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G610-U15 Smartphone

Maintenance Manual

Issue 1.0

Date 2013-04-22

HUAWEI TECHNOLOGIES CO., LTD.

by kass
Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.


Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com

Email: support@huawei.com

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Maintenance Manual About This Document

About This Document

Author
Prepared by Tian Haitao Date 2013-04-22
Reviewed by Date

Approved by Date

Change History
Date Version Change Reason Changed Section Description Author

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G610-U20 Smartphone
Maintenance Manual Contents

Contents

About This Document .........................................................................................................................ii


1 Product Overview .............................................................................................................................. 1
1.1 Appearance ................................................................................................................................................................... 1
1.2 Product Specifications .................................................................................................................................................. 2

2 Applicable Scope and Precautions ................................................................................................ 3


2.1 Applicable Scope .......................................................................................................................................................... 3
2.2 Precautions.................................................................................................................................................................... 3

3 Exploded View.................................................................................................................................... 4
4 Component Layout ............................................................................................................................ 6
4.1 Main Board Components .............................................................................................................................................. 6
4.2 Speaker Sub-Board Components .................................................................................................................................. 9
4.3 Proximity Sensor FPC Components ........................................................................................................................... 10
4.4 Speaker FPC Components .......................................................................................................................................... 11
4.5 Component Lists ......................................................................................................................................................... 11
4.5.1 Main Board Components ......................................................................................................................................... 11
4.5.2 Speaker FPC Components ....................................................................................................................................... 14
4.5.3 Proximity Sensor FPC Components ........................................................................................................................ 15
4.5.4 Speaker FPC Components ....................................................................................................................................... 15

5 Software Upgrade ............................................................................................................................ 17


5.1 Upgrade Preparation ................................................................................................................................................... 17
5.2 Precautions.................................................................................................................................................................. 17
5.3 Installing the USB Driver ........................................................................................................................................... 18
5.4 Upgrading a Phone...................................................................................................................................................... 18
5.4.1 Performing a USB Upgrade ..................................................................................................................................... 18
5.4.2 Performing a mircoSD card Upgrade....................................................................................................................... 23
5.4.3 Upgrading Phones Simultaneously .......................................................................................................................... 27
5.5 Troubleshooting .......................................................................................................................................................... 32

6 Maintenance Tools .......................................................................................................................... 33


7 Disassembly Procedure .................................................................................................................. 35
8 Assembly Procedure........................................................................................................................ 39

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Maintenance Manual Contents

9 Circuit and Failure Analysis ......................................................................................................... 43


9.1 Solution Introduction .................................................................................................................................................. 43
9.2 Baseband Subsystem................................................................................................................................................... 44
9.2.1 Startup Management Circuit .................................................................................................................................... 44
9.2.2 Charging Management Circuit ................................................................................................................................. 50
9.2.3 Clock Circuit............................................................................................................................................................ 55
9.2.4 Memory Circuit........................................................................................................................................................ 58
9.3 RF Subsystem ............................................................................................................................................................. 59
9.3.1 Overall Introduction ................................................................................................................................................. 59
9.3.2 Transmit Channel ..................................................................................................................................................... 63
9.3.3 GPS Channel............................................................................................................................................................ 65
9.3.4 Wi-Fi Channel.......................................................................................................................................................... 66
9.4 Peripheral Circuits ...................................................................................................................................................... 67
9.4.1 LCD Circuit ............................................................................................................................................................. 67
9.4.2 Touchscreen Circuit ................................................................................................................................................. 70
9.4.3 Front Camera Circuit ............................................................................................................................................... 72
9.4.4 Rear Camera Circuit ................................................................................................................................................ 74
9.4.5 G-Sensor Circuit ...................................................................................................................................................... 76
9.4.6 Light Sensor Circuit ................................................................................................................................................. 78
9.4.7 Key Circuit............................................................................................................................................................... 79
9.4.8 Motor Circuit ........................................................................................................................................................... 81
9.4.9 Receiver Circuit ....................................................................................................................................................... 82
9.4.10 Microphone Circuit ................................................................................................................................................ 84
9.4.11 Speaker Circuit....................................................................................................................................................... 86
9.4.12 Headset Circuit ...................................................................................................................................................... 88
9.4.13 SIM Card Circuit ................................................................................................................................................... 90
9.4.14 microSD Card Circuit ............................................................................................................................................ 92
9.4.15 USB Port Circuit .................................................................................................................................................... 94
9.4.16 Wi-Fi Module Circuit............................................................................................................................................. 96
9.4.17 Bluetooth Circuit.................................................................................................................................................... 98
9.4.18 GPS Circuit ............................................................................................................................................................ 99
9.4.19 FM Circuit ........................................................................................................................................................... 100

10 Solder Points on the PCB and BGA Chips ............................................................................ 103


11 Functional Tests ........................................................................................................................... 105
11.1 Keys ........................................................................................................................................................................ 105
11.2 MMI Test................................................................................................................................................................. 105
11.2.2 Voice Call Test ..................................................................................................................................................... 107

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Maintenance Manual 1 Product Overview

1 Product Overview

1.1 Appearance
Figure 1-1 G610-U15

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Maintenance Manual 1 Product Overview

1.2 Product Specifications


Table 1-1 G610-U15 specifications

Item Description
Dimensions 141.5 mm x 73.6 mm x 9.9 mm (5.57 in. x 2.90 in. x
0.39 in.)

Technical standard UMTS/GSM


Frequency bands GSM: 850/1800/1900 MHz
UMTS: 850/1900 MHz

Weight About 180 g (with battery)


Type Bar type with touchscreen

Antenna Built-in
UIM Standard SIM card
Power supply 5 V, 1 A

Battery 2150 mAh Standby time: more than 120 hours


Li-polymer battery Talk time: more than 180 minutes (network
dependent)

Display Resolution 540 x 960 pixels


LCD type TFT
Color 16.7M

LCD size 5 inches


Interfaces Charging interface Micro USB port
USB interface Micro USB port

microSD card microSD card slot


interface

Headset interface 3.5 mm headset jack


Maximum B2/5:24 dBm(wired)
transmit G850:33dBm(wired)
power
G1800/1900:30dBm(wired)

Static <-108 dBm (wired); BER ≤ 0.001 (UE)


sensitivity
Temperature Operating temperature: –10°C to +45°C
Storage temperature: –40°C to +70°C
Humidity Operating humidity: 5% to 95% RH

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Maintenance Manual 2 Applicable Scope and Precautions

2 Applicable Scope and Precautions

2.1 Applicable Scope


This document provides maintenance instructions for technical support at Huawei authorized
service centers. Being Huawei proprietary, this document is accessible only for authorized
service centers. Although every effort was made to ensure the accuracy of the document,
errors may still exist. If you find any errors or have any suggestions, please report them
through Huawei service platform ComPartner.

2.2 Precautions
To obtain product and maintenance information, visit the Huawei service website. It is highly
recommended that you install the Huawei service platform ComPartner.
To obtain the ComPartner installation package, visit http://support.huaweidevice.com/service/,
search for ComPartner. You will find the ComPartner installation package.

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Maintenance Manual 3 Exploded View

3 Exploded View

Figure 3-1 G610-U15 exploded view

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Maintenance Manual 3 Exploded View

The components listed in Table 3-1 are structural parts of the phone and cannot be used as
reference when requesting spare parts.

Table 3-1 Components in the exploded view

No. Name Description Quantity


1 TP G610 TP 1

2 LCD G610 LCD 1


3 Front cover assembly G610 front cover assembly 1
4 Receiver G610 receiver 1
5 Proximity sensor FPC G610 proximity sensor FPC 1
6 Front camera G610 front camera 1
7 Speaker sub-board G610 speaker sub-board 1

8 Main board G610 main board 1


9 Rear camera G610 rear camera 1

10 Rear cover assembly G610 rear cover assembly 1


11 Battery G610 battery 1
12 Battery cover assembly G610 battery cover assembly 1

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Maintenance Manual 4 Component Layout

4 Component Layout

4.1 Main Board Components


Figure 4-1 Components on side A of the main board

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Maintenance Manual 4 Component Layout

U2403 RF multi-functional
component:
Fault symptom: signal
J902 USB connector reception failure
Fault symptom: charging
failure or USB detection X700 26 MHz crystal
failure oscillator
Fault symptom: startup
failure

U700 TD-WCDMA baseband


processing IC
Fault symptom: signal reception
failure

LCD backlight shielding


case
Fault symptom: LCD failure

Q302 triode
Fault symptom: charging
failure

J901 battery connector U401 processor


Fault symptom: startup Fault symptom: startup
failure failure
J1502, J1503, J1504, and
J1501 power and volume
keys
Fault symptom: startup
failure and volume key
failure

U201 PM IC
Fault symptom: startup
failure

U1801 memory
Fault symptom: startup
failure
U2200 4-in-1 chip Fault
symptom: FM, Wi-Fi,
Bluetooth, and GPS
failures

J1101 headset
connector
J1001 front camera Fault symptom: headset
connector failure
Fault symptom: front
camera failure

Figure 4-2 Components on side B of the main board

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Maintenance Manual 4 Component Layout

Main antennapad
Fault
symptom:Signal J808 SPK Sub
reception Faulure board
connector,Fault
symptom:SPK
Failure and motor
J1301 LCD failurereception
Connector,Fault Faulure
symptom:LCD
Failurereception
Faulure

SD Connector, SIM Connector,


Fault Fault
symptom:SD symptom:SIM
FailureFailurerec detection Failure
eption Faulure symptom:WiFi
GPSshielding: failure and GPS
J1002 camera
case fault failureFailurerece
connector, Fault
symptom:GPS ption Faulure
symptom:rear
FailureFailurerec
camera
eption Faulure
J2301 WIFI GPS failuresymptom:
antenna springs WiFi failure and
J801 Proximity
GPS
Fault sensor FPC
symptom:WiFi failureFailurerece
connector
ption Fault
Faulure
failure and GPS J1501 TP Microphone Fault
symptom:proximi
failureFailurerece conneetor Fault symptom:Sound
ty sensor
ption Faulure symptom::TP collection failure
failuresymptom:
failuresymptom: furing call
WiFi failure and
WiFi failure and sendsymptom:Wi
GPS
GPS Fi failure and
failureFailurerece
failureFailurerece GPS
ption Faulure
ption Faulure failureFailurerece
ption Faulure

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Maintenance Manual 4 Component Layout

4.2 Speaker Sub-Board Components


Figure 4-3 Components on side A of the speaker sub-board

J101 speaker sub-


board connector
U101 motor Fault symptom:
Fault symptom: speaker failure and
motor failure motor failure

Figure 4-4 Components on side B of the speaker sub-board

D101, D102, and D103


LEDs
Fault symptom: LED
failure

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Maintenance Manual 4 Component Layout

4.3 Proximity Sensor FPC Components


Figure 4-5 Components on side A of the proximity sensor FPC

U101 proximity sensor


Fault symptom: proximity
sensor failure

D101 tri-color LED


Fault symptom: tri-
color LED failure

Figure 4-6 Component on side B of the proximity sensor FPC

J101 BTB connector


Fault symptom: tri-color LED
failure and proximity sensor
failure

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Maintenance Manual 4 Component Layout

4.4 Speaker FPC Components


Figure 4-7 Components on the speaker FPC

J101 and J102 BTB


connectors
Fault symptom: motor
failure and speaker failure

4.5 Component Lists


4.5.1 Main Board Components
Table 4-1 Components on the main board

PN Description Component
03022BTG G610-U00,HD1G610MG,G610 WCDMA Handset Main
Board,Plan G,2*1

03010URW UMTS G610,HD1G610M,G610 Handset Main


Board,2*1

15010397 Schottky Barrier D1301


Diode,40V,1A,0.6V,SOD1608,5A,Terminal Dedicated

14240460 BTB J801 and J808


Connector,female,10Pin,0.4mm,0.9mm,SMT,Terminal
Dedicated
14240582 Card Socket,Battery connector,4PIN,Mid Mount,Side J901
Contact,2.50mm,With Plastic Peg,0.50mm,Terminal
Dedicated
14240656 IO Connector,Micro_B Type Female,5pins,Side Plugging J902
Type,SMT,4 Dip,above PCB,Terminal Dedicated

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Maintenance Manual 4 Component Layout

14240181 BTB Connector,Female,24Pin,0.4mm,SMT,Mating J1001 and


Height 1.0mm,Terminal Dedicated J1002
14240663 Headphone J1101
Connector,12.6*6.7*4.2,6pin,arc,SMT,cambered surface
2.5mm under board,Terminal Dedicated

14240496 BTB Connector,Female,24Pin,0.4mm,SMT,Mating J1301


Height 0.8mm,Terminal Dedicated

14240155 Card Socket Connector,SIM Card J1401 and


Socket,6pin,Horizontal,2.54mm,Without Lock,Without J1402
Hold Peg,Height 0.95mm,Terminal Dedicated

14240303 Card Block J1403


Connector,Micro-SD,8,PUSH-PULL,1.1mm,Detect PIN
51621023 J1501, J1502,
108-5785,Ground Spring,U1250 J1503, and
J1504
14240226 BTB Connector,Female,50Pin,0.4mm,Mating Height J1506
1.0mm,SMT,Width 3.74mm After Mating,Terminal
Dedicated

51621024 J1601, J1602,


WN9149-N83-7F-W,Antenna Spring,U1250
and J1610
51621274 J1611, J2301,
J2302, J3202,
DKBA8.382.0615,Main Antenna SMT Spring,C5600
J3203, and
J3204
14240004 Coaxial Connector,RF J3201
Switch,Straight,Female,SMT,Terminal Dedicated
10100565 Terminal Power L201, L202,
Inductor,0.68uH,+/-20%,1.8A,0.06ohm,2.0*2.0*1.2mm,S and L203
PL0202D,2.9A,Terminal Dedicated
10070019 LB1303,
EMI beads,+/-25%,1000ohm,1.25ohm,0.25A,0402 LB1304, and
LB1305
15020175 LED,180cd,white,350mA,2.0mm*1.6mm*0.7mm,Termin LED301
al Dedicated
22050091 MIC1101 and
Microphone,-44dB.,D4*1.5mm,wideband,terminal
MIC1102

15060238 MOSFET,N Channel,20V,0.7A,530mohm,6V,SC,75 Q201 and Q901


15050211 Transistor,PNP,20V,2.5A,545mW,320mV,TSOP-6,100S, Q302
Terminal Dedicated
12070061 Temperature Compensated TCXO2200
Oscillator,26MHz,+/-1.5ppm(max),+1.8V,+/-0.5ppm(ma
x),-40degC,85degC,Terminal Dedicated

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Maintenance Manual 4 Component Layout

39200503 Terminal Baseband process IC,PMIC,Input U201


range:3.4-4.3V;Charger input of up to 10V,TFBGA
39200524 Terminal Baseband process IC,WSCDMA/GSM U401
BASEBAND PROCESSOR
MT6589M,1.2V/1.8V/2.8V/3.3V,TFBGA-515,Terminal
Dedicated
39200510 Terminal Baseband process U700
IC,WCDMA/HSDPA/HSUPA RF transceiver
MT6167,1.2V /1.8V/ 2.8V RF,HBGA-Terminal
Dedicated
38140098 Semiconductor U1201
Sensor,Accelerometer,LGA,3axis,Terminal Dedicated
39110762 Switching Regulators,dual channel backlight U1301
driver,2.7V~6.5V,30mA*2,1.2MHz,CSP-9L,Terminal
Dedicated

43140187 Interface Controller,TP IC,2.85V,UFBGA60, Terminal U1501


Dedicated
40060486 MCP,4GB(x8) U1801
eMMC,52MHz,1024KB,3.3V/1.8V,FBGA162,8Gb(x32)
LPDDR2,G610 Dedicated,Terminal Dedicated
39110756 Switching Regulators,DC/DC U2001
buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN

39210101 Terminal Baseband process IC,WLAN-BT-GPS-FM U2200


Transmitter and Receiver,2.3~5.5V,151pin WLCSP,
Terminal Dedicated

47990034 RF Impedance Converter,50:50 U2301


Balun,2300MHz~2700MHz,50:50,1.2dB
max.,0.5W,1608SMD,Terminal Dedicated
47090053 RF LNA,1575MHz,14dB min.,1.6dB U2302
max.,SOT886,Terminal Dedicated
47150274 RF Multi-Functional Component,Linear EDGE U3201
PAM(Polar
GPRS(2Tx+6TRx),824~849MHz/880~915MHz/1710~17
85MHz/1850~1910MHz,QFN,Terminal Dedicated
12020125 Crystal,0.032768MHz,12.5pF+/-30ppm,60/80kohm,3.2*1 X301
.5 SMD,Terminal Dedicate,ELOM,TS16949

12020268 Crystal X700


Oscillitor,26MHz,7.5pF,+/-10ppm,30ohm,3225,Terminal
Dedicated

15040393 Transient Suppression Diode,6V,25V,0.1w,3A,400um Z1401


15pin SMT,Terminal Dedicated

13030067 Ceramic Filter,2450MHz,1.8dB,20125,Terminal Z2301


Dedicated

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Maintenance Manual 4 Component Layout

13010180 SAW filter,1575.42MHz,0.9dB,1.4*1.1mm,for terminal Z2302


using only
13080106 Duplexer,1565~1607MHz/2400~2500MHz,0.8dB./0.9dB Z2303
.,13dB./18dB,1608,Terminal Dedicated
51624486 DKBA80200824,G610U-Shielding-Cpu-Frame,G610U J1609
51624490 DKBA80200828,G610U-Shielding-PMU-Frame,G610U J1608

51624492 DKBA80200830,G610U-Shielding-LCD J1603


LDO-Case,G610U
51624493 DKBA80200831,G610U-Shielding-GPS-Case,G610U J1605

51624494 DKBA80200842,G612C-Shielding-Charge-Case,G610U J1606


51624587 DKBA80201219,g610TD-Shielding-rf-Frame,G610 J1607
51624589 DKBA80201221, J1612
G610TD-Shielding-RF-Cover-2,G610TD
51624495 DKBA80200970,G610C-Shielding-B2B-Case,G610C J1604

13080175 Duplexer,1850~1910MHz;1930~1990MHz;,3dB.,3.7dB., U3302


45dB.,2016,Terminal Dedicated
47100621 RF Power Amplifying Module,1850~1920MHz,28dB U3301
typ. at Pout=27.5dBm for LTE,28.5dBm,QFN,Terminal
Dedicated
13080136 Duplexer,824~849MHz/869~894MHz,2.3dB.,2.5dB.,55d U3402
B./50dB.,2016,Terminal Dedicated-Balance
47100596 RF Power Amplifying Module,815~849MHz,28dB typ. U3401
at Pout=28.25dBm for
WCDMA,28.25dBm,QFN,Terminal Dedicated
13010258 1842.5MHz/1960MHz,2.8dB/3.0dB,50V,1814,Terminal Z3504
Dedicated

4.5.2 Speaker FPC Components


Table 4-2 Components on the speaker FPC

PN Description Component

D101, D102,
15020099 LED,0.045cd,White,5mA,0603,SMD,Terminal Dedicated
and D103

15040311 Transient Suppression Diode,6V,12V,50W,5A,SOD923 D104 and D105


BTB
14240460 Connector,female,10Pin,0.4mm,0.9mm,SMT,Terminal J101
Dedicated

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Maintenance Manual 4 Component Layout

L101, L102,
Mobile Dedicated,Chip Inductor,
L103, L104,
10100135 0.082uH,+/-5%,0.05A,3.50ohm,0201,Chip
L105, and
Inductor,Mobile Dedicated
L106

Terminal Chip
10100044 Inductor,0.082uH,+/-5%,0.15A,2.4ohm,0402,750000000 L107
Hz,Multilayer Inductor,Terminal Dedicated

Terminal Chip
10100047 Inductor,0.068uH+/-5%,0.6A,0.34ohm,0603,1700000000 L108 and L109
Hz,Wire Wound Inductor,Terminal Dedicated
Oscillating
32050032 Motor,SMT,2.7,75A,14000rpm,11mm*4.4mm*3.6mm,N U101
ull,28ohm

4.5.3 Proximity Sensor FPC Components


Table 4-3 Components on the proximity sensor FPC

PN Description Component
Chip Multilayer Ceramic
08070704 C101
Capacitor,6.3V,100nF,+/-10%,X5R,0201,TS16949

Chip Multilayer Ceramic


08070752 Capacitor,6.3V,0.22uF,+/-20%,X5R,0201,Terminal C102
Dedicated
LED,0.05cd/0.1cd/0.18cd,B(470)R(632)G(525)nm,20mA
15020111 D101
,SMD,Terminal Dedicated
BTB
14240459 Connector,male,10Pin,0.4mm,0.9mm,SMT,Terminal J101
Dedicated
Semiconductor Sensor,APS/ALS/IR
38140032 U101
Sensor,QFN8,Terminal Dedicated

4.5.4 Speaker FPC Components


Table 4-4 Components on the speaker FPC

PN Description Component
BTB
14240459 Connector,male,10Pin,0.4mm,0.9mm,SMT,Terminal J101 and J102
Dedicated

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G610-U20 Smartphone
Maintenance Manual 4 Component Layout

These component lists are for your reference only and subject to changes without notices. The
latest component lists are available in Huawei's BOM information system. If you have any
questions, contact technical support in your region.

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G610-U20 Smartphone
Maintenance Manual 5 Software Upgrade

5 Software Upgrade

5.1 Upgrade Preparation


Table 5-1 Items to be prepared for an upgrade

Item Description Remarks

Upgrade environment Computer Operating system: Windows XP or


Windows 7
USB cable
Upgrade file

microSD card 512 MB available space or more


Battery Ensure that the battery used for the
upgrade has sufficient power remaining.

Upgrade file Use the latest version for the upgrade.

Upgrade method USB upgrade microSD card upgrade is recommended.

microSD card
upgrade

5.2 Precautions
 To ensure that the upgrade is not interrupted, check that the battery has sufficient power
remaining.
 Upgrading the phone will have the user data erased. Back up the important data before
an upgrade.

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Maintenance Manual 5 Software Upgrade

5.3 Installing the USB Driver


Double-click Handset WinDriver1.3.exe on your computer desktop and follow the onscreen
instructions.

5.4 Upgrading a Phone


5.4.1 Performing a USB Upgrade
Step 1 Download the upgrade tool package SP_Flash_Tool_v3.1304.0.119-cust.rar. Check that the
version number is correct.

Figure 5-1 SP_Flash_Tool_v3.1304.0.119-cust.rar

Step 2 Decompress the package and double-click Flash_tool.exe in the package. On the displayed
dialog box, select USB MODE under Options and click the Download tab.

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Maintenance Manual 5 Software Upgrade

Figure 5-2 Flash_tool.exe in the upgrade tool package

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Maintenance Manual 5 Software Upgrade

Figure 5-3 Download tab page

Step 3 Decompress the upgrade package prestored on the computer. On the Download tab page,
click Scatter-loading.

Figure 5-4 Clicking Scatter-loading

Step 4 Select the MT6589_Android_scatter_emmc.txt file in the upgrade package and click Open.

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Maintenance Manual 5 Software Upgrade

Figure 5-5 Selecting MT6589_Android_scatter_emmc.txt

Step 5 Click Firmware->Upgrade.

Figure 5-6 Clicking Firmware->Upgrade

The dialog box shown in Figure 5-7 is displayed.

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Maintenance Manual 5 Software Upgrade

Figure 5-7 Dialog box displayed after you click Firmware->Upgrade

Step 6 Install the battery into the phone and connect the phone to the computer using a USB cable.
The upgrade tool automatically upgrades the phone.
The tool displays the upgrade progress, as shown in Figure 5-8.

Figure 5-8 Upgrade progress

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Maintenance Manual 5 Software Upgrade

The dialog box shown in Figure 5-9 is displayed when the upgrade succeeds. If any error
message is displayed during the upgrade. Start over from step 1.

Figure 5-9 Upgrade succeeded

----End

5.4.2 Performing a mircoSD card Upgrade


Step 1 Prepare the microSD card used for the upgrade.
1. Format the microSD card using FAT32.
2. Create a dload folder in the microSD card's root directory.
3. Copy the upgrade package UPDATE.APP to the dload folder.

 Do not change the names for the upgrade package and folder.
 A microSD card upgrade will have the internal memory of the phone erased.

Step 2 Choose the microSD upgrade method.


 Forcible upgrade
Remove and then re-install the battery, and press and hold the power, volume up, and
volume down keys. When the motor vibrates, release the power key. Do not release the
volume up or volume down keys unless the screen shown in Figure 5-11 is displayed.
 Normal upgrade
Power on the phone, enter *#*#1673495#*#* on the dialer. The screen shown in Figure
5-10 is displayed.

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Maintenance Manual 5 Software Upgrade

Figure 5-10 Engineering menu

Step 3 Touch SD 卡升级 then 确定. The phone automatically restarts and displays the startup logo
and then the upgrade screen, as shown in Figure 5-11.

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Maintenance Manual 5 Software Upgrade

Figure 5-11 Upgrade screen

When the screen shown in Figure 5-12 is displayed, the upgrade succeeds.
Step 4 Remove and then re-install the battery, and power on the phone.

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Maintenance Manual 5 Software Upgrade

Figure 5-12 Upgrade succeeded

----End

If an error occurs during the upgrade, the screen shown in Figure 5-13 and the upgrade failure
cause will be displayed.
If the cause for an upgrade failure is not displayed on the screen, send the sdload.log file in
the dload folder to the R&D.
During a microSD upgrade, some of the upgrade information is displayed on the screen, while
most information is saved in the sdload.log file.

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Maintenance Manual 5 Software Upgrade

Figure 5-13 Upgrade failed

5.4.3 Upgrading Phones Simultaneously


Upgrade Environment Requirements
To upgrade several phones simultaneously using the MTK tool, the computer used for the
upgrade must meet the following requirements:
 Operating system: Windows XP SP3 Chinese or English version
 Main frequency: 1 GHz or higher
 Display: SVGA or higher, minimum resolution of 1024x768 pixels
 Memory: 512 MB or larger
 Available drive space: 100 MB or larger
 USB port: one at least
 Others: standard keyboard and mouse

Configuring the Upgrade Tool


Figure 5-14 shows the main interface of the upgrade tool.

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Maintenance Manual 5 Software Upgrade

Figure 5-14 Parameter settings of the upgrade tool

To use the upgrade tool, install its driver on your computer and then configure the tool.

Figure 5-15 Driver

HUAWEI THMTK6515ML01Ver1003(1312).rar

Step 2 Set the port number.


1. Double-click HUAWEI THMTK6515ML02Ver1003(1312).rar.
2. To upgrade several main boards, on the displayed dialog box, select the ports to be used,
click Scan then 是(Y), place the main boards on the fixture, and close the fixture. The
port corresponding to each board will be displayed on the tool, as shown in Figure 5-16.
To upgrade several phones, connect a phone to the computer using a USB cable, click
Scan then 是(Y), press the volume down key on the phone, and install a battery to the
phone. The port corresponding to the phone will be displayed on the tool. Repeat this
procedure on other phones to be upgraded.
3. After all ports are correctly identified, the indicators and progress bars turn green.

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Maintenance Manual 5 Software Upgrade

Figure 5-16 Operations on the tool

Figure 5-17 Indicator and progress bar turned green

Step 3 Select the scatter file.


The scatter file is in the directory of the phone version software, as shown in 2.

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Maintenance Manual 5 Software Upgrade

Figure 5-18 Scatter file

Step 4 Upgrade the phone.


1. Click Start All.
2. For a main board, Start changes to DA, FR, or DL, and the indicator and progress bar
turn yellow. This indicates that the upgrade proceeds. For a phone, press the volume
down key, connect the phone to the computer using a USB cable, install the battery, and
release the volume down key until Start changes to DL.

Figure 5-19 Upgrade in progress

2. When the indicator and progress bar turn green, the upgrade succeeds. Click Start All to
upgrade the next main board or phone. If the indicator turns red, the upgrade fails. Click
Start All to re-upgrade the main board or phone.

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Maintenance Manual 5 Software Upgrade

Figure 5-20 Upgrade succeeded

Figure 5-21 Upgrade failed

----End

Precautions
 When you re-identify the port numbers of each main board or phone, if some of the port
numbers are the same, you may have mixed the USB cables. To address this issue, clear
the check boxes of the repeated port numbers, and re-identify them.
 If you fail to identify the port numbers due to misoperations, restart the computer.
 After you install the tool's driver on the computer, the driver will be automatically
installed to each port during the upgrade. If the installation cannot be automatically
carried out, follow the instructions to manually install the driver.

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Maintenance Manual 5 Software Upgrade

5.5 Troubleshooting
Table 5-2 Solutions to different upgrade failures

Failure Solution
(Computer) Failed to Check that there is no conflicting driver on the computer.
detect the phone's Check that the driver used for the upgrade has been properly
presence installed.
Check that the USB cable has been properly connected to the
computer and phone.
USB upgrade failure Check that the USB cable has been properly connected to the
computer and phone.
Check that the USB driver has been properly installed.
Check that the upgrade file version is correct.
Perform the upgrade again.
microSD card upgrade Check that the upgrade file is correct.
failure Check that the upgrade method is correct.
Check that the microSD card functions properly.
Perform the upgrade again.

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Maintenance Manual 6 Maintenance Tools

6 Maintenance Tools

Name: heat gun


Usage: heats components

Name: heat gun


Usage: heats components

Name: soldering iron


Usage: solders components

Name: DC power supply


Usage: supplies power

Name: soldering fixture


Usage: secures PCBAs

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Maintenance Manual 6 Maintenance Tools

Name: lead-free tin solder wire


Usage: solders components

Name: digital multimeter


Usage: measures parameters during maintenance

Name: toolkit
Usage: assembles and disassembles devices

Name: electric screwdriver


Usage: fastens and removes screws

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Maintenance Manual 7 Disassembly Procedure

7 Disassembly Procedure

2. Remove the battery cover from the slot (designed


1. Ensure that the ESD wrist strap is properly for removing the battery cover) at the lower corner on
grounded. the right surface of the phone in the counterclockwise
manner.

3. Remove the 11 screws from the housing. Secure the 4. Remove the rear cover use the spudger. Lift the left
phone with your hand when removing the screws to edge (close to the battery left side) up and release the
avoiding damaging the housing. buckles of the rear and front covers in the
counterclockwise manner.

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Maintenance Manual 7 Disassembly Procedure

5. Release the rear camera BTB connector from the 6. Release the proximity sensor BTB connector from
main board and remove the rear camera. Do not bump the main board. Do not bump off the surrounding
off the surrounding components of the rear camera. components of the BTB connector. Secure the main
Secure the main board when removing the rear camera. board when releasing the BTB connector.

7. Release the TP BTB connector from the main board. 8. Release the LCD BTB connector from the main
Do not bump off the surrounding components of the board. Do not bump off the surrounding components
BTB connector. Secure the main board when releasing of the BTB connector. Secure the main board when
the BTB connector. releasing the BTB connector.

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Maintenance Manual 7 Disassembly Procedure

9. Release the sub-board BTB connector from the main 10. Release the main board from the buckles on the
board, remove the FPC from the sub-board. Do not front cover from left to right. Do not bend the main
bump off the surrounding components of the BTB board when removing it.
connector. Secure the main board when releasing the
BTB connector.

11. Release the front camera BTB connector from the 12. Slightly pry away the buckle using the tweezers to
main board and remove the front camera. Do not bump reserve a space for you to insert the tweezers to lift up
off the surrounding components of the BTB connector. the proximity sensor FPC. Do not forcibly pry the FPC
up.

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Maintenance Manual 7 Disassembly Procedure

13. Gently pry the sub-board up, starting from the area 14. The phone is successfully disassembled.
shown in the above figure. Make sure this area is
totally pried up before you pry the other part of the
sub-board to avoid deforming the sub-board.

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Maintenance Manual 8 Assembly Procedure

8 Assembly Procedure

1. Ensure that the ESD wrist strap is properly 2. Align the speaker sub-board with the corresponding
grounded. positioning pins on the front cover, with the motor side
facing upward, attach the sub-board to the front cover,
and slightly press the board to make sure it is securely
attached.

3. Install the proximity sensor FPC. Make sure the 4. Connect the front camera BTB male and female.
FPC is properly installed into its slot on the front Make sure the connectors are properly fastened and do
cover. not bump the surrounding components.

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Maintenance Manual 8 Assembly Procedure

5. Using the screw hole in the upper left corner of the 6. Fasten the TP BTB connector to the main board.
front cover, slant the main board and insert it into the Press the connector to ensure it is securely fastened.
upper left buckle, upper right buckle, and then the Do not bump the surrounding components. Press the
bottom buckle of the front cover. During the operation, main board after you fasten the connectors.
make sure the front camera is aligned with the front
camera lens. Gently press the front camera into the slot
on the front cover and ensure that the camera is
protruding out.

7. Fasten the proximity sensor BTB connector to the 8. Fasten the LCD BTB connector to the main board.
main board. Press the connector to ensure it is securely Press the connector to ensure it is securely fastened.
fastened. Do not bump the surrounding components. Do not bump the surrounding components. Press the
Press the main board after you fasten the connectors. main board after you fasten the connectors.

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Maintenance Manual 8 Assembly Procedure

9. Connect the speaker sub-board to the main board 10. Attach the rear camera to the slot on the main
using the speaker FPC. Press the connectors to ensure board. Ensure that the camera is properly attached,
that the two boards are properly connected. Do not without conflicting with its slot. Fasten the rear camera
bump the surrounding components. BTB connector to the main board. Press the connector
to ensure it is securely fastened. Do not bump the
surrounding components.

4 8 6 2

10
11

1 3
5 9 7
12. Tighten the 11 screws in the numeric order. There
11. Join the rear cover with the front cover, from the are two types of the screws, do not misplace them.
bottom up. Ensure that the covers are properly fastened
and the gap between them is even.

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Maintenance Manual 8 Assembly Procedure

13. Fasten the battery cover to the phone from the top
down. Press the edges of the battery cover to ensure it
is securely fastened. Check whether the volume and
other functional keys are properly installed. Check that
the gap and mismatch between the battery cover and
main board of the phone are complaint with the
standard.

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Maintenance Manual 9 Circuit and Failure Analysis

9 Circuit and Failure Analysis

Before the maintenance, restore the phone to its factory settings to ensure that the failure is
not caused by environmental factors or incorrect functional settings.

9.1 Solution Introduction


Figure 9-1 Functional blocks of the G610-U15

The G610-U15 is a UMTS bar-type phone developed by Huawei based on the MT6589M
platform and RF chip MT6167.
The main board of the phone includes the baseband processing module in the MT6589M,
MT6320 (PM module), RF module (including the transceiver, PA and antenna), man-machine
interfaces, and dedicated functional modules (such as Wi-Fi, GPS, and Bluetooth). The LCD
connects to the main board through the FPC; the receiver connects to the main board through
springs; the motor and speaker are on the speaker sub-board; the microphone is soldered to

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Maintenance Manual 9 Circuit and Failure Analysis

the main board; the RE antenna connects to the main board through springs. All the preceding
components plus the covers and battery comprise a mobile phone.
G610-U15 incorporates a 5-inch TFT LCD with a resolution of 540 x 960 pixels. The phone
provides a micro USB charging port and supports polyphonic ringtones and the FM function.
The phone has a built-in RF antenna and works with a 2150 mAh Li-ion battery.

9.2 Baseband Subsystem


9.2.1 Startup Management Circuit
Circuit Diagram

Figure 9-2 Startup circuit

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-3 Power-on and power-off sequences

Circuit Analysis
When a battery is inserted into the phone, PWRKEY is at high level. When you press the
power key, PWRBT is short-circuited to the ground, PWRKEY is pulled down, and an
interrupt occurs. The power supplies start to work in sequence, and the system is powered on.
In detail, the buck power supply for VCORE and VPROC is started at the very beginning, and
then the VIO18 and VIO28 power supplies start in sequence. After all the power supplies that
should be started by default are on and the power-on sequence and power supply requirement
are met, the system is powered on and then reset.
After the power-on process is completely carried out, the baseband chip sends the PWRBB
signal to the PM IC to confirm the startup of the system.
To ensure that the phone is properly powered on, the PWRKEY signal should be kept low
until the PM IC receives the PWRBB signal.
The RTC module outputs the PWRBB signal to wake up the system: If the RTC is set to wake
up the system at a predefined time, the PWRBB signal will be directly sent to the PM IC. In
this case, when the set time arrives, the PWRBB signal will be pulled up to start the power-on
sequence of the PM IC. This is the RTC waking up action.
When an effective charger is connected to the phone, if the charger is detected by the system,
the system will also start in case that the input voltage is within a range where an OVP event
does not occur. However, if the voltage is lower than the UVLO voltage or the battery is not
in position, the system will not start up. If the voltage is lower than the UVLO voltage but the

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Maintenance Manual 9 Circuit and Failure Analysis

battery is in position, the system will charge the battery. When the battery voltage is high
enough, the system automatically starts up.

Figure 9-4 Power-on sequence when a charger is inserted

Troubleshooting Process
To troubleshoot the startup failure, check whether the I/O interface (battery connector) is
damaged. If the I/O interface is intact, use a DC regulated power supply to supply power to
the phone and test the phone's current.
The power-on failures include the following types:
 No current startup failure
 Weak current startup failure
 Excessive current startup failure

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-5 Troubleshooting no current (< 10 mA) startup failures

Startup failure

Connect the phone to a fake


battery and maintenance power
supply, power on the phone, and
observe the current

No current

Is the side key Y Reconnect


FPC properly the side key
fastened to the FPC to the
main board? main board

Y
Replace the
Is the side key FPC faulty?
side key FPC

Is the voltage on R1505 N


between Check U201
3.4 V to 4.2 V?

Y
Resolder and
replace U401

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-6 Troubleshooting weak current (< 100 mA) startup failures

Startup failure

Connect the phone to a fake


battery and maintenance
power supply, power on the
phone, and observe the
current
Reference voltage
values:
Weak current VCORE = 1.1 V,
VAPROC = 1.2 V
VDD18 = 1.8 V

Are the VCORE, N


VAPROC, and
VDD18 voltages
Resolder or
normal? replace U201

N
Is the TCXO2200 output
Resolder or
frequency 26 MHz?
replace X605

Resolder or
replace U401

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-7 Troubleshooting excessive current (> 1 A) startup failures

Startup failure

Connect the phone to a fake


battery and maintenance power
supply, power on the phone,
and observer the current

Excessive
current

Y
Is VBAT short-
circuited to the Replace the faulty
ground? component

Y
Are the VCORE,
VAPROC, and VDD18 Replace the faulty
short-circuited? component

Resolder or replace
U201

Circuit Signals

Table 9-1 Circuit signals of this section

Signal Description Reference Value or Waveform


VBAT Battery voltage 3.2–4.2 V

VCORE Digital core voltage 1.1 V


VAPROC Processor voltage 1.2 V
VDD18 I/O voltage 1.8 V

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Maintenance Manual 9 Circuit and Failure Analysis

9.2.2 Charging Management Circuit


Circuit Diagram

Figure 9-8 Charging circuit

Circuit Analysis
The power management chip MT6320 incorporates a charging solution. Three charging
modes are available, including trickle charging, constant current charging, and constant
voltage charging. The charging module in the MTK6329 is used to control the charging for
the phone. The G610-U15 support two charging modes: USB charging and charger.
Charging principle:
VBUS passes through two resistors that work as the voltage divider and converts into VCDT.
If VCDT is detected, the system determines that a charger is connected to the phone.
The CHR_LDO in the PM unit serves as a stabilizer, to lock the voltage at 2.8 V for the
charging module. The NMOS semiconductor is used to prevent VBUS from entering the
triode on the charging circuit then to the PM chip, protecting the PM chip. The VDRV signal
is used to control the charging current. R909 monitors the charging current.

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-9 shows the charging process. For an over-discharged battery whose voltage is lower
than 2.2 V, the system charges the battery in trickle charging mode with a 2 mA current. After
the battery voltage exceeds 2.2 V but does not reach 3.3 V, the system charges the battery in
trickle charging mode. In this process, if USB charging is used, the charging current is about
70 mA. If a charger is used, the trickle charging current is 200 mA. After the battery voltage
reaches 3.3 V, constant current charging starts. The charging current in this process can be
controlled by the phone software. On the charger provided with the G610-U15, the triode is
completely enabled to activate the charger's automatic current limiting function. When the
battery voltage reaches 4.1 V, constant voltage charging starts. When the battery voltage
reaches the threshold set by the software, the charging process ends. Once the battery voltage
exceeds 4.35 V, an overvoltage protection component will disconnect the charging circuit to
protect the battery.

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-9 Charging process

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Maintenance Manual 9 Circuit and Failure Analysis

Troubleshooting Process
Fault symptom: The charging failures may include the following types:
 A charger is connected to the phone but the phone does not respond.
 The phone displays the charging icon on the screen but in fact the battery fails to be
charged.
Solution: Check whether the I/O connector is damaged and then follow the procedure shown
in Figure 9-10.

Figure 9-10 Troubleshooting charging failures

Charging failure

N
Is the charger Replace the
properly charger
functioning?
Y
Y
Is J902 poorly Resolder
soldered? J902

N
N
Is R909 bearing a Replace
voltage? Q302

Y
N
Are there CHR_LDO Replace
signals? U201

Y
N
Is the battery in good
Y
contact with the Repair J901
battery connector?

Y
Y Replace the
Is the battery
damaged? battery

N
Reload the software to the phone and
restore the phone to its factory settings

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Signals

Table 9-2 Circuit signals of this section

Signal Description Reference Value or


Waveform

VBUS Charging power input 4.2 V


CHR_LDO Charging linear power 2.8 V
ISENSE Charging current detection input /
VBAT A 0.2 ohm resistor (R909) is added /
between ISENSE and VBAT to detect
the charging current. The phone software
controls the charging process based on
the charging current.

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Maintenance Manual 9 Circuit and Failure Analysis

9.2.3 Clock Circuit


Circuit Diagram

Figure 9-11 Clock circuit

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Analysis

Figure 9-12 Working principle of the clock circuit

The 26 MHz crystal oscillator X700 provides clock for the MT6167 (U700). The MT6167
then provides clock for the MT6589M.
The 26 MHz temperature compensation crystal oscillator TCXO2200 provides clock signals
for the 4-in-1 chip MT6628Q (U2200). The signal is used by the GPS module.
The clock signals output by the 32 kHz crystal pass the buffer and are then sent to the
MT6320 and MT6628Q to keep the system running in sleep mode.

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Maintenance Manual 9 Circuit and Failure Analysis

Troubleshooting Process

Figure 9-13 Troubleshooting clock circuit failures

No clock signal
output
N Resolder the
Are the crystal and
crystal and
crystal oscillator
properly soldered? cyrstal
oscillator
Y
Y Replace the
Are the crystal and
crystal oscillator faulty crystal
damaged? or crystal
oscillator
N
Resolder or replace
the faulty clock IC

Circuit Signals

Table 9-3 Circuit signals of this section

Signal Description Reference Value or


Waveform
26 MHz crystal Provides clock signals for the
oscillator MT6167 and then MT6589M

26 MHz Provides clock signals for the


temperature MT6628Q and GPS
compensation
crystal
oscillator
32 KHz crystal Provides clock signals for the
MT6230 and then MT6628Q

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Maintenance Manual 9 Circuit and Failure Analysis

9.2.4 Memory Circuit


Circuit Diagram

Figure 9-14 Memory circuit

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Analysis
The MT6589M visits the DDR in the MCP through the high-speed data bus EBI1. Both DDR
1 and DDR2 are supported. At the same time, the MT6589M can visit the eMMC through an
MMC data bus. The eMMC uses an 8-bit data line for data transmission.

Troubleshooting Process
You may hardly find a memory is faulty. When a memory is faulty, it may cause other failures.
Troubleshoot the failures according to the corresponding procedures. However, the memory
chip may have few chances to break down.

Circuit Signals

Table 9-4 Circuit signals of this section

Signal Description Reference Value or


Waveform
VDD18_PMU Power Supply for the memory 1.8 V
MC0CK Clock signals for the eMMC
MC0CMD Command signals for the eMMC
MC0RST Reset signals for the eMMC
MC0DA[0:7] Data line for the eMMC

9.3 RF Subsystem
9.3.1 Overall Introduction
The RF subsystem can be divided into RF transceiver (MT6167), GSM PA, BAND2 PA,
BAND 5 PA, and 4-in-1 chip MT6628Q that includes the Wi-Fi, Bluetooth, GPS, and FM
modules. They are described in detail as follows:
The G610-U15 is a UMTS smartphone based on the MTK platform MT6589M+MT6167.
Figure 9-15 shows the platform structure.

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Figure 9-15 Platform structure

Circuit Diagram

Figure 9-16 GSM PA and RF switch

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Figure 9-17 Working principle of the receive module of the GSM 850 MHz and Band 5

Figure 9-18 Working principle of the receive module of the GSM Band 2

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Figure 9-19 Working principle of the receive modules of the GSM 1800 MHz and 1900 MHz

Troubleshooting Process

Figure 9-20 Troubleshooting reception failures

Reception failure

Test the signal Y


reception at the RF Re-install the
connector antenna

N
Determine the
faulty band

Is any component
on the faulty circuit
poorly soldered?

Is there any missing


component on the
receive channel of each
band?

Return the phone to


Huawei for repair

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9.3.2 Transmit Channel


Circuit Diagram

Figure 9-21 GSM transmit channel

Figure 9-22 GSM Band2 transmit channel

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Figure 9-23 GSM Band5 transmit channel

Troubleshooting Process

Figure 9-24 Troubleshooting transmission failures

Transmission failure

Y
Test the signal reception Re-install the
at the RF connector antenna
N
Y
Are signals of all bands Replace the RF
not able to be received? front end U3201

Is there any
component on the
circuit of each band
poorly soldered?

Is there any missing


component on the circuit
of each band?

Return the phone to


Huawei for repair

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9.3.3 GPS Channel


Circuit Diagram

Figure 9-25 GPS channel

Circuit Analysis
The GPS signals pass through the antenna and a group of the matching circuit and enter the
SAW filter. The signals are then amplified by a low noise amplifier and enter the MT6628Q.

Troubleshooting Process
If no GPS signals can be received by the phone, first check whether the antenna and antenna
springs are properly connected. If yes, check whether the LNA back end has signals (the GPS
module has no RF switch, use an RF cable for the inspection). If not, replace the LNA. If the
circuit has no missing component but the problem persists, return the phone to Huawei for
repair.

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9.3.4 Wi-Fi Channel


Circuit Diagram

Figure 9-26 Wi-Fi channel

Circuit Analysis
The Wi-Fi signals pass through the antenna and then a filter and enter the balun in the
shielding case. After this, the signals become differential signals and enter the MT6628Q.

Troubleshooting Process
The Wi-Fi module has no RF switch. You need to use an RF cable to check the signal
reception of each bands. Pay special attention to the matching circuit after the balun. Make
sure the two matching circuits are consistent.
If no component is missing on the Wi-Fi circuit, the Wi-Fi chip (4-in-1 chip) may be damaged.
Return the phone to Huawei for repair.

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9.4 Peripheral Circuits


9.4.1 LCD Circuit
Circuit Diagram

Figure 9-27 LCD circuit

Circuit Analysis
The LCD BTB connector J1301 is used to connect the LCD module to U401. The LCD
module uses high-speed MIPI data lines (a group for clock signals and two groups for data
signals) for signal transmission and supports a refresh rate of 60 Hz. T1301, T1302, and
T1303 are the common-mode chokes for each of the three groups of the MIPI data lines,
which are used to prevent the interference from entering the LCD module and radiating to
other components. With the frame synchronization function, the LCD uses LPTE as the data
transmission synchronization signal to avoid screen tearing. The LCD module has two power

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supplies VDD28_PMU and VDD18_PMU. LCD_ID1 and LCD_ID0 are used to distinguish
LCD manufacturers. IM, MODESEL, LANESEL are control signals for LCD configuration
and pulled down to GND by default. The typical transmission mode is MIPI DSI command
mode based on 2 lanes of transmission channels. The initialization signal LRSTB is effective
when at low level. The backlight control signal LCD_CABC is used to enable the backlight
driving chip U1301 when there is data transmitted to the LCD.
The location number U1301 indicates the TPS61161. The 5-inch LCD backlight uses eight
LEDs connected in serial. A ground resistor of 10 ohms impedance is added to the
TPS61161's pin FB to realize the maximum current of 20 mA (Duty: 100%) for the LEDs.
The LED brightness (current output by the driver) is controlled by the PWM signals output by
LCD_CABC. When no data is transmitted to the LCD, LCD_CABC outputs nothing, and the
LCD backlight is turned off.

Troubleshooting Process

Figure 9-28 Troubleshooting LCD failures

LCD failure

Is the power supply N


(VDD28_PMU and U201
Check U202
VDD18_PMU) to the
LCD normal?

Y
Are the signals output to the Y
LCD normal?Are T1301 to
T1303 disconnected or short- Resolder or replace U401
circuited?

N
Is the LCD backlight (VLED_P Y
and VLED_N) normal? Are the Resolder or replace U1301
surrounding components
disconnected or short-circuited?

Replace J1301

Circuit Signals

Table 9-5 Circuit signals of this section

Signal Description Reference Value or


Waveform
VDD18_PMU Digital power supply input 1.8 V

VDD28_PMU Analog power supply input 2.8 V

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Signal Description Reference Value or


Waveform
MIPI_DATAP0 MIPI data line High-speed digital differential
signal
MIPI_DATAN0 MIPI data line High-speed digital differential
signal

MIPI_DATAP1 MIPI data line High-speed digital differential


signal
MIPI_DATAN1 MIPI data line High-speed digital differential
signal
MIPI_CLKP MIPI clock High-speed digital differential
signal
MIPI_CLKN MIPI clock High-speed digital differential
signal
LRSTB Reset signal; effective when at Operating: high level
low level Resetting: low level or low
pulse
IM Transmission type select 0V
signal
MODESEL Transmission type select 0V
signal
LANSEL MIPI data select signal 0V
LPTE Frame synchronizing signal Digital pulse signal

LCD_ID1 Manufacturer detection signal BOE: 00


LCD_ID0 Manufacturer detection signal TIANMA: 01
Truly: 10

VLED_P Backlight adjusting signal DC voltage: about 25 V


VLED_N Backlight adjusting signal
LCD_CABC Backlight adjusting signal Switch on: high level or PWM
signal
Switch off: 0 V

GND Ground cable 0V

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9.4.2 Touchscreen Circuit


Circuit Diagram

Figure 9-29 Touchscreen circuit

Circuit Analysis
The TP controller U1501 detects the coordinates of the touch point using its 11 groups of the
Txx signals and 22 groups of the Rxx signals and sends interrupts and the coordinates to the
CPU U401 using the I2C data bus. U1501 is powered by VDD18_CTP and VDD_CTPU1501
connects to the TP module through the BTB connector J1506. J1506 bears the T** and R**

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signals as well as the TP_ID1 and TP_ID0 signals that are used to detect the module
manufacturer and other information.

Troubleshooting Process

Figure 9-30 Troubleshooting touchscreen failures

Touchscreen failure

N
Is the TP module Replace the TP module or front
normal? cover assembly

Y
N
Is the power supply
Resolder or replace U1501
to the TP control IC
normal?

Y
N
Is VDD18_PMU
normal?
Check U201

Is the I2C signal normal? Is N


the I2C0 pull-up resistor Replace the faulty components
properly connected?

Y
N
Is the TP control IC Resolder or replace U1501
normal?
Y

Replace J1501

Circuit Signals

Table 9-6 Circuit signals of this section

Signal Description Reference Value or Waveform


VDD28_CTP TP controller power 2.85 V
supply
VDD18_PMU TP controller power 1.8 V
supply
EINT6_CTP TP controller interrupt Low pulse signal
signal

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Signal Description Reference Value or Waveform

CTP_RST TP controller reset Not used at present.


signal

T** Scan signal sent by the /


TP
R** Scan signal received by /
the TP
TP_ID1 Manufacture detection ID0 ID1
signal
O-Film GND GND
TP_ID0 Manufacture detection
signal ECW NC GND

Truly GND NC
JUNDA NC NC

TOUCH_EN VDD28_CTP power Effective when at high level


supply control signal

9.4.3 Front Camera Circuit


Circuit Diagram

Figure 9-31 Front camera circuit

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Circuit Analysis
The front camera supports a resolution of 0.3 mega pixels, uses a 24-pin BTB connector and
MIPI interface to communicate with the main board, and is controlled through the I2C data
bus.

Troubleshooting Process

Figure 9-32 Troubleshooting front camera failures

Front camera failure

Is the front camera N Replace the front camera


normal? module

Is the front camera N Resolder or replace the BTB


BTB connector connector
normal?
Y

Is the power supply N


to the front camera Check U201
normal?

Replace U401

Circuit Signals

Table 9-7 Circuit signals of this section

Signal Description Reference Value or


Waveform
VCAMA_AVDD Camera analog power supply 2.8 V
VCAMD_DOVDD Camera digital power supply 1.8 V

VCAMD_DVDD_0.3M Camera digital power supply 1.8 V


SUBCAM_CMPDN Camera power supply Effective when at high level
enabling signal (operating)
SUBCAM_RST Camera initialization signal Effective when at low level
The operating level is high.

SUBCAM_MCLK Reference clock for the Digital pulse signal

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camera; 24 MHz
SUBCAM_CLKN/P Pixel clock for the system MIPI differential clock
SCL1 Camera I2C signal for Digital pulse signal
transmitting control and
SDA1 configuration data Digital pulse signal

SUBCAM_D0N/P MIPI differential data signal Differential data signal

9.4.4 Rear Camera Circuit


Circuit Diagram

Figure 9-33 Rear camera circuit

Circuit Analysis
The rear camera supports a resolution of 5 mega pixels, uses a 24-pin BTB connector and
MIPI interface to communicate with the main board, and is controlled through the I2C data
bus.

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Troubleshooting Process

Figure 9-34 Troubleshooting rear camera failures

Rear camera failure

N
Is the rear camera Replace the rear camera module
normal?

Is the rear camera BTB N Resolder or replace the BTB


connector normal? connector

Is the power supply to N


Check U201
the rear camera normal?

Replace U401

Circuit Signals

Table 9-8 Circuit signals of this section

Signal Description Reference Value or Waveform


VCAMA_AVDD Camera analog power 2.8 V
supply

VCAMD_DOVDD Camera digital power 1.8 V


supply
VCAMD2_DVDD Camera digital power 1.8 V
supply

VCAM_AFVLD Camera focusing motor's 2.85 V


power supply
MCAM_MCLK Reference clock for the Digital pulse signal
camera; 24 MHz
MCAM_CLKP MIPI clock signal High-speed digital pulse signal
MCAM_CLKN MIPI clock signal High-speed digital pulse signal

MCAM _DATAP0 MIPI data signal High-speed digital pulse signal


MCAM MIPI data signal High-speed digital pulse signal
_DATAN0

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Signal Description Reference Value or Waveform

MCAM _DATAP1 MIPI data signal High-speed digital pulse signal

MMCAM MIPI data signal High-speed digital pulse signal


_DATAN1
SCL1 I2C control signal Digital pulse signal

SDA1 I2C control signal Digital pulse signal


CMPDN Camera power supply Effective when at high level
enabling signal (operating)
CMRST Camera initialization Effective when at low level
signal The operating level is high.
PWDN_VCM Camera autofocus motor Default value: low level
control signal Operating: high level

9.4.5 G-Sensor Circuit


Circuit Diagram

Figure 9-35 Accelerometer circuit

Circuit Analysis
The G-sensor U1201 sends the real-time acceleration information to the CPU through the
I2C0 data bus. EINT3_G_SENSOR and EINT4_G_SENSOR interrupt signals.

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Troubleshooting Process

Figure 9-36 Troubleshooting accelerometer failures

G-sensor failure

Are VDD28_PMU N
and VDD18_PMU Replace U202
normal?

Is the G-sensor N
Resolder or replace U1201
chip normal?

Y
Resolder or
replace U401

Circuit Signals

Table 9-9 Circuit signals of this section

Signal Description Reference Value or


Waveform
VDD18_PMU Sensor power supply 1.8 V

VDD28_PMU Sensor power supply 2.8 V


EINT3_G_SENSOR Interrupt signal Effective when at low level
When no signal is transferring,
the level is high.
EINT4_G_SENSOR Interrupt signal Effective when at low level
When no signal is transferring,
the level is high.
SCL0 I2C signal, used to read the High and low pulses
acceleration information
SDA0 High and low pulses

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9.4.6 Light Sensor Circuit


Circuit Diagram

Figure 9-37 Light sensor circuit

Circuit Analysis
The sensor U101 is a 2-in-1 sensor that has the light sensor and proximity sensor integrated. It
transmits light sensing and proximity sensing information to the CPU through the I2C0 data
bus in real time. EINT1_P_SENSOR is the interrupt signal.

Troubleshooting Process

Figure 9-38 Troubleshooting light sensor failures

Light sensor failure

Is N
VDD28_PMU Check U202
normal?

N
Is the light sensor Resolder or replace U101
chip normal?

Y
Resolder or
replace U401

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Circuit Signals

Table 9-10 Circuit signals of this section

Signal Description Reference Value or


Waveform

VDD28_PMU Sensor power supply 2.8 V


EINT2_P_SENSOR Interrupt signal Effective when at low level
When no signal is transferring,
the level is high.
SCL0 I2C signal, used to read the High and low pulses
acceleration information
SDA0 High and low pulses

9.4.7 Key Circuit


Circuit Diagram

Figure 9-39 Key circuit

Circuit Analysis
The key circuit is simple because only three keys (power, volume up, and volume down) are
used on the G610-U15. Each key is controlled by a signal. When a key is not pressed, its
control signal is at high level; when it is pressed, the control circuit is short-circuited to the
ground, and the control signal changes to low level. Serving as the bearer of the keys, the side
key FPC connects the keys to the CPU through springs.

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Troubleshooting Process

Figure 9-40 Troubleshooting key failures

Key failure

Is the side key N Replace the side key


FPC normal? FPC

Are the springs N Resolder or replace the


normal? springs

Y
Resolder or
replace U401

Circuit Signals

Table 9-11 Circuit signals of this section

Signal Description Reference Value or Waveform


PWRKEY Power-on and power-off Default: high level
signal The level is low when the power key is
pressed.
KCOL1 Volume up Default: high level
The level is low when the power key is
pressed.

KCOL0 Volume down Default: high level


The level is low when the power key is
pressed.

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9.4.8 Motor Circuit


Circuit Diagram

Figure 9-41 Motor circuit

Circuit Analysis
The motor is driven by the VIBR_PMU_OUT signal output by the MT6320. The chip
provides auto-switchover. Therefore, no external diode is required. A 1 ohm resistor R102 is
deployed to limit the current pass through the motor.

Troubleshooting Process

Figure 9-42 Troubleshooting motor failures

Motor failure

Is the motor N
properly soldered? Resolder the motor

N
Is the motor Replace the motor
normal?

Y
Resolder or
replace U201

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Circuit Signals

Table 9-12 Circuit signals of this section

Signal Description Reference Value or


Waveform

VIBR_PMU_OUT Motor power supply driving 2.7 V


signal

9.4.9 Receiver Circuit


Circuit Diagram

Figure 9-43 Receiver circuit

Circuit Analysis
The receiver is driven by the HSP and HSN differential signals output by the MT6589M.
C1123 and C1124 filter the RF interference out, and C1125 filters the differential interference
out.

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Troubleshooting Process

Figure 9-44 Troubleshooting receiver failures

Receiver failure

N
Is the receiver Replace the receiver
normal?

Is the receiver circuit N Clear faults on the


normal? circuit

Y
Resolder or
replace U401

Circuit Signals

Table 9-13 Circuit signals of this section

Signal Description Reference Value or Waveform


HSN Differential input's negative electrode Analog differential signal
HSP Differential input's positive electrode Analog differential signal

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9.4.10 Microphone Circuit


Circuit Diagram

Figure 9-45 Microphone circuit

Circuit Analysis
The VMIC power supply output by the MT6589M provides bias voltage for the microphone.
Sound collected by the microphone are converted into MICP0 and MICN0 differential signals
and sent to the CPU for processing. The G610-U15 applies dual microphones, and both
support noise reduction. C1120 and C1121 block the DC voltage, R1106 and R1114 are the
bias resistors, and C110 and C111 filter the RF interference out.

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Troubleshooting Process

Figure 9-46 Troubleshooting microphone failures

Microphone failure

Is the N
microphone Replace the
normal? microphone

Y
N Clear faults on the
Is the microphone
circuit normal? circuit

Replace
U401

Circuit Signals

Table 9-14 Circuit signals of this section

Signal Description Reference Value or Waveform

VMIC Microphone power supply 1.9 V


MICP0 Differential signal input's positive electrode Analog differential signal
MICN0 Differential signal input's negative electrode Analog differential signal

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9.4.11 Speaker Circuit


Circuit Diagram

Figure 9-47 Speaker circuit

Circuit Analysis
The speaker is driven by the SPK_P and SPK_N differential signals output by the MT6320.
The speaker connects to the speaker sub-board through springs. C105 and C106 filter the RF
interference out. The speaker applies foolproof design.

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Troubleshooting Process

Figure 9-48 Troubleshooting speaker failures

Speaker failure

N
Is the speaker normal? Replace the
speaker

Y
N
Is the speaker Clear fault
circuit normal? on the circuit

Resolder or
replace U201

Circuit Signals

Table 9-15 Circuit signals of this section

Signal Description Reference Value or Waveform


SPK_P Differential signal input PWM signal

SPK_N Differential signal input PWM signal

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9.4.12 Headset Circuit


Circuit Diagram

Figure 9-49 Headset circuit

Circuit Analysis
When a headset is inserted into the phone, pin 4 of the headset connector is pulled down, and
EINT0_HP generates an interrupt. The MT6589M detects the interrupt, determining that a
headset has been inserted. After you press the key on the headset, EARBIAS output periodical
square waves. When EARBIAS is at high level, the MT6589M detects the ACCDET pin. If
the pin is detected as low, the chip determines that the key has been pressed.

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Troubleshooting Process

Figure 9-50 Troubleshooting headset earpiece failures

Headset earpiece
failure

N
Is J1101 normal? Replace
J1101

Are components on N
Replace the
the left and right
audio channels
faulty
normal? components
Y

Is any component on N
the earphone circuit Clear faults
short-circuited to the on the circuit
ground?

Replace U401

Figure 9-51 Troubleshooting headset microphone failures

Headset microphone
failure

N
Is J1101 normal? Replace
J1101

Y
N
Is the EARBIAS Identify the
voltage normal? cause and
fix it
Y

N
Is the microphone circuit
Clear faults
short-circuited to the
ground? on the circuit

Replace U401

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Circuit Signals

Table 9-16 Circuit signals of this section

Signal Description Reference Value or


Waveform

VDD18_PMU Headset insertion detection 1.8 V


VMIC_BIAS1 Headset microphone power supply 1.9 V
EINT0_HP Interrupt detection signal Default value: 1.5 V
Effective when at low level

ACCDET Key pressing detection Default value: 1.5 V


Effective when at low level
HPLP Headset left channel Pulse signal

HPRP Headset left channel Pulse signal


MICN1 Negative electrode of the microphone Differential signal
differential signal
MICP1 Negative electrode of the microphone Differential signal
differential signal

9.4.13 SIM Card Circuit


Circuit Diagram

Figure 9-52 SIM card circuit

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Circuit Analysis
The G610-U15 supports two SIM cards. Figure 9-53 shows the SIM card holder circuit,
which is a common one that can be seen on basically every platform. UIM1_CLK is the clock
signal, UIM_RESET is the reset signal, VDD_UIM1 is the power supply signal, and
UIM1_SIO is the data signal.

Troubleshooting Process

Figure 9-53 Troubleshooting SIM card detection failures

SIM card detection


failure

Is the SIM card N


properly Replace the SIM card
functioning?
Y
Is the SIM card holder N Clean the SIM card
blocked by insulated holder
materials?

Is the SIM card N


holder properly Resolder J1406
soldered?

N
Resolder or
replace U401

Circuit Signals

Table 9-17 Circuit signals of this section

Signal Description Reference Value or Waveform


SCLK Clock signal /
SRST Reset signal /
VSIM_PMU Voltage signal If the card can be detected, the voltage should be 3.3 V.
SIO Data signal /

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9.4.14 microSD Card Circuit


Circuit Diagram

Figure 9-54 microSD card circuit

Circuit Analysis
The microSD card holder is on the main board and communicate with U401 through the EMI
component. Data transmission (read and write) to the microSD card complies with the
standard microSD card protocol.

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Troubleshooting Process

Figure 9-55 Troubleshooting microSD card detection failures

microSD card
detection failure

Is the microSD card N Resolder or replace the


holder properly microSD card holder
soldered?
Y

Is the power supply to the N Resolder or replace


microSD card normal? U201

N Resolder or replace the


Are the SD_DET and
other signals normal? faulty components

Y
Resolder or
replace U401

Circuit Signals

Table 9-18 Circuit signals of this section

Signal Description Reference Value or Waveform


VMCH_PMU Power supply Normal voltage: 3.3 V
signal
MC1CK Clock signal /
MC1CMD Command signal /

MC1DA0–MC1DA3 Data signal /


SD_DET microSD SD-DET is at high level when the microSD is
detection signal in position. Otherwise, it is at low level.

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Maintenance Manual 9 Circuit and Failure Analysis

9.4.15 USB Port Circuit


Circuit Diagram

Figure 9-56 USB port circuit

Circuit Analysis
The USB port circuit is simple. USB_DM and USB_DP are the data lines. VUSB is the
voltage signal, which is 3.3 V.
KCOL0 is the USB download triggering signal. When KCOL0 is grounded, the system enters
USB download mode.

Troubleshooting Process

Figure 9-57 Troubleshooting USB detection failures

USB failure

Is the USB port N


Resolder the USB port
properly soldered?

Are the surrounding N Resolder or replace the


components of the USB port surrounding
properly functioning? components

Y
Resolder or
replace U401

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Signals

Table 9-19 Circuit signals of this section

Signal Description Reference Value or Waveform


VBUS USB power supply The voltage is 3.3 V.
USB_DM USB data (+) High-speed digital pulse signal

USB_DP USB data (–) High-speed digital pulse signal


KCOL0 USB download When KCOL0 is grounded, the system enters
triggering signal USB download mode.

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Maintenance Manual 9 Circuit and Failure Analysis

9.4.16 Wi-Fi Module Circuit


Circuit Diagram

Figure 9-58 Wi-Fi module circuit

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Analysis
The 4-in-1 chip MT6628Q provides the Wi-Fi function. The Wi-Fi module in this chip uses
the SDIO interface for signal transmission. The Wi-Fi antenna connects to the antenna on the
phone housing through the spring J2301. The Wi-Fi module and GPS module shares the
antenna. The external power supply provides the VBAT and 2.8 V voltages to the MT6628Q.
The LDO inside the MT6628Q provides a 1.7 V for the on-chip modules.

Figure 9-59 MT6628Q structure

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Troubleshooting Process

Figure 9-60 Troubleshooting Wi-Fi failures

Wi-Fi connection
failure

Is the 4-in-1 chip N


U2200 properly Resolder U2200
soldered?

N Re-install the antenna,


Is the Wi-Fi antenna or resolder or replace
circuit normal? the surrounding
components, especially
Y U2301
Resolder or
replace U401

Circuit Signals

Table 9-20 Circuit signals of this section

Signal Description Reference Value or Waveform


MC2_DAT0_6628– Wi-Fi data signal /
MC2DAT3_6628
MC2_CMD_6628 Command signal /
MC2_CLK_6628 Clock signal /

WIFI_INT_B_6628 Reset signal /

9.4.17 Bluetooth Circuit


Circuit Diagram
See section 9.4.16 "Wi-Fi Module Circuit" for the module's circuit diagram.

Circuit Analysis
The Bluetooth function is provided by the MT6628Q, too. The BT module uses the PCM
interface for signal transmission. The Bluetooth antenna connects to the antenna on the
phone housing through the spring J2301. The Wi-Fi module and Bluetooth module
shares the antenna.

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Troubleshooting Process

Figure 9-61 Troubleshooting Bluetooth failures

Bluetooth failure

N
Is the 4-in-1 chip Resolder U2200
U2200 normal?

Y
Re-install the antenna,
Is the Bluetooth N or resolder or replace
antenna circuit normal? the surrounding
components
Y
Resolder or
replace U401

Circuit Signals

Table 9-21 Circuit signals of this section

Signal Description Reference Value or Waveform


DAICLK Bluetooth clock signal /
DAISYNC PCM interface sync signal /

DAIPCMIN PCM interface input data /

DAIPCMOUT PCM interface output data /


UTXD3 UART interface used in /
BT&GPS&FM control signal
URXD3 UART Interface used in /
BT&GPS&FM control signal

BGF_INT_B_6628 BT&GPS&FM interrupt signal /

9.4.18 GPS Circuit


Circuit Diagram
See section 9.4.16 "Wi-Fi Module Circuit" for the module's circuit diagram.

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Maintenance Manual 9 Circuit and Failure Analysis

Circuit Analysis
The GPS function is provided by the MT6628Q, too. The GPS module uses the UART
interface for signal transmission. The GPS antenna connects to the antenna on the phone
housing through the spring J2301. The GPS module does not share its antenna with any other
module.

Troubleshooting Process

Figure 9-62 Troubleshooting GPS failures

GPS failure

Is the 4-in-1 chip N


U2200 properly Resolder U2200
soldered?
Y
Re-install the antenna, or
N resolder or replace the
Is the GPS antenna
circuit normal? surrounding components,
and check that Z2303 and
U2200 are properly soldered
Y
Resolder or
replace U401

Circuit Signals

Table 9-22 Circuit signals of this section

Signal Description Reference Value or Waveform


UTXD3 UART interface used in /
BT&GPS&FM control signal
URXD3 UART interface used in /
BT&GPS&FM control signal

9.4.19 FM Circuit
Circuit Diagram
See section 9.4.16 "Wi-Fi Module Circuit" for the module's circuit diagram. Figure 9-63
shows the FM antenna circuit.

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Maintenance Manual 9 Circuit and Failure Analysis

Figure 9-63 FM antenna circuit

Circuit Analysis
The FM function is also provided by the MT6628Q. The FM module uses the I2S interface
for signal transmission. The FM module employs the ground cable of the headset as its
antenna. Therefore, the FM function is disabled when no headset is inserted into the phone.
The FM antenna applies differential signals to improve its anti-interference capability.

Troubleshooting Process

Figure 9-64 Troubleshooting FM failures

FM signal reception
failure

Resolder or replace the


Is the headset jack N headset jack and check
properly soldered? the surrounding
components.
Y

Is the 4-in-1 chip N


U2200 properly Resolder U2200.
soldered?
Y
Resolder or
replace U401

Circuit Signals

Table 9-23 Circuit signals of this section

Signal Description Reference Value or


Waveform
FM_IN_L FM left audio channel signal /
FM_IN_R FM right audio channel signal /

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Signal Description Reference Value or


Waveform
I2S_DATA_IN_6628 FM I2S data signal /

I2S_CLK_6628 FM I2S clock signal /


I2S_WS_6628 FM I2S world select signal /

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G610-U20 Smartphone
Maintenance Manual 10 Solder Points on the PCB and BGA Chips

10 Solder Points on the PCB and BGA


Chips

Red (R: 255, G: 0, B: 0) : vacant point

Green (R: 0, G: 255, B: 0) : ground point

Blue (R: 0, G: 0, B: 255) : solder point

Figure 10-1 Solder points on the PCB front side

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Maintenance Manual 10 Solder Points on the PCB and BGA Chips

Figure 10-2 Solder points on the PCB back side

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G610-U20 Smartphone
Maintenance Manual 11 Functional Tests

11 Functional Tests

11.1 Keys
Figure 11-1 G610-U15 keys

11.2 MMI Test


On the phone dialer, enter *#*#2846579#*#* to enter MMI test mode. Press the volume down
key to start a test. Touch the menu key on the keypad to skip the current test and go to the next.
Touch the return key to return to the previous test.

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Maintenance Manual 11 Functional Tests

Table 11-1 MMI test

No. Test Item Step Test Description


Content

1 microSD 1 microSD card If a microSD card is inserted and works properly, the test item
card test automatically passes, and the MMI test automatically proceeds.
If the microSD card is faulty, the test is indicated as failed, and
you need to press the volume down key to proceed.

2 Key test 2 Keys Press or touch all keys on the phone. When a key is pressed or
touched, the color of the corresponding area on the screen
should change. After all keys are tested, press the volume down
key to proceed.

3 LCD test 3 White screen Press the volume down key. A white screen is displayed.
Black screen Press the volume down key. A black screen is displayed.
Color screen Press the volume down key. A color screen is displayed,
showing red, green, and blue strips.
4 LCD 4 LCD If the LCD backlight repeatedly turns on and off, the LCD
backlight backlight backlight is normal. Press the volume down key to proceed.
test

5 Keypad 5 Keypad LEDs If the keypad backlight repeatedly turns on and off, the test item
backlight passes. Press the volume down key to proceed.
test

6 Touchscreen 6 Touchscreen Slide your figure along the touchscreen edges in a circle. The
test route that your finger passes should turn red.
Press the volume down key to proceed.
7 Proximity 7 Proximity Place a board about 4 mm away from the proximity sensor's
sensor test sensor hole on the touchscreen.
If the icon changes from a human portrait to a call icon, the test
item passes. Press the volume down key to proceed.
8 Light sensor 8 Light sensor Check whether the phone can detect environmental light data.
test When the test screen is displayed, orient the phone front side to
the light and block the light sensor using your hand, the phone
automatically detects the light changes and determines whether
the test item passes. If the test item passes, the phone
automatically proceeds to the next test item. If the phone fails to
detect the light changes after you tried changing the light
environment for the phone several times, touch the menu key to
confirm the light sensor failure.

9 Motor test 9 Motor The motor vibrates intermittently.


Press the volume down key to proceed.
10 Speaker test 10 Speaker If the speaker delivers clear sound, the test item passes.
Press the volume down key to proceed.
11 Receiver 11 Receiver If the receiver plays the pre-stored audio file repeatedly, the test
test item passes. Press the volume down key to proceed.

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Maintenance Manual 11 Functional Tests

No. Test Item Step Test Description


Content
12 Microphone 12 Microphone Touch Record. Speak into the microphone, and then touch
loopback Play. If the microphone functions properly, you can hear the
test voice recording from the receiver. Test the headset microphone
in the same way.
Press the volume down key to proceed.

13 FM test 13 FM After a headset is inserted, the phone searches for and plays an
FM channel. If you hear the program from the headset, the test
item passes.
Press the volume down key to proceed.

14 Headset 14 Headset After the headset is insert, the in icon turns green. After the
wire control headset is removed, the out icon turns green. The test item
test passes.
Press the volume down key to proceed.
15 Rear camera 15 Rear camera After the phone displays the preview screen, press the volume
test up key to take a picture. If the flashlight blinks once, the test
item passes. Press the power key to test the auto-focus function
of the camera.
Press the volume down key to proceed.
16 Front 16 Front camera After the phone displays the preview screen, press the volume-
camera test down key to proceed.

17 Bluetooth 17 Bluetooth The phone automatically tests the Bluetooth function. During
test function the test, the phone searches for Bluetooth devices in range and
displays the devices that have been found.
If a Bluetooth device is searched out, the test item passes. Press
the volume down key to proceed.
Prepare a device with Bluetooth enabled for this test item.
18 G-sensor 18 G-sensor Keep the phone 45°to the X, Y, and Z axises. If the test item
test automatically passes, the G-sensor functions properly.
19 Wi-Fi test 19 Wi-Fi If the phone receives signals properly, the test item passes.
function Ensure that the phone under test is within the coverage of a
Wi-Fi hotspot.

20 SIM card 20 SIM card If a SIM is inserted into the phone and functions properly, the
test test item passes. Press the volume down key to view the test
results.

The MMI test is complete, and the test results are displayed on the LCD.

11.2.2 Voice Call Test


Step 1 Install a UIM card and battery on the phone.
Step 2 Press and hold the power key to power on the phone.

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Maintenance Manual 11 Functional Tests

Step 3 Check that the signal strength displayed on the LCD is correct (given that the network is
normal).
Step 4 Place a call to a fixed-line number and check the voice quality during the call.
Step 5 If no problems are found, end the test. If any problems are found, troubleshoot the phone or
send it to an advanced service center for repair.
----End

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