TX-2B/RX-2B

TOY CAR REMOTE CONTROLLER WITH FIVE FUNCTIONS

DESCRIPTION

The TX-2B/RX-2B is a pair of CMOS LSIs designed for remote

controlled car applications. The TX-2B/RX-2B has five control
keys for controlling the motions (i.e. forward, backward, SOP-16-225-1.27

rightward, leftward and the turbo function) of the remote

controlled car.

FEATURES
DIP-14-300-2.54 DIP-16-300-2.54
* Wide operating voltage range (VCC=1.5~5.0V)
* Low stand-by current
* Auto-power-off function for TX-2B
* Few external components are needed ORDERING INFORMATION

Device Package
TX-2B DIP-14-300-2.54
RX-2B DIP-16-300-2.54
TX-2BS/RX-2BS SOP-16-225-1.27

BLOCK DIAGRAM

FOSC TEST B
13 2

OSCI 12
Oscillator Timing
Generator
OSCO 11

9 VDD
RIGHT 1

LEFT 14
10 PC
Latch Encoding
TURBO 6 Logic 8 SO
Circuit Circuit
7 SC
FORWARD 5

BACKWARD 4

3
GND

TRANSMITTER TX-2B Block Diagram

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BLOCK DIAGRAM (continued)

OSCI 4
Timing
Oscillator Generator 13 VDD
OSCO 5

Decoding Computer
SI 3 AMP Circuit

VO1 15
PLA
VI1 14

LDB 9
Control 6 RIGHT
Logic
RDB 8 7 LEFT
Latch 12 TURBO
Circuit
VI2 16 10 BACKWARD
VO2 1 11 FORWARD

2
GND

RECEIVER RX-2B Block Diagram

ABSOLUTE MAXIMUM RATINGS

Characteristics Symbol Value Unit

Supply Voltage VDD 0.3~5.0 V
Input / Output Voltage VIN, VOUT GND-0.3~VDD+0.3 V
Operating Temperature TOPR -10~65 °C
Storage Temperature Tstg -25~125 °C

ELECTRICAL CHARACTERISTICS

1. TX-2B (VDD=4.0V, Fosc=128KHz, Tamb =25°C, unless otherwise specified.)

Characteristics Symbol Min. Typ. Max. Unit

Operating Voltage VDD 1.5 4.0 5.0 V
Operating Current IDD -- -- 2.0 mA
Stand-By Current ISTB -- -- 10 µA
DC O/P Driving Current Idrive 5 -- -- mA
AC O/P Driving Current Idrive 5 -- -- mA
AC O/P Frequency Faudio 0.5 -- 1.0 kHz

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2. RX-2B (VDD=4.0V, Fosc=128KHz, Tamb=25°C, unless otherwise specified.)

Characteristics Symbol Min. Typ. Max. Unit

Operating Voltage VDD 1.5 4.0 5.0 V
Operating Current IDD -- -- 3.0 mA
O/P Driving Current Idrive 1 -- -- mA
O/P Sinking Current Isink 1 -- -- mA
Effect Decoding Frequency Variation Ftolerance -20 -- 20 %

PIN CONFIGURATION

RIGHT 1 16 LEFT VO2 1 16 VI2

RIGHT 1 14 LEFT TEST 2 15 FOSC GND 2 15 VO1

TEST 2 13 FOSC GND 3 14 OSCI SI 3 14 VI1

RX-2B/RX-2BS
TX-2BS

GND 3 12 OSCI BACNWARD 4 13 OSCO OSCI 4 13 V DD

TX-2B

BACKWARD 4 11 OSCO FORWARD 5 12 PC OSCO 5 12 TURBO

FORWARD 5 10 PC TURBO 6 11 V DD RIGHT 6 11 FORWARD

TURBO 6 9 V DD SC 7 10 SO LEFT 7 10 BACKWARD

SC 7 8 SO NC 8 9 NC ROB 8 9 LDB

PIN DESCRIPTION

1. TX-2B

Pin No.
Symbol Description
TX-2B TX-2BS
1 1 RIGHT The rightward function will be selected, if this pin is connected to GND
2 2 TEST This pin is used for testing mode
3 3 GND Negative power supply
4 4 BACKWARD The backward function will be selected, if this pin is connected to GND
5 5 FORWARD The forward function will be selected, if this pin is connected to GND
6 6 TURBO The turbo function will be selected if this pin is connected to GND
7 7 SC Output pin of the encoding signal with carrier frequency
8 10 SO Output pin of the encoding signal without carrier frequency
9 11 VDD Positive power supply
10 12 PC Power control output pin
11 13 OSCO Oscillator output pin
12 14 OSCI Oscillator input pin
13 15 FOSC This pin is used for testing mode
14 16 LEFT The leftward function will be selected, if this pin is connected to GND
8, 9 NC Not connect

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2. RX-2B

Pin No. Symbol Description

1 VO2 Inverter 2 output pin for power amplify
2 GND Negative power supply
3 SI Input pin of the encoding signal
4 OSCI Oscillator input pin
5 OSCO Oscillator output pin
6 RIGHT Rightward output pin
7 LEFT Leftward output pin
8 ROB Rightward function disable, if this pin is connected to GND
9 LDB Leftward function disable, if this pin is connected to GND
10 BACKWARD Backward output pin
11 FORWARD Forward output pin
12 TURBO TURBO output pin
13 VDD Positive power supply
14 VI1 Inverter 1 input pin for power amplify
15 VO1 Inverter 1 output pin for power amplify
16 VI2 Inverter 2 input pin for power amplify

FUNCTION DESCRIPTION

Code format

1. ENCODE RULE

(A).Bit Format (W1 is used for function codes,W2 for start codes)
1KHz

W1
1KHz 50% Duty cycle

W2
500Hz 75% Duty cycle

(B).Date Format

W2 W2 W2 W2 (n) X W1 W2 W2 W2 W2 (n) X W1 W2 W2 W2 W2

W2 W2 W2 W2 1 2 3 4 W2 W2 W2 W2

1 2 3 4 W1 W1 W1 W1
W1 W1
n-th
start code
n x W1
function code
1 word

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Number Of Function Code (N) W1 Function Key Decode Result

4 End Code
10 Forward Forward
16 Forward & Turbo Forward
22 Turbo Turbo
28 Turbo & Forward & Left Forward & Left
34 Turbo & Forward & Right Forward & Right
40 Backward Backward
46 Backward & Right Backward & Right
52 Backward & Left Backward & Left
58 Left Left
64 Right Right

2. ENCODE/DECODE TIMING

Any function key

Encode output
1st word 2nd word 3rd word 1 2 3 4 5 6 7 8

end code

Decode output

9ms 9ms

SI

8ms (n) W 1 8ms 1ms

Decode output

T=17ms+(nW1)x1ms

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 TX-2B/RX-2B

TESTING CIRCUIT

(The oscillator frequency of TX-2B, RX-2B is 128KHz, the oscillator resistor is 160KΩ and 250KΩ respectively)

forward

backward
fosc=128kHz

turbo
VCC=3V

14 13 12 11 10 9 8 16 15 14 13 12 11 10 9
100 F

TX-2B RX-2B

1 2 3 4 5 6 7 1 2 3 4 5 6 7 8
backward

forward

turbo
right

right
left

left
fosc=128kHz

TYPICAL APPLICATION CIRCUIT

TRANSMITTER

VCC
Rosc=500k
R.F.
SI CIRCUIT
14 13 12 11 10 9 8

TX-2B

1 2 3 4 5 6 7
backward

forward

turbo
right
left

RECEIVER

power
switch
16 15 14 13 12 11 10 9
100 F

4.3V RX-2B
VCC
1 2 3 4 5 6 7 8
R.F.
CIRCUIT
500k

GND

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 TX-2B/RX-2B

INFRARED APPLICATION CIRCUIT

TRANSMITTER

DC:3V

100 F
fosc=114kHz

1~4.7
14 13 12 11 10 9 8

Photo Diode
TX-2B

1 2 3 4 5 6 7

Frontwar
Backw

Turbo
C8050
Right

ard
Left

RECEIVER

16 15 14 13 12 11 10 9
DC:5V 100K

RX-2B
F

VDD
100

OUT IR
1 2 3 4 5 6 7 8 Receiver
1815

fosc=114KHz

GND

RECOMMENDED APPLICATION CIRCUIT

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 TX-2B/RX-2B

RECOMMENDED APPLICATION CIRCUIT (continued)

PACKAGE OUTLINE

DIP-14-300-2.54 UNIT: mm

2.54

1.52
15 degree

19.55±0.3

0.5MIN

0.46
2.40MAX

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 TX-2B/RX-2B

PACKAGE OUTLINE (continued)

DIP-16-300-2.54 UNIT: mm

SOP-16-225-1.27 UNIT: mm

5.72±0.25
3.9±0.3
6.0±0.4

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 TX-2B/RX-2B

HANDLING MOS DEVICES:

Electrostatic charges can exist in many things. All of our MOS devices are internally protected against
electrostatic discharge but they can be damaged if the following precautions are not taken:
• Persons at a work bench should be earthed via a wrist strap.
• Equipment cases should be earthed.
• All tools used during assembly, including soldering tools and solder baths, must be earthed.
• MOS devices should be packed for dispatch in antistatic/conductive containers.

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 TX-2B/RX-2B

ATTACHMENT

Revision History

Data REV Description Page

2002.03.11 1.0 Original
2002.03.21 1.1 Modify the”2. ENCODE/DECODE TIMING”
2005.12.19 1.2 Add the package of “SOP-16-225-1.27”

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