OS-T - 1100 Thermal Stress Analysis of A Printed Circuit Board With Anisotropic Material Properties

29/01/2019 OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board with Anisotropic Material Properties
OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board

with Anisotropic Material Properties
Printed Circuit Boards (PCB's) are used in electronic components to both mechanically support
and provide electrical connections between components. Construction involves etching a thin
copper layer that has been deposited onto a non-conductive, glass-fiber/epoxy composite
substrate. Electrical components are then mounted to the board and connected to the copper
traces with electrical solder.
The concentrated, intense heating that occurs during the soldering process creates stresses in the substrate
material. In this exercise, you will simulate this process and determine if the stresses and strains resulting from this
process are acceptable or not.
The model makes use of solid hexahedral (CHEXA8) elements with a thin skin of shell elements (CQUAD4) on the
outside faces.
The consistent unit system used in this simulation are: kg, mm, GPa, kN and °C
Figure 1.
Launching HyperMesh and Setting the OptiStruct User Profile
1. Launch HyperMesh.
The User Profile dialog appears.
2. Select OptiStruct and click OK

OK.
This loads the user profile. It includes the appropriate template, macro menu, and import reader, paring down
the functionality of HyperMesh to what is relevant for generating models for OptiStruct.
Opening the Model
1. Click File > (and then) Open > (and then) Model
Model.
2. Select the circuit_board.hm file you saved to your working directory from the optistruct.zip file. Refer to
Accessing the Model Files.
https://altairhyperworks.com/hwhelp/Altair/2017/help/os/topics/solvers/printer_circuit_board_r.htm#printer_circuit_board_r 1/8
3. Click Open
Open.
The circuit_board.hm database is loaded into the current HyperMesh session, replacing any existing data.
The database only contains geometric data.
Setting Up the Model
Creating MAT9 Material for Solid Elements
The MAT9 material type defines the properties for linear, temperature independent, anisotropic materials. This
material model is well suited to this tutorial, due to the composite structure of the substrate. The X, Y and Z
orientations of the laminated material have different elastic moduli and thermal expansion coefficients. The MAT9
material applied to solid elements allows a simplification of the model over using a shell model of the composite,
with the individual ply layer properties and orientations defined.
1. In the Model Browser, right-click and select Create > (and then) Material
Material.
2. For Name, enter PCB_solids .
3. For Card Image,select MAT9 and click Yes to confirm.
4. Enter the following values for the oriented elastic and shear modulus of the composite:
G11 17.0
G22 16.2
G33 7.00
G44 4.93
G55 4.70
G66 2.03
5. Enter the following values for the thermal expansion rates and reference temperature:
A1 1.6e-5
A2 1.9e-5
A3 8.0e-5
TREF 10.0
Figure 2.
Creating MAT2 Material for Shell Elements
You should still be in the materials/create panel from the previous step.
1. In the Model Browser, right-click and select Create > (and then) Material
Material.
2. For Name, enter PCB_shells .
3. For Card Image, select MAT2 and click Yes to confirm.
4. Enter the following values for the shell element material properties:
G11 17.0
G22 16.2
G33 4.90
A1 1.6e-5
A2 1.9e-5
TREF 10.0
Creating Properties with a Material Reference
1. In the Model Browser, right-click and select Create > (and then) Property
Property.
2. For Name, enter shell .
3. For Card Image, select PSHELL

PSHELL.
4. For Material, click Create > (and then) Material

Material.
5. In the Select Material dialog, select PCB_shells from the list of materials and click OK to complete the material
selection.
6. Enter the thickness for the shell component by clicking T, and enter 0.001 .
Figure 3.
7. Repeat steps 1 to 6 to create another property with name Solids , with Card Image set as PSOLID and
Material as PCB_solids
PCB_solids.
8. In the Model Browser, click the pcb_solids component.

The component entry is displayed in the Entity Editor below.
9. For Property, click Unspecified > (and then) Property

Property.
10. In the Select Property dialog, select Solids and click OK to complete the property selection.
11. Repeat steps 8 to 10 for both solder_pads and shell_faces selecting shell for the property name.
Creating Displacement Constraints at the Mounting Holes
1. In the Model Browser, right-click and select Create > (and then) Load Collector.
Collector
2. For Name, enter constraints .
3. Leave Card Image set to None

None.
4. Select a suitable color.

Figure 4.
5. Click BCs > (and then) Create > (and then) Constraints to open the Constraints panel.
6. Click nodes > (and then) by sets.

sets
7. Select the constrain_nodes entity set and click select

select.
8. Leave all 6 degrees of freedom selected and click create

create.
9. Click return to go back to the main menu.
Creating Applied Temperature Loads at the Solder Pads
1. Create a new load collector named temperature_loads .
2. Leave Card Image set to None.
3. Click BCs > (and then) Create > (and then) Interfaces to open the Temperatures panel.
4. Click nodes > (and then) by collector.

collector
5. Check the box next to the solder_pads component.
6. Click select
select.
7. Verify that constant value (the field label specifies value=) is selected and enter 345.0 .
8. Verify the load types= is set to TEMP.
9. Click create to create the temperature_loads.
10. Click return to go back to the main menu.
Creating a Load Step
1. In the Model Browser, right-click and select Create > (and then) Load Step.
Step
A default load step template is now displayed in the Entity Editor below the Model Browser.
2. For Name, enter thermal_loading .
3. For Analysis type, select Linear Static from the drop-down menu.
4. For SPC, select Unspecified > (and then) Loadcol
5. In the Select Loadcol dialog, select constraints and click OK

OK.
6. For TEMP, click Unspecified > (and then) TEMP

TEMP.
7. In the Select Loadcol dialog, select temperature_loads and click OK

OK.
An OptiStruct loadstep has been created, which references the inertia relief support points in the load
collector SPCs and the forces in the load collector static_loads.
Adding Control Cards to the Analysis
1. Click Setup > (and then) Create > (and then) Control Cards to open the Control Cards panel.
2. Click next to advance until OUTPUT is available, click OUTPUT to add card requesting output results format.
3. For the number_of_outputs field on the lower part of the panel, enter 2 .
4. Set one of the KEYWORD to OP2 to request the OP2 format results file, and set the second output as H3D
format. The frequency (FREQ) of the output can be set as ALL
ALL.
5. Click return to go back to the Control Cards panel.
6. Click next to advance to the second page of control cards, then once more to go to the third page.
7. Activate the SCREEN card with the OUT option.
8. Return to the Control Card panel.
9. Select GLOBAL_OUTPUT_REQUEST on the first page to access the output settings.
10. Activate the STRAIN option to request strain results output. Leave the default settings for this card.
11. Click return twice to get back to the main menu.
Submitting the Job
A linear static analysis of this C-clip is performed prior to the definition of the optimization process. An analysis
identifies the responses of the structure before optimization to ensure that constraints defined for the optimization
are reasonable.
The model axi-symmetry_full_geometry.hm already has the excavator MBD analysis set up with all the bodies
defined as rigid bodies..
1. From the Analysis page, click the OptiStruct panel.

Figure 5. Accessing the OptiStruct Panel
2. Click save as.

as
3. In the Save As dialog, specify location to write the OptiStruct model file and enter axi-symmetry_model for
filename.
For OptiStruct input decks, .fem is the recommended extension.
4. Click Save
Save.
The input file field displays the filename and location specified in the Save As dialog.
5. Set the export options toggle to all

all.
6. Set the run options toggle to analysis

analysis.
7. Set the memory options toggle to memory default.

default
8. Clear the options field.
9. Click OptiStruct to launch the OptiStruct job.
If the job is successful, new results files should be in the directory where the axi-symmetry_model.fem was written.
The axi-symmetry_model.out file is a good place to look for error messages that could help debug the input deck if
any errors are present.
The default files written to the directory are:
axi-symmetry_model.html HTML report of the analysis, providing a summary of the problem

formulation and the analysis results.
axi-symmetry_model.out OptiStruct output file containing specific information on the file

setup, the setup of your optimization problem, estimates for the
amount of RAM and disk space required for the run, information for
each of the optimization iterations, and compute time information.
Review this file for warnings and errors.
axi-symmetry_model.h3d HyperView binary results file.
axi-symmetry_model.res HyperMesh binary results file.
axi-symmetry_model.stat Summary, providing CPU information for each step during analysis
process.
axi-symmetry_model.mvw HyperView session file.
axi- HTML file used to post-process the .h3d with HyperView Player
symmetry_model_frames.html using a browser. It is linked with the _menu.html file.
axi- HTML file to post-process the .h3d with HyperView Player using a
symmetry_model_menu.html browser.
The default files written to the directory are:
axi- OptiStruct output file containing specific information on the file setup, the
symmetry_model.out setup of your optimization problem, estimates for the amount of RAM
and disk space required for the run, information for each of the
optimization iterations, and compute time information. Review this file for
warnings and errors.
axi- Summary of analysis process, providing CPU information for each step
symmetry_model.stat during analysis process.
axi- Reduced matrices (DMIG) file.

symmetry_model_AX.pch
The matrices are written to the .pch file with the same format as the DMIG bulk data entry. They are defined by a
single header entry and one or more column entries. By default, the name of the stiffness matrix is KAAX, the mass is
MAAX, and the load is PAX. Since mass matrix is not used in this tutorial, it is not written to .pch file.
The I/O Option entry, DMIGNAME, provides you with control over the name of the matrices.
Also, the following files will be output and which are specific to the random response analysis.
axi- ASCII result file, containing RMS and peak values of PSD.
symmetry_model.peak
ASCII result file, containing PSD results.
axi-
symmetry_model.rand
axi- HyperView script file. This file will automatically create the plot of PSD over
symmetry_model.mvw the frequency for the results contained in .rand file.
axi- Binary file containing RMS and PSD results.

symmetry_model.op2
Also, the following files will be output and which are specific to the random response analysis.
axi- Binary plotting file.

symmetry_model_mbd.abf
axi- Binary results file (Modal results).

symmetry_model_mbd.h3d
axi- Log file from OS-Motion containing the information on the joints and
symmetry_model_mbd.log markers, simulation etc., which are specific to MBD analysis.
axi- Binary results file for plotting.

symmetry_model_mbd.mrf
axi- Model file in .xml format – solver intermediate input deck.

symmetry_model_mbd.xml
There are a few more files written to the directory with the name axi-symmetry_model_mbd.

OS-T - 1100 Thermal Stress Analysis of A Printed Circuit Board With Anisotropic Material Properties

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29/01/2019 OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board with Anisotropic Material Properties

OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board

Launching HyperMesh and Setting the OptiStruct User Profile

2. Select OptiStruct and click OK

Opening the Model

Setting Up the Model

Creating MAT9 Material for Solid Elements

2. For Name, enter PCB_solids .

3. For Card Image,select MAT9 and click Yes to confirm.

Creating MAT2 Material for Shell Elements

2. For Name, enter PCB_shells .

3. For Card Image, select MAT2 and click Yes to confirm.

Creating Properties with a Material Reference

2. For Name, enter shell .

3. For Card Image, select PSHELL

4. For Material, click Create > (and then) Material

8. In the Model Browser, click the pcb_solids component.

9. For Property, click Unspecified > (and then) Property

Creating Displacement Constraints at the Mounting Holes

2. For Name, enter constraints .

3. Leave Card Image set to None

4. Select a suitable color.

6. Click nodes > (and then) by sets.

7. Select the constrain_nodes entity set and click select

8. Leave all 6 degrees of freedom selected and click create

9. Click return to go back to the main menu.

Creating Applied Temperature Loads at the Solder Pads

1. Create a new load collector named temperature_loads .

2. Leave Card Image set to None.

4. Click nodes > (and then) by collector.

5. Check the box next to the solder_pads component.

8. Verify the load types= is set to TEMP.

9. Click create to create the temperature_loads.

10. Click return to go back to the main menu.

Creating a Load Step

2. For Name, enter thermal_loading .

4. For SPC, select Unspecified > (and then) Loadcol

5. In the Select Loadcol dialog, select constraints and click OK

6. For TEMP, click Unspecified > (and then) TEMP

7. In the Select Loadcol dialog, select temperature_loads and click OK

Adding Control Cards to the Analysis

5. Click return to go back to the Control Cards panel.

7. Activate the SCREEN card with the OUT option.

8. Return to the Control Card panel.

9. Select GLOBAL_OUTPUT_REQUEST on the first page to access the output settings.

11. Click return twice to get back to the main menu.

Submitting the Job

1. From the Analysis page, click the OptiStruct panel.

2. Click save as.

5. Set the export options toggle to all

6. Set the run options toggle to analysis

7. Set the memory options toggle to memory default.

8. Clear the options field.

9. Click OptiStruct to launch the OptiStruct job.

axi-symmetry_model.html HTML report of the analysis, providing a summary of the problem

axi-symmetry_model.out OptiStruct output file containing specific information on the file

axi-symmetry_model.h3d HyperView binary results file.

axi-symmetry_model.res HyperMesh binary results file.

axi-symmetry_model.mvw HyperView session file.

The default files written to the directory are:

axi- Reduced matrices (DMIG) file.

axi- Binary file containing RMS and PSD results.

axi- Binary plotting file.