LIST OF ICs​ ​AND THEIR PROBABLE LOCATION

1.​ ​ADCS

a.​ ​DRV592VFPG4 H-bridge IC(9.20x9.20mm)---------​obc board(torquers)

------------------x 3

b.​ ​Max4624 ezt series switch IC(2.80x3.mm)---------​obc

board(torquers)------------------x 3

2.​ ​POWER

a.​ ​Max 4372 current sensor—(3.3x3.3mm)-----torquers​ ​(obc board

)-----------------x 3

​ solar panels (​TBD​)--------------x 4

b.​ ​MIC 2514 relay magnetometer-()---​TBD

c.​ ​LM5118 buck boost converter---(6.4x4.5mm)------​TBD

d.​ ​DS2778 BATTERY PROTECTION UNIT---(3x5mm)------​power board

(battery)

e.​ ​TPS 2553 relay----(3.05x3.00mm)------------------​obc board (payload,

TTC,PA, GPS) ------x 4

f.​ ​LT3480 converter -----------(3.55x2.45mm)--------​obc board (OBC, TTC,

Payload, torquers)​ ​
Magnetometer)------------------------x ​ ​5​ ​/​ ​8

3.​ ​OBC

a.​ ​AT91SAM7SE512 Microcontroller​ ​(22x16x1.6mm)------------​obc board

b.​ ​S29GL-P (20.20x14.10x1.20mm)-----------obc board

c.​ ​AT28LV010 EEPROM(20.20x8.10x1.20mm)---------------​obc board

d.​ ​C414B108 NVSRAM-------​obc board

e.​ ​Multiplexer-​--(5x4.5x1.2mm)-------------obc board

f.​ ​Max 232 logic converter—(10.63x10.50mm)--------obc

board---------------------------x 3

4.​ ​TTC

a.​ ​RF5110G PA-(3x3mm)----------------------------​obc board

b.​ ​CC1070 TX​ ​---(5x5mm)----------------------------​obc

 board-------------------------------------x 2

c.​ ​ADF7070 RX---(7x7mm)---------------------------​obc board

d.​ ​PIC 16C72A-(10.33x7.90x.311mm)-​------------obc board

Other devices and location

5.​ ​Magnetometer ---------------------------------------------​ ​TBD

6.​ ​GPS-------------------------------------------------------------​TBD

7.​
Payload​

8.​ ​Battery box--------------------------------------------------​power board /​TBD

9.​ ​GPS antenna-------------------------------------------------outer aluminium panel, exact

location ​TBD

10.​ ​TTC antenna--------------------------------------------------outside along roll

axis

11.​ ​Solar panels---------------------------------------------------on the four sides of

satellite(+/-Y, -X, +Z)

12.​ ​LVI----------------------------------------------------------------- -Z

13.​ ​Torquer coils---------------------------------------------------- on the aluminium

panels, (-X, +Z, +Y)

14.​ ​The most vulnerable devices are those which are based on CMOS
technology.

15.​ ​List of ICs containing overcurrent fault detection

a.​ ​DRV592-------> 4 A

b.​ ​Max4624 ezt series switch IC pg 6 data sheet

c.​ ​Tps customisable

d.​ ​MIC 2514--------------------- refer pg 5

16.​ ​List of ICs containing voltage fault detection

a.​ ​DRV592-------under​ ​voltage------------- < 2.8V

 b.​ ​Tps reverse voltage

c.​ ​Lt3480

17.​ ​List of ICs with temperature fault detection

a.​ ​DRV592-------junction temperature------------- > 130 C

b.​ ​MIC 2514--------------------- >170 C

c.​ ​Tps > 135 C

18.​ ​List of cable categories, their quantity and direction of signal flow

DATA

POWER

RF

COMPONENT DETAILS AND RELATION

1.​ ​Power Component Details And Relation

1.1 Converters and output

CONVERTER COMPONENT VOLTAGE QUANTITY

1.​ ​LT3480 a.​ ​OBC board 3.3 V 1
b.​ ​TTC board 3.3 V 1
c.​ ​RF amplifier(in
case best efficiency 3V 1
is not obtained at
3.3 V)
d.​ ​GPS 5V 1
e.​ ​PAYLOAD 5V 1
f.​ ​MAX232 5V 3
g.​ ​Multiplexer 5V 1
h.​ ​Thermal sensors TBD TBD
i.​ ​Heater TBD 1(min.)
2.​ ​LM5118 a.​ ​Magnetometer 9V 1
b.​ ​Magnetorquer 1 TBD 1
c.​ ​Magnetorquer TBD 1
2
 d.​ ​Magnetorquer 3 TBD 1

1.2 Converters And Relay Pair

CONVERTER RELAY IC LOAD

1.​ ​LT3480 a.​ ​TPS2553 Payload
b.​ ​TPS2553 TTC
c.​ ​TPS2553 GPS
d.​ ​TPS2553 Thermal heater(based on
voltage requirement))
2.​ ​LM5118 a.​ ​MIC2514 Magnetometer

1.3 Current Sensors

LOCATION CURRENT SENSOR IC

1.​ ​Between ​Solar Panel​ ​1​ and the MAX4372
shunt regulator
2.​ ​Between ​Solar Panel​ ​2​ and the MAX4372
shunt regulator
3.​ ​Between ​Solar Panel​ ​3​ and the MAX4372
shunt regulator
4.​ ​Between ​Solar Panel​ ​4​ and the MAX4372
shunt regulator
5.​ ​Before ​ Torquer1 MAX4372
6.​ ​Before ​ Torquer2 MAX4372
7.​ ​Before ​ Torquer3 MAX4372

2. ​OBC COMPONENT DETAILS AND RELATION

MICROCONTROLLER PERIPHERALS
a.​ ​AT28LV010 EEPROM
AT91SAM7SE512 b.​ ​C414B108 NVSRAM
c.​ ​FLASH
d.​ ​MUX

2.1 ​Interfacing with other devices

COMPONENT SUB SYSTEM QUANTITY TYPE OF NATURE

CONNECTION
a.​ ​DRV9593 ADCS 3 a.​ ​HIZ From OBC
b.​ ​Enable From OBC
b.​ ​Max4624 ADCS 3 a.​ ​Input From OBC
Logic
c.​ ​MIC2514 POWER 1 a.​ ​Control From OBC
(relay) line
d.​ ​DS2778(BPU) POWER 1 a.​ ​SDO
b.​ ​PIO
e.​ ​TPS2553 POWER 4 a.​ ​FAULT To OBC
(relay) b.​ ​ENABLE From OBC
f.​ ​MAX 4372 POWER 7 a. a/d TO OBC
(cs) converter
g.​ ​ADF7070 (Tx) TTC 1 a.​ ​SCLK
b.​ ​SDI
c.​ ​SOD
d.​ ​PSEL
h.​ ​CC1070 TTC 1 a.​ ​D1
(​the other CC1070 is b.​ ​SOD
interfaced with the c.​ ​SCLK
PIC microcontroller​) d.​ ​PSEL
e.​ ​D1
f.​ ​DCLK
i.​ ​PIC TTC 1 TBD