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Peripheral Coarse Grain Formation in High Silicon Containing AlMgSi Alloys

Yusuf Demirci1, Zafer Zorlu1, S. Mutlu Ayan1, Kemal Çakır1, Özgül Keleş2
1
Asas Aluminum Tic. A.S., Kucucek Mevkii Akyazı, 54440, Sakarya-TURKEY
2
Department of Metallurgical and Materials Engineering, Istanbul Technical University, Maslak,

34469, Istanbul- TURKEY

Abstract

AlMgSi aluminum alloys are prefered for structural applications in automotive, railway and aerospace
industries. The quality of products, in terms of mechanical properties and surface quality, are very
vital. Peripheral coarse grain growth (PCG) structure is one of surface imperfections that result in low
machinability, mechanical properties and surface appearance. PCG is generally observed in high-
strength aluminum alloys.

In this study, alloy composition, die design and extrusion process parameters have been investigated
to understand the major factors effecting PCG structure in hard aluminum alloys and retarding PCG
formation. The recrystallized layer thickness was examined using optical and electron microscopy,
the hardness of the layer was measured. Significant improvement on PCG has been obtained by
changing die design and alloy composition.

Keywords: AlMgSi aluminum alloys, Peripheral coarse grain growth, recyrstallization

Introduction

In todays competetive world social and economic life of countries mainly depend on communication
and transportation. Increasing demands and necessities on commute, travel and transporting
manufactured goods from one place to another compel governments to make invesments on
transportation sector. Automotive, aerospace, railway industries have been working on mainly
providing reliable, faster, enviromental friendly, and safe design solutions to meet these demands
and requirements.

Aluminum one of the material which fullfill many of design criteria especially in the field of structural
applications due to its high specific strength and being produced using versatile manufacturing
techniques such as casting, rolling and extrusion.

High strength AlMgSi alloys have been used in extrusion process for the production of structural
applications. Mechanical properties and the surface quality of structural extruded aluminum
products are vital for customers. Due to the nature of extrusion process- high strain and strain rates
at elevated temperatures-there is always a risk of inhomogenous grain structure on the surface of
extruded aluminum alloys. Understanding the response of high strength aluminum alloys under hot
deformation governs the mechanical and surface properties of materials a results of changing
microstructure [1, 2].

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Microstructural developments in these alloys are affected by alloy composition, dynamic restoration
and hardening mechnanisms. The main alloying elements in high strength alloys are Magnesium (Mg)
and Silicon (Si). The strength in these alloys is a results of Mg2Si and the 1.73: 1 Mg/Si ratio is
required for the formation of Mg2Si phase. Other elements such as Manganese (Mn) and Chromium
(Cr) are used for retarding recrystallization to control grain growth. Several recyrstallization
mechanism could be seen in aluminum extrusion namely, static, dynamic and geomeric
recrystallization. Peripheral coarse grain growth (PCG) structure is one of surface imperfections that
result in low machinability, mechanical properties and surface appearance. Peripheral coarse grain
growth is generally observed in high-strength aluminum alloys[3-5].

In this study, alloy composition, die design and extrusion process parameters have been investigated
to understand the major factors effecting PCG structure in hard aluminum alloys for retarding PCG
formation. The recrystallized layer thickness was examined using optical and electron microscopy,
the hardness of the layer was measured. Significant improvement on PCG has been obtained by
changing die design and alloy composition.

Experimental

Aluminum billets having two different compositions were cast using Direct Chill (DC) casting
technique. The dimension of the cast billet was 355mm diameter and 6,5m length. The chemical
compositions of the billets were analyzed by utilizing optical emission spectroscopy (ARL 3465).
Mainly Cr content was changed. The compositions of the alloys are given in Table 1. The average
silicon contents in the billets were 2.7 for high silicon contents. The chromium amounts were 0.017%
and 0.068%.

Table 1. The chemical composition for cast billets

Alloy Si% Fe% Cu% Mn% Mg% Zn% Ti% Cr%

Low Cr 2.4 0.279 0.041 0.562 0.885 0.061 0.02 0.017


High Cr 2.5 0.276 0.045 0.607 0.819 0.036 0.034 0.068

The billets were homogenized in a batch furnace. Two different homogenization temperatures were
used (530° C and 550° C). All billets were kept in the furnace for 600 minutes. The cooling rate was in
the range of 600-650 °C/hour. Preheating temperature was 400°C in a gas furnace, and the billet was
exposed to induction heating at 480°C for 100sn.The billets were cut in 1100mm for extrusion and
preheated in the gas and an induction furnace sequentially. The extrusion was conducted in a 55MN
press. The parameters were given in Table 2. The extrusion ratio was 46. Two hollow dies having flat
and conical bearings were used. The dies were cooled using liquid nitrogen. Different extrusion rates
of 2.5, 5 and 7 were utilized. The profile was water-quenched.

Extruded parts were etched using Keller’s agent for macro structural analyses. For microstructural
analyses the samples taken from extruded profiles were ground using sand papers of 180, 600, 1200,
2500 and 4000 and polished 3µm cloth using 9 and 1 µm silica. Etching was made in 60ml water,

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10gNaOH, and Calcium Hegza Cyanoferrat solution for 2 minutes. Recrystallized layer thicknesses
were examined by optical (Nikon Epilips MA200) and electron microscopy (FEG-SEM 7000F). The
microhardness (Future Tech FM700) was measured under the load of 300g for 10s.

Table 2. Extrusion process parameters

Alloy Homogenization Die Bearing Extrusion


Temperature Design Sped
(°C) (m/dk)
Low Cr 550 Chocked 5
High Cr 550 Chocked 5
High Cr 530 Chocked 2.5
High Cr 530 Flat 2.5
High Cr 530 Choked 5
High Cr 530 Choked 7

Results and Discussion

The effect of chemical composition and extrusion process parameters.

Macrostructural images of the extruded profile obtained from a flat die were given in Figures 1 a, b
and c. In Figure 1a shows the top view of the surface. While large slightly elongated grains were seen
at the edges and through the center, the sizes of grains were smaller and the grains were more
globular. In the cross sectional microstructure, it is seen that the large grains on the surface were
seem to have shallow depths, however small grains had large recrystallized layer (see Figure 1b). In
Figure 1c the schematic was given to show the relation between the appearance of grains from the
surface and the cross section of the extruded profile. And, as expected large grains have shallow
depths than those of small grains. Due to possible high surface friction at the edges during extrusion
static and dynamic recrystallization could occur and result in recrystallization and grain growth. It is
well known that, both deformation and elevated temperature play a great role in recrystallization in
aluminum. Stored energy due to deformation and the elevated temperature had an effect on the
PCG layer. As an increase in stored energy, new grains start to form and grow. Having large deformed
grains show the predominance of dynamic recrystallization to static recrystallization [4-6].

The macrostructural images of the extruded profile produced by using a conical and a flat die were
given in Figures 2a and b. In Table 3, the thicknesses of PCG layers for each trial were given.

Elongated fibrous grains were seen in the top view (see Figure 2a). The PCG layer thickness measured
had almost no recrystallized layer. Parson et. al. [7] had seen that increase in bearing length and
chocked angled had reduced the generation of PCG grains. With the help of chocked angle dies, it is
possible to reduce the deformation as well as temperature due to friction. They both result in less
stored energy causing elongated fibrous grain structure.

Added to this, it is well known that Cr and Mn have an influence on the recrystallization temperature
[1,2]. As seen in Table 3, even in the case of high homogenization temperatures high Cr containing
alloys showed relatively thinner PCG layer. And, in the case of flat die bearing extrusion profiles, the
layer thicknesses were increased in the center as well as at the edges.

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Table 3: PCG layer thicknesses measured.

Alloy Homogenization Die Bearing Extrusion Center 1 Edge 1 Edge 2


Temperature Design Rate (µm) (µm) (µm)
(°C) (m/dk)
Low Cr 550 Conical 5 632 537 750
High Cr 550 Conical 5 452 401 423
High Cr 530 Conical 2.5 0 19 106
High Cr 530 Flat 2.5 412 41 23
High Cr 530 Conical 5 278 152 63
High Cr 530 Conical 7 542 333 263

Left Center Right

(a)

y
Left Center Right
x

(b)

(c)

Figure 1. a. Top view of low Cr containing alloy. b. The cross sectional view of low Cr containing alloy.
c. Schematic of recrystallized layer.

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(a) (b)

c d

Figure 2. The surface image of the extruded part and high Cr containing alloy. a. Sample taken from
the flat bearing die. b. Sample taken from the choked angled bearing die. c. Cross sectional
microstructure of profile produced by the flat bearing die. d. Cross sectional microstructure of profile
produced by the choked angled bearing die.

The surface hardness profile of the extruded parts were given in Figure 3. Low hardness values were
gathered at edges while high values were achieved in the center of the parts. Large grains showed
low hardness values as expected. The in-depth hardness profile of all samples taken from surface
center was given in Figure 4. The hardness values increased from the surface through the center of
the parts.

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Figure 3. The surface hardness profile of all extruded part.

Figure 4. The in-depth hardness profile of all extruded parts.

In Figures 5 a and b, the cross sectional microstructure of extruded parts subjected to 530 and
550°C were given. In case of 550°C homogenization with an extrusion speed of 5m/min, the depth
of central grains was around 452µm and the depth for the parts homogenized at 530°C and
extruded at 5m/min was around 300µm. In Figures 6 a, b and c SEM images taken from an
extruded profile homogenized at 530°C and extruded at a speed of 5m/min were illustrated.
Homogenization temperature effects the both density of dispersoids and the reycrstallization
resistance. Royset et. al [8] have found that low homogenization temperature significant
reduction in PCG layer.

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(a) (b)

Figure 5. Microstructures of alloys investigated a. Extruded profile homogenized at 550°C , b.


Extruded profile homogenized at 530°C.

The sizes of intermetallics close to extrusion surface were slightly larger and distributed sparsely
than those of central parts. EDS analyses were taken from the the intermetallics showed that the
particle number 1 had AlFeMgSi, particle 2 had AlFeMnSi and particle number 3 had Si (see
Figures 6 a, b and c).

(a)

(b) (c)

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Figure 6. The SEM images high Cr containing alloy homogenized at 530°C and extruded with a flat die
at a rate of 5m/min. a. PCG layer of the extruded part taken from the surface center. b. The
distribution of intermetallics in 1. Region. c. The distribution of intermetallics in 2. Region.

The Effect of Die Design and Extrusion Speed

The front view of a hollow die was given in Figures 7 a. A hollow die design was used. The bearing
shape was changed. One had a flat (see Figure 7b) the other had a choked angle ( see Figure 7c).

b c

Figure 7. a. The front view of a hollow die used. b. The part of the flat bearing die. c. The part of the choked
bearing die.

As seen in Table 3 the thickness of PCG layer was less than 100µm along the periphery of the
extruded profile produced using higher billet with a choked angled die. The microstructural
examination of extruded profile center was shown in Figures 8 a and b. The layer thickness was
around 30µm.

Center

Figure 8. a. The picture of the extruded part using chocked angled die. b. The crosssectional
microstructure of the extruded part showing the PCG layer thickness.

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The extrusion speeds were 2.5, 5 and 7m/min. In case of 2.5m/min speed appliedalmost no layer had
seen. Increasing extrusion speed had increased the PCG layer (see Figures 9 a, b and c). The
thicknesses were around 280µm and 550 µm respectively. Increasing extrusion speed rising the
friction and profile surface temperature resulting high stored energy.

b c

Figure 9. Microstructure of alloys investigated (a) Profile used extrusion speed of 2.5m/min ,(b)
5m/min, (c) 7m/min.

Conclusions

In this work, alloy composition, die design and extrusion process parameters have been investigated
to understand the major factors effecting PCG structure in high silicon containing aluminum alloys.
The interactions among alloy composition especially Cr content in the alloy, homogenization
temperature, die design and extrusion speed had a significant influence on the stored energy in
extrusion profile. Along the periphery of the profiles which have a high stored energy due to
deformation and elevated temperature trigger the recrystallization mechanisms namely static and
dynamic recrystallization. In this study, significant improvements had been obtained in PCG layer
morphology and following conclusions were made;

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- The addition of chromium and low homogenization in high silicon containing alloys had
reduced the PCG layer thickneses,

- Die bearing angle has a significant effect on the PCG layer. A decrease was seen in the layer
thickness.

- Increasing extrusion speed also increased the PCG layer thickness.

Acknowledgements

We would like to express our great apprecation to Safa Bayar Yavuz and Sabahattin Ara for their
great support in this work. And Onur, Gülbaba, Sefer Volkan Kubilay and Berk Yörüker for their help
during the trials and the characterization of the samples.

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