK
Access board related to the NRZ NRZ from/to
protected Port board group CK CK protection Port board
LOS LOS
NRZ NRZ
from/to the last CK CK
Access board related to the from/to
NRZ NRZ
protected Port board group CK CK protection Port board
LOS LOS
NRZ NRZ
from/to the last CK CK from/to
Access board related to the NRZ NRZ protection Port board
protected Port board group CK CK
LOS LOS
to/from
FAIL
HiCap Matrix board

Remote
Inventory RIBUS I/F RIBUS
HPROT
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Boards
Control Section
RIBUS I/F. A red/ green LED is equipped for board fail alarm indication on the front
cover plate.
High Speed (HS) Port Protection
The 1670SM shelf is designed to handle STM-1 electrical Ports (High Speed Ports) with
+1 ( = up to 15) Equipment Protection Switching (EPS) or no protection of the STM-1
Port boards. Up to 16 HS Port boards can be housed in the Port area. There are 4 High
Speed Ports per STM-1 Port board. It supports up to 60 STM-1 ports (working ports per
shelf) plus 4 STM-1 protection ports in case of EPS. This leads to a maximum of 15
working boards and one protection board per 1670SM shelf (15+1 protection).
In the 1670SM shelf, the protection Port board needs to be a related High-speed
Protection (HPROT) board in the Access area (slot 4). In case of no EPS, the protection
board and the HPROT board have to be omitted.
The constraints for the main/protection Port boards are the following:
• The Access board corresponding to the protecting board must be an HPROT Access
board
• The HPROT board has to be plugged at the left side of the Access board group
(A4ES1)
• The protection Port board has to be plugged in at the left side adjacent to the protected
Port board group (P4ES1 ).
• The protection Port board and the Port boards of the protected group have to be of the
same type.
ote that no protection is planned for the Access boards, and note also that the type of
protection can not be changed (i.e. it isn't possible to change the protection scheme from
+1 to 1+1).
Manual Switch and force switch commands can be given via software by the user to
activate the protection boards. The protections status is reported to the EC.
High Speed Connections
Each Access board is connected also with the previous one and next one in both the
receive and transmit direction; this way, +1 protection is provided using the HPROT
board in last position at the left side of the Access boards pertaining to the protected Port
board group.
The Port boards P4ES1 manage up to 4 HS signals. Protection is always enabled for all
HS signals of the switched Port board.
Input Side (from the Access Module Point of View)
The CMI encoded STM-1 signals coming from the line and connected to the Access
board are RZ decoded. The clock CK is extracted from the data. By means of the back
panel connections, RZ data and CK are forwarded to both the pertaining main Port
board and to the next Access board in the direction to the protection Port board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Boards
Output Side (from the Access Module Point of View)
The signal, coming from main and protection ports via back panel connections, is coded
into the line format (CMI).
The protection port is not devoted to a specific main port, therefore the signal transmitted
from the protection Port board is distributed to all Access boards involved in the
protection scheme. The connections are functionally point-to-multipoint but physically
every Access board realizes a point-to-point connection to wards the previous and the
next Access board using a buffer to decouple and regenerate the signal.
EPS Switching Causes
• failures causing the internal equipment link loss as powering, Clock loss, board
oscillator, optical module defective, electrical interface defective and so on;
as RIBUS failure or M-bus failure.
loss of DC/DC synchronism).
automatic switch.
...................................................................................................................................................................................................................................
Optical Link Enhanced (HCLINKE)
...................................................................................................................................................................................................................................

Main functions and configuration
The HCLI KE board is a 10 Gbit/s interface port aimed at connecting together a 1670SM
to the 1678MCC main shelf.
The HCLI KE is hosted in a dedicated section of the 1670SM, located in the lower row,
named Link Area.
Up to eight HCLI KE can be hosted in one 1670SM (four "main" and four "spare").
The HCLI KE board can be put in the link area of the 1670SM: the roles of the main and
the spare boards and their positions are fixed (refer to chapter “1670SM Shelf - Basic
Equipment” (p. 3-90) ).
Two GA (#1 to #2) are used and they provide the following capabilities:
• 1xSTM-64 sections (with full SDH functionalities) is generated and terminated
• manage ALS
The connection between 1670SM and 1678MCC is MSP protected:
• a Multiplex Section Protection (in according to the K1-K2 APS standard protocol)
dual-ended is implemented.
The MSP protection scheme is automatically created at the board configuration, but the
following simple rule has to be followed: the board HCLI KE spare has to be created
after (and deleted before) the corresponding HCLI KE main.
Description
The main functions are: regenerator section termination, multiplex section termination
and section adaptation. The GA directly interface the backplane and the optical devices.
The two GA are connected to ISPB bus via a common GTLP to TTL level converter
interface.
Each HCLI KE is connected to HCMATRIX/A and HCMATRIX/B. The throughput of
each interconnection is 10 Gbit/s, obtained via 16 differential LVDS connections at 622
Mbit/s. Each HCLI KE receives from each matrix a dedicated 622 MHz clock in LVDS
format.
Each HCLI KE is connected also to the control subsystem of the 1670SM equipment,
i.e.:
• Intra Shelf Parallel Bus (ISPB), mastered by the active HCMATRIX
• Serial Peripheral Bus (SPI) A and B, mastered by HCMATRIX/A and /B
The ISPB allows for the access to the contents of the internal registers of the ASICs
hosted on the HCLI KE board.
The SPI busses are terminated on the board via a 'Spider' device which allows for the read
and write of some provisioning and alarms available on the board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Each LI K slot has a 'board presence' pin which allows the HCMATRIX boards to detect
the presence of the board.
The HCLI KE board has an optical interface which has an aggregate bandwidth of 10
Gbit/s bi-directional for the connection to the 1678MCC main shelf.
Transmission resources
The following transmission features are supported:
• All transmission features at the VC-4 path layer are supported for the HCLI KE
board (HPOM, HSUT, HTCM/HTCT);
• J0 management;
• Linear MSP 1+1 bi-directional is supported between a HCLI KE-A and
HCLI KE-B (fixed scheme created with the configuration of the main/spare boards
like an EPS 1+1 for HCMATRIX);
• AU4-4c and AU4-16c signals can be transported.
The following limitations apply to transmission:
• HCLI KE does not support the transport of AU4-64c signal;
• no bidirectional transmission on single fiber (this is not a functional limitation).
Synchronization, auxiliary channel and loopback

o limitation applies to synchronization, so HCLI KE can be used as synchronization
sources and they can carry SSM messages.
Each HCLI KE is connected to the 6-wires synchronization bus aimed at collecting the
synchronization sources for the CRU, which is hosted on both matrices. Each of the six
wires can be loaded with a 2 MHz clock by any port of the 1670SM: this rule applies also
for the HCLI KE board.
Power supply and optical characteristics

This board hosts on it the circuitry for the DC/DC converter 48V/+5V, 48/-5V and one 10
Gbit/s optical module.
The HCLI KE board receives the battery voltage and generates through DC/DC
converters following voltages:
• +3.3 V
• +1.8 V
• +5 V
• -5 V.
Also HCLI KE board receives the spider voltage +3.3 VS by backpanel.
The main optical characteristics are:
wavelength: 1290 to 1330 nm (second window)

launched average power per fiber: min. -6.0 dBm max. -1.0 dBm
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
sensitivity: -11.0 dBm (@ BER =10 -12)

saturation: -1.0 dBm (@ BER =10 -12)
...................................................................................................................................................................................................................................
Bus Termination (BTERM)
...................................................................................................................................................................................................................................
Bus Termination (BTERM)

Refer to Figure 4-113, “BTERM Board Block Diagram” (p. 4-255).
The main function of this board is to give the electrical termination to the buses routed on
the backplane and to supply the reference voltages of ISPB bus located on the other
boards housed in the shelf.
The signal buses are:
• ISPB (communication way between the microprocessor and the GA of the equipment)
• ISSB (connection way between SC on HCMATRIX and other processor in the shelf,
if present)
• CK2M (reference clocks T1/T2 between port and synchronization function on
HCMATRIX)
• SPIDER (connection way between all boards and SC on HCMATRIX)
These buses are routed on the backplane as a ring structure; therefore it is necessary to
have a double termination, one at each end of line.
The BTERM is powered by -48 V by CO GIHC board; it generates a 3.3 V and a 1.5 V
used on board (a VTT voltage for terminations on other units).
The Bus Termination houses also the RIBUS I/F block, whose function is described in
“Remote Inventory Subsystem” (p. 4-123), and the Remote Inventory.
On the front cover plate a green/red LED is available for board fail alarm indication.
This board is not managed by CT. It is very important to check its presence (it is
mandatory) and its correct functionality.
Figure 4-113 BTERM Board Block Diagram
all all
buses buses
TERMINATIONS
3.3V 1.5V
48V DC D C Regulator to other units
from VTT
Converter
CONGIHC
FAIL
REMOTE RIBUS to/from

RIBUS
INVENTORY I/F MATRIX
BTERM
...................................................................................................................................................................................................................................
Control and General Interface Board (CONGIHC)
...................................................................................................................................................................................................................................

Each 1670SM shelf houses two Control and General Interface High-Capacity
(CO GIHC) boards, referred as CO GIHC A (slot 1) and CO GIHC B (slot 21).
The CO GIHC boards are not intended as redundant (only for power and internal LA ).
Each board provides a set of functions. Both boards are necessary to provide the complete
set.
Table 4-17, “Interfaces on the Boards CO GIHC A and B” (p. 4-256) lists the interfaces
provided on each CO GIHC board.
Table 4-17 Interfaces on the Boards CONGIHC A and B

CONGIHC/A CONGIHC/B
POWER A POWER B
Housekeeping & Remote Alarms (a subset) Housekeeping & Remote Alarms (a subset)
Rack lamps (R/M), not used ot used
QMD (Q2), not used Shelf ID connector
Ext. LA 10 base 2 not used
Ext. LA 10 base T not used
I T LED I T LED
Internal LA (10 Base T) A1 Internal LA (10 Base T) B1
Auxiliary Housekeeping (connector for FA Auxiliary Housekeeping (connector for FA
alarm cable) alarm cable)
Remote Alarms
Internal LA (10 base T) A2 Internal LA (10 Base T) B2
ote: The Shelf ID connector which provides shelf identification within the Internal
LA is connected to the front panel of the CO GIHC B board (Slot 21).
The main functions performed by the CO GIHC board are (refer to Figure 4-114,
“CO GIHC Board Block Diagram” (p. 4-257)) :
• Input power stage
• A D/OR and Remote Alarms (not used)
• Housekeeping interface
• R/M interface
• QMD interface
• External LA interface
• Remote Inventory
• Auxiliary Housekeeping interface
• Internal LA interface (LI K 1+2)
• Remote Alarms.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-114 CONGIHC Board Block Diagram
Input Power Stage
B att
+ Batt_A
MAIN +Batt TO ALL
Station POWER EMI BOARDS
battery B att_A BLOCK FILTER
TO
RIBUS
Service PROTECTION I/F +3V
DC/DC TO ALL
battery POLARITY CICUIT 3.3 V
48V BLOCK BOARDS
INVERSION
PROTECTION
9V STEP UP
CONVERTER
RACK
LAMPS BAT FAIL
R/M
20%
AND/OR URG, NURG, IND
HOUSEKEEPING 6
AND REMOTE HK IN
ALARM not used
2 HK OUT
AUXILIARY to/from
8+8 AUX HK (in&out)
HOUSEKEEPING HiCap Matrix
(connector for Board
FAN alarm
cable)
NON SDH
EQUIPMENT not used
QMD M
INTERFACE TRANSCEIVER U
X not used
(shelf ID is connected
on CONGIHC B in
Slot 21)
9V
COAX
TRANSCEIVER
BNC INTERFACE
External LAN (CTI) UNIVERSAL
ETHERNET M not used
RJ45 INTERFACE U
ADAPTER X not used
Q3 (AUI)
INTERFACE
\f\b BNC
FAIL
to/from
HiCap Matrix
RJ45 Board
\b Remote RIBUS RIBUS
Inventory I/F
RJ45 CMISS
\f\b DXC
LAN
INTERFACE CONGIHC
Input Power Stage

The input power stage decouples the power station battery. It contains the Main Power
Block with EMI input filters, a Protection Circuit Block, a Step up converter to provide -9
V and a DC/DC converter to provide the +3.3 V to the RIBUS I/F block.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
QMD Interface
Interface is not used (shelf ID on CO GIHC B).
Internal LAN Interface
This interface links the 1670SM shelves via the Internal LA to the Control partsystem.
Redundant interfaces (LI K #1, #2) are provided:
• LI K #1:
– two B C for 10Base2 connection type (not used)
– RJ45 for 10BaseT connection type.
• LI K #2:
– RJ45 for 10Base T connection type.
...................................................................................................................................................................................................................................
Matrix Board (HCMATRIX)
...................................................................................................................................................................................................................................

The 1670SM equipment hosts up to two HCMATRIX boards (referred HCMATRIX/A in
the slot 22 and HCMATRIX/B in the slot 41); only one board is active, the other one is
standby.
As the HCMATRIX is in 1+1 redundant configuration, all the functions realized by the
board are redundant as well.
The HCMATRIX performs different functions:
• connections between ports
• equipment synchronization (Clock Reference Unit)
• performance monitoring collection
• power supply
• remote inventory.
The HCMATRIX board has two boards: MATRIX SUPPLY (DC/DC converters) and
MATRIX MOTHERBOARDS (all other functionalities).
The HCMATRIX can handle up to 512 STM-1 signals of which 256 from Port boards
(and the other from LI K boards).
MATRIX CONNECTIONS
The connections between HCMATRIX and ports are realized by means of links at 622
Mbit/s (refer to Figure 4-115, “HCMATRIX Board Block Diagram” (p. 4-262)).
EQUIPMENT SYNCHRONIZATION
The equipment synchronization is realized by the SETS function (Synchronous
Equipment Timing Source) that distributes to each port the pertaining synchronization
signals.
A high stability oscillator at 10 MHz (VCXO - 0,37 ppm) is present to guarantee an
holdover or free running working mode compliant to the ITU-T Recs.
The clock reference (CRU) working modes can be: locked, holdover and free running.
When working in locked mode, the SETS block can select its reference signal among (the
selection is accomplished by means of the software and craft terminal):
• timing reference signals coming from the SDH ports (T1)
• 2 MHz clocks coming from the SERVICE board (T3)
The SETG block (Synchronous Equipment Timing Generation) generates:
• a system clock T0 (at 622.08 MHz) locked to the selected reference (T1 or T3) and
distributed to the equipment;
• CK38Mhz : it is derived from the system clock (T0) and is distributed to all the ports;
ts frequency is 38.88 MHz;
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• MFSY : it is the multiframe synchronism at 500 Hz, obtained from the ck38 MHz; it is
distributed to all the ports and boards;
• a 2 MHz clock T4 used as synchronization clock towards the external, accessible from
the SERVICE board;
• SY1S : it is the 1 second synchronism that is sent to a GA for the managing of the
Performance Monitoring Data.
The synchronization system is able to guarantee the hitless switching functionality in case
of CRU switch only if the two CRUs are locked. In order to work in 'locked mode' the
two CRUs exchange some signals.
For a detailed description of the synchronization subsystem refer to “Synchronization
Subsystem” (p. 4-51).
SHELF CONTROLLER FUNCTIONS

The HCMATRIX houses the circuitry necessary to realize the Shelf Controller.
The SC provide the resources to support the SW functions related to the control and
management operation of the boards. To perform its functions, the SC directly interfaces
the ASICs on the board implementing the SDH functions for data collection (faults or
alarm event detections, performance monitoring data) and configuration provisioning.
As the SC is involved in critical activities (for instance EPS), is 1+1 protected.
The internal interfaces supporting SC element for communication tasks are:
• Management -Bus (ISPB) : it is a parallel bus connecting the SC processor to all the
transport ASICs located on the traffic boards to provide communications among the
boards and the Controller, for management of the boards (management of payload
processing functions).
• ISSB : Intra Shelf Serial Bus is a serial bus for communication among SC and, if
present, other processor in the Shelf.
• RIBUS (SPI): it is a serial bus connecting the SC processor to the serially interfaced
devices called RIBUS-I/F, located on each board for simple read or write operations,
for communications about Remote Inventory, boards failure, bus releasing.
• IPL : it is a channel between the two SC (active and standby).
A push-button is present to reset the SC.
The 'Board Missing' signals of all the boards are connected with a GA.
For a detailed description of the Controller refer to “Controller Subsystem” (p. 4-37),
where the control subsystem is described.
PERFORMANCE MONITORING COLLECTION

The "Performance Monitoring Management" block housed on the HCMATRIX board
realizes Performance Monitoring functionalities; it collects and stores the data (Defect
seconds and Errored blocks) coming from all the flows.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The Performance Monitoring Controller is managed by a GA and can be made at:

• Adaptation and Regeneration section
• Multiplex section
• Multiplex section adaptation
• HSUT
• HPOM
• HPT
• TCT and TCM.
POWER SUPPLY
The board receives via backpanel connectors the -48 V coming from CO GIHC boards
and extracts the main power supply via dedicated DC/DC Converters hosted on the
'MATRIX SUPPLY' board.
The power supplies used in the HCMATRIX are the following:
• +3.3 V (it is obtained by 8 DC/DC conv. -48/+3.3 V-5 A; it is the main power supply
of the board)
• +2.5 V (it is obtained from the +3.3 V with 7 Step Down +3.3 V/+2.5 V-5 A)
• +1.7 V (it is obtained from the +3.3 V with a Step Down +3.3 V/+1.7 V-5 A)
• +0.8 V (it is obtained from the +3.3 V with a Step Down +3.3 V/+0.8 V-5 A).
The Remote-Inventory and RIBUS-I/F blocks are powered by the 3.3 V power service
coming from the CO GIHC boards.
REMOTE INVENTORY
It is the memory used to maintain the board history and data.
For more details about the Remote Inventory function refer to “Remote Inventory
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-115 HCMATRIX Board Block Diagram
PERFORMANCE
MONITORING
MANAGEMENT
MATRIX
MSP
SNCP AU4 HPC HVC

622 Mb/s from/to all
Squelcing port cards
Timing &
T0 Synchronization T1
10MHz (SETS) from SDH ports
OSC
SETG T3
T4 (ck e xt)
Reset MFSY
T0 CK38 to ports
T0
SC Management bus Management bus

M B US
Driver
FLASH Bus From/to
OFF
EPROM spare MATRIX
(1 Mb)
Remote and ports
Inventory
RIBUS RIBUS
I/F
Unit
Failure ID
RIBUS
ISSB From/to
spare HCMATRIX
3.3 V
48/60 V
2.5 V DC/DC from
CONGIHC
1.7 V CONVERTERS
0.8 V GROUP
HCMATRIX
...................................................................................................................................................................................................................................
FANs Unit
...................................................................................................................................................................................................................................
FANs Unit
Refer to Figure 4-116, “FA s Unit Block Diagram” (p. 4-265).
In the FA s subrack can be housed two FA s units that works together in order to avoid
high temperature inside the 1670SM subrack.
Each FA S unit is composed by seven FA s and some electronic circuits necessary to:
• FA s alarm management
• Send remote alarms to the Top Rack Unit (TRU)
• Power supply
In the following a description of the unit is given; more in details Figure 4-116, “FA s
Unit Block Diagram” (p. 4-265) shows how the two FA units work together.
FANS ALARM MANAGEMENT

Each FA on the unit can generate an alarm signal in case of faulty (AL1A, AL1B, AL2,
AL3 ... etc.): this function actually is not used.
The "FA s alarm management" block process all this signal in order to:
• generate FA s urgent alarm (URG_V)
• turn on the relevant red on the unit front
One FA faulty is enough to generate an URG_V alarm and turn on the relevant red LED
on the unit.
The state of the FA s unit can be supervised by the 1670SM Craft Terminal application if
the remote alarm URG_V are connected to the Housekeeping contact on the CO GIHC
board.
ote: in case of one broken FA in one of the two FA s unit, the following
indication will be display:
FANs unit with al least one broken FANs unit without broken FAN
FAN
URG_V red LED O URG_V red LED OFF
URG red LED O URG red LED O
REMOTE ALARMS
This block process the alarms detected on the board in order to generate remote alarms
towards the Top Rack Unit:
• URG: urgent alarm generated in case of at least one broken FA or loss of station
battery. When active the relevant red LED on the front of the unit is turned on.
• URG: not used.
• ATT: attended alarm. By pressing the push-button present on the board it is possible
to store an URG alarm. This action will turn off the URG LED alarm and will light up
the yellow LED on the board; the attended command is also sent to the rack lamps.
...................................................................................................................................................................................................................................
FANs Unit
...................................................................................................................................................................................................................................
ote: on the CT and on the OS application the URG and ATT remote alarm are
named in a different way; the relation between this two terminology is explained in
Table 7-16, “Relation between Alarm severity terminology” (p. 7-36).
POWER SUPPLY
The FA s unit are powered by a DC/DC converter that starting from the station battery
(-48/-60 V) derive a 12 VDC voltage. Each FA is protected by a fuse.
Another voltage is generated (VSERVin) in order to power supply the FA S ALARMS
MA AGEME T block if no external service battery (VSERVext) is available.
In case of station battery faulty an alarm is generated (PWAL); as consequence the URG
LED and the relevant remote alarm will be activated (T-URG).
...................................................................................................................................................................................................................................
FANs Unit
...................................................................................................................................................................................................................................
Figure 4-116 FANs Unit Block Diagram
FANs UNIT (Board 2)

FANS
1A 5A
2 3 4
1B 5B
NOT USED
&
AND5
&
AL4
AL3
Housekeeping
CONGIHC
AL2
AND1 URG_V
to
BAT_B
48/60 V T URG
AL5A NOT USED

AND5
AL5B
& FANs UNIT (Board 1)
AL4
AL3 not used
AL2 NURG_V
AL1B not used
AL1A & AND1 R A
Housekeeping
E L
CONGIHC
M A
O R URG_V
T M URG_V
FANS
to
1A 5A E S
2 3 4
URG
1B 5B FANS
ALARMS
MANAGEMENT
RM
Top Rack Unit

URG_V
from/to
AL5A
>
=1
AL5B L A ATT
AL4 O L URG
AL3 C A
AL2 A R
L M
AL1B S
AL1A
BAT_A VSERVext
F1
48/60 V DC/DC
Converter
F7 to fans
VSERVin
Housekeeping
CONGIHC
VSERVin ALARMS
DC/DC
Converter STORING
to
PWAL T URG
...................................................................................................................................................................................................................................
Product description Units Descriptions OED shelf 1662SMC
Overview
...................................................................................................................................................................................................................................
Units Descriptions OED shelf 1662SMC
Introduction
The following Table 4-18, “Units involved in 1662SMC” (p. 4-266) sums up the units
managed in the 1662SMC Shelf Equipment.
Table 4-18 Units involved in 1662SMC

(mm)
Control / Control and General I/F CO GI 20 2
Common
Common / Compact STM-16 SY TH16 40 2
LI K
Control / Termination Bus BUSTERM 2
Common
PDH Port 63x2 Mbit/s Port P63E1 20 8
63x2 Mbit/s Port with retiming P63E1
PDH Access 63x2 Mbit/s Prot. (75 Ohm) A63E1A 20 8
63x2 Mbit/s Prot. (120 Ohm) A63E1B
63x2 Mbit/s Prot. (120 Ohm/K20) A63E1B
Low Speed Protection LPROT 2
...................................................................................................................................................................................................................................
63x2 Mbit/s Access Board
...................................................................................................................................................................................................................................

Refer to Figure 4-117, “63x2 Access Board - Block Diagram” (p. 4-268).
The 63x2 Mbit/s access board provides the connections from back panel to the external
line and vice versa for 63 PDH signals. According to the type of line impedance (75 Ohm
or 120 Ohm) and electrical characteristics different types of access board are available.
In the following a generic description of the access board is given:
INPUT side
Under normal operating condition, the signal received from the line is sent to the 63x2
Mbit/s "main" port board.
Under alarm condition, the signal received from the line is switched towards the LSPROT
board. The switching command SEL is received from the RIBUS I/F block.
A protection block is present to protect the incoming signal against spikes ( G.703).
OUTPUT side
The two signals received from the port and LSPROT port boards 63x2 Mbit/s are sent to a
selector.
The SEL command, received from the RIBUS I/F block, select the signal to sent to the
line.
Remote inventory
The RIBUS I/F is present to read/write inventory data as code, series number,
construction data present on the RI (refer to “Remote Inventory Subsystem” (p. 4-123) for
details).
Power supply
The access board receive the +3.3 VDC provided by the CO GI boards.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-117 63x2 Access Board - Block Diagram
Input 1
INPUT TO PORT CARD
SPIKE
FROM LINE PROTECTION
TO LSPROT CARD
SEL
Output 1
OUTPUT SPIKE FROM PORT CARD
TO LINE PROTECTION FROM LSPROT CARD
SEL
Input 63 TO PORT CARD

INPUT SPIKE
FROM LINE PROTECTION
TO LSPROT CARD
SEL
Output 63
OUTPUT SPIKE FROM PORT CARD
TO LINE PROTECTION FROM LSPROT CARD
SEL
SEL
FAIL
REMOTE RIBUS RIBUS

INVENTORY IF TO/FROM
CMISS SYNTH16
+3.3 Vdc F
FROM CONGI
63x2 MBit/s Access
...................................................................................................................................................................................................................................
Low Speed Protection
...................................................................................................................................................................................................................................
Low Speed Protection

Refer to Figure 4-117, “63x2 Access Board - Block Diagram” (p. 4-268).
The LSPROT board is used to realize EPS protection for low speed ports. It realizes the
connection between the port board and the LS protection bus if protection is requested.
The LSPROT board receives the signals coming from the port board via back panel.
Control Section
The RIBUS I/F block is present to read/write inventory data as code, series number,
construction data present on the RI (refer to “Remote Inventory Subsystem” (p. 4-123) for
details).
Power supply
The access board receive the +3.3 VDC provided by the CO GI boards. On the front cover
plate a red/ green LED is available for board failure alarm indication.
Figure 4-118 LSPROT Board - Block Diagram
1 1
FROM LS TO PORT CARD
Protection Bus
FROM LS 63 63
TO PORT CARD
Protection Bus
FAIL
REMOTE RIBUS RIBUS

INVENTORY IF TO/FROM
CMISS SYNTH16
+3.3 Vdc F
FROM CONGI
LSPROT
...................................................................................................................................................................................................................................
63x2 Mbit/s Port Board (P63E1)
...................................................................................................................................................................................................................................

Refer to Figure 4-119, “63x2 Mbit/s Board - Block Diagram” (p. 4-273).
The P63E1 is a bidirectional board which interfaces 63 plesiochronous 2048 kbit/s signals
and the STM4-BPF signal (BPF=backpanel format).
Due to the backpanel format (STM4-BPF or STM4*), the 63 plesiochronous 2 Mbit/s
signals that can be housed in an STM-1 frame, are dropped / inserted in the AU4#1 of the
STM-4* frame.
The board is composed by the following blocks:
• (G.A.)
G.A. is an ASIC (or Gate Array) that maps 63x2 Mbit/s streams into an STM-1 frame
as required by ITU-T G.783 Rec.
As the backpanel format for data exchange between 63x2 Mbit/s and Matrix board is
STM-4*, the 2 Mbit/s streams are inserted/extracted on the AU4 #1 of the STM-4*
frame.
IPUT side
– PPI (E12_TT_Sk and E12/P12x_A_Sk): This block provides the electrical
interface between the physical transmission medium and the internal board
format. The received 2048 kbit/s line signal is HDB3 coded. A decoder on the
physical interface decodes the signal to RZ (non return-to-zero) format.
– LPA (S12/P12x_A_So) : This block adapts user data for transport in the
synchronous domain. For asynchronous user data, lower order path adaptation
involves bit justification. The 2.048 Mbit/s is inserted into a C-12 container (by
means of asynchronous mapping), which is synchronized (stuffing) with the
correspondent TU-12.
• V5[5-7]: Signal label insertion in the byte V5[5-7].
– LPT (S12_TT_So) : The LPT function creates a VC-12 by generating and adding
POH to a C-12. The POH formats are defined in Recommendations G.708 and
G.709.
• J2: trail trace identifier is generated.

• V5[1,2]: BIP-2 is calculated and transmitted.
• V5[3]: the number of errors is encoded in REI.
• V5[8]: RDI indication is inserted.
– LTCT So : This block performs Tandem Connection Termination and Adaptation

Source functions, according to ITU and ETSI standards, on Low Path tributaries.
It inserts into incoming Low order VC the 2 byte, and performs BIP-2 parity
compensation for that byte insertion. The inserted 2 is composed by remote
signalling, incoming error count, APId.
– STM4-BPF I/F () :
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
The STM-1 equivalent signal is multiplexed into the Back-Panel STM4*

equivalent signal.
The signal is sent to the "Main" and "Spare" MATRIX boards .
OUTPUT side
– EPS :
This block select one of the two signal source provided by the MATRIX boards
"Main" and "Spare"
– STM4-BPF I/F () :
The STM-1 equivalent signal is demultiplexed from the Back-Panel STM4*
equivalent signal.
– LTCT Sk : This block performs Tandem Connection Monitoring / Termination and
Adaptation Sink functions, according to ITU and ETSI standards, on Low Path
tributaries (configuration choice between Monitoring and Termination is by
preset). It extracts from incoming Low order VC the BIP-2 parity and 2 byte,
and then operates alignment, detection and correlation of alarms, error check.
When Termination function is configured, it also modifies data flow by 2 byte
overriding, AIS insertion, generation of remote signalling.
– LPT (S12_TT_Sk): The LPT function terminates and processes the POH to
determine the status of the defined path attributes.
• J2: trail trace identifier is recovered --> TIM detection.

• V5[1,2]: BIP-2 is recovered --> Ex-BER, Signal Degrade
alarm
• V5[3]: REI bit is recovered and the derived performance
primitives is reported.
• V5[8]: RDI information is recovered and reported.
• AIS or SSF detection --> SSF alarm
– LPA (S12/P12x_A_Sk): It extracts the VC12-POH and processes the TU12 pointer.
• V5[5-7]: Signal label detection in the byte V5[5-7] --> Signal label Mismatch
detection
• AIS or SSF is applied if Signal label Mismatch is detected
– PPI (E12/P12x_A_So and E12_TT_So): This block provides the interface between
the internal board format and the physical transmission medium. It encodes into
HDB3 code the signal to be sent on line.
Other functions implemented are :
– Clock Reference Selection Block (on G.A): provides six 2 MHz clock links
towards the MATRIX boards for synchronization purposes. The selection among
the 63 flows is made via software.
– TIMIG (on G.A): receives the reference clock (38.88 MHz) and synchronism
pulse (500 Hz) from the MATRIX boards and extracts the local clocks used by the
G.A.
The Tx clock is locked, by means of a PLL to the system clock or, when in free
running, to a local oscillator with a +-50 ppm drift: (51 MHz OSC) block.
– RIBUS I/F
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
This block is used to read/write from/to the "RIBUS" stream, to control the LED
on the board, to release the Management-bus in case of power failure, and to use
the remote inventory. It is powered by the + 3.3 VDC supply by CO GI boards.
– REMOTE IVETORY
It is the memory containing the board information, for identification purposes.
– M-BUS Driver
It drives the input-output gates of the Management-bus. These drivers can be
disabled (by the Bus-OFF signal) in case of power failure.
– DC/DC COVERTER
It converts the 48/60 V power supply to the 3.3 V used to supply all the
components in the board.
The DC/DC converter is synchronized with a synchronization clock at 288 MHz
(signal Power-Sync, generated by G.A.) in order to avoid EMI problems.
– STEP DOW
It uses the 3.3 V power supply from DC/DC Converter block to obtain the 2.5 V
used to power the Gate Array (G.A.).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-119 63x2 Mbit/s Board - Block Diagram
2Mb/s
inputs Input side
2Mb/s #1
PPI LPA LPT LTCT

#1 sink source source source
..
ckr1 .. ckrx
Access Card
.. .. STM4
..
Main and Spare

..
from
BPF
.. I/F
MATRIX
..
to
2Mb/s #63 ckr1 Clock
#63 Reference 6x
ckr63
ckr63 ckrx Selection
2Mb/s Output side

outputs 2Mb/s #1
PPI LPA LPT LTCT

#1 source sink sink sink
Access Card
cktx ckt1
..
.. ..
to
STM4
.. . BPF EPS
.. I/F
.
Main and Spare

2Mb/s #63
MATRIX
from
#63
cktx ckt63
ckt1 ckt63
Local Clocks
ck system a
ckrx TIMING ck system b
G.A. cktx
Config. & Status

Power 2.5 V 51MHz
Sync
STEP OSC M B US
DOWN Driver
Management
48/60 V DC/DC Bus
CONGI A & B
CONV.
3.3 V
from
Bus OFF CMISS
MATRIX
to/from
F + 3.3 Vdc
Remote
Inventory
RIBUS RIBUS
I/F
Unit ID
Failure
63x2 MBit/s Port
...................................................................................................................................................................................................................................
63x2 Mbit/s / G703 / ISDN-PRA Port Board (P63E1N)
...................................................................................................................................................................................................................................

Refer to Figure 4-120, “63x2 Mbit/s G.703/ISD -PRA, Block Diagram” (p. 4-278).
ote: The ISD-PRA functionality is not supported by the 1678MCC up to now!
The 63x2 Mbit/s /G.703/ISD -PRA port is similar to the basic 63x2 Mbit/s port,
described in the previous paragraph “63x2 Mbit/s Port Board (P63E1)” (p. 4-270), with
the difference that the present board implements also the T functionality on ISD
Primary Rate Access (PRA) and the "Retiming function" on the 2 Mbit/s interfaces.
The Retiming function applies the Equipment Clock to the outgoing 2 Mbit/s signal that
therefore becomes synchronized with the SDH network synchronization reference .
The additional circuit that allows this implementation consists in an elastic buffer that is
able to absorb the jitter and wander that is transferred to the PDH signal when SDH
pointer justification occurs.
This feature is programmable via SW, in order to include or exclude the Retiming for
each single port. The same P63E1 board can mix ports that apply or not the retiming.
In this paragraph the description of the T ISD -PRA function is reported, all the other
blocks functionalities are described in the previous paragraph “63x2 Mbit/s Port Board
(P63E1)” (p. 4-270).
The ISD -PRA (Integrated Services Digital etwork - Primary Rate Access) is a facility
to carry a number of synchronous digital communication channels to the user over a 2048
kbit/s structured signal; the ISD - PRA structure is defined in recommendation ETS 300
233.
The 2048 kbit/s signals can be structured or non-structured: in this latter case, the PRA
functionality must be disabled from Craft-Terminal. The selection among
structured/non-structured and basic-frame/multiframe options is achieved by means of
Craft-Terminal, for individual signals.
It performs standard PRA functionality as well as some custom Leased Line functions
(settings from CT).
Figure 4-121, “Functional Diagram of the T ISD -PRA Block” (p. 4-279) illustrates the
T ISD -PRA block, that performs the following functions:
UPSTREAM DIRECTIO
(from user to SDH network: incoming signal SY2Min, outgoing signal UP2Mout)
• Loopback2: by means of command LB2, sent by the controller, or detected in the Sa6
message coming from the SDH network (UP2Min signal); this command sends back
to the source the upstream signal.
• AIS Detection: the AIS alarm (AIS2M) is detected after the reception of 512 bits
containing less than 3 zeroes.
• Frame Alignment (FA): it performs basic-frame and multi-frame alignment according
to ITU-T G.706, presettable from the controller (commands BF and MF); the LOF2M
alarm is declared in case of non alignment .
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Failure Condition: the Failure Condition FC2M alarm is the "OR" of LOS2M, LOF2M ,
AIS2M alarms.
• REI alarm detection (E): the REI2M alarm is detected if E=0.
• RAI alarm detection (A): the RAI2M alarm is detected if active for 5 consecutive
frames.
• Data Error detection (CRC-4): errors integrity check on the incoming data, according
to CRC-4 procedure (Cyclic Redundancy Check), as defined in G.706. In case of
errors, the alarm ERR2M is indicated.
• E bit insertion (E): the outgoing E bit is set to 0 when
– a failure condition (FCU) is detected on signal from SDH network (UP2Min);
– errors (ERRU) are detected on data from SDH network (UP2Min);
– the E insertion may be inhibited from controller, in this case E=1.
– E=1 in other cases.
• A bit insertion (A): the outgoing A bit is
– set to '0' when a failure condition (FC2M) is detected on signal from user
(SY2Min);
– set to '1' when Loopback2 (LB2) is activated;
– passed transparently in other cases;
– set to '1' when a failure condition (FCU) is detected on signal from SDH network
(UP2Min); this option is enabled only in case of Leased Line applications
– the A bit may be forced from controller.
• Sa5, Sa6 Messages:
– the outgoing Sa6 message is inserted in 4 Sa6 bits of 4 consecutive frames, with
the following significance (listed in order of their priority/severity):
- 1000 --> power fail
- 1111 --> SSF or AUXPU/AISU on signal from SDH network (UP2Min);
- 1110 --> LOFU on signal from SDH network (UP2Min);
- 1100 --> FC2M on signal from user (SY2Min);
- 0000 --> loopback2 (LB2) activated
- 0001 --> alarm REI2M from user
- 0010 --> CRC-4 errors (ERR2M) from user
- 0011 --> simultaneous occurrence of both previous (REI2M and ERR2M)
- 0011 --> only basic-frame alignment on SY2Min signal, when in automatic
search
- 0000 --> normal operations.
– the outgoing Sa5 bit is set to:
- '0' --> when loopback2 (LB2) is activated
- '1' --> in other cases.
• CRC-4 bits insertion: the CRC-4 on data is performed and the result is inserted on bits
C1 to C4, according to G.706.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Frame Word insertion (FW): the basic-frame and multi-frame alignment words are
inserted on the frame.
• Substituted Frames insertion: the substituted frames are inserted, in case of
occurrence of a failure condition (FC2M) on incoming signal from user. Substituted
frame is a frame with Sa4, Sa5, Sa7, Sa8 as well as all the bits in time slots 1 to 31 set
to '1', and with A bit set to '0'.
DOWSTREAM DIRECTIO
(from SDH network to user: incoming signal UP2Min, outgoing signal SY2Mout)
• Loopback-RX: by means of command LB-RX, sent by the controller; this command
sends back to the source the downstream signal.
• AIS Detection: the AIS alarm (AISU) is detected after the reception of 512 bits
containing less than 3 zeroes.
• AUXP Detection: the AUXPU alarm is detected after the reception of 512 bits
containing the pattern ...010101... with less than 3 deviation from the pattern itself. It
can be enabled from the controller.
• Frame Alignment (FA): it performs basic-frame and multi-frame alignment according
to ITU-T G.706, presettable from the controller (commands BF and MF); the LOFU
alarm is declared in case of non alignment.
• Failure Condition: the Failure Condition FCU alarm is the "OR" of SSF, LOFU , AISU,
AUXPU alarms. SSF=Server Signal Fail, from upstream.
• REI alarm detection (E): the REIU alarm is detected if E=0.
• RAI alarm detection (A): the RAIU alarm is detected if active for 5 consecutive
frames.
• Sa6: the Sa6 bit is read for every 4 consecutive frames, to check the presence of the
loopback2 command, when 4XSa6=1010, for 8 consecutive times.
• Data Error detection (CRC-4): errors integrity check on the incoming data, according
to CRC-4 procedure (Cyclic Redundancy Check), as defined in G.706. In case of
errors, the alarm ERRU is indicated.
• A insertion: the A bit is
– passed transparently in standard applications
– set to '1' when a failure condition (FC2M) is detected on signal from user
(SY2Min); this option is enabled only in case of Leased Line applications
– set to '1' when forced from the controller; this option is enabled only in case of
Leased Line applications.
• E bit insertion (E): the outgoing E bit is set to 0 when
– a failure condition (FC2M) is detected on signal from user (SY2Min);
– errors (ERR2M) are detected on data from user (SY2Min);
– the E insertion may be inhibited from controller, in this case E=1.
– E=1 in other cases.
– set to '0' when Power Fail alarm (PWF) is active; this option is enabled only in
case of Leased Line applications.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
• Sa4 insertion: the bits Sa4 to Sa8 are passed transparently in standard applications,
– Sa4 is set to '0' when Power Fail alarm (PWF) is active, passed transparently
otherwise; this option is enabled only in case of Leased Line applications.
• CRC-4 bits insertion: the CRC-4 on data is performed and the result is inserted on bits
C1 to C4, according to G.706.
• Frame Word insertion (FW): the basic-frame and multi-frame alignment words are
inserted on the frame.
• AIS insertion: a continuous bitstream of all 'O ES' is inserted, in case of occurrence
of
– force command from the controller;
– a failure condition (FCU) on signal from SDH network (UP2Min);
– a failure condition (FC2M) on signal from user (SY2Min); this option is enabled
only in case of Leased Line applications.
ALARMS, STATUS AD COMMADS COVEYED FROM/TO COTROLLER
Every alarm, status and errors counting results are reported to the controller, for
monitoring purposes:
• LOS, REI, RAI, FC, ERR(CRC-4), SSF detected either in upstream and in
downstream signal directions; LOS = Loss of user Signal; SSF = upstream Server
Signal Fail.
The controller sends the following commands, in order to enable the relevant functions:
• LB-2, LB-RX, BF, MF, ForceA, InhibitE, etc; BF = Basic Frame; MF = Multi Frame.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-120 63x2 Mbit/s G.703/ISDN-PRA, Block Diagram
Input side
2Mb/s #1
2Mb/s 2 Mb/s
inputs POM
NT
PPI ISDN LPA LPT LTCT
#1 sink PRA
source
source source source .
.
Access Card
.. . STM4
..
Main and Spare

ckr1 ckrx
.
from
BPF
.. I/F
MATRIX
..
.
to
2Mb/s #63 ckr1 Clock
#63 Reference 6x
ckr63
ckr63 ckrx Selection
Output side
2Mb/s #1 2 Mb/s
2Mb/s POM
outputs
NT
PPI ISDN LPA LPT LTCT
PRA sink
Access Card
#1 source sink sink

sink
..
to
STM4
.. . BPF EPS
cktx .. ckt1 I/F
..
Main and Spare

MATRIX
2Mb/s #63
from
#63
cktx ckt63
ckt1 ckt63
Local Clocks
ck system a
ckrx TIMING
G.A. cktx
ck system b
Config. & Status

Power 2.5 V 51MHz
Sync
STEP OSC M B US
DOWN Driver
Management
DC/DC
CONGI A & B
48/60 V Bus
CONV.
3.3 V
from
Bus OFF CMISS

MATRIX
to/from
F + 3.3 Vdc
Remote
Inventory
RIBUS RIBUS
I/F
Unit ID
Failure
63x2 MBit/s Port Board
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-121 Functional Diagram of the NT ISDN-PRA Block
To SDH Network (upstream)
SSF
UP2Min
UP2Mout
LBRX
FC2M
AISu
FC U
AIS
FRAMES
SUBST
AUXPu
AUXP
FW
+
LOFu
BF MF
FA
+
CRC–4
REIU
MF
RAIU
A
Messages
Sa5, Sa6
+
BF
LB2
Sa6
LB
FCU
ERR U
CRC–4
(*)
FC2M
+
ERR U
A
CONVEYED FROM/TO CONTROLLER

FCU
FC 2M
+
(*)
ERR U
E
RAIU
+
A*
ALARMS & STATUS

ERR2M
REI U
FC 2M
ERR2M
CRC–4
+
E
PWF
FC U
(*)
RAI2M
A
2M
Sa4*
(*)
+
PWF
RAI2M ERR
REI 2M
E
FC 2M
CRC–4
LOF2M
REI 2M
BF MF
+
FA
AIS 2M
FC2M
FW
AIS
+
FC2M
AIS
FCU (*)
CONTROLLER
EQUICO62
To User (downstream)
LB 2
FROM/TO
SY2Mout
SY2Min
LOS2M
PWF
...................................................................................................................................................................................................................................
CONGI Board
...................................................................................................................................................................................................................................
CONGI Board
Refer to Figure 4-122, “CO GI - Block Diagram” (p. 4-283).
The 1662SMC equipment can house two CO GI boards, referred as CO GI A main (slot
1) and CO GI B (slot 20).
They are not intended as main and spare : each board provides a set of functions . Both
boards are necessary to provide the complete set.
CO GI A can be used as stand alone but in this case only a subset of interfaces can be
used .
Table 4-19, “CO GI A and CO GI B interfaces” (p. 4-280) reports the interfaces present
on each CO GI board.
Table 4-19 CONGI A and CONGI B interfaces

CONGI A (slot 1) CONGI B (slot 20)
POWER POWER
Housekeeping & Remote Alarms (a subset) Housekeeping & Remote Alarms ( a subset)
Rack lamps (R/M) ot used
QMD (Q2) - FA Alarm QMD (Q2) - Shelf ID
Q3 10 base 2 ot used
Q3 10 base T (LA ) ot used
I T LED I T LED
The main functions performed by the board are:

1. Input power stage
2. A D/OR and Remote Alarms
3. Housekeeping interface (only on CO GI in slot 1)
4. R/M interface
5. QMD interface (only on CO GI in slot 1)
6. RIMMEL interface
7. Q3/QB3 interface (only on CO GI in slot 1)
8. Temperature sensor
9. Remote inventory.
1 Input power stage
This circuit decouples the power station battery .
It contains the "Main Power block" with two fuses, EMI input filters, a "protection circuit
block" , a "step up converter" to provide -9 V and a DC/DC converter to provide the +3.3
V to the RIBUS I/F block. In case of fuse broken an alarm is generated (FUSE).
...................................................................................................................................................................................................................................
CONGI Board
...................................................................................................................................................................................................................................
A solder strap is present to provide the main power (48 V) in modality "two wires" (if
+Vbatt is connected to ground or "three wire" (if + Vbatt is not connected to ground) in
order to obtain a DC/I decoupling system.
2 A D/OR and Remote Alarms
The circuit generates the remote alarms and lights up the the Rack lamps in case of station
battery fault.
It is powered from the 3.3 VDC power from the service battery and uses it to control the
station battery. In case of loss of 3.3 VDC a PWA DOR alarm is generated.
The A D/OR circuit monitors the station battery and provides an alarm (BAT FAIL) in
case the voltage level decreases more than 20 % of the nominal value. If BAT FAIL alarm
of the CO GI in slot 1 or the same alarm of the CO GI in slot 20 are present, the
ORALIM alarm is generated and sent to the Shelf Controller.
3 Housekeeping interface
The CO GI board (3 wire) provides 4 inputs and 2 outputs contacts suitable for customer
purpose.
4 R/M interface
It is used to connect the rack lamps and incoming call signal.
Table 4-20 Rack lamps signals

ACRONYM FUNCTION
T*RATTD alarms storing
T*RURG urgent alarm
T*RURG not urgent alarm
T*CH incoming call
T*TOR absence of one battery
ote: On the Craft Terminal (CT) and on the Operation System (OS). application the
T*RURG, and T* R URG remote alarm sent toward the rack lamp are named in a
different way; the relation between this two terminology is explained in Table 7-16,
“Relation between Alarm severity terminology” (p. 7-36).
5 QMD interface
It is a RS-485 interface that allows the dialogue between the E (EC function) and a non
SDH equipment.
In this case the E acts as a mediation device.
CO GI in slot 1: FA alarm
CO GI in slot 2: Shelf ID
6 RIMMEL interface
...................................................................................................................................................................................................................................
CONGI Board
...................................................................................................................................................................................................................................
This block provide a serial communication interface with the FA s Shelf in order to
receive information like presence of FA s unit, FA alarms, FA s unit remote inventory
etc. (for details about connection with FA s Shelf refer to Installation Handbook).
"Rimmel block" is also connected with the Shelf Controller (housed on the MATRIX) and
Equipment Controller in order to:
• manage the HOUSEKEEPI G contact
• provisioning remote alarm
• read the 2/3 wire operating mode
• detect an over-temperature inside the equipment.
7 Q3/QB3 interface
The Q3/QB3 interface on CO GI is used for OS connection. Two connectors are
available :
• 2 B C for 10 Base 2 connection type
• RJ45 for 10 base T connection type.
The Coaxial Transceiver Interface (CTI) circuit performs the driver/receiver interface
between the Q3/QB3 coaxial cable ( B C) and the universal ethernet adapter (AUI).
The purpose of the AUI adapter is to adapt the signal, coming from the Equipment
Controller, to the LA interface. It is directly connected to the RJ45 connector or through
CTI to B C connector. The LA interface is only used on CO GI in slot 1.
8 Temperature sensor
The mentioned sensor provide an alarm when the temperature inside the equipment is
over 55 degree Celsius; the alarm is than sent to the RIMMEL block.
9 Remote inventory
It is the memory used to maintain the board history and communication and routing data
relevant to the E ; Remote Inventory activity is managed by the RIBUS I/F block.
...................................................................................................................................................................................................................................
CONGI Board
...................................................................................................................................................................................................................................
Figure 4-122 CONGI - Block Diagram
2/3 wire mode Input Power Stage
+ Batt_A Fuse MAIN Batt

POWER EMI
Station +Batt TO ALL
battery B att_A Fuse BLOCK FILTER BOARDS
STEP UP
9V CONVERTER
PROTECTION +3.3Vdc
DC/DC TO ALL
CICUIT 3.3 V
BLOCK BOARDS
to
RIBUS I/F
Fuse
To SYNTH16
48V BAT FAIL
To other CONGI
20% PWANDOR To SYNTH16
OR ALIM
RACK LAMPS OR To SYNTH16
R/M BAT FAIL From
other CONGI
AND/OR alarms from
URG, NURG, LOSQ2, INT, UP
SYNTH16
HOUSEKEEPING REMOTE ALARM

AND REMOTE 6/4 HOUSKEEPING_IN HK IN
ALARM
2 HOUSKEEPING_OUT HK OUT to/from
RIMMEL SYNTH16
FANS unit
FANS management
Serial Link
Temperature
sensor
NON SDH
EQUIPMENT QMD to/from
M
INTERFACE TRANSCEIVER U SYNTH16
(Q2) X not used
OPERATION 9V
SYSTEM COAX
TRANSCEIVER
10BASE2 INTERFACE
(CTI) UNIVERSAL to/from
ETHERNET M SYNTH16
10BASET INTERFACE U
ADAPTER X not used
Q3 (AUI)
INTERFACE
+3.3 Vdc
FAIL
Remote RIBUS to/from

RIBUS SYNTH16
Inventory I/F
CMISS
CONGI
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
SYNTH16 Board
Refer to Figure 4-123, “SY TH16 - Block Diagram” (p. 4-292).
This board uses SFP optical modules,the optical module can be distinguished by letters L
and S defining their dependance on optical components used for Long distance or Short
distance.
The SDH functions required to manage STM-16 signal are implemented by four
G.A.(G.A. #1 to G.A..#4 in Figure 4-123, “SY TH16 - Block Diagram” (p. 4-292))
mounted on the board. They interface the matrix module and a special ASIC mounted on
the SY TH16 board.
Another G.A. (G.A.5 in Figure 4-123, “SY TH16 - Block Diagram” (p. 4-292)) is
present with MUX/DEMUX and loop functions. This G.A. interface the line side with
one stream at 2488 Mbit/s and the equipment side with four stream at 622 Mbit/s.
Two types of loops are possible inside this G.A.:
• Line loop
• Internal loop.
Referring to the ITU-T G.783 recommendation, the four G.A. performs the following
functions :
• TTF (only the CRISTALLO #1 )
• HOA (all CRISTALLO from 1 to 4)
• LPOM /LSUT (all CRISTALLO from 1 to 4)
• HPOM /HSUT ( only the CRISTALLO#1).
Cross connection functions (MSP, HPC and LPC) are performed by the MATRIX H and
MATRIX L modules mounted on two SY TH16 boards (working in 1+1 configuration).
The TTF block is connected to the MATRIX H module and G.A.#7 mounted on the
SY TH16 board through four bidirectional links at 622 Mbit/s in 1+1 configuration (H
link).
HOA block is connected both to the MATRIX modules(HPC matrices and the LPC
matrices) and a special ASIC mounted on the SY TH16 board through two bidirectional
link at 622 MBit/s each in 1+1 configuration ("X link" and "L link" respectively)
G.A.#7 are used to establish three bidirectional links at 2.5 Gbit/s between two SY TH16
in the backpanel. This G.A. interface the matrix or G.A.#1 to #4 side with four stream at
622 Mbit/s and interface the backpanel side with one stream at 2488 Mbit/s.
The G.A.#1 send and receive four 622 Mbit/s signal (data + clock) to/from the G.A.#5.
The SPI can detect an external LOS from the input line .
The SFP optical module provides to the G.A.#1 its status by means of two input signals:
Laser Degrade and Laser Failure.
The ALS algorithm is hardware implemented and the G.A.#1 provides the Laser shut
Down command (LASER OFF).
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
TTF BLOCK (SPI, RST, MST, MSA)

This block performs the Transport Terminal Functions (sink on Input side, source on
Output side) for the STM-16 signal.
TTF block provides the T1 timing references at 2 MHz , derived from the STM-16 input
signals.
IPUT side : from line to MSP MATRIX H Module (in SYTH16)
SPI (OSn/RSn_A_Sk): it descrambles the incoming signal , counts the OOF and reveals
the LOF alarm.
RST (RSn_TT_Sk): performs frame alignment detection (A1, A2) , regenerator section
trace recovery (J0) and mismatch detection, BIP-8 Errored Block count.
MST (MSn_TT_Sk): performs BIP-24 errored block count, MS-REI recovery, MS-RDI
and MS-AIS detection. TSD is applied in case of MS-DEG (signal degrade), TSF is
applied if MS-AIS is detected.
MSA (MSn/Sn_A_Sk): performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification. Sixteen MSA blocks are present.
Moreover the following functions are performed on the Input side :
TP byte insertion (Rx side): since the cross connection functions are centralized , for
protection purpose TSD (Trail Signal Degrade) and TSF (Trail Signal Failure) are
transmitted towards the two SY TH16 boards.
K BYTES insertion and extraction (Rx side): this block provides the in-band transmission
of K1, K2, bytes towards the G.A.#8 mounted on SY TH16 board. The bytes are
extracted from the line when a TSF is received and they are transmitted towards G.A.#8
mounted on SY TH16 board.
OUTPUT side: from MATRIX H MODULE(in SY TH16) to line
MSA (Ms/Sn_A_So): it performs AUG assembly, AU-4 pointer generation, AU-AIS
generation. The sixteen AU4 structure are byte interleaved in the STM-16 structure with
fixed phase relationship vs. the same multiple signal.
MST (MSn_TT_So): it performs BIP-24 calculation and insertion, MS-REI MS-RDI and
MS-AIS insertion.
RST (RSn_TT_So): it performs frame alignment insertion, regenerator section path trace
insertion, BIP-8 calculation and insertion.
K BYTES insertion and extraction (Tx side): K1, K2 bytes are extracted from the frame
coming from backpanel and re-inserted on the same output line frame.
HOA BLOCK (HPT, HPA)
From HPC matrix (MATRIX H) to LPC matrix (MATRIX L)
HPT (Sn_TT_Sk): path trace information is recovered, REI information is recovered,
HP-RDI and U EQ are detected, VC4 BIP-8 errored count block. TSF is applied if SSF
or U EQ or TIM or AIS is detected.
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
TSD is applied if a condition of signal degrade is detected.

Moreover:
1 byte extraction (Rx side): for the network Tandem Connection Termination &
Monitoring function (TCT/TCM).
HPA (Sn/Sm_A_Sk): VC-4 disassembly, TU pointer interpretation, LOP and TU-AIS
detection,HP-SLM and LOM detection.
From LPC matrix(MATRIX L) to HPC matrix(MATRIX H)
HPA (Sn/Sm_A_So): VC4 assembly, TU pointer generation, TU-AIS generation , signal
label insertion.
HPT (Sn_TT_So): path trace identification insertion, RDI and REI indications insertion,
VC-4 BIP-8 calculation and insertion.
Moreover:
1 byte insertion (Tx side): for the network Tandem Connection Termination &
Monitoring function (TCT/TCM).
The Cristallo provides also the HSUT, HPOM (alternative) and LSUT, LPOM functions
(alternative) both in Rx and Tx side.
The main task of HSUT are:
RX side (from MSA to HPC matrix):
• Path trace information recovery
• REI recovery
• HP-RDI detection (path status monitoring
• U EQ and VC-AIS detection (signal label monitoring)
• VC4 BIP-8 Errored Block count.
Tx side: (from HPC matrix to MSA)
• Generation of an unequipped container
• "unequipped" insertion, trail trace identifier generation
• RDI and /or REI information generation
• VC-4 BIP-8 calculation and insertion.
The main task of HPOM are:
RX and TX side:
• Signal termination
• J1 path recovering
• REI information recovering
• HP-RDI detection (path status monitoring
• U EQ and VC-AIS detection (signal label monitoring)
• VC4 BIP-8 Errored Block count
• TSF is generated in case of SSF , U EQ, TIM , AIS . TSD is generated in case of SD.
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
The main tasks of LSUT are :

RX side (from HPA to LPC matrix):
• Recovering of VC-m unequipped signal label
• Path trace recovering
• BIP-2 recovery
• REI and RDI recovery.
Tx side (from LPC matrix to HPA ):
• Insertion of VC-m unequipped signal label
• Path trace insertion
• BIP-2 insertion
• REI and RDI insertion.
LSUT is used to monitor unequipped path trails.
The main tasks of LPOM are :
• Trace identifier monitoring
• RDI and REI recovering and deriving for performance primitives
• Signal label monitoring
• VC-m BIP-2 errored block count.
LPOM is used for performance monitoring purposes.
There is a module named CESCO mounted on the SY TH16 board. The CESCO
module is the hardware platform designed to support both the Equipment Controller (EC)
and Shelf Controller (SC) functions for the 1662SMC and equipment.
Equipment Controller (EC):
The Equipment Controller function is hosted by a virtual module called EQUICO62,
which is only available on the left SY TH16 board. The EC functionality is therefore
unprotected. If the left SY TH16 board is faulty, plugged out or unreachable,
communication within the 1662SMC shelf is lost. The traffic is not affected.
The EC manages:
• Local dialog with a personal computer (F interface)
• Dialog with a remote Operation System for etwork Management operation through
interface QAUX.
• Dialog with the external equipment for etwork Management operations through
Interface Q2
(Mediation Device Function)
• Remote alarms (RE) , alarms criteria towards the rack lamps (RA), housekeeping
alarms (HK) and front cover LED
• ISSB bus.
The EC performs as well all the SW functions related to the control and management
activities like info-model processing, event reporting and logging, equipment data base
management, SW downloading and management, etc.
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
To support its activities the EC function requires a boot memory (FEPROM) and RAM
memory. The EC and SC software is loaded from the FLC in the main shelf.
F interface:
It is used for connection to a local Craft Terminal; The standard implementation of the
physical layer for the F interface consists of an RS-232 UART port accessible from the
SY TH16 board front panel.
Q3 interface:
It is dedicated to an OS station connection through Local Access etwork (LA ); QB3
requires a 10BASE2 or a 10BaseT interface that is physical provided by CO GI board.
Q2 interface:
A mediation function interface is provided to connect the 1662SMC to non-SDH network
element The RS-485 interface and the cable connector are provided on the CO GI board.
RE, RA, HK and LEDs interface:
RE consists of parallel I/O signals used for remote alarms that can be accessed on the
CO GI board
RA is dedicated to send commands toward the rack to light up the relevant lamps.; the
physical interface is available on the CO GI board.
By pressing a push button is possible to store an alarm.
HK consist of parallel I/O signals used to handle housekeeping signals (for example
alarms received from FA s Subrack, open door etc.); In this way they can be supervised
by Craft Terminal. The physical interface is available on the CO GI board.
The Equipment Controller also drive the LEDs present on the front cover to display
alarms or status indication concerning the equipment.
By pressing a push button present on the SY TH16 front cover is possible to check the
efficiency of the LEDs.
ISSB bus:
It is an high performance bus supporting communication among the EC function, the SC
function on the SY TH16.
SHELF CONTROLLER FUNCTIONS
The SY TH16 houses the circuitry necessary to realize the Shelf Controller.
The SC provide the resources to support the SW functions related to the control and
management operation of the boards. To perform its functions, the SC directly interfaces
the ASICs on the board implementing the SDH functions for data collection (faults or
alarm event detections, performance monitoring data) and configuration provisioning.
As the SC is involved in critical activities ( for instance EPS) , it is 1+1 protected.
The internal interfaces supporting SC element for communication tasks are:
SPI interface
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
On the "CESCO " module the SC processor is master of the "SPI" interface that uses this
bus to access the inventory memory devices and the parallel I/O functions that are
available on board each controlled board in the equipment for control of board's alarm
led, board status or static alarms collection. The Saby chip on board "CESCO " is
accessible as a slave device by the SC processor through this interface.
Signals required for this interface are available on the mother board connectors with
LVTTL levels.
ISPB interface
The "ISPB" interface is supported by the SC processor and consists of a backplane
parallel bus through which the processor can access memory mapped devices (SDH
ASICs) placed on board the controlled boards (in the 1662SMC: SDH or PDH port
boards, SY TH16 boards).
The ISPB bus is effectively an out board extension of the SC processor bus, controlled
through a bridge device.
All the related signals are available on the mother board(SY TH16) connectors with
LVTTL electrical levels; the transceivers required for the LVTTL top GTLP signal
conversion must be placed on the mother board the "CESCO " module is plugged on.
MATRIX module also are mounted on the SY TH16 board,the module performs different
functions:
• connections between ports
• equipment synchronization functions
• performance monitoring collection.
As the MATRIX module is in 1+1 redundant configuration, all the functions realized by
the board are redundant as well.
CONNECTIONS
The connections between MATRIX and ports are realized by means of links at 622 Mbit/s
(link X, link L and link H in Figure 4-123, “SY TH16 - Block Diagram” (p. 4-292))
On the MATRIX are implemented the following SDH functions to realize the connections
:
MSP (Multiplex Section Protection)
It performs the Multiplex Section Protection (linear and MS-PRI G) according to the
MSP algorithm result.
Refer to para “Protection Subsystem” (p. 4-54) for details on MSP.
AU4 squelching
It is used to avoid mis-connections when the MS-SPRI G protection is active. For each
incoming and outgoing AU4 , should be possible to insert AIS.
SCP (Sub-etwork Connection Protection)
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
It performs the Sub- etwork Connection Protections, in case of S CP-ring network

configuration,switching from A to B path signals (A and B are two generic transmission
side).
S CP is of types HO-S CP (for VC-4 path signals) and LO-S CP (for VC-3 ,VC-12,
etc. path signals). It can be S CP/I and S CP/ .
Refer to para “Protection Subsystem” (p. 4-54) for details on S CP protection.
HPC (High order Path Connection)
This block acts as connection matrix, supporting cross-connection for a max of 96x96
STM1 equivalent signals at VC-4 level.
LPC (Low order Path Connection)
This block acts as connection matrix, supporting cross-connection for a max of 64x64
STM1 equivalent signals at VC-12 level.
EQUIPMENT SYNCHRONIZATION
The equipment synchronization is realized by the SETS function (Synchronous
Equipment Timing Source) that distributes to each equipment port the pertaining
synchronization signals.
A high stability oscillator at 10 MHz is present to guarantee an holdover or free running
working mode compliant to the ITU-T Recs.
The clock reference working modes can be: locked, hold over and free running.
When working in locked mode, the SETS block can select its reference signal among (the
selection is ac complished by means of the software and craft terminal):
• Timing reference signals coming from the SDH ports (T1)
• 2 MHz signal coming from the PDH ports (T2)
• 2 MHz clocks (T3) or 2 Mbit/s signals (T6) coming from the SERVICE board
The T3/T6 clocks are two (i.e. T3a, T3b or T6a, T6b).
The SETG block (Synchronous Equipment Timing Generation) generates :
• A system clock T0 (at 622.08 MHz) locked to the selected reference (T1, T2, T3/T6)
and distributed to the equipment.
• CK38Mhz: it is derived from the system clock (T0) and is distributed to all the ports.
Its frequency is 38.88 MHz.
• MFSY: it is the multiframe synchronism at 500 Hz, obtained from the ck38 MHz. It is
distributed to all the ports.
• a 2 MHz clock T4 or a 2 Mbit/s signal T5 used as synchronization clock.
The T4/T5 clocks are two (T4a, T4b and T5a, T5b).
Other functions implemented are:
RIBUS. It is a serial bus connecting the SC processor to the serially interfaced devices
called RIBUS-I/F, located on each board for simple read or write operations, for
communications about Remote Inventory, boards failure, bus releasing.
RIBUS I/F is powered by the +3.3 VDC supply by CO GI boards.
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
A push-button is present to reset the SC.

PERFORMANCE MONITORING COLLECTION
The "Performance Monitoring Management" block housed on the SY TH16 board
realizes Performance Monitoring functionalities; it collects and stores the data ( Defect
seconds and Errored blocks) coming from all the flows.
The Performance monitoring can be made at:
• Adaptation and Regeneration section
• Multiplex section
• Multiplex section adaptation
• HSUT and LSUT
• HPOM and LPOM
• HPT and LPT.
POWER SUPPLY
The board receives via backpanel connectors the -48 V coming from CO GI boards.
The DC/DC converter present on the board generates the following voltage:
• +3.3 V
• +2.5 V
• +1.8 V
• +1.7 V
• +1.5 V
• +1.2 V
• +0.6 V.
The Remote-Inventory and RIBUS-I/F blocks are powered by the 3.3 V power service
coming from the CO GI boards.
REMOTE INVENTORY
It is the memory used to maintain the board history and data.
For more details about the Remote Inventory function refer to para “Remote Inventory
...................................................................................................................................................................................................................................
SYNTH16 Board
...................................................................................................................................................................................................................................
Figure 4-123 SYNTH16 - Block Diagram
...................................................................................................................................................................................................................................
FAN Unit for FAN Shelf
...................................................................................................................................................................................................................................

The FA s shelf is composed by a mechanical structure and a back-plane. The FA Shelf
is used to prevent high temperature inside the 1662SMC equipment and must be equipped
with four FA units and two Metallic FA grids in the rack.
Each FA s unit is composed by four FA s and some electronic circuits necessary to:
• FA s and alarms management
• Metallic FA grid management
• Remote inventory
• Power supply.
FUNCTION SPECIFICATION:
One FA unit controller manages the power and FA 's alarm and controls the FA
on/off. At the same time this controller communicate with CO GI by serial interface.
FANS ALARM MANAGEMENT
The core of the FA unit for FA shelf is the "FA Controller" that perform the
following functionality:
• FA power supply: at the start up the control of FA s is distributed in sharing mode,
so the max current value is reduced at only one FA at a time.
• FA control: the sensing criteria is integrated in order to have an alarm if almost one
FA is out of order. If an alarm is present (FA AL1, FA AL2, FA AL3, FA
AL4) because a FA is temporary out of order, the FA controller try every 8 sec. to
restart the FA .
• Temperature sensor: an external sensor generate an alarm (TEMP AL) when the
temperature exceed 55° C.
• Remote inventory: through this interface the FA controller read the information
stored in the flash EPROM.
• LED control: the meaning of the LED is reported in Figure 3-87, “FA s Subrack
Cover - Front View” (p. 3-139).
• Serial Alarms Interface: the FA controller reports the alarm on a serial link toward
the CO GI board in order to transfer the information to the Shelf Controller on the
SY TH16.
The FA s controller generate an alarm called ALM_URG B #n if at least one FA is
faulty or the 12 VDC is not present.
METALLIC FAN GRID
Two metallic FA grids are present at the bottom of the FA shelf in order to prevent
dusty problem at cooled circuit. These FA grid could not be removed permanently
because it performs also the function of anti-fire protection.
If the FA grid have been removed from the shelf an electro-mechanical sensor generate
the alarm signal FILTER AL.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
REMOTE INVENTORY
It is a flash EPROM where are stored information about the unit like construction date,
code number, maker name, Board-type, etc.
POWER SUPPLY
The main power supply is coming from two connectors: power supply "A" and power
supply "B" coming from station battery.
The voltage value for both batteries is: 48 VDC, 3 A max; in case of failure an alarm is
generated (AL BAT_A, AL BAT_B)
A DC/DC converter on the unit provides the 12 V necessary to power the FA s. Another
DC/DC converter provides the 3.3 V power supply voltage from which through a serial
regulator is derived a 2.5 V.
If one of the above secondary voltage are not present, is generated an alarm (PSU ALM
#n).
ATTENTION:
When insert the FA unit into the FA shelf, extract the FA unit from the FA shelf or
do any operation on the FA unit, be sure to wear ESD protective wrist.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 4-124 FANs Shelf 19" General Block Diagram
BATTERY A PSU ALM #3
SLOT ID
PSU ALM
PSU ALM #2
BATTERY B >
_ 1
PSU ALM #1
FAN UNIT
Housekeeping
PSU ALM #0
BATTERY A FOR FAN SHELF 19
CONGI
to
BATTERY B
#0
ALM_URG_B #0
FILTER AL1
ALM_URG_B #1 ALM_URG
FILTER AL2 >
_ 1
ALM_URG_B #2
ALM_URG_B #3
Metallic FAN Grid 1
SLOT ID
PSU ALM #1
FAN UNIT
SENSOR
FILTER AL1
BATTERY A
FOR FAN SHELF 19 ALM_URG_B #1
#1
FILTER AL1
FILTER AL2
SLOT ID
FAN UNIT PSU ALM #2

ALM_URG_B #2
#2
FILTER AL1
Metallic FAN Grid 2
FILTER AL2
SLOT ID
SENSOR
FILTER AL2
FAN UNIT PSU ALM #3

BATTERY B ALM_URG_B #3
#3
FILTER AL1
FILTER AL2
FAN SHELF 19
...................................................................................................................................................................................................................................
Product description FAN Unit for FAN Shelf
...................................................................................................................................................................................................................................
Figure 4-125 FANs Unit for FAN Shelf 19" Block Diagram
AL_12V
ALBAT_A +12 V
DC/DC
BATTERY A Converter +12 V
+3.3 V P A
O L PSU ALM
DC/DC +3.3 V W A
BATTERY B Converter +2.5 V E R
+2.5 V R M
SERIAL
REGULATOR
ALBAT_B
FANS1 FANS2 FANS3 FANS4
FAN AL1 FAN AL2 FAN AL3 FAN AL4
+ 12 V + 12 V + 12 V + 12 V
TEMP_AL
TEMPERATURE
SENSOR
ALBAT_A
ALBAT_B
AL_12V
FAN AL2
FAN AL3
FAN AL4
FAN AL1
control 1
control 2
control 3
control 4
FAN
FAN
FAN
FAN
REMOTE
INVENTORY
SLOT ID
FANS CONTROL FAULTY FANS POWER

SENSOR ALARM
LED
FILTER AL1 FILTER

FANS CONTROLLER ALM_URG_A NOT USED
FILTER AL2 ALARM
AL_12V
ALM_URG_B
>
_ 1
AL_FAN
SERIAL SERIAL NOT USED
ALARM ALARM AL_FAN
INTERFACE INTERFACE
A B
NOT USED
FANS MANAGEMENT to
CONGI unit
FAN UNIT FOR FAN SHELF19
...................................................................................................................................................................................................................................
5 5 perations,
O
administration,
maintenance, and
provisioning (OAM&P)
Overview
Purpose
This chapter describes hardware and software interfaces used for administration,
maintenance, and provisioning activities, the system management function for the
administration of the 1678 Metro Core Connect (MCC) and the maintenance and
provisioning features available in the 1678 MCC.
Contents
Operations 5-2
Visible alarm indicators 5-3
Craft Terminal 5-8
TL1 Interface 5-10
...................................................................................................................................................................................................................................
Operations, administration, maintenance, and Operations
provisioning (OAM&P) Overview
...................................................................................................................................................................................................................................
Operations
Overview
Purpose
This section describes the hardware and software interfaces used for administration,
maintenance, and provisioning activities. These include
• Visible and audible indicators
• Graphical User Interface (GUI) on the Craft Terminal (CT)
• Operations interfaces
Graphical user interface

The GUI on the CT retrieves detailed information about local and remote network
elements. The GUI is also used to provision local and remote 1678 MCC circuit packs
and the switching matrix.
Contents
Visible alarm indicators 5-3

Craft Terminal 5-8
TL1 Interface 5-10
...................................................................................................................................................................................................................................
provisioning (OAM&P) Visible alarm indicators
...................................................................................................................................................................................................................................
Visible alarm indicators

This section describes the visible indicators of the 1678 MCC network element that are
located on the circuit pack faceplates.
Circuit pack indicators

The following figure illustrates the position of the bicolor LED on a circuit pack
faceplate.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Optical channels
Bicolor LED
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Circuit pack faceplate

All circuit pack faceplates are equipped with a bicolor or with a multicolor LED. The
bicolor LED can be illuminated red or green, the multicolor LED additionally can be
illuminated yellow.
LED Function
Red The LED is lit red, when the 1678 MCC network element has detected a failure in
or involving that circuit pack.
Green The LED is lit green, when the circuit pack is in service.
The LED flashes green during the boot process, for example after inserting a
circuit pack into the shelf.
Yellow The LED is lit yellow, when the circuit pack is stand by1.
Notes:
1. The following circuit packs have a multicolor LED on the faceplate: ES64SC, FLCSERV,
FLCCO GI, LAX20, LAX40, ALM, LX160, HCMATRIX, P63E1, P63E1 –M4, and the
FA .
10 Gigabit Ethernet port LEDs

In addition to the circuit pack indicators the 10GE transmission units bear an LED for
each external Ethernet port, providing the following information:
• one LED indicating the link integrity
• one LED indicating transceived data.
LEDs on the FLCSERV

In addition to the circuit pack indicators the First Level Controller and Service interfaces
board bears LEDs, providing the following information:
LED Function
ACT The LED is lit, when the circuit pack is the active unit
(Green)
OM EOW Line Status (not supported)
(Yellow)
BUSY/ EOW Line Status (not supported)
CALL
(Green)
URG (Red) Urgent Alarm (Critical or Major)1
URG ot Urgent alarm (Minor)1
(Red)
ATTD Alarm storing (Attended)1
(Yellow)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
LED Function
AB Abnormal condition1
(Yellow)
I D Indicative Alarm (Warning)1
(Yellow)
Notes:
1. This LED is never lit.
LEDs on the FLCCONGI

In addition to the circuit pack indicators the First Level Controller and Control & General
interfaces board bears LEDs, providing the following information:
LED Function
ACT The LED is lit, when the circuit pack is the active unit
(Green)
URG (Red) Urgent Alarm (Critical or Major)1
URG ot Urgent alarm (Minor)1
(Red)
ATTD Alarm storing (Attended)1
(Yellow)
AB Abnormal condition1
(Yellow)
I D Indicative Alarm (Warning)1
(Yellow)
Notes:
1. This LED is never lit.
LEDs on the alarm board

In addition to the circuit pack indicators the alarm board bears LEDs, providing the
following information:
LED Function
U (Red) Urgent Alarm (Critical or Major)
U (Red) ot Urgent alarm (Minor)
AT Alarm storing (Attended)
(Yellow)
AB Abnormal condition
(Yellow)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
LED Function
I (Yellow) Indicative Alarm (Warning)
LEDs on the FANs subrack cover

In addition to the circuit pack indicators the FA s subrack cover bears LEDs, providing
the following information:
LED Function
URG ot used or not present
(Red)
URG (Red) Urgent alarm
ATTD Alarm storing (Attended)
(Yellow)
ot used or not present
(Red)
Fans urgent alarm (URG–V)
(Red)
LEDs on the SYNTH16 board

In addition to the circuit pack indicators the SY TH16 board bears LEDs, providing the
following information:
LED Function
U (Red) Urgent Alarm (Critical or Major)
U (Red) ot Urgent alarm (Minor)
AT Alarm storing (Attended)
(Yellow)
AB Abnormal condition
(Yellow)
I (Yellow) Indicative Alarm (Warning)
On, when circuit pack is active
Off, when circuit pack is standby
(Green)
Further reading
For further information please refer to the 1678 MCC User Provisioning Guide.
...................................................................................................................................................................................................................................
provisioning (OAM&P) Craft Terminal
...................................................................................................................................................................................................................................
Craft Terminal
The Craft Terminal is a project in charge of the local management of single network
elements.
Multiple E management up to 32 etwork elements is possible, obtaining a remote
Craft Terminal application. This number is defined in order not to overload the network.
The Craft Terminal uses a state-of-the-art platform for providing an advanced and
integrated Management. It is ALMAP, the Alcatel Management Platform.
The Craft Terminal is based on EML core, a project that extends ALMAP in order to
provide a common set of functions for projects which realize an Alcatel-Lucent network
management system. This project is common with the 1353SH (Element Management
Level), permitting the same approach for the E management (commonality of views and
commands).
Examples of network management architecture are reported in Figure 5-1, “Example of
network management architecture via Craft Terminal” (p. 5-9).
The SDH/SO ET Equipment provides two types of physical interfaces for management
functions: the F interface and the QB3 interface. The management computer, that can be
connected to these interfaces, can be:
• a CRAFT TERMI AL (CT). It is generally a personal computer (PC), connected
through the F interface for local management.
• OPERATIO SYSTEM (OS). Workstations utilized for the TM (Telecommunica-
tions Management etwork). They are connected through the QB3 interface, for
network management.
The management can be realized in local or remote mode:
• in the local mode the managed equipment is directly connected to the computer via F
interface
• in the remote mode the managed equipment can be connected
– indirectly via the OSI etworking which can include both DCCM / DCCR
protocol or Ethernet LA (Local Area etwork)
– indirectly via an IP network using a tunnel over IP.
For more detailed information refer to the 1678 MCC User Provisioning Guide.
The Craft Terminal provides a password and user handling similar as done for
1660OMS . This includes the following features for user profile administration:
• Change administrator password
• Create new user
• Delete user
• Change user password.
Modification of the profile (user role) for an existing user is not supported. The
assignment of a profile to a user is only possible when creating this user. For more
detailed information refer to the 1678 MCC User Provisioning Guide.
...................................................................................................................................................................................................................................
provisioning (OAM&P) Craft Terminal
...................................................................................................................................................................................................................................
Figure 5-1 Example of network management architecture via Craft Terminal
LAN
OPERATIONS NE OPERATIONS
SYSTEM GATEWAY SYSTEM
LAN LAN LAN LAN

BRIDGES / DCN BRIDGES /
ROUTERS ROUTERS
QB3 QB3
N.E F CRAFT N.E F N.E F

GATEWAY TERMINAL GATEWAY GATEWAY
DCC/LAN DCC/LAN DCC/LAN

DCC/LAN
NE NE NE
F Craft NE
F
Terminal
DCC/LAN
DCC/LAN DCC/LAN
F F
N.E N.E
N.E
DCN : Data Communication Network

N.E. : Network Element (MSN, ADM, CROSS CONNECT; etc)
...................................................................................................................................................................................................................................
provisioning (OAM&P) TL1 Interface
...................................................................................................................................................................................................................................
TL1 Interface
For A SI market application the 1678 provides a TL1 E management interface. The
basic characteristics of the TL1 interface are compliant to applicable Bellcore standards.
The TL1 interface is implemented by a new software layer TL1.
The TL1 interface will be used by operator personnel for daily work from remote
locations and networkelement ( E) local maintenance. The TL1 interface will further be
used by etwork Management for AlarmSupervision and Path Provisioning.
The TL1 interface is a command line interface. The operator starts a Telnet session via
LA and can control the system using TL1 commands.
Figure 5-2 Example of network management architecture via TL1 interface

LAN
TL1
NE OPERATIONS
interface GATEWAY SYSTEM
LAN LAN LAN LAN

BRIDGES / DCN BRIDGES /
ROUTERS ROUTERS
QB3 QB3
N.E F CRAFT N.E F N.E F

GATEWAY TERMINAL GATEWAY GATEWAY
DCC/LAN DCC/LAN DCC/LAN

DCC/LAN
F F
NE NE NE NE
DCC/LAN
DCC/LAN DCC/LAN
F F
N.E N.E
N.E
DCN : Data Communication Network

N.E. : Network Element (MSN, ADM, CROSS CONNECT; etc)
...................................................................................................................................................................................................................................
6 Quality and reliability
6
Alcatel-Lucent’s commitment to quality and reliability

Alcatel-Lucent is extremely committed to providing our customers with products of the
highest level of quality and reliability in the industry. 1678 MCC is a prime example of
this commitment.
Quality policy
Alcatel-Lucent is committed to achieving sustained business excellence by integrating
quality principles and methods into all we do at every level of our company to
• Anticipate and meet customer needs and exceed their expectations, every time
• Relentlessly improve how we work – to deliver the world's best and most innovative
communications solutions – faster and more cost-effectively than our competitors
Reliability in the product life-cycle

Each stage of the life cycle of 1678 MCC relies on people and processes that contribute to
the highest product quality and reliability possible. The reliability of a product begins at
the earliest planning stage and continues into
• Product architecture
• Design and simulation
• Documentation
• Prototype testing during development
• Design change control
• Manufacturing and product testing (including 100% screening)
• Product quality assurance
• Product field performance
• Product field return management
The R&D community of Alcatel-Lucent is certified by ISO 9001.
...................................................................................................................................................................................................................................
Quality and reliability Ensuring quality
...................................................................................................................................................................................................................................
Ensuring quality
This section describes the critical elements that ensure product quality and reliability
within
• Product development
• Manufacturing
Critical elements of product development

The product development group’s strict adherence to the following critical elements
ensures the product’s reliability
• Design standards
• Design and test practices
• Comprehensive qualification programs
• System-level reliability integration
• Reliability audits and predictions
• Development of quality assurance standards for manufactured products
Critical elements of manufacturing

ote: Independent Quality Representatives are also present at manufacturing locations to
ensure shipped product quality.
The manufacturing and field deployment groups’ strict adherence to the following critical
elements ensures the product’s reliability
• Pre-manufacturing
• Qualification
• Accelerated product testing
• Product screening
• Production quality tracking
• Failure mode analysis
• Feedback and corrective actions
...................................................................................................................................................................................................................................
Quality and reliability Conformity statements
...................................................................................................................................................................................................................................
Conformity statements
Electromagnetic Compatibility (EMC)
The CE markings printed on the product denote compliancy with the following directives:
• 89/336/EEC of May 3rd, 1989 (EMC directives), amended:
– by the 92/31/EEC Directive issued on April 28th, 1992
– by the 93/68/EEC Directive issued on July 22nd, 1993
Compliancy to above Directives is declared, when the equipment is installed as for the
manufacturer handbooks, according to the following European orm:
• E 300 386 (V1.3.1) environment "Telecommunication center"
Warning: This is a class A product of E 55022. In domestic, residential and light
industry environments, this product may cause radio interference in which case the user
may be required to take adequate measures.
Safety
Compliancy to Safety orms is declared in that the equipment satisfies standardized
norms:
• IEC 60950-1 ed. 2001 for electrical safety

• E 60950-1 ed. 2001 for electrical safety
• E 60825-1 ed. 1994 + A11 ed. 1996 + A2 ed. 2001 for optical safety
• IEC 60825-1 ed. 1993 + A2 ed. 2001 (1999) for optical safety
• E 60825-2 ed. 2000 for optical safety
• IEC 60825-2 ed. 2000 for optical safety
Safety norms and labels

Reger to the 1678 MCC Safety Guide to obtain the following information:
• General Safety Rules
• Labels
• Several Dangerous Conditions
...................................................................................................................................................................................................................................
Quality and reliability Electromagnetic Compatibility
...................................................................................................................................................................................................................................
Electromagnetic Compatibility
The equipment's EMC norms depend on the type of installation being carried out (cable
termination, grounding, etc.) and on the operating conditions (equipment, setting options
of the electrical/electronic units, presence of dummy covers, etc.).
• Before starting any installation, turn-up & commissioning, operation & maintenance
work refer to the relevant Handbooks and chapters.
• The norms set down to guarantee EMC compatibility, are distinguished inside this
handbook by the symbol and term:
ATTE TIO : EMC ORMS
General Norms - Installation

• All connections (towards the external source of the equipment) made with shielded
cables use only cables and connectors suggested in this technical handbook or in the
relevant Plant Documentation, or those specified in the Customer's "Installation
orms" (or similar documents).
• Shielded cables must be suitably terminated.
• Install filters outside the equipment as required.
• Ground connect the equipment utilizing a conductor with proper diameter and
impedance.
• Mount shields (if utilized), previously positioned during the installation phase, but not
before having cleaned and decreased it.
• Before inserting the shielded unit proceed to clean and decrease all peripheral surfaces
(contact springs and connection points, etc.).
• Screw fasten the units to the subrack.
• To correctly install EMC compatible equipment follow the instructions given.
General Norms - Turn-up & Commissioning, Operation

• Preset the electrical units as required to guarantee EMC compatibility.
• Check that the equipment is operating with all the shields properly positioned
(dummy covers, ESD connector protections, etc.).
• To properly use EMC compatible equipment observe the information given.
...................................................................................................................................................................................................................................
Quality and reliability Electromagnetic Compatibility
...................................................................................................................................................................................................................................
General Norms - Maintenance

• Before inserting the shielded unit, which will replace the faulty or modified unit,
proceed to clean and decrease all peripheral surfaces (contact springs and connection
points, etc.).
• Clean the dummy covers of the spare units as well.
• Screw fasten the units to the subrack.
...................................................................................................................................................................................................................................
Quality and reliability Electrostatic Dischargers (ESD)
...................................................................................................................................................................................................................................
Electrostatic Dischargers (ESD)

Before removing the ESD protections from the monitors, connectors etc., observe the
precautionary measures stated. Make sure that the ESD protections have been replaced
and after having terminated the maintenance and monitoring operations.
Most electronic devices are sensitive to electrostatic dischargers, to this concern the
following warning labels have been affixed:
Observe the precautionary measures stated when having to touch the electronic parts
during the installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
ELASTICIZED BAND
COILED CORD
• an elasticized band worn around the wrist;

• a coiled cord connected to the elasticized band and to the stud on the subrack.
...................................................................................................................................................................................................................................
Quality and reliability Labels affixed to the Equipment
...................................................................................................................................................................................................................................
Labels affixed to the Equipment

This chapter indicates the positions and the information contained on the identification
and serial labels affixed to the equipment.
Figure 6-1, “Subrack label (1)” (p. 6-8) through Figure 6-7, “Back panels internal label”
(p. 6-13) illustrate the most common positions of the labels on the units, modules and
subracks.
Figure 6-8, “Label specifying item not on catalogue (P/ and serial number)” (p. 6-14)
through Figure 6-11, “Label identifying the equipment (example)” (p. 6-15) illustrate the
information (e.g., identification and serial o.) printed on the labels.
The table below relates the reference numbers stated on the figures to the labels used.
ote: Labelling depicted hereafter is for indicative purposes and could be changed
without any notice.
Table 6-1 Label references

Ref. No. Name of Label
1 label specifying item not on catalogue (P/ and serial number)
Refer to Figure 6-8, “Label specifying item not on catalogue (P/ and serial
number)” (p. 6-14).
2 label specifying item on catalogue (P/ and serial number)
Refer to Figure 6-9, “Label specifying item on catalogue (P/ and serial
number)” (p. 6-14).
3 item identification label - item on catalog
Refer to Figure 6-10, “Item identification labels - item on catalog” (p. 6-14).
4 label identifying the equipment
Refer to Figure 6-11, “Label identifying the equipment (example)” (p. 6-15).
5 label identifying compliancy with CE and WEEE Directives.
Refer to Figure 6-12, “CE Label” (p. 6-15) and Figure 6-13, “WEEE Label”
(p. 6-15).
On contract basis, customized labels can be affixed to the equipment.

Standard labels can be affixed to any position on the equipment, as required by the
Customer.
However, for each of the above are applied the rules defined by each individual
Customer.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 6-1 Subrack label (1)
ABCD
ote: the above reference numbers are detailed on Table 6-1, “Label references”
(p. 6-7).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
ABC
(p. 6-7).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
NB.1
ABC
ote: the label is present on the support side.

(p. 6-7).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 6-4 Labels on units with standard cover plate
ABC 2
3
xxxxxxxxx
xxxxxx
xxxxxx
(p. 6-7).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 6-5 Modules label
ABC
(p. 6-7).
Figure 6-6 Internal label for Printed Board Assembly
NB.1
ABC
ote: the label is present on the PCB component side.

...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
(p. 6-7).
Figure 6-7 Back panels internal label
NB.1
ABC
ote: the label is present on PCB components side or rear side on the empty spaces.
(p. 6-7).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 6-8 Label specifying item not on catalogue (P/N and serial number)
Figure 6-9 Label specifying item on catalogue (P/N and serial number)
Figure 6-10 Item identification labels - item on catalog
FREQUENCY ACRONYM
(Optional)
ANV ITEM PART NUMBER
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 6-11 Label identifying the equipment (example)
EQUIPMENT NAME
Figure 6-12 CE Label
Figure 6-13 WEEE Label
ote: CE and WEEE symbols can be in the same label or in different position of the
equipment.
...................................................................................................................................................................................................................................
7
Overview
Purpose
This chapter provides the technical specifications for 1678 Metro Core Connect (MCC).
These data are necessary for planning the application of a 1678 MCC network element in
an existing or new network.
Data indicated in the handbook must be considered as standard values.
Data indicated in the contract must be considered as guaranteed values.
Contents
General Characteristics 7-3

Standards and interfaces 7-3
Electrical Interface Characteristics 7-8
Electrical Transmission Interfaces 7-8
Electrical Safety 7-10
Optical Interface Characteristics 7-11
STM- Optical Characteristics 7-11
Optical Safety 7-29
Power Supply Characteristics 7-34
Electrical specifications 7-34
Alarm Characteristics 7-35
Units Alarms 7-35
Equipment Alarms and Trouble-shooting 7-36
Auto Port Monitoring 7-37
Mechanical Characteristics 7-38
1678 MCC Rack 7-38
OED Rack 7-39
...................................................................................................................................................................................................................................
Technical specifications Overview
...................................................................................................................................................................................................................................
1678 MCC Main Shelf 7-40

1678 MCC Main Shelf (SO ET) 7-41
1670SM Shelf 7-42
1662SMC Shelf 7-43
Environmental Conditions 7-44
General aspects 7-44
Waste from Electrical and Electronic Equipment (WEEE) 7-45
Acoustical noise 7-46
Climatic for Operating Conditions 7-47
Storage 7-50
Transportation 7-53
EMI/EMC Condition 7-55
Dismantling & recycling 7-56
WEEE general Information 7-56
How to disassemble equipment 7-57
Tools necessary for disassembly 7-58
Procedure 7-1: Shelf Disassembly 7-59
Procedure 7-2: Unit Disassembly 7-66
Hazardous Materials and Components 7-77
ECO Declaration 7-79
...................................................................................................................................................................................................................................
Technical specifications General Characteristics
Standards and interfaces
...................................................................................................................................................................................................................................
General Characteristics

General
Optical Line bit rate SDH: 155.520 Mbit/s (STM-1)

622.080 Mbit/s (STM-4)
2,488.320 Mbit/s (STM-16)
9,953.280 Mbit/s (STM-64)
SOET: 155.520 Mbit/s (OC-3)
622.080 Mbit/s (OC12)
Type of optical fiber Single mode, according to ITU-T G.652, G.653 and
G.654.
Wavelength Refer to Table 7-1, “Parameters specified for STM-1
optical interface” (p. 7-12) up to Table 7-10, “Parameters
specified for 1000B-LX Optical Interface” (p. 7-24).
Span length Depending on fibre type and optical power budget
reported in Table 7-1, “Parameters specified for STM-1
optical interface” (p. 7-12) up to Table 7-10, “Parameters
specified for 1000B-LX Optical Interface” (p. 7-24).
Application types Metro Core Connect in protected and unprotected linear
links and rings, DXC (up to 4096 STM-1 equivalent
ports).
Interface types Optical interface: STM-1, STM-4, STM-16, STM-64
and GE.
Applied telecommunication standards

ITU-T G.703 for electrical interfaces
ITU-T G.707 for SDH frame and multiplexing structure
ITU-T G.957, G.958 and G.691 for optical interfaces
ITU-T G.821 and G.826 for transmission quality
ITU-T G.813 for synchronization
ITU-T G.783 for SDH equipment specification
ITU-T G.841 for network protection architectures
ITU-T G.704 and G.774 for system management functions
ITU-T G.662 and G.663 for optical amplification
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
ITU-T G784/G.774 for system management functions

ITU-T G.8080F for architecture of GASO
ITU-T G.828/829 for error performances
ITU-T G.798 for OT
ITU–T G.694.1 for DWDM optical interfaces
ITU–T G.694.2 for CWDM optical interfaces
Applied standards for GMRE
IETF Standards
Signaling: RSVP–TE as defined in RFC2205, RFC2209, RFC2961, RFC3209, RFC3471,
RFC3473, RFC3474, RFC3476, RFC3477, RFC3945,
RFC4874, RFC4875, RFC4920, draft–ietf–mpls–soft–
preemption–08.txt, draft–ietf–ccamp–rsvp–restart–
ext–09
Routing: OSPF–TE as defined in RFC2328, RFC2370, RFC3623, RFC3630, RFC4202,
RFC4203, RFC4258, RFC4652
Link Management: LMP as defined in RFC4204 and RFC4207
OIF Standards
U I 1.0 Signaling Specification, OIF–U I–01.0–R2–Common, OIF–U I–01.0–R2–
Release 2 RSVP
E– I–01.0 OIF–E– I–Sig–01.0 – Intra–Carrier E– I Signaling
Specification
OIF–E I–OSPF–01.0 – External etwork– etwork
Interface (E– I) OSPF–based Routing – 1.0
Add-Drop and Cross connect features
Cross-Connections capacity 4096 x 4096 STM-1 equivalent ports at VC-4 level (640
Gb/s)
Connectivity Aggregate-to-tributary time slot assignment.
Aggregate-to-aggregate time slot interchange.
Tributary-to-tributary time slot assignment.
Drop&continue.
Loopbacks.
Broadcast.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Cross connect features 1678 MCC has a symmetrical architecture. All traffic
port (PDH, SDH) of the same type have the same
functionality and behavior and there is no inherent split
between tributaries and aggregates. This means that it is
possible the allocation of the PDH and VCi signals into
every port.
Transmission delay
For each type of cross-connection 125 µs maximum for any traffic pathway
Protections
etwork protection Linear 1+1, single and dual ended MSP.

S C-P/I, S C-P/ .
Collapsed single and dual node interconnection.
Centralized Restoration.
MS-SPRing: 2F @STM-16 and 2F @STM-64.
Equipment protection (EPS) Centralized Matrix: 1+1.
Equipment Controller: 1+1.
Shelf Controller: 1+1.
Management interface
Local: Craft Interface RS232 PC compatible SUB-D 9 pins at 38 Kbit/s 1

(PC)
Remote: Craft Interface RS232 PC compatible SUB-D 9 pins at 38 Kbit/s;
(PC) it handles up to 32 Es via DCC (D1 ÷ D3 and/or D4 ÷
D12) 1
Remote: Transmission G.773 QB3 10 base-2 and 10 base-T connectors
Management
etwork (TM )
interface
Information According to ITU-T (G.774) and ETSI specifications
Model
Dual addressing It allows OS redundancy
to OS
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Notes:
1. The maximum allowable length of the serial cable for RS232 is 15 m. This is valid if the
data speed is max. 38 Kbit/s and if cables of category CAT-5 are used (CAT-5 is what
Alcatel-Lucent is using and requesting for this interface).
Operation processes
Configuration and provisioning Equipment, ports, add-drop, cross-connect,synchronization,

protection, MCF, SEMF, OH connection.
Software download It is made locally as well as remotely on non volatile
memories without traffic interruption.
Performance monitoring According to G.784, G.826 and G.821.
Remote inventory At board and sub-board level.
on volatile database Yes.
Unit and Equipment Through Remote Inventory
acknowledgement (Company id, Unit Type, Unit Part umber, Serial Part
umber, Software Part umber etc.).
For details refer to the 1678 MCC User Provisioning
Guide.
Security Password, categories (operator profile), back-up for
programs and data.
OW interface
Type 64 kbit/s G.703 co-directional or telephone front jack

Engineering OW E1 and E2 access, DTMF in band signalling
Unit substitution characteristics (hot replacement)
For traffic boards without interfering on other channels

For central units (redundant) without interfering on traffic
Housekeeping
8 inputs + 4 outputs (max)

System alarms One LED on each board, Central LEDs
(URG, URG, AB , I D, ATTD)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Output Housekeeping signals (CPO) and Remote Alarms
By electronic relay contacts to be

connected to external negative
voltage:
Max. guaranteed current with closed 50 mA
condition
Voltage drops vs ground with closed -2 V ÷ 0 V
condition
Max. allowed voltage with open -72 V
condition
Input Housekeeping signals (CPI)
Max. guaranteed current with closed 3 mA

condition
Voltage drops vs ground with closed -2 V ÷ 0 V
condition
Max. allowed voltage with open -72 V
condition
Clock characteristics (synchronization)
Selectable input clock 2048 kHz external from 2 Mbit/s port (T2).
2048 kHz external synch clock (T3).
2.048 Mbit/s or 1.544 Mbit/s signal from FLCSERV /
FLCCO GI board without data (T6)
STM- sync clock interface (T1).
o. of selected clock (normal mode) 6 max.
Synchronization output 2048 kHz G.703 (2 output, T4a and T4b) or 2.048 Mbit/s
(2 output, T5a and T5b).
Operational modes Locked to reference.
Free-run mode ± 4.6 ppm (PLL without reference).
Holdover mode drift 0.37 ppm max./day (PLL with
stored frequency for more than half an hour,with no
selected input frequency).
Synchronization selection Priority and SSM algorithm.
Equipment timing source options Free-run accuracy ±4.6 ppm.
Holdover drift 0.37 ppm per day maximum.
...................................................................................................................................................................................................................................
Technical specifications Electrical Interface Characteristics
Electrical Transmission Interfaces
...................................................................................................................................................................................................................................
Electrical Interface Characteristics

2 Mbit/s
2 Mbit/s 75 Ω 2 Mbit/s 120 Ω

Bitrate 2 048 kBit/s ± 50 ppm
Code HDB3
Electrical interface according to ITU-T G.703
Output voltage (peak to peak) 2.37 V ± 0.237 V 3 V ± 0.3 V
Return loss ≥ 12 dB 51 - 102 kHz
≥ 18 dB 102 - 2048 kHz
≥ 14 dB 2048 - 3072 kHz
Type of line coaxial pair, 75 Ω symmetrical 120 Ω
Supported signal structure Framed and unframed
140 Mbit/s

Code CMI
Output voltage (peak to peak) 1 V ± 0.1 V
Return loss ≥ 15 dB over frequency range 7 to 210 MHz
Type of line coaxial pair, 75 Ω
Supported signal structure Framed and unframed
STM-1e

Code CMI
Output voltage (peak to peak) 1 V ± 0.1 V
Return loss ≥15 dB over frequency range 8 to 240 MHz
Type of line coaxial pair, 75 Ω
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
V.11 64Kbit/s contradirectional interface
Type electrical, according to ITU-T Rec. V.11

Receivers:
Input impedance > 6 KΩ
Rx levels "1" or "OFF" < -0.3 V
"1" or "O " > +0.3 V
Drivers:
Differential output 2 V (min.)
Use intrabuilding connections
RS-232 oversampled interface 9600 Kbit/s
Bit rate 9600 kbit/s

Mode RS-232 Tx & Rx data only
Electrical levels 24 Vpp
Use intrabuilding connections
...................................................................................................................................................................................................................................
Electrical Safety
...................................................................................................................................................................................................................................
Electrical Safety
Safety status
Safety status of the connections with other T V2 (Telecommunication etwork Voltage)

equipments for Remote Alarms, Housekeeping Alarms
(CPO, CPI), Rack Lamp (RM).
SELV (Safety Extra Low Voltage) for all the
other.
...................................................................................................................................................................................................................................
Technical specifications Optical Interface Characteristics
STM-N Optical Characteristics
...................................................................................................................................................................................................................................
Optical Interface Characteristics

STM-1 optical characteristics
Types of optical interfaces S-1.1, L-1.1, L-1.2 (alternative modules).

Characteristics are given in Table 7-1,
“Parameters specified for STM-1 optical
interface” (p. 7-12).
Optical connectors SFP plug-in
Pulse shape refer to ITU-T G.957
Types of optical interfaces S-4.1, L-4.1, L-4.2 (alternative modules).

interface” (p. 7-13).
Types of optical interfaces I-16.1, S-16.1, L-16.1, L-16.2 (alternative

modules).
interfaces” (p. 7-14).
Types of colored interfaces CWA, CWP, DWA
“Parameters specified for STM-16 colored
optical interfaces” (p. 7-15).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Types of optical interfaces I-64.1, S-64.2, L-64.2, V-64.2, U-64.2

interfaces” (p. 7-17).
Types of colored interfaces DWDM APD
“Parameters specified for STM-64 colored
optical interfaces” (p. 7-22).
Optical connectors FC/PC or SC/PC (alternative units)
1 GE optical characteristics
Types of optical interfaces 1000B–LX, 1000B–SX, 1000B–ZX

“Parameters specified for 1000B-SX Optical
Interface” (p. 7-23), Table 7-10, “Parameters
specified for 1000B-LX Optical Interface”
(p. 7-24), and Table 7-11, “Parameters
specified for 1000B–ZX Optical Interface”
(p. 7-25).
Optical connectors LC-Duplex SFP (Small Formfactor Pluggable)
10 GE optical characteristics
Types of optical interfaces 10GBASE-S, 10GBASE-L, 10GBASE-E,

10GBASE-Z
“Parameters specified for 10GE-SR” (p. 7-26)
and Table 7-13, “Parameters specified for
10GE-LR,-ER,-ZR” (p. 7-27).
Optical connectors FC/PC or SC/PC (alternative units)
Table 7-1 Parameters specified for STM-1 optical interface

CHARACTERISTICS UNIT VALUES
DIGITAL SIG AL STM-1 according to G.707, G.958
ominal bit rate Kbit/s 155,520
Application code S-1.1 L-1.1 L-1.2
Operating wavelength range nm 1261 ÷ 1360 1280 ÷ 1335 1480 ÷ 1580
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-1 Parameters specified for STM-1 optical interface (continued)

TRA SMITTER at reference point S
Source type MLM MLM SLM
Spectral characteristics:
- maximum RMS width nm 7.7 4 -
- maximum -20 dB width nm - - 1
- min. side mode suppression ratio dB - - 30
Mean launch power:
- maximum dBm -8 0 0
- minimum dBm -15 -5 -5
Minimum extinction ratio dB 8.2 10 10
OPTICAL PATH between S and R
Attenuation range dB 0÷12 10÷28 10÷28
Maximum dispersion ps/nm 100 250 1900
Minimum optical return loss (ORL) at
S (including connectors) dB n.a. n.a. 20
Maximum discrete reflectance
between S and R dB n.a. n.a. -25
RECEIVER at reference point R
Type of detector In Ga As PI
-10
Main received power (@ BER=10 ):
- minimum (sensitivity) dBm -28 -34 -34
- maximum (overload) dBm -8 -10 -10
Maximum optical path penalty dB 1 1 1
Maximum reflectance of receiver
measured at R dB -14 -14 -25
Notes:
1. n.a. = not applicable
Table 7-2 Parameters specified for STM-4 optical interface

ominal bit rate Kbit/s 622,080
Application code S-4.1 L-4.11 L-4.2
Operating wavelength range nm 1274 ÷ 1356 1280 ÷ 1335 1480 ÷ 1580
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-2 Parameters specified for STM-4 optical interface (continued)

Source type MLM SLM SLM
- maximum RMS width nm 2.5 - -
- maximum -20 dB width nm - 1 1
- min. side mode suppression ratio dB - 30 30
Mean launch power:
- maximum dBm -8 +2 +2
- minimum dBm -15 -3 -3
Minimum extinction ratio dB 8.2 10 10
Maximum dispersion ps/nm 84 250 1900
Minimum optical return loss (ORL) at
S (including connectors) dB 14 20 24
between S and R dB -20 -25 -27
Type of detector In Ga As PI
-10
Main received power (@ BER=10 ):
Notes:
1. Suitable for interworking with the L-4.1 of the ADM product family; in this application the
power budget is 10÷24 dB, 250 ps/nm dispersion.
Table 7-3 Parameters specified for STM-16 optical interfaces

ominal bit rate Kbit/s 2,488,320
Application code I-16.1 S-16.1 L-16.1 L-16.2
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-3 Parameters specified for STM-16 optical interfaces (continued)

1270 ÷ 1270 ÷ 1280 ÷ 1500 ÷
Operating wavelength range nm 1360 1360 1335 1580
Source type MLM SLM SLM SLM
- maximum RMS width
- maximum -20 dB width nm 4 - - -
- minimum side mode suppression nm - 1 1 1

ratio dB - 30 30 30
Mean launch power:
- maximum dBm -3 0 +2 +2
- minimum dBm -10 -5 -2 -2
Minimum extinction ratio dB 8.2 8.2 8.2 8.2
Attenuation range dB 0÷7 0÷12 10÷24 10÷24
Maximum dispersion ps/nm 12 100 250 1600
Minimum ORL at S (including
connectors) dB 24 24 24 24
between S and R dB -27 -27 -27 -27
Type of detector In Ga As PI In Ga As APD
Mean received power (@ BER=10-10):
- minimum (sensitivity) dBm -18 -18 -27 -28
- maximum (overload) dBm -3 0 -8 -8
Maximum optical path penalty dB 1 1 1 2
measured at R dB -27 -27 -27 -27
Table 7-4 Parameters specified for STM-16 colored optical interfaces

Application code CWA CWP DWA
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

(continued)
APD CWDM PI CWDM
interface for interface for
long haul short haul
Interface type (C8L1–1D2) (C8S1–1D2) APD DWDM
1527,98 nm
(196.200 THz)
–> 1563,96 nm
(191.700 THz),
1471, 1491, 1511, 1531, 1551, 1571, 100 GHz grid,
1591, 1611 compliant with ITU–T compliant with
Addressed wavelengths nm G.694.2 ITU–T G.694.1
Minimum launched power dBm 0 0 0
Maximum launched power dBm +5.0 +5.0 4.0
Maximum wavelength
deviation at end of life pm t.b.d. t.b.d. +/– 100
Allowed bit rates Mbps 2 –> 2700 2 –> 2700 100 –> 2700
Minimum extinction ratio dB 8.2 8.2 8.2
Maximum –20dB
bandwidth nm 1 1 n.a.
Maximum –15dB
bandwidth nm n.a. n.a. 0.12
Minimum SMSR dB 30 30 30
1600 @ 1611nm 1000 @ 1611nm
1600 @ 1591nm 900 @ 1591nm
1500 @ 1571nm 900 @ 1571nm
1400 @ 1511nm 900 @ 1511nm
1400 @ 1531nm 800 @ 1531nm
1300 @ 1511nm 800 @ 1511nm
Maximum chromatic 1200 @ 1491nm 700 @ 1491nm

dispersion ps/nm 1100 @ 1471nm 700 @ 1471nm 1800 / 24001
Min. sensitivity, @
BER=10–10 dBm –28 –18 –28
Minimum overload dBm –9 0 –8
Maximum optical path 2 / 3 depending
penalty dB 2 1 on dispersion1
Maximum receiver
reflectance dB –27 –27 –27
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

(continued)
Optical connector (Tx/Rx) LC LC LC
Fiber type SMF SMF SMF
Notes:
1. 2 dB path penalty corresponds to a dispersion of 1800 ps/nm/km, 3 dB to 2400 ps/nm/km.

DIGITAL SIG AL STM-64 according to G.707, G.958, G.691
Application code I-64.1 S-64.2b L-64.2b
Operating wavelength range nm 1290÷1330 1530÷1565 1530÷1565
Source type SLM EA-ILM EA-ILM
- maximum spectral power density mW/MHz t.b.d.1 t.b.d. t.b.d.
- maximum -20 dB width nm 1 t.b.d. t.b.d.
- minimum side mode suppression
ratio dB 30 30 t.b.d.
- chirp parameter radians t.b.d. t.b.d. t.b.d.
Mean launch power:
- maximum dBm -1 +2 12
- minimum dBm -6 -1 10
Minimum extinction ratio dB 6 8.2 8.2
Chromatic dispersion:
- maximum ps/nm 6.6 800 1600
- minimum ps/nm n.a.2 n.a. t.b.d.
Maximum DGD ps/nm 30 30 30
connectors) dB 14 24 24
Maxim. discrete reflectance between
S and R dB -27 -27 -27
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

Type of detector PI PI PI
Mean received power: (@ BER=
10-12 and OS R=19 dB/0.1 nm)
Maxim. reflectance of receiver
Notes:
1. t.b.d.= to be defined
2. n.a. = not applicable
3. = with 10dB attenuation
Table 7-6 Parameters specified for STM-64 optical interface - P1L1-2D2

long-haul application
DIGITAL SIG AL STM-64 according to G.958
Signal class RZ 10G long-haul
Application code P1L1-2D2
Operating wavelength range nm 1530÷1565
Source type SLM
- maximum spectral power density mW/MHz t.b.d.
- maximum -20 dB width nm t.b.d.
- minimum side mode suppression ratio dB 30
- chirp parameter radians t.b.d.
Mean launch power:
- maximum dBm +4
- minimum dBm 0
Minimum extinction ratio dB 9
Attenuation range dB 11÷22
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-6 Parameters specified for STM-64 optical interface - P1L1-2D2

long-haul application (continued)
- maximum ps/nm 1600
- minimum ps/nm t.b.d.
Maximum DGD ps/nm 30
Minimum ORL at S (including connectors) dB 24
Maxim. discrete reflectance between S and R dB -27
Type of detector PI
Mean received power: (@ BER= 10-12 and
OS R=19 dB/0.1 nm)
- minimum (sensitivity) dBm -24
- maximum (overload) dBm -7
Maximum optical path penalty dB 2
Maxim. reflectance of receiver measured at R dB -27
Notes:
L-64.2 Application (Long Haul)

This is a single port board supporting the long haul application L-64.2. The optical
components are not pluggable, they are fixed on the board. A booster is integrated on the
board, the booster is connected with an optical cable on the front panel. o external
booster is required.
An external 10dB attenuator has to be used between the ILM output and the input of the
booster.
The L-64.2 board can be used for distances up to 80 km.
Figure 7-1, “Long Haul Application (L-64.2)” (p. 7-20) shows the network block diagram
for implementing L-64.2 application.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-1 Long Haul Application (L-64.2)
10dB
Attenuator
external part
V-64.2 Application (Very Long Haul)

V-64.2 Alcatel-Lucent solution is based on usage of interfaces with Forward Error
Correction (FEC), Dispersion Compensation Module (DCM) and preamplifier. The DCM
is a passive component without any control functions. Up to two DCMs are located in a
Dispersion Compensation Unit (DCU). The DCU is an external component, which is
mounted as separate unit in the rack (refer to chapter “Dispersion Compensation Unit
(DCU)” (p. 3-8)).
The V-64.2 board can be used for distances up to 120 km.
Figure 7-2, “Very Long Haul Application (V-64.2)” (p. 7-20) shows the network block
diagram for implementing V-64.2 application.
Figure 7-2 Very Long Haul Application (V-64.2)
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
U-64.2 Application (Ultra Long Haul)

U-64.2 Alcatel-Lucent solution is based on usage of interfaces with FEC, DCMs, booster
and preamplifier. The board has the same function as the V-64.2 board with the addition
of a booster and an additional DCM.
The U-64.2 board can be used for distances up to 160 km.
Figure 7-3, “Ultra Long Haul Application (U-64.2)” (p. 7-21) shows the network block
diagram for implementing U-64.2 application.
Figure 7-3 Ultra Long Haul Application (U-64.2)
pump failure (PF) > HW Error

inputPowerLoss (IPL) > notreported
pump failure (PF) > HW Error

inputPowerLoss (IPL) > notreported
LOS

STM-64 according to
DIGITAL SIG AL Alcatel-Lucent proprietary
Application code V-64.2 U-64.2
Operating wavelength range nm 1550.12 1550.12
Source type
- maximum spectral power density mW/MHz t.b.d. t.b.d.
- maximum -20 dB width nm t.b.d. t.b.d.
- minimum side mode suppression ratio dB 30 30
- chirp parameter radians 0±0.1 0±0.1
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

Mean launch power:
- maximum dBm 3 12
- minimum dBm 0 10
Minimum extinction ratio dB 10 10
Attenuation range dB 20÷35 25÷44
- maximum ps/nm 1000 1000
- minimum ps/nm -560 -560
Maximum DGD ps/nm t.b.d. t.b.d.
Minimum ORL at S (including connectors) dB 24 24
Maxim. discrete reflectance between S and R dB -27 -27
Type of detector PI PI
Mean received power: (@ BER= 10-12 and
OS R=19 dB/0.1 nm)
- minimum (sensitivity) dBm -33 -34
- maximum (overload) dBm -13.5 -13
Maxim. reflectance of receiver measured at R dB -27 -27
Notes:

DIGITAL SIG AL STM–64 according to G.958
Application code DWDM APD
Interface type APD DWDM
1529,55 nm (196.00 THz) –>
1561,42 nm (192.00 THz), 100 GHz
Addressed wavelengths nm grid, compliant with ITU–T G.694.1
Minimum launched power dBm –2.0
Maximum launched power dBm +3.0
Maximum wavelength
deviation at end of life pm +/– 100
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

(continued)
Allowed bit rates Gbps 9.95328; 10.3125; 10.709; 11.095728
Minimum extinction ratio dB 9.0
Maximum –15dB bandwidth GHz +/– 8
Minimum SMSR dB 30
Maximum chromatic dispersion ps/nm 1600
Minimum sensitivity, @ –25 @ 1300 ps/nm

BER=10–4 w/o ASE noise dBm –23 @ 1600 ps/nm
17 @ 1300 ps/nm
–4
OS R (dB), @ BER=10 dB/0.1nm 19 @ 1600 ps/nm
Minimum sensitivity, @
BER=10–12 up to 10.3125 Gbps dBm –22 @ 1300 ps/nm
Minimum OS R (dB), @
BER=10–12 up to 10.3125 Gbps dB/0.1nm 25 @ 1600 ps/nm
Minimum overload dBm –8
Maximum receiver reflectance dB –27
Optical connector (Tx/Rx) LC
Fiber type SMF
Table 7-9 Parameters specified for 1000B-SX Optical Interface

DIGITAL SIG AL GE interface according to IEEE 802.3
ominal bit rate Gbps 1.250 Gbps
Application code 1000B-SX
CO DITIO S MI MAX
TX SIDE
Output optical power dBm - -9.5 -4.0
Output optical power BOL
(25°C, nominal power supply) dBm - -8.5 -4.0
Operating wavelength range nm - 820 860
∆λ rms nm - - 0.85
Relative Intensity oise dB/Hz - - -117
RX SIDE
Type of detector I Ga As PI
1
Sensitivity dBm - -18.0
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-9 Parameters specified for 1000B-SX Optical Interface (continued)

Sensitivity BOL (25°C,
1
nominal power supply) dBm - -19.0
-12.5 (62.5µm)
Stressed Receiver Sensitivity dBm See IEEE 802.3 - -13.5 (50µm)
Maximum input optical power dBm - - 0
Maximum input optical power
BOL (25°C, nominal power
supply) dBm - - +1.0
Loss of signal - Assert Pin dBm - -30 -18.0
Loss of signal - Deassert Pin dBm - -30 -17.0
LOS Hysteresis dB - 1 4.0
Data Output Rise/Fall time ps - - 250
Notes:
1. With fiber: 550 m MMF 50 µm (500 MHz Km @ 850nm), 500 m MMF 50 µm (400 MHz
Km @ 850nm), 275 m MMF 62.5 µm (200 MHz Km @ 850nm), 220 m MMF 62.5 µm (160
MHz Km @ 850nm)
Table 7-10 Parameters specified for 1000B-LX Optical Interface

Application code 1000B-LX
CO DITIO S MI MAX
TX SIDE
Output optical power (SMF) dBm - -11.0 -3.0
Output optical power BOL
(SMF) (25°C, nominal power
supply) dBm - -10.0 -3.0
Output optical power on MMF
50 & 62.5µm dBm - -11.5 -3.0
Output optical power BOL on
MMF 50 & 62.5µm (25°C,
nominal power supply) dBm - -10.5 -3.0
∆λ rms nm - - 4.0
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-10 Parameters specified for 1000B-LX Optical Interface (continued)

Relative Intensity oise dB/Hz - - -120
RX SIDE
Type of detector I Ga As PI
1
Sensitivity dBm - -20.0
Sensitivity BOL (25°C, nominal
1
power supply) dBm - -21.0
Stressed Receiver Sensitivity dBm See IEEE 802.3 - -14.4
Maximum input optical power dBm - - -3.0
Maximum input optical power
BOL (25°C, nominal power
supply) dBm - - -2.0
Loss of signal - Assert Pin dBm - -30 -21.0
Loss of signal - Deassert Pin dBm - -30 -20.0
LOS Hysteresis dB - 1 4.0
Data Output Rise/Fall time ps - - 175
Notes:
1. With fiber: 550 m MMF 50 µm (400 MHz Km @ 1300nm), 550 m MMF 62.5 µm (500
MHz Km @ 1300nm), 5000 m SMF 10 µm
Table 7-11 Parameters specified for 1000B–ZX Optical Interface

Application code 1000B–ZX
CO DITIO S MI MAX
TX SIDE
Output optical power (SMF) dBm - 0 5
∆λ rms nm - - 1.0
Extinction ratio dB - 9.0 -
RX SIDE
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-11 Parameters specified for 1000B–ZX Optical Interface (continued)

Min. Sensitivity (BER=10–12)
Pmin1 –241
Pmin2 dBm –222
Min. overload dBm - 0 -
Loss of signal – Assert Pin dBm - –30 –24.5
Loss of signal – Deassert Pin dBm - –29.5 –24.0
LOS Hysteresis dBm - 0.5 6.0
Fiber type 9/125 µm SMF
Optical connector LC DUPLEX
Notes:
1. Conditions: BER=10–12 Measured at 1250 Mbps, PRBS 27–1, RZ back to back
2. Conditions: BER=10–12 Measured at 1250 Mbps, PRBS 27–1, RZ with fiber
Table 7-12 Parameters specified for 10GE-SR

PARAMETER UNIT MIN TYP MAX
Digital Signal 10GE according to IEEE 802.3ae
ominal bit rate (Kbit/s) 10,312,5
Application code 10GBASE-SR
Optical Transmitter Data Output
Laser Safety Class Class 1 according to IEC 60825
Center wavelength nm 840 860
Optical average output power (Pout) dBm -7.3 > -6.3 -1
Pout in shut-down (Pout_sd) dBm -30
1
Optical modulation amplitude (OMA) dBm
1
Spectral width RMS nm
Extinction ratio dB 3
Eye mask IEEE 802.3ae-2002
ORL at MPI-S interface dB 12
2
RI 12OMA dB/Hz -128
3
Link power budget
Optical Receiver Data Input
Operating wavelength nm 840 860
Sensitivity @ BER=1e-12 4 dBm < -11.9 -9.9
Receiver Sensitivity in OMA dBm < -13.1 -11.1
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-12 Parameters specified for 10GE-SR (continued)

PARAMETER UNIT MIN TYP MAX
Stressed receiver sensitivity in OMA 2 dBm -7.5
Receiver reflectance dB -14
Jitter tolerance IEEE 802.3ae-2002
Notes:
1. Conforms to IEEE 802.3ae-2002: Triple Tradeoff Curves (TTC) figure 52-3 and table 52-8
2. Test pattern and procedure according to IEEE 802.3ae-2002
3. Conforms to IEEE 802.3ae-2002, table 52-10
4. Sensitivity in average power measured in back-to-back conditions
Table 7-13 Parameters specified for 10GE-LR,-ER,-ZR

DIGITAL SIG AL
ominal bit rate Kbit/s 10GE according to IEEE 802.3ae 10,312,5
Application code 10GBASE-LR 10GBASE-ER 10GBASE-ZR
Operating wavelength range nm 1290÷1330 1530÷1565 1530÷1565
Source type SLM EA-ILM EA-ILM
- maximum spectral power
density mW/MHz t.b.d. t.b.d. t.b.d.
- maximum -20 dB width nm 1 t.b.d. t.b.d.
- minimum side mode
suppression ratio dB 30 30 t.b.d.
- chirp parameter radians t.b.d. t.b.d. t.b.d.
Mean launch power:
- maximum dBm -1 +2 12
- minimum dBm -6 -1 10
Minimum extinction ratio dB 6 8.2 8.2
- maximum ps/nm 6.6 800 1600
- minimum ps/nm n.a. n.a. t.b.d.
Maximum DGD ps/nm 30 30 30
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-13 Parameters specified for 10GE-LR,-ER,-ZR (continued)

connectors) dB 14 24 24
Maxim. discrete reflectance
between S and R dB -27 -27 -27
Type of detector PI PI PI
Mean received power: (@ BER=
10-12 and OS R=19 dB/0.1 nm)
Maxim. reflectance of receiver
...................................................................................................................................................................................................................................
Optical Safety
...................................................................................................................................................................................................................................
Optical Safety
Hazard Level classification
The HAZARD LEVEL classification of the different optical interfaces is given in Table
7-14, “Hazard level classification of different optical interfaces” (p. 7-29).
The hazard level was assigned in accordance with the requirements of IEC 60825-1
(1998) + Am. 2 (2001) and IEC 60825-2 (2000) or IEC 60825-1 (1998) and IEC 60825-2
(2000).
Table 7-14 Hazard level classification of different optical interfaces

MODULE or PORT OPTICAL INTERFACE HAZARD
LEVEL
STM-1 S-1.1 (short haul) 1
STM-1 L-1.1 (long haul) 1M
STM-16 I-16.1 (intra-office) 1
STM-64 I-64.1 (intra-office) 1
STM-64 S-64.2 (short haul) 1M
STM-64 V-64.2 (very long haul) 1M
STM-64 U-64.2 (ultra long haul) 1M
GE 1000B-SX 1
GE 1000B-SX 1
GE 1000B-LX 1
GE 10GBASE-S 1
...................................................................................................................................................................................................................................
Optical Safety
...................................................................................................................................................................................................................................
Incorporated Laser Sources Characteristics

Output optical interfaces data: the wavelength and the maximum optical power at the
output connector of incorporated laser sources is given in Table 7-15, “Incorporated laser
sources characteristics” (p. 7-30).
Table 7-15 Incorporated laser sources characteristics

MODULE OPTICAL INTERFACE WAVELENGTH MAX. OPT.
or PORT [nm] POWER [mW]1
STM-1 S-1.1 (short haul) 1261 ÷ 1360 0.16
STM-1 L-1.1 (long haul) 1280 ÷ 1335 1
STM-1 L-1.2 (long haul) 1480 ÷ 1580 1
STM-4 S-4.1 (short haul) 1274 ÷ 1356 0.16
STM-4 L-4.1 (long haul) 1280 ÷ 1335 1.6
STM-4 L-4.2 (long haul) 1480 ÷ 1580 1.6
STM-16 I-16.1 (intra-office) 1270 ÷ 1360 1
STM-16 S-16.1 (short haul) 1270 ÷ 1360 1
STM-16 L-16.1 (long haul) 1280 ÷ 1335 1.6
STM-16 L-16.2 (long haul) 1500 ÷ 1580 1.6
STM-64 I-64.1 (intra-office) 1290 ÷ 1330 0.8
STM-64 S-64.2 (short haul) 1530 ÷ 1565 1.6
STM-64 L-64.2 (long haul) 1530 ÷ 1565 16
STM-64 V-64.2 (very long haul) 1550.12 4.5
STM-64 U-64.2 (ultra long haul) 1550.12 16
GE 1000B-SX 820 ÷ 860 0.4
GE 1000B-LX 1270 ÷ 1355 0.5
GE 10GBASE-LX 840 ÷ 860 0.4
Notes:
1. The maximum optical power at the interfaces is in normal operating conditions and depends
on setting and calibration carried out during the factory test or installation.
Location Type
The equipment shall be installed in "restricted locations" (industrial and commercial
premises) or "controlled locations" (optical cable ducts and switching centers).
Labelling
The label are affixed in factory on this cover protection fibre.
Only the labels corresponding to the worst case at 2 nd and 3 rd window are put on the
cover.
...................................................................................................................................................................................................................................
Optical Safety
...................................................................................................................................................................................................................................
In the following description it is specified when the label shall be affixed by the customer.
The optical interfaces which have HAZARD LEVEL 1 (refer to Table 7-14, “Hazard level
classification of different optical interfaces” (p. 7-29)) carry the following explanatory
label (a multilingual label kit is also provided):
The label is put on the fibre protection cover of the following parts:
• STM-1 port with S-1.1 interface
• STM-16 port with I-16.1 interface
• STM-64 port with I-64.1 interface
• GE port with 1000Base SX
• GE port with 1000Base LX.
The optical interfaces which have HAZARD LEVEL 1M (refer to Table 7-14, “Hazard
level classification of different optical interfaces” (p. 7-29)) carry the hazard symbol
label:
The label is affixed near the optical connectors on the front plate of the following
interfaces:
• L-1.1 (STM-1 port)

...................................................................................................................................................................................................................................
Optical Safety
...................................................................................................................................................................................................................................
• L-16.1 (STM-16 port)

• L-16.2 (STM-16 port)
• S-64.2 (STM-64 port)
• L-64.2 (STM-64 port)
• L-64.2 CF (colored STM-64 port multi channel)
• V-64.2 (STM-64 port)
• U-64.2 (STM-64 port)
The optical interfaces which have HAZARD LEVEL 1M and operate at 2 nd window (refer
to Table 7-14, “Hazard level classification of different optical interfaces” (p. 7-29)), carry
the following explanatory label (a multilingual label kit is also provided):
The label is affixed on the fibre protection cover of the following parts:
• STM-1 port with L-1.1 interface
• STM-16 port with L-16.1 interface.
The optical interfaces which have HAZARD LEVEL 1M and operate at 3 rd window (refer
to Table 7-14, “Hazard level classification of different optical interfaces” (p. 7-29)), carry
the following explanatory label (a multilingual label kit is also provided):
The label is affixed on the fibre protection cover of the following parts:
...................................................................................................................................................................................................................................
Optical Safety
...................................................................................................................................................................................................................................
• STM-64 port with L-64.2 colored interface (multi channel)

• STM-64 port with V-64.2 interface
• STM-64 port with U-64.2 interface.
The multilingual label kit, for STM-1 ports, is placed in the same plastic bag provided
together with the module where explanatory labels (in English language), above
mentioned, are put.
For all other units the multilingual label kit is inserted in the pre-package.
The multilingual label kit contains a set of label that reproduce the same (explanatory)
above depicted in the following languages:
• Italian
• French
• Spanish
• German.
Apertures and Fibre Connectors

The locations of apertures and fibre connectors are reported on topographical drawings of
units front view in “Units Front View” (p. 3-39).
Engineering Design Features

In normal operating conditions, unless intentional manumission, the laser radiation is
never accessible.
The laser beam is launched in optical fibre through an appropriate connector that totally
shuts up the laser radiation. Moreover a plastic cover is fitted upon optical connectors by
means of screws.
In case of cable fibre break, to minimize exposure times, ALS procedure according to
ITU-T G.958 Rec. is implemented on STM- ports.
The shutdown timing is 550 ± 50 ms; the reactivation timing is less than 850 ms.
Safety Instructions
The safety instructions for proper assembly, maintenance, and safe use including clear
warning concern ing precautions to avoid possible exposure to hazardous laser radiation,
are reported in the 1678 MCC Safety Guide.
...................................................................................................................................................................................................................................
Technical specifications Power Supply Characteristics
Electrical specifications
...................................................................................................................................................................................................................................
Power Supply Characteristics
Electrical specifications
Input Voltage (Battery): -48/-60 VDC

in according to ETSI E 300 132-2 V2.1.2 (2003-09)
Functional Protection Earth: FPE-2 wire or FPE-3 wire
Max. power consumption: 1678 MCC Shelf: 2000 W maximum
1670SM Shelf: 1000 W maximum
1662SMC Shelf: 500 W maximum
...................................................................................................................................................................................................................................
Technical specifications Alarm Characteristics
Units Alarms
...................................................................................................................................................................................................................................
Alarm Characteristics
Units Alarms
Each port board or access board of the equipment is provided with a bicolor LED
(green/red) on the front coverplate.
This LED indicates:
• when red, internal failure
• when green, in service unit.
...................................................................................................................................................................................................................................
Equipment Alarms and Trouble-shooting
...................................................................................................................................................................................................................................
Equipment Alarms and Trouble-shooting

All the alarms detected on the units are collected by the First Level Controller (FLC)
board.
The 1678 MCC equipment has been designed to dialog with a Personal Computer (PC) in
order to service, activate and trouble–shoot the equipment.
Trouble–shooting procedure for the equipment and details of the alarms for each board
and relevant indications are described in the 1678 MCC Maintenance and
Trouble-Clearing Guide.
Connection with the PC is achieved through connector available on Equipment Controller
board.
The board can be connected to an Operations System associated to the Transmission
Management etwork in order to execute operations similar to those carried out by the
PC.
ote: On the Craft Terminal (CT) and on the Operation System (OS) application the
URGE T (URG), OT URGE T ( URG) and I DICATIVE alarms are named in a
different way; the relation between these terms is explained in Table 7-16, “Relation
between Alarm severity terminology” (p. 7-36).
Table 7-16 Relation between Alarm severity terminology

Alarm severity terminology on CT and Alarm severity terminology used for EC
OS
CRITICAL or MAJOR URG , T*URG, T*RURG,
MI OR URG, , T* URG, T*R URG
WAR I G I DICATIVE
I DETERMI ATE (not used) --
...................................................................................................................................................................................................................................
Auto Port Monitoring
...................................................................................................................................................................................................................................
Auto Port Monitoring

To prevent alarms from being raised and failures being reported during trail provisioning
actions, the fault cause declaration can be enabled and disabled via physical port
functions.
This is controlled via their port mode parameter. It provides the following modes:
• MO – Monitored
The incoming port signal is monitored for defects.
• AUTO – Automatic
Port monitoring is disabled. However, as soon as a transition from “no input signal
present” to “input signal applied” is detected, the port monitoring mode is
automatically switched to Monitored. Please note that the transition from “no input
signal present” to “input signal applied” is mandatory for the port monitoring mode to
be automatically switched to Monitored. The port monitoring mode will remain
unchanged in the Auto state as long as no transition from “no input signal present” to
“input signal applied” takes place. ote furthermore that the Auto port monitoring
mode of the physical ports is not propagated to the underlying TPs, that is, if the
Alarm Severity Assignment Profiles (ASAP) of the TPs are configured accordingly
then the TPs will report alarms, while the port does not.
ote: “ ot Monitored” is not explicitly defined as a port monitoring mode. However,
the corresponding behaviour can easily be realized by selecting “Monitored” as the
port monitoring mode, and assigning “ o alarms” as the Alarm Severity Assignment
Profile (ASAP) for the respective port.
...................................................................................................................................................................................................................................
Technical specifications Mechanical Characteristics
1678 MCC Rack
...................................................................................................................................................................................................................................
Mechanical Characteristics
1678 MCC Rack
Equipment practice 1678 MCC rack according to ETS 300 119 - 2

(mechanical compatibility) H
D
W
Rack size (mm) 600 W x 300 D x 2200 H

Rack cabling Vertical between rack and subrack - Front
access
Back-to-back installation Yes
...................................................................................................................................................................................................................................
OED Rack
...................................................................................................................................................................................................................................
OED Rack
Equipment practice Optinex rack according to ETS 300 119 - 2

(mechanical compatibility)
Rack size (mm) 600 W x 300 D x 2200 H
Rack cabling Vertical between rack and subrack - Front
access
Back-to-back installation Yes
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
...................................................................................................................................................................................................................................
1678 MCC Main Shelf
Shelf size (mm) (including cable channel) 533 W x 294 D x 674 H

Board size (mm) Traffic Port board: 217.5 D x 475 H
Cooling Forced, heat pipe technique
Electrical Connectors IEC 807 (Sub-D)
IEC 169-1 (coax. 1.0/2.3)
...................................................................................................................................................................................................................................
1678 MCC Main Shelf (SONET)
...................................................................................................................................................................................................................................
1678 MCC Main Shelf (SONET)
Shelf size (mm) 533 W x 294 D x 684 H

(including cable channel and Dust filter)
Board size (mm) Traffic Port board: 217.5 D x 475 H
Cooling Forced, heat pipe technique
IEC 169-1 (coax. 1.0/2.3)
...................................................................................................................................................................................................................................
1670SM Shelf
...................................................................................................................................................................................................................................
1670SM Shelf
Shelf size (mm) Main Shelf 533 W x 280 D x 875 H

FA s 533 W x 280 D x 75 H
Subrack
Board size (mm) Port board: 213 D x 265 H
Access 92 D x 265 H
board:
FA s Unit: 495 W x 268.5 D x 28.5 H
Cooling Forced
IEC 169-1 (coax. 1.0/2.3)
...................................................................................................................................................................................................................................
1662SMC Shelf
...................................................................................................................................................................................................................................
1662SMC Shelf
Shelf size (mm) Main Shelf 470 W x 250 D x 390 H

FA s 533 W x 280 D x 110 H
Subrack
Board size (mm) 213 D x 265 H
Cooling Forced
Electrical Connectors IEC 603/DI 41612
IEC 807 (Sub-D)
IEC 169-1 (coax. 1.0/2.3)
B C 50 Ω
RJ11
...................................................................................................................................................................................................................................
Technical specifications Environmental Conditions
General aspects
...................................................................................................................................................................................................................................
Environmental Conditions
General aspects
Main environmental aspects of Alcatel-Lucent products are:
• Energy consumption during manufacturing and use,
• Materials harmfulness and recyclability,
• Emissions to air, water or soil related to the manufacturing and the use of the product,
• Electromagnetic (EM) emissions,
• Value recovery at the product end of life.
...................................................................................................................................................................................................................................
Waste from Electrical and Electronic Equipment (WEEE)
...................................................................................................................................................................................................................................
Waste from Electrical and Electronic Equipment (WEEE)

The marking printed on the shelf (refer to Figure 6-1, “Subrack label (1)” (p. 6-8) and
Table 6-1, “Label references” (p. 6-7)) denotes compliancy with the Directive
2002/96/EC On Waste of Electrical and Electronic E quipment.
The general principle is the producer responsibility in the management of the products he
puts on the market when discarded by the owner. The producer responsibility now covers
the end of life of the products sold.
The European directive is effective in a country once transposed. The starting date for the
producer re sponsibility for the European text is August 13, 2005.
All Alcatel-Lucent products fall under in Category 3 of Annex 1A of the WEEE directive
(Directive 2002/96/ EC) i.e. "IT and Telecommunication equipment" under item "other
products transmitting sound, images or other information by telecommunications."
Alcatel-Lucent products fall under WEEE directive name: "Other product or equipment of
transmitting sound, images or other information by telecommunications" in Annex 1B.
This mark will not cause any responsibility as all responsibilities will be defined by
contract.
...................................................................................................................................................................................................................................
Acoustical noise
...................................................................................................................................................................................................................................
Acoustical noise
The acoustical noise level of the product complies with:
• ETS 300 753 Environmental Class 3.1 for attended telecommunication equipment
rooms (maximum sound level 7.2 bels)
...................................................................................................................................................................................................................................
Climatic for Operating Conditions
...................................................................................................................................................................................................................................

The 1678 MCC Equipment meets the requirements of ETSI Standards.
It uses FA units.
The functionality of the 1678 MCC Equipment, vs. Temperature, is in compliance with:
ETS 300 019-1-3 : February 1992 , class 3.1
Class 3.1 : Temperature-controlled locations.
This class applies to a weather protected location having neither temperature nor humidity
control. The location may have openings directly to the open air, i.e. may be only partially
weather protected. The effect of direct solar radiation and heat trap conditions exist.
The climatogram is shown in Figure 7-4, “Climatogram for Class 3.1” (p. 7-48).
This class applies to locations:
• where installed equipment may be exposed to solar radiation and to heat radiation. It
may also be exposed to movements of the surrounding air due to draughts in
buildings. They are not subjected to condensed water, precipitation, water from
sources other than rain or icing;
• without particular risks of biological attacks. This includes protective measures, e.g.
special product design, or installations at locations of such construction that mould
growth and attacks by animals, etc. are not probable;
• with normal levels of contaminants experienced in urban areas with industrial
activities scattered over the whole area and/or with heavy traffic;
• without special precautions to minimize the presence of sand or dust, but which are
not situated in proximity to sources of sand or dust;
• with insignificant vibration and shock.
The conditions of this class may be found in:
• normal living or working areas, e.g. living rooms, rooms for general use (theatres,
restaurants);
• offices;
• shops;
• workshops for electronic assemblies and other electrotechnical products;
• telecommunication centers;
• storage rooms for valuable and sensitive products.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-4 Climatogram for Class 3.1
Table 7-17 Climate parameters for environmental class 3.1

Environmental parameter Unit 3.1
(A) Low air temperature °C +5
(B) High air temperature °C + 40
(C) Low relative humidity % 5
(D) High relative humidity % 85
(E) Low absolute humidity g/m3 1
(F) High absolute humidity g/m3 25
(G) Rate of change of temperature ( ote 1) °C/min 0.5
(H) Low air pressure kPa 70
(I) High air pressure ( ote 2) kPa 106
(J) Solar radiation W/m2 700
(K) Heat radiation W/m2 600
(L) Movement of the surrounding air ( ote 3) m/s 5
(M) Conditions of condensation none no
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-17 Climate parameters for environmental class 3.1 (continued)

( ) Conditions of winddriven rain, snow, hail, etc. none no
(O) Conditions of water from sources other than none no
rain
(P) Conditions of icing none no
Notes:
1. Averaged over a period of 5 minutes.
2. Conditions in mines are not considered.
3. A cooling system based on non-assisted convection may be disturbed by adverse movement
of the surrounding air.
...................................................................................................................................................................................................................................
Storage
...................................................................................................................................................................................................................................
Storage
The 1678 MCC equipment meet the following requirements vs. storage:
ETS 300 019-1-1 : February 1992, class 1.2
Class 1.2 : weatherproofed, not temperature controlled storage locations.
This class applies to weatherproofed storage having neither temperature nor humidity
control. The location may have openings directly to the open air, i.e., it may be only
partly weatherproofed. The climatogram is shown on Figure 7-5, “Climatogram for Class
1.2” (p. 7-51).
This class applies to storage locations:
• where equipment may be exposed to solar radiation and temporarily to heat radiation.
They may also be exposed to movements of the surrounding air due to draughts, e.g.
through doors, windows or other openings. They may be subjected to condensed
water, dripping water and to icing. They may also be subjected to limited wind-driven
precipitation including snow;
• where mould growth or attacks by animals, except termites, may occur;
• with normal levels of contaminants experienced in urban areas with industrial
activities scattered over the whole area, ad/or with heavy traffic;
• in areas with sources of sand or dust, including urban areas;
• with vibration of low significance and insignificant shock.
The conditions of this class may occur in:
• unattended buildings
• some entrances of buildings
• some garages and shacks.
...................................................................................................................................................................................................................................
Storage
...................................................................................................................................................................................................................................
Figure 7-5 Climatogram for Class 1.2
absolute air humidity [ g/m 3 ]

29
air temperature [o C ]
0.5
relative air humidity [ % ]
Table 7-18 Climate parameters for environmental class 1.2

(A) Low air temperature ( ote °C - 25
1)
(B) High air temperature ( ote °C + 55
1)
(C) Low relative humidity ( ote % 10
1)
(D) High relative humidity ( ote % 100
1)
(E) Low absolute humidity ( ote g/m3 0.5
1)
(F) High absolute humidity ( ote g/m3 29
1)
(G) Rain intensity mm/min no
(H) Rate of change of ( ote °C/min 0.5
temperature 2)
(I) Low air pressure ( ote kPa 70
3)
...................................................................................................................................................................................................................................
Storage
...................................................................................................................................................................................................................................
Table 7-18 Climate parameters for environmental class 1.2 (continued)

(J) High air pressure ( ote kPa 106
4)
(K) Solar radiation W/m2 1120
(L) Heat radiation W/m2 ( ote 7)
(M) Movement of the surrounding air m/s 30
( ) Conditions of condensation none yes
(O) Conditions of precipitation (rain, none yes ( ote 6)
snow, hail, etc.)
(P) Low rain temperature ( ote °C no
5)
(Q) Conditions of water from sources none dripping
other than rain water
(R) Conditions of icing and frosting none yes
Notes:
1. For simultaneous occurrence of parameters (A) to (F) see Figure 7-5, “Climatogram for
Class 1.2” (p. 7-51)
2. Averaged over a period of 5 minutes.
3. 70 kPa represent a limit value for open-air storage, normally at about 3 000 m.
4. Conditions in mines are not considered.
5. This rain temperature should be considered together with high air temperature (B) and solar
radiation (K). The cooling effect of the rain has to be considered in connection with the
surface temperature of the equipment.
6. Applies to wind-driven precipitation.
7. Conditions of heat radiation, e.g. in the vicinity of room heating systems.
...................................................................................................................................................................................................................................
Transportation
...................................................................................................................................................................................................................................
Transportation
The 1678 MCC equipment meets the following requirements vs. transportation:
ETS 300 019-1-2 : February 1992, class 2.2
Class 2.2 : Careful transportation (refer to Table 7-19, “Climatic conditions for
environmental classes 2.1/2.2” (p. 7-53)).
This class applies to transportation where special cars has been taken e.g. with respect to
low temperature and handling.
Class 2.2 covers the condition of class 2.1. In addition class 2.2 includes transportation in
all types of lorries and trailers in areas with well-developed road system.
It also includes transportation by ship and by train specially designed, shock-reducing
buffers. Manual loading and unloading of to 20 Kg is included.
Extension of extreme low temperature during transportation is permitted for the
1678 MCC equipment in its standard packing:
at -40° C for 72 hours maximum
without damaging the optical interfaces.
Table 7-19 Climatic conditions for environmental classes 2.1/2.2

Environmental parameter Unit 2.1 and 2.2
(A) low temperature air °C - 25
(B) High temperature, air in unventilated °C + 70
enclosures ( ote 1)
(C) High temperature, air in ventilated enclosures °C + 40
or outdoor air ( ote 2)
(D) Change of temperature air/air ( ote 3) °C -25 / +30
(E) Change of temperature air/water ( ote 3) °C +40 / +5
(F) Relative humidity, not combined with rapid % 95
temperature changes °C +40
(G) Relative humidity, combined with rapid % 95
temperature changes air/air, at high relative °C -25 / +30
humidity ( ote 3, 6)
(H) Absolute humidity, combined with rapid g/m3 60
temperature changes: air/air at high water °C +70 / +15
content ( ote 4)
(I) Low air pressure kPa 70
(J) Change of air pressure kPa/min no
(K) Movement of the surrounding medium, air m/s 20
(L) Precipitation rain mm/min 6 ( ote 7)
2
(M) Radiation, solar W/m 1120
...................................................................................................................................................................................................................................
Transportation
...................................................................................................................................................................................................................................
Table 7-19 Climatic conditions for environmental classes 2.1/2.2 (continued)

Environmental parameter Unit 2.1 and 2.2
( ) Radiation, heat W/m2 600
(O) Water from sources other than rain ( ote 5) m/s 1 ( ote 7)
(P) Wetness none conditions of wet
surfaces
Notes:
1. The high temperature of the surfaces of a product may be influenced by both the
surrounding air temperature, given here, and the solar radiation through a window or another
opening.
2. The high temperature of the surface of a product is influenced by the surrounding air
temperature, given here, and the solar radiation defined below.
3. A direct transfer of the product between the two given temperature is presumed.
4. The product is assumed to be subjected to a rapid decrease of temperature only (no rapid
increase). The figures of water content apply to temperatures down to the dew-point; at
lower temperatures the relative humidity is assumed to be approximately 100 %.
5. The figure indicates the velocity of water and not the height of water accumulated.
6. Occurrence of condensation.
7. For short duration only.
...................................................................................................................................................................................................................................
EMI/EMC Condition
...................................................................................................................................................................................................................................
EMI/EMC Condition
For the EMI/EMC condition refer to “Conformity statements” (p. 6-3).
...................................................................................................................................................................................................................................
Technical specifications Dismantling & recycling
WEEE general Information
...................................................................................................................................................................................................................................
Dismantling & recycling
WEEE general Information

According to the European directive (2002/96/EC) Waste Electric and Electronic
Equipment, from August 13, 2005 the "producer" of the equipment being sold, unless
otherwise specified in the contract with the Customer, is responsible for collecting and
treating Electrical and Electronic Equipment.
Equipment put on the market after August 13, 2005 have a label (refer to “Labels affixed
to the Equipment” (p. 6-7)) affixed on the product. The presence of the black label
indicates the product has been put on the market after August 13, 2005.
The following paragraphs give a description example of how to disassemble an
equipment; the same principle can be applied to all the shelves and units composing the
equipment.
The unit chosen for disassembly is one of the most complex.
“How to disassemble equipment” (p. 7-57) describes the equipment disassembly; in
detail:
• “Tools necessary for disassembly” (p. 7-58) lists the tools necessary for disassembly
• Procedure 7-1: “Shelf Disassembly” (p. 7-59) describes the shelf disassembly
• Procedure 7-2: “Unit Disassembly” (p. 7-66) describes the unit disassembly
• “Hazardous Materials and Components” (p. 7-77) describes the procedure to apply in
order to manage Hazardous materials and components (example battery)
“ECO Declaration” (p. 7-79) reports the ECO declaration info.
...................................................................................................................................................................................................................................
How to disassemble equipment
...................................................................................................................................................................................................................................
How to disassemble equipment

This equipment is designed for easy disassembly, by using screws and rivets for
mechanical assembly of shelves and modules. The variety of screw types is minimized.
Tools necessary for shelf and units disassembly are reported in “Tools necessary for
disassembly” (p. 7-58).
The disassembly process depends on the respective recycling methods and can be derived
from the delivered assembly instructions of the product.
...................................................................................................................................................................................................................................
Tools necessary for disassembly
...................................................................................................................................................................................................................................
Tools necessary for disassembly

The following tools are necessary for unit disassembly:
• # T9 TORX screw driver
• # T20 TORX screw driver
• Crosshead screw driver
• Wrench #
• Scissors
• Protection gloves
...................................................................................................................................................................................................................................
Procedure 7-1: Shelf Disassembly
...................................................................................................................................................................................................................................

Figure 3-38, “Optical XFP Module” (p. 3-62) shows an example for a shelf. The same
rules can be applied to the specific equipment to be dismantled.
In order to disassemble the shelf first remove the boards eventually present, included
termination bus.
Figure 7-6 Shelf Front and Rear View
Procedure:
...................................................................................................................................................................................................
1 Remove the two screws (A) in order to disassemble the handle as reported in Figure 7-7,
“Handle Removal and Disassembly” (p. 7-60)
...................................................................................................................................................................................................
2 Repeat the same procedure on the other handle.

...................................................................................................................................................................................................
3 Separate the two plastic blocks of the handle as reported in Figure 7-7, “Handle Removal
and Disassembly” (p. 7-60).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-7 Handle Removal and Disassembly
...................................................................................................................................................................................................
4 Unscrew all the screws present on rear cover as reported in Figure 7-8, “Rear Cover
Removal” (p. 7-61).
...................................................................................................................................................................................................
5 Remove the rear cover in order to access the shelf Back Panel.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-8 Rear Cover Removal
...................................................................................................................................................................................................
6 Unscrew all the screws fastening the Back Panel to the mechanical structure of the shelf
as indicated in Figure 7-9, “Back Panel Removal” (p. 7-62) (dashed line).
...................................................................................................................................................................................................
7 Remove the Back Panel from the shelf mechanical structure.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-9 Back Panel Removal
...................................................................................................................................................................................................
8 Remove the upper and lower guides from the shelf access area by unscrewing the relevant
screws as indicated in Figure 7-10, “Upper and Lower Guides Plane Removal” (p. 7-63).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-10 Upper and Lower Guides Plane Removal
...................................................................................................................................................................................................
9 Remove the side wall by unscrewing the relevant screw as indicated in Figure 7-11, “Side
Wall Removal” (p. 7-64).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
10 Remove the two contact springs from the side wall as indicated in Figure 7-12, “Optical
Fiber Duct, Guides and Contact Spring Removal” (p. 7-65) (refer to chapter “Hazardous
Materials and Components” (p. 7-77) for info about hazardous parts dismantling).
Figure 7-11 Side Wall Removal
...................................................................................................................................................................................................
11 Remove the two guides of the "basic area" and the two optical fiber ducts by pulling them
out as indicated in Figure 7-12, “Optical Fiber Duct, Guides and Contact Spring
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
12 Unscrew all the screws present on the other "side wall" in order to complete the shelf
disassembly.
Figure 7-12 Optical Fiber Duct, Guides and Contact Spring Removal
EN D O F S T E P S
...................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Procedure 7-2: Unit Disassembly
...................................................................................................................................................................................................................................

The following figures show an example for a unit. The same rules can be applied to the
specific units to be dismantled.
Procedure:
...................................................................................................................................................................................................
1 Remove the two screws (A) from the side coverplate as indicated in Figure 7-13, “Side
Coverplate Removal” (p. 7-66).
Figure 7-13 Side Coverplate Removal
...................................................................................................................................................................................................
2 Remove the screws (B) that fix the two levers and subsequently pull out them from the
front plate as indicated in Figure 7-14, “Levers Removal” (p. 7-67).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-14 Levers Removal
...................................................................................................................................................................................................
3 Unscrew and extract the two optical connectors (C) as indicated Figure 7-15, “Optical
Connectors Support Removal” (p. 7-68).
...................................................................................................................................................................................................
4 Remove the screw (D) fixing the connectors support as indicated in Figure 7-15, “Optical
Connectors Support Removal” (p. 7-68).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
5 Rotate the connectors support (E) and pull it sideways to be removed as indicated Figure
7-15, “Optical Connectors Support Removal” (p. 7-68).
Figure 7-15 Optical Connectors Support Removal
...................................................................................................................................................................................................
6 Remove the two screws (F) from the side coverplate as indicated in Figure 7-16, “Side
Coverplate and Contact Spring Removal” (p. 7-69).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
7 Extract from the top the contact spring (G) as indicated in Figure 7-16, “Side Coverplate
and Contact Spring Removal” (p. 7-69) (refer to chapter “Hazardous Materials and
Components” (p. 7-77) for info about hazardous parts dismantling).
...................................................................................................................................................................................................
8 Extract the fibers from the cavity (H) as indicated in Figure 7-16, “Side Coverplate and
Contact Spring Removal” (p. 7-69).
Figure 7-16 Side Coverplate and Contact Spring Removal
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
9 Disconnect the two flat cables (M) as indicated in Figure 7-17, “Internal Connectors
...................................................................................................................................................................................................
10 Unscrew (L) connectors with the aid of a wrench as indicated Figure 7-17, “Internal
Connectors Removal” (p. 7-70).
...................................................................................................................................................................................................
11 Remove the fibers ( ) from supports pulling them out Figure 7-17, “Internal Connectors
Figure 7-17 Internal Connectors Removal
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................
12 Remove the two screws (O) on the other side of the board that fixes the dissipator to the
Printed Circuit Board (PCB) as indicated in Figure 7-18, “Dissipator Removal” (p. 7-71).
...................................................................................................................................................................................................
13 The dissipator can now be removed (refer to Figure 7-19, “Modules Removal from
Dissipator” (p. 7-72)).
Figure 7-18 Dissipator Removal
...................................................................................................................................................................................................
14 Remove the screws (P) from dissipator as indicated in Figure 7-19, “Modules Removal
from Dissipator” (p. 7-72).
...................................................................................................................................................................................................
15 ow the two modules on the other side of the dissipator are free to be removed (refer to
Figure 7-21, “Gold Connector Removal” (p. 7-74));
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
ote: Pay attention during modules removal because of white conductive paste (refer
to chapter “Hazardous Materials and Components” (p. 7-77) for info about hazardous
parts dismantling).
...................................................................................................................................................................................................
16 Remove the plastic part (X) in Figure 7-20, “Daughter Board Removal” (p. 7-73) by
unscrewing the screw present on the rear side of the dissipator.
Figure 7-19 Modules Removal from Dissipator
...................................................................................................................................................................................................
17 Remove the screws (Q) and (R) that fix the daughter board and pull it out from the
mother board (refer to Figure 7-20, “Daughter Board Removal” (p. 7-73)).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-20 Daughter Board Removal
...................................................................................................................................................................................................
18 Cutaway gold plated connector (S) from daughter board (refer to Figure 7-21, “Gold
Connector Removal” (p. 7-74)).
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-21 Gold Connector Removal
...................................................................................................................................................................................................
19 Remove all internal cables as indicated in Figure 7-22, “Internal Cables Removal”
(p. 7-75). To remove cables it is enough to pull them out from their support.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-22 Internal Cables Removal
...................................................................................................................................................................................................
20 Remove screws (T) that fix the metal support to the mother board as indicated in Figure
7-23, “Connector metal Support Removal” (p. 7-76).
...................................................................................................................................................................................................
21 Remove the metal support.

...................................................................................................................................................................................................
22 Cutaway the gold plated connector (U) from mother board.
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Figure 7-23 Connector metal Support Removal
END O F S T E P S
...................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Hazardous Materials and Components
...................................................................................................................................................................................................................................

Table 7-20, “List of hazardous materials and components present in the equipment”
(p. 7-77) lists the presence or not of hazardous substance/components.
ote: The system cabling is designed for reduced halogen content. All the traffic
cabling is fully PVC free.
Table 7-20 List of hazardous materials and components present in the
equipment
Materials/Substances Presence in the Where
Equipment
Batteries External
O
(Mercury/ iCad/Lithium/Other)
Batteries Internal
O
(Mercury/ iCad/Lithium/Other)
Mercury O
Cadmium O
Capacitors with PCBs O
Capacitors with substance of concern +
height > 25 mm, diameter > 25 mm or O
proportionately similar volume
Gas discharge lamps O
Mercury containing Backlighting lamps O
Plastic containing brominated flame
retardants other than in Printed Circuit O
Assemblies
Liquid Crystal Displays with a surface
O
greater than 100 cm2
Asbestos O
Refractory ceramic fibres O
In all units where dissipators are present a
withe thermal conductive paste is used in
between mechanical parts.
In Figure 7-20, “Daughter Board
Removal” (p. 7-73) an example is shown.
Thermal conductive paste YES
ote: Protective plastic gloves must be
used in order to avoid contact between
hands and thermal conductive paste. Pay
attention to avoid contact of thermal
conductive paste with eyes.
Radio-active substances O
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
Table 7-20 List of hazardous materials and components present in the

equipment (continued)
Materials/Substances Presence in the Where
Equipment
Beryllium Oxide O
Refer to Figure 7-12, “Optical Fiber Duct,
Guides and Contact Spring Removal”
(p. 7-65) and Figure 7-16, “Side
Coverplate and Contact Spring Removal”
Other forms of Beryllium YES (p. 7-69) point G.
ote: Copper-beryllium contact spring
must be separated from other material and
must be fused in a specific regulated
environment.
Pressure volume O
Liquids volume O
Gasses volume O
"Hidden" mechanical springs or other
O
equivalent parts
Ozone depleting substances, according to
those categories that are already banned in O
the Montreal protocol.
Chloroparaffins with chain length 10-13 C
atoms, chlorination greater than 50% con
O
tained in mechanical plastic parts heavier
than 25g,
Lead contained in mechanical parts
O
heavier than 25 g.
Polychlorinated biphenyls (PCB) or
O
polychlorinated terphenyls (PCT).
Polybrominated biphenyls and their ethers
(CAS no. 32534-81-9, CAS no.
32536-52-0, CAS no. 1163-19-5, CAS
O
no.13554-09-6) contained in mechanical
parts heavier than 25 g, in concentrations
exceeding the natural background levels.
...................................................................................................................................................................................................................................
ECO Declaration
...................................................................................................................................................................................................................................
ECO Declaration
The 1678 MCC is the next generation Broadband and Wideband Cross Connect.
Addressing transmission Metro & Core networks, it combines unmatched density and
high capacity together with data-aware capabilities.
Thanks to its density, it allows for a modernization of Central Offices and concentrate in
one single node multi-ring features (evolution of 1670SM), cross-connect functionalities
like restoration and GMPLS (evolution of 1674 Lambda Gate), as well as data
functionality (along the lines of OMS ISA features). All Central Office required
transport functions are integrated in one node. This provides operators with full network
flexibility at a minimum cost.
Weight and Dimensional Characteristics
Equipment Type No Dimensions Weight

depth x width x height
[in mm]
Rack 1 300 D x 600 W x 2200 H 49 kg
inclusive TRU
OED 1662SMC 1 250 D x 470 W x 390 H 27 kg
fully equipped
OED 1670SM 1 280 D x 533 W x 850 H 65 kg
fully equipped
Main 1678 MCC/LO 1 294 D x 533 W x 575 H 60 kg
fully equipped
Rack (Optinex) 1 300 D x 600 W x 2200 H 49 kg
inclusive GTRU
Extension of system lifetime

The product is designed to ensure an outstanding quality of service through very high
traffic transmission, connection and protection performances and minimum service
interruption.
The life utility is at least 5 years. This means that maintenance will be assured for at least
5 years.
The system architecture facilitates future extendibility and upgradeability:
• On-site configuration changes as e.g. extension of the node traffic capacity without
re-cabling of interconnections.
• Implementation of new features and functionalities by remote Software download.
The terms and conditions of warranty, service availability and spare parts availability are
individually agreed between Alcatel-Lucent and the customer and are part of the relevant
contractual commitments.
...................................................................................................................................................................................................................................
ECO Declaration
...................................................................................................................................................................................................................................
Power consumption
The product is designed for low power consumption. Developing new components with
very high integration density and low voltage supply leads to a significant reduction of
power consumption.
Depending on the number and type of I/O ports the power consumption may vary in a
wide range. The power consumption of the several boards is shown in the following table.
Table 7-21 Power Consumption
Power
Main LO ext. OED OED
Configuration of PBAs consumption
1678 MCC Shelf 1670SM 1662SMC
[W] (per item)
1678 MCC Shelf 0 x x
Matrix 640 Gbit/s 130 x
LAX40 75 x
LAX20 56 x
FLCCO GI enhanced 37 x
FLCSERVICE enhanced 37 x
Power Supply Filter 18 x x
Termination Bus 2.5 x x
16xSTM-1 53 x
16xSTM-1/4 56 x
4xSTM-16 56 x
8xSTM-16 56 x
16xSTM-16 56 x
LAC40 76 x
Opto TRX SFP I/S/L-16 1.2 x x1 x1
1xL-64.2 84 x
1xV-64.2 88 x
1xU-64.2 92 x
4xSTM-64 XFP 75 x
2xSTM-64 XFP 63 x
Opto TRX I64.2 XFP 2.5 x
Opto TRX S64.2 XFP 3.5 x
Opto TRX XFP P1L1–2D2 (80 km) 3.5 x
4xGE 58 x
...................................................................................................................................................................................................................................
ECO Declaration
...................................................................................................................................................................................................................................
Table 7-21 Power Consumption (continued)

Power
[W] (per item)
8xGE 58 x
16xGE 60 x
2x10GE 95 x
4x10GE 150 x
Step-up Converter in GTRU 50
Bypass module in GTRU 0.5
ISA–ES64 Server Board 148 x
Opto TRX XFP 10GE–Base S 2.5 x
Opto TRX SFP S/L–4 1 x
Opto TRX SFP S/L–1 1 x x
Opto SFP CWDM 1.2 x
Opto SFP STM–16 DWDM 1.4 x
Elect. TRX SFP STM–1E 1 x
Opto TRX XFP DWDM 3.5 x
1678 MCC FA 70 x x
LA switch (separate shelf) 35
LA20 90 x
LX160 130 x
ALM 3 x
1670SM Shelf 0 x
CO GIHC 12 x
Matrix Hi-Cap 100 x
Termination Bus 1670 1.5 x
HCLI KE 24 x
2x140/STM-1 opt./elect. Adapter 0.5 x
4x140/STM-1 opt./elect. Port 12 x
16xSTM-1 opt./elect. Port 25 x
16xSTM-1 electrical Access 15 x
2xSTM-4 Access 3 x
4xSTM-4 Port 24 x
HPROT16 0.5 x
12xSTM-1 opt. Access compact 22 x
...................................................................................................................................................................................................................................
ECO Declaration
...................................................................................................................................................................................................................................
Table 7-21 Power Consumption (continued)

Power
[W] (per item)
16xSTM-1 opt. Port compact 12 x
1670 FA Unit 30 x
1662SMC Shelf 0 x
CO GI 6 x
T_Bus 2 x
Access 63x2Mbit/s 2 x
63x2Mbit/s PORT 12 x
LPROT 1.2 x
SY TH16 50 x
FA Shelf 0 x
FA Unit 16.5 x
Notes:
1. Opto TRX SFP I–16 and Opto TRX SFP S–16 only.
Radio frequency emission

Regarding conformance with radio frequency emission requirements, the product
complies with:
• European directive 89/336/EEC (EMC-directive)
• ETS 300 386 V1.3.2 (Ed05/2003)
Acoustical noise
The acoustical noise level of the product measured according to ISO 7779 and ISO 3745
was 7.93 bels.
Materials
The product does not contain:
• Asbestos,
• Cadmium,
• Mercury,
• Ozone depleting substances, according to those categories that are already banned in
the Montreal protocol,
• Chloroparaffins with chain length 10-13 C atoms, chlorination greater than 50%
contained in mechanical plastic parts heavier than 25g,
• Lead contained in mechanical parts heavier than 25g,
...................................................................................................................................................................................................................................
ECO Declaration
...................................................................................................................................................................................................................................
• Polychlorinated biphenyls (PCB) or polychlorinated terphenyls (PCT),

• Polybrominated biphenyls and their ethers (CAS no. 32534-81-9, CAS no.
32536-52-0, CAS no 1163-19-5, CAS no. 13654-09-6) contained in mechanical parts
heavier than 25g,
in concentrations exceeding the natural background levels.
The system cabling is designed for reduced halogen content.
Disassembly
The product is designed for easy disassembly, by using screws and rivets for mechanical
assembly of racks and modules. The variety of types of screws is minimized. o
particular tools are needed for the disassembly of the racks and shelves/subracks. The
disassembly process depends on the respective recycling methods and can be derived
from the delivered assembly instructions of the product.
Batteries
The product requires no backup batteries.
Packaging
The packaging of the product complies with the directive 94/62/EEC concerning
packaging and packaging waste. Depending on the means of transportation the racks are
packed in a cardboard or wooden box, which can easily be recycled after use.
Environmentally harmful materials are not used for packaging. The packaging materials
are marked according to ISO 11 469. If required by the customer and agreed by both
parties, Alcatel-Lucent can take care of the proper disposal of all packaging materials.
Take back information
On request of customers, Alcatel-Lucent can take care of the take back of depreciated
equipment and of the ecological safe and appropriate disposal under conditions to be
agreed.
For that purpose Alcatel-Lucent co-operates with qualified companies.
Documentation
In order to reduce paper consumption for Customer Documentation, Alcatel-Lucent
delivers the Generic Customer Documentation as a CD-ROM. The CD-ROM contains
interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance
Manuals and User Guides. This allows the operator to put the documentation on a server
accessible by all relevant people in the organization without any additional paper copies.
Additionally more specific documentations as e.g. information about products and
solutions, services and support, training events etc. will be provided by means of
Alcatel-Lucent website accessible by all customers. This will allow distribution of
up-to-date information very quickly and without wasting natural resources.
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
Numerics
1320 CT
see “Alcatel-Lucent 1320 Craft Terminal” (p. GL-1).
1353 NM
see “Alcatel-Lucent 1353 ode Manager” (p. GL-1).
...................................................................................................................................................................................................................................
A Acknowledgment
When an alarm is taken into account by the application, the operator has to acknowledge it to
point out that he has seen it and that he will react in the right way. During alarm configuration it is
possible to set a maximum delay for alarm acknowledgement. The operator can decide whether or
not alarm clearing has to be acknowledged.
Administrator
A user who has access rights to all the Management Domains of the Craft Terminal product. An
administrator has access to the whole network and to all the management functionalities.
Alarm
An alerting indication to a condition that may have an immediate or potentially negative impact
on the state of an equipment or the Craft Terminal. An alarm is characterized by an alarm begin
and an alarm end.
Alarm Severity Assignment Profile

Function allowing the assignment of severities to the alarms depending on their probable causes.
Alarm Status
Identifies the type and severity of an occurring alarm.
Alcatel-Lucent 1320 Craft Terminal (1320 CT)

The Alcatel-Lucent 1320 CT is an element-management application that provides network
operators with facilities for local or remote setup, and for continuous field maintenance of
Alcatel-Lucent's transmission network elements.
Alcatel-Lucent 1353 Node Manager (1353 NM)

The Alcatel-Lucent 1353 M is working at Element Management Layer (EML). It is a global
element management platform that offers a comprehensive and flexible solution for operating,
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal GL-1
Glossary
...................................................................................................................................................................................................................................
administrating, maintaining and provisioning ext Generation SDH/SO ET/WDM networks

comprised of Optical Multi-Service odes (OMS ), Optical Multi-Service Gateways (OMSG),
Integrated Service Adapters (ISA) modules (for ATM, Ethernet, MPLS), Digital Cross-Connects
(DXC), C/DWDM and microwave equipment.
The 1353 M:
• handles the physical configuration of the network resources.
• collects and processes the alarms emitted by the network elements to inform the operator
about necessary actions
• collects performance data of the network elements to allow preventive maintenance
• ensures the availability of the network resources.
Alcatel-Lucent 1353 SDH Element Manager (1353 SH)

The Alcatel-Lucent 1353 SH is an Element Management System (EMS) for equipment
configuration and surveillance. It is designed to meet the network element provisioning and
maintenance requirements. All the functions that it implements have been optimized with regard
to maintenance activities.
The primary functions of the Alcatel-Lucent 1353 SH fall within three management
domains:
• Alarm management, and related links to identify, easily and unambiguously, the source of the
problem in order to launch recovery actions. Alarms are grouped by severity and by
functional domain to provide the network operator with easier alarm recognition and
suggestions as to possible corrective actions.
• etwork element configuration.
• Direct control of the network elements, identifying and managing any communication
problems.
Alcatel-Lucent 1354 NP (1354 NP)

The Alcatel-Lucent 1354 P ( P: etwork Protection) is a management system working at
etwork Management Layer ( ML). It optimizes the use of the network resources and correlates
performance data to paths and provides statistics of the quality to paths.
Alcatel-Lucent 1354 Regional Manager (1354 RM)

The Alcatel-Lucent 1354 RM is an integrated, centralized, scalable and flexible network
management layer solution for the management of end-to-end transport services across
SDH/SO ET and WDM networks. Its features include point-and-click setup of paths, automatic
gathering of QoS data as well as advanced surveillance of integrated network services.
ALMAP
Alcatel-Lucent Management Platform
ASAP
Alarm Severity Assignment Profile
...................................................................................................................................................................................................................................
B Board
A board is part of an E. Boards are electronic cards that fit into slots in the E.
...................................................................................................................................................................................................................................
GL-2 Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6
Glossary
...................................................................................................................................................................................................................................
Bridge
The action of transmitting identical traffic on both the working and protection trails.
Bridge Request
A message sent from a tail-end node to the head-end node requesting that the head-end perform a
bridge of the working channels onto the protection channels.
Bridge Request status

A message sent from a tail-end node to all other nodes within the protection system indicating that
the tail-end has requested a bridge.
Bridge&switch node
The node that performs the bridge and switch function for a protection event. Where the bridge
and switch is performed on a per AU-4 basis, the node executing a bridge and switch of at least
one AU-4 is referred to as a bridge and switch node. ote that with a Transoceanic application, a
node in the switching status may not be a bridge&switch node, whereas a node in the
pass-through state may be a bridge&switch node. With the Classic application, only a request
node (see below) may be a bridge&switch node.
...................................................................................................................................................................................................................................
C CBS
Committed Burst Size
CIR
Committed Information Rate
Compact Disk Read Only Memory

Data saving support from which the information can only be read. Is useful for stocking data due
to its available memory space.
Concatenation
A procedure whereby a multiplicity of virtual containers is associated one with another with the
result that their combined capacity can be used as a single container across which bit sequence
integrity is maintained.
Craft Terminal
Workstation or Personal computer (PC) from which local address to a E is possible. It can be
used to configure or perform monitoring tasks on the E.
Cross-connection
Cross-Connections provide the network with the Routing Capabilities, this is the possibility of
routing one signal to a particular destination.
CSF
Client Signal Fail
CSPF
Constrained Shortest Path First
CT
Craft Terminal
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
CTP
Connection Termination Point
...................................................................................................................................................................................................................................
D Digital Communication network

Communication etwork in which the transmission of data is done in a digitized format.
DPR
Data Plane Routing
...................................................................................................................................................................................................................................
E Element Management Layer (EML)

This application is responsible for the configuration and management of etwork Elements.
Embedded Communication Channel

Communication channel used in conjunction with packet commuting networks (X25) to manage
distant SDH networks. These communication channels are related to the QECC protocols.
Equipment Protection Switching (EPS)

Used to provide protection for cards within an equipment to protect traffic in the event of card
failure.
ETS
Ethernet Transport Services
Extra traffic
Traffic that is carried over the protection trail when it is not used for the protection of working
traffic. Extra traffic is not protected and is preempted when the protection trail is required to
protect the working traffic.
...................................................................................................................................................................................................................................
F Filter
They are related to the alarms or events generated on a E or internally within the Craft Terminal
itself. They can be configured by an operator to reject specified types of notifications and limit the
processing that is applied to them.
FLC Light
This cost reduced FLC variant is introduced for small system configurations (1 rack only). The
FLC Light is equipped with a DCR processor module only. The EM processor module is replaced
by an IDE disk controller module.
Flushing
This deals with logs. When a log is flushed, all its records are deleted.
Functional Access Domain

It defines the range of functions which are available to a specified user.
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
G Gateway Network Element

It is a etwork Element devoted to the control, from the OS, of those Es providing a QECC
interface. To do this it uses a QB3 interface and performs the QB3 ↔ QECC conversion.
GPI
General purpose input
GPO
General purpose output
GUI
Graphical User Interface
...................................................................................................................................................................................................................................
H Head End
ode executing the bridge (adjacent along the direction where a failure is present).
History Report
This function enables operators to get information concerning performances, security or alarms on
entities composing the network, or on the network itself. The operator specifies the time period
for which he requires the report.
Human Machine Interface

It is the graphical user interface application through which the operators interact with the system.
...................................................................................................................................................................................................................................
I Idle
A node that is not generating, detecting or passing-through bridge requests or bridge request status
information.
Information Manager
Processes used by the Craft Terminal that are the functional part of the Craft Terminal
applications.
Intermediate Node
The node that is not a request node. It is always in the pass-through state. If such a node executes
bridge and switch of at least one AU-4 it is also a bridge&switch node.
International Telegraph and Telephone Consultative Committee

Standard organization for telecommunications. ow called the ITU-T (International
Telecommunication Union).
Isolated Node
A single node that is isolated from a traffic perspective by ring switches on each of its two spans
by its adjacent nodes.
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
L LAC
Local Access Control
LAPD (Link Access Procedure in the D channel)

Protocol used on the data link layer (OSI layer 2) according to the ITU-T Rec. Q.921.
Line Terminal
A line terminal is the end point of a communication link. It is used to transmit or receive signals.
They can undertake signal conversion functions (adapting a signal to two different transmission
media) or multiplexing/demultiplexing functions.
Logs
Logs are files used to store history data concerning the incoming notifications, operator
commands and system alarms. The size of the log can be configured.
...................................................................................................................................................................................................................................
M Management Domain
The Craft terminal product is partitioned into management domains for functional purposes. Each
management domain is associated with functionalities that enable the operators to manage the
Es.
Management Information Base (MIB)

Describes all the managed objects controlled by the system and is used as a data base pertaining
the configuration of the equipment.
Media Access Control Address

Represents the Level 2 address for Local Area etworks.
Megabits per second

Unit that corresponds to the transmission of 106 bits every second.
Mis-connection
A condition in which traffic destined for a given node is incorrectly routed to another node and no
corrective action has been taken.
MPLS
Multi-Protocol Label Switching
MSSPRing channels
The range of channels that are part of the MSSPRing operation (i.e. the whole of the working and
protection channels).
Multiplex Section
In general, represents the section containing the multiplexed signals.
Multiplexer
Equipment used to combine several signals to produce a single signal at a higher transmission rate
and to decompose it back to the smaller rate signals.
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
MultiService Node
Equipment that can be configured as a Multiple Line Terminal Multiplexer or as an Add/Drop
Multiplexer or as a Mini local cross-connect.
...................................................................................................................................................................................................................................
N Network Access Domain

Defined as a set of etwork Elements. ADs are used to define the set of etwork Elements that
a user can manage.
Network Element (NE)

Either a telecommunication equipment or groups parts of a Telecommunication etwork. Have
characteristics compliant with ITU recommendations.
Network Element Synthesis

Common Craft Terminal view, displayed to the operator after the Craft Terminal start-up. It
manages the supervision and login of the E, accessing the User Service Manager functions.
Network Management Level

Designates the management functions performed on networks elements assembled in a network.
NML
etwork Management Layer
Notification
Spontaneous data received by the system concerning a E.
NPOS
etwork Protection Operating System
...................................................................................................................................................................................................................................
O OED link
A link between the 1678 MCC main shelf and an Optical Edge Device (OED).
Operation System
A system dedicated to the supervision of Es in a standard way, using protocols and interfaces. It
offers to the operator a set of functions necessary to supervise the Es. The 1353 M is an
Operation System.
Operator
The end-user of the Craft Terminal. He supervises E or part of the network that is dependant on
his user profile.
Optical Edge Device

The 1670SM and 1662SMC are called Optical Edge Devices. They are used in the 1678 Metro
Core Connect (MCC) to provide additional I/O ports.
...................................................................................................................................................................................................................................
P PDA
Portable Device Application
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
Physical Interface
Electrical or Electrical/Optical transformers that decouple the line signals and adapt the form of
signal for further transmission. This functional block also manages clock extraction, signal loss
monitoring and loopback functions.
PIR
Peak Information Rate
PM
Performance Monitoring
Port
A physical point at which the etwork Element can be attached to a transmission medium. A port
is either a termination point or a source point.
...................................................................................................................................................................................................................................
R Repeater
Equipment used to regenerate a signal when it has travelled a long distance.
...................................................................................................................................................................................................................................
S SDH
Synchronous Digital Hierarchy
Session
A session is a temporary association between an operator and the Craft Terminal. A session
always begins with the identification and authentication of the operator (the login phase) and ends
with the exit of the operator from the Craft Terminal (the logout phase).
Severity
Linked to alarms, severities indicate the magnitude related to the failure.
Small Computer Serial Interface

The Small Computer System Interface is an American ational Standard for interconnecting
computers and peripheral devices. The SCSI standard includes specifications for a variety of
device types.
SNMP
Simple etwork Management Protocol
STC
State changes
...................................................................................................................................................................................................................................
T TDM
Time Division Multiplexing
Telecommunication Management Network

Defines the concept of interoperable management of T s. They provide an organized network
structure to achieve the interconnection of the different components of the T and the services to
process the information.
...................................................................................................................................................................................................................................
Glossary
...................................................................................................................................................................................................................................
Telecommunication Network
Describes the network to be managed. Provides the transmission, the transport and the switching
supports to the interconnected etwork Elements.
Terminal Point
Describes either the origin or the termination of a signal in an equipment. Is related to a port.
Thresholding
This is the assignment of a specified value to monitored parameters (for example Bit Error Rates)
that, when exceeded, generate trouble indications.
TTP
Trail Termination Point
...................................................................................................................................................................................................................................
U User Profile
Identifies the functionalities of the Craft Terminal to which a user has access. A finite number of
predefined user profiles is determined by a fixed set of FADs. To give user access to Craft
Terminal functionality, the administrator must assign a profile to a sole user account by choosing
one among the predefined profiles installed with the Craft Terminal.
User Service Manager

These are presentation processes used by the Craft Terminal to manage the Human Machine
Interface and facilitate the interaction with the product, to configure, check and monitor the Es.
...................................................................................................................................................................................................................................
W WDM
Wavelength Division Multiplexing
Wrapping
Wrapping is the technique that enables the most recent entries in a file to replace the oldest when
a file is full.
...................................................................................................................................................................................................................................
Z ZIC
Zero Installation Craft
...................................................................................................................................................................................................................................
Index
Numerics configuration possibilities, 3-3 fault

1000BASE-SX, 2-6 connection LED, 5-4
1+1, 2-15 main shelf - 1670SM shelf, .............................................................
1:1, 2-15 3-99
G GASO / GMPLS support, 1-13
1662SMC shelf main shelf - lower order
extension shelf, 3-74 GMPLS, 2-17
basic board functions, 3-125
cross-connections, 2-11 GMRE, 2-17
basic equipment, 3-124
.............................................................
CT
part list, 3-130
Craft Terminal, 5-2 H HMU
system configurations, 3-126
............................................................. Housekeeping Monitoring
units front view, 3-133 Unit, 3-10
D data interfaces, 1-13
1670SM shelf hot pluggable, 2-21
DCU
basic board functions, 3-91 HUB STM– configuration, 1-16
Dispersion Compensation Unit,
basic equipment, 3-90 .............................................................
3-8
configuration rules, 3-93
............................................................. I interface
connection to main shelf, 3-99
E EPL Ethernet, 2-6
I/O interfaces, 3-92
Ethernet Private Line, 2-12 operations, 2-8
part list, 3-102
equipment, 2-22 power, 2-9
physical configuration, 3-88
Equipment protection, 2-20 timing, 2-7
system configurations, 3-93
equipment view transmission, 2-4
units front view, 3-106
main shelf, 1-8 inventory, 2-22
.............................................................
.............................................................
Ethernet interface, 2-6
A add/drop multiplexer, 1-16
EVPL L LCAS
aggregation, 1-13
Ethernet Virtual Private Line, Link Capacity Adjustment
applications, 1-12 2-12 Scheme, 2-12
............................................................. ............................................................. LEDs
C circuit packs F faceplate circuit pack, 5-4
faceplates, 5-4 circuit pack, 5-4 Linear APS, 2-15
configuration, 1-16 LEDs, 5-3 linear drop–insert, 1-18
...................................................................................................................................................................................................................................
3AG 24683 AAAA R4.6 Alcatel-Lucent – Internal IN-1
Index
...................................................................................................................................................................................................................................
lower order extension shelf operations interface, 2-8 .............................................................
configuration rules, 3-69 optical interface module, 2-21 T terminal multiplexer, 1-16
connection to main shelf, 3-74 Optical signal-to-noise ratio timing interface, 2-7
(OS R), 2-13
equipment front view, 3-67 Timing Marker, 2-26
OS R
part list, 3-77 transmission interface, 2-4
See: Optical signal-to-noise
physical configuration, 3-65 ratio .............................................................
units front view, 3-81 .............................................................
V virtual concatenation, 2-12
LPT P physical configuration visible alarms, 5-3
Link Pass Through, 2-12 1662SMC shelf, 3-123
.............................................................
1670SM shelf, 3-88
M main rack, 3-7 lower order extension shelf,
main shelf 3-64
configuration rules, 3-19 main shelf, 3-11
connection to 1670SM shelf, OED shelves, 3-86

3-99 point–to–point links, 1-18
connection to lower order power interface, 2-9
extension shelf, 3-74
product
equipment front view, 3-16
development, 6-2
part list, 3-30
.............................................................
physical configuration, 3-12
Q quality policy, 6-1
units front view, 3-39
.............................................................
management interfaces, 1-3
R reliability
meshed topology, 1-18
product, 6-1
mixed configuration, 1-16
ring structure, 1-18
MS-SPRing, 2-14
See: Multiplex Section Shared .............................................................
Protection Ring
S services, 1-5
MSP, 2-15
SFP, 2-21
Multiplex Section Shared
Protection Ring (MS-SPRing), slide-in module, 2-21
2-14 Small Form Factor Pluggable, 2-21
multiplexing scheme, 1-5 S CP, 2-16
multirack configurations, 3-7 SSM, 2-26
............................................................. Sub- etwork Connection
Protection
N network topologies, 1-18
S CP, 2-16
.............................................................
Synchronization, 2-24
O OED integration, 1-15
OED racks, 3-7

...................................................................................................................................................................................................................................
IN-2 Alcatel-Lucent – Internal 3AG 24683 AAAA R4.6

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Proprietary – Use pursuant to Company instruction

1678 Metro Core Connect (MCC) | Release 4.6

Copyright © 2009 Alcatel-Lucent. All rights reserved.

ot to be used or disclosed except in accordance with applicable agreements.

About this document

Intended audience .................................................................................................................................................................... xxix

Conventions used ..................................................................................................................................................................... xxix

Related information .................................................................................................................................................................. xxx

Technical support ..................................................................................................................................................................... xxxi

How to comment ...................................................................................................................................................................... xxxi

1678 MCC network solutions ............................................................................................................................................... 1-1

General Description .................................................................................................................................................................. 1-5

1678 MCC Main Shelf Equipment View .......................................................................................................................... 1-8

Insertion of the Equipment into the etwork ................................................................................................................ 1-11

Applications .............................................................................................................................................................................. 1-12

Configuration ............................................................................................................................................................................ 1-16

etwork Topologies ............................................................................................................................................................... 1-18

Overview ....................................................................................................................................................................................... 2-1

Overview ....................................................................................................................................................................................... 2-3

Synchronous/electrical interfaces ........................................................................................................................................ 2-4

Data interfaces ............................................................................................................................................................................ 2-6

Timing interfaces ....................................................................................................................................................................... 2-7

Operations interfaces ................................................................................................................................................................ 2-8

Power interfaces ......................................................................................................................................................................... 2-9

Overview .................................................................................................................................................................................... 2-10

Cross-connection features .................................................................................................................................................... 2-11

Ethernet features ...................................................................................................................................................................... 2-12

Forward error correction ....................................................................................................................................................... 2-13

Ring protection ......................................................................................................................................................................... 2-14

Line protection ......................................................................................................................................................................... 2-15

Path protection .......................................................................................................................................................................... 2-16

Restoration - Support of the GMPLS Protocol ............................................................................................................. 2-17

Overview .................................................................................................................................................................................... 2-19

Equipment protection ............................................................................................................................................................. 2-20

Optical interface modules ..................................................................................................................................................... 2-21

Equipment reports ................................................................................................................................................................... 2-22

Synchronization and timing

Overview .................................................................................................................................................................................... 2-23

Timing features ........................................................................................................................................................................ 2-24

Timing protection .................................................................................................................................................................... 2-25

Timing interface features ...................................................................................................................................................... 2-26

3 Topologies and configurations

Overview ....................................................................................................................................................................................... 3-1

Configuration Possibilities ..................................................................................................................................................... 3-3

Rack Configuration for SO ET markets .......................................................................................................................... 3-6

LA Switches (LSX) ............................................................................................................................................................... 3-7

Dispersion Compensation Unit (DCU) .............................................................................................................................. 3-8

Housekeeping Monitoring Unit (HMU) ......................................................................................................................... 3-10

Physical configuration of the main shelf

Overview .................................................................................................................................................................................... 3-11

1678 MCC Main Shelf (SR78) ........................................................................................................................................... 3-12

Equipment Front View .......................................................................................................................................................... 3-16

Configuration Rules ............................................................................................................................................................... 3-19

Part List ....................................................................................................................................................................................... 3-30

Units Front View ..................................................................................................................................................................... 3-39

Physical configuration of the LO extension shelf

Overview .................................................................................................................................................................................... 3-64

Lower Order Extension Shelf ............................................................................................................................................. 3-65

Equipment Front View .......................................................................................................................................................... 3-67

Configuration Rules ............................................................................................................................................................... 3-69

Connection to the Main Shelf ............................................................................................................................................. 3-74

Part List ....................................................................................................................................................................................... 3-77

Units Front View ..................................................................................................................................................................... 3-81