CHAPTER 1

INTRODUCTION

The usage of the microprocessors is, to processing data and produce useful
function. The microprocessor is an electronics system processor that incorporates the
functions of a computer central processing unit on a single integrated circuit (IC). The
major issue of the microprocessor or any other electronic devices are creating heat, it
causes the performance of the electronic system might be reduced or damaged the
system quickly so that every electronic system required a proper cooling system.
Nowadays electronic system is using a fin with or without a fan for cooling, it cannot
provide appropriate cooling. Air is used for cooling an electronic system but, its heat
transfer rate is less comparatively liquid. Air, gases and dry vapors heat transfer
coefficient is 0.5- 1000 W/ m2K is less than liquid heat transfer coefficient 10- 10000
W/ m2K. Water and liquid have a high heat transfer rate, so it is useful for cooling an
electronic system. Water and liquid system need more maintenance and need more
safety, it might damage the electronic devices, it avoids by using microfluid.

1.1 Microfluidics

Microfluidics is a concept of small scales (around 100 nanometers to 500

micrometers) channels used to pass the fluid. Microfluidics can be considered both
science (a study of the microfluid behaviour while passing in micro channels) and
technology (design and manufacturing of microfluid device). Manufacturing microfluid
device is difficult in the traditional method so, that we use rapid prototyping and
moulding technique. Microfluid devices are made by glass, silicon, polymers such as
PDMS (Polydimethylesiloxane). Micro-channels formed the microfluidic chip; it is
useful in biomedical applications. The microfluidics concept will helpful for heat
reduction in electronic devices.

1.2 Heat Flux in Electronic devices

Electronic devices such as laptops, desktop, processors and IC’s are creating
heat because of the manipulation of data with the use of silicon and germanium chipset
processors. Heat is a more problem in processing units; it’s slow down the processing

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and reduces the performance of the devices some cases the heat will damage the device
permanently. For avoiding those issues in electronic devices by using fins and fans. Fin
is used for free air cooling and fan is used for force air cooling but, both are not
sufficient for cooling processor units. By the experiment, a laptop (HP 15-ab512)
generates heat from 35℃ to maximum of 50℃ (figure 1.1) by using infrared camera.
The maximum heat generation wants to be cooled then only user attained the full
performance of the device.

Fig 1.1 Heat generated from laptop (37.7℃ to 50℃)

1.3 Microfluidics in Laptop
Microfluid will help to reduce the heat generated from the electronic devices. It
can do two ways, inbuilt the microfluid chip (shown in figure 1.2) while manufacturing
of processors and another way is to prepare microfluid chips for already sold products.
First, get the information of the processor and size of the processor to design microfluid
chip and make tube structure to the fan area. The laptop generated heat will flow
through the convection mode to microfluid, the fluid pass through the fan area to cool
the microfluid again return the fluid to the microchip. This will help to cool the
microprocessor.

Fig 1.2 Microfluid chip

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 CHAPTER 2

LITERATURE REVIEW

Philip Y. Paik et al. [1] The thermal management in integrated circuit (IC) is
difficult to design. In this literature discussed about various method for cooling an IC’s
and alternative cooling of microfluidics chips. In microfluidics have three methods such
as open microfluidics, continuous flow and droplet microfluidics. In this paper author
used droplet microfluidics methods for cooling an IC’s using microliters, nanoliters, and
picoliters, to independently move along a substrate.

S.H. Pourhoseini and N. Naghizadeh [2] discussed the use of silver-water

in microfluidics and experimental analysis of the silver-water microfluid on the thermo-
physical properties, flow of microfluid and heat transfer performance in plate heat
exchanger. an experimental system which included a CR14-45 COMER plate heat
exchanger, five pt100 platinum resistance temperature sensors with temperature control
system, two rotameters for flow rate indication and control, an insulated reservoir tank
with two immersed heaters in it and a stainless steel centrifugal pump for circulating
fluid was prepared. In the next step, silver microparticles were syn- thesized from
AgNO 3 and then 8 L of silver-water microfluid was prepared with different
concentrations in the range of 0–0.125 wt% and their thermal conductivity, heat
capacity and temperature difference rate were experimentally gauged.

Vamsi Krishna Pasam et al. [3] discussed cutting fluids are used for reducing
friction and reduced the heat generated from the machining object and reduced the wear
in the tool. Cooling a machine tool and machinability object need sufficient fluids, it
spends much coolant in the manufacturing process. Introducing a new techniques
Minimum Quantity Lubrication (MQL) to reduce the heat. Two types of solid lubricants
such as boric acid (H3BO3) and molybdenum disulphide (MoS2) were dispersed in the
coconut oil as micro and Nano fluids. To study the performance of the machine and
observe of nanofliuid and microfluid by varying speed, it useful for applying various
machining process.

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 Heshmati A. et al. [4] discussed the continuity, momentum and energy
equation solving by using Finite Volume Method and simple algorithm to link with the
pressure and velocity of the fluid flow in micro-channels. Different nanoparticles such
as Al2O3, CuO, ZnO and SiO2 with different volume fractions from 0% to 4% and
different nanoparticle diameter from 20 to 50 nm were considered with water as a base
fluid to explore the best nanofluid for heat transfer enhancement. It is clearly shown that
nanofluids with more nanofluid volume fraction and small nanoparticle diameter affect
the heat transfer considerably. Results clearly illustrated that SiO2 with 4% volume
fraction and 20 nm nanoparticle diameter shows the best performance for heat transfer
enhancement in compared with other nanoparticles

Michael J. Beauchamp et al. [5] This paper presents the three dimensional (3D)
printing machine to manufacture the microfluid chips. 3D printers to make fluidic
channels directed at point-of-care or lab-on-a-chip applications. Here, we look critically
at the cross-sectional sizes of these 3D printed fluidic structures, classifying them as
millifluidic (larger than 1 mm), sub-millifluidic (0.5–1.0 mm), large microfluidic (100–
500 μm), or truly microfluidic (smaller than 100 μm). Custom formulated resins and
stereolithographic printers. Such 3D printed microfluidic devices for bioanalysis will
accelerate research through designs that can be easily created and modified, allowing
improved assays to be developed.

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 CHAPTER 3
PROBLEM DEFINITION

The main objective of the electronic systems has contained a microprocessor, it

accessing the data based on the input given from the user. Laptop and desktop systems
are processing data and give the output of the data. While processing the processor
create the heat flux based on the performance of the input given, this heat is want to
remove or control for attaining maximum performance of the system and avoid the
damage in the microprocessor. Microprocessor cooled by using a thin layer of fins and
high speed rotating fans, it does not give sufficient cooling effect. By the analysis
laptops are create more heat from comparing to desktop computers, its range from 35℃
to 50℃. The heat flux varies from a company based on the cooling system provided by
the company. In gaming laptops are creating more heat because of while playing the
game, processor and graphics card want to process the frame changes and rendering
operation, it creates more heat. For that need a proper cooling system to improve the
performance of the laptop.

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 CHAPTER 4
OBJECTIVE
The objective of this project is,

To design microfluid chip and reduce the heat flux in laptop

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 CHAPTER 5
METHODOLOGY
The following figure 5.1 shows the methodology used for the experiment and
simulation based on which further analysis has to be made.

Lecture survey

Problem definition & Objective

Study and Data Study of Heat Flux in

Collection of Microfluid Microprocessor

Purchasing of Material and

Machine

Design of Microfluid Chips

No

Placed in
laptop/ Safety
Check
No
Yes

Analysing Heat
Flux in Laptop
Yes

Implement to other Electronic Devices

Fig 5.1 Methodology for Microfluid used to Reduce Heat Generation in Laptop

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 After the literature survey problem is to be defined and objective is to be
identified. Next step is data collection like machines, materials and flow in
micro-channels.
 After the data collection wants to design the microfluid chips by using
Photolithography technique and test flow properties before placing in laptop.
 After placing in laptop check the pump and flow motion in micro channels.
 Finally completing the design and placing of microfluid chip in laptop to analyse
the heat generated in laptop before and after the implementation of microfluid
chips. If the system could not transfer expected heat from the microprocessor,
alter the micro channel flow design.
 After testing, it gets success then implements the microfluid chip into other
electronic devices and analyse the performance.

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 CHAPTER 6
EXPECTED RESULT

The expected outcomes for this research will be

1. Reduce heat flux from microprocessor with help of microfluid chip
2. Improve the performance of the microprocessor
3. Improve battery life of the laptop

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 CHAPTER 7
PROJECT BUDGET

Budget items Amount requested in Rs.

1st Year 2nd Year 3rd

Year
(a) Staff JRF
SRF 10,000 10,000 10,000

RA 10,000 10,000 10,000

(b) Contingency

Chemical, samples glassware 1,000 1,000 2,000

etc

Travel 5,000 7,000 10,000

1st 2nd Year 3rd Year

Year

(c) Equipment (itemwise)

1. Photolithography - 1,38,880 -

2. Micro tools 10,000 2,000 -

3. Photolithography Mask 20,000 - 10,000

(d) Total 56,000 1,68,880 42,000

The total project budget is approximated as Rs. 2,66,880/-

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 REFERENCES

[1] philip y. Paik, vamsee k. Pamula, and krishnendu chakrabarty, “adaptive cooling of
integrated circuits using digital microfluidics” ieee transactions on very large scale
integration (vlsi) systems,10.1109/tvlsi.2007.915434
[2] S.H. Pourhoseini and N. Naghizadeh, “An experimental study on optimum
concentration of silver-water microfluid for enhancing heat transfer performance of
a plate heat exchanger”, Journal of the Taiwan Institute of Chemical Engineers 0 0
0 (2017) 1–8.
[3] Vamsi Krishna Pasam, Rukmini Srikant Revuru, Srinu Gugulothu, “Comparing the
performance & viability of nano and microfluids in minimum quantity lubrication
for machining AISI1040 steel” ,Materials Today: Proceedings 5 (2018) 8016–8024.
[4] A. Heshmati, H.A. Mohammed, A.N. Darus, “Mixed convection heat transfer of
nanofluids over backward facing step having a slotted baffle”, Applied
Mathematics and Computation 240 (2014) 368–386.
[5] Michael J. Beauchamp, Gregory P. Nordin and Adam T. Woolley, “Moving from
millifluidic to truly microfluidic sub-100-μm cross-section 3D printed devices”,
10.1007/s00216-017-0398-3.

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